TW202129288A - Catr system for automatic measuring aip - Google Patents

Abstract

A CATR (Compact Antenna Test Range) system for automatic measuring AiP (Antenna in Chip) comprises a wafer gripping jig, a CATR unit, a test load board, a socket, and a communication performance measurement device. The wafer gripping jig includes a robot arm and a wafer suction nozzle. The robot arm is controlled to move the position of the wafer nozzle. The CATR unit is used to measure the radiation characteristics of an AiP, and includes a reflecting mirror and a feeding antenna. The reflecting mirror is disposed on the wafer suction nozzle, and the feeding antenna is pointing to a concave surface of the reflecting mirror. The socket is used to set the AiP and is fixed to the test load board. The communication performance measuring device includes a first communication port and a second communication port. The first communication port is electrically connected to the feeding antenna through the test load board. The second communication port is electrically connected to the AiP sequentially through the test load board and the socket. In addition, when one of the first communication port and the second communication port is used as a transmitting port, the other is used as a receiving port.

Description

Automated measurement of reduced distance field system for packaged antenna

The invention relates to a measurement system, in particular to a short-range field system for automatic measurement of packaged antennas.

The characteristic evaluation method of known package antennas (Antenna in Chip, AiP) is usually to set the AiP on a package test carrier (socket, SKT), and then use the probe to directly contact the pins of AiP for non-radiation electrical testing. If you want to measure the various parameters of the over-the-air technology (Over-the-Air Technology, OTA), you must build the AiP on the device under test (such as a smart phone) before you can perform the OTA measurement.

The disadvantages of this known technology are: (1), there is no way to perform OTA measurement at the same time when AiP performs the aforementioned non-radiation electrical measurement; and (2), set the AiP in the device to be tested before proceeding to the whole machine OTA measurement, if the performance of the OTA test is not good and then the AiP design is modified again, it will delay the development timeline of AiP.

In order to solve the aforementioned problems of the known technology, the present invention proposes a system for automatically measuring the short-distance field of the packaged antenna.

The short-distance field system for automatic measurement of packaged antennas of the present invention includes a chip clamping fixture, a short-distance field antenna unit, a test carrier board (Load Board), a package test carrier (SKT), and a communication efficiency measurement device. equipment.

The chip clamping fixture includes a mechanical arm and a chip suction nozzle. The robotic arm is controlled to move the position of the wafer suction nozzle, and the wafer suction nozzle uses suction to suck and put down a package antenna.

The narrow field antenna unit is used to measure the radiation characteristics of the package antenna, and includes a reflector and a feed antenna, the reflector is arranged on the chip suction nozzle, and the feed antenna points to a concave surface of the reflector .

The packaged test carrier is used to set the packaged antenna, and is fixed on the test carrier.

The communication efficiency measurement equipment includes a first communication port and a second communication port. The first communication port is electrically connected to the feed antenna through the test carrier board, the second communication port is electrically connected to the package antenna through the test carrier board and the package test carrier in sequence, and the first communication port and the When one of the second communication ports is used as a transmitting port, the other is used as a receiving port.

Preferably, the feed antenna is arranged on a surface of the test carrier, and the package test carrier is also arranged on the surface of the test carrier.

Preferably, the packaging test carrier has a ring-shaped convex wall, and the feed antenna is arranged on the convex wall.

Preferably, the robotic arm includes a first arm and a second arm, the first arm being fixed and extending along a first direction, the first direction being perpendicular to the surface of the test carrier, and the second The arm rod is vertically connected with the first arm rod, and the second arm rod can move parallel to the first direction and rotate with the first arm rod as an axis.

Preferably, the wafer clamping jig further includes an air extraction device connected to the wafer suction nozzle, and the air extraction device is located on a convex side of the reflector.

Preferably, the feed antenna is a beamforming (beamforming) antenna.

Preferably, the feed antenna is a horn (horn) antenna.

Preferably, when the package antenna is placed on the package test carrier, the concave surface of the reflector reflects the non-uniform plane wave from the feed antenna into a uniform plane wave toward the package antenna.

The effect of the present invention is that the robot arm automatically places the package antenna (AiP) on the package test carrier (SKT) for conducting electrical conductivity measurement, and at the same time, the reflector mounted on the wafer nozzle is also The robot arm moves to the upper side of the packaged antenna, so the present invention can also perform OTA measurement on the packaged antenna, thereby solving the shortcomings of the prior art.

1 to 3, the first preferred embodiment of the short-distance field system for automated measurement of packaged antennas of the present invention includes a chip clamping fixture 1, a short-distance field antenna unit 2, a test carrier 3, a Packaging test carrier 4, and a communication efficiency energy measuring device 5.

The wafer clamping fixture 1 includes a robotic arm 11, a wafer suction nozzle 12, and an air suction device 13 connected to the wafer suction nozzle 12.

The robot arm 11 is controlled to move the position of the wafer suction nozzle 12, the wafer suction nozzle 12 sucks and puts down the package antenna 6 by suction, and the suction device 13 controls the suction force of the wafer suction nozzle 12.

The narrow field antenna unit 2 is used to measure the radiation characteristics of the package antenna 6 and includes a reflector 21 and a feed antenna 22.

The reflecting mirror 21 is arranged in a chamber 121 defined by the wafer suction nozzle 12. The reflecting mirror 21 is a concave mirror and includes a concave surface 211 for reflecting the incident wave and a convex surface 212 facing away from the concave surface 211. The suction device 13 is located outside the chamber 121 defined by the wafer suction nozzle 12, And it is located on the convex surface 212 side of the reflector 21, the purpose of which is to reduce the electromagnetic interference of the air extraction device 13 on the reflector 21.

The feed antenna 22 is arranged on a surface 31 of the test carrier 3, the feed antenna 22 is a horn (horn) antenna or a beamforming (beamforming), and the main beam of the feed antenna points to the mirror 21 Concave 211.

The packaged test carrier 4 is used for setting the packaged antenna 6 and is fixed on the surface 31 of the test carrier 3, and the packaged test carrier 4 includes a groove 41 for setting the packaged antenna 6.

The communication efficiency measurement device 5 includes a first communication port 51 and a second communication port 52. The first communication port 51 is electrically connected to the feed antenna 22 through the test carrier 3, the second communication port 52 is electrically connected to the package antenna 6 through the test carrier 3 and the package test carrier 4 in sequence, and, When one of the first communication port 51 and the second communication port 52 is used as a transmitting port, the other is used as a receiving port.

The operation diagram of this preferred embodiment is shown in FIG. 1 to FIG. 3 in sequence. 1 the robot arm 11 moves the chip suction nozzle 12 close to the package antenna 6. At this time, the suction device 13 draws out the air in the chamber 121 of the chip suction nozzle 12, and the package antenna 6 is sucked, and then the machine The arm 11 rotates 180 degrees around the axis Z as shown in FIG. 2, and then the robotic arm 11 extends to the top of the package test carrier 4 as shown in FIG. The packaged antenna 6 is placed in the groove 41 of the packaged test carrier 4. When the package antenna 6 is set on the package test carrier 4, the robot arm 11 is controlled to move the chip suction nozzle 12 to the measurement position shown in FIG. 3, and the reflector 21 will come from the feed antenna 22 at this time The non-uniform plane wave of φ is reflected into a uniform plane wave toward the package antenna 6. The communication efficiency measurement device 5 performs OTA measurement on the package antenna 6 through the narrow field antenna unit 2, and the communication efficiency measurement device 5 further Through the test carrier 3 and the package test carrier 4, non-radiative electrical measurements are performed on the package antenna 6, such as S11 parameters.

Fig. 4 is a schematic diagram of a second preferred embodiment of the present invention. The second preferred embodiment is similar to the first preferred embodiment, but the difference lies in that: the packaging test carrier 4 of the second preferred embodiment has a ring-shaped convex wall 42 and the feed antenna 22 is arranged on the Convex wall 42 on.

5 to 7 are schematic diagrams of the third preferred embodiment of the present invention. The third preferred embodiment is similar to the first preferred embodiment. The difference is that the robot arm 11 of the third preferred embodiment includes a first arm 111 and a second arm 112. The arm 111 is fixed and extends along the first direction Z, the first direction Z is perpendicular to the surface 31 of the test carrier 3, the second arm 112 is perpendicularly connected to the first arm 111, and the second arm The rod 112 can move parallel to the first direction Z and rotate around the first arm 111 as an axis.

The effect of the present invention is that the robot arm 11 automatically places the package antenna 6 on the package test carrier 4 for electrical conductivity measurement, and at the same time, the reflector 21 mounted on the chip suction nozzle 12 is also The robot arm 11 moves to the upper side of the package antenna 6 in linkage, so the present invention can also perform OTA measurement on the package antenna 6, thereby solving the shortcomings of the prior art. It is supplemented that the conductivity measurement is to use the communication efficiency measurement device 5 to sequentially measure the package antenna 6 through the test carrier 3 and the package test carrier 4 that are electrically connected, such as S11 parameters. .

1: Chip clamping fixture

11: Robotic arm

111: Primary boom

112: second boom

12: Wafer nozzle

121: Room

13: Exhaust device

2: Short-distance field antenna unit

21: Mirror

211: Concave

212: Convex

22: feed antenna

3: Test carrier board

31: Surface

4: Packaging and testing vehicle

41: Groove

42: convex wall

5: Communication efficiency measurement equipment

51: The first communication port

52: second communication port

6: Encapsulated antenna

Z: axis, first direction

FIG. 1 is a first schematic diagram of the first preferred embodiment of the system for automatically measuring the reduced distance field of a packaged antenna according to the present invention.

Figure 2 is a second schematic diagram of the first preferred embodiment.

Fig. 3 is a third schematic diagram of the first preferred embodiment.

Fig. 4 is a schematic diagram of the second preferred embodiment.

Fig. 5 is a first schematic diagram of the third preferred embodiment.

Fig. 6 is a second schematic diagram of the third preferred embodiment.

Fig. 7 is a third schematic diagram of the third preferred embodiment.

1: Chip clamping fixture

11: Robotic arm

12: Wafer nozzle

121: Room

13: Exhaust device

2: Short-distance field antenna unit

21: Mirror

22: feed antenna

3: Test carrier board

31: Surface

4: Packaging and testing vehicle

5: Communication efficiency measurement equipment

51: The first communication port

52: second communication port

6: Encapsulated antenna

Z: first direction

Claims (8)

A reduced-range field system for automatic measurement of packaged antennas, including: A wafer gripping jig, including a robotic arm and a wafer suction nozzle, the robotic arm is controlled to move the position of the wafer suction nozzle, and the chip suction nozzle uses suction to suck and place a package antenna; A narrow field antenna unit for measuring the radiation characteristics of the package antenna, and includes a reflector and a feed antenna, the reflector is arranged on the chip suction nozzle, and the feed antenna points to a side of the reflector Concave A test carrier board; A packaging test carrier for setting the package antenna and fixing it on the test carrier; and A communication efficiency measurement equipment includes a first communication port and a second communication port. The first communication port is electrically connected to the feed antenna through the test carrier, and the second communication port sequentially passes through the test carrier, The packaging test carrier is electrically connected to the packaging antenna, and when one of the first communication port and the second communication port is used as a transmitting port, the other is used as a receiving port. According to claim 1, the reduced-distance field system for automated measurement of packaged antennas, wherein the feed antenna is arranged on a surface of the test carrier, and the packaged test carrier is also arranged on the surface of the test carrier. The shrinking field system for automated measurement of packaged antennas according to claim 1, wherein the packaged test carrier has a ring-shaped convex wall, and the feed antenna is arranged on the convex wall. The retractable field system for automated measurement of packaged antennas according to claim 1, wherein the robotic arm includes a first arm and a second arm, the first arm being fixed and extending along the first direction, The first direction is perpendicular to the surface of the test carrier, the second arm is perpendicularly connected to the first arm, and the second arm can move parallel to the first direction, and the first arm is the axis Rotate. The retractable field system for automated measurement of packaged antennas according to claim 1, wherein the chip clamping fixture further includes an air extraction device connected to the chip suction nozzle, and the air extraction device is located on a convex surface of the reflector side. The system for automatically measuring the short-distance field of a packaged antenna according to claim 1, wherein the feed antenna is a beamforming (beamforming) antenna. The automatic measurement of the reduced-range field system of the packaged antenna according to claim 1, wherein the feed antenna is a horn antenna. The retracted field system for automated measurement of packaged antennas according to claim 1, wherein when the packaged antenna is placed on the packaged test carrier, the concave surface of the reflector reflects the non-uniform plane wave from the feed antenna into A uniform plane wave towards the packaged antenna.

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