TW202104791A - Replacement method for vaporization device - Google Patents

Replacement method for vaporization device Download PDF

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TW202104791A
TW202104791A TW109111929A TW109111929A TW202104791A TW 202104791 A TW202104791 A TW 202104791A TW 109111929 A TW109111929 A TW 109111929A TW 109111929 A TW109111929 A TW 109111929A TW 202104791 A TW202104791 A TW 202104791A
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heat exchanger
heat
gasification device
gaseous gas
aforementioned
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TW109111929A
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Chinese (zh)
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TWI768318B (en
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中森涼馬
岩崎正英
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日商神戶製鋼所股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D90/00Component parts, details or accessories for large containers
    • B65D90/12Supports
    • EFIXED CONSTRUCTIONS
    • E02HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02DFOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D27/00Foundations as substructures
    • E02D27/32Foundations for special purposes
    • E02D27/38Foundations for large tanks, e.g. oil tanks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17CVESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C9/00Methods or apparatus for discharging liquefied or solidified gases from vessels not under pressure
    • F17C9/02Methods or apparatus for discharging liquefied or solidified gases from vessels not under pressure with change of state, e.g. vaporisation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • F28D5/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation in which the evaporating medium flows in a continuous film or trickles freely over the conduits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/16Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged in parallel spaced relation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geometry (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Paleontology (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

The present application discloses a method for replacing an existing vaporization device with a new vaporization device. The replacement method comprising: removing a heat exchanger of an existing vaporization device from a base structure; installing a first heat exchanger including an open rack-type vaporizer on the base structure from which the heat exchanger has been removed; installing, on a place other than the base structure, a second heat exchanger for heating the vaporized gas obtained by vaporizing a liquefied gas; connecting the first heat exchanger to the second heat exchanger so that the vaporized gas flows from the first heat exchanger into the second heat exchanger; and increasing the supply amount of the liquefied gas to be supplied to the first heat exchanger to be greater than the supply amount of the liquefied gas having been supplied to the heat exchanger of the existing vaporization device.

Description

氣化裝置的置換方法Replacement method of gasification device

本發明,是關於將既有之氣化裝置予以置換成新的氣化裝置的方法。The present invention relates to a method of replacing an existing gasification device with a new gasification device.

已知有一種開架式的氣化裝置(參照日本特開平10-196894號公報及日本特開2017-40296號公報),其具有:在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使液態氣體氣化之構造的熱交換器。There is known an open-frame vaporization device (refer to Japanese Patent Laid-Open No. 10-196894 and Japanese Patent Laid-Open No. 2017-40296), which has a heating liquid supplied to the outer surface of a heat transfer tube in which liquid gas flows, and A heat exchanger constructed to vaporize liquid gas.

在將既有之氣化裝置予以交換成新的氣化裝置時,要求著抑制交換所伴隨之成本的上昇,並增加使液態氣體氣化的能力。為了抑制交換成本的上昇,較佳是使既有之氣化裝置之熱交換器之利用在固定設置的基礎構造亦利用於新的氣化裝置。但是,將基礎構造予以再利用的情況時,會難以使新的氣化裝置的能力增大。例如,將基礎構造予以再利用的情況時,就無法將新的氣化裝置的尺寸從既有之氣化裝置的尺寸大幅地增加。若無法容許新的氣化裝置的尺寸增加的話,例如,就無法採用使導熱管的數量增加、使導熱管變長、使導熱面板的數量增加等之措施,使得氣化能力受到限制。When an existing gasification device is exchanged for a new gasification device, it is required to suppress the increase in costs associated with the exchange and to increase the ability to vaporize liquid gas. In order to suppress the increase in the exchange cost, it is preferable to use the heat exchanger of the existing gasification device in the fixed basic structure and also use it in the new gasification device. However, when the basic structure is reused, it is difficult to increase the capacity of the new gasification device. For example, when the basic structure is reused, the size of the new gasification device cannot be greatly increased from the size of the existing gasification device. If the size of the new gasification device cannot be increased, for example, measures such as increasing the number of heat pipes, lengthening the heat pipes, and increasing the number of heat conducting panels cannot be adopted, which limits the gasification capacity.

本發明之目的在於提供一種技術,其可利用既有之氣化裝置之熱交換器的基礎構造,來固定設置具有比既有之氣化裝置還優異之氣化能力的新的氣化裝置。The object of the present invention is to provide a technique which can use the basic structure of the heat exchanger of the existing gasification device to fix and install a new gasification device having a gasification ability superior to that of the existing gasification device.

本發明之一型態之氣化裝置的置換方法,可利用在將既有之氣化裝置予以置換成新的氣化裝置,該氣化裝置具有:在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使前述液態氣體氣化來產生氣態氣體並使前述氣態氣體昇溫的熱交換器。置換方法,是具備以下作業:將前述既有之氣化裝置的前述熱交換器,從基礎構造予以去除;將具備1或2個以上之開架式氣化器的第1熱交換器,予以固定設置在去除了前述熱交換器的前述基礎構造上,該開架式氣化器,構成為在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使前述液態氣體氣化;在與前述基礎構造不同的場所,設置將前述液態氣體之氣化結果所得到的氣態氣體予以昇溫的第2熱交換器;以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器的方式,來將前述第1熱交換器連接於前述第2熱交換器;進行以下之任一者:使供給至前述第1熱交換器的前述液態氣體之供給量,比前述既有之氣化裝置之對前述熱交換器供給的前述液態氣體之供給量更大、以及使前述液態氣體之氣化結果所得到的氣態氣體之溫度,比前述既有之氣化裝置所致之氣化結果所得到的氣態氣體之溫度更高。The replacement method of a gasification device of one type of the present invention can be used to replace an existing gasification device with a new gasification device. The gasification device has: A heat exchanger that supplies a heating liquid to vaporize the liquid gas to generate a gaseous gas and raise the temperature of the gaseous gas. The replacement method includes the following operations: removing the heat exchanger of the existing vaporization device from the basic structure; fixing the first heat exchanger with one or more open-frame vaporizers The open-frame vaporizer is installed on the basic structure from which the heat exchanger is removed, and the open-frame vaporizer is configured to supply a heating liquid to the outer peripheral surface of the heat transfer tube in which the liquid gas flows, thereby vaporizing the liquid gas; Where the aforementioned basic structure is different, a second heat exchanger that raises the temperature of the gaseous gas obtained as a result of the vaporization of the aforementioned liquid gas is installed; the aforementioned gaseous gas flows from the aforementioned first heat exchanger to the aforementioned second heat exchanger The method is to connect the first heat exchanger to the second heat exchanger; perform any of the following: make the supply amount of the liquid gas supplied to the first heat exchanger more vaporized than the existing one. The supply of the liquid gas supplied to the heat exchanger by the device is larger, and the temperature of the gaseous gas obtained as a result of the gasification of the liquid gas is higher than that of the gasification result of the aforementioned existing gasification device. The temperature of the obtained gaseous gas is higher.

上述的置換方法,可利用既有之氣化裝置之熱交換器的基礎構造,來固定設置具有比既有之氣化裝置還優異之氣化能力的新的氣化裝置。The above-mentioned replacement method can use the basic structure of the heat exchanger of the existing gasification device to fix and install a new gasification device with better gasification ability than the existing gasification device.

本發明之目的、特徵及優點,藉由以下詳細的說明與附加圖式,而更為明白。The purpose, features, and advantages of the present invention will be more apparent from the following detailed description and additional drawings.

圖1,是既有之氣化裝置100之概略的佈局圖。參照圖1,說明既有之氣化裝置100。Fig. 1 is a schematic layout diagram of a conventional gasification device 100. Referring to FIG. 1, a conventional gasification device 100 will be described.

氣化裝置100,具備:在基礎構造200上空出間隔來整列之三台的熱交換器111、112、113、連接於該等之熱交換器111、112、113的三個多歧管114、115、116。熱交換器111、112、113的各個,是設置成透過海水與液態氣體之間的熱交換來使液態氣體氣化,而產生氣態氣體。多歧管114、115、116,用來對該等之熱交換器111、112、113供給海水及液態氣體,並回收來自該等之熱交換器111、112、113的氣態氣體。The gasification device 100 includes three heat exchangers 111, 112, and 113 arranged at intervals on the basic structure 200, and three multi-manifolds 114 connected to the heat exchangers 111, 112, and 113. 115, 116. Each of the heat exchangers 111, 112, and 113 is arranged to vaporize the liquid gas through heat exchange between seawater and the liquid gas to generate gaseous gas. The manifolds 114, 115, and 116 are used to supply seawater and liquid gas to the heat exchangers 111, 112, and 113, and to recover gaseous gas from the heat exchangers 111, 112, and 113.

多歧管114、115、116,在基礎構造200的外側於熱交換器111、112、113的整列方向延伸設置。多歧管114、115、116的各個,連接於熱交換器111、112、113。多歧管114,連接於海水泵212,該海水泵212將藉由取水設備211取得的海水予以吐出。海水的供給路徑,在圖1是以虛線描繪。多歧管115,連接於供給液態氣體的供給設備220。來自供給設備220之液態氣體的供給量,是基於需求方所需要之氣態氣體的量,來設定在既定的值。液態氣體的供給路徑,在圖1是以鏈線描繪。於多歧管116,流入有在熱交換器111、112、113產生的氣態氣體。多歧管116,連接於從需要氣態氣體的需求方延伸設置的管構件。氣態氣體的流動路徑,在圖1是以實線描繪。The manifolds 114, 115, and 116 extend in the alignment direction of the heat exchangers 111, 112, and 113 outside the basic structure 200. Each of the multi-manifolds 114, 115, and 116 is connected to the heat exchangers 111, 112, and 113. The multi-manifold 114 is connected to a sea water pump 212, and the sea water pump 212 discharges the sea water obtained by the water intake device 211. The supply path of seawater is depicted by a broken line in FIG. 1. The multi-manifold 115 is connected to a supply device 220 for supplying liquid gas. The supply amount of liquid gas from the supply device 220 is set at a predetermined value based on the amount of gaseous gas required by the demand side. The supply path of the liquid gas is depicted by chain lines in FIG. 1. In the multi-manifold 116, gaseous gas generated in the heat exchangers 111, 112, and 113 flows in. The multi-manifold 116 is connected to a pipe member extending from the demand side that needs gaseous gas. The flow path of the gaseous gas is depicted by a solid line in FIG. 1.

基礎構造200,用來固定熱交換器111、112、113。基礎構造200,含有:形成在地面上的基座部230、從基座部230豎立設置的基礎框231。基礎框231,在俯視時,含有:形成大致C型的外框232、將被外框232包圍的區域予以分隔成三個固設區域234、235、236的兩個分隔框233。The basic structure 200 is used to fix the heat exchangers 111, 112, and 113. The base structure 200 includes a base 230 formed on the ground, and a base frame 231 erected from the base 230. The base frame 231 includes, in a plan view, a substantially C-shaped outer frame 232 and two partition frames 233 that partition the area surrounded by the outer frame 232 into three fixed areas 234, 235, and 236.

熱交換器111、112、113,具有開架式的構造,在構造上為共通。熱交換器111、112、113的構造,參照圖1及圖2來說明。圖2,是熱交換器111、112、113各自所含之開架式氣化器300之概略的立體圖。熱交換器111、112、113,各自僅具有一個開架式氣化器300亦可,具有兩個以上的開架式氣化器300亦可。The heat exchangers 111, 112, and 113 have an open-frame structure, and are common in structure. The structure of the heat exchangers 111, 112, and 113 will be described with reference to FIGS. 1 and 2. Fig. 2 is a schematic perspective view of an open-frame vaporizer 300 included in each of the heat exchangers 111, 112, and 113. The heat exchangers 111, 112, and 113 may each have only one open-frame vaporizer 300, or may have two or more open-frame vaporizers 300.

開架式氣化器300是構成為,在使既定流量的液態氣體從供給設備220供給時,產生比需求方所需要之溫度更高溫度的氣態氣體。開架式氣化器300,含有:三個導熱面板310、從多歧管114直接或間接地延伸設置的四個供給管321、分別連接於該等之供給管321的四個槽盤322。此外,開架式氣化器300,具有一對的多歧管315、316。多歧管315,連接於參照圖1所說明的多歧管115(參照圖1)。多歧管316,連接於參照圖1所說明的多歧管116。四個槽盤322,是空出間隔,而在基礎框231之開口部位的寬度方向整列。導熱面板310,豎立設置在槽盤322之間。於是,三個導熱面板310,也是空出間隔,而在基礎框231之開口部位的寬度方向整列。The open-frame vaporizer 300 is configured to generate a gaseous gas having a higher temperature than the demand side requires when a liquid gas of a predetermined flow rate is supplied from the supply device 220. The open-frame vaporizer 300 includes three heat-conducting panels 310, four supply pipes 321 extending directly or indirectly from the multi-manifold 114, and four trays 322 respectively connected to the supply pipes 321. In addition, the open-frame vaporizer 300 has a pair of multi-manifolds 315 and 316. The multi-manifold 315 is connected to the multi-manifold 115 described with reference to FIG. 1 (refer to FIG. 1 ). The multi-manifold 316 is connected to the multi-manifold 116 described with reference to FIG. 1. The four troughs 322 are spaced apart, and are aligned in the width direction of the opening of the base frame 231. The heat conducting panel 310 is erected between the trough plates 322. Therefore, the three heat-conducting panels 310 are also spaced apart and aligned in the width direction of the opening of the base frame 231.

三個導熱面板310的各個,含有:下集管311、在下集管311的上方分開的位置所配置的上集管312、在下集管311與上集管312之間大致鉛直地延伸的複數個導熱管313。下集管311,從液態氣體用的多歧管315延伸,進入至固設區域234、235、236內。上集管312,從氣態氣體用的多歧管316延伸,進入至固設區域234、235、236內。複數個導熱管313,在下集管311及上集管312的延伸設置方向整列。Each of the three heat conducting panels 310 includes: a lower header 311, an upper header 312 arranged at a position separated above the lower header 311, and a plurality of pieces extending substantially vertically between the lower header 311 and the upper header 312 Heat pipe 313. The lower header 311 extends from the multi-manifold 315 for liquid gas into the fixed areas 234, 235, and 236. The upper header 312 extends from the multi-manifold 316 for gaseous gas into the fixed areas 234, 235, and 236. The plurality of heat conducting tubes 313 are aligned in the extending direction of the lower header 311 and the upper header 312.

四個槽盤322的各個,用來將海水供給至所對應的導熱面板310。槽盤322及所對應的導熱面板310,形成開架式的氣化器。槽盤322,具有於導熱管313之整列方向較長的箱狀構造,且於上方開口。槽盤322,配置在比上集管312更低的位置且比鉛直方向之導熱面板310的中間位置更高的位置,並與複數個導熱管313的上部相鄰。Each of the four trough plates 322 is used to supply seawater to the corresponding heat conducting panel 310. The trough plate 322 and the corresponding heat conducting panel 310 form an open-frame vaporizer. The trough plate 322 has a box-like structure that is long in the alignment direction of the heat pipe 313, and is open at the upper side. The trough plate 322 is arranged at a position lower than the upper header 312 and higher than the middle position of the heat conduction panel 310 in the vertical direction, and is adjacent to the upper part of the plurality of heat conduction tubes 313.

四個供給管321,連接於四個槽盤322與海水用的多歧管114,而形成海水的供給路徑。The four supply pipes 321 are connected to the four trays 322 and the multi-manifold 114 for seawater to form a seawater supply path.

海水,在藉由取水設備211取得之後,藉由海水泵212往多歧管114送出。海水,藉由多歧管114,而分配置熱交換器111、112、113各自的四個供給管321。海水,通過該等之供給管321,而供給至熱交換器111、112、113各自的四個槽盤322。海水,從槽盤322溢出,而供給至複數個導熱管313之外周面的上部。海水,沿著該等之導熱管313的外周面而流下。海水的供給量,是設定成能夠得到比需求方所需要之溫度更高溫度的氣態氣體。After the seawater is obtained by the water intake device 211, it is sent to the multi-manifold 114 by the seawater pump 212. For seawater, four supply pipes 321 of each of the heat exchangers 111, 112, and 113 are allocated by the multi-manifold 114. The seawater is supplied to the four tank plates 322 of the heat exchangers 111, 112, and 113 through the supply pipes 321. The seawater overflows from the pan 322 and is supplied to the upper part of the outer peripheral surface of the plurality of heat transfer pipes 313. The sea water flows down along the outer peripheral surface of the heat pipes 313. The supply of seawater is set to obtain a gaseous gas at a higher temperature than the demand side needs.

液態氣體,從供給設備220供給至多歧管115、315,藉由多歧管315,分配至熱交換器111、112、113各自的下集管311。液態氣體,從下集管311流入至複數個導熱管313,並朝向上集管312。在這期間,液態氣體,會與沿著複數個導熱管313之外周面而流下的海水進行熱交換,而成為氣態氣體。氣態氣體,依序通過上集管312及多歧管316、116,而供給至需求方。熱交換器111、112、113,不只是具有產生從液態氣體往氣態氣體之相變的功能,還具有使氣態氣體昇溫一定程度的功能。於是,從熱交換器111、112、113排出之氣態氣體的溫度,超過需求方所需要之既定的溫度。The liquid gas is supplied from the supply device 220 to the multi-manifolds 115 and 315, and is distributed to the lower headers 311 of the heat exchangers 111, 112, and 113 through the multi-manifold 315. The liquid gas flows from the lower header 311 to the plurality of heat conducting tubes 313 and faces the upper header 312. During this period, the liquid gas exchanges heat with the seawater flowing down the outer peripheral surface of the plurality of heat transfer pipes 313, and becomes a gaseous gas. The gaseous gas passes through the upper header 312 and the multi-manifolds 316 and 116 in sequence to be supplied to the demand side. The heat exchangers 111, 112, and 113 not only have the function of generating a phase change from liquid gas to gaseous gas, but also have the function of raising the temperature of the gaseous gas to a certain extent. Therefore, the temperature of the gaseous gas discharged from the heat exchangers 111, 112, and 113 exceeds the predetermined temperature required by the demand side.

將氣化裝置100予以置換成新的氣化裝置400用的置換方法,參照圖1、圖3至圖5來說明。置換方法,大致分成:去除氣化裝置100的除去工程、將新的氣化裝置400的主要部位予以固定設置的固設工程、進行主要部位間之管連接的連接工程。圖3,是將除去工程予以概略表示的佈局圖。圖4,是將固設工程予以概略表示的佈局圖。圖5,是將連接工程予以概略表示的佈局圖。The replacement method for replacing the gasification device 100 with a new gasification device 400 will be described with reference to FIGS. 1 and 3 to 5. The replacement method is roughly divided into: a removal process of the removal gasification device 100, a fixing process of fixing the main parts of the new gasification device 400, and a connection process of pipe connections between the main parts. Fig. 3 is a layout diagram schematically showing the removal process. Fig. 4 is a layout diagram schematically showing the fixing work. Fig. 5 is a layout diagram schematically showing the connection process.

在除去工程(參照圖3)中,多歧管114、115、116與熱交換器111、112、113之間的連接被解除。之後,使熱交換器111、112、113,從基礎構造200撤走。In the removal process (refer to FIG. 3), the connection between the manifolds 114, 115, and 116 and the heat exchangers 111, 112, and 113 is released. After that, the heat exchangers 111, 112, and 113 are removed from the basic structure 200.

在固設工程(參照圖4)中,設置三台第1熱交換器431、432、433及一台第2熱交換器434。第1熱交換器431、432、433,以分別配置在固設區域234、235、236內的方式,固定設置在基礎構造200。亦即,第1熱交換器431、432、433,分別固定設置在既有之熱交換器111、112、113曾固定設置的位置。第2熱交換器434,固定設置在從基礎構造200分開的位置。In the fixing process (refer to FIG. 4), three first heat exchangers 431, 432, and 433 and one second heat exchanger 434 are installed. The first heat exchangers 431, 432, and 433 are fixedly installed in the foundation structure 200 so as to be arranged in the fixed areas 234, 235, and 236, respectively. That is, the first heat exchangers 431, 432, and 433 are respectively fixedly installed at positions where the existing heat exchangers 111, 112, and 113 were fixedly installed. The second heat exchanger 434 is fixedly installed at a position separated from the basic structure 200.

連接工程(參照圖5)中,第1熱交換器431、432、433,連接於三個多歧管114、115、116的各個。多歧管116,亦連接於第2熱交換器434。在連接工程中,使第2熱交換器434連通於需求方,而完成新的氣化裝置400。In the connection process (refer to FIG. 5), the first heat exchangers 431, 432, and 433 are connected to each of the three manifolds 114, 115, and 116. The multi-manifold 116 is also connected to the second heat exchanger 434. In the connection process, the second heat exchanger 434 is connected to the demand side, and the new gasification device 400 is completed.

關於第1熱交換器431、432、433的構造,將圖2之開架式氣化器300的說明,援用於第1熱交換器431、432、433的各個。Regarding the structure of the first heat exchangers 431, 432, and 433, the description of the open-frame vaporizer 300 in FIG. 2 is applied to each of the first heat exchangers 431, 432, and 433.

作為第2熱交換器434,可利用具有殼管構造的熱交換器440。熱交換器440,參照圖4至圖6來說明。圖6,是熱交換器440之概略的剖面圖。As the second heat exchanger 434, a heat exchanger 440 having a shell and tube structure can be used. The heat exchanger 440 will be described with reference to FIGS. 4 to 6. FIG. 6 is a schematic cross-sectional view of the heat exchanger 440. As shown in FIG.

熱交換器440,具有:供加熱用媒體流入流出之中空的殼441、供氣態氣體流動的複數個導熱管442、連接於該等之導熱管442之各個兩端的一對管室443、444。此外,熱交換器440,具有供給管471及排出管472,其分別形成加熱用媒體對於殼441的流入口及流出口。導熱管442,配設在殼441內,沿著殼441的延伸設置方向延伸。管室443,在連接工程(參照圖5)中,連結於:多歧管116或是連接於多歧管116的管構件。管室444,連結於:連通於需求方的管構件。又,對殼441流通氣態氣體,對導熱管442流通加熱用媒體亦可。The heat exchanger 440 has a hollow shell 441 through which the heating medium flows in and out, a plurality of heat pipes 442 through which gaseous gas flows, and a pair of tube chambers 443 and 444 connected to the respective ends of the heat pipes 442. In addition, the heat exchanger 440 has a supply pipe 471 and a discharge pipe 472, which form an inlet and an outlet of the heating medium to the housing 441, respectively. The heat pipe 442 is arranged in the shell 441 and extends along the extending direction of the shell 441. The pipe chamber 443 is connected to the multi-manifold 116 or a pipe member connected to the multi-manifold 116 in the connection process (refer to FIG. 5). The tube chamber 444 is connected to a tube member connected to the demand side. In addition, a gaseous gas may be circulated through the shell 441, and a heating medium may be circulated through the heat pipe 442.

加熱用媒體,是在固設工程(參照圖4)及連接工程(參照圖5)中,在熱交換器440作為第2熱交換器434被固定設置之後或是連接工程結束之後,通過供給管471,來供給至殼441內。加熱用媒體,在殼441內對流動於複數個導熱管442的氣態氣體賦予熱。之後,加熱用媒體,通過排出管472,排出至殼441之外。供給至殼441內的加熱用媒體,為海水亦可,為比氣態氣體還高溫之其他的媒體亦可。在海水作為加熱用媒體來使用的情況時,從取水設備211供給至供給管471亦可。The heating medium is passed through the supply pipe after the heat exchanger 440 is fixedly installed as the second heat exchanger 434 in the fixing process (refer to FIG. 4) and the connection process (refer to FIG. 5) or after the connection process is completed. 471, come and supply it into the shell 441. The heating medium applies heat to the gaseous gas flowing through the plurality of heat transfer tubes 442 in the case 441. After that, the heating medium is discharged out of the casing 441 through the discharge pipe 472. The heating medium supplied into the shell 441 may be seawater, or other media having a higher temperature than gaseous gas. When seawater is used as a heating medium, it may be supplied from the water intake device 211 to the supply pipe 471.

在新的氣化裝置400完成之後,從供給設備220將液態氣體供給至第1熱交換器431、432、433。在第1熱交換器431、432、433之熱交換的結果所得到的氣態氣體,通過多歧管116及管室443,流入至導熱管442。在導熱管442內流動的氣態氣體,與殼441內的加熱用媒體熱交換,而使溫度成為超過需求方所需要的溫度。藉由加熱用媒體昇溫過的氣態氣體,通過管室444而排出,供給至需求方。After the new vaporization device 400 is completed, the liquid gas is supplied from the supply device 220 to the first heat exchangers 431, 432, and 433. The gaseous gas obtained as a result of the heat exchange in the first heat exchangers 431, 432, and 433 passes through the manifold 116 and the tube chamber 443, and flows into the heat transfer tube 442. The gaseous gas flowing in the heat pipe 442 exchanges heat with the heating medium in the shell 441, and the temperature becomes higher than the temperature required by the demand side. The gaseous gas heated by the heating medium is discharged through the tube chamber 444 and supplied to the demand side.

從既有之氣化裝置100置換成新的氣化裝置400之優點,如以下說明。The advantages of replacing the existing gasification device 100 with a new gasification device 400 are described below.

參照圖1及圖5可得知,基礎構造200、多歧管114、115、116、供給設備220、海水泵212及取水設備211等之附屬設備,利用在氣化裝置100、400之雙方。該等附屬設備,可直接利用於新的氣化裝置400,故抑制從既有之氣化裝置100置換成新的氣化裝置400時所伴隨之費用的增加。但是,該等附屬設備的一部分或全部,是配合新的氣化裝置400所需要的性能來交換亦可。1 and 5, it can be seen that the basic structure 200, the multi-manifold 114, 115, 116, the supply equipment 220, the sea water pump 212, and the water intake equipment 211 and other auxiliary equipment are used in both the gasification devices 100 and 400. These ancillary equipment can be directly used in the new gasification device 400, so the increase in costs associated with replacing the existing gasification device 100 with the new gasification device 400 is suppressed. However, part or all of these auxiliary equipment may be exchanged to match the performance required by the new gasification device 400.

新的氣化裝置400,除了與既有之熱交換器111、112、113對應的第1熱交換器431、432、433以外,還具有第2熱交換器434。第2熱交換器434,擔任以第1熱交換器431、432、433所產生之氣態氣體的昇溫功能,故第1熱交換器431、432、433,與既有之熱交換器111、112、113不同,可不必擔任對氣態氣體昇溫的功能。在新的氣化裝置400要求比既有之氣化裝置100還多之氣態氣體之供給的情況,供給設備220,是以比對既有之熱交換器111、112、113之液態氣體的供給量更多的供給量,來將液態氣體供給至第1熱交換器431、432、433。該情況時,從第1熱交換器431、432、433朝向第2熱交換器434之氣態氣體的溫度,會有低於需求方所需要之溫度的情況。但是,第2熱交換器434使氣態氣體昇溫,故從第2熱交換器434朝向需求方之氣態氣體的溫度,可滿足需求方的要求溫度條件。於是,新的氣化裝置400,具有較高的氣化能力,可供給滿足需求方之要求的氣態氣體。The new vaporization device 400 has a second heat exchanger 434 in addition to the first heat exchangers 431, 432, and 433 corresponding to the existing heat exchangers 111, 112, and 113. The second heat exchanger 434 has the function of raising the temperature of the gaseous gas generated by the first heat exchangers 431, 432, and 433. Therefore, the first heat exchangers 431, 432, and 433 are the same as the existing heat exchangers 111, 112. , 113 is different, it does not have to serve as the function of heating up the gaseous gas. When the new gasification device 400 requires more gaseous gas supply than the existing gasification device 100, the supply device 220 is to compare the supply of liquid gas to the existing heat exchangers 111, 112, and 113. A larger supply amount is used to supply the liquid gas to the first heat exchangers 431, 432, and 433. In this case, the temperature of the gaseous gas from the first heat exchangers 431, 432, 433 to the second heat exchanger 434 may be lower than the temperature required by the demand side. However, since the second heat exchanger 434 raises the temperature of the gaseous gas, the temperature of the gaseous gas from the second heat exchanger 434 to the demand side can satisfy the demanded temperature condition of the demand side. Therefore, the new gasification device 400 has a higher gasification capacity and can supply gaseous gas that meets the requirements of the demand side.

且,在新的氣化裝置400要求供給比從既有之氣化裝置100所得到之氣態氣體之溫度更高之溫度的氣態氣體的情況時,主要控制第2熱交換器434,藉此可將氣態氣體的溫度提升到需求方的要求溫度條件。在該情況也是,新的氣化裝置400,具有較高的氣化能力,可供給滿足需求方之要求的氣態氣體。In addition, when the new gasification device 400 requires the supply of gaseous gas at a higher temperature than the gaseous gas obtained from the existing gasification device 100, the second heat exchanger 434 is mainly controlled, thereby enabling Raise the temperature of the gaseous gas to the required temperature condition of the demand side. In this case too, the new gasification device 400 has a higher gasification capacity and can supply gaseous gas that meets the requirements of the demand side.

如上述般,新的氣化裝置400,具有以下優點。可因應需求方的要求,來操作氣化裝置400,而得到以下優點之中的任一者。As described above, the new gasification device 400 has the following advantages. The gasification device 400 can be operated according to the requirements of the demand side, and any one of the following advantages can be obtained.

(1)新的氣化裝置400,可將液態氣體的處理量提升至比既有之氣化裝置100更高。 (2)新的氣化裝置400,可使得到之氣態氣體的溫度比氣化裝置100更高。 (3)新的氣化裝置400,可將液態氣體的處理量提升至比氣化裝置100更高,且,使得到之氣態氣體的溫度比氣化裝置100更高。(1) The new gasification device 400 can increase the processing capacity of liquid gas to a higher level than the existing gasification device 100. (2) The new gasification device 400 can make the temperature of the obtained gaseous gas higher than that of the gasification device 100. (3) The new gasification device 400 can increase the processing capacity of liquid gas to be higher than that of the gasification device 100, and make the temperature of the obtained gaseous gas higher than that of the gasification device 100.

使在三台第1熱交換器431、432、433所得到的氣態氣體至流入至第2熱交換器434。亦即,對於在三台第1熱交換器431、432、433所得到的氣態氣體之昇溫處理,是藉由一台第2熱交換器434來進行。於是,與設置有對應於該等第1熱交換器431、432、433各個的昇溫設備的構造相較之下,新的氣化裝置400,不需要寬廣的面積。與既有之氣化裝置100的設置區域相較之下,新的氣化裝置400,只需要增大第2熱交換器434之設置區域分量的面積。The gaseous gas obtained in the three first heat exchangers 431, 432, and 433 is allowed to flow into the second heat exchanger 434. That is, the temperature raising process of the gaseous gas obtained in the three first heat exchangers 431, 432, and 433 is performed by one second heat exchanger 434. Therefore, compared with the structure provided with the temperature raising equipment corresponding to each of the first heat exchangers 431, 432, and 433, the new vaporization device 400 does not require a wide area. Compared with the installation area of the existing gasification device 100, the new gasification device 400 only needs to increase the area of the installation area component of the second heat exchanger 434.

流入流出於殼441內的加熱用媒體,以加熱用媒體具有比流入至殼441的氣態氣體還高之溫度為條件,可從各式種類來選擇。例如,加熱用媒體,為溫水、工程水、海水、蒸氣及溫空氣之任一者皆可。The heating medium flowing into and out of the casing 441 can be selected from various types on the condition that the heating medium has a higher temperature than the gaseous gas flowing into the casing 441. For example, the heating medium may be any of warm water, engineering water, sea water, steam, and warm air.

圖7,是可作為第2熱交換器434來利用的其他熱交換器450之概略的剖面圖。參照圖1、圖6及圖7,來說明熱交換器450。FIG. 7 is a schematic cross-sectional view of another heat exchanger 450 that can be used as the second heat exchanger 434. The heat exchanger 450 will be described with reference to FIG. 1, FIG. 6, and FIG.

熱交換器450,具備具有複數片鰭片451的導熱管453。該等之鰭片451,是為了使從空氣對氣態氣體的導熱面積增大而設置。氣態氣體,在流動於導熱管453內的期間,空氣的熱,會通過導熱管453及鰭片451而往氣態氣體傳遞。由於在氣態氣體的昇溫是使用空氣,故熱交換器450的運轉成本比較廉價。The heat exchanger 450 includes a heat transfer tube 453 having a plurality of fins 451. These fins 451 are provided to increase the heat transfer area from the air to the gaseous gas. While the gaseous gas is flowing in the heat pipe 453, the heat of the air will be transferred to the gaseous gas through the heat pipe 453 and the fins 451. Since air is used to raise the temperature of the gaseous gas, the operating cost of the heat exchanger 450 is relatively inexpensive.

第2熱交換器434,為板式熱交換器亦可。圖8,是可作為第2熱交換器434來利用的板式熱交換器460之概略的立體圖。The second heat exchanger 434 may be a plate heat exchanger. FIG. 8 is a schematic perspective view of a plate heat exchanger 460 that can be used as the second heat exchanger 434. As shown in FIG.

熱交換器460,具有有著高熱傳導率的複數個導熱板461。該等之導熱板461,在表面形成有凹凸,於既定的方向重疊。其結果,在相鄰的導熱板461之間,在邊界形成有供氣態氣體或加熱用媒體流動的流路。形成氣態氣體用之流路的相鄰之一對導熱板461彼此的接合部,在以下的說明中,稱為「第1接合部462」。形成加熱用媒體用之流路的相鄰之一對導熱板461彼此的接合部,在以下的說明中,稱為「第2接合部463」。第1接合部462及第2接合部463,在導熱板461的整列方向上交互排列。The heat exchanger 460 has a plurality of heat conducting plates 461 with high thermal conductivity. The heat conducting plates 461 are formed with concavities and convexities on the surface and overlap in a predetermined direction. As a result, between the adjacent heat transfer plates 461, a flow path through which the gaseous gas or the heating medium flows is formed at the boundary. The junction of one pair of adjacent heat transfer plates 461 forming the flow path for the gaseous gas is referred to as the "first junction 462" in the following description. In the following description, the junction between one pair of adjacent heat transfer plates 461 forming the flow path for the heating medium is referred to as the "second junction 463". The first joining portion 462 and the second joining portion 463 are arranged alternately in the alignment direction of the heat transfer plate 461.

於熱交換器460,形成有:氣態氣體用的供給流路464與排氣流路465、以及加熱用媒體用的供給流路466與排出流路467。該等之流路464~467,是各自以貫通導熱板461的方式形成。氣態氣體用的供給流路464及排氣流路465,連通於在第1接合部462形成的流路。於是,該流路,成為供氣態氣體流動的氣體流路。加熱用媒體用的供給流路466及排出流路467,連通於在第2接合部463形成的流路。於是,該流路,成為供加熱用媒體流動的媒體流路。The heat exchanger 460 is formed with a supply flow path 464 and an exhaust flow path 465 for gaseous gas, and a supply flow path 466 and a discharge flow path 467 for the heating medium. These flow paths 464 to 467 are formed so as to penetrate through the heat conducting plate 461, respectively. The supply flow path 464 and the exhaust flow path 465 for the gaseous gas communicate with the flow path formed in the first junction 462. Then, this flow path becomes a gas flow path through which gaseous gas flows. The supply flow path 466 and the discharge flow path 467 for the heating medium communicate with the flow path formed in the second junction 463. Then, this flow path becomes a media flow path through which the heating medium flows.

在連接工程(參照圖5)中,多歧管116或從多歧管116延伸的管構件連通於氣態氣體用的供給流路464。連通於需求方的管構件,被連通於氣態氣體用的排氣流路465。在加熱用媒體用的供給流路466,連通有管構件,其將從加熱用媒體的供給源(未圖示)排出的加熱用媒體予以導引。在加熱用媒體用的排出流路467,連通有使加熱用媒體回到供給源的管構件。In the connection process (refer to FIG. 5), the multi-manifold 116 or a pipe member extending from the multi-manifold 116 communicates with the supply flow path 464 for gaseous gas. The pipe member connected to the demand side is connected to the exhaust flow path 465 for gaseous gas. The supply flow path 466 for the heating medium is connected with a pipe member which guides the heating medium discharged from a supply source (not shown) of the heating medium. The discharge flow path 467 for the heating medium communicates with a pipe member that returns the heating medium to the supply source.

在連接工程之後,從供給設備220將液態氣體供給至第1熱交換器431、432、433。在第1熱交換器431、432、433得到的氣態氣體,通過氣態氣體用的供給流路464,流入至第1接合部462的氣體流路。此時,加熱用媒體,通過供給流路466,而從供給源供給至第2接合部463的媒體流路。在第1接合部462的氣體流路內流動的氣態氣體,透過導熱板461,與在第2接合部463的媒體流路內流動的加熱用媒體熱交換而昇溫。昇溫後的氣態氣體,通過排氣流路465,供給至需求方。熱交換後的加熱用媒體,通過排出流路467,回到供給源。After the connection process, the liquid gas is supplied from the supply device 220 to the first heat exchangers 431, 432, and 433. The gaseous gas obtained in the first heat exchangers 431, 432, and 433 passes through the supply flow path 464 for gaseous gas and flows into the gas flow path of the first junction 462. At this time, the heating medium passes through the supply flow path 466 and is supplied from the supply source to the media flow path of the second junction 463. The gaseous gas flowing in the gas flow path of the first joining portion 462 passes through the heat transfer plate 461 and exchanges heat with the heating medium flowing in the medium flow path of the second joining portion 463 to increase the temperature. The heated gaseous gas passes through the exhaust flow path 465 and is supplied to the demand side. The heating medium after the heat exchange passes through the discharge flow path 467 and returns to the supply source.

氣態氣體與加熱用媒體之間的熱交換,是透過具有高熱傳導率的複數個導熱板461來進行。於是,加熱用媒體的熱,有效率地傳達至氣態氣體。The heat exchange between the gaseous gas and the heating medium is performed through a plurality of heat conducting plates 461 having high thermal conductivity. Therefore, the heat of the heating medium is efficiently transferred to the gaseous gas.

關於上述實施形態,是將具有複數台熱交換器111、112、113的既有之氣化裝置100置換成新的氣化裝置400。但是,上述的置換方法,亦可適用於將具有一台熱交換器的既有之氣化裝置101置換成新的氣化裝置401。圖9,是既有之氣化裝置101之概略的佈局圖。圖10,是表示除去工程之概略的佈局圖。圖11,是表示固設工程之概略的佈局圖。圖12,是表示連接工程之概略的佈局圖。參照圖1、圖3、圖9至圖12,說明從既有之氣化裝置101往新的氣化裝置401的置換方法。Regarding the above-mentioned embodiment, the existing gasification device 100 having a plurality of heat exchangers 111, 112, and 113 is replaced with a new gasification device 400. However, the above-mentioned replacement method can also be applied to replace the existing gasification device 101 with one heat exchanger with a new gasification device 401. Fig. 9 is a schematic layout diagram of a conventional gasification device 101. Fig. 10 is a layout diagram showing the outline of the removal process. Fig. 11 is a layout diagram showing the outline of the fixing work. Fig. 12 is a layout diagram showing the outline of the connection process. 1, 3, 9 to 12, the replacement method from the existing gasification device 101 to the new gasification device 401 will be described.

既有之氣化裝置101(參照圖9),具有一台熱交換器111。熱交換器111,固定設置於基礎構造201。基礎構造201,具有基座部230與基礎框237。基礎框237,以形成固設區域234的方式,在俯視時具有大致C型的形狀。在除去工程(參照圖10)中,熱交換器111、海水泵212、供給設備220及需求方之間的連接被解除。之後,熱交換器111,從基礎構造201撤走。在固設工程(參照圖11)中,第1熱交換器431固定設置於基礎構造201。第2熱交換器434,在基礎構造201之外固定設置。在連接工程(參照圖12)中,第1熱交換器431,連接於海水泵212、供給設備220及第2熱交換器434。第2熱交換器434,除了第1熱交換器431,還連接於需求方。之後,使來自供給設備220之液態氣體的供給量增加。The existing gasification device 101 (refer to FIG. 9) has a heat exchanger 111. The heat exchanger 111 is fixedly installed in the base structure 201. The base structure 201 has a base 230 and a base frame 237. The base frame 237 has a substantially C-shaped shape in a plan view to form the fixed area 234. In the removal process (refer to FIG. 10), the connection between the heat exchanger 111, the sea water pump 212, the supply device 220, and the consumer is released. After that, the heat exchanger 111 is removed from the basic structure 201. In the fixing process (refer to FIG. 11 ), the first heat exchanger 431 is fixedly installed on the foundation structure 201. The second heat exchanger 434 is fixedly installed outside the base structure 201. In the connection process (see FIG. 12), the first heat exchanger 431 is connected to the sea water pump 212, the supply device 220, and the second heat exchanger 434. The second heat exchanger 434 is connected to the demand side in addition to the first heat exchanger 431. After that, the supply amount of the liquid gas from the supply device 220 is increased.

關於上述實施形態,新的第1熱交換器431、432、433,具有與既有之熱交換器111、112、113相同的構造亦可,具有使既有之熱交換器111、112、113改良的構造亦可。例如,若可將新的第1熱交換器431、432、433配置在固設區域234、235、236內的話,第1熱交換器431、432、433,具有比既有之熱交換器111、112、113還多的導熱管313亦可。Regarding the above embodiment, the new first heat exchangers 431, 432, and 433 may have the same structure as the existing heat exchangers 111, 112, and 113, and may have the existing heat exchangers 111, 112, and 113. An improved structure is also possible. For example, if the new first heat exchangers 431, 432, and 433 can be arranged in the fixed areas 234, 235, and 236, the first heat exchangers 431, 432, and 433 will be better than the existing heat exchanger 111. , 112, 113 more heat pipes 313 can also be used.

關於上述實施形態,基礎框231,朝向多歧管114、115、116開口。但是,基礎框231,朝向與多歧管114、115、116相反的方向開口亦可。Regarding the above-mentioned embodiment, the base frame 231 opens toward the manifolds 114, 115, and 116. However, the base frame 231 may open in a direction opposite to the multi-manifold 114, 115, and 116.

在圖1所示之既有的熱交換器111、112、113之中至少任一個,具有兩個以上的圖2所示之開架式氣化器300的情況,基礎構造200,亦可包含:將屬於同一個熱交換器且彼此相鄰之開架式的氣化器予以分隔的分隔構件(未圖示)。In the case where at least any one of the existing heat exchangers 111, 112, 113 shown in FIG. 1 has two or more open-frame vaporizers 300 shown in FIG. 2, the basic structure 200 may also include: A partition member (not shown) that separates open-frame vaporizers that belong to the same heat exchanger and are adjacent to each other.

供給至氣化裝置100、400的液態氣體之種類,包含液態天然氣。The type of liquid gas supplied to the gasification devices 100 and 400 includes liquid natural gas.

關於上述實施形態,在液態氣體的氣化是利用海水。但是,比液態氣體更高溫度之其他的加熱用液體,亦可利用於液態氣體的氣化。Regarding the above-mentioned embodiment, seawater is used for the vaporization of liquid gas. However, other heating liquids having a higher temperature than liquid gas can also be used for vaporization of liquid gas.

關於上述各種實施形態來說明之氣化裝置的置換方法,主要具備以下的特徵。The replacement method of the gasification device explained in the above various embodiments mainly has the following characteristics.

本發明之一型態之氣化裝置的置換方法,可利用在將既有之氣化裝置予以置換成新的氣化裝置,該氣化裝置具有:在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使前述液態氣體氣化來產生氣態氣體並使前述氣態氣體昇溫的熱交換器。置換方法,是具備以下作業:將前述既有之氣化裝置的前述熱交換器,從基礎構造予以去除;將具備1或2個以上之開架式氣化器的第1熱交換器,予以固定設置在去除了前述熱交換器的前述基礎構造上,該開架式氣化器,構成為在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使前述液態氣體氣化;在與前述基礎構造不同的場所,設置將前述液態氣體之氣化結果所得到的氣態氣體予以昇溫的第2熱交換器;以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器的方式,來將前述第1熱交換器連接於前述第2熱交換器;進行以下之任一者:使供給至前述第1熱交換器的前述液態氣體之供給量,比前述既有之氣化裝置之對前述熱交換器供給的前述液態氣體之供給量更大、以及使前述液態氣體之氣化結果所得到的氣態氣體之溫度,比前述既有之氣化裝置所致之氣化結果所得到的氣態氣體之溫度更高。The replacement method of a gasification device of one type of the present invention can be used to replace an existing gasification device with a new gasification device. The gasification device has: A heat exchanger that supplies a heating liquid to vaporize the liquid gas to generate a gaseous gas and raise the temperature of the gaseous gas. The replacement method includes the following operations: removing the heat exchanger of the existing vaporization device from the basic structure; fixing the first heat exchanger with one or more open-frame vaporizers The open-frame vaporizer is installed on the basic structure from which the heat exchanger is removed, and the open-frame vaporizer is configured to supply a heating liquid to the outer peripheral surface of the heat transfer tube in which the liquid gas flows, thereby vaporizing the liquid gas; Where the aforementioned basic structure is different, a second heat exchanger that raises the temperature of the gaseous gas obtained as a result of the vaporization of the aforementioned liquid gas is installed; the aforementioned gaseous gas flows from the aforementioned first heat exchanger to the aforementioned second heat exchanger The method is to connect the first heat exchanger to the second heat exchanger; perform any of the following: make the supply amount of the liquid gas supplied to the first heat exchanger more vaporized than the existing one. The supply of the liquid gas supplied to the heat exchanger by the device is larger, and the temperature of the gaseous gas obtained as a result of the gasification of the liquid gas is higher than that of the gasification result of the aforementioned existing gasification device. The temperature of the obtained gaseous gas is higher.

根據上述構造,新的氣化裝置,如以下所述,可具有超過既有之氣化裝置的氣化能力,且既有之氣化裝置之固定設置所使用的基礎構造,亦可利用在新的氣化裝置。既有之氣化裝置用的基礎構造,利用在新的氣化裝置之第1熱交換器的固定設置。在第1熱交換器氣化過的氣態氣體,流入至第2熱交換器,藉由第2熱交換器來昇溫。亦即,第2熱交換器,擔任以第1熱交換器所得到之氣態氣體的昇溫功能。第1熱交換器,與既有之氣化裝置的熱交換器不同,不具有對氣態氣體的昇溫功能亦可,只要能產生從液態氣體往氣態氣體的相變即可。從第1熱交換器朝向第2熱交換器之液態氣體的溫度,低於必要之溫度亦可,故對第1熱交換器之液態氣體的供給量,可設定成比既有之氣化裝置之往熱交換器之液態氣體的供給量更大的值。需求方,需要比藉由既有之氣化裝置所產生之氣態氣體的溫度更高溫度之氣態氣體的情況,可使用第2熱交換器,來產生滿足需求方對於溫度之要求的氣態氣體。於是,新的氣化裝置,具有超越既有之氣化裝置的氣化能力。According to the above structure, the new gasification device, as described below, can have a gasification capacity that exceeds that of the existing gasification device, and the basic structure used for the fixed installation of the existing gasification device can also be used in the new gasification device. The gasification unit. The basic structure of the existing gasification device is used in the fixed installation of the first heat exchanger of the new gasification device. The gaseous gas vaporized in the first heat exchanger flows into the second heat exchanger and is heated by the second heat exchanger. That is, the second heat exchanger has a function of raising the temperature of the gaseous gas obtained by the first heat exchanger. The first heat exchanger, unlike the heat exchanger of the existing gasification device, does not have the function of raising the temperature of the gaseous gas, as long as it can produce a phase change from a liquid gas to a gaseous gas. The temperature of the liquid gas from the first heat exchanger to the second heat exchanger may be lower than the necessary temperature. Therefore, the supply of the liquid gas to the first heat exchanger can be set to be higher than that of the existing gasification device The supply of liquid gas to the heat exchanger has a larger value. If the demand side requires a gaseous gas with a higher temperature than the gaseous gas produced by the existing gasification device, a second heat exchanger can be used to generate a gaseous gas that meets the demand side's temperature requirements. Therefore, the new gasification device has a gasification capacity that exceeds the existing gasification device.

關於上述構造,前述基礎構造,含有基礎框亦可,該基礎框豎立設置成定出前述既有之氣化裝置之固定設置有前述熱交換器的固設區域。在前述固設區域內固定設置有前述第1熱交換器亦可。Regarding the above-mentioned structure, the above-mentioned basic structure may include a basic frame, and the basic frame is erected so as to define a fixed area of the existing gasification device where the heat exchanger is fixedly installed. The first heat exchanger may be fixedly installed in the fixed area.

根據上述構造,第1熱交換器,是在以基礎框所定出的固設區域內固定設置,故在既有之氣化裝置所使用的基礎框亦可利用在新的氣化裝置。由於沒有必要設置新的基礎框,故能抑制氣化裝置之置換用的費用。According to the above structure, the first heat exchanger is fixedly installed in the fixed area defined by the base frame, so the base frame used in the existing gasification device can also be used in the new gasification device. Since there is no need to install a new basic frame, the cost of replacement of the gasification device can be suppressed.

關於上述構造,前述既有之氣化裝置,具有複數台前述熱交換器亦可。在將前述既有之氣化裝置的前述熱交換器從前述基礎構造去除的工程中,將前述複數台熱交換器從前述基礎構造去除亦可。在將前述第1熱交換器固定設置於前述基礎構造上的工程中,在曾固定設置有前述複數台熱交換器的複數個固設位置的各個,固定設置前述第1熱交換器亦可。在將前述第1熱交換器連接於前述第2熱交換器的工程中,(i)以在前述複數台第1熱交換器內所得到的前述氣態氣體流入的方式將多歧管連接於前述複數台第1熱交換器,(ii)以流入至前述多歧管的前述氣態氣體流入至前述第2熱交換器的方式,將前述多歧管或從前述多歧管延伸的管構件連接於前述第2熱交換器亦可。Regarding the above structure, the aforementioned existing gasification device may have a plurality of the aforementioned heat exchangers. In the process of removing the heat exchanger of the existing gasification device from the basic structure, the plurality of heat exchangers may be removed from the basic structure. In the process of fixing the first heat exchanger to the basic structure, the first heat exchanger may be fixedly installed in each of the plurality of fixed positions where the plurality of heat exchangers have been fixedly installed. In the process of connecting the first heat exchanger to the second heat exchanger, (i) the multi-manifold is connected to the foregoing so that the gaseous gas obtained in the plurality of first heat exchangers flows in. A plurality of first heat exchangers, (ii) connecting the multi-manifold or a pipe member extending from the multi-manifold so that the gaseous gas that has flowed into the multi-manifold flows into the second heat exchanger The aforementioned second heat exchanger may also be used.

根據上述構造,既有之氣化裝置與置換後的氣化裝置,如以下所述,不需要過度寬廣的設置空間就能架構。在既有之氣化裝置具有複數台熱交換器時,新的氣化裝置,具有取代該等之熱交換器的複數台第1熱交換器亦可。該等之第1熱交換器,配置在既有之氣化裝置之熱交換器的固設位置,故既有之氣化裝置之複數台熱交換器之設置所利用的空間,可利用在複數台第1熱交換器的設置。該等之第1熱交換器,是藉由多歧管來連接,故該等之第1熱交換器所得到的氣態氣體,流入至多歧管。第2熱交換器,通過多歧管或從多歧管延伸的管構件,而接收以複數台第1熱交換器所得到的氣態氣體,可將所接收的氣態氣體予以昇溫。亦即,不必對應複數台第1熱交換器的各個來設置複數台第2熱交換器,就能得到對氣態氣體的昇溫功能。由於不必對應複數台第1熱交換器的各個來設置複數台第2熱交換器,故與既有之氣化裝置交換後的氣化裝置,不需要過度寬廣的設置空間。According to the above structure, the existing gasification device and the replaced gasification device can be constructed without an excessively wide installation space as described below. When the existing gasification device has a plurality of heat exchangers, the new gasification device may have a plurality of first heat exchangers instead of these heat exchangers. These first heat exchangers are arranged at the fixed positions of the heat exchangers of the existing gasification equipment, so the space used for the installation of the plural heat exchangers of the existing gasification equipment can be used in plural The installation of the first heat exchanger. The first heat exchangers are connected by a multi-manifold, so the gaseous gas obtained by the first heat exchangers flows into the multi-manifold. The second heat exchanger receives gaseous gas obtained by a plurality of first heat exchangers through a multi-manifold or a pipe member extending from the multi-manifold, and can raise the temperature of the received gaseous gas. That is, it is not necessary to provide a plurality of second heat exchangers corresponding to each of the plurality of first heat exchangers, and the function of raising the temperature of the gaseous gas can be obtained. Since it is not necessary to install a plurality of second heat exchangers corresponding to each of the plurality of first heat exchangers, the gasification device after exchange with the existing gasification device does not require an excessively wide installation space.

關於上述構造,前述第2熱交換器,是使用與前述加熱用液體不同種類的加熱用媒體,來使前述氣態氣體昇溫的構造亦可。Regarding the above structure, the second heat exchanger may be a structure that uses a different type of heating medium from the heating liquid to raise the temperature of the gaseous gas.

根據上述構造,在既有之氣化裝置的熱交換器,是將使用在液態氣體之氣化的加熱用液體,亦利用在氣態氣體的昇溫。該情況時,加熱用媒體會因液態氣體的氣化與氣態氣體的昇溫而無法選擇。另一方面,第2熱交換器,與既有之氣化裝置的熱交換器不同,是使用與從液態氣體往氣態氣體之相變所使用的加熱用液體不同種類的加熱用媒體,來使氣態氣體昇溫。於是,可選擇適合氣態氣體之昇溫的加熱用媒體。According to the above-mentioned structure, the heat exchanger of the existing gasification device uses the heating liquid used for the gasification of the liquid gas, and is also used for the temperature rise of the gaseous gas. In this case, the heating medium cannot be selected due to the vaporization of the liquid gas and the temperature rise of the gaseous gas. On the other hand, the second heat exchanger, unlike the heat exchanger of the existing gasification device, uses a different type of heating medium from the heating liquid used for the phase change from liquid gas to gaseous gas, so that The gaseous gas heats up. Therefore, a heating medium suitable for the temperature increase of the gaseous gas can be selected.

關於上述構造,前述第2熱交換器,亦可具有:中空的殼、在前述殼內延伸出的導熱管、以使比前述氣態氣體更高溫的加熱用媒體流入流出於前述殼的方式來連接於前述殼的供給管及排出管。在將前述第1熱交換器連接於前述第2熱交換器的工程中,以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器之前述導熱管的方式,將從前述第1熱交換器延伸的管構件連接於前述第2熱交換器亦可。Regarding the above-mentioned structure, the second heat exchanger may also have a hollow shell, a heat transfer pipe extending from the shell, and a connection such that a heating medium having a higher temperature than the gaseous gas flows in and out of the shell. The supply pipe and the discharge pipe of the aforementioned shell. In the process of connecting the first heat exchanger to the second heat exchanger, the gaseous gas flows from the first heat exchanger to the heat transfer tube of the second heat exchanger, and the second heat exchanger 1 The pipe member extending from the heat exchanger may be connected to the aforementioned second heat exchanger.

根據上述構造,加熱用媒體,在比氣態氣體更高溫的條件之下,可從各式種類的媒體來選擇。氣態氣體,從第1熱交換器流入至在第2熱交換器的殼內延伸出的導熱管時,是藉由流入殼的加熱用媒體來使氣態氣體昇溫。According to the above structure, the heating medium can be selected from various types of medium under the condition of a higher temperature than the gaseous gas. When the gaseous gas flows from the first heat exchanger to the heat transfer pipe extending from the shell of the second heat exchanger, the temperature of the gaseous gas is raised by the heating medium flowing into the shell.

關於上述構造,前述第2熱交換器,是形成有比前述氣態氣體更高溫的加熱用媒體用的流路及前述氣態氣體用的流路之板式的熱交換器亦可。在將前述第1熱交換器連接於前述第2熱交換器的工程中,以前述氣態氣體從前述第1熱交換器流入至前述氣態氣體用之前述流路的方式,將從前述第1熱交換器延伸的管構件連接於前述板式的熱交換器亦可。Regarding the above structure, the second heat exchanger may be a plate-type heat exchanger in which a flow path for a heating medium having a higher temperature than the gaseous gas and a flow path for the gaseous gas are formed. In the process of connecting the first heat exchanger to the second heat exchanger, the gaseous gas flows from the first heat exchanger into the flow path for the gaseous gas, and the first heat is removed from the gaseous gas flow path. The pipe member extending from the exchanger may be connected to the aforementioned plate-type heat exchanger.

根據上述構造,在媒體流路流動之加熱用媒體的熱,會通過導熱板,傳達給氣體流路中的氣態氣體,而用在氣態氣體的昇溫。According to the above structure, the heat of the heating medium flowing in the medium flow path is transferred to the gaseous gas in the gas flow path through the heat conducting plate, and is used to raise the temperature of the gaseous gas.

關於上述構造,前述第2熱交換器,具有導熱管與從前述導熱管突出的鰭片亦可。在將前述第1熱交換器連接於前述第2熱交換器的工程中,以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器之前述導熱管的方式,將從前述第1熱交換器延伸的管構件連接於前述第2熱交換器亦可。Regarding the above structure, the second heat exchanger may have a heat transfer tube and fins protruding from the heat transfer tube. In the process of connecting the first heat exchanger to the second heat exchanger, the gaseous gas flows from the first heat exchanger to the heat transfer tube of the second heat exchanger, and the second heat exchanger 1 The pipe member extending from the heat exchanger may be connected to the aforementioned second heat exchanger.

根據上述構造,氣態氣體,從第1熱交換器流入至第2熱交換器的導熱管,透過導熱管及鰭片而與空氣進行熱交換,故在氣態氣體的昇溫可利用空氣。於是,可抑制氣態氣體之昇溫所必要的成本。 [產業上的可利用性]According to the above structure, the gaseous gas flows into the heat transfer tube of the second heat exchanger from the first heat exchanger, and exchanges heat with the air through the heat transfer tube and the fins. Therefore, air can be used to increase the temperature of the gaseous gas. Therefore, the cost necessary for the temperature rise of the gaseous gas can be suppressed. [Industrial availability]

關於上述實施形態所說明的技術,適合利用在利用氣態氣體之各式各樣的技術領域。The technology described in the above-mentioned embodiment can be suitably used in various technical fields using gaseous gas.

100:既有之氣化裝置 212:海水泵 111:熱交換器 220:供給設備 112:熱交換器 230:基座部 113:熱交換器 231:基礎框 114:多歧管 232:外框 115:多歧管 233:分隔框 116:多歧管 234:固設區域 200:基礎構造 235:固設區域 211:取水設備 236:固設區域100: Existing gasification device 212: Sea water pump 111: Heat Exchanger 220: supply equipment 112: Heat Exchanger 230: Base 113: Heat Exchanger 231: basic frame 114: Multi-Manifold 232: Outer Frame 115: Multi-Manifold 233: divider box 116: Multi-Manifold 234: fixed area 200: basic structure 235: fixed area 211: water fetching equipment 236: fixed area

[圖1]既有之氣化裝置之概略的佈局圖。 [圖2]既有之氣化裝置之氣化器之概略的立體圖。 [圖3]將除去工程予以概略表示的佈局圖。 [圖4]將固設工程予以概略表示的佈局圖。 [圖5]將連接工程予以概略表示的佈局圖。 [圖6]可作為新的氣化裝置之第2熱交換器來利用的熱交換器之概略的剖面圖。 [圖7]可作為新的氣化裝置之第2熱交換器來利用的其他熱交換器之概略的剖面圖。 [圖8]可作為新的氣化裝置之第2熱交換器來利用的其他熱交換器之概略的立體圖。 [圖9]既有之氣化裝置之概略的佈局圖。 [圖10]表示除去工程之概略的佈局圖。 [圖11]表示固設工程之概略的佈局圖。 [圖12]表示連接工程之概略的佈局圖。[Figure 1] The schematic layout of the existing gasification plant. [Figure 2] A schematic perspective view of the vaporizer of the existing vaporization device. [Figure 3] A layout diagram schematically showing the removal process. [Figure 4] A layout diagram that outlines the fixed installation project. [Figure 5] A layout diagram schematically showing the connection works. [Fig. 6] A schematic cross-sectional view of a heat exchanger that can be used as a second heat exchanger of a new gasification device. [Fig. 7] A schematic cross-sectional view of another heat exchanger that can be used as the second heat exchanger of the new gasification device. [Fig. 8] A schematic perspective view of another heat exchanger that can be used as the second heat exchanger of the new gasification device. [Figure 9] The schematic layout of the existing gasification plant. [Figure 10] A layout diagram showing the outline of the removal process. [Figure 11] A layout diagram showing the outline of the fixed installation project. [Figure 12] A layout diagram showing the outline of the connection project.

100:既有之氣化裝置 100: Existing gasification device

111:熱交換器 111: Heat Exchanger

112:熱交換器 112: Heat Exchanger

113:熱交換器 113: Heat Exchanger

114:多歧管 114: Multi-Manifold

115:多歧管 115: Multi-Manifold

116:多歧管 116: Multi-Manifold

200:基礎構造 200: basic structure

211:取水設備 211: water fetching equipment

212:海水泵 212: Sea water pump

220:供給設備 220: supply equipment

230:基座部 230: Base

231:基礎框 231: basic frame

232:外框 232: Outer Frame

233:分隔框 233: divider box

234:固設區域 234: fixed area

235:固設區域 235: fixed area

236:固設區域 236: fixed area

Claims (7)

一種氣化裝置的置換方法,將既有之氣化裝置予以置換成新的氣化裝置,該氣化裝置具有:在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使前述液態氣體氣化來產生氣態氣體並使前述氣態氣體昇溫的熱交換器,該方法具備以下作業: 將前述既有之氣化裝置的前述熱交換器,從基礎構造予以去除; 將具備1或2個以上之開架式氣化器的第1熱交換器,予以固定設置在去除了前述熱交換器的前述基礎構造上,該開架式氣化器,構成為在流動有液態氣體的導熱管之外周面供給加熱用液體,藉此使前述液態氣體氣化; 在與前述基礎構造不同的場所,設置將前述液態氣體之氣化結果所得到的氣態氣體予以昇溫的第2熱交換器; 以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器的方式,來將前述第1熱交換器連接於前述第2熱交換器; 進行以下中之至少任一者:使供給至前述第1熱交換器的前述液態氣體之供給量,比前述既有之氣化裝置之對前述熱交換器供給的前述液態氣體之供給量更大、以及使前述液態氣體之氣化結果所得到的氣態氣體之溫度,比前述既有之氣化裝置所致之氣化結果所得到的氣態氣體之溫度更高。A method for replacing a gasification device. The existing gasification device is replaced with a new gasification device. The gasification device has: A heat exchanger that vaporizes liquid gas to generate gaseous gas and heat the aforementioned gaseous gas. This method has the following operations: Remove the aforementioned heat exchanger of the aforementioned existing gasification device from the basic structure; The first heat exchanger equipped with one or more open-frame vaporizers is fixedly installed on the aforementioned basic structure from which the heat exchanger is removed. The open-frame vaporizer is configured to flow liquid gas The outer peripheral surface of the heat conducting tube is supplied with heating liquid, thereby vaporizing the aforementioned liquid gas; Install a second heat exchanger that raises the temperature of the gaseous gas obtained as a result of the vaporization of the liquid gas in a place different from the aforementioned basic structure; Connecting the first heat exchanger to the second heat exchanger in such a manner that the gaseous gas flows from the first heat exchanger to the second heat exchanger; Perform at least one of the following: make the supply amount of the liquid gas supplied to the first heat exchanger larger than the supply amount of the liquid gas supplied to the heat exchanger in the existing gasification device , And the temperature of the gaseous gas obtained as a result of the vaporization of the aforementioned liquid gas is higher than the temperature of the gaseous gas obtained as a result of the vaporization by the aforementioned existing gasification device. 如請求項1所述之氣化裝置的置換方法,其中, 前述基礎構造,含有基礎框,該基礎框豎立設置成定出前述既有之氣化裝置之固定設置有前述熱交換器的固設區域, 在前述固設區域內固定設置前述第1熱交換器。The replacement method of a gasification device according to claim 1, wherein: The aforementioned basic structure includes a foundation frame, which is erected to define a fixed area of the aforementioned existing gasification device where the aforementioned heat exchanger is fixedly arranged, The first heat exchanger is fixedly installed in the fixing area. 如請求項1或2所述之氣化裝置的置換方法,其中, 前述既有之氣化裝置,具有複數台前述熱交換器, 在將前述既有之氣化裝置的前述熱交換器從前述基礎構造去除的工程中,將前述複數台熱交換器從前述基礎構造去除, 在將前述第1熱交換器固定設置於前述基礎構造上的工程中,在曾固定設置有前述複數台熱交換器的複數個固設位置的各個,固定設置前述第1熱交換器, 在將前述第1熱交換器連接於前述第2熱交換器的工程中, (i)以在前述複數台第1熱交換器內所得到的前述氣態氣體流入的方式將多歧管連接於前述複數台第1熱交換器, (ii)以流入至前述多歧管的前述氣態氣體流入至前述第2熱交換器的方式,將前述多歧管或從前述多歧管延伸的管構件連接於前述第2熱交換器。The replacement method of a gasification device according to claim 1 or 2, wherein: The aforementioned existing gasification device has a plurality of aforementioned heat exchangers, In the process of removing the heat exchanger of the existing gasification plant from the basic structure, the plural heat exchangers are removed from the basic structure, In the process of fixing the first heat exchanger to the foundation structure, the first heat exchanger is fixedly installed in each of the plurality of fixed positions where the plurality of heat exchangers were fixedly installed, and In the process of connecting the first heat exchanger to the second heat exchanger, (i) Connecting a multi-manifold to the plurality of first heat exchangers so that the gaseous gas obtained in the plurality of first heat exchangers flows in, (ii) The multi-manifold or a pipe member extending from the multi-manifold is connected to the second heat exchanger so that the gaseous gas that has flowed into the multi-manifold flows into the second heat exchanger. 如請求項1或2所述之氣化裝置的置換方法,其中, 前述第2熱交換器,是構成為使用與前述加熱用液體不同種類的加熱用媒體,來使前述氣態氣體昇溫。The replacement method of a gasification device according to claim 1 or 2, wherein: The second heat exchanger is configured to use a different type of heating medium from the heating liquid to raise the temperature of the gaseous gas. 如請求項1或2所述之氣化裝置的置換方法,其中, 前述第2熱交換器,具有:中空的殼、在前述殼內延伸出的導熱管、以使比前述氣態氣體更高溫的加熱用媒體流入流出於前述殼的方式來連接於前述殼的供給管及排出管, 在將前述第1熱交換器連接於前述第2熱交換器的工程中,以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器之前述導熱管的方式,將從前述第1熱交換器延伸的管構件連接於前述第2熱交換器。The replacement method of a gasification device according to claim 1 or 2, wherein: The second heat exchanger includes a hollow shell, a heat pipe extending in the shell, and a supply pipe connected to the shell so that a heating medium having a higher temperature than the gaseous gas flows in and out of the shell And discharge pipe, In the process of connecting the first heat exchanger to the second heat exchanger, the gaseous gas flows from the first heat exchanger to the heat transfer pipe of the second heat exchanger, and the second heat exchanger 1 The pipe member extending from the heat exchanger is connected to the aforementioned second heat exchanger. 如請求項1或2所述之氣化裝置的置換方法,其中, 前述第2熱交換器,是形成有比前述氣態氣體更高溫的加熱用媒體用的流路及前述氣態氣體用的流路之板式的熱交換器, 在將前述第1熱交換器連接於前述第2熱交換器的工程中,以前述氣態氣體從前述第1熱交換器流入至前述氣態氣體用之前述流路的方式,將從前述第1熱交換器延伸的管構件連接於前述板式的熱交換器。The replacement method of a gasification device according to claim 1 or 2, wherein: The second heat exchanger is a plate-type heat exchanger in which a flow path for a heating medium having a higher temperature than the gaseous gas and a flow path for the gaseous gas are formed. In the process of connecting the first heat exchanger to the second heat exchanger, the gaseous gas flows from the first heat exchanger to the flow path for the gaseous gas, and the first heat is removed from the The pipe member extending from the exchanger is connected to the aforementioned plate-type heat exchanger. 如請求項1或2所述之氣化裝置的置換方法,其中, 前述第2熱交換器,具有導熱管與從前述導熱管突出的鰭片, 在將前述第1熱交換器連接於前述第2熱交換器的工程中,以前述氣態氣體從前述第1熱交換器流入至前述第2熱交換器之前述導熱管的方式,將從前述第1熱交換器延伸的管構件連接於前述第2熱交換器。The replacement method of a gasification device according to claim 1 or 2, wherein: The second heat exchanger has a heat pipe and fins protruding from the heat pipe, In the process of connecting the first heat exchanger to the second heat exchanger, the gaseous gas flows from the first heat exchanger to the heat transfer pipe of the second heat exchanger, and the second heat exchanger 1 The pipe member extending from the heat exchanger is connected to the aforementioned second heat exchanger.
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