TW202133309A - Loading device of wafer carrier and loading method thereof including a carrier, a main calibration mechanism, a wafer calibration mechanism and a feeding mechanism - Google Patents

Abstract

A loading device for a wafer carrier and a loading method thereof are provided, in which a carrier, a main calibration mechanism, a wafer calibration mechanism and a feeding mechanism are respectively provided within the movable range of first and second robot arms. The first robot arm is equipped with an image capturing assembly and a wafer positioning member loading and unloading mechanism, and the second robot arm is equipped with a wafer pick-and-place mechanism. The first robot arm drives the image capturing assembly to move to the main calibration mechanism to calibrate its imaging range, and then drives the wafer positioning member loading and unloading mechanism to move to the main calibration mechanism to calibrate its working position, so as to correctly align the image capturing assembly with one of wafer trays of the carrier, and then remove the wafer positioning member on the wafer tray by the wafer positioning part loading and unloading mechanism. The second robot arm drives the wafer pick-and-place mechanism to move to the main calibration mechanism to correct its working position, and the wafer is taken out by the feeding mechanism and placed in the wafer calibration mechanism. The wafer notch is adjusted to a correct angle, and then the wafer is moved to the wafer tray. The image capturing assembly is used to confirm whether the wafer is intact, then combine the wafer positioning member on the wafer tray, and press it on the periphery of the wafer to complete positioning.

Description

Placement device and placement method of wafer carrier plate

The present invention relates to a placing device and a placing method of a wafer carrier, and in particular to a placing device and method that can reduce labor costs and ensure the direction and accuracy of wafer placement on the wafer tray.

The general integrated circuit (IC) manufacturing process can be divided into three parts: silicon wafer manufacturing, integrated circuit manufacturing, and integrated circuit packaging; when the silicon ingot is cut into wafers, it needs After yellow light, crystal growth, etching, mechanical polishing and other complicated procedures, the production of the integrated circuit can be completed. In the above manufacturing process, the wafer is tested, cleaned, evaporated, dried or soaked. For organic solvents and other processes, in order to effectively fix the wafers for processing, each wafer needs to be fixed on a wafer tray first, and each wafer tray carries each wafer to perform the processing operations of the above processes .

The basic structure of the conventional wafer disk is a disk body with an area slightly larger than the outer diameter of the wafer. A separable ring frame is provided above the disk body to define a position for accommodating the wafer. A plurality of buckling mechanisms are arranged on the periphery of the disc body, and the annular frame body can be clamped by the buckling mechanisms to be pressed on the periphery of the wafer to form a positioning.

In practical applications, in order to process a larger amount of wafers at the same time, most of the wafer trays are placed on a large-area carrier tray, which can accommodate multiple wafer trays and move them to different types at the same time. Processing procedures to effectively increase the efficiency of wafer processing.

With the gradual popularity of automated processing, the use of robotic arms to place and fix each wafer on each wafer tray in the carrier not only saves a lot of manpower, but also reduces production costs and improves processing efficiency. It is an inevitable trend, and because the general wafer processing requires extremely high precision, a flat cut notch is provided on the edge of the wafer to ensure the accuracy of its placement. In this way, it also forms the direction of the wafer placement. Therefore, how to overcome the requirements and limitations of wafer placement direction and accuracy under the operational requirements of using robotic arms to place each wafer is an urgent task for all related industries.

In view of the above-mentioned shortcomings of conventional processing devices and methods for placing wafers in a wafer tray on a carrier tray, the inventors have studied and improved ways to address these shortcomings, and finally the present invention has been produced.

The main purpose of the present invention is to provide a wafer carrier tray placement device and placement method, which are mainly provided with an image grabbing assembly and a wafer positioning member loading and unloading mechanism on a first robotic arm, and a second robotic arm There is a wafer pick-and-place mechanism, and a carrier plate, a main calibration mechanism, a wafer calibration mechanism and a feeding mechanism are respectively built within the movable range of the first and second robot arms. The first mechanism is used first. The arm drives the image capture assembly to the main calibration mechanism to calibrate the accuracy of the imaging range, and then the first mechanical arm drives the wafer positioning member loading and unloading mechanism to the main calibration mechanism to calibrate its operating position and store it in memory The relative position coordinates between the wafer positioning member loading and unloading mechanism and the image capturing range of the image grabbing assembly, and then moving the image grabbing assembly to the top of the carrier to obtain an image of one of the wafer trays on the carrier, and correct it Correspondingly, the first mechanical arm then refers to the relative position coordinates, drives the wafer positioning member loading and unloading mechanism to align the wafer tray, and takes out the wafer positioning member pre-fixed on the periphery of the wafer tray, and then the second mechanical arm The arm drives the wafer pick-and-place mechanism to the main calibration mechanism to calibrate the working position of the wafer pick-and-place mechanism, and then from the wafer pick-and-place mechanism to the feeding mechanism, take out the wafer to be processed and place it on the The wafer calibration mechanism is used to obtain the code of the wafer, and adjust the notch of the wafer to the correct angle, and then the wafer is moved on the wafer tray by the wafer pick-and-place mechanism, and finally, The first robotic arm drives the image grabbing assembly to the carrier tray, confirms whether the wafer on the wafer tray is complete, and then drives the wafer positioning member loading and unloading mechanism to combine the wafer positioning member on the wafer tray And the wafer positioning member can be pressed on the periphery of the wafer to form a positioning, so as to complete an automated processing operation of accurately and quickly displacing each wafer onto the wafer carrier.

In order to achieve the above objectives and effects, the technical means adopted by the present invention include: a wafer carrier tray placement device, at least including: a first mechanical arm connected and driven by a control module, in the first mechanical The movable end of the arm is provided with at least one image grabbing component; a second robotic arm is connected and driven by the control module, and the movable end of the second robotic arm is provided with a wafer pick-and-place mechanism; a carrier plate, It is set in the movable range of the first and second robot arms, and is connected and driven by the control module. The carrier is provided with at least one wafer tray for holding wafers; a main calibration mechanism is provided Within the range of movement of the first and second robot arms, and are connected and driven by the control module to calibrate the positions of the image grabbing assembly and the wafer pick-and-place mechanism respectively; a wafer calibration mechanism is set in The second robot arm is within the range of motion, and is connected and driven by the control module for reading the code of the inserted wafer and adjusting the gap of the wafer; a feeding mechanism is arranged on the first 2. Within the movable range of the robotic arm, for storing multiple wafers to be processed.

According to the above structure, each wafer is fixed on the wafer tray via a lockable wafer positioning member, and the movable end of the first robot arm is additionally provided with a wafer capable of loading and unloading the wafer positioning member Positioning member loading and unloading mechanism.

According to the above structure, the image capturing component has an upper image capturing element that can generate illuminating light, the main correction mechanism has a lower image capturing element, a transparent sheet is arranged above the lower image capturing element, and a function is provided on the transparent sheet The standard scale of the positioning reference; the wafer positioning member loading and unloading mechanism has a positioning surface, and a positioning scale is provided on the positioning surface; the wafer pick-and-place mechanism has a wafer chuck that can suck wafers on the wafer chuck There is an indicating scale.

According to the above structure, the wafer positioning member loading and unloading mechanism is provided with a plurality of laser light sources on the outer side of the positioning surface.

According to the above structure, the main correction mechanism is provided with a range-finding laser light source beside the lower image-taking element.

According to the above structure, the feeding mechanism is a cassette with a accommodating space inside, the cassette is arranged on a lifting mechanism, the lifting mechanism is connected and driven by the control module to adjust the setting The height of the magazine.

According to the above structure, the disc carrier is arranged on a sliding mechanism, the sliding mechanism has a sliding seat, and the sliding seat can move along a plurality of sliding guide rails extending in parallel, and the sliding seat is arranged on the sliding seat. There is a pivot seat for holding the tray.

According to the above structure, an outer cover is provided above the carrier, and a recess is provided on the outer cover, so that a part of the wafer disk on the carrier can be exposed to the outside.

According to the above structure, the wafer calibration mechanism has a supporting base for placing wafers, the center of the supporting base is through, and an image capturing unit is arranged above the supporting base. A suction head with a vacuum suction hole is arranged under the through part, and the suction head can be driven by a transposition mechanism to lift and pivot.

The technical means adopted by the present invention further includes: a placement method using the placement device of the aforementioned wafer carrier, at least including: a step of "correcting the imaging range of the image capture component", which is driven by the first mechanical arm The image grabbing assembly is moved to the main calibration mechanism to calibrate the imaging range of the image grabbing assembly to the correct position; a "wafer positioning assembly handling mechanism calibration operation position" step is to drive the wafer positioning by the first robot arm The positioning surface of the piece loading and unloading mechanism is moved to the main correction mechanism to adjust and calibrate the operating position of the wafer positioning piece loading and unloading mechanism, and the control module can compare and memorize the operating position of the wafer positioning piece loading and unloading mechanism with the image grabbing assembly Obtain the relative positional coordinates between the image ranges; a step of "the image grabbing assembly correctly corresponds to the wafer tray" is that the first robot arm drives the image grabbing assembly to move to the top of the carrier, and corrects the position to accurately correspond to One of the wafer trays on the carrier tray; a step of "wafer positioning element loading and unloading mechanism removes the wafer positioning element from the wafer tray", the control module refers to the relative position coordinates, and passes through the first mechanical The arm drives the wafer positioner loading and unloading mechanism to align the wafer tray with the positioning surface, and take out the wafer positioner preset on the periphery of the wafer tray; a "wafer pick-and-place mechanism calibration operation position" step is The wafer pick-and-place mechanism is driven by the second mechanical arm to move to the main correction mechanism to correct the working position of the wafer pick-and-place mechanism; a "wafer pick-and-place mechanism places the wafer on the wafer correction mechanism The step is to drive the wafer pick-and-place mechanism to the feeding mechanism to take out the wafer to be processed by the second robot arm, and place the wafer on the support seat of the wafer calibration mechanism; The "wafer calibration mechanism reads the code of the wafer and turns the wafer notch to the correct angle" step is to obtain the code and notch position of the wafer by the imaging unit of the wafer calibration mechanism, and then turn it The placement mechanism drives the suction head to suck up the wafer and rotates the wafer to adjust the wafer gap to the correct angle; then the placement mechanism drives the suction head to suck the wafer down to move the wafer down. The circle is placed on the supporting seat; a "wafer pick-and-place mechanism transfers the wafer to the wafer tray" step, the second robotic arm drives the wafer pick-and-place mechanism to transfer the wafer from the support Take it out of the holder and place it on the wafer tray of the carrier; a step of "the image grabbing assembly obtains the image of the wafer" is driven by the first robotic arm to move the image grabbing assembly to the carrier, and Obtain the image of the previously placed wafer to confirm whether the wafer is intact; a "wafer locator loading and unloading mechanism installs the wafer locator on the wafer tray to fix the wafer" step is performed by the first The mechanical arm drives the wafer positioning member loading and unloading mechanism to combine the wafer positioning member on the wafer tray, and the wafer positioning member is pressed against the periphery of the wafer to form a positioning.

According to the above method, a lower image capturing element is built in the main calibration mechanism, a transparent sheet is set above the lower image capturing element, and a standard scale is set on the transparent sheet as a positioning reference; an upper capturing element is built in the image capturing assembly If there is a position deviation between the standard scale position in the imaging range of the upper imaging element and the standard scale position in the imaging range of the lower imaging element, the control module passes through the first mechanical arm Drive the image capture component to adjust the position so that the standard scale positions in the imaging range of the upper and lower image capture components overlap, that is, the imaging range of the image capture component can be corrected to the correct position.

According to the above method, a lower image capturing element is built in the main calibration mechanism, a transparent sheet is set above the lower image capturing element, and a standard scale is set on the transparent sheet as a positioning reference; the wafer pick-and-place mechanism is provided There is an indicating scale; if the standard scale position in the imaging range of the lower imaging element is deviated from the indicating scale on the wafer pick-and-place mechanism, the control module drives the wafer pick-up via the second mechanical arm The position of the placement mechanism is adjusted so that the indicating scale overlaps the standard scale, that is, the working position of the wafer picking and placement mechanism can be corrected to the correct position.

According to the above method, a lower image capturing element is built in the main calibration mechanism, a transparent sheet is provided above the lower image capturing element, and a standard scale is provided on the transparent sheet as a positioning reference; the positioning of the wafer positioning member loading and unloading mechanism A positioning scale is provided on the surface; if a position deviation occurs between the standard scale position in the imaging range of the lower imaging element and the positioning scale on the positioning surface, the control module drives the crystal through the first mechanical arm The position of the mounting and unloading mechanism of the circular positioning piece is adjusted so that the positioning scale overlaps the standard scale, that is, the working position of the loading and unloading mechanism of the wafer positioning piece can be corrected to the correct position.

According to the above method, a range-finding laser light source is built in the main calibration mechanism, and the range-finding laser light source can generate a laser beam to measure the image grabbing assembly, wafer positioning member loading and unloading mechanism, and wafer pick-and-place The distance between the mechanism and the lower image capturing element is used to adjust the lens focal length of the lower image capturing element through the control module.

According to the above method, at least three laser light sources are built on the periphery of the wafer positioner handling mechanism. In the step of "wafer positioner handling mechanism removing the wafer positioner from the wafer tray", the control The module drives the wafer positioning member loading and unloading mechanism to adjust the position through the first mechanical arm, so that the laser beams of the same length generated by the laser light sources can be projected on the wafer tray together, so that the wafer can be positioned The piece loading and unloading mechanism correctly corresponds to the wafer tray.

According to the above method, the wafer calibration mechanism is provided with at least a supporting seat, an imaging unit and a transposition mechanism, the supporting seat is for supporting the wafer, and the imaging unit obtains the wafer Encoding and notch position, the transposition mechanism can drive the wafer to rotate to adjust the wafer notch to the correct angle.

In order to obtain a more detailed understanding of the above-mentioned objects, effects and features of the present invention, the following descriptions are given with reference to the following drawings:

Please refer to Figures 1 and 2, it can be seen that the main structure of the present invention includes: the first robot arm 1, the second robot arm 2, the carrier 3, the main calibration mechanism 4, the wafer calibration mechanism 5 and the feeding mechanism 6, etc. Part; the first robotic arm 1 is connected and driven by a control module (which can be a computer with computing functions, not shown), and the movable end of the first robotic arm 1 is provided with an image grabbing component 11 And a wafer positioning member loading and unloading mechanism 12.

In a feasible embodiment, the image capture component 11 has an image capture element 111 (which can be a CCD camera) on which the illuminating light can be generated; the wafer positioning member handling mechanism 12 is provided with a positioning surface 121, the positioning The surface 121 (center) is provided with a positioning scale 122 (may be a hole), at least two opposite clamping members 123 are provided on the outer peripheral side of the positioning surface 121, and the wafer positioning member handling mechanism 12 is provided with a plurality of evenly distributed peripheral sides The laser light source 124, the plurality of laser light sources 124 are respectively arranged on at least three points outside the positioning surface 121.

The second robotic arm 2 is connected to and driven by the control module. The movable end of the second robotic arm 2 is provided with a wafer pick-and-place mechanism 21 (which can be a wafer chuck) capable of adsorbing wafers 60; In a feasible embodiment, an indicator scale 211 is provided on the wafer pick-and-place mechanism 21 (wafer chuck).

The carrier 3 is arranged in the movable range of the first and second robot arms 1, 2 and is connected and driven by the control module. A plurality of wafer trays 31 are arranged at different positions on the carrier 3. Each wafer tray 31 is respectively provided with a lockable wafer positioning member 311 (may be a pressing ring).

In a possible embodiment, the tray 3 is disposed on a sliding mechanism 33, and the sliding mechanism 33 has a sliding seat 331, and the sliding seat 331 is arranged on a plurality of sliding guide rails 332 extending in parallel. On the sliding seat 331 is provided with a pivot seat 333 for supporting the tray 3; and a cover 32 is fixed above the tray 3, and a recessed notch 321 is provided on the cover 32 to allow the load The partial wafer disk 31 on the disk 3 is exposed to the outside, and the sliding mechanism 33 is operated by the control module, so that the sliding seat 331 can drive the pivot seat 333 to slide between the two ends of the sliding guide 332. The tray 3 can be driven to pivot via the pivot seat 333.

The main calibration mechanism 4 is set in the movable range of the first and second robot arms 1, 2 and is connected and driven by the control module to calibrate the image grabbing assembly 11 and the wafer positioning member loading and unloading mechanism respectively 12 and the wafer pick-and-place mechanism 21 to keep them in the correct positions respectively.

In a feasible embodiment, the main correction mechanism 4 has a lower image capturing element 42 that can generate illuminating light and at least one range-finding laser light source 41 with a range-finding function; the lower image capturing element 42 may be a In the CCD camera, a transparent sheet 43 is arranged above the lower image capturing element 42, and a standard scale 431 is arranged in the center of the transparent sheet 43.

The wafer correction mechanism 5 is arranged in the movable range of the second robot arm 2 and is connected and driven by the control module; in this embodiment, the wafer correction mechanism 5 has a The holding seat 51 of the wafer 60 has a through hole in the center of the holding seat 51, an image capturing unit 52 is arranged above the holding seat 51, and a suction head 53 with a vacuum suction hole is arranged below the through hole to For sucking the wafer 60, the sucking head 53 can be driven by a transposition mechanism 54 to perform lifting and pivoting movements.

The feeding mechanism 6 (which may be a feeding cassette) is arranged in the movable range of the second robot arm 2 and can accommodate a plurality of wafers 60 to be processed in the inside thereof.

In practical applications, a lifting mechanism 61 can be provided below the feeding mechanism 6 as needed, and the lifting mechanism 61 can drive the feeding mechanism 6 to raise or lower the position.

Please refer to Figure 3, it can be seen that the placement method of the present invention includes: "Image grabbing assembly correction image capture range" S11, "Wafer positioning member loading and unloading mechanism correction operation position" S12, "Image grabbing assembly correctly corresponds to the wafer "Tank" S13, "Wafer locator loading and unloading mechanism to remove the wafer locator from the wafer tray" S14, "Wafer pick-and-place mechanism calibration operation position" S15, "Wafer pick-and-place mechanism to place the wafer on the wafer "On the calibration mechanism" S16, "The wafer calibration mechanism reads the code of the wafer and turns the wafer notch to the correct angle" S17, "The wafer pick-and-place mechanism transfers the wafer to the wafer tray" S18, " The image grabbing component obtains the image of the wafer" S19, "The wafer positioner is mounted on the wafer tray by the wafer positioner loading and unloading mechanism to fix the wafer" S20 and other steps; refer to Figures 4 to 17 below, and In conjunction with the structure of Figures 1 and 2, explain the above steps respectively:

First, in the step S11 of "correcting the image capturing range of the image capture assembly", the first mechanical arm 1 drives the image capture assembly 11 to move to the main correction mechanism 4 (as shown in Fig. 4) to adjust and correct the The image grabbing component 11 obtains the image range to the correct position.

In this embodiment, when the first mechanical arm 1 drives the image capture assembly 11 to approach the main correction mechanism 4, the lower image capture element 42 directly obtains the position of the standard scale 431 on the transparent sheet 43, and the main The correction mechanism 4 utilizes the laser beam 411 generated by the distance measuring laser light source 41 to project onto the image capture component 11, so as to measure the distance of the image capture component 11 to adjust the lens focal length of the lower image capture component 42; and The image capturing component 11 obtains the position of the standard scale 431 on the transparent sheet 43 through the upper image capturing element 111, and the control module compares the position of the standard scale 431 obtained by the lower image capturing element 42 with the image capturing element. The component 11 obtains the difference between the position of the standard scale 431, and adjusts the position of the image grabbing component 11 through the first robot arm 1, so that the position of the standard scale 431 obtained by the lower image capturing element 42 and the upper image capturing element 111 obtain The images of the standard scale 431 are superimposed, and then the control module memorizes the coordinates of the correct image capturing range of the image capture unit 11, so as to achieve the purpose of correcting the image capture range of the image capture unit 11.

In the step S12 of "wafer positioning member handling mechanism calibration operation position", the first robot arm 1 drives the positioning surface 121 of the wafer positioning member handling mechanism 12 to move to the main calibration mechanism 4 (as shown in Figure 5). Show) to adjust and calibrate the working position of the wafer positioning member handling mechanism 12, and the control module can compare and memorize the relative position between the working position of the wafer positioning member handling mechanism 12 and the image range obtained by the image grabbing assembly 11 coordinate.

In this embodiment, when the first mechanical arm 1 drives the wafer positioning member loading and unloading mechanism 12 to approach the main correction mechanism 4, the main correction mechanism 4 uses the laser light generated by the distance measuring laser light source 41 to project To the positioning surface 121 to measure the distance of the wafer positioning member mounting and dismounting mechanism 12 to adjust the lens focal length of the lower image capturing element 42; and the lower image capturing element 42 can observe the standard scale 431 on the transparent sheet 43 And the position difference between the positioning scale 122 (or hole) on the positioning surface 121, and the control module drives the wafer positioning member loading and unloading mechanism 12 through the first robot arm 1 to adjust the position, so that the positioning surface 121 The upper positioning scale 122 (or hole) overlaps the standard scale 431 position, so that the working position of the wafer positioning member handling mechanism 12 can be corrected to the correct position.

In the step S13 of "the image grabbing assembly correctly corresponds to the wafer tray", the first robot arm 1 drives the image grabbing assembly 11 to move to the top of the carrier tray 3 (as shown in Figure 6) to confirm the wafer The position of the disk 31 and check the condition on the wafer disk 31 (whether there are remaining chips or fragments of the wafer 60).

In step S14 of the "wafer positioning member loading and unloading mechanism removes the wafer positioning member from the wafer tray", the control module refers to the relative position coordinates, and drives the wafer positioning member loading and unloading mechanism via the first robot arm 1 12 approach the wafer tray 31, and use the control module to drive the wafer positioning member loading and unloading mechanism 12 to adjust the position via the first robot arm 1, so that the plurality of (at least three) laser light sources 124 generate mines of the same length The beams can be projected on the wafer disk 31 together, so that the positioning surface 121 is aligned (parallel to) the wafer disk 31 (as shown in Figure 7), and the periphery of the wafer disk 31 is preset After the wafer positioning member 311 is unlocked, the clamping member 123 is used to take out the wafer positioning member 311 and maintain the clamping state (as shown in Figures 8 and 9).

In the step S15 of "wafer pick-and-place mechanism calibration operation position", the second robot arm 2 drives the wafer pick-and-place mechanism 21 to move to the main calibration mechanism 4 (as shown in Figure 10, in order to facilitate the inspection of the The main calibration mechanism 4 does not show the wafer calibration mechanism 5) to calibrate the position of the wafer pick-and-place mechanism 21.

In this embodiment, when the second mechanical arm 2 drives the wafer pick-and-place mechanism 21 to approach the main correction mechanism 4, the main correction mechanism 4 uses the laser light generated by the distance measuring laser light source 41 to project to The wafer pick-and-place mechanism 21 is used to measure the distance of the wafer pick-and-place mechanism 21 to adjust the lens focal length of the lower image capturing element 42; and the lower image capturing element 42 can observe the standard scale on the transparent sheet 43 The position difference between 431 and the indicating scale 211 on the wafer pick-and-place mechanism 21, and the control module drives the wafer pick-and-place mechanism 21 to adjust the position via the second robot arm 2 to make the wafer pick-and-place The indicator scale 211 and the standard scale 431 on the mechanism 21 are overlapped, so that the working position of the wafer pick-and-place mechanism 21 can be calibrated to the correct position.

In step S16 of the "wafer pick-and-place mechanism placing the wafer on the wafer calibration mechanism", the second robotic arm 2 drives the wafer pick-and-place mechanism 21 to move to the feeding mechanism 6 to take out the wafer to be processed. Circle 60 (as shown in Fig. 11), and place the wafer 60 on the supporting seat 51 of the wafer calibration mechanism 5 (as shown in Fig. 12).

The "wafer calibration mechanism reads the code of the wafer and turns the notch of the wafer to the correct angle" in step S17. The imaging unit 52 of the wafer calibration mechanism 5 first obtains the code and notch of the wafer 60 Position (as shown in Fig. 13), the control module calculates the angle to be adjusted for the wafer 60 according to the notch position of the wafer tray 31 to be inserted, and the transposition mechanism 54 drives the suction head 53 The wafer 60 is sucked up (away from the holder 51), and the wafer 60 is rotated to adjust the notch of the wafer 60 to the correct angle; then the transposition mechanism 54 drives the suction head 53 to suck the wafer The circle 60 descends to place the wafer 60 back on the supporting seat 51.

The "wafer pick-and-place mechanism transfers the wafer to the wafer tray" in step S18. The second robot arm 2 drives the wafer pick-and-place mechanism 21 to transfer the wafer 60 with the correct notch angle from the wafer. The calibration mechanism 5 is removed from the supporting seat 51 and placed on the wafer tray 31 of the carrier tray 3 (as shown in FIG. 14).

The "image grabbing assembly obtains the image of the wafer" S19 is driven by the first robotic arm 1 to move the image grabbing assembly 11 to the carrier 3 (as shown in Figure 15), and obtain the placement in the previous step Image of the wafer 60 to confirm whether the wafer 60 is complete and placed in the correct position.

The "wafer positioner loading and unloading mechanism installs the wafer positioner on the wafer tray to fix the wafer" in step S20. The first robot arm 1 drives the wafer positioner loading and unloading mechanism 12 to clamp the wafer. The wafer positioning member 311 clamped by the member 123 is coupled to the wafer tray 31 (as shown in FIG. 16), and the wafer positioning member 311 is pressed against the periphery of the wafer 60 to form a positioning (such as Shown in Figure 17).

Then, the pivot seat 333 drives the tray 3 to rotate, so that the wafer tray 31 that has loaded the wafer 60 is turned under the cover 32, and the other wafer tray 31 without the wafer 60 is moved to the The undercut 321 of the outer cover 32 is exposed, so that the above steps S13, S14, S16, S17, S18, S19, S20 can be repeated in order to fix the different wafers 60 on the wafer trays 31; finally, After each wafer tray 31 of the carrier 3 has loaded the wafer 60, the sliding seat 331 of the sliding mechanism 33 slides outward along the sliding guide 332, so as to move the carrier 3 to the next Process.

In summary, the wafer carrier tray placement device and placement method of the present invention can indeed reduce labor costs and ensure the directionality and accuracy of wafer placement on the wafer tray, which is indeed a novelty. For advanced inventions, I filed an application for invention patents in accordance with the law; however, the content of the above description is only a description of the preferred embodiments of the present invention, and all changes, modifications, changes or equivalents extended by the technical means and scope of the present invention Any replacement should also fall within the scope of the patent application of the present invention.

1: The first robotic arm

11: Image grabbing component

111: Upper imaging element

12: Wafer positioning part loading and unloading mechanism

121: positioning surface

122: positioning scale

123: Clamping parts

124: Laser light source

2: The second robotic arm

21: Wafer pick-and-place mechanism

211: Indicating scale

3: Carrying disk

31: Wafer tray

311: Wafer locator

32: outer cover

321: Notch

33: Sliding mechanism

331: sliding seat

332: Sliding rail

333: pivot seat

4: Main calibration mechanism

41: Ranging laser light source

411: Laser beam

42: Lower imaging element

43: transparent sheet

431: standard scale

5: Wafer calibration mechanism

51: Socket

52: Acquisition unit

53: suction head

54: Transpose organization

6: Feeding mechanism

60: Wafer

61: Lifting mechanism

S11: Correction of image capture range by image capture component

S12: Wafer positioning part loading and unloading mechanism corrects the working position

S13: The image capture component correctly corresponds to the wafer tray

S14: Wafer locator loading and unloading mechanism to remove the wafer locator from the wafer tray

S15: Wafer pick-and-place mechanism to correct the working position

S16: Wafer pick-and-place mechanism places the wafer on the wafer calibration mechanism

S17: Wafer calibration mechanism reads the code of the wafer and turns the notch of the wafer to the correct angle

S18: The wafer pick-and-place mechanism transfers the wafers to the wafer tray

S19: Image grabbing component to obtain wafer image

S20: The wafer positioning member loading and unloading mechanism installs the wafer positioning member on the wafer tray to fix the wafer

Figure 1 is a complete three-dimensional structure diagram of the present invention with a partial decomposition of the carrier plate.

Figure 2 is a partial enlarged schematic diagram of the main correction mechanism of the present invention.

Figure 3 is a flowchart of the placement method of the present invention.

Figure 4 is a schematic diagram of the state of the image capture assembly of the present invention being calibrated above the main calibration mechanism.

Fig. 5 is a schematic diagram of the state of the wafer positioning member loading and unloading mechanism of the present invention in the correction position above the main correction mechanism.

Figure 6 is a schematic diagram of the state where the image grabbing assembly of the present invention is correctly corresponding to the wafer tray above the carrier tray.

FIG. 7 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to grab the wafer positioning member.

Fig. 8 is a schematic diagram of the state of removing the wafer positioning member by the wafer positioning member loading and unloading mechanism of the present invention.

Figure 9 is a partial enlarged schematic diagram of part A in Figure 8.

Fig. 10 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention in the correction position above the main correction mechanism.

Figure 11 is a schematic diagram of the wafer pick-and-place mechanism of the present invention taking out the wafer from the feeding mechanism.

FIG. 12 is a schematic diagram of the operation of the wafer pick-and-place mechanism of the present invention when the wafer is placed on the wafer calibration mechanism.

Figure 13 is a schematic diagram of the state of the wafer calibration mechanism of the present invention to calibrate the wafer.

FIG. 14 is a schematic diagram of the state of the wafer pick-and-place mechanism of the present invention moving the wafer onto the wafer tray.

Figure 15 is a schematic diagram of the state of the image grabbing assembly of the present invention confirming the position of the wafer on the carrier.

FIG. 16 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention is moved to the wafer tray to install the wafer positioning member.

FIG. 17 is a schematic diagram of the state where the wafer positioning member loading and unloading mechanism of the present invention is moved back to the initial position and the wafer positioning member is fixed on the wafer tray.

1: The first robotic arm

11: Image grabbing component

111: Upper imaging element

12: Wafer positioning part loading and unloading mechanism

121: positioning surface

122: positioning scale

123: Clamping parts

124: Laser light source

2: The second robotic arm

21: Wafer pick-and-place mechanism

211: Indicating scale

3: carrier

31: Wafer tray

311: Wafer locator

32: outer cover

321: Notch

33: Sliding mechanism

331: sliding seat

332: Sliding rail

333: pivot seat

4: Main calibration mechanism

41: Ranging laser light source

411: Laser beam

42: Lower imaging element

43: transparent sheet

431: standard scale

5: Wafer calibration mechanism

51: Socket

52: Acquisition unit

53: suction head

54: Transpose organization

6: Feeding mechanism

60: Wafer

61: Lifting mechanism

Claims (21)

A placement device for a wafer carrier disc, at least comprising: A first mechanical arm is connected and driven by a control module, and at least one image capture component is provided on the movable end of the first mechanical arm; A second robot arm is connected and driven by the control module, and a wafer pick-and-place mechanism is provided on the movable end of the second robot arm; A carrier plate is set within the movable range of the first and second robot arms and is connected and driven by the control module. The carrier plate is provided with at least one wafer tray for holding wafers; A main calibration mechanism is set in the movable range of the first and second robot arms, and is connected and driven by the control module to calibrate the positions of the image grabbing assembly and the wafer pick-and-place mechanism respectively; A wafer calibration mechanism is set in the movable range of the second robot arm, and is connected and driven by the control module for reading the code of the inserted wafer and adjusting the gap of the wafer; A feeding mechanism is arranged in the movable range of the second mechanical arm for storing a plurality of wafers to be processed. As described in the first item of the patent application, each wafer is fixed on the wafer tray via a lockable wafer positioning member, and the movable end of the first robot arm There is also a wafer positioning member loading and unloading mechanism capable of loading and unloading the wafer positioning member. As described in the second item of the scope of patent application, the wafer carrier tray placement device, wherein the image capture component has an upper image capturing element that can generate illuminating light, and the main correction mechanism has a lower image capturing element to capture images from the bottom A transparent sheet is provided above the component, and a standard scale is provided on the transparent sheet as a positioning reference; the wafer positioning member loading and unloading mechanism has a positioning surface, and a positioning scale is provided on the positioning surface; the wafer pick-and-place mechanism has a A wafer chuck for sucking wafers is provided with an indicator scale on the wafer chuck. For the wafer carrier tray placement device described in item 3 of the scope of patent application, the wafer positioning member loading and unloading mechanism is provided with a plurality of laser light sources outside the positioning surface. As described in item 3 of the patent application, the main correction mechanism is provided with a range-finding laser light source beside the lower imaging element. For example, the wafer carrier tray placement device described in item 1, 2, or 3, 4, or 5 of the scope of the patent application, wherein the feeding mechanism is a cassette with a accommodating space inside, and the cassette is set in On a lifting mechanism, the lifting mechanism is connected and driven by the control module to adjust the height of the magazine. For example, the wafer carrier disk placement device described in item 1 or 2 or 3 or 4 or 5 of the scope of patent application, wherein the carrier disk is arranged on a sliding mechanism, the sliding mechanism has a sliding seat, and The sliding seat is movable along a plurality of sliding guide rails extending in parallel, and a pivot seat for supporting the tray is provided on the sliding seat. For example, the wafer carrier disk placement device described in the scope of patent application, wherein the carrier disk is arranged on a sliding mechanism, the sliding mechanism has a sliding seat, and the sliding seat can be parallel along a plurality of The extended sliding guide rail moves, and the sliding seat is provided with a pivot seat for supporting the tray. For example, in the wafer carrier tray placement device described in item 7 of the scope of patent application, a cover is provided on the carrier tray, and the cover is provided with a notch so that a part of the wafer tray on the carrier tray can be exposed to the outside. For example, the wafer carrier tray placement device described in the scope of patent application, wherein a cover is provided on the carrier tray, and the cover is provided with a notch so that a part of the wafer tray on the carrier tray can be exposed to the outside. For example, the wafer carrier tray placement device described in item 1 or 2 or 3 or 4 or 5 of the scope of patent application, wherein the wafer calibration mechanism has a holder for placing wafers, and the center of the holder It is a through-through, an image-taking unit is provided above the supporting base, and a suction head with a vacuum suction hole is provided under the through part of the supporting base. The suction head can be driven by a transposition mechanism to lift and pivot. change. For example, the wafer carrier tray placement device described in item 6 of the scope of patent application, wherein the wafer calibration mechanism has a supporting seat for placing wafers, and the center of the supporting seat is penetrated and placed on the supporting seat. An image capturing unit is arranged above the seat, and a suction head with a vacuum suction hole is arranged below the through part of the supporting seat. The suction head can be driven by a transposition mechanism to lift and pivot. For example, the wafer carrier tray placement device described in item 7 of the scope of patent application, wherein the wafer calibration mechanism has a holder for placing wafers. An image capturing unit is arranged above the base, and a suction head with a vacuum suction hole is arranged below the through part of the supporting base, and the suction head can be driven by a transposition mechanism to lift and pivot. For example, the wafer carrier tray placement device described in item 8 of the scope of patent application, wherein the wafer calibration mechanism has a holder for placing wafers, and the center of the holder is penetrated, and the holder An image capturing unit is arranged above the base, and a suction head with a vacuum suction hole is arranged below the through part of the supporting base, and the suction head can be driven by a transposition mechanism to lift and pivot. A placement method using the placement device of the aforementioned wafer carrier disc includes at least: A step of "calibrating the image capturing range of the image grabbing assembly" in which the first mechanical arm drives the image grabbing assembly to the main calibration mechanism to correct the image capturing range of the image grabbing assembly to the correct position; A step of "calibrating the working position of the wafer positioner loading and unloading mechanism" is in which the first robot arm drives the positioning surface of the wafer positioner loading and unloading mechanism to move to the main calibration mechanism to adjust and calibrate the wafer positioner loading and unloading mechanism The control module can compare and memorize the relative position coordinates between the operating position of the wafer positioning member loading and unloading mechanism and the image range obtained by the image grabbing assembly; A step of "the image grabbing component correctly corresponds to the wafer tray" is that the first robot arm drives the image grabbing component to move above the carrier and corrects the position to accurately correspond to one of the wafer trays on the carrier ； A step of "wafer positioning member loading and unloading mechanism removes the wafer positioning member from the wafer tray", the control module refers to the relative position coordinates, and the first robot arm drives the wafer positioning member loading and unloading mechanism to Align the positioning surface with the wafer tray, and take out the wafer positioning parts preset on the periphery of the wafer tray; A step of "calibrating the operating position of the wafer pick-and-place mechanism" in which the second robotic arm drives the wafer pick-and-place mechanism to the main correction mechanism to calibrate the operating position of the wafer pick-and-place mechanism; A "wafer pick-and-place mechanism places the wafer on the wafer calibration mechanism" step is that the second robotic arm drives the wafer pick-and-place mechanism to the feeding mechanism to take out the wafer to be processed, and The wafer is placed on the supporting seat of the wafer calibration mechanism; A "wafer calibration mechanism reads the code of the wafer and turns the notch of the wafer to the correct angle" step is to obtain the code and notch position of the wafer by the imaging unit of the wafer calibration mechanism, and then use the The transposition mechanism drives the suction head to suck the wafer up, and rotates the wafer to adjust the wafer notch to the correct angle; then the transposition mechanism drives the suction head to suck the wafer down to move the wafer down. The wafer is placed on the supporting seat; A "wafer pick-and-place mechanism transfers the wafer to the wafer tray" step is that the second robot arm drives the wafer pick-and-place mechanism to take the wafer out of the holder and place it on the carrier. On the wafer disk of the disk; A step of "the image grabbing assembly obtains the image of the wafer", in which the first robotic arm drives the image grabbing assembly to move to the carrier and obtains the image of the previously placed wafer to confirm whether the wafer is complete; A "wafer positioner loading and unloading mechanism installs the wafer positioner on the wafer tray to fix the wafer" step, the first robot arm drives the wafer positioner loading and unloading mechanism to combine the wafer positioner On the wafer tray, the wafer positioning member is pressed against the periphery of the wafer to form a positioning. For example, the placement method described in item 15 of the scope of patent application, wherein a lower image capturing element is built in the main correction mechanism, a transparent sheet is set above the lower image capturing element, and a standard scale is set on the transparent sheet as a positioning reference; An upper image capturing element is built in the image capturing component. If a position deviation occurs between the standard scale position in the image capturing range of the upper image capturing element and the standard scale position in the image capturing range of the lower image capturing element, then The control module drives the image capture assembly to adjust the position via the first mechanical arm, so that the standard scale positions in the image capture range of the upper and lower image capture elements overlap, that is, the image capture range of the image capture assembly can be corrected To the correct position. For example, the placement method described in item 15 of the scope of patent application, wherein a lower image capturing element is built in the main correction mechanism, a transparent sheet is set above the lower image capturing element, and a standard scale is set on the transparent sheet as a positioning reference There is an indicating scale on the wafer pick-and-place mechanism; if the standard scale position in the imaging range of the lower imaging element and the indicating scale on the wafer pick-and-place mechanism produce a positional deviation, the control module will pass The second mechanical arm drives the wafer pick-and-place mechanism to adjust the position so that the indicator scale overlaps the standard scale, that is, the working position of the wafer pick-and-place mechanism can be corrected to the correct position. For example, the placement method described in item 15 of the scope of patent application, wherein a lower image capturing element is built in the main correction mechanism, a transparent sheet is arranged above the lower image capturing element, and a standard scale is provided on the transparent sheet as a positioning reference; The positioning surface of the wafer positioning member loading and unloading mechanism is provided with a positioning scale; if there is a position deviation between the standard scale position in the imaging range of the lower imaging element and the positioning scale on the positioning surface, the control module The group drives the wafer positioning member loading and unloading mechanism to adjust the position via the first mechanical arm, so that the positioning scale overlaps the standard scale, that is, the working position of the wafer positioning member loading and unloading mechanism can be calibrated to the correct position. For example, the placement method described in item 15 of the scope of patent application, wherein a range-finding laser light source is built in the main correction mechanism, and the range-finding laser light source can generate a laser beam to measure the image capture component, crystal The distance between the circular positioning member mounting and dismounting mechanism and the wafer pick-and-place mechanism respectively and the lower image-taking element can be adjusted by the control module to adjust the lens focal length of the lower image-taking element. For example, the placement method described in item 15 of the scope of patent application, wherein at least three laser light sources are built on the periphery of the wafer positioning member loading and unloading mechanism. In the step of "circular positioning member", the control module is used to drive the wafer positioning member loading and unloading mechanism to adjust the position through the first mechanical arm, so that the laser beams of the same length generated by each laser light source can be projected on the wafer together On the disk, so that the wafer positioning member loading and unloading mechanism correctly corresponds to the wafer disk. For example, the placing method described in item 15 of the scope of patent application, wherein the wafer calibration mechanism is provided with at least a supporting seat, an image capturing unit and a transposition mechanism, and the supporting seat is used to hold the wafer The image capturing unit obtains the code and notch position of the wafer, and the transposition mechanism can drive the wafer to rotate to adjust the notch of the wafer to the correct angle.

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