TW202117762A - 電容式匿蹤複合結構 - Google Patents

電容式匿蹤複合結構 Download PDF

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TW202117762A
TW202117762A TW108137535A TW108137535A TW202117762A TW 202117762 A TW202117762 A TW 202117762A TW 108137535 A TW108137535 A TW 108137535A TW 108137535 A TW108137535 A TW 108137535A TW 202117762 A TW202117762 A TW 202117762A
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electromagnetic wave
layer
capacitive
wave absorption
composite structure
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TWI716155B (zh
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傅浩瑋
蔡欣蓉
徐文光
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國立清華大學
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Priority to US16/842,772 priority patent/US20210119343A1/en
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Abstract

一種電容式匿蹤複合結構,包括沿厚度方向堆疊的數層結構層,且所述結構層的層數在3層以上,其中每一層結構層在平面方向上是由互相交替的多個電磁波吸收圖案與多個絕緣圖案組成。每一層結構層中的電磁波吸收圖案對準於其鄰接的結構層的絕緣圖案,且每一層結構層中的絕緣圖案對準於其鄰接的結構層的電磁波吸收圖案。

Description

電容式匿蹤複合結構
本發明是有關於一種匿蹤技術(Stealth technology),且特別是有關於一種電容式匿蹤複合結構。
所謂的匿蹤技術主要是藉由兩種方法來減少從目標物反射至雷達的雷達截面積(radar cross section,RCS)。第一種常見的方法為透過幾何的形狀改變,使雷達發射之電磁波改變反射至雷達接收站無法攔截到訊號的方向;另一種方法則是藉由在戰機或是戰艦之外殼加上具有吸收電磁波特性的材料,藉由幾何形狀改變達到匿蹤為較容易之作法。
然而,前者需改變飛行器的外型,將難以配合空氣動力學而影響飛行器的速度;後者在材料之邊緣、材料間交接處會產生圓錐狀之邊緣散射,降低吸收效果。
因為具有吸收電磁波特性的材料本身的本質阻抗與空氣的本質阻抗不匹配,所以雷達發射之電磁波往往還沒有進入材料被吸收,就已經被反射而不利於匿蹤。
本發明提供一種電容式匿蹤複合結構,具有重量輕、厚度薄且提高電磁波吸收效果的功效。
本發明的電容式匿蹤複合結構包括沿厚度方向堆疊的數層結構層,且所述結構層的層數在3層以上,其中每一層結構層在平面方向上是由互相交替的多個電磁波吸收圖案與多個絕緣圖案組成。每一層結構層中的電磁波吸收圖案對準於其鄰接的結構層的絕緣圖案,且每一層結構層中的絕緣圖案對準於其鄰接的結構層的電磁波吸收圖案。
在本發明的一實施例中,上述電磁波吸收圖案的材料選自奈米碳管、碳黑、碳基鐵、鐵氧體、氮化鐵、羰基鐵、多晶鐵、具有鐵鈷鎳之磁性粉末、碳纖維、碳化矽、活性碳中的至少一種。
在本發明的一實施例中,上述電磁波吸收圖案的材料還可包括樹脂。
在本發明的一實施例中,上述絕緣圖案的材料包括環氧樹脂、酚樹脂、三聚氰胺樹脂、尿素樹脂、聚酯樹脂、胺基甲酸乙酯樹脂、丙烯酸樹脂等熱固性樹脂;或者聚乙烯、聚丙烯、乙烯一醋酸乙烯酯共聚物、聚氯乙烯、聚二氯亞乙烯、聚苯乙烯、壓克力、聚乙烯醇、聚對苯二甲酸二乙酯等熱塑性樹脂。
在本發明的一實施例中,在上述平面方向上的電磁波吸收圖案之間的間隔在3公分~10公分之間。
在本發明的一實施例中,每一層結構層的厚度可在3mm以下。
在本發明的一實施例中,上述電容式匿蹤複合結構還可包括補強材,設置於每一層結構層中的電磁波吸收圖案內與絕緣圖案內。
在本發明的一實施例中,上述補強材例如玻璃纖維、碳纖維、芳香聚醯胺纖維等,或以紙、木材、石棉、玄武岩纖維等天然材料作為纖維。
在本發明的一實施例中,上述電容式匿蹤複合結構的屏蔽波段例如8GHz~12GHz。
在本發明的一實施例中,上述電容式匿蹤複合結構的屏蔽波段係隨電磁波吸收圖案的間隔可調變的。
基於上述,本發明利用在厚度方向上與平面方向上都採用交替配置的電磁波吸收圖案與絕緣圖案,達到提高電磁波吸收率的效果。
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。
下文列舉一些實施例並配合所附圖式來進行詳細地說明,但所提供的實施例並非用以限制本發明所涵蓋的範圍。此外,圖式僅以說明為目的,並未依照原尺寸作圖。為了方便理解,下述說明中相同的元件將以相同之符號標示來說明。
圖1是依照本發明的一實施例的一種電容式匿蹤複合結構的示意圖。
請參照圖1,本實施例的電容式匿蹤複合結構100包括沿厚度方向d1堆疊的數層結構層102,且結構層102的層數在3層以上,且每一層結構層102的厚度t例如在3mm以下;較佳地,單一層結構層120的厚度t越薄能獲得更佳的電磁波吸收效果。而且,每一層結構層102在平面方向d2上是由互相交替的多個電磁波吸收圖案104與多個絕緣圖案106組成。每一層結構層102中的電磁波吸收圖案104對準於其鄰接的結構層102的絕緣圖案106,且每一層結構層102中的絕緣圖案106對準於其鄰接的結構層102的電磁波吸收圖案104。在一實施例中,電磁波吸收圖案104的材料包括可產生介電損耗的材料與產生磁損耗的材料,例如奈米碳管(carbon nanotubes,CNTs)、碳黑(carbon black,CB)、碳基鐵(carbonyl iron,CI)、鐵氧體、氮化鐵、羰基鐵、多晶鐵、具有鐵鈷鎳之磁性粉末、碳纖維、碳化矽、活性碳等;絕緣圖案106的材料可為熱固性樹脂或熱塑性樹脂,例如環氧樹脂、酚樹脂、三聚氰胺樹脂、尿素樹脂、聚酯樹脂、胺基甲酸乙酯樹脂、丙烯酸樹脂等熱固性樹脂;或者聚乙烯、聚丙烯、乙烯-醋酸乙烯酯共聚物、聚氯乙烯、聚二氯亞乙烯、聚苯乙烯、壓克力、聚乙烯醇、聚對苯二甲酸二乙酯等熱塑性樹脂。由於絕緣圖案106的本質阻抗比電磁波吸收圖案104的本質阻抗還要接近空氣的本質阻抗,所以當電磁波接觸到電容式匿蹤複合結構100,極大部分會進入其中,並被電磁波吸收圖案104吸收,而提升電磁波吸收效果。在一實施例中,在平面方向上的電磁波吸收圖案104之間的間隔s例如在3公分~10公分之間,但本發明並不限於此;較佳地,間距s越窄能獲得更佳的電磁波吸收效果。另外,經實驗證明,電容式匿蹤複合結構100的屏蔽波段可在X波段(8GHz ~ 12GHz),且電容式匿蹤複合結構的屏蔽波段係隨電磁波吸收圖案的間隔可調變的,因此間隔s可在3公分以下或10公分以上。
圖2是依照本發明的另一實施例的一種電容式匿蹤複合結構的示意圖,其中沿用圖1的元件符號與部分內容,並採用相同的元件符號來表示相同或近似的元件,且省略了相同技術內容的說明。關於省略部分的說明可參考前一實施例的內容,下文不再重複贅述。
在圖2中,電容式匿蹤複合結構200還可包括補強材202,設置於每一層結構層102中的電磁波吸收圖案104內與絕緣圖案106內,其中補強材202例如玻璃纖維、碳纖維、芳香聚醯胺纖維等,或以紙、木材、石棉、玄武岩纖維等天然材料作為纖維的紙纖維、木材纖維、石棉纖維或玄武岩纖維。舉例來說,補強材202若是玻璃纖維布,則電磁波吸收圖案104的材料除了上述可產生介電損耗的材料與產生磁損耗的材料還可包括樹脂,作為黏結劑,與絕緣圖案106所用的樹脂可以是相同的或者不同的。
以下將列舉一種電容式匿蹤複合結構的製作方法,但本發明並不限於此。
圖3是依照本發明的再一實施例的一種電容式匿蹤複合結構的製作流程圖。
請參照圖3,在步驟300中,製作單層結構層,且本實施例是以含有補強材的結構層為例。舉例來說,可先進行步驟302,混合電磁波吸收材料與樹脂,以得到均勻混合的混合物;然後進行步驟304,將上述混合物與絕緣材料沿水平方向交替塗佈於補強材上,以得到在平面方向上互相交替的多個電磁波吸收圖案與多個絕緣圖案。關於補強材、電磁波吸收材料(即電磁波吸收圖案的材料)、絕緣材料(即絕緣圖案的材料))與樹脂的選用,可參照上述實施例的內容,不再贅述。
接著,在步驟310中,重覆N次上述步驟,以得到N+1層的結構層,其中N為正整數。
然後,在步驟320中,重疊N+1層結構層,且每一層結構層中的電磁波吸收圖案需對準於其鄰接結構層的絕緣圖案,每一層結構層中的絕緣圖案也需對準於其鄰接結構層的電磁波吸收圖案。
之後,在步驟330中,進行熱壓。所述熱壓的溫度範圍與時間,可依結構層所含材料的種類、結構層的厚度或者結構層的面積大小做調整。
此外,若是不含補強材的結構層,還可採用其他方式製作,例如在金屬基材(如飛行器機殼)表面逐層塗佈,也可製作出如圖1的電容式匿蹤複合結構100。
為驗證本發明的效果,列舉以下實驗進行說明,但本發明並不限於下列實驗。
〈電磁波吸收分析〉
利用美國海軍研究辦公室(United States Naval Research Laboratory,NRL)的Arch Method進行分析,如圖4所示。
在圖4中,待測物400置於鋁板402上,並使用可移動的發射端404以及接收端406(虛線代表移動至不同位置的404、406),對待測物400表面發射不同頻率的電磁波408,並接收從待測物400反射回來的電磁波408。根據發射端404以及接收端406的電磁波能量比較,可得到反射損耗(reflection loss)。
〈實驗例1〉
按照圖3的步驟製作電容式匿蹤複合結構,其中補強材是玻璃纖維布、絕緣材料是環氧樹脂、電磁波吸收材料包含2 phr的奈米碳管、200 phr的碳基鐵以及環氧樹脂,其中phr是指對每100份(以質量計)樹脂添加的份數。
首先,利用三軸輥(Triaxial roller)攪拌上述電磁波吸收材料1小時並抽真空,再將混合後的電磁波吸收材料以及上述絕緣材料以澆注方式沿水平方向交替塗佈於玻璃纖維布上,其中電磁波吸收圖案的寬度約3至10公分、電磁波吸收圖案之間的間隔約3至10公分,且上述電磁波吸收圖案的寬度實質上等於電磁波吸收圖案之間的間隔。
重複上述步驟,以製作出3層結構層,再將這3層結構層交替重疊,以120℃熱壓3小時,得到實驗例1的電容式匿蹤複合結構。然後進行電磁波吸收分析,結果分別顯示於圖5和圖6。
〈比較例1〉
如實驗例1的製備方式,但並無絕緣圖案,而是在玻璃纖維布上直接塗佈整面的電磁波吸收材料。然後進行電磁波吸收分析,結果顯示於圖5。
〈比較例2〉
如比較例1的製備方式,但增加一層結構層,而形成由4層結構層重疊熱壓得到的複合結構。然後進行電磁波吸收分析,結果顯示於圖5。
從圖5可得到,實驗例1的電容式匿蹤複合結構在9.49GHz~12.38GHz的波段,具有明顯的反射損耗,足以證明本發明的電容式匿蹤複合結構在X波段(X band)的電磁波吸收效果優於比較例1~2。
〈實驗例2〉
如實驗例1的製備方式,但電磁波吸收圖案之間的間隔改為10公分。然後進行電磁波吸收分析,結果顯示於圖6。
〈實驗例3〉
如實驗例1的製備方式,但電磁波吸收圖案之間的間隔改為3公分。然後進行電磁波吸收分析,結果顯示於圖6。
從圖5可得到,隨著電磁波吸收圖案的間隔變化,電容式匿蹤複合結構具有電磁波吸收效果的波段也會改變,因此可根據應用面調整電容式匿蹤複合結構中的電磁波吸收圖案間隔。
舉例來說,若是以反射損耗-10dB為基準,實驗例1的屏蔽波段在8.49GHz~12.38GHz,所以可應用於雷達、衛星通信、測速槍的電磁波屏蔽;實驗例2的屏蔽波段在13.4GHz~15.3GHz,所以可應用於衛星通信、測速照相的電磁波屏蔽;實驗例3的屏蔽波段在5.2GHz~9.25GHz,所以可應用於電子收費系統(electronic toll collection,ETC)、Wi-Fi、衛星通信等的電磁波屏蔽。
綜上所述,本發明的電容式匿蹤複合結構是藉由在厚度方向與水平方向均由類似電容的電磁吸收圖案與絕緣圖案交錯的方式配置,來減少阻抗不匹配、加強破壞性干涉、控制最大反射損耗之位置、增加電磁波在電磁波吸收材料中被消散的能力,得以應用在各種頻率的電磁波屏蔽,如軍事常用的X-band範圍。而且,藉由補強材的添加,能直接做成具有力學強度的複合結構,沒有剥落問題。
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。
100、200:電容式匿蹤複合結構 102:結構層 104:電磁波吸收圖案 106:絕緣圖案 202:補強材 300、302、304、310、320、330:步驟 400:待測物 402:鋁板 404:發射端 406:接收端 408:電磁波 d1:厚度方向 d2:平面方向 s:間隔 t:厚度
圖1是依照本發明的一實施例的一種電容式匿蹤複合結構的示意圖。 圖2是依照本發明的另一實施例的一種電容式匿蹤複合結構的示意圖。 圖3是依照本發明的另一實施例的一種電容式匿蹤複合結構的製作流程圖。 圖4是進行電磁波吸收分析的設備示意圖。 圖5是實驗例1與比較例1~2的頻率對反射損耗的關係曲線圖。 圖6是實驗例1~3的頻率對反射損耗的關係曲線圖。
100:電容式匿蹤複合結構
102:結構層
104:電磁波吸收圖案
106:絕緣圖案
d1:厚度方向
d2:平面方向
s:間隔
t:厚度

Claims (10)

  1. 一種電容式匿蹤複合結構,包括: 沿厚度方向堆疊的多數層結構層,且所述多數層結構層的層數在3層以上,其中 每一層所述結構層在平面方向上是由互相交替的多數個電磁波吸收圖案與多數個絕緣圖案組成,且 每一層所述結構層中的所述電磁波吸收圖案對準於其鄰接的所述結構層的所述絕緣圖案,且每一層所述結構層中的所述絕緣圖案對準於其鄰接的所述結構層的所述電磁波吸收圖案。
  2. 如申請專利範圍第1項所述的電容式匿蹤複合結構,其中所述電磁波吸收圖案的材料選自奈米碳管、碳黑、碳基鐵、鐵氧體、氮化鐵、羰基鐵、多晶鐵、具有鐵鈷鎳之磁性粉末、碳纖維、碳化矽、活性碳中的至少一種。
  3. 如申請專利範圍第2項所述的電容式匿蹤複合結構,其中所述電磁波吸收圖案的材料更包括樹脂。
  4. 如申請專利範圍第1項所述的電容式匿蹤複合結構,其中所述絕緣圖案的材料包括環氧樹脂、酚樹脂、三聚氰胺樹脂、尿素樹脂、聚酯樹脂、胺基甲酸乙酯樹脂、丙烯酸樹脂、聚乙烯、聚丙烯、乙烯一醋酸乙烯酯共聚物、聚氯乙烯、聚二氯亞乙烯、聚苯乙烯、壓克力、聚乙烯醇或聚對苯二甲酸二乙酯。
  5. 如申請專利範圍第1項所述的電容式匿蹤複合結構,其中在所述平面方向上的所述多數個電磁波吸收圖案的間隔在3公分~10公分之間。
  6. 如申請專利範圍第1項所述的電容式匿蹤複合結構,其中每一層所述結構層的厚度在3mm以下。
  7. 如申請專利範圍第1項所述的電容式匿蹤複合結構,更包括補強材,設置於每一層所述結構層中的所述多數個電磁波吸收圖案內與所述多數個絕緣圖案內。
  8. 如申請專利範圍第7項所述的電容式匿蹤複合結構,其中所述補強材包括玻璃纖維、碳纖維、芳香聚醯胺纖維、紙纖維、木材纖維、石棉纖維或玄武岩纖維。
  9. 如申請專利範圍第1項所述的電容式匿蹤複合結構,其中所述電容式匿蹤複合結構的屏蔽波段為8GHz~12GHz。
  10. 如申請專利範圍第1項所述的電容式匿蹤複合結構,其中所述電容式匿蹤複合結構的屏蔽波段是隨所述多數個電磁波吸收圖案的間隔可調變的。
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