TW202107599A - Wafer processing apparatus having particle sensors - Google Patents

Abstract

The present invention provides a wafer processing apparatus having a particle detector, which includes: a wafer transfer unit which holds a wafer and transfers it to a processing area where a wafer processing process is performed; a particle detector which is equipped at a predetermined position of the aforementioned wafer transfer unit to determine whether particles are present on a transfer path of the wafer held by the wafer transfer unit; and an inflow fan which rotates to cause a fluid to flow into the particle detector. In addition, inside a transfer plate, a discharge fan may be provided at a position corresponding to a through hole, and a particle detector may be further provided outside the transfer plate corresponding to the through hole. With the aforementioned configuration, the wafer processing apparatus of the present invention has the effect of minimizing wafer contamination caused by particles.

Description

Wafer processing equipment with particle sensor

The present invention relates to wafer processing equipment, and more specifically, to a wafer processing with a particle sensor that enables sensing particles flowing in during the wafer processing process and judging the contamination state of the wafer during processing equipment.

The semiconductor industry, as an industry that achieves outstanding development and growth together with the electronics, communications, and information business sectors, is not only a core element for entering the information society and the development of cutting-edge industries, but also as a necessity for increasing the productivity and high value-added of conventional industries. The demand for the essential components of the company is rapidly expanding and diversifying.

However, the semiconductor industry requires huge equipment investment, and the development of technology itself also requires a large amount of R&D investment. Compared with sales, R&D investment is significantly higher than other industries. This is because the characteristics of semiconductor products are extremely important to the manufacturing process. Sensitive products.

In addition, the semiconductor industry has the characteristics of rapid technological innovation and the life cycle of products is very short compared to other industries.

From the initial wafer production to the final finished product, this kind of semiconductor roughly goes through the four processes of wafer manufacturing process, wafer processing process, package assembly process and module assembly process.

Among them, the wafer processing process is generally achieved by applying automated wafer processing equipment. The wafer processing equipment performs various wafer processing such as coating photosensitive liquid on the wafer or wafer etching.

However, in the processing of such wafers, external particles often flow into the wafer processing equipment, which may cause fatal problems for the wafer processing equipment whose pollution degree is kept extremely low.

In addition, even in the environment where external particles cannot flow into the wafer processing equipment, when the wafer is transported by the robot arm (Arm), when it collides with other objects or equipment, particles will be generated. If it is not handled or eliminated in time, product defects will inevitably occur.

Therefore, it is required to develop a device for solving this problem.

[Prior Technical Literature] [Patent Literature] Korea Public Utility Model Bulletin No. 1998-010231.

[The problem to be solved by the invention]

The present invention is an invention developed to solve the above-mentioned problems of the prior art. The purpose of the present invention is to detect particles flowing in or generated in the wafer processing process in advance and perform rapid processing, so that the wafer processing equipment can be maintained in a clean room environment.

The object of the present invention is not limited to this, and other objects not mentioned are clearly understood by practitioners from the following description.

[Means to solve the problem]

The wafer processing equipment with a particle sensor intended to achieve the above-mentioned object of the present invention may include: a wafer transfer unit that places the wafer and transfers it to a process area where the wafer processing process is performed; a particle sensor, It is equipped in a pre-set position of the wafer transfer unit to determine whether particles are present on the transfer path of the wafer placed in the wafer transfer unit; and an inflow fan that rotates to cause fluid to flow into the particle sensor .

In addition, the wafer transfer unit may include: a transfer arm for placing the wafer; and a transfer plate equipped to support the transfer arm so that the transfer arm is transferred to the process area.

In addition, the particle sensor may include an inflow hole for allowing the particles to flow in, and the inflow hole may be built into the transfer plate in a state of being exposed toward the transfer arm.

In addition, a through hole may be formed in the transfer plate, the through hole is provided at least at a position corresponding to the inflow hole, and the cross-sectional area of the through hole is greater than or equal to the cross-sectional area of the inflow hole.

In addition, the particle sensor may include a communication part that communicates by one or more of wired and wireless methods, and may also include receiving measurement data measured by the particle sensor and transmitted by the communication part, and The central processing module for monitoring.

In addition, the central processing module may execute particle response processing when the measurement data meets a preset limit criterion.

In addition, it may further include a discharge fan arranged adjacent to the transfer path of the wafer, and the central processing module may control the operation of the discharge fan when it is determined that the measurement data meets a preset limit criterion.

In addition, it may further include a plurality of imaging modules arranged along the transfer path of the wafer, and the central processing module may receive the imaging module obtained by the imaging module when it is determined that the measurement data meets the preset limit criterion. The image data is sent out.

In addition, the central processing module may determine that the restriction criterion is satisfied when the particle size of the particle is equal to or greater than the criterion value.

In addition, the central processing module may determine that the restriction criterion is satisfied when the density of the particle per unit space is equal to or greater than the reference value.

In addition, the central processing module can control the inflow fan to rotate in a direction that discharges the fluid from the particle sensor to the outside.

On the other hand, a space may be formed inside the transfer plate, a through hole communicating with the space may be formed on the outer peripheral surface of the transfer plate, and the inside of the transfer plate may be provided at a position corresponding to the through hole There is a discharge fan, and a particle sensor is also provided on the outside of the transfer plate corresponding to the through hole.

[Efficacy of invention]

The wafer processing equipment with the particle sensor of the present invention, which aims to solve the above-mentioned problems, has the following effects.

First, it has the advantage of being able to effectively sense and process particles that have flowed in or occurred during the wafer processing process, especially during the transfer process.

Second, according to this, there is an advantage that the inside of the wafer processing equipment can be maintained in a clean room environment.

Third, it has the advantage of being able to perform various follow-up treatments according to the cause of particle occurrence and quickly eliminate the cause.

Fourth, it has the advantage of removing particles immediately when they occur to maximize the quality of the final product.

The effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned are clearly understood by practitioners from the description of the scope of patent application.

Hereinafter, with reference to the drawings, preferred embodiments of the present invention that can specifically achieve the objectives of the present invention will be described. In describing the present embodiment, the same names and the same signs are used for the same configuration, and additional descriptions thereof are omitted.

FIG. 1 is a diagram showing the appearance of a wafer processing apparatus 100 according to the first embodiment of the present invention, and FIG. 2 is a diagram showing the appearance of a wafer transfer unit 200 in the wafer processing apparatus 100 according to the first embodiment of the present invention.

3 is a diagram showing the state of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment 100 according to the first embodiment of the present invention.

As shown in FIGS. 1 to 3, the wafer processing equipment 100 of the present invention includes: a wafer transfer unit 200, which places the wafers and transfers them to the process area through which the processing process is performed; and a particle sensor 300 , Which is provided at a preset position of the wafer transfer unit 200, and determines whether there are particles on the transfer path of the wafer W placed in the wafer transfer unit 200.

Furthermore, the wafer processing apparatus 100 of the present invention may include various constituent elements for processing the wafer W. For example, the wafer processing equipment 100 may include multiple processing areas for performing various processing processes including wafer cutting, grinding, etching, coating, etc., and the wafer transfer unit 200 may be selectively equipped in the multiple processing areas. In this process area, the wafer W is placed and transported.

On the other hand, in the embodiments of the present invention that will be described below, a representative example is the use of a spin coater in the processing process of coating chemical substances on the wafer W in the various processing processes of the wafer processing equipment 100. Of the wafer transfer unit 200 and the particle sensor 300.

However, as mentioned above, the wafer transfer unit 200 and the particle sensor 300 can of course also be provided in any process area of the wafer processing equipment 100, and are not limited to the form of the embodiment described below.

As far as the first embodiment of the present invention shown in FIGS. 1 to 3 is concerned, the wafer processing equipment 100 may include a coating part 110, a fluid supply part 120, a photosensitive liquid container 130, and a solvent container (not shown in the figure). Out).

The coating portion 110 may include more than one processing space inside, and the processing space may be fabricated and opened and closed with a coating door 112 formed on the side of the coating portion 110.

Furthermore, the fluid supply part 120 is provided at the lower part of the coating part 110, receives and transfers the photosensitive liquid and solvent from the photosensitive liquid storage part 130 and the solvent storage part, and makes them flow toward the coating part 110 side. Therefore, the fluid supply part 120 may include various piping assemblies on the inside.

The photosensitive liquid storage unit 130 may include a photosensitive liquid storage tank that contains photosensitive liquid as a constituent element that includes photosensitive liquid. The photosensitive liquid contained in the photosensitive liquid storage tank may be transferred to the coating part 110 through the aforementioned fluid supply part 120.

The solvent storage section is a constituent element provided with a solvent, and the solvent storage tank for containing the solvent may include one or more chemical tanks provided inside. Furthermore, the solvent contained in the solvent storage box may also be transferred to the coating part 110 through the aforementioned fluid supply part.

The wafer transfer unit 200 may be equipped at various positions in the wafer processing equipment 100, especially as shown in FIG. 2, may include: a transfer arm 210 for placing the wafer W; a transfer plate 212, which is equipped with The transfer arm 210 is supported so that the transfer arm 210 is transferred to the coating section 110 including a processing space for processing the wafer W.

At this time, in this embodiment, the transfer arm 210 includes a mounting portion 216 for mounting the wafer W and a forward and backward moving portion 215 capable of moving the mounting portion 216 in the forward and backward directions. Furthermore, the transfer plate 212 is provided at the lower part of the transfer arm 210.

In addition, in this embodiment, the wafer transfer unit 200 may include: a first drive actuator 240, which provides driving force so that the transfer plate 212 can move up and down along the guide rail 220; and a second drive actuator 250, which The connecting portion 230 provides driving force so that the forward and backward moving portion 215 can move forward and backward.

As shown in FIG. 3, the present invention includes a particle sensor 300, which is equipped in a pre-set position of the wafer transfer unit 200, and determines whether the wafer W placed in the wafer transfer unit 200 Whether there are particles on the transport path.

In the present embodiment, the particle sensor 300 is inserted into the through hole 213 formed in the transfer plate 212 and built in the transfer plate 212 in a state of being connected by a connecting member, but as long as it is easy to feel Where the particle is detected, the particle sensor 300 can also be applied to any part of the wafer transfer unit 200.

Furthermore, the particle sensor 300 may include an inflow hole 310 for allowing particles to flow in, and the inflow hole 310 has a state of being exposed in the direction of the transfer arm 210.

In addition, the particle sensor 300 may include a suction fan (not shown in the figure), the suction fan generates suction force as it rotates, and particles can flow in through the inflow hole 310. Moreover, in this embodiment, a heat dissipation hole 320 for dissipating internal heat to the outside may be formed on one side of the particle sensor 300.

As described above, in the present embodiment, the particle sensor 300 is equipped on the transfer plate 212, and thus has the advantage of being able to effectively sense and process particles flowing in or generated during the transfer of the wafer W.

On the other hand, the particle sensor 300 may include a communication unit (not shown in the figure) capable of performing communication by one or more of wired and wireless communication. Therefore, the particle sensor 300 measures The flow of measurement data is shown in Figure 4.

As shown in FIG. 4, the measurement data measured by the particle sensor 300 is transmitted to the dynamic positioning system 20 and the central processing module 30 through the main board 10 of the particle sensor 300.

The central processing module 30 receives measurement data, and while performing monitoring operations, when the measurement data meets a preset limit criterion, it can control each part to execute particle response processing.

The limit criterion can be set in various ways to meet the environment. For example, in this embodiment, when the particle size of the central processing module 30 is above the reference value, and the density per unit space of the particle is the reference value. In the above, it is determined that the restriction criterion is satisfied.

In addition, the central processing module 30 can execute various particle response processing when it is determined that the measurement data meets a preset limit criterion.

As far as this embodiment is concerned, the wafer processing equipment 100 may further include: a discharge fan (not shown in the figure), which is arranged adjacent to the various transfer paths in the wafer W process; and a plurality of imaging modules (not shown in the figure) (Shown), it is arranged along the transfer path of the wafer W. Therefore, when the central processing module 30 determines that the measurement data meets the preset limit criterion, it can control the operation of the discharge fan to discharge the particles to the outside, Or receive the image data obtained by the shooting module and send it out.

In addition, the central processing module 30 can of course execute various particle response processes such as visual and auditory alarms and air-conditioning equipment control.

On the other hand, the wafer W can be moved by the wafer transfer unit 200 according to a program (schedule) preset in the processing process, and therefore, it is possible to determine where it is at a certain time. That is, the central processing module 30 can grasp the position of the wafer W and the current process status and the like based on the current time.

Therefore, the central processing module 30 can also track the position of the wafer W at the time based on the sensing, and track and monitor each of the wafer processing equipment 100 when it determines that the measurement data meets the preset limit criteria. The location of the particle in the constituent element.

FIG. 5 is a graph showing the measurement result by the particle sensor 300 as time flows. The horizontal axis of the graph shown in Figure 5 represents the flow of time as the process progresses, and the vertical axis represents the degree of contamination caused by particles.

As shown in Figure 5, as time flows, the wafer goes through each of the (A) process to (D) process, and the measurement data measured by the particle sensor 300 is transmitted to the center at a preset unit time interval. Processing module 30. The unit time can be set in various ways. In this embodiment, the particle sensor 300 is set to emit measurement data every 100 ms.

As mentioned above, the wafer W can be moved to the process area of (A) process ~ (D) process by means of the wafer transfer unit 200 according to the pre-set procedure (timetable) in the processing process, and it can be judged Where is it located at a certain moment.

As far as the chart exemplarily illustrated in FIG. 5 is concerned, when the wafer W is located in the process area of the (B) process, it is shown that the measurement data measured by the particle sensor 300 meets the preset limit criteria. From this, it can be judged where the problem occurred in the (B) process.

Therefore, in this case, it is possible to control the operation of the discharge fan adjacent to the corresponding process area to discharge the particles to the outside, or perform various particle response processing such as receiving and sending the image data obtained by the imaging module.

The first embodiment of the present invention has been described above. In this embodiment, the particle sensor 300 is provided on the transfer plate 212, but of course, it can also be provided at various positions of the wafer transfer unit 200, or in other configurations of the wafer processing equipment 100 Elements.

Next, another embodiment of the present invention will be described.

FIG. 6(a) is a diagram illustrating the appearance of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment according to the second embodiment of the present invention.

As for the second embodiment of the present invention shown in FIG. 6(a), as shown in the aforementioned first embodiment, the particle sensor 300 is built in the transfer plate 212, and this point is the same.

However, in this embodiment, the through hole 213 formed in the transfer plate 212 is provided at a position corresponding to the inflow hole 310 of the particle sensor 300, and the cross-sectional area is the same as the cross-sectional area of the inflow hole 310. Formation, this point is different.

That is, in this embodiment, the size of the through hole 213 is minimized to prevent particles from flowing into other parts of the particle sensor 300 other than the inflow hole 310 or the inner side of the transfer plate 212, which can minimize operation failure.

On the other hand, FIG. 6(b) shows a configuration in which an inflow fan 217 is provided on the upper part of the through hole 213 in the second embodiment of the present invention.

The inflow fan 217 transfers the surrounding particles to the particle sensor 300 through the through hole 213, so that the particles can be sensed more quickly and accurately. On the other hand, in the initial state, the inflow fan 217 rotates in the direction in which the fluid flows into the particle sensor 300, and then, if it is determined that the particle is sensed by the particle sensor 300, it is controlled so that the direction and the initial Rotate in the opposite direction to remove surrounding particles.

On the other hand, in (b) of FIG. 6, the inflow hole 310 is shaped so that its width gradually decreases along the rotation direction of the fan, and the rotation of the fan causes the fluid to flow into the inflow hole 310. Due to the shape of the inflow hole 310, the liquid velocity increases at the end of the inflow hole 310, so that particles can flow into the particle sensor 300 quickly and accurately.

FIG. 7 is a diagram showing the appearance of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment according to the third embodiment of the present invention.

As for the third embodiment of the present invention shown in FIG. 7, the particle sensor 300 is built in the transfer plate 212, and the cross-sectional area of the through hole 213 is the same as the cross-sectional area of the inflow hole 310. .

However, in this embodiment, it is formed so that the inner surface of the transfer plate 212 and the upper surface of the particle sensor 300 are slightly spaced apart, and a sealing member 214 is also provided therebetween.

The sealing member 214 may be formed around the through hole 213 and the inflow hole 310 to prevent particles from flowing between the inner surface of the transfer plate 212 and the upper surface of the particle sensor 300.

FIG. 8 is a diagram showing the appearance of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment according to the fourth embodiment of the present invention.

With regard to the fourth embodiment of the present invention shown in FIG. 8, the particle sensor 300 is built into the transfer plate 212 as in the aforementioned third embodiment, and is formed so that the inner surface of the transfer plate 212 and the particle sensor The upper surface of the device 300 is slightly spaced apart, and a sealing member 214 is also provided therebetween.

However, in this embodiment, the width d2 of the through hole 213 is formed to be greater than the width d1 of the inflow hole 310, which is different.

That is, in this embodiment, the area of the through hole 213 is formed to be larger, so that the inflow amount of particles can be increased, and more precise measurement data can be obtained.

FIG. 9 is a diagram showing the appearance of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment according to the fifth embodiment of the present invention.

As far as the fifth embodiment of the present invention shown in FIG. 9 is concerned, the particle sensor 300 is built into the transfer plate 212 as in the foregoing fourth embodiment, and is formed so that the inner surface of the transfer plate 212 and the particle sensor The upper surface of the filter 300 is slightly spaced apart, and a sealing member 214 is also provided therebetween. At the same time, the width of the through hole 213 is formed to be larger than the width of the inflow hole 310.

However, in the present embodiment, the outer circumference of the through hole 213 and the inner circumference of the sealing member 214 are formed obliquely in a form in which the width gradually decreases from the upper part to the lower part. This point is different.

As described above, this embodiment can completely delete the various staggered layers that were formed between the transfer plate 212 and the shell of the particle sensor 300 in the fourth embodiment. Therefore, the particles can follow the through hole 213 and the The inclined surface of the sealing member 214 slides and flows into the inflow hole 310 side more smoothly.

FIG. 10 is a diagram showing the appearance of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment according to the sixth embodiment of the present invention.

Regarding the sixth embodiment of the present invention shown in FIG. 10, as shown in the foregoing first embodiment, the particle sensor 300 is built in the transfer plate 212 and is equipped with the upper surface exposed to the outside.

However, in the present embodiment, the particle sensor 300 is equipped with multiple, and the multiple through holes 213 formed in the transfer plate 212 are equipped with each, which is different.

Therefore, in this embodiment, particles can be collected and measured from different areas of the transfer plate 212, and more precise monitoring can be performed based on each measurement data.

FIG. 11 is a diagram showing the appearance of the transfer plate 212 and the particle sensor 300 in the wafer processing equipment according to the seventh embodiment of the present invention.

With regard to the seventh embodiment of the present invention shown in FIG. 11, the particle sensor 300 is formed to be able to move along the X axis and the Y axis within the transfer plate 212, which is different from the foregoing embodiment.

Specifically, as far as this embodiment is concerned, the inside of the transfer plate 212 includes: a pair of first transfer rails 420 spaced apart from each other; a second transfer rail 430 connected to the pair of first transfer rails Between 420, it is formed to be able to move along the length direction of the first transfer rail 420.

Moreover, the second transfer rail 430 is equipped with a placement member 410 for placing the particle sensor 300, and the placement member 410 is formed to be able to move along the length direction of the second transfer rail 430.

That is, the particle sensor 300 of this embodiment is formed to be movable along the X-axis and Y-axis in the transfer plate 212, and according to the situation, a plurality of through holes (213, 213, (Not shown in the figure) to move between and respond quickly.

On the other hand, in the case of the fourth embodiment to the seventh embodiment, as in the second embodiment examined previously, a configuration in which the shape of the inflow fan or the inflow hole is gradually reduced can be applied, which is a common technique The staff speaks for itself.

On the other hand, as shown in FIG. 12, an empty space is formed inside the transfer plate 212, and a through hole communicating with the empty space is formed on the outer peripheral surface of the transfer plate 212.

A blower fan 218 is attached to the through hole of the transfer plate 212 along the inner peripheral surface of the transfer plate 212. The blower fan 218 rotates in a predetermined manner and is configured to release the air inside the transfer plate 212 to the outside.

As described above, the air blower 218 releases the air on the inner peripheral surface of the transfer plate 212 to the outside, thereby achieving cooling of the transfer plate 212.

However, inside the transfer plate 212, particles may be generated during operation, and such particles may contaminate the adjacent wafer W.

Therefore, in the present invention, the particle sensor 300 described above is attached to the through hole to sense the amount of particles generated in the air released from the inside of the transfer plate 212.

The particle sensor 300 can be equipped in the side shell 301 surrounding the side of the particle sensor 300 and the upper shell 302 surrounding the exposed surface of the particle sensor 300, in the side shell 301 and/or the upper shell 302 , A plurality of grooves for discharging air by the blower fan 218 may be formed.

When the particle sensing measurement sensed by the particle sensor 300 is greater than the preset amount, the rotation speed of the blower fan 218 is increased, so that the particles inside the transfer plate 212 are discharged to the outside.

Then, it can be controlled so that the discharge fan at the adjacent position is activated to discharge the particles to the outside.

As mentioned above, after examining the preferred embodiments of the present invention, in addition to the embodiments described above, the present invention can be embodied in other specific forms without exceeding its purpose or scope. This is in the corresponding technical field. The technicians speak for themselves. Therefore, the above-mentioned embodiments are not limited but illustrative. Therefore, the present invention is not limited to the above-mentioned description, and may be changed within the scope of the claims and the equivalent scope thereof.

10: Motherboard 20: Control system 30: Central Processing Module 100: Wafer processing equipment 110: Coating Department 112: coating door 120: Fluid Supply Department 130: photosensitive liquid container 200: Wafer transfer unit 210: transfer arm 212: transfer board 213: Through Hole 214: Sealing member 215: Moving part forward and backward 216: Placement Department 217: Inflow Fan 218: fan 220: Rail 230: connecting part 240: The first drive actuator 250: second drive actuator 300: particle sensor 301: side shell 302: upper shell 310: Inflow hole 320: cooling hole 410: Place components 420: place components 430: second transfer track W: Wafer

FIG. 1 is a diagram showing the appearance of a wafer processing apparatus according to a first embodiment of the present invention;

2 is a diagram showing the appearance of a wafer transfer unit in the wafer processing equipment according to the first embodiment of the present invention;

3 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment according to the first embodiment of the present invention;

4 is a diagram showing the flow of measurement data measured by means of the particle sensor in the wafer processing apparatus of the first embodiment of the present invention;

FIG. 5 is a graph showing the measurement result by means of the particle sensor as time flows;

6 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment according to the second embodiment of the present invention;

7 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment of the third embodiment of the present invention;

8 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment according to the fourth embodiment of the present invention;

9 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment of the fifth embodiment of the present invention;

10 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment of the sixth embodiment of the present invention;

FIG. 11 is a diagram showing the appearance of the transfer plate and the particle sensor in the wafer processing equipment of the seventh embodiment of the present invention; and

Fig. 12 is a diagram showing the appearance of the sensing device and the blower fan for removing particles inside the transfer plate of the present invention.

200: Wafer transfer unit

210: transfer arm

212: transfer board

215: Moving part forward and backward

216: Placement Department

220: Rail

230: connecting part

240: The first drive actuator

250: second drive actuator

W: Wafer

Claims (12)

A wafer processing equipment, including: Wafer transfer unit, which places wafers and transfers them to the process area for wafer processing; A particle sensor, which is provided at a preset position of the wafer transfer unit, and determines whether particles are present on the transfer path of the wafer placed in the wafer transfer unit; and The inflow fan rotates to cause the fluid to flow into the particle sensor. The wafer processing equipment described in claim 1, wherein the aforementioned wafer transfer unit includes: The transfer arm, which is used for placing the aforementioned wafers; and The transfer plate is equipped to support the transfer arm so that the transfer arm is transferred to the process area. The wafer processing apparatus according to claim 2, wherein the particle sensor includes an inflow hole for allowing the particles to flow in, and the inflow hole is incorporated in the transfer plate in a state of being exposed toward the transfer arm. The wafer processing apparatus according to claim 3, wherein a through hole is formed in the transfer plate, the through hole is provided at least at a position corresponding to the inflow hole, and the cross-sectional area is greater than or equal to the cross section of the inflow hole area. The wafer processing equipment described in claim 1, wherein the aforementioned particle sensor includes: The communications department that can communicate by more than one of wired and wireless methods; A central processing module that receives and monitors measurement data measured by the particle sensor and transmitted by the communication unit. The wafer processing equipment described in claim 5, wherein the central processing module executes particle response processing when the measurement data meets a preset limit criterion. The wafer processing equipment described in claim 6, which further includes a discharge fan arranged adjacent to the transfer path of the wafer; The central processing module controls the operation of the discharge fan when it is determined that the measurement data meets a preset limit criterion. The wafer processing equipment described in claim 6, which further includes a plurality of imaging modules arranged along the transfer path of the wafer; When the aforementioned central processing module determines that the aforementioned measurement data meets a preset limit criterion, it receives and sends out the image data obtained by the aforementioned photographing module. The wafer processing equipment according to claim 6, wherein the central processing module determines that the aforementioned limit criterion is satisfied when the particle size of the aforementioned particles is equal to or greater than a reference value. The wafer processing equipment according to claim 6, wherein the central processing module determines that the aforementioned limit criterion is satisfied when the density of the particles per unit space is equal to or greater than a reference value. The wafer processing equipment according to claim 7, wherein the central processing module controls the inflow fan to rotate in a direction in which the fluid is discharged from the particle sensor to the outside. The wafer processing equipment described in claim 2, wherein a space is formed inside the transfer plate; A through hole communicating with the aforementioned space is formed on the outer peripheral surface of the aforementioned transfer plate; Inside the transfer plate, a discharge fan is provided at a position corresponding to the through hole, and a particle sensor is also provided outside the transfer plate corresponding to the through hole.

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