TW202110920A - Laminate - Google Patents

Laminate Download PDF

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TW202110920A
TW202110920A TW109117126A TW109117126A TW202110920A TW 202110920 A TW202110920 A TW 202110920A TW 109117126 A TW109117126 A TW 109117126A TW 109117126 A TW109117126 A TW 109117126A TW 202110920 A TW202110920 A TW 202110920A
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mass
block copolymer
laminate
polymer block
adhesive layer
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TW109117126A
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Chinese (zh)
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清水星哉
千田泰史
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日商可樂麗股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F257/00Macromolecular compounds obtained by polymerising monomers on to polymers of aromatic monomers as defined in group C08F12/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10Homopolymers or copolymers of propene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Graft Or Block Polymers (AREA)
  • Laminated Bodies (AREA)

Abstract

This laminate has a base material layer and an adhesive layer, wherein the ratio [i/ii] of the Shore A hardness i of the base material layer with respect to the Shore A hardness ii of the adhesive layer is 1.1 or more, and at least one of the base material layer and the adhesive layer contains a block copolymer or a hydrogenated product thereof. The block copolymer includes a polymeric block (A) and a polymeric block (B), wherein the polymeric block (B) has a structural unit that is derived from a conjugated diene compound and that includes, in a main chain, at least one alicyclic backbone (X) represented by formula (X).

Description

積層體Layered body

本發明係關於包含基材層與黏著層之積層體。The present invention relates to a laminate including a substrate layer and an adhesive layer.

在具有含有來自芳香族乙烯基化合物之結構單元的聚合物嵌段、與含有來自共軛二烯化合物之結構單元的聚合物嵌段之嵌段共聚物及其氫化物之中,已知有具制振性者,且可被利用於制振材料。又,上述嵌段共聚物及其氫化物被認為有除了制振性之外還能具有隔音性、耐熱性、耐衝擊性、及黏接著性等物性者,能使用於各式各樣的用途。 例如,已開示一種苯乙烯系化合物與異戊二烯或丁二烯等共軛二烯化合物之氫化嵌段共聚物,其為了使制振性、柔軟性、耐熱性、拉伸強度及耐衝擊性等機械特性優異,而指定tanδ的峰溫度、乙烯基鍵結量(例如,參照專利文獻1~4)。Among the block copolymers having polymer blocks containing structural units derived from aromatic vinyl compounds, and polymer blocks containing structural units derived from conjugated diene compounds, and their hydrogenated products are known Vibration damping person, and can be used as a vibration damping material. In addition, the above-mentioned block copolymers and their hydrogenated products are considered to have physical properties such as sound insulation, heat resistance, impact resistance, and adhesive properties in addition to vibration damping properties, and can be used in various applications. . For example, a hydrogenated block copolymer of a styrene-based compound and a conjugated diene compound such as isoprene or butadiene has been disclosed for the purpose of improving vibration resistance, flexibility, heat resistance, tensile strength, and impact resistance. It is excellent in mechanical properties such as properties, and the peak temperature of tanδ and the vinyl bond amount are specified (for example, refer to Patent Documents 1 to 4).

另一方面,作為包含基材層及具黏著力的層(黏著層)之積層體,已知例如表面保護薄膜。眾所皆知使用含有苯乙烯系彈性體及黏著賦予樹脂之黏著劑組成物形成表面保護薄膜中之黏著層(例如,參照專利文獻5及6)。 [先前技術文獻] [專利文獻]On the other hand, as a laminate including a substrate layer and an adhesive layer (adhesive layer), for example, a surface protective film is known. It is known to use an adhesive composition containing a styrene-based elastomer and an adhesion-imparting resin to form an adhesive layer in a surface protective film (for example, refer to Patent Documents 5 and 6). [Prior Technical Literature] [Patent Literature]

專利文獻1 日本特開2002-284830號公報 專利文獻2 國際公開第2000/015680號 專利文獻3 日本特開2006-117879號公報 專利文獻4 日本特開2010-053319號公報 專利文獻5 日本特開平5-194923號公報 專利文獻6 日本特開2010-126711號公報Patent Document 1   JP 2002-284830 A Patent Document 2 "International Publication No. 2000/015680 Patent Document 3   JP 2006-117879 A Patent Document 4   JP 2010-053319 A Patent Document 5   Japanese Patent Laid-Open No. 5-194923 Patent Document 6   JP 2010-126711 A

[發明所欲解決的課題][The problem to be solved by the invention]

上述嵌段共聚物及其氫化物因除了制振性之外更能具有黏接著性等物性,故正探討一種積層體,其展現制振性且兼備具黏接著性的積層體被要求之物性。 關於上述制振性,雖正進行用於使其更優異的改良,但難以平衡良好地使制振性及黏接著性等各種物性進一步提升。又,作為具黏接著性的積層體被要求之物性,除了黏著力之外,還可列舉殘膠(黏著層的一部分殘留在被接著體的現象)的抑制等。再者,在使用表面保護薄膜等積層體之被接著體中,有電氣製品等的使用中會變熱者,又,被設置在室外的被接著體或在室外使用的被接著體等會因氣溫上升而黏著層的接著保持力降低,而有積層體變得容易剝落之虞。正追求即使係對於此種被接著體及使用環境的溫度變化亦能耐受的黏著力。The above-mentioned block copolymers and their hydrogenated products have physical properties such as adhesiveness in addition to vibration damping properties. Therefore, a laminate is being explored that exhibits vibration damping properties and possesses the physical properties required for laminates with adhesive properties. . Regarding the aforementioned vibration damping properties, although improvements are being made to make them more excellent, it is difficult to further improve various physical properties such as vibration damping properties and adhesive properties in a well-balanced manner. In addition, the physical properties required for an adhesive layered body include the suppression of adhesive residue (a phenomenon in which a part of the adhesive layer remains on the adherend) in addition to the adhesive force. Furthermore, among the bonded bodies that use laminates such as surface protection films, there are those that heat up during use of electrical products, etc., and the bonded bodies that are installed outdoors or the bonded bodies used outdoors may be affected by the As the temperature rises, the adhesion holding power of the adhesive layer decreases, and the laminate may easily peel off. We are pursuing the adhesive force that can withstand the temperature changes of the bonded body and the use environment.

於是,本發明提供一種包含黏著層與基材層之積層體,其可對被接著體賦予制振性,即使在高溫中亦不易剝落且不易產生殘膠。 [用於解決課題的手段]Therefore, the present invention provides a laminated body including an adhesive layer and a base layer, which can impart vibration damping properties to the adherend, and is not easy to peel off even at high temperatures and is not easy to produce glue residue. [Means used to solve the problem]

為了解決上述課題而專心致志地探討的結果,本發明人等思及下述本發明,並發現可解決該課題。 亦即,本發明係如同下述。As a result of intensive research in order to solve the above-mentioned problem, the present inventors considered the following invention and found that the problem can be solved. That is, the present invention is as follows.

一種積層體,其係具有基材層及黏著層之積層體, 前述基材層的蕭耳A硬度i相對於前述黏著層的蕭耳A硬度ii之比[i/ii]為1.1以上, 前述基材層及前述黏著層之中至少1層包含下述嵌段共聚物或其氫化物。 前述嵌段共聚物含有聚合物嵌段(A)及聚合物嵌段(B),前述聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以下述式(X)所示之1種以上的脂環式骨架(X)之結構單元。A laminated body, which is a laminated body having a substrate layer and an adhesive layer, The ratio [i/ii] of the Shore A hardness i of the substrate layer to the Shore A hardness ii of the adhesive layer is 1.1 or more, At least one of the base material layer and the adhesive layer contains the following block copolymer or its hydrogenated product. The aforementioned block copolymer contains a polymer block (A) and a polymer block (B). The aforementioned polymer block (B) is a structural unit derived from a conjugated diene compound and has the following formula in the main chain: (X) One or more structural units of alicyclic skeleton (X) shown in (X).

Figure 02_image001
(上述式(X)中,R1 ~R3 各自獨立地表示氫原子或碳數1~11的烴基,複數個R1 ~R3 各自可相同或不同。) [發明效果]
Figure 02_image001
(In the above formula (X), R 1 to R 3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 11 carbon atoms, and a plurality of R 1 to R 3 may be the same or different.) [Effects of the invention]

根據本發明,提供一種包含黏著層與基材層之積層體,其可對被接著體賦予制振性,即使在高溫中亦不易剝落且不易產生殘膠。According to the present invention, there is provided a laminated body including an adhesive layer and a base layer, which can impart vibration damping properties to an adherend, and is not easy to peel off even at a high temperature, and is not easy to generate glue residue.

[用於實施發明的形態][Forms used to implement the invention]

本發明的積層體,其係具有基材層及黏著層之積層體, 其特徵在於,基材層的蕭耳A硬度i相對於黏著層的蕭耳A硬度ii之比[i/ii]為1.1以上, 基材層及黏著層之中至少1層包含下述嵌段共聚物或其氫化物。 前述嵌段共聚物含有聚合物嵌段(A)及聚合物嵌段(B),前述聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以前述式(X)所示之1種以上的脂環式骨架(X)之結構單元。 以下針對積層體所含之基材層及黏著層、以及嵌段共聚物及其氫化物進行說明。The laminate of the present invention is a laminate having a substrate layer and an adhesive layer, It is characterized in that the ratio [i/ii] of the Shore A hardness i of the base layer to the Shore A hardness ii of the adhesive layer is 1.1 or more, At least one of the base layer and the adhesive layer contains the following block copolymer or its hydrogenated product. The aforementioned block copolymer contains a polymer block (A) and a polymer block (B). The aforementioned polymer block (B) is a structural unit derived from a conjugated diene compound, and has a main chain containing the aforementioned formula (X) One or more structural units of alicyclic skeleton (X) shown in (X). Hereinafter, the base material layer and the adhesion layer contained in the laminate, the block copolymer and its hydrogenated product will be described.

《嵌段共聚物及其氫化物》 本發明的實施形態(以下,有時稱為「本實施形態」)中,嵌段共聚物或其氫化物只要被包含在基材層及黏著層之中至少1層中即可。藉由含有嵌段共聚物或其氫化物,能對積層體賦予制振性及黏接著性,但可因應積層體的各種用途而在基材層或黏著層之一方或兩方中含有嵌段共聚物或其氫化物。"Block copolymers and their hydrogenated products" In the embodiment of the present invention (hereinafter, sometimes referred to as "this embodiment"), the block copolymer or its hydrogenated product may be contained in at least one of the base layer and the adhesion layer. By containing the block copolymer or its hydrogenated product, it is possible to impart vibration damping and adhesive properties to the laminate. However, it is possible to include a block in one or both of the base layer or the adhesive layer according to the various uses of the laminate. Copolymer or its hydrogenated product.

[聚合物嵌段(A)] 構成嵌段共聚物的聚合物嵌段(A),由制振性及機械特性之觀點而言,較佳為具有被使用作為單體之來自芳香族乙烯基化合物之結構單元。 聚合物嵌段(A)係較佳為在聚合物嵌段(A)中含有大於70莫耳%的來自芳香族乙烯基化合物之結構單元(以下,有時簡稱為「芳香族乙烯基化合物單元」),由機械特性之觀點而言,更佳為80莫耳%以上,再佳為90莫耳%以上,又更佳為95莫耳%以上,特佳為實質上為100莫耳%。[Polymer block (A)] From the viewpoint of vibration damping properties and mechanical properties, the polymer block (A) constituting the block copolymer preferably has a structural unit derived from an aromatic vinyl compound used as a monomer. The polymer block (A) preferably contains more than 70 mol% of the structural unit derived from the aromatic vinyl compound in the polymer block (A) (hereinafter, sometimes referred to as "aromatic vinyl compound unit"). ") From the viewpoint of mechanical properties, it is more preferably 80 mol% or more, still more preferably 90 mol% or more, still more preferably 95 mol% or more, and particularly preferably substantially 100 mol%.

作為上述芳香族乙烯基化合物,可列舉:苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、α-甲基苯乙烯、β-甲基苯乙烯、2,6-二甲基苯乙烯、2,4-二甲基苯乙烯、α-甲基-鄰甲基苯乙烯、α-甲基-間甲基苯乙烯、α-甲基-對甲基苯乙烯、β-甲基-鄰甲基苯乙烯、β-甲基-間甲基苯乙烯、β-甲基-對甲基苯乙烯、2,4,6-三甲基苯乙烯、α-甲基-2,6-二甲基苯乙烯、α-甲基-2,4-二甲基苯乙烯、β-甲基-2,6-二甲基苯乙烯、β-甲基-2,4-二甲基苯乙烯、鄰氯苯乙烯、間氯苯乙烯、對氯苯乙烯、2,6-二氯苯乙烯、2,4-二氯苯乙烯、α-氯-鄰氯苯乙烯、α-氯-間氯苯乙烯、α-氯-對氯苯乙烯、β-氯-鄰氯苯乙烯、β-氯-間氯苯乙烯、β-氯-對氯苯乙烯、2,4,6-三氯苯乙烯、α-氯-2,6-二氯苯乙烯、α-氯-2,4-二氯苯乙烯、β-氯-2,6-二氯苯乙烯、β-氯-2,4-二氯苯乙烯、鄰三級丁基苯乙烯、間三級丁基苯乙烯、對三級丁基苯乙烯、鄰甲氧基苯乙烯、間甲氧基苯乙烯、對甲氧基苯乙烯、鄰氯甲基苯乙烯、間氯甲基苯乙烯、對氯甲基苯乙烯、鄰溴甲基苯乙烯、間溴甲基苯乙烯、對溴甲基苯乙烯、被矽基取代的苯乙烯衍生物、茚、乙烯基萘、N-乙烯基咔唑等。此等芳香族乙烯基化合物可單獨使用一種,亦可使用二種以上。其中,由製造成本與物性平衡之觀點而言,較佳為苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、及此等的混合物,更佳為苯乙烯。Examples of the above-mentioned aromatic vinyl compounds include: styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, β-methylstyrene, 2,6- Dimethylstyrene, 2,4-Dimethylstyrene, α-methyl-o-methylstyrene, α-methyl-m-methylstyrene, α-methyl-p-methylstyrene, β -Methyl-o-methylstyrene, β-methyl-m-methylstyrene, β-methyl-p-methylstyrene, 2,4,6-trimethylstyrene, α-methyl-2 ,6-Dimethylstyrene, α-methyl-2,4-dimethylstyrene, β-methyl-2,6-dimethylstyrene, β-methyl-2,4-dimethylstyrene Methyl styrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, 2,6-dichlorostyrene, 2,4-dichlorostyrene, α-chloro-o-chlorostyrene, α-chloro- M-chlorostyrene, α-chloro-p-chlorostyrene, β-chloro-o-chlorostyrene, β-chloro-m-chlorostyrene, β-chloro-p-chlorostyrene, 2,4,6-trichlorobenzene Ethylene, α-chloro-2,6-dichlorostyrene, α-chloro-2,4-dichlorostyrene, β-chloro-2,6-dichlorostyrene, β-chloro-2,4-di Chlorostyrene, o-tertiary butyl styrene, m-tertiary butyl styrene, p-tertiary butyl styrene, o-methoxy styrene, m-methoxy styrene, p-methoxy styrene, o Chloromethylstyrene, m-chloromethylstyrene, p-chloromethylstyrene, o-bromomethylstyrene, m-bromomethylstyrene, p-bromomethylstyrene, styrene derivatives substituted by silyl groups , Indene, vinyl naphthalene, N-vinyl carbazole, etc. One kind of these aromatic vinyl compounds may be used alone, or two or more kinds may be used. Among them, from the viewpoint of the balance of production cost and physical properties, styrene, α-methylstyrene, p-methylstyrene, and mixtures thereof are preferred, and styrene is more preferred.

只要不妨礙本發明之目的及效果,則聚合物嵌段(A)亦可含有來自芳香族乙烯基化合物以外的其他不飽和單體之結構單元(以下,有時簡稱為「其他不飽和單體單元」),但在聚合物嵌段(A)中較佳為30莫耳%以下,更佳為小於20莫耳%,再佳為小於15莫耳%,又更佳為小於10莫耳%,又再佳為小於5莫耳%,特佳為0莫耳%。 作為該其他不飽和單體,可列舉例如選自包含丁二烯、異戊二烯、2,3-二甲基丁二烯、1,3-戊二烯、1,3-己二烯、異丁烯、甲基丙烯酸甲酯、甲基乙烯基醚、β-蒎烯、8,9-對

Figure 109117126-A0304-12-01
烯、二戊烯、亞甲基降莰烯、2-亞甲基四氫呋喃等之群組中的至少1種。聚合物嵌段(A)含有該其他不飽和單體單元之情形的結合形態無特別限制,可為隨機、錐狀之任一者。As long as the purpose and effects of the present invention are not hindered, the polymer block (A) may also contain structural units derived from other unsaturated monomers other than aromatic vinyl compounds (hereinafter, sometimes referred to as "other unsaturated monomers"Unit"), but in the polymer block (A), it is preferably 30 mol% or less, more preferably less than 20 mol%, still more preferably less than 15 mol%, and more preferably less than 10 mol% , And more preferably less than 5 mol%, particularly preferably 0 mol%. Examples of the other unsaturated monomers include those selected from butadiene, isoprene, 2,3-dimethylbutadiene, 1,3-pentadiene, 1,3-hexadiene, Isobutylene, methyl methacrylate, methyl vinyl ether, β-pinene, 8,9-pair
Figure 109117126-A0304-12-01
At least one of the group consisting of ene, dipentene, methylene norbornene, 2-methylenetetrahydrofuran, and the like. When the polymer block (A) contains the other unsaturated monomer unit, the bonding form is not particularly limited, and it may be random or tapered.

嵌段共聚物只要具有至少1個前述聚合物嵌段(A)即可。在嵌段共聚物具有2個以上的聚合物嵌段(A)之情形中,該等聚合物嵌段(A)可相同亦可不同。此外,在本說明書中,所謂「聚合物嵌段不同」,意指構成聚合物嵌段的單體單元、重量平均分子量、立體異構性、及在具有複數個單體單元之情形中的各單體單元的比例及共聚合的形態(隨機、梯度、嵌段)之中至少1個不同。The block copolymer only needs to have at least one of the aforementioned polymer block (A). In the case where the block copolymer has two or more polymer blocks (A), the polymer blocks (A) may be the same or different. In addition, in this specification, the term "different polymer blocks" means the monomer units constituting the polymer blocks, the weight average molecular weight, the stereoisomerism, and each of the monomer units in the case of having plural monomer units. At least one of the ratio of monomer units and the form of copolymerization (random, gradient, block) is different.

(重量平均分子量) 聚合物嵌段(A)的重量平均分子量(Mw)並無特別限制,但嵌段共聚物具有的聚合物嵌段(A)之中,至少1個聚合物嵌段(A)的重量平均分子量較佳為3,000~60,000,更佳為4,000~50,000。藉由嵌段共聚物具有至少1個上述範圍內的重量平均分子量之聚合物嵌段(A),機械強度更為提升,成形加工性亦優異。 此外,重量平均分子量係藉由凝膠滲透層析法(GPC)測定所求取之標準聚苯乙烯換算的重量平均分子量。(Weight average molecular weight) The weight average molecular weight (Mw) of the polymer block (A) is not particularly limited, but the weight average molecular weight of at least one polymer block (A) among the polymer blocks (A) possessed by the block copolymer It is preferably 3,000 to 60,000, more preferably 4,000 to 50,000. Since the block copolymer has at least one polymer block (A) having a weight average molecular weight within the above range, the mechanical strength is further improved, and the molding processability is also excellent. In addition, the weight average molecular weight is a weight average molecular weight in terms of standard polystyrene obtained by gel permeation chromatography (GPC) measurement.

(聚合物嵌段(A)的含量) 嵌段共聚物中之聚合物嵌段(A)的含量,較佳為50質量%以下,更佳為30質量%以下,再佳為16質量%以下,特佳為14質量%以下。若為50質量%以下,則具有適當的柔軟性,可成為tanδ峰頂強度不降低且制振性優異的嵌段共聚物或其氫化物。又,下限值較佳為1質量%以上,更佳為3質量%以上,再佳為6質量%以上。若為1質量%以上,則可成為在積層體的各種用途中具有較佳機械特性及成形加工性的嵌段共聚物或其氫化物。 此外,嵌段共聚物中之聚合物嵌段(A)的含量係藉由1 H-NMR測定所求取的值,更詳細而言,係根據實施例所記載之方法而測定的值。(Content of polymer block (A)) The content of polymer block (A) in the block copolymer is preferably 50% by mass or less, more preferably 30% by mass or less, and still more preferably 16% by mass or less , Particularly preferably 14% by mass or less. If it is 50% by mass or less, it has appropriate flexibility, and can be a block copolymer or its hydrogenated product having excellent vibration damping properties without reducing the tanδ peak top strength. In addition, the lower limit is preferably 1% by mass or more, more preferably 3% by mass or more, and still more preferably 6% by mass or more. If it is 1% by mass or more, it can be a block copolymer or its hydrogenated product having better mechanical properties and moldability in various applications of the laminate. In addition, the content of the polymer block (A) in the block copolymer is a value obtained by 1 H-NMR measurement, and more specifically, a value measured according to the method described in the examples.

[聚合物嵌段(B)] 構成嵌段共聚物之聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以下述式(X)所示之1種以上的脂環式骨架(X)之結構單元(以下,有時簡稱為「含有脂環式骨架的單元」)。又,聚合物嵌段(B)亦能含有:不含脂環式骨架(X)的來自共軛二烯化合物之結構單元(以下,有時簡稱為「共軛二烯單元」)。 聚合物嵌段(B)中之含有脂環式骨架的單元與共軛二烯單元之合計,由展現出優異的制振性之觀點而言,較佳為50莫耳%以上,更佳為70莫耳%以上,再佳為90莫耳%以上,特佳為實質上為100莫耳%。 在嵌段共聚物中具有2個以上的聚合物嵌段(B)之情形中,該等聚合物嵌段(B)可相同亦可不同。[Polymer block (B)] The polymer block (B) constituting the block copolymer is a structural unit derived from a conjugated diene compound, and has an alicyclic skeleton (X) containing one or more types represented by the following formula (X) in the main chain The structural unit (hereinafter, sometimes abbreviated as "alicyclic skeleton-containing unit"). In addition, the polymer block (B) may also contain a structural unit derived from a conjugated diene compound (hereinafter, sometimes simply referred to as "conjugated diene unit") that does not contain an alicyclic skeleton (X). The total of the alicyclic skeleton-containing unit and the conjugated diene unit in the polymer block (B) is preferably 50 mol% or more from the viewpoint of exhibiting excellent vibration damping properties, and more preferably 70 mol% or more, more preferably 90 mol% or more, and particularly preferably substantially 100 mol%. When there are two or more polymer blocks (B) in the block copolymer, the polymer blocks (B) may be the same or different.

Figure 02_image001
Figure 02_image001

上述式(X)中,R1 ~R3 各自獨立地表示氫原子或碳數1~11的烴基,複數個R1 ~R3 各自可相同或不同。上述烴基的碳數,較佳為碳數1~5,更佳為1~3,再佳為1(亦即,甲基)。又,上述烴基可為直鏈或分支鏈,且可為飽和或不飽和烴基。由物性及脂環式骨架(X)形成之觀點而言,R1 ~R3 特佳為各自獨立地為氫原子或甲基。 此外,在已氫化嵌段共聚物之情形,上述式(X)中之乙烯基能被氫化。因此,在氫化物中之脂環式骨架(X)的意義中,亦包含上述式(X)中之乙烯基被氫化的骨架。In the above formula (X), R 1 to R 3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 11 carbon atoms, and a plurality of R 1 to R 3 may be the same or different. The carbon number of the above-mentioned hydrocarbon group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 (that is, methyl). In addition, the above-mentioned hydrocarbon group may be a straight chain or a branched chain, and may be a saturated or unsaturated hydrocarbon group. From the viewpoint of physical properties and formation of the alicyclic skeleton (X), R 1 to R 3 are particularly preferably each independently a hydrogen atom or a methyl group. In addition, in the case of a hydrogenated block copolymer, the vinyl group in the above formula (X) can be hydrogenated. Therefore, in the meaning of the alicyclic skeleton (X) in the hydride, the skeleton in which the vinyl group in the above formula (X) is hydrogenated is also included.

聚合物嵌段(B)係來自共軛二烯化合物之結構單元,脂環式骨架(X)係來自該共軛二烯化合物。脂環式骨架(X)係藉由後述方法並利用共軛二烯化合物的陰離子聚合而生成,但因應所使用之共軛二烯化合物,於含有脂環式骨架的單元之主鏈包含至少1種的脂環式骨架(X)。藉由該脂環式骨架(X)被組入聚合物嵌段(B)所含之結構單元的主鏈,因分子運動變小而玻璃轉移溫度上升,在室溫附近的tanδ的峰頂強度提升,可展現出優異的制振性。The polymer block (B) is a structural unit derived from a conjugated diene compound, and the alicyclic skeleton (X) is derived from the conjugated diene compound. The alicyclic skeleton (X) is produced by the method described later using anionic polymerization of a conjugated diene compound, but depending on the conjugated diene compound used, the main chain of the unit containing the alicyclic skeleton contains at least 1 Kind of alicyclic skeleton (X). With the alicyclic skeleton (X) incorporated into the main chain of the structural unit contained in the polymer block (B), the glass transition temperature rises due to the decrease of molecular motion, and the peak top strength of tanδ near room temperature Improved, can show excellent vibration damping performance.

作為上述共軛二烯化合物,可列舉:丁二烯、異戊二烯、己二烯、2,3-二甲基-1,3-丁二烯、2-苯基-1,3-丁二烯、1,3-戊二烯、2-甲基-1,3-戊二烯、1,3-己二烯、1,3-辛二烯、1,3-環己二烯、2-甲基-1,3-辛二烯、1,3,7-辛三烯、菌綠烯、月桂油烯及氯丁二烯等。其中,較佳為丁二烯、異戊二烯、或併用丁二烯與異戊二烯。Examples of the above-mentioned conjugated diene compound include butadiene, isoprene, hexadiene, 2,3-dimethyl-1,3-butadiene, 2-phenyl-1,3-butadiene Diene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 1,3-hexadiene, 1,3-octadiene, 1,3-cyclohexadiene, 2 -Methyl-1,3-octadiene, 1,3,7-octatriene, bacteriochlorene, myrcene and chloroprene, etc. Among them, butadiene, isoprene, or a combination of butadiene and isoprene is preferred.

在併用丁二烯與異戊二烯之情形,其等的摻合比例[異戊二烯/丁二烯](質量比)並無特別限制,但較佳為5/95~95/5,更佳為10/90~90/10,再佳為40/60~70/30,特佳為45/55~65/35。此外,若以莫耳比表示該混合比例[異戊二烯/丁二烯],則較佳為5/95~95/5,更佳為10/90~90/10,再佳為40/60~70/30,特佳為45/55~55/45。In the case where butadiene and isoprene are used in combination, the blending ratio [isoprene/butadiene] (mass ratio) is not particularly limited, but it is preferably 5/95 to 95/5, It is more preferably 10/90 to 90/10, still more preferably 40/60 to 70/30, particularly preferably 45/55 to 65/35. In addition, if the mixing ratio [isoprene/butadiene] is expressed in molar ratio, it is preferably 5/95 to 95/5, more preferably 10/90 to 90/10, and still more preferably 40/ 60~70/30, particularly preferably 45/55~55/45.

作為具體例,針對在使用丁二烯、異戊二烯、或丁二烯與異戊二烯兩方作為共軛二烯化合物之情形中主要生成的脂環式骨架(X)進行說明。 單獨使用丁二烯作為共軛二烯化合物之情形,生成具有下述(i)的取代基的組合之脂環式骨架(X)。亦即,此情形,脂環式骨架(X)僅成為R1 ~R3 同時為氫原子之脂環式骨架。因此,作為嵌段共聚物或其氫化物的較佳態樣之一例,可列舉聚合物嵌段(B)具有以下結構單元者:於主鏈包含R1 ~R3 同時為氫原子之一種脂環式骨架(X)。As a specific example, the alicyclic skeleton (X) that is mainly produced when butadiene, isoprene, or both butadiene and isoprene is used as the conjugated diene compound will be described. When butadiene is used alone as the conjugated diene compound, an alicyclic skeleton (X) having a combination of the following substituents (i) is produced. That is, in this case, the alicyclic skeleton (X) becomes only the alicyclic skeleton in which R 1 to R 3 are hydrogen atoms at the same time. Therefore, as an example of a preferred aspect of the block copolymer or its hydrogenated product, the polymer block (B) has the following structural unit: a resin containing R 1 to R 3 in the main chain and at the same time being a hydrogen atom Cyclic skeleton (X).

又,單獨使用異戊二烯作為共軛二烯化合物之情形,主要生成具有下述(v)及(vi)的取代基的組合之2種的脂環式骨架(X)。 又,併用丁二烯與異戊二烯作為共軛二烯化合物之情形,主要生成具有下述(i)~(vi)的取代基的組合之6種的脂環式骨架(X)。 (i)   :R1 =氫原子、R2 =氫原子、R3 =氫原子 (ii)  :R1 =氫原子、R2 =甲基、R3 =氫原子 (iii) :R1 =氫原子、R2 =氫原子、R3 =甲基 (iv)  :R1 =甲基、R2 =氫原子、R3 =氫原子 (v)   :R1 =甲基、R2 =甲基、R3 =氫原子 (vi)  :R1 =甲基、R2 =氫原子、R3 =甲基In addition, when isoprene is used alone as the conjugated diene compound, an alicyclic skeleton (X) having two combinations of the following substituents (v) and (vi) is mainly produced. In addition, when butadiene and isoprene are used in combination as a conjugated diene compound, an alicyclic skeleton (X) having six combinations of the following substituents (i) to (vi) is mainly produced. (i): R 1 = hydrogen atom, R 2 = hydrogen atom, R 3 = hydrogen atom (ii): R 1 = hydrogen atom, R 2 = methyl, R 3 = hydrogen atom (iii): R 1 = hydrogen Atom, R 2 = hydrogen atom, R 3 = methyl (iv): R 1 = methyl, R 2 = hydrogen atom, R 3 = hydrogen atom (v): R 1 = methyl, R 2 = methyl, R 3 = hydrogen atom (vi): R 1 = methyl, R 2 = hydrogen atom, R 3 = methyl

在上述式(X)中,由藉由具有為烴基之取代基而分子運動變得更小且制振性進一步提升之觀點而言,聚合物嵌段(B)中之至少1種的脂環式骨架(X)較佳為脂環式骨架(X’),其係上述R1 ~R3 之中至少1個為碳數1~11的烴基。其中,由可效率佳地從共軛二烯化合物生成脂環式骨架、制振性及機械特性的平衡之觀點而言,更佳為該脂環式骨架(X’)中之烴基為甲基。 尤其,更佳為R1 ~R3 各自獨立地表示氫原子或甲基且R1 ~R3 不同時為氫原子之脂環式骨架。亦即,聚合物嵌段(B)更佳為具有以下構成單元:於主鏈包含在具有上述(ii)~(vi)的取代基的組合之脂環式骨架中之任一種以上。In the above formula (X), from the viewpoint that the molecular motion becomes smaller and the vibration damping property is further improved by having a substituent that is a hydrocarbon group, at least one alicyclic ring in the polymer block (B) The formula skeleton (X) is preferably an alicyclic skeleton (X'), and at least one of the above-mentioned R 1 to R 3 is a hydrocarbon group having 1 to 11 carbon atoms. Among them, it is more preferable that the hydrocarbon group in the alicyclic skeleton (X') is a methyl group from the viewpoint of efficiently generating an alicyclic skeleton from a conjugated diene compound, vibration damping properties, and mechanical properties. . In particular, it is more preferable that R 1 to R 3 each independently represent a hydrogen atom or a methyl group, and R 1 to R 3 are not at the same time an alicyclic skeleton of a hydrogen atom. That is, the polymer block (B) more preferably has the following structural unit: any one or more of the alicyclic skeletons having the combination of the above-mentioned substituents (ii) to (vi) are contained in the main chain.

(聚合物嵌段(B)的乙烯基鍵結量) 在構成聚合物嵌段(B)之構成單元為異戊二烯單元、丁二烯單元、異戊二烯及丁二烯的混合物單元之任一者之情形中,作為形成前述脂環式骨架(X)之鍵結形態以外的異戊二烯及丁二烯各自的鍵結形態,在丁二烯之情形中可設為1,2-鍵結、1,4-鍵結,在異戊二烯之情形中可設為1,2-鍵結、3,4-鍵結、1,4-鍵結。(Vinyl bonding amount of polymer block (B)) When the structural unit constituting the polymer block (B) is any one of isoprene units, butadiene units, isoprene and butadiene mixture units, the aforementioned alicyclic skeleton is formed The bonding morphology of isoprene and butadiene other than the bonding morphology of (X) can be 1,2-bonding or 1,4-bonding in the case of butadiene. In the case of diene, it can be 1,2-bonded, 3,4-bonded, or 1,4-bonded.

在嵌段共聚物及其氫化物中,聚合物嵌段(B)中的3,4-鍵結單元及1,2-鍵結單元的含量(以下,有時僅稱為「乙烯基鍵結量」)的合計較佳為55~95莫耳%,更佳為63~95莫耳%,再佳為70~95莫耳%。只要為上述範圍,則可展現出優異的制振性。 於此,乙烯基鍵結量係根據實施例所記載之方法並藉由1 H-NMR測定所算出之值。 此外,在聚合物嵌段(B)僅由丁二烯構成之情形中,前述所謂的「3,4-鍵結單元及1,2-鍵結單元的含量」係替換為「1,2-鍵結單元的含量」以應用。In the block copolymer and its hydrogenated substances, the content of 3,4-bonded units and 1,2-bonded units in the polymer block (B) (hereinafter, sometimes only referred to as "vinyl-bonded The total amount") is preferably 55 to 95 mol%, more preferably 63 to 95 mol%, and still more preferably 70 to 95 mol%. As long as it is in the above range, excellent vibration damping properties can be exhibited. Here, the vinyl bond amount is a value calculated by 1 H-NMR measurement according to the method described in the examples. In addition, when the polymer block (B) is composed only of butadiene, the aforementioned "content of 3,4-bonding unit and 1,2-bonding unit" is replaced with "1,2- The content of bonding unit" is applied.

(脂環式骨架(X)含量) 在聚合物嵌段(B)中,只要包含於主鏈包含脂環式骨架(X)之結構單元即可,但由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,在聚合物嵌段(B)中較佳為含有1莫耳%以上的脂環式骨架(X),更佳為1.1莫耳%以上,再佳為1.4莫耳%以上,又更佳為1.8莫耳%以上,又再佳為4莫耳%以上,又再佳為10莫耳%以上,特佳為13莫耳%以上。又,聚合物嵌段(B)中的脂環式骨架(X)的含量的上限只要為不損及本發明效果的範圍內則無特別限制,但由生產性之觀點而言,較佳為40莫耳%以下,亦可為30莫耳%以下,亦可為20莫耳%以下,亦可為18莫耳%以下。 由使制振性進一步提升之觀點而言,在聚合物嵌段(B)中更佳為含有1莫耳%以上的上述脂環式骨架(X’),再佳為1.3莫耳%以上,又更佳為1.6莫耳%以上。脂環式骨架(X’)的含量的上限值係與上述脂環式骨架(X)的含量的上限值相同。(Alicyclic skeleton (X) content) In the polymer block (B), as long as the structural unit containing the alicyclic skeleton (X) is contained in the main chain, it is easy to suppress the viscosity even at high temperatures due to the effect of exhibiting more excellent vibration damping properties. From the viewpoint of the reduction of the subsequent force, the polymer block (B) preferably contains 1 mol% or more of the alicyclic skeleton (X), more preferably 1.1 mol% or more, and still more preferably 1.4 mol%. Ear% or more, more preferably 1.8 mol% or more, still more preferably 4 mol% or more, still more preferably 10 mol% or more, and particularly preferably 13 mol% or more. In addition, the upper limit of the content of the alicyclic skeleton (X) in the polymer block (B) is not particularly limited as long as it is within a range that does not impair the effects of the present invention, but from the viewpoint of productivity, it is preferably 40 mol% or less, 30 mol% or less, 20 mol% or less, or 18 mol% or less. From the viewpoint of further improving the vibration damping properties, the polymer block (B) preferably contains 1 mol% or more of the above-mentioned alicyclic skeleton (X'), and still more preferably 1.3 mol% or more. More preferably, it is 1.6 mol% or more. The upper limit of the content of the alicyclic skeleton (X') is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

更具體而言,作為共軛二烯化合物,使用異戊二烯之情形、使用丁二烯之情形、或併用丁二烯與異戊二烯之情形,在各情形中之脂環式骨架含量係如同下述。 在使用異戊二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,具有前述(v)、(vi)的取代基的組合之脂環式骨架(X’)存在1種以上時,其等的合計含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為1莫耳%以上,更佳為1.5莫耳%以上,由在寬廣溫度範圍中獲得優異的制振性的效果之觀點而言,再佳為2莫耳%以上,又更佳為3莫耳%以上,特佳為4莫耳%以上。又,使用異戊二烯之情形的上述合計含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。More specifically, as the conjugated diene compound, when isoprene is used, when butadiene is used, or when butadiene and isoprene are used in combination, the content of alicyclic skeleton in each case The line is as follows. In the case of using isoprene as the conjugated diene compound, in the polymer block (B), an alicyclic skeleton (X') having a combination of the aforementioned substituents (v) and (vi) exists When one or more types are used, the total content of them is preferably 1 mol% or more from the viewpoint of exhibiting a more excellent vibration damping effect and easily suppressing the decrease in adhesive force even at high temperatures. It is preferably 1.5 mol% or more, and from the viewpoint of obtaining excellent vibration damping effects in a wide temperature range, it is still more preferably 2 mol% or more, still more preferably 3 mol% or more, and particularly preferably 4 More than mol%. In addition, the upper limit of the total content in the case of using isoprene is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

在使用丁二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,脂環式骨架(X)存在時,其含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為5莫耳%以上,更佳為10莫耳%以上,再佳為15莫耳%以上,又再佳為20莫耳%以上,又更佳為25莫耳%以上,特佳為30莫耳%以上。又,使用丁二烯之情形的上述含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。In the case of using butadiene as the conjugated diene compound, when the alicyclic skeleton (X) is present in the polymer block (B), its content is determined by the effect of exhibiting more excellent vibration damping properties, From the viewpoint of easily suppressing the decrease in adhesive force even at high temperatures, it is preferably 5 mol% or more, more preferably 10 mol% or more, still more preferably 15 mol% or more, and still more preferably 20 mol% Ear% or more, more preferably 25 mol% or more, particularly preferably 30 mol% or more. In addition, the upper limit of the content in the case of using butadiene is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

在併用丁二烯與異戊二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,具有前述(ii)、(iii)、(v)、(vi)的取代基的組合之脂環式骨架(X’)存在一種以上時,其等的合計含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為1莫耳%以上,更佳為2莫耳%以上,再佳為5莫耳%以上,又更佳為8莫耳%以上,又再佳為13莫耳%以上。併用丁二烯與異戊二烯之情形的上述合計含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。 又,在併用丁二烯與異戊二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,具有前述(i)~(vi)的取代基的組合之脂環式骨架(X)存在一種以上時,其等的合計含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為1莫耳%以上,更佳為5莫耳%以上。併用丁二烯與異戊二烯之情形的上述合計含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。In the case where butadiene and isoprene are used in combination as the conjugated diene compound, the polymer block (B) has the aforementioned substituents (ii), (iii), (v), and (vi) When there is more than one kind of alicyclic skeleton (X') in the combination of, the total content of the same is from the viewpoint of exhibiting a more excellent vibration damping effect and easily suppressing the decrease in adhesive force even at high temperatures , Preferably 1 mol% or more, more preferably 2 mol% or more, still more preferably 5 mol% or more, still more preferably 8 mol% or more, and still more preferably 13 mol% or more. The upper limit of the total content in the case of using butadiene and isoprene in combination is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X). In addition, in the case where butadiene and isoprene are used in combination as the conjugated diene compound, in the polymer block (B), an alicyclic formula having a combination of the aforementioned substituents (i) to (vi) When there is more than one type of skeleton (X), the total content of them is preferably 1 mol from the viewpoint of exhibiting a more excellent vibration damping effect and easily suppressing the decrease in adhesive force even at high temperatures % Or more, more preferably 5 mol% or more. The upper limit of the total content in the case of using butadiene and isoprene in combination is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

此外,嵌段共聚物或其氫化物所含之上述脂環式骨架(X)(包含(X’))含量係藉由嵌段共聚物的13 C-NMR測定而由來自聚合物嵌段(B)中的脂環式骨架(X)的積分值所求取之值,更詳細而言,係根據實施例所記載之方法所測定之值。In addition, the content of the alicyclic skeleton (X) (including (X')) contained in the block copolymer or its hydrogenated product is determined by the 13 C-NMR measurement of the block copolymer and derived from the polymer block ( The value obtained by the integral value of the alicyclic skeleton (X) in B) is, in more detail, the value measured according to the method described in the examples.

又,嵌段共聚物或其氫化物在聚合物嵌段(B)的氫化率為0莫耳%以上且小於50莫耳%之情形,可確定已與脂環式骨架(X)鍵結的乙烯基與已與主鏈鍵結的乙烯基之含有莫耳比。 例如,在具有前述(ii)、(iii)、(v)、(vi)的取代基的組合之脂環式骨架(X’)中,已與該脂環式骨架(X’)鍵結的乙烯基末端的碳原子(下述化學式的(a))在13 C-NMR中之化學位移係出現在107~110ppm附近,已與主鏈鍵結的乙烯基末端的碳原子(下述化學式的(b))在13 C-NMR中之化學位移係出現在110~116ppm附近。而且,氫化率為0~40莫耳%之情形,由13 C-NMR所測定之峰面積比[化學位移值107~110ppm的峰面積]/[化學位移值110~116ppm的峰面積]通常成為0.01~3.00的範圍,由可展現出更優異的制振性之觀點而言,該面積比較佳係成為0.01~1.50,更佳係成為0.01~1.00,再佳係成為0.01~0.50,又再佳係成為0.01~0.20。In addition, when the hydrogenation rate of the block copolymer or its hydrogenated product in the polymer block (B) is 0 mol% or more and less than 50 mol%, it can be confirmed that the alicyclic skeleton (X) has been bonded The molar ratio between the vinyl group and the vinyl group bonded to the main chain. For example, in an alicyclic skeleton (X') having a combination of substituents (ii), (iii), (v), and (vi), the alicyclic skeleton (X') has been bonded The chemical shift system of the vinyl terminal carbon atom ((a) of the following chemical formula) in 13 C-NMR appears in the vicinity of 107~110 ppm, and the vinyl terminal carbon atom that has been bonded to the main chain (the following chemical formula (b)) The chemical shift in 13 C-NMR is around 110-116 ppm. Moreover, when the hydrogenation rate is 0-40 mol%, the peak area ratio measured by 13 C-NMR [peak area with chemical shift value of 107-110 ppm]/[peak area with chemical shift value of 110-116 ppm] usually becomes In the range of 0.01 to 3.00, from the viewpoint of exhibiting more excellent vibration damping properties, the area is preferably 0.01 to 1.50, more preferably 0.01 to 1.00, and even more preferable is 0.01 to 0.50, and still more preferable The system becomes 0.01 to 0.20.

Figure 02_image005
Figure 02_image005

又,針對氫化物,在13 C-NMR測定中幾乎未觀測到來自脂環式骨架(X)上的碳原子的峰,但能觀測到來自與分支狀烷基鍵結的該脂環式骨架(X)上的碳原子的峰,該分支狀烷基來自具有取代基R3 的乙烯基,該R3 為碳數1~11的烴基。 藉此,關於氫化物,聚合物嵌段(B)的氫化率為50~99莫耳%之情形,亦能確定上述與來自具有R3 的乙烯基之分支狀烷基鍵結的脂環式骨架(X)上的碳原子、及與來自乙烯基的分支狀烷基鍵結的主鏈上的碳原子之含有莫耳比。In addition, for the hydride, almost no peak derived from the carbon atom on the alicyclic skeleton (X) was observed in the 13 C-NMR measurement, but the peak derived from the alicyclic skeleton bonded to the branched alkyl group was observed. The peak of the carbon atom on (X), the branched alkyl group is derived from a vinyl group having a substituent R 3 , and the R 3 is a hydrocarbon group having 1 to 11 carbon atoms. From this, regarding the hydrogenated product, even when the hydrogenation rate of the polymer block (B) is 50 to 99 mol%, the above-mentioned alicyclic type bonded to the branched alkyl group derived from the vinyl group having R 3 can also be determined The molar ratio of the carbon atoms on the skeleton (X) and the carbon atoms on the main chain bonded to the branched alkyl group derived from the vinyl group.

例如,在具有前述(iii)、(vi)的取代基的組合之脂環式骨架(X)中,與異戊二烯基鍵結之脂環式骨架(X)上的碳原子(下述化學式的(c))在13 C-NMR中之化學位移係出現在50.0~52.0ppm附近,與異戊二烯基鍵結之主鏈上的碳原子(下述化學式的(d))在13 C-NMR中之化學位移係出現在43.0~45.0ppm附近。而且,氫化率為40~99莫耳%之情形,由13 C-NMR所測定之峰面積比[化學位移值50.0~52.0ppm的峰面積]/[化學位移值43.0~45.0ppm的峰面積]通常成為0.01~3.00的範圍,由可展現出更優異的制振性之觀點而言,該面積比較佳係成為0.01~1.50的範圍,更佳係成為0.01~1.00的範圍,再佳係成為0.01~0.50的範圍,又再佳係成為0.01~0.25。 此外,上述峰面積比,更詳細而言,可根據實施例所記載之方法而測定。For example, in the alicyclic skeleton (X) having a combination of the substituents (iii) and (vi), the carbon atoms on the alicyclic skeleton (X) bonded to the isoprenyl group (below The chemical shift of the chemical formula (c)) in 13 C-NMR appears in the vicinity of 50.0~52.0ppm, and the carbon atom on the main chain bonded to the isoprenyl group ((d) in the following chemical formula) is at 13 The chemical shift system in C-NMR appears in the vicinity of 43.0-45.0ppm. In addition, when the hydrogenation rate is 40 to 99 mol%, the peak area ratio measured by 13 C-NMR [peak area with a chemical shift value of 50.0-52.0 ppm]/[peak area with a chemical shift value of 43.0-45.0 ppm] It is usually in the range of 0.01 to 3.00. From the viewpoint of exhibiting more excellent vibration damping properties, the area is preferably in the range of 0.01 to 1.50, more preferably in the range of 0.01 to 1.00, and still more preferably in the range of 0.01 The range of -0.50 is more preferably 0.01-0.25. In addition, the above-mentioned peak area ratio can be measured in more detail according to the method described in Examples.

Figure 02_image007
Figure 02_image007

(重量平均分子量) 嵌段共聚物具有的聚合物嵌段(B)的合計的重量平均分子量,由制振性及成為積層體之際的成形加工性等之觀點而言,在氫化前的狀態下,較佳為15,000~800,000,更佳為50,000~700,000,再佳為70,000~600,000,特佳為90,000~500,000,最佳為130,000~450,000。(Weight average molecular weight) The total weight average molecular weight of the polymer block (B) of the block copolymer is preferably in the state before hydrogenation from the viewpoints of vibration damping properties and molding processability when forming a laminate. 15,000 to 800,000, more preferably 50,000 to 700,000, still more preferably 70,000 to 600,000, particularly preferably 90,000 to 500,000, most preferably 130,000 to 450,000.

(其他結構單元) 聚合物嵌段(B)只要不妨礙本發明之目的及效果,則亦可含有來自前述共軛二烯化合物以外的其他聚合性的單體之結構單元。此情形,在聚合物嵌段(B)中,來自共軛二烯化合物以外的其他聚合性的單體之結構單元的含量,較佳為小於50莫耳%,更佳為小於30莫耳%,再佳為小於20莫耳%,又更佳為小於10莫耳%,特佳為0莫耳%。 作為該其他聚合性的單體,可較佳列舉例如選自包含苯乙烯、α-甲基苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、對三級丁基苯乙烯、2,4-二甲基苯乙烯、N-乙烯基咔唑、乙烯基萘及乙烯基蒽等芳香族乙烯基化合物、以及甲基丙烯酸甲酯、甲基乙烯基醚、β-蒎烯、8,9-對

Figure 109117126-A0304-12-01
烯、二戊烯、亞甲基降莰烯、2-亞甲基四氫呋喃、1,3-環戊二烯、1,3-環己二烯、1,3-環庚二烯、1,3-環辛二烯等之群組的至少1種化合物。 嵌段共聚物只要具有至少1個前述聚合物嵌段(B)即可。在嵌段共聚物具有2個以上的聚合物嵌段(B)之情形中,該等聚合物嵌段(B)可相同亦可不同。(Other structural units) The polymer block (B) may contain structural units derived from other polymerizable monomers other than the aforementioned conjugated diene compound as long as it does not interfere with the purpose and effects of the present invention. In this case, in the polymer block (B), the content of structural units derived from polymerizable monomers other than the conjugated diene compound is preferably less than 50 mol%, more preferably less than 30 mol% , More preferably less than 20 mol%, more preferably less than 10 mol%, particularly preferably 0 mol%. As the other polymerizable monomers, for example, selected from the group consisting of styrene, α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-tertiary butyl Aromatic vinyl compounds such as styrene, 2,4-dimethylstyrene, N-vinylcarbazole, vinyl naphthalene and vinyl anthracene, as well as methyl methacrylate, methyl vinyl ether, β-pine Ene, 8,9-pair
Figure 109117126-A0304-12-01
Ene, dipentene, methylene norbornene, 2-methylenetetrahydrofuran, 1,3-cyclopentadiene, 1,3-cyclohexadiene, 1,3-cycloheptadiene, 1,3 -At least one compound of the group of cyclooctadiene and the like. The block copolymer only needs to have at least one of the aforementioned polymer block (B). In the case where the block copolymer has two or more polymer blocks (B), the polymer blocks (B) may be the same or different.

[製造方法] (嵌段共聚物) 作為嵌段共聚物的製造方法,例如,將1種以上的共軛二烯化合物作為單體並藉由陰離子聚合法使其聚合,藉此形成具有於主鏈包含前述脂環式骨架(X)之結構單元的聚合物嵌段(B),添加聚合物嵌段(A)的單體,又因應需要進一步逐次添加聚合物嵌段(A)的單體及共軛二烯化合物,藉此可獲得嵌段共聚物。 藉由上述陰離子聚合法使脂環式骨架生成的方法可使用眾所周知的技術(例如,參照美國專利第3966691號說明書)。脂環式骨架係藉由單體的耗盡而被形成在聚合物的末端,藉由對其進一步逐次添加單體,可從該脂環式骨架使聚合再次開始。因此,可依據單體的逐次添加時間、聚合溫度、或者觸媒的種類及添加量、單體與觸媒之組合等,而調整該脂環式骨架的生成的有無及其含量。又,在陰離子聚合法中,可使用陰離子聚合起始劑、溶媒、及因應需要的路易斯鹼。[Production method] (Block copolymer) As a method of producing a block copolymer, for example, one or more conjugated diene compounds are used as monomers and polymerized by an anionic polymerization method, thereby forming an alicyclic skeleton (X) containing the aforementioned alicyclic skeleton in the main chain. In the polymer block (B) of the structural unit, the monomers of the polymer block (A) are added, and the monomers and conjugated diene compounds of the polymer block (A) are further added successively according to the needs, so that the Obtain a block copolymer. The method for generating an alicyclic skeleton by the above-mentioned anionic polymerization method can use a well-known technique (for example, refer to the specification of US Patent No. 3,966,691). The alicyclic skeleton is formed at the end of the polymer by depletion of monomers, and by further adding monomers to it successively, the polymerization can be restarted from the alicyclic skeleton. Therefore, the presence or absence and content of the alicyclic skeleton can be adjusted according to the successive addition time of the monomers, the polymerization temperature, or the type and amount of the catalyst, the combination of the monomer and the catalyst, and the like. In addition, in the anionic polymerization method, an anionic polymerization initiator, a solvent, and a Lewis base as required can be used.

在上述方法中,作為能使用作為陰離子聚合的聚合起始劑之有機鋰化合物,可列舉例如甲基鋰、乙基鋰、正丁基鋰、二級丁基鋰、三級丁基鋰、戊基鋰等。又,作為能使用作為聚合起始劑之二鋰化合物,可列舉例如萘二鋰、二鋰己基苯等。 作為偶合劑,可列舉例如二氯甲烷、二溴甲烷、二氯乙烷、二溴乙烷、二溴苯、苯甲酸苯酯等。 此等聚合起始劑及偶合劑的使用量可依據嵌段共聚物及其氫化物所期望之重量平均分子量而適當決定。一般而言,烷基鋰化合物、二鋰化合物等起始劑,較佳為以聚合所使用之聚合物嵌段(A)的單體及共軛二烯化合物等的單體的合計每100質量份為0.01~0.2質量份的比例使用,在使用偶合劑之情形,較佳為以前述單體的合計每100質量份為0.001~0.8質量份的比例使用。In the above method, the organolithium compound that can be used as a polymerization initiator for anionic polymerization includes, for example, methyl lithium, ethyl lithium, n-butyl lithium, secondary butyl lithium, tertiary butyl lithium, and pentyl lithium. Base lithium and so on. In addition, examples of dilithium compounds that can be used as a polymerization initiator include naphthalene dilithium, dilithium hexylbenzene, and the like. As a coupling agent, dichloromethane, dibromomethane, dichloroethane, dibromoethane, dibromobenzene, phenyl benzoate, etc. are mentioned, for example. The usage amount of these polymerization initiators and coupling agents can be appropriately determined according to the desired weight average molecular weight of the block copolymer and its hydrogenated product. Generally speaking, the initiator such as alkyl lithium compound and dilithium compound is preferably based on the total mass of the monomers such as the polymer block (A) and the conjugated diene compound used in the polymerization per 100 mass The part is used in a ratio of 0.01 to 0.2 parts by mass, and when a coupling agent is used, it is preferably used in a ratio of 0.001 to 0.8 parts by mass per 100 parts by mass of the total of the aforementioned monomers.

作為溶媒,只要不對陰離子聚合反應造成不良影響則無特別限制,可列舉例如:環己烷、甲基環己烷、正己烷、正戊烷等脂肪族烴;苯、甲苯、二甲苯等芳香族烴等。又,聚合反應通常係以0~100℃,較佳為10~70℃的溫度進行0.5~50小時,較佳為1~30小時。The solvent is not particularly limited as long as it does not adversely affect the anionic polymerization reaction. Examples include aliphatic hydrocarbons such as cyclohexane, methylcyclohexane, n-hexane, and n-pentane; aromatics such as benzene, toluene, and xylene. Hydrocarbon etc. In addition, the polymerization reaction is usually carried out at a temperature of 0 to 100°C, preferably 10 to 70°C, for 0.5 to 50 hours, preferably 1 to 30 hours.

又,藉由在共軛二烯化合物的聚合之際添加路易斯鹼作為共觸媒的方法,可提高聚合物嵌段(B)中之上述脂環式骨架(X)的含量、3,4-鍵結及1,2-鍵結的含量。 作為可使用之路易斯鹼,可列舉例如:二甲醚、二乙醚、四氫呋喃、2,2-二(2-四氫呋喃基)丙烷(DTHFP)等醚類;乙二醇二甲醚、二乙二醇二甲醚、三乙二醇二甲醚、四乙二醇二甲醚等二醇醚類;三乙胺、N,N,N’,N’-四亞甲基二胺、N,N,N’,N’-四甲基乙二胺(TMEDA)、N-甲基

Figure 109117126-A0304-12-02
啉等胺類;三級丁酸鈉、三級戊醇鈉或異戊醇鈉等脂肪族醇的鈉或鉀鹽、或者二烷基環己醇鈉、例如如薄荷醇鈉(sodium mentholate)般的脂環式醇的鈉或鉀鹽等金屬鹽等。此等路易斯鹼可使用單獨一種或組合二種以上而使用。In addition, by adding a Lewis base as a co-catalyst during the polymerization of the conjugated diene compound, the content of the alicyclic skeleton (X) in the polymer block (B) can be increased, and the content of 3,4- The content of bonding and 1,2-bonding. Usable Lewis bases include, for example, ethers such as dimethyl ether, diethyl ether, tetrahydrofuran, 2,2-bis(2-tetrahydrofuryl)propane (DTHFP); ethylene glycol dimethyl ether, diethylene glycol Dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether and other glycol ethers; triethylamine, N,N,N',N'-tetramethylene diamine, N,N, N',N'-tetramethylethylenediamine (TMEDA), N-methyl
Figure 109117126-A0304-12-02
Amines such as morpholines; sodium or potassium salts of aliphatic alcohols such as sodium tertiary butyrate, sodium tertiary amylate or sodium isoamylate, or sodium dialkylcyclohexanol, such as sodium mentholate Metal salts such as sodium or potassium salt of the alicyclic alcohol. These Lewis bases can be used alone or in combination of two or more.

路易斯鹼的添加量,係依據將上述脂環式骨架(X)的含量控制在何種程度,以及在前述聚合物嵌段(B)特別包含來自異戊二烯及/或丁二烯之結構單元之情形中是將構成聚合物嵌段(B)之異戊二烯單元及/或丁二烯單元的乙烯基鍵結量控制在何種程度而決定。因此,路易斯鹼的添加量並無嚴格意義上的限制,但在被使用作為聚合起始劑之烷基鋰化合物或二鋰化合物所含有之鋰的每1公克原子中,通常在0.1~1,000莫耳,較佳為在1~100莫耳的範圍內使用。The amount of Lewis base added depends on how much the content of the alicyclic skeleton (X) is controlled, and the polymer block (B) specifically contains a structure derived from isoprene and/or butadiene In the case of the unit, it is determined how much the vinyl bonding amount of the isoprene unit and/or butadiene unit constituting the polymer block (B) is controlled. Therefore, the amount of Lewis base added is not strictly limited, but it is usually 0.1 to 1,000 moles per 1 gram atom of the lithium contained in the alkyl lithium compound or dilithium compound used as the polymerization initiator. The ears are preferably used in the range of 1-100 mol.

共軛二烯化合物的平均進料速度(以下,有時稱為「平均二烯進料速度」),由提高脂環式骨架(X)的含量之觀點而言,每1莫耳的活性末端,較佳為150kg/h以下,更佳為110kg/h以下,再佳為55kg/h以下,亦可為45kg/h以下,亦可為30kg/h以下,亦可為22kg/h以下。由提高生產性之觀點而言,下限值為每1莫耳的活性末端,較佳為1kg/h以上,更佳為3kg/h以上,再佳為5kg/h以上,亦可為7kg/h以上,亦可為10kg/h以上,亦可為15kg/h以上。The average feed rate of the conjugated diene compound (hereinafter, sometimes referred to as the "average diene feed rate"), from the viewpoint of increasing the content of the alicyclic skeleton (X), per 1 mole of active end , Preferably 150kg/h or less, more preferably 110kg/h or less, still more preferably 55kg/h or less, 45kg/h or less, 30kg/h or less, or 22kg/h or less. From the viewpoint of improving productivity, the lower limit is per 1 mole of active end, preferably 1 kg/h or more, more preferably 3 kg/h or more, still more preferably 5 kg/h or more, and may also be 7 kg/ h or more, may be 10kg/h or more, or 15kg/h or more.

在藉由上述方法進行聚合後,添加醇類、羧酸類、水等活性氫化合物而使聚合反應停止,藉此可獲得嵌段共聚物。After polymerization by the above method, active hydrogen compounds such as alcohols, carboxylic acids, and water are added to stop the polymerization reaction, thereby obtaining a block copolymer.

(氫化物) 將藉由上述製造方法所得之嵌段共聚物作為氫化物之情形,在惰性有機溶媒中,在氫化觸媒的存在下進行氫化反應(hydrogenation reaction)。藉由氫化反應,嵌段共聚物中之來自聚合物嵌段(B)中的共軛二烯化合物之碳-碳雙鍵被氫化,可成為嵌段共聚物的氫化物。 氫化反應可將氫壓力設為0.1~20MPa左右,較佳為0.5~15MPa,更佳為0.5~5MPa,將反應溫度設為20~250℃左右,較佳為50~180℃,更佳為70~180℃,且將反應時間設為通常0.1~100小時左右,較佳為1~50小時而實施。 作為氫化觸媒,可列舉例如:雷氏鎳;使Pt、Pd、Ru、Rh、Ni等金屬負載於碳、氧化鋁、矽藻土等單體之非均相觸媒;包含過渡金屬化合物與烷基鋁化合物、烷基鋰化合物等的組合之戚格勒(Ziegler)系觸媒;茂金屬系觸媒等。(Hydride) When the block copolymer obtained by the above-mentioned production method is used as a hydrogenated product, a hydrogenation reaction is carried out in the presence of a hydrogenation catalyst in an inert organic solvent. Through the hydrogenation reaction, the carbon-carbon double bond derived from the conjugated diene compound in the polymer block (B) in the block copolymer is hydrogenated to become a hydrogenated product of the block copolymer. For the hydrogenation reaction, the hydrogen pressure can be set at about 0.1-20 MPa, preferably 0.5-15 MPa, more preferably 0.5-5 MPa, and the reaction temperature may be set at about 20-250°C, preferably 50-180°C, more preferably 70 -180°C, and the reaction time is usually about 0.1 to 100 hours, preferably 1 to 50 hours. Examples of hydrogenation catalysts include Reich's nickel; heterogeneous catalysts in which metals such as Pt, Pd, Ru, Rh, and Ni are supported on monomers such as carbon, alumina, and diatomaceous earth; and include transition metal compounds and Ziegler-based catalysts, metallocene-based catalysts, etc., which are combinations of alkyl aluminum compounds, alkyl lithium compounds, etc.

如此所得之氫化物可在藉由將聚合反應液注入甲醇等而使其凝固後使其加熱或減壓乾燥,或者是在施以將聚合反應液與蒸氣一起注入熱水中使其與溶媒共沸而去除之所謂蒸汽汽提後進行加熱或減壓乾燥,藉此而取得。The hydride obtained in this way can be coagulated by injecting the polymerization reaction liquid into methanol or the like, and then dried under heating or reduced pressure, or it can be mixed with the solvent by pouring the polymerization reaction liquid and steam into hot water. The so-called steam stripping, which is removed by boiling, is obtained by heating or drying under reduced pressure.

可因應在積層體的各種用途中所期望之性能而指定是否使用上述嵌段共聚物或氫化物。同樣地,可因應在積層體的各種用途中所期望之性能而指定將製成氫化物之際的上述聚合物嵌段(B)中的碳-碳雙鍵的氫化率設為何種程度。 例如,能製成氫化物的氫化率愈高則耐熱性、耐候性愈提升之氫化物。上述氫化率,例如可設為50莫耳%以上且99莫耳%以下、60莫耳%以上且99莫耳%以下、70莫耳%以上且99莫耳%以下、80莫耳%以上且99莫耳%以下。It is possible to specify whether to use the above-mentioned block copolymer or hydrogenated product according to the desired performance in various applications of the laminate. Similarly, it is possible to specify how much the hydrogenation rate of the carbon-carbon double bond in the polymer block (B) when it is made into a hydrogenated product in accordance with the performance desired in various applications of the laminate. For example, the higher the hydrogenation rate of the hydride, the higher the heat resistance and weather resistance. The hydrogenation rate can be set to, for example, 50 mol% or more and 99 mol% or less, 60 mol% or more and 99 mol% or less, 70 mol% or more and 99 mol% or less, 80 mol% or more, and Below 99 mol%.

因此,可為聚合物嵌段(B)的氫化率為0莫耳%以上(亦即,亦包含未氫化之情形)且小於50莫耳%之嵌段共聚物或其氫化物,又,亦可為聚合物嵌段(B)的氫化率為50~99莫耳%之氫化物。 此外,上述氫化率係將聚合物嵌段(B)中的來自共軛二烯化合物及脂環式骨架(X)之結構單元中的碳-碳雙鍵的含量藉由氫化後的1 H-NMR測定所求取的值,更詳細而言,係根據實施例所記載之方法所測定的值。Therefore, it can be a block copolymer or its hydrogenated product with a hydrogenation rate of the polymer block (B) of 0 mol% or more (that is, including the case where it is not hydrogenated) and less than 50 mol%, and also It can be a hydrogenated product with a hydrogenation rate of 50-99 mol% of the polymer block (B). In addition, the above-mentioned hydrogenation rate is based on the content of the carbon-carbon double bond in the structural unit derived from the conjugated diene compound and the alicyclic skeleton (X) in the polymer block (B) by 1 H- after hydrogenation. The value obtained by the NMR measurement is, more specifically, the value measured according to the method described in the examples.

(聚合物嵌段(A)與聚合物嵌段(B)的結合樣式) 嵌段共聚物只要聚合物嵌段(A)與聚合物嵌段(B)會結合,則不限定其結合形式,可為直鏈狀、分支狀、放射狀、或此等2個以上組合的結合樣式之任一者。其中,聚合物嵌段(A)與聚合物嵌段(B)的結合形式較佳為直鏈狀,作為其例,在以A表示聚合物嵌段(A)且以B表示聚合物嵌段(B)時,可列舉以A-B所示之二嵌段共聚物、以A-B-A或B-A-B所示之三嵌段共聚物、以A-B-A-B所示之四嵌段共聚物、以A-B-A-B-A或B-A-B-A-B所示之五嵌段共聚物、(A-B)nZ型共聚物(Z表示偶合劑殘基,n表示3以上的整數)等。其中,較佳為直鏈狀的三嵌段共聚物、或二嵌段共聚物,由柔軟性、製造的容易性等之觀點而言,較佳為使用A-B-A型的三嵌段共聚物。 作為A-B-A型的三嵌段共聚物,具體而言,可列舉苯乙烯-丁二烯/異戊二烯-苯乙烯共聚物。其中,基材層及黏著層之中至少1層較佳為至少包含苯乙烯-氫化丁二烯/異戊二烯-苯乙烯共聚物作為嵌段共聚物的氫化物。(Combination style of polymer block (A) and polymer block (B)) The block copolymer is not limited as long as the polymer block (A) and the polymer block (B) can be combined. The combination can be linear, branched, radial, or a combination of two or more of these Combine any of the styles. Among them, the combination of the polymer block (A) and the polymer block (B) is preferably linear. As an example, A represents the polymer block (A) and B represents the polymer block. (B) In the case of (B), the diblock copolymer represented by AB, the triblock copolymer represented by ABA or BAB, the tetrablock copolymer represented by ABAB, the five represented by ABABA or BABAB Block copolymers, (AB) nZ type copolymers (Z represents a coupling agent residue, n represents an integer of 3 or more), and the like. Among them, a linear triblock copolymer or a diblock copolymer is preferred. From the viewpoints of flexibility and ease of production, it is preferred to use an A-B-A type triblock copolymer. As an A-B-A type triblock copolymer, specifically, styrene-butadiene/isoprene-styrene copolymer is mentioned. Among them, at least one of the base layer and the adhesion layer is preferably a hydrogenated product containing at least a styrene-hydrogenated butadiene/isoprene-styrene copolymer as a block copolymer.

於此,在本說明書中,在同種的聚合物嵌段係隔著二官能的偶合劑等而結合成直線狀之情形,結合的聚合物嵌段全體被視作為一個聚合物嵌段。據此,亦包含上述例示,原本嚴格而言應被標記為Y-Z-Y(Z表示偶合殘基)的聚合物嵌段,除了特別需要與單獨的聚合物嵌段Y作區分之情形以外,整體被表示為Y。在本說明書中,因將包含偶合劑殘基之此種聚合物嵌段視為如上所述,故例如包含偶合劑殘基且嚴格而言應被標記為A-B-Z-B-A(Z表示偶合劑殘基)的嵌段共聚物係被標記為A-B-A,且被視作為三嵌段共聚物的一例。Herein, in this specification, when the same type of polymer blocks are combined linearly via a difunctional coupling agent or the like, the entire combined polymer blocks are regarded as one polymer block. Accordingly, including the above-mentioned examples, the polymer block that should be strictly labeled as YZY (Z represents the coupling residue), except for the case where it is necessary to distinguish it from the separate polymer block Y, is represented as a whole. Is Y. In this specification, since such a polymer block containing a coupling agent residue is considered as described above, for example, a polymer block containing a coupling agent residue and strictly speaking should be marked as ABZBA (Z represents a coupling agent residue) The block copolymer system is labeled ABA and is regarded as an example of a triblock copolymer.

(聚合物嵌段(A)及(B)的含量) 在嵌段共聚物中,只要不妨礙本發明之目的及效果,則亦可含有由前述聚合物嵌段(A)及(B)以外之其他單體所構成的聚合物嵌段,但前述聚合物嵌段(A)及前述聚合物嵌段(B)的合計含量較佳為90質量%以上,更佳為95質量%以上,特佳為實質上為100質量%。只要為90質量%以上,則可製成制振性及成形加工性優異,即使在高溫中亦容易抑制黏接著力的降低,且可適合使用於積層體之嵌段共聚物或其氫化物。(Content of polymer blocks (A) and (B)) In the block copolymer, as long as it does not interfere with the purpose and effects of the present invention, it may also contain polymer blocks composed of other monomers other than the aforementioned polymer blocks (A) and (B), but the aforementioned polymerization The total content of the polymer block (A) and the aforementioned polymer block (B) is preferably 90% by mass or more, more preferably 95% by mass or more, and particularly preferably substantially 100% by mass. As long as it is 90% by mass or more, it can be made to have excellent vibration damping properties and molding processability, and it is easy to suppress the decrease in adhesive force even at high temperatures, and it can be suitably used for the block copolymer or its hydrogenated product of the laminate.

(重量平均分子量) 嵌段共聚物及其氫化物之由凝膠滲透層析法所致之以標準聚苯乙烯換算所求取的重量平均分子量(Mw),較佳為15,000~800,000,更佳為50,000~700,000,再佳為60,000~600,000,又更佳為70,000~600,000,特佳為90,000~500,000,最佳為130,000~450,000。只要嵌段共聚物及其氫化物的重量平均分子量為15,000以上,則耐熱性變高,只要為800,000以下,則成形性加工性變得良好。(Weight average molecular weight) The weight average molecular weight (Mw) of the block copolymer and its hydrogenated product obtained by gel permeation chromatography in terms of standard polystyrene is preferably 15,000-800,000, more preferably 50,000-700,000, More preferably, it is 60,000 to 600,000, more preferably 70,000 to 600,000, particularly preferably 90,000 to 500,000, and most preferably 130,000 to 450,000. As long as the weight average molecular weight of the block copolymer and its hydrogenated product is 15,000 or more, the heat resistance becomes high, and as long as it is 800,000 or less, the moldability and processability become good.

[tanδ] (tanδ的峰頂溫度及強度) tanδ(損耗正切)係動態黏彈測定中之頻率1Hz的損耗模數/儲存模數之比,tanδ的峰頂溫度及強度係大大地有助於制振性、及其他物性。於此,所謂tanδ的峰頂強度,係指tanδ的峰成為最大時的tanδ的值。又,所謂tanδ的峰頂溫度,係指tanδ的峰成為最大時的溫度。[tanδ] (Peak top temperature and intensity of tanδ) Tanδ (loss tangent) is the ratio of loss modulus/storage modulus at a frequency of 1 Hz in dynamic viscoelastic measurement. The peak top temperature and strength of tanδ greatly contribute to vibration damping and other physical properties. Here, the peak top intensity of tanδ refers to the value of tanδ when the peak of tanδ becomes the maximum. In addition, the peak top temperature of tanδ refers to the temperature at which the peak of tanδ becomes the maximum.

本說明書中,嵌段共聚物或其氫化物的tanδ的峰頂溫度及強度係藉由將嵌段共聚物或其氫化物以溫度230℃、壓力10MPa加壓3分鐘,製作厚度1.0mm的單層片,將該單層片裁切成圓板形狀,將此作為試驗片而進行測定。測定條件係根據JIS K 7244-10(2005年),為應變量0.1%、頻率1Hz、測定溫度-70~100℃、升溫速度3℃/分鐘。 此外,嵌段共聚物或其氫化物的峰頂溫度及tanδ強度,更詳細而言,係根據實施例所記載之方法而測定之值。In this specification, the peak top temperature and strength of the tanδ of the block copolymer or its hydrogenated product are made by pressing the block copolymer or its hydrogenated product at a temperature of 230°C and a pressure of 10 MPa for 3 minutes to produce a unit with a thickness of 1.0 mm. For the layered piece, the single-layered piece was cut into a disc shape, and this was used as a test piece for measurement. The measurement conditions are based on JIS K 7244-10 (2005), with a strain amount of 0.1%, a frequency of 1 Hz, a measurement temperature of -70 to 100°C, and a heating rate of 3°C/min. In addition, the peak top temperature and tanδ intensity of the block copolymer or its hydrogenated product are, more specifically, values measured according to the method described in the examples.

嵌段共聚物或其氫化物藉由上述測定而能成為tanδ的峰頂強度為1.0以上。在更高者中,為1.5以上,再者亦有成為1.9以上者。tanδ的峰頂強度愈高,表示其溫度下之制振性等物性愈優異,若為1.0以上,則在實際使用環境下可獲得充分的制振性。 又,嵌段共聚物或其氫化物的tanδ的峰頂溫度較佳為-50℃以上,更佳為-40℃以上,再佳為-30℃以上,又更佳為-25℃以上,亦可為0℃以上。又,上述tanδ的峰頂溫度的上限,只要為不損及本發明效果的範圍即可,可為50℃以下,亦可為40℃以下,亦可為35℃以下。作為tanδ的峰頂溫度的範圍,例如,較佳為-50~50℃,更佳為-40~40℃,再佳為-30~30℃,又更佳為-25~25℃。只要上述tanδ的峰頂溫度為-50℃以上,則在實際使用環境下可獲得充分的制振性,若為50℃以下,則在使用於黏著層之際可展現出所期望的接著性。The block copolymer or its hydrogenated product has a peak top intensity of 1.0 or more that can be tan δ by the above measurement. Among the higher ones, it is 1.5 or more, and some of them are 1.9 or more. The higher the peak top strength of tanδ, the better the physical properties such as vibration damping properties at temperature. If it is 1.0 or more, sufficient vibration damping properties can be obtained under actual use environments. In addition, the peak top temperature of the tanδ of the block copolymer or its hydrogenated product is preferably -50°C or higher, more preferably -40°C or higher, still more preferably -30°C or higher, and still more preferably -25°C or higher. It can be above 0°C. In addition, the upper limit of the peak top temperature of tanδ may be a range that does not impair the effects of the present invention, and may be 50°C or lower, 40°C or lower, or 35°C or lower. The range of the peak top temperature of tanδ is, for example, preferably -50 to 50°C, more preferably -40 to 40°C, still more preferably -30 to 30°C, and still more preferably -25 to 25°C. As long as the peak top temperature of tanδ is -50°C or higher, sufficient vibration damping properties can be obtained in an actual use environment, and if it is 50°C or lower, the desired adhesiveness can be exhibited when used in an adhesive layer.

(tanδ成為1.0以上的溫度區域的最大幅度) 又,嵌段共聚物或其氫化物存在由上述測定條件所測定之在-70~100℃中的tanδ成為1.0以上之連續的溫度區域,該溫度區域的最大幅度較佳為12℃以上,更佳為13℃以上,再佳為15℃以上,又更佳為17℃以上。 如同前述,在聚合物嵌段(B)的結構單元中,前述脂環式骨架(X)組入主鏈,藉由能進一步具有高的乙烯基鍵結量而分子運動變小,因此玻璃轉移溫度會上升,相對於溫度變化,玻璃轉移變得緩和。藉此,嵌段共聚物或其氫化物的tanδ顯示為1以上的溫度範圍變寬廣,變得能在寬廣的溫度範圍中顯示制振性。只要tanδ成為1.0以上的溫度區域的最大幅度為12℃以上,甚至為13℃以上,則在實際使用環境下可獲得更優異的制振性。又,該溫度區域的最大幅度並無特別的上限值,但例如由生產性之觀點而言,上限值可為35℃,亦可為30℃,亦可為25℃。(tanδ becomes the maximum width of the temperature range above 1.0) In addition, the block copolymer or its hydrogenated product has a continuous temperature range in which the tanδ at -70 to 100°C measured by the above measurement conditions becomes 1.0 or more. The maximum width of the temperature range is preferably 12°C or more, and more It is preferably 13°C or higher, more preferably 15°C or higher, and still more preferably 17°C or higher. As mentioned above, in the structural unit of the polymer block (B), the aforementioned alicyclic skeleton (X) is incorporated into the main chain, and the molecular motion becomes smaller due to the higher vinyl bonding amount, so the glass transfer The temperature will rise, and the glass transition will be gentler with respect to the temperature change. Thereby, the temperature range in which the tanδ of the block copolymer or its hydrogenated product is 1 or more is widened, and it becomes possible to exhibit vibration damping properties in a wide temperature range. As long as the maximum width of the temperature range where the tan δ becomes 1.0 or more is 12° C. or more, or even 13° C. or more, more excellent vibration damping properties can be obtained in an actual use environment. In addition, there is no particular upper limit for the maximum width of the temperature range, but from the viewpoint of productivity, for example, the upper limit may be 35°C, 30°C, or 25°C.

≪基材層≫ 由適合使被接著體的制振性更提升之觀點而言,基材層可包含上述的嵌段共聚物或其氫化物。 基材層中之嵌段共聚物或其氫化物的含量,較佳為1~100質量%。由容易使被接著體的制振性進一步提升之觀點而言,基材層中之嵌段共聚物或其氫化物的含量,更佳為3質量%以上,再佳為5質量%以上,又更佳為10質量%以上。又,該含量的上限只要為不損及本發明效果的範圍則無特別限制,但由保持積層體的強度且容易與可使用作為後述基材層的材質的其他樹脂良好地相容之觀點而言,更佳為90質量%以下,再佳為80質量%以下,又更佳為70質量%以下,又再佳為60質量%以下,又再佳為50質量%以下,又再佳為40質量%以下,又亦可為30質量%以下,25質量%以下。≪Substrate layer≫ From the viewpoint of being suitable for improving the vibration damping properties of the adherend, the base layer may contain the above-mentioned block copolymer or its hydrogenated product. The content of the block copolymer or its hydrogenated product in the substrate layer is preferably 1 to 100% by mass. From the viewpoint that it is easy to further improve the vibration damping properties of the adherend, the content of the block copolymer or its hydrogenated product in the base layer is more preferably 3% by mass or more, and still more preferably 5% by mass or more, and More preferably, it is 10% by mass or more. In addition, the upper limit of the content is not particularly limited as long as it is within a range that does not impair the effects of the present invention. However, it maintains the strength of the laminate and is easily compatible with other resins that can be used as the material of the base layer described later. In other words, it is more preferably 90% by mass or less, still more preferably 80% by mass or less, still more preferably 70% by mass or less, still more preferably 60% by mass or less, still more preferably 50% by mass or less, and still more preferably 40 The mass% or less may also be 30 mass% or less and 25 mass% or less.

[非脂環式骨架嵌段共聚物及其氫化物] 由作為積層體的性能之觀點而言,基材層含有與上述的嵌段共聚物或其氫化物同樣的聚合物嵌段(A)及聚合物嵌段(B),並且,亦可包含該聚合物嵌段(B)不具有於主鏈包含以上述的式(X)所示的脂環式骨架之結構單元的嵌段共聚物或其氫化物(以下,有時稱為「非脂環式骨架嵌段共聚物或其氫化物」)。 上述非脂環式骨架嵌段共聚物及其氫化物除了聚合物嵌段(B)不具有於主鏈包含以式(X)所示的脂環式骨架之結構單元以外,係與上述的嵌段共聚物或其氫化物相同。[Non-alicyclic skeleton block copolymer and its hydrogenated products] From the standpoint of performance as a laminate, the base layer contains the same polymer block (A) and polymer block (B) as the block copolymer or its hydrogenated product, and may also contain the same The polymer block (B) does not have a block copolymer or its hydrogenated product (hereinafter, sometimes referred to as "non-alicyclic Formula backbone block copolymer or its hydrogenated product"). The above-mentioned non-alicyclic skeleton block copolymers and their hydrogenated products are combined with the above-mentioned block copolymers, except that the polymer block (B) does not have a structural unit containing an alicyclic skeleton represented by formula (X) in the main chain. The segment copolymer or its hydrogenated product is the same.

[其他樹脂] 在基材層中,由作為積層體的性能、經濟性之觀點而言,較佳為將上述的嵌段共聚物或其氫化物以外的其他樹脂(以下,有時稱為「其他樹脂」)使用作為基材層的材質。[Other resins] In the base material layer, from the viewpoint of performance as a laminate and economical efficiency, it is preferable to use a resin other than the above-mentioned block copolymer or its hydrogenated product (hereinafter, sometimes referred to as "other resin") Use the material as the base layer.

(烯烴樹脂) 由作為積層體的性能、經濟性之觀點而言,上述其他樹脂較佳為烯烴樹脂。作為烯烴樹脂,可列舉例如:高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈低密度聚乙烯等聚乙烯;均聚聚丙烯、嵌段聚丙烯、隨機聚丙烯等聚丙烯;α-烯烴的單獨聚合物或共聚物;丙烯及/或乙烯與α-烯烴的共聚物等。作為上述α-烯烴,可列舉例如:1-丁烯、1-戊烯、3-甲基-1-丁烯、1-己烯、3-甲基-1-戊烯、4-甲基-1-戊烯、1-庚烯、1-辛烯、1-壬烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等碳數20以下的α-烯烴,此等可使用一種或二種以上。又,亦可使用藉由順丁烯二酸等使此等烯烴樹脂進行改質之改質烯烴樹脂。 在此等烯烴樹脂之中,由與上述的嵌段共聚物或其氫化物的相容性高、適合獲得透明性優異的積層體之觀點而言,較佳為聚丙烯。 更具體而言,作為本實施形態的較佳態樣之一例,在基材層中,就上述其他樹脂而言,可使用烯烴樹脂、與嵌段共聚物或其氫化物。其中,較佳為使用烯烴樹脂、與嵌段共聚物的氫化物。因烯烴樹脂與上述氫化物的相容性良好,故容易維持基材層的更優異的透明性。(Olefin resin) From the viewpoint of performance as a laminate and economical efficiency, the above-mentioned other resin is preferably an olefin resin. Examples of olefin resins include polyethylenes such as high-density polyethylene, medium-density polyethylene, low-density polyethylene, and linear low-density polyethylene; polypropylenes such as homopolypropylene, block polypropylene, and random polypropylene; Single polymer or copolymer of α-olefin; propylene and/or copolymer of ethylene and α-olefin, etc. As the above-mentioned α-olefins, for example, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4-methyl- 1-pentene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1 -Eicosene and other α-olefins with a carbon number of 20 or less. One or two or more of these can be used. In addition, modified olefin resins in which these olefin resins are modified by maleic acid or the like can also be used. Among these olefin resins, polypropylene is preferred from the viewpoint of high compatibility with the above-mentioned block copolymer or its hydrogenated product and suitable for obtaining a laminate having excellent transparency. More specifically, as an example of a preferable aspect of the present embodiment, in the base material layer, the other resin described above may be an olefin resin, a block copolymer, or a hydrogenated product thereof. Among them, it is preferable to use a hydrogenated product of an olefin resin and a block copolymer. Since the olefin resin has good compatibility with the above-mentioned hydrogenated compound, it is easy to maintain more excellent transparency of the base layer.

(烯烴樹脂以外的樹脂) 又,作為上述其他樹脂,可使用上述烯烴樹脂以外的樹脂。 作為烯烴樹脂以外的樹脂,可列舉:聚異戊二烯、聚丁二烯、乙烯-丙烯-二烯共聚物硫化物、苯乙烯-丁二烯橡膠、苯乙烯-異戊二烯橡膠、腈橡膠、丁基橡膠、天然橡膠、乙烯-乙酸乙烯酯共聚物、乙烯-(甲基)丙烯酸酯共聚物、乙烯-(甲基)丙烯酸乙酯共聚物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸共聚物的金屬離子交聯樹脂(離子聚合物)、聚苯乙烯、AS樹脂、ABS樹脂等苯乙烯系樹脂、聚伸苯醚系樹脂、耐綸6、耐綸66等聚醯胺樹脂、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂、聚胺基甲酸酯系樹脂、聚甲醛均聚物、聚甲醛共聚物等縮醛系樹脂、聚甲基丙烯酸甲酯系樹脂等丙烯酸系樹脂、聚氯乙烯、氯乙烯-乙酸乙烯酯共聚物、乙烯-氯乙烯-乙酸乙烯酯共聚物等。(Resin other than olefin resin) In addition, as the other resin described above, resins other than the above-mentioned olefin resin can be used. Examples of resins other than olefin resins include polyisoprene, polybutadiene, ethylene-propylene-diene copolymer sulfide, styrene-butadiene rubber, styrene-isoprene rubber, and nitrile Rubber, butyl rubber, natural rubber, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylate copolymer, ethylene-ethyl(meth)acrylate copolymer, ethylene-(meth)acrylic acid copolymer, Metal ion cross-linked resins of ethylene-(meth)acrylic acid copolymers (ionomers), polystyrene, AS resins, ABS resins and other styrene resins, polyphenylene ether resins, nylon 6, nylon 66 Polyamide resins, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyurethane resins, polyoxymethylene homopolymers, polyoxymethylene copolymers, etc. Acrylic resins such as aldehyde resins and polymethyl methacrylate resins, polyvinyl chloride, vinyl chloride-vinyl acetate copolymers, ethylene-vinyl chloride-vinyl acetate copolymers, and the like.

又,作為基材層的材質,由作為積層體的性能、經濟性之觀點而言,較佳為可列舉:嵌段共聚物或其氫化物與其他樹脂的組合,以及,非脂環式骨架嵌段共聚物及其氫化物與其他樹脂的組合,由作為積層體的性能、經濟性及獲得更優異的制振性之觀點而言,更佳為嵌段共聚物或其氫化物與其他樹脂的組合。 基材層的構成可為一層,亦可為二層以上的多層構成。包含二層以上之情形,亦可使用材質不同的二種以上的樹脂。In addition, as the material of the base material layer, from the viewpoint of performance as a laminate and economical efficiency, it is preferable to include: a combination of a block copolymer or its hydrogenated product and other resins, and a non-alicyclic skeleton The combination of a block copolymer and its hydrogenated product and other resins is more preferably a block copolymer or its hydrogenated product and other resins from the viewpoints of performance as a laminate, economic efficiency, and obtaining more excellent vibration damping properties The combination. The structure of the substrate layer may be a single layer, or a multilayer structure of two or more layers. When two or more layers are included, two or more resins with different materials can also be used.

[含量] 基材層中之非脂環式骨架嵌段共聚物及其氫化物的含量,由作為積層體的性能之觀點而言,較佳為1質量%以上,更佳為5質量%以上,再佳為10質量%以上。另一方面,基材層中之非脂環式骨架嵌段共聚物及其氫化物的含量的上限,只要在不損及本發明效果的範圍中則未被特別限制,可為100質量%,但由經濟性之觀點而言,較佳為50質量%以下,更佳為40質量%以下,再佳為30質量%以下。[content] The content of the non-alicyclic skeleton block copolymer and its hydrogenated product in the base layer is preferably 1% by mass or more, more preferably 5% by mass or more, from the viewpoint of performance as a laminate It is 10% by mass or more. On the other hand, the upper limit of the content of the non-alicyclic skeleton block copolymer and its hydrogenated product in the base layer is not particularly limited as long as it does not impair the effects of the present invention, and may be 100% by mass. However, from the viewpoint of economic efficiency, it is preferably 50% by mass or less, more preferably 40% by mass or less, and still more preferably 30% by mass or less.

基材層中之其他樹脂的含量,由作為積層體的性能及經濟性之觀點而言,較佳為10質量%以上,更佳為20質量%以上,再佳為30質量%以上,又再佳為40質量%以上,又再佳為50質量%以上,又再佳為60質量%以上。另一方面,基材層中之上述的其他樹脂的含量的上限,只要在不損及本發明效果的範圍中則未被特別限制,可為100質量%,但在使基材層含有上述的嵌段共聚物或其氫化物之情形中,由容易使被接著體的制振性進一步提升之觀點而言,較佳為97質量%以下,更佳為95質量%以下,再佳為90質量%以下。The content of other resins in the substrate layer is preferably 10% by mass or more, more preferably 20% by mass or more, still more preferably 30% by mass or more, from the standpoint of performance and economy as a laminate It is preferably 40% by mass or more, still more preferably 50% by mass or more, and still more preferably 60% by mass or more. On the other hand, the upper limit of the content of the above-mentioned other resins in the base layer is not particularly limited as long as it does not impair the effects of the present invention. It may be 100% by mass. However, when the base layer contains the above In the case of a block copolymer or its hydrogenated product, from the viewpoint of easily improving the vibration damping properties of the adherend, it is preferably 97% by mass or less, more preferably 95% by mass or less, and still more preferably 90% by mass %the following.

在基材層中,嵌段共聚物或其氫化物與其他樹脂的含量之比例,若將此等的合計含量設為100質量%,則嵌段共聚物或其氫化物的含量為較佳為1~99質量%,更佳為1~90質量%,再佳為1~80質量%,又再佳為1~70質量%,又再佳為1~60質量%,又再佳為1~50質量%,又再佳為1~40質量%,又亦可為1~30質量%、1~25質量%。 作為本實施形態的較佳態樣之一例,其他樹脂為烯烴樹脂之情形,上述含量的比例係嵌段共聚物或其氫化物的含量為1~99質量%,且烯烴樹脂的含量為99~1質量%,更佳態樣係與上述嵌段共聚物或其氫化物與其他樹脂的含量的比例為相同。 作為本實施形態的更佳態樣之一例,其他樹脂為聚丙烯之情形,嵌段共聚物或其氫化物的含量為1~99質量%,且聚丙烯的含量為99~1質量%,更佳態樣係與上述嵌段共聚物或其氫化物與其他樹脂的含量的比例為相同。In the base layer, the ratio of the content of the block copolymer or its hydrogenated product to other resins, if the total content of these is 100% by mass, the content of the block copolymer or its hydrogenated product is preferably 1 to 99 mass%, more preferably 1 to 90 mass%, still more preferably 1 to 80 mass%, still more preferably 1 to 70 mass%, still more preferably 1 to 60 mass%, still more preferably 1 to 50% by mass, more preferably 1-40% by mass, or 1-30% by mass, or 1-25% by mass. As an example of a preferable aspect of this embodiment, when the other resin is an olefin resin, the ratio of the above content is that the content of the block copolymer or its hydrogenated product is 1 to 99% by mass, and the content of the olefin resin is 99 to 99%. 1% by mass, and more preferably the same as the ratio of the content of the block copolymer or its hydrogenated product and other resins. As an example of a more preferable aspect of this embodiment, when the other resin is polypropylene, the content of the block copolymer or its hydrogenated product is 1 to 99% by mass, and the content of polypropylene is 99 to 1% by mass, and more The preferred aspect is the same as the ratio of the content of the block copolymer or its hydrogenated product to other resins.

又,作為本實施形態的較佳態樣之一例,基材層的材質為非脂環式骨架嵌段共聚物或其氫化物與其他樹脂的組合之情形,非脂環式骨架嵌段共聚物或其氫化物與其他樹脂的含量的比例,若將此等的合計含量設為100質量%,則非脂環式骨架嵌段共聚物或其氫化物的含量為較佳為1~99質量%,更佳為1~90質量%,再佳為1~80質量%,又再佳為1~70質量%,又再佳為1~60質量%,又再佳為1~50質量%,又再佳為1~40質量%。 基材層中之嵌段共聚物或其氫化物、與非脂環式骨架嵌段共聚物及其氫化物、以及其他樹脂的合計含量,較佳為90質量%以上,更佳為95質量%以上,亦可為100質量%。In addition, as an example of a preferable aspect of this embodiment, when the material of the base layer is a non-alicyclic skeleton block copolymer or a combination of its hydrogenated product and other resins, the non-alicyclic skeleton block copolymer The ratio of the content of its hydrogenated product to other resins, if the total content of these is set to 100% by mass, the content of the non-alicyclic skeleton block copolymer or its hydrogenated product is preferably 1 to 99% by mass , More preferably 1 to 90 mass%, still more preferably 1 to 80 mass%, still more preferably 1 to 70 mass%, still more preferably 1 to 60 mass%, still more preferably 1 to 50 mass%, and More preferably, it is 1-40% by mass. The total content of the block copolymer or its hydrogenated product, non-alicyclic skeleton block copolymer and its hydrogenated product, and other resins in the base layer is preferably 90% by mass or more, more preferably 95% by mass The above may be 100% by mass.

[添加劑] 又,本實施形態中之基材層,在不損及本發明效果的範圍中,並非妨礙含有後述的黏著賦予樹脂者。但是,因基材層具有黏接著性而會損及作為基材的性能,且有產生對於基材展現出不需要的黏接著性等不良狀況之虞,因此,基材層中之黏著賦予樹脂的含量較佳為小於1質量%,基材層亦可為實質上不包含黏著賦予樹脂(黏著賦予樹脂的含量為0質量%)者。 基材層中,在不損及本發明目的之範圍中,亦可因應需要而進一步添加添加劑。作為添加劑,可列舉例如:交聯劑(異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合系交聯劑、吖𠰂系交聯劑、胺樹脂等)、熱穩定劑、光穩定劑、紫外線吸收劑、紅外線吸收劑、抗氧化劑、潤滑劑、著色劑、抗靜電劑、阻燃劑、撥水劑、防水劑、親水性賦予劑、導電性賦予劑、導熱性賦予劑、電磁波屏蔽性賦予劑、透光性調整劑、螢光劑、滑動性賦予劑、透明性賦予劑、防黏附劑(anti-blocking agent)、金屬惰性化劑、防菌劑、結晶成核劑、龜裂防止劑、臭氧劣化防止劑、防鼠劑、分散劑、增黏劑、耐光劑、耐候劑、銅害防止劑、補強劑、防霉劑、大環狀分子(環糊精、杯芳烴、葫蘆脲(cucurbituril)等)、前述黏著賦予樹脂以外的黏著劑(丙烯酸系黏著劑等)等。添加劑的含量,由抑制來自基材層的滲出之觀點而言,在上述的基材層用的樹脂成分每100質量份中,較佳為10質量份以下,更佳為5質量份以下。[additive] In addition, the base material layer in the present embodiment does not impede the inclusion of the adhesion-imparting resin described later in the range that does not impair the effects of the present invention. However, due to the adhesiveness of the base material layer, the performance as a base material is impaired, and there is a risk of undesirable adhesion to the base material. Therefore, the adhesion imparting resin in the base material layer The content of is preferably less than 1% by mass, and the base material layer may be substantially free of adhesion-imparting resin (the content of adhesion-imparting resin is 0% by mass). In the base material layer, in a range that does not impair the purpose of the present invention, further additives may be added as needed. Examples of additives include cross-linking agents (isocyanate-based cross-linking agents, epoxy-based cross-linking agents, metal chelate-based cross-linking agents, acridine-based cross-linking agents, amine resins, etc.), heat stabilizers, and light stabilizers. Agent, ultraviolet absorber, infrared absorber, antioxidant, lubricant, coloring agent, antistatic agent, flame retardant, water repellent, water repellent, hydrophilicity imparting agent, conductivity imparting agent, thermal conductivity imparting agent, electromagnetic wave Barrier property imparting agent, light transmittance modifier, fluorescent agent, slip property imparting agent, transparency imparting agent, anti-blocking agent, metal inertizer, antibacterial agent, crystal nucleating agent, tortoise Crack preventive agent, ozone deterioration preventive agent, rodent inhibitor, dispersant, tackifier, light stabilizer, weathering agent, copper damage preventive agent, reinforcing agent, antifungal agent, macrocyclic molecule (cyclodextrin, calixarene, Cucurbituril (cucurbituril, etc.), adhesives (acrylic adhesives, etc.) other than the aforementioned adhesion-imparting resin. The content of the additive is preferably 10 parts by mass or less, and more preferably 5 parts by mass or less per 100 parts by mass of the above-mentioned resin component for the base layer from the viewpoint of suppressing bleeding from the substrate layer.

≪黏著層≫ 本實施形態中之黏著層,除了上述的嵌段共聚物或其氫化物以外,由提高積層體的黏著力、即使在高溫亦維持黏著力之觀點而言,較佳為含有黏著賦予樹脂。≪Adhesive layer≫ In addition to the above-mentioned block copolymer or its hydrogenated product, the adhesion layer in this embodiment preferably contains an adhesion-imparting resin from the viewpoint of improving the adhesion of the laminate and maintaining the adhesion even at high temperatures.

[黏著賦予樹脂] 作為黏著賦予樹脂,可列舉例如:苯并呋喃-茚樹脂等苯并呋喃樹脂;對三級丁基酚-乙炔樹脂、酚-甲醛樹脂、萜烯-酚樹脂、聚萜烯樹脂、二甲苯-甲醛樹脂等酚系樹脂及萜烯系樹脂;芳香族系石油樹脂、脂肪族系石油樹脂、脂環式系石油樹脂、芳香族系石油樹脂、改質脂環式系石油樹脂等石油樹脂;以松香的新戊四醇酯及松香的甘油酯等所代表之松香酯、氫化松香、氫化松香的甲酯、聚合松香的新戊四醇酯、氫化松香酯、高熔點酯系樹脂、聚合松香、硬化松香、特殊松香酯等松香系樹脂等。其中,作為黏著賦予樹脂,可適合地使用脂環族飽和烴系樹脂。脂環族飽和烴系樹脂可列舉芳香族系石油樹脂經氫化者,亦可使用例如荒川化學工業股份有限公司製「ALCON」系列等市售品。此等黏著賦予樹脂可單獨使用,亦可併用二種以上。此外,由所得之黏著層的殘膠減少及耐熱性、耐候性提升之觀點而言,較佳為使用已氫化的黏著賦予樹脂。 上述黏著賦予樹脂的軟化點較佳為85~160℃,更佳為100~150℃,再佳為105~145℃。只要黏著賦予樹脂的軟化點為85℃以上,則變得容易抑制在高溫(約60℃)的接著保持力的降低,只要為160℃以下,則構成黏著層之組成物的成形加工性良好。[Adhesive Resin] Examples of the adhesion-imparting resin include: benzofuran resins such as coumarone-indene resin; p-tertiary butylphenol-acetylene resin, phenol-formaldehyde resin, terpene-phenol resin, polyterpene resin, xylene- Phenolic resins and terpene resins such as formaldehyde resins; petroleum resins such as aromatic petroleum resins, aliphatic petroleum resins, alicyclic petroleum resins, aromatic petroleum resins, and modified alicyclic petroleum resins; Rosin ester represented by neopentyl erythritol ester of rosin and glyceryl ester of rosin, hydrogenated rosin, methyl ester of hydrogenated rosin, neopentyl erythritol ester of polymerized rosin, hydrogenated rosin ester, high melting point ester resin, polymerized rosin, Rosin-based resins such as hardened rosin and special rosin esters. Among them, as the adhesion-imparting resin, an alicyclic saturated hydrocarbon-based resin can be suitably used. Examples of the alicyclic saturated hydrocarbon-based resin include hydrogenated aromatic petroleum resins, and commercial products such as the "ALCON" series manufactured by Arakawa Chemical Industry Co., Ltd. can also be used. These adhesion-imparting resins may be used alone or in combination of two or more kinds. In addition, from the viewpoints of reducing the residual glue of the obtained adhesive layer and improving the heat resistance and weather resistance, it is preferable to use a hydrogenated adhesive imparting resin. The softening point of the adhesion-imparting resin is preferably 85 to 160°C, more preferably 100 to 150°C, and still more preferably 105 to 145°C. As long as the softening point of the adhesion-imparting resin is 85°C or more, it becomes easy to suppress the decrease in adhesive retention at high temperature (about 60°C), and as long as it is 160°C or less, the molding processability of the composition constituting the adhesive layer is good.

[含量] 黏著層中之上述的嵌段共聚物或其氫化物的含量可為100質量%,但由積層體的制振性及在高溫的黏著力之觀點而言,較佳為1~80質量%。 又,黏著層中之嵌段共聚物或其氫化物的上述含量,由使積層體的制振性更優異之觀點而言,更佳為5質量%以上,再佳為10質量%以上。另一方面,黏著層中之嵌段共聚物或其氫化物的上述含量,由經濟性及更容易維持在高溫的黏著力之觀點而言,更佳為70質量%以下,再佳為60質量%以下,又再佳為50質量%以下,又再佳為40質量%以下。[content] The content of the above-mentioned block copolymer or its hydrogenated product in the adhesive layer may be 100% by mass, but from the viewpoint of the vibration damping properties of the laminate and the adhesive force at high temperatures, it is preferably 1 to 80% by mass. In addition, the above-mentioned content of the block copolymer or its hydrogenated product in the adhesive layer is more preferably 5% by mass or more, and still more preferably 10% by mass or more from the viewpoint of making the laminate more excellent in vibration damping properties. On the other hand, the above-mentioned content of the block copolymer or its hydrogenated product in the adhesive layer is more preferably 70% by mass or less, and still more preferably 60% by mass from the viewpoint of economy and easier maintenance of adhesion at high temperatures. % Or less, more preferably 50% by mass or less, and still more preferably 40% by mass or less.

黏著層中之黏著賦予樹脂的含量,由黏著層的黏著力之觀點而言,較佳為1質量%以上,更佳為5質量%以上,再佳為10質量%以上,又再佳為15質量%以上。另一方面,黏著層中之黏著賦予樹脂的上述含量,由減少黏著層的殘膠之觀點而言,較佳為60質量%以下,更佳為50質量%以下,再佳為40質量%以下。The content of the adhesive imparting resin in the adhesive layer, from the viewpoint of the adhesive force of the adhesive layer, is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 10% by mass or more, and still more preferably 15 Above mass%. On the other hand, the above-mentioned content of the adhesion-imparting resin in the adhesive layer is preferably 60% by mass or less, more preferably 50% by mass or less, and still more preferably 40% by mass or less from the viewpoint of reducing residual glue in the adhesive layer .

[非脂環式骨架嵌段共聚物及其氫化物] 又,作為構成黏著層之樹脂成分,由作為積層體的性能之觀點而言,較佳為使用上述的非脂環式骨架嵌段共聚物或其氫化物。 黏著層中之非脂環式骨架嵌段共聚物或其氫化物的含量,由黏著層的殘膠減少及黏著層的黏著力之觀點而言,較佳為10質量%以上,更佳為20質量%以上,再佳為30質量%以上,又再佳為40質量%以上。另一方面,黏著層中之非脂環式骨架嵌段共聚物及其氫化物的含量的上限,在不損及本發明效果的範圍中未被特別限制,可為100質量%,但由經濟性之觀點而言,較佳為95質量%以下,更佳為90質量%以下,再佳為80質量%以下。[Non-alicyclic skeleton block copolymer and its hydrogenated products] In addition, as the resin component constituting the adhesive layer, from the viewpoint of performance as a laminate, it is preferable to use the above-mentioned non-alicyclic skeleton block copolymer or its hydrogenated product. The content of the non-alicyclic skeleton block copolymer or its hydrogenated product in the adhesive layer is preferably 10% by mass or more, and more preferably 20, from the viewpoint of the reduction of the residual glue of the adhesive layer and the adhesive force of the adhesive layer. Mass% or more, more preferably 30 mass% or more, and still more preferably 40 mass% or more. On the other hand, the upper limit of the content of the non-alicyclic skeleton block copolymer and its hydrogenated product in the adhesive layer is not particularly limited within a range that does not impair the effect of the present invention. It can be 100% by mass, but it is economical From the viewpoint of performance, it is preferably 95% by mass or less, more preferably 90% by mass or less, and still more preferably 80% by mass or less.

[其他樹脂成分] (烯烴樹脂) 在不損及本發明目的之範圍中,作為構成黏著層之樹脂成分,可使用烯烴樹脂。 作為烯烴樹脂,可列舉例如:高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈低密度聚乙烯等聚乙烯;均聚聚丙烯、嵌段聚丙烯、隨機聚丙烯等聚丙烯;α-烯烴的單獨聚合物或共聚物;丙烯及/或乙烯與α-烯烴的共聚物等。作為上述α-烯烴,可列舉例如:1-丁烯、1-戊烯、3-甲基-1-丁烯、1-己烯、3-甲基-1-戊烯、4-甲基-1-戊烯、1-庚烯、1-辛烯、1-壬烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等碳數20以下的α-烯烴,此等可使用一種或二種以上。又,亦可使用藉由順丁烯二酸等使此等烯烴樹脂進行改質之改質烯烴樹脂。[Other resin components] (Olefin resin) In the range that does not impair the purpose of the present invention, an olefin resin can be used as the resin component constituting the adhesive layer. Examples of olefin resins include polyethylenes such as high-density polyethylene, medium-density polyethylene, low-density polyethylene, and linear low-density polyethylene; polypropylenes such as homopolypropylene, block polypropylene, and random polypropylene; Single polymer or copolymer of α-olefin; propylene and/or copolymer of ethylene and α-olefin, etc. As the above-mentioned α-olefins, for example, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4-methyl- 1-pentene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1 -Eicosene and other α-olefins with a carbon number of 20 or less. One or two or more of these can be used. In addition, modified olefin resins in which these olefin resins are modified by maleic acid or the like can also be used.

(烯烴樹脂以外的樹脂) 又,在不損及本發明目的之範圍中,作為構成黏著層之樹脂成分,可使用上述烯烴樹脂以外的樹脂。 作為烯烴樹脂以外的樹脂,可列舉:聚異戊二烯、聚丁二烯、乙烯-丙烯-二烯共聚物硫化物、苯乙烯-丁二烯橡膠、苯乙烯-異戊二烯橡膠、腈橡膠、丁基橡膠、天然橡膠、乙烯-乙酸乙烯酯共聚物、乙烯-(甲基)丙烯酸酯共聚物、乙烯-(甲基)丙烯酸乙酯共聚物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸共聚物的金屬離子交聯樹脂(離子聚合物)、聚苯乙烯、AS樹脂、ABS樹脂等苯乙烯系樹脂、聚伸苯醚系樹脂、耐綸6、耐綸66等聚醯胺樹脂、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂、聚胺基甲酸酯系樹脂、聚甲醛均聚物、聚甲醛共聚物等縮醛系樹脂、聚甲基丙烯酸甲酯系樹脂等丙烯酸系樹脂、聚氯乙烯、氯乙烯-乙酸乙烯酯共聚物、乙烯-氯乙烯-乙酸乙烯酯共聚物等。(Resin other than olefin resin) Moreover, in the range which does not impair the objective of this invention, resin other than the said olefin resin can be used as a resin component which comprises an adhesive layer. Examples of resins other than olefin resins include polyisoprene, polybutadiene, ethylene-propylene-diene copolymer sulfide, styrene-butadiene rubber, styrene-isoprene rubber, and nitrile Rubber, butyl rubber, natural rubber, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylate copolymer, ethylene-ethyl(meth)acrylate copolymer, ethylene-(meth)acrylic acid copolymer, Metal ion cross-linked resins of ethylene-(meth)acrylic acid copolymers (ionomers), polystyrene, AS resins, ABS resins and other styrene resins, polyphenylene ether resins, nylon 6, nylon 66 Polyamide resins, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyurethane resins, polyoxymethylene homopolymers, polyoxymethylene copolymers, etc. Acrylic resins such as aldehyde resins and polymethyl methacrylate resins, polyvinyl chloride, vinyl chloride-vinyl acetate copolymers, ethylene-vinyl chloride-vinyl acetate copolymers, and the like.

(添加劑) 黏著層中,在不損及本發明目的之範圍中,可因應需要而添加塑化劑、填充劑。 作為塑化劑,可列舉例如:石蠟系、環烷系、芳香族系的加工油;鄰苯二甲酸二辛酯、鄰苯二甲酸二丁酯等鄰苯二甲酸衍生物;白油;礦物油;乙烯與α-烯烴的液狀共寡聚物;液態石蠟;聚丁烯;低分子量聚異丁烯;液狀聚丁二烯、液狀聚異戊二烯、液狀聚異戊二烯/丁二烯共聚物、液狀苯乙烯/丁二烯共聚物、液狀苯乙烯/異戊二烯共聚物等液狀聚二烯及其氫化物等。 作為填充劑,可列舉例如:滑石、雲母、矽酸鈣、玻璃、玻璃薄片、玻璃珠粒、玻璃中空球、玻璃纖維、碳酸鈣、碳酸鎂、碳酸鋅、鹼性碳酸鎂、氫氧化鋁、氫氧化鎂、氫氧化鈣、硼酸鋅、碳鈉鋁石、多磷酸銨、鋁酸鈣、水滑石、矽石、矽石氧化鋁、矽藻土、矽灰石、沸石、水鋁石、鋁矽酸鈉、矽酸鎂、石墨烯、碳酸鋇、氮化矽、氮化鋁、氮化硼、鈦酸鉀、矽酸鋁(高嶺土、黏土、葉蠟石、皂土)、矽酸鎂(厄帖浦石)、硼酸鋁、硫酸鈣、硫酸鎂、氧化鋁、氧化鈦、氧化鐵、氧化鋅、氧化鎂、氧化錫、氧化銻、亞鐵酸鋇、亞鐵酸鍶、碳黑、奈米碳管、石墨、碳纖維、活性碳、碳中空球、鈦酸鈣、鋯鈦酸鉛、碳化矽等無機填料;木粉、澱粉等有機填料;有機顏料等。此等填充劑可單獨使用,亦可併用二種以上。 又,黏著層中,在不損及本發明目的之範圍中,亦可因應需要而進一步添加其他添加劑。作為添加劑,可列舉例如:交聯劑(異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合系交聯劑、吖𠰂系交聯劑、胺樹脂等)、熱穩定劑、光穩定劑、紫外線吸收劑、紅外線吸收劑、抗氧化劑、潤滑劑、著色劑、抗靜電劑、阻燃劑、撥水劑、防水劑、親水性賦予劑、導電性賦予劑、導熱性賦予劑、電磁波屏蔽性賦予劑、透光性調整劑、螢光劑、滑動性賦予劑、透明性賦予劑、防黏附劑、金屬惰性化劑、防菌劑、結晶成核劑、龜裂防止劑、臭氧劣化防止劑、防鼠劑、分散劑、增黏劑、耐光劑、耐候劑、銅害防止劑、補強劑、防霉劑、大環狀分子(環糊精、杯芳烴、葫蘆脲等)、前述黏著賦予樹脂以外的黏著劑(丙烯酸系黏著劑等)等。 另一方面,由最大限度享受本發明效果之觀點而言,在黏著層中,上述塑化劑、填充材、添加劑的各自含量較佳為10質量%以下,更佳為5質量%以下,再佳為2質量%以下。只要此等的含量為10質量%以下,則被認為幾乎不對後述tanδ強度的表現造成影響。(additive) In the adhesive layer, plasticizers and fillers can be added as needed within the scope that does not impair the purpose of the present invention. Examples of plasticizers include: paraffin-based, naphthenic-based, and aromatic-based processing oils; phthalic acid derivatives such as dioctyl phthalate and dibutyl phthalate; white oil; minerals Oil; liquid co-oligomer of ethylene and α-olefin; liquid paraffin; polybutene; low molecular weight polyisobutylene; liquid polybutadiene, liquid polyisoprene, liquid polyisoprene/ Liquid polydienes such as butadiene copolymers, liquid styrene/butadiene copolymers, and liquid styrene/isoprene copolymers and their hydrogenated products. Examples of fillers include talc, mica, calcium silicate, glass, glass flakes, glass beads, glass hollow spheres, glass fibers, calcium carbonate, magnesium carbonate, zinc carbonate, basic magnesium carbonate, aluminum hydroxide, Magnesium hydroxide, calcium hydroxide, zinc borate, dawsonite, ammonium polyphosphate, calcium aluminate, hydrotalcite, silica, silica alumina, diatomaceous earth, wollastonite, zeolite, diaspore, aluminum Sodium silicate, magnesium silicate, graphene, barium carbonate, silicon nitride, aluminum nitride, boron nitride, potassium titanate, aluminum silicate (kaolin, clay, pyrophyllite, bentonite), magnesium silicate ( Othepite), aluminum borate, calcium sulfate, magnesium sulfate, aluminum oxide, titanium oxide, iron oxide, zinc oxide, magnesium oxide, tin oxide, antimony oxide, barium ferrite, strontium ferrite, carbon black, naphthalene Rice carbon tube, graphite, carbon fiber, activated carbon, carbon hollow sphere, calcium titanate, lead zirconate titanate, silicon carbide and other inorganic fillers; wood flour, starch and other organic fillers; organic pigments, etc. These fillers may be used alone, or two or more of them may be used in combination. In addition, in the adhesive layer, other additives may be further added as needed within the scope not to impair the purpose of the present invention. Examples of additives include cross-linking agents (isocyanate-based cross-linking agents, epoxy-based cross-linking agents, metal chelate-based cross-linking agents, acridine-based cross-linking agents, amine resins, etc.), heat stabilizers, and light stabilizers. Agent, ultraviolet absorber, infrared absorber, antioxidant, lubricant, coloring agent, antistatic agent, flame retardant, water repellent, water repellent, hydrophilicity imparting agent, conductivity imparting agent, thermal conductivity imparting agent, electromagnetic wave Barrier imparting agent, light transmittance modifier, fluorescent agent, sliding property imparting agent, transparency imparting agent, anti-adhesion agent, metal inertizer, antibacterial agent, crystal nucleating agent, anti-cracking agent, ozone deterioration Preventive agents, rodent inhibitors, dispersants, tackifiers, lightfasteners, weathering agents, copper damage inhibitors, reinforcing agents, antifungal agents, macrocyclic molecules (cyclodextrin, calixarene, cucurbituril, etc.), the aforementioned Adhesives (acrylic adhesives, etc.) other than the adhesion imparting resin. On the other hand, from the viewpoint of maximizing the effect of the present invention, in the adhesive layer, the respective contents of the plasticizer, filler, and additives are preferably 10% by mass or less, and more preferably 5% by mass or less. Preferably, it is 2% by mass or less. As long as the content is 10% by mass or less, it is considered that it hardly affects the performance of the tanδ strength described later.

≪積層體的製造方法≫ 上述的積層體的製造方法並無特別限定,可列舉例如:(1)構成基材層的組成物與構成黏著層的組成物之由多層T型模(T-DIE)擠壓機等所致之共擠壓成形法;(2)將構成黏著層的組成物塗布於已成形的基材層之方法;(3)將已成形的基材層與構成黏著層的組成物藉由壓縮成形而積層之壓縮成形法等。≪Method of manufacturing laminated body≫ The manufacturing method of the above-mentioned laminate is not particularly limited, and examples include: (1) The composition of the base layer and the composition of the adhesive layer are caused by a multi-layer T-die (T-DIE) extruder, etc. The co-extrusion method; (2) the method of coating the composition of the adhesive layer on the formed substrate layer; (3) the method of compressing the formed substrate layer and the composition of the adhesive layer Laminated compression molding method, etc.

構成基材層的組成物及構成黏著層的組成物可分別利用熔融混練而製造。 作為熔融混練,只要在各層中將摻合的成分分別使用亨歇爾混合機、V型摻合機、帶式摻合機、滾筒摻合機、錐形摻合機等混合機進行混合,或者在其混合後,藉由單軸或雙軸擠壓機、捏合機等而進行熔融混練即可。熔融混練時的溫度可適當設定,但通常為150~300℃,較佳為160~250℃。 所得之構成基材層及黏著層的各組成物,由利用擠壓成形而容易地製造積層體之觀點而言,較佳為分別進行顆粒(pellet)化。The composition constituting the base layer and the composition constituting the adhesion layer can be manufactured by melt kneading, respectively. As for melt kneading, as long as the components to be blended in each layer are mixed using a Henschel mixer, V-blender, belt blender, drum blender, cone blender, etc., or After mixing, it is only necessary to perform melt kneading by a uniaxial or biaxial extruder, a kneader, or the like. The temperature during melt kneading can be appropriately set, but is usually 150 to 300°C, preferably 160 to 250°C. From the viewpoint of easily producing a laminate by extrusion molding, the obtained respective compositions constituting the base layer and the adhesive layer are preferably pelletized separately.

藉由上述(2)的塗布方法製造積層體之情形,可在有機溶媒中使構成黏著層的組成物溶解而製作溶液,將此溶液塗布於已成形的基材層後,藉由進行乾燥,適當地獲得積層體。此有機溶媒只要為可溶解構成黏著層的組成物之溶媒則未被特別限定。作為上述溶媒,可列舉例如環己烷、甲基環己烷、正己烷、正庚烷、苯、甲苯、甲苯-乙醇混合溶媒、二甲苯、乙基苯、四氫呋喃等。此等溶媒可單獨使用,或亦可併用二種以上。由塗布容易性、溶液的製造容易性、乾燥容易性之觀點而言,較佳為甲苯、甲苯-乙醇混合溶媒、二甲苯、乙基苯。 溶液中之樹脂成分的濃度,由塗布容易性、溶液的製造容易性、乾燥容易性之觀點而言,較佳為5~50質量%,更佳為5~40質量%,再佳為5~30質量%。In the case of manufacturing a laminate by the coating method of (2) above, the composition constituting the adhesive layer can be dissolved in an organic solvent to prepare a solution, and the solution can be applied to the formed substrate layer and then dried, Appropriately obtain a laminate. The organic solvent is not particularly limited as long as it can dissolve the composition constituting the adhesive layer. As said solvent, cyclohexane, methylcyclohexane, n-hexane, n-heptane, benzene, toluene, toluene-ethanol mixed solvent, xylene, ethylbenzene, tetrahydrofuran etc. are mentioned, for example. These solvents may be used alone, or two or more of them may be used in combination. From the viewpoints of ease of application, ease of solution production, and ease of drying, toluene, a toluene-ethanol mixed solvent, xylene, and ethylbenzene are preferred. The concentration of the resin component in the solution is preferably 5-50% by mass, more preferably 5-40% by mass, and still more preferably 5~ 30% by mass.

藉由上述(1)的共擠壓成形法製造積層體之情形,係將構成基材層之組成物、及構成黏著層之組成物分別使用不同的擠壓機進行熔融可塑化,製成各顆粒。其後,可利用已設置在擠壓機前端的進料模組模頭(feed block die),使各顆粒合流、多層化並進行擠壓後,以薄膜狀取得,藉此可適當地製造。 藉由上述(3)的壓縮成形法製造積層體之情形,可在已成形的基材上,重疊顆粒狀或片狀之構成黏著層的組成物,一邊加熱一邊壓縮成形後,藉由冷卻而適當地獲得。In the case of manufacturing a laminate by the co-extrusion molding method of (1) above, the composition constituting the substrate layer and the composition constituting the adhesive layer are respectively melted and plasticized using different extruders to make each Particles. After that, the feed block die that has been installed at the front end of the extruder can be used to merge the pellets into multiple layers and extrude them, and then obtain them in the form of a film, thereby making them suitable for production. In the case of manufacturing a laminate by the compression molding method described in (3) above, a granular or sheet-shaped composition constituting the adhesive layer can be superimposed on a molded substrate, and then compressed and molded while being heated, and then cooled down. Obtain appropriately.

構成黏著層的組成物為熱熔型之情形中,可使用與以往同樣的熱熔用的施用器(applicator),將該組成物進行加熱熔融並塗布於基材層後,藉由冷卻,而適當地獲得積層體。When the composition constituting the adhesive layer is a hot-melt type, the same hot-melt applicator as in the past can be used. After the composition is heated and melted and applied to the base material layer, it is cooled down. Appropriately obtain a laminate.

茲揭示積層體中之構成基材層的組成物與構成黏著層的組成物之組合的一例。上述組合,在以<1>表示上述的嵌段共聚物或其氫化物、以<2>表示非脂環式骨架嵌段共聚物或其氫化物時,可列舉例如: 構成基材層之組成物包含烯烴樹脂與<1>及/或<2>,構成黏著層之組成物包含黏著賦予樹脂與<1>及/或<2>之積層體(惟,基材層及黏著層之中至少1層包含<1>); 構成基材層之組成物包含烯烴樹脂與<1>及/或<2>,構成黏著層之組成物包含黏著賦予樹脂與<1>之積層體; 構成基材層之組成物包含烯烴樹脂與<1>及/或<2>,構成黏著層之組成物包含黏著賦予樹脂與<2>之積層體(惟,基材層及黏著層之中至少1層包含<1>); 構成基材層之組成物包含烯烴樹脂與<1>,構成黏著層之組成物包含黏著賦予樹脂與<1>及/或<2>之積層體; 構成基材層之組成物包含烯烴樹脂與<2>,構成黏著層之組成物包含黏著賦予樹脂與<1>及/或<2>之積層體(惟,基材層及黏著層之中至少1層包含<1>)。 本實施形態不受限於上述構成基材層之組成物與構成黏著層之組成物的組合。上述構成基材層之組成物及構成黏著層之組成物中的<1>、<2>、烯烴樹脂、及黏著賦予樹脂的各自的具體態樣,係分別與上述的具體態樣為相同。又,上述構成基材層之組成物及構成黏著層之組成物中,可分別包含上述的添加劑。An example of the combination of the composition constituting the base layer and the composition constituting the adhesive layer in the laminate is disclosed. For the above combination, when the block copolymer or its hydrogenated product is represented by <1>, and the non-alicyclic skeleton block copolymer or its hydrogenated product is represented by <2>, for example: The composition constituting the base layer includes an olefin resin and <1> and/or <2>, and the composition constituting the adhesive layer includes a laminate of an adhesion-imparting resin and <1> and/or <2> (but, the base layer And at least one of the adhesive layers contains <1>); The composition constituting the substrate layer includes an olefin resin and <1> and/or <2>, and the composition constituting the adhesive layer includes a laminate of an adhesion-imparting resin and <1>; The composition constituting the substrate layer includes an olefin resin and <1> and/or <2>, and the composition constituting the adhesive layer includes a laminate of an adhesion-imparting resin and <2> (but at least among the substrate layer and the adhesive layer 1 layer contains <1>); The composition constituting the substrate layer includes an olefin resin and <1>, and the composition constituting the adhesive layer includes an adhesion-imparting resin and a laminate of <1> and/or <2>; The composition constituting the substrate layer includes an olefin resin and <2>, and the composition constituting the adhesive layer includes an adhesion-imparting resin and a laminate of <1> and/or <2> (however, at least among the substrate layer and the adhesive layer 1 layer contains <1>). The present embodiment is not limited to the combination of the composition constituting the base layer and the composition constituting the adhesive layer. The specific aspects of <1>, <2>, olefin resin, and adhesion-imparting resin in the composition constituting the base layer and the composition constituting the adhesion layer are the same as the above-mentioned specific aspects, respectively. In addition, the composition constituting the substrate layer and the composition constituting the adhesive layer may each contain the above-mentioned additives.

≪各層及積層體的物性≫ [硬度之比[i/ii]] 本實施形態中,基材層的蕭耳A硬度i相對於黏著層的蕭耳A硬度ii之比[i/ii]為1.1以上。若該蕭耳A硬度的比[i/ii]小於1.1,則基材層作為對於黏著層的支撐體之功能受損,黏著層變得難以固定在基材層,在將積層體使用於各種用途之際會產生不良狀況。上述比[i/ii]雖因應用途而較佳的值不同,但由可將黏著層固定在基材層,且容易貼附及剝離積層體之觀點而言,較佳為1.2以上,更佳為1.3以上。又,上述比[i/ii]的上限因應用途而異,因此無法統一地規定,但例如可定為3.3以下。≪Physical properties of each layer and laminate≫ [Ratio of hardness [i/ii]] In this embodiment, the ratio [i/ii] of the Shore A hardness i of the base layer to the Shore A hardness ii of the adhesive layer is 1.1 or more. If the ratio [i/ii] of the Shore A hardness is less than 1.1, the function of the base layer as a support for the adhesive layer is impaired, and the adhesive layer becomes difficult to be fixed to the base layer. Undesirable conditions may occur when used. The above-mentioned ratio [i/ii] has different values depending on the application, but from the viewpoint that the adhesive layer can be fixed to the substrate layer and the laminate can be easily attached and peeled off, it is preferably 1.2 or more, more preferably It is 1.3 or more. In addition, the upper limit of the above-mentioned ratio [i/ii] differs depending on the application, and therefore cannot be uniformly specified, but it can be set to 3.3 or less, for example.

[硬度] 上述基材層的蕭耳A硬度i只要可滿足上述硬度之比[i/ii]則未被限制。另一方面,由可適當地顯示作為基材層的性能、及積層體的貼附及剝離的容易性之觀點而言,基材層的蕭耳A硬度i較佳為60~100,更佳為70~98。 上述黏著層的蕭耳A硬度ii只要可滿足上述硬度之比[i/ii]則未被限制。另一方面,由與基材層的接著性、不易產生殘膠、對被接著材料的貼附及剝離的容易性之觀點而言,黏著層的蕭耳A硬度ii較佳為30~80,更佳為40~70。 此外,蕭耳A硬度,更詳細而言,係根據實施例所記載之方法而測定之值。[hardness] The Shore A hardness i of the substrate layer is not limited as long as it satisfies the hardness ratio [i/ii]. On the other hand, from the viewpoint that the performance as a base layer and the ease of attaching and peeling of the laminate can be appropriately exhibited, the Shore A hardness i of the base layer is preferably 60-100, more preferably It is 70~98. The Shore A hardness ii of the adhesive layer is not limited as long as it satisfies the hardness ratio [i/ii]. On the other hand, from the viewpoints of adhesion to the substrate layer, resistance to adhesive residue, and ease of attaching and peeling to the material to be bonded, the Shore A hardness ii of the adhesive layer is preferably 30 to 80. More preferably, it is 40-70. In addition, the Shaw A hardness, in more detail, is a value measured according to the method described in the examples.

[黏著層的儲存模數] 本實施形態中,黏著層在23℃的儲存模數E’(23℃)相對於在60℃的儲存模數E’(60℃)之比[E’(23℃)/E’(60℃)],較佳為2以上。 本實施形態中,藉由黏著層包含上述的嵌段共聚物或其氫化物,上述儲存模數的比[E’(23℃)/E’(60℃)]變得容易達到2以上。一般而言,黏著力在變得愈高溫時會愈降低,但本實施形態中,只要該儲存模數的比[E’(23℃)/E’(60℃)]為2以上,則從23℃至60℃的剝離強度的降低程度會變小,成為即使在高溫亦不易剝落且不易產生殘膠之傾向。 在本實施形態中,黏著層的上述儲存模數的比[E’(23℃)/E’(60℃)]係藉由調整黏著層的組成(上述的黏著賦予樹脂、上述的嵌段共聚物或其氫化物、上述的非脂環式骨架嵌段共聚物及其氫化物、及其他樹脂成分的種類及含量)等,而亦能為2.5以上,甚至為3.0以上。 此外,儲存模數,更詳細而言,係根據實施例所記載之方法而測定之值。[Storage modulus of adhesive layer] In this embodiment, the ratio of the storage modulus E'(23°C) of the adhesive layer at 23°C to the storage modulus E'(60°C) at 60°C [E'(23°C)/E'(60°C) )], preferably 2 or more. In this embodiment, since the adhesive layer contains the above-mentioned block copolymer or its hydrogenated product, the above-mentioned storage modulus ratio [E'(23°C)/E'(60°C)] easily becomes 2 or more. Generally speaking, the adhesive force decreases as the temperature becomes higher, but in this embodiment, as long as the storage modulus ratio [E'(23°C)/E'(60°C)] is 2 or more, the At 23°C to 60°C, the degree of peel strength decreases, and it tends to be less likely to peel off even at high temperatures and less likely to produce residual glue. In this embodiment, the ratio [E'(23°C)/E'(60°C)] of the above-mentioned storage modulus of the adhesive layer is adjusted by adjusting the composition of the adhesive layer (the above-mentioned adhesion imparting resin, the above-mentioned block copolymerization The type and content of the above-mentioned non-alicyclic skeleton block copolymer and its hydrogenated product, and other resin components), etc., can also be 2.5 or more, or even 3.0 or more. In addition, the storage modulus, in more detail, is a value measured according to the method described in the examples.

[tanδ強度] 上述的嵌段共聚物或其氫化物可顯示優異的制振性。因此,基材層含有嵌段共聚物或其氫化物之情形,基材層的tanδ強度在23℃的溫度中較佳能成為0.05以上,更佳能成為0.10以上,在40℃的溫度中較佳能成為0.05以上,更佳能成為0.10以上,在60℃的溫度中較佳能成為0.05以上,更佳能成為0.10以上。 又,黏著層含有嵌段共聚物或其氫化物之情形,黏著層的tanδ強度,在23℃的溫度中較佳能成為0.10以上,更佳能成為0.15以上,再佳能成為0.18以上,在40℃的溫度中較佳能成為0.10以上,更佳能成為0.15以上,再佳能成為0.18以上,又再佳能成為0.25以上,在60℃的溫度中較佳能成為0.10以上,更佳能成為0.15以上,再佳能成為0.18以上。 又,已貼附積層體的被接著體的損耗係數,相較於未貼附積層體的被接著體的損耗係數,可期待較佳為變大0.05以上,更佳為變大0.10以上,再佳為變大0.15以上。尤其,在基材層及黏著層兩者中含有嵌段共聚物或其氫化物之情形,已貼附積層體的被接著體的損耗係數,相較於未貼附積層體的被接著體的損耗係數,可期待較佳為變大0.10以上,更佳為變大0.15以上,再佳為變大0.20以上。 此外,tanδ強度,更詳細而言,係根據實施例所記載之方法而測定之值。[tanδ intensity] The above-mentioned block copolymer or its hydrogenated product can exhibit excellent vibration damping properties. Therefore, when the base layer contains a block copolymer or its hydrogenated product, the tanδ strength of the base layer is preferably at least 0.05 at a temperature of 23°C, more preferably at least 0.10, and preferably at a temperature of 40°C. 0.05 or more, more preferably 0.10 or more, preferably 0.05 or more at a temperature of 60°C, more preferably 0.10 or more. In addition, when the adhesive layer contains a block copolymer or its hydrogenated product, the tanδ strength of the adhesive layer is preferably 0.10 or more at a temperature of 23°C, more preferably 0.15 or more, and still more preferably 0.18 or more, at 40°C The temperature is preferably 0.10 or more, more Canon is 0.15 or more, then Canon is 0.18 or more, and then Canon is 0.25 or more, at a temperature of 60°C, it is preferably 0.10 or more, more Canon is 0.15 or more, and further Canon is 0.18 or more . In addition, the loss factor of the adherend to which the laminated body has been attached is expected to be preferably greater than 0.05, more preferably 0.10 or greater than the loss factor of the adherend to which the laminated body is not attached. Preferably, it becomes larger than 0.15. In particular, when both the base layer and the adhesive layer contain a block copolymer or its hydrogenated product, the loss coefficient of the adherend with the laminated body is compared with that of the adherend without the laminated body. The loss coefficient is expected to be preferably increased by 0.10 or more, more preferably increased by 0.15 or more, and still more preferably increased by 0.20 or more. In addition, the tanδ intensity is, in more detail, a value measured according to the method described in the examples.

[剝離強度] 在本實施形態中,積層體的剝離強度係將丙烯酸樹脂板作為被接著體,以積層體的黏著層與被接著體面對接觸之方式貼合,根據JIS Z 0237(2009年)所測定之180度剝離強度,在測定溫度23℃中較佳可成為5.0N/25mm以上,更佳可成為6.0N/25mm以上。又,同條件中之剝離強度在測定溫度60℃中較佳可成為2.0N/25mm以上,更佳可成為2.5N/25mm以上。一般而言,黏接著力在變得愈高溫時會愈降低,但本實施形態中,基材層或黏著層的一者或兩者中包含上述的嵌段共聚物或其氫化物,且將其含量調整成適當的範圍等,藉此變得容易達成上述黏著力。 又,在本實施形態中,積層體在60℃的上述剝離強度相對於在23℃的上述剝離強度之比亦能為0.3以上,甚至0.4以上。該剝離強度的比,尤其係藉由調整黏著層的組成(上述的嵌段共聚物或其氫化物、上述的黏著賦予樹脂及任意成分的種類、含量)等而變得容易達成。 此外,剝離強度,更詳細而言,係根據實施例所記載之方法而測定之值。[Peel strength] In this embodiment, the peel strength of the laminate is that the acrylic resin board is used as the adherend, and the adhesive layer of the laminate is in contact with the adherend. It is measured in accordance with JIS Z 0237 (2009). The 180-degree peel strength is preferably 5.0N/25mm or more at a measurement temperature of 23°C, and more preferably 6.0N/25mm or more. In addition, the peel strength under the same conditions is preferably 2.0N/25mm or more at a measurement temperature of 60°C, and more preferably 2.5N/25mm or more. Generally speaking, the adhesive force decreases as the temperature becomes higher, but in this embodiment, one or both of the base material layer or the adhesive layer contains the above-mentioned block copolymer or its hydrogenated product, and the The content is adjusted to an appropriate range, etc., thereby making it easier to achieve the above-mentioned adhesive force. Furthermore, in this embodiment, the ratio of the peel strength at 60°C of the laminate to the peel strength at 23°C can also be 0.3 or more, or even 0.4 or more. The ratio of the peeling strength can be easily achieved by adjusting the composition of the adhesive layer (the above-mentioned block copolymer or its hydrogenated product, the above-mentioned type and content of the adhesion-imparting resin and optional components) and the like. In addition, the peel strength, in more detail, is a value measured according to the method described in the examples.

≪積層體的尺寸≫ 本實施形態的構成積層體的黏著層的厚度並無特別限制,但通常較佳為1μm以上且200μm以下,更佳為5μm以上且150μm以下,再佳為5μm以上且100μm以下。 另一方面,基材層的厚度並無特別的限制,只要因應積層體的用途而指定即可,但就適當地發揮黏著層的黏著力而言,較佳為500μm以下,更佳為200μm以下,再佳為100μm以下。又,基材層的厚度通常為5μm以上。≪The size of the laminated body≫ The thickness of the adhesive layer constituting the laminate of the present embodiment is not particularly limited, but it is usually preferably 1 μm or more and 200 μm or less, more preferably 5 μm or more and 150 μm or less, and still more preferably 5 μm or more and 100 μm or less. On the other hand, the thickness of the substrate layer is not particularly limited, as long as it is specified according to the purpose of the laminate, but in terms of properly exerting the adhesive force of the adhesive layer, it is preferably 500 μm or less, more preferably 200 μm or less , More preferably 100μm or less. In addition, the thickness of the base layer is usually 5 μm or more.

≪用途≫ 本實施態樣中,積層體可使用於各種用途。 作為用途,例如為包含積層體的接著劑,作為接著劑,可列舉感壓接著劑。又,可列舉包含上述感壓接著劑之黏著膠帶、黏著片、表面保護薄膜。≪Use≫ In this embodiment, the laminate can be used for various applications. The use is, for example, an adhesive containing a laminate, and examples of the adhesive include a pressure-sensitive adhesive. In addition, adhesive tapes, adhesive sheets, and surface protection films containing the above-mentioned pressure-sensitive adhesive can be cited.

又,作為上述接著劑,可列舉熱熔接著劑。 上述熱熔接著劑,可列舉例如: 在一次性尿布、大人用失禁產品、衛生棉、床墊、繃帶、外科手術單(surgical drape)、單面膠帶、雙面膠帶、轉印膠帶、標籤、塑膠片、不織布片、紙片、紙板、書籍、過濾器或具備包裝的物品中的使用; 在墊片密封劑(尤其,汽車、電機零件、技術照明領域)中的使用; 在多層薄膜的可再密封之托盤的製造中的使用; 在包含郵寄容器素材的物品中的使用; 在防振材料、緩衝材料、衝擊吸收材料、低反彈材料、防墜材料、免震材料、防震材料、或制振材料(較佳為消音材料,更佳為汽車產業中的衰減或消音墊、襯墊、片材及膠帶)中的使用; 在電子裝置(尤其,LCD顯示器、LED顯示器、觸控螢幕、或可撓性薄膜太陽能電池)中的使用; 在經皮性藥物傳遞系統中的使用; 在導管(較佳為冷卻線圈)、電子零件(較佳為發光零件、電腦設備、手機、平板電腦、觸控螢幕、汽車技術高傳真系統、及聲頻系統)、太陽熱加熱的熱管與水箱之間的結合部、燃料電池及風力機、電腦晶片的製造、光學裝置、電池、機殼、冷卻器、熱交換裝置、電線、纜線、電熱線、冰箱、洗碗機、空調設備、蓄電池、變壓器、雷射設備、功能性衣物、車座位、醫療用設備、防火裝置、電動機、飛機、及列車中之使用; 在3D印刷材料的長絲、用於密封發熱裝置的注封用密封劑或成形密封劑中的使用; 將具有由木材、金屬、聚合物塑膠、玻璃及紡織品所形成之基材的物品進行接合之用途上的使用;給水塔中之對外面的接合之用途上的使用;作為在鞋類的製造中或窗的製造中之釉料的使用、在門及建築板的製造中或可攜式裝置及顯示器的製造中的使用; 在裝訂、木材接著、平面層壓、可撓性包裝、包覆貼合(profile wrapping)、封邊、紡織品層壓、低壓成形、及鞋子中的使用; 在書籍、包裝薄膜、剛性面板、家具、窗、鞋類、汽車前照燈、汽車飾件或用於衣物之經接合布料/織物的製造中的使用; 在裝飾薄膜中的使用。 [實施例]Moreover, as said adhesive agent, a hot melt adhesive agent can be mentioned. The above-mentioned hot melt adhesives include, for example: Used in disposable diapers, adult incontinence products, sanitary napkins, mattresses, bandages, surgical drape (surgical drape), single-sided tape, double-sided tape, transfer tape, labels, plastic sheets, non-woven sheets, paper sheets, cardboard, Use in books, filters or articles with packaging; Use in gasket sealants (especially in the fields of automobiles, motor parts, and technical lighting); Use in the manufacture of multi-layer film resealable trays; Use in articles containing materials for mailing containers; In anti-vibration materials, cushioning materials, shock-absorbing materials, low-rebound materials, anti-falling materials, shock-proof materials, shock-proof materials, or vibration-damping materials (preferably sound-absorbing materials, more preferably attenuating or sound-absorbing mats in the automotive industry, Liner, sheet and tape); Use in electronic devices (especially LCD displays, LED displays, touch screens, or flexible thin-film solar cells); Use in transdermal drug delivery systems; Between conduits (preferably cooling coils), electronic parts (preferably light-emitting parts, computer equipment, mobile phones, tablets, touch screens, automotive technology high-fidelity systems, and audio systems), solar heating heat pipes and water tanks Combinations of fuel cells and wind turbines, computer chip manufacturing, optical devices, batteries, cabinets, coolers, heat exchange devices, wires, cables, heating wires, refrigerators, dishwashers, air-conditioning equipment, batteries, transformers , Laser equipment, functional clothing, car seats, medical equipment, fire protection devices, electric motors, airplanes, and trains; Use in filaments of 3D printing materials, sealants or molding sealants for sealing heating devices; The use of joining objects with substrates formed of wood, metal, polymer plastic, glass and textiles; the use of joining to the outside in the water supply tower; as in the manufacture of footwear Or use of glaze in the manufacture of windows, in the manufacture of doors and building panels, or in the manufacture of portable devices and displays; Used in binding, wood bonding, flat lamination, flexible packaging, profile wrapping, edge banding, textile lamination, low-pressure forming, and shoes; Use in the manufacture of books, packaging films, rigid panels, furniture, windows, footwear, car headlights, car trims, or bonded fabrics/fabrics for clothing; Use in decorative film. [Example]

以下,藉由實施例及比較例而更具體地說明本發明,但本發明不受限於此等。Hereinafter, the present invention will be explained more specifically with examples and comparative examples, but the present invention is not limited to these.

<嵌段共聚物及氫化物> 將由後述的製造例所得之嵌段共聚物或氫化物的物性評價方法揭示於以下。 (1)聚合物嵌段(A)的含量 將氫化前的嵌段共聚物溶解於CDCl3 ,進行1 H-NMR測定[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃],由來自苯乙烯之峰強度與來自二烯之峰強度的比,算出聚合物嵌段(A)的含量。<Block copolymer and hydrogenated product> The physical property evaluation method of the block copolymer or hydrogenated product obtained by the manufacturing example mentioned later is demonstrated below. (1) Content of polymer block (A) The block copolymer before hydrogenation was dissolved in CDCl 3 and measured by 1 H-NMR [device: "ADVANCE 400 Nano bay" (manufactured by Bruker), measurement temperature: 30 °C], the content of the polymer block (A) is calculated from the ratio of the peak intensity derived from styrene to the peak intensity derived from diene.

(2)重量平均分子量(Mw) 藉由下述條件的凝膠滲透層析法(GPC)測定,針對嵌段共聚物的氫化物,求取聚苯乙烯換算的重量平均分子量(Mw)。 (GPC測定裝置及測定條件) ・裝置:GPC裝置「HLC-8020」(Tosoh股份有限公司製) ・分離管柱:將Tosoh股份有限公司製的「TSKgel GMHXL」、「G4000HXL」及「G5000HXL」串聯連接。 ・離析液:四氫呋喃 ・離析液流量:0.7mL/min ・樣本濃度:5mg/10mL ・管柱溫度:40℃ ・偵測器:示差折射率(RI)偵測器 ・檢量線:使用標準聚苯乙烯而作成(2) Weight average molecular weight (Mw) According to the gel permeation chromatography (GPC) measurement under the following conditions, the weight average molecular weight (Mw) in terms of polystyrene is calculated for the hydrogenated product of the block copolymer. (GPC measuring device and measuring conditions) ・Device: GPC device "HLC-8020" (manufactured by Tosoh Co., Ltd.) ・Separation column: "TSKgel GMHXL", "G4000HXL" and "G5000HXL" manufactured by Tosoh Co., Ltd. are connected in series. ・Separation liquid: Tetrahydrofuran ・Separate flow rate: 0.7mL/min ・Sample concentration: 5mg/10mL ・Column temperature: 40℃ ・Detector: Differential refractive index (RI) detector ・Calibration line: made using standard polystyrene

(3)聚合物嵌段(B)中之氫化率 藉由1 H-NMR測定,由來自異戊二烯及/或丁二烯的殘留烯烴之峰面積與來自乙烯、丙烯及/或丁烯之峰面積的比而算出。 ・裝置:核磁共振裝置「ADVANCE 400 Nano bay」(Bruker公司製) ・溶媒:CDCl3 (3) The hydrogenation rate in the polymer block (B) was measured by 1 H-NMR, and the peak area of the residual olefin derived from isoprene and/or butadiene was compared with the peak area derived from ethylene, propylene and/or butene. Calculated by the ratio of the peak area.・Device: Nuclear magnetic resonance device "ADVANCE 400 Nano bay" (manufactured by Bruker) ・Solvent: CDCl 3

(4)聚合物嵌段(B)中之乙烯基鍵結量 將氫化前的嵌段共聚物溶解於CDCl3 ,進行1 H-NMR測定[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃]。由來自異戊二烯及/或丁二烯之結構單元的全部峰面積,與異戊二烯結構單元中之3,4-鍵結單元及1,2-鍵結單元、丁二烯結構單元中之1,2-鍵結單元、或者在來自異戊二烯與丁二烯的混合物之結構單元之情形下係對應於各前述鍵結單元的峰面積之比,算出乙烯基鍵結量(3,4-鍵結單元與1,2-鍵結單元的含量的合計)。(4) Vinyl bonding amount in polymer block (B) The block copolymer before hydrogenation is dissolved in CDCl 3 and measured by 1 H-NMR [device: "ADVANCE 400 Nano bay" (manufactured by Bruker) , Measurement temperature: 30℃]. From the total peak area of the structural unit derived from isoprene and/or butadiene, and the 3,4-bonding unit, 1,2-bonding unit and butadiene structural unit in the isoprene structural unit In the 1,2-bonding unit, or in the case of a structural unit derived from a mixture of isoprene and butadiene, the ratio of the peak area of each aforementioned bonding unit is calculated, and the vinyl bonding amount is calculated ( The total content of 3,4-bonding unit and 1,2-bonding unit).

(5)聚合物嵌段(B)中的脂環式骨架(X)的含量 將氫化前的嵌段共聚物600mg及Cr(acac)3 40mg溶解於CDCl3 4mL,使用10mmNMR管,進行定量13 C-NMR測定(脈衝程式:zgig、Inverse gated 1H decoupling法)[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃],利用下述的方法,算出聚合物嵌段(B)中的脂環式骨架X、X1、及X2各自的含量。 此外,表3中,X、X1、及X2表示以下脂環式骨架。 X:具有以下(i)~(vi)的取代基的組合之脂環式骨架 X1:具有以下(i)、(iv)的取代基的組合之脂環式骨架 X2:具有以下(ii)、(iii)、(v)、(iv)的取代基的組合之脂環式骨架 (i):R1 =氫原子、R2 =氫原子、R3 =氫原子;(1,2Bd+Bd) (ii):R1 =氫原子、R2 =甲基、R3 =氫原子;(1,2Bd+1,2Ip) (iii):R1 =氫原子、R2 =氫原子、R3 =甲基;(1,2Bd+3,4Ip) (iv):R1 =甲基、R2 =氫原子、R3 =氫原子;(1,2Ip+Bd) (v):R1 =甲基、R2 =甲基、R3 =氫原子;(1,2Ip+1,2Ip) (vi):R1 =甲基、R2 =氫原子、R3 =甲基;(1,2Ip+3,4Ip)(5) The content of the alicyclic skeleton (X) in the polymer block (B). Dissolve 600 mg of the block copolymer before hydrogenation and 40 mg of Cr(acac) 3 in 4 mL of CDCl 3 and use a 10 mm NMR tube to quantify 13 C-NMR measurement (pulse program: zgig, Inverse gated 1H decoupling method) [device: "ADVANCE 400 Nano bay" (manufactured by Bruker), measurement temperature: 30°C], the polymer block was calculated by the following method ( The content of each of the alicyclic skeleton X, X1, and X2 in B). In addition, in Table 3, X, X1, and X2 represent the following alicyclic skeletons. X: an alicyclic skeleton having a combination of the following (i) to (vi) substituents X1: an alicyclic skeleton having a combination of the following (i) and (iv) substituents X2: having the following (ii), (iii) The alicyclic skeleton (i) of the combination of substituents of (v) and (iv): R 1 = hydrogen atom, R 2 = hydrogen atom, R 3 = hydrogen atom; (1,2Bd+Bd) (ii): R 1 = hydrogen atom, R 2 = methyl, R 3 = hydrogen atom; (1,2Bd+1,2Ip) (iii): R 1 = hydrogen atom, R 2 = hydrogen atom, R 3 = Methyl; (1,2Bd+3,4Ip) (iv): R 1 = methyl, R 2 = hydrogen atom, R 3 = hydrogen atom; (1,2Ip+Bd) (v): R 1 = methyl , R 2 = methyl, R 3 = hydrogen atom; (1,2Ip+1,2Ip) (vi): R 1 = methyl, R 2 = hydrogen atom, R 3 = methyl; (1,2Ip+3 ,4Ip)

[算出方法] 將各峰與所來自的結構揭示於表1-1。若將各峰的積分值設為a~g,則各結構的積分值係成為如表1-2般,X、X1、X2的含量可分別以(a+g-c)/(a+b+c-d+e/2+2f)、(g-c)/(a+b+c-d+e/2+2f)、a/(a+b+c-d+e/2+2f)而算出。[Calculation method] The peaks and their derived structures are disclosed in Table 1-1. If the integral value of each peak is set as a to g, the integral value of each structure becomes as shown in Table 1-2, and the contents of X, X1, and X2 can be expressed as (a+gc)/(a+b+c -d+e/2+2f), (gc)/(a+b+c-d+e/2+2f), a/(a+b+c-d+e/2+2f).

[表1] 表1-2 表1-1 結構 積分值 峰(ppm) 結構 積分值 St d-f 108~110 X2 a 1,4Ip f 110~113 3,4Ip+1,2Ip+X1 b 3,4Ip+1,2Ip b-(g-c) 113~116 1,2Bd c 1.4Bd (e-(d-f)×4)/2 122~127 1,4Ip+St d 1,2Bd c 127~132 1,4Bd×2+St×4 e X1 g-c 132~137 1,4Ip f X2 a 142~145 1,2Bd+X1 g 總計 a+b+c-d+e/2+2f [Table 1] Table 1-2 Table 1-1 structure Integral value Peak (ppm) structure Integral value St df 108~110 X2 a 1,4Ip f 110~113 3,4Ip+1,2Ip+X1 b 3,4Ip+1,2Ip b-(gc) 113~116 1,2Bd c 1.4Bd (e-(df)×4)/2 122~127 1,4Ip+St d 1,2Bd c 127~132 1,4Bd×2+St×4 e X1 gc 132~137 1,4Ip f X2 a 142~145 1,2Bd+X1 g total a+b+c-d+e/2+2f

(6)13 C-NMR的峰面積比 針對製造例1及比較製造例1的氫化物,進行上述定量13 C-NMR測定[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃,溶媒:CDCl3 ],算出峰面積比[化學位移值50.0~52.0ppm的峰面積]/[化學位移值43.0~45.0ppm的峰面積]。(6) Peak area ratio of 13 C-NMR For the hydrides of Production Example 1 and Comparative Production Example 1, the above-mentioned quantitative 13 C-NMR measurement was performed [device: "ADVANCE 400 Nano bay" (manufactured by Bruker), and measurement temperature: 30°C, solvent: CDCl 3 ], and calculate the peak area ratio [peak area with a chemical shift value of 50.0-52.0 ppm]/[peak area with a chemical shift value of 43.0-45.0 ppm].

(7)tanδ的峰頂溫度、峰頂強度、tanδ成為1.0以上的溫度區域的最大幅度、在20℃及30℃的tanδ強度 為了以下的測定,將嵌段共聚物的氫化物在溫度230℃、壓力10MPa加壓3分鐘,藉此製作厚度1.0mm的單層片。將該單層片裁切成圓板形狀,將此作為試驗片。 測定中,基於JIS K 7244-10(2005年),作為平行平板振動流變計,使用圓板的直徑為8mm之應變控制型動態黏彈性裝置「ARES-G2」(TA Instruments Japan公司製)。 藉由上述試驗片,完全填充2片平板之間的間隙,以應變量0.1%,對於上述試驗片以1Hz的頻率給予振動,以3℃/分鐘的定速從-70℃升溫至100℃為止。直到剪切損耗模數及剪切儲存模數的測定值無變化為止,保持上述試驗片與圓板的溫度,求取tanδ的峰強度的最大值(峰頂強度)及獲得該最大值之溫度(峰頂溫度)。又,求取tanδ成為1.0以上的溫度區域的最大幅度、在20℃及30℃的tanδ強度。該值愈大,表示制振性愈優異。(7) Peak top temperature of tanδ, peak top intensity, the maximum width of the temperature range where tanδ becomes 1.0 or more, and the tanδ intensity at 20°C and 30°C For the following measurement, the hydrogenated product of the block copolymer was pressed at a temperature of 230°C and a pressure of 10 MPa for 3 minutes to produce a single-layer sheet with a thickness of 1.0 mm. This single-layer sheet was cut into a circular plate shape, and this was used as a test piece. In the measurement, based on JIS K 7244-10 (2005), a strain-controlled dynamic viscoelastic device "ARES-G2" (manufactured by TA Instruments Japan Co., Ltd.) with a circular plate diameter of 8 mm was used as a parallel plate vibration rheometer. With the above test piece, the gap between the two plates is completely filled, and the strain is 0.1%. The above test piece is vibrated at a frequency of 1 Hz, and the temperature is raised from -70°C to 100°C at a constant rate of 3°C/min. . Until the measured values of the shear loss modulus and the shear storage modulus do not change, keep the temperature of the test piece and the disc, and obtain the maximum value of the peak intensity of tanδ (peak top intensity) and the temperature at which the maximum value is obtained (Peak top temperature). In addition, the tanδ intensity at 20°C and 30°C, which is the maximum width of the temperature region where tanδ becomes 1.0 or more, is obtained. The larger the value, the better the vibration damping performance.

[製造例1] 氫化物(H-TPE-1)的製造 在已進行氮取代且乾燥的耐壓容器中,裝填環己烷50kg作為溶媒,裝填濃度10.5質量%的二級丁基鋰的環己烷溶液87g(二級丁基鋰的實質添加量:9.1g)作為陰離子聚合起始劑。 將耐壓容器內升溫至50℃後,添加苯乙烯(1)1.0kg,使其聚合1小時,以容器內溫度50℃,添加作為路易斯鹼的2,2-二(2-四氫呋喃基)丙烷(DTHFP)63g,將異戊二烯8.16kg及丁二烯6.48kg的混合液利用表2所示之平均二烯進料速度,耗費5小時添加後,使其聚合2小時,再添加苯乙烯(2)1.0kg,使其聚合1小時,藉此獲得包含聚苯乙烯-聚(異戊二烯/丁二烯)-聚苯乙烯三嵌段共聚物的反應液。 在該反應液中,在氫氣氣體環境下添加由辛酸鎳及三甲基鋁所形成之戚格勒系氫化觸媒,以氫壓力1MPa、80℃的條件使其反應5小時。使該反應液放置冷卻及釋放壓力後,藉由水洗而去除上述觸媒,使其真空乾燥,藉此獲得聚苯乙烯-聚(異戊二烯/丁二烯)-聚苯乙烯三嵌段共聚物的氫化物(以下,有時稱為H-TPE-1)。 關於各原料及其使用量,揭示於表2。又,將前述物性評價的結果揭示於表3。[Manufacturing Example 1] Manufacturing of hydride (H-TPE-1) In a dry pressure vessel that has been substituted with nitrogen, 50 kg of cyclohexane is filled as a solvent, and 87 g of a cyclohexane solution of secondary butyl lithium with a concentration of 10.5% by mass (the actual amount of secondary butyl lithium added: 9.1 g) As an anionic polymerization initiator. After raising the temperature in the pressure vessel to 50°C, add 1.0 kg of styrene (1) to polymerize for 1 hour, and add 2,2-bis(2-tetrahydrofuryl)propane as the Lewis base at a temperature of 50°C in the vessel (DTHFP) 63g, a mixture of 8.16kg isoprene and 6.48kg butadiene was added using the average diene feed rate shown in Table 2. After 5 hours of addition, it was polymerized for 2 hours, and then styrene was added (2) 1.0 kg was polymerized for 1 hour to obtain a reaction liquid containing a polystyrene-poly(isoprene/butadiene)-polystyrene triblock copolymer. In this reaction solution, a Chigler-based hydrogenation catalyst composed of nickel octoate and trimethylaluminum was added in a hydrogen gas atmosphere, and the reaction was carried out for 5 hours under the conditions of a hydrogen pressure of 1 MPa and 80°C. After allowing the reaction solution to cool down and releasing the pressure, the catalyst was removed by washing with water and dried in a vacuum, thereby obtaining a polystyrene-poly(isoprene/butadiene)-polystyrene triblock The hydrogenated product of the copolymer (hereinafter, sometimes referred to as H-TPE-1). About each raw material and its usage amount, it is shown in Table 2. In addition, the results of the aforementioned physical property evaluation are shown in Table 3.

[製造例2] 氫化物(H-TPE-2)的製造 除了將各成分及其等的使用量、以及反應條件變更成如同表2所記載以外,與製造例1同樣地進行,製造嵌段共聚物的氫化物(H-TPE-2)。又,將前述物性評價的結果揭示於表3。 [製造例3] 氫化物(H-TPE-3)的製造 除了將各成分及其等的使用量、以及反應條件變更成如同表2所記載以外,與製造例1同樣地進行,製造嵌段共聚物的氫化物(H-TPE-3)。又,將前述物性評價的結果揭示於表3。 [製造例4] 氫化物(H-TPE-4)的製造 除了將各成分及其等的使用量、以及反應條件變更成如同表2所記載以外,與製造例1同樣地進行,製造嵌段共聚物的氫化物(H-TPE-4)。又,將前述物性評價的結果揭示於表3。[Manufacturing Example 2] Manufacturing of hydride (H-TPE-2) Except for changing the usage amount of each component and the like, and reaction conditions as described in Table 2, the same procedure as in Production Example 1 was carried out to produce a hydrogenated block copolymer (H-TPE-2). In addition, the results of the aforementioned physical property evaluation are shown in Table 3. [Manufacturing Example 3] Manufacturing of hydride (H-TPE-3) Except for changing the usage amount of each component and the like, and the reaction conditions as described in Table 2, the same procedure as in Production Example 1 was carried out to produce a hydrogenated block copolymer (H-TPE-3). In addition, the results of the aforementioned physical property evaluation are shown in Table 3. [Manufacturing Example 4] Manufacturing of hydride (H-TPE-4) Except for changing the usage amount of each component and the like, and reaction conditions as described in Table 2, the same procedure as in Production Example 1 was carried out to produce a hydrogenated block copolymer (H-TPE-4). In addition, the results of the aforementioned physical property evaluation are shown in Table 3.

[比較製造例1] 氫化物(H-TPE-1’)的製造 除了將各成分及其等的使用量、以及反應條件變更成如同表2所記載以外,與製造例1同樣地進行,製造嵌段共聚物的氫化物(H-TPE-1’)。又,將前述物性評價的結果揭示於表3。[Comparative Manufacturing Example 1] Manufacturing of hydride (H-TPE-1’) Except for changing the usage amounts of the components and the like, and the reaction conditions as described in Table 2, the same procedure as in Production Example 1 was carried out to produce a hydrogenated block copolymer (H-TPE-1'). In addition, the results of the aforementioned physical property evaluation are shown in Table 3.

[表2] 製造例 比較製造例 1 2 3 4 1 嵌段共聚物的氫化物 H-TPE-1 H-TPE-2 H-TPE-3 H-TPE-4 H-TPE-1’ 使用量 (kg) 環己烷 50 50 50 50 50 二級丁基鋰 (10.5質量%環己烷溶液) 0.087 0.081 0.087 0.087 0.166 (A) 苯乙烯(1) 1.0 0.67 0.5 1.0 1.5 苯乙烯(2) 1.0 0.67 1.5 1.0 1.5 (B) 異戊二烯 8.16 8.57 8.16 14.64 13.64 丁二烯 6.48 6.74 6.48 0 0 路易斯鹼 DTHFP 0.063 - - 0.032 0 四氫呋喃 - 0.33 0.31 - 0 反應條件 二烯聚合溫度(℃) 50 50 40 40 50 二烯進料時間(h) 5 5 5 5 5 活性末端每1mol的平均二烯進料速度(kg/h) 20.5 23 20.5 20.5 10.0 [Table 2] Manufacturing example Comparative manufacturing example 1 2 3 4 1 Hydride of block copolymer H-TPE-1 H-TPE-2 H-TPE-3 H-TPE-4 H-TPE-1' Usage (kg) Cyclohexane 50 50 50 50 50 Secondary butyl lithium (10.5 mass% cyclohexane solution) 0.087 0.081 0.087 0.087 0.166 (A) Styrene (1) 1.0 0.67 0.5 1.0 1.5 Styrene (2) 1.0 0.67 1.5 1.0 1.5 (B) Isoprene 8.16 8.57 8.16 14.64 13.64 Butadiene 6.48 6.74 6.48 0 0 Lewis base DTHFP 0.063 - - 0.032 0 Tetrahydrofuran - 0.33 0.31 - 0 Reaction conditions Diene polymerization temperature (℃) 50 50 40 40 50 Diene feed time (h) 5 5 5 5 5 Average feed rate of diene per 1 mol of active end (kg/h) 20.5 twenty three 20.5 20.5 10.0

[表3] 製造例 比較製造例 1 2 3 4 1 所使用的嵌段共聚物的氫化物 H-TPE-1 H-TPE-2 H-TPE-3 H-TPE-4 H-TPE-1’ 聚合物嵌段(A)的結構單元 St St St St St 構成聚合物嵌段(B)之成分 Ip/Bd Ip/Bd Ip/Bd Ip Ip 構成聚合物嵌段(B)之成分的質量比 55/45 55/45 55/45 100 100 構成聚合物嵌段(B)之成分的莫耳比 50/50 50/50 50/50 100 100 聚合物結構 A/B/A A/B/A A/B/A A/B/A A/B/A 聚合物嵌段(A)的含量(質量%) 12 8 12 12 18 嵌段共聚物的氫化物的重量平均分子量 167,000 166,000 163,000 150,000 96,000 聚合物嵌段(B)中之氫化率(莫耳%) 95 92 91 86 99 聚合物嵌段(B)中之乙烯基鍵結量(莫耳%) 76 60 64 83 4 嵌段(B)中的X1或X1的氫化體的含量(莫耳%) 5 0.2 0.2 0 0 嵌段(B)中的X2或X2的氫化體的含量(莫耳%) 9.9 1.7 1.7 5.2 0 嵌段(B)中的X或X的氫化體的含量(莫耳%) 14.9 1.9 1.9 5.2 0 氫化後的13 C-NMR的面積比 [50~52ppm的峰面積]/[43~45ppm的峰面積] 0.21 0 0 0 0 tanδ的峰頂溫度(℃) 14.9 -25 -21 31.9 -52.7 tanδ的峰頂強度 2.24 2.05 2.23 2.20 2.01 成為tanδ≧1之溫度區域的最大幅度(℃) 17.9 14 14.6 20.7 8.6 20℃、1Hz中之tanδ強度 1.70 0.07 0.09 0.29 0.03 30℃、1Hz中之tanδ強度 0.81 0.06 0.07 2.03 0.03 [table 3] Manufacturing example Comparative manufacturing example 1 2 3 4 1 Hydrogenated block copolymer used H-TPE-1 H-TPE-2 H-TPE-3 H-TPE-4 H-TPE-1' Structural unit of polymer block (A) St St St St St Components constituting the polymer block (B) Ip/Bd Ip/Bd Ip/Bd Ip Ip The mass ratio of the components constituting the polymer block (B) 55/45 55/45 55/45 100 100 The molar ratio of the components constituting the polymer block (B) 50/50 50/50 50/50 100 100 Polymer structure A/B/A A/B/A A/B/A A/B/A A/B/A Content of polymer block (A) (mass%) 12 8 12 12 18 Weight average molecular weight of hydrogenated block copolymer 167,000 166,000 163,000 150,000 96,000 Hydrogenation rate in polymer block (B) (mol%) 95 92 91 86 99 Vinyl bond amount in polymer block (B) (mol%) 76 60 64 83 4 The content of X1 or X1 hydride in block (B) (mol%) 5 0.2 0.2 0 0 The content of X2 or X2 hydride in block (B) (mol%) 9.9 1.7 1.7 5.2 0 The content of X or X hydride in block (B) (mol%) 14.9 1.9 1.9 5.2 0 13 C-NMR area ratio after hydrogenation [50~52ppm peak area]/[43~45ppm peak area] 0.21 0 0 0 0 Peak top temperature of tanδ (℃) 14.9 -25 -twenty one 31.9 -52.7 Peak top intensity of tanδ 2.24 2.05 2.23 2.20 2.01 Become the maximum range of the temperature zone where tanδ≧1 (℃) 17.9 14 14.6 20.7 8.6 Tanδ intensity at 20℃, 1Hz 1.70 0.07 0.09 0.29 0.03 Tanδ intensity at 30℃, 1Hz 0.81 0.06 0.07 2.03 0.03

製造例1~4的嵌段共聚物的氫化物顯示tanδ的峰頂強度為1.0以上,又在寬廣的溫度區域中顯示tanδ的峰頂溫度,因此可謂為適合在廣泛用途中用作為制振材料。尤其,若相較於比較製造例1,則可知製造例1~4中20℃及30℃的tanδ強度比較高,在室溫附近的制振性優異。The hydrogenated product of the block copolymer of Production Examples 1 to 4 shows a peak top strength of tanδ of 1.0 or more, and a peak top temperature of tanδ in a wide temperature range, so it can be said to be suitable for use as a vibration damping material in a wide range of applications . In particular, when compared with Comparative Production Example 1, it can be seen that in Production Examples 1 to 4, the tanδ strength at 20°C and 30°C is relatively high, and the vibration damping properties near room temperature are excellent.

<積層體> [實施例1~8][比較例1~3] (基材層的製作方法) 將表4所示之基材層的組成,投入塑譜儀(Brabender) (Brabender公司製,「Plastograph EC 50cc混合器」),以汽缸溫度240℃、螺桿旋轉數100rpm進行3分鐘熔融混練後,將所得之組成物進行沖壓成形(240℃,2分鐘),製作基材層的片材(厚度1mm)。<Laminated body> [Examples 1 to 8] [Comparative Examples 1 to 3] (Method of making substrate layer) The composition of the substrate layer shown in Table 4 was put into a Brabender (Brabender company, "Plastograph EC 50cc mixer"), and melted and kneaded at a cylinder temperature of 240°C and a screw rotation number of 100 rpm for 3 minutes. The obtained composition was press-formed (240°C, 2 minutes) to produce a sheet (thickness 1 mm) of the base layer.

(黏著層的製作方法) 將表4所示之黏著層的組成,投入塑譜儀(Brabender公司製,「Plastograph EC 50cc混合器」),以汽缸溫度180℃、螺桿旋轉數100rpm進行3分鐘熔融混練後,將所得之組成物進行沖壓成形(180℃,2分鐘),製作黏著層的片材(厚度1mm)。(Method of making adhesive layer) The composition of the adhesive layer shown in Table 4 was put into a plastic spectrometer (manufactured by Brabender, "Plastograph EC 50cc mixer"), and melted and kneaded at a cylinder temperature of 180°C and a screw rotation number of 100 rpm for 3 minutes. The resulting composition The object was press-formed (180°C, 2 minutes) to produce an adhesive layer sheet (thickness 1 mm).

(積層體的製作方法) 將表4所示之基材層的組成的顆粒投入單軸擠壓機「GM30」(GM Engineering製)的給料斗,將表4所示之黏著層的組成的顆粒投入單軸擠壓機「GM25」(GM Engineering製)的給料斗,使用多歧管模頭(multi-manifold die)作為T型模,以擠壓溫度220℃進行共擠壓,獲得厚度50μm(基材層厚度:35μm,黏著層厚度:15μm)的積層體。(Method of making laminate) The pellets with the composition of the substrate layer shown in Table 4 were put into the hopper of the uniaxial extruder "GM30" (manufactured by GM Engineering), and the pellets with the composition of the adhesive layer shown in Table 4 were put into the uniaxial extruder. The feed hopper of "GM25" (manufactured by GM Engineering) uses a multi-manifold die as a T-die, and performs co-extrusion at an extrusion temperature of 220°C to obtain a thickness of 50 μm (base material layer thickness: 35 μm, Adhesive layer thickness: 15μm) laminate.

[物性評價] 將上述製作的基材層、黏著層及積層體的物性評價方法揭示於以下。 (蕭耳A硬度) 將所得之基材層及黏著層的片材分別重疊6片,作為厚度6mm的硬度測定用試驗片,根據JIS K 6253(2012年),使用自動橡膠硬度計P2-A型(高分子計器製),測定基材層的蕭耳A硬度i、黏著層的蕭耳A硬度ii。將結果揭示於表4。[Physical Property Evaluation] The physical property evaluation methods of the base material layer, the adhesive layer, and the laminate produced above are disclosed below. (Shore A hardness) The obtained substrate layer and the adhesive layer were superimposed on 6 sheets, respectively, and used as a test piece for hardness measurement with a thickness of 6mm. According to JIS K 6253 (2012), an automatic rubber hardness tester P2-A (manufactured by Polymer Tester) was used. ) To measure the Shore A hardness i of the base layer and the Shore A hardness ii of the adhesive layer. The results are shown in Table 4.

(儲存模數、tanδ強度(拉伸、10Hz)) 根據JIS K 7244-4(1999年),進行測定。具體而言,將所得之基材層及黏著層的片材裁切成長度70mm×寬度5mm×厚度1mm者作為樣本,使用「DMA242E」(NETZSCH公司製),在頻率10Hz的條件下,以3℃/分鐘從-70℃升溫至200℃並進行測定,藉此測定在23、60℃中之黏著層的拉伸儲存模數(E’)、基材層及黏著層在23、40、60℃中之tanδ強度。將結果揭示於表4。(Storage modulus, tanδ strength (tensile, 10Hz)) The measurement is performed in accordance with JIS K 7244-4 (1999). Specifically, the obtained substrate layer and adhesive layer sheet was cut into a sample with a length of 70 mm × a width of 5 mm × a thickness of 1 mm, and used "DMA242E" (manufactured by NETZSCH) under a frequency of 10 Hz. ℃/minute is increased from -70℃ to 200℃ and measured to determine the tensile storage modulus (E') of the adhesive layer at 23, 60℃, the substrate layer and the adhesive layer at 23, 40, 60 Tanδ intensity in ℃. The results are shown in Table 4.

(HAZE) 所得之積層體的HAZE係藉由濁度/混濁度計「HR-100」(村上色彩技術研究所股份有限公司製)而測定。將結果揭示於表4。(HAZE) The HAZE of the obtained laminate was measured with a turbidity/turbidity meter "HR-100" (manufactured by Murakami Color Research Institute Co., Ltd.). The results are shown in Table 4.

(剝離強度、殘膠(23℃)) 在丙烯酸擠壓板(商品名 SUMIPEX E,厚度1.5mm,SUMIKA ACRYL販售股份有限公司製),以所得之積層體的黏著層面對接觸丙烯酸樹脂板之方式進行貼附,將切斷成寬度25mm者作為試驗片。由此試驗片的基材層側,使用2kg橡膠輥,以10mm/分鐘的速度往復轉壓2次後,在23±1℃、濕度50±5%的氣體環境下放置24小時。其後,根據JIS Z 0237(2009年),使用INSTRON 5566(INSTRON公司製),以300mm/分鐘的剝離速度測定積層體與丙烯酸樹脂板間的180度剝離強度,作為剝離強度(23℃)。又,以目視確認剝離後的被接著體是否有殘膠。將結果揭示於表4。(Peeling strength, residual glue (23℃)) On an acrylic extrusion sheet (trade name SUMIPEX E, thickness 1.5mm, manufactured by SUMIKA ACRYL Sales Co., Ltd.), the resulting laminate is attached to the acrylic resin sheet on the adhesive layer, and cut into width The size of 25mm is used as the test piece. Thus, the substrate layer side of the test piece was reciprocated twice at a speed of 10 mm/min using a 2 kg rubber roller, and then left for 24 hours in a gas environment at 23±1°C and a humidity of 50±5%. Thereafter, in accordance with JIS Z 0237 (2009), using INSTRON 5566 (manufactured by INSTRON), the 180-degree peel strength between the laminate and the acrylic resin plate was measured at a peeling speed of 300 mm/min, as the peel strength (23°C). In addition, visually confirm whether there is any residual glue in the adherend after peeling. The results are shown in Table 4.

(剝離強度、殘膠(60℃)) 在23±1℃、濕度50±5%的氣體環境下放置24小時後,再在60℃的氣體環境下放置10分鐘後,在60℃的氣體環境下測定剝離強度,除此以外係與上述(剝離強度、殘膠(23℃))同樣地進行,並作為剝離強度、殘膠(60℃)。將結果揭示於表4。(Peeling strength, residual glue (60℃)) After leaving for 24 hours in a 23±1°C and 50±5% humidity gas environment, and then placing it in a 60°C gas environment for 10 minutes, measure the peel strength in a 60°C gas environment. Otherwise, it is the same as the above (Peel strength, residual glue (23°C)) was performed in the same manner, and set as peel strength and residual glue (60°C). The results are shown in Table 4.

[表4]   實施例 比較例 1 2 3 4 5 6 7 8 1 2 3 基材層 組成 (質量份) 烯烴樹脂 80 80 80 90 70 80 80 80 80 90 70 H-TPE-1 20 20 0 10 30 0 0 0 0 0 0 H-TPE-2 0 0 0 0 0 20 0 0 0 0 0 H-TPE-3 0 0 0 0 0 0 20 0 0 0 0 H-TPE-4 0 0 0 0 0 0 0 20 0 0 0 H-TPE-1’ 0 0 20 0 0 0 0 0 20 10 30 物性 蕭耳A硬度i 93 93 91 87 87 88 88 88 91 88 86 tanδ強度(23℃) 0.15 0.15 0.07 0.09 0.19 0.09 0.09 0.07 0.07 0.06 0.07 tanδ強度(40℃) 0.13 0.13 0.06 0.08 0.17 0.07 0.07 0.12 0.06 0.06 0.06 tanδ強度(60℃) 0.12 0.12 0.06 0.08 0.13 0.08 0.08 0.08 0.06 0.07 0.07 黏著層 組成 (質量份) H-TPE-1 20 0 20 20 20 20 20 20 0 0 0 H-TPE-1’ 60 80 60 60 60 60 60 60 80 80 80 黏著賦予樹脂 20 20 20 20 20 20 20 20 20 20 20 物性 蕭耳A硬度ii 54 52 54 54 54 54 54 54 52 52 52 tanδ強度(23℃) 0.22 0.12 0.22 0.22 0.22 0.22 0.22 0.22 0.12 0.12 0.12 tanδ強度(40℃) 0.33 0.08 0.33 0.33 0.33 0.33 0.33 0.33 0.08 0.08 0.08 tanδ強度(60℃) 0.19 0.07 0.19 0.19 0.19 0.19 0.19 0.19 0.07 0.07 0.07 E’(23℃)(MPa) 24.3 6.1 24.3 24.3 24.3 24.3 24.3 24.3 6.1 6.1 6.1 E’(60℃)(MPa) 5.8 5.5 5.8 5.8 5.8 5.8 5.8 5.8 5.5 5.5 5.5 E’(23℃)/E’(60℃) 4.22 1.11 4.22 4.22 4.22 4.22 4.22 4.22 1.11 1.11 1.11 積層體 物性 蕭耳A硬度比[i/ii] 1.72 1.79 1.69 1.61 1.61 1.63 1.63 1.63 1.75 1.70 1.65 HAZE(%) 0.3 0.3 1.1 0.7 0.7 0.5 0.4 0.4 0.8 1.3 3.0 剝離強度(23℃)(N/25mm) 6.4 6.2 8.1 5.4 7.4 5.1 5.2 5.1 6.0 4.2 5.7 殘膠(23℃) 剝離強度(60℃)(N/25mm) 3.4 2.8 5 4.7 3.2 3.3 4.4 3.6 2.2 1.7 2.2 殘膠(60℃) 剝離強度(60℃)/剝離強度(23℃) 0.53 0.45 0.62 0.87 0.43 0.65 0.85 0.71 0.36 0.40 0.39 [Table 4] Example Comparative example 1 2 3 4 5 6 7 8 1 2 3 Substrate layer Composition (parts by mass) Olefin resin 80 80 80 90 70 80 80 80 80 90 70 H-TPE-1 20 20 0 10 30 0 0 0 0 0 0 H-TPE-2 0 0 0 0 0 20 0 0 0 0 0 H-TPE-3 0 0 0 0 0 0 20 0 0 0 0 H-TPE-4 0 0 0 0 0 0 0 20 0 0 0 H-TPE-1' 0 0 20 0 0 0 0 0 20 10 30 Physical properties Shaw A Hardness i 93 93 91 87 87 88 88 88 91 88 86 tanδ intensity (23℃) 0.15 0.15 0.07 0.09 0.19 0.09 0.09 0.07 0.07 0.06 0.07 tanδ intensity (40℃) 0.13 0.13 0.06 0.08 0.17 0.07 0.07 0.12 0.06 0.06 0.06 tanδ intensity (60℃) 0.12 0.12 0.06 0.08 0.13 0.08 0.08 0.08 0.06 0.07 0.07 Adhesive layer Composition (parts by mass) H-TPE-1 20 0 20 20 20 20 20 20 0 0 0 H-TPE-1' 60 80 60 60 60 60 60 60 80 80 80 Adhesion imparting resin 20 20 20 20 20 20 20 20 20 20 20 Physical properties Shaw A hardness ii 54 52 54 54 54 54 54 54 52 52 52 tanδ intensity (23℃) 0.22 0.12 0.22 0.22 0.22 0.22 0.22 0.22 0.12 0.12 0.12 tanδ intensity (40℃) 0.33 0.08 0.33 0.33 0.33 0.33 0.33 0.33 0.08 0.08 0.08 tanδ intensity (60℃) 0.19 0.07 0.19 0.19 0.19 0.19 0.19 0.19 0.07 0.07 0.07 E'(23℃)(MPa) 24.3 6.1 24.3 24.3 24.3 24.3 24.3 24.3 6.1 6.1 6.1 E'(60℃)(MPa) 5.8 5.5 5.8 5.8 5.8 5.8 5.8 5.8 5.5 5.5 5.5 E'(23℃)/E'(60℃) 4.22 1.11 4.22 4.22 4.22 4.22 4.22 4.22 1.11 1.11 1.11 Layered body Physical properties Shaw A hardness ratio [i/ii] 1.72 1.79 1.69 1.61 1.61 1.63 1.63 1.63 1.75 1.70 1.65 HAZE(%) 0.3 0.3 1.1 0.7 0.7 0.5 0.4 0.4 0.8 1.3 3.0 Peel strength (23℃)(N/25mm) 6.4 6.2 8.1 5.4 7.4 5.1 5.2 5.1 6.0 4.2 5.7 Residual glue (23℃) no no no no no no no no no no no Peel strength (60℃)(N/25mm) 3.4 2.8 5 4.7 3.2 3.3 4.4 3.6 2.2 1.7 2.2 Residual glue (60℃) no no no no no no no no no no no Peel strength (60℃)/Peel strength (23℃) 0.53 0.45 0.62 0.87 0.43 0.65 0.85 0.71 0.36 0.40 0.39

表4所示之各成分係如同下述。 ・烯烴樹脂:均聚聚丙烯(NOVATEC-PP,Japan Polypropylene股份有限公司製) ・黏著賦予樹脂:Alcon P-125(脂環族飽和烴系樹脂,軟化點(環球法)125±5℃,荒川化學工業股份有限公司製)The components shown in Table 4 are as follows. ・Olefin resin: Homopolypropylene (NOVATEC-PP, manufactured by Japan Polypropylene Co., Ltd.) ・Adhesive resin: Alcon P-125 (alicyclic saturated hydrocarbon resin, softening point (ring and ball method) 125±5°C, manufactured by Arakawa Chemical Industry Co., Ltd.)

由表4可知,在基材層中包含嵌段共聚物的氫化物之實施例1、2及4~8,其在23~60℃的溫度範圍中,基材層的tanδ強度的值為大,在黏著層中包含嵌段共聚物的氫化物之實施例1及3~8,其在23~60℃的溫度範圍中,黏著層的tanδ強度的值為大。 又,相較於比較例1~3的積層體,實施例1及3~8的黏著層的儲存模數E’之比[E’(23℃)/E’(60℃)]大,為2以上。如此,實施例1及3~8的積層體之23℃與60℃的儲存模數之比係大於比較例,23℃至60℃的剝離強度的降低變少[(在60℃中之剝離強度)/(在23℃中之剝離強度)為大]。實施例2與比較例1~3之黏著層的構成雖為相同,但相較於比較例1~3的積層體,實施例2在23℃至60℃的剝離強度的降低變少。作為相較於比較例1~3,實施例2的上述剝離強度的降低變少的主要原因之一,可列舉:因包含嵌段共聚物的氫化物,而對基材層賦予適當柔軟性。 又,實施例1~8的積層體即使在60℃亦無殘膠。 因此可知,實施例的積層體係藉由在基材層或黏著層的一方或者兩方中含有嵌段共聚物或其氫化物,該嵌段共聚物或其氫化物具有於主鏈包含脂環式骨架(X)之結構單元,而期待可對被接著體賦予優異的制振性,又即使在高溫條件下亦不易剝落且極不易產生殘膠。It can be seen from Table 4 that in Examples 1, 2 and 4-8 in which the hydrogenated product of the block copolymer is contained in the base layer, the value of the tanδ intensity of the base layer is large in the temperature range of 23-60°C. In Examples 1 and 3-8 in which the hydrogenated product of the block copolymer is contained in the adhesive layer, the value of the tanδ intensity of the adhesive layer is large in the temperature range of 23-60°C. In addition, compared with the laminates of Comparative Examples 1 to 3, the storage modulus E'ratio [E'(23°C)/E'(60°C)] of the adhesive layers of Examples 1 and 3-8 is larger, which is 2 or more. In this way, the ratio of storage modulus at 23°C to 60°C of the laminates of Examples 1 and 3 to 8 is greater than that of the comparative example, and the peel strength at 23°C to 60°C decreases less [(Peel strength at 60°C )/(Peel strength at 23°C) is large]. Although the structure of the adhesive layer of Example 2 and Comparative Examples 1-3 is the same, compared with the laminated body of Comparative Examples 1-3, the fall of the peeling strength of Example 2 at 23-60 degreeC becomes small. As one of the main reasons for the reduction in the above-mentioned peel strength of Example 2 compared to Comparative Examples 1 to 3, it is possible to cite the fact that the hydrogenated product of the block copolymer is included to impart appropriate flexibility to the base layer. In addition, the laminates of Examples 1 to 8 had no glue residue even at 60°C. Therefore, it can be seen that the laminated system of the embodiment contains a block copolymer or its hydrogenated product in one or both of the substrate layer and the adhesive layer, and the block copolymer or its hydrogenated product has an alicyclic type in the main chain. The structural unit of the skeleton (X) is expected to provide excellent vibration damping properties to the adherend, and it is not easy to peel off even under high temperature conditions, and it is extremely unlikely to produce glue residue.

此外,雖未明確,但由實施例1及3~8的剝離強度之比,可推測含有嵌段共聚物或其氫化物之黏著層因在高溫(60℃)會柔軟化,故藉由以下狀況而抑制黏著層與被接著材料的接著力之降低:浸透至被接著材料(丙烯酸樹脂板)表面的微小凹凸而發揮如錨定物般的作用,或者,黏著層表面的微小凹凸的凸部嵌入被接著材料的凹部而發揮彈性的緊束力的作用。又,由於即使黏著層的構成相同,剝離強度比亦會依據基材層的構成而產生差異,此被認為係受到基材層的柔軟性的影響。 再者,相較於實施例3及比較例1~3的積層體,實施例1、2及4~8的積層體的HAZE低且透明性高。此被認為係因實施例1、2及4~8的基材層的構成成分、亦即嵌段共聚物或其氫化物係與聚丙烯的相容性高。 因此,本實施形態中之實施例1、2及4~8的積層體係有用於被要求透明性的用途,例如有用於作為液晶顯示器等的表面保護薄膜。 [產業可利用性]In addition, although it is not clear, based on the ratio of the peel strength of Examples 1 and 3 to 8, it can be inferred that the adhesive layer containing the block copolymer or its hydrogenated product will be softened at high temperature (60°C). Therefore, the following Under the circumstances, the adhesion between the adhesive layer and the material to be adhered is suppressed: it penetrates into the small irregularities on the surface of the material to be adhered (acrylic resin sheet) and acts like an anchor, or the small irregularities on the surface of the adhesive layer. It fits into the recess of the material to be bonded and exerts an elastic tightening force. In addition, even if the composition of the adhesive layer is the same, the peel strength ratio differs depending on the composition of the base layer, which is considered to be affected by the flexibility of the base layer. Furthermore, compared with the laminates of Example 3 and Comparative Examples 1 to 3, the laminates of Examples 1, 2, and 4 to 8 had lower HAZE and higher transparency. This is considered to be because the constituent components of the base material layers of Examples 1, 2, and 4 to 8, that is, the block copolymer or its hydrogenated product system has high compatibility with polypropylene. Therefore, the laminate systems of Examples 1, 2, and 4 to 8 in this embodiment are useful for applications where transparency is required, for example, as a surface protective film for liquid crystal displays and the like. [Industry Availability]

本發明的積層體因可對被接著體賦予制振性,且即使在高溫亦不易剝落且不易產生殘膠,故有用於作為黏著膠帶及黏著片等的接著劑、電子裝置等的表面保護薄膜、防止輸送時、保管時及加工時的對象產品的汙染及損傷之表面保護薄膜等。Since the laminated body of the present invention can impart vibration damping properties to the adherend, it is not easy to peel off even at high temperature and is not easy to generate residual glue, so it is used as an adhesive tape and adhesive sheet, etc., as a surface protection film for electronic devices, etc. , Surface protection film to prevent contamination and damage of the target product during transportation, storage, and processing.

無。no.

無。no.

Figure 109117126-A0101-11-0001-1
Figure 109117126-A0101-11-0001-1

無。no.

Claims (21)

一種積層體,其係具有基材層及黏著層之積層體, 前述基材層的蕭耳A硬度i相對於前述黏著層的蕭耳A硬度ii之比[i/ii]為1.1以上, 前述基材層及前述黏著層之中至少1層包含下述嵌段共聚物或其氫化物; 前述嵌段共聚物含有聚合物嵌段(A)及聚合物嵌段(B),前述聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以下述式(X)所示之1種以上的脂環式骨架(X)之結構單元;
Figure 03_image001
(上述式(X)中,R1 ~R3 各自獨立地表示氫原子或碳數1~11的烴基,複數個R1 ~R3 各自可相同或不同)。
A laminate having a substrate layer and an adhesive layer, wherein the ratio [i/ii] of the Shore A hardness i of the substrate layer to the Shore A hardness ii of the adhesive layer is 1.1 or more, At least one of the substrate layer and the aforementioned adhesive layer contains the following block copolymer or its hydrogenated product; the aforementioned block copolymer contains a polymer block (A) and a polymer block (B), and the aforementioned polymer block Paragraph (B) is a structural unit derived from a conjugated diene compound, and has a structural unit containing at least one alicyclic skeleton (X) represented by the following formula (X) in the main chain;
Figure 03_image001
(In the above formula (X), R 1 to R 3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 11 carbon atoms, and a plurality of R 1 to R 3 may be the same or different).
如請求項1之積層體,其中,在前述基材層中,前述嵌段共聚物或其氫化物的含量為1~100質量%。The laminate according to claim 1, wherein, in the base material layer, the content of the block copolymer or its hydrogenated product is 1-100% by mass. 如請求項1或2之積層體,其中,在前述基材層中,前述嵌段共聚物或其氫化物的含量為1~99質量%,烯烴樹脂的含量為99~1質量%。The laminate of claim 1 or 2, wherein, in the base material layer, the content of the block copolymer or its hydrogenated product is 1 to 99% by mass, and the content of the olefin resin is 99 to 1% by mass. 如請求項3之積層體,其中,前述烯烴樹脂為聚丙烯。The laminate according to claim 3, wherein the olefin resin is polypropylene. 如請求項1至4中任一項之積層體,其中,在前述基材層中,黏著賦予樹脂的含量為小於1質量%。The laminate according to any one of claims 1 to 4, wherein the content of the adhesion-imparting resin in the base material layer is less than 1% by mass. 如請求項1至5中任一項之積層體,其中,在前述黏著層中,前述嵌段共聚物或其氫化物的含量為1~80質量%。The laminate according to any one of claims 1 to 5, wherein, in the adhesive layer, the content of the block copolymer or its hydrogenated product is 1 to 80% by mass. 如請求項1至6中任一項之積層體,其中,在前述黏著層中,黏著賦予樹脂的含量為1質量%以上。The laminate according to any one of claims 1 to 6, wherein the content of the adhesion-imparting resin in the adhesive layer is 1% by mass or more. 如請求項1至7中任一項之積層體,其中,在前述脂環式骨架(X)中,包含有前述R1 ~R3 之中至少1個為碳數1~11的烴基之脂環式骨架(X’)。The laminate according to any one of claims 1 to 7, wherein, in the alicyclic skeleton (X) , at least one of the foregoing R 1 to R 3 is a hydrocarbon group with 1 to 11 carbons. Cyclic skeleton (X'). 如請求項8之積層體,其中,在前述脂環式骨架(X’)中的前述烴基為甲基。The laminate of claim 8, wherein the hydrocarbon group in the alicyclic skeleton (X') is a methyl group. 如請求項1至9中任一項之積層體,其至少包含苯乙烯-氫化丁二烯/異戊二烯-苯乙烯共聚物作為前述嵌段共聚物的氫化物。The laminate according to any one of claims 1 to 9, which contains at least a styrene-hydrogenated butadiene/isoprene-styrene copolymer as the hydrogenated product of the aforementioned block copolymer. 如請求項1至7中任一項之積層體,其中,前述R1 ~R3 同時為氫原子。The laminate according to any one of claims 1 to 7, wherein the aforementioned R 1 to R 3 are hydrogen atoms at the same time. 如請求項1至11中任一項之所記載之積層體,其在前述聚合物嵌段(B)中含有1莫耳%以上的前述脂環式骨架(X)。The laminate as described in any one of claims 1 to 11, which contains 1 mol% or more of the alicyclic skeleton (X) in the polymer block (B). 如請求項8或9之積層體,其在前述聚合物嵌段(B)中含有1莫耳%以上的前述脂環式骨架(X’)。The laminate of claim 8 or 9, which contains 1 mol% or more of the alicyclic skeleton (X') in the polymer block (B). 如請求項1至13中任一項之積層體,其中,前述聚合物嵌段(B)的氫化率為0莫耳%以上且小於50莫耳%。The laminate according to any one of claims 1 to 13, wherein the hydrogenation rate of the aforementioned polymer block (B) is 0 mol% or more and less than 50 mol%. 如請求項1至13中任一項之積層體,其中,前述聚合物嵌段(B)的氫化率為50~99莫耳%。The laminate according to any one of claims 1 to 13, wherein the hydrogenation rate of the aforementioned polymer block (B) is 50 to 99 mol%. 如請求項1至15中任一項之積層體,其中,前述聚合物嵌段(B)中的乙烯基鍵結量為55~95莫耳%。The laminate according to any one of claims 1 to 15, wherein the vinyl bond amount in the polymer block (B) is 55 to 95 mol%. 如請求項1至16中任一項之積層體,其中,前述嵌段共聚物或其氫化物存在:根據JIS K 7244-10(2005年),在應變量0.1%、頻率1Hz、測定溫度-70~100℃、升溫速度3℃/分鐘的條件下測定而得之tanδ成為1.0以上之連續的溫度區域;該溫度區域的最大幅度為13℃以上。Such as the laminate of any one of claims 1 to 16, wherein the aforementioned block copolymer or its hydrogenated product exists: in accordance with JIS K 7244-10 (2005), the strain amount is 0.1%, the frequency is 1 Hz, and the measurement temperature- The tanδ measured under the conditions of 70 to 100°C and a temperature increase rate of 3°C/min is a continuous temperature range of 1.0 or more; the maximum range of this temperature range is 13°C or more. 如請求項1至17中任一項之積層體,其中,前述聚合物嵌段(A)含有大於70莫耳%的來自芳香族乙烯基化合物之結構單元。The laminate according to any one of claims 1 to 17, wherein the aforementioned polymer block (A) contains more than 70 mol% of structural units derived from an aromatic vinyl compound. 如請求項18之積層體,其中,在前述嵌段共聚物中的前述聚合物嵌段(A)的含量為50質量%以下。The laminate of claim 18, wherein the content of the polymer block (A) in the block copolymer is 50% by mass or less. 如請求項18之積層體,其中,在前述嵌段共聚物中的前述聚合物嵌段(A)的含量為16質量%以下。The laminate according to claim 18, wherein the content of the polymer block (A) in the block copolymer is 16% by mass or less. 如請求項1至20中任一項之積層體,其中,前述黏著層之在23℃的儲存模數E’(23℃)相對於在60℃的儲存模數E’(60℃)之比[E’(23℃)/E’(60℃)]為2以上。The laminate of any one of claims 1 to 20, wherein the ratio of the storage modulus E'(23°C) of the aforementioned adhesive layer at 23°C to the storage modulus E'(60°C) at 60°C [E'(23°C)/E'(60°C)] is 2 or more.
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