TW202132519A - Bonding film, bonding film laminate comprising the same and metal clad laminate comprising the same - Google Patents

Abstract

The present invention provides an adhesive film, an adhesive film-attached laminate thereof, and a metal foil laminate thereof. The adhesive film is formed of an adhesive film composition containing an adhesive resin, an epoxy resin, and a filler, and the adhesive resin includes carboxylic acid-modified olefin resin and polyphenylene ether resin. After the adhesive film is cured, the dielectric constant (Dk) measured under the conditions of 1GHz to 10GHz and 20DEG C to 80DEG C is 2.6 or less, the dielectric loss (Df) is 0.005 or less, and after the adhesive film is cured, the moisture absorption rate is 0.1% or less.

Description

Adhesive film, its adhesive laminate and its metal foil laminate

The present invention relates to an adhesive film, an adhesive film adhesion laminate including the adhesive film, and a metal foil laminate including the adhesive film. In more detail, the present invention relates to an adhesive film, an adhesive film adhesion laminate including the same, and a metal foil laminate including the same. That is, in a wide range of temperatures and frequencies, the dielectric constant and dielectric loss are low, and moisture absorption Low rate, excellent adhesion and heat resistance.

Recently, with the trend toward integration, miniaturization, thinning, high density, and high bending of electronic products, there is an increasing need for printed circuit boards (PCBs) that can be easily built into smaller spaces. In particular, recently, a flexible printed circuit board (FPCB) with repeated bending properties has been developed. With the technological development of smart phones and portable mobile electronic devices, the use of flexible printed circuit boards has increased dramatically, and the demand for them has also increased.

Generally, in a flexible circuit board, a copper foil as a metal foil is laminated on a base film made of polyimide resin or the like as a base film. The base film and the metal foil are bonded to each other through the adhesive film. The existing conjunctiva is formed by polyimide adhesives, acrylonitrile butadiene rubber adhesives and the like. However, it is difficult for polyimide-based adhesives and acrylonitrile-butadiene rubber-based adhesives to reduce the dielectric constant and moisture absorption rate.

The background art of the present invention is disclosed in Korean Patent Publication No. 2016-0083204 and the like.

The problem to be solved by the invention

The object of the present invention is to provide an adhesive film with low dielectric constant, dielectric loss and moisture absorption rate.

Another object of the present invention is to provide an adhesive film with excellent adhesion and heat resistance.

Another object of the present invention is to provide an adhesive film with a low rate of change in dielectric constant and dielectric loss due to frequency changes and temperature changes.

Another object of the present invention is to provide an adhesive conjunctiva with a low minimum melt viscosity.

Another object of the present invention is to provide a conjunctival film with low electrical resistance and a proper range of ion mobility.

Another object of the present invention is to provide an adhesive film adhered laminate and a metal foil laminate having the adhesive film of the present invention.

Technical means to solve the problem

The adhesive film of the present invention may be formed of a composition containing adhesive resin, epoxy resin, and filler. The adhesive resin includes carboxylic acid-modified olefin resin and polyphenylene ether resin. After the adhesive film is cured, the temperature is between 1 GHz and 10 GHz. And measured under the conditions of 20℃ to 80℃, the dielectric constant (Dk) is 2.6 or less, the dielectric loss (dielectric loss, Df) is 0.005 or less, and the moisture absorption rate is 0.1% after the above-mentioned conjunctiva is hardened. the following.

In a specific embodiment, the above composition may not contain a hardener.

In a specific embodiment, the above-mentioned carboxylic acid-modified olefin resin may contain at least one of acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, maleic anhydride, itaconic anhydride, and fumaric anhydride. Modified olefin resin.

In a specific embodiment, the acid value of the above-mentioned carboxylic acid-modified olefin resin may be 0.5 mg CH ₃ ONa/g to 1.5 mg CH ₃ ONa/g.

In a specific embodiment, the difference between the glass transition temperature of the polyphenylene ether resin and the carboxylic acid-modified olefin resin may be 100°C to 250°C.

In a specific embodiment, the above-mentioned carboxylic acid-modified olefin resin may include a carboxylic acid-modified linear polypropylene resin.

In a specific embodiment, in 100 parts by weight of the aforementioned binder resin, 40 to 80 parts by weight of the aforementioned carboxylic acid-modified olefin resin and 20 to 60 parts by weight of the aforementioned polyphenylene ether resin may be included.

In a specific embodiment, the above-mentioned filler may include a mixture of inorganic nano-silica and fluororesin filler.

In a specific embodiment, relative to 100 parts by weight of the above-mentioned binder resin, it may comprise 1 part by weight to 10 parts by weight of the above-mentioned epoxy resin and 5 parts by weight to 40 parts by weight of the above-mentioned filler.

In a specific embodiment, at the same frequency, the ratio of the hardened dielectric constant to the hardened dielectric loss of the adhesive film may be more than 650, that is, the hardened dielectric constant/hardened dielectric The electrical loss can be 650 or more.

In a specific embodiment, the cured glass transition temperature of the adhesive film may be 60°C to 80°C.

The adhesive film adhesion laminate of the present invention includes: a polyimide resin film; and the adhesive film of the present invention formed on at least one side of the polyimide resin film.

The metal foil laminate of the present invention includes: a polyimide resin film; an adhesive film formed on at least one side of the polyimide resin film; and a metal foil formed on one side of the adhesive film, and the adhesive film is formed Between the polyimide resin film and the metal foil, the adhesive film is the adhesive film of the present invention.

Compare the effects of previous technologies

The invention provides an adhesive conjunctiva with low dielectric constant, dielectric loss and moisture absorption rate.

The present invention provides an adhesive film with excellent adhesion and heat resistance.

The present invention provides an adhesive film with a low rate of change of dielectric constant and dielectric loss caused by frequency change and temperature change.

The present invention provides a conjunctival film with a minimum melt viscosity and a low viscosity.

The present invention provides a conjunctival film with low electrical resistance and an appropriate range of ion mobility.

The present invention provides an adhesive film adhesion laminate and a metal foil laminate having the adhesive film of the present invention.

The following embodiments are used to illustrate the present invention in detail, so that those with ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The present invention can be embodied in many different forms, and is not limited to the embodiments described here. In the drawings, in order to clearly explain the present invention, parts that are not related to the description are omitted, and the same or similar structural elements are given the same symbols throughout the specification. In the figure, the length, thickness, etc. of each component are used for explaining the present invention, and the present invention is not limited to the length, thickness, etc. described in the figure.

In this specification, when describing a numerical range, "X to Y" means "X or more and Y or less (X≤and≤Y)".

The inventors of the present invention included a carboxylic acid-modified olefin-based resin and a polyphenylene ether-based resin as the adhesive resin in an adhesive film formed from a composition for an adhesive film containing a binder resin, an epoxy resin, and a filler. After the conjunctiva hardened, it was confirmed that the dielectric constant (Dk), the dielectric loss (Df), and the moisture absorption rate were significantly low, and the present invention was completed.

In this specification, "dielectric constant" and "dielectric loss" are values measured at 1 GHz to 10 GHz and 20°C to 80°C. Preferably, the dielectric constant and dielectric loss are values measured at 10 GHz and 25°C.

Although it will be described below, the conjunctiva of the present invention is in a semi-hardened state (Grade B).

As long as there is no special description in this specification, the "hardening" in "after hardening" means that the adhesive film is hardened at a temperature of 150°C to 190°C for 45 minutes to 90 minutes. That is, for example, the "dielectric constant after curing" means the dielectric constant measured after curing the adhesive film under the above-mentioned conditions.

In a wide frequency and a wide temperature range, the adhesive film of the present invention has a low dielectric constant and dielectric loss after curing, and when the metal foil described below is laminated, the reliability can be improved.

In a specific embodiment, the dielectric constant of the adhesive film after hardening may be 2.6 or less, for example, it may be 0 to 2.6. In the above range, static electricity or electric movement to the device to which the adhesive film is attached can be minimized, and thus the electrical influence on the adhesive film can be minimized.

In a specific embodiment, the dielectric loss of the adhesive film after hardening may be 0.005 or less, for example, it may be 0.0001 to 0.0049. In the above range, static electricity or electric movement to the device to which the adhesive film is attached can be minimized, and thus the electrical influence on the adhesive film can be minimized.

The adhesive film of the present invention can ensure the above-mentioned dielectric constant and dielectric loss, and the change rate of the dielectric constant and the change rate of the dielectric loss caused by the frequency change and the temperature change are low. As a result, uniform dielectric constant and dielectric loss can be ensured in a wide range of frequencies, thereby improving workability, and uniform dielectric constant and dielectric loss can be ensured in a wide range of temperatures, thereby ensuring Reliability based on temperature changes of the conjunctiva.

In a specific embodiment, in the conjunctiva, the change rate of the dielectric constant based on the frequency change of the following formula 1 may be 0.6% or less, for example, it may be 0% to 0.6%, based on the frequency change of the following formula 2 The rate of change of the amount of dielectric loss may be 0.01% or less, for example, it may be 0% to 0.01%. In the above range, the above-mentioned practicability and reliability can be ensured. [Formula 1] Change rate of dielectric constant =│Dk (@10GHz)－Dk (@1GHz)│/│10-1│×100

(In the above formula 1, Dk (@10GHz) is the dielectric constant of the adhesive film at a frequency of 10GHz after hardening, and Dk (@1GHz) is the dielectric constant of the adhesive film at a frequency of 1GHz after hardening). [Equation 2] The rate of change of dielectric loss=│Df (＠10GHz)－Df (＠1GHz)│/│10-1│×100

(In the above formula 2, Df (@10GHz) is the dielectric loss of the adhesive film at a frequency of 10GHz after hardening, and Df (@1GHz) is the dielectric loss of the adhesive film at a frequency of 1GHz after hardening).

Generally, the higher the measurement frequency, the higher the value of the dielectric constant of the conjunctiva, and the lower the measurement frequency, the higher the value of the dielectric loss of the conjunctiva. The adhesive film of the present invention can ensure the above-mentioned low dielectric constant and dielectric loss. In the frequency change, the rate of change of the dielectric constant and the rate of change of the dielectric loss can be reduced. Thus, the laminate described below can be improved. Practicability and reliability.

In a specific embodiment, in the conjunctiva, the change rate of the dielectric constant based on the temperature change of the following formula 3 may be 0.3% or less, for example, it may be 0% to 0.3%, based on the temperature change of the following formula 4 The rate of change of the amount of dielectric loss is 0.002% or less, for example, it may be 0% to 0.0015%. In the above range, the above-mentioned practicality and reliability can be ensured. [Equation 3] Change rate of dielectric constant=│Dk (＠80℃)－Dk (＠20℃)│/│80-20│×100

(In the above formula 3, Dk(＠80℃) is the dielectric constant at 80℃ of the conjunctiva after hardening, and Dk(＠20℃) is the dielectric constant at 20℃ of the conjunctiva after hardening. Electrical constant). [Equation 4] The rate of change of dielectric loss=│Df(＠80℃)－Df(＠20℃)│/│80-20│×100

(In the above formula 4, Df(＠80℃) is the dielectric loss at 80℃ of the conjunctiva after hardening, and Df(@20℃) is the dielectric loss at 20℃ of the conjunctiva after hardening. Power loss).

Generally, the higher the measurement temperature, the higher the dielectric constant and dielectric loss of the adhesive film. The adhesive film of the present invention can ensure the above-mentioned dielectric constant and dielectric loss, and reduce the rate of change of the dielectric constant and the rate of change of the dielectric loss during temperature changes, thereby improving the applicability in the above-mentioned laminate And reliability.

In one embodiment, the ratio of the hardened dielectric constant to the hardened dielectric loss (dielectric constant after hardening/dielectric loss after hardening) of the adhesive film at the same frequency can be more than 650, for example, From 650 to 1200. In the above range, when the adhesive film is applied to the laminate described below, the adhesion reliability can be improved, and the adhesion and electrical properties between the adherends can be improved.

In this manual, "moisture absorption rate" refers to the value measured by IPC-TM-650 2.6.2.1, immersed in water (immersion) for 24 hours at a temperature of 25°C and measured against the conjunctiva. Usually, the moisture permeability is measured in the adhesive base film and the metal foil adhesive film. As is well known by those of ordinary skill in the technical field of the present invention, the moisture permeability is to measure the degree of moisture passing through the conjunctiva after the conjunctiva is placed under the conditions of high temperature and high humidity. In contrast, the conjunctiva of the present invention significantly reduces the moisture absorption rate measured in a state where the conjunctiva is completely immersed in water.

In a specific embodiment, the moisture absorption rate of the conjunctiva after hardening may be 0.1% or less, for example, it may be 0.01% to 0.06%. In the above range, when the components are installed, the adverse effects caused by the moisture flowing into the material from the atmosphere can be reduced to prevent problems in the adhesion or electrical characteristics between the materials.

The adhesive film can satisfy the dielectric constant, dielectric loss and moisture absorption rate at the same time according to the above range. Therefore, when the adhesive film is applied to the metal foil laminate described below, the adhesion reliability can be improved, and the adhesion and electrical characteristics between the adherends can be improved. For example, like a metal foil laminate, the adhesive film can be used to bond the base film and the metal foil. This will be explained in detail below.

The adhesive film of the present invention can ensure flexibility in addition to the above-mentioned electrical characteristics and battery characteristics. Therefore, in the laminate described below, it is used to bond the base film and the metal plate. In particular, the production of a flexible printed circuit board becomes simple.

The adhesive film of the present invention is suitable for the metal foil laminate described below, and has excellent peel strength with respect to the base film (for example, polyimide film) and the metal foil (for example, copper plate), so that the bonding reliability is also excellent. excellent.

In a specific embodiment, the peel strength of the adhesive film after curing measured for a laminate in which the polyimide film, the mucosal film, and the polyimide film are sequentially stacked may be 1.0 Kgf/cm or more. In the above range, when the adhesive film is applied to the laminate described below, the adhesion reliability can be improved. For example, the aforementioned peel strength may be 1.5Kgf/cm to 3.0Kgf/cm.

In another specific embodiment, the cured peel strength of the adhesive film measured for a laminate in which a polyimide film, an adhesive film, and a metal foil are sequentially stacked may be 1.0 Kgf/cm or more. In the above range, when the adhesive film is applied to the laminate described below, the adhesion reliability can be improved. For example, the aforementioned peel strength may be 1.5Kgf/cm to 3.0Kgf/cm. In this specification, "peel strength" refers to the value measured in accordance with the IPC-TM-650 2.4.8C standard.

The hardened glass transition temperature of the adhesive film may be 60°C to 80°C, for example, it may be 60°C to 70°C. In the above range, it is possible to have a good bending resistance effect.

In the conjunctiva, the temperature at which the quality loss ratio of 5% based on the following formula 5 occurs may be 300°C to 500°C, for example, it may be 350°C to 450°C. In the above range, the adhesive film has excellent heat resistance and can be applied to the laminate described below. [Equation 5] Quality loss ratio=│The heated quality of the hardened conjunctiva-the initial quality of the hardened conjunctiva│/The initial quality of the hardened conjunctiva×100

The temperature at which the above-mentioned quality loss rate is 5% can be determined by thermogravimetric analysis (TGA, thermogravimetric analysis). Specifically, for the initial quality of 10 mg of the conjunctiva, starting at an initial temperature of 25°C, the temperature can be increased and measured at a rate of 10°C/min.

The surface resistivity of the conjunctiva after hardening may be 1×10 ⁹ MΩ to 10×10 ⁹ MΩ, for example, it may be 2×10 ⁹ MΩ to 10×10 ⁹ MΩ. The volume resistivity of the conjunctiva after hardening may be 1×10 ⁹ MΩ·cm to 10×10 ⁹ MΩ·cm, for example, it may be 2×10 ⁹ MΩ·cm to 10×10 ⁹ MΩ·cm. In the above range, it is possible to have a good insulating effect. In this manual, surface resistance and volume resistance can be measured by IPC-TM-650 2.5.17.1 respectively.

The thickness of the conjunctiva can be 5 μm to 50 μm. Within the above range, it can be used for the laminate described below.

When a voltage of 50V is applied to the mucosa at 85°C, 85% relative humidity and within 1000 hours, ion migration can be 1×10 ¹³ Ω or more. In the above range, it is possible to have an insulation resistance effect between circuits.

In the conjunctiva, the solder resistance in the polyimide film/hardened conjunctiva/polyimide film can be 260℃/10 seconds to 288℃/10 seconds. The welding resistance in the film/hardened adhesive film/metal foil can range from 260°C/10 seconds to 300°C/10 seconds. In the above range, it is possible to have a good heat resistance effect. Welding resistance can be measured by IPC-TM-650 2.4.13F, but it is not limited to this.

The conjunctiva of the present invention can be embodied by the composition for conjunctiva described below. Hereinafter, the composition for conjunctiva of the present invention will be explained.

The composition includes a binder resin, an epoxy resin, and a filler, and the binder resin includes a carboxylic acid-modified olefin resin and a polyphenylene ether resin. In the adhesive film composition, it is necessary to contain a carboxylic acid-modified olefin resin and a polyphenylene ether resin as a binder resin. If one of the carboxylic acid-modified olefin resin and the polyphenylene ether resin is not replaced or one of them is replaced by another type of resin described below, the effect of the present invention cannot be normally exhibited.

In a specific embodiment, the binder resin can only be formed of two types of resins: carboxylic acid-modified olefin resin and polyphenylene ether resin.

The composition for adhesive films of the present invention forms an adhesive film by the reaction between the carboxylic acid group contained in the carboxylic acid-modified olefin resin and the epoxy resin. Therefore, the above composition does not contain a hardener.

The carboxylic acid-modified olefin resin is a part of the above composition, which imparts the adhesiveness, flexibility and electrical properties of the adhesive film.

The carboxylic acid-modified olefin resin may include a carboxylic acid-modified linear polyolefin resin. In this case, the linear may include a linear or branched polyolefin resin, and preferably, may include a linear polyolefin resin. In a specific embodiment, the olefin resin may include one or more of polyethylene resin, polypropylene resin, and polybutene resin. Preferably, the olefin resin may include a polypropylene resin, and when it is included together with the above-mentioned polyphenylene ether resin, the effects of the present invention can be more easily manifested.

The carboxylic acid-modified olefin resin may contain a prescribed modifying substance, for example, an unsaturated carboxylic acid or a polyolefin resin modified by an anhydride thereof. For example, the unsaturated carboxylic acid or its anhydride may contain one or more of acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, maleic anhydride, itaconic anhydride, and fumaric anhydride. Preferably, the above-mentioned modified substance may be maleic anhydride.

The acid value of the carboxylic acid-modified olefin resin may be 0.5 mgCH ₃ ONa/g to 1.5 mg CH ₃ ONa/g. In the above range, good adhesion and heat resistance can be expressed. The above-mentioned "acid value" can be measured by the ASTM D 1613 method.

The glass transition temperature of the carboxylic acid-modified olefin resin may be 5°C to 100°C, for example, it may be 10°C to 50°C. In the above range, there can be an effect of providing good flexibility.

In 100 parts by weight of the binder resin, 40 to 80 parts by weight of the carboxylic acid-modified olefin resin may be included. In the above range, the dielectric constant and moisture absorption rate of the present invention can be achieved, and the insulation resistance effect can be achieved. Preferably, in 100 parts by weight of the binder resin, 50 to 80 parts by weight of the carboxylic acid-modified olefin resin may be included.

Polyphenylene ether resin is a part of the above composition, which imparts adhesiveness, flexibility and electrical properties to the adhesive film.

The polyphenylene ether resin may contain at least one of unmodified polyphenylene ether and modified polyphenylene ether. Preferably, the polyphenylene ether resin may include unmodified polyphenylene ether.

As the polyphenylene ether resin, a type having a glass transition temperature higher than that of the carboxylic acid-modified olefin resin can be used. Thus, the effect of the present invention can be easily realized. The difference between the glass transition temperature of the polyphenylene ether resin and the carboxylic acid-modified olefin resin may be 100°C to 250°C, for example, it may be 100°C to 150°C. The glass transition temperature of the polyphenylene ether resin may be greater than 100°C and 300°C or less, for example, it may be 110°C to 200°C. Within the above range, it is possible to have an excellent flexibility effect.

In 100 parts by weight of the binder resin, 20 to 60 parts by weight of polyphenylene ether resin may be included. In the above range, the dielectric constant and moisture absorption rate of the present invention can be achieved. Preferably, in 100 parts by weight of the binder resin, 20 to 50 parts by weight of polyphenylene ether resin may be included.

The epoxy resin can react with the above-mentioned binder resin, in particular, with the carboxylic acid-modified olefin resin to improve adhesion and heat resistance.

In 100 parts by weight of the binder resin, 1 to 10 parts by weight of epoxy resin may be included. In the above range, the dielectric constant and moisture absorption rate of the present invention can be achieved, and excellent adhesion effect can be achieved.

The epoxy resin may include a general epoxy resin well known to those having ordinary knowledge in the technical field to which the present invention pertains having two or more epoxy groups. For example, the epoxy resin may include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AD type epoxy resin, rubber modified epoxy resin, fatty acid modified ring Oxygen resin, polyurethane modified epoxy resin, low-chlorine epoxy resin, silane modified epoxy resin, dicyclopentadiene epoxy resin, multifunctional novolak epoxy resin, glycidyl ether epoxy resin, phenol novolak Epoxy resins, cresol novolac epoxy resins, bisphenol A novolac epoxy resins, etc., but not limited to these. Preferably, the epoxy resin may include a cresol novolac epoxy resin.

On the other hand, the composition of the present invention does not contain a hardener. The adhesive film of the present invention can be produced by the reaction of the epoxy group of the epoxy resin and the carboxylic acid in the above-mentioned adhesive resin, so that there is no need to add a hardener.

For this reason, the ratio of the total number of moles of carboxylic acid groups in the binder resin to the total number of moles of epoxy groups in the epoxy resin may be 1 or more, for example, it may be 1 to 2. In the above range, the adhesive film of the present invention can be embodied without a hardener.

The filler may contain one or more of inorganic fillers and organic fillers. Preferably, the filler can be a mixture of inorganic filler and organic filler. Therefore, when combined with the above-mentioned binder resin and epoxy resin, the moisture absorption rate and dielectric constant of the present invention can be easily achieved.

The inorganic filler may contain at least one of metal, non-metal, metal oxide, and non-metal oxide. For example, the inorganic filler may contain one or more of silicon dioxide, titanium dioxide, aluminum oxide, zinc oxide, copper, and silver. Preferably, the inorganic filler may include silica, for example, inorganic nano silica. The average particle diameter (D50) of the inorganic filler may be 5 nm to 1000 nm, preferably, it may be 10 nm to 100 nm. In the above range, it is possible to have a stable volume change rate effect.

The organic filler may include a fluororesin filler. For example, the fluororesin filler may include polytetrafluoroethylene filler, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer filler, tetrafluoroethylene-hexafluoropropylene copolymer filler, tetrafluoroethylene-ethylene copolymer One or more of fillers and polychlorotrifluoroethylene fillers. Preferably, the organic filler may include a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer filler. The average particle size (D50) of the organic filler may be 1 μm to 100 μm, preferably, 5 μm to 50 μm. In the above range, a good low-dielectric effect can be obtained.

In the adhesive composition of the present invention, an inorganic filler and an organic filler may be contained in a specific content ratio. For example, relative to 100 parts by weight of inorganic filler, 100 to 600 parts by weight of organic filler may be included. In the above range, it is possible to have a low dielectric constant and heat resistance improvement effect.

With respect to 100 parts by weight of the binder resin, 5 to 40 parts by weight of filler may be included. In the above range, good heat resistance can be obtained and the value of the dielectric constant may be lowered.

If necessary, the composition for adhesive films of the present invention may further include one or more of additives such as plasticizers, leveling agents, ultraviolet absorbers, and flame retardants, and thickeners, but it is not limited thereto.

The composition of the present invention may further include a solvent, so that the coating property of the adhesive film can be improved. The above-mentioned solvent may contain at least one of dimethylformamide, methyl ethyl ketone, and dimethylacetamide, but is not limited thereto.

For the adhesive film, the above-mentioned composition is applied to a base film or a release film with a predetermined thickness, dried and heat-treated to prepare a semi-cured state. For example, the adhesive film is heat-treated at a temperature of 50°C to 180°C for 1 minute to 10 minutes, thereby making it into a semi-hardened state.

Hereinafter, a conjunctival adhesion laminate according to an embodiment of the present invention will be described.

The mucosal adhesion laminate of the present invention includes a base film and an adhesive film formed on at least one surface of the base film, and the above-mentioned conjunctiva includes the adhesive film of the present invention. The conjunctival adhesion laminate of the present invention may include a cover film, but is not limited to this.

1, the conjunctival adhesion laminate may include: a base membrane 10; a first conjunctival membrane 20 formed on one side of the base membrane 10; and a second conjunctival membrane 30 formed on the other side of the base membrane 10, the first conjunctival membrane 20. One or more of the second conjunctiva 30 may include the conjunctiva of the present invention.

The base film 10 includes a film formed of polyimide resin. Polyimide resin is a resin that provides high heat resistance, and can be used as a cover film for covering an adhesive film adhesion laminate. The thickness of the base film 10 may be 5 μm to 100 μm, preferably, it may be 5 μm to 75 μm. Within the above range, the base film that can be used as a cover film can exhibit both flexibility and rigidity.

The first conjunctiva 20 and the second conjunctiva 30 can be the above-mentioned conjunctiva of the present invention, and only one of the first conjunctiva 20 and the second conjunctiva 30 can be the conjunctiva of the present invention. The first conjunctiva 20 and the second conjunctiva 30 may be in a semi-hardened state, that is, a B-grade conjunctiva.

The thickness of the first conjunctiva 20 and the second conjunctiva 30 may be the same or different. For example, they may be in the thickness range of the above-mentioned conjunctiva of the present invention.

Hereinafter, a metal foil laminate according to an embodiment of the present invention will be described.

The metal foil laminate of the present invention includes: a base film; an adhesive film formed on at least one side of the base film; and a metal foil formed on one side of the adhesive film, and the adhesive film includes the adhesive film of the present invention. The metal foil laminate of the present invention may include a printed circuit board, for example, a flexible printed circuit board.

2, the metal foil laminate may include: a base film 10; a first adhesive film 20 formed on one side of the base film 10; a first metal foil 40 formed on one side of the first adhesive film 20; and a second adhesive film 30 , Formed on the other side of the base film 10; and the second metal foil 50, formed on one side of the second adhesive film 30.

The descriptions of the base membrane 10, the first conjunctiva 20, and the second conjunctiva 30 are as shown in FIG. 1 above. The first metal foil 40 and the second metal foil 50 may include one or more of copper foil, silver foil, aluminum foil, and stainless steel foil, and preferably, may include copper foil. The first metal foil 40 and the second metal foil 50 may both be copper foil, or one may be copper foil, and the other may be a metal foil other than copper foil. The thickness of the first metal foil 40 and the second metal foil 50 may be the same or different, for example, the thickness may be 1 μm to 200 μm, for example, it may be 3 μm to 70 μm.

Hereinafter, the present invention will be described in more detail through embodiments. Such embodiments are only used to illustrate the present invention, and the present invention is not limited thereto.

Example 1

Mix 55 parts by weight of carboxylic acid-modified polypropylene resin (SM040A, Toyobo, acid value: 1.0mgCH ₃ ONa/g) and 20 parts by weight of polyphenylene ether resin (PPO, Sabik, -OH value: 800mgKOH/g) , Mix 3 parts by weight of cresol novolac epoxy resin (YDCN1P, KUKDO chemical, EEW: 200g/eq), 6 parts by weight of inorganic nano-silica (R972, Evonik, average particle size (D50): 17nm), 15 parts by weight of a fluororesin filler (PFA, AGC, average particle size (D50): 10 μm), and 150 parts by weight of methyl ethyl ketone as a solvent were added to prepare a composition. In Table 1 below, "-" means that the corresponding component is not included.

The prepared composition was applied to a polyimide film in a predetermined thickness, and dried and heat-treated at a temperature of 130° C. for 3 minutes to produce a semi-cured adhesive film (thickness: 25 μm).

Example 2 to Example 3

Except that the content of each component in Example 1 was changed as shown in Table 1, the adhesive film in a semi-hardened state was prepared by the same method as in Example 1.

Comparative example 1

Mix 6 parts by weight of polyphenylene ether resin (PPO, Sabik, -OH value: 800mgKOH/g), 43 parts by weight of halogen-free epoxy p-Amino Phenol type (jER630, Mitsubishi Chemical, EEW: 100g/eq), 21 parts by weight Parts of biphenyl epoxy resin (NC3000H, Nippon Kayaku, EEW: 290g/eq), 21 parts by weight of acrylonitrile butadiene rubber containing carboxylic acid groups (Nipol1072, Nippon Zeon, -COOH content: 8 weight percent) , 9 parts by weight of 4,4-diaminodiphenyl sulfide (DDS, Sigma-Aldrich, EEW: 64g/eq) as a hardener for epoxy resin, 0.2 parts by weight of undecylimidazole as a hardening accelerator (C11Z, Shikoku Hwaseong), 130 parts by weight of methyl ethyl ketone was added as a solvent to prepare a composition.

The prepared composition was applied to a polyimide film in a predetermined thickness, and dried and heat-treated at a temperature of 130° C. for 3 minutes to produce a semi-cured adhesive film (thickness: 25 μm).

Comparative example 2

Mix 5 parts by weight of halogen-free epoxy p-Amino Phenol type ((jER630, Mitsubishi Chemical, EEW: 100g/eq), 60 parts by weight of halogen-free modified polyacetal amide (PIAD200, Arakawa), 25 parts by weight Halogen-free modified polyacetal amide (PIAD150L, Arakawa), 10 parts by weight of ester modified hardener (HPC-8150, DIC), and 0.05 parts by weight of 2-ethyl 4-methylimidazole as a hardening accelerator ( 2E4MZ, Shikoku Hwaseong), 130 parts by weight of methyl ethyl ketone was added as a solvent to prepare a composition.

The prepared composition was applied to a polyimide film in a predetermined thickness, and dried and heat-treated at a temperature of 130° C. for 3 minutes to produce a semi-cured adhesive film (thickness: 25 μm).

Comparative example 3

Mix 7 parts by weight of carboxylic acid-modified styrene elastomer (SM300A, Toyobo, acid value: 10mgCH ₃ ONa/g), and 55 parts by weight of polypropylene resin (JSS-395N, acid value: 0mgCH ₃ ONa/g), Hunan Petrochemical), 14 parts by weight of polyphenylene ether resin (PPO, -OH value: 800mgKOH/g, Sabik), 2 parts by weight of cresol novolac epoxy resin (YDCN1P, EEW: 200g/eq, KUKDO Chemical) , 4 parts by weight of inorganic nano-silica (R972, average particle size (D50): 17nm, Evonik), 17 parts by weight of fluororesin filler (PFA, average particle size (D50): 10μm, AGC), 1 weight Parts of hardener (DDS, Sigma-Aldrich), 120 parts by weight of methyl ethyl ketone as a solvent were added to prepare a composition.

The prepared composition was applied to a polyimide film in a predetermined thickness, and dried and heat-treated at a temperature of 130° C. for 3 minutes to produce a semi-cured adhesive film (thickness: 25 μm).

Under the temperature condition of 160° C., the adhesive films of the examples and the comparative examples were heat-treated for 60 minutes to produce the adhesive films in a fully cured state.

The following physical properties were evaluated for the hardened conjunctiva, and the results are shown in Table 2, Table 3, Figure 3, and Figure 4 below.

(1) Peel strength (unit: Kgf/cm): The peel strength was evaluated according to IPC-TM-650 2.4.8C. For polyimide (PI) film/adhesive film/polyimide film, polyimide film/adhesive film/copper foil (Cu), pass a temperature of 25°C, a peeling angle of 180°, and a peeling speed of 50mm/min The peel strength was evaluated.

(2) Welding resistance (unit: °C/second): Welding resistance was measured by IPC-TM-650 2.4.13F. For polyimide (PI) film/adhesive membrane/polyimide (PI) film, polyimide (PI) film/adhesive membrane/copper foil (Cu), the welding resistance was measured.

(3) Dielectric constant (unit: none) and dielectric loss (unit: none): For the conjunctiva, use Network Analyzer (MS4642B 36585K, Anritsu Co.) at a temperature of 25°C and a frequency of 10 GHz. The dielectric constant (Dk) and dielectric loss (Df) were evaluated.

(4) Coefficient of thermal expansion (unit: ppm/℃): Through IPC-TM-650 2.4.41.3, using a thermomechanical analyzer (TMA, thermomechanical analyzer) to analyze α1, α2.

(5) Glass transition temperature (Tg, unit: °C): For the adhesive film, use a dynamic mechanical analyzer (DMA, dynamic mechanical analyzer), and use the temperature at which the tanδ modulus reaches the maximum as the glass transition temperature.

(6) 5% quality loss temperature (unit: ℃): For the mucosa, 5% quality loss was analyzed by thermogravimetric analysis.

(7) Surface resistance and volume resistance (unit: MΩ, MΩ•cm): For the adhesive film, the surface resistance and volume resistance were evaluated according to IPC-TM-650 2.5.17.

(8) Ion migration (ion-migration, unit: Ω): For the mucosa, the ion migration characteristics were evaluated by 85°C/85RH%/1000 hours, 50V, L/S=50μm/50μm.

(9) Moisture absorption rate (unit: %): For the conjunctiva, the moisture absorption rate was measured by IPC-TM-650 2.6.2.1A.

(10) Dielectric constant and dielectric loss based on frequency change: The dielectric constant and dielectric loss are measured by the same method as (3), and the frequency is changed to 1GHz, 3GHz, 5GHz, and at a temperature of 25℃. 10GHz and measured the dielectric constant and dielectric loss.

(11) Dielectric constant and dielectric loss based on temperature change: Measure the dielectric constant and dielectric loss by the same method as (3). In 10GHz, change the measurement temperature to 20℃, 40℃, 60℃, 80℃ and measured the dielectric constant and dielectric loss. [Table 1] Example Comparative example 1 2 3 1 2 3 Modified styrene elastomer SM300A - - - - - 7 Carboxylic acid modified polypropylene resin SM040A 55 50 60 - - - Polypropylene resin JSS-395N - - - - - 55 Polyphenylene ether resin PPO 20 20 20 6 - 14 Epoxy resin YDCN1P 3 3 3 - - 2 jER630 - - - 43 5 - NC3000H - - - twenty one - - Polyimides PIAD200 - - - - 60 - PIAD150L - - - - 25 - Acrylonitrile Butadiene Nipol1072 - - - twenty one - - Inorganic filler R972 6 6 6 - - 4 Organic filler PFA 15 20 10 - - 17 hardener DDS - - - 9 - 1 HPC-8150 - - - - 10 - 2E4MZ - - - - 0.05 - C11Z - - - 0.2 - - [Table 2] Example Comparative example 1 2 3 1 2 3 Peel strength (Kgf/cm) PI/PI 2.0 1.8 2.4 0.9 1.1 1 PI/Cu 1.9 2.0 2.1 1.5 1.2 1.3 Welding resistance (℃/sec) PI/PI 288/10 288/10 288/10 288/10 288/10 288/2 PI/Cu 280/10 280/10 280/10 288/10 288/10 288/2 Dielectric constant (Dk) 2.35 2.36 2.38 3.42 2.99 2.85 Dielectric loss (Df) 0.0023 0.0026 0.0035 0.0357 0.0045 0.0182 Coefficient of thermal expansion (ppm/℃) α1 126 173 160 150 67 105 α2 420 310 360 450 277 650 Tg (℃) 65 68 62 65 72 85 5% quality loss (℃) 380 377 376 290 406 381 Surface resistance (MΩ) 8×10 ⁹ 9×10 ⁹ 9×10 ¹⁰ 1×10 ⁶ 4×10 ⁸ 3×10 ⁹ Volume resistance (MΩ•cm) 9.3×10 ⁹ 9.5×10 ⁹ 9.9×10 ⁹ 3×10 ⁸ 2×10 ⁹ 5×10 ⁹ Ion movement (Ω) 10 ¹³ 10 ¹³ 10 ¹³ 10 ¹³ 10 ¹¹ 10 ¹³ Moisture absorption rate (%) 0.05 0.05 0.05 1.0 0.6 0.06 [table 3] Example Comparative example 1 2 3 1 2 3 Dielectric constant 1GHz 2.41 2.43 2.35 3.44 2.87 2.58 3GHz 2.42 2.45 2.37 3.41 2.88 2.66 5GHz 2.44 2.46 2.49 3.40 2.90 2.78 10GHz 2.45 2.48 2.40 3.40 2.95 2.85 Dielectric loss 1GHz 0.0020 0.0022 0.0026 0.0310 0.0043 0.0172 3GHz 0.0022 0.0025 0.0027 0.0324 0.0052 0.0179 5GHz 0.0023 0.0027 0.0028 0.0340 0.0058 0.0181 10GHz 0.0025 0.0029 0.0030 0.0419 0.0064 0.0182 Dielectric constant 20℃ 2.47 2.56 2.50 3.38 3.01 2.85 40℃ 2.49 2.56 2.51 3.40 3.16 2.86 60℃ 2.50 2.56 2.51 3.43 3.19 2.88 80°C 2.51 2.58 2.52 3.56 3.29 2.89 Dielectric loss 20℃ 0.0024 0.0029 0.0030 0.0300 0.0045 0.0182 40℃ 0.0025 0.0033 0.0031 0.0334 0.0047 0.0188 60℃ 0.0026 0.0035 0.0033 0.0350 0.0049 0.0191 80°C 0.0028 0.0038 0.0035 0.0479 0.0055 0.0194

As shown in Table 2 above, the dielectric constant and moisture absorption rate of the adhesive film of the present invention are low, and both exhibit the effects of the present invention. In addition, as shown in Table 3, Fig. 3, and Fig. 4 above, the dielectric constant of the adhesive film is low, and the rate of change of the dielectric constant due to frequency and temperature changes is also low.

In contrast, Comparative Example 1, which is an acrylonitrile-butadiene-based adhesive film, and Comparative Example 2, which is a polyimide-based adhesive film, and Comparative Example 3, which includes an unmodified olefin resin with a carboxylic acid and a hardener, cannot obtain the product of the present invention. Effect.

Simple modifications or changes of the present invention can be easily implemented by those with ordinary knowledge in the technical field to which the present invention belongs, and such modifications or changes fall within the scope of the present invention.

10: Basement membrane 20: The first conjunctiva 30: second conjunctiva 40: The first metal foil 50: second metal foil

[Fig. 1] is a cross-sectional view of the conjunctival adhesion laminate according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of a metal foil laminate according to an embodiment of the present invention. Fig. 3 shows the dielectric constant and dielectric loss caused by the frequency change of the adhesive film of Example 1, Comparative Example 1, and Comparative Example 2. In FIG. 3, △ is the result of Example 1, ◇ is the result of Comparative Example 1, and □ is the result of Comparative Example 2. Fig. 4 shows the dielectric constant and dielectric loss caused by the temperature change of the adhesive film of Example 1 and Comparative Example 2. In FIG. 4, ○ is the result of Example 1, and □ is the result of Comparative Example 2.

10: Basement membrane

20: The first conjunctiva

30: second conjunctiva

Claims (16)

An adhesive film, which is formed by a combination of a binder resin, an epoxy resin and a filler, wherein The binder resin includes a carboxylic acid-modified olefin resin and a polyphenylene ether resin, After the conjunctiva is hardened, the dielectric constant measured under the conditions of 1GHz to 10GHz and 20°C to 80°C is less than 2.6, and the dielectric loss is less than 0.005. After the conjunctiva is cured, the moisture absorption rate is less than 0.1% . The conjunctiva according to claim 1, wherein the composition does not contain a hardener. The adhesive film according to claim 1, wherein the carboxylic acid-modified olefin resin contains acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, maleic anhydride, itaconic anhydride, and fumaric anhydride. Of more than one modified olefin resin. The adhesive film according to claim 1, wherein the ratio of the total number of moles of carboxylic acid groups in the adhesive resin to the total number of moles of epoxy groups in the epoxy resin is 1 to 2. The adhesive film according to claim 1, wherein the difference between the glass transition temperature of the polyphenylene ether resin and the carboxylic acid-modified olefin resin is 100°C to 250°C. The adhesive film according to claim 1, wherein the carboxylic acid-modified olefin resin comprises a carboxylic acid-modified linear polypropylene resin. The adhesive film according to claim 1, wherein in 100 parts by weight of the adhesive resin, 40 parts by weight to 80 parts by weight of the carboxylic acid-modified olefin resin and 20 parts by weight to 60 parts by weight of the polystyrene are contained Ether resin. The adhesive film according to claim 1, wherein the filler comprises a mixture of an inorganic nano-silica and a fluororesin filler. The adhesive film according to claim 1, wherein relative to 100 parts by weight of the adhesive resin, the epoxy resin is contained in an amount of 1 to 10 parts by weight and the filler is in an amount of 5 to 40 parts by weight. The adhesive film according to claim 1, wherein in the same frequency, the ratio of the hardened dielectric constant to the hardened dielectric loss of the adhesive film is 650 or more, that is, the hardened dielectric constant/hardened The dielectric loss afterwards is more than 650. The conjunctiva according to claim 1, wherein the hardened glass transition temperature of the conjunctiva is 60°C to 80°C. An adhesive laminate for conjunctiva, comprising: a polyimide resin film; and An adhesive film formed on at least one side of the polyimide resin film, The mucosa comprises the mucosa according to any one of claims 1 to 11. The conjunctival adhesion laminate according to claim 12, wherein the conjunctiva adhesion laminate includes a cover film. A metal foil laminate, comprising: A polyimide resin film; An adhesive film formed on at least one side of the polyimide resin film; and A metal foil is formed on one side of the conjunctiva, The adhesive film is formed between the polyimide resin film and the metal foil, The mucoconjunctiva is the mucoconjunctiva according to any one of claims 1 to 11. The metal foil laminate according to claim 14, wherein the metal foil includes a copper foil. The metal foil laminate according to claim 14, wherein the metal foil laminate includes a flexible circuit board.

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