TW202138297A - Method of manufacturing ordered arrangement of graphene-carbon nano tube of metal substrate and composite coatings for carbon deposit - Google Patents

Method of manufacturing ordered arrangement of graphene-carbon nano tube of metal substrate and composite coatings for carbon deposit Download PDF

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TW202138297A
TW202138297A TW109112496A TW109112496A TW202138297A TW 202138297 A TW202138297 A TW 202138297A TW 109112496 A TW109112496 A TW 109112496A TW 109112496 A TW109112496 A TW 109112496A TW 202138297 A TW202138297 A TW 202138297A
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sputtering target
metal substrate
carbon
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TWI787598B (en
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簡士堡
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信紘科技股份有限公司
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Abstract

The invention discloses a method of manufacturing ordered arrangement of graphene-carbon nano tube of metal substrate and composite coatings for carbon deposit, which deposits sputtering target and penetrating fluid into evacuated penetrating oven in order to make the penetrating fluid penetrates the sputtering target in the evacuated penetrating oven, and places the penetrated sputtering target into evacuated magnetic control sputtering machine and controls cooling water of the evacuated magnetic control sputtering target machine, namely, operates evacuated magnetic control sputtering process on the metal substrate, utilizes the characteristic of metal organic salt of the penetrating fluid that can remain non-magnetic under 150℃before decomposition, decomposes nano metal organic salt particles in high temperature zone after being sputtering and depositing on the metal substrate as catalyst of carbon so the carbon that came from the sputtering target can form carbon structural layer on concave / convex rough portion of the metal substrate. Accordingly, the invention reflects the beneficial effects of being easy and time saving on manufacture.

Description

金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法Manufacturing method of orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on metal substrate

本發明係有關於一種金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,尤其是指一種於製作上更為簡易便利,且更能節省製作工時,而在其整體施行使用上更增實用功效特性者。The present invention relates to a manufacturing method of orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on a metal substrate, and in particular refers to a method that is simpler and more convenient in manufacturing, and can save manufacturing man-hours. In its overall implementation and use, it is more practical and functional.

按,隨著高科技的蓬勃發展,電子元件的體積趨於微小化,而且單位面積上的密集度也愈來愈高,其效能更是不斷增強,在這些因素之下,電子元件的產品品質需求幾乎逐年升高。According to the vigorous development of high technology, the volume of electronic components tends to be miniaturized, and the density per unit area is getting higher and higher, and their performance is continuously enhanced. Under these factors, the product quality of electronic components Demand is increasing almost every year.

其中,就一般常見電子元件之金屬基材而言,其於製作加工過程中主要係將金屬基材於侵蝕槽內利用化學藥劑[如:強酸、強鹼]清洗表面以除油、除銹,且再經中和槽與清洗槽洗除藥劑後,並經多數個化學槽,利用化學方式侵蝕、腐蝕將鋁箔表面加工形成多數凹孔狀的表面,再經中和清洗及強酸與電化學作用形成耐電壓的氧化層的氧化槽後,最後通過清洗中和槽與烘乾槽而完成該金屬基材的製作程序。Among them, as for the metal substrate of common electronic components, the metal substrate is mainly used in the corrosion tank to clean the surface with chemical agents (such as strong acid, strong alkali) to remove oil and rust during the manufacturing process. And after the agent is removed by the neutralization tank and the cleaning tank, and through a plurality of chemical tanks, the surface of the aluminum foil is chemically eroded and corroded to form a plurality of concave-shaped surfaces, and then subjected to neutralization cleaning, strong acid and electrochemical action After forming the oxidation tank of the voltage-resistant oxide layer, the process of making the metal substrate is completed by cleaning the neutralization tank and the drying tank.

然而,上述金屬基材製作方法,其雖可達到製作完成該金屬基材之預期功效,但也在其實際施行操作過程中發現,該金屬基材於製作上需經過多個不同的槽、進行數不同的步驟,造成不僅顯得步驟極為繁雜不便,且相對需耗費較多的製作工時,致令其在整體施行操作上仍存在有改進之空間。However, although the above-mentioned metal substrate manufacturing method can achieve the expected effect of manufacturing the metal substrate, it is also discovered in the actual implementation process that the metal substrate needs to pass through a plurality of different grooves in the production process. The number of different steps not only makes the steps extremely complicated and inconvenient, but also consumes a lot of production man-hours, so that there is still room for improvement in the overall implementation.

緣是,發明人有鑑於此,秉持多年該相關行業之豐富設計開發及實際製作經驗,再予以研究改良,提供一種金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,以期達到更佳實用價值性之目的者。The reason is that, in view of this, the inventor upholds many years of rich experience in design, development and actual production in the related industry, and then researches and improves it to provide a metal substrate with an ordered arrangement of graphene carbon nanotubes and a composite coating of carbon deposition. Manufacturing methods in order to achieve the purpose of better practical value.

本發明之主要目的在於提供一種金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其主要係於製作上更為簡易便利,且更能節省製作工時,而在其整體施行使用上更增實用功效特性者。The main purpose of the present invention is to provide a method for manufacturing graphene carbon nanotubes with metal substrates in an orderly arrangement and carbon deposition composite coating, which is mainly easier and more convenient in manufacturing, and can save manufacturing man-hours. And in its overall implementation and use, it is more practical and functional.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法之主要目的與功效,係由以下具體技術手段所達成:The main purpose and effect of the manufacturing method of the orderly arrangement and carbon deposition composite coating of the graphene carbon nanotubes on the metal substrate of the present invention are achieved by the following specific technical means:

其主要係包括下列步驟:The main system includes the following steps:

A.石墨濺鍍靶材:將石墨製作成各種幾何型狀的磁控濺鍍靶材;A. Graphite sputtering target: Graphite is made into various geometric shapes of magnetron sputtering target;

B.滲透液:將有機金屬鹽溶解於有機容劑中,使其達到飽和溶解度,而製作出滲透液;B. Permeate: Dissolve the organic metal salt in an organic solvent to make it reach saturated solubility to produce a permeate;

C.滲透:將該濺鍍靶材與該滲透液一併置入真空滲透爐,讓該滲透液於真空滲透爐內之真空環境下滲透至該濺鍍靶材中;C. Infiltration: Put the sputtering target and the permeate into a vacuum infiltration furnace together, and allow the permeate to penetrate into the sputtering target under the vacuum environment in the vacuum infiltration furnace;

D.金屬基材:將金屬基材於雙面表面形成有凹凸粗糙部;D. Metal base material: the metal base material is formed with irregularities on both sides of the surface;

E.濺鍍:將經過該滲透液滲透後之該濺鍍靶材置入真空磁控濺鍍機內,控制該真空磁控濺鍍靶機內之冷卻水,即可對經由D步驟處理之該金屬基材進行真空磁控濺鍍作業,利用該滲透液之有機金屬鹽在150℃以下未分解前仍保持為非磁性質,被濺射後至高溫區分解出奈米有機金屬鹽之金屬顆粒而沉積在該金屬基材上,作為碳素的催化劑,使得在來自該濺鍍靶材之碳快速相互鍵結,形成有序碳結構,即可在該金屬基材之凹凸粗糙部上形成有序的二維或三維碳結構層。E. Sputtering: Put the sputtering target after the penetration of the penetrating liquid into the vacuum magnetron sputtering machine, control the cooling water in the vacuum magnetron sputtering target machine, and then you can The metal substrate is subjected to vacuum magnetron sputtering operation, and the organic metal salt of the permeate remains non-magnetic before being decomposed at 150°C. After being sputtered, the metal of the nano-organic metal salt is decomposed to the high temperature zone. The particles are deposited on the metal substrate as a catalyst for carbon, so that the carbon from the sputtering target is rapidly bonded to each other to form an ordered carbon structure, which can be formed on the unevenness of the metal substrate Ordered two-dimensional or three-dimensional carbon structure layer.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該濺鍍靶材之石墨含量≧99.95%,且孔隙率為15%~30%。A preferred embodiment of the method for manufacturing a composite coating of graphene carbon nanotubes with orderly arrangement and carbon deposition on a metal substrate of the present invention, wherein the sputtering target has a graphite content of ≧99.95% and a porosity of 15% ~30%.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該真空滲透爐設有爐體,該爐體內供設置該濺鍍靶材,且令該滲透液於該爐體內淹沒該濺鍍靶材,於該爐體設有真空閥與氣壓控制裝置相連結,利用該氣壓控制裝置之高真空泵可對該爐體內部進行抽真空作業,並於該爐體設有真空表,透過該真空表觀察該爐體內部的氣壓值。A preferred embodiment of the method for manufacturing a composite coating of graphene carbon nanotubes with orderly arrangement and carbon deposition on a metal substrate of the present invention, wherein the vacuum infiltration furnace is provided with a furnace body, and the sputtering target is provided in the furnace body And make the permeate to submerge the sputtering target material in the furnace body, and the furnace body is provided with a vacuum valve connected to the air pressure control device, and the high vacuum pump of the air pressure control device can be used to vacuum the interior of the furnace body Work, and set up a vacuum gauge on the furnace body, and observe the pressure value inside the furnace body through the vacuum gauge.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該真空滲透爐之該爐體連接有滲透液回收槽,經由該滲透液回收槽回收使用後之滲透液供重覆循環使用。A preferred embodiment of the method for manufacturing a composite coating of graphene carbon nanotubes with an orderly arrangement and carbon deposition on a metal substrate of the present invention, wherein the furnace body of the vacuum infiltration furnace is connected with a permeate recovery tank through which the infiltration The liquid recovery tank recovers the used permeate for repeated recycling.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該金屬基材係為鋁含量≧99.7%之高純度鋁箔、銅含量99.7%之高純度銅箔任一種。The preferred embodiment of the manufacturing method of the ordered arrangement of graphene carbon nanotubes and carbon deposition composite coating of the metal substrate of the present invention, wherein the metal substrate is a high-purity aluminum foil with an aluminum content ≧99.7%, and a copper content 99.7% of any kind of high-purity copper foil.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該金屬基材於雙面係經化學粗鍍、電化學腐蝕、噴塗、蒸濺鍍任一種方式在表面形成有凹凸粗糙部。A preferred embodiment of the method for manufacturing a composite coating of graphene carbon nanotubes with orderly arrangement and carbon deposition on a metal substrate of the present invention, wherein the metal substrate is subjected to rough chemical plating, electrochemical corrosion, and spraying on both sides , Either method of vapor sputtering has uneven roughness formed on the surface.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該真空磁控濺鍍靶機為平面真空磁控濺鍍靶機、圓形平面真空磁控濺鍍靶機、圓柱形磁真空磁控濺鍍靶機任一種。The preferred embodiment of the manufacturing method of the orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on the metal substrate of the present invention, wherein the vacuum magnetron sputtering target machine is a plane vacuum magnetron sputtering target machine, Any of circular plane vacuum magnetron sputtering target machine, cylindrical magnetic vacuum magnetron sputtering target machine.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該濺鍍靶材的靶材面工作維持在至多150℃以下,同時該真空磁控濺鍍機之腔體內的工作溫度至少300℃以上、真空度在0.1Pa以下。The preferred embodiment of the manufacturing method of orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on a metal substrate of the present invention, wherein the target surface of the sputtering target is maintained at most 150°C or less, and at the same time The working temperature in the cavity of the vacuum magnetron sputtering machine is at least 300° C. and the vacuum degree is below 0.1 Pa.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該有機金屬鹽係為鐵、鈷、鎳任一種。The preferred embodiment of the method for manufacturing a composite coating of graphene carbon nanotubes with orderly arrangement and carbon deposition on a metal substrate of the present invention, wherein the organic metal salt is any one of iron, cobalt, and nickel.

本發明金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法的較佳實施例,其中,該金屬基材之凹凸粗糙部上所形成的該碳結構層係為碳奈米管、石墨烯任一種或兩種之組合。A preferred embodiment of the method for manufacturing a composite coating of graphene carbon nanotubes with orderly arrangement and carbon deposition on a metal substrate of the present invention, wherein the carbon structure layer formed on the concave-convex rough portion of the metal substrate is Any one or a combination of carbon nanotubes and graphene.

為令本發明所運用之技術內容、發明目的及其達成之功效有更完整且清楚的揭露,茲於下詳細說明之,並請一併參閱所揭之圖式及圖號:In order to make the technical content, the purpose of the invention and the effects achieved by the present invention more complete and clear, the following detailed descriptions are given, and please refer to the disclosed drawings and figure numbers together:

首先,請參閱第一圖本發明之製作流程示意圖所示,本發明主要係包括下列步驟:First of all, please refer to the first figure shown in the schematic diagram of the production process of the present invention. The present invention mainly includes the following steps:

A.石墨濺鍍靶材:將石墨含量≧99.95%之高純度石墨製作成各種幾何型狀的磁控濺鍍靶材,且控制該濺鍍靶材之孔隙率為15%~30%;A. Graphite sputtering target: High-purity graphite with graphite content ≧99.95% is made into various geometric magnetron sputtering targets, and the porosity of the sputtering target is controlled to be 15%~30%;

B.滲透液:將有機金屬鹽[如:鐵、鈷、鎳等]溶解於有機容劑中,使其達到飽和溶解度,而製作出滲透液;B. Penetrant: Dissolve organic metal salts [such as iron, cobalt, nickel, etc.] in an organic solvent to achieve saturated solubility to produce a permeate;

C.滲透:請再一併參閱第二圖本發明之真空滲透爐結構示意圖所示,將該濺鍍靶材(1)與該滲透液(2)一併置入真空滲透爐(3),該真空滲透爐(3)設有爐體(31),該爐體(31)內供設置該濺鍍靶材(1),且令該滲透液(2)於該爐體(31)內淹沒該濺鍍靶材(1),於該爐體(31)設有真空閥(311)與氣壓控制裝置(32)相連結,利用該氣壓控制裝置(32)之高真空泵可對該爐體(31)內部進行抽真空作業,並於該爐體(31)設有真空表(312),以能透過該真空表(312)觀察該爐體(31)內部的氣壓值,而讓該滲透液(2)於該爐體(31)內之真空環境下滲透至該濺鍍靶材(1)中,另於該爐體(31)連接有滲透液回收槽(33),以可經由該滲透液回收槽(33)回收使用後之滲透液供重覆循環使用;C. Infiltration: Please refer to the second figure as shown in the schematic diagram of the vacuum infiltration furnace of the present invention, and put the sputtering target (1) and the penetrant (2) into the vacuum infiltration furnace (3) together. The vacuum infiltration furnace (3) is provided with a furnace body (31) in which the sputtering target material (1) is provided, and the infiltration liquid (2) is allowed to flood the furnace body (31) Sputtering target material (1), the furnace body (31) is provided with a vacuum valve (311) connected to the air pressure control device (32), and the high vacuum pump of the air pressure control device (32) can be used for the furnace body (31) ) Is vacuumed inside, and the furnace body (31) is provided with a vacuum gauge (312) so that the pressure value inside the furnace body (31) can be observed through the vacuum gauge (312), so that the permeate ( 2) Infiltrate into the sputtering target (1) under the vacuum environment in the furnace body (31), and the furnace body (31) is connected with a permeate recovery tank (33) so that the permeate can pass through The recovery tank (33) recovers the used permeate for repeated recycling;

D.金屬基材:將鋁含量≧99.7%之高純度鋁箔或銅含量99.7%之高純度銅箔等金屬基材,於雙面經化學粗鍍或電化學腐蝕或噴塗或蒸濺鍍,以在該金屬基材表面形成有凹凸粗糙部;D. Metal substrate: Metal substrates such as high-purity aluminum foil with aluminum content ≧99.7% or high-purity copper foil with copper content 99.7% are subjected to rough chemical plating or electrochemical corrosion, spraying or evaporation on both sides to Concave and convex rough parts are formed on the surface of the metal substrate;

E.濺鍍:將經過該滲透液(2)滲透後之該濺鍍靶材(1)置入真空磁控濺鍍機(4)內,該真空磁控濺鍍靶機(4)可為平面真空磁控濺鍍靶機[請再一併參閱第三圖本發明應用在平面真空磁控濺鍍靶機之使用狀態示意圖所示]、圓形平面真空磁控濺鍍靶機[請再一併參閱第四圖本發明應用在圓形平面真空磁控濺鍍靶機之使用狀態示意圖所示]、圓柱形磁真空磁控濺鍍靶機[請再一併參閱第五圖本發明應用在圓柱形磁真空磁控濺鍍靶機之使用狀態示意圖所示]任一種,控制該真空磁控濺鍍靶機(4)內之冷卻水,使該濺鍍靶材(1)的靶材面工作維持在至多150℃以下,同時該真空磁控濺鍍機(4)之腔體內的工作溫度至少300℃以上、真空度在0.1Pa以下,即可對經由D步驟處理之該金屬基材(5)進行真空磁控濺鍍作業[請再一併參閱第六圖本發明於增強型非平衡閉合磁場進行真空磁控濺鍍作業狀態示意圖、第七圖本發明於大型多靶非平衡閉合磁場進行真空磁控濺鍍作業狀態示意圖、第八圖本發明之另一進行真空磁控濺鍍作業狀態示意圖及第九圖本發明之又一進行真空磁控濺鍍作業狀態示意圖所示],利用該滲透液(2)之有機金屬鹽[如:鐵、鈷、鎳等]在150℃以下未分解前仍保持為非磁性質,被濺射後至高溫區分解出鐵、鈷、鎳等奈米有機金屬鹽之金屬顆粒而沉積在該金屬基材(5)上,作為碳素的催化劑,使得在來自該濺鍍靶材(1)之源源不絕的碳原子或碳團簇快速相互鍵結,形成有序碳結構,而即可在該金屬基材(5)之全面或部分面的凹凸粗糙部上形成有碳奈米管或石墨烯任一種或兩種組合之有序的二維或三維碳結構層(51)[第十圖本發明之成形狀態示意圖、第十一圖本發明之另一成形狀態示意圖及第十二圖本發明之又一成形狀態示意圖所示],並利用維持該真空磁控濺鍍靶機(4)之工作條件以控制在該金屬基材(5)上所形成之碳結構層(51)的長度或片徑。E. Sputtering: Put the sputtering target (1) after the penetration of the penetrant (2) into the vacuum magnetron sputtering machine (4), the vacuum magnetron sputtering target machine (4) can be Planar vacuum magnetron sputtering target machine [please refer to the third figure together. This invention is applied to the use state of plane vacuum magnetron sputtering target machine as shown in the schematic diagram], circular plane vacuum magnetron sputtering target machine [please again Also refer to the fourth figure. The application of the present invention in the circular plane vacuum magnetron sputtering target machine is shown in the schematic diagram], the cylindrical magnetic vacuum magnetron sputtering target machine [please also refer to the fifth figure. The application of the present invention As shown in the schematic diagram of the use state of the cylindrical magnetic vacuum magnetron sputtering target machine], control the cooling water in the vacuum magnetron sputtering target machine (4) to make the target material of the sputtering target material (1) The surface work is maintained at most below 150°C, and the working temperature in the cavity of the vacuum magnetron sputtering machine (4) is at least 300°C or more, and the vacuum degree is below 0.1Pa. (5) Carrying out vacuum magnetron sputtering operation [please refer to the sixth figure together with the schematic diagram of the vacuum magnetron sputtering operation in the enhanced unbalanced closed magnetic field of the present invention, and the seventh figure of the present invention in the large-scale multi-target unbalanced closing A schematic diagram of a vacuum magnetron sputtering operation state under a magnetic field, Fig. 8 is another schematic diagram of a vacuum magnetron sputtering operation of the present invention, and Fig. 9 is another schematic diagram of a vacuum magnetron sputtering operation of the present invention], The organometallic salt [such as iron, cobalt, nickel, etc.] using the permeate (2) remains non-magnetic before being decomposed at 150°C, and decomposes iron, cobalt, nickel, etc. into the high temperature zone after being sputtered The metal particles of nanoorganometallic salt are deposited on the metal substrate (5), which act as a carbon catalyst, so that the endless carbon atoms or carbon clusters from the sputtering target (1) quickly interact with each other. Bonded to form an ordered carbon structure, and then an ordered two of carbon nanotubes or graphene can be formed on the entire or partial surface of the metal substrate (5). One-dimensional or three-dimensional carbon structure layer (51) [shown in Figure 10, a schematic view of the forming state of the present invention, Figure 11, a schematic view of another forming state of the present invention, and Figure 12, a schematic view of another forming state of the present invention], and The working conditions of the vacuum magnetron sputtering target machine (4) are maintained to control the length or sheet diameter of the carbon structure layer (51) formed on the metal substrate (5).

如此一來,即可將該金屬基材(5)應用於電容器電極箔、超級電容器電極箔、鋰電池電極、散熱膜、EMI散熱膜等。In this way, the metal substrate (5) can be applied to capacitor electrode foil, super capacitor electrode foil, lithium battery electrode, heat dissipation film, EMI heat dissipation film, and the like.

藉由以上所述,本發明之使用實施說明可知,本發明與現有技術手段相較之下,本發明主要係於製作上更為簡易便利,且更能節省製作工時,而在其整體施行使用上更增實用功效特性者。Based on the above, the description of the use and implementation of the present invention shows that, compared with the prior art, the present invention is mainly simpler and more convenient in manufacturing, and can save manufacturing man-hours, and is implemented in its entirety. Those who use more practical functional characteristics.

然而前述之實施例或圖式並非限定本發明之產品結構或使用方式,任何所屬技術領域中具有通常知識者之適當變化或修飾,皆應視為不脫離本發明之專利範疇。However, the foregoing embodiments or drawings do not limit the product structure or usage mode of the present invention, and any appropriate changes or modifications by persons with ordinary knowledge in the relevant technical field should be regarded as not departing from the patent scope of the present invention.

綜上所述,本發明實施例確能達到所預期之使用功效,又其所揭露之具體構造,不僅未曾見諸於同類產品中,亦未曾公開於申請前,誠已完全符合專利法之規定與要求,爰依法提出發明專利之申請,懇請惠予審查,並賜准專利,則實感德便。In summary, the embodiments of the present invention can indeed achieve the expected use effect, and the specific structure disclosed by it has not been seen in similar products, nor has it been disclosed before the application, since it has fully complied with the provisions of the patent law. In accordance with the requirements, Yan filed an application for a patent for invention in accordance with the law, and asked for favors for examination and granted a patent.

1:濺鍍靶材1: Sputtering target

2:滲透液2: penetrant

3:真空滲透爐3: Vacuum infiltration furnace

31:爐體31: Furnace

311:真空閥311: Vacuum valve

312:真空表312: Vacuum gauge

32:氣壓控制裝置32: Air pressure control device

33:滲透液回收槽33: Permeate recovery tank

4:真空磁控濺鍍靶機4: Vacuum magnetron sputtering target machine

5:金屬基材5: Metal substrate

51:碳結構層51: Carbon structure layer

第一圖:本發明之製作流程示意圖Figure 1: Schematic diagram of the production process of the present invention

第二圖:本發明之真空滲透爐結構示意圖Figure 2: Schematic diagram of the vacuum infiltration furnace structure of the present invention

第三圖:本發明應用在平面真空磁控濺鍍靶機之使用狀態示意圖Figure 3: Schematic diagram of the use state of the present invention applied to the plane vacuum magnetron sputtering target machine

第四圖:本發明應用在圓形平面真空磁控濺鍍靶機之使用狀態示意圖Figure 4: Schematic diagram of the use state of the present invention applied to the circular plane vacuum magnetron sputtering target machine

第五圖:本發明應用在圓柱形磁真空磁控濺鍍靶機之使用狀態示意圖Figure 5: Schematic diagram of the use of the present invention applied to cylindrical magnetic vacuum magnetron sputtering target machine

第六圖:本發明於增強型非平衡閉合磁場進行真空磁控濺鍍作業狀態示意圖Figure 6: Schematic diagram of the vacuum magnetron sputtering operation of the present invention in an enhanced unbalanced closed magnetic field

第七圖:本發明於大型多靶非平衡閉合磁場進行真空磁控濺鍍作業狀態示意圖Figure 7: Schematic diagram of the vacuum magnetron sputtering operation of the present invention in a large multi-target unbalanced closed magnetic field

第八圖:本發明之另一進行真空磁控濺鍍作業狀態示意圖Figure 8: Another schematic diagram of the present invention for vacuum magnetron sputtering operation

第九圖:本發明之又一進行真空磁控濺鍍作業狀態示意圖Figure 9: Another schematic diagram of the present invention for vacuum magnetron sputtering operation

第十圖:本發明之成形狀態示意圖Figure 10: Schematic diagram of the forming state of the present invention

第十一圖:本發明之另一成形狀態示意圖Figure 11: A schematic diagram of another forming state of the present invention

第十二圖:本發明之又一成形狀態示意圖Figure 12: A schematic diagram of another forming state of the present invention

Claims (10)

一種金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其主要係包括下列步驟: A.石墨濺鍍靶材:將石墨製作成各種幾何型狀的磁控濺鍍靶材; B.滲透液:將有機金屬鹽溶解於有機容劑中,使其達到飽和溶解度,而製作出滲透液; C.滲透:將該濺鍍靶材與該滲透液一併置入真空滲透爐,讓該滲透液於真空滲透爐內之真空環境下滲透至該濺鍍靶材中; D.金屬基材:將金屬基材於雙面表面形成有凹凸粗糙部; E.濺鍍:將經過該滲透液滲透後之該濺鍍靶材置入真空磁控濺鍍機內,控制該真空磁控濺鍍靶機內之冷卻水,即可對經由D步驟處理之該金屬基材進行真空磁控濺鍍作業,利用該滲透液之有機金屬鹽在150℃以下未分解前仍保持為非磁性質,被濺射後至高溫區分解出奈米有機金屬鹽之金屬顆粒而沉積在該金屬基材上,作為碳素的催化劑,使得在來自該濺鍍靶材之碳快速相互鍵結,形成有序碳結構,即可在該金屬基材之凹凸粗糙部上形成有序的二維或三維碳結構層。A manufacturing method of orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on a metal substrate mainly includes the following steps: A. Graphite sputtering target: Graphite is made into various geometric shapes of magnetron sputtering target; B. Permeate: Dissolve the organic metal salt in an organic solvent to make it reach saturated solubility to produce a permeate; C. Infiltration: Put the sputtering target and the permeate into a vacuum infiltration furnace together, and allow the permeate to penetrate into the sputtering target under the vacuum environment in the vacuum infiltration furnace; D. Metal base material: the metal base material is formed with irregularities on both sides of the surface; E. Sputtering: Put the sputtering target after the penetration of the penetrating liquid into the vacuum magnetron sputtering machine, control the cooling water in the vacuum magnetron sputtering target machine, and then you can The metal substrate is subjected to vacuum magnetron sputtering operation, and the organic metal salt of the permeate remains non-magnetic before being decomposed at 150°C. After being sputtered, the metal of the nano-organic metal salt is decomposed to the high temperature zone. The particles are deposited on the metal substrate as a catalyst for carbon, so that the carbon from the sputtering target is rapidly bonded to each other to form an ordered carbon structure, which can be formed on the unevenness of the metal substrate Ordered two-dimensional or three-dimensional carbon structure layer. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該濺鍍靶材之石墨含量≧99.95%,且孔隙率為15%~30%。The orderly arrangement of graphene carbon nanotubes and carbon deposition composite coating manufacturing method for metal substrates according to claim 1, wherein the sputtering target has a graphite content of ≧99.95% and a porosity of 15%~ 30%. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該真空滲透爐設有爐體,該爐體內供設置該濺鍍靶材,且令該滲透液於該爐體內淹沒該濺鍍靶材,於該爐體設有真空閥與氣壓控制裝置相連結,利用該氣壓控制裝置之高真空泵可對該爐體內部進行抽真空作業,並於該爐體設有真空表,透過該真空表觀察該爐體內部的氣壓值。The method for manufacturing an orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on a metal substrate according to claim 1, wherein the vacuum infiltration furnace is provided with a furnace body, and the sputtering target material is provided in the furnace body , And make the permeate to submerge the sputtering target in the furnace body, a vacuum valve is provided in the furnace body to connect with the air pressure control device, and the high vacuum pump of the air pressure control device can vacuumize the inside of the furnace body , And the furnace body is provided with a vacuum gauge, and the pressure value inside the furnace body is observed through the vacuum gauge. 如請求項3所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該真空滲透爐之該爐體連接有滲透液回收槽,經由該滲透液回收槽回收使用後之滲透液供重覆循環使用。According to claim 3, the orderly arrangement of graphene carbon nanotubes on a metal substrate and a carbon deposition composite coating manufacturing method, wherein the furnace body of the vacuum infiltration furnace is connected with a permeate recovery tank through which the permeate The recovery tank recovers the used permeate for repeated recycling. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該金屬基材係為鋁含量≧99.7%之高純度鋁箔、銅含量99.7%之高純度銅箔任一種。The method for manufacturing an orderly arrangement and carbon deposition composite coating of graphene carbon nanotubes on a metal substrate according to claim 1, wherein the metal substrate is a high-purity aluminum foil with an aluminum content of ≧99.7%, and a copper content of 99.7 % Of any kind of high-purity copper foil. 如請求項1或5所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該金屬基材於雙面係經化學粗鍍、電化學腐蝕、噴塗、蒸濺鍍任一種方式在表面形成有凹凸粗糙部。According to claim 1 or 5, the orderly arrangement of graphene carbon nanotubes on a metal substrate and the carbon deposition composite coating manufacturing method, wherein the metal substrate is subjected to rough chemical plating, electrochemical corrosion, Either spraying or sputtering has uneven roughness formed on the surface. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該真空磁控濺鍍靶機為平面真空磁控濺鍍靶機、圓形平面真空磁控濺鍍靶機、圓柱形磁真空磁控濺鍍靶機任一種。According to claim 1, the orderly arrangement and carbon deposition composite coating manufacturing method of graphene carbon nanotubes on a metal substrate, wherein the vacuum magnetron sputtering target machine is a plane vacuum magnetron sputtering target machine, a circular Either a flat plane vacuum magnetron sputtering target machine or a cylindrical magnetic vacuum magnetron sputtering target machine. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該濺鍍靶材的靶材面工作維持在至多150℃以下,同時該真空磁控濺鍍機之腔體內的工作溫度至少300℃以上、真空度在0.1Pa以下。According to claim 1, the orderly arrangement of graphene carbon nanotubes on metal substrates and the carbon deposition composite coating manufacturing method, wherein the target surface of the sputtering target is maintained at most 150°C or less, while the The working temperature in the cavity of the vacuum magnetron sputtering machine is at least 300℃ and the vacuum degree is below 0.1Pa. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該有機金屬鹽係為鐵、鈷、鎳任一種。The method for manufacturing a composite coating of ordered arrangement and carbon deposition of graphene carbon nanotubes on a metal substrate according to claim 1, wherein the organometallic salt is any one of iron, cobalt, and nickel. 如請求項1所述金屬基材之石墨烯碳奈米管之有序排列與碳沉積複合塗層製造方法,其中,該金屬基材之凹凸粗糙部上所形成的該碳結構層係為碳奈米管、石墨烯任一種或兩種之組合。The method for manufacturing a composite coating of ordered arrangement and carbon deposition of graphene carbon nanotubes on a metal substrate according to claim 1, wherein the carbon structure layer formed on the uneven portion of the metal substrate is carbon Any one or a combination of nanotubes and graphene.
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