TW202108810A - Liquid material vaporizer - Google Patents

Abstract

In order to provide a liquid material vaporizer capable of sufficiently cooling a liquid material so that the liquid material does not vaporize more upstream than a vaporization chamber and also capable of reducing the consumption of a refrigerant used for cooling, in the disclosure, the liquid material vaporizer includes a vaporization chamber 52, a material supply system 6, and a cooling system 7. The vaporization chamber 52 heats the liquid material and produces a material gas in which the liquid material is vaporized. The material supply system 6 includes: a material supply path 63, through which a gas-liquid mixture in which the liquid material and a carrier gas are mixed flows; and a material ejection port 62, through which the gas-liquid mixture passing through the material supply path 63 is ejected into the vaporization chamber 52. The cooling system 7 includes: a cooling flow path 73, in which at least a liquid-state refrigerant in which a constituent contained in the liquid material is dissolved flows, and formed by cooling the material ejection port 62 side in the material supply path 63 with the refrigerant; and a solvent ejection port 72, through which the refrigerant passing through the cooling flow path 73 is ejected into the vaporization chamber 52.

Description

Liquid material vaporization device

The present invention relates to a liquid material vaporization device for vaporizing liquid materials.

In a semiconductor manufacturing process, as a process gas for adsorption on the surface of a substrate, a material gas obtained by vaporizing a liquid material that is liquid at room temperature is sometimes used. For example, in the case of forming a thin film of atomic units on the substrate by the Atomic Layer Deposition (ALD) method, as the liquid material, there are the following liquid materials that contain strontium (Sr) with low vapor pressure and high viscosity The organic metal liquid materials of elements such as barium (Ba) and lanthanum (La) are solutes, which are made by dissolving the solute in solvents such as ethyl cyclohexane (ECH) or tetrahydrofuran (THF). In addition, in recent years, liquid materials in which a solid material is used as a solute at room temperature and the solute is dissolved in a solvent have also begun to be used. Hereinafter, the so-called liquid material is used regardless of the difference in the state of the solute at normal temperature, and materials that do not contain the solute are sometimes collectively referred to as liquid materials.

As a device for vaporizing liquid materials, there are a baking method in which liquid materials are vaporized by bubbling in a tank in which liquid materials are stored, and the use of heaters ( It is an instantaneous vaporization method in which liquid materials are sprayed in a vaporization chamber that is kept at a high temperature, and the liquid materials are vaporized instantaneously.

In the calcination method, there is a problem that when a liquid material obtained by dissolving a solid material in a solvent as described above is vaporized, a solute with a low vapor pressure remains in the tank, and the liquid material is easily concentrated.

On the other hand, the liquid material vaporization device of the instantaneous vaporization method has an internal mixing method (refer to Patent Document 1) and an external mixing method (refer to Patent Document 2). The internal mixing method is to combine the liquid material with a carrier gas (carrier gas). ) Pre-mixing and spraying into the gasification chamber, the external mixing method is to mix the liquid material and the carrier gas when they are supplied into the gasification chamber.

In the instantaneous vaporization method, since the vicinity of the ejection port of the liquid material opening to the vaporization chamber becomes high temperature, only the solvent of the liquid material in the vicinity of the ejection port evaporates, and the solute may remain. Therefore, the supply path of the liquid material may be clogged, or the ejection port may be clogged.

In order to solve this problem, Patent Document 3 proposes a liquid material vaporization device that combines an internal mixing method and an external mixing method. The liquid material vaporization device includes a material supply system and a carrier gas supply system. The material supply system includes a material injection nozzle for spraying a gas-liquid mixture pre-mixed with a liquid material and a carrier gas into the vaporization chamber. ), the carrier gas supply system includes a carrier gas flow path formed by passing through the outer surface of the material injection nozzle, and a ring for injecting the carrier gas into the gasification chamber from its surroundings around the front end opening of the material injection nozzle. Carrier gas ejection port. That is, it can be considered that the material injection nozzle is cooled by the carrier gas supplied to the periphery of the material injection nozzle by the carrier gas supply system, or the carrier gas is used to prevent heat transfer from the vaporization chamber to the material injection nozzle, thereby preventing only liquid material The solvent evaporates.

However, even with the above-mentioned configuration, especially when a liquid material in which a solid material is a solute is vaporized, the phenomenon that only the solvent evaporates may not be sufficiently suppressed in some cases. In addition, even if the so-called pre-evaporation phenomenon of the solvent is prevented, the consumption of the carrier gas for cooling or heat insulation is very large. [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2006-108230 [Patent Document 2] Japanese Patent Laid-Open No. 2007-46084 [Patent Document 3] Japanese Patent No. 5004890

[The problem to be solved by the invention] The present invention was completed in view of the above-mentioned problems, and its object is to provide a method that can sufficiently cool liquid materials in a manner that does not vaporize more upstream than the vaporization chamber, and can reduce the consumption of the cooling medium. Liquid material vaporization device. [Means to solve the problem]

That is, the liquid material vaporization apparatus of the present invention is characterized by including: a vaporization chamber, a material supply system, and a cooling system. The vaporization chamber heats the liquid material to generate a material gas obtained by vaporizing the liquid material. The material supply system includes: a material supply path for a gas-liquid mixture of liquid material and carrier gas to flow; and a material ejection port for ejecting the gas-liquid mixture through the material supply path to the gas In the chemical chamber, the cooling system includes: a cooling flow path for flowing at least a solvent that dissolves the components contained in the liquid material flowing in the material supply path, and the material in the material supply path The spray port side is formed to be cooled; and the solvent spray port sprays the refrigerant passing through the cooling flow path into the vaporization chamber.

In this type of liquid material vaporization device, a solvent flows in the cooling flow path, and the cooling flow path is formed to cool the material ejection port side in the material supply path, so The solvent is vaporized near the material ejection port which has the highest temperature, and the latent heat of vaporization allows sufficient cooling. Therefore, the liquid material can be prevented from vaporizing on the upstream side of the vaporization chamber, and problems such as clogging or clogging of the flow path can be prevented.

In addition, the solvent flowing in the cooling flow path evaporates near the material ejection port, and can be cooled with precise pinpoints by the latent heat of vaporization, which is comparable to the case of cooling or insulation using only carrier gas. Compared with this, the consumption of media required for cooling can be greatly reduced.

Furthermore, since the solvent evaporated in the cooling flow path is supplied into the vaporization chamber, the partial pressure of the liquid material in the vaporization chamber can be reduced, and the vaporization can be further assisted. In addition, since the components contained in the liquid material are dissolved in the solvent ejected from the solvent ejection port, even if a part of the liquid material remains near the material ejection port, it can be expected to dissolve such components in the vaporized solvent. The solvent and the effect of removing it.

In order that the solvent ejected from the cooling system to the vaporization chamber does not affect the supply destination of the material gas and easily removes the solute of the liquid material remaining in the material ejection port, the liquid material only needs to be The solid material may be a liquid material obtained by dissolving in a solvent, and the refrigerant may be the solvent.

In order to make it easier for the solvent flowing in the cooling flow path to evaporate near the material ejection port, the cooling effect achieved by the latent heat of vaporization is improved, and the ejection from the solvent ejection port in the vaporization chamber is also improved. The auxiliary effect of the solvent on the gasification of the liquid material can be constructed in the following manner: in the cooling flow path, a gas-liquid mixture of the solvent and the carrier gas flows, and the material is ejected from the material ejection port The gas-liquid mixture and the solvent ejected from the solvent ejection port are mixed in the vaporization chamber.

In order to cause the liquid material to start to evaporate after being ejected into the vaporization chamber, and to cause the solvent flowing in the cooling flow path to start vaporizing in the cooling flow path, the material may be sprayed by latent heat of vaporization Local cooling in the vicinity of the outlet, as long as the material supply path includes a first nozzle portion with a reduced flow path area near the material ejection port, and the cooling flow path includes a predetermined distance from the solvent ejection port to the upstream side, and The second nozzle part that expands after the area of the flow path is reduced is sufficient.

As a preferable configuration example of the second nozzle portion, there can be mentioned a configuration in which the first nozzle portion is cooled by the latent heat of vaporization of the solvent evaporated at the outlet of the second nozzle portion .

In order to prolong the time that the refrigerant evaporated in the cooling flow path stays near the material ejection port and further improve the cooling effect, it is only necessary to form a stagnation where the evaporated solvent stays on the outlet side of the second nozzle part. Room can be.

In order to fully mix the liquid material ejected from the material ejection port and the solvent ejected from the solvent ejection port in the vaporization chamber, so that the liquid material can be vaporized more easily, it is only necessary to configure it in the following manner, namely: more Each of the solvent ejection ports is arranged in a circular shape with the material ejection port as the center, and each ejection direction of the plurality of solvent ejection ports is spiral with the ejection direction of the material ejection port as the central axis.

In order to fully mix the liquid material and the carrier gas in the vaporization chamber and spray them to the periphery of the vaporization chamber to promote the vaporization of the liquid material, the following liquid material vaporization device may be used, that is, it includes : A gasification chamber, a material supply system, and a cooling system. The gasification chamber heats the liquid material to generate a material gas that vaporizes the liquid material. The material supply system includes: a material supply path for liquid A gas-liquid mixture formed by mixing a material and a carrier gas flows; and a material ejection port for ejecting the gas-liquid mixture through the material supply path into the gasification chamber; the cooling system includes: a cooling flow path , The carrier gas is provided to flow, and the material ejection port side is formed in the material supply path by the carrier gas cooling; and the solvent ejection port ejects the carrier gas passing through the cooling flow path to In the gasification chamber, one or more material ejection ports are formed so as to surround the solvent ejection port. [Effects of the invention]

In the liquid material vaporization device of the present invention in this way, since the refrigerant in a liquid state flows so as to cool the material ejection port side in the material supply path through which the liquid material flows, it is possible to use The latent heat of vaporization of the refrigerant cools the material near the ejection port with precise markings. Therefore, the liquid material can be prevented from evaporating in front of the vaporization chamber, and the consumption of the refrigerant due to local cooling can also be reduced.

1 to 4, the liquid material vaporization apparatus 100 according to the first embodiment of the present invention will be described.

The liquid material vaporization device 100 is a device for vaporizing liquid materials to generate material gas. The generated material gas is used as, for example, a process gas that is supplied to perform various treatments on the surface of the substrate.

The liquid material to be vaporized is a liquid material obtained by dissolving a solid material as a solute in a solvent (liquefied raw material), and the vapor pressure of the solid material is lower than the vapor pressure of the solvent. Therefore, sometimes only the solvent evaporates first due to temperature or pressure, and the solid material that is only the solute does not vaporize and remains.

Specifically, as shown in FIG. 1, the liquid material vaporization device 100 includes: a first gas-liquid mixing mechanism 1 for mixing a liquid material and a carrier gas to generate a gas-liquid mixture; and a second gas-liquid mixing mechanism 2. Mixing a solvent constituting a part of the liquid material with a carrier gas to generate a gas-liquid mixture; and a vaporization mechanism 3, which heats the liquid material to generate a material gas.

The first gas-liquid mixing mechanism 1 includes a first valve unit 11 that controls the flow rate of the liquid material supplied to the carrier gas.

In addition, the second gas-liquid mixing mechanism 2 has the same configuration as the first gas-liquid mixing mechanism 1, and includes a second valve unit 21 that controls the flow rate of the solvent supplied to the carrier gas. In the above embodiment, the carrier gas supplied to the first gas-liquid mixing mechanism 1 and the carrier gas supplied to the second gas-liquid mixing mechanism 2 are the same type of gas, for example, nitrogen (N ₂ ) or the like is used. In addition, the solvent supplied to the second gas-liquid mixing mechanism is used as a refrigerant for preventing evaporation of the liquid material in the sprayer 4 described later. In addition, the solvent and the solvent constituting the liquid material supplied to the first gas-liquid mixing mechanism 1 are of the same kind. Furthermore, if the solid material as the solute of the liquid material can be dissolved, the solvent supplied to the second gas-liquid mixing mechanism 2 may be of a different kind from the solvent constituting the liquid material supplied to the first gas-liquid mixing mechanism 1.

The vaporization mechanism 3 includes a sprayer 4 arranged on the upstream side and a vaporizer 5 arranged on the downstream side. The sprayer 4 sprays the gas-liquid mixture supplied from each gas-liquid mixing mechanism into the vaporizer 5. The vaporizer 5 includes a vaporization chamber 52 formed inside, and a heater 51 configured to maintain the inside of the vaporization chamber 52 at a constant temperature.

Hereinafter, the details of the sprayer 4 will be described with reference to FIGS. 2 to 4.

The sprayer 4 is configured such that each gas-liquid mixture is supplied from the base end side, and the liquid material and the like are ejected into the vaporization chamber 52 from the front end surface facing the vaporization chamber 52. The sprayer 4 has a substantially cylindrical shape, and a flow path through which a gas-liquid mixture flows or a nozzle portion for pressure adjustment are formed inside. That is, the sprayer 4 includes a material supply system 6 that supplies liquid material into the vaporization chamber 52 and a cooling system 7 that supplies refrigerant for preventing the liquid material flowing in the material supply system 6 from evaporating. In the material supply system 6 and the cooling system 7, the gas-liquid mixture flows synchronously.

As shown in Figs. 2 and 3, the material supply system 6 includes: 1 material inlet (port) 61, which is open on the end surface of the base end side of the sprayer 4, and is supplied with liquid from the first gas-liquid mixing mechanism 1. The gas-liquid mixture of the material and the carrier gas; the material ejection port 62 at the end face of the tip side of the sprayer 4 ejects the gas-liquid mixture containing the liquid material into the vaporization chamber 52; and the material supply path 63 is for introducing the material A flow path is connected between the port 61 and the material ejection port 62, and the gas-liquid mixture flows. The material supply system 6 is formed along the central axis in a substantially cylindrical sprayer 4.

In the material supply path 63, a first nozzle portion 64 whose flow path area is reduced in the vicinity of the material ejection port 62 is formed. The outlet of the first nozzle portion 64 coincides with the material ejection outlet 62. Therefore, the gas-liquid mixture passing through the first nozzle portion 64 is once squeezed, and then expands in the vaporization chamber 52.

In the above embodiment, the cooling system 7 is configured as follows: five cooling systems 7 are formed to surround the material supply system 6, and in the sprayer 4 on the front end side facing the vaporization chamber 52, the material supply system 6 and The cooling system 7 is the closest. Specifically, as shown in FIGS. 2 and 3, the cooling system 7 is formed with a refrigerant inlet 71, which is supplied with a gas-liquid mixture containing a solvent and a carrier gas from the second gas-liquid mixing mechanism 2; and a solvent ejection port 72 , The liquid or gas introduced from the refrigerant inlet 71 is ejected into the vaporization chamber 52; and the cooling flow path 73 connects the refrigerant inlet 71 and the solvent ejection outlet 72, and supplies the gas and liquid used as the refrigerant The mixture flows.

The cooling flow path 73 is formed to cool the material ejection port 62 side by a refrigerant in the material supply path 63. Specifically, the cooling flow path 73 is provided on the base end side of the sprayer 4 in parallel with the material supply path 63, but on the front end side of the sprayer 4, it is curved obliquely with respect to the axial direction of the sprayer 4 so as to approach the material ejection port 62 side. . In addition, the cooling flow path 73 includes a second nozzle portion 74 provided at a position separated from the solvent ejection port 72 by a predetermined distance toward the upstream side. The second nozzle portion 74 is configured such that the area of the flow path is reduced and then enlarged, and its position relative to the axial direction of the sprayer 4 is arranged at substantially the same position as the first nozzle portion 64.

With such a configuration, the solvent contained in the gas-liquid mixture is in a liquid state on the base end side of the cooling flow path 73, but evaporates at the time when the refrigerant supply path has passed through the second nozzle portion 74 on the front end side of the refrigerant supply path. Therefore, the vicinity of the first nozzle portion 64 and the material ejection port 62 is cooled with precise points by the latent heat of vaporization of the solvent flowing in the cooling flow path 73.

Next, the arrangement relationship between the material ejection port 62 and the solvent ejection port 72 will be described with reference to FIG. 4. As shown in FIG. 4, the center part of the front end surface of the sprayer 4 is recessed into a bowl shape, and the material ejection port 62 is opened in the innermost part. In addition, the five solvent ejection ports 72 are arranged side by side on the circumference with the material ejection port 62 as the center. The five solvent ejection ports 72 are formed in such a manner that they open toward the slope of the beating bowl, and each ejection direction of the refrigerant becomes a spiral shape with the ejection direction of the material ejection port 62 as the central axis.

According to the liquid material vaporization apparatus 100 configured as described above, the front end side of the sprayer 4 facing the vaporization chamber 52 heated by the heater 51, particularly the vicinity of the material ejection port 62, is used in the cooling flow path. The liquid solvent flowing in 73 vaporizes, and is locally cooled by its latent heat of vaporization.

Therefore, in the liquid material flowing in the material supply path 63 in the vicinity of the material ejection port 62, only the solvent evaporates and the solid material as the solute remains.

Even if a slight vaporization occurs in the solvent constituting the liquid material, solid material remains near the material ejection port 62. Since the vaporized solvent is supplied from the solvent ejection port 72 to the vicinity of the material ejection port 62, it can remain The solid material dissolves again. Therefore, while supplying the material gas, it is possible to perform the removal of residual substances in the vicinity of the material ejection port 62 in parallel. In addition, the partial pressure of the solid material in the vaporization chamber 52 may be reduced by the vaporized solvent supplied from the solvent ejection port 72 into the vaporization chamber 52. Therefore, the gasification of the solid material in the gasification chamber 52 can be promoted.

Furthermore, since accurate punctuation cooling using the latent heat of vaporization is realized, it is possible to greatly reduce the cooling cost compared to the case where, for example, only the carrier gas flows in the cooling flow path 73 and the vicinity of the material ejection port 62 is cooled. The amount of refrigerant required. In addition, since the cooling flow path 73 flows in the state of a gas-liquid mixture formed by mixing the solvent and the carrier gas, the solvent is more easily vaporized on the front end side of the cooling flow path 73, and the cooling efficiency can be improved. In addition, compared to the case where only the solvent is allowed to flow in the cooling flow path 73, the necessary supply pressure can also be lowered.

In addition, the liquid material vaporization apparatus 100 of the first embodiment realizes the spraying of the liquid material into the internal mixing method in the vaporization chamber 52 by the material supply system 6, and by supplying the solvent or the vaporized by each cooling system 7 The carrier gas also realizes the spraying of the external mixing method. By implementing a hybrid spray of an internal mixing method and an external mixing method in this way, a spray state suitable for the vaporization of the solid material contained in the liquid material can be realized.

Next, the liquid material vaporization apparatus 100 according to the second embodiment of the present invention will be described with reference to FIGS. 5 and 6. In addition, the members corresponding to the members described in the first embodiment are denoted by the same reference numerals.

As shown in FIGS. 5 and 6, the configuration of the cooling channel 73 of the liquid material vaporization apparatus 100 of the second embodiment is different from that of the first embodiment. Specifically, the position of the second nozzle portion 74 of the cooling flow path 73 is arranged on the further upstream side, and the outlet of the second nozzle portion 74 is formed with a retention chamber 75 in which the vaporized refrigerant temporarily retains. The retention chamber 75 is a substantially rectangular parallelepiped-shaped space, and is formed so that the flow path area of the cooling flow path 73 becomes the largest. In addition, the areas of the outflow port and the inflow port are formed to be small with respect to the wall surfaces on the inflow side and the outflow side of the retention chamber 75.

According to such a liquid material vaporization device, the solvent vaporized by the second nozzle portion 74 can stay in the vicinity of the material ejection port 62 for a predetermined time, so that the cooling effect can be further improved.

Next, the third embodiment will be described with reference to FIG. 7.

In the third embodiment, the positional relationship between the material supply path 63 and the cooling flow path 73 is opposite to that of the foregoing embodiments. That is, the flow path extending along the central axis of the sprayer 4 becomes the cooling flow path 73, and the plurality of flow paths provided around the cooling flow path 73 become the material supply path 63. Furthermore, a material ejection port 62 is formed so as to surround the solvent ejection port 72 formed at the center of the front end surface of the sprayer 4.

In addition, in the third embodiment, no liquid flows in the cooling flow path 73, and only the carrier gas flows as a refrigerant. On the other hand, in the material supply path 63, a gas-liquid mixture of a liquid material obtained by dissolving a solid material in a solvent and a carrier gas flows and mixes.

If the liquid material vaporization device 100 is configured in this way, the combined mixing combining internal mixing and external mixing can be realized, and the liquid material can be sprayed to vaporization in the vaporization chamber 52 in a fully mixed state with the carrier gas. The peripheral part of the chamber 52. Therefore, the vaporization of the liquid material can be promoted.

Other embodiments will be described.

The cooling flow path is not limited to the flow path through which the gas-liquid mixture flows, and may be, for example, a flow path through which only liquid refrigerant flows. In addition, the refrigerant is not limited to the solvent constituting the liquid material flowing in the material supply path, and may be another type of liquid. In this case, as long as it has the property of dissolving the solute constituting the liquid material. In addition, in the third embodiment, not only the carrier gas but also a liquid such as a solvent that functions as a refrigerant may flow in the cooling flow path.

Regarding the liquid material, it is not limited to the solute being a solid material, and the liquid material may be one obtained by dissolving a solute, such as an organometallic liquid material, in a solvent.

In the first embodiment and the second embodiment, the case where a plurality of cooling systems are provided for the material supply system is shown, but only one cooling system may be provided for one material supply system. In addition, even in the case where there are a plurality of cooling systems, it can also be set as the final confluence of the solvent ejection ports. In this case, the solvent ejection port may be formed in a ring shape so as to surround the material ejection port.

The ejection direction of the material ejection port and the solvent ejection port is not limited to the directions shown in each embodiment. For example, the ejection direction of the material ejection port and the ejection direction of the solvent ejection port may be respectively parallel.

The carrier gas and the carrier gas are not limited to the same type of gas, and may be different types of gas.

In addition, a part of each embodiment may be combined or a part may be modified without violating the gist of the present invention.

1: The first gas-liquid mixing mechanism 2: The second gas-liquid mixing mechanism 3: Gasification mechanism 4: sprayer 5: Vaporizer 6: Material supply system 7: Cooling system 11: The first valve unit 21: The second valve unit 51: heater 52: Vaporization chamber 100: Liquid material vaporization device 61: Material inlet 62: Material ejection outlet 63: Material supply path 64: The first nozzle part 71: Refrigerant inlet 72: Solvent spray outlet 73: Cooling flow path 74: The second nozzle part 75: Detention Room

Fig. 1 is a schematic diagram of a liquid material vaporization apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing the structure of the sprayer of the first embodiment. Fig. 3 is a schematic cross-sectional perspective view showing the structure of the sprayer of the first embodiment. Fig. 4 is an enlarged schematic partial perspective view of the vicinity of the ejection port of the sprayer of the first embodiment. Fig. 5 is a schematic cross-sectional view showing the structure of the sprayer of the second embodiment. Fig. 6 is a schematic cross-sectional perspective view showing the structure of the sprayer of the second embodiment. Fig. 7 is a schematic cross-sectional view showing the structure of the sprayer of the third embodiment.

1: The first gas-liquid mixing mechanism

2: The second gas-liquid mixing mechanism

3: Gasification mechanism

4: sprayer

5: Vaporizer

6: Material supply system

7: Cooling system

11: The first valve unit

21: The second valve unit

51: heater

52: Vaporization chamber

100: Liquid material vaporization device

Claims (8)

A liquid material gasification device, comprising: a gasification chamber, which heats the liquid material to generate a material gas formed by gasifying the liquid material; The material supply system includes a material supply path and a material ejection port. The material supply path allows a gas-liquid mixture formed by mixing a liquid material and a carrier gas to flow, and the material ejection port mixes the gas-liquid passing through the material supply path Body ejected into the vaporization chamber; and The cooling system includes: a cooling flow path and a solvent ejection port. The cooling flow path allows at least a solvent that dissolves components contained in the liquid material flowing in the material supply path to flow, and to flow through the material supply path It is formed by cooling the material ejection port side, and the solvent ejection port ejects the solvent passing through the cooling flow path into the vaporization chamber. The liquid material vaporization device according to claim 1, wherein the liquid material flowing in the material supply path is a liquid material obtained by dissolving a solid material in a solvent, The solvent flowing in the cooling flow path is of the same type as the solvent constituting the liquid material. The liquid material vaporization device according to claim 1, which is configured in the following manner: in the cooling flow path, a gas-liquid mixture formed by mixing a solvent and a carrier gas is flowed, The gas-liquid mixture ejected from the material ejection port and the solvent ejected from the solvent ejection port are mixed in the vaporization chamber. The liquid material vaporization device according to claim 1, wherein the material supply path includes a first nozzle portion with a reduced flow path area near the material ejection port, The cooling flow path includes a second nozzle portion that is provided at a predetermined distance from the solvent ejection port toward the upstream side, and the area of the flow path is reduced and then expanded. The liquid material vaporization device according to claim 4 is configured to cool the first nozzle part by latent heat of vaporization of the solvent evaporated at the outlet of the second nozzle part. The liquid material vaporization apparatus according to claim 4, wherein a retention chamber in which the evaporated solvent is retained is formed on the outlet side of the second nozzle portion. The liquid material vaporization device according to any one of claims 1 to 6, which is configured in such a way that a plurality of the solvent ejection ports are arranged in a circular shape with the material ejection ports as the center, The ejection directions of the plurality of the solvent ejection ports are spiral with the ejection direction of the material ejection ports as the central axis. A liquid material gasification device, comprising: a gasification chamber, which heats the liquid material to generate a material gas formed by gasifying the liquid material; The material supply system includes a material supply path and a material ejection port. The material supply path allows a gas-liquid mixture formed by mixing a liquid material and a carrier gas to flow, and the material ejection port mixes the gas-liquid passing through the material supply path Body ejected into the vaporization chamber; and The cooling system includes a cooling flow path and a solvent ejection port. The cooling flow path allows carrier gas to flow and is formed to cool the material ejection port side in the material supply path. The solvent ejection port will The carrier gas passing through the cooling flow path is ejected into the gasification chamber, and One or more material ejection ports are formed to surround the solvent ejection port.

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