TW202120629A - Moisture-proof and insulating coating material and application thereof - Google Patents

Abstract

The invention provides a moisture-proof and insulating coating material comprising a block copolymer or hydrogenated copolymer thereof (A), an adhesive resin (B), a solvent (C) and a polymer-modified silane compound (D). The invention also provides a moisture-proof and insulating film, a method of producing the same and an electrical device including the same. The moisture-proof and insulating film is low corrosive and capable of covering the electrical device, thereby diminishing damage of such electrical device for a long-term use in a stringent environment.

Description

Moisture-proof insulating coating and its application

The present invention relates to a moisture-proof insulating coating for electronic parts, electronic parts using the moisture-proof insulating coating for moisture-proof and insulating treatment, and a manufacturing method thereof, and in particular to provide a moisture-proof insulating coating for electronic parts with low corrosiveness.

With the advancement of science and technology, electronic components have gradually developed towards miniaturization and multi-functionality, and the design of circuits in electronic components has become more and more complicated. At this time, insulation and moisture resistance have become important keys that affect the service life of electronic components. The conventional technology achieves protection from moisture, dust, gas, and insulation by forming a coating layer outside the electronic component.

Japanese Patent Publication No. 2006-16531 discloses a moisture-proof insulating coating, which is made up of 10-40 parts by weight of thermoplastic resin, 1-20 parts by weight of hydrogenated terpene resin and 50-90 parts by weight of solvent. composition. The coating layer formed by the aforementioned coating has good moisture-proof and insulating properties. However, it will cause corrosion in harsh environments (such as high temperature or high humidity), which may cause damage to electronic components after long-term use. And can't be Accepted by the industry.

Therefore, how to improve the corrosion phenomenon of the coating layer formed by the moisture-proof insulating coating after long-term use while meeting the current industry requirements is the goal of hard research in the technical field of the present invention.

One aspect of the present invention is to provide a moisture-proof insulating coating. In some embodiments, the moisture-proof insulating coating may include block copolymer or its hydride resin (A), adhesive resin (B), solvent (C) and polymer modified silane compound (D), as follows Explain it in detail.

Block copolymer or its hydrogenated resin (A)

The block copolymer or its hydrogenated resin (A) contains a skeleton. In some embodiments, the aforementioned backbone includes at least two vinyl aromatic polymer blocks and at least one conjugated diene polymer block.

Generally speaking, the hydrogenation rate of the block copolymer or its hydrogenated resin (A) is in the range of 10% to 90%. Preferably, the hydrogenation rate of the block copolymer or its hydrogenated resin (A) is in the range of 15%-85%; more preferably, the hydrogenation rate of the block copolymer or its hydrogenated resin (A) ranges from 20% to 80%.

Preferably, the above-mentioned vinyl aromatic polymer block is obtained by polymerization of vinyl aromatic monomers. The vinyl aromatic monosystem is selected from one or more of the following compounds: (1) Unsubstituted or alkyl-substituted styrene compounds: such as styrene, 2-methylstyrene, 3-methyl base Styrene, 4-methylstyrene, 4-ethylstyrene, 4-tert-butylstyrene, 2,4-dimethylstyrene, α-methylstyrene, α-methyl-4- Methyl styrene, etc.; (2) Styrene compounds substituted by halogen: for example, 2-chlorostyrene, 4-chlorostyrene, etc.

Preferably, the above-mentioned conjugated diene-based polymer block is obtained by polymerization of conjugated diene-based monomers. This conjugated diene is a single system selected from one or more of the following compounds: 1,3-butadiene, 2-methyl-1,3-butadiene, 2-methyl-1,3- Isoprene, 2,3-dimethyl-1,3-butadiene, 1,3-pentadiene, 1,3-hexadiene.

In a specific example of the present invention, the method for synthesizing the block copolymer or its hydride resin (A) may include the following steps: (1) polymerization reaction is performed, which separates the vinyl aromatic monomer and the conjugate The diene monomer is dissolved in an organic solvent, and then a polymerization initiator is added to carry out anionic polymerization reaction, thereby forming a block copolymer precursor. After that, (2) a hydrogenation reaction is performed, in which the foregoing block copolymer precursor is subjected to a hydrogenation reaction in the presence of a hydrogenation catalyst to obtain a block copolymer or its hydrogenated resin (A). The (1) polymerization reaction and (2) hydrogenation reaction are described below.

(1) Polymerization reaction: When preparing the block copolymer or its hydride resin (A), preferably, the vinyl aromatic monomer and/or conjugated diene monomer can be diluted with an organic solvent to an appropriate level. The concentration is mixed and polymerized. In a specific embodiment of the present invention, the concentration after dilution may be, for example, 25% by weight.

Preferably, the above-mentioned organic solvent is selected from (1) aliphatic compounds: for example, n-butane, isobutane, n-pentane, n-hexane, n-heptane, n- Octane, etc.; (2) Alicyclic compounds: for example, cyclopentane, methylcyclopentane, cyclohexane, methylcyclohexane, cycloheptane, methylcycloheptane, etc.; or (3) the above random combination. In addition, aromatic compounds such as benzene, toluene, xylene, and ethylbenzene can also be used without affecting the progress of the polymerization reaction.

The above-mentioned polymerization initiator is not particularly limited, and conventionally used organic alkali metal compounds can usually be used. The aforementioned organic alkali metal compounds include, but are not limited to, aliphatic alkali metal compounds, aromatic alkali metal compounds, organic amino alkali metal compounds, and the like. Preferably, the polymerization initiator can be selected from C ₁ to C ₂₀ aliphatic lithium compound, C ₆ to C ₂₀ aromatic lithium compound, C ₁ to C ₂₀ aliphatic sodium compound, C ₆ to C ₂₀ aromatic A group consisting of sodium compounds, C ₁ to C ₂₀ aliphatic potassium compounds, C ₆ to C ₂₀ aromatic potassium compounds, or any combination of the foregoing.

The aforementioned C ₁ to C ₂₀ aliphatic lithium compound may include, but is not limited to, n-propyl lithium, n-butyl lithium, second butyl lithium, tertiary butyl lithium, hexamethylene dilithium, butadienyl dilithium , Prenyl dilithium. The aforementioned C ₆ to C ₂₀ aromatic lithium compound may include, but is not limited to, the reaction product of diisopropenylbenzene and sec-butyl lithium, or divinylbenzene, sec-butyl lithium and a small amount of 1,3-butanedi Reaction products of olefins, etc. Furthermore, the organic alkali metal compounds disclosed in the specification of U.S. Patent Publication No. 5,708,092, British Patent Publication No. 2,241,239, and U.S. Patent Publication No. 5,527,753 may also be used. Not only one kind of the above-mentioned polymerization initiator may be used, but two or more kinds may be mixed and used.

Preferably, the above-mentioned polymerization reaction temperature ranges from 10°C to 150°C; more preferably, the polymerization reaction temperature ranges from 40°C to 120°C. This aggregate reaction The reaction time is adjusted according to the polymerization reaction temperature. Preferably, the polymerization reaction time is within 10 hours; more preferably, the polymerization reaction time is within the range of 0.5 hours to 5 hours. Preferably, the aforementioned polymerization reaction environment is in an inert gas environment such as nitrogen. The polymerization reaction pressure range is not particularly limited, as long as the vinyl aromatic monomer, conjugated diene monomer, and solvent can be maintained in the liquid state within the pressure range required for the liquid state to be carried out within the above-mentioned polymerization temperature range. can. Furthermore, it must be noted that during the polymerization reaction, no impurities that can inert the polymerization initiator and the living polymer, such as water, oxygen, carbon dioxide, etc., are not mixed.

(2) Hydrogenation reaction: The hydrogenation catalyst is not particularly limited, and conventional users can be used, such as (1) a hydrogenation catalyst in which a metal is placed in a porous inorganic substance; (2) an organic acid salt or a transition metal salt , Ziegler type hydrogenation catalyst that reacts with reducing agent; (3) organometallic compound; (4) organometallic complex, etc.

The above-mentioned hydrogenation catalyst may include but is not limited to (1) a hydrogenation catalyst in which metals such as Ni, Pt, Pd, and Ru are supported on carbon, silica, alumina, diatomaceous earth, etc.; (2) the use of Ni, Co, Fe Organic acid salts such as, Cr, or transition metal salts such as acetone acetonate, Ziegler hydrogenation catalysts that react with reducing agents such as organoaluminum; (3) Organometallic compounds such as Ti, Ru, Rh, Zr; (4) Ti , Ru, Rh, Zr and other organometallic complexes. The above-mentioned hydrogenation catalyst may also be disclosed in Japanese Patent Publication No. 42-8704, Japanese Patent Publication No. 43-6636, Japanese Patent Publication No. 63-4841, Japanese Patent Publication No. 1-37970, Japanese Patent The hydrogenation catalyst in Japanese Patent Publication No. 1-53851 and Japanese Patent Publication No. 2-9041. on The hydrogenation catalyst is preferably an organometallic complex of titanocene, a reducing organometallic compound, or a combination of the above.

As the above-mentioned organometallic complex of titanocene, the complex disclosed in Japanese Patent Laid-Open No. 8-109219 can be used. The organometallic complexes of titanocene include complexes having at least one ligand, and the ligand has dicyclopentadiene titanium dichloride, monopentamethylcyclopentadiene titanium trichloride (Substituted) cyclopentadiene skeleton, indenyl skeleton or fluorenyl skeleton. The aforementioned reducing organometallic compounds include, but are not limited to, organolithium and other organo-alkali metal compounds, organomagnesium compounds, organoaluminum compounds, organoboron compounds, or organozinc compounds.

Preferably, the above-mentioned hydrogenation reaction temperature is in the range of 0°C to 200°C; more preferably, the hydrogenation reaction temperature is in the range of 30°C to 150°C. Preferably, the hydrogenation reaction pressure is in the range of 0.1 MPa to 15 MPa; more preferably, the hydrogenation reaction pressure is in the range of 0.2 MPa to 10 MPa; and even more preferably, the hydrogenation reaction pressure is in the range of 0.3 MPa to 7 MPa. Preferably, the hydrogenation reaction time ranges from 3 minutes to 10 hours; more preferably, the hydrogenation reaction time ranges from 10 minutes to 5 hours. The aforementioned hydrogenation reaction can also be implemented by a batch process, a continuous process, or any combination of the foregoing processes.

The hydrogenation rate of the above-mentioned hydrogenated conjugated diene polymer block can be controlled by the hydrogenation reaction temperature, the hydrogenation pressure, the hydrogenation reaction time, the amount of hydrogen used, and the type of the hydrogenation reaction, and there is no specific limitation.

Preferably, the number average molecular weight of the block copolymer or its hydrogenated resin (A) ranges from 10,000 to 200,000; more preferably, it is 15,000 to 150,000; particularly preferably, 18,000 to 100,000.

Adhesive resin (B)

In a preferred embodiment of the present invention, the adhesive resin (B) includes petroleum resin, rosin resin or terpene resin. These materials are easily soluble in solvents.

The petroleum resin is preferably an aliphatic petroleum resin, a petroleum resin, an aromatic hydrocarbon, an alicyclic petroleum resin, an aliphatic/aromatic copolymer petroleum resin, and a hydrogenated petroleum resin thereof.

The petroleum-based resin according to the present invention may be commercially available products, such as: "ARKON P" and "ARKON M" (the above are trade names) manufactured by Arakawa Chemical Industry Co., Ltd., "escorez" (trade names) manufactured by Tonen Petrochemical Co., Ltd., Mitsui "Hi-rez" (product name) manufactured by Chemical Corporation, "Quintone" (product name) manufactured by ZEON Corporation, "wingtak" (product name) manufactured by Goodyear, and "startak" (product name) manufactured by Dainippon Ink Chemical Industry Co., Ltd. ), "tohopetorosin" (trade name) manufactured by Tonen Petrochemical Co., Ltd., "W120" (trade name) manufactured by Yingqun Chemical Co., Ltd., "takace" (trade name) manufactured by Mitsui Chemicals Co., Ltd., and "FTR" manufactured by Mitsui Chemicals Co., Ltd. ( Commodity name) etc.

Rosin-based resins are preferably rosin and its derivatives and rosin-modified resins, and the source can be natural rosin, polymerized rosin, and the like. In a specific embodiment of the present invention, the rosin-based resin can be, for example, esterified rosin such as pentaerythritolester rosin and glycerine ester rosin, and hydrogen additives thereof. Commercial products can also be used, such as: "Resin", "Wood" made by Arakawa Chemical Industry Co., Ltd. "Rosin", "ester gum A", "ester gum H", "PENSEL A", "PENSEL C" (above are trade names), and "pentalin A", "fooraru AX" manufactured by Hercules Corp., "Fooraru 85", "fooraru 105" and "pentalin C" (above are the product names), etc.

The terpene resin is preferably polyterpene, terpene phenol resin and its hydrogenated resin. Commercial products can be used, such as "picolight S" and "picolight A" (the above are trade names) manufactured by Physical Chemical Hercules, and manufactured by Yasuhara Chemical "YS resin", "YS Polyster-T" and "Clearon" (above are product names), etc.

In a preferred embodiment of the present invention, commercial adhesive resin (B) is used, for example: KE311, KE604, P100, P125, P140, M100, M115, M135, A100, S100, 101, 102 (Produced by Arakawa Chemical Co., Ltd.), YSTO125 resin, TR105, CREARON P125, CREARON M115, CREARON K110, CREARON K4090, RESIN U130, RESIN T145, RESIN T160, YST0125 (produced by Anhara Chemical Co., Ltd.).

The softening point of the adhesive resin (B) is not particularly limited, and it is preferably from 100°C to 150°C as measured by the ring and ball method, more preferably from 110°C to 140°C.

Based on the above block copolymer or its hydrogenated resin (A) in an amount of 100 parts by weight, the adhesive resin (B) in an amount of 15 to 150 parts by weight, preferably 20 to 120 parts by weight , More preferably 25 parts by weight to 100 parts by weight.

Solvent (C)

The moisture-proof insulating coating according to the present invention contains a solvent (C). The choice of this solvent (C) must take into account the conditions for drying the moisture-proof insulating coating at room temperature. Preferably, the aforementioned solvent (C) is such as acetone or methyl Ketone solvents such as ethyl ketone; aromatic hydrocarbon solvents such as toluene and xylene; aliphatic solvents such as cyclohexane, methylcyclohexane, and ethylcyclohexane; such as ethyl acetate, butyl acetate or acetic acid Ester solvents of isopropyl ester; alcohol solvents such as ethanol or butanol; such as paraffin oil, naphthalene oil, mineral turpentine, naphtha or other petroleum-based solvents. On the other hand, the boiling point of the aforementioned solvent (C) is preferably 70°C to 140°C. When the boiling point of the solvent (C) is between 70°C and 140°C, when the moisture-proof insulating coating is applied to glass, semiconductor wafers, etc. In the case of electronic parts such as printed circuit boards, it is less likely to cause workability problems such as peeling of the insulating film and insufficient drying.

Based on the above block copolymer or its hydrogenated resin (A) in an amount of 100 parts by weight, the solvent (C) in an amount of 150 to 1500 parts by weight, preferably 180 to 1200 parts by weight, more Preferably, it is 200 parts by weight to 1000 parts by weight.

Silane compound modified by polymer (D)

Generally speaking, the polymer of the polymer-modified silane compound (D) of the present invention may include a polybutadiene structure. The aforementioned polybutadiene structure is selected from at least one group consisting of polybutadiene, polybutadiene containing anhydride groups, and styrene-butadiene copolymer.

The number average molecular weight of the above-mentioned polymer-modified silane compound (D) ranges from 5000 to 11000; preferably, from 5500 to 10000; Especially preferably, it is 6000 to 9500. In some specific examples, the aforementioned polymer-modified silane compound (D) can be a commercially available product, for example, the product name X-12-1267B (number average molecular weight 6000), X-12 manufactured by Shin-Etsu Chemical Co., Ltd. -1287A (number average molecular weight 6500), X-12-1281A (number average molecular weight 9000) or X-12-1281A-ES (number average molecular weight 9500).

Based on the above block copolymer or its hydrogenated resin (A) in an amount of 100 parts by weight, the polymer-modified silane compound (D) in an amount of 0.1 to 10 parts by weight, preferably 0.2 parts by weight To 9 parts by weight, more preferably 0.3 parts by weight to 8 parts by weight. When the above-mentioned moisture-proof insulating coating does not use polymer-modified silane compound (D), the moisture-proof insulating layer formed therefrom is poor in hydrophobicity and water resistance, and has the disadvantage of high corrosion when applied to electronic parts . When the used amount of the polymer-modified silane compound (D) is 0.1 parts by weight to 10 parts by weight, the problem of corrosivity can be further improved.

Additive (E)

The moisture-proof insulating coating of the present invention may optionally contain additives (E), which may be, for example, fillers, modifiers, defoamers, adhesives, inorganic pigments, organic pigments, organic dyes, and the like. Specific examples of the aforementioned filler are silica, magnesia, aluminum hydroxide, aluminum oxide, aluminum nitride, boron nitride or calcium carbonate, preferably fine powder. Specific examples of the aforementioned modifier are: manganese naphthenate or its analogues, such as the salt metal of manganese octenate. Specific examples of the aforementioned defoaming agent are silicone oil, fluorine oil or other known polycarboxylic acid polymers. The aforementioned adhesives can use common conventional products, which will not be repeated here. The aforementioned organic pigments contain black Color pigments. Black pigments suitable for use in the present invention are preferably black pigments having heat resistance, light resistance and solvent resistance. Specific examples of the aforementioned black pigments are black organic pigments such as perylene black, lactam black, cyanine black, aniline black, etc.; from red and blue , Green, purple, yellow, cyanine (cyanine), magenta (magenta) and other pigments, select two or more than two kinds of pigments to mix, make it into a nearly black mixed color organic pigment; carbon black (carbon black) , Chromium oxide, iron oxide, titanium black (titanium black), graphite and other light-shielding materials, wherein the aforementioned carbon black can include but is not limited to CIpigment black 7, etc., and specific examples of the aforementioned carbon black are commercially available products manufactured by Mitsubishi Chemical (Trade names MA100, MA230, MA8, #970, #1000, #2350, #2650). The aforementioned black pigments can generally be used singly or in a mixture of multiple types.

Manufacturing method of moisture-proof insulating coating

In a specific embodiment, the method for manufacturing the moisture-proof insulating coating of the present invention may include modifying the block copolymer or its hydride resin (A), adhesive resin (B), and polymer modified silane compound (D ) And the like are uniformly dispersed in the solvent (C), and stirred in a stirrer for 3 to 24 hours until the solid content is dissolved and mixed to form a liquid moisture-proof insulating coating. Generally speaking, the viscosity of the moisture-proof insulating coating is well-known to those with ordinary knowledge in the technical field of the present invention, and can be adjusted according to the required coating properties, volatility and other properties. When the viscosity of the moisture-proof insulating coating is between 0.1Pa‧S and 30Pa‧S, the moisture-proof insulating coating has better coating properties. The viscosity of the aforementioned moisture-proof insulating coating ranges from 0.1Pa‧S to 20Pa‧S is preferable, and 0.1Pa‧S to 10Pa‧S is more preferable.

Moisture-proof insulating film, electronic parts containing the same, and manufacturing method thereof

The present invention also provides a method for manufacturing a moisture-proof insulating film, which includes coating a carrier with the aforementioned moisture-proof insulating paint. Preferably, the aforementioned carrier is an electronic component.

The present invention also provides a moisture-proof insulating film, which is produced according to the aforementioned method for manufacturing the moisture-proof insulating film.

The present invention further provides an electronic component, which includes the aforementioned moisture-proof insulating film.

The present invention also provides a method for manufacturing an electronic component. The electronic component includes a moisture-proof insulating film, and the moisture-proof insulating film is provided by the method including the foregoing.

In the above embodiments, the electronic parts suitable for the moisture-proof insulating coating for moisture-proof insulation treatment may include, but are not limited to, circuit boards equipped with microprocessors, transistors, capacitors, resistors, relays, transformers, etc., and this circuit board It is equipped with lead wire, wire harness and other configurations that require moisture-proof insulation treatment.

In some embodiments, the aforementioned method for treating electronic parts with moisture-proof insulating coatings can use commonly known coating methods, such as dipping, brush coating, spray coating, and mechanical dispensing (dispenser) coating. Bufa and so on. In a preferred embodiment of the present invention, after the above-mentioned electronic component is coated, the coating film is dried at a temperature of 20°C to 80°C to obtain the electronic component of the present invention.

Hereinafter, several preparation examples, examples and comparative examples are used to illustrate the moisture-proof insulating coating of the present invention and its application.

Preparation of block copolymer resin (A)

Preparation of hydrogenation catalyst

In the following synthesis example, the hydrogenation catalyst is prepared by adding 1 liter of dried and purified cyclohexane into a reaction vessel filled with nitrogen, and adding 100 millimoles of bis(η5-cyclopentadiene) Titanium chloride, while fully stirring, add a n-hexane solution containing 200 millimoles of trimethylaluminum to obtain a reaction liquid. The reaction solution is allowed to react at room temperature for about three days, and the product obtained is the hydrogenation catalyst.

Synthesis Example A-1

Under a nitrogen atmosphere, a cyclohexane solution containing 10 parts by weight of styrene, a cyclohexane solution containing 1.3 parts by weight of n-butyllithium, and 0.05 parts by weight of tetramethylethylenediamine [no Randomizer] was placed in an autoclave with a stirrer, and polymerization was carried out at a temperature of 70°C for 20 minutes; then, within 50 minutes, 20 parts by weight of styrene and 50 parts by weight of 1, Add the cyclohexane solution of 3-butadiene (1,3-butadiene) to the aforementioned autoclave, and The polymerization reaction was carried out at 70°C for 5 minutes. Then, a cyclohexane solution containing 10 parts by weight of 1,3-butadiene was added, and the polymerization reaction was carried out at 70°C for 5 minutes. Next, add a cyclohexane solution containing 10 parts by weight of styrene, and carry out the polymerization reaction at 70°C for 25 minutes. After the reaction, add the aforementioned hydrogenation catalyst to the reaction solution containing the precursor of the block copolymer And hydrogen, relative to 100 parts by weight of the block copolymer precursor, the content of the aforementioned hydrogenation catalyst is 100 ppm, the amount of hydrogen used is 1.1 parts by weight, the hydrogenation operating pressure is 0.7 MPa, the hydrogenation reaction time is 1 hour, and the hydrogenation reaction temperature is The hydrogenation reaction is carried out at 65°C. After that, methanol and 0.3 parts by weight of octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate (relative to 100 parts by weight of block copolymer precursor) were added After solvent removal treatment, a block copolymer resin (A-1) can be obtained. The number average molecular weight of the aforementioned block copolymer resin (A-1) is 66,000, and the hydrogenation rate is 50%.

Synthesis examples A-2 to A-9

Synthesis examples A-2 to A-9 are based on the same steps as Synthesis Example A-1 to prepare block copolymers or their hydride resins, except that the vinyl aromatic monomers and conjugated diene monomers are changed. Hydrogen, hydrogen usage and hydrogenation reaction conditions are shown in Table 1.

Preparation of moisture-proof insulating coating

Example 1

Take 100 parts by weight of the block copolymer or its hydrogenated resin (A-1) obtained in the aforementioned synthesis example, 15 parts by weight of the adhesive resin (B-1), 0.08 Parts by weight of polymer-modified silane compound (D-1), add 200 parts by weight of solvent (C-1), stir in a blender for 16 hours until the solid content is dissolved and mixed, then it can be prepared to obtain moisture-proof insulation The coatings were measured according to the following evaluation methods, and the results are shown in Table 2.

Examples 2 to 15 and Comparative Examples 1 to 6

The manufacturing method is the same as in Example 1, except that the block copolymer or its hydrogenated resin (A), adhesive resin (B), solvent (C), polymer modified silane compound (D), and others are changed The types and amounts of silane compounds (D') and additives (E), their formulations and evaluation results are shown in Table 2 and Table 3, respectively.

Evaluation method

Corrosive

On the patterned electrode formed on the glass substrate, a comb-shaped ITO circuit with a line/space of 40μm/10μm was formed, and a 100μm thick composition of the embodiment or the comparative example was coated on the electrode, and it was allowed to stand still at room temperature. Let it stand for 10 minutes and then dry at 70°C for 2 hours.

Next, the above-mentioned glass substrate was subjected to a temperature and humidity stability test (manufactured by IMV, model MIGRATION TESTER MODEL MIG-8600) by applying a bias voltage of 10V under the conditions of 60°C and a humidity of 90% RH. After a 500-hour test, Observe whether the ITO circuit has a burr shape, and evaluate the corrosiveness according to the following criteria:

◎: No burrs are produced at all

○: Only slight and inconspicuous burrs

△: There are many but not obvious burrs

×: There is a large amount of sharp burrs.

As shown in the results of Table 2, when the moisture-proof insulating coating contains a polymer-modified silane compound (D), the moisture-proof insulating film formed thereby can have low corrosion. In some embodiments, when the moisture-proof insulating coating limits the usage of the silane compound (D) modified by the polymer, the corrosion of the moisture-proof insulating film can be further reduced. On the other hand, as shown in Table 3, if the moisture-proof insulating coating does not use a polymer-modified silane compound (D), the moisture-proof insulating film formed therefrom has poor corrosion resistance.

Although the present invention has been disclosed in several embodiments as above, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field to which the present invention belongs can make various modifications without departing from the spirit and scope of the present invention. Modifications and modifications, therefore, the scope of protection of the present invention shall be subject to those defined by the attached patent application scope.

Table 1

Table 2

table 3

Claims (9)

A kind of moisture-proof insulating coating, including: A block copolymer or its hydrogenated resin (A), wherein the block copolymer or its hydrogenated resin (A) comprises a skeleton, and the skeleton comprises at least two vinyl aromatic polymer blocks and at least one Conjugated diene polymer block; An adhesive resin (B); A solvent (C); and A polymer modified silane compound (D). According to the first item of the scope of patent application, the moisture-proof insulating coating, wherein the polymer contains a polybutadiene structure. The moisture-proof insulating coating according to the second item of the scope of patent application, wherein the polybutadiene structure is selected from the copolymerization of polybutadiene, polybutadiene containing acid anhydride groups, and styrene-butadiene At least one member of an ethnic group consisting of things. According to the first item of the scope of patent application, the moisture-proof insulating coating, wherein the adhesive resin (B) is at least one selected from the group consisting of petroleum-based resins, rosin-based resins and terpene-based resins. The moisture-proof insulating coating described in item 1 of the scope of patent application, wherein the usage amount based on the block copolymer or its hydrogenated resin (A) is 100 parts by weight, and the usage amount of the adhesive resin (B) is 15 Parts by weight to 150 parts by weight, the usage amount of the solvent (C) is 150 parts by weight to 1500 parts by weight, and the usage amount of the polymer-modified silane compound (D) is 0.1 parts by weight to 10 parts by weight. A method for manufacturing a moisture-proof insulating film includes coating an electronic component with the moisture-proof insulating paint described in any one of items 1 to 5 in the scope of the patent application. A moisture-proof insulating film is produced by the method described in item 6 of the scope of the patent application. An electronic component comprising the moisture-proof insulating film as described in item 7 of the scope of patent application. A method for manufacturing an electronic component, which includes coating an electronic component with the moisture-proof insulating coating described in any one of items 1 to 5 of the scope of the patent application to form the electronic component, wherein the electronic component includes a moisture-proof Insulating film.