TW202115132A - Polymerizable composition, method for manufacturing coated structure, coated structure and coating material - Google Patents

Polymerizable composition, method for manufacturing coated structure, coated structure and coating material Download PDF

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TW202115132A
TW202115132A TW109130258A TW109130258A TW202115132A TW 202115132 A TW202115132 A TW 202115132A TW 109130258 A TW109130258 A TW 109130258A TW 109130258 A TW109130258 A TW 109130258A TW 202115132 A TW202115132 A TW 202115132A
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長坂一輝
齋藤智美
前田洋介
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日商艾迪科股份有限公司
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    • C08F2/00Processes of polymerisation
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    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/52Amides or imides
    • C08F220/54Amides, e.g. N,N-dimethylacrylamide or N-isopropylacrylamide
    • C08F220/56Acrylamide; Methacrylamide
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
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    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
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    • C08F220/10Esters
    • C08F220/34Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C08F220/343Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate in the form of urethane links
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    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
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    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
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    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/042Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder

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Abstract

The main purpose of the present invention is to provide a polymerizable composition which is capable of forming a coating material having an excellent ability to capture an acid component and high adhesive power. The present invention pertains to a polymerizable composition which contains a first polymerizable compound having an amide group and an ethylenically unsaturated group and which is to be used for coating an acid component-containing member. Preferably, the first polymerizable compound comprises at least one compound selected from the group consisting of an acrylamide compound having a structure in which an amide group is directly bonded to an ethylenically unsaturated group, a urethane compound having a urethane bond and an ethylenically unsaturated group and an isocyanuric ring-containing compound having an isocyanuric ring and an ethylenically unsaturated group.

Description

聚合性組合物、被覆構造體的製造方法、被覆構造體及被覆材Polymerizable composition, manufacturing method of covering structure, covering structure and covering material

本發明係關於一種用於形成被覆含有酸成分之構件之被覆材的聚合性組合物。The present invention relates to a polymerizable composition for forming a coating material for coating a member containing an acid component.

以酸產生劑使陽離子聚合性成分硬化而成之硬化物用於各種用途中,譬如用以形成光波導之構件、或用以製造濾光器之構件等。The cured product formed by curing the cation polymerizable component with an acid generator is used in various applications, such as a member for forming an optical waveguide or a member for manufacturing an optical filter.

使用酸產生劑製造硬化物時,存在酸產生劑殘留於所製成之硬化物中之情況。於此情形時,存在由酸產生劑所產生之酸自硬化物滲出而腐蝕周圍之構件的危險。When an acid generator is used to produce a hardened product, there are cases where the acid generator remains in the finished hardened product. In this case, there is a risk that the acid generated by the acid generator oozes out of the hardened substance and corrodes surrounding components.

為了抑制殘留有酸產生劑之硬化物之周圍所存在之構件發生腐蝕,進行如下操作:用包含酸捕捉材之被覆材被覆殘留有酸產生劑之硬化物。例如專利文獻1中記載了如下內容:將含有咪唑等胺系化合物之樹脂層積層於殘留有酸產生劑之硬化物。 [先前技術文獻] [專利文獻]In order to prevent corrosion of the members existing around the hardened product with the acid generator remaining, the following operation is performed: the hardened product with the acid generator remaining is covered with a coating material containing an acid trapping material. For example, Patent Document 1 describes that a resin containing an amine compound such as imidazole is laminated on a cured product in which an acid generator remains. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本專利特開2014-225019號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-225019

然而,專利文獻1中記載之樹脂層存在無法充分捕捉由酸產生劑所產生之酸的問題。又,該文獻中記載之樹脂層存在與硬化物之接著力較弱之問題。However, the resin layer described in Patent Document 1 has a problem that it cannot sufficiently capture the acid generated by the acid generator. In addition, the resin layer described in this document has the problem of weak adhesion to the cured product.

因此,本發明之課題在於提供一種能夠捕捉含有酸成分之構件中之酸成分且與含有酸成分之構件之接著力較高的被覆材,即,提供一種能夠形成酸成分捕捉性優異且接著力較高之被覆材的材料。Therefore, the subject of the present invention is to provide a coating material capable of capturing the acid component in a member containing an acid component and having high adhesion to the member containing the acid component, that is, to provide a coating material capable of forming an excellent acid component capture property and adhesive force. The material of the higher covering material.

本發明人為了解決上述課題而努力進行了探究,結果發現,藉由使用包含特定聚合性化合物之組合物形成被覆含有酸成分之構件之被覆材,能夠解決上述課題,從而完成了本發明。The inventors of the present invention worked diligently to solve the above-mentioned problems. As a result, they found that the above-mentioned problems can be solved by using a composition containing a specific polymerizable compound to form a coating material that coats a member containing an acid component, thereby completing the present invention.

即,本發明係關於一種聚合性組合物,其係包含具有醯胺基及乙烯性不飽和基之第1聚合性化合物者,且 用以被覆含有酸成分之構件。That is, the present invention relates to a polymerizable composition containing a first polymerizable compound having an amide group and an ethylenically unsaturated group, and Used to coat components containing acid.

又,本發明係關於一種被覆構造體的製造方法,其具有利用被覆材被覆含有酸成分之構件之步驟, 上述被覆材包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元。In addition, the present invention relates to a method of manufacturing a covering structure, which has a step of covering a member containing an acid component with a covering material, The coating material includes a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group.

又,本發明係關於一種被覆構造體,其具有含有酸成分之構件、及被覆該構件之被覆材, 上述被覆材包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元。In addition, the present invention relates to a covering structure having a member containing an acid component and a covering material covering the member, The coating material includes a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group.

又,本發明係關於一種被覆材,其包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元,上述被覆材用以被覆含有酸成分之構件。In addition, the present invention relates to a coating material comprising a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group, and the coating material is used for coating and containing an acid Components of ingredients.

本發明係關於一種聚合性組合物、包含含有該聚合性組合物之聚合物之被覆材的被覆構造體、該被覆構造體的製造方法、被覆材。以下,對本發明詳細地進行說明。The present invention relates to a polymerizable composition, a coating structure containing a coating material containing a polymer of the polymerizable composition, a method for manufacturing the coating structure, and a coating material. Hereinafter, the present invention will be described in detail.

A.聚合性組合物 本發明之聚合性組合物係包含具有醯胺基及乙烯性不飽和基之第1聚合性化合物者,且用以被覆含有酸成分之構件。A. Polymerizable composition The polymerizable composition of the present invention contains a first polymerizable compound having an amide group and an ethylenically unsaturated group, and is used to coat a member containing an acid component.

本發明之聚合性組合物含有具有醯胺基及乙烯性不飽和基之第1聚合性化合物。藉由含有第1聚合性化合物之聚合性組合物之聚合物,能夠形成具有優異之酸成分捕捉性及較高之接著力之被覆材。 此處,能夠形成此種具有優異之酸成分捕捉性及較高之接著力之被覆材的原因尚不清楚,但推測如下。 即,上述聚合性組合物之聚合物包含第1聚合性化合物之聚合體。又,聚合體具有源自第1聚合性化合物之包含-(C=O)-N-的結構單元。該結構單元中之-(C=O)-N-能夠有效率地捕捉酸成分。結果能夠發揮如下效果:能夠抑制位於被覆構造體周圍之構件之由酸成分所引起之腐蝕;能夠抑制經上述被覆材所被覆之含有酸成分之構件中所包含之成分因酸成分而發生分解等。更具體而言,上述聚合體所具有之醯胺基能夠以氮原子及羰基與酸成分之間形成錯合物之方式使酸成分穩定化。該機制不同於咪唑化合物等鹼性基捕捉酸成分之機制,因此,因鹼性基之酸成分捕捉及中和而導致之酸成分捕捉能力之降低較少,能夠更有效率地捕捉酸成分。 又,因聚合體具有醯胺基,故捕捉酸成分之醯胺基穩定地固定於上述聚合物中,其結果,能夠穩定地捕捉酸成分。 由此,包含上述聚合體之聚合物能夠於聚合物中穩定地捕捉含有酸成分之構件中之酸成分,而穩定地抑制含有酸成分之構件周圍之構件之腐蝕等。 進而,上述聚合性組合物之聚合物中所包含之聚合體因具有乙烯性不飽和基,而對硬化物具有較高之接著力。其結果,含有酸成分之構件與被覆材不容易剝離。更具體而言,上述聚合性組合物能夠形成包含第1聚合性化合物彼此藉由乙烯性不飽和基而以網狀聚合而成之聚合體的聚合物。由此,能夠製成與含有酸成分之構件之接著力較高之被覆材。又,因上述聚合性組合物之聚合體具有醯胺基,故與陽離子硬化性組合物中所包含之陽離子硬化性成分之親和性優異。由此,能夠製成與陽離子硬化性組合物之硬化物等含有酸成分之構件之接著力較高之被覆材。The polymerizable composition of the present invention contains a first polymerizable compound having an amide group and an ethylenically unsaturated group. The polymer of the polymerizable composition containing the first polymerizable compound can form a coating material with excellent acid trapping properties and high adhesive force. Here, the reason why such a coating material with excellent acid trapping properties and high adhesive force can be formed is not clear, but it is estimated as follows. That is, the polymer of the polymerizable composition includes the polymer of the first polymerizable compound. In addition, the polymer has a structural unit containing -(C=O)-N- derived from the first polymerizable compound. -(C=O)-N- in this structural unit can efficiently capture acid components. As a result, the following effects can be exerted: it is possible to suppress the corrosion of the components located around the covered structure caused by the acid component; it is possible to suppress the decomposition of the components contained in the component containing the acid component covered by the above-mentioned coating material due to the acid component, etc. . More specifically, the amide group possessed by the above polymer can stabilize the acid component so that a complex between the nitrogen atom and the carbonyl group and the acid component can be formed. This mechanism is different from the mechanism in which basic groups such as imidazole compounds capture acid components. Therefore, the acid component capturing ability of the basic group is less reduced due to the capturing and neutralization of the acid component, and the acid component can be captured more efficiently. In addition, since the polymer has an amide group, the amide group that captures the acid component is stably fixed in the polymer. As a result, the acid component can be stably captured. Thereby, the polymer containing the above-mentioned polymer can stably capture the acid component in the acid component-containing member in the polymer, and stably suppress the corrosion of the member around the acid component-containing member. Furthermore, the polymer contained in the polymer of the above-mentioned polymerizable composition has an ethylenically unsaturated group and therefore has a high adhesive force to the cured product. As a result, the member containing the acid component and the coating material are not easily peeled off. More specifically, the above-mentioned polymerizable composition can form a polymer including a polymer in which the first polymerizable compounds are polymerized in a network form via an ethylenically unsaturated group. As a result, it is possible to produce a coating material with high adhesion to the member containing the acid component. In addition, since the polymer of the above-mentioned polymerizable composition has an amide group, it has excellent affinity with the cation curable component contained in the cation curable composition. As a result, it is possible to form a coating material having a high adhesive force with a member containing an acid component, such as a cured product of a cationic curable composition.

1.第1聚合性化合物 聚合性組合物中所包含之第1聚合性化合物係具有醯胺基及乙烯性不飽和基者,於一分子中具有至少1個醯胺基,且具有至少1個乙烯性不飽和基。醯胺基與乙烯性不飽和基可直接鍵結,亦可經由二價連結基而鍵結。於第1聚合性化合物於一分子中具有複數個醯胺基之情形時,複數個醯胺基可經由連結基或不經由連結基以直鏈狀鍵結,亦可經由連結基或不經由連結基以環狀鍵結。 作為乙烯性不飽和基,只要為具有自由基聚合性者即可,可例舉:丙烯醯基、甲基丙烯醯基、乙烯基等。 作為此種第1聚合性化合物,例如可例舉: 具有醯胺基與乙烯性不飽和基直接鍵結之結構之丙烯醯胺化合物、 具有胺基甲酸酯鍵及乙烯性不飽和基之胺基甲酸酯化合物、及 具有異三聚氰酸環及乙烯性不飽和基之含異三聚氰酸環化合物。1. The first polymerizable compound The first polymerizable compound contained in the polymerizable composition has an amide group and an ethylenically unsaturated group, and has at least one amide group and at least one ethylenically unsaturated group in one molecule. The amide group and the ethylenically unsaturated group may be directly bonded, or may be bonded via a divalent linking group. When the first polymerizable compound has a plurality of amide groups in one molecule, the plural amide groups may be bonded in a linear manner via a linking group or not through a linking group, and may also be linked through a linking group or not through a linking group. The base is bonded in a ring. The ethylenically unsaturated group may be any one having radical polymerizability, and it may, for example, be an acryloyl group, a methacryloyl group, or a vinyl group. As such a first polymerizable compound, for example: An acrylamide compound with a structure in which an amide group and an ethylenically unsaturated group are directly bonded, A urethane compound having a urethane bond and an ethylenically unsaturated group, and An isocyanuric acid ring-containing compound having an isocyanuric acid ring and an ethylenically unsaturated group.

(1)丙烯醯胺化合物 丙烯醯胺化合物係具有醯胺基與乙烯性不飽和基直接鍵結之結構的化合物。 此種丙烯醯胺化合物之中,就聚合反應容易進行且易獲得性優異之方面而言,較佳為乙烯性不飽和基與醯胺基中之羰基直接鍵結而形成丙烯醯基或甲基丙烯醯基的丙烯醯胺或甲基丙烯醯胺。 作為此種丙烯醯胺化合物,就能夠形成可更有效地捕捉酸成分之聚合體,容易形成接著力較高之被覆材之方面而言,較佳為使用下述式(A1)所表示者。(1) Acrylic amide compound The acrylamide compound is a compound having a structure in which an amide group and an ethylenically unsaturated group are directly bonded. Among such acrylamide compounds, it is preferred that the ethylenic unsaturated group is directly bonded to the carbonyl group in the amide group to form an acrylamide group or a methyl group in terms of easy polymerization reaction and excellent availability. Acrylic acrylamide or methacrylamide. As such an acrylamide compound, it is preferable to use the one represented by the following formula (A1) in terms of being able to form a polymer that can more effectively capture the acid component and easily form a coating material with a higher adhesive force.

[化1]

Figure 02_image001
[化1]
Figure 02_image001

式中,n表示1或2之整數。 於n為1之整數之情形時,R1 及R2 分別獨立地表示氫原子、下述式(a)所表示之基、碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰,R1 及R2 可相互鍵結而形成雜環, R3 表示氫原子或甲基。 於n為2之整數之情形時,R1 表示直接鍵、碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰, R2 表示氫原子、碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰, R2 可與相鄰氮原子鍵結而形成含有2個氮原子之雜環, R3 表示氫原子或甲基, 2個R2 及R3 可分別相同,亦可不同。In the formula, n represents an integer of 1 or 2. When n is an integer of 1 , R 1 and R 2 each independently represent a hydrogen atom, a group represented by the following formula (a), a monovalent hydrocarbon group having 1 to 30 carbon atoms, and 2 to 30 carbon atoms A monovalent heterocyclic group, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with a divalent group selected from the following group (I), wherein in 2 When more than one methylene group is substituted with a divalent group selected from the following group (I), the divalent group is not adjacent, and R 1 and R 2 may be bonded to each other to form a heterocyclic ring, and R 3 represents Hydrogen atom or methyl group. When n is an integer of 2, R 1 represents a direct bond, a divalent hydrocarbon group with 1 to 30 carbon atoms, a divalent heterocyclic group with 2 to 30 carbon atoms, or the hydrocarbon group or the heterocyclic group One or more methylene groups are substituted with a divalent group selected from the following group (I), wherein two or more methylene groups are substituted with a divalent group selected from the following group (I) In the case of a divalent group, the divalent group is not adjacent, and R 2 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 30 carbon atoms, a monovalent heterocyclic group containing 2 to 30 carbon atoms, or the hydrocarbon group Or one or more methylene groups in the heterocyclic group are substituted with divalent groups selected from the following group (I), wherein two or more methylene groups are substituted with In the case of the divalent group of the following group (I), the divalent group is not adjacent, R 2 can bond with the adjacent nitrogen atom to form a heterocyclic ring containing two nitrogen atoms, and R 3 represents a hydrogen atom or methyl The two groups of R 2 and R 3 may be the same or different.

[化2]

Figure 02_image003
[化2]
Figure 02_image003

式中,R4 表示氫原子、或碳原子數1~30之一價烴基, R5 表示氫原子或甲基, X表示直接鍵、碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰, 於上述通式(A1)所表示之化合物中存在複數個上述通式(a)所表示之基之情形時,存在複數個之R4 、R5 及X可分別相同,亦可不同, *表示鍵結鍵。 群(I):-O-、-S-、-NR6 -、-NR6 -(C=O)-O-、-CO-、-(C=O)-O-、-O-(C=O)-、-O-(C=O)-O- R6 表示氫原子或碳原子數1~30之一價烴基。In the formula, R 4 represents a hydrogen atom or a monovalent hydrocarbon group with 1 to 30 carbon atoms, R 5 represents a hydrogen atom or a methyl group, and X represents a direct bond, a divalent hydrocarbon group with 1 to 30 carbon atoms, and 2 carbon atoms. ~30 divalent heterocyclic group, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with a divalent group selected from the following group (I), wherein, When two or more methylene groups are substituted with a divalent group selected from the following group (I), the divalent group is not adjacent, and there are plural in the compound represented by the general formula (A1) In the case of the base represented by the above general formula (a), there are a plurality of R 4 , R 5 and X which may be the same or different, respectively, and * represents a bonding bond. Group (I): -O-, -S-, -NR 6 -, -NR 6 -(C=O)-O-, -CO-, -(C=O)-O-, -O-(C =O)-, -O-(C=O)-O- R 6 represents a hydrogen atom or a monovalent hydrocarbon group with 1 to 30 carbon atoms.

於本發明中,烴基意指由脂肪族烴基、芳香族烴基及將該等基組合而成之含芳香族環烴基所組成之一群之基。 於本發明中,含雜環基意指由雜環基、及烴基中之1個以上之氫原子被取代為雜環基而成之基所組成之一群之基。含雜環基只要包含雜環即可,可包含脂肪族烴基或芳香族烴基。 再者,上述烴基及含雜環基之概念亦包括基中之1個以上之氫原子被取代基取代的情況。In the present invention, the hydrocarbon group means a group consisting of an aliphatic hydrocarbon group, an aromatic hydrocarbon group, and an aromatic ring-containing hydrocarbon group formed by combining these groups. In the present invention, the heterocyclic group-containing group means a group consisting of a heterocyclic group and a group in which one or more hydrogen atoms in the hydrocarbon group are substituted with a heterocyclic group. The heterocyclic group-containing group only needs to include a heterocyclic ring, and may include an aliphatic hydrocarbon group or an aromatic hydrocarbon group. Furthermore, the above-mentioned concepts of hydrocarbon groups and heterocyclic groups also include the case where more than one hydrogen atom in the group is substituted by a substituent.

作為式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數1~30之一價烴基,並無特別限定,例如可例舉:可具有取代基之碳原子數1~30之烷基、可具有取代基之碳原子數2~30之烯基、可具有取代基之碳原子數2~30之炔基、可具有取代基之碳原子數3~30之環烷基、可具有取代基之碳原子數4~30之環烷基烷基等可具有取代基之脂肪族烴基;可具有取代基之碳原子數6~30之芳基等芳香族烴基;可具有取代基之碳原子數7~30之芳烷基、及可具有取代基之碳原子數8~30之烯基芳基等可具有取代基之含芳香族環烴基等。 The monovalent hydrocarbon group with 1 to 30 carbon atoms represented by R 1 , R 2 , R 4 and R 6 in the formula (A1) is not particularly limited. For example, the number of carbon atoms that may have a substituent 1-30 alkyl, optionally substituted alkenyl with 2-30 carbon atoms, optionally substituted alkynyl with 2-30 carbon atoms, optionally substituted ring with 3-30 carbon atoms Alkyl group, optionally substituted aliphatic hydrocarbon group such as cycloalkylalkyl having 4 to 30 carbon atoms; optionally substituted aromatic hydrocarbon group such as aryl group with 6 to 30 carbon atoms; An optionally substituted aromatic ring-containing hydrocarbon group such as an aralkyl group having 7 to 30 carbon atoms and an optionally substituted alkenyl aryl group having 8 to 30 carbon atoms.

於式(A1)中之R1 、R2 、R4 及R6 為碳原子數1~30之烷基之情形時,該烷基可為直鏈狀,亦可為支鏈狀。作為直鏈烷基,例如可例舉:甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基、正十一烷基、正十二烷基、正十四烷基、正十六烷基、正十八烷基及正二十烷基。作為支鏈烷基,可例舉:異丙基、異丁基、第二丁基、第三丁基、異戊基、第三戊基、異辛基、2-乙基己基、第三辛基、異壬基及異癸基等。 When R 1 , R 2 , R 4 and R 6 in the formula (A1) are an alkyl group having 1 to 30 carbon atoms, the alkyl group may be linear or branched. Examples of linear alkyl groups include methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, n-decyl, and n-decyl. Monoalkyl, n-dodecyl, n-tetradecyl, n-hexadecyl, n-octadecyl and n-eicosyl. Examples of branched alkyl groups include isopropyl, isobutyl, second butyl, tertiary butyl, isopentyl, tertiary pentyl, isooctyl, 2-ethylhexyl, and tertiary octyl. Base, isononyl and isodecyl, etc.

式(A1)中之R1 、R2 、R4 及R6 所採用之碳原子數2~30之烯基係具有不飽和雙鍵者,可使用飽和脂肪族烴基中之1個以上之亞甲基被取代為不飽和雙鍵而成者。 作為飽和脂肪族烴基,可例舉:上述有時具有取代基之碳原子數1~30之烷基、有時具有取代基之碳原子數3~30之環烷基、有時具有取代基之碳原子數4~30之環烷基烷基等。 作為上述烯基,可為具有1個不飽和雙鍵者,亦可為具有2個以上不飽和雙鍵者。 上述烯基可為鏈狀,亦可具有環狀結構。 於本發明中,就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,較佳為鏈狀。於該烯基為鏈狀之情形時,烯基可為直鏈狀,亦可為支鏈狀。 於該烯基為鏈狀之情形時,可為末端具有不飽和雙鍵之末端烯基,亦可為內部具有不飽和雙鍵之內部烯基。於本發明中,就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,較佳為末端烯基。 再者,作為末端烯基,可例舉*-CH=CH2 或*-C(CH3 )=CH2 (*表示鍵結鍵)。又,於用以形成烯基之飽和脂肪族烴基具有支鏈結構之情形時,烯基可於支鏈結構之各個末端具有不飽和雙鍵。即,烯基可使用末端具有2個以上不飽和雙鍵之烯基。 作為碳原子數為2~30之直鏈狀末端烯基,例如可例舉-(CH2 )p1 -CH=CH2 (p1表示0~28之整數)。作為碳原子數為2~30之支鏈狀末端烯基,例如可例舉-(CH2 )p2 -C(CH3 )=CH2 (p2表示0~27之整數)。 於本發明中,作為上述烯基,直鏈狀末端不飽和雙鍵結構及支鏈狀末端不飽和雙鍵結構均可使用,較佳為直鏈狀末端不飽和雙鍵結構。其原因在於,這樣會使得上述第1聚合性化合物之聚合速度較快。 作為末端烯基之具體例,例如可例舉:乙烯基、2-丙烯基、3-丁烯基、4-戊烯基及5-己烯基等。作為內部烯基,例如可例舉:2-丁烯基、3-戊烯基、2-己烯基、3-己烯基、2-庚烯基、3-庚烯基、4-庚烯基、3-辛烯基、3-壬烯基、4-癸烯基、3-十一碳烯基及4-十二碳烯基等。 作為環狀烯基,可例舉:3-環己烯基、2,5-環己二烯基-1-甲基及4,8,12-十四碳三烯基烯丙基等。In formula (A1), the alkenyl group with 2 to 30 carbon atoms used in R 1 , R 2 , R 4 and R 6 has an unsaturated double bond, and one or more of the saturated aliphatic hydrocarbon groups can be used. The methyl group is substituted with an unsaturated double bond. Examples of saturated aliphatic hydrocarbon groups include the above-mentioned alkyl groups with 1 to 30 carbon atoms which may have substituents, cycloalkyl groups with 3 to 30 carbon atoms which may have substituents, and those which may have substituents. Cycloalkylalkyl groups having 4 to 30 carbon atoms, etc. The alkenyl group may have one unsaturated double bond, or may have two or more unsaturated double bonds. The above-mentioned alkenyl group may be chain-like or may have a cyclic structure. In the present invention, from the viewpoint of further improving the acid component trapping properties of the obtained polymer, it is preferably chain-like. When the alkenyl group is chain-like, the alkenyl group may be linear or branched. When the alkenyl group is chain-like, it may be a terminal alkenyl group having an unsaturated double bond at the end, or an internal alkenyl group having an unsaturated double bond inside. In the present invention, the terminal alkenyl group is preferred from the viewpoint of further improving the acid component capture property of the polymer obtained. In addition, as the terminal alkenyl group, *-CH=CH 2 or *-C(CH 3 )=CH 2 (* represents a bonding bond). Furthermore, when the saturated aliphatic hydrocarbon group used to form the alkenyl group has a branched structure, the alkenyl group may have an unsaturated double bond at each end of the branched structure. That is, as the alkenyl group, an alkenyl group having two or more unsaturated double bonds at the end can be used. As the linear terminal alkenyl group having 2 to 30 carbon atoms, for example, -(CH 2 ) p1 -CH=CH 2 (p1 represents an integer of 0 to 28). As the branched terminal alkenyl group having 2 to 30 carbon atoms, for example, -(CH 2 ) p2 -C(CH 3 )=CH 2 (p2 represents an integer of 0 to 27). In the present invention, as the alkenyl group, both a linear terminal unsaturated double bond structure and a branched terminal unsaturated double bond structure can be used, and a linear terminal unsaturated double bond structure is preferred. The reason is that this makes the polymerization rate of the first polymerizable compound faster. As a specific example of a terminal alkenyl group, a vinyl group, 2-propenyl group, 3-butenyl group, 4-pentenyl group, 5-hexenyl group, etc. are mentioned, for example. Examples of internal alkenyl groups include 2-butenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 2-heptenyl, 3-heptenyl, and 4-heptene. Group, 3-octenyl, 3-nonenyl, 4-decenyl, 3-undecenyl, 4-dodecenyl, etc. The cyclic alkenyl group may, for example, be 3-cyclohexenyl, 2,5-cyclohexadienyl-1-methyl, 4,8,12-tetradecatrienylallyl, and the like.

式(A1)中之R1 、R2 、R4 及R6 所採用之碳原子數2~30之炔基係具有不飽和三鍵者,可使用飽和脂肪族烴基中之1個以上之亞甲基被取代為不飽和三鍵而成者。 作為上述炔基,可為具有1個不飽和三鍵者,亦可為具有2個以上不飽和三鍵者。 上述炔基可為鏈狀,亦可具有環狀結構。於本發明中,就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,較佳為鏈狀。 於該炔基為鏈狀之情形時,可為具有末端不飽和三鍵結構之基、即末端具有不飽和三鍵結構之基,亦可為具有內部不飽和三鍵結構之基、即內部具有不飽和三鍵結構之基。 於該炔基為鏈狀之情形時,炔基可為直鏈狀,亦可為支鏈狀。 作為上述碳原子數2~30之炔基,可例舉:乙炔基、1-丙炔基、2-丙炔基、1-丁炔基、2-丁炔基、3-丁炔基、1-辛炔基、1-癸炔基、1-十八碳炔基等。In formula (A1), the alkynyl group with 2 to 30 carbon atoms used in R 1 , R 2 , R 4 and R 6 has an unsaturated triple bond, and one or more of the saturated aliphatic hydrocarbon groups can be used. The methyl group is substituted with an unsaturated triple bond. The alkynyl group may have one unsaturated triple bond, or may have two or more unsaturated triple bonds. The above-mentioned alkynyl group may be chain-like or may have a cyclic structure. In the present invention, from the viewpoint of further improving the acid component trapping properties of the obtained polymer, it is preferably chain-like. When the alkynyl group is chain-like, it can be a group with a terminal unsaturated triple bond structure, that is, a group with an unsaturated triple bond structure at the end, or a group with an internal unsaturated triple bond structure, that is, a group with an internal unsaturated triple bond structure. The base of unsaturated triple bond structure. When the alkynyl group is chain-like, the alkynyl group may be linear or branched. Examples of the alkynyl group having 2 to 30 carbon atoms include ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, 2-butynyl, 3-butynyl, 1 -Octynyl, 1-decynyl, 1-octadecynyl, etc.

作為式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數3~30之環烷基,可例舉:環烷烴中去除1個氫原子而成之基、或環烷烴中之1個或2個以上之氫原子被取代為上述烷基、烯基及/或炔基而成之化合物中所包含之環烷烴中去除1個氫原子而成的基。 作為此種碳原子數3~30之環烷基,可例舉整體具有3~30個碳原子之飽和單環式或飽和多環式烷基。作為飽和單環式烷基,例如可例舉:環丙基、環丁基、環戊基、環己基、環庚基、環辛基、環壬基及環癸基等。作為飽和多環式烷基,例如可例舉:金剛烷基、十氫萘基、八氫并環戊二烯、雙環[1.1.1]戊基及十四氫蒽基等。 Examples of the cycloalkyl group having 3 to 30 carbon atoms represented by R 1 , R 2 , R 4 and R 6 in the formula (A1) include: a group obtained by removing one hydrogen atom from a cycloalkane, or One or two or more hydrogen atoms in the cycloalkane are substituted with the above-mentioned alkyl group, alkenyl group, and/or alkynyl group, and a group obtained by removing one hydrogen atom from the cycloalkane contained in the compound. As such a cycloalkyl group having 3 to 30 carbon atoms, a saturated monocyclic or saturated polycyclic alkyl group having 3 to 30 carbon atoms as a whole may be mentioned. As a saturated monocyclic alkyl group, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, cyclodecyl, etc. are mentioned, for example. As a saturated polycyclic alkyl group, adamantyl, decahydronaphthyl, octahydrocyclopentadiene, bicyclo[1.1.1]pentyl, tetradecahydroanthryl, etc. are mentioned, for example.

式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數4~30之環烷基烷基意指烷基之氫原子被取代為環烷基且整體具有4~30個碳原子的基。該環烷基烷基中之環烷基可為單環,亦可為多環。 The cycloalkylalkyl group having 4 to 30 carbon atoms represented by R 1 , R 2 , R 4 and R 6 in the formula (A1) means that the hydrogen atom of the alkyl group is substituted with a cycloalkyl group and has 4 to 4 as a whole. A base of 30 carbon atoms. The cycloalkyl group in the cycloalkylalkyl group may be monocyclic or polycyclic.

作為環烷基為單環之碳原子數4~30之環烷基烷基,例如可例舉:環丙基甲基、環丁基甲基、環戊基甲基、環己基甲基、環庚基甲基、環辛基甲基、環壬基甲基及環癸基甲基等環烷基甲基;2-環丁基乙基、2-環戊基乙基、2-環己基乙基、2-環庚基乙基、2-環辛基乙基、2-環壬基乙基及2-環癸基乙基等環烷基乙基;3-環丁基丙基、3-環戊基丙基、3-環己基丙基、3-環庚基丙基、3-環辛基丙基、3-環壬基丙基及3-環癸基丙基等環烷基丙基;4-環丁基丁基、4-環戊基丁基、4-環己基丁基、4-環庚基丁基、4-環辛基丁基、4-環壬基丁基、4-環癸基丁基等環烷基丁基。作為環烷基為多環之碳原子數4~20之環烷基烷基,可例舉:雙環[1.1.0]丁基、雙環[1.1.1]戊基、雙環[2.1.0]戊基、雙環[3.1.0]己基、雙環[2.1.1]己基、雙環[2.2.0]己基、雙環[4.1.0]庚基、雙環[3.2.0]庚基、雙環[3.1.1]庚基、雙環[2.2.1]庚基、雙環[5.1.0]辛基、雙環[4.2.0]辛基、雙環[4.1.1]辛基、雙環[3.3.0]辛基、雙環[3.2.1]辛基、雙環[2.2.2]辛基、螺[4,4]壬基、螺[4,5]癸基、十氫萘、三環癸基、四環十二烷基及雪松醇、環十二烷基3-3-金剛烷基丙基及十氫萘基丙基等。The cycloalkyl group is a monocyclic cycloalkylalkyl group having 4 to 30 carbon atoms, for example, cyclopropylmethyl, cyclobutylmethyl, cyclopentylmethyl, cyclohexylmethyl, and cycloheptyl Cycloalkylmethyl such as methyl, cyclooctylmethyl, cyclononylmethyl and cyclodecylmethyl; 2-cyclobutylethyl, 2-cyclopentylethyl, 2-cyclohexylethyl, 2-cycloheptylethyl, 2-cyclooctylethyl, 2-cyclononylethyl, 2-cyclodecylethyl and other cycloalkylethyls; 3-cyclobutylpropyl, 3-cyclopentyl Cycloalkylpropyl, 3-cyclohexylpropyl, 3-cycloheptylpropyl, 3-cyclooctylpropyl, 3-cyclononylpropyl and 3-cyclodecylpropyl; 4 -Cyclobutylbutyl, 4-cyclopentylbutyl, 4-cyclohexylbutyl, 4-cycloheptylbutyl, 4-cyclooctylbutyl, 4-cyclononylbutyl, 4-cyclodecyl Cycloalkylbutyl groups such as butyl group. The cycloalkyl group is a polycyclic cycloalkylalkyl group having 4 to 20 carbon atoms, for example: bicyclo[1.1.0]butyl, bicyclo[1.1.1]pentyl, bicyclo[2.1.0]pentyl Bicyclo[3.1.0]hexyl, bicyclo[2.1.1]hexyl, bicyclo[2.2.0]hexyl, bicyclo[4.1.0]heptyl, bicyclo[3.2.0]heptyl, bicyclo[3.1.1] Heptyl, bicyclo[2.2.1]heptyl, bicyclo[5.1.0]octyl, bicyclo[4.2.0]octyl, bicyclo[4.1.1]octyl, bicyclo[3.3.0]octyl, bicyclo[ 3.2.1]octyl, bicyclo[2.2.2]octyl, spiro[4,4]nonyl, spiro[4,5]decyl, decahydronaphthalene, tricyclodecyl, tetracyclododecyl and Cedarol, cyclododecyl 3-3-adamantyl propyl and decahydronaphthyl propyl, etc.

再者,作為脂肪族烴基,亦可使用環烷基烷基中之烷基之亞甲基被取代為-CH=CH-而成之基、即環烷基伸烷基。Furthermore, as the aliphatic hydrocarbon group, a cycloalkylalkylene group in which the methylene group of an alkyl group in a cycloalkylalkyl group is substituted with -CH=CH-, that is, a cycloalkylalkylene group can also be used.

作為式(A1)中之R1 、R2 、R4 及R6 所採用之碳原子數6~30之芳基,可例舉:芳香族烴環中去除1個氫原子而成之基、或芳香族烴環中之1個或2個以上之氫原子被取代為上述脂肪族烴基而成之化合物中所包含之芳香族烴環中去除1個氫原子而成的基。 作為芳香族烴環,可例舉:單環結構、縮環結構、多環結構等。 多環結構係將2個以上之單環結構及/或縮環結構之芳香族烴環連結而成者,只要具有芳香族性即可。更具體而言,作為多環結構,可例舉:將單環結構與單環結構連結而成者、將單環結構與縮環結構連結而成者、將縮環結構與縮環結構連結而成者等。 作為將單環結構及/或縮環結構之芳香族烴環彼此連結之基,可例舉:直接鍵、-S-、-O-、-CO-、-CR101 R102 -。R101 及R102 分別獨立地表示氫原子或碳原子數1~4之烷基。 作為具有單環結構之芳基,例如可例舉苯基等。 作為碳原子數6~30之芳基,例如亦可例舉:甲苯基、二甲苯基、乙基苯基、4-乙烯基苯基、4-甲基苯基、2,4,6-三甲基苯基等單環結構之芳基。 作為具有縮環結構之芳基,例如可例舉:萘基、蒽基及菲基等。 作為具有多環結構之芳基,例如可例舉:聯苯基、二苯甲酮基等。 Examples of the aryl group having 6 to 30 carbon atoms used for R 1 , R 2 , R 4 and R 6 in the formula (A1) include: a group formed by removing one hydrogen atom from an aromatic hydrocarbon ring, Or one or two or more hydrogen atoms in the aromatic hydrocarbon ring are substituted with the above-mentioned aliphatic hydrocarbon group by removing one hydrogen atom from the aromatic hydrocarbon ring contained in the compound. As an aromatic hydrocarbon ring, a monocyclic structure, a condensed ring structure, a polycyclic structure, etc. are mentioned. The polycyclic structure is one formed by linking two or more monocyclic structures and/or condensed aromatic hydrocarbon rings, as long as it has aromaticity. More specifically, as the polycyclic structure, there can be exemplified: those formed by connecting a single ring structure and a single ring structure, those formed by connecting a single ring structure and a condensed ring structure, and a condensed ring structure and a condensed ring structure are connected Winners and so on. Examples of the group that connects the aromatic hydrocarbon rings of the monocyclic structure and/or the condensed ring structure to each other include a direct bond, -S-, -O-, -CO-, -CR 101 R 102 -. R 101 and R 102 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. As the aryl group having a monocyclic structure, for example, a phenyl group may be mentioned. As the aryl group having 6 to 30 carbon atoms, for example, tolyl, xylyl, ethylphenyl, 4-vinylphenyl, 4-methylphenyl, 2,4,6-tris Monocyclic aryl groups such as methylphenyl. As the aryl group having a condensed ring structure, for example, a naphthyl group, an anthryl group, a phenanthryl group, etc. may be mentioned. As an aryl group having a polycyclic structure, for example, a biphenyl group, a benzophenone group, etc. may be mentioned.

式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數7~30之芳烷基意指烷基之1個以上之氫原子被取代為上述芳基而成之基。作為碳原子數7~30之芳烷基,例如可例舉:苄基、2-甲基苄基、3-甲基苄基、4-甲基苄基、α-二甲基苄基、2-苯基乙基、2-苯基丙基、3-苯基丙基、二苯基甲基、三苯基甲基及三苯基丙基等苯基烷基;以及萘基丙基等萘基烷基。 The aralkyl group having 7 to 30 carbon atoms represented by R 1 , R 2 , R 4 and R 6 in the formula (A1) means that one or more hydrogen atoms of the alkyl group are substituted with the above-mentioned aryl group base. Examples of aralkyl groups having 7 to 30 carbon atoms include benzyl, 2-methylbenzyl, 3-methylbenzyl, 4-methylbenzyl, α-dimethylbenzyl, 2 -Phenylalkyl such as phenylethyl, 2-phenylpropyl, 3-phenylpropyl, diphenylmethyl, triphenylmethyl and triphenylpropyl; and naphthalene such as naphthylpropyl基alkyl.

式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數8~30之烯基芳基意指烯基之1個以上之氫原子被取代為上述芳基而成之基。作為碳原子數8~30之烯基芳基,例如可例舉:苯基丙烯基、苯基丁烯基、苯基戊炔基或甲苯基丙烯基、甲苯基丁烯基及甲苯基戊炔基等。 The alkenyl aryl group having 8 to 30 carbon atoms represented by R 1 , R 2 , R 4 and R 6 in the formula (A1) means that one or more hydrogen atoms of the alkenyl group are substituted with the above-mentioned aryl group The base. Examples of alkenyl aryl groups having 8 to 30 carbon atoms include phenylpropenyl, phenylbutenyl, phenylpentynyl or tolylpropenyl, tolylbutenyl and tolylpentynyl Base and so on.

作為式(A1)中之R1 、R2 、R4 及R6 所採用之烴基,亦可使用具有不飽和雙鍵之烴基(以下,有時亦稱為含不飽和雙鍵基)。 此處,含不飽和雙鍵基只要具有芳香族環之環中以外之不飽和雙鍵且不包含雜環即可。 作為上述含不飽和雙鍵基,可使用碳原子數2~30者,可例舉:烯基、或者烯基與環烷基、環伸烷基或芳香族烴基組合而成的基。 作為烯基與環烷基、環伸烷基或芳香族烴基組合而成的基,可例舉:環烷基、環伸烷基或芳香族烴基中之氫原子之1個以上被取代為烯基而成的基、或者烯基中之氫原子之1個以上被取代為環烷基、環伸烷基或芳香族烴基而成的基等。 上述含不飽和雙鍵基所具有之不飽和雙鍵之數量只要為1個以上即可,較佳為1~2,較佳為1。其原因在於,這樣第1聚合性化合物容易形成硬化收縮較小且接著力較高之被覆材。 As the hydrocarbon group used for R 1 , R 2 , R 4 and R 6 in the formula (A1), a hydrocarbon group having an unsaturated double bond (hereinafter, also referred to as an unsaturated double bond-containing group) may also be used. Here, the unsaturated double bond-containing group should just have an unsaturated double bond other than the aromatic ring and it does not contain a heterocyclic ring. As the above-mentioned unsaturated double bond-containing group, one having 2 to 30 carbon atoms can be used, and examples thereof include an alkenyl group, or a combination of an alkenyl group, a cycloalkyl group, a cycloalkylene group, or an aromatic hydrocarbon group. As a group formed by combining an alkenyl group with a cycloalkyl group, a cycloalkylene group or an aromatic hydrocarbon group, one or more of the hydrogen atoms in the cycloalkyl group, cycloalkylene group or aromatic hydrocarbon group is substituted with an alkene A group in which one or more of the hydrogen atoms in an alkenyl group is substituted with a cycloalkyl group, a cycloalkylene group, or an aromatic hydrocarbon group, or the like. The number of unsaturated double bonds possessed by the above-mentioned unsaturated double bond-containing group may be one or more, preferably 1-2, and more preferably one. The reason for this is that the first polymerizable compound can easily form a coating material with a small curing shrinkage and a high adhesive force.

於本發明中,含雜環基可為包含雜環之基,可為去除雜環之環中之1個氫原子而成之基、去除雜環中之1個以上之氫原子被取代為上述脂肪族烴基而成之化合物之雜環中之1個氫原子而成的基、或烴基中之氫原子被取代為雜環基而成之基。於本發明中,含雜環基包括未經取代之含雜環基及具有取代基之含雜環基。 作為式(A1)中之R1 、R2 及R4 所表示之碳原子數2~30之一價含雜環基,例如可例舉:吡咯啶基、吡啶基、吡𠯤基、哌啶基、哌𠯤基、吡唑啉基、嘧啶基、嗒𠯤基、三𠯤基、六氫三𠯤基、咔唑基、苯并咔唑基、二苯并咔唑基、吡咯基、吲哚基、氮丙啶基、咪唑基、苯并咪唑基、吡唑基、喹啉基、異喹啉基、吡咯啶酮基、哌啶酮基及二氧基咪唑啶基等環中具有氮原子之雜環基;哌喃基、呋喃基、苯并呋喃基、四氫呋喃基、苯并二氫哌喃基、𠮿

Figure 109130258-0000-3
基、二苯并呋喃基、1,3-二氧雜環戊烷基及環氧乙烷基等環中具有氧原子之雜環基;噻吩基、苯并噻吩基、硫代呋喃基、二苯并噻吩基及四氫噻吩基等環中具有硫原子之雜環基;㗁唑基、苯并㗁唑基、異㗁唑基、𠰌啉基及㗁唑啶等環中具有氮原子及氧原子之雜環基;噻唑基、噻二唑基、苯并噻唑基、異噻唑基及硫代𠰌啉基等環中具有氮原子及硫原子之雜環基;上述2個以上之雜環基經由直接鍵、-S-、-O-、-CO-或-CR103 R104 -連結而成的基。R103 及R104 分別獨立地表示氫原子或碳原子數1~4之烷基。In the present invention, the heterocyclic group may be a group including a heterocyclic ring, may be a group obtained by removing one hydrogen atom in the ring of the heterocyclic ring, and replacing one or more hydrogen atoms in the heterocyclic ring with the above The aliphatic hydrocarbon group is composed of one hydrogen atom in the heterocyclic ring of the compound, or the hydrogen atom in the hydrocarbon group is substituted with a heterocyclic group. In the present invention, the heterocyclic group includes an unsubstituted heterocyclic group and a substituted heterocyclic group. Examples of the monovalent heterocyclic group containing 2 to 30 carbon atoms represented by R 1 , R 2 and R 4 in the formula (A1) include: pyrrolidinyl, pyridyl, pyridine, and piperidine Group, piperidine group, pyrazoline group, pyrimidinyl group, titanyl group, trisyl group, hexahydrotrisyl group, carbazolyl group, benzocarbazolyl group, dibenzocarbazolyl group, pyrrolyl group, indole There are nitrogen atoms in the ring, such as phenyl, aziridinyl, imidazolyl, benzimidazolyl, pyrazolyl, quinolinyl, isoquinolinyl, pyrrolidinone, piperidinone and dioxyimidazolidinyl The heterocyclic group; piperanyl, furanyl, benzofuranyl, tetrahydrofuranyl, chromanyl dihydropyranyl, 𠮿
Figure 109130258-0000-3
Group, dibenzofuranyl, 1,3-dioxolane and oxiranyl and other heterocyclic groups with oxygen atoms in the ring; thienyl, benzothienyl, thiofuranyl, two Heterocyclic groups with sulfur atoms in the ring such as benzothienyl and tetrahydrothienyl; oxazolyl, benzoazolyl, isooxazolyl, pyrolinyl and azolidine have nitrogen atoms and oxygen in the ring Heterocyclic groups of atoms; thiazolyl, thiadiazolyl, benzothiazolyl, isothiazolyl, and thiothiolinyl and other heterocyclic groups having a nitrogen atom and a sulfur atom in the ring; the above two or more heterocyclic groups A group formed by a direct bond, -S-, -O-, -CO- or -CR 103 R 104 -. R 103 and R 104 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

式(A1)中之R1 與R2 鍵結所形成之雜環可為含有氮原子及碳原子之環,亦可為含有氮原子、除氮原子以外之雜原子及碳原子之環。作為雜原子,可例舉氧原子或硫原子。就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,上述雜環較佳為含有氮原子、除氮原子以外之雜原子及碳原子之環,較佳為含有氮原子、氧原子及碳原子之環。上述雜環可為五員環,亦可為六員環。就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,上述雜環較佳為六員環。作為含有氮原子及碳原子之五員環之雜環,可例舉:吡咯環、吡咯啶環、咪唑環、咪唑啶環、咪唑啉環、吡唑環、吡唑啶環及哌啶環等。作為含有氮原子及碳原子之六員環之雜環,可例舉:哌𠯤環、吡啶環、嗒𠯤環、嘧啶環及吡𠯤環。作為含有氮原子、氧原子及碳原子之六員環之雜環,可例舉𠰌啉環等。作為含有氮原子、硫原子及碳原子之六員環之雜環,可例舉噻𠯤環等。 上述R1 與R2 鍵結所形成之雜環亦包括雜環之環中之1個以上之氫原子被取代為碳原子數1~30之脂肪族烴基而成者。 The heterocyclic ring formed by the bonding of R 1 and R 2 in the formula (A1) may be a ring containing a nitrogen atom and a carbon atom, or a ring containing a nitrogen atom, a heteroatom other than a nitrogen atom, and a carbon atom. As the hetero atom, an oxygen atom or a sulfur atom may be mentioned. From the standpoint of further improving the acid component capture property of the obtained polymer, the heterocyclic ring is preferably a ring containing a nitrogen atom, a heteroatom other than a nitrogen atom, and a carbon atom, and preferably contains a nitrogen atom and an oxygen atom. And a ring of carbon atoms. The aforementioned heterocyclic ring may be a five-membered ring or a six-membered ring. From the viewpoint of further improving the acid component capturing properties of the obtained polymer, the heterocyclic ring is preferably a six-membered ring. Examples of the five-membered ring heterocycle containing nitrogen and carbon atoms include: pyrrole ring, pyrrolidine ring, imidazole ring, imidazole ring, imidazoline ring, pyrazole ring, pyrazole ring, piperidine ring, etc. . Examples of the six-membered heterocyclic ring containing a nitrogen atom and a carbon atom include piperidine ring, pyridine ring, pyrimidine ring, pyrimidine ring and pyrimidine ring. The six-membered heterocyclic ring containing a nitrogen atom, an oxygen atom, and a carbon atom may, for example, be a pholine ring. The six-membered heterocyclic ring containing a nitrogen atom, a sulfur atom and a carbon atom may, for example, be a thiocyclic ring. The heterocyclic ring formed by the bonding of R 1 and R 2 also includes one in which one or more hydrogen atoms in the ring of the heterocyclic ring are substituted with an aliphatic hydrocarbon group having 1 to 30 carbon atoms.

作為式(A1)中之n為2且R2 與相鄰氮原子鍵結所形成之含有2個氮原子之雜環,可例舉哌𠯤等。 再者,於R2 與相鄰氮原子鍵結而形成含有2個氮原子之雜環之情形時,R2 作為二價基發揮功能。例如,於下述(1-19)所表示之化合物中,R1 及R2 兩者皆為與另一者之氮原子鍵結之二價烴基。又,於(1-19)所表示之化合物中,R1 及R2 兩者皆為整體碳原子數為9、包含末端烯基且具有支鏈結構的二價烴基,係亞甲基被取代為-O-、-NR6 -CO-、-CO-O-之二價基且R6 為氫原子的基。 As a heterocyclic ring containing 2 nitrogen atoms formed by n being 2 and R 2 bonding with adjacent nitrogen atoms in the formula (A1), piperazine and the like can be mentioned. Furthermore, when R 2 is bonded to an adjacent nitrogen atom to form a heterocyclic ring containing two nitrogen atoms, R 2 functions as a divalent group. For example, in the compound represented by (1-19) below, both R 1 and R 2 are divalent hydrocarbon groups bonded to the nitrogen atom of the other. In addition, in the compound represented by (1-19), both R 1 and R 2 are divalent hydrocarbon groups with a total number of carbon atoms of 9, including a terminal alkenyl group and having a branched structure, and the methylene group is substituted It is a divalent group of -O-, -NR 6 -CO-, and -CO-O-, and R 6 is a hydrogen atom.

於式(A1)中之n為2時之R1 及X係碳原子數1~30之二價烴基之情形時,作為該烴基,可例舉自上述碳原子數1~30之一價烴基去除1個氫原子而成的二價基。於本發明中,就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,較佳為碳原子數1~30之伸烷基。該伸烷基可為直鏈狀,亦可為支鏈狀。作為直鏈狀伸烷基,例如可例舉:自甲基、乙基、正丙基、正丁基、正戊基、正己基、正庚基、正辛基、正壬基、正癸基、正十一烷基、正十二烷基、正十四烷基、正十六烷基、正十八烷基及正二十烷基等直鏈狀烷基之末端之碳原子去除1個氫原子而成的二價基。作為支鏈狀伸烷基,例如可例舉:自異丙基、異丁基、第二丁基、第三丁基、異戊基、第三戊基、異辛基、2-乙基己基、第三辛基、異壬基及異癸基等支鏈狀伸烷基中之碳原子去除1個氫原子而成的二價基。 In the case where R 1 when n is 2 in formula (A1) and X are a divalent hydrocarbon group having 1 to 30 carbon atoms, the hydrocarbon group may be exemplified by the above-mentioned monovalent hydrocarbon group having 1 to 30 carbon atoms A divalent group formed by removing one hydrogen atom. In the present invention, from the viewpoint of further improving the acid component trapping properties of the obtained polymer, an alkylene group having 1 to 30 carbon atoms is preferred. The alkylene group may be linear or branched. Examples of linear alkylene groups include methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl, n-nonyl, and n-decyl. , N-undecyl, n-dodecyl, n-tetradecyl, n-hexadecyl, n-octadecyl, n-eicosyl and other straight-chain alkyl end carbon atoms removed 1 A divalent group formed by hydrogen atoms. Examples of branched alkylene groups include isopropyl, isobutyl, second butyl, tertiary butyl, isopentyl, tertiary pentyl, isooctyl, and 2-ethylhexyl. , Tertiary octyl, isononyl and isodecyl and other branched alkylenes are divalent groups formed by removing one hydrogen atom from a carbon atom in a branched alkylene group.

於式(A1)中之R1 及X係碳原子數2~30之二價含雜環基之情形時,作為該烴基,可例舉自上述碳原子數2~30之一價含雜環基去除1個氫原子而成的二價基。 When R 1 and X in the formula (A1) are a divalent heterocyclic ring-containing group having 2 to 30 carbon atoms, examples of the hydrocarbon group include the above-mentioned monovalent heterocyclic ring-containing group having 2 to 30 carbon atoms. A divalent group formed by removing one hydrogen atom.

上述碳原子數1~30之一價烴基、上述碳原子數1~30之一價烴基、上述碳原子數1~30之二價烴基及上述碳原子數2~30之二價含雜環基、R1 與R2 鍵結所形成之雜環、以及R2 與相鄰氮原子鍵結所形成之含有2個氮原子之雜環中之1個以上之氫原子可被取代。 作為取代具有取代基之一價或二價烴基、具有取代基之一價或二價含雜環基、具有取代基之R1 與R2 鍵結所形成之雜環、及R2 與相鄰氮原子鍵結所形成之含有2個氮原子之雜環中之氫原子的取代基,例如可例舉:鹵素原子、氰基、硝基、羥基、硫醇基、-COOH或-SO2 H。作為鹵素原子,可例舉:氟、氯、溴、碘等。 再者,於本說明書中,於特定碳原子數之基之氫原子被取代為含有碳原子之取代基之情形時,包括該取代基之碳原子在內滿足特定碳原子數之規定。因此,碳原子數1~30之烴基於該基中之氫原子被取代為含有碳原子之取代基之情形時,碳原子數1~30係指氫原子被取代後之碳原子數,並非指氫原子被取代前之基之碳原子數。 又,特定碳原子數之基中之亞甲基被取代為二價基而成之基的碳原子數之規定與其取代前之基中所包含之碳原子數之規定相同。因此,碳原子數1~30之烴基中之亞甲基被取代為二價基而成之基之碳原子數亦滿足1~30。The above-mentioned monovalent hydrocarbon group with 1 to 30 carbon atoms, the above-mentioned monovalent hydrocarbon group with 1 to 30 carbon atoms, the above-mentioned divalent hydrocarbon group with 1 to 30 carbon atoms, and the above-mentioned divalent heterocyclic ring-containing group with 2 to 30 carbon atoms One or more hydrogen atoms in the heterocyclic ring formed by bonding between R 1 and R 2 and the heterocyclic ring formed by bonding between R 2 and adjacent nitrogen atoms and containing two nitrogen atoms may be substituted. As a substituted monovalent or divalent hydrocarbon group with a substituent, a monovalent or divalent heterocyclic group with a substituent, a heterocyclic ring formed by the bonding of R 1 and R 2 with a substituent, and R 2 and adjacent The substituent of the hydrogen atom in the heterocyclic ring containing 2 nitrogen atoms formed by the bonding of the nitrogen atom may, for example, be a halogen atom, a cyano group, a nitro group, a hydroxyl group, a thiol group, -COOH or -SO 2 H . As a halogen atom, fluorine, chlorine, bromine, iodine, etc. are mentioned. Furthermore, in this specification, when a hydrogen atom of a group with a specific number of carbon atoms is substituted with a substituent containing a carbon atom, the carbon atom of the substituent, including the carbon atom of the substituent, satisfies the requirement of the specific number of carbon atoms. Therefore, when a hydrocarbon with 1 to 30 carbon atoms is based on the case where the hydrogen atom in the group is substituted with a substituent containing carbon atoms, the number of carbon atoms from 1 to 30 refers to the number of carbon atoms after the hydrogen atom is substituted, and does not mean The number of carbon atoms in the group before the hydrogen atom is replaced. In addition, the number of carbon atoms in a group formed by substituting a methylene group with a specific number of carbon atoms with a divalent group is the same as the number of carbon atoms contained in the group before the substitution. Therefore, the number of carbon atoms of the group in which the methylene group in the hydrocarbon group having 1-30 carbon atoms is substituted with a divalent group also satisfies 1-30.

於本發明中,於n=1之情形時,式(A1)中之R1 及R2 較佳為分別獨立為氫原子、上述式(a)所表示之基、碳原子數1~30之一價烴基、或該烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,或者相互鍵結而形成雜環。 其中,R1 及R2 較佳為氫原子、上述式(a)所表示之基、有時具有取代基之碳原子數1~30之烷基、有時具有取代基之碳原子數2~30之含不飽和雙鍵基、或該含不飽和雙鍵基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,或者相互鍵結而形成雜環,尤佳為氫原子、上述式(a)所表示之基、有時具有取代基之碳原子數1~20之烷基、有時具有取代基之碳原子數2~20之含不飽和雙鍵基、或該含不飽和雙鍵基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,或者相互鍵結而形成雜環,其中,尤佳為氫原子、上述式(a)所表示之基、有時具有取代基之碳原子數1~10之烷基、有時具有取代基之碳原子數2~10之烯基或該烯基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,或者相互鍵結而形成雜環,其中,尤佳為氫原子、上述式(a)所表示之基、有時具有取代基之碳原子數1~4之烷基、或有時具有取代基之碳原子數3~10之烯基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,或者相互鍵結而形成雜環。其原因在於,上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 R1 及R2 所採用之含不飽和雙鍵基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基中,取代亞甲基之選自上述群(I)之二價基較佳為選自由-O-、-NR6 -(C=O)-O-、-CO-、及-(C=O)-O-所組成之群中之基,其中,較佳為包含-NR6 -(C=O)-O-,尤佳為包含-NR6 -(C=O)-O-及-(C=O)-O-。其原因在於,上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。In the present invention, when n=1, R 1 and R 2 in formula (A1) are preferably hydrogen atoms, the group represented by the above formula (a), and those with 1 to 30 carbon atoms. A monovalent hydrocarbon group or one or more methylene groups in the hydrocarbon group are substituted with a divalent group selected from the above group (I), or they are bonded to each other to form a heterocyclic ring. Among them, R 1 and R 2 are preferably a hydrogen atom, a group represented by the above formula (a), an alkyl group having 1 to 30 carbon atoms which may have a substituent, and a carbon atom number of 2 to which may have a substituent. 30 unsaturated double bond-containing groups, or one or more methylene groups in the unsaturated double bond-containing groups are substituted with divalent groups selected from the above group (I), or are bonded to each other It forms a heterocyclic ring, particularly preferably a hydrogen atom, a group represented by the above formula (a), a substituted alkyl group having 1 to 20 carbon atoms, and a substituted group containing 2 to 20 carbon atoms. Unsaturated double bond group, or one or more methylene groups in the unsaturated double bond-containing group are substituted with divalent groups selected from the above group (I), or are bonded to each other to form a heterocyclic ring Among them, a hydrogen atom, the group represented by the above formula (a), an alkyl group having 1 to 10 carbon atoms which may have a substituent, and an alkenyl group having 2 to 10 carbon atoms which may have a substituent are particularly preferable Or one or more methylene groups in the alkenyl group are substituted with divalent groups selected from the above group (I), or they are bonded to each other to form a heterocyclic ring. Among them, a hydrogen atom, the above-mentioned The group represented by the formula (a), the alkyl group having 1 to 4 carbon atoms which may have substituents, or the methylene group of one or more of the alkenyl groups having 3 to 10 carbon atoms which may have substituents It is substituted with a divalent group selected from the above group (I), or is bonded to each other to form a heterocyclic ring. The reason is that the above-mentioned polymerizable composition easily forms a coating material having excellent acid component capturing properties. One or more methylene groups in the unsaturated double bond-containing groups used by R 1 and R 2 are substituted with divalent groups selected from the above group (I), and the substituted methylene groups are selected from The divalent group of the above group (I) is preferably selected from the group consisting of -O-, -NR 6 -(C=O)-O-, -CO-, and -(C=O)-O- the group, which preferably comprises a -NR 6 - (C = O) -O- , particularly preferably comprising -NR 6 - (C = O) -O- and - (C = O) -O-. The reason is that the above-mentioned polymerizable composition easily forms a coating material having excellent acid component capturing properties.

於本發明中,於n=2之情形時,式(A1)中之R1 較佳為碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,其中,較佳為碳原子數1~30之二價烴基或該烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,尤其更佳為有時具有取代基之碳原子數1~30之伸烷基、該伸烷基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基(以下,稱為亞甲基取代伸烷基)、自有時具有取代基之碳原子數2~30之含不飽和雙鍵基去除1個氫原子而成之二價基、或自該含不飽和雙鍵基去除1個氫原子而成之二價基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成的基(以下,有時稱為二價亞甲基取代含不飽和雙鍵基),尤其進而較佳為碳原子數1~30之二價亞甲基取代含不飽和雙鍵基。其原因在於,上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 於R1 係有時具有取代基之含不飽和雙鍵基中去除1個氫原子而成之二價基、或上述含不飽和雙鍵基中之亞甲基被取代為選自上述群(I)之二價基而成的二價基之情形時,上述R1 較佳為支鏈基,其中,較佳為具有末端不飽和雙鍵結構之基。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 於R1 係二價烴基或該烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基之情形時,該烴基之碳原子數較佳為1~25,其中,較佳為3~20,尤佳為5~15。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 於R1 係有時具有取代基之伸烷基或有時具有取代基之亞甲基取代伸烷基之情形時,該伸烷基及該亞甲基取代伸烷基之碳原子數較佳為1~25,較佳為3~20,尤其更佳為5~15。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。又,其原因在於,這樣會使得上述聚合性組合物容易形成接著力較高之被覆材。In the present invention, when n=2, R 1 in formula (A1) is preferably a divalent hydrocarbon group having 1 to 30 carbon atoms, a divalent heterocyclic group containing 2 to 30 carbon atoms, or One or more methylene groups in the hydrocarbon group or the heterocyclic group are substituted with a divalent group selected from the above group (I), and among them, a divalent group having 1 to 30 carbon atoms is preferred A hydrocarbon group or a group in which one or more methylene groups in the hydrocarbon group are substituted with a divalent group selected from the above group (I), and it is particularly preferably a hydrocarbon group having 1 to 30 carbon atoms which may have substituents. An alkyl group, one or more methylene groups in the alkylene group is substituted with a divalent group selected from the above group (I) (hereinafter referred to as a methylene substituted alkylene group), own When having a substituent, a divalent group formed by removing one hydrogen atom from an unsaturated double bond-containing group with 2 to 30 carbon atoms, or a divalent group formed by removing one hydrogen atom from the unsaturated double bond-containing group One or more of the methylene groups are substituted with divalent groups selected from the above group (I) (hereinafter, sometimes referred to as divalent methylene substituted unsaturated double bond-containing groups), especially further Preferably, a divalent methylene group having 1 to 30 carbon atoms is substituted with an unsaturated double bond-containing group. The reason is that the above-mentioned polymerizable composition easily forms a coating material having excellent acid component capturing properties. The divalent group formed by removing one hydrogen atom from the unsaturated double bond-containing group which may have substituents in the R 1 system, or the methylene group in the above-mentioned unsaturated double bond-containing group is substituted to be selected from the above group ( In the case of a divalent group formed from the divalent group of I), the above-mentioned R 1 is preferably a branched group, and among them, a group having a terminal unsaturated double bond structure is preferable. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. When R 1 is a divalent hydrocarbon group or when one or more methylene groups in the hydrocarbon group are substituted with a divalent group selected from the above group (I), the number of carbon atoms of the hydrocarbon group is preferably 1-25, among them, 3-20 are preferred, and 5-15 are particularly preferred. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. When R 1 is an alkylene group sometimes having substituents or a methylene group substituted alkylene group sometimes having substituents, the number of carbon atoms of the alkylene group and the methylene substituted alkylene group is preferable It is 1-25, preferably 3-20, especially more preferably 5-15. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. In addition, the reason is that this makes it easy for the polymerizable composition to form a coating material with a high adhesive force.

於R1 係二價烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基之情形時,被選自該群(I)中之二價基取代的亞甲基之數量較佳為1~6,較佳為2~5。 於R1 係有時具有取代基之亞甲基取代伸烷基之情形時,被取代為選自上述群(I)之二價基的亞甲基之數量較佳為1~6,其中,較佳為2~5。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。When one or more methylene groups in the divalent hydrocarbon group of R 1 are substituted with a divalent group selected from the above group (I), it is selected from the divalent group (I) The number of methylene groups substituted by the group is preferably 1-6, more preferably 2-5. In the case where R 1 is a methylene substituted alkylene group sometimes having a substituent, the number of methylene groups substituted with a divalent group selected from the above group (I) is preferably 1 to 6, wherein, Preferably it is 2-5. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties.

又,於R1 係二價烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基之情形時,選自該群(I)中之二價基較佳為包含選自由-O-、-NR6 -(C=O)-O-、-CO-、-(C=O)-O-所組成之群中之至少1種基,其中,較佳為包含-O-。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。In addition, when one or more methylene groups in the divalent hydrocarbon group of R 1 are substituted with a group selected from the divalent group of the above group (I), it is selected from two of the group (I) The valence group preferably includes at least one group selected from the group consisting of -O-, -NR 6 -(C=O)-O-, -CO-, -(C=O)-O-, wherein , Preferably contains -O-. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties.

於本發明中,於n=2之情形時,式(A1)中之R2 較佳為氫原子、碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,或者與相鄰氮原子鍵結而形成含有2個氮原子之雜環,其中,R2 較佳為氫原子,或者與相鄰氮原子鍵結而形成含有2個氮原子之雜環,尤佳為氫原子。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 於R2 與相鄰氮原子、即經由R1 所鍵結之氮原子鍵結而形成具有2個氮之雜環之情形時,R2 可較佳地採用與上述化合物n為2時之R1 相同之基。於上述R2 形成含有2個氮原子之雜環之情形時,R2 較佳為有時具有取代基之含不飽和雙鍵基中去除1個氫原子而成之二價基、或上述烯基中之亞甲基被取代為選自上述群(I)之二價基而成之基。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。In the present invention, when n=2, R 2 in formula (A1) is preferably a hydrogen atom, a monovalent hydrocarbon group having 1 to 30 carbon atoms, and a monovalent heterocyclic ring containing 2 to 30 carbon atoms. Group, or one or more methylene groups in the hydrocarbon group or the heterocyclic group are substituted with divalent groups selected from the above group (I), or are bonded to adjacent nitrogen atoms to form a group containing A heterocyclic ring with 2 nitrogen atoms, wherein R 2 is preferably a hydrogen atom, or is bonded to an adjacent nitrogen atom to form a heterocyclic ring containing 2 nitrogen atoms, and a hydrogen atom is particularly preferred. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. When R 2 is bonded to an adjacent nitrogen atom, that is , a nitrogen atom bonded via R 1 to form a heterocyclic ring having two nitrogens, R 2 can preferably be the same as R when the above compound n is 2. 1 The same base. When the above-mentioned R 2 forms a heterocyclic ring containing 2 nitrogen atoms, R 2 is preferably a divalent group obtained by removing one hydrogen atom from an unsaturated double bond-containing group which may have a substituent, or the above-mentioned alkene The methylene group in the group is substituted with a divalent group selected from the group (I). The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties.

上述式(a)所表示之基中之X較佳為碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,其中,較佳為碳原子數1~30之二價烴基或碳原子數2~30之二價含雜環基,尤佳為碳原子數1~30之二價烴基,其中,尤其更佳為碳原子數1~30之伸烷基,其中,尤其進而較佳為碳原子數1~10之伸烷基,其中,尤其進而較佳為碳原子數1~4之伸烷基。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。又,其原因在於這樣容易獲得。 於X係碳原子數1~30之二價伸烷基之情形時,該伸烷基較佳為直鏈。又,該伸烷基可具有取代基,但較佳為不具有取代基。其原因在於這樣容易獲得。X in the group represented by the above formula (a) is preferably a divalent hydrocarbon group with 1 to 30 carbon atoms, a divalent heterocyclic group with 2 to 30 carbon atoms, or the hydrocarbon group or the heterocyclic group One or more methylene groups are substituted with divalent groups selected from the above group (I). Among them, a divalent hydrocarbon group with 1 to 30 carbon atoms or a divalent hydrocarbon group with 2 to 30 carbon atoms is preferred. The divalent heterocyclic group is particularly preferably a divalent hydrocarbon group having 1 to 30 carbon atoms, and among them, an alkylene group having 1 to 30 carbon atoms is particularly more preferred, and among these, a divalent hydrocarbon group having 1 to 30 carbon atoms is more preferred. The alkylene group of 10 is particularly preferably an alkylene group having 1 to 4 carbon atoms. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. Also, the reason is that it is so easy to obtain. When X is a divalent alkylene group having 1 to 30 carbon atoms, the alkylene group is preferably a straight chain. In addition, the alkylene group may have a substituent, but preferably has no substituent. The reason is that it is so easy to obtain.

上述式(A1)中之R3 及式(a)中之R5 為氫原子或甲基,較佳為氫原子。其原因在於,這樣會使得第1聚合性化合物之聚合速度較快。 上述式(a)中之R4 為氫原子或碳原子數1~30之烴基,較佳為氫原子。其原因在於,這樣會使得第1聚合性化合物之聚合速度較快。 上述式(A1)所表示之化合物中,於R2 及R3 、R4 、R5 及X存在複數個之情形時,存在複數個之R2 及R3 、R4 、R5 及X可分別相同,亦可不同,但就容易合成之觀點而言,較佳為相同。 R 3 in the above formula (A1) and R 5 in the formula (a) are a hydrogen atom or a methyl group, preferably a hydrogen atom. The reason is that this makes the polymerization rate of the first polymerizable compound faster. R 4 in the above formula (a) is a hydrogen atom or a hydrocarbon group having 1 to 30 carbon atoms, preferably a hydrogen atom. The reason is that this makes the polymerization rate of the first polymerizable compound faster. When the compound represented by the above formula (A1), the symbols R 2 and R 3, R 4, R 5 and X presence of a plurality of case, there are a plurality of R 2 and R 3, R 4, R 5 and X may be They are the same or different, but from the viewpoint of ease of synthesis, they are preferably the same.

於本發明中,就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,式(A1)所表示之化合物較佳為包含選自由下述化合物A1-1、化合物A1-2、化合物A1-3、化合物A1-4及化合物A1-5所組成之群中之至少1種化合物。 化合物A1-1:式(A1)中之n為1且R1 及R2 相互鍵結而形成雜環之化合物 化合物A1-2:式(A1)中之n為1且R1 及R2 分別獨立為氫原子、或有時具有取代基之碳原子數1~30之烷基、或該烷基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基的化合物 化合物A1-3:式(A1)中之n為1、R1 係氫原子且R2 係有時具有取代基之含不飽和雙鍵基、或該含不飽和雙鍵基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基的化合物 化合物A1-4:式(A1)中之n為1且R1 及R2 分別獨立為上述基(a)的化合物 化合物A1-5:式(A1)中之n為2、R1 係碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基且R2 係氫原子、碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基的化合物In the present invention, the compound represented by formula (A1) preferably contains a compound selected from the group consisting of the following compounds A1-1, A1-2, and compounds from the viewpoint of further improving the acid component capturing property of the obtained polymer At least one compound in the group consisting of A1-3, compound A1-4 and compound A1-5. Compound A1-1: The compound in formula (A1) where n is 1 and R 1 and R 2 are bonded to each other to form a heterocyclic ring. Compound A1-2: In formula (A1), n is 1 and R 1 and R 2 are respectively Independently a hydrogen atom, or an alkyl group having 1 to 30 carbon atoms that may have a substituent, or one or more methylene groups in the alkyl group are substituted with a divalent group selected from the above group (I), and Compound A1-3: In formula (A1), n is 1, R 1 is a hydrogen atom and R 2 is an unsaturated double bond-containing group which may have substituents, or the unsaturated double bond-containing group Compounds in which one or more methylene groups are substituted with divalent groups selected from the above group (I) Compound A1-4: In formula (A1), n is 1 and R 1 and R 2 are respectively Compound A1-5 independently of the above group (a): n in formula (A1) is 2, R 1 is a divalent hydrocarbon group with 1-30 carbon atoms, and a divalent heterocyclic ring-containing group with 2-30 carbon atoms One or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with a divalent group selected from the above group (I), and R 2 is a hydrogen atom and has a carbon number of 1 to A 30 monovalent hydrocarbon group, a monovalent heterocyclic group containing 2 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with two selected from the above group (I) Valence base compound

其中,於本發明中,上述丙烯醯胺化合物較佳為包含上述化合物A1-1。 作為上述化合物A1-1之含量,上述丙烯醯胺化合物100質量份中,較佳為30質量份以上,其中,較佳為40質量份以上,尤佳為50質量份以上,其中,尤佳為60質量份以上,其中,尤佳為70質量份以上,其中,尤佳為80質量份以上,其中,尤佳為90質量份以上,其中,尤佳為100質量份。其原因在於,藉由使上述化合物A1-1之含量處於上述範圍內,上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。Among them, in the present invention, the above-mentioned acrylamide compound preferably includes the above-mentioned compound A1-1. As the content of the compound A1-1, in 100 parts by mass of the acrylamide compound, 30 parts by mass or more are preferable, among them, 40 parts by mass or more are preferable, and 50 parts by mass or more are more preferable, and among them, more preferably 60 parts by mass or more, particularly preferably 70 parts by mass or more, particularly preferably 80 parts by mass or more, particularly preferably 90 parts by mass or more, and particularly preferably 100 parts by mass. The reason is that, by setting the content of the compound A1-1 in the above range, the polymerizable composition can easily form a coating material having excellent acid component trapping properties.

上述化合物A1-1中,雜環較佳為含有氮原子、除氮原子以外之雜原子及碳原子之環,較佳為含有氮原子、氧原子及碳原子之環。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異且接著力較高之被覆材。又,該雜環較佳為五員環或六員環,更佳為六員環。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異且接著力較高之被覆材。又,其原因在於這樣容易獲得。 關於上述雜環,環中之1個以上之氫原子可被取代基取代,但較佳為未經取代者。其原因在於,這樣會使得所獲得之聚合物之酸成分捕捉性進一步提高。又,其原因在於這樣容易獲得。 作為用作上述化合物A1-1之化合物,具體而言,可例舉下述式(A1-1)所表示之化合物。In the above compound A1-1, the heterocyclic ring is preferably a ring containing a nitrogen atom, a heteroatom other than a nitrogen atom, and a carbon atom, and is preferably a ring containing a nitrogen atom, an oxygen atom, and a carbon atom. The reason is that this makes it easy for the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness. Furthermore, the heterocyclic ring is preferably a five-membered ring or a six-membered ring, more preferably a six-membered ring. The reason is that this makes it easy for the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness. Also, the reason is that it is so easy to obtain. Regarding the above-mentioned heterocyclic ring, one or more hydrogen atoms in the ring may be substituted by a substituent, but it is preferably unsubstituted. The reason is that this will further improve the acid component trapping properties of the obtained polymer. Also, the reason is that it is so easy to obtain. As a compound used as said compound A1-1, the compound represented by following formula (A1-1) can be mentioned specifically,.

上述化合物A1-2中,於採用有時具有取代基之碳原子數1~30之烷基、或該烷基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基作為R1 及R2 中任一者之情形時,上述烷基之碳原子數較佳為1~20,較佳為1~10,尤佳為1~4。又,該烷基可為直鏈,亦可為支鏈。該烷基可經取代,亦可未經取代,較佳為未經取代。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 上述化合物A1-2中,R1 及R2 分別獨立為氫原子、或有時具有取代基之碳原子數1~30之烷基、或該烷基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基。 作為R1 或R2 之較佳組合之例,較佳為下述例。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 ・組合1:R1 及R2 分別獨立為直鏈烷基,其中,較佳為碳原子數1~20之直鏈烷基,尤佳為碳原子數1~10之直鏈烷基,其中,尤佳為碳原子數1~4之直鏈烷基。該烷基較佳為未經取代。其原因在於,這樣會使得所獲得之聚合物之酸成分捕捉性進一步提高。又,其原因在於這樣容易獲得。 ・組合2:R1 為氫原子,R2 為支鏈烷基,其中,R2 較佳為碳原子數1~20之支鏈烷基,尤佳為碳原子數1~10之支鏈烷基,其中,尤佳為碳原子數1~4之支鏈烷基。該烷基較佳為未經取代。其原因在於,這樣會使得所獲得之聚合物之酸成分捕捉性進一步提高。又,其原因在於這樣容易獲得。 作為用作上述化合物A1-2之化合物,具體而言,可例舉下述式(A1-2)、式(A1-3)、(A1-4)所表示之化合物。In the above compound A1-2, an alkyl group having 1 to 30 carbon atoms which may have a substituent is used, or one or more methylene groups in the alkyl group are substituted with two selected from the above group (I) When the group formed of a valence group is any one of R 1 and R 2 , the number of carbon atoms of the above-mentioned alkyl group is preferably 1-20, more preferably 1-10, and particularly preferably 1-4. In addition, the alkyl group may be linear or branched. The alkyl group may be substituted or unsubstituted, and is preferably unsubstituted. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. In the above compound A1-2, R 1 and R 2 are each independently a hydrogen atom, or an alkyl group having 1 to 30 carbon atoms which may have a substituent, or one or more methylene groups in the alkyl group are substituted It is a group selected from the divalent group of the above group (I). As examples of preferable combinations of R 1 or R 2 , the following examples are preferable. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties.・Combination 1: R 1 and R 2 are each independently a linear alkyl group. Among them, a linear alkyl group with 1 to 20 carbon atoms is preferred, and a linear alkyl group with 1 to 10 carbon atoms is particularly preferred. , Particularly preferably a straight chain alkyl group with 1 to 4 carbon atoms. The alkyl group is preferably unsubstituted. The reason is that this will further improve the acid component trapping properties of the obtained polymer. Also, the reason is that it is so easy to obtain.・Combination 2: R 1 is a hydrogen atom, R 2 is a branched alkyl group, wherein R 2 is preferably a branched alkyl group with 1 to 20 carbon atoms, and particularly preferably a branched alkyl group with 1 to 10 carbon atoms Among them, a branched alkyl group having 1 to 4 carbon atoms is particularly preferred. The alkyl group is preferably unsubstituted. The reason is that this will further improve the acid component trapping properties of the obtained polymer. Also, the reason is that it is so easy to obtain. As a compound used as the said compound A1-2, the compound represented by following formula (A1-2), a formula (A1-3), and (A1-4) can be mentioned specifically,.

作為上述化合物A1-3中之R2 所採用之含不飽和雙鍵基中所包含之不飽和雙鍵之數量,只要為1以上即可,較佳為1~2,尤佳為1。其原因在於,藉由設為上述數量,容易獲得上述化合物。 作為上述化合物A1-3中之R2 ,亦可較佳地採用有時具有取代基之含不飽和雙鍵基、或上述含不飽和雙鍵基中之亞甲基被取代為選自上述群(I)之二價基而成之基(以下,有時簡單記為亞甲基取代含不飽和雙鍵基)中任一種基,其中,較佳為未經取代之含不飽和雙鍵基中之亞甲基被取代為選自上述群(I)之二價基而成之基。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 就所獲得之聚合物之酸成分捕捉性進一步提高之觀點而言,R2 所採用之含不飽和雙鍵基或亞甲基取代含不飽和雙鍵基之碳原子數較佳為2~20,更佳為2~10。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 R2 所採用之含不飽和雙鍵基或亞甲基取代含不飽和雙鍵基較佳為具有末端不飽和雙鍵結構之基,即末端具有不飽和雙鍵。 該末端不飽和雙鍵結構可為直鏈狀,亦可為支鏈狀,較佳為直鏈狀。其原因在於,這樣會使得上述化合物A1-3之聚合速度較快。 該亞甲基取代含不飽和雙鍵基較佳為2個以上之亞甲基被取代為選自上述群(I)之二價基。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 將該亞甲基取代含不飽和雙鍵基中之亞甲基取代的二價基較佳為選自-O-、-NR6 -(C=O)-O-、-CO-、-(C=O)-O-之群中之基,其中,較佳為包含-NR6 -(C=O)-O-。R6 較佳為氫原子。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 作為此種化合物A1-3之具體例,可例舉下述(1-1)~(1-15)所表示之化合物。The number of unsaturated double bonds contained in the unsaturated double bond-containing group used in R 2 in the above compound A1-3 may be 1 or more, preferably 1 to 2, and particularly preferably 1. The reason is that, by setting the above-mentioned amount, the above-mentioned compound can be easily obtained. As R 2 in the above compound A1-3, an unsaturated double bond-containing group sometimes having a substituent, or the methylene group in the above unsaturated double bond-containing group is substituted to be selected from the above group (I) Any of the divalent groups (hereinafter, sometimes simply referred to as methylene-substituted unsaturated double bond-containing groups). Among them, unsubstituted unsaturated double bond-containing groups are preferred The methylene group in is substituted with a divalent group selected from the above group (I). The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. From the viewpoint of further improvement of the acid component capturing property of the obtained polymer, the number of carbon atoms of the unsaturated double bond-containing group or methylene-substituted unsaturated double bond-containing group used in R 2 is preferably 2-20 , More preferably 2~10. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. The unsaturated double bond-containing group or methylene-substituted unsaturated double bond-containing group used by R 2 is preferably a group having a terminal unsaturated double bond structure, that is, an unsaturated double bond at the end. The terminal unsaturated double bond structure may be linear or branched, preferably linear. The reason is that this will make the polymerization rate of the above-mentioned compound A1-3 faster. The methylene-substituted unsaturated double bond-containing group is preferably two or more methylene groups substituted with a divalent group selected from the above group (I). The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. The methylene substituted divalent group substituted by the methylene group in the unsaturated double bond-containing group is preferably selected from -O-, -NR 6 -(C=O)-O-, -CO-, -( The base in the group of C=O)-O-, wherein, preferably includes -NR 6 -(C=O)-O-. R 6 is preferably a hydrogen atom. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. As a specific example of such a compound A1-3, the compounds represented by the following (1-1) to (1-15) can be mentioned.

[化3]

Figure 02_image005
[化3]
Figure 02_image005

[化4]

Figure 02_image007
[化4]
Figure 02_image007

[化5]

Figure 02_image009
[化5]
Figure 02_image009

[化6]

Figure 02_image011
[化6]
Figure 02_image011

[化7]

Figure 02_image013
[化7]
Figure 02_image013

[化8]

Figure 02_image015
[化8]
Figure 02_image015

[化9]

Figure 02_image017
[化9]
Figure 02_image017

[化10]

Figure 02_image019
[化10]
Figure 02_image019

[化11]

Figure 02_image021
[化11]
Figure 02_image021

[化12]

Figure 02_image023
[化12]
Figure 02_image023

[化13]

Figure 02_image025
[化13]
Figure 02_image025

[化14]

Figure 02_image027
[化14]
Figure 02_image027

[化15]

Figure 02_image029
[化15]
Figure 02_image029

[化16]

Figure 02_image031
[化16]
Figure 02_image031

[化17]

Figure 02_image033
[化17]
Figure 02_image033

又,作為用作上述化合物A1-3之化合物,具體而言,亦可例舉下述式(A1-7)所表示之化合物。In addition, as a compound used as the above-mentioned compound A1-3, specifically, a compound represented by the following formula (A1-7) may also be exemplified.

上述化合物A1-4中,式(a)中之R4 較佳為氫原子。式(a)中之X較佳為碳原子數1~30之二價烴基或碳原子數2~30之二價含雜環基,更佳為碳原子數1~30之伸烷基,進而較佳為碳原子數1~10之伸烷基,進而較佳為碳原子數1~4之伸烷基。該伸烷基較佳為直鏈。又,該伸烷基較佳為不具有取代基。 作為用作上述化合物A1-4之化合物,具體而言,可例舉下述式(A1-6)所表示之化合物。In the above compound A1-4, R 4 in the formula (a) is preferably a hydrogen atom. X in the formula (a) is preferably a divalent hydrocarbon group having 1 to 30 carbon atoms or a divalent heterocyclic group containing 2 to 30 carbon atoms, more preferably an alkylene group having 1 to 30 carbon atoms, and further It is preferably an alkylene group having 1 to 10 carbon atoms, and more preferably an alkylene group having 1 to 4 carbon atoms. The alkylene group is preferably straight chain. In addition, the alkylene group preferably does not have a substituent. As a compound used as the said compound A1-4, the compound represented by following formula (A1-6) can be mentioned specifically,.

上述化合物A1-5中,R1 較佳為碳原子數1~30之二價烴基、或該烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基,其中,更佳為有時具有取代基之碳原子數1~30之伸烷基、或該伸烷基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基(以下,稱為亞甲基取代伸烷基)、或自有時具有取代基之碳原子數2~30之含不飽和雙鍵基去除1個氫原子而成之二價基(以下,有時稱為二價含不飽和雙鍵基)、或自上述含不飽和雙鍵基去除1個氫原子而成之二價基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成的基(以下,有時稱為二價亞甲基取代含不飽和雙鍵基),尤其進而較佳為碳原子數1~30之亞甲基取代伸烷基。其原因在於,上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。又,容易獲得。 再者,下述式(1-16)~(1-22)所表示之化合物表示如下之例:R1 係自有時具有取代基之含不飽和雙鍵基中之亞甲基被取代為選自上述群(I)之二價基而成之基去除1個氫原子而成的二價基,係支鏈基,且係具有末端不飽和雙鍵結構之基。又,表示R1 係具有2個末端不飽和雙鍵結構之基之例。 上述化合物A1-5中,於R1 為二價烴基之情形時,該烴基之碳原子數較佳為1~25,其中,較佳為3~20,尤佳為5~15。 於R1 係有時具有取代基之伸烷基或有時具有取代基之亞甲基取代伸烷基之情形時,該伸烷基及該亞甲基取代伸烷基之碳原子數較佳為1~25,較佳為3~20,尤其更佳為5~15。其原因在於,上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。又,上述聚合性組合物容易形成具有較高之接著力之被覆材。 於上述化合物A1-5中所使用之R1 係二價烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基之情形時,被選自該群(I)中之二價基取代的亞甲基之數量較佳為1~6,較佳為2~5。 於上述化合物A1-5中所使用之R1 係有時具有取代基之亞甲基取代伸烷基之情形時,被取代為選自上述群(I)之二價基的亞甲基之數量較佳為1~6,其中,較佳為2~5。又,於上述化合物A1-5中所使用之R1 係二價烴基,係該烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基之情形時,上述二價基較佳為包含選自-O-、-NR6 -(C=O)-O-、-CO-、-(C=O)-O-中之至少1種基,其中,較佳為包含-O-。其原因在於,這樣會使得上述聚合性組合物容易形成酸成分捕捉性優異之被覆材。 上述化合物A1-5中,較佳為R2 係氫原子,R1 係有時具有取代基之伸烷基或有時具有取代基之亞甲基取代伸烷基,將該亞甲基取代伸烷基中之亞甲基取代的二價基包含-O-。作為此種化合物A1-5,例如亦可例舉下述式(A1-5)所表示之化合物。 上述化合物A1-5中,亦可較佳地使用R2 為氫原子,或者R2 與相鄰氮原子、即經由R1 所鍵結之氮原子鍵結而形成具有2個氮之雜環者。 作為此種化合物A1-5之具體例,例如可例舉下述式(1-16)~(1-22)所表示之化合物。In the above compound A1-5, R 1 is preferably a divalent hydrocarbon group having 1 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group are substituted with a divalent group selected from the above group (I). Among them, it is more preferred that an alkylene group having 1 to 30 carbon atoms which may have a substituent, or one or more methylene groups in the alkylene group are substituted to be selected from the above group (I) A divalent group (hereinafter referred to as a methylene substituted alkylene group), or an unsaturated double bond-containing group with 2 to 30 carbon atoms that may have substituents by removing one hydrogen atom The divalent group (hereinafter, sometimes referred to as a divalent unsaturated double bond-containing group), or one or more methylene groups in the divalent group formed by removing one hydrogen atom from the above-mentioned unsaturated double bond-containing group A group substituted with a divalent group selected from the above group (I) (hereinafter, sometimes referred to as a divalent methylene-substituted unsaturated double bond-containing group), particularly preferably having 1 to 30 carbon atoms The methylene substituted alkylene. The reason is that the above-mentioned polymerizable composition easily forms a coating material having excellent acid component capturing properties. Also, easy to obtain. In addition, the compounds represented by the following formulas (1-16) to (1-22) represent the following examples: R 1 is substituted with a methylene group in an unsaturated double bond-containing group which may have a substituent The divalent group formed by removing one hydrogen atom from the divalent group selected from the above group (I) is a branched group and a group having a terminal unsaturated double bond structure. In addition, it shows an example in which R 1 is a group having two terminal unsaturated double bond structures. In the above compound A1-5, when R 1 is a divalent hydrocarbon group, the number of carbon atoms of the hydrocarbon group is preferably 1-25, of which 3-20 is preferred, and 5-15 is particularly preferred. When R 1 is an alkylene group sometimes having substituents or a methylene group substituted alkylene group sometimes having substituents, the number of carbon atoms of the alkylene group and the methylene substituted alkylene group is preferable It is 1-25, preferably 3-20, especially more preferably 5-15. The reason is that the above-mentioned polymerizable composition easily forms a coating material having excellent acid component capturing properties. In addition, the above-mentioned polymerizable composition is easy to form a coating material having a high adhesive force. When one or more methylene groups in the R 1 divalent hydrocarbon group used in the above compound A1-5 are substituted with a group selected from the divalent group of the above group (I), it is selected from The number of methylene groups substituted by divalent groups in the group (I) is preferably 1-6, more preferably 2-5. When R 1 used in the above compound A1-5 is sometimes substituted with a substituted methylene group, the number of methylene groups substituted with the divalent group selected from the above group (I) Preferably it is 1-6, and among them, it is preferably 2-5. In addition, R 1 used in the above compound A1-5 is a divalent hydrocarbon group in which one or more methylene groups in the hydrocarbon group are substituted with a divalent group selected from the above group (I) In case, the above-mentioned divalent group preferably contains at least one group selected from -O-, -NR 6 -(C=O)-O-, -CO-, -(C=O)-O-, Among them, it is preferable to include -O-. The reason for this is that this makes it easy for the polymerizable composition to form a coating material with excellent acid trapping properties. In the above compound A1-5, R 2 is preferably a hydrogen atom, and R 1 is an alkylene group sometimes having a substituent or a methylene-substituted alkylene group sometimes having a substituent, and the methylene group is substituted for the alkylene group. The divalent group substituted by the methylene group in the alkyl group includes -O-. As such a compound A1-5, for example, a compound represented by the following formula (A1-5) can also be exemplified. Among the above compounds A1-5, R 2 is a hydrogen atom, or R 2 is bonded to an adjacent nitrogen atom, that is , a nitrogen atom bonded via R 1 to form a heterocyclic ring with two nitrogens. . As a specific example of such a compound A1-5, the compound represented by following formula (1-16)-(1-22) is mentioned, for example.

[化18]

Figure 02_image035
[化18]
Figure 02_image035

[化19]

Figure 02_image037
[化19]
Figure 02_image037

[化20]

Figure 02_image039
[化20]
Figure 02_image039

[化21]

Figure 02_image041
[化21]
Figure 02_image041

[化22]

Figure 02_image043
[化22]
Figure 02_image043

[化23]

Figure 02_image045
[化23]
Figure 02_image045

[化24]

Figure 02_image047
[化24]
Figure 02_image047

上述各種丙烯醯胺可單獨使用1種,或者將2種以上組合使用。The above-mentioned various acrylamides can be used individually by 1 type or in combination of 2 or more types.

(2)胺基甲酸酯化合物 上述胺基甲酸酯化合物係具有胺基甲酸酯鍵及乙烯性不飽和基之化合物。 再者,包含胺基甲酸酯鍵、進而具有醯胺基與乙烯性不飽和基直接鍵結之結構的化合物屬於丙烯醯胺化合物,不包括在胺基甲酸酯化合物內。(2) Urethane compound The aforementioned urethane compound is a compound having a urethane bond and an ethylenically unsaturated group. Furthermore, compounds containing a urethane bond and further having a structure in which an amide group and an ethylenically unsaturated group are directly bonded are acrylamide compounds and are not included in the urethane compound.

胺基甲酸酯化合物中所包含之乙烯性不飽和基之數量只要為1以上即可,較佳為2以上20以下,更佳為2以上15以下,進而較佳為3以上10以下。其原因在於,這樣會使得聚合性組合物容易形成酸成分捕捉性優異且接著力較高之被覆材。The number of ethylenically unsaturated groups contained in the urethane compound may be 1 or more, preferably 2 or more and 20 or less, more preferably 2 or more and 15 or less, and still more preferably 3 or more and 10 or less. The reason is that this makes it easy for the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness.

胺基甲酸酯化合物之中,就聚合反應容易進行,易獲得性優異之方面而言,較佳為乙烯性不飽和基為丙烯酸酯基或甲基丙烯酸酯基之丙烯酸胺基甲酸酯或甲基丙烯酸胺基甲酸酯。Among the urethane compounds, in terms of easy progress of the polymerization reaction and excellent availability, the ethylenically unsaturated group is preferably an acrylic urethane or methacrylate group. Methacrylate urethane.

胺基甲酸酯化合物之分子量只要能夠獲得所需之酸成分捕捉性及接著力即可,較佳為200以上30000以下,更佳為300以上10000以下,進而較佳為400以上5000以下。其原因在於,這樣能夠使得聚合性組合物形成酸成分捕捉性優異且接著力較高之被覆材。The molecular weight of the urethane compound should just be able to obtain the required acid component trapping properties and adhesive force, and is preferably 200 or more and 30,000 or less, more preferably 300 or more and 10,000 or less, and still more preferably 400 or more and 5,000 or less. The reason is that this allows the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness.

作為可較佳地用於本發明中之胺基甲酸酯化合物,例如可例舉下述式(10)或(11)所表示之化合物。As the urethane compound that can be preferably used in the present invention, for example, a compound represented by the following formula (10) or (11) can be mentioned.

[化25]

Figure 02_image049
[化25]
Figure 02_image049

式中,R11 、R12 及R13 分別獨立地表示碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(Ia)之二價基而成之基, R11 、R12 或R13 中之至少1個基中,1個以上之氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基, X1 、X2 及X3 分別獨立地表示碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(Ia)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(Ia)之二價基之情形時,該二價基不相鄰。 群(Ia):-O-、-S-、-NR14 -、-NR14 -(C=O)-O-、-CO-、-(C=O)-O-、-O-(C=O)-、-O-(C=O)-O- R14 表示氫原子或碳原子數1~30之一價烴基。In the formula, R 11 , R 12 and R 13 each independently represent a monovalent hydrocarbon group having 1 to 30 carbon atoms, a monovalent heterocyclic group containing 2 to 30 carbon atoms, or the hydrocarbon group or the heterocyclic group containing One or more methylene groups are substituted with divalent groups selected from the following group (Ia), and at least one of R 11 , R 12 or R 13 has one or more hydrogen atoms Is substituted with an acrylate group or a methacrylate group, X 1 , X 2 and X 3 each independently represent a divalent hydrocarbon group with 1 to 30 carbon atoms, a divalent heterocyclic group containing 2 to 30 carbon atoms, Or one or more methylene groups in the hydrocarbon group or the heterocyclic group are substituted with a divalent group selected from the following group (Ia), wherein two or more methylene groups are substituted In the case of a divalent group selected from the following group (Ia), the divalent group is not adjacent. Group (Ia): -O-, -S-, -NR 14 -, -NR 14 -(C=O)-O-, -CO-, -(C=O)-O-, -O-(C =O)-, -O-(C=O)-O- R 14 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms.

[化26]

Figure 02_image051
[化26]
Figure 02_image051

式中,R15 及R16 分別獨立地表示碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(Ib)之二價基而成之基, R15 或R16 中之至少1個基中,1個以上之氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基, X4 表示碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(Ib)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(Ib)之二價基之情形時,該二價基不相鄰。 群(Ib):-O-、-S-、-NR17 -、-NR17 -(C=O)-O-、-CO-、-(C=O)-O-、-O-(C=O)-、-O-(C=O)-O- R17 表示氫原子或碳原子數1~30之一價烴基。In the formula, R 15 and R 16 each independently represent a monovalent hydrocarbon group having 1 to 30 carbon atoms, a monovalent heterocyclic group containing 2 to 30 carbon atoms, or one of the hydrocarbon group or the heterocyclic group containing The above methylene group is substituted with a divalent group selected from the following group (Ib), in which at least one of R 15 or R 16 is substituted with an acrylate group Or a methacrylate group, X 4 represents a divalent hydrocarbon group with 1 to 30 carbon atoms, a divalent heterocyclic group with 2 to 30 carbon atoms, or one or more of the hydrocarbon group or the heterocyclic group The methylene group is substituted with a divalent group selected from the following group (Ib), wherein two or more methylene groups are substituted with a divalent group selected from the following group (Ib) When, the divalent groups are not adjacent. Group (Ib): -O-, -S-, -NR 17 -, -NR 17 -(C=O)-O-, -CO-, -(C=O)-O-, -O-(C =O)-, -O-(C=O)-O- R 17 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms.

作為式(10)中之R11 、R12 、R13 及R14 所表示之碳原子數1~30之一價烴基,可與上述式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數1~30之一價烴基相同。 作為式(10)中之R11 、R12 及R13 所表示之碳原子數2~30之一價含雜環基,可與上述式(A1)中之R1 、R2 及R4 所表示之碳原子數1~30之碳原子數2~30之一價含雜環基相同。 再者,式(10)中之R11 、R12 及R13 所採用之碳原子數1~30之一價烴基及碳原子數1~30之碳原子數2~30之一價含雜環基可包含該基內部具有不飽和雙鍵之內部烯基結構、末端具有不飽和鍵之末端烯基結構等烯基結構,但通常不包含烯基結構。 作為式(10)中之X1 、X2 及X3 所表示之碳原子數1~30之二價烴基及碳原子數2~30之二價含雜環基,可與式(A1)中之R1 及X所表示之碳原子數1~30之二價烴基及碳原子數2~30之二價含雜環基相同。As the monovalent hydrocarbon group with 1 to 30 carbon atoms represented by R 11 , R 12 , R 13 and R 14 in formula (10), it can be combined with R 1 , R 2 , R 4 and R 4 in the above formula (A1) The monovalent hydrocarbon groups with 1 to 30 carbon atoms represented by R 6 are the same. As the monovalent heterocyclic group containing 2 to 30 carbon atoms represented by R 11 , R 12 and R 13 in formula (10), it can be combined with R 1 , R 2 and R 4 in formula (A1). The indicated monovalent heterocyclic group containing 1-30 carbon atoms and 2-30 carbon atoms is the same. Furthermore, the monovalent hydrocarbon group with 1-30 carbon atoms and the monovalent heterocyclic ring-containing group with 1-30 carbon atoms and 2-30 carbon atoms used for R 11 , R 12 and R 13 in formula (10) The group may include an alkenyl structure such as an internal alkenyl structure having an unsaturated double bond inside the group, a terminal alkenyl structure having an unsaturated bond at the end, but usually does not include an alkenyl structure. As the divalent hydrocarbon group with 1 to 30 carbon atoms and the divalent heterocyclic group with 2 to 30 carbon atoms represented by X 1 , X 2 and X 3 in the formula (10), it can be combined with the formula (A1) The divalent hydrocarbon group having 1 to 30 carbon atoms and the divalent heterocyclic group containing 2 to 30 carbon atoms represented by R 1 and X are the same.

作為式(11)中之R15 、R16 及R17 所表示之碳原子數1~30之一價烴基,可與上述式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數1~30之一價烴基相同。 作為式(11)中之R15 及R16 所表示之碳原子數2~30之一價含雜環基,可與上述式(A1)中之R1 、R2 及R4 所表示之碳原子數1~30之碳原子數2~30之一價含雜環基相同。 再者,式(11)中之R15 及R16 所採用之碳原子數1~30之一價烴基及碳原子數1~30之碳原子數2~30之一價含雜環基可包含該基內部具有不飽和鍵之內部烯基結構、末端具有不飽和鍵之末端烯基結構等烯基結構,但通常不包含烯基結構。 作為式(11)中之X4 所表示之碳原子數1~30之二價烴基及碳原子數2~30之二價含雜環基,可與式(A1)中之R1 及X所表示之碳原子數1~30之二價烴基及碳原子數2~30之二價含雜環基相同。As the monovalent hydrocarbon group with 1 to 30 carbon atoms represented by R 15 , R 16 and R 17 in the formula (11), it can be combined with R 1 , R 2 , R 4 and R 6 in the above formula (A1) The indicated monovalent hydrocarbon groups with 1 to 30 carbon atoms are the same. As the monovalent heterocyclic group containing 2 to 30 carbon atoms represented by R 15 and R 16 in the formula (11), it can be combined with the carbon represented by R 1 , R 2 and R 4 in the above formula (A1) The monovalent heterocyclic group having 1 to 30 carbon atoms and 2 to 30 carbon atoms is the same. Furthermore, the monovalent hydrocarbon group with 1-30 carbon atoms and the monovalent heterocyclic group with 2-30 carbon atoms with 1-30 carbon atoms used in R 15 and R 16 in formula (11) may include The group has an alkenyl structure such as an internal alkenyl structure having an unsaturated bond inside, and a terminal alkenyl structure having an unsaturated bond at the end, but usually does not include an alkenyl structure. As the divalent hydrocarbon group with 1 to 30 carbon atoms and the divalent heterocyclic group with 2 to 30 carbon atoms represented by X 4 in formula (11), it can be combined with R 1 and X in formula (A1) The indicated divalent hydrocarbon group having 1 to 30 carbon atoms and the divalent heterocyclic ring-containing group having 2 to 30 carbon atoms are the same.

於本發明中,式(10)中之R11 、R12 及R13 較佳為碳原子數1~30之一價烴基、或該烴基中之1個以上之亞甲基被取代為上述群(Ia)而成之基,更佳為有時具有取代基之碳原子數1~30之烷基、或該烷基中之1個以上之亞甲基被取代為上述群(Ia)而成之基(亞甲基取代烷基),進而較佳為有時具有取代基之碳原子數1~30之亞甲基取代烷基。其原因在於,這樣會使得容易形成酸成分捕捉性優異且接著力較高之被覆材。 於R11 、R12 及R13 為烷基或亞甲基取代烷基之情形時,就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,該烷基或該亞甲基取代烷基之碳原子數較佳為1~20,更佳為2~10,更佳為3~8。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,較佳為該烷基或該亞甲基取代烷基之2個以上之氫原子被丙烯酸酯基或甲基丙烯酸酯基取代,更佳為2~7個氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基,更佳為3~6個氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,較佳為R11 、R12 及R13 皆被取代為丙烯酸酯基或甲基丙烯酸酯基。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,將亞甲基取代烷基中之亞甲基取代的二價基較佳為包含-O-。In the present invention, R 11 , R 12 and R 13 in formula (10) are preferably a monovalent hydrocarbon group having 1 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group are substituted with the above group The group formed by (Ia) is more preferably an alkyl group having 1 to 30 carbon atoms which may have a substituent, or one or more methylene groups in the alkyl group are substituted with the above group (Ia) The group (methylene-substituted alkyl group) is more preferably a methylene-substituted alkyl group having 1 to 30 carbon atoms which may have a substituent. The reason is that this makes it easy to form a coating material that has excellent acid trapping properties and high adhesiveness. When R 11 , R 12, and R 13 are alkyl groups or methylene substituted alkyl groups, from the viewpoint of easily forming a coating material with excellent acid trapping properties and high adhesiveness, the alkyl group or the alkyl group The number of carbon atoms of the methyl-substituted alkyl group is preferably 1-20, more preferably 2-10, and still more preferably 3-8. From the viewpoint of easily forming a coating material with excellent acid trapping properties and high adhesive force, it is preferable that two or more hydrogen atoms of the alkyl group or the methylene substituted alkyl group are acrylate groups or methacrylic acid groups. Ester group substitution, more preferably 2-7 hydrogen atoms are substituted with acrylate group or methacrylate group, and more preferably 3-6 hydrogen atoms are substituted with acrylate group or methacrylate group. From the viewpoint of easily forming a coating material having excellent acid component capturing properties and high adhesiveness, it is preferable that all of R 11 , R 12 and R 13 are substituted with an acrylate group or a methacrylate group. From the viewpoint of easily forming a coating material having excellent acid component capturing properties and high adhesiveness, the divalent group substituted by the methylene group in the methylene substituted alkyl group preferably contains -O-.

於本發明中,式(11)中之R15 及R16 較佳為碳原子數1~30之一價烴基,更佳為有時具有取代基之碳原子數1~30之烷基。其原因在於,這樣會使得容易形成酸成分捕捉性優異且接著力較高之被覆材。於R15 及R16 係有時具有取代基之烷基之情形時,就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,該烷基之碳原子數較佳為1~20,更佳為2~15。該烷基更佳為支鏈狀。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,較佳為該烷基中之1~5個氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基,較佳為2~4個氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,較佳為R15 及R16 皆被取代為丙烯酸酯基或甲基丙烯酸酯基。 又,式(11)中之X4 較佳為碳原子數1~30之二價烴基,更佳為有時具有取代基之碳原子數6~30之伸芳基,進而較佳為有時具有取代基之碳原子數6~20之伸芳基,尤佳為伸苯基或甲伸苯基。其原因在於,這樣會使得容易形成酸成分捕捉性優異且接著力較高之被覆材。 In the present invention, R 15 and R 16 in the formula (11) are preferably a monovalent hydrocarbon group having 1 to 30 carbon atoms, and more preferably an alkyl group having 1 to 30 carbon atoms which may have a substituent. The reason is that this makes it easy to form a coating material that has excellent acid trapping properties and high adhesiveness. In the case where R 15 and R 16 are alkyl groups that may have substituents, from the viewpoint of easily forming a coating material with excellent acid trapping properties and high adhesiveness, the number of carbon atoms of the alkyl group is preferably 1-20, more preferably 2-15. The alkyl group is more preferably branched. From the viewpoint of easily forming a coating material with excellent acid trapping properties and high adhesion, it is preferable that 1 to 5 hydrogen atoms in the alkyl group are substituted with acrylate groups or methacrylate groups, and more preferably 2 to 4 hydrogen atoms are substituted with acrylate groups or methacrylate groups. From the viewpoint of easily forming a coating material having excellent acid component capturing properties and high adhesiveness, it is preferable that both R 15 and R 16 are substituted with an acrylate group or a methacrylate group. In addition, X 4 in the formula (11) is preferably a divalent hydrocarbon group having 1 to 30 carbon atoms, more preferably an arylene group having 6 to 30 carbon atoms that may have a substituent, and more preferably sometimes The substituted arylene group having 6 to 20 carbon atoms is particularly preferably a phenylene group or a tolylene group. The reason is that this makes it easy to form a coating material that has excellent acid trapping properties and high adhesiveness.

作為可用作第1聚合性化合物之胺基甲酸酯化合物,例如可例舉丙烯酸或丙烯酸羥乙酯等和異氰酸酯進行加成反應之反應性化合物與異佛爾酮二異氰酸酯等二異氰酸酯的衍生物等。該等衍生物可利用己內酯或多元醇等進行擴鏈。作為胺基甲酸酯化合物,亦可使用市售品。作為此種市售品,例如可例舉:U-122P、U-3、40P、U-4HA、U-1084A(以上為新中村化學工業製造);KRM7595、KRM7610、KRM7619(以上為Daicel-Cytec製造)等。胺基甲酸酯化合物可單獨使用1種,或者將2種以上組合使用。As the urethane compound that can be used as the first polymerizable compound, for example, the derivatization of a reactive compound such as acrylic acid or hydroxyethyl acrylate and an isocyanate by addition reaction with a diisocyanate such as isophorone diisocyanate Things and so on. These derivatives can be extended by using caprolactone or polyols. As a urethane compound, you may use a commercial item. As such commercially available products, for example, U-122P, U-3, 40P, U-4HA, U-1084A (the above are manufactured by Shinnakamura Chemical Industry); KRM7595, KRM7610, KRM7619 (the above are Daicel-Cytec Manufacturing) and so on. A urethane compound can be used individually by 1 type or in combination of 2 or more types.

(3)含異三聚氰酸環化合物 含異三聚氰酸環化合物係具有異三聚氰酸環及乙烯性不飽和基之化合物,具有源自異三聚氰酸環之醯胺基。 再者,具有異三聚氰酸環、及醯胺基與乙烯性不飽和基直接鍵結之結構的化合物屬於丙烯醯胺化合物,不包括在含異三聚氰酸環化合物內。 又,具有異三聚氰酸環及胺基甲酸酯鍵、且不具有醯胺基與乙烯性不飽和基直接鍵結之結構的化合物屬於胺基甲酸酯化合物,不包括在含異三聚氰酸環化合物內。(3) Compounds containing isocyanuric acid ring The isocyanuric acid ring-containing compound is a compound having an isocyanuric acid ring and an ethylenically unsaturated group, and has an amide group derived from the isocyanuric acid ring. Furthermore, compounds having an isocyanuric acid ring and a structure in which an amide group and an ethylenically unsaturated group are directly bonded are acrylamide compounds, and are not included in the isocyanuric acid ring-containing compound. In addition, compounds that have an isocyanuric acid ring and a urethane bond, and do not have a structure in which an amide group and an ethylenically unsaturated group are directly bonded are urethane compounds, and are not included in the Polycyanate ring compound.

作為含異三聚氰酸環化合物中所包含之乙烯性不飽和基之數量,只要為1以上即可,更佳為1以上15以下,進而較佳為2以上9以下,尤佳為3以上6以下。其原因在於,聚合性組合物容易形成具有優異之酸成分捕捉性及較高之接著力之被覆材。The number of ethylenically unsaturated groups contained in the isocyanuric acid ring-containing compound may be 1 or more, more preferably 1 or more and 15 or less, still more preferably 2 or more and 9 or less, and particularly preferably 3 or more 6 or less. The reason is that the polymerizable composition is easy to form a coating material having excellent acid component capturing properties and high adhesive force.

含異三聚氰酸環化合物之中,就聚合反應容易進行,易獲得性優異之方面而言,較佳為乙烯性不飽和基為丙烯酸酯基之含有異三聚氰酸環之丙烯酸酯、或乙烯性不飽和基為甲基丙烯酸酯基之含有異三聚氰酸環之甲基丙烯酸酯。Among the isocyanuric acid ring-containing compounds, in terms of easy progress of the polymerization reaction and excellent availability, preferred are isocyanuric acid ring-containing acrylates in which the ethylenically unsaturated group is an acrylate group, Or the ethylenically unsaturated group is a methacrylate group containing isocyanuric acid ring methacrylate.

作為含異三聚氰酸環化合物之分子量,只要能夠獲得所需之酸成分捕捉性及接著力即可,較佳為200以上5000以下,更佳為300以上3000以下,尤佳為400以上2000以下。其原因在於,這樣會使得聚合性組合物容易形成酸成分捕捉性優異且接著力較高之被覆材。As the molecular weight of the isocyanuric acid ring-containing compound, as long as it can obtain the required acid trapping properties and adhesion, it is preferably 200 or more and 5000 or less, more preferably 300 or more and 3000 or less, and particularly preferably 400 or more and 2000 the following. The reason is that this makes it easy for the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness.

作為含異三聚氰酸環化合物,可例舉下述式(12)所表示之化合物。As an isocyanuric acid ring-containing compound, the compound represented by following formula (12) can be mentioned.

[化27]

Figure 02_image053
[化27]
Figure 02_image053

式中,R18 、R19 及R20 分別獨立地表示碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(Ic)中之二價基而成之基, R18 、R19 及R20 中之至少1個基之1個以上氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基, X5 、X6 及X7 分別獨立地表示直接鍵、碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(Ia)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(Ic)之二價基之情形時,該二價基不相鄰。 群(Ic):-O-、-S-、-NR221 -、-NR221 -(C=O)-O-、-CO-、-(C=O)-O-、-O-(C=O)-或-O-(C=O)-O-。R221 表示氫原子或碳原子數1~30之一價烴基。In the formula, R 18 , R 19 and R 20 each independently represent a monovalent hydrocarbon group having 1 to 30 carbon atoms, a monovalent heterocyclic group containing 2 to 30 carbon atoms, or the hydrocarbon group or the heterocyclic group containing One or more methylene groups are substituted with divalent groups selected from the following group (Ic), and at least one hydrogen atom of at least one of R 18 , R 19 and R 20 is Substituted with an acrylate group or a methacrylate group, X 5 , X 6 and X 7 each independently represent a direct bond, a divalent hydrocarbon group with 1-30 carbon atoms, and a divalent heterocyclic ring-containing group with 2-30 carbon atoms Group, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with a divalent group selected from the following group (Ia), wherein more than two methylene groups When substituted with a divalent group selected from the following group (Ic), the divalent group is not adjacent. Group (Ic): -O-, -S-, -NR 221 -, -NR 221 -(C=O)-O-, -CO-, -(C=O)-O-, -O-(C =O)-or -O-(C=O)-O-. R 221 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms.

作為式(12)中之R18 、R19 、R20 及R221 所表示之碳原子數1~30之一價烴基,可與上述式(A1)中之R1 、R2 、R4 及R6 所表示之碳原子數1~30之一價烴基相同。 作為式(12)中之R18 、R19 及R20 所表示之碳原子數2~30之一價含雜環基,可與上述式(A1)中之R1 、R2 及R4 所表示之碳原子數1~30之碳原子數2~30之一價含雜環基相同。 再者,式(12)中之R18 、R19 及R20 所採用之碳原子數1~30之一價烴基及碳原子數1~30之碳原子數2~30之一價含雜環基可包含具有內部不飽和雙鍵結構基之內部烯基結構、末端具有不飽和鍵之末端烯基結構等烯基結構,但通常不包含烯基結構。 作為式(12)中之X5 、X6 及X7 所表示之碳原子數1~30之二價烴基及碳原子數2~30之二價含雜環基,可與式(A1)中之R1 及X所表示之碳原子數1~30之二價烴基及碳原子數2~30之二價含雜環基相同。As the monovalent hydrocarbon group with 1 to 30 carbon atoms represented by R 18 , R 19 , R 20 and R 221 in formula (12), it can be combined with R 1 , R 2 , R 4 and R 4 in the above formula (A1) The monovalent hydrocarbon groups with 1 to 30 carbon atoms represented by R 6 are the same. As the monovalent heterocyclic group containing 2 to 30 carbon atoms represented by R 18 , R 19 and R 20 in the formula (12), it can be combined with R 1 , R 2 and R 4 in the above formula (A1) The indicated monovalent heterocyclic group containing 1-30 carbon atoms and 2-30 carbon atoms is the same. Furthermore, the monovalent hydrocarbon group with 1-30 carbon atoms and the monovalent heterocyclic ring with 1-30 carbon atoms and 2-30 carbon atoms used in R 18 , R 19 and R 20 in the formula (12) The group may include an alkenyl structure such as an internal alkenyl structure having an internal unsaturated double bond structure group, and a terminal alkenyl structure having an unsaturated bond at the end, but usually does not include an alkenyl structure. As the divalent hydrocarbon group with 1 to 30 carbon atoms and the divalent heterocyclic group with 2 to 30 carbon atoms represented by X 5 , X 6 and X 7 in the formula (12), it can be combined with the formula (A1) The divalent hydrocarbon group having 1 to 30 carbon atoms and the divalent heterocyclic group containing 2 to 30 carbon atoms represented by R 1 and X are the same.

於本發明中,R18 、R19 及R20 較佳為碳原子數1~30之一價烴基、或該烴基中之1個以上之亞甲基被取代為上述群(Ic)而成之基,更佳為有時具有取代基之碳原子數1~30之烷基、或該烷基中之1個以上之亞甲基被取代為上述群(Ic)而成之基(亞甲基取代烷基),進而較佳為有時具有取代基之碳原子數1~30之烷基。其原因在於,這樣會使得容易形成酸成分捕捉性優異且接著力較高之被覆材。於R18 、R19 及R20 係有時具有取代基之烷基之情形時,就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,該烷基之碳原子數較佳為1~20,更佳為2~8。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,較佳為該烷基中之末端之1個以上之氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基,更佳為1個氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,較佳為R18 、R19 及R20 中之2個以上被取代為丙烯酸酯基或甲基丙烯酸酯基,更佳為R18 、R19 及R20 全部被取代為丙烯酸酯基或甲基丙烯酸酯基。 又,式(12)中之X5 、X6 及X7 較佳為直接鍵或碳原子數1~30之二價烴基,更佳為直接鍵或有時具有取代基之碳原子數6~30之伸烷基,進而較佳為直接鍵。其原因在於,這樣會使得容易形成酸成分捕捉性優異且接著力較高之被覆材。In the present invention, R 18 , R 19 and R 20 are preferably a monovalent hydrocarbon group having 1 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group are substituted with the above group (Ic) The group is more preferably an alkyl group having 1 to 30 carbon atoms which may have a substituent, or a group in which one or more methylene groups in the alkyl group are substituted with the above group (Ic) (methylene group) Substituted alkyl group), and more preferably an alkyl group having 1 to 30 carbon atoms which may have a substituent. The reason is that this makes it easy to form a coating material that has excellent acid trapping properties and high adhesiveness. When R 18 , R 19 and R 20 are sometimes substituted alkyl groups, the number of carbon atoms in the alkyl group is Preferably it is 1-20, more preferably 2-8. From the viewpoint of easily forming a coating material with excellent acid trapping properties and high adhesiveness, it is preferable that one or more hydrogen atoms at the terminal of the alkyl group are substituted with acrylate groups or methacrylate groups. More preferably, one hydrogen atom is substituted with an acrylate group or a methacrylate group. From the viewpoint of easily forming a coating material with excellent acid component capturing properties and high adhesiveness, it is preferable that two or more of R 18 , R 19 and R 20 are substituted with an acrylate group or a methacrylate group, More preferably, all of R 18 , R 19 and R 20 are substituted with an acrylate group or a methacrylate group. In addition, X 5 , X 6 and X 7 in formula (12) are preferably direct bonds or divalent hydrocarbon groups having 1 to 30 carbon atoms, more preferably direct bonds or sometimes substituted carbon atoms having 6 to The alkylene group of 30 is more preferably a direct bond. The reason is that this makes it easy to form a coating material that has excellent acid trapping properties and high adhesiveness.

作為含異三聚氰酸環化合物,亦可使用市售品。作為此種市售品,例如可例舉:A-9300、A93003CL(以上為新中村化學工業製造)。作為該丙烯酸酯化合物,較佳為使用下述式(A1-8)所表示之異氰尿酸三(2-丙烯醯氧基乙基)酯。其原因在於,這樣會使得聚合性組合物容易形成酸成分捕捉性優異且接著力較高之被覆材。As the isocyanuric acid ring-containing compound, a commercially available product may also be used. As such a commercially available product, for example, A-9300 and A93003CL (the above are manufactured by Shinnakamura Chemical Industry Co., Ltd.). As the acrylate compound, it is preferable to use tris(2-propenoxyethyl) isocyanurate represented by the following formula (A1-8). The reason is that this makes it easy for the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness.

上述含異三聚氰酸環化合物可單獨使用1種,或者將2種以上組合使用。The above-mentioned isocyanuric acid ring-containing compound can be used individually by 1 type or in combination of 2 or more types.

(4)其他 本發明之聚合性組合物中所包含之第1聚合性化合物可僅由丙烯醯胺化合物所構成,亦可僅由胺基甲酸酯化合物所構成,還可僅由含異三聚氰酸環化合物所構成。或者,第1聚合性化合物亦可包含選自丙烯醯胺化合物、胺基甲酸酯化合物及含異三聚氰酸環化合物中之2種以上。 尤其就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,第1聚合性化合物較佳為至少包含丙烯醯胺化合物。於此情形時,丙烯醯胺化合物之含量於第1聚合性化合物之合計100質量份中較佳為40質量份以上,更佳為50~100質量份,進而較佳為70~100質量份,進而較佳為80~100質量份,進而較佳為90~100質量份,尤佳為95~100質量份。藉由將丙烯醯胺化合物之含量設為上述範圍,聚合性組合物之硬化速度優異,故而較佳。 又,就使其具有更優異之酸成分捕捉性之觀點而言,第1聚合性化合物較佳為將丙烯醯胺化合物與胺基甲酸酯化合物及含異三聚氰酸環化合物中至少一者併用,其中,較佳為併用胺基甲酸酯化合物。於併用之情形時,丙烯醯胺化合物之含量於第1聚合性化合物之合計100質量份中較佳為40質量份以上,更佳為50~99質量份,進而較佳為60~97質量份,進而較佳為70~95質量份,進而較佳為85~93質量份。(4) Other The first polymerizable compound contained in the polymerizable composition of the present invention may be composed only of an acrylamide compound, may be composed only of a urethane compound, or may be composed only of an isocyanuric acid ring-containing compound. The compound is composed. Alternatively, the first polymerizable compound may include two or more selected from the group consisting of acrylamide compounds, urethane compounds, and isocyanuric ring-containing compounds. In particular, from the viewpoint of easily forming a coating material having excellent acid component capturing properties and high adhesiveness, the first polymerizable compound preferably contains at least an acrylamide compound. In this case, the content of the acrylamide compound in the total 100 parts by mass of the first polymerizable compound is preferably 40 parts by mass or more, more preferably 50-100 parts by mass, and still more preferably 70-100 parts by mass, More preferably, it is 80-100 mass parts, More preferably, it is 90-100 mass parts, Especially preferably, it is 95-100 mass parts. By setting the content of the acrylamide compound in the above range, the curing rate of the polymerizable composition is excellent, which is preferable. In addition, from the viewpoint of making it have more excellent acid component trapping properties, the first polymerizable compound is preferably at least one of an acrylamide compound, a urethane compound, and an isocyanuric ring-containing compound These are used in combination, and among them, a urethane compound is preferably used in combination. When used in combination, the content of the acrylamide compound is preferably 40 parts by mass or more in the total 100 parts by mass of the first polymerizable compound, more preferably 50 to 99 parts by mass, and still more preferably 60 to 97 parts by mass It is more preferably 70 to 95 parts by mass, and still more preferably 85 to 93 parts by mass.

本發明之聚合性組合物中之第1聚合性化合物之含量於上述聚合性組合物之固形物成分100質量份中較佳為10質量份以上,更佳為20質量份以上。其原因在於,這樣會使得聚合性組合物容易形成酸成分捕捉性優異且接著力較高之被覆材。 就使硬化性優異之觀點而言,上述第1聚合性化合物之含量於上述聚合性組合物之固形物成分100質量份中較佳為70質量份以上,更佳為90質量份以上。又,就使酸成分捕捉性特別優異之觀點而言,較佳為95質量份以上,較佳為100質量份。其原因在於,藉由設為上述含量,於採用將聚合性組合物塗佈於上述構件的步驟、及使上述聚合性組合物中之第1聚合性化合物聚合的步驟作為被覆構造體製造方法之情形時(以下,有時將具有塗佈步驟及聚合步驟之被覆構造體製造方法稱為第1製造方法),容易形成接著力較高之被覆材。 又,上述第1聚合性化合物之含量於上述聚合性組合物之固形物成分100質量份中較佳為20質量份以上50質量份以下,更佳為25質量份以上35質量份以下。其原因在於,藉由設為上述含量,於採用使聚合性組合物中之第1聚合性化合物聚合而形成被覆材的步驟、及使上述被覆材形成步驟中所獲得之被覆材與含有酸成分之構件接觸的步驟作為被覆構造體製造方法之情形時(以下,有時將採用被覆材形成步驟及接觸步驟之被覆構造體製造方法稱為第2製造方法),被覆材容易貼合於含有酸成分之構件。 再者,固形物成分係指包含聚合性組合物之除溶劑以外之全部成分者。 又,更詳細而言,上述第1製造方法可與下述「C.被覆構造體的製造方法」之項之「1.被覆步驟」中所記載之第1方法相同,更詳細而言,上述第2製造方法可與下述「C.被覆構造體的製造方法」之項之「1.被覆步驟」中所記載之第2方法相同。The content of the first polymerizable compound in the polymerizable composition of the present invention is preferably 10 parts by mass or more, and more preferably 20 parts by mass or more in 100 parts by mass of the solid content of the polymerizable composition. The reason is that this makes it easy for the polymerizable composition to form a coating material having excellent acid component capturing properties and high adhesiveness. From the viewpoint of excellent curability, the content of the first polymerizable compound in 100 parts by mass of the solid content of the polymerizable composition is preferably 70 parts by mass or more, and more preferably 90 parts by mass or more. In addition, from the viewpoint of making the acid component capturing properties particularly excellent, it is preferably 95 parts by mass or more, and more preferably 100 parts by mass. The reason is that, by setting the above content, the step of applying the polymerizable composition to the member and the step of polymerizing the first polymerizable compound in the polymerizable composition are adopted as the method of manufacturing the coated structure. In the case (hereinafter, the manufacturing method of the coating structure having the coating step and the polymerization step is sometimes referred to as the first manufacturing method), it is easy to form a coating material with a high adhesive force. In addition, the content of the first polymerizable compound in 100 parts by mass of the solid content of the polymerizable composition is preferably 20 parts by mass or more and 50 parts by mass or less, more preferably 25 parts by mass or more and 35 parts by mass or less. The reason is that by setting the above content, the step of polymerizing the first polymerizable compound in the polymerizable composition to form a coating material and the coating material obtained in the step of forming the coating material and the acid component are used In the case where the step of contacting the member is used as the manufacturing method of the covering structure (hereinafter, the method of manufacturing the covering structure using the covering material forming step and the contacting step is sometimes referred to as the second manufacturing method), the covering material is easy to adhere to the acid-containing Components of ingredients. In addition, the solid component refers to the one containing all the components of the polymerizable composition excluding the solvent. Furthermore, in more detail, the above-mentioned first manufacturing method may be the same as the first method described in "1. Coating step" in the item of "C. Manufacturing method of covered structure" below, and in more detail, the above The second manufacturing method can be the same as the second method described in "1. Coating Step" in the section of "C. Manufacturing Method of Coated Structure" below.

2.第2聚合性化合物 本發明之聚合性組合物除了第1聚合性化合物以外亦可進而含有第2聚合性化合物。第2聚合性化合物係除第1聚合性化合物以外之具有乙烯性不飽和基之化合物。藉由使其除了第1聚合性化合物以外亦含有第2聚合性化合物,所獲得之硬化物具有較高之接著力。2. The second polymerizable compound The polymerizable composition of the present invention may further contain a second polymerizable compound in addition to the first polymerizable compound. The second polymerizable compound is a compound having an ethylenically unsaturated group other than the first polymerizable compound. By making it contain the second polymerizable compound in addition to the first polymerizable compound, the cured product obtained has a high adhesive force.

於本發明中,作為第2聚合性化合物,例如可使用具有丙烯酸基、甲基丙烯基及乙烯基等乙烯性不飽和基且不具有醯胺基的化合物,無特別限制。 第2聚合性化合物可為具有1個乙烯性不飽和基之單官能化合物,亦可為具有2個以上乙烯性不飽和基之多官能化合物。 作為第2聚合性化合物,可使用公知之化合物。例如,可將國際公開第2018/012383號公報中所記載之化合物、國際公開第2014/021023號公報中所記載之聚合性有機物質等用作第2聚合性化合物。In the present invention, as the second polymerizable compound, for example, a compound having an ethylenically unsaturated group such as an acrylic group, a methacryl group, and a vinyl group and not having an amide group can be used, and it is not particularly limited. The second polymerizable compound may be a monofunctional compound having one ethylenically unsaturated group, or may be a multifunctional compound having two or more ethylenically unsaturated groups. As the second polymerizable compound, a known compound can be used. For example, the compound described in International Publication No. 2018/012383, the polymerizable organic substance described in International Publication No. 2014/021023, and the like can be used as the second polymerizable compound.

作為第2聚合性化合物,例如可例舉:碳原子數1~30之烴、或該烴中之1個以上之亞甲基被取代為選自下述群a之二價基而成之化合物中之1個以上氫原子被取代為丙烯酸酯基或甲基丙烯酸酯基而成的基。其中,於上述烴之2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰。又,上述烴可具有取代基。作為該取代基,可例舉碳原子數1~30之一價烴基。作為該烴基,可例舉與式(A1)中之R1 、R2 、R3 、及R4 中之碳原子數1~30之一價烴基相同者。 群a:-O-、-CO-、-(C=O)-O-、-O-(C=O)-或-O-(C=O)-O-。As the second polymerizable compound, for example, a hydrocarbon having 1 to 30 carbon atoms, or a compound in which one or more methylene groups in the hydrocarbon are substituted with a divalent group selected from the following group a One or more of the hydrogen atoms is substituted with an acrylate group or a methacrylate group. However, when two or more methylene groups of the above-mentioned hydrocarbon are substituted with a divalent group selected from the following group (I), the divalent group is not adjacent. In addition, the above-mentioned hydrocarbon may have a substituent. The substituent may, for example, be a monovalent hydrocarbon group having 1 to 30 carbon atoms. The hydrocarbon group may be the same as the monovalent hydrocarbon group having 1 to 30 carbon atoms in R 1 , R 2 , R 3 , and R 4 in the formula (A1). Group a: -O-, -CO-, -(C=O)-O-, -O-(C=O)- or -O-(C=O)-O-.

與第1聚合性化合物組合之第2聚合性化合物可根據由本發明之聚合性組合物之聚合物所被覆之含有酸成分之構件之用途而適當決定。於上述聚合性組合物用於作為被覆構造體製造方法之第1製造方法中之情形時,作為第2聚合性化合物,就能夠容易地形成酸成分捕捉性優異且接著力較高之被覆材之方面而言,較佳為使用單官能化合物,例如苯氧基聚乙二醇丙烯酸酯等苯氧基聚伸烷基二醇丙烯酸酯。 就容易形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,作為第2聚合性化合物,亦較佳為使用:例如1,9-壬二醇二丙烯酸酯及1,10-癸二醇二丙烯酸酯等二元醇之丙烯酸酯化合物;以及聚乙二醇二丙烯酸酯及聚丙二醇二丙烯酸酯等聚伸烷基二醇二丙烯酸酯等2官能之第2聚合性化合物。The second polymerizable compound to be combined with the first polymerizable compound can be appropriately determined according to the use of the acid component-containing member coated with the polymer of the polymerizable composition of the present invention. When the above-mentioned polymerizable composition is used in the first manufacturing method as the manufacturing method of the covering structure, as the second polymerizable compound, it is possible to easily form a covering material with excellent acid trapping properties and high adhesiveness. From the aspect, it is preferable to use a monofunctional compound, for example, phenoxy polyalkylene glycol acrylate such as phenoxy polyethylene glycol acrylate. From the viewpoint of easy formation of a coating material with excellent acid component capturing properties and high adhesiveness, it is also preferable to use as the second polymerizable compound: for example, 1,9-nonanediol diacrylate and 1,10- Acrylate compounds of glycols such as decanediol diacrylate; and bifunctional second polymerizable compounds such as polyalkylene glycol diacrylates such as polyethylene glycol diacrylate and polypropylene glycol diacrylate.

於聚合性組合物用於作為被覆構造體製造方法之第2製造方法中之情形時,就包含聚合性組合物之聚合物的被覆材容易貼合於含有酸成分之構件之觀點而言,第2聚合性化合物較佳為使用下述式(13)所表示之化合物。When the polymerizable composition is used in the second manufacturing method as the manufacturing method of the coated structure, from the viewpoint that the coating material containing the polymer of the polymerizable composition is easily attached to the member containing the acid component, the first 2 The polymerizable compound is preferably a compound represented by the following formula (13).

[化28]

Figure 02_image055
[化28]
Figure 02_image055

式中,Al表示有時具有取代基之碳原子數1~30之鏈狀或包含脂環之烷基,R212 表示氫原子或甲基。In the formula, Al represents a chain-like or alicyclic alkyl group having 1 to 30 carbon atoms which may have a substituent, and R 212 represents a hydrogen atom or a methyl group.

作為Al所採用之碳原子數1~30之鏈狀或包含脂環之烷基,可使用上述式(A1)中之R1 、R2 、R3 、及R4 所採用之碳原子數1~30之脂肪族烴基之例示基。 作為此種烷基,具體而言,可例舉:甲基、乙基、丙基、丁基、戊基、己基、庚基、辛基、壬基、癸基、十一烷基及十二烷基等直鏈狀或支鏈狀之鏈狀烷基、甲基環戊基、二甲基環戊基、環己基、甲基環己基、二甲基環己基、環庚基、環辛基及環壬基等環烷基、環烷基烷基。As the chain-like or alicyclic alkyl group with 1-30 carbon atoms used for Al, the carbon number 1 used for R 1 , R 2 , R 3 , and R 4 in the above formula (A1) can be used An exemplary group of -30 aliphatic hydrocarbon groups. Specific examples of such alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl. Linear or branched chain alkyl such as alkyl, methylcyclopentyl, dimethylcyclopentyl, cyclohexyl, methylcyclohexyl, dimethylcyclohexyl, cycloheptyl, cyclooctyl Cycloalkyl and cycloalkylalkyl such as cyclononyl.

於本發明中,就容易形成接著力較高之被覆材之觀點而言,Al所表示之烷基之碳原子數較佳為1~20,更佳為1~10,進而較佳為1~5。 就容易形成接著力較高之被覆材之觀點而言,Al所表示之烷基較佳為鏈狀。 就容易形成接著力較高之被覆材之觀點而言,該烷基較佳為未經取代。In the present invention, the number of carbon atoms of the alkyl group represented by Al is preferably from 1 to 20, more preferably from 1 to 10, and still more preferably from 1 to from the viewpoint of easy formation of a coating material with high adhesive force. 5. From the viewpoint of easy formation of a coating material with high adhesive force, the alkyl group represented by Al is preferably chain-like. From the viewpoint of easily forming a coating material with high adhesive force, the alkyl group is preferably unsubstituted.

作為式(13)所表示之化合物,較佳為使用丙烯酸甲酯、丙烯酸乙酯及丙烯酸丁酯等丙烯酸烷基酯。其原因在於,藉由將第1聚合性化合物與丙烯酸烷基酯併用,於上述聚合性組合物用於作為被覆構造體製造方法之第2製造方法中之情形時,包含聚合性組合物之聚合物的被覆材容易貼合於含有酸成分之構件,可較佳地用作黏著片。As the compound represented by the formula (13), alkyl acrylates such as methyl acrylate, ethyl acrylate, and butyl acrylate are preferably used. The reason is that by using the first polymerizable compound together with the alkyl acrylate, when the above-mentioned polymerizable composition is used in the second manufacturing method as the manufacturing method of the covered structure, the polymerization of the polymerizable composition is included. The coating material of the object is easy to adhere to the member containing the acid component, and can be preferably used as an adhesive sheet.

第2聚合性化合物之玻璃轉移溫度(Tg)較佳為0℃以下,更佳為-20℃以下,進而較佳為-30℃~-50℃。其原因在於,藉由使用玻璃轉移溫度處於上述範圍內之第2聚合性化合物,於上述聚合性組合物用於作為被覆構造體製造方法之第2製造方法中之情形時,包含聚合性組合物之聚合物的被覆材容易貼合於含有酸成分之構件。玻璃轉移溫度係指例如第2聚合性化合物之均聚物(homopolymer)之Tg。均聚物之Tg可根據JIS K7121:2012中規定之方法進行測定。The glass transition temperature (Tg) of the second polymerizable compound is preferably 0°C or lower, more preferably -20°C or lower, and still more preferably -30°C to -50°C. The reason is that by using the second polymerizable compound whose glass transition temperature is within the above-mentioned range, when the above-mentioned polymerizable composition is used in the second manufacturing method of the manufacturing method of the covered structure, the polymerizable composition is included The polymer coating material is easy to adhere to the member containing the acid component. The glass transition temperature means, for example, the Tg of the homopolymer of the second polymerizable compound. The Tg of the homopolymer can be measured according to the method specified in JIS K7121:2012.

第2聚合性化合物可單獨使用1種,或者將2種以上組合使用。The second polymerizable compound may be used singly or in combination of two or more kinds.

於本發明之聚合性組合物含有第1聚合性化合物及第2聚合性化合物之情形時,第1聚合性化合物之含量於第1聚合性化合物及第2聚合性化合物之合計100質量份中較佳為20質量份以上,更佳為20~50質量份,更佳為25~35質量份。其原因在於,藉由將第1聚合性化合物之含量設為上述範圍,於上述聚合性組合物用於作為被覆構造體製造方法之第2製造方法中之情形時,包含聚合性組合物聚合所得之聚合物的被覆材容易貼合於含有酸成分之構件。When the polymerizable composition of the present invention contains the first polymerizable compound and the second polymerizable compound, the content of the first polymerizable compound is more than 100 parts by mass of the total of the first polymerizable compound and the second polymerizable compound. It is preferably 20 parts by mass or more, more preferably 20 to 50 parts by mass, and even more preferably 25 to 35 parts by mass. The reason is that by setting the content of the first polymerizable compound in the above range, when the polymerizable composition is used in the second manufacturing method as a method for manufacturing a covered structure, the polymerized composition is included. The polymer coating material is easy to adhere to the member containing the acid component.

3.自由基聚合起始劑 本發明之聚合性組合物亦可進而含有自由基聚合起始劑。藉由含有自由基聚合起始劑,容易進行第1聚合性化合物之聚合。作為自由基起始劑,可例舉光自由基聚合起始劑或熱自由基聚合起始劑。作為光自由基聚合起始劑及熱自由基聚合起始劑,可使用公知之自由基聚合起始劑,無特別限制。作為自由基聚合起始劑,尤佳為使用光自由基聚合起始劑。其原因在於,這樣會使得聚合性組合物之聚合性進一步提高。作為光自由基聚合起始劑,可例示較佳之苯乙酮系化合物及醯基膦系化合物等。 作為此種光自由基聚合起始劑,可例舉日本專利特開2018-172495號公報或日本專利特開2018-127527號公報、日本專利特開2017-098290號公報中記載之化合物。3. Free radical polymerization initiator The polymerizable composition of the present invention may further contain a radical polymerization initiator. By containing a radical polymerization initiator, the polymerization of the first polymerizable compound is facilitated. The radical initiator may, for example, be a photo radical polymerization initiator or a thermal radical polymerization initiator. As the photo radical polymerization initiator and the thermal radical polymerization initiator, a known radical polymerization initiator can be used, and there is no particular limitation. As the radical polymerization initiator, it is particularly preferable to use a photoradical polymerization initiator. The reason is that this will further improve the polymerizability of the polymerizable composition. As the photoradical polymerization initiator, preferred acetophenone-based compounds, acylphosphine-based compounds, and the like can be exemplified. As such a photoradical polymerization initiator, the compounds described in Japanese Patent Application Publication No. 2018-172495, Japanese Patent Application Publication No. 2018-127527, and Japanese Patent Application Publication No. 2017-098290 may be mentioned.

本發明之聚合性組合物中之自由基聚合起始劑之含量相對於第1聚合性化合物及第2聚合性化合物之合計100質量份較佳為1~20質量份,更佳為1~10質量份。藉由使聚合起始劑之含量為1質量份以上,易於防止硬化感度不足所引起之硬化不良,故而較佳,藉由設為20質量份以下,能夠抑制光照射時或加熱時產生揮發物。The content of the radical polymerization initiator in the polymerizable composition of the present invention is preferably 1-20 parts by mass, more preferably 1-10 parts by mass relative to 100 parts by mass of the total of the first polymerizable compound and the second polymerizable compound Mass parts. By setting the content of the polymerization initiator to 1 part by mass or more, it is easy to prevent poor curing caused by insufficient curing sensitivity. Therefore, it is preferably set to 20 parts by mass or less to suppress the generation of volatiles during light irradiation or heating. .

4.溶劑 本發明之聚合性組合物可含有溶劑。該溶劑係於常溫(25℃)大氣壓下為液狀者,係可使聚合性組合物之各成分分散或溶解者。因此,第1聚合性化合物、第2聚合性化合物及酸產生劑、以及下述增感劑等即便於常溫(25℃)大氣壓下為液狀,亦不包括在溶劑中。作為上述溶劑,水、有機溶劑均可使用。於本發明中,上述溶劑較佳為有機溶劑。其原因在於,這樣容易使第1聚合性化合物及第2聚合性化合物溶解或分散。4. Solvent The polymerizable composition of the present invention may contain a solvent. The solvent is liquid at normal temperature (25°C) and atmospheric pressure, and is capable of dispersing or dissolving each component of the polymerizable composition. Therefore, even if the first polymerizable compound, the second polymerizable compound, the acid generator, and the sensitizer described below are liquid at normal temperature (25° C.) and atmospheric pressure, they are not included in the solvent. As the above-mentioned solvent, both water and organic solvents can be used. In the present invention, the above-mentioned solvent is preferably an organic solvent. The reason is that it is easy to dissolve or disperse the first polymerizable compound and the second polymerizable compound in this way.

作為有機溶劑,可例舉:碳酸丙二酯、碳酸二乙酯等碳酸酯類;丙酮、2-庚酮等酮類;乙二醇、丙二醇、丙二醇單乙酸酯、二丙二醇及二丙二醇單乙酸酯之單甲醚或單苯醚等多元醇類及其衍生物;二㗁烷之類的環式醚類;甲酸乙酯、乙酸3-甲基-3-甲氧基丁酯等酯類;甲苯、二甲苯等芳香族烴類;γ-己內酯、δ-己內酯等內酯等。Examples of organic solvents include: carbonates such as propylene carbonate and diethyl carbonate; ketones such as acetone and 2-heptanone; ethylene glycol, propylene glycol, propylene glycol monoacetate, dipropylene glycol, and dipropylene glycol mono Polyols and derivatives such as monomethyl ether or monophenyl ether of acetate; cyclic ethers such as dioxane; esters such as ethyl formate and 3-methyl-3-methoxybutyl acetate Classes; aromatic hydrocarbons such as toluene and xylene; lactones such as γ-caprolactone and δ-caprolactone, etc.

上述聚合性組合物中之溶劑之含量於聚合性組合物100質量份中較佳為80質量份以下。 又,於上述聚合性組合物含有溶劑之情形時,上述溶劑之含量更佳為5質量份以上50質量份以下,進而較佳為10質量份以上40質量份以下。其原因在於,藉由將溶劑之含量設為上述範圍,聚合性組合物之塗佈性變得良好。The content of the solvent in the polymerizable composition is preferably 80 parts by mass or less in 100 parts by mass of the polymerizable composition. Furthermore, when the polymerizable composition contains a solvent, the content of the solvent is more preferably 5 parts by mass or more and 50 parts by mass or less, and still more preferably 10 parts by mass or more and 40 parts by mass or less. The reason is that by setting the content of the solvent in the above range, the coatability of the polymerizable composition becomes good.

5.增感劑 本發明之聚合性組合物可含有增感劑。作為該增感劑,例如可例舉日本專利特表2008-506749號公報中作為分光增感劑所記載之化合物。 上述增感劑之含量只要能夠形成酸成分捕捉性優異且接著力較高之被覆材即可,上述增感劑相對於自由基聚合起始劑100質量份,較佳為0.1質量份以上50質量份以下,更佳為1質量份以上10質量份以下。5. Sensitizer The polymerizable composition of the present invention may contain a sensitizer. As this sensitizer, the compound described as a spectral sensitizer in Japanese Patent Application Publication No. 2008-506749 may be mentioned, for example. The content of the above-mentioned sensitizer only needs to be able to form a coating material with excellent acid component capturing properties and high adhesive force. The above-mentioned sensitizer is preferably 0.1 parts by mass or more and 50 parts by mass relative to 100 parts by mass of the radical polymerization initiator Part or less, more preferably 1 part by mass or more and 10 parts by mass or less.

6.添加劑 本發明之聚合性組合物除了第1聚合性化合物、第2聚合性化合物、自由基聚合起始劑、溶劑及增感劑以外,亦可視需要包含慣用之添加物,譬如:聚合性化合物、聚合起始劑、著色劑、無機化合物、潛在性添加劑、有機聚合體、鏈轉移劑、界面活性劑、矽烷偶合劑、三聚氰胺化合物、熱聚合抑制劑;塑化劑;助黏劑;填充劑;消泡劑;調平劑;表面調整劑;抗氧化劑;紫外線吸收劑;分散助劑;防凝聚劑;觸媒;效果促進劑;交聯劑;增黏劑等。6. Additives In addition to the first polymerizable compound, the second polymerizable compound, a radical polymerization initiator, a solvent, and a sensitizer, the polymerizable composition of the present invention may also contain customary additives, such as polymerizable compounds, polymerizable compounds, and sensitizers. Initiators, colorants, inorganic compounds, latent additives, organic polymers, chain transfer agents, surfactants, silane coupling agents, melamine compounds, thermal polymerization inhibitors; plasticizers; adhesion promoters; fillers; Foaming agent; leveling agent; surface regulator; antioxidant; ultraviolet absorber; dispersing aid; anti-cohesive agent; catalyst; effect accelerator; crosslinking agent; tackifier, etc.

本發明之聚合性組合物中之上述添加物之含量可根據添加劑之種類而適當決定。就能夠形成酸成分捕捉性優異且接著力較高之被覆材之觀點而言,上述添加物之合計含量於聚合性組合物100質量份中較佳為30質量份以下,更佳為20質量份以下,尤佳為10質量份以下。The content of the above-mentioned additives in the polymerizable composition of the present invention can be appropriately determined according to the types of additives. From the viewpoint of being able to form a coating material with excellent acid component capturing properties and high adhesion, the total content of the above-mentioned additives in 100 parts by mass of the polymerizable composition is preferably 30 parts by mass or less, more preferably 20 parts by mass Below, it is especially preferable that it is 10 mass parts or less.

7.含有酸成分之構件 本發明之聚合性組合物用以被覆含有酸成分之構件。 於本發明中,酸成分可為可供應質子(H )者。 作為此種酸成分,可例舉:鹽酸、硫酸、硝酸及磷酸等無機酸、以及羧酸(芳香族羧酸及脂肪族羧酸等)、磺酸及亞磺酸等有機酸等布忍斯特酸、可於自外部侵入之水(H2 O)之存在下等供應質子之FeCl3 、AlCl3 、Fe(OTs)3 、PF5 、AsF5 、SbF5 、BF3 、BCl3 、BBr3 、及SO3 等路易斯酸等。 上述構件中所包含之酸成分可作為上述構件之形成材料預先包含於其中,亦可在形成上述構件時產生。 作為上述酸成分之含量,只要於不存在上述被覆材時會產生周邊構件之腐蝕、含有酸成分之構件中之其他成分之改性等由含有酸成分所導致之不良情況即可,例如,於上述含有酸成分之構件100質量份中,可設為0.001質量份以上5質量份以下。 於本發明中,上述含有酸成分之構件較佳為包含含有酸產生劑及陽離子硬化性成分之陽離子硬化性組合物之硬化物的構件,即,由上述陽離子硬化性組合物中之酸產生劑產生酸成分,藉此使上述陽離子硬化性成分彼此硬化而形成者。其原因在於具有如下優點:容易形成所需形狀之構件;容易於所需時點形成構件。 又,被覆可為被覆含有酸成分之構件全部,或者被覆一部分。例如可針對俯視下特定面積之塗膜,覆蓋塗膜上表面,亦可不覆蓋塗膜上表面,而以僅覆蓋塗膜側面之方式以框狀形成。 又,被覆並不限定於與含有酸成分之構件直接相接地配置的情形,亦包括介隔其他構件配置的情形。其中,於本發明中,就能夠有效地捕捉上述構件中之酸成分之觀點而言,較佳為與上述構件直接相接地配置。7. The component containing the acid component The polymerizable composition of the present invention is used to coat the component containing the acid component. In the present invention, the acid component may be one that can supply protons (H + ). Examples of such acid components include mineral acids such as hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid, as well as organic acids such as carboxylic acids (aromatic carboxylic acid and aliphatic carboxylic acid, etc.), and organic acids such as sulfonic acid and sulfinic acid. Acid, FeCl 3 , AlCl 3 , Fe(OTs) 3 , PF 5 , AsF 5 , SbF 5 , BF 3 , BCl 3 , BBr 3 that can supply protons in the presence of water (H 2 O) that can penetrate from the outside , And SO 3 and other Lewis acids. The acid component contained in the above-mentioned member may be contained in advance as a forming material of the above-mentioned member, or may be generated when the above-mentioned member is formed. As for the content of the above-mentioned acid component, it is sufficient that corrosion of peripheral components, modification of other components in the component containing the acid component, etc. occur in the absence of the above-mentioned coating material due to defects caused by the acid component, for example, In 100 parts by mass of the above-mentioned acid component-containing member, it may be 0.001 part by mass or more and 5 parts by mass or less. In the present invention, the above-mentioned acid component-containing member is preferably a member containing a hardened product of a cation hardening composition containing an acid generator and a cation hardening component, that is, the acid generator in the above-mentioned cation hardening composition An acid component is generated, whereby the above-mentioned cation curable components are hardened to each other. The reason is that it has the following advantages: it is easy to form a member of a desired shape; it is easy to form a member at the required time. In addition, the coating may cover the entire component containing the acid component, or a part of it. For example, the upper surface of the coating film may be covered for a specific area of the coating film in a plan view, or the upper surface of the coating film may not be covered, but formed in a frame shape so as to cover only the side surface of the coating film. In addition, the coating is not limited to the case where it is placed directly in contact with the member containing the acid component, and it also includes the case where it is placed through other members. Among them, in the present invention, in terms of being able to effectively capture the acid component in the above-mentioned member, it is preferable to arrange it directly in contact with the above-mentioned member.

(1)陽離子硬化性組合物 陽離子硬化性組合物係含有酸產生劑及陽離子硬化性成分者。 以下,對陽離子硬化性組合物詳細地進行說明。(1) Cationic curable composition The cationic curable composition contains an acid generator and a cationic curable component. Hereinafter, the cationic curable composition will be described in detail.

(1-1)陽離子硬化性成分 作為陽離子硬化性組合物中所包含之陽離子硬化性成分,只要為利用酸產生劑所產生之酸來引起高分子化或交聯反應的化合物,則可無特別限制地使用。作為陽離子硬化性成分,例如可使用環氧化合物、氧雜環丁烷化合物、環狀內酯化合物、環狀縮醛化合物、環狀硫醚化合物、螺原酸酯化合物、乙烯系化合物等。陽離子硬化性成分可單獨使用1種,或者將2種以上組合使用。作為包含2種以上陽離子硬化性成分之陽離子硬化性組合物之例,可例舉包含結構或分子量等不同之2種以上陽離子硬化性成分者。(1-1) Cationic hardening ingredients As the cation curable component contained in the cation curable composition, as long as it is a compound that causes the polymerization or crosslinking reaction by the acid generated by the acid generator, it can be used without particular limitation. As the cation curable component, for example, epoxy compounds, oxetane compounds, cyclic lactone compounds, cyclic acetal compounds, cyclic thioether compounds, spiroorthoester compounds, vinyl compounds, etc. can be used. The cationic curable component can be used singly or in combination of two or more kinds. As an example of a cationic curable composition containing two or more types of cationic curable components, those containing two or more types of cationic curable components different in structure, molecular weight, etc. can be mentioned.

作為結構不同之陽離子硬化性成分之組合,例如可例舉選自環氧化合物、氧雜環丁烷化合物、環狀內酯化合物、環狀縮醛化合物、環狀硫醚化合物、螺原酸酯化合物、乙烯系化合物等不同分類中之2種以上組合而成者,譬如包含環氧化合物及氧雜環丁烷化合物兩者之組合。具體而言,可例舉選自芳香族環氧化合物、脂環式環氧化合物及脂肪族環氧化合物中之2種以上組合而成者,譬如包含作為環氧化合物之脂肪族環氧化合物及脂環式環氧化合物者、包含作為環氧化合物之脂肪族環氧化合物及芳香族環氧化合物者、包含芳香族環氧化合物及脂環式環氧化合物者等。As a combination of cationic curable components with different structures, for example, an epoxy compound, an oxetane compound, a cyclic lactone compound, a cyclic acetal compound, a cyclic thioether compound, and a spiroorthoester may be mentioned. A combination of two or more of different classifications such as a compound and a vinyl compound, for example, includes a combination of an epoxy compound and an oxetane compound. Specifically, a combination of two or more selected from aromatic epoxy compounds, alicyclic epoxy compounds, and aliphatic epoxy compounds can be exemplified, such as containing aliphatic epoxy compounds as epoxy compounds and Those containing alicyclic epoxy compounds, those containing aliphatic epoxy compounds and aromatic epoxy compounds as epoxy compounds, those containing aromatic epoxy compounds and alicyclic epoxy compounds, and the like.

作為分子量不同之陽離子硬化性成分之組合,例如可例舉作為環氧化合物之分子量不同之2種脂肪族環氧化合物組合而成者等。As a combination of cationic curable components having different molecular weights, for example, a combination of two types of aliphatic epoxy compounds having different molecular weights as epoxy compounds can be mentioned.

於本發明中,就提高聚合性組合物之聚合物與硬化物之密接性之觀點而言,陽離子硬化性成分較佳為包含選自環氧化合物及氧雜環丁烷化合物中之至少1種。In the present invention, from the viewpoint of improving the adhesion between the polymer of the polymerizable composition and the cured product, the cationic curable component preferably contains at least one selected from epoxy compounds and oxetane compounds .

用作陽離子硬化性成分之環氧化合物只要包含環氧結構,則其種類並無特別限制。例如,包含環氧結構及氧雜環丁烷結構兩者之化合物屬於環氧化合物。作為此種環氧化合物,例如可例舉:芳香族環氧化合物、脂環式環氧化合物、脂肪族環氧化合物等。於本發明中,環氧化合物尤佳為至少包含脂環式環氧化合物。As long as the epoxy compound used as the cationic curable component contains an epoxy structure, the type is not particularly limited. For example, a compound containing both an epoxy structure and an oxetane structure is an epoxy compound. As such an epoxy compound, an aromatic epoxy compound, an alicyclic epoxy compound, an aliphatic epoxy compound, etc. are mentioned, for example. In the present invention, the epoxy compound particularly preferably contains at least an alicyclic epoxy compound.

(1-1-1)脂環式環氧化合物 脂環式環氧化合物係具有脂環與環氧環共有一部分環結構之環氧環烷基者。 再者,於包含芳香族環及環氧環烷基兩者之情形時,屬於脂環式環氧化合物。 作為脂環式環氧化合物,可例舉用氧化劑使含有環己烯環或環戊烯環之化合物環氧化所獲得之含有環氧環己烷或環氧環戊烷之化合物。(1-1-1) Alicyclic epoxy compound The alicyclic epoxy compound has an epoxy cycloalkyl group in which an alicyclic ring and an epoxy ring share a part of the ring structure. Furthermore, when it contains both an aromatic ring and an epoxy cycloalkyl group, it belongs to an alicyclic epoxy compound. As the alicyclic epoxy compound, an epoxycyclohexane or epoxycyclopentane-containing compound obtained by epoxidizing a compound containing a cyclohexene ring or a cyclopentene ring with an oxidizing agent can be exemplified.

作為脂環式環氧化合物,例如可例舉:3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、3,4-環氧-1-甲基環己基-3,4-環氧-1-甲基己烷羧酸酯、6-甲基-3,4-環氧環己基甲基-6-甲基-3,4-環氧環己烷羧酸酯、3,4-環氧-3-甲基環己基甲基-3,4-環氧-3-甲基環己烷羧酸酯、3,4-環氧-5-甲基環己基甲基-3,4-環氧-5-甲基環己烷羧酸酯、2-(3,4-環氧環己基-5,5-螺-3,4-環氧)環己烷-間二㗁烷、雙(3,4-環氧環己基甲基)己二酸酯、3,4-環氧-6-甲基環己基羧酸酯、亞甲基雙(3,4-環氧環己烷)、二環戊二烯二環氧化物、伸乙基雙(3,4-環氧環己烷羧酸酯)、環氧六氫鄰苯二甲酸二辛酯、環氧六氫鄰苯二甲酸二(2-乙基己基)酯、1-環氧乙基-3,4-環氧環己烷、1,2-環氧-2-環氧乙基環己烷、丙烯酸3,4-環氧環己基甲酯、甲基丙烯酸3,4-環氧環己基甲酯等。作為脂環式環氧化合物,就硬化性優異之觀點而言,尤佳為3,4-環氧環己烷羧酸3,4-環氧環己基甲酯、3,4-環氧-1-甲基環己基-3,4-環氧-1-甲基己烷羧酸酯等。又,於陽離子硬化性組合物含有染料之情形時,就能夠獲得所需波長區域之光吸收性優異之硬化物之觀點而言較佳。包含脂肪族環及芳香族環兩者之環氧化合物屬於脂環式環氧化合物。As an alicyclic epoxy compound, for example, 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexyl methyl ester, 3,4-epoxy-1-methylcyclohexyl-3 ,4-Epoxy-1-methylhexane carboxylate, 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexane carboxylate, 3,4-Epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexane carboxylate, 3,4-epoxy-5-methylcyclohexylmethyl- 3,4-Epoxy-5-methylcyclohexane carboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-meta Alkyl, bis(3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexylcarboxylate, methylene bis(3,4-epoxycyclohexyl) Alkane), dicyclopentadiene diepoxide, ethylenebis(3,4-epoxycyclohexane carboxylate), dioctyl epoxyhexahydrophthalate, epoxyhexahydrophthalate Di(2-ethylhexyl) dicarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, acrylic acid 3,4 -Epoxycyclohexyl methyl ester, 3,4-epoxycyclohexyl methyl methacrylate, etc. As the alicyclic epoxy compound, from the viewpoint of excellent curability, 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexyl methyl ester and 3,4-epoxy-1 are particularly preferred -Methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate, etc. Moreover, when the cationic curable composition contains a dye, it is preferable from the viewpoint that a cured product having excellent light absorption in the desired wavelength region can be obtained. Epoxy compounds containing both aliphatic and aromatic rings belong to alicyclic epoxy compounds.

作為脂環式環氧化合物,亦可使用市售品。作為此種市售品,例如可例舉日本專利第6103653號公報等所記載者。As an alicyclic epoxy compound, you may use a commercial item. As such a commercially available product, for example, those described in Japanese Patent No. 6103653, etc. may be mentioned.

作為脂環式環氧化合物,亦可較佳地使用式(21)所表示之化合物。As the alicyclic epoxy compound, the compound represented by formula (21) can also be preferably used.

[化29]

Figure 02_image057
[化29]
Figure 02_image057

式中,n1表示1或2之整數, 於n1為1之情形時,A表示碳原子數1~30之一價烴基、或該烴基中之1個以上之亞甲基被取代為選自下述群(II)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰,該烴基中之1個以上之氫原子可被環氧基取代, 於n1為2之情形時,A表示碳原子數1~30之二價烴基、或該二價烴基中之1個以上之亞甲基被取代為選自下述群(II)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰,該二價烴基中之1個以上之氫原子可被環氧基取代。 群(II):-O-、-S-、-NR31 -、-NR31 -(C=O)-O-、-CO-、-(C=O)-O-、-O-(C=O)-或-O-(C=O)-O-。R31 表示氫原子或碳原子數1~30之一價烴基。In the formula, n1 represents an integer of 1 or 2. When n1 is 1, A represents a monovalent hydrocarbon group with 1 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group are substituted to be selected from the following A group composed of a divalent group of the group (II), wherein when two or more methylene groups are substituted with a divalent group selected from the following group (I), the divalent group is not adjacent , One or more hydrogen atoms in the hydrocarbyl group may be substituted by an epoxy group. When n1 is 2, A represents a divalent hydrocarbyl group with 1 to 30 carbon atoms, or one or more of the divalent hydrocarbyl groups The methylene group is substituted with a divalent group selected from the following group (II), wherein two or more methylene groups are substituted with a divalent group selected from the following group (I) In this case, the divalent groups are not adjacent, and more than one hydrogen atom in the divalent hydrocarbon group may be substituted by epoxy groups. Group (II): -O-, -S-, -NR 31 -, -NR 31 -(C=O)-O-, -CO-, -(C=O)-O-, -O-(C =O)-or -O-(C=O)-O-. R 31 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms.

作為式(21)中之A及R31 所表示之碳原子數1~30之一價烴基,可與上述通式(A1)中之R1 、R2 及R3 、以及基(a)中之R4 所表示之碳原子數1~30之一價烴基相同。 作為式(21)中之A所表示之碳原子數1~30之二價烴基,可與上述通式(A1)中n1=2時之R1 所表示之碳原子數1~30之二價烴基相同。 又,關於上述碳原子數1~30之一價烴基及碳原子數1~30之二價烴基,於基中之氫原子被取代基取代之情形時,作為取代基,可使用將上述通式(A1)中之R1 等所採用之烴基中之氫原子取代的取代基之例示基及環氧基等。As the monovalent hydrocarbon group with 1 to 30 carbon atoms represented by A and R 31 in formula (21), it can be combined with R 1 , R 2 and R 3 in the above general formula (A1), and in the group (a) The monovalent hydrocarbon groups with 1 to 30 carbon atoms represented by R 4 are the same. As the divalent hydrocarbon group with 1 to 30 carbon atoms represented by A in the formula (21), it can be used with the divalent hydrocarbon group with 1 to 30 carbon atoms represented by R 1 when n1 = 2 in the general formula (A1). The hydrocarbon groups are the same. In addition, regarding the above-mentioned monovalent hydrocarbon group with 1 to 30 carbon atoms and a divalent hydrocarbon group with 1 to 30 carbon atoms, when the hydrogen atom in the group is substituted by a substituent, as the substituent, the above general formula can be used (A1) Exemplary groups and epoxy groups etc. of the substituents substituted by hydrogen atoms in the hydrocarbon groups used for R 1 etc. in (A1).

於本發明中,於式(21)中之n1為1之情形時,A較佳為碳原子數1~30之一價烴基,其中,較佳為有時具有取代基之碳原子數1~30之烷基。其原因在於,容易進一步提高聚合性組合物之聚合物與硬化物之密接性。n為1時之A之碳原子數較佳為1~20,其中,較佳為1~10,尤佳為1~4。作為取代該A所採用之一價烴基中之1個以上氫原子的取代基,可較佳地使用環氧基。其原因在於,容易進一步提高聚合性組合物之聚合物與硬化物之密接性。In the present invention, when n1 in formula (21) is 1, A is preferably a monovalent hydrocarbon group having 1 to 30 carbon atoms, and among these, it is preferably a monovalent hydrocarbon group having 1 to 30 carbon atoms which may have a substituent. The alkyl group of 30. The reason is that it is easy to further improve the adhesion between the polymer of the polymerizable composition and the cured product. When n is 1, the number of carbon atoms of A is preferably 1-20, and among them, it is preferably 1-10, and particularly preferably 1-4. As the substituent for substituting one or more hydrogen atoms in the monovalent hydrocarbon group used in A, an epoxy group can be preferably used. The reason is that it is easy to further improve the adhesion between the polymer of the polymerizable composition and the cured product.

於本發明中,於式(21)中之n1為2之情形時,A較佳為碳原子數1~30之二價烴基中之1個以上之亞甲基被取代為選自上述群(II)之二價基而成之基,其中,較佳為有時具有取代基之碳原子數1~30之伸烷基中之亞甲基被取代為選自上述群(II)之二價基而成之基,取代有時具有取代基之碳原子數1~30之伸烷基中之亞甲基的二價基較佳為包含-O-(C=O)-或-O-(C=O)-O-。n為2時之A之碳原子數較佳為1~20,其中,較佳為2~10。其原因在於,容易進一步提高聚合性組合物之聚合物與硬化物之密接性。In the present invention, when n1 in formula (21) is 2, A is preferably a divalent hydrocarbon group having 1 to 30 carbon atoms. One or more methylene groups are substituted to be selected from the above group ( II) is a group consisting of a divalent group, and among them, it is preferable that the methylene group in the alkylene group having 1 to 30 carbon atoms that may have a substituent is substituted with a divalent group selected from the above group (II) It is preferable that the divalent group substituted for the methylene group in the alkylene having 1 to 30 carbon atoms which may have a substituent includes -O-(C=O)- or -O-( C=O)-O-. When n is 2, the number of carbon atoms of A is preferably 1-20, and among them, 2-10 is preferable. The reason is that it is easy to further improve the adhesion between the polymer of the polymerizable composition and the cured product.

陽離子硬化性組合物中所包含之脂環式環氧化合物之含量例如於陽離子硬化性成分100質量份中較佳為40質量份以上,其中,較佳為50質量份以上,進而較佳為60質量份以上90質量份以下。其原因在於,容易進一步提高聚合性組合物之聚合物與硬化物之密接性。The content of the alicyclic epoxy compound contained in the cationic curable composition is, for example, preferably 40 parts by mass or more in 100 parts by mass of the cationic curable component, and among them, it is preferably 50 parts by mass or more, and more preferably 60 parts by mass. Parts by mass or more and 90 parts by mass or less. The reason is that it is easy to further improve the adhesion between the polymer of the polymerizable composition and the cured product.

(1-1-2)芳香族環氧化合物 芳香族環氧化合物只要為具有芳香族環之環氧化合物即可,係不包含環氧環烷基之環氧化合物。 作為此種芳香族環氧化合物之具體例,可例舉:具有至少1個芳香族環之多酚、或其環氧烷加成物之聚縮水甘油醚、例如雙酚A、雙酚F、或對其等進而加成環氧烷而成之化合物之縮水甘油醚化物或苯酚酚醛清漆型環氧化合物;間苯二酚或對苯二酚、鄰苯二酚等具有2個以上酚性羥基之芳香族化合物之縮水甘油醚;苯二甲醇或苯二乙醇、苯二丁醇等具有2個以上醇性羥基之芳香族化合物之聚縮水甘油醚化物;鄰苯二甲酸、對苯二甲酸、偏苯三甲酸等具有2個以上羧酸之多元酸芳香族化合物之聚縮水甘油酯、苯甲酸或甲苯甲酸、萘甲酸等苯甲酸類之聚縮水甘油酯、苯甲酸之縮水甘油酯、氧化苯乙烯或二乙烯苯之環氧化物等。其中,較佳為含有選自酚類之聚縮水甘油醚、具有2個以上醇性羥基之芳香族化合物之聚縮水甘油醚化物、多酚類之聚縮水甘油醚化物、苯甲酸類之聚縮水甘油酯、多元酸類之聚縮水甘油酯之群中之至少1種,尤佳為具有2個以上醇性羥基之芳香族化合物之聚縮水甘油醚化物。(1-1-2) Aromatic epoxy compound The aromatic epoxy compound should just be an epoxy compound which has an aromatic ring, and is an epoxy compound which does not contain an epoxy cycloalkyl group. As a specific example of such an aromatic epoxy compound, a polyphenol having at least one aromatic ring, or a polyglycidyl ether of an alkylene oxide adduct thereof, such as bisphenol A, bisphenol F, Or the glycidyl etherate or phenol novolak type epoxy compound of a compound obtained by adding alkylene oxide to it; resorcinol, hydroquinone, catechol, etc. have two or more phenolic hydroxyl groups Glycidyl ethers of aromatic compounds; polyglycidyl ethers of aromatic compounds with more than two alcoholic hydroxyl groups such as benzenedimethanol, benzenediethanol, and benzenedibutanol; phthalic acid, terephthalic acid, Trimellitic acid and other polyglycidyl esters of aromatic compounds with more than two carboxylic acids, benzoic acid or toluic acid, naphthoic acid and other benzoic acid polyglycidyl esters, benzoic acid glycidyl esters, benzene oxide Epoxides of ethylene or divinylbenzene, etc. Among them, preferred are polyglycidyl ethers containing polyglycidyl ethers selected from phenols, aromatic compounds having two or more alcoholic hydroxyl groups, polyglycidyl ethers of polyphenols, and polyglycidyls of benzoic acid. At least one of glycerides and polyglycidyl esters of polybasic acids is particularly preferably a polyglycidyl etherate of an aromatic compound having two or more alcoholic hydroxyl groups.

作為芳香族化合物環氧化合物,可較佳地使用式(22)所表示之化合物。As the aromatic compound epoxy compound, a compound represented by formula (22) can be preferably used.

[化30]

Figure 02_image059
[化30]
Figure 02_image059

式中,Ra 表示亞甲基、-CH(CH3 )-、-C(CH3 )2 -、或-CH(Rd ),Rb 表示碳原子數1~4之伸烷基,Rc 表示直接鍵或-O-,Rd 表示下述式(b)所表示之基,n2表示1~4之整數。Wherein, R a represents a methylene group, -CH (CH 3) -, - C (CH 3) 2 -, or -CH (R d), R b represents a number of 1 to 4 carbon atoms, alkyl of stretch, R c represents a direct bond or -O-, R d represents a group represented by the following formula (b), and n2 represents an integer of 1-4.

[化31]

Figure 02_image061
[化31]
Figure 02_image061

式中,Ra' 表示亞甲基、-CH(CH3 )-、或-C(CH3 )2 -,Rb' 表示碳原子數1~4之伸烷基,Rc' 表示直接鍵或-O-,n2'表示1~4之整數,*表示鍵結鍵。Wherein, R a 'represents a methylene group, -CH (CH 3) -, or -C (CH 3) 2 -, R b' represents a number of 1 to 4 carbon atoms, alkyl of stretch, R c 'represents a direct bond Or -O-, n2' represents an integer from 1 to 4, and * represents a bonding bond.

作為Rb 及Rb' 所表示之碳原子數1~4之伸烷基,可設為R1 所表示之碳原子數1~30之伸烷基中之碳原子數1~4者。The alkylene group having 1 to 4 carbon atoms represented by R b and R b'may be one having 1 to 4 carbon atoms in the alkylene group having 1 to 30 carbon atoms represented by R 1.

作為芳香族環氧化合物,亦可使用市售品。作為此種市售品,例如可例舉日本專利第6103653號公報等所記載者。As the aromatic epoxy compound, commercially available products may also be used. As such a commercially available product, for example, those described in Japanese Patent No. 6103653, etc. may be mentioned.

芳香族環氧化合物之含量並無特別限制,例如於陽離子硬化性成分100質量份中,可設為0質量份以上60質量份以下。於上述陽離子硬化性成分含有芳香族環氧化合物之情形時,芳香族環氧化合物之含量於陽離子硬化性成分100質量份中較佳為1質量份以上50質量份以下,其中,較佳為5質量份以上20質量份以下。其原因在於,藉由將含量設為該範圍,陽離子硬化性組合物之塗佈性及硬化性之平衡優異。The content of the aromatic epoxy compound is not particularly limited. For example, in 100 parts by mass of the cationic curable component, it can be set to 0 parts by mass or more and 60 parts by mass or less. When the above-mentioned cationic curable component contains an aromatic epoxy compound, the content of the aromatic epoxy compound in 100 parts by mass of the cationic curable component is preferably 1 part by mass or more and 50 parts by mass or less, and among them, it is preferably 5 Parts by mass or more and 20 parts by mass or less. The reason is that, by setting the content in this range, the balance between the coatability and curability of the cationic curable composition is excellent.

(1-1-3)脂肪族環氧化合物 作為脂肪族環氧化合物,只要為不包含芳香族環及環氧環烷基之環氧化合物即可,可例舉:具有至少1個脂肪族環之多元醇之聚縮水甘油醚、脂肪族多元醇或其環氧烷加成物之聚縮水甘油醚、脂肪族長鏈多元酸之聚縮水甘油酯、丙烯酸縮水甘油酯或甲基丙烯酸縮水甘油酯進行乙烯基聚合所合成之均聚物;丙烯酸縮水甘油酯或甲基丙烯酸縮水甘油酯與其他乙烯基單體進行乙烯基聚合所合成之共聚物等。(1-1-3) Aliphatic epoxy compound The aliphatic epoxy compound may be an epoxy compound that does not contain an aromatic ring and an epoxycycloalkyl group, and examples include: polyglycidyl ether of a polyol having at least one aliphatic ring, and aliphatic polyvalent Homopolymer synthesized by vinyl polymerization of polyglycidyl ether of alcohol or its alkylene oxide adduct, polyglycidyl ester of aliphatic long-chain polybasic acid, glycidyl acrylate or glycidyl methacrylate; glycidyl acrylate Copolymers of glycerol ester or glycidyl methacrylate and other vinyl monomers through vinyl polymerization.

作為代表性之脂肪族環氧化合物,可例舉:氫化雙酚A二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、甘油之三縮水甘油醚、三羥甲基丙烷之三縮水甘油醚、山梨醇之四縮水甘油醚、二季戊四醇之六縮水甘油醚、聚乙二醇之二縮水甘油醚、聚丙二醇之二縮水甘油醚等多元醇之縮水甘油醚;又,對脂肪族多元醇、例如丙二醇、三羥甲基丙烷、甘油等加成1種或2種以上之環氧烷所獲得的聚醚多元醇之聚縮水甘油醚、脂肪族長鏈二元酸之二縮水甘油酯。進而可例舉:脂肪族高級醇之單縮水甘油醚或苯酚、甲酚、丁基苯酚;又,對其等加成環氧烷所獲得之聚醚醇之單縮水甘油醚、高級脂肪酸之縮水甘油酯、環氧化大豆油、環氧硬脂酸辛酯、環氧硬脂酸丁酯、環氧化聚丁二烯等。再者,脂肪族環氧樹脂可為不包含脂肪族環及芳香族環者。As a representative aliphatic epoxy compound, for example, hydrogenated bisphenol A diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerol ter Glycidyl ether, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, etc. Glycidyl ether of alcohol; In addition, polyglycidyl ether of polyether polyol obtained by adding one or more kinds of alkylene oxide to aliphatic polyols, such as propylene glycol, trimethylolpropane, glycerol, etc., Diglycidyl ester of aliphatic long-chain dibasic acid. Further examples include: monoglycidyl ether of aliphatic higher alcohols or phenol, cresol, butyl phenol; in addition, monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxide to them, and glycidyls of higher fatty acids Glycerides, epoxidized soybean oil, epoxy octyl stearate, epoxy butyl stearate, epoxidized polybutadiene, etc. Furthermore, the aliphatic epoxy resin may not contain an aliphatic ring and an aromatic ring.

脂肪族環氧化合物之含量並無特別限制,例如,於陽離子硬化性成分100質量份中,可設為0質量份以上60質量份以下。於上述陽離子硬化性成分含有脂肪族環氧化合物之情形時,脂肪族環氧化合物之含量於陽離子硬化性成分100質量份中較佳為1質量份以上50質量份以下,其中,較佳為5質量份以上40質量份以下。其原因在於,藉由將含量設為該範圍,陽離子硬化性組合物之塗佈性及硬化性之平衡優異。作為脂肪族環氧化合物,亦可使用市售品。作為此種市售品,例如可例舉日本專利第6103653號公報等所記載者。The content of the aliphatic epoxy compound is not particularly limited. For example, in 100 parts by mass of the cationic curable component, it can be set to 0 parts by mass or more and 60 parts by mass or less. When the above-mentioned cationic curable component contains an aliphatic epoxy compound, the content of the aliphatic epoxy compound in 100 parts by mass of the cationic curable component is preferably 1 part by mass or more and 50 parts by mass or less, and particularly preferably 5 More than 40 parts by mass and less than 40 parts by mass. The reason is that, by setting the content in this range, the balance between the coatability and curability of the cationic curable composition is excellent. As an aliphatic epoxy compound, you may use a commercial item. As such a commercially available product, for example, those described in Japanese Patent No. 6103653, etc. may be mentioned.

陽離子硬化性成分中所包含之各種環氧化合物之合計含量於陽離子硬化性成分100質量份中較佳為50質量份以上,進而較佳為60質量份以上,進而較佳為80質量份以上。其原因在於,這樣會使得陽離子硬化性組合物之塗佈性及硬化性之平衡優異。The total content of the various epoxy compounds contained in the cationic curable component is preferably 50 parts by mass or more in 100 parts by mass of the cationic curable component, more preferably 60 parts by mass or more, and still more preferably 80 parts by mass or more. The reason is that this will make the cationic curable composition have an excellent balance between coatability and curability.

作為陽離子硬化性組合物中所包含之陽離子硬化性成分,如上所述,亦可使用氧雜環丁烷化合物。作為氧雜環丁烷化合物,可為具有氧雜環丁烷結構且不包含環氧結構者。作為此種氧雜環丁烷化合物,例如可例舉日本專利第6103653號公報等所記載之化合物。As the cationic curable component contained in the cationic curable composition, as described above, an oxetane compound can also be used. As an oxetane compound, what has an oxetane structure and does not contain an epoxy structure may be sufficient. As such an oxetane compound, the compound described in Japanese Patent No. 6103653 etc. can be mentioned, for example.

氧雜環丁烷化合物之含量並無特別限制,例如,於陽離子硬化性成分100質量份中,可設為0質量份以上40質量份以下。於上述陽離子硬化性成分含有氧雜環丁烷化合物之情形時,氧雜環丁烷化合物之含量較佳為10質量份以上30質量份以下。其原因在於,這樣會使得陽離子硬化性組合物之塗佈性及硬化性之平衡優異。The content of the oxetane compound is not particularly limited. For example, in 100 parts by mass of the cationic curable component, it can be set to 0 parts by mass or more and 40 parts by mass or less. When the cation curable component contains an oxetane compound, the content of the oxetane compound is preferably 10 parts by mass or more and 30 parts by mass or less. The reason is that this will make the cationic curable composition have an excellent balance between coatability and curability.

作為陽離子硬化性組合物中所包含之陽離子硬化性成分,除了如上所述者以外,亦可例舉硫雜環丙烷化合物及硫雜環丁烷化合物等。進而,亦可將環狀內酯化合物、環狀縮醛化合物、環狀硫醚化合物、螺原酸酯化合物、以及乙烯醚化合物及乙烯性不飽和化合物等乙烯系化合物等用作陽離子硬化性成分。關於該等陽離子硬化性成分之詳細內容,可與國際公開第2013/172145號公報所記載之內容相同。As the cation curable component contained in the cation curable composition, in addition to the above, a thiane compound, a thietane compound, and the like may also be exemplified. Furthermore, cyclic lactone compounds, cyclic acetal compounds, cyclic thioether compounds, spiroorthoester compounds, and vinyl compounds such as vinyl ether compounds and ethylenically unsaturated compounds can also be used as cation curable components. . The details of these cationic curable components may be the same as those described in International Publication No. 2013/172145.

陽離子硬化性組合物中所包含之陽離子硬化性成分可為低分子量化合物及高分子量化合物中任一者。就陽離子硬化性組合物之易塗佈性等觀點而言,陽離子硬化性成分較佳為低分子量化合物。又,低分子量化合物於陽離子硬化性組合物中之分散性或溶解性等優異,故而能夠獲得透明性優異之硬化物,就該方面而言亦有利。另一方面,就提高陽離子硬化性組合物之硬化物之密接性之觀點而言,陽離子硬化性成分較佳為高分子量化合物。The cationic curable component contained in the cationic curable composition may be any one of a low molecular weight compound and a high molecular weight compound. From the viewpoint of easy coating of the cationic curable composition, the cationic curable component is preferably a low molecular weight compound. In addition, the low-molecular-weight compound is excellent in dispersibility, solubility, etc. in the cation curable composition, so it is possible to obtain a cured product having excellent transparency, which is also advantageous in this respect. On the other hand, from the viewpoint of improving the adhesion of the cured product of the cationic curable composition, the cationic curable component is preferably a high molecular weight compound.

就塗佈性等觀點而言,陽離子硬化性組合物較佳為至少包含低分子量化合物作為陽離子硬化性成分。但就陽離子硬化性組合物之易塗佈性與由該陽離子硬化性組合物所獲得之硬化物之密接性之平衡之觀點而言,陽離子硬化性組合物亦可包含低分子量化合物及高分子量化合物兩者。From the viewpoint of coatability and the like, the cationic curable composition preferably contains at least a low molecular weight compound as the cationic curable component. However, from the viewpoint of the balance between the ease of coating of the cationic curable composition and the adhesion of the cured product obtained from the cationic curable composition, the cationic curable composition may also include low molecular weight compounds and high molecular weight compounds Both.

作為低分子量化合物之分子量,只要能夠獲得所需塗佈性等即可,例如可設為1000以下,較佳為50以上500以下,其中,較佳為50以上300以下。另一方面,高分子量化合物之分子量只要能夠獲得所需易接著性等即可,例如,可設為大於1000,較佳為1000以上50000以下,其中,較佳為1000以上10000以下。於本說明書中,分子量意指化合物為聚合體之情形時之重量平均分子量(Mw)。重量平均分子量可利用凝膠滲透層析法(GPC)以標準聚苯乙烯換算值求出。具體而言,關於重量平均分子量Mw,例如可使用日本分光(股)製造之GPC(LC-2000plus系列),將溶出溶劑設為四氫呋喃,將校準曲線用聚苯乙烯標準設為Mw1110000、707000、397000、189000、98900、37200、13700、9490、5430、3120、1010、589(東曹(股)製造之TSKgel標準聚苯乙烯),將測定管柱設為KF-804、KF-803、KF-802(昭和電工(股)製造)進行測定而獲得。測定溫度可設為40℃,流速可設為1.0 mL/分。The molecular weight of the low-molecular-weight compound may be as long as the desired coatability and the like can be obtained. For example, it can be set to 1000 or less, preferably 50 or more and 500 or less, and among them, 50 or more and 300 or less. On the other hand, the molecular weight of the high-molecular-weight compound may be as long as the desired adhesiveness and the like can be obtained. For example, it may be greater than 1,000, preferably 1,000 or more and 50,000 or less, and among them, 1,000 or more and 10,000 or less. In this specification, the molecular weight means the weight average molecular weight (Mw) when the compound is a polymer. The weight average molecular weight can be calculated by gel permeation chromatography (GPC) in terms of standard polystyrene. Specifically, for the weight average molecular weight Mw, for example, GPC (LC-2000plus series) manufactured by JASCO Corporation can be used, the elution solvent is tetrahydrofuran, and the polystyrene standard for the calibration curve is Mw1110000, 707000, 397000 , 189000, 98900, 37200, 13700, 9490, 5430, 3120, 1010, 589 (TSKgel standard polystyrene manufactured by Tosoh Corporation), set the measuring column to KF-804, KF-803, KF-802 (Manufactured by Showa Denko Co., Ltd.). The measurement temperature can be set to 40°C, and the flow rate can be set to 1.0 mL/min.

陽離子硬化性組合物中所包含之低分子量化合物之含量並無特別限制,例如,於陽離子硬化性成分100質量份中較佳為10質量份以上,其中,較佳為30質量份以上,尤佳為50質量份以上,較佳為60質量份以上。其原因在於,藉由使上述含量處於上述範圍內,陽離子硬化性組合物之塗佈性及硬化性之平衡優異。The content of the low-molecular-weight compound contained in the cationic curable composition is not particularly limited. For example, it is preferably 10 parts by mass or more in 100 parts by mass of the cationic curable component, and more preferably 30 parts by mass or more, particularly It is 50 parts by mass or more, preferably 60 parts by mass or more. The reason for this is that by setting the above content within the above range, the cationic curable composition has an excellent balance between coatability and curability.

陽離子硬化性組合物中之陽離子硬化性成分之含量並無特別限制,例如,於陽離子硬化性組合物之固形物成分100質量份中,可設為50質量份以上,較佳為50質量份以上99質量份以下,其中,較佳為70質量份以上96質量份以下,其中,較佳為85質量份以上95質量份以下。其原因在於,藉由使上述含量處於上述範圍內,陽離子硬化性組合物之塗佈性及硬化性之平衡優異。The content of the cationic curable component in the cationic curable composition is not particularly limited. For example, in 100 parts by mass of the solid component of the cationic curable composition, it can be 50 parts by mass or more, preferably 50 parts by mass or more 99 parts by mass or less, among them, 70 parts by mass or more and 96 parts by mass or less are preferable, and among them, 85 parts by mass or more and 95 parts by mass or less are preferable. The reason for this is that by setting the above content within the above range, the cationic curable composition has an excellent balance between coatability and curability.

又,陽離子硬化性成分之含量於陽離子硬化性組合物中之樹脂成分100質量份中,可設為50質量份以上,較佳為80質量份以上,其中,較佳為90質量份以上,尤佳為95質量份以上。又,亦可為100質量份,即,僅包含陽離子硬化性成分作為樹脂成分。其原因在於,藉由使上述含量處於上述範圍內,陽離子硬化性組合物之塗佈性及硬化性之平衡優異。In addition, the content of the cationic curable component in 100 parts by mass of the resin component in the cationic curable composition can be 50 parts by mass or more, preferably 80 parts by mass or more, and among them, 90 parts by mass or more, especially Preferably, it is 95 parts by mass or more. Moreover, it may be 100 parts by mass, that is, only the cationic curable component may be contained as the resin component. The reason for this is that by setting the above content within the above range, the cationic curable composition has an excellent balance between coatability and curability.

(1-2)酸產生劑 作為與陽離子硬化性成分一併包含於硬化性組合物中之酸產生劑,只要為可在特定條件下產生酸之化合物,則無論為哪一種都沒問題,並無特別限定。作為此種酸產生劑,例如可使用:可藉由紫外線照射等光照射來產生酸之光酸產生劑、可藉由熱來產生酸之熱酸產生劑。作為酸產生劑,可使用光酸產生劑及熱酸產生劑中至少一者。就容易硬化之觀點、能夠減少硬化時對與陽離子硬化性組合物相鄰使用之周邊構件所造成的熱損傷、周邊構件之選擇自由度提高之觀點等而言,較佳為光酸產生劑。又,光酸產生劑亦有硬化速度較快之優點。另一方面,就光難以到達之位置亦容易形成硬化物之觀點而言,酸產生劑較佳為熱酸產生劑。又,熱酸產生劑由於硬化速度相對較慢,故而利用其進行硬化處理(加熱處理)後,能夠容易地與其他構件貼合。(1-2) Acid generator As the acid generator contained in the curable composition together with the cation curable component, there is no problem in any of them as long as it is a compound that can generate an acid under specific conditions, and is not particularly limited. As such an acid generator, for example, a photoacid generator that can generate acid by light irradiation such as ultraviolet irradiation, and a thermal acid generator that can generate acid by heat can be used. As the acid generator, at least one of a photoacid generator and a thermal acid generator can be used. From the viewpoint of ease of hardening, the ability to reduce thermal damage to peripheral members used adjacent to the cationic curable composition during hardening, and the viewpoint of increasing the freedom of choice of peripheral members, a photoacid generator is preferred. In addition, the photoacid generator also has the advantage of a faster curing speed. On the other hand, the acid generator is preferably a thermal acid generator from the viewpoint that a hardened product is easily formed at a position hard to reach by light. In addition, since the thermal acid generator has a relatively slow curing speed, it can be easily bonded to other members after being subjected to a curing treatment (heat treatment) with the thermal acid generator.

陽離子硬化性組合物中所包含之酸產生劑之含量以單獨或複數種之合計量計,於陽離子硬化性組合物之固形物成分100質量份中,可設為0.01質量份以上10質量份以下,其中,較佳為0.1質量份以上5質量份以下。其原因在於,這樣能夠更有效地發揮本發明之酸成分捕獲性優異之效果。The content of the acid generator contained in the cation curable composition is singly or the total amount of plural kinds, in 100 parts by mass of the solid content of the cationic curable composition, it can be set to 0.01 parts by mass or more and 10 parts by mass or less Among them, it is preferably not less than 0.1 parts by mass and not more than 5 parts by mass. The reason for this is that it is possible to more effectively exhibit the excellent acid component trapping effect of the present invention.

於陽離子硬化性組合物中,酸產生劑相對於陽離子硬化性成分之使用比率並無特別限定,只要在不阻礙本發明目的之範圍內以大致通常之使用比率使用即可。例如,相對於陽離子硬化性成分100質量份,酸產生劑較佳為0.05質量份以上10質量份以下,較佳為0.5質量份以上8質量份以下,較佳為1質量份以上7質量份以下。其原因在於,藉由將使用比率設為上述範圍,能夠使陽離子硬化性成分充分地硬化,並且更有效地發揮本發明之酸成分捕獲性優異之效果。In the cationic curable composition, the use ratio of the acid generator to the cationic curable component is not particularly limited, as long as it is used at a generally normal use ratio within a range that does not hinder the purpose of the present invention. For example, relative to 100 parts by mass of the cationic curable component, the acid generator is preferably 0.05 parts by mass or more and 10 parts by mass or less, preferably 0.5 parts by mass or more and 8 parts by mass or less, preferably 1 part by mass or more and 7 parts by mass or less . The reason is that by setting the use ratio in the above range, the cationic curable component can be sufficiently hardened, and the effect of the present invention of excellent acid component trapping properties can be more effectively exhibited.

作為用作陽離子硬化性組合物中所含酸產生劑之光酸產生劑,可無特別限制地使用公知者。於本發明中,就感度之方面而言,進而較佳為下述式(2)所表示之芳香族鋶鹽。又,其原因在於,藉由使光酸產生劑為上述芳香族鋶鹽,上述芳香族鋶鹽之酸產生效率優異,因此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。As a photoacid generator used as an acid generator contained in a cation curable composition, a well-known thing can be used without a restriction|limiting in particular. In the present invention, in terms of sensitivity, the aromatic sulfonium salt represented by the following formula (2) is more preferable. In addition, the reason is that by using the above-mentioned aromatic sulfonium salt as the photoacid generator, the above-mentioned aromatic sulfonium salt is excellent in acid generation efficiency, and therefore the excellent acid component trapping effect of the present invention can be exerted more effectively.

[化32]

Figure 02_image063
[化32]
Figure 02_image063

(式中,R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 及R34 分別獨立地表示氫原子、鹵素原子、有時具有取代基之碳原子數1~10之烷基、該烷基中之除鍵結部位側末端以外之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基、有時具有取代基之碳原子數1~10之烷氧基、該烷氧基中之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基、有時具有取代基之碳原子數1~10之酯基、或上述酯基中之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基, R35 表示氫原子、鹵素原子、有時具有取代基之碳原子數1~10之烷基、該烷基中之除鍵結部位側末端以外之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基、或選自下述式(A)~(C)中之任一取代基, Anq- 表示q價陰離子, q表示1或2之整數, p表示使電荷變為中性之係數)(In the formula, R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 and R 34 each independently represent hydrogen Atoms, halogen atoms, sometimes substituted alkyl groups with 1 to 10 carbon atoms, and methylene groups other than the end of the bonding site in the alkyl group are substituted under the condition that oxygen atoms are not adjacent to each other. A group formed from a divalent group of the above group (I), an alkoxy group having 1 to 10 carbon atoms that may have a substituent, and the methylene group in the alkoxy group is not adjacent to oxygen atoms A group substituted with a divalent group selected from the above group (I), an ester group with 1 to 10 carbon atoms that may have a substituent, or the methylene group in the above ester group is not adjacent to an oxygen atom It is substituted with a divalent group selected from the above group (I) under the conditions, R 35 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms that may have a substituent, the alkyl group Among them, the methylene group other than the end of the bonding site is substituted with a divalent group selected from the above group (I) under the condition that the oxygen atom is not adjacent, or is selected from the following formula (A) Any of the substituents in ~(C), An q- represents an anion of q valence, q represents an integer of 1 or 2, and p represents a coefficient that makes the charge neutral)

[化33]

Figure 02_image065
[化33]
Figure 02_image065

式中,*表示鍵結鍵。In the formula, * represents the bonding bond.

(式中,R121 、R122 、R123 、R124 、R125 、R126 、R127 、R128 、R129 、R130 、R131 、R132 、R133 、R134 、R136 、R137 、R138 、R139 、R140 、R141 、R142 、R143 及R144 、R145 、R146 、R147 、R148 及R149 分別獨立地表示氫原子、鹵素原子、有時具有取代基之碳原子數1~10之烷基、該烷基中之除鍵結部位側末端以外之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基、有時具有取代基之碳原子數1~10之烷氧基、該烷氧基中之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基、有時具有取代基之碳原子數1~10之酯基、或該酯基中之亞甲基在氧原子不相鄰之條件下被取代為選自上述群(I)之二價基而成之基, *表示式(2)中之與S之鍵結位置)(In the formula, R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 and R 144 , R 145 , R 146 , R 147 , R 148 and R 149 each independently represent a hydrogen atom, a halogen atom, and sometimes have The substituent is an alkyl group having 1 to 10 carbon atoms, and the methylene group in the alkyl group other than the end of the bonding site is substituted with the two selected from the above group (I) under the condition that the oxygen atom is not adjacent A group consisting of a valence group, an alkoxy group having 1 to 10 carbon atoms which may have a substituent, and the methylene group in the alkoxy group is substituted to be selected from the above group under the condition that the oxygen atom is not adjacent to each other ( I) a divalent group, sometimes a substituted ester group with 1 to 10 carbon atoms, or the methylene group in the ester group is substituted under the condition that the oxygen atom is not adjacent to selected from The base formed by the divalent base of the above group (I), *represents the bonding position with S in formula (2))

於上述式(2)所表示之化合物中,作為R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 、R35 、R121 、R122 、R123 、R124 、R125 、R126 、R127 、R128 、R129 、R130 、R131 、R132 、R133 、R134 、R136 、R137 、R138 、R139 、R140 、R141 、R142 、R143 、R144 、R145 、R146 、R147 、R148 及R149 所表示之鹵素原子,可例舉:氟、氯、溴、碘等。In the compound represented by the above formula (2), as R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , The halogen atoms represented by R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 , R 144 , R 145 , R 146 , R 147 , R 148 and R 149 can be exemplified : Fluorine, chlorine, bromine, iodine, etc.

上述式(2)所表示之化合物中,作為R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 、R35 、R121 、R122 、R123 、R124 、R125 、R126 、R127 、R128 、R129 、R130 、R131 、R132 、R133 、R134 、R136 、R137 、R138 、R139 、R140 、R141 、R142 、R143 、R144 、R145 、R146 、R147 、R148 及R149 所表示之碳原子數1~10之烷基,可例舉:上述「1.第1聚合性化合物」之「(1)丙烯醯胺化合物」之項所記載之通式(A1)中之R2 所採用之基之例示碳原子數1~30之烷基、碳原子數3~30之環烷基及碳原子數4~30之環烷基烷基、以及該等基中之亞甲基之1個以上(鍵結部位側末端除外)被取代為上述群(I)所表示之二價基而成之基(再者,上述群(I)所表示之二價基不相鄰)中的滿足特定碳原子數者。 又,作為將上述有時具有取代基之碳原子數1~10之烷基中之氫原子取代的取代基,可例舉將上述「1.第1聚合性化合物」之「(1)丙烯醯胺化合物」之項所記載之烴基中之氫原子取代的取代基之例示基。 作為此種R21 等所採用之烷基,可例舉:甲基、乙基、丙基、異丙基、丁基、第二丁基、第三丁基、異丁基、戊基、異戊基、第三戊基、己基、環己基、庚基、辛基、壬基、乙基辛基、2-甲氧基乙基、3-甲氧基丙基、4-甲氧基丁基、2-丁氧基乙基、甲氧基乙氧基乙基、甲氧基乙氧基乙氧基乙基、3-甲氧基丁基、2-甲硫基乙基、氟甲基、二氟甲基、三氟甲基、氯甲基、二氯甲基、三氯甲基、溴甲基、二溴甲基、三溴甲基、二氟乙基、三氯乙基、二氯二氟乙基、五氟乙基、七氟丙基、九氟丁基、十氟戊基、十三氟己基、十五氟庚基、十七氟辛基、甲氧基甲基、1,2-環氧乙基、甲氧基乙基、甲氧基乙氧基甲基、甲硫基甲基、乙氧基乙基、丁氧基甲基、第三丁硫基甲基、4-戊烯氧基甲基、三氯乙氧基甲基、雙(2-氯乙氧基)甲基、甲氧基環己基、1-(2-氯乙氧基)乙基、1-甲基-1-甲氧基乙基、乙基二硫基乙基、三甲基矽烷基乙基、第三丁基二甲基矽烷氧基甲基、2-(三甲基矽烷基)乙氧基甲基、第三丁氧基羰基甲基、乙基氧基羰基甲基、乙基羰基甲基、第三丁氧基羰基甲基、丙烯醯氧基乙基、甲基丙烯醯氧基乙基、2-甲基-2-金剛烷氧基羰基甲基、乙醯基乙基、2-甲氧基-1-丙烯基、羥甲基、2-羥乙基、1-羥乙基、2-羥丙基、3-羥丙基、3-羥丁基、4-羥丁基、1,2-二羥乙基等。In the compound represented by the above formula (2), R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 35 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 , R 144 , R 145 , R 146 , R 147 , R 148 and R 149 have 1 to 10 carbon atoms Examples of the alkyl group include the number of carbon atoms of the group used for R 2 in the general formula (A1) described in the item of "(1) acrylamide compound" in the above "1. First polymerizable compound" 1-30 alkyl, 3-30 cycloalkyl, 4-30 cycloalkylalkyl, and 1 or more methylene groups in these groups (bonding site side end Except) is substituted with the divalent group represented by the above group (I) (in addition, the divalent group represented by the above group (I) is not adjacent) satisfying the specified number of carbon atoms. In addition, as the substituent for substituting the hydrogen atom in the alkyl group having 1 to 10 carbon atoms which may have a substituent, the above-mentioned "1. The first polymerizable compound" can be exemplified by "(1) acrylic acid Exemplary groups of substituents substituted by hydrogen atoms in the hydrocarbon groups described in the section of "amine compounds". Examples of the alkyl groups used for such R 21 and the like include methyl, ethyl, propyl, isopropyl, butyl, second butyl, tertiary butyl, isobutyl, pentyl, and isopropyl. Pentyl, tertiary pentyl, hexyl, cyclohexyl, heptyl, octyl, nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl , 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, Difluoromethyl, trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichloro Difluoroethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, tridecafluorohexyl, pentafluoroheptyl, heptafluorooctyl, methoxymethyl, 1, 2-Ethoxyethyl, methoxyethyl, methoxyethoxymethyl, methylthiomethyl, ethoxyethyl, butoxymethyl, tertiary butylthiomethyl, 4- Pentenyloxymethyl, trichloroethoxymethyl, bis(2-chloroethoxy)methyl, methoxycyclohexyl, 1-(2-chloroethoxy)ethyl, 1-methyl -1-Methoxyethyl, ethyldithioethyl, trimethylsilylethyl, tert-butyldimethylsilyloxymethyl, 2-(trimethylsilyl)ethoxy Methyl, tertiary butoxycarbonylmethyl, ethyloxycarbonylmethyl, ethylcarbonylmethyl, tertiary butoxycarbonylmethyl, acryloxyethyl, methacryloxyethyl , 2-Methyl-2-adamantyloxycarbonylmethyl, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydroxyethyl, 1-hydroxyethyl, 2 -Hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, 1,2-dihydroxyethyl, etc.

於上述式(2)所表示之化合物中,作為R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 、R121 、R122 、R123 、R124 、R125 、R126 、R127 、R128 、R129 、R130 、R131 、R132 、R133 、R134 、R136 、R137 、R138 、R139 、R140 、R141 、R142 、R143 及R144 、R145 、R146 、R147 、R148 及R149 所表示之碳原子數1~10之烷氧基,可例舉-O-與烷基之鍵結部位側末端之亞甲基鍵結而成之基。作為構成上述烷氧基之烷基,可使用上述R21 等所採用之烷基之示例。 作為此種R21 等所採用之烷氧基,具體而言,可例舉:甲氧基、乙氧基、丙氧基、異丙氧基、丁基氧基、第二丁基氧基、第三丁基氧基、異丁基氧基、戊基氧基、異戊基氧基、第三戊基氧基、己基氧基、環己基氧基、環己基甲基氧基、四氫呋喃基氧基、四氫哌喃基氧基、2-甲氧基乙基氧基、3-甲氧基丙氧基、4-甲氧基丁基氧基、2-丁氧基乙基氧基、甲氧基乙氧基乙基氧基、甲氧基乙氧基乙氧基乙基氧基、3-甲氧基丁基氧基、2-甲硫基乙基氧基、三氟甲基氧基等。In the compound represented by the above formula (2), as R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , Alkoxy with 1 to 10 carbon atoms represented by R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 and R 144 , R 145 , R 146 , R 147 , R 148 and R 149 The group may, for example, be a group in which -O- is bonded to a methylene group at the end of the bonding site of an alkyl group. As the alkyl group constituting the above-mentioned alkoxy group, examples of the alkyl group used in the above-mentioned R 21 and the like can be used. As the alkoxy group used for such R 21 and the like, specifically, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butyloxy group, a second butyloxy group, Tertiary butyloxy, isobutyloxy, pentyloxy, isopentyloxy, tertiary pentyloxy, hexyloxy, cyclohexyloxy, cyclohexylmethyloxy, tetrahydrofuranyloxy Group, tetrahydropiperanyloxy, 2-methoxyethyloxy, 3-methoxypropoxy, 4-methoxybutyloxy, 2-butoxyethyloxy, methyl Oxyoxyethoxyethyloxy, methoxyethoxyethoxyethyloxy, 3-methoxybutyloxy, 2-methylthioethyloxy, trifluoromethyloxy Wait.

於上述式(2)所表示之化合物中,作為R21 、R22 、R23 、R24 、R25 、R26 、R27 、R28 、R29 、R30 、R31 、R32 、R33 、R34 、R121 、R122 、R123 、R124 、R125 、R126 、R127 、R128 、R129 、R130 、R131 、R132 、R133 、R134 、R136 、R137 、R138 、R139 、R140 、R141 、R142 、R143 及R144 、R145 、R146 、R147 、R148 及R149 所表示之碳原子數2~10之酯基,只要為鍵結部位側末端具有酯鍵(-CO-O-或-O-CO-)之基即可,可例舉酯鍵與烷基之鍵結部位側末端之亞甲基鍵結而成之基。作為構成上述酯基之烷基,可使用作為上述R21 等所採用之烷基所例舉者。 作為此種R21 等所採用之酯基,具體而言,可例舉:甲氧基羰基、乙氧基羰基、異丙氧基羰基、苯氧基羰基、乙醯氧基、丙醯氧基、丁醯氧基、氯乙醯氧基、二氯乙醯氧基、三氯乙醯氧基、三氟乙醯氧基、第三丁基羰氧基、甲氧基乙醯氧基、苯甲醯氧基等。In the compound represented by the above formula (2), as R 21 , R 22 , R 23 , R 24 , R 25 , R 26 , R 27 , R 28 , R 29 , R 30 , R 31 , R 32 , R 33 , R 34 , R 121 , R 122 , R 123 , R 124 , R 125 , R 126 , R 127 , R 128 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 136 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 and R 144 , R 145 , R 146 , R 147 , R 148 and R 149 represent ester groups with 2 to 10 carbon atoms , As long as it is a group having an ester bond (-CO-O- or -O-CO-) at the end of the bonding site, and an ester bond may be bonded to the methylene group at the end of the bonding site of the alkyl group. Chengzhiji. As the alkyl group constituting the above-mentioned ester group, those exemplified as the alkyl group used in the above-mentioned R 21 and the like can be used. As the ester group used for such R 21 etc., specifically, a methoxycarbonyl group, an ethoxycarbonyl group, an isopropoxycarbonyl group, a phenoxycarbonyl group, an acetoxy group, and a propoxy group may be mentioned. , Butyroxy, chloroacetoxy, dichloroacetoxy, trichloroacetoxy, trifluoroacetoxy, tert-butylcarbonyloxy, methoxyacetoxy, benzene Formaldehyde and so on.

於本發明中,上述R35 較佳為選自上述化學式(A)~(C)者,其中,較佳為選自上述式(A)或(B)者。藉由使上述R35 具有上述結構,上述酸產生劑之酸產生效率優異。其原因在於,由此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。In the present invention, the above-mentioned R 35 is preferably selected from the above-mentioned chemical formulae (A) to (C), and among them, it is preferably selected from the above-mentioned formula (A) or (B). By making the said R 35 have the said structure, the acid generating efficiency of the said acid generator is excellent. The reason for this is that it is thereby possible to more effectively exhibit the excellent acid component trapping effect of the present invention.

R21 、R22 、R24 、R25 、R26 、R27 、R29 、R30 、R31 、R32 、R33 及R34 較佳為氫原子、鹵素原子、有時具有取代基之碳原子數1~10之烷基,尤佳為氫原子。藉由為上述官能基,上述酸產生劑之酸產生效率優異。其原因在於,由此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。 其中,R23 及R28 較佳為氫原子、鹵素原子、碳原子數1~10之烷基,尤佳為氫原子或鹵素原子。藉由為上述官能基,上述酸產生劑之酸產生效率優異。其原因在於,由此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。R 21 , R 22 , R 24 , R 25 , R 26 , R 27 , R 29 , R 30 , R 31 , R 32 , R 33 and R 34 are preferably hydrogen atoms, halogen atoms, and sometimes substituted ones The alkyl group having 1 to 10 carbon atoms is particularly preferably a hydrogen atom. By being the above-mentioned functional group, the acid generation efficiency of the above-mentioned acid generator is excellent. The reason for this is that it is thereby possible to more effectively exhibit the excellent acid component trapping effect of the present invention. Among them, R 23 and R 28 are preferably a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms, and particularly preferably a hydrogen atom or a halogen atom. By being the above-mentioned functional group, the acid generation efficiency of the above-mentioned acid generator is excellent. The reason for this is that it is thereby possible to more effectively exhibit the excellent acid component trapping effect of the present invention.

R121 、R122 、R124 、R125 、R126 、R127 、R129 、R130 、R131 、R132 、R133 、R134 、R137 、R138 、R139 、R140 、R141 、R142 、R143 、R144 、R145 、R146 、R147 、R148 及R149 較佳為氫原子、鹵素原子、碳原子數1~10之烷基,尤佳為氫原子。藉由為上述官能基,上述酸產生劑之酸產生效率優異。其原因在於,由此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。 R123 、R128 及R136 較佳為氫原子、鹵素原子、碳原子數1~10之烷基,其中,較佳為氫原子或鹵素原子。藉由為上述官能基,上述酸產生劑之酸產生效率優異。其原因在於,由此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。R 121 , R 122 , R 124 , R 125 , R 126 , R 127 , R 129 , R 130 , R 131 , R 132 , R 133 , R 134 , R 137 , R 138 , R 139 , R 140 , R 141 , R 142 , R 143 , R 144 , R 145 , R 146 , R 147 , R 148 and R 149 are preferably a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, and a hydrogen atom is particularly preferred. By being the above-mentioned functional group, the acid generation efficiency of the above-mentioned acid generator is excellent. The reason for this is that it is thereby possible to more effectively exhibit the excellent acid component trapping effect of the present invention. R 123 , R 128 and R 136 are preferably a hydrogen atom, a halogen atom, or an alkyl group having 1 to 10 carbon atoms, and among them, a hydrogen atom or a halogen atom is preferred. By being the above-mentioned functional group, the acid generation efficiency of the above-mentioned acid generator is excellent. The reason for this is that it is thereby possible to more effectively exhibit the excellent acid component trapping effect of the present invention.

於上述式(2)所表示之化合物中,作為Anq- 所表示之q價陰離子,例如可例舉:四(五氟苯基)硼酸根[(C6 F5 )4 B]- 、四氟硼酸根(BF4 )- 、六氟磷酸根(PF6 )- 、六氟銻酸根(SbF6 )- 、六氟砷酸根(AsF6 )- 、六氯銻酸根(SbCl6 )- 、三(五氟甲基)三氟磷酸根離子(FAP陰離子)過氯酸根離子(ClO4 )- 、三氟甲基亞硫酸根離子(CF3 SO3 )- 、氟磺酸根離子(FSO3 )- 、甲苯磺酸根陰離子、三硝基苯磺酸根陰離子、樟腦磺酸根、九氟丁磺酸根、十六氟辛磺酸根、四芳基硼酸根、四(五氟苯基)硼酸根等。In the compound represented by the above formula (2), as the q-valent anion represented by An q- , for example, tetrakis (pentafluorophenyl) borate [(C 6 F 5 ) 4 B] - , tetrakis Fluoroborate (BF 4 ) - , hexafluorophosphate (PF 6 ) - , hexafluoroantimonate (SbF 6 ) - , hexafluoroarsenate (AsF 6 ) - , hexachloroantimonate (SbCl 6 ) - , three (Pentafluoromethyl) trifluorophosphate ion (FAP anion) perchlorate ion (ClO 4 ) - , trifluoromethyl sulfite ion (CF 3 SO 3 ) - , fluorosulfonate ion (FSO 3 ) - , Tosylate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadecafluorooctanesulfonate, tetraarylborate, tetrakis(pentafluorophenyl)borate, etc.

作為式(2)所表示之化合物,較佳為使用下述實施例所記載之下述式(F-1)~(F-4)、及(F-6)所表示之化合物。As the compound represented by the formula (2), the compounds represented by the following formulas (F-1) to (F-4) and (F-6) described in the following examples are preferably used.

用作陽離子硬化性組合物中所含之酸產生劑之熱酸產生劑只要為可藉由熱而產生酸之化合物,則無論為哪一種均無問題,並無特別限定。關於熱酸產生劑,就樹脂組合物硬化而成之硬化物之耐熱性而言,較佳為藉由熱而釋出路易斯酸之鎓鹽即複鹽、或其衍生物。於本發明中,較佳為使用下述式(14)所表示之鋶鹽。其原因在於,作為熱酸產生劑,樹脂之硬化性良好,又,由陽離子硬化性組合物所獲得之硬化物之耐熱性較高。又,上述酸產生劑之酸產生效率優異。由此能夠更有效地發揮本發明之酸成分捕獲性優異之效果。As long as the thermal acid generator used as the acid generator contained in the cation curable composition is a compound that can generate an acid by heat, there will be no problem and there is no particular limitation. Regarding the thermal acid generator, in terms of the heat resistance of the cured product formed by curing the resin composition, the onium salt of the Lewis acid is released by heat, that is, the double salt, or a derivative thereof. In the present invention, it is preferable to use a salt represented by the following formula (14). The reason is that as a thermal acid generator, the curability of the resin is good, and the cured product obtained from the cationic curable composition has high heat resistance. In addition, the acid generator described above has excellent acid generation efficiency. As a result, the excellent acid component trapping effect of the present invention can be exerted more effectively.

[化34]

Figure 02_image067
[化34]
Figure 02_image067

(式中,R225 表示氫原子、鹵素原子、有時具有取代基之碳原子數1~10之烷基、有時具有取代基之碳原子數6~20之芳基、碳原子數7~30之芳烷基、羥基、硝基、碸基及氰基,該烷基、芳基及芳烷基之1個以上之氫原子有時各自獨立地被取代為羥基、鹵素原子、碳原子數1~10之烷基、碳原子數6~20之芳基、碳原子數7~30之芳烷基、硝基、碸基或氰基, R226 表示氫原子、有時具有取代基之碳原子數1~10之烷基、有時具有取代基之碳原子數6~20之芳基、或有時具有取代基之碳原子數7~30之芳烷基,該烷基、芳基及芳烷基之1個以上之氫原子有時各自獨立地被取代為羥基、鹵素原子、碳原子數1~10之烷基、碳原子數6~20之芳香族基、碳原子數7~30之芳烷基、硝基、碸基或氰基, R227 表示有時所構成之亞甲基被取代為-O-或S-所表示之基的碳原子數1~10之烷基, Anq''- 表示q''價陰離子, q''表示1或2, p''表示將電荷保持為中性之係數)(In the formula, R 225 represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms which may have a substituent, an aryl group having 6 to 20 carbon atoms which may have a substituent, and a carbon number of 7 to 30 aralkyl groups, hydroxyl groups, nitro groups, sulfonyl groups and cyano groups. One or more hydrogen atoms of the alkyl groups, aryl groups and aralkyl groups may be independently substituted with hydroxyl groups, halogen atoms, and carbon atoms. 1-10 alkyl group, 6-20 aryl group, 7-30 aralkyl group, nitro group, sulfonyl group or cyano group, R 226 represents a hydrogen atom, sometimes substituted carbon An alkyl group having 1 to 10 atoms, an aryl group having 6 to 20 carbon atoms that may have a substituent, or an aralkyl group having 7 to 30 carbon atoms that may have a substituent, the alkyl group, aryl group, and One or more hydrogen atoms of an aralkyl group are sometimes independently substituted with a hydroxyl group, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, and a carbon number of 7 to 30. An aralkyl group, a nitro group, a sulfonyl group or a cyano group, R 227 represents an alkyl group with 1 to 10 carbon atoms in which the methylene group sometimes constituted is substituted with the group represented by -O- or S-, An q''- means q'' valence anion, q'' means 1 or 2, p'' means the coefficient to keep the charge as neutral)

於上述式(14)所表示之化合物中,作為R225 所表示之鹵素原子以及有時將R225 、R226 及R227 所表示之基之氫原子之1個以上取代之鹵素原子、以及R225 、R226 及R227 所表示之碳原子數1~10之烷基及有時將R225 、R226 及R227 所表示之基之氫原子之1個以上取代之碳原子數1~10之烷基,可與上述「(1-2)光酸產生劑」之項所記載之式(2)中之R21 等所採用之鹵素原子、烷基相同。 作為R225 及R226 所表示之碳原子數6~20之芳基及芳烷基、以及有時將R225 、R226 所表示之基之氫原子之1個以上取代之碳原子數6~20之芳基及芳烷基,可例舉:上述「1.第1聚合性化合物」之「(1)丙烯醯胺化合物」之項所記載之作為通式(A1)中之R2 所採用之基所例示之碳原子數6~30之芳基及碳原子數7~30之芳烷基、以及該等基中之亞甲基之1個以上(鍵結部位側末端除外)被取代為上述群(I)所表示之二價基而成之基(再者,上述群(I)所表示之二價基不相鄰)中的滿足特定碳原子數者。 作為上述碳原子數6~20之芳基,具體而言,可例舉:苯基、萘基、蒽基等。In the compound represented by the above formula (14), as the halogen atom represented by R 225 and the halogen atom sometimes substituted with one or more of the hydrogen atoms of the group represented by R 225 , R 226 and R 227, and R 225 , R 226, and R 227 represents an alkyl group with 1 to 10 carbon atoms, and sometimes replaces one or more of the hydrogen atoms of the group represented by R 225 , R 226, and R 227 with 1 to 10 carbon atoms a halogen atom of the alkyl group used in the formulas, may be related to those "(1-2) photoacid generator" described in the (2) of the other of R 21, the same alkyl group. The aryl group and aralkyl group having 6 to 20 carbon atoms represented by R 225 and R 226 , and the number of carbon atoms in which one or more hydrogen atoms of the group represented by R 225 and R 226 may be substituted with 6 to The aryl group and aralkyl group of 20 can be exemplified as the ones described in the item of "(1) acrylamide compound" of the above-mentioned "1. The first polymerizable compound" are used as R 2 in the general formula (A1) One or more of the aryl group with 6 to 30 carbon atoms and the aralkyl group with 7 to 30 carbon atoms, as well as the methylene group in these groups (except for the end at the bonding site side) are substituted with Among the groups formed by the divalent groups represented by the group (I) (in addition, the divalent groups represented by the group (I) are not adjacent), those satisfying the specified number of carbon atoms. Specific examples of the aryl group having 6 to 20 carbon atoms include a phenyl group, a naphthyl group, and an anthryl group.

作為上述式(13)中之p'Anq'- 及p''Anq''- 所表示之q'或q''價陰離子,可例舉:甲磺酸根陰離子、十二烷基磺酸根陰離子、苯磺酸根陰離子、甲苯磺酸根陰離子、三氟甲磺酸根陰離子、萘磺酸根陰離子、二苯胺-4-磺酸根陰離子、2-胺基-4-甲基-5-氯苯磺酸根陰離子、2-胺基-5-硝苯磺酸根陰離子、日本專利特開平10-235999號公報、日本專利特開平10-337959號公報、日本專利特開平11-102088號公報、日本專利特開2000-108510號公報、日本專利特開2000-168233號公報、日本專利特開2001-209969號公報、日本專利特開2001-322354號公報、日本專利特開2006-248180號公報、日本專利特開2006-297907號公報、日本專利特開平8-253705號公報、日本專利特表2004-503379號公報、日本專利特開2005-336150號公報、國際公開第2006/28006號公報等所記載之磺酸根陰離子等有機磺酸根陰離子,此外,可例舉:氯化物離子、溴化物離子、碘化物離子、氟化物離子、氯酸根離子、硫氰酸根離子、過氯酸根離子、六氟磷酸根離子、六氟銻酸根離子、四氟硼酸根離子、辛基磷酸根離子、十二烷基磷酸根離子、十八烷基磷酸根離子、苯基磷酸根離子、壬基苯基磷酸根離子、三(五氟甲基)三氟磷酸根離子(FAP陰離子)、2,2'-亞甲基雙(4,6-二第三丁基苯基)膦酸根離子、四(五氟苯基)硼酸根離子、具有使激發狀態下之活性分子去激發(淬滅)之功能之淬滅陰離子、或環戊二烯基環上具有羧基或膦酸基、磺酸基等陰離子性基的二茂鐵、二茂釕等茂金屬化合物陰離子等。其中,就耐熱性較高之方面而言,較佳為六氟磷酸根離子、六氟銻酸根離子、四(五氟苯基)硼酸根離子。 As the q'or q'valent anion represented by p'An q'- and p''An q''- in the above formula (13), there can be exemplified: methanesulfonate anion, dodecylsulfonate Anion, benzenesulfonate anion, tosylate anion, triflate anion, naphthalenesulfonate anion, diphenylamine-4-sulfonate anion, 2-amino-4-methyl-5-chlorobenzenesulfonate anion , 2-Amino-5-nitrobenzenesulfonate anion, Japanese Patent Laid-Open No. 10-235999, Japanese Patent Laid-Open No. 10-337959, Japanese Patent Laid-Open No. 11-102088, Japanese Patent Laid-Open 2000- 108510, Japanese Patent Application Publication No. 2000-168233, Japanese Patent Application Publication No. 2001-209969, Japanese Patent Application Publication No. 2001-322354, Japanese Patent Application Publication No. 2006-248180, Japanese Patent Application Publication 2006- Sulfonate anions described in 297907, Japanese Patent Laid-open No. 8-253705, Japanese Patent Special Publication No. 2004-503379, Japanese Patent Laid-Open No. 2005-336150, International Publication No. 2006/28006, etc. Organic sulfonate anion, in addition, can be exemplified: chloride ion, bromide ion, iodide ion, fluoride ion, chlorate ion, thiocyanate ion, perchlorate ion, hexafluorophosphate ion, antimony hexafluoro Acid ion, tetrafluoroborate ion, octyl phosphate ion, dodecyl phosphate ion, octadecyl phosphate ion, phenyl phosphate ion, nonyl phenyl phosphate ion, tris(pentafluoromethyl) Group) trifluorophosphate ion (FAP anion), 2,2'-methylene bis(4,6-di-tert-butylphenyl) phosphonate ion, tetrakis(pentafluorophenyl) borate ion, with The quenching anion that de-excites (quenches) the active molecule in the excited state, or the ferrocene and ruthenium with anionic groups such as carboxyl, phosphonic acid and sulfonic acid groups on the cyclopentadienyl ring And other metallocene compound anions. Among them, in terms of high heat resistance, hexafluorophosphate ion, hexafluoroantimonate ion, and tetrakis(pentafluorophenyl)borate ion are preferred.

上述熱酸產生劑可藉由熱來產生酸而使組合物硬化之溫度範圍並無特別限定,就能夠獲得耐熱性較佳之硬化物之方面、製程中之熱穩定性良好之方面而言,較佳為50℃以上250℃以下,更佳為100℃以上220℃以下,更佳為130℃以上200℃以下,進而較佳為150℃以上180℃以下。其原因在於,這樣會使得容易形成上述組合物之硬化物。The temperature range in which the above-mentioned thermal acid generator can generate acid by heat to harden the composition is not particularly limited. In terms of obtaining a cured product with better heat resistance, and in terms of good thermal stability in the manufacturing process, it is more It is preferably 50°C or higher and 250°C or lower, more preferably 100°C or higher and 220°C or lower, more preferably 130°C or higher and 200°C or lower, and still more preferably 150°C or higher and 180°C or lower. The reason is that this makes it easy to form a hardened product of the above-mentioned composition.

作為用於陽離子硬化性組合物之熱酸產生劑,亦可使用市售品。作為此種市售品,例如可例舉:San-Aid SI-B2A、San-Aid SI-B3A、San-Aid SI-B3、San-Aid SI-B4、San-Aid SI-60、San-Aid SI-80、San-Aid SI-100、San-Aid SI-110、San-Aid SI-150(以上為三新化學工業(股)製造)、Adekaopton CP-66、Adekaopton CP-77(以上為ADEKA(股)製造)等。其等可單獨使用1種,或者將2種以上組合使用。As the thermal acid generator used for the cationic curable composition, a commercially available product can also be used. As such a commercially available product, for example, San-Aid SI-B2A, San-Aid SI-B3A, San-Aid SI-B3, San-Aid SI-B4, San-Aid SI-60, San-Aid SI-80, San-Aid SI-100, San-Aid SI-110, San-Aid SI-150 (the above are manufactured by Sanxin Chemical Industry Co., Ltd.), Adekaopton CP-66, Adekaopton CP-77 (the above is ADEKA (Stock) Manufacturing) and so on. These can be used individually by 1 type or in combination of 2 or more types.

(1-3)其他 陽離子硬化性組合物係包含陽離子硬化性成分及酸產生劑者,但可視需要包含溶劑及其他成分。 作為溶劑,可使用有機溶劑、水等。作為包含有機溶劑及水之溶劑,通常使用在常溫(25℃)大氣壓下為液狀、且由陽離子硬化性組合物形成硬化物時能夠乾燥去除者。 作為其他成分,可例舉各種添加劑。 作為此種有機溶劑及各種添加劑,可與國際公開2017/098996號公報等中作為溶劑、添加劑等所記載者相同。 上述有機溶劑係能夠使陽離子硬化性組合物之各成分分散或溶解者。因此,陽離子硬化性成分及酸產生劑、以及下述增感劑等即便於常溫(25℃)大氣壓下為液狀,亦不包括在溶劑中。 作為上述有機溶劑,具體而言,可例舉:甲基乙基酮、甲基戊基酮、二乙基酮、丙酮、甲基異丙基酮、甲基異丁基酮、環己酮、2-庚酮等酮類;甲醇、乙醇、異丙醇或正丙醇、異丁醇或正丁醇、戊醇、二丙酮醇等醇系溶劑;乙二醇單甲醚乙酸酯、乙二醇單乙醚乙酸酯、丙二醇-1-單甲醚-2-乙酸酯(PGMEA)、二丙二醇單甲醚乙酸酯、乙酸3-甲氧基丁酯、丙酸乙氧基乙酯、1-第三丁氧基-2-丙醇、乙酸3-甲氧基丁酯、乙酸環己二醇酯等醚酯系溶劑;苯等BTX(Benzene-Toluene-Xylene,苯-甲苯-二甲苯)系溶劑;己烷等脂肪族烴系溶劑;松節油等萜烯系烴油;礦油精等石蠟系溶劑;四氯化碳等鹵化脂肪族烴系溶劑;氯苯等鹵化芳香族烴系溶劑;卡必醇系溶劑等。該等溶劑可使用1種,或者以2種以上之混合溶劑之形式使用。 又,於上述陽離子硬化性組合物100質量份中,上述溶劑之含量較佳為設為20質量份以上80質量份以下。其原因在於,這樣會使得塗佈性優異。 陽離子硬化性組合物可與酸產生劑一併使用增感劑。作為此種增感劑,可使用公知之增感劑,具體而言,可使用上述「1.第1聚合性化合物」之「5.增感劑」之項所記載之化合物。(1-3) Other The cationic curable composition contains a cationic curable component and an acid generator, but may contain a solvent and other components as needed. As the solvent, an organic solvent, water, etc. can be used. As a solvent containing an organic solvent and water, a solvent that is liquid at normal temperature (25° C.) and atmospheric pressure and can be dried and removed when a cured product is formed from a cationic curable composition is generally used. As other components, various additives may be mentioned. Such organic solvents and various additives may be the same as those described as solvents, additives, etc. in International Publication No. 2017/098996. The above-mentioned organic solvent is one capable of dispersing or dissolving each component of the cationic curable composition. Therefore, even if the cation curable component, acid generator, and sensitizer described below are liquid at normal temperature (25°C) and atmospheric pressure, they are not included in the solvent. As the above-mentioned organic solvent, specifically, methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, Ketones such as 2-heptanone; methanol, ethanol, isopropanol or n-propanol, isobutanol or n-butanol, pentanol, diacetone alcohol and other alcoholic solvents; ethylene glycol monomethyl ether acetate, ethyl Glycol monoethyl ether acetate, propylene glycol-1-monomethyl ether-2-acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate , 1-tertiary butoxy-2-propanol, 3-methoxybutyl acetate, cyclohexanediol acetate and other ether ester solvents; benzene and other BTX (Benzene-Toluene-Xylene, benzene-toluene-two Toluene) solvents; aliphatic hydrocarbon solvents such as hexane; terpene hydrocarbon oils such as turpentine; paraffin wax solvents such as mineral spirits; halogenated aliphatic hydrocarbon solvents such as carbon tetrachloride; halogenated aromatic hydrocarbons such as chlorobenzene Solvent; Carbitol-based solvents, etc. These solvents can be used singly or in the form of a mixed solvent of two or more kinds. In addition, in 100 parts by mass of the cationic curable composition, the content of the solvent is preferably 20 parts by mass or more and 80 parts by mass or less. The reason is that this makes the coatability excellent. The cationic curable composition can use a sensitizer together with an acid generator. As such a sensitizer, a well-known sensitizer can be used, and specifically, the compound described in the item of "5. Sensitizer" of the above-mentioned "1. First polymerizable compound" can be used.

陽離子硬化性組合物係包含陽離子硬化性成分作為樹脂成分者,但可視需要包含除陽離子硬化性成分以外之樹脂成分(以下,有時稱為其他樹脂成分)。作為其他樹脂成分,可在不損害本發明效果之範圍內採用本發明所屬技術領域中使用之公知成分。The cationic curable composition contains a cationic curable component as a resin component, but may optionally contain a resin component other than the cationic curable component (hereinafter, may be referred to as other resin component). As other resin components, well-known components used in the technical field to which the present invention belongs can be used within a range that does not impair the effects of the present invention.

陽離子硬化性組合物可視需要包含在酸成分之存在下容易受到分解、改性之成分。其原因在於,這樣能夠有效地發揮上述被覆材所具有之酸成分捕捉性優異之效果。 作為此種在酸成分之存在下容易受到分解、劣化之成分,例如可例舉染料等。作為上述染料,可較佳地使用陽離子染料。陽離子染料有時會在酸成分之存在下分解或改性,而使所需波長區域內之透過率發生變化。對此,於使用由上述聚合性組合物所形成之被覆材進行被覆之情形時,容易抑制染料之分解、改性,使所需波長區域內之透過率變化較少。 作為此種陽離子染料,例如可例舉:花青染料、部花青染料、吡咯甲川染料、偶氮染料、四氮雜卟啉染料、𠮿

Figure 109130258-0000-3
染料、三芳基甲烷染料等。作為該等陽離子染料,例如可使用日本專利特開2017-068221號公報所記載之花青系色素、部花青系色素、吡咯甲川系色素、偶氮系色素、四氮雜卟啉系色素、𠮿
Figure 109130258-0000-3
系色素、三芳基甲烷系色素等之示例。 又,作為吡咯甲川染料,亦可使用日本專利特開2006-189751號公報中之通式(1)所表示之化合物、日本專利特開2011-174036號公報中之通式(1)所表示之化合物等。作為四氮雜卟啉染料,亦可使用日本專利特開2017-68221號公報中之通式(1)所表示之化合物。 再者,上述染料之含量相對於上述陽離子硬化性成分100質量份可設為0.01質量份以上10質量份以下。 硬化物之製造方法只要能夠使硬化物形成為所需形狀,則並無特別限定。作為此種製造方法,例如可與下述「C.被覆構造體的製造方法」之項所記載之內容相同,故而省略此處之說明。The cationic curable composition may optionally contain components that are easily decomposed and modified in the presence of acid components. The reason for this is that it is possible to effectively exhibit the excellent effect of capturing the acid component of the above-mentioned coating material. As such a component that is easily decomposed and degraded in the presence of an acid component, for example, dyes and the like can be mentioned. As the above-mentioned dyes, cationic dyes can be preferably used. Cationic dyes are sometimes decomposed or modified in the presence of acid components, which changes the transmittance in the desired wavelength range. In contrast, when the coating material formed of the above-mentioned polymerizable composition is used for coating, it is easy to suppress the decomposition and modification of the dye, so that the transmittance in the desired wavelength range is less changed. Examples of such cationic dyes include cyanine dyes, merocyanine dyes, pyrromethene dyes, azo dyes, porphyrazine dyes, and
Figure 109130258-0000-3
Dyes, triarylmethane dyes, etc. As these cationic dyes, for example, cyanine dyes, merocyanine dyes, pyrromethine dyes, azo dyes, porphyrazine dyes, etc. described in Japanese Patent Laid-Open No. 2017-068221 can be used. 𠮿
Figure 109130258-0000-3
Examples of dyes, triarylmethane dyes, etc. In addition, as the pyrromethene dye, the compound represented by the general formula (1) in Japanese Patent Laid-Open No. 2006-189751 and the compound represented by the general formula (1) in Japanese Patent Laid-Open No. 2011-174036 can also be used. Compound etc. As the porphyrazine dye, the compound represented by the general formula (1) in JP 2017-68221 A can also be used. Furthermore, the content of the dye can be set to 0.01 part by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the cationic curable component. The method of manufacturing the hardened product is not particularly limited as long as it can form the hardened product into a desired shape. As such a manufacturing method, for example, the content described in the section of "C. Manufacturing Method of Covered Structure" below can be the same, so the description here is omitted.

(2)含有酸成分之構件 作為上述含有酸成分之構件之使用用途,只要為需求被覆材之酸成分捕捉性之用途即可,例如可例舉如下各種用途等:濾光器;印刷版;絕緣清漆;絕緣片材;積層板;印刷基板;密封劑、如半導體裝置用、LED(Light Emitting Diode,發光二極體)封裝體、液晶注入口用、有機電致發光(EL)用、光元件用、電絕緣用、電子零件用、或分離膜用等;及成形材料;層間絕緣膜;保護膜;印刷基板用、彩色電視用、PC(personal computer,個人電腦)顯示器用、攜帶型資訊終端用、CCD(Charge Coupled Device,電荷耦合元件)影像感測器之彩色濾光片用或電漿顯示面板用電極材料。(2) Components containing acid As the application of the above-mentioned acid component-containing member, any application that requires the acid component capture property of the coating material may be used. For example, the following various applications can be exemplified: filter; printing plate; insulating varnish; insulating sheet; laminate Boards; printed substrates; sealants, such as semiconductor devices, LED (Light Emitting Diode) packages, liquid crystal injection ports, organic electroluminescence (EL), optical components, electrical insulation, electronics For parts, or separation film, etc.; and molding materials; interlayer insulating film; protective film; printed circuit board, color TV, PC (personal computer, personal computer) display, portable information terminal, CCD (Charge Coupled Device) , Charge Coupled Device) The color filter of the image sensor or the electrode material for the plasma display panel.

作為上述濾光器,可為需求透過濾光器之光之光譜形狀變化者,例如可用於液晶顯示裝置(LCD)、電漿顯示面板(PDP)、電致發光顯示器(ELD)、陰極管顯示裝置(CRT)、CCD影像感測器、CMOS(complementary metal oxide semiconductor,互補金氧半導體)感測器、螢光顯示管、場發射型顯示器等圖像顯示裝置用、分析裝置用、半導體裝置製造用、天文觀測用、光通信用、眼鏡片、窗戶等用途。 於上述含有酸成分之構件之使用用途中,被覆材之酸成分捕捉性之效果發揮部位可為含有酸成分之構件本身之內部,亦可為含有酸成分之構件之外部。 作為酸成分捕捉性之效果發揮部位在內部之含有酸成分之構件之具體例,可例舉包含染料之濾光器。於此情形時,藉由上述被覆材,能夠抑制作為含有酸成分之構件之濾光器中之染料之分解、劣化等。 作為酸成分捕捉性之效果發揮部位在外部之含有酸成分之構件之具體例,可例舉:具有包含金屬、金屬氧化物等之配線之印刷基板、或印刷基板上配置有電子元件之電子基板上的支持配線之絕緣基材、覆蓋配線之絕緣膜、配置於配線間之層間絕緣膜。又,作為酸成分捕捉性之發揮部位在外部之上述構件之具體例,例如可例舉:上述濾光器、印刷基板、電子基板中所包含之各構件彼此、或用以固定濾光器、印刷基板及電子基板等之接著層、黏著層等。 作為酸成分捕捉性之發揮部位在內部之上述構件之具體例,亦可例舉包含容易受到酸成分所引起之劣化、分解等影響之藥劑等成分的顆粒物等樹脂成形體。As the above-mentioned filter, it can be one that requires a change in the spectral shape of the light that passes through the filter. For example, it can be used for liquid crystal display devices (LCD), plasma display panels (PDP), electroluminescence displays (ELD), and cathode tube displays. Device (CRT), CCD image sensor, CMOS (complementary metal oxide semiconductor) sensor, fluorescent display tube, field emission display and other image display devices, analytical devices, semiconductor device manufacturing Use, astronomical observation, optical communication, spectacle lenses, windows, etc. In the use of the above-mentioned member containing the acid component, the site where the effect of the acid component capturing property of the coating material is exerted may be the inside of the member containing the acid component itself, or the outside of the member containing the acid component. As a specific example of the member containing the acid component inside the site where the effect of the acid component capturing property is exerted, a dye-containing filter can be exemplified. In this case, by the above-mentioned coating material, it is possible to suppress the decomposition and deterioration of the dye in the optical filter, which is a member containing an acid component. As a specific example of a member containing an acid component in the external part where the effect of the acid component capturing effect is exerted, there can be mentioned: a printed circuit board with wiring containing metals, metal oxides, etc., or an electronic board with electronic components arranged on the printed circuit board The insulating substrate supporting the wiring, the insulating film covering the wiring, and the interlayer insulating film arranged in the wiring room. In addition, as a specific example of the above-mentioned member whose acid component capture property is externally located, for example, the various members included in the above-mentioned optical filter, printed circuit board, and electronic substrate may be used to fix the optical filter, Adhesive layers, adhesive layers, etc. for printed circuit boards and electronic substrates. As a specific example of the above-mentioned member in which the part where the acid component capture property is exerted is inside, a resin molded body such as pellets containing ingredients such as a drug that is easily affected by deterioration or decomposition by the acid component can also be exemplified.

上述含有酸成分之構件之俯視形狀係根據上述含有酸成分之構件之用途等而適當設定,於含有酸成分之構件形成於基材上之情形時,可為覆蓋基材整個面之膜狀,亦可為形成於基材之一部分之圖案狀。 於上述含有酸成分之構件用於例如彩色濾光片中所包含之各顏色像素、顏色調整層等液晶顯示裝置、電漿顯示面板、電致發光顯示器等圖像顯示裝置之濾光器中之情形時,上述含有酸成分之構件之俯視形狀可設為圖案狀。 於上述含有酸成分之構件用作例如固定2個構件之接著劑層等之情形時,上述含有酸成分之構件之俯視形狀可設為膜狀。 於上述含有酸成分之構件例如為包含染料或藥劑等之樹脂組合物之情形時,上述含有酸成分之構件之形狀可為粒狀。 上述含有酸成分之構件之膜厚係根據上述含有酸成分之構件之用途等而適當設定,於上述構件用於濾光器或接著劑層等之情形時,可設為0.01 μm以上10 mm以下。 於上述含有酸成分之構件用於例如圖像顯示裝置之濾光器之情形時,上述含有酸成分之構件之膜厚較佳為0.05 μm以上300 μm以下,較佳為0.1 μm以上100 μm以下,較佳為1 μm以上20 μm以下。其原因在於,藉由設為上述膜厚,能夠有效地發揮上述被覆材之酸成分捕捉性等效果。The shape of the member containing the acid component in plan view is appropriately set according to the use of the member containing the acid component, etc., when the member containing the acid component is formed on the substrate, it may be in the form of a film covering the entire surface of the substrate. It may also be a pattern formed on a part of the substrate. The above-mentioned components containing acid components are used in the filters of image display devices such as color pixels, color adjustment layers, etc. included in color filters, plasma display panels, electroluminescence displays, and other image display devices In this case, the plan view shape of the above-mentioned acid component-containing member may be a pattern shape. When the member containing the acid component is used as, for example, an adhesive layer for fixing two members, the shape of the member containing the acid component in plan view may be a film shape. When the acid component-containing member is, for example, a resin composition containing a dye or a drug, the shape of the acid component-containing member may be granular. The film thickness of the above-mentioned acid component-containing member is appropriately set according to the use of the above-mentioned acid component-containing member, etc. When the above-mentioned member is used in an optical filter or an adhesive layer, etc., it can be set to 0.01 μm or more and 10 mm or less . When the above-mentioned acid component-containing member is used in, for example, an optical filter of an image display device, the film thickness of the above-mentioned acid component-containing member is preferably 0.05 μm or more and 300 μm or less, preferably 0.1 μm or more and 100 μm or less , Preferably 1 μm or more and 20 μm or less. The reason for this is that by setting the film thickness as described above, the effect of capturing the acid component of the coating material and the like can be effectively exhibited.

B.被覆構造體 本發明之被覆構造體具有含有酸成分之構件、及被覆該構件之被覆材。上述被覆材包含含有具有源自第1聚合性化合物之結構單元之聚合體的聚合物,上述第1聚合性化合物具有醯胺基及乙烯性不飽和基。B. Covered structure The covering structure of the present invention has a member containing an acid component and a covering material covering the member. The coating material includes a polymer containing a polymer having a structural unit derived from a first polymerizable compound, and the first polymerizable compound has an amide group and an ethylenically unsaturated group.

1.被覆材 被覆材中所包含之聚合體只要包含源自第1聚合性化合物之重複單元即可。 上述聚合體可為包含源自第1聚合性化合物之重複單元之均聚物,亦可為包含源自第1聚合性化合物之重複單元(第1重複單元)、以及源自除第1聚合性化合物以外之具有乙烯性不飽和基之化合物即第2聚合性化合物之重複單元(第2重複單元)的共聚物。 作為此種被覆材,較佳為使用例如包含第1聚合性組合物之聚合性組合物之聚合物。其原因在於,這樣容易形成被覆材。 關於上述第1聚合性化合物、第2聚合性化合物及聚合性組合物之內容,可與上述「A.聚合性組合物」之項所記載之內容相同。 關於第1重複單元及第2重複單元之種類及含有比率等,亦可與聚合性組合物中之第1聚合性化合物及第2聚合性化合物相同。 例如,於上述聚合體包含第2重複單元之情形時,第1重複單元及第2重複單元之合計100質量份中之第1重複單元之含量可與上述「A.聚合性組合物」之項所記載之第1聚合性化合物及第2聚合性化合物之合計100質量份中之第1聚合性化合物之含量相同。 又,第1重複單元及第2重複單元之種類及含有比率等可根據被覆構造體的製造方法而有所差異。例如,於被覆構造體的製造方法為上述第1製造方法之情形時,第1重複單元及第2重複單元之種類及含量較佳為與上述「A.聚合性組合物」之項中記載之第1製造方法中較佳地使用之第1聚合性化合物及第2聚合性化合物之種類及含量相同。其原因在於,這樣容易形成被覆材。 同樣地,於被覆構造體的製造方法為上述第2製造方法之情形時,第1重複單元及第2重複單元之種類及含量較佳為與上述「A.聚合性組合物」之項中記載之第2製造方法中較佳地使用之第1聚合性化合物及第2聚合性化合物之種類及含量相同。其原因在於,這樣容易形成被覆材。1. Coating material The polymer contained in the coating material may contain repeating units derived from the first polymerizable compound. The above-mentioned polymer may be a homopolymer containing repeating units derived from the first polymerizable compound, or may include repeating units derived from the first polymerizable compound (first repeating unit), and derived from other than the first polymerizable compound. The compound having an ethylenically unsaturated group other than the compound is a copolymer of the repeating unit (second repeating unit) of the second polymerizable compound. As such a coating material, it is preferable to use, for example, a polymer of a polymerizable composition containing the first polymerizable composition. The reason is that it is easy to form a coating material in this way. The content of the above-mentioned first polymerizable compound, second polymerizable compound, and polymerizable composition may be the same as the content described in the item of the above-mentioned "A. Polymerizable composition". The types and content ratios of the first repeating unit and the second repeating unit may be the same as those of the first polymerizable compound and the second polymerizable compound in the polymerizable composition. For example, in the case where the above-mentioned polymer contains the second repeating unit, the content of the first repeating unit in 100 parts by mass of the total of the first repeating unit and the second repeating unit may be the same as the above-mentioned "A. Polymerizable composition". The content of the first polymerizable compound in the total 100 parts by mass of the first polymerizable compound and the second polymerizable compound described above is the same. In addition, the types and content ratios of the first repeating unit and the second repeating unit may vary depending on the manufacturing method of the covering structure. For example, when the manufacturing method of the covering structure is the above-mentioned first manufacturing method, the types and contents of the first repeating unit and the second repeating unit are preferably the same as those described in the section of "A. Polymerizable composition" above. The types and contents of the first polymerizable compound and the second polymerizable compound preferably used in the first production method are the same. The reason is that it is easy to form a coating material in this way. Similarly, when the manufacturing method of the covering structure is the above-mentioned second manufacturing method, the types and contents of the first repeating unit and the second repeating unit are preferably the same as those described in the section of "A. Polymerizable composition" above. The type and content of the first polymerizable compound and the second polymerizable compound preferably used in the second manufacturing method are the same. The reason is that it is easy to form a coating material in this way.

上述被覆材與含有酸成分之構件可抵接。或者,於上述被覆材與含有酸成分之構件之間可介置其他構件。就更確實地捕捉由含有酸成分之構件所產生之酸之觀點而言,較佳為上述被覆材與含有酸成分之構件抵接。 又,於酸成分捕捉性之效果發揮部位在含有酸成分之構件之外部之情形時,被覆材之形成部位可為效果發揮部位與含有酸成分之構件之間,亦可並非其等之間。例如,於依序形成配線、含有酸成分之構件作為印刷基板之情形時,被覆材之形成部位可並非被配線與含有酸成分之構件夾持之部位,例如可為依序積層有配線、含有酸成分之構件及被覆材之部位。The said coating material and the member containing an acid component can contact|abut. Alternatively, another member may be interposed between the above-mentioned coating material and the member containing the acid component. From the viewpoint of more reliably capturing the acid generated from the member containing the acid component, it is preferable that the coating material and the member containing the acid component are in contact with each other. In addition, when the site where the effect of capturing the acid component is outside the member containing the acid component, the formation site of the coating material may be between the site where the effect is exerted and the member containing the acid component, or not between them. For example, when wiring and an acid component-containing member are sequentially formed as a printed circuit board, the formation location of the coating material may not be a position sandwiched between the wiring and the acid component-containing member. Parts of acid components and coating materials.

被覆材之厚度並無特別限制,可根據被覆構造體之用途而適當決定。上述被覆材之厚度可設為0.01 μm以上300 μm以下。 於被覆對象之含有酸成分之構件為濾光器之情形時,上述被覆材之厚度較佳為0.01~100 μm,更佳為0.1~50 μm,尤佳為1~20 μm。其原因在於,藉由將上述厚度設為上述範圍,能夠有效地發揮優異之酸成分捕捉性及取得較高接著力之效果。The thickness of the coating material is not particularly limited, and can be appropriately determined according to the application of the coating structure. The thickness of the above-mentioned coating material may be 0.01 μm or more and 300 μm or less. When the acid component-containing member of the coating object is an optical filter, the thickness of the coating material is preferably 0.01-100 μm, more preferably 0.1-50 μm, and particularly preferably 1-20 μm. The reason is that by setting the above thickness to the above range, it is possible to effectively exhibit excellent acid trapping properties and obtain a high adhesive force effect.

關於上述被覆材之形成方法,只要該方法能夠以可被覆上述含有酸成分之構件之方式配置上述含有酸成分之構件即可,可與下述「C.被覆構造體的製造方法」之項所記載之內容相同。Regarding the formation method of the coating material, as long as the method can dispose the acid component-containing member so as to cover the acid component-containing member, it can be combined with the following "C. Method of Manufacturing Coated Structure". The recorded content is the same.

2.含有酸成分之構件 關於上述含有酸成分之構件,可與上述「A.聚合性組合物」之項所記載之內容相同,故而省略此處之說明。2. Components containing acid The above-mentioned acid component-containing member may be the same as the content described in the section of the above-mentioned "A. Polymerizable composition", so the description here is omitted.

2.其他 作為上述被覆構造體之用途,可與上述「A.聚合性組合物」之項所記載之含有酸成分之構件之使用用途相同。2. Other The use of the above-mentioned covered structure may be the same as the use of the member containing the acid component described in the item of "A. Polymerizable composition".

C.被覆構造體的製造方法 本發明之被覆構造體的製造方法具有利用被覆材被覆含有酸成分之構件之步驟。以下,對被覆材形成步驟詳細地進行敍述。C. Manufacturing method of covered structure The manufacturing method of the coated structure of the present invention includes a step of coating a member containing an acid component with a coating material. Hereinafter, the coating material forming step will be described in detail.

1.被覆步驟 本發明中之被覆步驟係利用被覆材被覆含有酸成分之構件之步驟。 又,被覆材包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元。 於本步驟中,作為利用被覆材被覆含有酸成分之構件之方法,只要該方法能夠形成被覆構造體,則並無特別限定。作為被覆方法,具體而言,可例舉下述第1方法及第2方法等。 ・第1方法 其係具有如下步驟之方法: 將包含第1聚合性化合物之聚合性組合物塗佈於上述含有酸成分之構件之步驟、 使上述聚合性組合物中之第1聚合性化合物聚合之步驟。 ・第2方法 其係具有如下步驟之方法: 使聚合性組合物中之第1聚合性化合物聚合而將第1聚合性化合物形成為被覆材之步驟、 以被覆含有酸成分之構件之方式使由上述被覆材形成步驟所獲得之被覆材與其接觸之步驟。 以下,將本步驟分成第1方法及第2方法進行說明。1. Covering steps The coating step in the present invention is a step of coating a member containing an acid component with a coating material. In addition, the coating material includes a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group. In this step, as a method of coating a member containing an acid component with a coating material, as long as the method can form a coating structure, it is not particularly limited. As a coating method, the following 1st method, 2nd method, etc. are mentioned specifically,. ・The first method It is a method with the following steps: The step of applying the polymerizable composition containing the first polymerizable compound to the above-mentioned acid component-containing member, The step of polymerizing the first polymerizable compound in the polymerizable composition. ・The second method It is a method with the following steps: The step of polymerizing the first polymerizable compound in the polymerizable composition to form the first polymerizable compound as a coating material, A step of contacting the coating material obtained in the above coating material forming step so as to coat the member containing the acid component. Hereinafter, this step is divided into the first method and the second method and will be described.

(1)第1方法 本步驟之第1方法具有如下步驟:將包含第1聚合性化合物之聚合性組合物塗佈於上述含有酸成分之構件之步驟、及使上述聚合性組合物中之第1聚合性化合物聚合之步驟。 (1-1)塗佈步驟 將本步驟中之聚合性組合物塗佈於上述構件並不限定於與上述構件直接相接地塗佈之形態,亦包括介隔其他構件相接之形態。 於本步驟中,作為聚合性組合物之塗佈方法,可例舉:旋轉塗佈機、輥式塗佈機、棒式塗佈機、模嘴塗佈機、簾幕式塗佈機、各種印刷、浸漬等公知方法。 關於藉由本步驟所塗佈之聚合性組合物之塗膜厚度,只要能夠形成所需厚度之被覆材即可,根據含有酸成分之構件之種類等而適當設定。 再者,關於上述第1聚合性化合物及聚合性組合物之內容,可與上述「A.聚合性組合物」之項所記載之內容相同,故而省略此處之說明。 其中,於本步驟中,上述聚合性組合物較佳為上述「A.聚合性組合物」之項中作為被覆構造體製造方法於第1製造方法中較佳地使用之內容。(1) Method 1 The first method of this step has the steps of: applying a polymerizable composition containing a first polymerizable compound to the above-mentioned acid component-containing member, and polymerizing the first polymerizable compound in the above-mentioned polymerizable composition. step. (1-1) Coating steps The application of the polymerizable composition in this step to the above-mentioned member is not limited to the form in which it is applied directly in contact with the above-mentioned member, and also includes the form in which it is interposed and connected to other members. In this step, as the coating method of the polymerizable composition, examples include: spin coater, roll coater, bar coater, die coater, curtain coater, various Known methods such as printing and dipping. Regarding the thickness of the coating film of the polymerizable composition applied in this step, as long as it can form a coating material of a desired thickness, it is appropriately set according to the type of the acid component-containing member and the like. In addition, the content of the above-mentioned first polymerizable compound and polymerizable composition may be the same as the content described in the item of the above-mentioned "A. Polymerizable composition", so the description here is omitted. Among them, in this step, the polymerizable composition is preferably the content that is preferably used in the first manufacturing method as a method of manufacturing a covered structure in the item of "A. Polymerizable composition" described above.

(1-2)聚合步驟 作為本步驟中之第1聚合性化合物之聚合方法,只要能夠使第1聚合性化合物彼此聚合而形成具有源自第1聚合性化合物之結構單元之聚合體即可,可採用公知之方法,例如可例舉:對聚合性組合物之塗膜照射能量線之方法、對聚合性組合物之塗膜進行加熱之方法等。於上述聚合性組合物包含自由基聚合起始劑之情形時,此種聚合方法較佳為根據該自由基聚合起始劑之種類而決定。具體而言,於聚合性組合物包含光自由基聚合起始劑作為自由基聚合起始劑之情形時,可較佳地使用照射能量線之方法,於聚合性組合物包含熱自由基聚合起始劑作為自由基聚合起始劑之情形時,可較佳地使用加熱之方法。其原因在於,容易使上述第1聚合性化合物聚合。(1-2) Polymerization step As the polymerization method of the first polymerizable compound in this step, as long as the first polymerizable compounds can be polymerized with each other to form a polymer having structural units derived from the first polymerizable compound, a known method can be used, such as Examples include: a method of irradiating the coating film of the polymerizable composition with energy rays, a method of heating the coating film of the polymerizable composition, and the like. In the case where the above-mentioned polymerizable composition contains a radical polymerization initiator, such a polymerization method is preferably determined according to the kind of the radical polymerization initiator. Specifically, when the polymerizable composition contains a photo-radical polymerization initiator as the radical polymerization initiator, the method of irradiating energy rays can be preferably used. When the polymerizable composition contains a thermal radical polymerization initiator, When the initiator is used as a radical polymerization initiator, a heating method can be preferably used. The reason is that it is easy to polymerize the above-mentioned first polymerizable compound.

於本步驟中,作為用以使第1聚合性化合物聚合之能量線之光源,可利用由超高壓水銀燈、高壓水銀燈、中壓水銀燈、低壓水銀燈、水銀蒸氣弧燈、氙弧燈、碳弧燈、金屬鹵素燈、螢光燈、鎢絲燈、準分子燈、殺菌燈、發光二極體、CRT(cathode-ray tube,陰極射線管)光源等所獲得之具有2000埃~7000埃波長之電磁波能量或電子束、X射線、輻射等高能量線。較佳為使用發出波長300~450 nm光之超高壓水銀燈、水銀蒸氣弧燈、碳弧燈、氙弧燈、發光二極體等。其原因在於,容易使第1聚合性化合物聚合。In this step, as the light source of the energy line used to polymerize the first polymerizable compound, ultra-high-pressure mercury lamps, high-pressure mercury lamps, medium-pressure mercury lamps, low-pressure mercury lamps, mercury vapor arc lamps, xenon arc lamps, and carbon arc lamps can be used. , Metal halide lamps, fluorescent lamps, tungsten filament lamps, excimer lamps, germicidal lamps, light-emitting diodes, CRT (cathode-ray tube, cathode ray tube) light source, etc., obtained by electromagnetic waves with a wavelength of 2000 angstroms to 7000 angstroms Energy or high-energy lines such as electron beams, X-rays, and radiation. It is preferable to use ultra-high pressure mercury lamps, mercury vapor arc lamps, carbon arc lamps, xenon arc lamps, light-emitting diodes, etc. that emit light with a wavelength of 300-450 nm. The reason is that it is easy to polymerize the first polymerizable compound.

能量線之照射量並無特別限制,可根據聚合性組合物之組成而適當決定。就防止聚合性組合物中之成分劣化之觀點而言,上述照射量較佳為100 mJ/cm2 ~2000 mJ/cm2The irradiation amount of energy rays is not particularly limited, and can be appropriately determined according to the composition of the polymerizable composition. From the viewpoint of preventing deterioration of the components in the polymerizable composition, the above-mentioned irradiation amount is preferably 100 mJ/cm 2 to 2000 mJ/cm 2 .

作為本步驟中之加熱聚合性組合物之塗膜之方法,可例舉採用加熱板等熱板、或大氣烘箱、惰性氣體烘箱、真空烘箱、熱風循環式烘箱等之方法。 作為塗膜加熱時之加熱溫度,並無特別限定,就容易使第1聚合性化合物聚合之觀點而言,較佳為70℃以上200℃以下,較佳為90℃以上150℃以下。 作為加熱塗膜時之加熱時間,並無特別限定,就提高生產性之方面而言,較佳為1~60分鐘,更佳為1~30分鐘。As a method of heating the coating film of the polymerizable composition in this step, a method of using a hot plate such as a hot plate, or an atmospheric oven, an inert gas oven, a vacuum oven, a hot air circulation type oven, etc. can be exemplified. The heating temperature at the time of heating the coating film is not particularly limited. From the viewpoint of easy polymerization of the first polymerizable compound, it is preferably 70°C or higher and 200°C or lower, and more preferably 90°C or higher and 150°C or lower. The heating time when heating the coating film is not particularly limited, but in terms of improving productivity, it is preferably 1 to 60 minutes, more preferably 1 to 30 minutes.

於本步驟中,上述聚合方法較佳為併用能量線照射方法及加熱方法之方法,更具體而言,較佳為依序進行能量線照射方法及加熱方法。其原因在於,能夠有效率地進行第1聚合性化合物之聚合。In this step, the above-mentioned polymerization method is preferably a method combining an energy ray irradiation method and a heating method, and more specifically, it is preferable to perform an energy ray irradiation method and a heating method sequentially. The reason is that the first polymerizable compound can be efficiently polymerized.

(2)第2方法 本步驟之第2方法係具有如下步驟之方法:使聚合性組合物中之第1聚合性化合物聚合而將第1聚合性化合物形成為被覆材、及以被覆含有酸成分之構件之方式使由上述被覆材形成步驟所獲得之被覆材與其接觸。(2) Method 2 The second method in this step is a method having the following steps: polymerizing the first polymerizable compound in the polymerizable composition to form the first polymerizable compound as a coating material, and coating the member containing the acid component The coating material obtained in the above coating material forming step is in contact with it.

(2-1)被覆材形成步驟 作為使本步驟中之第1聚合性化合物聚合而形成被覆材之方法,只要能夠使第1聚合性化合物彼此聚合而形成具有源自第1聚合性化合物之結構單元之聚合體,藉此將被覆材以可被覆上述構件之方式形成於上述構件即可。 作為此種方法,就提高操作性,且容易與被覆材接觸之觀點而言,較佳為將聚合性組合物塗佈於基材上之後使其聚合之方法。 關於上述第1聚合性化合物、聚合性組合物及第1聚合性化合物之聚合方法,可使用與上述「(1)第1方法」之項所記載之內容相同之方法,故而省略此處之說明。 其中,於本步驟中,上述聚合性組合物較佳為上述「A.聚合性組合物」之項中作為被覆構造體製造方法於第2製造方法中較佳地使用之內容。(2-1) Steps for forming coating material As a method of polymerizing the first polymerizable compound in this step to form a coating material, as long as the first polymerizable compounds are polymerized with each other to form a polymer having structural units derived from the first polymerizable compound, the coating The material may be formed on the above-mentioned member so as to cover the above-mentioned member. As such a method, from the viewpoint of improving workability and easy contact with the coating material, a method of polymerizing the polymerizable composition after coating the substrate is preferred. Regarding the polymerization method of the first polymerizable compound, the polymerizable composition, and the first polymerizable compound, the same method as described in the item "(1) First Method" above can be used, so the description here is omitted. . Among them, in this step, the polymerizable composition is preferably the content that is preferably used in the second manufacturing method as a method of manufacturing a covered structure in the item of "A. Polymerizable composition" described above.

(2-2)接觸步驟 作為以被覆含有酸成分之構件之方式使本步驟中之被覆材與其接觸之方法,只要能夠使被覆材與上述構件接觸以獲得所需酸成分捕捉性即可。 於本步驟中,與上述構件接觸並不限定於與上述構件直接相接之方法,亦可為介隔其他構件接觸之方法、即接觸與上述構件相鄰之其他構件之方法。 作為上述接觸方法,可例舉:經由接著劑將被覆材貼合於上述構件之方法;被覆材具有黏著力時利用上述被覆材之黏著力貼合於上述構件之方法等。 於本步驟中,上述接觸方法較佳為利用被覆材之黏著力貼合於上述構件之方法。其原因在於容易接觸。 使被覆材接觸時,上述接觸方法可將被覆材對上述構件加壓,亦可進行加熱。作為加熱條件,可設為60℃以上150℃以下之溫度條件。 於上述被覆材形成於基材上之情形時,上述接觸方法可為使包含基材及被覆材之積層體與上述構件接觸之方法,亦可為將被覆材自基材剝離後使被覆材與上述構件接觸之方法。(2-2) Contact steps As a method of bringing the coating material in this step into contact with the member containing the acid component, as long as the coating material can be brought into contact with the above-mentioned member to obtain the desired acid component capture property. In this step, the contact with the above-mentioned member is not limited to the method of directly connecting with the above-mentioned member, and may also be a method of interposing other members in contact, that is, a method of contacting other members adjacent to the above-mentioned member. Examples of the contact method include: a method of bonding a coating material to the member via an adhesive; a method of bonding the coating material to the member using the adhesive force of the coating material when the coating material has adhesive force. In this step, the above-mentioned contact method is preferably a method of attaching to the above-mentioned member by using the adhesive force of the covering material. The reason is easy access. When the covering material is brought into contact, the above-mentioned contact method may press the covering material against the above-mentioned member, or may heat it. As heating conditions, temperature conditions of 60°C or more and 150°C or less can be set. In the case where the coating material is formed on the substrate, the contact method may be a method of contacting a laminate including the substrate and the coating material with the member, or the coating material may be peeled from the substrate and the coating material may be brought into contact with the member. The contact method of the above-mentioned components.

(3)其他 關於上述被覆步驟中之聚合性組合物、含有酸成分之構件、及第1聚合性化合物等之其他相關內容,可與上述「A.聚合性組合物」之項所記載之內容相同,故而省略此處之說明。 關於由本步驟所形成之被覆材之內容等,可與上述「B.被覆構造體」之項所記載之被覆材之內容相同,故而省略此處之說明。(3) Other Regarding the polymerizable composition, the acid component-containing member, and the first polymerizable compound in the above-mentioned coating step, other related content may be the same as the content described in the item "A. Polymerizable composition" above, so it is omitted The description here. The content of the coating material formed by this step can be the same as the content of the coating material described in the item "B. Coating structure" above, so the description here is omitted.

2.其他步驟 本發明之被覆構造體的製造方法具有被覆步驟,但亦可視需要具有其他步驟。2. Other steps The manufacturing method of the covered structure of the present invention has a covering step, but may also have other steps as needed.

D.被覆材 本發明之被覆材包含源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物的聚合體。 又,其係用以被覆含有酸成分之構件者。 關於此種被覆材、其製造方法及含有酸成分之構件,可與上述「B.被覆構造體」之項所記載之內容相同。 [實施例]D. Coating material The coating material of the present invention contains a polymer derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group. In addition, it is used to coat a member containing an acid component. Regarding such a coating material, its manufacturing method, and the member containing an acid component, the contents described in the section of "B. Coating Structure" above can be the same. [Example]

以下,例舉實施例等對本發明進一步詳細地進行說明,但本發明並不限定於該等實施例。再者,只要無特別說明,則表1及2中之數值意指質量份。Hereinafter, the present invention will be described in further detail with examples and the like, but the present invention is not limited to these examples. In addition, unless otherwise specified, the numerical values in Tables 1 and 2 mean parts by mass.

[實施例1-1~1-16及比較例1-1~1-2以及實施例2-1~2-29及比較例2-1~2-5] 1.聚合性組合物(實施例1-1~1-16及比較例1-1~1-2)之製備 將以下之表1所記載之成分以該表所記載之比率混合而製備聚合性組合物。表1中之符號表示下述成分。 又,所獲得之聚合性組合物(組合物1-1~1-16及比較組合物1-1~1-2)之評價係利用下述實施例2-1~2-29及比較例2-1~2-5中所製造之被覆構造體進行。[Examples 1-1 to 1-16 and Comparative Examples 1-1 to 1-2, Examples 2-1 to 2-29 and Comparative Examples 2-1 to 2-5] 1. Preparation of polymerizable composition (Examples 1-1 to 1-16 and Comparative Examples 1-1 to 1-2) The components described in Table 1 below were mixed at the ratio described in the table to prepare a polymerizable composition. The symbols in Table 1 indicate the following components. In addition, the obtained polymerizable compositions (compositions 1-1 to 1-16 and comparative compositions 1-1 to 1-2) were evaluated using the following Examples 2-1 to 2-29 and Comparative Example 2 -1 to 2-5 of the covered structure manufactured.

[表1]    實施例1-1 實施例1-2 實施例1-3 實施例1-4 實施例1-5 實施例1-6 實施例1-7 實施例1-8 實施例1-9 實施例1-10 實施例1-11 實施例1-12 實施例1-13 實施例1-14 實施例1-15 實施例1-16 比較例1-1 比較例1-2 第1聚合性化合物 A1-1 100 40 50 50 90 90 90 50 70 50 90 90 90 50 30          A1-2    60                                                 A1-3       50                                              A1-4          50                                           A1-5             10                                        A1-6                10                                     A1-7                   10                                  A1-8                               10                      A1-9                                  10                   A1-10                                     10 20    100       第2聚合性化合物 A2-1                      50                30 70    100    A2-2                         30                            A2-3                            50                      100 聚合起始劑 B-1 5 5 7    3 3 3    3 3 2 1 3 2.5 3 3 3 3 B-2          9 3 3 3 5 3 3 4 3 3 2.5 3 1 3 3 調平劑 C-1 0.25 0.25       0.1 0.25 0.25       0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 C-2                      0.1 0.2                            增感劑 D-1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 咪唑化合物 D-2                                                    5 [Table 1] Example 1-1 Example 1-2 Example 1-3 Example 1-4 Example 1-5 Example 1-6 Example 1-7 Example 1-8 Example 1-9 Example 1-10 Example 1-11 Example 1-12 Example 1-13 Example 1-14 Example 1-15 Example 1-16 Comparative example 1-1 Comparative example 1-2 1st polymerizable compound A1-1 100 40 50 50 90 90 90 50 70 50 90 90 90 50 30 A1-2 60 A1-3 50 A1-4 50 A1-5 10 A1-6 10 A1-7 10 A1-8 10 A1-9 10 A1-10 10 20 100 2nd polymerizable compound A2-1 50 30 70 100 A2-2 30 A2-3 50 100 Polymerization initiator B-1 5 5 7 3 3 3 3 3 2 1 3 2.5 3 3 3 3 B-2 9 3 3 3 5 3 3 4 3 3 2.5 3 1 3 3 Leveling agent C-1 0.25 0.25 0.1 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 C-2 0.1 0.2 Sensitizer D-1 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Imidazole compounds D-2 5

[第1聚合性化合物] A1-1:下述式(A1-1)所表示之丙烯醯胺化合物(化合物A1-1) A1-2:下述式(A1-2)所表示之丙烯醯胺化合物(化合物A1-2) A1-3:下述式(A1-3)所表示之丙烯醯胺化合物(化合物A1-2) A1-4:下述式(A1-4)所表示之丙烯醯胺化合物(化合物A1-2) A1-5:下述式(A1-5)所表示之丙烯醯胺化合物(化合物A1-5) A1-6:下述式(A1-6)所表示之丙烯醯胺化合物(化合物A1-4) A1-7:下述式(A1-7)所表示之丙烯醯胺化合物(化合物A1-3) A1-8:下述式(A1-8)所表示之含異三聚氰酸環化合物(乙氧化異三聚氰酸三丙烯酸酯,A-9300,新中村化學製造) A1-9:含異三聚氰酸環化合物(己內酯改性異氰尿酸三(2-丙烯醯氧基乙基)酯A9300-1CL,新中村化學製造) A1-10:胺基甲酸酯化合物(丙烯酸胺基甲酸酯,新中村化學製造之U-9H,9官能)[First polymerizable compound] A1-1: The acrylamide compound (Compound A1-1) represented by the following formula (A1-1) A1-2: The acrylamide compound (Compound A1-2) represented by the following formula (A1-2) A1-3: The acrylamide compound (Compound A1-2) represented by the following formula (A1-3) A1-4: The acrylamide compound (Compound A1-2) represented by the following formula (A1-4) A1-5: The acrylamide compound (Compound A1-5) represented by the following formula (A1-5) A1-6: The acrylamide compound (Compound A1-4) represented by the following formula (A1-6) A1-7: An acrylamide compound (Compound A1-3) represented by the following formula (A1-7) A1-8: Isocyanuric ring-containing compound represented by the following formula (A1-8) (ethoxylated isocyanuric acid triacrylate, A-9300, manufactured by Shinnakamura Chemical Co., Ltd.) A1-9: Compound containing isocyanuric acid ring (caprolactone modified tris(2-propenoxyethyl) isocyanurate A9300-1CL, manufactured by Shinnakamura Chemical Co., Ltd.) A1-10: Urethane compound (Acrylic urethane, U-9H manufactured by Shinnakamura Chemical Co., Ltd., 9 functions)

[化35]

Figure 02_image069
[化35]
Figure 02_image069

[化36]

Figure 02_image071
[化36]
Figure 02_image071

[化37]

Figure 02_image073
[化37]
Figure 02_image073

[化38]

Figure 02_image075
[化38]
Figure 02_image075

[化39]

Figure 02_image077
[化39]
Figure 02_image077

[化40]

Figure 02_image079
[化40]
Figure 02_image079

[化41]

Figure 02_image081
[化41]
Figure 02_image081

[化42]

Figure 02_image083
[化42]
Figure 02_image083

[第2聚合性化合物] A2-1:苯氧基聚乙二醇丙烯酸酯(AMP-20GY,新中村化學製造) A2-2:聚丙二醇二丙烯酸酯(APG-200,新中村化學製造) A2-3:1,9-壬二醇二丙烯酸酯(A-NOD-N,新中村化學製造)[Second polymerizable compound] A2-1: Phenoxy polyethylene glycol acrylate (AMP-20GY, manufactured by Shinnakamura Chemical) A2-2: Polypropylene glycol diacrylate (APG-200, manufactured by Shinnakamura Chemical) A2-3: 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shinnakamura Chemical)

[其他成分] B-1:光自由基聚合起始劑(Lucirin TPO,BASF製造) B-2:光自由基聚合起始劑(Irg907,BASF製造) C-1:調平劑(SH-29PA,Dow Toray製造) C-2:調平劑(FZ-2110,Dow Toray製造) D-1:增感劑(DETX,日本化藥製造) D-2:咪唑化合物(2-乙基-4-甲基咪唑)[Other ingredients] B-1: Photo radical polymerization initiator (Lucirin TPO, manufactured by BASF) B-2: Light radical polymerization initiator (Irg907, manufactured by BASF) C-1: Leveling agent (SH-29PA, manufactured by Dow Toray) C-2: Leveling agent (FZ-2110, manufactured by Dow Toray) D-1: Sensitizer (DETX, manufactured by Nippon Kayaku) D-2: Imidazole compound (2-ethyl-4-methylimidazole)

2.被覆構造體(實施例2-1~2-29及比較例2-1~2-5)之製造 (1)含有酸成分之構件之形成 將以下之表2所記載之成分以該表所記載之比率混合,而製備混合物。使所製備之混合物通過5 μm之膜濾器,去除不溶解分而獲得陽離子硬化性組合物1~14。表2中之符號表示下述成分。 將陽離子硬化性組合物塗佈於基材(氧化銦錫(ITO)被覆載玻片,Sigma-Aldrich製造),而獲得具有塗膜之基材。作為基材,使用長10 cm、寬3 cm者。塗佈係採用棒式塗佈法進行。塗佈係以如下方式進行:於基材中央,陽離子硬化性組合物之塗佈長度為5 cm(基材之長邊方向)、塗佈寬度為3 cm(基材之短邊方向),即,長10 cm之基材之ITO面於俯視下被寬5 cm之陽離子硬化性組合物之塗膜分斷,於基材上形成未形成有陽離子硬化性組合物塗膜之2個側部(ITO面)。以陽離子硬化性組合物硬化後之膜厚為3~5 μm之方式調整陽離子硬化性組合物之塗佈厚度。將具有塗膜之基材載置於加熱板上,使該塗膜於90℃下乾燥1分鐘。 針對使用陽離子硬化性組合物1-1~1-5及1-7~1-14所形成之塗膜,使用UV-LED(Ultraviolet-Light Emitting Diode,紫外線發光二極體)以3000 mJ/cm2 對經乾燥之塗膜照射365 nm之紫外線而使塗膜硬化,從而於基材上形成陽離子硬化性組合物之硬化物(含有酸成分之構件)。 又,針對使用陽離子硬化性組合物1-6所形成之塗膜,於120℃在烘箱中加熱處理15分鐘而使塗膜硬化,從而於基材上形成陽離子硬化性組合物之硬化物(含有酸成分之構件)。2. Manufacture of covering structure (Examples 2-1 to 2-29 and Comparative Examples 2-1 to 2-5) (1) Formation of acid component-containing member The components described in Table 2 below are used in this table Mix at the stated ratio to prepare a mixture. The prepared mixture was passed through a 5 μm membrane filter to remove insoluble components to obtain cationic curable compositions 1-14. The symbols in Table 2 indicate the following components. The cationic curable composition is applied to a substrate (indium tin oxide (ITO) coated glass slide, manufactured by Sigma-Aldrich) to obtain a substrate with a coating film. As the base material, a length of 10 cm and a width of 3 cm are used. The coating system adopts bar coating method. The coating is carried out in the following way: in the center of the substrate, the coating length of the cationic curable composition is 5 cm (the long side direction of the substrate), and the coating width is 3 cm (the short side direction of the substrate), namely , The ITO surface of the substrate with a length of 10 cm is divided by the coating film of the cationic curable composition with a width of 5 cm in the plan view, and two side portions without the coating film of the cationic curable composition are formed on the substrate ( ITO surface). Adjust the coating thickness of the cationic curable composition so that the film thickness after curing of the cationic curable composition is 3 to 5 μm. The substrate with the coating film was placed on a hot plate, and the coating film was dried at 90°C for 1 minute. For the coating film formed by using cationic curable compositions 1-1 to 1-5 and 1-7 to 1-14, use UV-LED (Ultraviolet-Light Emitting Diode) at 3000 mJ/cm 2 Irradiate the dried coating film with 365 nm ultraviolet rays to harden the coating film, thereby forming a cured product of the cationic curable composition (a member containing an acid component) on the substrate. In addition, for the coating film formed using the cationic curable composition 1-6, heat treatment in an oven at 120°C for 15 minutes to harden the coating film to form a cured product of the cationic curable composition (containing The building block of the acid component).

(2)被覆構造體之形成 對形成於基材上之陽離子硬化性組合物1-1~1-14經硬化所獲得之硬化物(表3~4中,簡單記為硬化物1-1~1-14)之表面實施電暈放電處理,從而獲得具有基材(載玻片,ITO)及電暈放電處理過之陽離子硬化性組合物之硬化物(含有酸成分之構件)的積層基材。 於實施例2-1~2-29及比較例2-4~2-5中,對積層基材塗佈實施例1-1~1-16中所製備之聚合性組合物(表中,簡單記為組合物1-1~1-16)及比較例1-1~1-2中所製備之聚合性組合物(表中,簡單記為比較組合物1-1~1-2)而形成塗膜。塗佈係採用棒式塗佈法進行。關於聚合性組合物之塗佈,將塗佈長度設為5 cm(基材之長邊方向),將塗佈寬度設為3 cm(基材之短邊方向),以硬化後之膜厚為3~5 μm之方式調整聚合性組合物之塗佈厚度。又,塗佈部位係設為俯視下覆蓋陽離子硬化性組合物之硬化物整個面之部位。即,上述聚合性組合物之塗佈部位係設為與上述陽離子硬化性組合物之硬化物(含有酸成分之構件)之形成部位相同。 繼而,針對使用實施例1-1~1-16中所製備之聚合性組合物及比較例1-1~1-2中所製備之聚合性組合物所形成之塗膜,使用UV-LED以3000 mJ/cm2 照射365 nm之紫外線而使聚合性組合物聚合。藉此製造包含聚合性組合物之聚合物、陽離子硬化性組合物之硬化物、及基材的被覆構造體(實施例2-1~2-29及比較例2-4~2-5)。 又,除了未形成含有酸成分之構件(陽離子聚合性組合物之硬化物)以外,與實施例2-1等同樣地製造基材上積層有聚合性組合物之聚合物的比較例2-1~2-4之被覆構造體。(2) Formation of coating structure: Cured products obtained by curing the cationic curable compositions 1-1 to 1-14 formed on the substrate (in Tables 3 to 4, simply referred to as cured products 1-1 to 1-14) The surface of 1-14) is treated with corona discharge to obtain a laminated substrate with a substrate (glass slide, ITO) and a cured product of the corona discharge-treated cationic curable composition (member containing acid) . In Examples 2-1 to 2-29 and Comparative Examples 2-4 to 2-5, the polymerizable composition prepared in Examples 1-1 to 1-16 was applied to the laminated base material (in the table, simple Described as compositions 1-1 to 1-16) and the polymerizable compositions prepared in Comparative Examples 1-1 to 1-2 (in the table, simply referred to as comparative compositions 1-1 to 1-2).涂膜。 Coating. The coating system adopts bar coating method. Regarding the coating of the polymerizable composition, the coating length is set to 5 cm (the long side direction of the substrate), and the coating width is set to 3 cm (the short side direction of the substrate), and the film thickness after curing is Adjust the coating thickness of the polymerizable composition by 3 to 5 μm. In addition, the application site is a site that covers the entire surface of the cured product of the cationic curable composition in a plan view. That is, the application site of the polymerizable composition is the same as the formation site of the cured product (member containing an acid component) of the cationic curable composition. Then, for the coating film formed using the polymerizable composition prepared in Examples 1-1 to 1-16 and the polymerizable composition prepared in Comparative Examples 1-1 to 1-2, UV-LED was used to 3000 mJ/cm 2 is irradiated with 365 nm ultraviolet rays to polymerize the polymerizable composition. Thereby, the covering structure (Examples 2-1 to 2-29 and Comparative Examples 2-4 to 2-5) containing the polymer of the polymerizable composition, the cured product of the cation curable composition, and the substrate was produced. In addition, except that the acid component-containing member (cured product of the cationically polymerizable composition) was not formed, Comparative Example 2-1 in which a polymer with a polymerizable composition layered on a substrate was produced in the same manner as in Example 2-1 and the like ~2-4 covered structure.

(3)評價 針對實施例2-1~2-29及比較例2-1~2-5中所獲得之被覆構造體,進行腐蝕試驗及接著力試驗。(3) Evaluation Corrosion tests and adhesion tests were performed on the coated structures obtained in Examples 2-1 to 2-29 and Comparative Examples 2-1 to 2-5.

[腐蝕試驗] 測定所製得之被覆構造體之基材上未形成有硬化物之部位之氧化銦錫之電阻值(初始電阻值)。具體而言,將測試機之端子分別設置於基材之未形成有硬化物之兩側部,而測定基材之電阻值。測試機之端子分別設置於基材之長邊方向上距硬化物端部約1 cm之部位。其後,將被覆構造體靜置於恆溫恆濕槽中1週。將恆溫恆濕槽之溫度設定為60℃,將濕度設定為90%RH。測定靜置於恆溫恆濕槽中之被覆構造體之電阻值。電阻值測定係使用市售之兆歐測試機(絕緣電阻計)。使用靜置於恆溫恆濕槽後之電阻值及初始電阻值,由下述式算出電阻值之變化率。將其結果示於以下之表3及4中。變化率之值越小,意味著氧化銦錫之腐蝕得以抑制,具有優異之酸成分捕捉性。 變化率(%)=初始電阻值/靜置於恆溫恆濕槽後之電阻值×100[Corrosion Test] The resistance value (initial resistance value) of the indium tin oxide at the part where the hardened substance is not formed on the base material of the prepared covered structure was measured. Specifically, the terminals of the tester are respectively set on the two sides of the base material where the hardened material is not formed, and the resistance value of the base material is measured. The terminals of the tester are respectively arranged at a position about 1 cm away from the end of the hardened object in the longitudinal direction of the base material. After that, the covered structure was left in a constant temperature and humidity bath for 1 week. Set the temperature of the constant temperature and humidity tank to 60°C and the humidity to 90%RH. Measure the resistance value of the covered structure statically placed in a constant temperature and humidity tank. The resistance value was measured using a commercially available megohm tester (insulation resistance meter). Using the resistance value and the initial resistance value after being placed in a constant temperature and humidity tank, the rate of change of the resistance value is calculated from the following formula. The results are shown in Tables 3 and 4 below. The smaller the value of the rate of change, it means that the corrosion of indium tin oxide is suppressed, and it has excellent acid trapping properties. Change rate (%) = initial resistance value/resistance value after standing in a constant temperature and humidity tank×100

[接著力試驗] 對被覆構造體進行剝離試驗。具體而言,針對實施例及比較例中所獲得之被覆構造體,使用截切刀以相互30°之角度交叉,而切出到達陽離子硬化性組合物之硬化物(含有酸成分之構件)之40 mm切口。繼而,自交叉之2個切口之上,以接著部分之長度為50 mm之方式貼附透明膠帶,用橡皮擦自上而下進行摩擦,而使透明膠帶與被覆材表面密接。繼而,使透明膠帶密接2分鐘後,拿著透明膠帶之端將被覆材向垂直方向拉伸而使其剝離。將結果示於以下之表3及4中。 〇:未觀察到被覆材之剝離。 ×:觀察到了被覆材之剝離。 於未觀察到被覆材之剝離之情形時,表示被覆材具有較高之接著力。[Adhesion test] A peel test was performed on the covered structure. Specifically, for the coated structures obtained in the examples and comparative examples, cutting blades were used to cross each other at an angle of 30° to cut out the cured product (member containing acid component) reaching the cationic curable composition 40 mm incision. Then, from the intersection of the two incisions, stick the transparent tape so that the length of the next part is 50 mm, and rub it from top to bottom with an eraser to make the transparent tape adhere to the surface of the coating material. Then, after making the scotch tape close for 2 minutes, hold the end of the scotch tape and stretch the covering material in the vertical direction to peel it off. The results are shown in Tables 3 and 4 below. ○: Peeling of the coating material is not observed. ×: Peeling of the coating material is observed. When no peeling of the covering material is observed, it means that the covering material has a high adhesive force.

[表2]       組合物1-1 組合物1-2 組合物1-3 組合物1-4 組合物1-5 組合物1-6 組合物1-7 組合物1-8 組合物1-9 組合物1-10 組合物1-11 組合物1-12 組合物1-13 組合物1-14 陽離子硬化性成分 E-1 80 70 60 80 80 70 60 70 60 40 60 60 70 60 E-2 20    30       20 30 20 30 20    30 20 10 E-3    30 10                   20 10          E-4          20 20                            E-5                10                         E-6                   10                      E-7                      10                   E-8                         10                E-9                            20             E-10                               30       20 E-11                                  10       E-12                                     10 10 酸產生劑 F-1 5 5 5 4.5 6    3 5                2 F-2                         5                F-3                            6       2.5    F-4                               4 2.5       F-5                3                         F-6                   2             2.5 2.5 2 添加劑 調平劑 G-1 0.1 0.15 0.15 0.1    0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 G-2             0.1                            增感劑 G-3    1 1 0.1 1    1             0.5 0.5 0.5 G-4                      1                   G-5                         1                抗氧化劑 G-6    1          1          0.5          2 G-7                               0.5 1       色素 G-8          1                1.5 0.5 1       溶劑 H-1    30 30 30                100 50       50 H-2                60                         H-3    30 30 30                      70       H-4                      50 50                H-5                   60                      [Table 2] Composition 1-1 Composition 1-2 Composition 1-3 Composition 1-4 Composition 1-5 Composition 1-6 Composition 1-7 Composition 1-8 Composition 1-9 Composition 1-10 Composition 1-11 Composition 1-12 Composition 1-13 Composition 1-14 Cationic hardening ingredients E-1 80 70 60 80 80 70 60 70 60 40 60 60 70 60 E-2 20 30 20 30 20 30 20 30 20 10 E-3 30 10 20 10 E-4 20 20 E-5 10 E-6 10 E-7 10 E-8 10 E-9 20 E-10 30 20 E-11 10 E-12 10 10 Acid generator F-1 5 5 5 4.5 6 3 5 2 F-2 5 F-3 6 2.5 F-4 4 2.5 F-5 3 F-6 2 2.5 2.5 2 additive Leveling agent G-1 0.1 0.15 0.15 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 G-2 0.1 Sensitizer G-3 1 1 0.1 1 1 0.5 0.5 0.5 G-4 1 G-5 1 Antioxidants G-6 1 1 0.5 2 G-7 0.5 1 pigment G-8 1 1.5 0.5 1 Solvent H-1 30 30 30 100 50 50 H-2 60 H-3 30 30 30 70 H-4 50 50 H-5 60

[陽離子硬化性成分] E-1:下述式(E-1)所表示之脂環式環氧化合物(Celloxide 20121P,Daicel製造,低分子量化合物) E-2:下述式(E-2)所表示之脂肪族環氧化合物(低分子量化合物) E-3:脂肪族環氧化合物(EHPE-3150,Daicel製造,2,2-雙(羥甲基)-1-丁醇之1,2-環氧-4-(2-環氧乙烷基)環己烷加成物,高分子量化合物) E-4:下述式(E-4)所表示之脂肪族環氧化合物(低分子量化合物) E-5:下述式(E-5)所表示之芳香族環氧化合物(低分子量化合物) E-6:下述式(E-6)所表示之芳香族環氧化合物(低分子量化合物) E-7:下述式(E-7)所表示之芳香族環氧化合物(低分子量化合物) E-8:下述式(E-8)所表示之脂肪族環氧化合物(低分子量化合物) E-9:下述式(E-9)所表示之氧雜環丁烷化合物(東亞合成製造,OXT-211,低分子量化合物) E-10:下述式(E-10)所表示之脂環式環氧化合物(ARKEMA製造,二氧化檸檬烯,低分子量化合物) E-11:下述式(E-11)所表示之脂肪族環氧化合物(低分子量化合物) E-12:下述式(E-12)所表示之芳香族環氧化合物(VG-3101L,Printec製造,低分子量化合物)[Cationic hardening ingredient] E-1: Alicyclic epoxy compound represented by the following formula (E-1) (Celloxide 20121P, manufactured by Daicel, low molecular weight compound) E-2: Aliphatic epoxy compound (low molecular weight compound) represented by the following formula (E-2) E-3: Aliphatic epoxy compound (EHPE-3150, manufactured by Daicel, 1,2-epoxy-4-(2-oxirane) of 2,2-bis(hydroxymethyl)-1-butanol ) Cyclohexane adducts, high molecular weight compounds) E-4: Aliphatic epoxy compound (low molecular weight compound) represented by the following formula (E-4) E-5: Aromatic epoxy compound (low molecular weight compound) represented by the following formula (E-5) E-6: Aromatic epoxy compound (low molecular weight compound) represented by the following formula (E-6) E-7: Aromatic epoxy compound (low molecular weight compound) represented by the following formula (E-7) E-8: Aliphatic epoxy compound (low molecular weight compound) represented by the following formula (E-8) E-9: An oxetane compound represented by the following formula (E-9) (manufactured by Toagosei, OXT-211, low molecular weight compound) E-10: Alicyclic epoxy compound represented by the following formula (E-10) (manufactured by ARKEMA, limonene dioxide, low molecular weight compound) E-11: Aliphatic epoxy compound (low molecular weight compound) represented by the following formula (E-11) E-12: Aromatic epoxy compound represented by the following formula (E-12) (VG-3101L, manufactured by Printec, low molecular weight compound)

[化43]

Figure 02_image085
[化43]
Figure 02_image085

[化44]

Figure 02_image087
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Figure 02_image087

[化45]

Figure 02_image089
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Figure 02_image089

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Figure 02_image091
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Figure 02_image091

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Figure 02_image093
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Figure 02_image093

[化48]

Figure 02_image095
[化48]
Figure 02_image095

[化49]

Figure 02_image097
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Figure 02_image097

[化50]

Figure 02_image099
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Figure 02_image099

[化51]

Figure 02_image101
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Figure 02_image101

[化52]

Figure 02_image103
[化52]
Figure 02_image103

[化53]

Figure 02_image105
[化53]
Figure 02_image105

[酸產生劑] F-1:下述式(F-1)所表示之芳香族鋶鹽(三芳基鋶鹽,光酸產生劑) F-2:下述式(F-2)所表示之芳香族鋶鹽(三芳基鋶鹽,光酸產生劑) F-3:下述式(F-3)所表示之芳香族鋶鹽(三芳基鋶鹽,光酸產生劑) F-4:下述式(F-4)所表示之芳香族鋶鹽(三芳基鋶鹽,光酸產生劑) F-5:下述式(F-5)所表示之芳香族鋶鹽(熱酸產生劑,CPI-100P,San-Apro製造,單芳基鋶鹽) F-6:下述式(F-6)所表示之芳香族鋶鹽(三芳基鋶鹽,光酸產生劑)[Acid Generator] F-1: Aromatic sulfonium salt represented by the following formula (F-1) (triaryl sulfonium salt, photoacid generator) F-2: Aromatic sulfonium salt represented by the following formula (F-2) (triaryl sulfonium salt, photoacid generator) F-3: Aromatic sulfonium salt represented by the following formula (F-3) (triaryl sulfonium salt, photoacid generator) F-4: Aromatic sulfonium salt represented by the following formula (F-4) (triaryl sulfonium salt, photoacid generator) F-5: Aromatic sulfonium salt represented by the following formula (F-5) (thermal acid generator, CPI-100P, manufactured by San-Apro, monoaryl sulfonium salt) F-6: Aromatic sulfonium salt represented by the following formula (F-6) (triaryl sulfonium salt, photoacid generator)

[化54]

Figure 02_image107
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Figure 02_image107

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Figure 02_image109
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Figure 02_image109

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Figure 02_image111
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Figure 02_image111

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Figure 02_image113
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Figure 02_image113

[化58]

Figure 02_image115
[化58]
Figure 02_image115

[化59]

Figure 02_image117
[化59]
Figure 02_image117

[添加劑] G-1:調平劑(SH-29 Paint Aditive,東麗道康寧製造) G-2:調平劑(MEGAFAC F-444,DIC製造) G-3:下述式(G-3)所表示之苯并咔唑增感劑 G-4:下述式(G-4)所表示之二丁氧基蒽增感劑 G-5:下述式(G-5)所表示之二乙氧基萘增感劑 G-6:下述式(G-6)所表示之化合物(抗氧化劑) G-7:下述式(G-7)所表示之化合物(抗氧化劑) G-8:染料(四氮雜卟啉染料)[additive] G-1: Leveling agent (SH-29 Paint Aditive, manufactured by Toray Dow Corning) G-2: Leveling agent (MEGAFAC F-444, manufactured by DIC) G-3: Benzocarbazole sensitizer represented by the following formula (G-3) G-4: Dibutoxyanthracene sensitizer represented by the following formula (G-4) G-5: Diethoxynaphthalene sensitizer represented by the following formula (G-5) G-6: Compound (antioxidant) represented by the following formula (G-6) G-7: Compound (antioxidant) represented by the following formula (G-7) G-8: Dye (porphyrazine dye)

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Figure 02_image119
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Figure 02_image119

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Figure 02_image121
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Figure 02_image121

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Figure 02_image123
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Figure 02_image123

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Figure 02_image125
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Figure 02_image125

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Figure 02_image127
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Figure 02_image127

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Figure 02_image129
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Figure 02_image129

[溶劑] H-1:二丙酮醇 H-2:丙二醇單甲醚 H-3:丙二醇單甲醚乙酸酯 H-4:甲基乙基酮 H-5:二丙二醇單甲醚乙酸酯[Solvent] H-1: Diacetone alcohol H-2: Propylene glycol monomethyl ether H-3: Propylene glycol monomethyl ether acetate H-4: Methyl ethyl ketone H-5: Dipropylene glycol monomethyl ether acetate

[表3]    實施例 2-1 實施例 2-2 實施例 2-3 實施例 2-4 實施例 2-5 實施例 2-6 實施例 2-7 實施例 2-8 實施例 2-9 實施例 2-10 實施例 2-11 實施例 2-12 實施例 2-13 實施例 2-14    硬化物 硬化物1-1 硬化物1-2 硬化物1-3 硬化物1-4 硬化物1-5 硬化物1-6 硬化物1-7 硬化物1-8 硬化物1-9 硬化物1-10 硬化物1-11 硬化物1-12 硬化物1-13 硬化物1-14    聚合性組合物 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1 組合物1-1    酸成分捕捉性(腐蝕試驗、變化率) 102% 102% 105% 100% 101% 101% 101% 105% 103% 101% 106% 102% 100% 105%    接著力                                                       實施例 2-15 實施例 2-16 實施例 2-17 實施例 2-18 實施例 2-19 實施例 2-20 實施例 2-21 實施例 2-22 實施例 2-23 實施例 2-24 實施例 2-25 實施例 2-26 實施例 2-27 實施例 2-28 實施例 2-29 硬化物 硬化物1-1 硬化物1-1 硬化物1-1 硬化物1-2 硬化物1-2 硬化物1-2 硬化物1-3 硬化物1-3 硬化物1-3 硬化物1-3 硬化物1-3 硬化物1-3 硬化物1-3 硬化物1-1 硬化物1-1 聚合性組合物 組合物1-2 組合物1-3 組合物1-4 組合物1-5 組合物1-6 組合物1-7 組合物1-8 組合物1-9 組合物1-10 組合物1-11 組合物1-12 組合物1-13 組合物1-14 組合物1-15 組合物1-16 酸成分捕捉性(腐蝕試驗、變化率) 102% 108% 105% 106% 103% 104% 106% 107% 108% 104% 102% 100% 105% 111% 109% 接著力 [table 3] Example 2-1 Example 2-2 Example 2-3 Example 2-4 Example 2-5 Example 2-6 Example 2-7 Example 2-8 Example 2-9 Example 2-10 Example 2-11 Example 2-12 Example 2-13 Example 2-14 Hardened Hardened object 1-1 Hardened 1-2 Hardened object 1-3 Hardened object 1-4 Hardened material 1-5 Hardened material 1-6 Hardened objects 1-7 Hardened objects 1-8 Hardened objects 1-9 Hardened object 1-10 Hardened 1-11 Hardened 1-12 Hardened 1-13 Hardened object 1-14 Polymerizable composition Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Composition 1-1 Acid catchability (corrosion test, rate of change) 102% 102% 105% 100% 101% 101% 101% 105% 103% 101% 106% 102% 100% 105% Follow force Example 2-15 Example 2-16 Example 2-17 Example 2-18 Example 2-19 Example 2-20 Example 2-21 Example 2-22 Example 2-23 Example 2-24 Example 2-25 Example 2-26 Example 2-27 Example 2-28 Example 2-29 Hardened Hardened object 1-1 Hardened object 1-1 Hardened object 1-1 Hardened 1-2 Hardened 1-2 Hardened 1-2 Hardened object 1-3 Hardened object 1-3 Hardened object 1-3 Hardened object 1-3 Hardened object 1-3 Hardened object 1-3 Hardened object 1-3 Hardened object 1-1 Hardened object 1-1 Polymerizable composition Composition 1-2 Composition 1-3 Composition 1-4 Composition 1-5 Composition 1-6 Composition 1-7 Composition 1-8 Composition 1-9 Composition 1-10 Composition 1-11 Composition 1-12 Composition 1-13 Composition 1-14 Composition 1-15 Composition 1-16 Acid catchability (corrosion test, rate of change) 102% 108% 105% 106% 103% 104% 106% 107% 108% 104% 102% 100% 105% 111% 109% Follow force

[表4]    比較例2-1 比較例2-2 比較例2-3 比較例2-4 比較例2-5 硬化物 硬化物1-1 硬化物1-2 硬化物1-3 硬化物1-1 硬化物1-1 聚合性組合物 比較組合物1-1 比較組合物1-2 酸成分捕捉性(腐蝕試驗、變化率) 120% 113% 115% 120% 118% 接著力 - - - × × [Table 4] Comparative example 2-1 Comparative example 2-2 Comparative example 2-3 Comparative example 2-4 Comparative example 2-5 Hardened Hardened object 1-1 Hardened 1-2 Hardened object 1-3 Hardened object 1-1 Hardened object 1-1 Polymerizable composition no no no Comparative composition 1-1 Comparison composition 1-2 Acid catchability (corrosion test, rate of change) 120% 113% 115% 120% 118% Follow force - - - X X

[參考比較例2-1] 將實施例1-6中所製備之聚合性組合物塗佈於基材(氧化銦錫被覆載玻片,Sigma-Aldrich製造),而獲得具有塗膜之基材。作為基材,使用長10 cm、寬3 cm者。塗佈係採用棒式塗佈法進行。聚合性組合物1-6之塗佈長度係設為5 cm,塗佈寬度係設為3 cm,以塗膜位於基材中央之方式進行塗佈。以硬化後之膜厚為3~5 μm之方式調整聚合性組合物1-6之塗佈厚度。針對具有塗膜之基材,使用UV-LED以3000 mJ/cm2 照射365 nm之紫外線而使聚合性組合物聚合,從而獲得聚合體。藉由棒式塗佈法於所獲得之聚合體上塗佈陽離子性硬化性組合物1-2而形成塗膜,使該塗膜於90℃下乾燥1分鐘。使用UV-LED以3000 mJ/cm2 對經乾燥之塗膜照射了365 nm之紫外線,但陽離子硬化性組合物1-2並未硬化。[Reference Comparative Example 2-1] The polymerizable composition prepared in Example 1-6 was coated on a substrate (indium tin oxide coated glass slide, manufactured by Sigma-Aldrich) to obtain a substrate with a coating film . As the base material, a length of 10 cm and a width of 3 cm are used. The coating system adopts bar coating method. The coating length of the polymerizable composition 1-6 was set to 5 cm, and the coating width was set to 3 cm, and the coating was applied so that the coating film was located in the center of the substrate. Adjust the coating thickness of the polymerizable composition 1-6 so that the film thickness after curing is 3 to 5 μm. For the substrate with the coating film, use UV-LED to irradiate 365 nm ultraviolet rays at 3000 mJ/cm 2 to polymerize the polymerizable composition to obtain a polymer. The cationic curable composition 1-2 was coated on the obtained polymer by a bar coating method to form a coating film, and the coating film was dried at 90°C for 1 minute. A UV-LED was used to irradiate the dried coating film with ultraviolet rays of 365 nm at 3000 mJ/cm 2, but the cationic curable composition 1-2 did not harden.

[參考比較例2-2] 將10質量份之實施例1-1中所製備之聚合性組合物1-1與90質量份之陽離子性硬化性組合物1-1混合,而獲得混合組合物。將該混合組合物塗佈於基材(氧化銦錫被覆載玻片,Sigma-Aldrich製造),而獲得具有塗膜之基材。作為基材,使用長10 cm、寬3 cm者。塗佈係採用棒式塗佈法進行。混合組合物之塗佈長度係設為5 cm,塗佈寬度係設為3 cm,以塗膜位於基材中央之方式進行塗佈。使用UV-LED以3000 mJ/cm2 對具有塗膜之基材照射了365 nm之紫外線,但混合組合物並未硬化。[Reference Comparative Example 2-2] 10 parts by mass of the polymerizable composition 1-1 prepared in Example 1-1 and 90 parts by mass of the cationic curable composition 1-1 were mixed to obtain a mixed composition . The mixed composition was applied to a substrate (indium tin oxide coated glass slide, manufactured by Sigma-Aldrich) to obtain a substrate with a coating film. As the base material, a length of 10 cm and a width of 3 cm are used. The coating system adopts bar coating method. The coating length of the mixed composition is set to 5 cm, and the coating width is set to 3 cm, and the coating is applied with the coating film in the center of the substrate. A UV-LED was used to irradiate the coated substrate with 365 nm ultraviolet rays at 3000 mJ/cm 2, but the mixed composition did not harden.

表3及4表明,實施例2-1~2-29之被覆構造體、即具有包含實施例1-1~1-16之聚合性組合物之聚合物的被覆材者與不具有被覆材之比較例2-1~2-3之被覆構造體相比,變化率更小。 又,實施例2-1~2-29之被覆構造體、即具有包含實施例1-1~1-16之聚合性組合物之聚合物的被覆材者與比較例2-4及2-5、即具有包含比較例1-1及1-2之比較聚合性組合物之聚合物的被覆材者相比,變化率更小,且聚合物之接著力更強。 由以上結果確認,本發明之聚合性組合物之聚合物能夠形成酸成分捕捉性優異且接著力較高之被覆材。Tables 3 and 4 show that the covering structure of Examples 2-1 to 2-29, that is, the covering material having the polymer containing the polymerizable composition of Examples 1-1 to 1-16, and the covering material without the covering structure Compared with the covered structures of Comparative Examples 2-1 to 2-3, the rate of change is smaller. In addition, the covering structure of Examples 2-1 to 2-29, that is, the covering material having the polymer containing the polymerizable composition of Examples 1-1 to 1-16, and Comparative Examples 2-4 and 2-5 That is, compared with the coating material with the polymer containing the comparative polymerizable composition of Comparative Examples 1-1 and 1-2, the rate of change is smaller and the adhesive force of the polymer is stronger. From the above results, it was confirmed that the polymer of the polymerizable composition of the present invention can form a coating material having excellent acid component capturing properties and high adhesiveness.

[實施例3-1及比較例3-1~3-2] 1.聚合性組合物(實施例3-1及比較例3-1~3-2)之製備 將以下之表5所記載之成分以該表所記載之比率混合而製備聚合性組合物。表5中之符號表示下述成分。再者,關於表中之A1-1及D-2,表示與表1所記載之成分相同之內容。又,表中表示比率之數值係指質量份。[Example 3-1 and Comparative Examples 3-1 to 3-2] 1. Preparation of polymerizable composition (Example 3-1 and Comparative Examples 3-1 to 3-2) The components described in Table 5 below were mixed at the ratio described in the table to prepare a polymerizable composition. The symbols in Table 5 indicate the following components. In addition, the A1-1 and D-2 in the table indicate the same contents as the ingredients described in Table 1. In addition, the numerical values indicating the ratio in the table refer to parts by mass.

A2-4:丙烯酸丁酯 A2-5:丙烯酸羥乙酯 B-3:熱自由基聚合起始劑(2,2'-偶氮二異丁腈) E-1:甲基乙基酮A2-4: Butyl acrylate A2-5: Hydroxyethyl acrylate B-3: Thermal radical polymerization initiator (2,2'-azobisisobutyronitrile) E-1: Methyl ethyl ketone

2.被覆材之形成 向具備冷卻管及攪拌機之燒瓶中加入實施例及比較例之聚合性組合物,一面慢慢攪拌,一面使溶液之溫度上升至80℃,保持該溫度4小時後,升溫至100℃,保持該溫度1小時進行聚合,藉此獲得硬化物(共聚物,固形物成分10%)。 再者,於比較例3-2中,形成硬化物後,針對硬化物溶液添加咪唑化合物D-2。 又,實施例3-中所獲得之共聚物之重量平均分子量(Mw)為30萬。 又,比較例3-1及比較例3-2中所獲得之共聚物之重量平均分子量(Mw)為30萬。2. Formation of covering material The polymerizable compositions of the examples and comparative examples were added to a flask equipped with a cooling tube and a stirrer. While stirring slowly, the temperature of the solution was raised to 80°C. After maintaining the temperature for 4 hours, the temperature was raised to 100°C and kept at the same temperature. Polymerization is carried out at a temperature of 1 hour to obtain a cured product (copolymer, solid content 10%). Furthermore, in Comparative Example 3-2, after the cured product was formed, the imidazole compound D-2 was added to the cured product solution. In addition, the weight average molecular weight (Mw) of the copolymer obtained in Example 3 was 300,000. In addition, the weight average molecular weight (Mw) of the copolymer obtained in Comparative Example 3-1 and Comparative Example 3-2 was 300,000.

使用敷料器將所獲得之共聚物溶液塗佈於PET(polyethylene terephthalate,聚對苯二甲酸乙二酯)膜(東洋紡公司製造:A4300,厚度:100 μmm)上而形成塗膜,將作為溶劑之甲基乙基酮乾燥去除,藉此形成被覆材。再者,被覆材之俯視形狀係設為3 cm×5 cm之長方形狀。Use an applicator to coat the obtained copolymer solution on a PET (polyethylene terephthalate) film (manufactured by Toyobo Co., Ltd.: A4300, thickness: 100 μmm) to form a coating film, which will be used as a solvent The methyl ethyl ketone is dried and removed, thereby forming a coating material. Furthermore, the top view shape of the covering material is a 3 cm×5 cm rectangular shape.

3.被覆構造體之形成 作為積層基材(載玻片/ITO/含有酸成分之構件),採用以陽離子硬化性組合物1-1在積層有ITO之基材上形成硬化物(含有酸成分之構件)所得者,且將由實施例3-1及比較例3-1~3-2所形成之上述被覆材以加熱至80℃之狀態壓接,而將其積層於積層基材上,除此以外,利用與實施例2-1相同之方法獲得被覆構造體。3. Formation of covering structure As the laminated base material (slide/ITO/member containing acid component), a cured product (member containing acid component) is formed on the base material laminated with ITO with the cationic curable composition 1-1, and The above-mentioned coating materials formed by Example 3-1 and Comparative Examples 3-1 to 3-2 were pressure-bonded in a state heated to 80°C, and they were laminated on a laminated base material. Other than that, the same was used as in the examples Obtain the covered structure in the same way as 2-1.

4.評價 針對由實施例及比較例中所獲得之被覆材所形成之被覆構造體,進行上述[腐蝕試驗]及[接著力試驗]中記載之腐蝕試驗及接著力試驗。將結果示於以下之表5中。4. Evaluation The corrosion test and the adhesion test described in the above-mentioned [Corrosion Test] and [Adhesion Test] were performed on the coating structure formed from the coating materials obtained in the Examples and Comparative Examples. The results are shown in Table 5 below.

[表5]    實施例3-1 比較例3-1 比較例3-2 第1聚合性化合物 A1-1 30       第2聚合性化合物 A2-4 70 70 70 A2-5    30 30 咪唑化合物 D-2       3 起始劑 B-3 4 4 4 溶劑 E-1 900 900 900 評價 酸成分捕捉性(腐蝕試驗、變化率) 114% 120% 117% 接著力 × × [table 5] Example 3-1 Comparative example 3-1 Comparative example 3-2 1st polymerizable compound A1-1 30 2nd polymerizable compound A2-4 70 70 70 A2-5 30 30 Imidazole compounds D-2 3 Initiator B-3 4 4 4 Solvent E-1 900 900 900 Evaluation Acid catchability (corrosion test, rate of change) 114% 120% 117% Follow force X X

表5表明,由實施例3-1之聚合性組合物所獲得之被覆構造體與由比較例3-1~3-2之聚合性組合物所獲得之被覆構造體相比,變化率更小,且被覆材之接著力更強。由該結果確認,本發明之聚合性組合物之聚合物可用作酸成分捕捉性優異且接著力較高之被覆材。 [產業上之可利用性]Table 5 shows that the covered structure obtained from the polymerizable composition of Example 3-1 has a smaller rate of change than the covered structure obtained from the polymerizable composition of Comparative Examples 3-1 to 3-2 , And the adhesion of the covering material is stronger. From this result, it was confirmed that the polymer of the polymerizable composition of the present invention can be used as a coating material having excellent acid component capturing properties and high adhesiveness. [Industrial availability]

本發明取得如下效果:可提供一種能夠形成酸成分捕捉性優異且接著力較高之被覆材的聚合性組合物。The present invention has the following effect: it is possible to provide a polymerizable composition capable of forming a coating material having excellent acid component capturing properties and high adhesiveness.

Claims (12)

一種聚合性組合物,其係包含具有醯胺基及乙烯性不飽和基之第1聚合性化合物者,且 用以被覆含有酸成分之構件。A polymerizable composition comprising a first polymerizable compound having an amide group and an ethylenically unsaturated group, and Used to coat components containing acid. 如請求項1之聚合性組合物,其中第1聚合性化合物包含選自由: 具有醯胺基與乙烯性不飽和基直接鍵結之結構之丙烯醯胺化合物、 具有胺基甲酸酯鍵及乙烯性不飽和基之胺基甲酸酯化合物、及 具有異三聚氰酸環及乙烯性不飽和基之含異三聚氰酸環化合物 所組成之群中的至少1種化合物。The polymerizable composition of claim 1, wherein the first polymerizable compound contains selected from: An acrylamide compound with a structure in which an amide group and an ethylenically unsaturated group are directly bonded, A urethane compound having a urethane bond and an ethylenically unsaturated group, and Isocyanuric acid ring-containing compound with isocyanuric acid ring and ethylenically unsaturated group At least one compound in the group consisting of. 如請求項2之聚合性組合物,其中第1聚合性化合物包含丙烯醯胺化合物。The polymerizable composition according to claim 2, wherein the first polymerizable compound contains an acrylamide compound. 如請求項2之聚合性組合物,其中上述丙烯醯胺化合物係式(A1)所表示之化合物,
Figure 03_image131
式中,n表示1或2之整數; 於n為1之整數之情形時,R1 及R2 分別獨立地表示氫原子、下述式(a)所表示之基、碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰,R1 及R2 可相互鍵結而形成雜環, R3 表示氫原子或甲基; 於n為2之整數之情形時,R1 表示直接鍵、碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰, R2 表示氫原子、碳原子數1~30之一價烴基、碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰, R2 可與相鄰氮原子鍵結而形成含有2個氮原子之雜環, R3 表示氫原子或甲基, 2個R2 及R3 可分別相同,亦可不同;
Figure 03_image133
式中,R4 表示氫原子、或碳原子數1~30之一價烴基, R5 表示氫原子或甲基, X表示直接鍵、碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自下述群(I)之二價基而成之基,其中,於2個以上之亞甲基被取代為選自下述群(I)之二價基之情形時,該二價基不相鄰, 於上述通式(A1)所表示之化合物中存在複數個上述通式(a)所表示之基之情形時,存在複數個之R4 、R5 及X可分別相同,亦可不同, *表示鍵結鍵; 群(I):-O-、-S-、-NR6 -、-NR6 -(C=O)-O-、-CO-、-(C=O)-O-、-O-(C=O)-、-O-(C=O)-O- R6 表示氫原子或碳原子數1~30之一價烴基。
The polymerizable composition of claim 2, wherein the acrylamide compound is a compound represented by formula (A1),
Figure 03_image131
In the formula, n represents an integer of 1 or 2; when n is an integer of 1 , R 1 and R 2 each independently represent a hydrogen atom, the group represented by the following formula (a), and the number of carbon atoms is 1 to 30 A monovalent hydrocarbon group, a monovalent heterocyclic group having 2 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with two selected from the following group (I) In the case where two or more methylene groups are substituted with divalent groups selected from the following group (I), the divalent groups are not adjacent to each other, and R 1 and R 2 may be Bonded to each other to form a heterocyclic ring, R 3 represents a hydrogen atom or a methyl group; when n is an integer of 2, R 1 represents a direct bond, a divalent hydrocarbon group with 1 to 30 carbon atoms, and 2 to 30 carbon atoms The divalent heterocyclic group, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with a divalent group selected from the following group (I), wherein in 2 When more than one methylene group is substituted with a divalent group selected from the following group (I), the divalent group is not adjacent, and R 2 represents a hydrogen atom, a monovalent hydrocarbon group having 1 to 30 carbon atoms, A monovalent heterocyclic group containing 2 to 30 carbon atoms, or one or more methylene groups in the hydrocarbon group or the heterocyclic group containing are substituted with a divalent group selected from the following group (I) In the case where two or more methylene groups are substituted with a divalent group selected from the following group (I), the divalent group is not adjacent, and R 2 may be bonded to an adjacent nitrogen atom. A heterocyclic ring containing 2 nitrogen atoms is formed, R 3 represents a hydrogen atom or a methyl group, and the 2 R 2 and R 3 may be the same or different;
Figure 03_image133
In the formula, R 4 represents a hydrogen atom or a monovalent hydrocarbon group with 1 to 30 carbon atoms, R 5 represents a hydrogen atom or a methyl group, and X represents a direct bond, a divalent hydrocarbon group with 1 to 30 carbon atoms, and 2 carbon atoms. ~30 divalent heterocyclic group, or one or more methylene groups in the hydrocarbon group or the heterocyclic group is substituted with a divalent group selected from the following group (I), wherein, When two or more methylene groups are substituted with a divalent group selected from the following group (I), the divalent group is not adjacent, and there are plural in the compound represented by the general formula (A1) In the case of the base represented by the above general formula (a), there are a plurality of R 4 , R 5 and X which may be the same or different, respectively, * represents a bonding bond; Group (I): -O-, -S -, -NR 6 -, -NR 6 -(C=O)-O-, -CO-, -(C=O)-O-, -O-(C=O)-, -O-(C= O)-O-R 6 represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 30 carbon atoms.
如請求項4之聚合性組合物,其中上述式(A1)所表示之化合物係選自由下述化合物A1-1、化合物A1-2、化合物A1-3、化合物A1-4及化合物A1-5所組成之群中之化合物, 化合物A1-1:式(A1)中之n為1且R1 及R2 相互鍵結而形成雜環之化合物 化合物A1-2:式(A1)中之n為1且R1 及R2 分別獨立為氫原子、或可具有取代基之碳原子數1~30之烷基、或該烷基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基的化合物 化合物A1-3:式(A1)中之n為1、R1 為氫原子且R2 為可具有取代基之碳原子數2~30之具有不飽和雙鍵之烴基、或該具有不飽和雙鍵之烴基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基的化合物 化合物A1-4:式(A1)中之n為1且R1 及R2 分別獨立為上述基(a)之化合物 化合物A1-5:式(A1)中之n為2、R1 為碳原子數1~30之二價烴基、碳原子數2~30之二價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基且R2 為氫原子、碳原子數1~30之一價烴基、或碳原子數2~30之一價含雜環基、或者該烴基或該含雜環基中之1個以上之亞甲基被取代為選自上述群(I)之二價基而成之基的化合物。The polymerizable composition according to claim 4, wherein the compound represented by the above formula (A1) is selected from the group consisting of the following compound A1-1, compound A1-2, compound A1-3, compound A1-4 and compound A1-5 The compound in the group of composition, compound A1-1: the compound in formula (A1) where n is 1 and R 1 and R 2 are bonded to each other to form a heterocyclic ring. Compound A1-2: the compound in formula (A1) where n is 1 And R 1 and R 2 are each independently a hydrogen atom, or an alkyl group having 1 to 30 carbon atoms that may have a substituent, or one or more methylene groups in the alkyl group are substituted to be selected from the group (I Compound A1-3: In the formula (A1), n is 1, R 1 is a hydrogen atom, and R 2 is an unsaturated group with 2 to 30 carbon atoms that may have a substituent Compound A1-4 in which one or more methylene groups in the hydrocarbon group with a double bond or the hydrocarbon group with an unsaturated double bond is substituted with a divalent group selected from the above group (I): Formula ( A1) The compound in which n is 1 and R 1 and R 2 are each independently the above group (a) Compound A1-5: In formula (A1), n is 2, and R 1 is a divalent compound with 1 to 30 carbon atoms A hydrocarbyl group, a divalent heterocyclic group containing 2 to 30 carbon atoms, or one or more methylene groups in the hydrocarbyl group or the heterocyclic group-containing group is substituted with a divalent group selected from the above group (I) And R 2 is a hydrogen atom, a monovalent hydrocarbon group having 1 to 30 carbon atoms, or a monovalent heterocyclic group containing 2 to 30 carbon atoms, or one or more of the hydrocarbon group or the heterocyclic group containing A compound in which a methylene group is substituted with a divalent group selected from the group (I). 如請求項2之聚合性組合物,其中上述第1聚合性化合物之含量於上述聚合性組合物之固形物成分100質量份中為10質量份以上, 上述丙烯醯胺化合物之含量於上述第1聚合性化合物100質量份中為40質量份以上。The polymerizable composition of claim 2, wherein the content of the first polymerizable compound in 100 parts by mass of the solid content of the polymerizable composition is 10 parts by mass or more, The content of the acrylamide compound is 40 parts by mass or more in 100 parts by mass of the first polymerizable compound. 如請求項1之聚合性組合物,其進而包含除第1聚合性化合物以外之具有乙烯性不飽和基之第2聚合性化合物, 第1聚合性化合物之含量於第1聚合性化合物及第2聚合性化合物之合計100質量份中為20質量份以上。The polymerizable composition of claim 1, which further comprises a second polymerizable compound having an ethylenically unsaturated group in addition to the first polymerizable compound, The content of the first polymerizable compound is 20 parts by mass or more in the total of 100 parts by mass of the first polymerizable compound and the second polymerizable compound. 如請求項1至6中任一項之聚合性組合物,其中上述構件包含陽離子硬化性組合物之硬化物, 上述陽離子硬化性組合物含有酸產生劑及陽離子硬化性成分。The polymerizable composition according to any one of claims 1 to 6, wherein the above-mentioned member comprises a cured product of a cationic curable composition, The above-mentioned cation curable composition contains an acid generator and a cation curable component. 一種被覆構造體之製造方法,其具有利用被覆材被覆含有酸成分之構件之步驟, 上述被覆材包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元。A method for manufacturing a covering structure, which has a step of covering a member containing an acid component with a covering material, The coating material includes a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group. 如請求項8之被覆構造體的製造方法,其中形成上述被覆材之步驟具有: 將包含第1聚合性化合物之聚合性組合物塗佈於上述構件之步驟;及 使上述聚合性組合物中之第1聚合性化合物聚合之步驟。The method for manufacturing a covering structure of claim 8, wherein the step of forming the covering material includes: The step of applying a polymerizable composition containing the first polymerizable compound to the above-mentioned member; and The step of polymerizing the first polymerizable compound in the polymerizable composition. 一種被覆構造體,其具有含有酸成分之構件、及被覆該構件之被覆材, 上述被覆材包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元。A covering structure having a member containing an acid component and a covering material covering the member, The coating material includes a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group. 一種被覆材,其包含如下聚合體:該聚合體具有源自具有醯胺基及乙烯性不飽和基之第1聚合性化合物之結構單元,上述被覆材用以被覆含有酸成分之構件。A coating material comprising a polymer having a structural unit derived from a first polymerizable compound having an amide group and an ethylenically unsaturated group, the coating material being used for coating a member containing an acid component.
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