TW202112488A - Combined apparatus capable of simultaneously performing laser machining and CNC cutting capable of saving operation time, labor, machine cost, and installation space - Google Patents
Combined apparatus capable of simultaneously performing laser machining and CNC cutting capable of saving operation time, labor, machine cost, and installation space Download PDFInfo
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本發明係有關於用於雷射加工與CNC切割的整合機構,尤其是一種可同時進行雷射加工及CNC切割的組合裝置。 The present invention relates to an integrated mechanism for laser processing and CNC cutting, in particular to a combined device that can perform laser processing and CNC cutting at the same time.
雷射加工是應用雷射光束經過透鏡的處理達到高度聚焦後,在加工物件上應用雷射光束達到打標、除料、切割或調銑的目的。一般將工件置於一滑台上。再應用馬達系統控制該滑台的移動及轉動,將該滑台移動到適合雷射加工的位置以進行雷射加工作業。 Laser processing is to apply the laser beam to the processed object to achieve the purpose of marking, cutting, cutting or milling after the laser beam is processed by the lens to achieve a high degree of focus. Generally, the workpiece is placed on a sliding table. The motor system is then used to control the movement and rotation of the sliding table, and the sliding table is moved to a position suitable for laser processing to perform laser processing operations.
由於雷射加工的深度較淺,所以要挖出較深的溝槽或切割時必須另外使用CNC切割機進行切割,傳統上這兩種機台是分別存在的,使用者將一工件在一機台上製作完成時,在將該工件挪移到另一機台。此一方式相當耗費人工,且實際上雷射加工機台及機械控制部份會與CNC相關的部份皆相同,因此導致成本的增加。另外也必須配置足夠大的空間以同時容納兩機體,因此增加了廠房空間。 Because the depth of laser processing is relatively shallow, a CNC cutting machine must be used to cut deeper grooves or cutting. Traditionally, these two types of machines exist separately, and the user puts a workpiece in one machine. When the production on the stage is completed, the workpiece is moved to another machine. This method is quite labor intensive. In fact, the laser processing machine and the mechanical control part are the same as those related to the CNC, which leads to an increase in cost. In addition, a large enough space must be configured to accommodate the two bodies at the same time, thus increasing the workshop space.
由於上述之不便利性,基於發明人在此兩領域長久的經驗,故本案發明人希望提出一種嶄新的整合裝置,將雷射加工機頭及CNC切割機頭整合在同一機體中,以解決上述習知技術的問題。 Due to the above-mentioned inconvenience and based on the inventor’s long-term experience in these two fields, the inventor of this case hopes to propose a new integrated device that integrates the laser processing head and the CNC cutting head in the same body to solve the above problem. The problem of learning technology.
所以本發明的目的係為解決上述習知技術上的問題,本發明中提出一種可同時進行雷射加工及CNC切割的組合裝置,係將CNC切割機頭及雷射加工機頭整合在同一機體中,而且經由電腦事先規畫CNC加工及雷射加工的路徑並做適當的分配,所以當一工件需要同時進行CNC加工或雷射加工時,即可以在一機台中一次完成,不需要更換機台。再者本案的雷射加工加入振鏡及鏡頭的功能,可以在三維方向刻劃更細緻的圖形,而且振鏡移動的速度遠大於雷射加工機頭在軌道上移動的速度,所以節省操作時間。操作上比習知技術方便很多,而且也節省相當的人力。再者將CNC切割機頭及雷射加工機頭整台在同一機體中可以節省製作機體的成本,而且也節省安裝的空間。 Therefore, the purpose of the present invention is to solve the above-mentioned conventional technical problems. The present invention proposes a combined device that can perform laser processing and CNC cutting at the same time, which integrates the CNC cutting head and the laser processing head in the same body In addition, the paths of CNC machining and laser machining are planned in advance through the computer and allocated appropriately. Therefore, when a workpiece needs to be CNC machining or laser machining at the same time, it can be completed in one machine at one time without changing the machine. station. Moreover, the laser processing in this case adds the functions of the galvanometer and lens, which can draw more detailed graphics in the three-dimensional direction, and the movement speed of the galvanometer is much faster than the speed of the laser processing head on the track, so it saves operating time . The operation is much more convenient than conventional technology, and it also saves considerable manpower. Furthermore, integrating the CNC cutting head and the laser processing head in the same machine body can save the cost of making the machine body and also save the installation space.
為達到上述目的本案提出一種可同時進行雷射加工及CNC切割的組合裝置,包含一機台,包含一天車模組;該天車模組包含一第一軌道及一固定架;該固定架用於固定所需的元件;其中該固定架安裝在該第一軌道上且可沿著該第一軌道移動;一滑台用於置放一工件;其中該滑台安裝在一第二軌道上且可沿著該第二軌道移動;一第三軌道連接該天車模組或該第二軌道,使得該天車模組上的該固定架或該第二軌道上的該滑台可沿著該第三軌道移動,其中該第一軌道、該第二軌道及該第三軌道互不平行;因此該固定架可以相對於該工件進行三維方向的移動;一雷射加工機頭位在該滑台上方,用以發射雷射光束以進行雷射加工;該雷射加工機頭所發出的雷射光束用以投射到該工件進行雷射加工;其中該雷射加工機頭包含一雷射加工振鏡及一鏡頭,當該雷射加工機頭的位置固定時,所發射的雷射光束經過該雷射加工振鏡的偏折及經由該鏡頭調整聚焦位置,使得該雷射 光束在三維方向移動以投射到該工件上進行雷射加工;一CNC切割機頭位在該滑台上方,該CNC切割機頭包含一切削工具,該切削工具用於對該工件進行切割、鑽銑及調銑作業,使得該工件形成所需要的型態;其中該雷射加工機頭及該CNC切割機頭係安裝在該固定架上,經由該固定架及該滑台的相對移動,而將該雷射加工機頭及該CNC切割機頭移動到所需要的位置以對該工件進行雷射加工及切割作業;一電腦裝置連接該雷射加工機頭及該CNC切割機頭,該電腦裝置用於根據該雷射加工機頭及該CNC切割機頭的位置及雷射加工及切割方向,而決定整個雷射加工及切割空間及該滑台的空間座標;該電腦裝置用於標示出整個雷射加工及切割空間的三維圖形,並接收使用者之輸入之雷射加工及切割圖形;其中根據該雷射加工及切割圖形在三維空間的幾何位置,計算出該雷射加工及切割圖形對應該三維空間的點座標;並且該電腦裝置將三維空間的點座標向外傳送。 In order to achieve the above objective, this case proposes a combined device that can perform laser processing and CNC cutting at the same time. It includes a machine, including a crane module; the crane module includes a first track and a fixed frame; the fixed frame is used The components required for fixing; wherein the fixing frame is installed on the first rail and can move along the first rail; a sliding table is used to place a workpiece; wherein the sliding table is installed on a second rail and Can move along the second track; a third track is connected to the crown block module or the second track, so that the fixed frame on the crown block module or the sliding table on the second track can follow the The third track moves, wherein the first track, the second track, and the third track are not parallel to each other; therefore, the fixing frame can move in a three-dimensional direction relative to the workpiece; a laser processing head is located on the sliding table The upper part is used to emit a laser beam for laser processing; the laser beam emitted by the laser processing head is used to project the workpiece for laser processing; wherein the laser processing head includes a laser processing vibration Lens and a lens. When the position of the laser processing head is fixed, the emitted laser beam passes through the deflection of the laser processing galvanometer and adjusts the focus position through the lens, so that the laser The beam moves in a three-dimensional direction to be projected on the workpiece for laser processing; a CNC cutting head is located above the sliding table, and the CNC cutting head includes a cutting tool, which is used to cut and drill the workpiece. Milling and milling operations make the workpiece form the required shape; wherein the laser processing head and the CNC cutting head are installed on the fixed frame, and through the relative movement of the fixed frame and the sliding table, and Move the laser processing head and the CNC cutting head to the required position to perform laser processing and cutting operations on the workpiece; a computer device connects the laser processing head and the CNC cutting head, the computer The device is used to determine the entire laser processing and cutting space and the space coordinates of the sliding table according to the position of the laser processing head and the CNC cutting head and the laser processing and cutting direction; the computer device is used to mark The three-dimensional graphics of the entire laser processing and cutting space, and receiving the laser processing and cutting graphics input by the user; among them, the laser processing and cutting graphics are calculated according to the geometric position of the laser processing and cutting graphics in the three-dimensional space Corresponding to the point coordinates of the three-dimensional space; and the computer device transmits the point coordinates of the three-dimensional space outward.
由下文的說明可更進一步瞭解本發明的特徵及其優點,閱讀時並請參考附圖。 The features and advantages of the present invention can be further understood from the following description, and please refer to the accompanying drawings when reading.
1‧‧‧機台 1‧‧‧Machine
10‧‧‧雷射加工機頭 10‧‧‧Laser processing head
12‧‧‧雷射加工振鏡 12‧‧‧Laser processing galvanometer
13‧‧‧鏡頭 13‧‧‧Lens
20‧‧‧滑台 20‧‧‧Slide table
30‧‧‧馬達系統 30‧‧‧Motor System
40‧‧‧雷射加工及切割圖形 40‧‧‧Laser processing and cutting graphics
42‧‧‧雷射加工圖形 42‧‧‧Laser processing graphics
44‧‧‧CNC切割圖形 44‧‧‧CNC cutting graphics
50‧‧‧電腦裝置 50‧‧‧Computer device
55‧‧‧校正單元 55‧‧‧Correction unit
60‧‧‧雷射加工控制器 60‧‧‧Laser processing controller
65‧‧‧CNC切割控制器 65‧‧‧CNC Cutting Controller
67‧‧‧攝像機 67‧‧‧Camera
70‧‧‧電腦圖形分割裝置 70‧‧‧Computer graphics segmentation device
100‧‧‧工件 100‧‧‧Workpiece
200‧‧‧CNC切割機頭 200‧‧‧CNC cutting head
210‧‧‧切削工具 210‧‧‧Cutting Tools
300‧‧‧天車模組 300‧‧‧Crane Block Module
310‧‧‧第一軌道 310‧‧‧First Track
320‧‧‧第二軌道 320‧‧‧Second Track
330‧‧‧固定架 330‧‧‧Fixed frame
340‧‧‧第三軌道 340‧‧‧Third track
421‧‧‧雷射加工機頭移動路徑圖 421‧‧‧Laser processing head movement path diagram
422‧‧‧振鏡掃描區域圖 422‧‧‧ Galvanometer scanning area map
500‧‧‧電路板 500‧‧‧Circuit board
510‧‧‧溝槽 510‧‧‧Groove
511‧‧‧溝槽 511‧‧‧Groove
530‧‧‧線路 530‧‧‧line
531‧‧‧線路
532‧‧‧天線線路 532‧‧‧antenna line
533‧‧‧天線線路 533‧‧‧antenna line
圖1顯示本案之系統元件架構方塊圖。 Figure 1 shows a block diagram of the system component architecture of this case.
圖2顯示本案之天車模組、雷射加工機頭、CNC切割機頭、攝像機及滑台的組合示意圖。 Figure 2 shows the combined schematic diagram of the crane module, laser processing head, CNC cutting head, camera and sliding table in this case.
圖3顯示本案之雷射加工及切割圖形的分割方式示意圖。 Figure 3 shows a schematic diagram of the laser processing and cutting pattern division method in this case.
圖4顯示本案之工件為一電路板之示意圖。 Figure 4 shows a schematic diagram of a circuit board as the workpiece in this case.
圖5顯示本案對於圖4之電路板之溝槽配置所形成之CNC切割圖形。 FIG. 5 shows the CNC cutting pattern formed by the groove configuration of the circuit board of FIG. 4 in this case.
圖6顯示本案對於圖4之電路板之數條線路及天線線路配置所形成之雷 射加工機頭移動路徑圖。 Figure 6 shows the thunder formed by this case for the circuit board of Figure 4 and the arrangement of antenna lines. Diagram of the movement path of the injection processing head.
圖7之示意圖顯示圖6之雷射加工機頭移動路徑圖係為一軸線,其繞過圖4之電路板之數條線路及天線線路的中心。 The schematic diagram of FIG. 7 shows that the moving path diagram of the laser processing head of FIG. 6 is an axis, which goes around the center of several lines and antenna lines of the circuit board of FIG. 4.
圖8顯示本案對於圖4之電路板之線路及天線線路配置所形成之振鏡掃描區域圖。 FIG. 8 shows the scanning area diagram of the galvanometer formed by the circuit board and antenna circuit configuration of the circuit board in FIG. 4 in this case.
茲謹就本案的結構組成,及所能產生的功效與優點,配合圖式,舉本案之一較佳實施例詳細說明如下。 With regard to the structural composition of this case, and the effects and advantages that can be produced, in conjunction with the drawings, a detailed description of a preferred embodiment of this case is given as follows.
請參考圖1至圖8所示,顯示本發明之可同時進行雷射加工及CNC切割的組合裝置,包含下列元件:一機台1,包含一天車模組300。該天車模組300包含一第一軌道310及一固定架330。該固定架330用於固定所需的元件。
Please refer to FIG. 1 to FIG. 8, which show the combined device of the present invention capable of laser processing and CNC cutting at the same time, including the following components: a
如圖2所示,其中該固定架330安裝在該第一軌道310上且可沿著該第一軌道310移動。
As shown in FIG. 2, the fixing
一滑台20用於置放一工件100。其中該滑台20安裝在一第二軌道320上且可沿著該第二軌道320移動。其中該第一軌道310及該第二軌道320互不平行。因此該固定架330可以相對於該工件100進行二維的移動。
A sliding table 20 is used to place a
本案尚可包含一第三軌道340其連接該天車模組300或該第二軌道320,使得該天車模組300上的該固定架330或該第二軌道320上的該滑台20可沿著該第三軌道340移動,其中該第一軌道310、該第二軌道320及該第三軌道340互不平行。因此該固定架330可以相對於該工件100進行三維方向的移動。
This case may also include a
一雷射加工機頭10位在該滑台20上方,可以發射雷射光束以進行雷射加
工(雷雕、雷切、鑽銑)之用。該雷射加工機頭10所發出的雷射光束可以投射到該工件100進行雷射加工,而在該工件100呈現經雷射光束加工的圖文。其中該雷射加工機頭10包含一雷射加工振鏡12及一鏡頭13,當該雷射加工機頭10的位置固定時,所發射的雷射光束經過該雷射加工振鏡12的偏折及經由該鏡頭13調整聚焦位置,使得雷射光束在三維方向移動以投射到該工件100上進行雷射加工。
A
一CNC切割機頭200位在該滑台20上方,該CNC切割機頭200包含一切削工具210,該切削工具210用於對該工件100進行切割、鑽銑及調銑作業,使得該工件100形成所需要的型態。一般應用該CNC切割機頭200的該切削工具210可以切割出比雷射加工更深的刻痕。
A
其中該雷射加工機頭10及該CNC切割機頭200係安裝在該固定架330上,經由該固定架330及該滑台20的相對移動,而將該雷射加工機頭10及該CNC切割機頭200移動到所需要的位置以對該工件100進行雷射加工及切割作業。
The
所以在雷射加工及切割時為了將雷射光束投射到所需要的雷射加工點以及將該CNC切割機頭200對所需要的切割點進行切割,該雷射加工機頭10之該雷射加工振鏡12及該鏡頭13、及該CNC切割機頭200必須相對該工件100進行三維方向的移動。因此必須先依據雷射加工及切割的圖案先規劃該雷射加工振鏡12與該鏡頭13、及該CNC切割機頭200的移動軌跡。
Therefore, in order to project the laser beam to the required laser processing point and cut the
一馬達系統30連接該天車模組300及該滑台20,該馬達系統30主要用於控制該天車模組300及該滑台20的移動,以將該雷射加工機頭10及該CNC切割機頭200移動到適合雷射加工及切割的位置。
A motor system 30 is connected to the
一電腦裝置50連接該雷射加工機頭10及該CNC切割機頭200及該馬達系統30,該電腦裝置50用於根據該雷射加工機頭10及該CNC切割機頭200的位置及雷射加工及切割方向,而決定整個雷射加工及切割空間及該滑台20的空間座標。
A computer device 50 is connected to the
該電腦裝置50可標示出整個雷射加工及切割空間的二維圖形,並接收使用者之輸入之雷射加工及切割圖形40。其中根據該雷射加工及切割圖形40在三維空間的幾何位置,計算出該雷射加工及切割圖形40對應該三維空間的點座標。並且該電腦裝置50將三維空間的點座標向外傳送。 The computer device 50 can mark the two-dimensional graphics of the entire laser processing and cutting space, and receive the laser processing and cutting graphics 40 input by the user. According to the geometric position of the laser processing and cutting graphic 40 in the three-dimensional space, the point coordinates of the laser processing and cutting graphic 40 corresponding to the three-dimensional space are calculated. And the computer device 50 transmits the point coordinates of the three-dimensional space outward.
一雷射加工控制器60連接該雷射加工機頭10,係用於控制該雷射加工機頭10,以在該工件100上進行所需要的雷射加工作業。
A laser processing controller 60 is connected to the
一CNC切割控制器65連接該CNC切割機頭200,係用於控制該CNC切割機頭200,以在該工件100上進行所需要的切割及調銑作業。
A CNC cutting controller 65 is connected to the
其中該雷射加工控制器60及該CNC切割控制器65可配置在不同的裝置上,圖1中顯示該雷射加工控制器60及該CNC切割控制器65可位在該電腦裝置50中。 The laser processing controller 60 and the CNC cutting controller 65 can be configured on different devices. As shown in FIG. 1, the laser processing controller 60 and the CNC cutting controller 65 can be located in the computer device 50.
一攝像機67架設在該天車模組300上。該攝像機67用於對該工件100進行攝像並將所攝得的影像傳送到該電腦裝置50,以作為校正該雷射加工機頭10及該CNC切割機頭200的位置之用。
A
一電腦圖形分割裝置70位在該電腦裝置50中且連接該雷射加工控制器60及該CNC切割控制器65,該電腦圖形分割裝置70用於將該雷射加工及切割圖形40分割成一雷射加工圖形42及一CNC切割圖形44,如圖3所示。該雷射加工圖形42係為該雷射加工機頭10所需進行的雷射加工作業,該CNC切割圖
形44係為該CNC切割機頭200所需進行的切割、鑽銑及調銑作業。其中該雷射加工圖形42尚被分割成一雷射加工機頭移動路徑圖421及一振鏡掃描區域圖422。該雷射加工機頭移動路徑圖421係為該雷射加工機頭10在該雷射加工圖形42上的移動路徑,該振鏡掃描區域圖422係為該雷射加工振鏡12及該鏡頭13在該移動路徑上的特定位置周圍的選定區域,該雷射加工振鏡12及該鏡頭13係在該選定區域內移動以對該工件100的對應區域進行雷射加工作業。
A computer graphics dividing device 70 is located in the computer device 50 and connected to the laser processing controller 60 and the CNC cutting controller 65. The computer graphics dividing device 70 is used to divide the laser processing and cutting graphics 40 into a mine The shot processing pattern 42 and a
其中該工件100可為未經加工之板材,或是經前置加工之電路板、電子元件(如濾波器)、天線裝置或承載板(如陶瓷基板或半導體載板等)。因此本案可用於對該工件100進行加工或再加工的作業。
The
圖4中顯示一實際的應用例,其中該工件100為一電路板500,其中該電路板500上方覆蓋金屬膜,一般在電路板的製作中必須在板上進行切割、打孔、製作溝槽、並進行雷射加工形成調銑線以製作電路元件或電子元件(該電子元件如天線或高頻元件)。因此必須同時應用CNC切割機頭200及該雷射加工機頭10對該電路板500進行作業,該CNC切割機頭200係在該電路板500上進行切割及溝槽形成的作業,該雷射加工機頭10係用於形成該電路板500的線路。本案中必須在該電路板500上切割出溝槽510、511、數條線路530、531及天線線路532、533,所以在進行線路分配時,係以該溝槽510、511的幾何配置形成該CNC切割圖形44(如圖5所示),而該雷射加工機頭移動路徑圖421為一軸線其繞過該數條線路530、531及天線線路532、533的中心(如圖6及圖7所示),而該振鏡掃描區域圖422即為必須應用雷射加工形成的該數條線路530、531及天線線路532、533(如圖8所示)。
An actual application example is shown in FIG. 4, where the
其中該電腦裝置50尚包含一校正單元55連接該攝像機67,用於校正該雷
射加工機頭10及該CNC切割機頭200的位置。在校正時該校正單元55係控制該雷射加工機頭10及該CNC切割機頭200在該滑台20上各自雷射加工及切割出一校正區域,並由該攝像機67對此兩校正區域進行攝像,而由該校正單元55根據該攝像機67所攝得的影像計算此兩校正區域的差異關係,該差異關係包含X座標差值、Y座標差值、旋轉角度差值或非線性轉換關係,以作為校正之用。比如當該機台1為CNC切割機台時,則進行雷射加工時必須對於該第一軌道310、該第二軌道320及該第三軌道340依據上列計算的差異關係進行補償。反之當該機台1為雷射加工機台時,則進行CNC切割時必須對於該第一軌道310、該第二軌道320及該第三軌道340依據上列計算的差異關係進行補償。
The computer device 50 further includes a correction unit 55 connected to the
本案的優點在於將CNC切割機頭及雷射加工機頭整合在同一機體中,而且經由電腦事先規畫CNC加工及雷射加工的路徑並做適當的分配,所以當一工件需要同時進行CNC加工或雷射加工時,即可以在一機台中一次完成,不需要更換機台。再者本案的雷射加工加入振鏡及鏡頭的功能,可以在三維方向刻劃更細緻的圖形,而且振鏡移動的速度遠大於雷射加工機頭在軌道上移動的速度,所以節省操作時間。操作上比習知技術方便很多,而且也節省相當的人力。再者將CNC切割機頭及雷射加工機頭整合在同一機體中可以節省製作機體的成本,而且也節省安裝的空間。 The advantage of this case is that the CNC cutting head and the laser processing head are integrated into the same body, and the CNC processing and laser processing paths are planned in advance through the computer and allocated appropriately, so when a workpiece needs to be CNC processed at the same time Or laser processing, it can be done in one machine at one time, without the need to replace the machine. Moreover, the laser processing in this case adds the functions of the galvanometer and lens, which can draw more detailed graphics in the three-dimensional direction, and the movement speed of the galvanometer is much faster than the speed of the laser processing head on the track, so it saves operating time . The operation is much more convenient than conventional technology, and it also saves considerable manpower. Furthermore, integrating the CNC cutting head and the laser processing head in the same body can save the cost of manufacturing the body, and also save the installation space.
綜上所述,本案人性化及自動化之體貼設計,相當符合實際需求。其具體改進現有缺失,相較於習知技術明顯具有突破性之進步優點,確實具有功效之增進,且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上,已符合專利法規定。 In summary, the considerate design of humanization and automation in this case is quite in line with actual needs. Compared with the conventional technology, the specific improvement of the existing defects is obviously a breakthrough and the advantage is indeed an improvement in efficacy, and it is not easy to achieve. This case has not been disclosed or disclosed in domestic and foreign documents and markets, and it has complied with the provisions of the Patent Law.
上列詳細說明係針對本發明之一可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a possible embodiment of the present invention, but this embodiment is not intended to limit the scope of the patent of the present invention. Any equivalent implementation or modification that does not deviate from the technical spirit of the present invention should be included in In the scope of the patent in this case.
1‧‧‧機台 1‧‧‧Machine
10‧‧‧雷射加工機頭 10‧‧‧Laser processing head
12‧‧‧雷射加工振鏡 12‧‧‧Laser processing galvanometer
13‧‧‧鏡頭 13‧‧‧Lens
60‧‧‧雷射加工控制器 60‧‧‧Laser processing controller
65‧‧‧CNC切割控制器 65‧‧‧CNC Cutting Controller
67‧‧‧攝像機 67‧‧‧Camera
70‧‧‧電腦圖形分割裝置 70‧‧‧Computer graphics segmentation device
20‧‧‧滑台 20‧‧‧Slide table
30‧‧‧馬達系統 30‧‧‧Motor System
50‧‧‧電腦裝置 50‧‧‧Computer device
55‧‧‧校正單元 55‧‧‧Correction unit
100‧‧‧工件 100‧‧‧Workpiece
200‧‧‧CNC切割機頭 200‧‧‧CNC cutting head
210‧‧‧切削工具 210‧‧‧Cutting Tools
300‧‧‧天車模組 300‧‧‧Crane Block Module
Claims (11)
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TW108134250A TW202112488A (en) | 2019-09-23 | 2019-09-23 | Combined apparatus capable of simultaneously performing laser machining and CNC cutting capable of saving operation time, labor, machine cost, and installation space |
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