TW202129475A - Transparent conductive sheet, touch sensor, image display device, and manufacturing method therefor - Google Patents
Transparent conductive sheet, touch sensor, image display device, and manufacturing method therefor Download PDFInfo
- Publication number
- TW202129475A TW202129475A TW109131327A TW109131327A TW202129475A TW 202129475 A TW202129475 A TW 202129475A TW 109131327 A TW109131327 A TW 109131327A TW 109131327 A TW109131327 A TW 109131327A TW 202129475 A TW202129475 A TW 202129475A
- Authority
- TW
- Taiwan
- Prior art keywords
- transparent conductive
- area
- display area
- layer
- image display
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Laminated Bodies (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Non-Insulated Conductors (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
本發明涉及一種透明導電性片材、觸控感測器、影像顯示裝置及其製造方法。The invention relates to a transparent conductive sheet, a touch sensor, an image display device and a manufacturing method thereof.
以往觸控面板感測器已知有具備基材片材與配置於其上面之透明電極及繞線配線的透明導電性片材。In the past, a touch panel sensor has been known as a transparent conductive sheet including a base sheet, a transparent electrode and a winding wiring arranged on the base sheet.
例如,已有文獻提出一種觸控面板感測器,其具備透明導電性片材、被覆透明電極之光學構件及與繞線配線電性連接的FPC(例如參照下述專利文獻1)。
先前技術文獻
專利文獻For example, a document has already proposed a touch panel sensor including a transparent conductive sheet, an optical member covering a transparent electrode, and an FPC electrically connected to a winding wire (for example, refer to
專利文獻1:日本專利特開2015-133693號公報Patent Document 1: Japanese Patent Laid-Open No. 2015-133693
發明欲解決之課題 惟,在觸控面板感測器薄型化之目的下,已在試行將基材片材從透明電極及/或繞線配線剝離。The problem to be solved by the invention However, for the purpose of thinning the touch panel sensor, attempts have been made to peel off the substrate sheet from the transparent electrode and/or the wire-wound wiring.
然而,在相互鄰接之FPC與光學構件之邊界處,由於應力容易集中於透明電極及/或繞線配線且透明電極及/或繞線配線極薄之緣故,FPC與光學構件之邊界處的透明電極及/或繞線配線會有容易損傷之不良情況。However, at the boundary between the FPC and the optical component that are adjacent to each other, since the stress tends to concentrate on the transparent electrode and/or the wire and the transparent electrode and/or the wire is extremely thin, the boundary between the FPC and the optical member is transparent. The electrodes and/or winding wires may be easily damaged.
本發明提供一種謀求薄型化並可抑制透明導電層破損之透明導電性片材、觸控感測器、影像顯示裝置及其製造方法。The present invention provides a transparent conductive sheet, a touch sensor, an image display device, and a manufacturing method thereof that are thinner and can suppress damage to the transparent conductive layer.
用以解決課題之手段 本發明(1)包含一種透明導電性片材,其具有用以配置影像顯示構件之顯示區域、及與前述顯示區域連續之邊限區域;前述顯示區域中,朝厚度方向一側依序配置基材片材、剝離層、轉印層及透明導電層;且前述邊限區域中,朝前述厚度方向一側依序配置前述基材片材、前述轉印層及前述透明導電層。Means to solve the problem The present invention (1) includes a transparent conductive sheet having a display area for arranging an image display member and a marginal area continuous with the display area; in the display area, bases are sequentially arranged toward one side in the thickness direction The material sheet, the release layer, the transfer layer, and the transparent conductive layer; and in the margin area, the substrate sheet, the transfer layer, and the transparent conductive layer are sequentially arranged toward one side in the thickness direction.
該透明導電性片材之邊限區域中,由於基材片材與轉印層之間無剝離層,故可藉基材片材補強透明導電層。結果,可抑制邊限區域之透明導電層的損傷。In the marginal area of the transparent conductive sheet, since there is no peeling layer between the base sheet and the transfer layer, the transparent conductive layer can be reinforced by the base sheet. As a result, damage to the transparent conductive layer in the marginal area can be suppressed.
另一方面,在顯示區域中,可將基材片材及剝離層從轉印層剝離,故可謀求顯示區域之薄型化。On the other hand, in the display area, the base sheet and the release layer can be peeled from the transfer layer, so that the display area can be thinned.
本發明(2)包含一種透明導電性片材,其具有用以配置影像顯示構件之顯示區域、及與前述顯示區域連續之邊限區域;前述顯示區域中,朝厚度方向一側依序配置長條之基材片材、剝離層、轉印層及透明導電層;且前述邊限區域中,朝厚度方向一側依序配置長條之前述基材片材、前述轉印層及前述透明導電層;並且前述邊限區域係於前述長條方向上連續。The present invention (2) includes a transparent conductive sheet having a display area for arranging image display members and a marginal area continuous with the display area; in the display area, the length of the display area is arranged in sequence toward the thickness direction side Strips of the substrate sheet, release layer, transfer layer and transparent conductive layer; and in the marginal area, the strips of the substrate sheet, the transfer layer and the transparent conductive layer are sequentially arranged toward one side in the thickness direction Layer; and the aforementioned marginal area is continuous in the aforementioned longitudinal direction.
該透明導電性片材之邊限區域中,由於基材片材與轉印層之間無剝離層,故可藉基材片材補強透明導電層。結果,可抑制邊限區域之透明導電層的損傷。In the marginal area of the transparent conductive sheet, since there is no peeling layer between the base sheet and the transfer layer, the transparent conductive layer can be reinforced by the base sheet. As a result, damage to the transparent conductive layer in the marginal area can be suppressed.
另一方面,在顯示區域中,可將基材片材及剝離層從轉印層剝離,故可謀求顯示區域之薄型化。On the other hand, in the display area, the base sheet and the release layer can be peeled from the transfer layer, so that the display area can be thinned.
並且,將於長條方向上連續之邊限區域及與其對應之顯示區域,沿長條方向多量裁切成觸控感測器或影像顯示裝置的尺寸,即可簡便地製造出具有與觸控感測器或影像顯示裝置對應之尺寸的多個透明導電性片材。因此,可提升透明導電性片材之製造效率。In addition, the continuous marginal area in the strip direction and the corresponding display area are cut into the size of the touch sensor or image display device along the strip direction. A plurality of transparent conductive sheets of the size corresponding to the sensor or the image display device. Therefore, the manufacturing efficiency of the transparent conductive sheet can be improved.
本發明(3)包含一種觸控感測器,其具有用以配置影像顯示構件之顯示區域及與前述顯示區域連續之邊限區域;前述顯示區域中,朝厚度方向一側依序配置轉印層、透明電極及光學構件;前述邊限區域中,朝厚度方向一側依序配置基材片材、前述轉印層、繞線配線及相互鄰接之前述光學構件及配線電路基板;當往前述厚度方向投影時,前述光學構件及前述配線電路基板之邊界包含於前述邊限區域中。The present invention (3) includes a touch sensor having a display area for arranging image display members and a marginal area continuous with the aforementioned display area; in the aforementioned display area, transfers are sequentially arranged toward one side in the thickness direction Layer, transparent electrode, and optical member; in the marginal area, the substrate sheet, the transfer layer, the wiring wiring, and the adjacent optical member and the wiring circuit board are arranged in order toward one side in the thickness direction; When projecting in the thickness direction, the boundary between the optical member and the printed circuit board is included in the marginal area.
該觸控感測器中,光學構件及配線電路基板之邊界包含於邊限區域中。因此,邊限區域之基材片材可補強與邊界對應的繞線配線。其結果,可抑制繞線配線的損傷。In the touch sensor, the boundary between the optical member and the wiring circuit board is included in the marginal area. Therefore, the base material sheet in the marginal area can reinforce the winding wiring corresponding to the boundary. As a result, damage to the winding wiring can be suppressed.
又,在顯示區域中,由於沒有基材片材及剝離層,故可謀求顯示區域之薄型化。In addition, since there is no base sheet and release layer in the display area, it is possible to reduce the thickness of the display area.
本發明(4)包含如(3)記載之觸控感測器,其中前述邊界為間隔前述光學構件及前述配線電路基板之間隙。The present invention (4) includes the touch sensor as described in (3), wherein the boundary is a gap separating the optical member and the printed circuit board.
若光學構件及配線電路基板之邊界存在間隙,與此間隙對應之繞線配線的強度便會降低。剝離層配置於顯示區域及邊限區域兩者時,在將所述剝離層從轉印層剝離的步驟中,會造成對應間隙之繞線配線很大的負荷,而繞線配線容易破損。If there is a gap between the optical member and the printed circuit board, the strength of the winding wiring corresponding to the gap will decrease. When the peeling layer is disposed in both the display area and the marginal area, the step of peeling the peeling layer from the transfer layer will cause a large load on the winding wiring corresponding to the gap, and the winding wiring may be easily damaged.
但,該觸控感測器之邊限區域未配置有剝離層,而所述邊限區域包含有間隙。因此,邊限區域之基材片材可補強對應間隙的繞線配線。因此,可抑制繞線配線的損傷。However, the marginal area of the touch sensor is not provided with a peeling layer, and the marginal area includes a gap. Therefore, the substrate sheet in the marginal area can reinforce the winding wiring corresponding to the gap. Therefore, damage to the winding wiring can be suppressed.
本發明(5)包含(3)或(4)記載之觸控感測器,其中前述邊限區域具有對前述顯示區域回折之回折部。The present invention (5) includes the touch sensor described in (3) or (4), wherein the marginal area has a folded back portion that folds back to the display area.
該觸控感測器中,於邊限區域可利用基材片材補強回折部。因此,回折部之強度提升。其結果,即便邊限區域於回折部對顯示區域回折,仍能抑制回折部的損傷。In the touch sensor, the back-folding part can be reinforced by the base material sheet in the marginal area. Therefore, the strength of the turn-back portion is improved. As a result, even if the margin area is folded back to the display area at the folded-back portion, damage to the folded-back portion can be suppressed.
本發明(6)包含一種影像顯示裝置,其具備如(3)~(5)中任一項記載之觸控感測器、與配置於前述觸控感測器之前述顯示區域的前述影像顯示構件。The present invention (6) includes an image display device including the touch sensor as described in any one of (3) to (5), and the image display arranged in the display area of the touch sensor member.
該影像顯示裝置可具備已抑制透明導電層之損傷的觸控感測器。The image display device may be provided with a touch sensor that has suppressed damage to the transparent conductive layer.
本發明(7)包含一種影像顯示裝置之製造方法,其具備以下步驟:準備如(1)記載之透明導電性片材;從前述透明導電層形成透明電極及繞線配線;將光學構件涵蓋前述顯示區域及前述邊限區域中與前述顯示區域鄰接的部分配置,並將配線電路基板以與前述光學構件鄰接之方式配置於前述邊線區域中與前述部分位在相反側之部分;從前述轉印層剝離前述顯示區域之前述剝離層,而去除前述顯示區域之前述剝離層及與其對應之前述基材片材;將前述影像顯示構件配置於前述顯示區域中經去除前述剝離層及前述基材片材之前述轉印層上;及將前述邊限區域對前述顯示區域朝前述影像顯示構件側回折。The present invention (7) includes a method of manufacturing an image display device, which includes the following steps: preparing a transparent conductive sheet as described in (1); forming transparent electrodes and winding wires from the transparent conductive layer; and covering the aforementioned optical member Arrangement of the display area and the part of the border area adjacent to the display area, and arrange the wiring circuit board in the part of the border area that is on the opposite side to the part in the border area so as to be adjacent to the optical member; from the transfer The layer peels off the peeling layer in the display area, and removes the peeling layer in the display area and the base sheet corresponding to it; disposing the image display member in the display area after removing the peeling layer and the base sheet On the transfer layer of the material; and fold back the marginal area to the display area toward the image display member side.
於該製造方法中,可利用與光學構件及配線電路基板之邊界對應的基材片材來補強繞線配線。因此,可抑制繞線配線的損傷。In this manufacturing method, the wire-wound wiring can be reinforced with a base material sheet corresponding to the boundary between the optical member and the wiring circuit board. Therefore, damage to the winding wiring can be suppressed.
又,即使將影像顯示構件配置於顯示區域,仍可謀求對應顯示區域之影像顯示裝置的薄型化。In addition, even if the image display member is arranged in the display area, the image display device corresponding to the display area can be thinned.
並且,由於會將邊限區域對顯示區域朝影像顯示構件側回折,故當往前述厚度方向投影時,可使邊限區域及配置於其中之配線電路基板與顯示區域重疊。因此,可使影像顯示裝置之邊限區域窄化。 結果,可提高影像顯示裝置之顯示區域的面積比。In addition, since the marginal area is folded back toward the image display member side to the display area, when projecting in the aforementioned thickness direction, the marginal area and the wiring circuit board arranged therein can overlap the display area. Therefore, the marginal area of the image display device can be narrowed. As a result, the area ratio of the display area of the image display device can be increased.
在本發明(8)中包含如(7)記載之影像顯示裝置之製造方法,其中在配置前述光學構件及前述配線電路基板之步驟中,於前述光學構件及前述配線電路基板之間設置間隙。The present invention (8) includes the method for manufacturing an image display device as described in (7), wherein in the step of arranging the optical member and the wiring circuit board, a gap is provided between the optical member and the wiring circuit board.
在配置光學構件及配線電路基板之步驟中,可藉由光學構件及與配線電路基板之間隙對應的基材片材來補強繞線配線。因此,可抑制繞線配線的損傷。In the step of arranging the optical member and the wiring circuit board, the winding wiring can be reinforced by the optical member and the base material sheet corresponding to the gap of the wiring circuit board. Therefore, damage to the winding wiring can be suppressed.
發明效果 藉由本發明之透明導電性片材,可謀求薄型化,並抑制透明導電層之損傷。Invention effect With the transparent conductive sheet of the present invention, thickness reduction can be achieved and damage to the transparent conductive layer can be suppressed.
本發明之透明導電性片材可提升製造效率。The transparent conductive sheet of the present invention can improve manufacturing efficiency.
藉由本發明之觸控感測器,可抑制透明導電層之損傷。With the touch sensor of the present invention, damage to the transparent conductive layer can be suppressed.
根據本發明之影像顯示裝置及其製造方法,可於影像顯示裝置具備一種已抑制透明導電層損傷的觸控感測器。According to the image display device and the manufacturing method thereof of the present invention, the image display device can be provided with a touch sensor that has suppressed damage to the transparent conductive layer.
用以實施發明之形態 <一實施形態> [第1透明導電性片材] 參照圖1~圖2B說明本發明之透明導電性片材之一實施形態的第1透明導電性片材。The form used to implement the invention <One embodiment> [First transparent conductive sheet] The first transparent conductive sheet of one embodiment of the transparent conductive sheet of the present invention will be described with reference to FIGS. 1 to 2B.
圖1係沿著圖2A~圖2B之X-X線的剖面圖。圖1中各層係經適度誇大地描繪其厚度、長度等,以明確顯示該層結構。Fig. 1 is a cross-sectional view taken along line X-X of Fig. 2A to Fig. 2B. The thickness, length, etc. of each layer in Figure 1 have been appropriately exaggerated to clearly show the layer structure.
圖2A~圖2B中,邊限區域4(後述)係以影線(hatching)描繪,以明確顯示其配置及形狀。In FIGS. 2A to 2B, the marginal area 4 (described later) is drawn with hatching to clearly show its configuration and shape.
如圖1~圖2A所示,該第1透明導電性片材1具有朝與厚度方向正交之面方向延伸的形狀。第1透明導電性片材1例如在俯視下(與往厚度方向投影之投影面同義)呈大致矩形形狀。第1透明導電性片材1連續具有顯示區域3與邊限區域4。As shown in FIGS. 1 to 2A, the first transparent
顯示區域3係用以配置後述影像顯示構件9的區域。顯示區域3是第1透明導電性片材1中除了接著要說明之邊限區域4以外的主要區域。又,顯示區域3係包含後述影像顯示裝置30之感測器顯示部31(參照圖7B及圖8D)的區域。第1透明導電性片材1之顯示區域3的面積比率,例如為80%以上,宜為90%以上;又例如為99%以下。The
邊限區域4與顯示區域3連續。邊限區域4係未設置影像顯示構件9的留白區域(非顯示區域)。又,邊限區域4係接合後述之印刷配線板13(參照圖7A及圖8B)的區域。詳細而言,邊限區域4係於第1透明導電性片材1呈大致矩形形狀時,沿一邊設置端部(一端部)之區域。The
如圖1所示,該第1透明導電性片材1朝厚度方向一側依序具備基材片材5、剝離層6、轉印層7與透明導電層8。第1透明導電性片材1亦可僅具備基材片材5、剝離層6、轉印層7及透明導電層8,又亦可具備包夾於轉印層7及透明導電層8之間的機能層(光學調整層)等。機能層之配置不限於上述。As shown in FIG. 1, the first transparent
基材片材5形成第1透明導電性片材1之厚度方向的另一面。基材片材5具有與第1透明導電性片材1相同之外形。The
基材片材5的材料可舉例如樹脂(包含聚合物)。樹脂可舉例如聚對苯二甲酸乙二酯(PET)、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯樹脂,例如聚甲基丙烯酸酯等(甲基)丙烯酸樹脂(丙烯酸樹脂及/或甲基丙烯酸樹脂),例如聚乙烯、聚丙烯、環烯烴聚合物(COP)等烯烴樹脂,例如聚碳酸酯樹脂、例如聚醚磺酸樹脂、例如聚芳酯樹脂、例如三聚氰胺樹脂、例如聚醯胺樹脂、例如聚醯亞胺樹脂、例如纖維素樹脂、例如聚苯乙烯樹脂、例如降莰烯樹脂等。從強度及彎折特性之觀點來看,宜可舉如聚酯樹脂,較佳可舉如PET。The material of the
基材片材5在25℃下之拉伸強度,例如為10MPa以上,且宜為25MPa以上,更宜為35MPa以上,且100MPa以下。基材片材5的拉伸強度只要在上述下限以上,即可充分補強對應後述之間隙19的轉印層7及透明導電層8(繞線配線12)。拉伸強度係依JIS R7608(2004年)而求得。此外,以下構件之拉伸強度亦可藉由與上述同樣的方法求得。The tensile strength of the
基材片材5在25℃下之降伏應變例如為0.5%以上,宜為1%以上,更宜為2%以上;又例如為20%以下。只要基材片材5之降伏應變為上述下限以上,即可確實地將後述之回折部21彎折。降伏應變可依循JIS K7161(2012年)求得。
又,以下構件之降伏應變亦可藉由上述同樣的方法求得。The yield strain of the
基材片材5的厚度例如為1µm以上,宜為10µm以上;又例如為100µm以下,宜為75µm以下。The thickness of the
剝離層6配置於顯示區域3之基材片材5的厚度方向一面。具體而言,剝離層6接觸顯示區域3之基材片材5的厚度方向一面之整面。The
又,該第1透明導電性片材1中,剝離層6(及基材片材5)對轉印層7接觸(密著)。In addition, in the first transparent
亦即,該第1透明導電性片材1,於顯示區域3中具備剝離層6的同時,於邊限區域4中未具備剝離層6。That is, the first transparent
剝離層6之材料可舉例如氟樹脂、聚矽氧樹脂、油等。Examples of the material of the
剝離層6之厚度例如為0.01µm以上,宜為0.5µm以上;又例如為10µm以下,宜為5µm以下。The thickness of the
剝離層6對基材片材5之剝離力可調整成高於剝離層6對轉印層7的剝離力。The peeling force of the
轉印層7係用以將由後述透明導電層8形成之透明電極11及繞線配線12(參照圖8A)轉印至光學構件35(參照圖8B)之層。又,轉印層7亦為將其本身轉印至光學構件35之層。並且,轉印層7可作為硬塗層發揮功能。The
轉印層7配置於顯示區域3之剝離層6的厚度方向之一面與邊限區域4之基材片材5的厚度方向之一面。轉印層7接觸顯示區域3之剝離層6的厚度方向之一面與邊限區域4之基材片材5的厚度方向之一面。The
此外,轉印層7被覆剝離層6之一側端面。又,邊限區域4之轉印層7的厚度方向另一面係與顯示區域3之剝離層6的厚度方向另一面呈同平面。又,轉印層7之厚度方向之一面係沿著面方向之平坦面。In addition, the
轉印層7的材料可舉如含有丙烯酸樹脂等透明樹脂之透明組成物。所述樹脂組成物詳述於例如日本特開2018-192710號公報等。轉印層7在25℃下之降伏應變例如為0.5%以上,且宜為1%以上,更宜為2%以上;又例如為20%以下。The material of the
轉印層7之厚度例如為0.1µm以上,宜為0.5 µm以上;又例如為50µm以下,宜為25µm以下,更宜為10µm以下。轉印層7對基材片材5之厚度的比率例如為0.5以下,宜為0.1以下,更宜為0.01以下;又例如為0.0001以上。The thickness of the
透明導電層8形成第1透明導電性片材1之厚度方向之一面。透明導電層8配置於轉印層7之厚度方向之一面。具體而言,透明導電層8接觸轉印層7之厚度方向一面之整面。另外,透明導電層8於後述之觸控感測器20中,未如透明電極11及繞線配線12(參照圖8A)般圖案化,亦即透明導電層8之厚度方向另一面的整面與轉印層7之厚度方向一面的整面接觸。The transparent
透明導電層8之材料可舉例如金屬氧化物、金屬奈米線等。金屬氧化物可舉例如包含選自於由In、Sn、Zn、Ga、Sb、Ti、Si、Zr、Mg、Al、Au、Ag、Cu、Pd及W所構成群組中之至少1種金屬的金屬氧化物,且宜為銦-錫複合氧化物(ITO:Indium Tin Oxide)等含銦氧化物、含銻之氧化錫等。金屬氧化物中亦可視需求進一步摻雜有上述群組所示之金屬原子。透明導電層8亦可為以金屬氧化物或金屬構成之導電性圖案。導電性圖案之形狀可舉如條紋狀、四方狀、格子狀等,惟不受該等限定。Examples of the material of the transparent
透明導電層8之表面電阻例如為150Ω/□以下,例如為1Ω/□以上。The surface resistance of the transparent
透明導電層8之全光線透射率例如為80%以上,且宜為85%以上,更宜為90%以上;又例如為100%以下。The total light transmittance of the transparent
透明導電層8之厚度例如為10nm以上;且例如為200nm以下,宜為100nm以下,更宜為75nm以下。透明導電層8的厚度相對於基材片材5的厚度之比率例如為10-2
以下,宜為10-3
以下,更宜為10-4
以下;又例如為10-6
以上。The thickness of the transparent
又,轉印層7及透明導電層8之合計厚度相對於基材片材5之厚度的比率例如為0.5以下,宜為0.1以下,更宜為0.01以下;又例如為0.0001以上。In addition, the ratio of the total thickness of the
然後,在該第1透明導電性片材1之顯示區域3中,朝厚度方向一側依序配置基材片材5、剝離層6、轉印層7與透明導電層8。具體而言,顯示區域3係由基材片材5、配置於其厚度方向一面之剝離層6、配置於其厚度方向一面之轉印層7與配置於其厚度方向一面之透明導電層8所構成。亦即,在顯示區域3中,於基材片材5及轉印層7之間包夾有剝離層6。Then, in the
此外,邊限區域4中,朝厚度方向一側依序配置基材片材5、轉印層7與透明導電層8。具體而言,邊限區域4係由基材片材5、配置於其厚度方向一面之轉印層7與配置於其厚度方向一面之透明導電層8所構成。亦即,在邊限區域4中,基材片材5及轉印層7之間未包夾剝離層6,亦即基材片材5(之厚度方向一面)與轉印層7(之厚度方向另一面)相互接觸。簡而言之,第1透明導電性片材1中,邊限區域4係未配置剝離層6之區域。In addition, in the
此外,第1透明導電性片材1之顯示區域3及邊限區域4各自的形狀並無特別限定。例如,如圖2A所示,顯示區域3及邊限區域4各呈俯視大致矩形形狀。具體而言,顯示區域3及邊限區域4會呈共有一邊之俯視大致矩形形狀。詳細而言,顯示區域3之一端緣的全部被邊限區域4之另一端緣的全部所共有。In addition, the shape of each of the
或者,如圖2B所示,顯示區域3之一端緣的一部分亦可被邊限區域4之另一端緣的全部所共有。此時,邊限區域4譬如具有從顯示區域3之一端緣的一部分朝外側突出的形狀。具體而言,第1透明導電性片材1具有俯視略呈L字之形狀(鉤針狀)。Alternatively, as shown in FIG. 2B, a part of one end edge of the
要獲得該第1透明導電性片材1,首先係準備基材片材5,然後於其上依序積層剝離層6、轉印層7及透明導電層8。In order to obtain this first transparent
例如,藉由塗佈(網版印刷等)將剝離層6僅形成於基材片材5之厚度方向一面的顯示區域3上。接著,例如將樹脂組成物之漆料涵蓋塗佈於顯示區域3之剝離層6之厚度方向一面與邊限區域4之基材片材5之厚度方向一面上,然後進行加熱乾燥而形成轉印層7。然後,例如藉由濺鍍等方式於轉印層7之厚度方向一面之整面形成透明導電層8。For example, the
藉此,可製得第1透明導電性片材1,其具有與影像顯示構件9(參照圖8C)之尺寸對應的顯示區域3。Thereby, the first transparent
又,製造圖2A所示之第1透明導電性片材1,之後進行外形加工,具體而言即去除部分邊限區域4(切割加工)的同時,使一部份殘留,製造出圖2B所示之第1透明導電性片材1。In addition, the first transparent
圖2A~圖2B所示之第1透明導電性片材1的大小,舉例而言可根據配置於顯示區域3的影像顯示構件9(參照圖8C)之大小來適當設定。The size of the first transparent
第1透明導電性片材1的平面面積中邊限區域4之平面面積的比率,例如為20%以下,宜為10%以下,更宜為5%以下;又例如為0.1%以上。The ratio of the planar area of the
第1透明導電性片材1的厚度為基材片材5、剝離層6、轉印層7及透明導電層8之厚度合計,具體而言,例如為10µm以上;且例如為2000µm以下,宜為1000µm以下,更宜為500µm以下。The thickness of the first transparent
另,該第1透明導電性片材1尚未具備光學構件35及印刷配線板13(參照圖8B),並非具備光學構件35及印刷配線板13之觸控感測器20。又,第1透明導電性片材1尚未具備影像顯示構件9(參照圖8C),也非具備影像顯示構件9之影像顯示裝置30。第1透明導電性片材1係用以製造觸控感測器20或影像顯示裝置30之中間零件(中間構件),為產業上可利用之器件。In addition, the first transparent
[第2透明導電性片材]
如圖3A~圖6所示,亦可從具有長條片材形狀之第2透明導電性片材2裁切出多個第1透明導電性片材1(參照粗的點虛線),以獲得多個第1透明導電性片材1。[Second transparent conductive sheet]
As shown in FIGS. 3A to 6, it is also possible to cut out a plurality of first transparent
例如,第2透明導電性片材2捲繞成捲狀。第2透明導電性片材2可利用捲對捲(roll to roll)法製造,其係於2個輥間捲繞基材片材5,於該等輥之間朝長條方向輸送的同時依序形成剝離層6、轉印層7及透明導電層8。第2透明導電性片材2之長條方向的長度例如為5m以上,宜為10m以上,更宜為100m以上,例如為10,000m以下。For example, the second transparent
如圖3B所示,第2透明導電性片材2具備上述基材片材5、剝離層6、轉印層7及透明導電層8。As shown in FIG. 3B, the second transparent
圖3A~圖3B所示第2透明導電性片材2,例如具有:2個顯示區域3,其配置於與長條方向及厚度方向正交之寬度方向的兩側部分;與配置於該等之間的1個邊限區域4。2個顯示區域3及1個邊限區域4各於長條方向上連續。The second transparent
因此,在第2透明導電性片材2之寬度方向的兩側部分(顯示區域3)中,剝離層6、轉印層7及透明導電層8依序積層於長條基材片材5上。另一方面,在第2透明導電性片材2之寬度方向的中間部分(邊限區域4)中,轉印層7及透明導電層8依序積層於基材片材5上。Therefore, on both sides (display area 3) of the second transparent
要從1個第2透明導電性片材2製得多個第1透明導電性片材1,係如圖3A的粗度1之虛線所示,沿長條方向切割1個邊限區域4之寬度方向中間部,並沿寬度方向切割2個顯示區域3及1個邊限區域4。在該變形例中,如圖3B所示,在沿寬度方向剖視下,可從1個第2透明導電性片材2製得2個第1透明導電性片材1。To prepare a plurality of first transparent
圖4所示之第2透明導電性片材2具有配置於寬度方向兩端部及寬度方向中央部之3個邊限區域4,與配置於該等之間的2個顯示區域3。3個邊限區域4各於長條方向上連續。2個顯示區域3各於長條方向上連續。The second transparent
該變形例中,在寬度方向剖視下(未圖示),可從1個第2透明導電性片材2製得4個第1透明導電性片材1。In this modification, in a cross-sectional view in the width direction (not shown), four first transparent
又,雖在一實施形態中,係切割邊限區域4之寬度方向中間部,但舉例而言如圖5A所示,亦可切割顯示區域3及邊限區域4之邊界。In addition, although in one embodiment, the widthwise middle portion of the
又,如圖5B所示,亦可不沿著長條方向切割第2透明導電性片材2,僅沿寬度方向切割第2透明導電性片材2。Moreover, as shown in FIG. 5B, instead of cutting the second transparent
此外,如圖6所示,亦可將多個邊限區域4於長條方向上隔著間隔配置為條狀的圖案。此時,顯示區域3配置於多個邊限區域4間。
[觸控感測器、影像顯示裝置及其等之製造方法]
接著,參照圖1、圖2B、圖7A~圖8D說明從圖2B所示之第1透明導電性片材製造觸控感測器的方法,以及從觸控感測器製造影像顯示裝置之方法。In addition, as shown in FIG. 6, a plurality of
影像顯示裝置30之製造方法具備以下步驟:準備第1透明導電性片材1;形成透明電極11及繞線配線12;配置作為光學構件35及配線電路基板之一例的印刷配線板13;將剝離層6從轉印層7剝離;將影像顯示構件9配置於顯示區域3;回折邊限區域4。The manufacturing method of the
影像顯示裝置30之製造方法中,首先係以上述方法準備圖1及圖2B所示之第1透明導電性片材1。In the manufacturing method of the
接著,在影像顯示裝置30之製造方法中,如圖8A所示,從透明導電層8形成透明電極11及繞線配線12。例如,藉由蝕刻等方式將透明導電層8圖案化成透明電極11及繞線配線12。Next, in the manufacturing method of the
透明電極11形成於較顯示區域3的周端部更靠內側區域。透明電極11於觸控感測器20中,係形成可檢測使用者手指之位置及運動(面方向之移動)的圖案。例如,於面方向上將多個透明電極11彼此隔著間隔配置。The
繞線配線12形成於顯示區域3之周端部與邊限區域4。繞線配線12之一端連接多個透明電極11之端部(未圖示),又,另一端具有可與後述印刷配線板13之端子26(後述)連接之圖案。繞線配線12係與透明電極11、印刷配線板13電連接之電性配線。The winding
另外,繞線配線12亦可由透明配線部與金屬配線部41所形成,且該透明配線部係由透明導電層8構成,該金屬配線部41係由積層於該透明配線部上之金屬層40所構成(參照圖8A之假想線)。此時,首先將金屬層40積層於顯示區域3之周端部及邊限區域中透明導電層8的厚度方向之一面上,並蝕刻金屬層40及與其對應之透明導電層8而形成繞線配線12。In addition, the winding
接著,影像顯示裝置30之製造方法中,如圖7A及圖8B所示,將光學構件35涵蓋顯示區域3及邊限區域4之基端部分24進行配置。又,將印刷配線板13配置於邊限區域4的自由端部分25。Next, in the manufacturing method of the
基端部分24係邊限區域4中與顯示區域3鄰接的部分(區域)。The
光學構件35具有與顯示區域3、邊限區域4之基端部分24對應之形狀。光學構件35具有於俯視下與顯示區域3、邊限區域4之基端部分24重疊但與自由端部分25不重疊之形狀。The
例如,光學構件35朝厚度方向一側依序具備第1黏著劑層14、偏光板15、第2黏著劑層16、隱蔽層18及透明保護構件17。For example, the
第1黏著劑層14在俯視下具有與光學構件35相同之外形。第1黏著劑層14於轉印層7之厚度方向一側被覆透明電極11及繞線配線12。具體而言,第1黏著劑層14係配置於透明電極11、繞線配線12之側面及厚度方向一面、以及轉印層7上從透明電極11及繞線配線12露出之厚度方向一面。第1黏著劑層14的材料可列舉具透明性之黏著劑(具體上為壓敏接著劑)。第1黏著劑層14之全光線透射率例如為80%以上,宜為85%以上,更宜為90%以上;又例如為100%以下。第1黏著劑層1之厚度例如為5µm以上,又例如為100µm以下。The first
偏光板15具有沿面方向延伸之形狀。偏光板15在俯視下具有與第1黏著劑層14相同之外形。偏光板15配置於第1黏著劑層14之厚度方向一面。詳細而言,偏光板15接觸第1黏著劑層14之厚度方向一面之整面。偏光板15之全光線透射率例如為30%以上,宜為35%以上,更宜為40%以上;又例如為50%以下。偏光板15之厚度例如為1µm以上,例如為100µm以下。The
第2黏著劑層16在俯視下具有對應偏光板15之外形,具體而言為具有比偏光板15之尺寸稍小的尺寸。具體而言,基端部分24之第2黏著劑層16之一端面配置於較基端部分24之偏光板15一端面更靠顯示區域3側(後退)。另,基端部分24之第2黏著劑層16不包含於後述之回折部21(參照圖8C之粗度1的虛線)。The second
第2黏著劑層16配置於偏光板15之厚度方向一面。第2黏著劑層16接觸偏光板15之厚度方向一面。第2黏著劑層16之材料、全光線透射率及厚度與第1黏著劑層14之上述該等相同。The second
透明保護構件17具有沿面方向延伸之形狀。透明保護構件17配置於第2黏著劑層16之厚度方向一面。透明保護構件17接觸第2黏著劑層16之厚度方向一面。透明保護構件17之外周端緣在俯視下,具有較偏光板15尺寸稍小之尺寸。作為透明保護構件17,只要具有透明性及優異的機械強度便無特別限定,可舉例如玻璃板、樹脂板(例如透明聚醯亞胺、丙烯酸板等)等。透明保護構件17之全光線透射率例如為80%以上,宜為85%以上,更宜為90%以上;且例如為100%以下。透明保護構件17之厚度例如為10µm以上且例如為200µm以下。The transparent
遮蔽層18在俯視下具有包含繞線配線12之圖案。亦即,遮蔽層18配置於顯示區域3之周端部及邊限區域4。又,遮蔽層18形成於透明保護構件17之第2黏著層16側的面。遮蔽層18印刷於透明保護構件17之上述面。遮蔽層18之材料可舉例如含有黑色成分及樹脂之組成物等。遮蔽層18係於觸控感測器20中避免使用者從厚度方向一側視辨繞線配線12之層。遮蔽層18之全光線透射率例如為10%以下,宜為5%以下;又例如為0.0001%以上。遮蔽層18之厚度例如為0.5µm以上,且例如為50µm以下。The
光學構件35之機械強度較高。The mechanical strength of the
如圖8B所示,邊限區域4中,基材片材5、轉印層7、繞線配線12與光學構件35之一部分(具體而言為第1黏著劑層14及偏光板15)在厚度方向上重疊的部分,係可讓自由端部分25對顯示區域3回折之回折部21(後述)。As shown in FIG. 8B, in the
如圖7A及圖8B所示,印刷配線板13具有於邊限區域4從顯示區域3突出之方向(與顯示區域3及邊限區域4之鄰接方向同義)上伸長之大致矩形板形狀。印刷配線板13具備端子26,其配置於長條方向一端部之下面。印刷配線板13以端子26和繞線配線12之另一端電連接的方式,與邊限區域4之自由端部分25接合。As shown in FIGS. 7A and 8B, the printed
印刷配線板13在與光學構件35之間隔著間隙19。There is a
在將印刷配線板13與光學構件35以鄰接之方式配置於邊限區域4時,會不可避免地形成間隙19。When the printed
間隙19係印刷配線板13及光學構件35之間之邊界的一例。間隙19係形成於光學構件35之側端面與印刷配線板13之側端面之間的間隔。如圖7A所示,間隙19沿與邊限區域4之突出方向及厚度方向正交方向(沿著顯示區域3及邊限區域4所共有之一邊的方向)延伸。The
在俯視下,與間隙19重疊之轉印層7及繞線配線12的強度雖低,但其等可藉由與間隙19重疊之基材片材5來補強。邊限區域4中與間隙19對應之部分的拉伸強度例如為10MPa以上,宜為25MPa以上,更宜為35MPa以上,又為100MPa以下。In a plan view, although the strength of the
間隙19的寬度為光學構件35及印刷配線板13間之距離,並無特別限定。間隙19的寬度例如為100µm以上,更甚者為500µm;又例如為10,000µm以下。The width of the
印刷配線板13之拉伸強度例如為10MPa以上,宜為25MPa以上,更宜為35MPa以上,又為100MPa以下。The tensile strength of the printed
接著,在影像顯示裝置30之製造方法中,如圖8B之假想線所示,將顯示區域3之剝離層6從轉印層7剝離,並去除顯示區域3之剝離層6及與之對應的基材片材5。Next, in the method of manufacturing the
具體而言,例如抓取顯示區域3之剝離層6的其他端部,使其向厚度方向之另一側(或邊限區域4側)移動,同時將剝離層6隨顯示區域3之基材片材5剝離。Specifically, for example, grab the other end of the
接著,在基材片材5中對應於剝離層6之一端緣的部分形成切口27。例如使用切刀等切割裝置28,於剝離層6形成切口27。Next, a
之後,沿著切口27將顯示區域3之基材片材5從邊限區域4之基材片材5切離(分離)。After that, the
又,亦可先於基材片材5形成切口27後,再去除顯示區域3之基材片材5及剝離層6。In addition, after the
藉由基材片材5及剝離層6之去除(剝離),顯示區域3之轉印層7的厚度方向另一面露出於厚度方向另一側。By the removal (peeling) of the
藉此,可獲得觸控感測器20,其具有顯示區域3與邊限區域4,且顯示區域3係朝厚度方向一側依序配置有轉印層7、透明電極11與光學構件35,而邊限區域4係朝厚度方向一側依序配置有基材片材5、轉印層7、繞線配線12、光學構件35及印刷配線板13。邊限區域4包含間隙19。Thereby, a
另,該觸控感測器20之顯示區域3中,尚未配置影像顯示構件9(參照圖8C)。因此,觸控感測器20係用以製造具備影像顯示構件9之影像顯示裝置30的中間零件(中間構件)。該觸控感測器20亦為產業上可利用的器件。In addition, in the
接著,如圖8C所示,影像顯示裝置30之製造方法中,將影像顯示構件9配置於轉印層7的厚度方向另一面,其已去除觸控感測器20之顯示區域3的基材片材5及剝離層6。Next, as shown in FIG. 8C, in the method of manufacturing the
影像顯示構件9在俯視下具有與顯示區域3(剝離層6)相同的形狀及尺寸。The
具體而言,影像顯示構件9可舉例如有機EL(電致發光)顯示裝置(OLED)、液晶顯示裝置(LCD)等。又,影像顯示構件9亦可含有配置於上述裝置之厚度方向一面之習知的黏著劑層51。黏著劑層51係將上述裝置壓敏接著於顯示區域3中之轉印層7。Specifically, the
此外,影像顯示構件9之一端面與邊限區域4之基材片材5的突出方向上游側端面接觸。In addition, one end surface of the
影像顯示構件9的厚度例如為1µm以上,又例如為100µm以下。The thickness of the
藉此,可製得影像顯示裝置30,其具備有:具有已去除基材片材5及剝離層6之顯示區域3的觸控感測器20、配置於已去除基材片材5及剝離層6之顯示區域3的影像顯示構件9。此外,該影像顯示裝置30作為可藉回折部21彎折之影像顯示裝置30,亦為產業上可利用之裝置。Thereby, an
接著,影像顯示裝置30之製造方法中,如圖7B、圖8C之箭頭及圖8D所示,將邊限區域4對顯示區域3朝影像顯示構材9回折。Next, in the manufacturing method of the
具體而言,以回折部21彎曲的方式將邊限區域4之自由端部分25朝影像顯示構件9側回折。詳細而言,是以使偏光板15之厚度方向一面呈凸狀而邊限區域4之基材片材5之厚度方向另一面呈凹狀的方式,彎曲回折部21。Specifically, the
又,將自由端部分25與印刷配線板13一同回折。藉此,印刷配線板13在往厚度方向投影之投影面上,會與影像顯示構件9部分重疊。亦即,於光學構件35之側邊隔著間隔的印刷配線板13會因上述彎折,而移動至影像顯示構件9之厚度方向另一側。彎折後的影像顯示構件9雖可透過仰視視辨,但無法透過俯視視辨。Furthermore, the
藉此,可製得影像顯示裝置30,其具備觸控感測器20與影像顯示構件9,且其自由端部分25及印刷配線板13藉回折部21而回折。Thereby, the
該影像顯示裝置30在俯視下包含感測器顯示部31及邊框部32。The
感測器顯示部31含括在顯示區域3中,具體上為與透明電極11對應之區域。在感測器顯示部31中,偵測使用者手指運動的同時,會顯示基於影像顯示構材9之驅動的影像。The
邊緣區32係對應顯示區域3之周端部及彎折後之邊限區域4的區域,具體而言,即與遮蔽層18(繞線配線12)相對應的區域。邊框部32中,藉由遮蔽層18遮蔽之繞線配線12將透明電極11所檢測之電訊號傳輸至印刷配線板13。The
該影像顯示裝置30中,由於邊限區域4被彎折,因此可將影像顯示裝置30之邊框部32的平面面積比率設定得較小。具體而言,影像顯示裝置30之邊框部32的平面面積比率例如為10%以下,宜為5%以下,較宜為3%以下,更宜為1%以下;且例如為0.01%以上。In this
影像顯示裝置30在彎折之狀態下容置(安裝)於圖未示之框體後,例如可作為平板電腦終端、智慧型手機等使用。The
然後,如圖8A所示,第1透明導電性片材1之邊限區域4中,因基材片材5與轉印層7之間無剝離層6,故可藉由基材片材5補強透明導電層8。其結果,可抑制邊限區域4之透明導電層8(繞線配線12)的損傷。Then, as shown in FIG. 8A, in the
另一方面,在顯示區域3中,可將基材片材5及剝離層6從轉印層7剝離,故可謀求顯示區域3之薄型化。而可謀求顯示區域3之薄型化。On the other hand, in the
並且,如圖3A~圖5A所示,於第2透明導電性片材2,將於長條方向上連續之邊限區域4及與其對應之顯示區域3,沿長條方向多量裁切成觸控感測器20或影像顯示裝置30之尺寸,即可簡便地製造出具有與觸控感測器20或影像顯示裝置30對應之尺寸(寬度方向長度)的多個第1透明導電性片材1。因此,可提升第1透明導電性片材1之製造效率。And, as shown in FIGS. 3A to 5A, in the second transparent
相對地,圖6A所示變形例之邊限區域4未於長條方向上連續。因此,從提升製造效率之觀點來看,可沿長條方向切割第1透明導電性片材1之一實施形態、以及圖3~圖5B所示之第1透明導電性片材1,較圖6A所示之變形例適宜。In contrast, the
又,如圖8B所示,該觸控感測器20中,間隔光學構件35及印刷配線板13之間隙19含括於顯示區域3中。Moreover, as shown in FIG. 8B, in the
若光學構件35及印刷配線板13之間隙19存在,則會降低與該間隙19對應之繞線配線12的強度。當剝離層6配置於顯示區域3及邊限區域4兩者時,在將該剝離層6從轉印層7剝離的步驟會對與間隙19對應之繞線配線12造成很大的負荷,而繞線配線12容易破損。尤其,當間隙19之尺寸較大時,更加容易產生繞線配線12之上述破損。If the
但,該觸控感測器20之邊限區域4中未配置剝離層6,所述邊限區域4包含有間隙19。因此,邊限區域4之基材片材5可補強與間隙19對應之繞線配線12(透明導電層8)。因此,即使間隙19之尺寸較大,仍可抑制間隙19之繞線配線12(透明導電層8)的損傷。However, the
如圖8C所示,又於該觸控感測器20中,於邊限區域4中可利用基材片材5補強回折部21。因此,可提升回折部21之強度。
其結果,如圖8D所示,即便邊限區域4的自由端部分25於回折部21對顯示區域3回折,仍可抑制回折部21之損傷。As shown in FIG. 8C, in the
又,當邊限區域4的自由端部分25對顯示區域3回折而往前述厚度方向投影時,可將印刷配線板13及邊限區域4的自由端部分25與顯示區域3重疊配置。因此,可縮小觸控感測器20之邊限區域4的平面面積。其結果,可製造具有狹窄化之邊限區域4的影像顯示裝置30。Moreover, when the
該影像顯示裝置30可具備已抑制透明導電層8損傷的觸控感測器20。The
影像顯示裝置30之製造方法中,如圖7A及圖8B所示,係於配置光學構件35及印刷配線板13之步驟中,在邊限區域4設置間隙19。因此,即使將顯示區域3之剝離層6從轉印層7剝離,仍可基於邊限區域4之基材片材5的補強,來抑制繞線配線12的損傷。In the manufacturing method of the
又,即使將影像顯示構件9配置於顯示區域3,仍可謀求對應顯示區域3的影像顯示裝置30之薄型化。Furthermore, even if the
並且,因將邊限區域4的自由端部分25對顯示區域3朝影像顯示構件9側回折,故投當往前述厚度方向投影時,可將印刷配線板13及於邊限區域4中配置有印刷配線板13之自由端部分25與顯示區域3重疊。可縮小影像顯示裝置30之邊限區域4的平面面積。其結果,可於該影像顯示裝置30中將邊限區域4(邊框部32)狹窄化。In addition, since the
<變形例> 以下各變形例中,針對與上述一實施形態相同之構件及步驟附加相同參照符號,並省略其詳細說明。另,各變形例除了特別記載之外,可發揮與一實施形態同等的作用效果。此外,可以適當組合一實施形態及其變形例。<Modifications> In each of the following modifications, the same reference numerals are attached to the same members and steps as in the above-mentioned embodiment, and detailed descriptions thereof are omitted. In addition, each modification example can exhibit the same effect as that of the first embodiment, except for the special description. In addition, an embodiment and its modification examples can be combined as appropriate.
在一實施形態中,光學構件35中將偏光板15包含在回折部21中而於基端部分24回折時,使偏光板15彎曲。In one embodiment, when the
在該變形例中,如圖9C所示,偏光板15未含括於回折部21中,在基端部分24回折時不會使偏光板15彎曲,而能僅使基材5、轉印層7及繞線配線12彎曲。In this modification, as shown in FIG. 9C, the
如圖9A所示,邊限區域4之第1黏著劑層14、偏光板15及第2黏著劑層16之一端面呈同平面。As shown in FIG. 9A, one end surface of the first
回折部21包含基材片材5、轉印層7及繞線配線12,惟不含光學構件35。宜為回折部21僅具備基材片材5、轉印層7及繞線配線12。The folded-
在一實施形態中,於光學構件35及印刷配線板13之間設置有間隙19,惟例如圖10A所示,亦可使該等密著(無間隙地接觸)。如圖10A所示,光學構件35及印刷配線板13之邊界29含括於邊限區域4中。In one embodiment, a
圖10A所示之觸控感測器20及圖10C所示之影像顯示裝置30中,光學構件35及印刷配線板13之邊界29含括於該邊限區域4中。因此,邊限區域4之基材片材5可補強與邊界29對應之繞線配線12。其結果,可抑制繞線配線12之損傷。In the
另,上述發明雖被提供作為本發明例示之實施形態,但其僅為單純例示,不作為限定性的解釋。該技術領域之熟知此項技藝之人士顯知的本發明變形例含括於後述範圍內。In addition, although the above-mentioned invention is provided as an exemplary embodiment of the present invention, it is only a mere exemplification and is not interpreted as a limitation. Modifications of the present invention that are obvious to those skilled in the art in this technical field are included in the scope of the following description.
產業上之可利用性 透明導電性片材係配備於影像顯示裝置中。Industrial availability The transparent conductive sheet is equipped in the image display device.
1:第1透明導電性片材 2:第2透明導電性片材 3:顯示區域 4:邊限區域 5:基材片材 6:剝離層 7:轉印層 8:透明導電層 9:影像顯示構件 11:透明電極 12:繞線配線 13:印刷配線板 14:第1黏著劑層 15:偏光板 16:第2黏著劑層 17:透明保護構件 18:隱蔽層 19:間隙 20:觸控感測器 21:回折部 24:基端部分 25:自由端部分 26:端子 27:切口 28:切割裝置 29:邊界 30:影像顯示裝置 31:感測器顯示部 32:邊框部 35:光學構件1: The first transparent conductive sheet 2: The second transparent conductive sheet 3: display area 4: marginal area 5: Substrate sheet 6: peeling layer 7: Transfer layer 8: Transparent conductive layer 9: Image display component 11: Transparent electrode 12: Winding wiring 13: Printed wiring board 14: The first adhesive layer 15: Polarizing plate 16: The second adhesive layer 17: Transparent protective member 18: hidden layer 19: gap 20: Touch sensor 21: Turn-back section 24: basal part 25: Free end part 26: Terminal 27: incision 28: Cutting device 29: Border 30: Video display device 31: Sensor display 32: Frame part 35: Optical components
圖1係本發明之透明導電性片材之一實施形態的剖面圖。 圖2中,圖2A~圖2B係圖1之透明導電性片材的俯視圖;圖2A係顯示區域一端緣之全部被邊限區域另一端緣之全部所共有的態樣,圖2B係顯示區域一端緣之一部分被邊限區域另一端緣之全部所共有的態樣。 圖3中,圖3A~圖3B係用以製得多個第1透明導電性片材之第2透明導電性片材的圖;圖3A係俯視圖,圖3B係沿圖3A之Y-Y線的剖面圖。 圖4係圖3A所示第2透明導電性片材之變形例(設有3個邊限區域及2個顯示區域之變形例)的剖面圖。 圖5中,圖5A~圖5B係圖3A所示第2透明導電性片材之變形例的俯視圖;圖5A係沿著顯示區域及邊限區域之邊界切割第1透明導電性片材之態樣,圖5B係僅沿寬度方向切割第1透明導電性片材之態樣。 圖6係圖3A所示第2透明導電性片材之變形例(邊限區域為長條方向上呈條狀之變形例)的剖面圖。 圖7中,圖7A~圖7B係使用圖2B所示之第1透明導電性片材製得的觸控感測器及影像顯示裝置之俯視圖;圖7A表示觸控感測器,圖7B表示影像顯示裝置。 圖8中,圖8A~圖8D係圖7B所示影像顯示裝置之製造步驟圖;圖8A係表示從透明導電層形成透明電極及繞線配線之步驟,圖8B係表示隔著間隙配置光學構件及印刷配線板並將顯示區域之剝離層從轉印層剝離之步驟,圖8C係表示配置影像顯示構件之步驟,圖8D係表示彎折顯示區域的自由端部分之步驟。 圖9中,圖9A~圖9C係圖8A~圖8D所示製造方法的變形例(回折部不包含光學構件之變形例)之步驟圖;圖9A對應圖8B,表示配置光學構件及印刷配線板並將顯示區域之剝離層從轉印層剝離之步驟;圖9B對應圖8C,表示配置影像顯示構件之步驟;圖9C對應圖8D,表示彎折顯示區域之自由端部分之步驟。 圖10中,圖10A~圖10C係圖8A~圖8D所示製造方法的變形例(印刷配線板及光學構件接觸之變形例)之步驟圖;圖10A對應圖8B,表示將光學構件及印刷配線板鄰接配置並將顯示區域之剝離層從轉印層剝離之步驟;圖10B對應圖8C,表示配置影像顯示構件之步驟;圖10C對應圖8D,表示彎折顯示區域之自由端部分的步驟。Fig. 1 is a cross-sectional view of an embodiment of the transparent conductive sheet of the present invention. In Fig. 2, Figs. 2A~2B are top views of the transparent conductive sheet of Fig. 1; Fig. 2A shows a state shared by all the edges of one end of the region by all the other edges of the marginal region, and Fig. 2B is the display region A state in which a part of one edge is shared by all the other edges of the marginal area. In Fig. 3, Figs. 3A to 3B are diagrams of the second transparent conductive sheet used to make a plurality of first transparent conductive sheets; Fig. 3A is a top view, and Fig. 3B is a cross-section taken along line YY in Fig. 3A picture. Fig. 4 is a cross-sectional view of a modification of the second transparent conductive sheet shown in Fig. 3A (a modification in which three margin regions and two display regions are provided). In Fig. 5, Figs. 5A to 5B are top views of a modification of the second transparent conductive sheet shown in Fig. 3A; Fig. 5A is a state in which the first transparent conductive sheet is cut along the boundary between the display area and the marginal area In this way, FIG. 5B is a state in which only the first transparent conductive sheet is cut in the width direction. Fig. 6 is a cross-sectional view of a modification of the second transparent conductive sheet shown in Fig. 3A (a modification in which the marginal area is striped in the longitudinal direction). In Fig. 7, Figs. 7A-7B are top views of a touch sensor and an image display device made using the first transparent conductive sheet shown in Fig. 2B; Fig. 7A shows the touch sensor, and Fig. 7B shows Image display device. In Fig. 8, Figs. 8A to 8D are diagrams of the manufacturing steps of the image display device shown in Fig. 7B; Fig. 8A shows the steps of forming transparent electrodes and winding wiring from the transparent conductive layer, and Fig. 8B shows the arrangement of optical members with a gap therebetween. 8C shows the step of arranging the image display member, and FIG. 8D shows the step of bending the free end portion of the display area. In Fig. 9, Figs. 9A to 9C are step diagrams of a modification of the manufacturing method shown in Figs. 8A to 8D (a modification in which the folded part does not include an optical member); Fig. 9A corresponds to Fig. 8B, showing the arrangement of optical components and printed wiring Fig. 9B corresponds to Fig. 8C, showing the step of disposing the image display member; Fig. 9C corresponds to Fig. 8D, showing the step of bending the free end portion of the display area. In FIG. 10, FIGS. 10A to 10C are step diagrams of a modification of the manufacturing method shown in FIGS. 8A to 8D (modification of printed wiring board and optical member contact); FIG. 10A corresponds to FIG. 8B, showing the optical member and printing The wiring board is arranged adjacently and the peeling layer of the display area is peeled from the transfer layer; Fig. 10B corresponds to Fig. 8C, showing the step of disposing the image display member; Fig. 10C corresponds to Fig. 8D, showing the step of bending the free end portion of the display area .
1:第1透明導電性片材 1: The first transparent conductive sheet
3:顯示區域 3: display area
4:邊限區域 4: marginal area
5:基材片材 5: Substrate sheet
6:剝離層 6: peeling layer
7:轉印層 7: Transfer layer
8:透明導電層 8: Transparent conductive layer
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-183782 | 2019-10-04 | ||
JP2019183782A JP2021060722A (en) | 2019-10-04 | 2019-10-04 | Transparent conductive sheet, touch sensor, image display device and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202129475A true TW202129475A (en) | 2021-08-01 |
Family
ID=75337261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109131327A TW202129475A (en) | 2019-10-04 | 2020-09-11 | Transparent conductive sheet, touch sensor, image display device, and manufacturing method therefor |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2021060722A (en) |
TW (1) | TW202129475A (en) |
WO (1) | WO2021065366A1 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11074025B2 (en) * | 2012-09-03 | 2021-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
KR102307432B1 (en) * | 2013-12-09 | 2021-09-30 | 삼성디스플레이 주식회사 | Display device |
JP2016188976A (en) * | 2015-03-30 | 2016-11-04 | 株式会社ジャパンディスプレイ | Display device |
KR20180081654A (en) * | 2017-01-06 | 2018-07-17 | 삼성디스플레이 주식회사 | Display Apparatus |
KR102329830B1 (en) * | 2017-01-10 | 2021-11-23 | 삼성디스플레이 주식회사 | Organic light emitting display device |
JP6368410B2 (en) * | 2017-08-24 | 2018-08-01 | リンテック株式会社 | Touch panel |
JP2019072991A (en) * | 2017-10-16 | 2019-05-16 | 日東電工株式会社 | Method for producing inorganic layer laminate |
-
2019
- 2019-10-04 JP JP2019183782A patent/JP2021060722A/en active Pending
-
2020
- 2020-09-08 WO PCT/JP2020/033854 patent/WO2021065366A1/en active Application Filing
- 2020-09-11 TW TW109131327A patent/TW202129475A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2021060722A (en) | 2021-04-15 |
WO2021065366A1 (en) | 2021-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102373330B1 (en) | Display device and driving method thereof | |
JP5244938B2 (en) | Input device and manufacturing method thereof | |
TWI421581B (en) | Input device and manufacturing method thereof | |
EP3144768B1 (en) | Flexible electronic device | |
TWI433283B (en) | Electrostatic capacitive touch screen | |
JP2020184079A (en) | Display device | |
US20160328057A1 (en) | Display integrated antenna | |
CN109213347B (en) | Flexible panel and manufacturing method thereof | |
US10712845B2 (en) | Touch substrate and method of producing the same, and touch panel and method of producing the same, and display device | |
EP3291066A1 (en) | Display device | |
TWI485599B (en) | Touch component and flat panel display | |
TW201337680A (en) | Input device | |
CN104461145A (en) | Touch screen and production method thereof | |
CN112433636A (en) | Touch display panel, touch display device and manufacturing method of touch display panel | |
EP1594042B1 (en) | Touch panel | |
WO2017183315A1 (en) | Capacitive sensor | |
US10539728B2 (en) | Display panel, polarizer, color film substrate and display apparatus for conducting electrostatic charges | |
TW202129475A (en) | Transparent conductive sheet, touch sensor, image display device, and manufacturing method therefor | |
CN103052932A (en) | Capacitative touch sensor and capacitative touch panel integerated into a window panel and including same | |
EP4020578A2 (en) | Display device and method of manufacturing the same | |
JP2010049463A (en) | Transparent touch panel | |
JP2004265392A (en) | Touch panel | |
KR102580014B1 (en) | Flexible display module and image display device including the same | |
TWI447476B (en) | Manufacturing method of touch panel | |
WO2022102346A1 (en) | Image display device and manufacturing method therefor |