TW202107210A - Metrology apparatus and method using mechanical filter - Google Patents

Metrology apparatus and method using mechanical filter Download PDF

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TW202107210A
TW202107210A TW109112935A TW109112935A TW202107210A TW 202107210 A TW202107210 A TW 202107210A TW 109112935 A TW109112935 A TW 109112935A TW 109112935 A TW109112935 A TW 109112935A TW 202107210 A TW202107210 A TW 202107210A
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diagnostic
light
target
current target
diagnostic light
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保羅 亞歷山大 麥肯茲
傑西 昆恩 歐鐸
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荷蘭商Asml荷蘭公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/70033Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05GX-RAY TECHNIQUE
    • H05G2/00Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
    • H05G2/001X-ray radiation generated from plasma
    • H05G2/003X-ray radiation generated from plasma being produced from a liquid or gas
    • H05G2/006X-ray radiation generated from plasma being produced from a liquid or gas details of the ejection system, e.g. constructional details of the nozzle

Abstract

A metrology apparatus includes: a diagnostic apparatus configured to interact a diagnostic probe with a current target at a diagnostic region before the current target enters a target space; a detection apparatus; and a control system in communication with the detection apparatus. The detection apparatus includes: a light sensor having a field of view overlapping with the diagnostic region and configured to sense light produced from the interaction between the diagnostic probe and the current target at the diagnostic region; and a mechanical filter between the diagnostic region and the light sensor. The mechanical filter includes an optical beam reducer and an optical mask defining an aperture positioned between the optical beam reducer and the light sensor. The control system is configured to estimate a property of the current target based on the output from the light sensor.

Description

使用機械濾光器之度量衡裝置及方法Metrology device and method using mechanical filter

所揭示之主題係關於度量衡裝置及使用機械濾光器來在極紫外光源中之兩種類型之光之間進行區分的方法。The subject of the disclosure relates to metrology devices and the use of mechanical filters to distinguish between two types of light in extreme ultraviolet light sources.

在半導體微影(或光微影)中,製造積體電路(integrated circuit;IC)包括對半導體(例如,矽)基板(其亦稱作晶圓)執行多種物理及化學製程。光微影曝光裝置或掃描器為將所要圖案施加至基板之目標部分上的機器。晶圓係由沿軸向方向延伸之光束輻照,且晶圓經固定至載物台使得晶圓大體上沿實質上與軸向方向正交之橫向平面延伸。光束可具有在例如自約10奈米(nm)至約400 nm之紫外(ultraviolet;UV)範圍(range)內之波長,且具體言之在自約100 nm約400 nm之深UV (deep UV;DUV)範圍內或在小於約100 nm (或大約50 nm或更小,及包括13 nm)之極紫外(extreme ultraviolet;EUV)範圍內之波長。光束沿軸向方向(其與晶圓沿其延伸之橫向平面正交)行進。In semiconductor lithography (or photolithography), manufacturing an integrated circuit (IC) includes performing various physical and chemical processes on a semiconductor (eg, silicon) substrate (which is also referred to as a wafer). A photolithography exposure device or scanner is a machine that applies a desired pattern to a target portion of a substrate. The wafer is irradiated by a beam extending in the axial direction, and the wafer is fixed to the stage so that the wafer extends substantially along a horizontal plane substantially orthogonal to the axial direction. The light beam may have a wavelength within the range of ultraviolet (UV) from about 10 nanometers (nm) to about 400 nm, and in particular, deep UV (deep UV) from about 100 nm to about 400 nm. DUV) or a wavelength in the extreme ultraviolet (EUV) range of less than about 100 nm (or about 50 nm or less, and including 13 nm). The light beam travels in the axial direction (which is orthogonal to the lateral plane along which the wafer extends).

用以產生EUV光之方法包括但未必限於利用在EUV範圍內之發射譜線來將具有一元素(例如,氙、鋰或錫)之材料轉換成電漿狀態。在常常稱為雷射產生電漿(laser produced plasma;「LPP」)之一種此類方法中,可藉由利用可稱作驅動雷射之經放大光束輻照目標材料(例如,呈材料之小滴、板、帶、串流或叢集之形式)來產生所需電漿。對於此製程,通常在例如真空腔室之密封容器中產生電漿,且使用各種類型之度量衡設備來監視電漿。Methods for generating EUV light include, but are not necessarily limited to, using emission lines in the EUV range to convert a material with an element (for example, xenon, lithium, or tin) into a plasma state. In one such method, often referred to as laser produced plasma ("LPP"), a target material (e.g., a small amount of material) can be irradiated with an amplified light beam that can be called a driving laser. In the form of drops, plates, ribbons, strings, or clusters) to generate the required plasma. For this process, plasma is usually generated in a sealed container such as a vacuum chamber, and various types of metrology equipment are used to monitor the plasma.

在一些通用態樣中,度量衡裝置包括:診斷裝置,其經組態以在該當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用;偵測裝置;以及控制系統,其與偵測裝置通信。偵測裝置包括:光感測器,其具有與診斷區重疊之視場且經組態以感測由在診斷區處診斷探針與當前目標之間的相互作用產生之光;以及機械濾光器,其在診斷區與光感測器之間。機械濾光器包括光束縮減器及光學遮罩,該光學遮罩界定定位於光束縮減器與光感測器之間的孔口。控制系統經組態以基於來自光感測器之輸出而估計當前目標之屬性。In some general aspects, the metrology device includes: a diagnostic device, which is configured to cause the diagnostic probe to interact with the current target at the diagnostic area before the current target enters the target space; a detection device; and a control system, which Communicate with the detection device. The detection device includes: a light sensor that has a field of view overlapping with the diagnostic area and is configured to sense light generated by the interaction between the diagnostic probe and the current target at the diagnostic area; and mechanical filtering Detector, which is between the diagnostic area and the light sensor. The mechanical filter includes a beam reducer and an optical shield that defines an aperture positioned between the beam reducer and the light sensor. The control system is configured to estimate the attributes of the current target based on the output from the light sensor.

實施方案可包括以下特徵中之一或多者。舉例而言,機械濾光器可經組態以在角度上分離自診斷區發射之診斷光與自目標空間發射之非診斷光。診斷光可由在診斷區處當前目標與診斷探針之間的相互作用產生。非診斷光可包括自藉由目標空間中之先前目標產生之電漿發射的光。孔口之橫向範圍(extent)可約與光學遮罩之平面中之診斷光的橫向範圍相同或大於光學遮罩之平面中之診斷光的橫向範圍,且光學遮罩之橫向範圍可大於光學遮罩之平面中之非診斷光的橫向範圍或約與光學遮罩之平面中之非診斷光的橫向範圍相同。光學遮罩可經定位以使得自目標空間發射之非診斷光實質上由光學遮罩阻擋,而診斷光實質上穿過孔口。Implementations can include one or more of the following features. For example, the mechanical filter can be configured to angularly separate the diagnostic light emitted from the diagnostic area and the non-diagnostic light emitted from the target space. The diagnostic light can be generated by the interaction between the current target and the diagnostic probe at the diagnostic area. Non-diagnostic light may include light emitted from plasma generated by a previous target in the target space. The lateral extent of the aperture can be approximately the same as or greater than the lateral extent of the diagnostic light in the plane of the optical shield, and the lateral extent of the optical shield can be greater than that of the optical shield. The lateral extent of the non-diagnostic light in the plane of the cover may be approximately the same as the lateral extent of the non-diagnostic light in the plane of the optical cover. The optical shield may be positioned such that non-diagnostic light emitted from the target space is substantially blocked by the optical shield, while the diagnostic light substantially passes through the aperture.

機械濾光器可包括診斷區與光束縮減器之間的光學準直器。光束縮減器可為無焦光束縮減器且可經組態為與光學準直器結合以將有限物件投影至無限。光學準直器及最接近光學準直器之具有正焦距的光束縮減器之組件可整合至單個折射元件中。光束縮減器可經組態以維持光之準直狀態。The mechanical filter may include an optical collimator between the diagnostic zone and the beam reducer. The beam reducer can be an afocal beam reducer and can be configured to be combined with an optical collimator to project finite objects to infinity. The components of the optical collimator and the beam reducer with a positive focal length closest to the optical collimator can be integrated into a single refractive element. The beam reducer can be configured to maintain the collimated state of the light.

光感測器可包括以下一或多者:光電二極體、光電晶體、光相依電阻器、光電倍增管、多單元光接收器、四單元光接收器及相機。The light sensor may include one or more of the following: a photodiode, a photocrystal, a light-dependent resistor, a photomultiplier tube, a multi-unit light receiver, a four-unit light receiver, and a camera.

診斷探針可包括至少一個診斷光束,且光感測器經組態以感測由當前目標與至少一個診斷光束之間的相互作用產生之診斷光。診斷光可包括自當前目標反射、自當前目標散射或由當前目標阻擋之診斷光束。The diagnostic probe may include at least one diagnostic beam, and the light sensor is configured to sense the diagnostic light generated by the interaction between the current target and the at least one diagnostic beam. The diagnostic light may include the diagnostic beam reflected from the current target, scattered from the current target, or blocked by the current target.

偵測裝置可包括光譜濾光器及偏振濾光器中之一或多者。The detection device may include one or more of a spectral filter and a polarization filter.

診斷探針可包括第一診斷光束及第二診斷光束,該第一診斷光束及第二診斷光束各自經組態以在其進入目標空間之前與當前目標相互作用,每一相互作用發生於相異區及相異時間處。The diagnostic probe may include a first diagnostic beam and a second diagnostic beam. The first diagnostic beam and the second diagnostic beam are each configured to interact with the current target before it enters the target space. Each interaction occurs at a different District and different time.

光束縮減器可包括折射望遠鏡、反射望遠鏡或反射折射望遠鏡。折射望遠鏡可包括:正焦距透鏡配置及負焦距透鏡配置,其由其焦距之總和分離;或一對正焦距透鏡配置,其由其焦距之總和分離。The beam reducer may include a refracting telescope, a reflecting telescope or a catadioptric telescope. The refracting telescope may include: a positive focal length lens configuration and a negative focal length lens configuration, which are separated by the sum of their focal lengths; or a pair of positive focal length lens configurations, which are separated by the sum of their focal lengths.

光束縮減器可經組態以將照射光之橫向大小縮減至少五倍、至少十倍、至少二十倍或約十倍。The beam reducer can be configured to reduce the lateral size of the illumination light by at least five times, at least ten times, at least twenty times, or about ten times.

孔口可包括圓形開口、橢圓開口、多邊形開口或細長狹縫開口。The orifice may include a circular opening, an elliptical opening, a polygonal opening, or an elongated slit opening.

偵測裝置可定位於極紫外(EUV)光源之腔室外部,診斷區可在腔室內部,且偵測裝置可經由腔室之壁中之光學窗自腔室接收光。診斷區與光學窗之間的距離可為診斷區與目標空間之間的距離之大小之約200至500倍。The detection device can be positioned outside the chamber of the extreme ultraviolet (EUV) light source, the diagnosis area can be inside the chamber, and the detection device can receive light from the chamber through the optical window in the wall of the chamber. The distance between the diagnostic area and the optical window may be about 200 to 500 times the size of the distance between the diagnostic area and the target space.

偵測裝置可包括孔口之輸出端處之聚焦透鏡,聚焦透鏡經組態以將所感測光聚焦至光感測器上。The detection device may include a focusing lens at the output end of the aperture, the focusing lens being configured to focus the sensed light onto the light sensor.

孔口可具有至少2毫米(mm)之範圍。孔口可經定位以在診斷光在其處為準直或為非收斂及非發散之方位處接收診斷光。The orifice may have a range of at least 2 millimeters (mm). The orifice can be positioned to receive the diagnostic light at a location where the diagnostic light is collimated or non-convergent and non-divergent.

在另一通用態樣中,度量衡方法包括:在當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用;收集由在診斷區處診斷探針與當前目標之間的相互作用產生之診斷光,該收集亦包括收集由目標空間產生之非診斷光;使診斷光及非診斷光準直;使診斷光與非診斷光彼此在角度上分離包括縮減診斷光及非診斷光之橫向範圍;在診斷光及非診斷光已在角度上分離之後在自由非診斷光穿過之非感測區橫向移位之感測區處感測診斷光;以及基於所感測診斷光而估計當前目標之屬性。In another general aspect, the metrology method includes: interacting the diagnostic probe with the current target at the diagnostic area before the current target enters the target space; collecting the interaction between the diagnostic probe and the current target at the diagnostic area The diagnostic light generated, the collection also includes collecting the non-diagnostic light generated by the target space; collimating the diagnostic light and the non-diagnostic light; separating the diagnostic light and the non-diagnostic light from each other in angle, including reducing the diagnostic light and the non-diagnostic light Lateral range; after the diagnostic light and the non-diagnostic light have been angularly separated, the diagnostic light is sensed at the sensing area laterally displaced from the non-sensing area through which the non-diagnostic light passes; and the current is estimated based on the sensed diagnostic light The attributes of the target.

實施方案可包括以下特徵中之一或多者。舉例而言,診斷探針可藉由在診斷區處使一或多個診斷光束與當前目標相互作用來在診斷區處與當前目標相互作用;且診斷光可藉由在診斷區處收集已自當前目標反射、自當前目標散射或由當前目標阻擋之一或多個診斷光束來收集。Implementations can include one or more of the following features. For example, the diagnostic probe can interact with the current target at the diagnostic area by causing one or more diagnostic beams to interact with the current target at the diagnostic area; and the diagnostic light can interact with the current target at the diagnostic area. One or more diagnostic beams are collected by reflection from the current target, scattering from the current target, or blocked by the current target.

度量衡方法可進一步包括基於其光譜屬性及其偏振狀態中之一或多者而過濾診斷光。The metrology method may further include filtering the diagnostic light based on one or more of its spectral properties and its polarization state.

診斷區可在極紫外(EUV)光源之氣密密封腔室內部,且亦包括收集非診斷光之收集診斷光可包括接收包括經由腔室之壁中之光學窗傳輸之非診斷光的診斷光。The diagnostic area can be inside an airtight sealed chamber of an extreme ultraviolet (EUV) light source, and also includes collecting non-diagnostic light. Collecting diagnostic light can include receiving diagnostic light including non-diagnostic light transmitted through an optical window in the wall of the chamber .

診斷光及非診斷光之橫向範圍可藉由將診斷光及非診斷光之橫向範圍縮減五倍、至少十倍、至少二十倍或約十倍來縮減。The lateral extent of the diagnostic light and the non-diagnostic light can be reduced by reducing the lateral extent of the diagnostic light and the non-diagnostic light by five times, at least ten times, at least twenty times, or about ten times.

度量衡方法亦可包括阻擋非感測區處之非診斷光或重新引導該非診斷光。診斷光及非診斷光之橫向範圍可藉由以下中之一或多者縮減:折射該光及反射該光。The metrology method may also include blocking or redirecting the non-diagnostic light at the non-sensing area. The lateral range of the diagnostic light and the non-diagnostic light can be reduced by one or more of the following: refracting the light and reflecting the light.

度量衡方法亦可包括將診斷光聚焦在感測區處。The metrology method may also include focusing the diagnostic light at the sensing area.

診斷光及非診斷光之橫向範圍可藉由維持診斷光及非診斷光之準直狀態來縮減。The lateral range of the diagnostic light and the non-diagnostic light can be reduced by maintaining the collimation state of the diagnostic light and the non-diagnostic light.

度量衡方法亦可包括在診斷光及非診斷光在角度上彼此分離之後及在診斷光經感測之前,使診斷光穿過光學遮罩之孔口,該孔口具有大於診斷光之範圍的範圍。The metrology method may also include, after the diagnostic light and the non-diagnostic light are angularly separated from each other and before the diagnostic light is sensed, passing the diagnostic light through the aperture of the optical shield, the aperture having a range larger than the range of the diagnostic light .

參看圖1,度量衡裝置100經組態以用於估計在環境115內沿軌跡TR朝向目標空間110行進之當前目標105c之一或多個屬性。度量衡裝置100經組態以藉由分析在當前目標105c進入目標空間110之前由於一或多個診斷探針125與當前目標105c之間的相互作用產生之光(稱為診斷光120)來估計當前目標105c之至少一個屬性(諸如速度、方位、速率、方向)。然而,非診斷光122與診斷光120同時及相近似地產生。此非診斷光122可使度量衡裝置100內之光感測器130飽和或可干涉度量衡裝置100中之光感測器130之操作。因為此,非診斷光122可縮減由度量衡裝置100執行之分析之準確度且因此引起當前目標105c之所估計屬性的誤差。Referring to FIG. 1, the metrology apparatus 100 is configured to estimate one or more attributes of the current target 105 c traveling along the trajectory TR toward the target space 110 within the environment 115. The metrology device 100 is configured to estimate the current target 105c by analyzing the light (referred to as the diagnostic light 120) generated by the interaction between the one or more diagnostic probes 125 and the current target 105c before the current target 105c enters the target space 110. At least one attribute of the target 105c (such as speed, bearing, velocity, direction). However, the non-diagnostic light 122 and the diagnostic light 120 are generated at the same time and similarly. This non-diagnostic light 122 may saturate the light sensor 130 in the metrology device 100 or may interfere with the operation of the light sensor 130 in the metrology device 100. Because of this, the non-diagnostic light 122 can reduce the accuracy of the analysis performed by the metrology device 100 and thus cause errors in the estimated attributes of the current target 105c.

度量衡裝置100能夠更有效地及準確地估計當前目標105c之屬性,因為其能夠更有效地在診斷光120與非診斷光122之間進行區分。為此目的,度量衡裝置100包括偵測裝置135,該偵測裝置135包括光感測器130及在診斷區145 (當前目標105c在其處與診斷探針125相互作用)與光感測器130之間的機械濾光器140。機械濾光器140包括光束縮減器150及界定透光孔口160之不透光光學遮罩155。孔口160定位於光束縮減器150與光感測器130之間。為了恰當地感測診斷光120,光感測器130經定位以使得其視場與診斷區145重疊。度量衡裝置100亦包括產生診斷探針125之診斷裝置165及與偵測裝置135通信之控制系統170。控制系統170自感測器130接收輸出且對此輸出執行分析以估計當前目標105c之一或多個屬性。The metrology apparatus 100 can more effectively and accurately estimate the attributes of the current target 105c because it can more effectively distinguish between the diagnostic light 120 and the non-diagnostic light 122. For this purpose, the metrology apparatus 100 includes a detection device 135, which includes a light sensor 130 and a light sensor 130 in the diagnostic area 145 (where the current target 105c interacts with the diagnostic probe 125) Between the mechanical filter 140. The mechanical filter 140 includes a beam reducer 150 and an opaque optical shield 155 defining a light-transmitting aperture 160. The aperture 160 is positioned between the beam reducer 150 and the light sensor 130. In order to properly sense the diagnostic light 120, the light sensor 130 is positioned so that its field of view overlaps the diagnostic area 145. The measurement device 100 also includes a diagnosis device 165 that generates a diagnosis probe 125 and a control system 170 that communicates with the detection device 135. The control system 170 receives output from the sensor 130 and performs analysis on this output to estimate one or more attributes of the current target 105c.

機械濾光器140包括自診斷光120及非診斷光122形成相應準直光束之光學準直器142,且隨後光束縮減器150光學地縮減此等準直光束之大小以分別形成大小縮減的準直光束121、123。光束縮減器150增大藉由準直診斷光束121與準直非診斷光束123產生之影像之間的角分離度。非診斷光122來源於當前目標105c之方位(其產生診斷光120)外部之方位。舉例而言,診斷光120來源於診斷區145,而非診斷光122來源於診斷區145外部,諸如來自目標空間110。因為此,非診斷光122以與診斷光120以其進入機械濾光器140之角度略微不同之角度進入機械濾光器140。此事實可用於機械濾光器140之設計,該機械濾光器140可藉由增大相應準直光束121、123之間的角分離度來進一步分離由診斷光120及非診斷光122產生之影像。在光束已前進光束縮減器150與遮罩155之間的光學路徑152之長度之後,角分離度之增大容許孔口160處之兩種影像之間的較大區分。因此,在此實施方案中,遮罩155經置放以使得孔口160容許診斷光束121 (由診斷光120形成)傳遞至感測器130,而遮罩155阻擋非診斷光束123 (由非診斷光122形成)傳遞至感測器130。The mechanical filter 140 includes an optical collimator 142 that forms the corresponding collimated light beams from the diagnostic light 120 and the non-diagnostic light 122, and then the beam reducer 150 optically reduces the size of these collimated light beams to form reduced-size collimators. Straight beams 121, 123. The beam reducer 150 increases the angular separation between the images generated by the collimated diagnostic beam 121 and the collimated non-diagnostic beam 123. The non-diagnostic light 122 is derived from the position outside the current target 105c (which generates the diagnostic light 120). For example, the diagnostic light 120 originates from the diagnostic area 145, and the non-diagnostic light 122 originates from outside the diagnostic area 145, such as from the target space 110. Because of this, the non-diagnostic light 122 enters the mechanical filter 140 at an angle slightly different from the angle at which the diagnostic light 120 enters the mechanical filter 140. This fact can be used in the design of the mechanical filter 140, which can further separate the diagnostic light 120 and the non-diagnostic light 122 by increasing the angular separation between the corresponding collimated beams 121 and 123. image. After the light beam has advanced the length of the optical path 152 between the beam reducer 150 and the mask 155, the increase in the angular separation allows a greater distinction between the two images at the aperture 160. Therefore, in this embodiment, the mask 155 is placed so that the aperture 160 allows the diagnostic beam 121 (formed by the diagnostic light 120) to pass to the sensor 130, and the mask 155 blocks the non-diagnostic beam 123 (formed by the non-diagnostic light 120). The light 122 is formed) and is transmitted to the sensor 130.

光學準直器142形成相應準直光束以用於輸入至光束縮減器150。準直光束為具有足夠低以使得光束半徑在中等傳播距離內並不經歷大量改變之光束發散度之光束。在此情況下,在不存在任何額外光束塑形的情況下(因此,在不存在光束縮減器150的情況下),自光學準直器142輸出之每一準直光束之光束半徑在延伸至感測器130之距離內將不經歷大量改變。舉例而言,自光學準直器142輸出之準直光束之光束半徑在沿Z方向至感測器130之距離內改變小於1%、小於5%或小於10% (在不存在任何中間光學元件的情況下)。在一些實例中,光學準直器142與感測器130之間的沿Z方向之距離為約一米,但其可取決於光束縮減器150之設計而更短或更長。The optical collimator 142 forms a corresponding collimated beam for input to the beam reducer 150. A collimated beam is a beam with a beam divergence that is low enough so that the beam radius does not undergo a large amount of change within a medium propagation distance. In this case, in the absence of any additional beam shaping (hence, in the absence of the beam reducer 150), the beam radius of each collimated beam output from the optical collimator 142 extends to There will be no significant changes within the distance of the sensor 130. For example, the beam radius of the collimated beam output from the optical collimator 142 changes less than 1%, less than 5%, or less than 10% within the distance from the sensor 130 along the Z direction (in the absence of any intermediate optical element in the case of). In some examples, the distance along the Z direction between the optical collimator 142 and the sensor 130 is about one meter, but it can be shorter or longer depending on the design of the beam reducer 150.

光束縮減器150為無焦系統(亦即,不具有焦點之系統),此意謂光束縮減器150不產生輸入至光束縮減器150之準直光束之網狀收斂(net convergence)或發散度。亦即,光束縮減器150可視為具有保持或維持自光學準直器142輸出之光束之準直狀態之無限有效焦距。此類型之系統可經形成以具有一對光學元件,其中元件之間的距離d等於每一元件之焦距f1、f2之總和(亦即,d = f1+f2)。雖然無焦系統並不更改準直光束之發散度,但其的確更改光束之寬度,從而增大或縮減其放大率。總體而言,光束縮減器150可將自光學準直器142輸出之準直光束之橫向大小(亦即,XsYs平面中之大小)縮減至少五倍、至少十倍或至少二十倍。在一些實施方案中,光束縮減器150將準直光束之橫向大小縮減約10或約20倍。The beam reducer 150 is an afocal system (that is, a system without a focus), which means that the beam reducer 150 does not generate net convergence or divergence of the collimated beam input to the beam reducer 150. That is, the beam reducer 150 can be regarded as having an infinite effective focal length that maintains or maintains the collimated state of the beam output from the optical collimator 142. This type of system can be formed to have a pair of optical elements, where the distance d between the elements is equal to the sum of the focal lengths f1 and f2 of each element (ie, d = f1 + f2). Although the afocal system does not change the divergence of the collimated beam, it does change the width of the beam, thereby increasing or reducing its magnification. In general, the beam reducer 150 can reduce the lateral size (ie, the size in the XsYs plane) of the collimated beam output from the optical collimator 142 by at least five times, at least ten times, or at least twenty times. In some embodiments, the beam reducer 150 reduces the lateral size of the collimated beam by about 10 or about 20 times.

光束縮減器150可為例如折射望遠鏡、反射望遠鏡或反射折射望遠鏡。The beam reducer 150 may be, for example, a refracting telescope, a reflecting telescope or a catadioptric telescope.

折射望遠鏡使用折射光學器件,諸如透鏡或稜鏡,以在遮罩155之平面處形成相應準直光束之影像。在一些實施方案中,折射望遠鏡為包括由其焦距之總和分離之正焦距透鏡配置及負焦距透鏡配置之Galilean望遠鏡。在其他實施方案中,折射望遠鏡為包括由其焦距之總和分離之一對正焦距透鏡配置之Keplerian望遠鏡。在下文中參考圖3及4論述用作光束縮減器150之折射望遠鏡之實例。The refracting telescope uses refractive optics, such as a lens or a mirror, to form an image of the corresponding collimated beam on the plane of the mask 155. In some embodiments, the refracting telescope is a Galilean telescope that includes a positive focal length lens configuration and a negative focal length lens configuration separated by the sum of its focal lengths. In other embodiments, the refracting telescope is a Keplerian telescope that includes a lens configuration with a positive focal length separated by the sum of its focal lengths. An example of a refracting telescope used as the beam reducer 150 is discussed below with reference to FIGS. 3 and 4.

反射望遠鏡包括單個件或曲形鏡面之組合,該等曲形鏡面反射自光學準直器142輸出之準直光束且在遮罩155之平面處形成相應影像。舉例而言,在一些實施方案中,反射望遠鏡為Gregorian望遠鏡、Newtonian望遠鏡或Cassegrain (及其變型)望遠鏡。在其他實施方案中,反射望遠鏡為離軸設計,諸如Herschelian或Schiefspiegler (其為Cassegrain之變型)。關於圖13展示及描述反射望遠鏡之實例。The reflecting telescope includes a single piece or a combination of curved mirrors, which reflect the collimated light beam output from the optical collimator 142 and form a corresponding image on the plane of the mask 155. For example, in some embodiments, the reflecting telescope is a Gregorian telescope, a Newtonian telescope, or a Cassegrain (and its variants) telescope. In other embodiments, the reflecting telescope is an off-axis design, such as Herschelian or Schiefspiegler (which is a variant of Cassegrain). An example of a reflecting telescope is shown and described with respect to Figure 13.

反射折射望遠鏡為其中將折射及反射併入至通常實施透鏡(亦即,屈光學)及曲形鏡面(亦即,反射光學)之光學系統中之一種望遠鏡。舉例而言,在一些實施方案中,反射折射望遠鏡包括Schmidt-Cassegrain望遠鏡及Maksutov-Cassegrain望遠鏡。在其他實施方案中,反射折射望遠鏡為Herschelian望遠鏡之反射折射變型(其使用透鏡及鏡面兩者)或Stevick-Paul望遠鏡之離軸變型。關於圖14展示及描述反射折射望遠鏡之實例。A catadioptric telescope is a telescope in which refraction and reflection are incorporated into an optical system that usually implements a lens (ie, refractive optics) and a curved mirror (ie, reflective optics). For example, in some embodiments, catadioptric telescopes include Schmidt-Cassegrain telescopes and Maksutov-Cassegrain telescopes. In other embodiments, the catadioptric telescope is the catadioptric variant of the Herschelian telescope (which uses both lenses and mirrors) or the off-axis variant of the Stevick-Paul telescope. An example of a catadioptric telescope is shown and described with respect to Figure 14.

環境115可為極紫外(EUV)光源(諸如在下文中參考圖7論述之EUV光源)之腔室內之真空環境。在一些實施方案中,偵測裝置135置放於EUV光源之腔室外部,而診斷區145在腔室內,且偵測裝置135經由腔室之壁中之光學窗來接收診斷光120及非診斷光122。光學窗對診斷光120之波長為可穿透的。下文參考圖7論述此情況。The environment 115 may be a vacuum environment in the chamber of an extreme ultraviolet (EUV) light source (such as the EUV light source discussed below with reference to FIG. 7). In some embodiments, the detection device 135 is placed outside the chamber of the EUV light source, the diagnostic area 145 is inside the chamber, and the detection device 135 receives the diagnostic light 120 and non-diagnostic light through the optical window in the wall of the chamber光122. The optical window is transparent to the wavelength of the diagnostic light 120. This situation is discussed below with reference to FIG. 7.

如參考圖7所論述,EUV光源將EUV光供應至可為微影裝置之輸出裝置。EUV光藉由在目標105達到目標空間110時將目標105轉換為發射EUV光之電漿來形成於環境115中,且此EUV光經收集且傳輸至微影裝置。達到目標空間110之目標105藉由目標105與目標空間110中之輻射脈衝相互作用進行轉換,輻射脈衝將足夠能量提供至目標105以將其轉換為電漿。目標(各自通常指定為105)之連續流106自目標供應裝置175沿軌跡TR朝向目標空間110引導。As discussed with reference to FIG. 7, the EUV light source supplies EUV light to an output device that can be a lithography device. EUV light is formed in the environment 115 by converting the target 105 into plasma that emits EUV light when the target 105 reaches the target space 110, and this EUV light is collected and transmitted to the lithography device. The target 105 reaching the target space 110 is converted by the interaction of the target 105 with the radiation pulse in the target space 110, and the radiation pulse provides enough energy to the target 105 to convert it into plasma. A continuous stream 106 of targets (each generally designated 105) is guided from the target supply device 175 toward the target space 110 along the trajectory TR.

軌跡TR沿可視為目標(或軸向)方向之方向延伸,該方向位於由環境115之實體態樣界定之三維X、Y、Z座標系統中。因此,X、Y、Z座標系統可由界定環境115之腔室之壁或斑點界定。每一目標105之軸向方向大體上具有平行於環境115之座標系統之-X方向的分量。每一目標105之軸向方向亦可具有沿垂直於-X方向之方向Y及Z中之一或多者之分量。另外,由目標供應裝置175釋放之每一目標105可具有略微不同之實際軌跡且軌跡至少部分地取決於在釋放目標105時之目標供應裝置175之物理屬性以及環境115。The trajectory TR extends in a direction that can be regarded as a target (or axial) direction, which is located in a three-dimensional X, Y, and Z coordinate system defined by the physical form of the environment 115. Therefore, the X, Y, and Z coordinate system can be defined by the walls or spots of the chamber defining the environment 115. The axial direction of each target 105 substantially has a component parallel to the -X direction of the coordinate system of the environment 115. The axial direction of each target 105 may also have a component along one or more of the directions Y and Z perpendicular to the -X direction. In addition, each target 105 released by the target supply device 175 may have a slightly different actual trajectory and the trajectory depends at least in part on the physical properties of the target supply device 175 and the environment 115 when the target 105 is released.

另一方面,偵測裝置135界定局部三維Xs、Ys、Zs座標系統且此局部座標系統可由感測器130之影像平面界定。On the other hand, the detection device 135 defines a local three-dimensional Xs, Ys, and Zs coordinate system, and this local coordinate system can be defined by the image plane of the sensor 130.

每一目標105包括當轉換為電漿時發射EUV光之組分。此等目標105自產生區(諸如自目標供應裝置175)朝向目標空間110 (例如,彈道學地)行進。當前目標105c之屬性(諸如速度、方位、速率、方向、到達或運動)由度量衡裝置100藉由在當前目標105c沿軌跡TR行進時用藉由診斷系統165產生之診斷探針125探測當前目標105c、偵測或感測由診斷探針125與當前目標105c之間的相互作用產生之診斷光120以及分析偵測到之診斷光120來估計。Each target 105 includes a component that emits EUV light when converted to plasma. These targets 105 travel from the generating area (such as from the target supply device 175) toward the target space 110 (for example, the ballistic ground). The attributes of the current target 105c (such as speed, azimuth, velocity, direction, arrival, or movement) are detected by the metrology device 100 by using the diagnostic probe 125 generated by the diagnostic system 165 when the current target 105c is traveling along the trajectory TR. , Detect or sense the diagnostic light 120 generated by the interaction between the diagnostic probe 125 and the current target 105c and analyze the detected diagnostic light 120 to estimate.

如上文所提及,非診斷光122亦可存在,且此非診斷光122可干涉當前目標105c之屬性之準確估計。此非診斷光122可包括在當前目標105c與診斷探針125相互作用之前或之時由電漿發射之寬頻帶光輻射,該電漿藉由進入目標空間110之一或多個先前目標105p產生。另外,非診斷光122之強度可比診斷光120之強度大得多。As mentioned above, the non-diagnostic light 122 may also exist, and this non-diagnostic light 122 can interfere with the accurate estimation of the attributes of the current target 105c. This non-diagnostic light 122 may include broadband light radiation emitted by plasma before or when the current target 105c interacts with the diagnostic probe 125, which is generated by entering the target space 110 by one or more of the previous targets 105p . In addition, the intensity of the non-diagnostic light 122 may be much greater than the intensity of the diagnostic light 120.

非診斷光122可包括例如自先前目標105p之電漿發射之EUV光、具有與診斷光120之波長重疊之波長範圍的光,及/或存在之任何光及具有包括可由感測器130偵測之波長範圍之波長範圍的任何光。The non-diagnostic light 122 may include, for example, EUV light emitted from the plasma of the previous target 105p, light having a wavelength range that overlaps the wavelength of the diagnostic light 120, and/or any light that exists and can be detected by the sensor 130 Any light in the wavelength range of the wavelength range.

另一方面,診斷光120由診斷探針125與當前目標105c之間的相互作用產生且診斷光120具有實質上比非診斷光122之光譜帶寬更窄之光譜帶寬。舉例而言,診斷光120之光譜帶寬可比非診斷光122之總體光譜帶寬低數百倍。在一些實施方案中,諸如圖6A至6C中所展示,診斷光120自由當前目標105c反射或自當前目標105c散射之診斷探針125的一部分產生。On the other hand, the diagnostic light 120 is generated by the interaction between the diagnostic probe 125 and the current target 105c, and the diagnostic light 120 has a spectral bandwidth that is substantially narrower than the spectral bandwidth of the non-diagnostic light 122. For example, the spectral bandwidth of the diagnostic light 120 may be hundreds of times lower than the overall spectral bandwidth of the non-diagnostic light 122. In some embodiments, such as shown in FIGS. 6A to 6C, the diagnostic light 120 is generated from a portion of the diagnostic probe 125 that is reflected from or scattered from the current target 105c.

大體而言,感測器130可包括光電二極體、光電晶體、光相依電阻器及光電倍增管中之一或多者。在其他實施方案中,感測器130包括一或多個熱偵測器,諸如熱電偵測器、輻射熱計或校準電荷耦合器件(charged coupled device;CCD)或CMOS。在其他實施方案中,感測器130包括多單元光接收器、四單元光接收器或相機。Generally speaking, the sensor 130 may include one or more of a photodiode, a photocrystal, a light-dependent resistor, and a photomultiplier tube. In other embodiments, the sensor 130 includes one or more thermal detectors, such as a pyroelectric detector, a bolometer, or a calibrated charged coupled device (CCD) or CMOS. In other embodiments, the sensor 130 includes a multi-unit optical receiver, a four-unit optical receiver, or a camera.

如圖1之實施方案中所展示,光學遮罩155經定位以使得準直非診斷光束123 (由非診斷光122產生)實質上或大多經阻擋,而準直診斷光束121實質上穿過孔口160。關於圖15展示及論述另一實施方案,其中準直非診斷光束123實質上穿過孔口,而準直診斷光束121實質上由孔口阻擋。As shown in the embodiment of FIG. 1, the optical shield 155 is positioned so that the collimated non-diagnostic light beam 123 (generated by the non-diagnostic light 122) is substantially or mostly blocked, while the collimated diagnostic light beam 121 substantially passes through the hole口160. Another implementation is shown and discussed with respect to FIG. 15 in which the collimated non-diagnostic beam 123 substantially passes through the aperture and the collimated diagnostic beam 121 is substantially blocked by the aperture.

參考圖2A,在一些實施方案中,遮罩155為界定在XsYs平面中具有圓形形狀之孔口260A之遮罩255A。在其他實施方案中,諸如圖2B中所展示,遮罩155為界定具有狹縫形狀之孔口260B之遮罩255B,該孔口260B不為旋轉對稱的且具有大於沿Xs方向之範圍的沿Ys方向之範圍。圖2B之設計可對其中準直診斷光束121正移動、振盪或擾動以使得其影像平面沿Ys方向移動之情況有用。沿Ys方向之範圍適應準直診斷光束121之影像平面中之此波動。遮罩155可經組態以界定影像平面(XsYs平面)中之諸如橢圓孔口及多邊形開口之孔口160之其他形狀。2A, in some embodiments, the mask 155 is a mask 255A that defines an aperture 260A having a circular shape in the XsYs plane. In other embodiments, such as shown in FIG. 2B, the mask 155 is a mask 255B that defines a slit-shaped aperture 260B that is not rotationally symmetric and has an edge larger than the range along the Xs direction. Range in Ys direction. The design of FIG. 2B can be useful for a situation where the collimated diagnostic beam 121 is moving, oscillating or disturbing so that its image plane moves along the Ys direction. The range along the Ys direction adapts to this fluctuation in the image plane of the collimated diagnostic beam 121. The mask 155 may be configured to define other shapes in the image plane (XsYs plane) such as the elliptical aperture and the polygonal aperture 160.

為了恰當地容許準直診斷光束121傳遞至感測器130,沿XsYs平面之孔口160至少與XsYs平面中之準直診斷光束121之橫向範圍一樣大。另外,為了恰當地阻擋準直非診斷光束123,光學遮罩155應具有至少與XsYs平面中之準直非診斷光束123之橫向範圍一樣大的沿XsYs平面之範圍。此意謂,參考圖2A,XsYs平面中之孔口260A之範圍261A與XsYs平面中之準直診斷光束121之橫向範圍一樣大且遮罩255A之範圍256A足夠大以阻擋平面XsYs中之準直非診斷光束123之全部範圍。作為另一實例,參考圖2B,XsYs平面中之孔口260B之最短範圍261B與XsYs平面中之準直診斷光束121之橫向範圍一樣大且遮罩255B之範圍256B足夠大以阻擋平面XsYs中之準直非診斷光束123之全部範圍。In order to properly allow the collimated diagnostic beam 121 to be transmitted to the sensor 130, the aperture 160 along the XsYs plane is at least as large as the lateral extent of the collimated diagnostic beam 121 in the XsYs plane. In addition, in order to properly block the collimated non-diagnostic beam 123, the optical shield 155 should have a range along the XsYs plane that is at least as large as the lateral range of the collimated non-diagnostic beam 123 in the XsYs plane. This means that, referring to FIG. 2A, the range 261A of the aperture 260A in the XsYs plane is as large as the lateral range of the collimated diagnostic beam 121 in the XsYs plane, and the range 256A of the mask 255A is large enough to block the collimation in the plane XsYs The full range of the non-diagnostic beam 123. As another example, referring to FIG. 2B, the shortest range 261B of the aperture 260B in the XsYs plane is as large as the lateral range of the collimated diagnostic beam 121 in the XsYs plane, and the range 256B of the mask 255B is large enough to block one of the planes XsYs The entire range of the non-diagnostic beam 123 is collimated.

在一些實施方案中,XsYs平面中之相應孔口260A、260B之範圍261A、261B為至少2毫米(mm)或約4 mm。在孔口260A或260B處XsYs平面中之準直診斷光束121之範圍為約3 mm。在一些實施方案中,相應遮罩255A、255B之範圍256A、256B大於3 mm。In some embodiments, the range 261A, 261B of the corresponding orifice 260A, 260B in the XsYs plane is at least 2 millimeters (mm) or about 4 mm. The range of the collimated diagnostic beam 121 in the XsYs plane at the aperture 260A or 260B is about 3 mm. In some embodiments, the range 256A, 256B of the corresponding mask 255A, 255B is greater than 3 mm.

不同於空間濾光器,其中光聚焦於遮罩之孔口處,在機械濾光器140中,穿過孔口160 (諸如孔口260A或260B)之光(診斷光束121)為準直的且因此具有比在空間濾光器之孔口處聚焦之光更大的橫向範圍。因此,XsYs平面中之孔口160 (諸如孔口260A或260B)之大小可比在空間濾光器中使用之孔口大得多以阻擋經聚焦非診斷光且傳遞經聚焦診斷光。因為此,非想要顆粒(諸如環境115中之污垢)對孔口160 (諸如孔口260A或260B)之效能比此類顆粒對空間濾光器之孔口的影響少得多。舉例而言,XsYs平面中之孔口160之大小為約數毫米,且比非想要顆粒之大小大得多。另一方面,空間濾光器之孔口之典型大小可為毫米之幾分之一(例如,在範圍上100 µm)且非想要顆粒可具有相當大小。因為此,當與空間濾光器進行比較時,非想要顆粒與機械濾光器140中之準直光束121之間的干涉縮減。Different from the spatial filter, in which the light is focused at the aperture of the mask, in the mechanical filter 140, the light (diagnostic beam 121) passing through the aperture 160 (such as aperture 260A or 260B) is collimated And therefore, it has a larger lateral range than the light focused at the aperture of the spatial filter. Therefore, the size of the aperture 160 (such as the aperture 260A or 260B) in the XsYs plane can be much larger than the aperture used in the spatial filter to block the focused non-diagnostic light and pass the focused diagnostic light. Because of this, the effect of undesired particles (such as dirt in the environment 115) on the orifice 160 (such as the orifice 260A or 260B) is much less than that of such particles on the orifice of the spatial filter. For example, the size of the orifice 160 in the XsYs plane is about a few millimeters, and is much larger than the size of the undesired particles. On the other hand, the typical size of the orifice of the spatial filter can be a fraction of a millimeter (for example, in the range of 100 µm) and the undesired particles can be of comparable size. Because of this, when compared with the spatial filter, the interference between the undesired particles and the collimated beam 121 in the mechanical filter 140 is reduced.

另外,更易於引導準直診斷光束121穿過孔口160 (260A,260B),此係因為準直診斷光束121與4 mm孔口160 (或260A,260B)之間的相對定位中之容限為約0.2至0.4 mm。另一方面,準直診斷光束121與空間濾光器之100 µm孔口之間的相對定位中之容限為約5至10 µm。In addition, it is easier to guide the collimated diagnostic beam 121 through the aperture 160 (260A, 260B) because of the tolerance in the relative positioning between the collimated diagnostic beam 121 and the 4 mm aperture 160 (or 260A, 260B) It is about 0.2 to 0.4 mm. On the other hand, the tolerance in the relative positioning between the collimated diagnostic beam 121 and the 100 µm aperture of the spatial filter is about 5 to 10 µm.

參考圖3,展示偵測裝置135之實施方案335。在此圖解中,偵測裝置335之座標系統XsYsZs使得Ys為頁面之輸出且Zs垂直於感測器330之成像區延伸。偵測裝置335包括針對診斷光120及非診斷光122中之每一者產生相應準直光束以用於輸入至光束縮減器350之光學準直器342。如上文所論述,在不存在光束縮減器350的情況下,自光學準直器342輸出之每一準直光束之光束半徑在自光學準直器342延伸至感測器330之距離內將不經歷大量改變。光學準直器342在此實例中為雙合透鏡(兩個透鏡342a、342b)。雙合透鏡342之焦距或曲率半徑經選擇以使得診斷光120及非診斷光122之最初曲形波前變得至少對於延伸一定長度至感測器330之距離而言平坦或實質上平坦。Referring to FIG. 3, an implementation 335 of the detection device 135 is shown. In this illustration, the coordinate system XsYsZs of the detection device 335 makes Ys the output of the page and Zs extends perpendicular to the imaging area of the sensor 330. The detection device 335 includes an optical collimator 342 that generates a corresponding collimated light beam for each of the diagnostic light 120 and the non-diagnostic light 122 for input to the beam reducer 350. As discussed above, in the absence of the beam reducer 350, the beam radius of each collimated beam output from the optical collimator 342 will not be within the distance extending from the optical collimator 342 to the sensor 330. Going through a lot of changes. The optical collimator 342 is a doublet lens (two lenses 342a, 342b) in this example. The focal length or radius of curvature of the doublet lens 342 is selected so that the initial curved wavefront of the diagnostic light 120 and the non-diagnostic light 122 becomes flat or substantially flat at least for the distance extending a certain length to the sensor 330.

在此實施方案中,光束縮減器350經設計為Galilean型折射望遠鏡。光束縮減器350光學地縮減自光學準直器342輸出之準直光束之大小以分別形成大小縮減的準直光束121、123。光束縮減器350包括輸入側處之正焦距透鏡配置351 (其可為包括正雙凸透鏡、平凸透鏡或凹凸透鏡中之一或多者的收斂透鏡配置)。光束縮減器350包括輸出側處之負焦距透鏡配置353 (其可為包括凹透鏡之發散透鏡配置)。正焦距透鏡配置351及負焦距透鏡配置353由其焦距之總和分離。收斂透鏡配置351在此實例中為可幫助校正光束中之失真之複合透鏡(具有凸透鏡351a及凹透鏡351b)。光束縮減器350缺乏中間焦點(在收斂透鏡配置351與發散透鏡配置353之間不存在焦點)。雖然不要求,在此實施方案中,發散透鏡配置353包括在收斂透鏡351與發散透鏡353之間的輔助透鏡354。輔助透鏡354可用於與發散透鏡配置353組合以使來自正焦距透鏡配置351之光束準直。輔助透鏡354可為正焦距透鏡,諸如凹凸透鏡(如所展示)、雙凸透鏡或平凸透鏡。總體而言,光束縮減器350可將自光學準直器342輸出之準直光束之橫向大小(亦即,XsYs平面中之大小)縮減至少五倍、至少十倍或至少二十倍。In this embodiment, the beam reducer 350 is designed as a Galilean type refracting telescope. The beam reducer 350 optically reduces the size of the collimated light beam output from the optical collimator 342 to form collimated light beams 121 and 123 of reduced size, respectively. The beam reducer 350 includes a positive focal length lens configuration 351 at the input side (which may be a convergent lens configuration including one or more of a positive biconvex lens, a plano-convex lens, or a meniscus lens). The beam reducer 350 includes a negative focal length lens configuration 353 (which may be a divergent lens configuration including a concave lens) at the output side. The positive focal length lens configuration 351 and the negative focal length lens configuration 353 are separated by the sum of their focal lengths. The convergent lens configuration 351 in this example is a compound lens (having a convex lens 351a and a concave lens 351b) that can help correct distortion in the light beam. The beam reducer 350 lacks an intermediate focus (there is no focus between the convergent lens configuration 351 and the divergent lens configuration 353). Although not required, in this embodiment, the divergent lens configuration 353 includes an auxiliary lens 354 between the convergent lens 351 and the divergent lens 353. The auxiliary lens 354 can be used in combination with the divergent lens configuration 353 to collimate the light beam from the positive focal length lens configuration 351. The auxiliary lens 354 may be a positive focal length lens, such as a meniscus lens (as shown), a biconvex lens, or a plano-convex lens. In general, the beam reducer 350 can reduce the lateral size (ie, the size in the XsYs plane) of the collimated beam output from the optical collimator 342 by at least five times, at least ten times, or at least twenty times.

光束縮減器350輸出經縮減準直診斷光束121及經縮減準直非診斷光束123,其隨後前進至遮罩355之光學路徑352之長度。光學路徑352愈長,遮罩355處之來自此等光束121、123之相應影像之間的分離度愈大。在此實施方案中,遮罩355經置放以使得孔口360容許診斷光束121 (由診斷光120形成)傳遞至感測器330,而遮罩355阻擋非診斷光束123 (由非診斷光122形成)傳遞至感測器330。已穿過孔口360之準直診斷光束121可藉助於收斂透鏡357聚焦至感測器330之成像區上。The beam reducer 350 outputs the reduced collimated diagnostic beam 121 and the reduced collimated non-diagnostic beam 123, which then proceed to the length of the optical path 352 of the mask 355. The longer the optical path 352, the greater the degree of separation between the corresponding images from the light beams 121 and 123 at the mask 355. In this embodiment, the mask 355 is placed so that the aperture 360 allows the diagnostic beam 121 (formed by the diagnostic light 120) to pass to the sensor 330, and the mask 355 blocks the non-diagnostic beam 123 (formed by the non-diagnostic light 122). The formation) is transmitted to the sensor 330. The collimated diagnostic beam 121 that has passed through the aperture 360 can be focused on the imaging area of the sensor 330 by means of the convergent lens 357.

參考圖4,展示偵測裝置135之另一實施方案435。在此圖解中,偵測裝置435之座標系統XsYsZs與頁面對準。偵測裝置435包括針對診斷光120及非診斷光122中之每一者產生相應準直光束以用於輸入至偵測裝置435之光束縮減器450之光學準直器442。如上文所論述,自光學準直器442輸出之每一準直光束之光束半徑在延伸至感測器430之距離內並不經歷大量改變。光學準直器442在此實例中類似於光學準直器342且包含雙合透鏡(兩個透鏡442a、442b)。雙合透鏡442之焦距或曲率半徑經選擇以使得診斷光120及非診斷光122之最初曲形波前變得至少對於延伸一定長度至感測器430之距離而言平坦或實質上平坦。Referring to FIG. 4, another implementation 435 of the detection device 135 is shown. In this illustration, the coordinate system XsYsZs of the detection device 435 is aligned with the page. The detection device 435 includes an optical collimator 442 that generates a corresponding collimated beam for each of the diagnostic light 120 and the non-diagnostic light 122 for input to the beam reducer 450 of the detection device 435. As discussed above, the beam radius of each collimated beam output from the optical collimator 442 does not undergo a large amount of change within the distance extending to the sensor 430. The optical collimator 442 is similar to the optical collimator 342 in this example and includes a doublet lens (two lenses 442a, 442b). The focal length or radius of curvature of the doublet lens 442 is selected so that the initial curved wavefront of the diagnostic light 120 and the non-diagnostic light 122 becomes flat or substantially flat at least for the distance extending a certain length to the sensor 430.

在此實施方案中,光束縮減器450經設計為Keplerian型折射望遠鏡。光束縮減器450光學地縮減自光學準直器442輸出之準直光束之大小以分別形成大小縮減的準直光束121、123。光束縮減器450包括輸入側處之輸入正焦距透鏡配置451 (其可為包括正雙凸透鏡、平凸透鏡或凹凸透鏡中之一或多者的收斂透鏡配置)。光束縮減器450包括輸出側處之輸出正焦距透鏡配置453 (其可為包括正雙凸透鏡、平凸透鏡或凹凸透鏡中之一或多者的收斂透鏡配置)。舉例而言,正焦距透鏡配置453經展示為圖4中之非球面透鏡元件。有可能正焦距透鏡配置453為複合透鏡組。正焦距透鏡配置451、453由其焦距之總和分離。收斂透鏡配置451在此實例中為可幫助校正光束中之失真之複合透鏡(具有凸透鏡451a及凹透鏡451b)。中間焦點IF (或中間焦平面IF)在輸入收斂透鏡配置451與輸出收斂透鏡配置453之間。總體而言,光束縮減器450可將自光學準直器442輸出之準直光束之橫向大小(亦即,XsYs平面中之大小)縮減至少五倍、至少十倍或至少二十倍。沿Zs方向之光束縮減器450之範圍往往會大於沿Zs方向之光束縮減器350之範圍,且因此,空間需求可判定光束縮減器350或450之設計誰更合適。另外,若診斷光120或非診斷光122之功率過高而不能施加中間焦點IF (諸如存在於光束縮減器450中),則光束縮減器350可為更合適設計。In this embodiment, the beam reducer 450 is designed as a Keplerian type refracting telescope. The beam reducer 450 optically reduces the size of the collimated light beam output from the optical collimator 442 to form collimated light beams 121 and 123 of reduced size, respectively. The beam reducer 450 includes an input positive focal length lens configuration 451 at the input side (which may be a convergent lens configuration including one or more of a positive biconvex lens, a plano-convex lens, or a meniscus lens). The beam reducer 450 includes an output positive focal length lens configuration 453 at the output side (which may be a convergent lens configuration including one or more of a positive biconvex lens, a plano-convex lens, or a meniscus lens). For example, the positive focal length lens configuration 453 is shown as the aspheric lens element in FIG. 4. It is possible that the positive focal length lens configuration 453 is a compound lens group. The positive focal length lens arrangements 451, 453 are separated by the sum of their focal lengths. The convergent lens configuration 451 in this example is a compound lens (having a convex lens 451a and a concave lens 451b) that can help correct distortion in the light beam. The intermediate focal point IF (or intermediate focal plane IF) is between the input convergent lens configuration 451 and the output convergent lens configuration 453. In general, the beam reducer 450 can reduce the lateral size (ie, the size in the XsYs plane) of the collimated beam output from the optical collimator 442 by at least five times, at least ten times, or at least twenty times. The range of the beam reducer 450 along the Zs direction tends to be larger than the range of the beam reducer 350 along the Zs direction, and therefore, the space requirement can determine the design of the beam reducer 350 or 450 which is more suitable. In addition, if the power of the diagnostic light 120 or the non-diagnostic light 122 is too high to apply the intermediate focus IF (such as present in the beam reducer 450), the beam reducer 350 may be more appropriately designed.

光束縮減器450輸出經縮減準直診斷光束121及經縮減準直非診斷光束123,其隨後前進至遮罩455之光學路徑452之長度。光學路徑452愈長,遮罩455處之來自此等光束121、123之相應影像之間的分離度愈大。在此實施方案中,遮罩455經置放以使得孔口460容許診斷光束121 (由診斷光120形成)傳遞至感測器430,而遮罩455阻擋非診斷光束123 (由非診斷光122形成)傳遞至感測器430。已穿過孔口460之準直診斷光束121可藉助於收斂透鏡457聚焦至感測器430之成像區上。The beam reducer 450 outputs the reduced collimated diagnostic beam 121 and the reduced collimated non-diagnostic beam 123, which then proceed to the length of the optical path 452 of the mask 455. The longer the optical path 452 is, the greater the degree of separation between the corresponding images from the light beams 121 and 123 at the mask 455 is. In this embodiment, the mask 455 is placed so that the aperture 460 allows the diagnostic beam 121 (formed by the diagnostic light 120) to pass to the sensor 430, and the mask 455 blocks the non-diagnostic beam 123 (formed by the non-diagnostic light 122). The formation) is transmitted to the sensor 430. The collimated diagnostic beam 121 that has passed through the aperture 460 can be focused on the imaging area of the sensor 430 by means of the convergent lens 457.

參看圖5,在其他實施方案中,偵測裝置135為亦包括可與機械濾光器140串聯或並聯配置之一或多個光譜濾光器543及偏振濾光器544之偵測裝置535。光譜濾光器543為傳遞特定波長範圍內之光之濾光器,諸如帶通濾光器。偏振濾光器544為傳遞具有特定偏振之光之濾光器。舉例而言,診斷光120可取決於診斷探針125之偏振而具有相異偏振,而非診斷光122可為非偏振的。因此,偏振濾光器可選擇待傳遞之診斷光120之偏振。Referring to FIG. 5, in other embodiments, the detecting device 135 is a detecting device 535 that also includes one or more spectral filters 543 and polarization filters 544 that can be configured in series or in parallel with the mechanical filter 140. The spectral filter 543 is a filter that transmits light in a specific wavelength range, such as a band pass filter. The polarization filter 544 is a filter that transmits light with a specific polarization. For example, the diagnostic light 120 may have a different polarization depending on the polarization of the diagnostic probe 125, and the non-diagnostic light 122 may be unpolarized. Therefore, the polarization filter can select the polarization of the diagnostic light 120 to be transmitted.

參考圖6A,在一些實施方案中,診斷裝置165經設計為診斷裝置665A。診斷裝置665A產生來自光源626A之單個探針光束625A作為一或多個診斷探針125。探針光束625A經引導作為光幕以在位置x處與軌跡TR交叉以使得目標105中之每一者以其至目標空間110之方式穿過光幕。光源626A產生經引導穿過修改光束611A以形成單個探針光束625A之一或多個光學元件627A (諸如鏡面、透鏡、孔口及/或濾光器)之單個光束611A。Referring to Figure 6A, in some embodiments, the diagnostic device 165 is designed as a diagnostic device 665A. The diagnostic device 665A generates a single probe beam 625A from the light source 626A as one or more diagnostic probes 125. The probe beam 625A is guided as a light curtain to cross the trajectory TR at position x so that each of the targets 105 passes through the light curtain in its way to the target space 110. The light source 626A generates a single beam 611A that is directed through the modified beam 611A to form one or more of the optical elements 627A (such as mirrors, lenses, apertures, and/or filters) of a single probe beam 625A.

光源626A可為固態雷射器,諸如YAG雷射器,其可為在1070 nm下及在50 W功率下操作之釹摻雜YAG (Nd:YAG)雷射器。在此實例中,當當前目標105c在時間t處穿過探針光束625A時,探針光束625A中之至少一些自當前目標105c反射或散射以形成由偵測裝置135偵測之診斷光620A。控制系統170使用來自感測器130之資訊來估計當前目標105之移動屬性,其可用於估計目標空間110處之現有目標(其可為當前目標105c或後續目標)之到達時間。此估計可用於調整經引導至目標空間110之輻射脈衝之特性以確保輻射脈衝與目標空間110中之現有目標相互作用。控制系統170亦可依賴於一些關於現有目標之路徑之假設以執行計算從而估計目標空間110處之現有目標之到達時間。The light source 626A may be a solid state laser, such as a YAG laser, which may be a neodymium-doped YAG (Nd:YAG) laser operating at 1070 nm and at a power of 50 W. In this example, when the current target 105c passes through the probe beam 625A at time t, at least some of the probe beams 625A are reflected or scattered from the current target 105c to form the diagnostic light 620A detected by the detection device 135. The control system 170 uses the information from the sensor 130 to estimate the movement attributes of the current target 105, which can be used to estimate the arrival time of an existing target (which may be the current target 105c or a subsequent target) at the target space 110. This estimate can be used to adjust the characteristics of the radiation pulse guided to the target space 110 to ensure that the radiation pulse interacts with existing targets in the target space 110. The control system 170 can also rely on some assumptions about the path of the existing target to perform calculations to estimate the arrival time of the existing target at the target space 110.

探針光束625A可為高斯(Gaussian)光束以使得其光學強度之橫向分佈可經描述為具有高斯函數。探針光束625A之焦點或光束腰可經組態以在軌跡TR或-X方向處重疊。另外,光學元件627A可包括確保探針光束625A之焦點(或光束腰)與軌跡TR交疊之折射光學器件。The probe beam 625A can be a Gaussian beam so that the lateral distribution of its optical intensity can be described as having a Gaussian function. The focal point or beam waist of the probe beam 625A can be configured to overlap in the trajectory TR or -X direction. In addition, the optical element 627A may include a refractive optical device that ensures that the focus (or beam waist) of the probe beam 625A overlaps the track TR.

參考圖6B,在一些實施方案中,診斷裝置165經設計為診斷裝置665B。診斷裝置665B產生兩個探針光束625B_1及625B_2作為一或多個診斷探針125。探針光束625B_1經引導作為第一光幕以在第一方位(例如,沿X軸之方位x1)處與軌跡TR交叉以使得目標105中之每一者以其至目標空間110之方式穿過第一光幕。探針光束625B_2經引導作為第二光幕以在第二方位(例如,沿X軸之方位x2)處與軌跡TR交叉以使得目標105中之每一者以其至目標空間110之方式及在已穿過第一光幕之後穿過第二光幕。探針光束625B_1、625B_2由軌跡TR處之等於x2-x1之距離Δd分離。此雙幕診斷裝置665B不僅可用於判定目標105之方位及到達資訊且亦可用於判定目標105之速度(speed)或速率(velocity)。Referring to Figure 6B, in some embodiments, the diagnostic device 165 is designed as a diagnostic device 665B. The diagnostic device 665B generates two probe beams 625B_1 and 625B_2 as one or more diagnostic probes 125. The probe beam 625B_1 is guided as a first light curtain to cross the trajectory TR at a first orientation (for example, the orientation along the X axis x1) so that each of the targets 105 passes through in a way to the target space 110 The first light curtain. The probe beam 625B_2 is guided as a second light curtain to cross the trajectory TR at a second orientation (for example, the orientation along the X axis x2) so that each of the targets 105 reaches the target space 110 and in After passing through the first light curtain, pass through the second light curtain. The probe beams 625B_1, 625B_2 are separated by a distance Δd equal to x2-x1 at the track TR. The dual-screen diagnostic device 665B can be used not only to determine the orientation and arrival information of the target 105, but also to determine the speed or velocity of the target 105.

在一些實施方案中,診斷裝置665B包括產生單個光束611B之單個光源626B及接收單個光束且將光束611B拆分為兩個探針光束625B_1、625B_2之一或多個光學元件627B。另外,光學元件627B可包括用於將探針光束625B_1、625B_2朝向沿軌跡TR之相應方位x1、x2引導之組件。In some implementations, the diagnostic device 665B includes a single light source 626B that generates a single light beam 611B and an optical element 627B that receives the single light beam and splits the light beam 611B into one of two probe beams 625B_1, 625B_2. In addition, the optical element 627B may include components for guiding the probe beams 625B_1, 625B_2 toward the corresponding directions x1, x2 along the track TR.

在一些實施方案中,光學組件627B包括將來自單個光源626B之單個光束拆分為兩個探針光束625B_1、625B_2之光束分光器。舉例而言,光束分光器可為介電鏡面、光束分光器方塊或偏振光束分光器。光學組件627B中之一或多者可為經置放以重新引導探針光束625B_1、625B_2中之任一者或兩者以使得朝向軌跡TR引導探針光束625B_1、625B_2兩者之反射光學器件。In some embodiments, the optical assembly 627B includes a beam splitter that splits a single beam from a single light source 626B into two probe beams 625B_1, 625B_2. For example, the beam splitter can be a dielectric mirror, a beam splitter block, or a polarizing beam splitter. One or more of the optical components 627B may be reflective optics that are placed to redirect either or both of the probe beams 625B_1, 625B_2 such that both of the probe beams 625B_1, 625B_2 are directed toward the trajectory TR.

在其他實施方案中,光學組件627B包括拆分光學器件(諸如繞射光學器件或二進位相繞射光柵、雙折射晶體、強度光束分光器、偏振光束分光器或二色性光束分光器)及折射光學器件,諸如聚焦透鏡。光束611B經引導穿過拆分光學器件,該拆分光學器件將光束611B拆分為兩個光束,該兩個光束沿相異方向行進且經引導穿過折射光學器件以產生探針光束625B_1、625B_2。拆分光學器件可拆分光束611B以使得探針光束625B_1、625B_2由軌跡TR處之設定距離(例如,沿X方向之0.65 mm)分離。在此實例中,x2-x1=0.65 mm。另外,折射光學器件可確保探針光束625B_1、625B_2中之每一者之焦點(或光束腰)與軌跡TR重疊。In other embodiments, the optical component 627B includes splitting optics (such as diffraction optics or binary phase diffraction gratings, birefringent crystals, intensity beam splitters, polarizing beam splitters, or dichroic beam splitters) and Refractive optics, such as focusing lenses. The beam 611B is guided through the splitting optics, which splits the beam 611B into two beams that travel in different directions and are guided through the refractive optics to produce the probe beam 625B_1, 625B_2. The splitting optics can split the beam 611B so that the probe beams 625B_1, 625B_2 are separated by a set distance (for example, 0.65 mm along the X direction) at the track TR. In this example, x2-x1=0.65 mm. In addition, the refractive optics can ensure that the focal point (or beam waist) of each of the probe beams 625B_1 and 625B_2 overlaps the track TR.

如此實例中所展示,探針光束625B_1、625B_2經引導以使得其在不同方位x1、x2處與軌跡TR相交但大體上以相對於X軸之實質上類似角度相交。舉例而言,以相對於X軸之約90°引導探針光束625B_1、625B_2。在其他實施方案中,可使用拆分光學器件及折射光學器件來調整相對於X軸以其引導探針光束625B_1、625B_2之角度,使得該等探針光束朝向軌跡TR扇出且以不同及相異角度與軌跡TR相交。舉例而言,探針光束625B_1可相對於-X方向以大致90°與軌跡TR相交,而探針光束625B_2可相對於-X方向以小於90°之角度與軌跡TR相交。As shown in this example, the probe beams 625B_1, 625B_2 are directed so that they intersect the trajectory TR at different orientations x1, x2 but substantially at a substantially similar angle with respect to the X axis. For example, the probe beams 625B_1, 625B_2 are guided at approximately 90° with respect to the X axis. In other embodiments, split optics and refractive optics can be used to adjust the angles of the probe beams 625B_1, 625B_2 with respect to the X axis, so that the probe beams fan out toward the trajectory TR and have different phases. The different angle intersects the trajectory TR. For example, the probe beam 625B_1 may intersect the track TR at substantially 90° with respect to the -X direction, and the probe beam 625B_2 may intersect the track TR at an angle of less than 90° with respect to the -X direction.

探針光束625B_1、625B_2中之每一者可為高斯光束,使得可藉由高斯函數描述每一探針光束625B_1、625B_2之光學強度之橫向分佈。每一探針光束625B_1、625B_2之焦點或光束腰可經組態以在軌跡TR或-X方向處重疊。Each of the probe beams 625B_1, 625B_2 can be a Gaussian beam, so that the lateral distribution of the optical intensity of each probe beam 625B_1, 625B_2 can be described by a Gaussian function. The focal point or beam waist of each probe beam 625B_1, 625B_2 can be configured to overlap in the trajectory TR or -X direction.

光源626B可為固態雷射器,諸如YAG雷射器,其可為在1070 nm下及在50 W功率下操作之釹摻雜YAG (Nd:YAG)雷射器。在此實例中,當前目標105c在時間t1 (及方位x1)處穿過第一探針光束625B_1,且探針光束625B_1中之至少一些自當前目標105c反射或散射以形成由偵測裝置135 (藉助於機械濾光器140)偵測之診斷光620B_1。另外,當前目標105c在時間t2 (及方位x2)處穿過第二探針光束625B_2,探針光束625B_2中之至少一些自當前目標105c反射或散射以形成由偵測裝置135 (藉助於機械濾光器140)偵測之光620B_2。The light source 626B may be a solid state laser, such as a YAG laser, which may be a neodymium-doped YAG (Nd:YAG) laser operating at 1070 nm and at a power of 50 W. In this example, the current target 105c passes through the first probe beam 625B_1 at time t1 (and position x1), and at least some of the probe beams 625B_1 are reflected or scattered from the current target 105c to form a detection device 135 ( The diagnostic light 620B_1 detected by the mechanical filter 140). In addition, the current target 105c passes through the second probe beam 625B_2 at time t2 (and azimuth x2), and at least some of the probe beams 625B_2 are reflected or scattered from the current target 105c to form a detection device 135 (by means of mechanical filtering). The light device 140) detects the light 620B_2.

軌跡TR處之探針光束625B_1、625B_2之間的分離度Δd可取決於自目標供應裝置175以其釋放目標105之速率(rate)以及目標105之大小及材料而經調整或定製。舉例而言,分離度Δd可小於相鄰目標105之間的間距。作為另一實例,可基於相鄰目標105之間的間距而判定或設定分離度Δd以提供基於探針光束625B_1、625B_2與當前目標105c之間的相互作用而執行之量測之較大精確度。在一定程度上且大體而言,分離度Δd愈大,執行之量測之精確度愈高。舉例而言,分離度Δd可在約250 µm與800 µm之間。The separation Δd between the probe beams 625B_1 and 625B_2 at the trajectory TR can be adjusted or customized depending on the rate at which the target 105 is released from the target supply device 175 and the size and material of the target 105. For example, the degree of separation Δd may be smaller than the distance between adjacent targets 105. As another example, the separation Δd can be determined or set based on the distance between adjacent targets 105 to provide greater accuracy in the measurement performed based on the interaction between the probe beams 625B_1, 625B_2 and the current target 105c . To a certain extent and generally speaking, the greater the separation Δd, the higher the accuracy of the measurement performed. For example, the resolution Δd can be between about 250 µm and 800 µm.

探針光束625B_1、625B_2與當前目標105c之間的相互作用使得控制系統170能夠判定移動屬性,諸如沿-X方向之當前目標105c之速率V。亦有可能判定遍及許多目標105之速率V或改變速率V之趨勢。若進行關於當前目標105c之運動之一些假設,則亦有可能僅使用探針光束625B_1、625B_2來判定沿-X方向之當前目標105c之移動屬性中之改變。The interaction between the probe beams 625B_1, 625B_2 and the current target 105c enables the control system 170 to determine movement attributes, such as the velocity V of the current target 105c in the -X direction. It is also possible to determine the velocity V across many targets 105 or the tendency to change the velocity V. If some assumptions about the movement of the current target 105c are made, it is also possible to use only the probe beams 625B_1, 625B_2 to determine changes in the movement attributes of the current target 105c along the -X direction.

藉由診斷裝置165產生之診斷探針125 (諸如探針光束625A及探針光束625B_1、625B_2)之波長應與經引導至目標空間110 (以用於與目標105相互作用)之輻射脈衝之波長足夠相異以有助於在診斷光120與非診斷光122之間進行區分。在一些實施方案中,探針光束125、625A、625B_1及625B_2之波長為532 nm或1550 nm。The wavelength of the diagnostic probe 125 (such as the probe beam 625A and the probe beams 625B_1, 625B_2) generated by the diagnostic device 165 should be the same as the wavelength of the radiation pulse guided to the target space 110 (for interaction with the target 105) It is sufficiently different to help distinguish between the diagnostic light 120 and the non-diagnostic light 122. In some embodiments, the wavelengths of the probe beams 125, 625A, 625B_1, and 625B_2 are 532 nm or 1550 nm.

在諸如圖6C中展示之其他實施方案中,診斷裝置665C包括各自分別產生光束611C_1、611C_2之一對光源626C_1、626C_2 (諸如兩個雷射器),而非具有諸如診斷裝置665B中之光源626B之單個光源。光束611C_1、611C_2中之每一者穿過可更改或調整光束611C_1、611C_2之特性之相應一或多個光學元件627C_1、627C_2。一或多個光學元件中之每一者之輸出端為相應探針光束625C_1、625C_2。光學組件627C_1、627C_2可包括用於將相應探針光束625C_1、625C_2朝向沿軌跡TR之相應方位x1、x2引導之組件。上文參考光學組件608B論述光學組件627C_1、627C_1之實例。In other implementations such as that shown in FIG. 6C, the diagnostic device 665C includes a pair of light sources 626C_1, 626C_2 (such as two lasers) that each generate one of the light beams 611C_1, 611C_2, instead of having a light source 626B such as in the diagnostic device 665B The single light source. Each of the light beams 611C_1, 611C_2 passes through the corresponding one or more optical elements 627C_1, 627C_2 that can change or adjust the characteristics of the light beams 611C_1, 611C_2. The output end of each of the one or more optical elements is the corresponding probe beam 625C_1, 625C_2. The optical components 627C_1, 627C_2 may include components for guiding the corresponding probe beams 625C_1, 625C_2 toward the corresponding directions x1, x2 along the track TR. Examples of the optical components 627C_1, 627C_1 are discussed above with reference to the optical component 608B.

如上文所論述,且參考圖7,在一些實施方案中,度量衡裝置100經實施為EUV光源776中之度量衡裝置700以量測目標105之一或多個屬性。EUV光源776包括目標供應裝置775,該目標供應裝置775產生沿軌跡TR朝向由腔室716界定之真空環境715內部之目標空間710的目標(各自通常指定為105)之連續流706。EUV光源776將已藉由目標105與輻射脈衝778之間的相互作用產生之EUV光777供應至輸出裝置779。如上文所論述,在當前目標105c沿軌跡TR朝向目標空間710行進時,度量衡裝置700量測且分析當前目標105c之一或多個移動屬性(諸如速度、速率及加速度)。軌跡TR沿可視為目標(或軸向)方向之方向延伸,該方向位於由腔室716界定之三維X、Y、Z座標系統中。如上文所論述,目標105之軸向方向大體上具有平行於腔室716之座標系統之-X方向之分量。然而,目標105之軸向方向亦可具有沿垂直於-X方向之方向Y及Z中之一或多者之分量。另外,由目標供應裝置775釋放之每一目標105可具有略微不同之實際軌跡且軌跡取決於在釋放目標105時之目標供應裝置775之物理屬性以及腔室716內之環境715。As discussed above, and referring to FIG. 7, in some implementations, the metrology device 100 is implemented as the metrology device 700 in the EUV light source 776 to measure one or more attributes of the target 105. The EUV light source 776 includes a target supply device 775 that generates a continuous flow 706 of targets (each generally designated 105) along the trajectory TR toward the target space 710 inside the vacuum environment 715 defined by the chamber 716. The EUV light source 776 supplies EUV light 777 that has been generated by the interaction between the target 105 and the radiation pulse 778 to the output device 779. As discussed above, when the current target 105c travels toward the target space 710 along the trajectory TR, the metrology device 700 measures and analyzes one or more movement attributes (such as speed, velocity, and acceleration) of the current target 105c. The trajectory TR extends in a direction that can be regarded as the target (or axial) direction, which is in the three-dimensional X, Y, and Z coordinate system defined by the cavity 716. As discussed above, the axial direction of the target 105 generally has a component parallel to the −X direction of the coordinate system of the chamber 716. However, the axial direction of the target 105 may also have a component along one or more of the directions Y and Z perpendicular to the −X direction. In addition, each target 105 released by the target supply device 775 may have a slightly different actual trajectory and the trajectory depends on the physical properties of the target supply device 775 and the environment 715 in the chamber 716 when the target 105 is released.

EUV光源776大體上包括EUV集光器780、光學源781、與光學源781通信之致動系統782及與度量衡裝置700之控制系統770以及目標供應裝置775、光學源781及致動系統782通信的控制裝置783。The EUV light source 776 generally includes an EUV concentrator 780, an optical source 781, an actuation system 782 that communicates with the optical source 781, a control system 770 that communicates with the metrology device 700, and a target supply device 775, an optical source 781, and an actuation system 782 in communication.的控制装置783。 Control device 783.

EUV集光器780儘可能多地收集自電漿785發射之EUV光784且朝向輸出裝置779重新引導作為經收集EUV光777之彼EUV光784。集光器780可為反射光學器件,諸如能夠反射具有EUV波長之光(亦即,EUV光784)以形成所產生EUV光777之曲形鏡面。The EUV light collector 780 collects as much EUV light 784 emitted from the plasma 785 as possible and redirects it toward the output device 779 as the other EUV light 784 of the collected EUV light 777. The light collector 780 may be a reflective optical device, such as a curved mirror surface capable of reflecting light having EUV wavelengths (ie, EUV light 784) to form the generated EUV light 777.

光學源781產生輻射脈衝778之一或多個光束且大體上沿Z方向將輻射脈衝778之一或多個光束引導至目標空間710 (但輻射脈衝778之光束可處於相對於Z方向之一角度)。在作為示意性表示之圖7中,輻射脈衝778之光束經展示為沿-Y方向經引導。光學源781包括產生輻射脈衝778之一或多個光源、包括改變輻射脈衝778之光束之方向或角度之光學轉向組件的光束遞送系統及將輻射脈衝778之光束聚焦至目標空間710之聚焦總成。例示性光學轉向組件包括視需要藉由折射或反射來使輻射脈衝778之光束轉向或引導該光束的光學元件,諸如透鏡及鏡面。致動系統782可用於控制或移動光束遞送系統之光學組件及聚焦總成之各種特徵,以及調整產生輻射脈衝778之光學源781之態樣。The optical source 781 generates one or more beams of radiation pulses 778 and guides one or more beams of radiation pulses 778 to the target space 710 generally along the Z direction (but the beams of the radiation pulses 778 may be at an angle relative to the Z direction ). In FIG. 7 as a schematic representation, the beam of radiation pulse 778 is shown as being guided along the -Y direction. The optical source 781 includes one or more light sources that generate a radiation pulse 778, a beam delivery system including an optical steering component that changes the direction or angle of the beam of the radiation pulse 778, and a focusing assembly that focuses the beam of the radiation pulse 778 to a target space 710 . Exemplary optical steering components include optical elements such as lenses and mirrors that redirect or guide the beam of radiation pulse 778 by refraction or reflection as necessary. The actuation system 782 can be used to control or move various features of the optical components and focusing assembly of the beam delivery system, and to adjust the configuration of the optical source 781 that generates the radiation pulse 778.

光學源781包括至少一個增益介質及激發增益介質以產生輻射脈衝778之能量源。輻射脈衝778構成彼此及時分離之複數個光學脈衝。在其他實施方案中,自光學源781輸出之光束可為連續波(continuous wave;CW)光束。光學源781可為或包括例如固態雷射器(例如,Nd:YAG雷射器,鉺摻雜纖維(Er:玻璃)雷射器或在1070 nm下及在50 W功率下操作之釹摻雜YAG (Nd:YAG)雷射器)。The optical source 781 includes at least one gain medium and an energy source for exciting the gain medium to generate a radiation pulse 778. The radiation pulses 778 constitute a plurality of optical pulses separated from each other in time. In other embodiments, the light beam output from the optical source 781 may be a continuous wave (CW) light beam. The optical source 781 may be or include, for example, a solid state laser (eg, Nd:YAG laser, Erbium-doped fiber (Er:glass) laser, or neodymium doped at 1070 nm and 50 W power). YAG (Nd:YAG) laser).

致動系統782耦合至光學源781之組件且亦與控制裝置783通信且在控制裝置783之控制下。致動系統782能夠修改或控制輻射脈衝778與目標空間710中之目標105之間的相對位置。舉例而言,致動系統782經組態以調整輻射脈衝778之釋放之時序及輻射脈衝778以其行進之方向中的一或多者。The actuation system 782 is coupled to the components of the optical source 781 and also communicates with the control device 783 and is under the control of the control device 783. The actuation system 782 can modify or control the relative position between the radiation pulse 778 and the target 105 in the target space 710. For example, the actuation system 782 is configured to adjust one or more of the timing of the release of the radiation pulse 778 and the direction in which the radiation pulse 778 travels.

目標供應裝置775經組態以在特定速率下釋放目標105之流(或多者706)。當判定對當前目標105c之一或多個移動屬性執行量測及分析所需之時間之總量以及基於該量測及分析而影響對EUV光源776之其他態樣或組件之改變時,度量衡裝置700考慮此速率。舉例而言,控制系統170可將量測及分析之結果傳送至控制裝置783,其判定如何調整一或多個信號以適應致動系統782,從而調整經引導至目標空間710之輻射脈衝778之一或多個特性。The target supply device 775 is configured to release the stream of targets 105 (or more 706) at a certain rate. When determining the total amount of time required to perform measurement and analysis on one or more of the movement attributes of the current target 105c and the changes to other aspects or components of the EUV light source 776 based on the measurement and analysis, the measurement device 700 consider this rate. For example, the control system 170 may transmit the measurement and analysis results to the control device 783, which determines how to adjust one or more signals to adapt to the actuation system 782, thereby adjusting the radiation pulse 778 guided to the target space 710 One or more characteristics.

對輻射脈衝778之一或多個特性之調整可改進現有目標105'與目標空間710中之輻射脈衝778之間的相對對準。現有目標105'係在輻射脈衝778 (其恰好已經調整)到達目標空間710中時已進入目標空間710之目標。對輻射脈衝778之一或多個特性之此類調整改進現有目標105'與輻射脈衝778之間的相互作用且增加藉由此類相互作用產生之EUV光784之量。如圖7中所展示,先前目標105p已與先前輻射脈衝(未展示)相互作用以產生(除了EUV光784之外)發射非診斷光122之電漿785。The adjustment of one or more characteristics of the radiation pulse 778 can improve the relative alignment between the existing target 105 ′ and the radiation pulse 778 in the target space 710. The existing target 105 ′ is a target that has entered the target space 710 when the radiation pulse 778 (which happens to have been adjusted) reaches the target space 710. Such adjustments to one or more of the characteristics of the radiation pulse 778 improve the interaction between the existing target 105' and the radiation pulse 778 and increase the amount of EUV light 784 generated by such interaction. As shown in Figure 7, the previous target 105p has interacted with previous radiation pulses (not shown) to produce (in addition to EUV light 784) plasma 785 that emits non-diagnostic light 122.

在一些實施方案中,現有目標105'為當前目標105c。在此等實施方案中,對輻射脈衝778之一或多個特性之調整發生於相對較短之時間框內。相對較短時間框意謂輻射脈衝778之一或多個特性在對當前目標105c之移動屬性之分析完成之後的時間至當前目標105c進入目標空間710之時間期間經調整。因為輻射脈衝778之一或多個特性能夠在相對較短時間框內經調整,故存在影響當前目標105c (其移動屬性恰好已經分析)與輻射脈衝778之間的相互作用之足夠時間。In some embodiments, the existing target 105' is the current target 105c. In these embodiments, adjustments to one or more of the characteristics of the radiation pulse 778 occur within a relatively short time frame. The relatively short time frame means that one or more characteristics of the radiation pulse 778 are adjusted between the time after the analysis of the movement attributes of the current target 105c is completed to the time when the current target 105c enters the target space 710. Because one or more of the characteristics of the radiation pulse 778 can be adjusted within a relatively short time frame, there is sufficient time to affect the interaction between the current target 105c (whose movement properties have just been analyzed) and the radiation pulse 778.

在其他實施方案中,現有目標105'為另一目標,亦即,除當前目標105c之外且時間上在當前目標105c之後的目標。在此等實施方案中,對輻射脈衝778之一或多個特性之調整在相對較長時間框內發生,使得影響當前目標105c (其移動屬性恰好已經分析)與輻射脈衝778之間的相互作用係不可行的。另一方面,影響另一(或稍後)目標與輻射脈衝778之間的相互作用係可行的。相對較長時間框為大於在對當前目標105c之移動屬性之分析完成之後的時間至當前目標105c進入目標空間710之時間的時間框。取決於相對較長時間框,另一目標可鄰近於當前目標105c。或者,另一目標可鄰近於中間目標,該中間目標鄰近於當前目標105c。在此等其他實施方案中,假設另一目標(其不為當前目標105c)正以與偵測到或估計之當前目標105c之移動屬性足夠類似的移動屬性行進。In other embodiments, the existing target 105' is another target, that is, a target other than the current target 105c and temporally after the current target 105c. In these embodiments, the adjustment of one or more of the characteristics of the radiation pulse 778 occurs within a relatively long time frame, so as to affect the interaction between the current target 105c (whose movement properties happen to be analyzed) and the radiation pulse 778 Department is not feasible. On the other hand, it is possible to influence the interaction between another (or later) target and the radiation pulse 778. The relatively long time frame is a time frame that is greater than the time after the analysis of the movement attributes of the current target 105c is completed to the time the current target 105c enters the target space 710. Depending on the relatively long time frame, another target may be adjacent to the current target 105c. Alternatively, another target may be adjacent to an intermediate target, which is adjacent to the current target 105c. In these other embodiments, it is assumed that another target (which is not the current target 105c) is traveling with a movement attribute sufficiently similar to the detected or estimated movement attribute of the current target 105c.

目標105 (包括先前目標105p及當前目標105c,及藉由目標供應裝置775 (或175)產生之所有其他目標)中之每一者包括當轉換為電漿時發射EUV光之材料。每一目標105經由在目標空間710內與藉由光學源781產生之輻射脈衝778相互作用來至少部分地或大多轉換成電漿。藉由目標供應裝置775 (或1750產生之每一目標105為目標混合物,該目標混合物包括目標材料及視情況選用之雜質,諸如非目標顆粒。目標材料為能夠轉換為電漿狀態之具有在EUV範圍內之發射譜線之物質。目標105可為例如液體或熔融金屬之小滴、液體流之一部分、固體顆粒或叢集、液滴內所含有之固體顆粒、目標材料之發泡體或液體流之一部分內所含有之固體顆粒。目標材料可包括例如水、錫、鋰、氙或在經轉換為電漿狀態時具有在EUV範圍內之發射譜線之任何材料。舉例而言,目標材料可為元素錫,其可用作純錫(Sn);用作錫化合物,諸如SnBr4 、SnBr2 、SnH4 ;用作錫合金,諸如錫-鎵合金、錫-銦合金、錫-銦-鎵合金或此等合金之任何組合。在不存在雜質之情形下,則每一目標105僅包括目標材料。本文中所提供之論述為其中每一目標105係由諸如錫之熔融金屬製成之小滴的實例。然而,藉由目標供應裝置775 (或175)產生之每一目標105可採取其他形式。Each of the targets 105 (including the previous target 105p and the current target 105c, and all other targets generated by the target supply device 775 (or 175)) includes a material that emits EUV light when converted to plasma. Each target 105 is converted at least partially or mostly into plasma by interacting in the target space 710 with the radiation pulse 778 generated by the optical source 781. Each target 105 generated by the target supply device 775 (or 1750) is a target mixture, which includes the target material and optional impurities, such as non-target particles. The target material is capable of being converted into a plasma state with EUV Spectral-emitting substances within the range. Target 105 can be, for example, liquid or molten metal droplets, part of a liquid stream, solid particles or clusters, solid particles contained in the droplets, foams or liquid streams of target materials Solid particles contained in a part. The target material can include, for example, water, tin, lithium, xenon, or any material that has an emission spectrum in the EUV range when converted to a plasma state. For example, the target material can be as elemental tin, which can be used as pure tin (of Sn); as a tin compound, such as SnBr 4, SnBr 2, SnH 4 ; as a tin alloy, such as tin - gallium alloy, tin - indium alloys, tin - indium - gallium Alloy or any combination of these alloys. In the absence of impurities, each target 105 includes only the target material. The discussion provided herein is that each target 105 is made of a molten metal such as tin. An example of drops. However, each target 105 generated by the target supply device 775 (or 175) may take other forms.

目標105可藉由使熔融目標材料穿過目標供應裝置775 (或175)之噴嘴且允許目標105沿軌跡TR漂移至目標空間710中來提供至目標空間710。在一些實施方案中,目標105可藉由力(除了重力之外或不管重力)來引導至目標空間710。如下文所論述,與輻射脈衝778相互作用之現有目標105' (其可為當前目標105c)亦可已與一或多個先前輻射脈衝相互作用。或者,與輻射脈衝778相互作用之現有目標105'可達到目標空間710而沒有與任何其他輻射脈衝相互作用。The target 105 can be provided to the target space 710 by passing the molten target material through the nozzle of the target supply device 775 (or 175) and allowing the target 105 to drift into the target space 710 along the trajectory TR. In some embodiments, the target 105 may be guided to the target space 710 by force (in addition to or regardless of gravity). As discussed below, the existing target 105' (which may be the current target 105c) that interacts with the radiation pulse 778 may also have interacted with one or more previous radiation pulses. Alternatively, the existing target 105' interacting with the radiation pulse 778 can reach the target space 710 without interacting with any other radiation pulses.

在此實施方案中,偵測裝置735經定位於腔室716外部,而診斷區745在腔室716之環境715內部。腔室716之壁經裝配有光學窗736,該光學窗736對診斷光120之波長為可穿透的且能夠承受該壁處之任何壓差。光學窗736可固持於安裝件中且氣密密封於壁中以維持環境715內之壓力。舉例而言,光學窗736可由諸如硼矽酸鹽玻璃(BK7或N-BK7)或熔融矽石之具有相對低折射率及低色散之冕牌玻璃(crown glass)製成。光學窗736具有足夠大以適應診斷光120之範圍之孔口。診斷區745與光學窗之間的距離可為約數百毫米(或約600至700 mm),而診斷區745與目標空間710之間的距離可為約幾毫米(或約1至5 mm)。因此,診斷區745與光學窗之間的距離可為診斷區745與目標空間710之間的距離之200至500倍。In this embodiment, the detection device 735 is positioned outside the chamber 716, and the diagnostic zone 745 is inside the environment 715 of the chamber 716. The wall of the chamber 716 is equipped with an optical window 736 which is transparent to the wavelength of the diagnostic light 120 and can withstand any pressure difference at the wall. The optical window 736 can be held in the mounting member and hermetically sealed in the wall to maintain the pressure in the environment 715. For example, the optical window 736 may be made of crown glass with relatively low refractive index and low dispersion, such as borosilicate glass (BK7 or N-BK7) or fused silica. The optical window 736 has an aperture large enough to fit the range of the diagnostic light 120. The distance between the diagnostic area 745 and the optical window may be about hundreds of millimeters (or about 600 to 700 mm), and the distance between the diagnostic area 745 and the target space 710 may be about several millimeters (or about 1 to 5 mm) . Therefore, the distance between the diagnostic area 745 and the optical window may be 200 to 500 times the distance between the diagnostic area 745 and the target space 710.

控制裝置783與控制系統170通信且亦與EUV光源776之其他組件(諸如致動系統782、目標供應裝置775及光學源781)通信。參考圖8,展示控制裝置783之實施方案883且展示控制系統170之實施方案870。控制裝置883包括控制系統870,但控制系統870有可能與控制裝置883實體地分離並仍保持通信。另外,控制裝置883之特徵或組件可與控制系統870共用,包括圖8中未展示之特徵。The control device 783 communicates with the control system 170 and also communicates with other components of the EUV light source 776, such as the actuation system 782, the target supply device 775, and the optical source 781. Referring to FIG. 8, an implementation 883 of the control device 783 is shown and an implementation 870 of the control system 170 is shown. The control device 883 includes the control system 870, but the control system 870 may be physically separated from the control device 883 and still maintain communication. In addition, the features or components of the control device 883 can be shared with the control system 870, including features not shown in FIG. 8.

控制系統870包括經組態以自偵測裝置735 (或135,335,435)接收輸出之信號處理模組871。控制系統870包括與診斷裝置765 (或165)通信之診斷控制模組872。舉例而言,信號處理模組871自偵測裝置735 (135,335,435)內之感測器130接收信號,其中信號為與由在感測器130處偵測到之光產生之電流相關的電壓信號。大體而言,信號處理模組871分析來自感測器730之輸出,且基於此分析而判定當前目標105c之一或多個移動屬性。診斷控制模組872控制診斷裝置765之操作。舉例而言,診斷控制模組872可將信號提供至診斷裝置765以用於調整診斷裝置765之一或多個特性以及用於調整一或多個診斷探針725之一或多個特性。The control system 870 includes a signal processing module 871 configured to receive and output from the detection device 735 (or 135, 335, 435). The control system 870 includes a diagnosis control module 872 that communicates with the diagnosis device 765 (or 165). For example, the signal processing module 871 receives a signal from the sensor 130 in the detection device 735 (135, 335, 435), where the signal is related to the current generated by the light detected at the sensor 130 Voltage signal. Generally speaking, the signal processing module 871 analyzes the output from the sensor 730, and determines one or more movement attributes of the current target 105c based on this analysis. The diagnosis control module 872 controls the operation of the diagnosis device 765. For example, the diagnostic control module 872 may provide a signal to the diagnostic device 765 for adjusting one or more characteristics of the diagnostic device 765 and for adjusting one or more characteristics of the one or more diagnostic probes 725.

信號處理模組871亦判定是否需要基於當前目標105c之一或多個移動屬性之判定而對自光學源781輸出之後續輻射脈衝778做出調整。並且,若需要調整,則信號處理模組871將適當信號發送至與光學源781或致動系統782介接之光學源致動模組884。光學源致動模組884可在控制裝置883內(如圖8中所展示)或其可整合於控制系統870內。The signal processing module 871 also determines whether it is necessary to adjust the subsequent radiation pulse 778 output from the optical source 781 based on the determination of one or more movement attributes of the current target 105c. Moreover, if adjustment is required, the signal processing module 871 sends an appropriate signal to the optical source actuation module 884 which interfaces with the optical source 781 or the actuation system 782. The optical source actuation module 884 may be in the control device 883 (as shown in FIG. 8) or it may be integrated in the control system 870.

信號處理模組871可包括一或多個場可程式化硬體電路,諸如場可程式化閘陣列(field-programmable gate array;FPGA)。FPGA為經設計為由客戶或設計者在製造之後組態的積體電路。場可程式化硬體電路可為接收時戳之一或多個值、對所接收值執行計算且使用一或多個查找表來估計現有目標105'到達目標空間710之時間的專用硬體。特定而言,場可程式化硬體電路可用於快速地執行計算以在相對較短時間框內實現對輻射脈衝778之一或多個特性之調整,從而實現對與當前目標105c (其移動屬性恰好已由信號處理模組871分析)相互作用之輻射脈衝778之一或多個特性之調整。The signal processing module 871 may include one or more field-programmable hardware circuits, such as a field-programmable gate array (FPGA). FPGAs are integrated circuits that are designed to be configured by customers or designers after manufacturing. The field programmable hardware circuit may be dedicated hardware that receives one or more values of the time stamp, performs calculations on the received values, and uses one or more look-up tables to estimate the time for the existing target 105' to reach the target space 710. In particular, the field programmable hardware circuit can be used to quickly perform calculations to adjust one or more of the characteristics of the radiation pulse 778 within a relatively short time frame, so as to achieve alignment with the current target 105c (its movement attribute It happens to have been analyzed by the signal processing module 871) to adjust one or more characteristics of the interacting radiation pulse 778.

控制裝置883包括經組態以與目標供應裝置775介接之目標遞送模組885。另外,控制裝置883及控制系統870可包括具體言之經組態以與未展示之EUV光源776之其他組件介接的其他模組。The control device 883 includes a target delivery module 885 configured to interface with the target supply device 775. In addition, the control device 883 and the control system 870 may include other modules specifically configured to interface with other components of the EUV light source 776 not shown.

控制系統870大體上包括或可接入數位電子電路、電腦硬體、韌體及軟體中之一或多者。舉例而言,控制系統870可接入可為唯讀記憶體及/或隨機存取記憶體之記憶體873。適合於有形地體現電腦程式指令及資料之儲存器件包括所有形式之非揮發性記憶體,包括(藉助於實例):半導體記憶體器件,諸如EPROM、EEPROM及快閃記憶體器件;磁碟,諸如內部硬碟及抽取式磁碟;磁光碟;及CD-ROM磁碟。控制系統870亦可包括或一或多個輸入器件874i (諸如鍵盤、觸控螢幕、麥克風、滑鼠、手持式輸入器件等)及一或多個輸出器件874o (諸如揚聲器及監視器)或與該一或多個輸入裝置874i及該一或多個輸出裝置874o介接。The control system 870 generally includes or can be connected to one or more of digital electronic circuits, computer hardware, firmware, and software. For example, the control system 870 can access the memory 873 which can be a read-only memory and/or a random access memory. Storage devices suitable for tangibly embodying computer program instructions and data include all forms of non-volatile memory, including (by way of example): semiconductor memory devices, such as EPROM, EEPROM, and flash memory devices; magnetic disks, such as Internal hard disks and removable disks; magneto-optical disks; and CD-ROM disks. The control system 870 may also include or one or more input devices 874i (such as a keyboard, touch screen, microphone, mouse, handheld input device, etc.) and one or more output devices 874o (such as speakers and monitors) or The one or more input devices 874i and the one or more output devices 874o interface.

控制系統870亦可包括或接入一或多個可程式化處理器,及有形地體現於機器可讀儲存器件中以供可程式化處理器執行之一或多個電腦程式產品。一或多個可程式化處理器可各自執行指令之程式以藉由對輸入資料進行操作及產生適當輸出來執行所要功能。大體而言,處理器自記憶體873接收指令及資料。前述任一者可藉由經專門設計之特殊應用積體電路(application-specific integrated circuit;ASIC)補充或併入於其中。The control system 870 may also include or be connected to one or more programmable processors, and be tangibly embodied in a machine-readable storage device for the programmable processor to execute one or more computer program products. One or more programmable processors can each execute a program of instructions to perform desired functions by operating on input data and generating appropriate output. Generally speaking, the processor receives commands and data from the memory 873. Any of the foregoing can be supplemented by or incorporated into a specially designed application-specific integrated circuit (ASIC).

另外,模組中之任一者或多者可包括其自身數位電子電路、電腦硬體、韌體及軟體以及專用記憶體、輸入及輸出器件、可程式化處理器及電腦程式產品。同樣地,模組中之任一者或多者可接入且使用記憶體873、輸入器件874i、輸出器件874o、可程式化處理器及電腦程式產品。In addition, any one or more of the modules may include its own digital electronic circuits, computer hardware, firmware and software, as well as dedicated memory, input and output devices, programmable processors, and computer program products. Similarly, any one or more of the modules can access and use the memory 873, the input device 874i, the output device 874o, the programmable processor, and the computer program product.

雖然控制系統870經展示為分離及完整單元,但其組件及模組中之每一者有可能為分離單元。控制裝置883可包括圖8中未展示之其他組件,諸如專用記憶體、輸入/輸出器件、處理器及電腦程式產品。Although the control system 870 is shown as a separate and complete unit, each of its components and modules may be a separate unit. The control device 883 may include other components not shown in FIG. 8, such as dedicated memory, input/output devices, processors, and computer program products.

參考圖9,展示微影裝置779之實施方案979。微影裝置979藉由曝光光束B來曝光基板(其可稱作晶圓) W。微影裝置979包括均在殼體10中之複數個反射光學元件R1、R2、R3、遮罩M及狹縫S。殼體10為能夠支撐反射光學元件R1、R1、R2、遮罩M及狹縫S且亦能夠維持殼體10內之抽空空間的外殼、貯槽或其他結構。Referring to Figure 9, an implementation 979 of the lithography device 779 is shown. The lithography device 979 exposes the substrate (which may be referred to as a wafer) W by the exposure beam B. The lithography device 979 includes a plurality of reflective optical elements R1, R2, R3, a mask M, and a slit S all in the housing 10. The housing 10 is a housing, a storage tank, or other structure that can support the reflective optical elements R1, R1, R2, the mask M, and the slit S, and can also maintain the evacuated space in the housing 10.

EUV光777進入殼體10且由光學元件R1經由狹縫S朝向遮罩M反射。狹縫S部分地界定用於在微影製程中掃描基板W之分散光之形狀。遞送至基板W之劑量或遞送至基板W之光子數目取決於狹縫S之大小及以其掃描狹縫S之速度。The EUV light 777 enters the housing 10 and is reflected by the optical element R1 toward the mask M via the slit S. The slit S partially defines the shape of the scattered light used to scan the substrate W in the lithography process. The dose delivered to the substrate W or the number of photons delivered to the substrate W depends on the size of the slit S and the speed at which it scans the slit S.

遮罩M亦可稱作倍縮光罩或圖案化器件。遮罩M包括表示待形成於基板W上之光阻中之特徵的空間圖案。EUV光777與遮罩M相互作用。EUV光777與遮罩M之間的相互作用使得遮罩M之圖案經賦予至EUV光777上以形成曝光光束B。曝光光束B穿過狹縫S且由光學元件R2及R3引導至基板W。基板W與曝光光束B之間的相互作用將遮罩M之圖案曝光至基板W上,且光阻特徵籍此形成於基板W處。基板W包括複數個部分20 (例如,晶粒)。每一部分20在Y-Z平面中之面積小於整個基板W在Y-Z平面中之面積。每一部分20可由曝光光束B曝光以包括遮罩M之複本,使得每一部分20包括由遮罩M上之圖案指示之電子特徵。The mask M can also be referred to as a reduction mask or a patterned device. The mask M includes a space pattern representing features in the photoresist to be formed on the substrate W. The EUV light 777 interacts with the mask M. The interaction between the EUV light 777 and the mask M causes the pattern of the mask M to be imparted to the EUV light 777 to form the exposure beam B. The exposure light beam B passes through the slit S and is guided to the substrate W by the optical elements R2 and R3. The interaction between the substrate W and the exposure beam B exposes the pattern of the mask M to the substrate W, and the photoresist feature is formed at the substrate W by this. The substrate W includes a plurality of parts 20 (for example, dies). The area of each part 20 in the Y-Z plane is smaller than the area of the entire substrate W in the Y-Z plane. Each part 20 can be exposed by the exposure beam B to include a copy of the mask M so that each part 20 includes electronic features indicated by the pattern on the mask M.

微影裝置979可包括與EUV光源776之控制裝置783通信之微影控制系統30。The lithography device 979 may include a lithography control system 30 that communicates with the control device 783 of the EUV light source 776.

參考圖10,過程1090由度量衡裝置100 (或度量衡裝置700)執行。在當前目標105c進入目標空間110之前,診斷探針125在診斷區145中與當前目標105c相互作用(1091)。收集由相互作用(1091)產生之診斷光120,且同時,亦收集由目標空間110產生之一些非想要非診斷光122 (1092)。舉例而言,機械濾光器140之入口處之光瞳診斷光120及非診斷光122。診斷光120及非診斷光122為準直的(1093)。光學準直器142使已進入機械濾光器140之診斷光120及非診斷光122準直。此準直診斷光及非診斷光在角度上彼此分離(1094)。光束縮減器150縮減準直診斷光束及準直非診斷光束之橫向範圍(沿XsYs平面),且此等縮減之光束121、123分別離開光束縮減器150,且隨著其沿光學路徑152朝向遮罩155行進,其角分離度增大。在與開放影像平面光學通信之感測區(例如,感測器130)處感測準直診斷光束121,該開放影像平面自阻擋準直非診斷光束123之閉合影像平面橫向地移位(在XsYs平面中) (1095)。舉例而言,感測器130感測準直診斷光束121,感測器130與孔口160 (開放影像平面)光學通信,且孔口160在XsYs平面中自準直非診斷光束123照射在其上之遮罩155橫向地移位。基於所感測診斷光而估計當前目標105c之屬性(1096)。特定而言,控制系統170分析來自感測器130之輸出以估計當前目標105c之一或多個移動屬性。Referring to FIG. 10, the process 1090 is performed by the metrology apparatus 100 (or the metrology apparatus 700). Before the current target 105c enters the target space 110, the diagnostic probe 125 interacts with the current target 105c in the diagnostic area 145 (1091). The diagnostic light 120 generated by the interaction (1091) is collected, and at the same time, some undesired non-diagnostic light 122 generated by the target space 110 is also collected (1092). For example, the pupil diagnostic light 120 and the non-diagnostic light 122 at the entrance of the mechanical filter 140. The diagnostic light 120 and the non-diagnostic light 122 are collimated (1093). The optical collimator 142 collimates the diagnostic light 120 and the non-diagnostic light 122 that have entered the mechanical filter 140. The collimated diagnostic light and the non-diagnostic light are angularly separated from each other (1094). The beam reducer 150 reduces the lateral range (along the XsYs plane) of the collimated diagnostic beam and the collimated non-diagnostic beam, and these reduced beams 121 and 123 respectively leave the beam reducer 150 and follow the optical path 152 toward the shield The cover 155 travels, and its angular separation increases. The collimated diagnostic beam 121 is sensed at the sensing area (for example, the sensor 130) in optical communication with the open image plane, which is laterally shifted from the closed image plane blocking the collimated non-diagnostic beam 123 (at In the XsYs plane) (1095). For example, the sensor 130 senses the collimated diagnostic beam 121, the sensor 130 optically communicates with the aperture 160 (open image plane), and the aperture 160 self-collimates the non-diagnostic beam 123 in the XsYs plane to irradiate it. The upper mask 155 is shifted laterally. The attributes of the current target 105c are estimated based on the sensed diagnostic light (1096). Specifically, the control system 170 analyzes the output from the sensor 130 to estimate one or more movement attributes of the current target 105c.

如上文參考圖6A至6C所論述,診斷探針125可為經引導以與目標105之軌跡交叉之一或多個探針光束。因此,診斷探針125與當前目標105c之間的相互作用(1091)可在此等探針光束與當前目標105c之間。在一些實施方案中,經收集(1092)之診斷光120可為自當前目標105c反射或散射之探針光束125之一部分。在其他實施方案中,經收集(1092)之診斷光120為藉由當前目標105c產生之光。在其他實施方案中,經收集(1092)之診斷光120為由當前目標105c阻擋之光(如圖12中所展示)。As discussed above with reference to FIGS. 6A to 6C, the diagnostic probe 125 may be one or more probe beams that are guided to intersect the trajectory of the target 105. Therefore, the interaction (1091) between the diagnostic probe 125 and the current target 105c can be between these probe beams and the current target 105c. In some embodiments, the collected (1092) diagnostic light 120 may be a portion of the probe beam 125 reflected or scattered from the current target 105c. In other embodiments, the collected (1092) diagnostic light 120 is light generated by the current target 105c. In other embodiments, the collected (1092) diagnostic light 120 is light blocked by the current target 105c (as shown in Figure 12).

藉由用機械濾光器140阻擋或重新引導非診斷光122來縮減非診斷光122對來自感測器130之輸出之分析的影響,且因此防止非診斷光122照射在感測器130上且該非診斷光122實際上由遮罩155阻擋。另外,自準直器142輸出之準直診斷光束及準直非診斷光束之準直狀態一直經維持至遮罩155之平面,而準直診斷光束121在穿過孔口160之後進一步經聚焦至感測器130上。By blocking or redirecting the non-diagnostic light 122 with the mechanical filter 140, the influence of the non-diagnostic light 122 on the analysis of the output from the sensor 130 is reduced, and thus the non-diagnostic light 122 is prevented from being irradiated on the sensor 130 and This non-diagnostic light 122 is actually blocked by the mask 155. In addition, the collimated state of the collimated diagnostic beam and the collimated non-diagnostic beam output from the collimator 142 is maintained to the plane of the mask 155, and the collimated diagnostic beam 121 is further focused to the plane after passing through the aperture 160 On the sensor 130.

參考圖11,在其他實施方案中,光學準直器142及具有正焦距且最接近光學準直器142之光束縮減器150之組件經整合至單個折射元件1142/1151中。此積體單個折射元件1142/1151可應用於Galilean型折射望遠鏡(諸如圖3及展示於圖11中之望遠鏡)或Keplerian型折射望遠鏡(諸如圖4之望遠鏡)。11, in other implementations, the components of the optical collimator 142 and the beam reducer 150 having a positive focal length and closest to the optical collimator 142 are integrated into a single refractive element 1142/1151. The integrated single refracting element 1142/1151 can be applied to a Galilean type refracting telescope (such as the telescope shown in FIG. 3 and FIG. 11) or a Keplerian type refracting telescope (such as the telescope shown in FIG. 4).

參考圖12,在其他實施方案中,診斷光120由藉由當前目標105c阻擋之診斷探針光束1225之一部分產生。在度量衡裝置1200之此實施方案中,診斷探針1225提供當前目標105c之背部照明。感測器130為二維(例如,成像)感測器1230,諸如相機。因此,當當前目標105c與診斷探針1225交叉時,目標105c之陰影由遮掩診斷探針1225之至少一部分之目標105c形成,如圖12之插圖中所展示。此種配置可視為造影(shadowgraph)配置。在此類實施方案中,感測器1230經配置於與診斷裝置1265配置於其上之側相對的目標軌跡TR之一側上。感測器1230為捕獲診斷光1220之二維表示(其可視為影像)之相機。因此,例如,感測器1230包括數千或數百萬個光位點(或像素)之二維陣列。診斷光1220經引導至每一像素之感光性區域上,其中其經轉換成經收集至電壓信號中之電子且此等信號之陣列形成二維影像。如上文所論述,實質上阻擋非診斷光1222到達感測器1230。12, in other embodiments, the diagnostic light 120 is generated by a portion of the diagnostic probe beam 1225 blocked by the current target 105c. In this embodiment of the metrology apparatus 1200, the diagnostic probe 1225 provides backlighting of the current target 105c. The sensor 130 is a two-dimensional (eg, imaging) sensor 1230, such as a camera. Therefore, when the current target 105c crosses the diagnostic probe 1225, the shadow of the target 105c is formed by the target 105c covering at least a part of the diagnostic probe 1225, as shown in the inset of FIG. 12. This configuration can be regarded as a shadowgraph configuration. In such an implementation, the sensor 1230 is configured on a side of the target trajectory TR opposite to the side on which the diagnostic device 1265 is configured. The sensor 1230 is a camera that captures a two-dimensional representation of the diagnostic light 1220 (which can be regarded as an image). Thus, for example, the sensor 1230 includes a two-dimensional array of thousands or millions of light spots (or pixels). The diagnostic light 1220 is guided to the photosensitive area of each pixel, where it is converted into electrons collected in a voltage signal and the array of these signals forms a two-dimensional image. As discussed above, the non-diagnostic light 1222 is substantially blocked from reaching the sensor 1230.

參考圖13,在其他實施方案中,光束縮減器150經設計為自諸如準直器342之光學準直器接收準直光束之反射光束縮減器1350。反射光束縮減器1350包括凹形反射性元件(曲形鏡面) 1351,其使光束朝向凸形反射性元件(曲形鏡面) 1353收斂,從而使光準直為在相異方向(或角度)上沿光學路徑1352朝向遮罩155行進之準直診斷光束121及準直非診斷光束123。Referring to FIG. 13, in other embodiments, the beam reducer 150 is designed as a reflected beam reducer 1350 that receives a collimated light beam from an optical collimator such as the collimator 342. The reflected beam reducer 1350 includes a concave reflective element (curved mirror) 1351, which causes the beam to converge toward the convex reflective element (curved mirror) 1353, thereby collimating the light in a different direction (or angle) The collimated diagnostic beam 121 and the collimated non-diagnostic beam 123 travel along the optical path 1352 toward the mask 155.

參考圖14,在其他實施方案中,光束縮減器150經設計為自諸如準直器342之光學準直器接收準直光束之反射折射(混合式)光束縮減器1450。混合式光束縮減器1450包括將光束引導至曲形反射性元件(曲形鏡面) 1451b上之平坦反射性元件(平坦鏡面) 1451a,該曲形反射性元件1451b使光束朝向曲形鏡面1451b與凸形或收斂折射元件(透鏡) 1453之間的中間焦點IF收斂。透鏡1453使光準直為在相異方向(或角度)上沿光學路徑朝向遮罩155行進之準直診斷光束121及準直非診斷光束123。Referring to FIG. 14, in other embodiments, the beam reducer 150 is designed as a catadioptric (hybrid) beam reducer 1450 that receives a collimated light beam from an optical collimator such as the collimator 342. The hybrid beam reducer 1450 includes a flat reflective element (flat mirror) 1451a that guides the beam to a curved reflective element (curved mirror) 1451b, and the curved reflective element 1451b directs the beam toward the curved mirror 1451b and convex The intermediate focal point IF between the shaped or convergent refractive elements (lenses) 1453 converges. The lens 1453 collimates the light into a collimated diagnostic beam 121 and a collimated non-diagnostic beam 123 that travel along the optical path toward the mask 155 in different directions (or angles).

參考圖15,在其他實施方案中,遮罩155經設計為遮罩1555,其界定與準直非診斷光束123之途徑對準之孔口1560,而遮罩1555用以停止或防止準直診斷光束121傳遞到達感測器130。若有必要分析與非診斷光122相關之態樣,則此類設計可為有用的。Referring to FIG. 15, in other embodiments, the mask 155 is designed as a mask 1555, which defines an aperture 1560 aligned with the path of the collimated non-diagnostic beam 123, and the mask 1555 is used to stop or prevent collimated diagnosis The light beam 121 passes to the sensor 130. This type of design can be useful if it is necessary to analyze the state related to the non-diagnostic light 122.

在以下編號條項中闡述本發明之其他態樣。 1.     一種度量衡裝置,其包含: 診斷裝置,其經組態以在當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用; 偵測裝置,其包含: 光感測器,其具有與診斷區重疊之視場且經組態以感測由在診斷區處診斷探針與當前目標之間的相互作用產生之光;以及 機械濾光器,其在診斷區與光感測器之間,該機械濾光器包括光束縮減器及光學遮罩,該光學遮罩界定定位於光束縮減器與光感測器之間的孔口;以及 控制系統,其與偵測裝置通信且經組態以基於來自光感測器之輸出而估計當前目標之屬性。 2.     如條項1之度量衡裝置,其中機械濾光器經組態以在角度上分離自診斷區發射之診斷光與自目標空間發射之非診斷光,其中診斷光由在診斷區處當前目標與診斷探針之間的相互作用產生。 3.     如條項2之度量衡裝置,其中非診斷光包括自藉由目標空間中之先前目標產生之電漿發射的光。 4.     如條項2之度量衡裝置,其中孔口之橫向範圍約與光學遮罩之平面中之診斷光的橫向範圍相同或大於光學遮罩之平面中之診斷光的橫向範圍,且光學遮罩之橫向範圍大於光學遮罩之平面中之非診斷光的橫向範圍或約與光學遮罩之平面中之非診斷光的橫向範圍相同。 5.     如條項2之度量衡裝置,其中光學遮罩經定位以使得自目標空間發射之非診斷光實質上由光學遮罩阻擋,而診斷光實質上穿過孔口。 6.     如條項1之度量衡裝置,其中機械濾光器包含診斷區與光束縮減器之間的光學準直器。 7.     如條項6之度量衡裝置,其中光束縮減器為無焦光束縮減器且經組態為與光學準直器結合以將有限物件投影至無限。 8.     如條項6之度量衡裝置,其中光學準直器及最接近光學準直器之具有正焦距的光束縮減器之組件經整合至單個折射元件中。 9.     如條項6之度量衡裝置,其中光束縮減器經組態以維持光之準直狀態。 10.   如條項1之度量衡裝置,其中光感測器包含以下一或多者:光電二極體、光電晶體、光相依電阻器、光電倍增管、多單元光接收器、四單元光接收器及相機。 11.    如條項1之度量衡裝置,其中診斷探針包含至少一個診斷光束,且光感測器經組態以感測由當前目標與至少一個診斷光束之間的相互作用產生之診斷光。 12.   如條項11之度量衡裝置,其中診斷光包含自當前目標反射、自當前目標散射或由當前目標阻擋之診斷光束。 13.   如條項1之度量衡裝置,其中偵測裝置進一步包含光譜濾光器及偏振濾光器中之一或多者。 14.   如條項1之度量衡裝置,其中診斷探針包含第一診斷光束及第二診斷光束,該第一診斷光束及第二診斷光束各自經組態以在其進入目標空間之前與當前目標相互作用,每一相互作用發生於相異區及相異時間處。 15.   如條項1之度量衡裝置,其中光束縮減器包含折射望遠鏡、反射望遠鏡或反射折射望遠鏡。 16.   如條項15之度量衡裝置,其中折射望遠鏡包含: 正焦距透鏡配置及負焦距透鏡配置,其由其焦距之總和分離;或 一對正焦距透鏡配置,其由其焦距之總和分離。 17.   如條項1之度量衡裝置,其中光束縮減器經組態以將照射光之橫向大小縮減至少五倍、至少十倍、至少二十倍或約十倍。 18.   如條項1之度量衡裝置,其中孔口包括圓形開口、橢圓開口、多邊形開口或細長狹縫開口。 19.   如條項1之度量衡裝置,其中偵測裝置經定位於極紫外(EUV)光源之腔室外部,診斷區在腔室內部,且偵測裝置經由腔室之壁中之光學窗自腔室接收光。 20.   如條項19之度量衡裝置,其中診斷區與光學窗之間的距離可為診斷區與目標空間之間的距離之大小之約200至500倍。 21.   如條項1之度量衡裝置,其中偵測裝置包含孔口之輸出端處之聚焦透鏡,聚焦透鏡經組態以將所感測光聚焦至光感測器上。 22.   如條項1之度量衡裝置,其中孔口具有至少2毫米(mm)之範圍。 23.   如條項1之度量衡裝置,其中孔口經定位以在診斷光在其處為準直或為非收斂及非發散之方位處接收診斷光。 24.   一種度量衡方法,其包含: 在當前目標進入目標空間之前在診斷區處使診斷探針與當前目標相互作用; 收集由在診斷區處診斷探針與當前目標之間的相互作用產生之診斷光,收集亦包括收集由目標空間產生之非診斷光; 使診斷光及非診斷光準直; 使診斷光與非診斷光彼此在角度上分離包括縮減診斷光及非診斷光之橫向範圍; 在診斷光及非診斷光已在角度上分離之後在自由非診斷光穿過之非感測區橫向移位之感測區處感測診斷光;以及 基於所感測診斷光而估計當前目標之屬性。 25.   如條項24之度量衡方法,其中: 在診斷區處使診斷探針與當前目標相互作用包含在診斷區處使一或多個診斷光束與當前目標相互作用;以及 收集診斷光包含在診斷區處收集已自當前目標反射、自當前目標散射或由當前目標阻擋之一或多個診斷光束。 26.   如條項24之度量衡方法,其進一步包含基於其光譜屬性及其偏振狀態中之一或多者而過濾診斷光。 27.   如條項24之度量衡方法,其中診斷區在極紫外(EUV)光源之氣密密封腔室內部,且亦包括收集非診斷光之收集該診斷光包含接收包括經由腔室之壁中之光學窗傳輸之非診斷光的診斷光。 28.   如條項24之度量衡方法,其中縮減診斷光及非診斷光之橫向範圍包含將診斷光及非診斷光之橫向範圍縮減至少五倍、至少十倍、至少二十倍或約十倍。 29.   如條項24之度量衡方法,其進一步包含阻擋非感測區處之非診斷光或重新引導該非診斷光。 30.   如條項24之度量衡方法,其中縮減診斷光及非診斷光之橫向範圍包含以下中之一或多者:折射該光及反射該光。 31.   如條項24之度量衡方法,其進一步包含聚焦感測區處之診斷光。 32.   如條項24之度量衡方法,其中縮減診斷光及非診斷光之橫向範圍包含維持診斷光及非診斷光之準直狀態。 33.   如條項24之度量衡方法,其進一步包含在診斷光及非診斷光在角度上彼此分離之後及在診斷光經感測之前,使診斷光穿過光學遮罩之孔口,孔口具有大於診斷光之範圍的範圍。Other aspects of the present invention are described in the following numbered items. 1. A weighing and measuring device, which includes: A diagnostic device that is configured to cause the diagnostic probe to interact with the current target at the diagnostic area before the current target enters the target space; Detection device, which includes: A light sensor that has a field of view overlapping the diagnostic area and is configured to sense light generated by the interaction between the diagnostic probe and the current target at the diagnostic area; and A mechanical filter between the diagnostic area and the light sensor. The mechanical filter includes a beam reducer and an optical shield defining a hole positioned between the beam reducer and the light sensor Mouth; and A control system that communicates with the detection device and is configured to estimate the attributes of the current target based on the output from the light sensor. 2. The weights and measures device of Clause 1, in which the mechanical filter is configured to angularly separate the diagnostic light emitted from the diagnostic area and the non-diagnostic light emitted from the target space, wherein the diagnostic light is generated by the current target in the diagnostic area The interaction with the diagnostic probe occurs. 3. As in the measurement device of Clause 2, the non-diagnostic light includes the light emitted from the plasma generated by the previous target in the target space. 4. For the metrology device of Clause 2, the lateral range of the aperture is approximately the same as or greater than the lateral range of the diagnostic light in the plane of the optical cover, and the optical cover The lateral range is greater than or approximately the same as the lateral range of the non-diagnostic light in the plane of the optical shield. 5. As the weights and measures device of Clause 2, wherein the optical mask is positioned so that the non-diagnostic light emitted from the target space is substantially blocked by the optical mask, and the diagnostic light substantially passes through the aperture. 6. Such as the metrology device of Clause 1, in which the mechanical filter includes an optical collimator between the diagnostic area and the beam reducer. 7. For the metrology device of Clause 6, the beam reducer is an afocal beam reducer and is configured to be combined with an optical collimator to project a finite object to infinity. 8. As the weights and measures device of Clause 6, the components of the optical collimator and the beam reducer with a positive focal length closest to the optical collimator are integrated into a single refraction element. 9. Such as the metrology device of Clause 6, in which the beam reducer is configured to maintain the collimation state of the light. 10. Such as the measurement device of Clause 1, where the optical sensor includes one or more of the following: photodiode, photoelectric crystal, optical dependent resistor, photomultiplier tube, multi-unit optical receiver, four-unit optical receiver And camera. 11. The metrology device of clause 1, wherein the diagnostic probe includes at least one diagnostic beam, and the light sensor is configured to sense the diagnostic light generated by the interaction between the current target and the at least one diagnostic beam. 12. For the weights and measures device of Clause 11, the diagnostic light includes the diagnostic light beam reflected from the current target, scattered from the current target, or blocked by the current target. 13. Such as the metrology device of Clause 1, wherein the detection device further includes one or more of a spectral filter and a polarization filter. 14. The metrology device of clause 1, wherein the diagnostic probe includes a first diagnostic beam and a second diagnostic beam, and the first diagnostic beam and the second diagnostic beam are each configured to interact with the current target before it enters the target space. Each interaction occurs in a different area and at a different time. 15. Such as the weights and measures device of Clause 1, where the beam reducer includes a refracting telescope, a reflecting telescope or a reflective refracting telescope. 16. Such as the weights and measures device of Clause 15, in which the refracting telescope includes: The positive focal length lens configuration and the negative focal length lens configuration are separated by the sum of their focal lengths; or A pair of positive focal length lens configurations are separated by the sum of their focal lengths. 17. The weights and measures device of Clause 1, wherein the beam reducer is configured to reduce the lateral size of the irradiated light by at least five times, at least ten times, at least twenty times, or about ten times. 18. For the weighing and measuring device of Clause 1, wherein the orifice includes a circular opening, an elliptical opening, a polygonal opening or an elongated slit opening. 19. The metrology device of Clause 1, in which the detection device is positioned outside the chamber of the extreme ultraviolet (EUV) light source, the diagnostic area is inside the chamber, and the detection device is from the cavity through the optical window in the wall of the chamber The room receives light. 20. For the weights and measures device of Clause 19, the distance between the diagnostic area and the optical window can be about 200 to 500 times the distance between the diagnostic area and the target space. 21. Such as the measurement device of Clause 1, wherein the detection device includes a focusing lens at the output end of the aperture, and the focusing lens is configured to focus the sensed light onto the light sensor. 22. Such as the weights and measures device of Clause 1, in which the orifice has a range of at least 2 millimeters (mm). 23. Such as the weights and measures device of Clause 1, wherein the orifice is positioned to receive the diagnostic light at the position where the diagnostic light is collimated or non-convergent and non-divergent. 24. A measurement method, which includes: Make the diagnostic probe interact with the current target at the diagnostic area before the current target enters the target space; Collecting the diagnostic light generated by the interaction between the diagnostic probe and the current target in the diagnostic area. Collection also includes collecting the non-diagnostic light generated by the target space; Collimate diagnostic light and non-diagnostic light; The angular separation of diagnostic light and non-diagnostic light includes reducing the lateral range of diagnostic light and non-diagnostic light; After the diagnostic light and the non-diagnostic light have been angularly separated, the diagnostic light is sensed at the sensing area that is laterally displaced from the non-sensing area through which the non-diagnostic light passes; and Estimate the attributes of the current target based on the sensed diagnostic light. 25. Such as the weights and measures method of item 24, in which: Interacting the diagnostic probe with the current target at the diagnostic zone includes interacting one or more diagnostic beams with the current target at the diagnostic zone; and Collecting the diagnostic light includes collecting one or more diagnostic light beams that have been reflected from the current target, scattered from the current target, or blocked by the current target at the diagnostic area. 26. As the measurement method of Clause 24, it further includes filtering the diagnostic light based on one or more of its spectral properties and its polarization state. 27. The weights and measures method of Clause 24, wherein the diagnostic area is inside the hermetic sealed chamber of the extreme ultraviolet (EUV) light source, and also includes collecting non-diagnostic light. The diagnostic light includes receiving the light through the wall of the chamber. The non-diagnostic light transmitted by the optical window. 28. In the weights and measures method of Clause 24, reducing the lateral extent of diagnostic light and non-diagnostic light includes reducing the lateral extent of diagnostic light and non-diagnostic light by at least five times, at least ten times, at least twenty times, or about ten times. 29. As the weights and measures method of Clause 24, it further includes blocking the non-diagnostic light at the non-sensing area or redirecting the non-diagnostic light. 30. For the weights and measures method of Clause 24, the reduction of the lateral range of diagnostic light and non-diagnostic light includes one or more of the following: refracting the light and reflecting the light. 31. Such as the measurement method of Clause 24, which further includes focusing the diagnostic light at the sensing area. 32. As in the measurement method of Clause 24, reducing the horizontal range of diagnostic light and non-diagnostic light includes maintaining the collimation state of diagnostic light and non-diagnostic light. 33. As the weights and measures method of Clause 24, it further includes after the diagnostic light and the non-diagnostic light are angularly separated from each other and before the diagnostic light is sensed, passing the diagnostic light through the aperture of the optical shield, the aperture having A range larger than the range of the diagnostic light.

其他實施方案在以下申請專利範圍之範疇內。Other embodiments are within the scope of the following patent applications.

10:殼體 20:部分 30:微影控制系統 100:度量衡裝置 105:目標 105':現有目標 105c:當前目標 105p:先前目標 106:連續流 110:目標空間 115:環境 120:診斷光 121:準直光束 122:非診斷光 123:準直光束 125:診斷探針 130:光感測器 135:偵測裝置 140:機械濾光器 142:光學準直器 145:診斷區 150:光束縮減器 152:光學路徑 155:光學遮罩 160:孔口 165:診斷裝置 170:控制系統 175:目標供應裝置 255A:遮罩 255B:遮罩 256A:範圍 256B:範圍 260A:孔口 260B:孔口 261A:範圍 261B:範圍 330:感測器 335:偵測裝置 342:光學準直器 342a:透鏡 342b:透鏡 350:光束縮減器 351:正焦距透鏡配置 351a:凸透鏡 351b:凹透鏡 352:光學路徑 353:負焦距透鏡配置 354:輔助透鏡 355:遮罩 357:收斂透鏡 360:孔口 430:感測器 435:偵測裝置 442:光學準直器 442a:透鏡 442b:透鏡 450:光束縮減器 451:輸入正焦距透鏡配置 451a:凸透鏡 451b:凹透鏡 452:光學路徑 453:輸出正焦距透鏡配置 455:遮罩 457:收斂透鏡 460:孔口 535:偵測裝置 543:光譜濾光器 544:偏振濾光器 611A:光束 611B:光束 611C_1:光束 611C_2:光束 620A:診斷光 620B_1:診斷光 620B_2:光 625A:探針光束 625B_1:探針光束 625B_2:探針光束 625C_1:探針光束 625C_2:探針光束 626A:光源 626B:光源 626C_1:光源 626C_2:光源 627A:光學元件 627B:光學元件 627C_1:光學元件 627C_2:光學元件 665A:診斷裝置 665B:診斷裝置 665C:診斷裝置 700:度量衡裝置 706:連續流 710:目標空間 715:真空環境 716:腔室 725:診斷探針 735:偵測裝置 736:光學窗 745:診斷區 765:診斷裝置 775:目標供應裝置 776:EUV光源 777:EUV光 778:輻射脈衝 779:輸出裝置 780:EUV集光器 781:光學源 782:致動系統 783:控制裝置 784:EUV光 785:電漿 870:控制系統 871:信號處理模組 872:診斷控制模組 873:記憶體 874i:輸入裝置 874o:輸出裝置 883:控制裝置 884:光學源致動模組 885:目標遞送模組 979:微影裝置 1090:過程 1091,1092,1093,1094,1095,1096:步驟 1142:折射元件 1151:折射元件 1200:度量衡裝置 1220:診斷光 1222:非診斷光 1225:診斷探針光束 1230:二維感測器 1265:診斷裝置 1350:反射光束縮減器 1351:凹形反射性元件 1352:光學路徑 1353:凸形反射性元件 1450:反射折射光束縮減器 1451a:平坦反射性元件 1451b:曲形反射性元件 1453:凸形/收斂折射元件 1555:遮罩 1560:孔口 B:曝光光束 d:距離 f1:焦距 f2:焦距 IF:中間焦點 M:遮罩 R1:反射光學元件 R2:反射光學元件 R3:反射光學元件 S:狹縫 t:時間 t1:時間 t2:時間 TR:軌跡 V:速率 W:基板 x:位置 x1:方位 x2:方位 Δd:距離/分離度10: Shell 20: part 30: lithography control system 100: Weights and Measures Device 105: Goal 105': Existing target 105c: current target 105p: previous target 106: continuous flow 110: target space 115: Environment 120: Diagnostic light 121: collimated beam 122: non-diagnostic light 123: collimated beam 125: Diagnostic Probe 130: light sensor 135: Detection Device 140: mechanical filter 142: Optical collimator 145: Diagnosis area 150: beam reducer 152: Optical Path 155: Optical Mask 160: Orifice 165: Diagnostic Device 170: Control System 175: Target Supply Device 255A: Mask 255B: Mask 256A: Range 256B: range 260A: Orifice 260B: Orifice 261A: Range 261B: Range 330: Sensor 335: Detection Device 342: Optical collimator 342a: lens 342b: lens 350: beam reducer 351: Positive focal length lens configuration 351a: Convex lens 351b: Concave lens 352: Optical Path 353: Negative focal length lens configuration 354: auxiliary lens 355: Mask 357: Convergent lens 360: Orifice 430: Sensor 435: Detection Device 442: Optical collimator 442a: lens 442b: lens 450: beam reducer 451: Enter the positive focal length lens configuration 451a: Convex lens 451b: concave lens 452: Optical Path 453: Output positive focal length lens configuration 455: Mask 457: Convergent lens 460: Orifice 535: Detection Device 543: Spectral filter 544: Polarizing filter 611A: beam 611B: beam 611C_1: beam 611C_2: beam 620A: Diagnostic light 620B_1: Diagnostic light 620B_2: light 625A: Probe beam 625B_1: Probe beam 625B_2: Probe beam 625C_1: Probe beam 625C_2: Probe beam 626A: light source 626B: light source 626C_1: light source 626C_2: light source 627A: Optical components 627B: Optical components 627C_1: Optical components 627C_2: Optical components 665A: Diagnostic device 665B: Diagnostic device 665C: Diagnostic device 700: Weights and Measures Device 706: continuous flow 710: target space 715: vacuum environment 716: Chamber 725: Diagnostic Probe 735: Detection Device 736: Optical Window 745: Diagnostic Area 765: Diagnostic Device 775: Target Supply Device 776: EUV light source 777: EUV light 778: Radiation Pulse 779: output device 780: EUV Concentrator 781: Optical Source 782: Actuation System 783: control device 784: EUV light 785: Plasma 870: Control System 871: Signal Processing Module 872: Diagnostic Control Module 873: memory 874i: Input device 874o: output device 883: control device 884: Optical source actuation module 885: Target Delivery Module 979: Lithography Device 1090: process 1091, 1092, 1093, 1094, 1095, 1096: steps 1142: Refractive element 1151: Refractive element 1200: Weights and Measures Device 1220: diagnostic light 1222: non-diagnostic light 1225: Diagnostic probe beam 1230: two-dimensional sensor 1265: diagnostic device 1350: reflected beam reducer 1351: concave reflective element 1352: Optical Path 1353: convex reflective element 1450: catadioptric beam reducer 1451a: Flat reflective element 1451b: curved reflective element 1453: Convex/convergent refractive element 1555: Mask 1560: Orifice B: Exposure beam d: distance f1: focal length f2: focal length IF: Intermediate focus M: Mask R1: reflective optics R2: reflective optics R3: reflective optics S: slit t: time t1: time t2: time TR: trajectory V: rate W: substrate x: location x1: bearing x2: bearing Δd: distance/separation

圖1為包括具有用於收集在環境內產生之診斷光及非診斷光之機械濾光器之偵測裝置的度量衡裝置之示意性圖解,該診斷光由診斷區中之目標產生且該非診斷光由不同於診斷區之目標空間中之目標產生;Figure 1 is a schematic illustration of a metrology device including a detection device with a mechanical filter for collecting diagnostic light and non-diagnostic light generated in the environment, the diagnostic light is generated by a target in the diagnostic area and the non-diagnostic light Generated by a target in a target space different from the diagnosis area;

圖2A為可在圖1之機械濾光器中使用之遮罩之實施方案的示意性圖解;Figure 2A is a schematic illustration of an embodiment of a mask that can be used in the mechanical filter of Figure 1;

圖2B為可在圖1之機械濾光器中使用之遮罩之實施方案的示意性圖解;Fig. 2B is a schematic illustration of an embodiment of a mask that can be used in the mechanical filter of Fig. 1;

圖3為包括設計為折射Galilean望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;Fig. 3 is a schematic illustration of an implementation of the detection device of Fig. 1 including a beam reducer designed as a refracting Galilean telescope;

圖4為包括設計為折射Keplerian望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;FIG. 4 is a schematic diagram of an implementation of the detection device of FIG. 1 including a beam reducer designed as a refraction Keplerian telescope;

圖5為圖1之度量衡裝置之實施方案的示意性圖解,其中偵測裝置包括一或多個光譜濾光器及偏振濾光器;5 is a schematic diagram of an implementation of the metrology device of FIG. 1, wherein the detection device includes one or more spectral filters and polarization filters;

圖6A為產生單個診斷光束之診斷裝置之實施方案的示意性圖解及方塊圖;Figure 6A is a schematic diagram and block diagram of an implementation of a diagnostic device that generates a single diagnostic beam;

圖6B為由單個光源產生兩個診斷光束之診斷裝置之實施方案的示意性圖解及方塊圖;Fig. 6B is a schematic diagram and block diagram of an implementation of a diagnostic device that generates two diagnostic beams from a single light source;

圖6C為由相應光源產生兩個診斷光束之診斷裝置之實施方案的示意性圖解及方塊圖;Figure 6C is a schematic diagram and block diagram of an implementation of a diagnostic device that generates two diagnostic light beams from corresponding light sources;

圖7為在極紫外(EUV)光源中實施之圖1之度量衡裝置之實施方案的示意性圖解;FIG. 7 is a schematic diagram of an embodiment of the metrology device of FIG. 1 implemented in an extreme ultraviolet (EUV) light source;

圖8為圖1之度量衡裝置之控制裝置之實施方案的方塊圖;Figure 8 is a block diagram of an implementation of the control device of the metrology device of Figure 1;

圖9為接收自圖7之EUV光源輸出之EUV光的微影裝置之實施方案的示意性圖解;FIG. 9 is a schematic diagram of an embodiment of a lithography device that receives EUV light output from the EUV light source of FIG. 7;

圖10為由圖1之度量衡裝置執行以估計當前目標之一或多個屬性的過程之流程圖;FIG. 10 is a flowchart of a process performed by the metrology apparatus of FIG. 1 to estimate one or more attributes of the current target;

圖11為包括設計為折射Galilean望遠鏡之光束縮減器且其中光學準直器及光束縮減器之正焦距透鏡經整合至單個折射元件中的圖1之偵測裝置之實施方案的示意性圖解;11 is a schematic diagram of an implementation of the detection device of FIG. 1 including a beam reducer designed as a refractive Galilean telescope and in which the optical collimator and the positive focal length lens of the beam reducer are integrated into a single refractive element;

圖12為圖1之度量衡裝置之實施方案的示意性圖解,其中診斷探針為目標提供背部照明以使得目標之陰影由遮掩診斷探針之至少一部分的目標形成;FIG. 12 is a schematic illustration of an embodiment of the metrology device of FIG. 1, in which the diagnostic probe provides backlighting to the target so that the shadow of the target is formed by the target covering at least a part of the diagnostic probe;

圖13為包括設計為反射離軸望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;FIG. 13 is a schematic illustration of an implementation of the detection device of FIG. 1 including a beam reducer designed as a reflection off-axis telescope;

圖14為包括設計為反射折射離軸望遠鏡之光束縮減器的圖1之偵測裝置之實施方案的示意性圖解;以及Fig. 14 is a schematic illustration of an implementation of the detection device of Fig. 1 including a beam reducer designed as a catadioptric off-axis telescope; and

圖15為圖1之度量衡裝置之實施方案的示意性圖解,其中機械濾光器包括阻擋診斷光同時容許非診斷光穿過至感測器的遮罩。Fig. 15 is a schematic illustration of an embodiment of the metrology device of Fig. 1, wherein the mechanical filter includes a shield that blocks diagnostic light while allowing non-diagnostic light to pass through to the sensor.

申請人應注意圖式可能並非按比例的。舉例而言,示意性圖解中之光學元件之間的距離可大於或小於所展示的。Applicants should note that the drawings may not be to scale. For example, the distance between the optical elements in the schematic illustration can be greater or less than that shown.

100:度量衡裝置 100: Weights and Measures Device

105:目標 105: Goal

105c:當前目標 105c: current target

105p:先前目標 105p: previous target

106:連續流 106: continuous flow

110:目標空間 110: target space

115:環境 115: Environment

120:診斷光 120: Diagnostic light

121:準直光束 121: collimated beam

122:非診斷光 122: non-diagnostic light

123:準直光束 123: collimated beam

125:診斷探針 125: Diagnostic Probe

130:光感測器 130: light sensor

135:偵測裝置 135: Detection Device

140:機械濾光器 140: mechanical filter

142:光學準直器 142: Optical collimator

145:診斷區 145: Diagnosis area

150:光束縮減器 150: beam reducer

152:光學路徑 152: Optical Path

155:光學遮罩 155: Optical Mask

160:孔口 160: Orifice

165:診斷裝置 165: Diagnostic Device

170:控制系統 170: Control System

175:目標供應裝置 175: Target Supply Device

TR:軌跡 TR: trajectory

Claims (33)

一種度量衡裝置,其包含: 一診斷裝置,其經組態以在一當前目標進入一目標空間之前在一診斷區處使一診斷探針與該當前目標相互作用; 一偵測裝置,其包含: 一光感測器,其具有與該診斷區重疊之一視場且經組態以感測由在該診斷區處該診斷探針與該當前目標之間的該相互作用產生之光;以及 一機械濾光器,其在該診斷區與該光感測器之間,該機械濾光器包含一光束縮減器及一光學遮罩,該光學遮罩界定定位於該光束縮減器與該光感測器之間的一孔口;以及 一控制系統,其與該偵測裝置通信且經組態以基於來自該光感測器之輸出而估計該當前目標之一屬性。A weighing and measuring device, which comprises: A diagnostic device configured to allow a diagnostic probe to interact with the current target at a diagnostic area before the current target enters a target space; A detection device, which includes: A light sensor having a field of view overlapping the diagnostic area and configured to sense the light generated by the interaction between the diagnostic probe and the current target at the diagnostic area; and A mechanical filter is located between the diagnostic area and the light sensor. The mechanical filter includes a beam reducer and an optical shield. The optical shield defines a position between the beam reducer and the light sensor. An opening between the sensors; and A control system that communicates with the detection device and is configured to estimate an attribute of the current target based on the output from the light sensor. 如請求項1之度量衡裝置,其中該機械濾光器經組態以在角度上分離自該診斷區發射之診斷光與自該目標空間發射之非診斷光,其中該診斷光由在該診斷區處該當前目標與該診斷探針之間的一相互作用產生。The measurement device of claim 1, wherein the mechanical filter is configured to angularly separate the diagnostic light emitted from the diagnostic area and the non-diagnostic light emitted from the target space, wherein the diagnostic light is generated in the diagnostic area An interaction between the current target and the diagnostic probe is generated. 如請求項2之度量衡裝置,其中非診斷光包括自藉由該目標空間中之一先前目標產生之一電漿發射的光。The metrology device of claim 2, wherein the non-diagnostic light includes light emitted from a plasma generated by a previous target in the target space. 如請求項2之度量衡裝置,其中該孔口之橫向範圍約與該光學遮罩之平面中之該診斷光的橫向範圍相同或大於該光學遮罩之平面中之該診斷光的橫向範圍,且該光學遮罩之橫向範圍大於該光學遮罩之該平面中之該非診斷光的橫向範圍或約與該光學遮罩之該平面中之該非診斷光的橫向範圍相同。The measurement device of claim 2, wherein the lateral extent of the aperture is approximately the same as or greater than the lateral extent of the diagnostic light in the plane of the optical shield, and The lateral range of the optical shield is larger than or approximately the same as the lateral range of the non-diagnostic light in the plane of the optical shield. 如請求項2之度量衡裝置,其中該光學遮罩經定位以使得自該目標空間發射之該非診斷光實質上由該光學遮罩阻擋,而該診斷光實質上穿過該孔口。The metrology device of claim 2, wherein the optical shield is positioned such that the non-diagnostic light emitted from the target space is substantially blocked by the optical shield, and the diagnostic light substantially passes through the aperture. 如請求項1之度量衡裝置,其中該機械濾光器包含該診斷區與該光束縮減器之間的一光學準直器。The metrology device of claim 1, wherein the mechanical filter includes an optical collimator between the diagnostic area and the beam reducer. 如請求項6之度量衡裝置,其中該光束縮減器為一無焦光束縮減器且經組態為與該光學準直器結合以將一有限物件投影至無限。Such as the metrology device of claim 6, wherein the beam reducer is an afocal beam reducer and is configured to be combined with the optical collimator to project a finite object to infinity. 如請求項6之度量衡裝置,其中該光學準直器及最接近該光學準直器之具有正焦距的該光束縮減器之組件經整合至一單個折射元件中。The metrology device of claim 6, wherein the optical collimator and the components of the beam reducer with a positive focal length closest to the optical collimator are integrated into a single refractive element. 如請求項6之度量衡裝置,其中該光束縮減器經組態以維持光之一準直狀態。Such as the measurement device of claim 6, wherein the beam reducer is configured to maintain a collimated state of light. 如請求項1之度量衡裝置,其中該光感測器包含以下一或多者:光電二極體、光電晶體、光相依電阻器、光電倍增管、多單元光接收器、四單元光接收器及相機。For example, the metrology device of claim 1, wherein the light sensor includes one or more of the following: photodiode, photoelectric crystal, light-dependent resistor, photomultiplier tube, multi-unit light receiver, four-unit light receiver, and camera. 如請求項1之度量衡裝置,其中該診斷探針包含至少一個診斷光束,且該光感測器經組態以感測由該當前目標與該至少一個診斷光束之間的該相互作用產生之診斷光。The metrology device of claim 1, wherein the diagnostic probe includes at least one diagnostic beam, and the light sensor is configured to sense the diagnosis generated by the interaction between the current target and the at least one diagnostic beam Light. 如請求項11之度量衡裝置,其中該診斷光包含自該當前目標反射、自該當前目標散射或由該當前目標阻擋之該診斷光束。The measurement device of claim 11, wherein the diagnostic light includes the diagnostic light beam reflected from the current target, scattered from the current target, or blocked by the current target. 如請求項1之度量衡裝置,其中該偵測裝置進一步包含一光譜濾光器及一偏振濾光器中之一或多者。The measurement device of claim 1, wherein the detection device further includes one or more of a spectral filter and a polarization filter. 如請求項1之度量衡裝置,其中該診斷探針包含第一診斷光束及第二診斷光束,該第一診斷光束及第二診斷光束各自經組態以在其進入該目標空間之前與該當前目標相互作用,每一相互作用發生於一相異區及一相異時間處。The metrology device of claim 1, wherein the diagnostic probe includes a first diagnostic beam and a second diagnostic beam, and the first diagnostic beam and the second diagnostic beam are each configured to interact with the current target before it enters the target space. Interaction, each interaction occurs in a different area and a different time. 如請求項1之度量衡裝置,其中該光束縮減器包含一折射望遠鏡、一反射望遠鏡或一反射折射望遠鏡。Such as the measurement device of claim 1, wherein the beam reducer includes a refracting telescope, a reflecting telescope or a reflective refracting telescope. 如請求項15之度量衡裝置,其中該折射望遠鏡包含: 一正焦距透鏡配置及一負焦距透鏡配置,其由其焦距之總和分離;或 一對正焦距透鏡配置,其由其焦距之總和分離。Such as the weights and measures device of claim 15, wherein the refracting telescope includes: A positive focal length lens configuration and a negative focal length lens configuration, which are separated by the sum of their focal lengths; or A pair of positive focal length lens configurations are separated by the sum of their focal lengths. 如請求項1之度量衡裝置,其中該光束縮減器經組態以將照射光之一橫向大小縮減至少五倍、至少十倍、至少二十倍或約十倍。The metrology device of claim 1, wherein the beam reducer is configured to reduce a lateral size of the illuminating light by at least five times, at least ten times, at least twenty times, or about ten times. 如請求項1之度量衡裝置,其中該孔口包括一圓形開口、一橢圓開口、一多邊形開口或一細長狹縫開口。The weighing device of claim 1, wherein the orifice includes a circular opening, an elliptical opening, a polygonal opening, or an elongated slit opening. 如請求項1之度量衡裝置,其中該偵測裝置經定位於一極紫外(EUV)光源之一腔室外部,該診斷區在該腔室內部,且該偵測裝置經由該腔室之一壁中之一光學窗自該腔室接收光。The measurement device of claim 1, wherein the detection device is positioned outside a chamber of an extreme ultraviolet (EUV) light source, the diagnosis area is inside the chamber, and the detection device passes through a wall of the chamber One of the optical windows receives light from the cavity. 如請求項19之度量衡裝置,其中該診斷區與該光學窗之間的一距離為該診斷區與該目標空間之間的一距離之大小的約200至500倍。Such as claim 19, wherein a distance between the diagnostic area and the optical window is about 200 to 500 times the size of a distance between the diagnostic area and the target space. 如請求項1之度量衡裝置,其中該偵測裝置包含該孔口之一輸出端處之一聚焦透鏡,該聚焦透鏡經組態以將所感測光聚焦至該光感測器上。The measurement device of claim 1, wherein the detection device includes a focusing lens at an output end of the aperture, the focusing lens is configured to focus the sensed light onto the light sensor. 如請求項1之度量衡裝置,其中該孔口具有至少2毫米(mm)之範圍。Such as the weighing device of claim 1, wherein the aperture has a range of at least 2 millimeters (mm). 如請求項1之度量衡裝置,其中該孔口經定位以在該診斷光在其處為準直或為非收斂及非發散的一方位處接收診斷光。Such as the weighing device of claim 1, wherein the aperture is positioned to receive the diagnostic light at a position where the diagnostic light is collimated or non-convergent and non-divergent. 一種度量衡方法,其包含: 在一當前目標進入一目標空間之前在一診斷區處使一診斷探針與該當前目標相互作用; 收集由在該診斷區處該診斷探針與該當前目標之間的該相互作用產生之診斷光,該收集亦包括收集由該目標空間產生之非診斷光; 使該診斷光及該非診斷光準直; 使該診斷光與該非診斷光彼此在角度上分離包括縮減該診斷光及該非診斷光之橫向範圍; 在該診斷光及該非診斷光已在角度上分離之後在自由該非診斷光穿過之一非感測區橫向移位之一感測區處感測該診斷光;以及 基於所感測診斷光而估計該當前目標之一屬性。A method of weights and measures, which includes: Before a current target enters a target space, a diagnostic probe is made to interact with the current target at a diagnostic area; Collecting the diagnostic light generated by the interaction between the diagnostic probe and the current target at the diagnostic area, the collection also includes collecting non-diagnostic light generated by the target space; Collimate the diagnostic light and the non-diagnostic light; Separating the diagnostic light and the non-diagnostic light angularly from each other includes reducing the lateral range of the diagnostic light and the non-diagnostic light; After the diagnostic light and the non-diagnostic light have been angularly separated, sensing the diagnostic light at a sensing area that is laterally displaced by the non-diagnostic light through a non-sensing area; and An attribute of the current target is estimated based on the sensed diagnostic light. 如請求項24之度量衡方法,其中: 在該診斷區處使該診斷探針與該當前目標相互作用包含在該診斷區處使一或多個診斷光束與該當前目標相互作用;以及 收集診斷光包含在該診斷區處收集已自該當前目標反射、自該當前目標散射或由該當前目標阻擋之一或多個診斷光束。Such as the weights and measures method of claim 24, where: Interacting the diagnostic probe with the current target at the diagnostic zone includes interacting one or more diagnostic beams with the current target at the diagnostic zone; and Collecting diagnostic light includes collecting one or more diagnostic light beams at the diagnostic area that have been reflected from the current target, scattered from the current target, or blocked by the current target. 如請求項24之度量衡方法,其進一步包含基於其光譜屬性及其偏振狀態中之一或多者而過濾該診斷光。Such as the measurement method of claim 24, which further includes filtering the diagnostic light based on one or more of its spectral properties and its polarization state. 如請求項24之度量衡方法,其中該診斷區在一極紫外(EUV)光源之一氣密密封腔室內部,且亦包括收集非診斷光之收集該診斷光包含接收包括經由該腔室之一壁中之一光學窗透射之該非診斷光的該診斷光。The metrology method of claim 24, wherein the diagnostic area is inside an airtight chamber of an extreme ultraviolet (EUV) light source, and also includes collecting non-diagnostic light. The non-diagnostic light transmitted by one of the optical windows is the diagnostic light. 如請求項24之度量衡方法,其中縮減該診斷光及該非診斷光之該橫向範圍包含將該診斷光及該非診斷光之該橫向範圍縮減至少五倍、至少十倍、至少二十倍或約十倍。The weighing method of claim 24, wherein reducing the lateral extent of the diagnostic light and the non-diagnostic light comprises reducing the lateral extent of the diagnostic light and the non-diagnostic light by at least five times, at least ten times, at least twenty times, or about ten times Times. 如請求項24之度量衡方法,其進一步包含阻擋該非感測區處之該非診斷光或重新引導該非診斷光。Such as the measurement method of claim 24, which further includes blocking the non-diagnostic light at the non-sensing area or redirecting the non-diagnostic light. 如請求項24之度量衡方法,其中縮減該診斷光及該非診斷光之該橫向範圍包含以下中之一或多者:折射該光及反射該光。For the weighing method of claim 24, wherein reducing the lateral range of the diagnostic light and the non-diagnostic light includes one or more of the following: refracting the light and reflecting the light. 如請求項24之度量衡方法,其進一步包含聚焦該感測區處之該診斷光。Such as the measurement method of claim 24, which further includes focusing the diagnostic light at the sensing area. 如請求項24之度量衡方法,其中縮減該診斷光及該非診斷光之該橫向範圍包含維持該診斷光及該非診斷光之一準直狀態。For example, the measurement method of claim 24, wherein reducing the lateral range of the diagnostic light and the non-diagnostic light includes maintaining a collimation state of the diagnostic light and the non-diagnostic light. 如請求項24之度量衡方法,其進一步包含在該診斷光及該非診斷光在角度上彼此分離之後及在該診斷光經感測之前,使該診斷光穿過一光學遮罩之一孔口,該孔口具有大於該診斷光之範圍的範圍。The metrology method of claim 24, further comprising after the diagnostic light and the non-diagnostic light are angularly separated from each other and before the diagnostic light is sensed, passing the diagnostic light through an aperture of an optical shield, The aperture has a range larger than the range of the diagnostic light.
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