TW202131585A - Conductive member for discharge laser - Google Patents

Abstract

A conductive member for conducting a current associated with an electric discharge in a discharge chamber of a laser, the conductive member comprising at least one channel configured for increasing a current flow path in a part of the conductive member relative to a current flow path in another part of the conductive member, the conductive member configured for connecting the laser to a voltage source and to provide an interface between the voltage source and the discharge chamber of the laser.

Description

Conductive parts for discharge lasers

The present invention relates to a conductive component, associated equipment, system and method for conducting the current associated with the discharge in the discharge chamber of the laser.

Lithography equipment is a machine that is constructed to apply a desired pattern on a substrate. The lithography equipment can be used in, for example, integrated circuit (IC) manufacturing. The lithography equipment can, for example, project the pattern (often referred to as "design layout" or "design") of a patterning device (e.g., mask) onto a radiation-sensitive material (resist) provided on a substrate (e.g., wafer) ) On the layer.

With the continuous advancement of semiconductor manufacturing processes, the size of circuit components has continued to decrease for decades, and the amount of functional components such as transistors per device has steadily increased. This follows what is commonly referred to as "Moore's law" )” trend. In order to keep up with Mohr's Law, the semiconductor industry is pursuing technologies that enable smaller and smaller features. In order to project the pattern on the substrate, the lithography device can use electromagnetic radiation. The wavelength of this radiation determines the minimum size of the feature patterned on the substrate. The lower wavelength enables the preparation of smaller features on the substrate. The typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm and 13.5 nm. The lithography equipment using deep ultraviolet (DUV) radiation can be operated with wavelengths of 193 nm or 248 nm, and the lithography equipment using extreme ultraviolet (EUV) radiation can operate in the range of 4 nm to 20 nm, such as 6.7 nm or 13.5 nm Operate at the inner wavelength.

Gas discharge lasers can be used to generate DUV radiation. In this laser, the cathode and the anode are usually arranged in the cavity of the laser in a spaced relationship. When a discharge is generated between the cathode and the anode, current can flow from the cathode to the anode. The current can cause corrosion of the cathode and/or anode, and the corrosion may be uneven. The uneven corrosion of the cathode and/or anode can lead to a reduction in the service life of the cathode and/or anode, and therefore, the service life of the laser chamber is reduced.

According to one aspect of the present invention, there is provided a conductive member for conducting a current associated with a discharge in a discharge chamber of a laser, the conductive member including a conductive member configured to be opposite to the conductive member A current path in one part increases at least one channel of a current path in the other part of the conductive member, the conductive member is configured to connect the laser to a voltage source and connect the voltage source to the laser An interface is provided between the discharge chambers. By increasing the current path in the other portion of the conductive member relative to the current path in the portion of the conductive member, the current density or uniformity of current delivered through the conductive member can be improved. It has been found that this in turn can lead to an improved uniformity of the current distribution in the discharge chamber. The improved uniformity of the current distribution in the discharge chamber provides for more uniform corrosion of one of the cathode and the anode, which can lead to an increase in the service life of the cathode, anode, and/or discharge chamber of the laser.

The conductive component may include a plurality of such channels. Each of the channels can be associated with a portion of the conductive component. Each of the channels can be configured to increase a current path of the associated portion of the conductive member relative to the current path in another portion of the conductive member.

The conductive component may include a first end. The first end may include at least one of the channels.

The first end may include a first rounded edge. The first end may include at least two of the channels. The at least two of the channels may extend longitudinally inwardly from the first circular edge.

The conductive component may include a second end. The second end may include at least one of the channels.

The second end may include a second rounded edge. The second end may include at least two of the channels. The at least two of the channels may extend longitudinally inwardly from the second circular edge.

The conductive component can be configured for connection to a plurality of charge storage devices. The conductive component can be configured for connection to a plurality of conductive elements. The conductive component can be configured to conduct current from each of the plurality of charge storage devices to a respective conductive element of the plurality of conductive elements.

The conductive component may include a plurality of first connection points. The conductive component may include a plurality of second connection points. Each of the plurality of first connection points can be configured to connect to one of the plurality of charge storage devices. Each second connection point of the plurality of second connection points can be configured to connect to one of the plurality of conductive elements.

The plurality of first connection points may be configured in a configuration extending along the longitudinal direction of the conductive member. The plurality of second connection points may be configured in a configuration extending along the longitudinal direction of the conductive member.

The conductive component can be configured so that each of the channels is placed between a first connection point and a second connection point.

The conductive component may further include an insulating part. The insulating part can be placed in each channel.

The conductive component can be or include a conductive rod.

According to another aspect of the present invention, there is provided a laser including a discharge chamber and a conductive member for conducting a current associated with a discharge in the discharge chamber, the conductive member including a configured For increasing at least one channel of a current path in another part of the conductive part relative to a current path in another part of the conductive part, the conductive part is configured to connect the laser to a voltage source and connect the laser to a voltage source. An interface is provided between the voltage source and the discharge chamber of the laser.

The laser may include a plurality of charge storage devices. The laser may include a plurality of conductive elements. The plurality of charge storage devices and the plurality of conductive elements can be connected to the conductive component.

The conductive component can be configured to conduct current from each of the plurality of charge storage devices to a respective conductive element of the plurality of conductive elements.

The plurality of conductive elements can be configured to guide the current into the discharge chamber.

The conductive component may include a plurality of such channels. Each of the channels can be associated with a portion of the conductive component. Each of the channels can be configured to increase a current path of the associated portion of the conductive member relative to the current path in another portion of the conductive member.

The discharge chambers can be configured to contain one or more gases. The one or more gases may include krypton, argon, and/or fluorine.

Any feature of the conductive component in the above aspect can also be applied to or included in the conductive component in this aspect.

According to another aspect of the present invention, there is provided a lithography system, which includes: a radiation source, the radiation source includes a laser, the laser includes a discharge chamber and for conducting and according to any of the above aspects One is a conductive component of a current associated with a discharge in the discharge chamber; and a lithography device.

According to another aspect of the present invention, there is provided a method for operating a laser, the laser including a laser discharge chamber and a discharge chamber for conducting a current associated with a discharge in the discharge chamber A laser for a conductive member, the conductive member including at least one channel configured to increase a current path in another portion of the conductive member relative to a current path in another portion of the conductive member, the conductive member will The laser is connected to a voltage source and provides an interface between the voltage source and the discharge chamber of the laser, the method includes applying a voltage to the conductive member to cause a discharge in one of the discharge chambers, A current associated with the discharge flows into the discharge chamber through the conductive member.

The laser may include a plurality of charge storage devices. The laser may include a plurality of conductive elements. The plurality of charge storage devices and the plurality of conductive elements can be connected to the conductive component.

The conductive component can be configured to conduct current from each of the plurality of charge storage devices to a respective conductive element of the plurality of conductive elements. The plurality of conductive elements can be configured to guide the current into the discharge chamber.

Applying a voltage to the conductive member allows current to flow from the plurality of charge storage devices to the plurality of conductive elements via the conductive member, so that a portion of the conductive member is stored from one of the plurality of charge storage devices The current path from the device to the conductive element associated with one of the plurality of conductive elements is longer than in the other part of the conductive component from one of the plurality of charge storage devices to one of the plurality of conductive elements. The current path of the conductive element.

Applying a voltage to the conductive component can cause current to flow from the plurality of conductive elements into the discharge chamber.

The step of applying the voltage to the conductive member may include applying a negative potential to the conductive member.

The conductive component may include a plurality of such channels. Each of the channels can be associated with a portion of the conductive component. Each of the channels can be configured to increase a current path of the associated portion of the conductive member relative to the current path in another portion of the conductive member.

The conductive member may further include an insulating part disposed in each channel.

Any feature of the conductive component in the above aspect can also be applied to or included in the conductive component in this aspect.

It will be readily apparent to those familiar with the art that the various aspects and features of the present invention explained above or below can be combined with various other aspects and features of the present invention.

Fig. 1 schematically depicts a lithography system including a radiation source SO and a lithography device LA. The lithography equipment LA includes: an illumination system (also called a illuminator) IL, which is configured to adjust the radiation beam B (such as UV radiation, DUV radiation or EUV radiation); a mask support (such as a mask table) MT, It is constructed to support the patterning device (such as a mask) MA and is connected to a first positioner PM configured to accurately position the patterning device MA according to certain parameters; a substrate support (such as a wafer table) WT , Which is constructed to hold a substrate (such as a resist coated wafer) and is connected to a second positioner PW configured to accurately position the substrate support according to certain parameters; and a projection system (such as a refractive projection The lens system) PS is configured to project the pattern imparted to the radiation beam B by the patterning device MA onto the target portion C (for example, including one or more dies) of the substrate W.

In operation, the illumination system IL receives a radiation beam from the radiation source SO via the beam delivery system BD, for example. The illumination system IL may include various types of optical components for guiding, shaping or controlling radiation, such as refractive, reflective, magnetic, electromagnetic, electrostatic or other types of optical components or any combination thereof. The illuminator IL can be used to adjust the radiation beam B to have the desired spatial and angular intensity distribution in the cross section of the patterning device MA at the plane.

The term "projection system" PS used herein should be broadly interpreted as covering various types of projection systems suitable for the exposure radiation used and/or suitable for other factors such as the use of immersion liquids or the use of vacuum, including refraction , Reflection, catadioptric, synthetic, magnetic, electromagnetic and/or electrostatic optical system or any combination thereof. It can be considered that any use of the term "projection lens" herein is synonymous with the more general term "projection system" PS.

The lithography apparatus LA may belong to a type in which at least a part of the substrate may be covered by a liquid having a relatively high refractive index, such as water, so as to fill the space between the projection system PS and the substrate W—this is also referred to as immersion lithography. More information on the infiltration technique is given in US 6,952,253, which is incorporated herein by reference.

The lithography apparatus LA may also belong to a type having two or more substrate supports WT (also referred to as "dual stage"). In this "multi-stage" machine, the substrate supports WT can be used in parallel, and/or the subsequent exposure steps for preparing the substrate W can be performed on the substrate W located on one of the substrate supports WT, and at the same time The other substrate W on the other substrate support WT is used to expose a pattern on the other substrate W.

In addition to the substrate support WT, the lithography apparatus LA may also include a measurement stage. The measurement stage is configured to hold the sensor and/or the cleaning device. The sensor can be configured to measure the properties of the projection system PS and/or the properties of the radiation beam B. The measurement stage can hold multiple sensors. The cleaning device may be configured to clean a part of the lithography equipment, such as a part of the projection system PS or a part of a system that provides an immersion liquid. The measurement stage can move under the projection system PS when the substrate support WT is away from the projection system PS.

In operation, the radiation beam B is incident on a patterning device (such as a mask) MA held by the mask support MT, and is patterned by a pattern (design layout) existing on the patterning device MA. Having traversed the mask MA, the radiation beam B passes through the projection system PS, which focuses the beam on the target portion C of the substrate W. With the help of the second positioner PW and the position measuring system IF, the substrate support WT can be accurately moved, for example, to position different target parts C in the path of the radiation beam B at a focused and aligned position. Similarly, the first positioner PM and possibly another position sensor (which is not explicitly depicted in FIG. 1) can be used to accurately position the patterning device MA with respect to the path of the radiation beam B. The mask alignment marks M1, M2 and the substrate alignment marks P1, P2 can be used to align the patterning device MA and the substrate W. Although the substrate alignment marks P1, P2 as illustrated occupy dedicated target portions, they may be located in the spaces between the target portions. When the substrate alignment marks P1 and P2 are located between the target portion C, these substrate alignment marks are referred to as scribe lane alignment marks.

FIG. 2 shows a part of the laser 10 used in a lithography system (such as the lithography system shown in FIG. 1). The laser 10 may be part of or contained in the radiation source SO. The laser 10 may be provided in the form of a gas discharge laser (for example, an excimer laser). The laser 10 includes a discharge chamber 12. The laser 10 includes a first electrode 14 which can be a cathode. The laser 10 includes a second electrode 16 which can be an anode. The cathode 14 and the anode 16 are arranged in the discharge chamber 12. The cathode 14 and the anode 16 are arranged in a spaced relationship and opposed to each other. The anode 16 may be arranged on the supporting member 16b opposite to the cathode 14. The supporting member 16b may be provided in the form of an anode supporting rod. In other embodiments, other configurations for positioning the first electrode and the second electrode may be used.

The discharge chamber 12 may be configured to contain one or more gases 18, such as a mixed gas. The gas 18 may include an inert gas, such as argon, krypton, or xenon; and a reactive gas, such as fluorine or chlorine.

When a voltage is applied between the cathode 14 and the anode 16, a discharge may be generated in the discharge area 20 between the cathode 14 and the anode 16. The discharge can ionize the gas 18 in the chamber 12, which may cause a chemical reaction between the gases. For example, the mixed gas of argon and fluoride ions can chemically generate the excited molecule argon fluoride, which only exists in an excited state and can decay extremely rapidly. The excited molecule can release its excess energy by emitting photons, thereby returning to its ground state, where it dissociates back to free atoms. The photons generated during the discharge can then be reflected in the chamber by one or more optical components (not shown) and then directed from the laser 10 as a laser pulse. It should be understood that in other embodiments, another mixed gas such as a mixed gas of krypton gas and fluoride ion may be used.

In some embodiments, the mixed gas 18 may be pre-ionized to generate the desired electron density before discharging. The laser may include a pre-ionization device 21, which may be configured to generate ultraviolet radiation for ionizing the mixed gas 18 before discharging.

The laser 10 may include a plurality of insulating parts or components 19. The insulating part or component 19 may comprise a ceramic material, such as alumina (Al ₂ O ₃ or AlO ₂ ). Alternatively, the insulating part or component 19 may include a plastic material, which may include a polymer or polymer compound, Teflon or the like. The insulating part or component 19 can be arranged in the discharge chamber differently, for example, to electrically insulate the cathode 14 and the anode 16 from other parts of the discharge chamber 12.

It should be understood that the laser 10 may include other components for supplying one or more of the gas, circulating the gas in the discharge chamber, adjusting the temperature in the discharge chamber, and/or the like. The purpose of clarity is not shown in Figure 2.

The laser 10 includes a conductive member 22 for conducting the current associated with the discharge in the discharge chamber 12. Expressed in a different way, when there is a discharge in the discharge chamber, current can flow through the conductive member 22. Electric current can flow into the discharge chamber 12 through the conductive member 22. For example, as will be described below, current may flow through the conductive member 22 to the cathode 14 and from the cathode 14 to the anode 16. The conductive member 22 is configured to connect the laser 10 to the voltage source 24 and provide an interface between the voltage source 24 and the discharge chamber 12 of the laser 10. In other words, the voltage can be applied to the cathode 14 and/or the anode 16 via the conductive member 22. The conductive member 22 may be provided in the form of a conductive rod. The conductive member 22 may include metal, such as aluminum. The conductive member 22 may include a coating. The coating may include a fluorine-resistant material. For example, the coating may include a transition metal, such as nickel.

3A and 3B show an exemplary embodiment of a conductive member 22 for use with a laser (such as the laser 10 shown in FIG. 2). The conductive member 22 includes at least one channel 26 configured to increase the current path in the first portion 28 of the conductive member 22 relative to the current path in the second portion 30 of the conductive member 22. The channel 26 may alternatively or additionally be configured to increase the current path in the third portion 32 of the conductive member 22 relative to the current path in the second portion 30 of the conductive member 22. Expressed in a different way, the channel 26a can be configured to force the current to adopt a flow path in the first portion 28 of the conductive member 22 that is longer than the flow path of the current in the second portion 30 of the conductive member 22. This can lead to an increase in current density or current uniformity in the conductive member 22. It has been found that this in turn can lead to an improved uniformity of the current distribution in the discharge chamber 12. The term "current distribution" can be considered to encompass the current and/or current density along the cathode 14 and/or anode 16, for example along the length of the cathode 14 and/or anode 16. The improved uniformity of the current distribution in the discharge chamber can provide more uniform corrosion of the cathode and anode, which can lead to an increase in the service life of the cathode, anode, and/or discharge chamber of the laser.

The conductive member 22 includes a plurality of channels 26a to 26d, four of which are shown in FIGS. 3A and 3B. However, it should be understood that the number of channels can be selected based on the current distribution that may be desired or required in the discharge chamber 12 and/or the desired or required current density in the conductive member 22. It should also be understood that in other embodiments, the conductive member may include more or less than four channels.

Each of the channels 26 a to 26 d may be associated with the first portion 28 or the third portion 32 of the conductive member 22. Each of the channels 26a to 26d is configured to increase the current path in the associated portion of the conductive member 22 relative to the current path in the other portion of the conductive member (ie, the second portion 30). In the embodiment shown in FIGS. 3A and 3B, two channels 26a, 26b are associated with the first portion 28 of the conductive member 22. Each of the two channels 26a, 26b may be configured to increase the current path in the first portion 28 of the conductive member 22 relative to the current path in the second portion 30 of the conductive member 22. The other two channels 26c, 26d may be associated with the third portion 32 of the conductive member 22. Likewise, each of the other two channels 26c, 26d can be configured to increase the current path in the third portion 32 of the conductive member 22 relative to the current path in the second portion 30 of the conductive member 22. The first part 28, the second part 30, and the third part 32 are indicated by dashed lines in FIGS. 3A and 3B.

The conductive member 22 may be configured such that the two channels 26a, 26b extend parallel to each other, and/or the other two channels 26c, 26d extend parallel to each other, as shown in FIGS. 3A and 3B. Each of the two channels 26a, 26b and/or each of the other two channels 26c, 26d may be configured to extend along the axial or longitudinal direction A of the conductive member 22.

Parameters such as the size and configuration of the channels 26a, 26b and the other two channels 26c, 26d can be selected based on the desired current distribution in the discharge chamber 12 or the desired current density in the conductive member 22. The parameters may include the length L and width W of each channel 26a, 26b and each other channel 26c, 26d, as indicated in FIG. 3A. The length of each channel 26a, 26b and/or each additional channel 26c, 26d may be in the range of about 3 cm to 20 cm in some embodiments, but other dimensions may be used in other embodiments. The width of each channel 26a, 26b and/or each additional channel 26c, 26d may be in the range of about 0.5 cm to 1.3 cm in some embodiments, but other dimensions may be used in other embodiments. Each of the individual channels 26a to 26d may have the same size parameter or may be different.

The conductive member 22 may include a first end 34. The first portion 28 of the conductive member 22 may define or be a part of the first end 34 of the conductive member 22. In this embodiment, the first end 34 includes two channels 26a, 26b. It should be understood that in other embodiments, the first end may include less or more than two channels. The first end 34 may include a first rounded edge 34a. The conductive member 22 may be configured such that the two channels 26a, 26b extend longitudinally inwardly from the first circular edge 34a.

The conductive member 22 may include a second end 36. The third portion 32 of the conductive member 22 may define or be a part of the second end 36 of the conductive member 22. In this embodiment, the second end 36 includes two other channels 26c, 26d. It should be appreciated that in other embodiments, the second end may include more or less than two additional channels. The second end 36 may include a second first rounded edge 36a. The conductive member 22 may be configured such that the other two channels 26c, 26d extend longitudinally inwardly from the second circular edge 36a. One or all of the channels 26a to 26d may extend longitudinally inward from the first circular edge 34a and the second circular edge 36a. The conductive member 22 is configured such that the first circular edge 34a and the second circular edge 36a are arranged opposite to each other.

Experiments have shown that, for example, when in use, if the channels 26a to 26d are not targeted, the increased current can be at the first end 34 and/or the second end relative to the current flowing in the rest of the conductive member 22 36 in the flow. Expressed in a different way, when in use, the current density may be higher in the first end 34 and/or the second end 36 relative to the current density in the rest of the conductive member 22. By providing channels 26a, 26b as parts of the first end 34 of the conductive member 22 and/or providing additional channels 26c, 26d as parts of the second end 36, at the first end 34 and/or the second end The current density in 36 or the current flowing can be reduced. This can lead to an increase in the current density or the uniformity of the current flowing through the conductive member 22. This in turn can lead to more uniform corrosion of the cathode and/or anode, which can lead to an increase in the service life of the cathode, anode and/or discharge chamber.

FIG. 3A shows an exemplary conductive member 22, which can be used with the discharge chamber 12 containing an argon fluoride mixed gas, but can also be used in combination with other gas mixtures. The conductive member 22 may be configured to conduct current associated with the discharge in the discharge chamber 12, as described above. One or more of the dimensions of the conductive member 22 may be selected based on the current distribution that may be required or desired in the discharge chamber 12. Additionally or alternatively, in use, the size of the conductive member 22 may be selected to minimize or reduce the inductance of the conductive member 22, such as when current flows through the conductive member 22. It should be appreciated that, alternatively or in addition, the size may be selected based on one or more sizes of the discharge chamber 12 and/or other parts of the laser 10. In this embodiment, the conductive member 22 may have a thickness T in the range of 20 mm to 50 mm, for example about 30 mm, but other thicknesses may be used in other embodiments. The conductive member 22 also includes two recessed portions 35a having a thickness smaller than the thickness T. As shown in FIG. The conductive member 22 can have a length L1 and a width W1 that can be selected in combination with the size of the discharge laser and can be changed in various embodiments.

FIG. 3B shows an exemplary conductive member 22 that can be used with a discharge chamber 12 containing a mixed gas (such as a mixed gas of krypton fluoride), but the exemplary conductive member 22 of FIG. 3B can also be used in combination with other gas mixtures. The conductive member 22 shown in FIG. 3B is similar to the conductive member shown in FIG. 3A. However, it can be seen that the conductive member 22 shown in FIG. 3B is thinner than the conductive member 22 shown in FIG. 3A. In this embodiment, the conductive member 22 may have a thickness T in the range of 2 mm to 5 mm, for example about 3 mm, but other thicknesses may be used in other embodiments. The length L1 and width W1 of the conductive member 22 shown in FIG. 3B will be selected in conjunction with the size of the discharge laser and this can be changed in various embodiments.

FIG. 4A shows a plan view of the exemplary conductive member 22 shown in FIG. 3A. However, it should be understood that any of the features described below can also be applied to the conductive member 22 shown in FIG. 3B. The conductive member 22 is configured for connection to a voltage source 24. The conductive member 22 may be configured to receive a part of a connection configuration for connecting a voltage source to a laser (not shown in FIG. 4A). The conductive member 22 may include two recessed portions 35a. The two recessed portions 35a can be regarded as recessed down into the plane of FIG. 4A. The two recessed portions 35a are more clearly visible in Figure 3A. In some embodiments, the recessed portion 35a may be configured to receive at least part of the connection configuration. The two recessed portions 35 a are arranged in the center or middle portion 37 of the conductive member 22. The middle portion 37 of the conductive member 22 may be part of or included in the second portion 30 of the conductive member 22. Each of the recessed portions 35a may be configured to extend in the axial or longitudinal direction A. The width W2 of the center or middle portion 37 may be greater than the width W1 of the rest of the conductive member 22 (indicated in FIG. 3A). The center or middle portion 37 may be configured to allow a seal to be formed between the conductive member 22 and another portion of the laser 10.

The conductive member 22 can be configured to connect to a plurality of charge storage devices and a plurality of conductive elements. For example, each charge storage device can be provided in the form of a capacitor, as will be shown in FIG. 5. However, it should be understood that other devices for storing charge can be used. Although each conductive element may be provided in the form of a feed-through element, in other embodiments, other conductive elements may be used. The conductive member 22 can be configured to conduct the current from each capacitor to the respective feedthrough.

Referring to FIG. 4A, the conductive member 22 may include a plurality of first connection points 38. Each first connection point 38 can be configured for connection to a charge storage device, such as a capacitor. Each first connection point 38 may be provided in the form of a hole. The first connection point 38 is arranged along the axial or longitudinal direction A of the conductive member 22. The first connection point 38 may be arranged close to the outer edge or periphery of the conductive member 22. The first connection point 38 may be arranged in two rows 38 a, 38 b on opposite sides of the conductive member 22. Some of the first connection points 38 may be configured in the recessed portion 35a, as indicated in Fig. 4A.

The conductive member 22 may include a plurality of second connection points 40. Each second connection point 40 can be configured for connection to a feedthrough element. Each first connection point 38 is provided in the form of another hole. The second connection point 40 may be linearly arranged along the axial or longitudinal direction A of the conductive member 22, but in other embodiments, other arrangements may be used. The second connection point 40 can be arranged between the two rows 38 a and 38 b of the first connection point 38. Each second connection point 40 may be associated with a pair of first connection points 38. Each second connection point 40 can be arranged between a pair of associated first connection points 38.

FIG. 4B shows the first end 34 of the conductive member shown in FIG. 4A. The conductive member 22 can be configured such that each channel 26a, 26b extends between the first connection point 38 and the second connection point 40, and current can flow from the associated first connection point 38 to the second connection point 40. In the exemplary embodiment shown in FIG. 4A, each channel 26 a, 26 b extends substantially between two first connection points 38 and two second connection points 40. In use, when the conductive member 22 is connected to a capacitor and a feedthrough element, the conductive member 22 can conduct current from one or a pair of capacitors to the associated feedthrough element. The current paths in the first part 28 and the second part 30 of the conductive member are indicated by arrows in FIG. 4B. The flow path of the current in the first portion 28 of the conductive member 22 is longer than the flow path of the current in the second portion 30, as shown in FIG. 4B. Expressed in a different way, the channels 26a, 26b can be configured to force current on a flow path in the first portion 28 of the conductive member 22 that is longer than the flow path of the current in the second portion 30 of the conductive member 22. This can lead to an increase in the uniformity of the current flowing through the conductive member 22 or the current density in the conductive member 22. This in turn may result in a more uniform current or current density along the cathode 14 and/or anode 14, which may result in more uniform corrosion of the cathode and anode. This can lead to an increase in the service life of the cathode, anode and/or discharge chamber.

FIG. 4C shows the first end 34 of another exemplary embodiment of the conductive member 22. The conductive component shown in FIG. 4C is similar to the conductive component 22 described above. In this embodiment, the conductive member 22 includes an insulating portion 42. At least a part of the insulating portion 42 may be arranged in each of the two channels 26a, 26b. The insulating portion 42 can be configured to prevent current from flowing through each channel 26a, 26b or through both channels 26a, 26b. The insulating portion 42 may be configured based on the parameters of each channel 26a, 26b and/or the distance D between the two channels 26a, 26b. In this embodiment, the insulating portion 42 includes a U shape. It should be understood that in other embodiments, the insulating portion may have different shapes, for example, depending on the parameters of each channel and/or the distance between two channels. In other embodiments, the insulating portion may include two separate prongs 42a, and the prongs 42a are not coupled together to form an integral piece. The insulating portion 42 may include two prongs 42a and/or a portion 42b connecting the two prongs 42a. The length L3 and/or width W3 of each prong 42a can be selected based on the length L and/or width W of each channel 26a, 26b. Expressed in different ways, the length L3 and/or width W3 of each prong 42a can be selected to largely correspond to the length L and/or width W of each channel 26a, 26b. The insulating portion 42 may be disposed on the conductive member 22, for example, such that each of the prongs 42a is disposed in each of the two channels 26a, 26b. When each prong 42a of the insulating portion 42 is disposed in each of the two channels 26a, 26b, the portion 42b can cover the portion 34b of the first circular edge 34a. The portion 34b of the first circular edge 34a may extend between the two channels 26a, 26b.

The insulating part may be formed of an insulating material. For example, the insulating material may include a plastic material. The plastic material may contain polymers or polymer compounds, such as Teflon or the like. Alternatively, the insulating part may include a ceramic material, such as aluminum oxide (Al ₂ O ₃ or AlO ₂ ). The insulating portion 42 may be disposed in each channel 26a, 26b, as described above, to prevent the formation of an arc or arc discharge in each channel 26a, 26b and/or between the two channels 26a, 26b. It should be understood that the conductive member 22 may include another insulating portion. The other insulating part may include any of the features of the insulating part 42. Another insulating part can be arranged in each of the other channels 26c, 26d. The conductive member 22 may include an insulating portion disposed in one or more of the channels 26a to 26d. One or all of the channels 26a to 26d may include insulating parts disposed therein.

FIG. 5 is a cross-sectional view showing an exemplary embodiment of the laser 10. The laser 10 includes the part of the laser shown in FIG. 2. Therefore, any of the features described above with respect to FIG. 2 can also be applied to the laser 10 shown in FIG. 5.

FIG. 5 shows the outer part 12a of the discharge chamber 12, which is shown in FIG. The outer part 12a of the discharge chamber 12 may be provided on the outside of the discharge chamber 12 in the form of a groove. As described above, the laser 10 includes a conductive member 22. The conductive member 22 is configured to be attached to the outer part 12a of the discharge chamber. The conductive member 22 shown in FIG. 5 is the same as the conductive member 22 shown in FIGS. 4A and 4B. Thus, any of the features described above with respect to FIGS. 4A and 4B can also be applied to the conductive member 22 shown in FIG. 5.

The laser 10 includes a plurality of charge storage devices 44 provided in the form of a plurality of capacitors. Each capacitor 44 may have a capacitance in the range of 200 pF to 800 pF, but other capacitances may be used in other embodiments. The configuration of the capacitor 44 may correspond to the configuration of the first connection point 38 of the conductive member 22. In other words, the capacitor 44 may be arranged along the axial direction or the longitudinal direction B of the laser 10. The capacitors 44 may be arranged in two rows 44a, 44b on opposite sides of the outer portion 12a of the discharge chamber 12. The capacitor 44 may be connected to the conductive member 22, for example, using a plurality of conductive fasteners 46a, such as screws, pins, bolts, or the like, one of which is shown in FIG. 5. Each fastener 46a can be inserted into the first connection point to connect the capacitor to the conductive member 22.

The laser 10 includes a plurality of conductive elements 48 provided in the form of a plurality of feedthrough elements. The configuration of the feedthrough element 48 may correspond to the configuration of the second connection point 40 of the conductive member 22. In other words, the feedthrough element 48 may be linearly arranged along the axial or longitudinal direction B of the laser 10, such as shown in FIG. 5. Other configurations can be used in other embodiments. The feedthrough element 48 can be arranged between the two rows 44 a and 44 b of the capacitor 44. The feedthrough element 48 may be connected to the conductive member 22 using a plurality of other conductive fasteners 46b (such as screws, pins, bolts, or the like), one of which is shown in FIG. 5. Each other fastener 46b can be inserted into the second connection point to connect the feedthrough element 48 to the conductive part 22, but other fastening members can be used.

In some embodiments, the laser 10 may include an optional connecting member 45. The connecting member 45 may be provided in the form of a connecting board or an interconnecting board. The connecting plate 45 can be configured to be flexible. For example, the thickness of the connecting plate 45 may be less than 1 mm, but other thicknesses are used in other embodiments. The connection plate 45 may include a conductive material. The conductive material may include metal or metal alloy, such as copper or brass or the like. The connecting plate 45 may be disposed between the conductive component 22 and the capacitor 44 and the feedthrough element 48. The connecting plate 45 may have the same or similar shape and configuration as the conductive member 22 including the channel. In FIG. 5, two channels 45a and 45b corresponding to the two channels in the conductive member 22 can be seen. It should be understood that the number of channels in the connecting plate 45 may correspond to the number of channels in the conductive member 22. The connection plate 45 may be configured to ensure contact between the conductive member 22, the capacitor 44, and the feedthrough element 48. The connection plate 45 may include a plurality of other holes 45 a, for example, to allow the capacitor 44 and the feed-through element 48 to be connected to the conductive member 22 via the connection plate 45.

The laser 10 may include a connection configuration 47 for connecting a voltage source (not shown in FIG. 5) to the laser 10 (for example, the conductive member 22). The connection configuration 47 contains at least two connection elements 47a. Each connection element 47 may include a conductive material, such as metal. Each connecting element 47a can be disposed in a respective recessed portion 35a of the conductive member 22. The connecting element 47a may be fixed to the conductive member 22 by another plurality of fasteners 47b (for example, screws, pins, bolts, or the like). The connection configuration 47 may include at least two other connection elements 47c. The two other connecting elements 47c may each be provided in the form of elastic and/or flexible elements, such as springs or coil springs or the like. Each other connecting element 47c can be disposed in the groove 47d of each connecting element 47a. The connection element 47a and the other connection elements 47c may include conductive materials. The conductive material may include metal or metal alloy, such as tin, brass, copper, or the like. The connection arrangement 47 may contain at least two sealing elements 47e, for example two gaskets. Each sealing element 47e may be configured to surround the connecting element 47a and/or other connecting elements 47c. Expressed in different ways, each sealing element 47e can be disposed between the conductive component 22 and the connecting element 47a and/or other connecting elements 47c. A connection configuration 47 may be provided to ensure contact between the voltage source and the conductive member 22. It should be appreciated that in other embodiments, any of a variety of other components for bonding a voltage source to conductive components may be used.

FIG. 6 shows a cross-sectional view of a part of the laser 10 along the line B in FIG. 5. The cathode 14 and the anode 16 of the laser 10 can be configured to extend along the axial or longitudinal direction of the laser 10. The anode 16 is attached to the support member 16b by a plurality of fastening elements 16c, which may be provided in the form of screws, pins, bolts, or the like. The feedthrough elements 48 can be configured to direct current into the discharge chamber 12, and three of these feedthrough elements 48 are shown in FIG. 6. For example, the feedthrough element 48 can be connected to the cathode 14 of the laser 10. Each feedthrough element 48 may be configured to extend from the outer portion 12 a of the discharge chamber 12 into the discharge chamber 12. This allowable voltage is applied to the cathode 14 via the conductive member 22 and the feedthrough element 48, as will be described below. Each of the feedthrough elements 48 may be configured to seal at least a portion of the discharge chamber 12, for example, to prevent the gas 18 from leaking from the interior of the discharge chamber 12. Each feedthrough element 48 may include a fluorine-resistant material. The fluorine-resistant material may include a metal alloy, such as brass.

FIG. 7 shows a part of the laser 10 shown in FIG. 5. As described above, when there is a discharge between the cathode 14 and the anode 16, current may flow through one or more parts of the laser 10. The flow path of the current is indicated by the arrow in FIG. 7.

As described above, the voltage source 24 may be connected to the conductive member 22. In use, a voltage can be applied to the conductive member 22 to cause a discharge in the discharge chamber, so that the current associated with the discharge flows through the conductive member 22 into the discharge chamber 12. The voltage applied to the conductive member 22 may be in the range of 500V to 1500V.

The conductive member 22 may be connected to the capacitor 44 and the feedthrough element 48. When a voltage is applied to the conductive member 22, each capacitor 44 can be charged. The charging of each capacitor 44 can cause the voltage between the cathode 14 and the anode 16 to increase. This voltage can be applied to the cathode 14 via the feedthrough element 48. For example, a negative potential may be applied to the conductive member 22, which causes the feedthrough element 48 and the cathode 14 to be negatively charged. The negative potential applied to the conductive member 22 can also cause at least a portion of each capacitor 44 to be negatively charged. This in turn can generate an electric field between the cathode 14 and the anode 16, which is connected to ground. It should be understood that in other embodiments, a positive potential may be applied to the anode. The electric field can ionize the mixed gas 18 between the cathode 14 and the anode 16. When the mixed gas 18 is fully ionized, gas dissociation can occur, and electric discharge can be generated in the discharge area 20 of the discharge chamber 12. _{This can result in a drop in the voltage V CP} across each of the capacitors 44 and a voltage drop across the cathode 14 and anode 16. Current can flow from the capacitor 44 to the feedthrough element 48 via the conductive member 22. Current can flow from the feedthrough element 48 into the discharge chamber 12, for example, to the cathode 14 and across the discharge region 20 to the anode 16. By configuring the conductive member 22 to include at least one channel, the current density or current uniformity in the conductive member 22 can be improved, as described above. This in turn may result in increased uniformity of current or current density along the length of cathode 14 and anode 16, for example, along the length of cathode 14 and/or anode 16. This increased uniformity of current or current density can lead to more uniform corrosion of the cathode and anode, which can lead to an increase in the service life of the cathode, anode, and/or discharge chamber of the laser. The current may flow away from the anode 16 to ground (not shown), for example, using the current return element 54. The current return element 54 may be configured to connect the anode 16 to ground.

Figure 8 is a flowchart outlining the steps of a method for operating a laser, such as the laser 10 described above. In step 105, the method includes the step of using the conductive member 22 and the voltage source as described above to provide a discharge laser.

In step 110, the method includes applying a voltage to the conductive member using a voltage source. The voltage is applied to cause a discharge in the discharge chamber of the laser to operate the laser to generate a laser beam, as described above.

In step 115, the voltage applied to the conductive component causes current to flow from the charge storage device of the laser (for example, capacitor 44) to the conductive component (for example, feedthrough element 48) of the laser via the conductive component.

In step 120, the voltage applied to the conductive member causes current to flow from the feedthrough element 48 into the discharge chamber. For example, current can flow from the conductive element to the first electrode of the laser, such as the cathode 14. The current may, for example, flow from the first electrode of the laser to the second electrode of the laser (e.g., anode 16) across the discharge region 20.

The step of applying voltage may include charging a charge storage device (eg, capacitor 44) and/or conductive element. For example, as described above, a negative potential may be applied to the conductive member. This can cause at least a portion of the conductive component, the conductive element, and each charge storage device to be negatively charged. This in turn can cause the first electrode (eg, cathode) of the laser to be negatively charged.

The method may include, for example, the step of ionizing the mixed gas in the discharge chamber of the laser before the discharge.

It should be understood that any of the features described above, for example, with respect to FIG. 7 may be applied to or part of the method.

As described above, by forming channels in the conductive member, uneven corrosion of the cathode and/or anode can be reduced or prevented. Since the conductive part can be connected to the discharge chamber on the outer part, it may not be possible when the conductive part is detached from the outer part of the discharge chamber and/or the conductive part is (re)attached to the outer part of the discharge chamber. Exposure to fluorine gas. In addition, as described above, the formation of the channel may have no or reduced influence on one or more of the structure or thermal properties of the conductive component.

The term "channel" can be considered to encompass elongated grooves or elongated hollow spaces or portions.

It should be understood that the terms "current path" and "current flow path" can be used interchangeably.

It should be understood that references to plural features can be used interchangeably with references to their features in singular forms such as "at least one" and/or "each." The singular forms of features such as "at least one" or "each" can be used interchangeably.

In this document, the terms "radiation" and "beam" are used to cover all types of electromagnetic radiation, including ultraviolet radiation (e.g. having a wavelength of 365, 248, 193, 157 or 126 nm) and extreme ultraviolet radiation (EUV, e.g. Have a wavelength in the range of about 5 to 100 nm).

As used herein, the terms "reducing mask", "mask" or "patterning device" can be broadly interpreted as referring to a general patterning device that can be used to impart a patterned cross-section to an incident radiation beam , The patterned cross-section corresponds to the pattern to be produced in the target portion of the substrate. The term "light valve" may also be used herein. In addition to classic masks (transmission or reflection, binary, phase shift, hybrid, etc.), other examples of such patterned devices include programmable mirror arrays and programmable LCD arrays.

Although the use of lithography equipment in IC manufacturing may be specifically referred to herein, it should be understood that the lithography equipment described herein may have other applications. Possible other applications include manufacturing integrated optical systems, guidance and detection for magnetic domain memory, flat panel displays, liquid crystal displays (LCD), thin film magnetic heads, and so on.

Although the embodiments of the present invention in the context of the lithography device may be specifically referred to herein, the embodiments of the present invention may be used in other devices or systems. Embodiments of the present invention may form part of mask inspection equipment, metrology equipment, or any equipment that measures or processes objects such as wafers (or other substrates) or masks (or other patterning devices). These devices can often be referred to as lithography tools. This lithography tool can use vacuum conditions or environmental (non-vacuum) conditions.

Although the above may have specifically referred to the use of embodiments of the present invention in the context of optical lithography, it should be understood that the present invention is not limited to optical lithography and can be used in other applications (such as compression Printing photocopying).

Other aspects of the present invention are described in the following numbered items. 1. A conductive component used to conduct the current associated with the discharge in the discharge chamber of a laser, the conductive component comprising: At least one channel configured to increase the current path in another part of the conductive part relative to the current path in another part of the conductive part, the conductive part being configured to connect the laser to a voltage source and in the voltage source Provide an interface with the discharge chamber of the laser. 2. Such as the conductive part of Clause 1, where the conductive part contains a plurality of channels. 3. The conductive component as in clause 2, wherein each of the channels is associated with a part of the conductive component and is configured to increase the associated part of the conductive component relative to the current path in the other part of the conductive component Current path. 4. The conductive component of any of the preceding items, wherein the conductive component includes a first end, and the first end includes at least one of the channels. 5. The conductive component of clause 4, wherein the first end includes a first rounded edge, and the first end includes at least two of the channels extending longitudinally inward from the first rounded edge. 6. The conductive component according to any one of clauses 4 or 5, wherein the conductive component includes a second end, and the second end includes at least one of the channels. 7. The conductive component of clause 6, wherein the second end includes a second rounded edge, and the second end includes at least two of the channels extending longitudinally inward from the second rounded edge. 8. The conductive component according to any one of the preceding clauses, wherein the conductive component is configured for connection to a plurality of charge storage devices and a plurality of conductive elements. 9. The conductive component of clause 8, wherein the conductive component is configured to conduct current from each of the plurality of charge storage devices to the respective conductive element of the plurality of conductive elements. 10. Such as the conductive component of item 8 or 9, wherein the conductive component includes a plurality of first connection points and a plurality of second connection points, and each of the plurality of first connection points is configured It is used to connect to the charge storage device in the plurality of charge storage devices, and each second connection point of the plurality of second connection points is configured to be connected to the conductive element of the plurality of conductive elements. 11. For the conductive component of Clause 10, the plurality of first connection points and/or the plurality of second connection points are each arranged in a configuration extending along the longitudinal direction of the conductive component. 12. Such as the conductive component of clause 10 or 11, wherein the conductive component is configured such that each of the channels is placed between the first connection point and the second connection point. 13. The conductive component as described in any one of the preceding clauses, which further includes an insulating part arranged in each channel. 14. The conductive component as described in any one of the preceding clauses, wherein the conductive component includes a conductive rod. 15. A type of laser, which contains: Discharge chamber; and The conductive component is used to conduct the current associated with the discharge in the discharge chamber, and the conductive component includes: At least one channel configured to increase the current path in another part of the conductive part relative to the current path in another part of the conductive part, the conductive part being configured to connect the laser to a voltage source and in the voltage source Provide an interface with the discharge chamber of the laser. 16. Such as the laser of Clause 15, where the laser includes a plurality of charge storage devices and a plurality of conductive elements, and the plurality of charge storage devices and the plurality of conductive elements are connected to the conductive component. 17. Such as the laser of Clause 16, wherein the conductive member is configured to conduct the current from each of the plurality of charge storage devices to the respective conductive element of the plurality of conductive elements. 18. Such as the laser of Clause 16 or 17, in which a plurality of conductive elements are configured to guide current into the discharge chamber. 19. Such as the laser of any one of clauses 15 to 18, wherein the conductive component includes a plurality of channels, and each of these channels is associated with a part of the conductive component and is configured to be opposite to the conductive component. The current path in the other part increases the current path in the associated part of the conductive component. 20. Such as the laser of any one of clauses 15 to 19, wherein the discharge chamber is configured to contain one or more gases, and the one or more gases include krypton, argon, and/or fluorine. 21. A lithography system, which includes: A radiation source that includes a laser. The laser includes: Discharge chamber; and Such as the conductive member of any one of clauses 1 to 14, which is used to conduct the current associated with the discharge in the discharge chamber; and Lithography equipment. 22. A method for operating a laser, the laser contains: A laser with a laser discharge chamber; and A conductive member for conducting a current associated with a discharge in a discharge chamber, the conductive member including at least one configured to increase a current path in another part of the conductive member relative to a current path in one part of the conductive member The conductive component connects the laser to the voltage source and provides an interface between the voltage source and the discharge chamber of the laser. The method includes: A voltage is applied to the conductive member to cause a discharge in the discharge chamber, so that the current associated with the discharge flows into the discharge chamber through the conductive member. 23. The method as in Clause 22, wherein the laser includes a plurality of charge storage devices and a plurality of conductive elements, and the plurality of charge storage devices and the plurality of conductive elements are connected to the conductive component. 24. As in the method of clause 23, the conductive member is configured to conduct the current from each of the plurality of charge storage devices to the respective conductive element of the plurality of conductive elements, the plurality of Each conductive element is configured to direct current into the discharge chamber. 25. The method of item 23 or 24, wherein applying a voltage to a conductive member causes current to flow from the plurality of charge storage devices to the plurality of conductive elements through the conductive member, so that the portion of the conductive member is from the plurality of charges The current path from the charge storage device in the storage device to the associated conductive element in the plurality of conductive elements is longer than in another part of the conductive member from the charge storage device in the plurality of charge storage devices to the plurality of conductive elements The current path of the associated conductive element. 26. The method of Clause 25, wherein voltage is applied to the conductive component so that current flows from the plurality of conductive elements into the discharge chamber. 27. The method of any one of items 23 to 26, wherein the step of applying a voltage to the conductive member includes applying a negative potential to the conductive member. 28. The method according to any one of clauses 22 to 27, wherein the conductive component includes a plurality of channels, and each of the channels is associated with a part of the conductive component and is configured to be opposite to the conductive component. The current path in a part increases the current path in the associated part of the conductive component. 29. The method according to any one of clauses 22 to 29, wherein the conductive member further includes an insulating part arranged in each channel.

Although specific embodiments of the invention have been described above, it will be understood that the invention can be practiced in other ways than described. The above description is intended to be illustrative, not restrictive. Therefore, it will be obvious to those familiar with the technology that the described invention can be modified without departing from the scope of the patent application set forth below.

10: Laser 12: Discharge chamber 12a: Outer part 14: First electrode 16: Second electrode 16b: Support member 16c: Fastening element 18: Gas 19: Insulating part or component 20: Discharge area 21: Pre-ionization Device 22: conductive component 24: voltage source 26: channel 26a: channel 26b: channel 26c: channel 26d: channel 28: first part 30: second part 32: third part 34: first end 34a: first circle Edge 34b: part 35a: recessed part 36: second end 36a: second rounded edge 37: center or middle part 38: first connection point 38a: column 38b: column 40: second connection point 42: insulating part 42a : Fork tip 42b: Part 44: Charge storage device 44a: Column 44b: Column 45: Connection plate 45a: Channel 45b: Channel 46a: Conductive fastener 46b: Conductive fastener 47: Connection configuration 47a: Connection element 47b: Fastener 47c : Connecting element 47d: groove 47e: sealing element 48: conductive element 54: current return element 105: step 110: step 115: step 120: step A: axial or longitudinal direction B: radiation beam/axial or longitudinal direction BD : Beam delivery system C: Target part D: Distance IF: Position measurement system IL: Illumination system L: Length L1: Length L3: Length LA: Lithography equipment M1: Mask alignment mark M2: Mask alignment mark MA : Patterning device MT: Mask support P1: Substrate alignment mark P2: Substrate alignment mark PM: First positioner PS: Projection system PW: Second positioner SO: Radiation source T: Thickness V _CP : Voltage W : Substrate/width W1: width W2: width W3: width WT: substrate support

The embodiments of the present invention will now be described by way of example only with reference to the accompanying schematic drawings, in which:

Figure 1 depicts a schematic overview of a lithography system including a radiation source and a lithography device;

Figure 2 depicts a cross-sectional view of a part of a laser that can be used in the lithography system of Figure 1;

Figures 3A and 3B depict exemplary embodiments of conductive components for use with the laser of Figure 2;

Figure 4A depicts a plan view of the conductive component of Figure 3A;

Fig. 4B depicts the first end of an embodiment of the conductive member of Fig. 4A;

4C depicts the first end of another exemplary conductive member for use with the laser of FIG. 2;

Figure 5 depicts a partially exploded view of the laser chamber including part of the laser of Figure 2;

Figure 6 depicts a cross-sectional view of part of the laser of Figure 5;

Figure 7 depicts a part of the laser of Figure 5; and

Figure 8 depicts a flowchart outlining the steps of a method for operating a laser.

22: conductive parts

26a: Channel

26b: Channel

26c: Channel

26d: Channel

28: Part One

30: Part Two

32: Part Three

34: first end

34a: first round edge

36: second end

36a: second round edge

A: axial or longitudinal direction

L1: length

W1: width

Claims (30)

A conductive component for conducting a current associated with a discharge in a discharge chamber of a laser, the conductive component comprising: At least one channel configured to increase a current path in another part of the conductive part relative to a current path in another part of the conductive part, the conductive part being configured to connect the laser to a The voltage source also provides an interface between the voltage source and the discharge chamber of the laser. Such as the conductive component of claim 1, wherein the conductive component includes a plurality of the channels. The conductive component of claim 2, wherein each of the channels is associated with a portion of the conductive component and is configured to increase the amount of the conductive component relative to the current path in the other portion of the conductive component A current path in the associated part. The conductive component of claim 1, wherein the conductive component includes a first end, and the first end includes at least one of the channels. The conductive component of claim 4, wherein the first end includes a first rounded edge, and the first end includes at least two of the channels longitudinally extending inward from the first rounded edge. The conductive component of claim 4, wherein the conductive component includes a second end, and the second end includes at least one of the channels. The conductive component of claim 6, wherein the second end includes a second rounded edge, and the second end includes at least two of the channels longitudinally extending inward from the second rounded edge. Such as the conductive component of claim 1, wherein the conductive component is configured to connect to a plurality of charge storage devices and a plurality of conductive elements. The conductive component of claim 8, wherein the conductive component is configured to conduct current from each of the plurality of charge storage devices to a respective conductive element of the plurality of conductive elements. Such as the conductive component of claim 9, wherein the conductive component includes a plurality of first connection points and a plurality of second connection points, and wherein each of the plurality of first connection points is configured for connection To one of the plurality of charge storage devices, and each second connection point of the plurality of second connection points is configured to be connected to one of the plurality of conductive elements. For example, the conductive component of claim 10, wherein the plurality of first connection points and/or the plurality of second connection points are each arranged in a configuration extending along the longitudinal direction of the conductive component. Such as the conductive component of claim 11, wherein the conductive component is configured such that each of the channels is disposed between a first connection point and a second connection point. Such as the conductive component of claim 2, which further includes an insulating part arranged in each channel. The conductive component of claim 3, wherein the conductive component includes a conductive rod. A laser that contains: A discharge chamber; and A conductive component for conducting a current associated with a discharge in the discharge chamber, the conductive component comprising: At least one channel configured to increase a current path in another part of the conductive part relative to a current path in another part of the conductive part, the conductive part being configured to connect the laser to a The voltage source also provides an interface between the voltage source and the discharge chamber of the laser. Such as the laser of claim 15, wherein the laser includes a plurality of charge storage devices and a plurality of conductive elements, and the plurality of charge storage devices and the plurality of conductive elements are connected to the conductive member. Such as the laser of claim 16, wherein the conductive member is configured to conduct current from each of the plurality of charge storage devices to a respective conductive element of the plurality of conductive elements. Such as the laser of claim 16, wherein the plurality of conductive elements are configured to guide the current into the discharge chamber. Such as the laser of claim 15, wherein the conductive member includes a plurality of the channels, each of the channels is associated with a part of the conductive member and is configured for use relative to the other part of the conductive member The current path in increases a current path in the associated portion of the conductive component. Such as the laser of claim 18, wherein the discharge chamber is configured to contain one or more gases, and the one or more gases include krypton, argon, and/or fluorine. A lithography system, which includes: Contains a radiation source of a laser, the laser contains: A discharge chamber; and Such as a conductive component of claim 13, which is used to conduct a current associated with a discharge in the discharge chamber; and A lithography device. A method for operating a laser, the laser comprising: A laser with a laser discharge chamber; and A conductive member for conducting a current associated with a discharge in the discharge chamber, the conductive member including another portion of the conductive member configured to increase a current path in a portion of the conductive member At least one channel of a current path in the current path, the conductive member connects the laser to a voltage source and provides an interface between the voltage source and the discharge chamber of the laser, the method includes: A voltage is applied to the conductive component to cause a discharge in the discharge chamber, so that a current associated with the discharge flows into the discharge chamber through the conductive component. The method of claim 22, wherein the laser includes a plurality of charge storage devices and a plurality of conductive elements, and the plurality of charge storage devices and the plurality of conductive elements are connected to the conductive component. Such as the method of claim 23, wherein the conductive member is configured to conduct current from each of the plurality of charge storage devices to one of the plurality of conductive elements, the plurality of conductive elements A conductive element is configured to guide the current into the discharge chamber. The method of claim 23, wherein the voltage is applied to the conductive member so that current flows from the plurality of charge storage devices to the plurality of conductive elements through the conductive member, so that the portion of the conductive member is from the plurality of conductive elements The current path from one of the charge storage devices to the associated conductive element of one of the plurality of conductive elements is longer than in the other part of the conductive member from one of the plurality of charge storage devices to the charge storage device One of the plurality of conductive elements is associated with the current path of the conductive element. The method of claim 25, wherein the voltage is applied to the conductive member so that current flows from the plurality of conductive elements into the discharge chamber. The method of claim 23, wherein the step of applying the voltage to the conductive member includes applying a negative potential to the conductive member. The method of claim 23, wherein the conductive member includes a plurality of the channels, each of the channels is associated with a part of the conductive member and is configured for use relative to another part of the conductive member The current path increases a current path in the associated portion of the conductive component. The method of claim 22, wherein the conductive member further includes an insulating part disposed in each channel. The method of claim 28, wherein the conductive member further includes an insulating part disposed in each channel.

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