TW202110955A - 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 - Google Patents

熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 Download PDF

Info

Publication number
TW202110955A
TW202110955A TW109122370A TW109122370A TW202110955A TW 202110955 A TW202110955 A TW 202110955A TW 109122370 A TW109122370 A TW 109122370A TW 109122370 A TW109122370 A TW 109122370A TW 202110955 A TW202110955 A TW 202110955A
Authority
TW
Taiwan
Prior art keywords
group
thermosetting photosensitive
cured film
photosensitive composition
film
Prior art date
Application number
TW109122370A
Other languages
English (en)
Chinese (zh)
Other versions
TWI857090B (zh
Inventor
榎本雄一郎
青島俊栄
山﨑健太
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW202110955A publication Critical patent/TW202110955A/zh
Application granted granted Critical
Publication of TWI857090B publication Critical patent/TWI857090B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW109122370A 2019-07-05 2020-07-02 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件 TWI857090B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-126114 2019-07-05
JP2019126114 2019-07-05

Publications (2)

Publication Number Publication Date
TW202110955A true TW202110955A (zh) 2021-03-16
TWI857090B TWI857090B (zh) 2024-10-01

Family

ID=

Also Published As

Publication number Publication date
JPWO2021006181A1 (ja) 2021-01-14
WO2021006181A1 (ja) 2021-01-14
JP7261882B2 (ja) 2023-04-20

Similar Documents

Publication Publication Date Title
TWI841777B (zh) 硬化膜的製造方法、積層體的製造方法及電子元件的製造方法
JP7492003B2 (ja) 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TWI835240B (zh) 硬化物之製造方法、積層體之製造方法及半導體元件之製造方法以及處理液
JP7261882B2 (ja) 熱硬化性感光性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
TW202236012A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202130707A (zh) 樹脂組成物、硬化膜、積層體、硬化膜的製造方法及半導體元件
TW202112907A (zh) 硬化性樹脂組成物、硬化膜、積層體、硬化膜的製造方法、半導體器件、樹脂及樹脂的製造方法
TW202131108A (zh) 圖案形成方法、感光性樹脂組成物、積層體的製造方法及電子元件的製造方法
TW202110954A (zh) 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202107204A (zh) 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202346484A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體元件的製造方法以及半導體元件
WO2023157911A1 (ja) 樹脂組成物、硬化物、積層体、硬化物の製造方法、積層体の製造方法、半導体デバイスの製造方法、及び、半導体デバイス
TW202319451A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法、積層體的製造方法、半導體裝置的製造方法及半導體裝置、以及化合物
TW202242002A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法、半導體裝置及樹脂
TW202234158A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件
TW202307084A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置、以及聚醯亞胺前驅物及其製造方法
TW202234156A (zh) 樹脂組成物、硬化物、積層體、硬化物之製造方法及半導體元件以及化合物
TW202248294A (zh) 樹脂組成物、硬化物、積層體、硬化物的製造方法及半導體裝置
TW202210557A (zh) 硬化物的製造方法、積層體的製造方法及電子元件的製造方法
CN114514470A (zh) 图案形成方法、感光性树脂组合物、层叠体的制造方法及半导体器件的制造方法
TW202116874A (zh) 負型硬化性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
KR20220086621A (ko) 패턴 형성 방법, 광경화성 수지 조성물, 적층체의 제조 방법, 및, 전자 디바이스의 제조 방법
TWI857090B (zh) 熱硬化性感光性組成物、硬化膜、積層體、硬化膜的製造方法及半導體器件
TW202305040A (zh) 硬化物的製造方法、積層體的製造方法、半導體裝置的製造方法、樹脂組成物、硬化物、積層體及半導體裝置
TW202311307A (zh) 硬化物之製造方法、積層體之製造方法及半導體元件之製造方法以及處理液及樹脂組成物