TW202104320A - Tackifying composition - Google Patents

Tackifying composition Download PDF

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TW202104320A
TW202104320A TW109117127A TW109117127A TW202104320A TW 202104320 A TW202104320 A TW 202104320A TW 109117127 A TW109117127 A TW 109117127A TW 109117127 A TW109117127 A TW 109117127A TW 202104320 A TW202104320 A TW 202104320A
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adhesive composition
mass
polymer block
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block copolymer
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TW109117127A
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Chinese (zh)
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清水星哉
千田泰史
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日商可樂麗股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/04Reduction, e.g. hydrogenation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/10Materials in mouldable or extrudable form for sealing or packing joints or covers

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Graft Or Block Polymers (AREA)

Abstract

This tackifying composition contains, with respect to 100 parts by mass of a block copolymer or a hydrogenated product thereof, at least one selected from 1-1000 parts by mass of tackifying resins and 1-1000 parts by mass of plasticizing agents. The block copolymer includes a polymeric block (A) and a polymeric block (B), wherein the polymeric block (B) has a structural unit that is derived from a conjugated diene compound and that includes, in a main chain, at least one alicyclic backbone (X) represented by formula (X).

Description

黏接著組成物Adhesive composition

本發明係關於包含嵌段共聚物或其氫化物的黏接著組成物。The present invention relates to an adhesive composition containing a block copolymer or its hydrogenated product.

在具有含有來自芳香族乙烯基化合物之結構單元的聚合物嵌段、與含有來自共軛二烯化合物之結構單元的聚合物嵌段之嵌段共聚物及其氫化物之中,已知有具制振性者,且可被利用於制振材料。又,上述嵌段共聚物及其氫化物被認為有除了制振性之外還能具有隔音性、耐熱性、耐衝擊性、及黏接著性等物性者,能使用於各式各樣的用途。 例如,已開示一種苯乙烯系化合物與異戊二烯或丁二烯等共軛二烯化合物之氫化嵌段共聚物,其為了使制振性、柔軟性、耐熱性、拉伸強度及耐衝擊性等機械特性優異,而指定tanδ的峰溫度、乙烯基鍵結量(例如,參照專利文獻1~4)。Among the block copolymers having polymer blocks containing structural units derived from aromatic vinyl compounds, and polymer blocks containing structural units derived from conjugated diene compounds, and their hydrogenated products are known Vibration damping person, and can be used as a vibration damping material. In addition, the above-mentioned block copolymers and their hydrogenated products are considered to have physical properties such as sound insulation, heat resistance, impact resistance, and adhesive properties in addition to vibration damping properties, and can be used in various applications. . For example, a hydrogenated block copolymer of a styrene-based compound and a conjugated diene compound such as isoprene or butadiene has been disclosed for the purpose of improving vibration resistance, flexibility, heat resistance, tensile strength, and impact resistance. It is excellent in mechanical properties such as properties, and the peak temperature of tanδ and the vinyl bond amount are specified (for example, refer to Patent Documents 1 to 4).

上述嵌段共聚物之中,斷開時間(open time)長且顯示良好黏接著性者,已知使用作為例如尿布及不織布等的接著劑、電氣電子零件等的表面保護薄膜的接著劑(例如,參照專利文獻5)。 又,上述嵌段共聚物之中顯示制振性及黏接著性者,已知可使用作為例如汽車、建築領域中之密封劑(例如,參照專利文獻6)。 [先前技術文獻] [專利文獻]Among the above-mentioned block copolymers, those having a long open time and good adhesiveness are known to be used as adhesives for surface protection films such as diapers and non-woven fabrics, and surface protective films for electrical and electronic parts (such as , Refer to Patent Document 5). In addition, among the above-mentioned block copolymers, those exhibiting vibration damping properties and adhesive properties are known to be used as sealants in, for example, the automotive and construction fields (for example, refer to Patent Document 6). [Prior Technical Literature] [Patent Literature]

專利文獻1 日本特開2002-284830號公報 專利文獻2 國際公開第2000/015680號 專利文獻3 日本特開2006-117879號公報 專利文獻4 日本特開2010-053319號公報 專利文獻5 國際公開第2002/040611號 專利文獻6 國際公開第2015/087954號Patent Document 1   JP 2002-284830 A Patent Document 2 "International Publication No. 2000/015680 Patent Document 3   JP 2006-117879 A Patent Document 4   JP 2010-053319 A Patent Document 5" International Publication No. 2002/040611 Patent Document 6 ``International Publication No. 2015/087954

[發明所欲解決的課題][The problem to be solved by the invention]

另一方面,有時透過黏接著劑接合之被接著體會因振動而剝落,正要求黏接著劑的性能提升。又,隨著溫度上升,黏接著力呈現降低的傾向,期望即使在高溫中亦維持黏接著力。 因此,期望不易從被接著體剝離且即使在高溫中亦維持黏接著力,在黏接著組成物中,針對兼顧制振性及黏接著性仍有改良的餘地。 於是,本發明提供具有制振性且即使在高溫中亦不易剝落的黏接著組成物。 [用於解決課題的手段]On the other hand, sometimes the adhered body joined through the adhesive may peel off due to vibration, and the performance of the adhesive is required to improve. In addition, as the temperature rises, the adhesive strength tends to decrease, and it is desirable to maintain the adhesive strength even at high temperatures. Therefore, it is desired that it does not easily peel from the adherend and maintains the adhesive force even at high temperatures. In the adhesive composition, there is still room for improvement for both vibration damping properties and adhesive properties. Therefore, the present invention provides an adhesive composition that has vibration damping properties and is not easy to peel off even at high temperatures. [Means used to solve the problem]

為了解決上述課題而專心致志地探討的結果,本發明人等思及下述本發明,並發現可解決該課題。 亦即,本發明係如同下述。As a result of intensive research in order to solve the above-mentioned problem, the present inventors considered the following invention and found that the problem can be solved. That is, the present invention is as follows.

一種黏接著組成物,其相對於下述嵌段共聚物或其氫化物100質量份,包含選自1~1000質量份的黏著賦予樹脂、及1~1000質量份的塑化劑中之至少1種。 前述嵌段共聚物含有聚合物嵌段(A)及聚合物嵌段(B),該聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以下述式(X)所示之1種以上的脂環式骨架(X)之結構單元。An adhesive composition containing at least 1 selected from 1 to 1000 parts by mass of adhesion-imparting resin and 1 to 1000 parts by mass of plasticizer relative to 100 parts by mass of the following block copolymer or its hydrogenated product Kind. The aforementioned block copolymer contains a polymer block (A) and a polymer block (B). The polymer block (B) is a structural unit derived from a conjugated diene compound and has the following formula in the main chain: (X) One or more structural units of alicyclic skeleton (X) shown in (X).

Figure 02_image001
(上述式(X)中,R1 ~R3 各自獨立地表示氫原子或碳數1~11的烴基,複數個R1 ~R3 各自可相同或不同。) [發明效果]
Figure 02_image001
(In the above formula (X), R 1 to R 3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 11 carbon atoms, and a plurality of R 1 to R 3 may be the same or different.) [Effects of the invention]

根據本發明,可提供具有制振性且即使在高溫亦不易剝落的黏接著組成物。According to the present invention, it is possible to provide an adhesive composition that has vibration damping properties and is not easily peeled off even at high temperatures.

[用於實施發明的形態][Forms used to implement the invention]

≪黏接著組成物≫ 本發明的黏接著組成物,其特徵在於,相對於下述嵌段共聚物或其氫化物100質量份,包含選自1~1000質量份的黏著賦予樹脂、及1~1000質量份的塑化劑中之至少1種。 前述嵌段共聚物含有聚合物嵌段(A)及聚合物嵌段(B),該聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以前述式(X)所示之1種以上的脂環式骨架(X)之結構單元。 針對黏接著組成物所含之各成分,係在以下進行說明。≪Adhesive composition≫ The adhesive composition of the present invention is characterized by containing an adhesion-imparting resin selected from 1 to 1000 parts by mass and 1 to 1000 parts by mass of plasticizing resin relative to 100 parts by mass of the following block copolymer or its hydrogenated product At least one of the agents. The aforementioned block copolymer contains a polymer block (A) and a polymer block (B). The polymer block (B) is a structural unit derived from a conjugated diene compound and has a main chain containing the aforementioned formula (X) One or more structural units of alicyclic skeleton (X) shown in (X). The components contained in the adhesive composition are described below.

[嵌段共聚物或其氫化物] 在本發明的實施形態(以下,有時稱為「本實施形態」)中,嵌段共聚物或其氫化物係用於製成具有制振性且即使在高溫中亦不易剝落的黏接著組成物之必要成分。 [聚合物嵌段(A)] 構成嵌段共聚物的聚合物嵌段(A),由制振性及機械特性之觀點而言,較佳為具有被使用作為單體之來自芳香族乙烯基化合物之結構單元。 聚合物嵌段(A)係較佳為在聚合物嵌段(A)中含有大於70莫耳%的來自芳香族乙烯基化合物之結構單元(以下,有時簡稱為「芳香族乙烯基化合物單元」),由機械特性之觀點而言,更佳為80莫耳%以上,再佳為90莫耳%以上,又更佳為95莫耳%以上,特佳為實質上為100莫耳%。[Block copolymer or its hydrogenated product] In the embodiment of the present invention (hereinafter, sometimes referred to as "this embodiment"), the block copolymer or its hydrogenated product is used to form an adhesive composition that has vibration damping properties and is not easy to peel off even at high temperatures. Essential ingredients of things. [Polymer block (A)] From the viewpoint of vibration damping properties and mechanical properties, the polymer block (A) constituting the block copolymer preferably has a structural unit derived from an aromatic vinyl compound used as a monomer. The polymer block (A) preferably contains more than 70 mol% of the structural unit derived from the aromatic vinyl compound in the polymer block (A) (hereinafter, sometimes referred to as "aromatic vinyl compound unit"). ") From the viewpoint of mechanical properties, it is more preferably 80 mol% or more, still more preferably 90 mol% or more, still more preferably 95 mol% or more, and particularly preferably substantially 100 mol%.

作為上述芳香族乙烯基化合物,可列舉:苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、α-甲基苯乙烯、β-甲基苯乙烯、2,6-二甲基苯乙烯、2,4-二甲基苯乙烯、α-甲基-鄰甲基苯乙烯、α-甲基-間甲基苯乙烯、α-甲基-對甲基苯乙烯、β-甲基-鄰甲基苯乙烯、β-甲基-間甲基苯乙烯、β-甲基-對甲基苯乙烯、2,4,6-三甲基苯乙烯、α-甲基-2,6-二甲基苯乙烯、α-甲基-2,4-二甲基苯乙烯、β-甲基-2,6-二甲基苯乙烯、β-甲基-2,4-二甲基苯乙烯、鄰氯苯乙烯、間氯苯乙烯、對氯苯乙烯、2,6-二氯苯乙烯、2,4-二氯苯乙烯、α-氯-鄰氯苯乙烯、α-氯-間氯苯乙烯、α-氯-對氯苯乙烯、β-氯-鄰氯苯乙烯、β-氯-間氯苯乙烯、β-氯-對氯苯乙烯、2,4,6-三氯苯乙烯、α-氯-2,6-二氯苯乙烯、α-氯-2,4-二氯苯乙烯、β-氯-2,6-二氯苯乙烯、β-氯-2,4-二氯苯乙烯、鄰三級丁基苯乙烯、間三級丁基苯乙烯、對三級丁基苯乙烯、鄰甲氧基苯乙烯、間甲氧基苯乙烯、對甲氧基苯乙烯、鄰氯甲基苯乙烯、間氯甲基苯乙烯、對氯甲基苯乙烯、鄰溴甲基苯乙烯、間溴甲基苯乙烯、對溴甲基苯乙烯、被矽基取代的苯乙烯衍生物、茚、乙烯基萘、N-乙烯基咔唑等。此等芳香族乙烯基化合物可單獨使用一種,亦可使用二種以上。其中,由製造成本與物性平衡之觀點而言,較佳為苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、及此等的混合物,更佳為苯乙烯。Examples of the above-mentioned aromatic vinyl compounds include: styrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, α-methylstyrene, β-methylstyrene, 2,6- Dimethylstyrene, 2,4-Dimethylstyrene, α-methyl-o-methylstyrene, α-methyl-m-methylstyrene, α-methyl-p-methylstyrene, β -Methyl-o-methylstyrene, β-methyl-m-methylstyrene, β-methyl-p-methylstyrene, 2,4,6-trimethylstyrene, α-methyl-2 ,6-Dimethylstyrene, α-methyl-2,4-dimethylstyrene, β-methyl-2,6-dimethylstyrene, β-methyl-2,4-dimethylstyrene Methyl styrene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, 2,6-dichlorostyrene, 2,4-dichlorostyrene, α-chloro-o-chlorostyrene, α-chloro- M-chlorostyrene, α-chloro-p-chlorostyrene, β-chloro-o-chlorostyrene, β-chloro-m-chlorostyrene, β-chloro-p-chlorostyrene, 2,4,6-trichlorobenzene Ethylene, α-chloro-2,6-dichlorostyrene, α-chloro-2,4-dichlorostyrene, β-chloro-2,6-dichlorostyrene, β-chloro-2,4-di Chlorostyrene, o-tertiary butyl styrene, m-tertiary butyl styrene, p-tertiary butyl styrene, o-methoxy styrene, m-methoxy styrene, p-methoxy styrene, o Chloromethylstyrene, m-chloromethylstyrene, p-chloromethylstyrene, o-bromomethylstyrene, m-bromomethylstyrene, p-bromomethylstyrene, styrene derivatives substituted by silyl groups , Indene, vinyl naphthalene, N-vinyl carbazole, etc. One kind of these aromatic vinyl compounds may be used alone, or two or more kinds may be used. Among them, from the viewpoint of the balance of production cost and physical properties, styrene, α-methylstyrene, p-methylstyrene, and mixtures thereof are preferred, and styrene is more preferred.

只要不妨礙本發明之目的及效果,則聚合物嵌段(A)亦可含有來自芳香族乙烯基化合物以外的其他不飽和單體之結構單元(以下,有時簡稱為「其他不飽和單體單元」),但在聚合物嵌段(A)中較佳為30莫耳%以下,更佳為小於20莫耳%,再佳為小於15莫耳%,又更佳為小於10莫耳%,又再佳為小於5莫耳%,特佳為0莫耳%。 作為該其他不飽和單體,可列舉例如選自包含丁二烯、異戊二烯、2,3-二甲基丁二烯、1,3-戊二烯、1,3-己二烯、異丁烯、甲基丙烯酸甲酯、甲基乙烯基醚、β-蒎烯、8,9-對

Figure 109117127-A0304-12-01
烯、二戊烯、亞甲基降莰烯、2-亞甲基四氫呋喃等之群組中的至少1種。聚合物嵌段(A)含有該其他不飽和單體單元之情形的結合形態無特別限制,可為隨機、錐狀之任一者。As long as the purpose and effects of the present invention are not hindered, the polymer block (A) may also contain structural units derived from other unsaturated monomers other than aromatic vinyl compounds (hereinafter, sometimes referred to as "other unsaturated monomers"Unit"), but in the polymer block (A), it is preferably 30 mol% or less, more preferably less than 20 mol%, still more preferably less than 15 mol%, and more preferably less than 10 mol% , And more preferably less than 5 mol%, particularly preferably 0 mol%. Examples of the other unsaturated monomers include those selected from butadiene, isoprene, 2,3-dimethylbutadiene, 1,3-pentadiene, 1,3-hexadiene, Isobutylene, methyl methacrylate, methyl vinyl ether, β-pinene, 8,9-pair
Figure 109117127-A0304-12-01
At least one of the group consisting of ene, dipentene, methylene norbornene, 2-methylenetetrahydrofuran, and the like. When the polymer block (A) contains the other unsaturated monomer unit, the bonding form is not particularly limited, and it may be random or tapered.

嵌段共聚物只要具有至少1個前述聚合物嵌段(A)即可。在嵌段共聚物具有2個以上的聚合物嵌段(A)之情形中,該等聚合物嵌段(A)可相同亦可不同。此外,在本說明書中,所謂「聚合物嵌段不同」,意指構成聚合物嵌段的單體單元、重量平均分子量、立體異構性、及在具有複數個單體單元之情形中的各單體單元的比例及共聚合的形態(隨機、梯度、嵌段)之中至少1個不同。The block copolymer only needs to have at least one of the aforementioned polymer block (A). In the case where the block copolymer has two or more polymer blocks (A), the polymer blocks (A) may be the same or different. In addition, in this specification, the term "different polymer blocks" means the monomer units constituting the polymer blocks, the weight average molecular weight, the stereoisomerism, and each of the monomer units in the case of having plural monomer units. At least one of the ratio of monomer units and the form of copolymerization (random, gradient, block) is different.

(重量平均分子量) 聚合物嵌段(A)的重量平均分子量(Mw)並無特別限制,但嵌段共聚物具有的聚合物嵌段(A)之中,至少1個聚合物嵌段(A)的重量平均分子量較佳為3,000~60,000,更佳為4,000~50,000。藉由嵌段共聚物具有至少1個上述範圍內的重量平均分子量之聚合物嵌段(A),有利於制振性的進一步提升。 此外,重量平均分子量係藉由凝膠滲透層析法(GPC)測定所求取之標準聚苯乙烯換算的重量平均分子量。(Weight average molecular weight) The weight average molecular weight (Mw) of the polymer block (A) is not particularly limited, but the weight average molecular weight of at least one polymer block (A) among the polymer blocks (A) possessed by the block copolymer It is preferably 3,000 to 60,000, and more preferably 4,000 to 50,000. Since the block copolymer has at least one polymer block (A) with a weight average molecular weight within the above range, it is beneficial to further improve the vibration damping properties. In addition, the weight average molecular weight is a weight average molecular weight in terms of standard polystyrene obtained by gel permeation chromatography (GPC) measurement.

[聚合物嵌段(A)的含量] 嵌段共聚物中之聚合物嵌段(A)的含量,較佳為50質量%以下,更佳為30質量%以下,再佳為16質量%以下,特佳為14質量%以下。若為50質量%以下,則具有適當的柔軟性,可成為tanδ峰頂強度不降低且制振性優異的嵌段共聚物或其氫化物。又,下限值較佳為1質量%以上,更佳為3質量%以上,再佳為6質量%以上。若為1質量%以上,則可成為在黏接著組成物的各種用途中具有較佳的機械特性、成形加工性及塗布性等處理性的嵌段共聚物或其氫化物。 此外,嵌段共聚物中之聚合物嵌段(A)的含量係藉由1 H-NMR測定所求取的值,更詳細而言,係根據實施例所記載之方法而測定的值。[Content of polymer block (A)] The content of polymer block (A) in the block copolymer is preferably 50% by mass or less, more preferably 30% by mass or less, and still more preferably 16% by mass or less , Particularly preferably 14% by mass or less. If it is 50% by mass or less, it has appropriate flexibility and can be a block copolymer or its hydrogenated product that does not decrease the tanδ peak top strength and is excellent in vibration damping properties. In addition, the lower limit is preferably 1% by mass or more, more preferably 3% by mass or more, and still more preferably 6% by mass or more. If it is 1% by mass or more, it can be a block copolymer or its hydrogenated product that has better handling properties such as mechanical properties, moldability, and coating properties in various applications of the adhesive composition. In addition, the content of the polymer block (A) in the block copolymer is a value obtained by 1 H-NMR measurement, and more specifically, a value measured according to the method described in the examples.

[聚合物嵌段(B)] 構成嵌段共聚物之聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以下述式(X)所示之1種以上的脂環式骨架(X)之結構單元(以下,有時簡稱為「含有脂環式骨架的單元」)。又,聚合物嵌段(B)亦能含有:不含脂環式骨架(X)的來自共軛二烯化合物之結構單元(以下,有時簡稱為「共軛二烯單元」)。 聚合物嵌段(B)中的含有脂環式骨架的單元與共軛二烯單元之合計,由展現出優異的制振性之觀點而言,較佳為50莫耳%以上,更佳為70莫耳%以上,再佳為90莫耳%以上,特佳為實質上為100莫耳%。 在嵌段共聚物中具有2個以上的聚合物嵌段(B)之情形中,該等聚合物嵌段(B)可相同亦可不同。[Polymer block (B)] The polymer block (B) constituting the block copolymer is a structural unit derived from a conjugated diene compound, and has an alicyclic skeleton (X) containing one or more types represented by the following formula (X) in the main chain The structural unit (hereinafter, sometimes abbreviated as "alicyclic skeleton-containing unit"). In addition, the polymer block (B) may also contain a structural unit derived from a conjugated diene compound (hereinafter, sometimes simply referred to as "conjugated diene unit") that does not contain an alicyclic skeleton (X). The total of the alicyclic skeleton-containing unit and the conjugated diene unit in the polymer block (B) is preferably 50 mol% or more from the viewpoint of exhibiting excellent vibration damping properties, and more preferably 70 mol% or more, more preferably 90 mol% or more, and particularly preferably substantially 100 mol%. When there are two or more polymer blocks (B) in the block copolymer, the polymer blocks (B) may be the same or different.

Figure 02_image001
Figure 02_image001

上述式(X)中,R1 ~R3 各自獨立地表示氫原子或碳數1~11的烴基,複數個R1 ~R3 各自可相同或不同。上述烴基的碳數,較佳為碳數1~5,更佳為1~3,再佳為1(亦即,甲基)。又,上述烴基可為直鏈或分支鏈,且可為飽和或不飽和烴基。由物性及脂環式骨架(X)形成之觀點而言,R1 ~R3 特佳為各自獨立地為氫原子或甲基。 此外,在已氫化嵌段共聚物之情形,上述式(X)中之乙烯基能被氫化。因此,在氫化物中之脂環式骨架(X)的意義中,亦包含上述式(X)中之乙烯基被氫化的骨架。In the above formula (X), R 1 to R 3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 11 carbon atoms, and a plurality of R 1 to R 3 may be the same or different. The carbon number of the hydrocarbon group is preferably 1 to 5, more preferably 1 to 3, and even more preferably 1 (that is, methyl). In addition, the above-mentioned hydrocarbon group may be a straight chain or a branched chain, and may be a saturated or unsaturated hydrocarbon group. From the viewpoint of physical properties and formation of the alicyclic skeleton (X), R 1 to R 3 are particularly preferably each independently a hydrogen atom or a methyl group. In addition, in the case of a hydrogenated block copolymer, the vinyl group in the above formula (X) can be hydrogenated. Therefore, in the meaning of the alicyclic skeleton (X) in the hydride, the skeleton in which the vinyl group in the above formula (X) is hydrogenated is also included.

聚合物嵌段(B)係來自共軛二烯化合物之結構單元,脂環式骨架(X)係來自該共軛二烯化合物。脂環式骨架(X)係藉由後述方法並利用共軛二烯化合物的陰離子聚合而生成,但因應所使用之共軛二烯化合物,於含有脂環式骨架的單元的主鏈包含至少1種的脂環式骨架(X)。藉由該脂環式骨架(X)被組入聚合物嵌段(B)所含之結構單元的主鏈,因分子運動變小而玻璃轉移溫度上升,在室溫附近的tanδ的峰頂強度提升,可展現出優異的制振性。The polymer block (B) is a structural unit derived from a conjugated diene compound, and the alicyclic skeleton (X) is derived from the conjugated diene compound. The alicyclic skeleton (X) is produced by the method described below using anionic polymerization of a conjugated diene compound. However, depending on the conjugated diene compound used, the main chain of the alicyclic skeleton-containing unit contains at least 1 Kind of alicyclic skeleton (X). With the alicyclic skeleton (X) incorporated into the main chain of the structural unit contained in the polymer block (B), the glass transition temperature rises due to the decrease of molecular motion, and the peak top strength of tanδ near room temperature Improved, can show excellent vibration damping performance.

作為上述共軛二烯化合物,可列舉:丁二烯、異戊二烯、己二烯、2,3-二甲基-1,3-丁二烯、2-苯基-1,3-丁二烯、1,3-戊二烯、2-甲基-1,3-戊二烯、1,3-己二烯、1,3-辛二烯、1,3-環己二烯、2-甲基-1,3-辛二烯、1,3,7-辛三烯、菌綠烯、月桂油烯及氯丁二烯等。其中,較佳為丁二烯、異戊二烯、或併用丁二烯與異戊二烯。Examples of the above-mentioned conjugated diene compound include butadiene, isoprene, hexadiene, 2,3-dimethyl-1,3-butadiene, 2-phenyl-1,3-butadiene Diene, 1,3-pentadiene, 2-methyl-1,3-pentadiene, 1,3-hexadiene, 1,3-octadiene, 1,3-cyclohexadiene, 2 -Methyl-1,3-octadiene, 1,3,7-octatriene, bacteriochlorene, myrcene and chloroprene, etc. Among them, butadiene, isoprene, or a combination of butadiene and isoprene is preferred.

在併用丁二烯與異戊二烯之情形,其等的摻合比例[異戊二烯/丁二烯](質量比)並無特別限制,但較佳為5/95~95/5,更佳為10/90~90/10,再佳為40/60~70/30,特佳為45/55~65/35。此外,若以莫耳比表示該混合比例[異戊二烯/丁二烯],則較佳為5/95~95/5,更佳為10/90~90/10,再佳為40/60~70/30,特佳為45/55~55/45。In the case of using butadiene and isoprene in combination, the blending ratio [isoprene/butadiene] (mass ratio) is not particularly limited, but it is preferably 5/95~95/5, More preferably, it is 10/90~90/10, still more preferably 40/60~70/30, particularly preferably 45/55~65/35. In addition, if the mixing ratio [isoprene/butadiene] is expressed in molar ratio, it is preferably 5/95~95/5, more preferably 10/90~90/10, and still more preferably 40/ 60~70/30, particularly preferably 45/55~55/45.

作為具體例,針對在使用丁二烯、異戊二烯、或丁二烯與異戊二烯兩方作為共軛二烯化合物之情形中主要生成的脂環式骨架(X)進行說明。 單獨使用丁二烯作為共軛二烯化合物之情形,生成具有下述(i)的取代基的組合之脂環式骨架(X)。亦即,此情形,脂環式骨架(X)僅成為R1 ~R3 同時為氫原子之脂環式骨架。因此,作為嵌段共聚物或其氫化物的較佳態樣之一例,可列舉聚合物嵌段(B)具有以下結構單元者:於主鏈包含R1 ~R3 同時為氫原子之一種脂環式骨架(X)。As a specific example, the alicyclic skeleton (X) that is mainly produced when butadiene, isoprene, or both butadiene and isoprene is used as the conjugated diene compound will be described. When butadiene is used alone as the conjugated diene compound, an alicyclic skeleton (X) having a combination of the following substituents (i) is produced. That is, in this case, the alicyclic skeleton (X) only becomes the alicyclic skeleton in which R 1 to R 3 are hydrogen atoms at the same time. Therefore, as an example of a preferred aspect of the block copolymer or its hydrogenated product, the polymer block (B) has the following structural units: a resin containing R 1 to R 3 in the main chain and simultaneously being hydrogen atoms Cyclic skeleton (X).

又,單獨使用異戊二烯作為共軛二烯化合物之情形,主要生成具有下述(v)及(vi)的取代基的組合之2種的脂環式骨架(X)。 又,併用丁二烯與異戊二烯作為共軛二烯化合物之情形,主要生成具有下述(i)~(vi)的取代基的組合之6種的脂環式骨架(X)。 (i)   :R1 =氫原子、R2 =氫原子、R3 =氫原子 (ii)  :R1 =氫原子、R2 =甲基、R3 =氫原子 (iii) :R1 =氫原子、R2 =氫原子、R3 =甲基 (iv)  :R1 =甲基、R2 =氫原子、R3 =氫原子 (v)   :R1 =甲基、R2 =甲基、R3 =氫原子 (vi)  :R1 =甲基、R2 =氫原子、R3 =甲基In addition, when isoprene is used alone as the conjugated diene compound, an alicyclic skeleton (X) having two combinations of the following substituents (v) and (vi) is mainly produced. In addition, when butadiene and isoprene are used in combination as a conjugated diene compound, an alicyclic skeleton (X) having six combinations of the following substituents (i) to (vi) is mainly produced. (i): R 1 = hydrogen atom, R 2 = hydrogen atom, R 3 = hydrogen atom (ii): R 1 = hydrogen atom, R 2 = methyl, R 3 = hydrogen atom (iii): R 1 = hydrogen Atom, R 2 = hydrogen atom, R 3 = methyl (iv): R 1 = methyl, R 2 = hydrogen atom, R 3 = hydrogen atom (v): R 1 = methyl, R 2 = methyl, R 3 = hydrogen atom (vi): R 1 = methyl, R 2 = hydrogen atom, R 3 = methyl

在上述式(X)中,由藉由具有為烴基之取代基而分子運動變得更小且制振性進一步提升之觀點而言,聚合物嵌段(B)中之至少1種的脂環式骨架(X)較佳為脂環式骨架(X’),其係上述R1 ~R3 之中至少1個為碳數1~11的烴基。其中,由可效率佳地從共軛二烯化合物生成脂環式骨架、制振性及機械特性的平衡之觀點而言,更佳為該脂環式骨架(X’)中之烴基為甲基。 尤其,更佳為R1 ~R3 各自獨立地表示氫原子或甲基且R1 ~R3 不同時為氫原子之脂環式骨架。亦即,聚合物嵌段(B)更佳為具有以下構成單元:於主鏈包含在具有上述(ii)~(vi)的取代基的組合之脂環式骨架中之任一種以上。In the above formula (X), from the viewpoint that the molecular motion becomes smaller and the vibration damping property is further improved by having a substituent that is a hydrocarbon group, at least one alicyclic ring in the polymer block (B) The formula skeleton (X) is preferably an alicyclic skeleton (X'), and at least one of the above-mentioned R 1 to R 3 is a hydrocarbon group with 1 to 11 carbon atoms. Among them, it is more preferable that the hydrocarbon group in the alicyclic skeleton (X') is a methyl group from the viewpoint of efficiently generating an alicyclic skeleton from a conjugated diene compound, vibration damping properties, and mechanical properties. . In particular, it is more preferable that R 1 to R 3 each independently represent a hydrogen atom or a methyl group, and R 1 to R 3 are not simultaneously an alicyclic skeleton of a hydrogen atom. That is, the polymer block (B) more preferably has the following structural unit: any one or more of the alicyclic skeletons having a combination of the above-mentioned substituents (ii) to (vi) are contained in the main chain.

(聚合物嵌段(B)的乙烯基鍵結量) 在構成聚合物嵌段(B)之構成單元為異戊二烯單元、丁二烯單元、異戊二烯及丁二烯的混合物單元之任一者之情形中,作為形成前述脂環式骨架(X)之鍵結形態以外的異戊二烯及丁二烯各自的鍵結形態,在丁二烯之情形中可設為1,2-鍵結、1,4-鍵結,在異戊二烯之情形中可設為1,2-鍵結、3,4-鍵結、1,4-鍵結。(Vinyl bonding amount of polymer block (B)) When the structural unit constituting the polymer block (B) is any one of isoprene units, butadiene units, isoprene and butadiene mixture units, the aforementioned alicyclic skeleton is formed The bonding morphology of isoprene and butadiene other than the bonding morphology of (X) can be 1,2-bonding or 1,4-bonding in the case of butadiene. In the case of diene, it can be 1,2-bonded, 3,4-bonded, or 1,4-bonded.

在嵌段共聚物及其氫化物中,聚合物嵌段(B)中的3,4-鍵結單元及1,2-鍵結單元的含量(以下,有時僅稱為「乙烯基鍵結量」)的合計較佳為55~95莫耳%,更佳為63~95莫耳%,再佳為66~95莫耳%,又更佳為70~95莫耳%。只要為上述範圍,則可展現出優異的制振性。又,有乙烯基鍵結量變得愈高,愈有抑制黏接著組成物的剝離強度因溫度上升而降低的傾向,黏接著組成物在高溫中變得更不易剝落。 於此,乙烯基鍵結量係根據實施例所記載之方法並藉由1 H-NMR測定所算出之值。 此外,在聚合物嵌段(B)僅由丁二烯構成之情形中,前述所謂的「3,4-鍵結單元及1,2-鍵結單元的含量」係替換為「1,2-鍵結單元的含量」以應用。In the block copolymer and its hydrogenated substances, the content of 3,4-bonded units and 1,2-bonded units in the polymer block (B) (hereinafter, sometimes only referred to as "vinyl-bonded The total amount") is preferably 55 to 95 mol%, more preferably 63 to 95 mol%, still more preferably 66 to 95 mol%, and still more preferably 70 to 95 mol%. As long as it is in the above range, excellent vibration damping properties can be exhibited. In addition, the higher the amount of vinyl bonding, the more it tends to suppress the decrease in the peel strength of the adhesive composition due to the increase in temperature, and the adhesive composition becomes less likely to peel off at high temperatures. Here, the vinyl bond amount is a value calculated by 1 H-NMR measurement according to the method described in the examples. In addition, when the polymer block (B) is composed only of butadiene, the aforementioned "content of 3,4-bonding unit and 1,2-bonding unit" is replaced with "1,2- The content of bonding unit" is applied.

(脂環式骨架(X)含量) 在聚合物嵌段(B)中,只要包含於主鏈包含脂環式骨架(X)之結構單元即可,但由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,在聚合物嵌段(B)中較佳為含有1莫耳%以上的脂環式骨架(X),更佳為1.1莫耳%以上,再佳為1.4莫耳%以上,又更佳為1.8莫耳%以上,又再佳為4莫耳%以上,又再佳為10莫耳%以上,特佳為13莫耳%以上。又,有脂環式骨架(X)的上述含量變得愈高,愈有抑制黏接著組成物的剝離強度因溫度上升而降低的傾向,黏接著組成物在高溫中變得更不易剝落。 又,聚合嵌段(B)中的脂環式骨架(X)的含量的上限只要為不損及本發明效果的範圍內則無特別限制,但由生產性之觀點而言,較佳為40莫耳%以下,亦可為30莫耳%以下,亦可為20莫耳%以下,亦可為18莫耳%以下。 由使制振性進一步提升之觀點而言,在聚合物嵌段(B)中更佳為含有1莫耳%以上的上述脂環式骨架(X’),再佳為1.3莫耳%以上,又更佳為1.6莫耳%以上。脂環式骨架(X’)的含量的上限值係與上述脂環式骨架(X)的含量的上限值相同。(Alicyclic skeleton (X) content) In the polymer block (B), as long as the structural unit containing the alicyclic skeleton (X) is contained in the main chain, it is easy to suppress the viscosity even at high temperatures due to the effect of exhibiting more excellent vibration damping properties. From the viewpoint of the reduction of the subsequent force, the polymer block (B) preferably contains 1 mol% or more of the alicyclic skeleton (X), more preferably 1.1 mol% or more, and still more preferably 1.4 mol%. Ear% or more, more preferably 1.8 mol% or more, still more preferably 4 mol% or more, still more preferably 10 mol% or more, and particularly preferably 13 mol% or more. In addition, the higher the content of the alicyclic skeleton (X), the more likely it is that the peel strength of the adhesive composition is suppressed from decreasing due to temperature rise, and the adhesive composition becomes less likely to peel off at high temperatures. In addition, the upper limit of the content of the alicyclic skeleton (X) in the polymer block (B) is not particularly limited as long as it is within a range that does not impair the effect of the present invention, but from the viewpoint of productivity, it is preferably 40. Mole% or less, 30 mole% or less, 20 mole% or less, or 18 mole% or less. From the viewpoint of further improving the vibration damping properties, the polymer block (B) preferably contains 1 mol% or more of the above-mentioned alicyclic skeleton (X'), and still more preferably 1.3 mol% or more. More preferably, it is 1.6 mol% or more. The upper limit of the content of the alicyclic skeleton (X') is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

更具體而言,作為共軛二烯化合物,使用異戊二烯之情形、使用丁二烯之情形、或併用丁二烯與異戊二烯之情形,在各情形中之脂環式骨架含量係如同下述。 在使用異戊二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,具有前述(v)、(vi)的取代基的組合之脂環式骨架(X’)存在一種以上時,其等的合計含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為1莫耳%以上,更佳為1.5莫耳%以上,由在寬廣溫度範圍中獲得優異的制振性的效果之觀點而言,再佳為2莫耳%以上,又更佳為3莫耳%以上,特佳為4莫耳%以上。又,使用異戊二烯之情形的上述合計含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。More specifically, as the conjugated diene compound, when isoprene is used, when butadiene is used, or when butadiene and isoprene are used in combination, the content of alicyclic skeleton in each case The line is as follows. In the case of using isoprene as the conjugated diene compound, in the polymer block (B), an alicyclic skeleton (X') having a combination of the aforementioned substituents (v) and (vi) exists In the case of more than one type, the total content of them is preferably 1 mol% or more from the viewpoint of exhibiting more excellent vibration damping effects and easily suppressing the decrease in adhesive force even at high temperatures. 1.5 mol% or more. From the viewpoint of obtaining excellent vibration damping effects in a wide temperature range, it is more preferably 2 mol% or more, still more preferably 3 mol% or more, and particularly preferably 4 mol% Ear% or more. In addition, the upper limit of the total content in the case of using isoprene is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

在使用丁二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,脂環式骨架(X)存在時,其含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為5莫耳%以上,更佳為10莫耳%以上,再佳為15莫耳%以上,又再佳為20莫耳%以上,又更佳為25莫耳%以上,特佳為30莫耳%以上。又,使用丁二烯之情形的上述含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。In the case of using butadiene as the conjugated diene compound, when the alicyclic skeleton (X) is present in the polymer block (B), its content is determined by the effect of exhibiting more excellent vibration damping properties, From the viewpoint of easily suppressing the decrease in adhesive force even at high temperatures, it is preferably 5 mol% or more, more preferably 10 mol% or more, still more preferably 15 mol% or more, and still more preferably 20 mol% Ear% or more, more preferably 25 mol% or more, particularly preferably 30 mol% or more. In addition, the upper limit of the content in the case of using butadiene is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

在併用丁二烯與異戊二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,具有前述(ii)、(iii)、(v)、(vi)的取代基的組合之脂環式骨架(X’)存在一種以上時,其等的合計含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為1莫耳%以上,更佳為2莫耳%以上,再佳為5莫耳%以上,又更佳為8莫耳%以上,又再佳為13莫耳%以上。併用丁二烯與異戊二烯之情形的上述合計含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。 又,在併用丁二烯與異戊二烯作為共軛二烯化合物之情形中,在聚合物嵌段(B)中,具有前述(i)~(vi)的取代基的組合之脂環式骨架(X)存在一種以上時,其等的合計含量,由展現出更優異的制振性的效果、即使在高溫中亦容易抑制黏接著力的降低之觀點而言,較佳為1莫耳%以上,更佳為5莫耳%以上。併用丁二烯與異戊二烯之情形的上述合計含量的上限值係與前述脂環式骨架(X)的含量的上限值相同。In the case where butadiene and isoprene are used in combination as the conjugated diene compound, the polymer block (B) has the aforementioned substituents (ii), (iii), (v), and (vi) When there is more than one kind of alicyclic skeleton (X') in the combination of, the total content of the same is from the viewpoint of exhibiting a more excellent vibration damping effect and easily suppressing the decrease in adhesive force even at high temperatures , Preferably 1 mol% or more, more preferably 2 mol% or more, still more preferably 5 mol% or more, still more preferably 8 mol% or more, and still more preferably 13 mol% or more. The upper limit of the total content in the case of using butadiene and isoprene in combination is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X). In addition, in the case where butadiene and isoprene are used in combination as the conjugated diene compound, in the polymer block (B), an alicyclic formula having a combination of the aforementioned substituents (i) to (vi) When there is more than one type of skeleton (X), the total content of them is preferably 1 mol from the viewpoint of exhibiting a more excellent vibration damping effect and easily suppressing the decrease in adhesive force even at high temperatures % Or more, more preferably 5 mol% or more. The upper limit of the total content in the case of using butadiene and isoprene in combination is the same as the upper limit of the content of the aforementioned alicyclic skeleton (X).

此外,嵌段共聚物或其氫化物所含之上述脂環式骨架(X)(包含(X’))含量係藉由嵌段共聚物的13 C-NMR測定而由來自聚合物嵌段(B)中的脂環式骨架(X)的積分值所求取之值,更詳細而言,係根據實施例所記載之方法所測定之值。In addition, the content of the alicyclic skeleton (X) (including (X')) contained in the block copolymer or its hydrogenated product is determined by the 13 C-NMR measurement of the block copolymer and derived from the polymer block ( The value obtained by the integral value of the alicyclic skeleton (X) in B) is, in more detail, the value measured according to the method described in the examples.

又,嵌段共聚物或其氫化物在聚合物嵌段(B)的氫化率為0莫耳%以上且小於50莫耳%之情形,可確定已與脂環式骨架(X)鍵結的乙烯基與已與主鏈鍵結的乙烯基之含有莫耳比。 例如,在具有前述(ii)、(iii)、(v)、(vi)的取代基的組合之脂環式骨架(X’)中,已與該脂環式骨架(X’)鍵結的乙烯基末端的碳原子(下述化學式的(a))在13 C-NMR中之化學位移係出現在107~110ppm附近,已與主鏈鍵結的乙烯基末端的碳原子(下述化學式的(b))在13 C-NMR中之化學位移係出現在110~116ppm附近。而且,氫化率為0~40莫耳%之情形,由13 C-NMR所測定之峰面積比[化學位移值107~110ppm的峰面積]/[化學位移值110~116ppm的峰面積]通常成為0.01~3.00的範圍,由可展現出更優異的制振性之觀點而言,該面積比較佳係成為0.01~1.50,更佳係成為0.01~1.00,再佳係成為0.01~0.50,又再佳係成為0.01~0.20。In addition, when the hydrogenation rate of the block copolymer or its hydrogenated product in the polymer block (B) is 0 mol% or more and less than 50 mol%, it can be confirmed that the alicyclic skeleton (X) has been bonded The molar ratio between the vinyl group and the vinyl group bonded to the main chain. For example, in an alicyclic skeleton (X') having a combination of substituents (ii), (iii), (v), and (vi), the alicyclic skeleton (X') has been bonded The chemical shift system of the vinyl terminal carbon atom ((a) of the following chemical formula) in 13 C-NMR appears in the vicinity of 107~110 ppm, and the vinyl terminal carbon atom that has been bonded to the main chain (the following chemical formula (b)) The chemical shift in 13 C-NMR is around 110~116ppm. In addition, when the hydrogenation rate is 0-40 mol%, the peak area ratio measured by 13 C-NMR [peak area with chemical shift value of 107 to 110 ppm]/[peak area with chemical shift value of 110 to 116 ppm] usually becomes In the range of 0.01 to 3.00, from the viewpoint of exhibiting more excellent vibration damping properties, the area is preferably 0.01 to 1.50, more preferably 0.01 to 1.00, and even better is 0.01 to 0.50, and even better The line becomes 0.01~0.20.

Figure 02_image005
Figure 02_image005

又,針對氫化物,在13 C-NMR測定中幾乎未觀測到來自脂環式骨架(X)上的碳原子的峰,但能觀測到來自與分支狀烷基鍵結的該脂環式骨架(X)上的碳原子的峰,該分支狀烷基來自具有取代基R3 的乙烯基,該R3 為碳數1~11的烴基。 藉此,關於氫化物,聚合物嵌段(B)的氫化率為50~99莫耳%之情形,亦能確定上述與來自具有R3 的乙烯基之分支狀烷基鍵結的脂環式骨架(X)上的碳原子、及與來自乙烯基的分支狀烷基鍵結的主鏈上的碳原子之含有莫耳比。In addition, for the hydride, almost no peak derived from the carbon atom on the alicyclic skeleton (X) was observed in the 13 C-NMR measurement, but the peak derived from the alicyclic skeleton bonded to the branched alkyl group was observed. The peak of the carbon atom on (X), the branched alkyl group is derived from a vinyl group having a substituent R 3 , and the R 3 is a hydrocarbon group having 1 to 11 carbon atoms. From this, regarding the hydrogenated product, when the hydrogenation rate of the polymer block (B) is 50 to 99 mol%, the above-mentioned alicyclic type bonded to the branched alkyl group derived from the vinyl group having R 3 can also be determined The molar ratio of the carbon atoms on the skeleton (X) and the carbon atoms on the main chain bonded to the branched alkyl group derived from the vinyl group.

例如,在具有前述(iii)、(vi)的取代基的組合之脂環式骨架(X)中,與異戊二烯基鍵結之脂環式骨架(X)上的碳原子(下述化學式的(c))在13 C-NMR中之化學位移係出現在50.0~52.0ppm附近,與異戊二烯基鍵結之主鏈上的碳原子(下述化學式的(d))在13 C-NMR中之化學位移係出現在43.0~45.0ppm附近。而且,氫化率為40~99莫耳%之情形,由13 C-NMR所測定之峰面積比[化學位移值50.0~52.0ppm的峰面積]/[化學位移值43.0~45.0ppm的峰面積]通常成為0.01~3.00的範圍,由可展現出更優異的制振性之觀點而言,該面積比較佳係成為0.01~1.50的範圍,更佳係成為0.01~1.00的範圍,再佳係成為0.01~0.50的範圍,又再佳係成為0.01~0.25。 此外,上述峰面積比,更詳細而言,可根據實施例所記載之方法而測定。For example, in the alicyclic skeleton (X) having a combination of the substituents (iii) and (vi), the carbon atoms on the alicyclic skeleton (X) bonded to the isoprenyl group (below The chemical shift of the chemical formula (c)) in 13 C-NMR appears in the vicinity of 50.0~52.0 ppm, and the carbon atom on the main chain bonded to the isoprenyl group ((d) in the following chemical formula) is at 13 The chemical shift system in C-NMR appears around 43.0~45.0ppm. In addition, when the hydrogenation rate is 40 to 99 mol%, the peak area ratio measured by 13 C-NMR [peak area with chemical shift value of 50.0-52.0 ppm]/[peak area with chemical shift value of 43.0-45.0 ppm] Usually it is in the range of 0.01 to 3.00. From the viewpoint of exhibiting more excellent vibration damping properties, the area is preferably in the range of 0.01 to 1.50, more preferably in the range of 0.01 to 1.00, and even more preferably in the range of 0.01 The range of ~0.50, the best system becomes 0.01~0.25. In addition, the above-mentioned peak area ratio can be measured in more detail according to the method described in Examples.

Figure 02_image007
Figure 02_image007

(重量平均分子量) 嵌段共聚物具有的聚合物嵌段(B)的合計的重量平均分子量,由制振性及黏接著組成物的處理性等之觀點而言,在氫化前的狀態下,較佳為15,000~800,000,更佳為50,000~700,000,再佳為70,000~600,000,特佳為90,000~500,000,最佳為130,000~450,000。(Weight average molecular weight) The total weight average molecular weight of the polymer block (B) of the block copolymer is preferably 15,000 to 15,000 in the state before hydrogenation from the viewpoints of vibration damping properties and handling properties of the adhesive composition. 800,000, more preferably 50,000~700,000, still more preferably 70,000~600,000, particularly preferably 90,000~500,000, most preferably 130,000~450,000.

(其他結構單元) 聚合物嵌段(B)只要不妨礙本發明之目的及效果,則亦可含有來自前述共軛二烯化合物以外的其他聚合性的單體之結構單元。此情形,在聚合物嵌段(B)中,來自共軛二烯化合物以外的其他聚合性的單體之結構單元的含量,較佳為小於50莫耳%,更佳為小於30莫耳%,再佳為小於20莫耳%,又更佳為小於10莫耳%,特佳為0莫耳%。 作為該其他聚合性的單體,可較佳列舉例如選自包含苯乙烯、α-甲基苯乙烯、鄰甲基苯乙烯、間甲基苯乙烯、對甲基苯乙烯、對三級丁基苯乙烯、2,4-二甲基苯乙烯、N-乙烯基咔唑、乙烯基萘及乙烯基蒽等芳香族乙烯基化合物、以及甲基丙烯酸甲酯、甲基乙烯基醚、β-蒎烯、8,9-對

Figure 109117127-A0304-12-01
烯、二戊烯、亞甲基降莰烯、2-亞甲基四氫呋喃、1,3-環戊二烯、1,3-環己二烯、1,3-環庚二烯、1,3-環辛二烯等之群組的至少1種化合物。 嵌段共聚物只要具有至少1個前述聚合物嵌段(B)即可。在嵌段共聚物具有2個以上的聚合物嵌段(B)之情形中,該等聚合物嵌段(B)可相同亦可不同。(Other structural units) The polymer block (B) may contain structural units derived from other polymerizable monomers other than the aforementioned conjugated diene compound as long as it does not interfere with the purpose and effects of the present invention. In this case, in the polymer block (B), the content of structural units derived from polymerizable monomers other than the conjugated diene compound is preferably less than 50 mol%, more preferably less than 30 mol% , More preferably less than 20 mol%, more preferably less than 10 mol%, particularly preferably 0 mol%. As the other polymerizable monomers, for example, selected from the group consisting of styrene, α-methylstyrene, o-methylstyrene, m-methylstyrene, p-methylstyrene, p-tertiary butyl Aromatic vinyl compounds such as styrene, 2,4-dimethylstyrene, N-vinylcarbazole, vinyl naphthalene and vinyl anthracene, as well as methyl methacrylate, methyl vinyl ether, β-pine Ene, 8,9-pair
Figure 109117127-A0304-12-01
Ene, dipentene, methylene norbornene, 2-methylenetetrahydrofuran, 1,3-cyclopentadiene, 1,3-cyclohexadiene, 1,3-cycloheptadiene, 1,3 -At least one compound of the group of cyclooctadiene and the like. The block copolymer only needs to have at least one of the aforementioned polymer block (B). In the case where the block copolymer has two or more polymer blocks (B), the polymer blocks (B) may be the same or different.

[製造方法] (嵌段共聚物) 作為嵌段共聚物的製造方法,例如,將1種以上的共軛二烯化合物作為單體並藉由陰離子聚合法使其聚合,藉此形成具有於主鏈包含前述脂環式骨架(X)之結構單元的聚合物嵌段(B),添加聚合物嵌段(A)的單體,又因應需要進一步逐次添加聚合物嵌段(A)的單體及共軛二烯化合物,藉此可獲得嵌段共聚物。 藉由上述陰離子聚合法使脂環式骨架生成的方法可使用眾所周知的技術(例如,參照美國專利第3966691號說明書)。脂環式骨架係藉由單體的耗盡而被形成在聚合物的末端,藉由對其進一步逐次添加單體,可從該脂環式骨架使聚合再次開始。因此,可依據單體的逐次添加時間、聚合溫度、或者觸媒的種類及添加量、單體與觸媒之組合等,而調整該脂環式骨架的生成的有無及其含量。又,在陰離子聚合法中,可使用陰離子聚合起始劑、溶媒、及因應需要的路易斯鹼。[Production method] (Block copolymer) As a method of producing a block copolymer, for example, one or more conjugated diene compounds are used as monomers and polymerized by an anionic polymerization method, thereby forming an alicyclic skeleton (X) containing the aforementioned alicyclic skeleton in the main chain. In the polymer block (B) of the structural unit, the monomers of the polymer block (A) are added, and the monomers and conjugated diene compounds of the polymer block (A) are further added successively according to the needs, so that the Obtain a block copolymer. The method for generating an alicyclic skeleton by the above-mentioned anionic polymerization method can use a well-known technique (for example, refer to the specification of US Patent No. 3,966,691). The alicyclic skeleton is formed at the end of the polymer by depletion of monomers, and by further adding monomers to it successively, the polymerization can be restarted from the alicyclic skeleton. Therefore, the presence or absence and content of the alicyclic skeleton can be adjusted according to the successive addition time of the monomers, the polymerization temperature, or the type and amount of the catalyst, the combination of the monomer and the catalyst, and the like. In addition, in the anionic polymerization method, an anionic polymerization initiator, a solvent, and a Lewis base as required can be used.

在上述方法中,作為能使用作為陰離子聚合的聚合起始劑之有機鋰化合物,可列舉例如甲基鋰、乙基鋰、正丁基鋰、二級丁基鋰、三級丁基鋰、戊基鋰等。又,作為能使用作為聚合起始劑之二鋰化合物,可列舉例如萘二鋰、二鋰己基苯等。 作為偶合劑,可列舉例如二氯甲烷、二溴甲烷、二氯乙烷、二溴乙烷、二溴苯、苯甲酸苯酯等。 此等聚合起始劑及偶合劑的使用量可依據嵌段共聚物及其氫化物所期望之重量平均分子量而適當決定。一般而言,烷基鋰化合物、二鋰化合物等起始劑,較佳為以聚合所使用之聚合物嵌段(A)的單體及共軛二烯化合物等的單體的合計每100質量份為0.01~0.2質量份的比例使用,在使用偶合劑之情形,較佳為以前述單體的合計每100質量份為0.001~0.8質量份的比例使用。In the above method, the organolithium compound that can be used as a polymerization initiator for anionic polymerization includes, for example, methyl lithium, ethyl lithium, n-butyl lithium, secondary butyl lithium, tertiary butyl lithium, and pentyl lithium. Base lithium and so on. In addition, examples of dilithium compounds that can be used as a polymerization initiator include naphthalene dilithium, dilithium hexylbenzene, and the like. As a coupling agent, dichloromethane, dibromomethane, dichloroethane, dibromoethane, dibromobenzene, phenyl benzoate, etc. are mentioned, for example. The usage amount of these polymerization initiators and coupling agents can be appropriately determined according to the desired weight average molecular weight of the block copolymer and its hydrogenated product. Generally speaking, the initiator such as alkyl lithium compound and dilithium compound is preferably based on the total mass of the monomers such as the polymer block (A) and the conjugated diene compound used in the polymerization per 100 mass The parts are used in a ratio of 0.01 to 0.2 parts by mass. When a coupling agent is used, it is preferably used in a ratio of 0.001 to 0.8 parts by mass per 100 parts by mass of the total of the aforementioned monomers.

作為溶媒,只要不對陰離子聚合反應造成不良影響則無特別限制,可列舉例如:環己烷、甲基環己烷、正己烷、正戊烷等脂肪族烴;苯、甲苯、二甲苯等芳香族烴等。又,聚合反應通常係以0~100℃,較佳為10~70℃的溫度進行0.5~50小時,較佳為1~30小時。The solvent is not particularly limited as long as it does not adversely affect the anionic polymerization reaction. Examples include aliphatic hydrocarbons such as cyclohexane, methylcyclohexane, n-hexane, and n-pentane; aromatics such as benzene, toluene, and xylene. Hydrocarbon etc. In addition, the polymerization reaction is usually carried out at a temperature of 0 to 100°C, preferably 10 to 70°C, for 0.5 to 50 hours, preferably 1 to 30 hours.

又,藉由在共軛二烯化合物的聚合之際添加路易斯鹼作為共觸媒的方法,可提高聚合物嵌段(B)中之上述脂環式骨架(X)的含量、3,4-鍵結及1,2-鍵結的含量。 作為可使用之路易斯鹼,可列舉例如:二甲醚、二乙醚、四氫呋喃、2,2-二(2-四氫呋喃基)丙烷(DTHFP)等醚類;乙二醇二甲醚、二乙二醇二甲醚、三乙二醇二甲醚、四乙二醇二甲醚等二醇醚類;三乙胺、N,N,N’,N’-四亞甲基二胺、N,N,N’,N’-四甲基乙二胺(TMEDA)、N-甲基

Figure 109117127-A0304-12-02
啉等胺類;三級丁醇鈉、三級戊醇鈉或異戊醇鈉等脂肪族醇的鈉或鉀鹽、或者二烷基環己醇鈉、例如如薄荷醇鈉(sodium mentholate)般的脂環式醇的鈉或鉀鹽等金屬鹽等。此等路易斯鹼可單獨使用一種或組合二種以上而使用。In addition, by adding a Lewis base as a co-catalyst during the polymerization of the conjugated diene compound, the content of the alicyclic skeleton (X) in the polymer block (B) can be increased, and the content of 3,4- The content of bonding and 1,2-bonding. Usable Lewis bases include, for example, ethers such as dimethyl ether, diethyl ether, tetrahydrofuran, 2,2-bis(2-tetrahydrofuryl)propane (DTHFP); ethylene glycol dimethyl ether, diethylene glycol Dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether and other glycol ethers; triethylamine, N,N,N',N'-tetramethylene diamine, N,N, N',N'-tetramethylethylenediamine (TMEDA), N-methyl
Figure 109117127-A0304-12-02
Amines such as morpholines; sodium or potassium salts of aliphatic alcohols such as sodium tertiary butoxide, sodium tertiary pentanoxide, or sodium isoamyloxide, or sodium dialkylcyclohexanoxide, such as sodium mentholate Metal salts such as sodium or potassium salt of the alicyclic alcohol. These Lewis bases can be used individually by 1 type or in combination of 2 or more types.

路易斯鹼的添加量,係依據將上述脂環式骨架(X)的含量控制在何種程度,以及在前述聚合物嵌段(B)特別包含來自異戊二烯及/或丁二烯之結構單元之情形中是將構成聚合物嵌段(B)之異戊二烯單元及/或丁二烯單元的乙烯基鍵結量控制在何種程度而決定。因此,路易斯鹼的添加量並無嚴格意義上的限制,但在被使用作為聚合起始劑之烷基鋰化合物或二鋰化合物所含有之鋰的每1公克原子中,通常在0.1~1,000莫耳,較佳為在1~100莫耳的範圍內使用。The amount of Lewis base added depends on how much the content of the alicyclic skeleton (X) is controlled, and the polymer block (B) specifically contains a structure derived from isoprene and/or butadiene In the case of the unit, it is determined how much the vinyl bonding amount of the isoprene unit and/or butadiene unit constituting the polymer block (B) is controlled. Therefore, the amount of Lewis base added is not strictly limited, but it is usually 0.1 to 1,000 moles per 1 gram atom of the lithium contained in the alkyl lithium compound or dilithium compound used as the polymerization initiator. The ears are preferably used in the range of 1-100 mol.

共軛二烯化合物的平均進料速度(以下,有時稱為「平均二烯進料速度」),由提高脂環式骨架(X)的含量之觀點而言,每1莫耳的活性末端,較佳為150kg/h以下,更佳為110kg/h以下,再佳為55kg/h以下,亦可為45kg/h以下,亦可為30kg/h以下,亦可為22kg/h以下。由提高生產性之觀點而言,下限值為每1莫耳的活性末端,較佳為1kg/h以上,更佳為3kg/h以上,再佳為5kg/h以上,亦可為7kg/h以上,亦可為10kg/h以上,亦可為15kg/h以上。The average feed rate of the conjugated diene compound (hereinafter, sometimes referred to as the "average diene feed rate"), from the viewpoint of increasing the content of the alicyclic skeleton (X), per 1 mole of active end , Preferably 150kg/h or less, more preferably 110kg/h or less, still more preferably 55kg/h or less, 45kg/h or less, 30kg/h or less, or 22kg/h or less. From the viewpoint of improving productivity, the lower limit is per 1 mole of active end, preferably 1 kg/h or more, more preferably 3 kg/h or more, still more preferably 5 kg/h or more, and may also be 7 kg/ h or more, may be 10kg/h or more, or 15kg/h or more.

在藉由上述方法進行聚合後,添加醇類、羧酸類、水等活性氫化合物而使聚合反應停止,藉此可獲得嵌段共聚物。After polymerization by the above method, active hydrogen compounds such as alcohols, carboxylic acids, and water are added to stop the polymerization reaction, thereby obtaining a block copolymer.

(氫化物) 將藉由上述的製造方法所得之嵌段共聚物作為氫化物之情形,在惰性有機溶媒中,在氫化觸媒的存在下進行氫化反應(hydrogenation reaction)。藉由氫化反應,嵌段共聚物中之來自聚合物嵌段(B)中的共軛二烯化合物之碳-碳雙鍵被氫化,可成為嵌段共聚物的氫化物。 氫化反應可將氫壓力設為0.1~20MPa左右,較佳為0.5~15MPa,更佳為0.5~5MPa,將反應溫度設為20~250℃左右,較佳為50~180℃,更佳為70~180℃,且將反應時間設為通常0.1~100小時左右,較佳為1~50小時而實施。 作為氫化觸媒,可列舉例如:雷氏鎳;使Pt、Pd、Ru、Rh、Ni等金屬負載於碳、氧化鋁、矽藻土等單體之非均相觸媒;包含過渡金屬化合物與烷基鋁化合物、烷基鋰化合物等的組合之戚格勒(Ziegler)系觸媒;茂金屬系觸媒等。(Hydride) When the block copolymer obtained by the above-mentioned production method is used as a hydrogenated product, a hydrogenation reaction is carried out in the presence of a hydrogenation catalyst in an inert organic solvent. Through the hydrogenation reaction, the carbon-carbon double bond derived from the conjugated diene compound in the polymer block (B) in the block copolymer is hydrogenated to become a hydrogenated product of the block copolymer. For the hydrogenation reaction, the hydrogen pressure can be set to about 0.1 to 20 MPa, preferably 0.5 to 15 MPa, more preferably 0.5 to 5 MPa, and the reaction temperature is set to about 20 to 250°C, preferably 50 to 180° C., more preferably 70 ~180°C, and the reaction time is usually about 0.1 to 100 hours, preferably 1 to 50 hours. Examples of hydrogenation catalysts include Reich's nickel; heterogeneous catalysts in which metals such as Pt, Pd, Ru, Rh, and Ni are supported on monomers such as carbon, alumina, and diatomaceous earth; and include transition metal compounds and Ziegler-based catalysts, metallocene-based catalysts, etc., which are combinations of alkyl aluminum compounds, alkyl lithium compounds, etc.

如此所得之氫化物可在藉由將聚合反應液注入甲醇等而使其凝固後使其加熱或減壓乾燥,或者是在施以將聚合反應液與蒸氣一起注入熱水中使其與溶媒共沸而去除之所謂蒸汽汽提後進行加熱或減壓乾燥,藉此而取得。The hydride obtained in this way can be coagulated by injecting the polymerization reaction liquid into methanol or the like, and then dried under heating or reduced pressure, or it can be mixed with the solvent by pouring the polymerization reaction liquid and steam into hot water. The so-called steam stripping, which is removed by boiling, is obtained by heating or drying under reduced pressure.

可因應在黏接著組成物的各種用途中所期望之性能而指定是否使用上述嵌段共聚物或氫化物。同樣地,可因應在黏接著組成物的各種用途中所期望之性能而指定將製成氫化物之際的上述聚合物嵌段(B)中的碳-碳雙鍵的氫化率設為何種程度。 例如,能製成氫化物的氫化率愈高則耐熱性、耐候性愈提升之氫化物。上述氫化率,例如可設為50莫耳%以上且99莫耳%以下、60莫耳%以上且99莫耳%以下、70莫耳%以上且99莫耳%以下、80莫耳%以上且99莫耳%以下。Whether to use the above-mentioned block copolymer or hydrogenated compound can be specified according to the desired performance in various applications of the adhesive composition. Similarly, the hydrogenation rate of the carbon-carbon double bond in the polymer block (B) when it is made into a hydrogenated product can be specified in accordance with the performance desired in the various applications of the adhesive composition. . For example, the higher the hydrogenation rate of the hydride, the higher the heat resistance and weather resistance. The hydrogenation rate can be set to, for example, 50 mol% or more and 99 mol% or less, 60 mol% or more and 99 mol% or less, 70 mol% or more and 99 mol% or less, 80 mol% or more, and Below 99 mol%.

因此,可為聚合物嵌段(B)的氫化率為0莫耳%以上(亦即,亦包含未氫化之情形)且小於50莫耳%之嵌段共聚物或其氫化物,又,亦可為聚合物嵌段(B)的氫化率為50~99莫耳%之氫化物。 此外,上述氫化率係將聚合物嵌段(B)中的來自共軛二烯化合物及脂環式骨架(X)之結構單元中的碳-碳雙鍵的含量藉由氫化後的1 H-NMR測定所求取的值,更詳細而言,係根據實施例所記載之方法所測定的值。Therefore, it can be a block copolymer or its hydrogenated product with a hydrogenation rate of the polymer block (B) of 0 mol% or more (that is, including the case where it is not hydrogenated) and less than 50 mol%, and also It can be a hydrogenated product with a hydrogenation rate of 50-99 mol% of the polymer block (B). In addition, the above-mentioned hydrogenation rate is based on the content of the carbon-carbon double bond in the structural unit derived from the conjugated diene compound and the alicyclic skeleton (X) in the polymer block (B) by 1 H- after hydrogenation. The value obtained by the NMR measurement is, more specifically, the value measured according to the method described in the examples.

(聚合物嵌段(A)與聚合物嵌段(B)的結合樣式) 嵌段共聚物只要聚合物嵌段(A)與聚合物嵌段(B)會結合,則不限定其結合形式,可為直鏈狀、分支狀、放射狀、或此等2個以上組合的結合樣式之任一者。其中,聚合物嵌段(A)與聚合物嵌段(B)的結合形式較佳為直鏈狀,作為其例,在以A表示聚合物嵌段(A)且以B表示聚合物嵌段(B)時,可列舉以A-B所示之二嵌段共聚物、以A-B-A或B-A-B所示之三嵌段共聚物、以A-B-A-B所示之四嵌段共聚物、以A-B-A-B-A或B-A-B-A-B所示之五嵌段共聚物、(A-B)nZ型共聚物(Z表示偶合劑殘基,n表示3以上的整數)等。其中,較佳為直鏈狀的三嵌段共聚物、或二嵌段共聚物,由柔軟性、製造的容易性等之觀點而言,較佳為使用A-B-A型的三嵌段共聚物。 作為A-B-A型的三嵌段共聚物,具體而言,可列舉苯乙烯-丁二烯/異戊二烯-苯乙烯共聚物。其中,黏接著組成物較佳為至少包含苯乙烯-氫化丁二烯/異戊二烯-苯乙烯共聚物作為嵌段共聚物的氫化物。(Combination style of polymer block (A) and polymer block (B)) The block copolymer is not limited as long as the polymer block (A) and the polymer block (B) can be combined. The combination can be linear, branched, radial, or a combination of two or more of these Combine any of the styles. Among them, the combination of the polymer block (A) and the polymer block (B) is preferably linear. As an example, A represents the polymer block (A) and B represents the polymer block. (B) In the case of (B), the diblock copolymer represented by AB, the triblock copolymer represented by ABA or BAB, the tetrablock copolymer represented by ABAB, the five represented by ABABA or BABAB Block copolymers, (AB) nZ type copolymers (Z represents a coupling agent residue, n represents an integer of 3 or more), and the like. Among them, a linear triblock copolymer or a diblock copolymer is preferred. From the viewpoints of flexibility and ease of production, it is preferred to use an A-B-A type triblock copolymer. As an A-B-A type triblock copolymer, specifically, styrene-butadiene/isoprene-styrene copolymer is mentioned. Among them, the adhesive composition is preferably a hydrogenated product containing at least a styrene-hydrogenated butadiene/isoprene-styrene copolymer as a block copolymer.

於此,在本說明書中,在同種的聚合物嵌段係隔著二官能的偶合劑等而結合成直線狀之情形,結合的聚合物嵌段全體被視作為一個聚合物嵌段。據此,亦包含上述例示,原本嚴格而言應被標記為Y-Z-Y(Z表示偶合殘基)的聚合物嵌段,除了特別需要與單獨的聚合物嵌段Y作區分之情形以外,整體被表示為Y。在本說明書中,因將包含偶合劑殘基之此種聚合物嵌段視為如上所述,故例如包含偶合劑殘基且嚴格而言應被標記為A-B-Z-B-A(Z表示偶合劑殘基)的嵌段共聚物係被標記為A-B-A,且被視作為三嵌段共聚物的一例。Herein, in this specification, when the same type of polymer blocks are combined linearly via a difunctional coupling agent or the like, the entire combined polymer blocks are regarded as one polymer block. Accordingly, including the above-mentioned examples, the polymer block that should be strictly labeled as YZY (Z represents the coupling residue), except for the case where it is particularly necessary to distinguish it from the separate polymer block Y, is represented as a whole Is Y. In this specification, since such a polymer block containing a coupling agent residue is considered as described above, for example, a polymer block containing a coupling agent residue and strictly speaking should be marked as ABZBA (Z represents a coupling agent residue) The block copolymer system is labeled ABA and is regarded as an example of a triblock copolymer.

(聚合物嵌段(A)及(B)的含量) 在嵌段共聚物中,只要不妨礙本發明目的及效果,則亦可含有由前述聚合嵌段(A)及(B)以外之其他單體所構成的聚合嵌段,但前述聚合物嵌段(A)及前述聚合物嵌段(B)的合計含量較佳為90質量%以上,更佳為95質量%以上,特佳為實質上為100質量%。只要為90質量%以上,則可製成制振性更優異及即使在高溫中亦容易抑制黏接著力的降低之黏接著組成物。(Content of polymer blocks (A) and (B)) In the block copolymer, as long as it does not interfere with the purpose and effects of the present invention, it may also contain a polymer block composed of other monomers other than the aforementioned polymer blocks (A) and (B), but the aforementioned polymer block The total content of (A) and the aforementioned polymer block (B) is preferably 90% by mass or more, more preferably 95% by mass or more, and particularly preferably substantially 100% by mass. As long as the content is 90% by mass or more, it is possible to produce an adhesive composition that is more excellent in damping properties and easily suppresses the decrease in adhesive force even at high temperatures.

(重量平均分子量) 嵌段共聚物及其氫化物之由凝膠滲透層析法所致之以標準聚苯乙烯換算所求取的重量平均分子量(Mw),較佳為15,000~800,000,更佳為50,000~700,000,再佳為60,000~600,000,又更佳為70,000~600,000,特佳為90,000~500,000,最佳為130,000~450,000。只要嵌段共聚物及其氫化物的重量平均分子量為15,000以上,則耐熱性變高,只要為800,000以下,則黏接著組成物的處理性變得良好。(Weight average molecular weight) The weight average molecular weight (Mw) of the block copolymer and its hydrogenated product obtained by gel permeation chromatography in terms of standard polystyrene is preferably 15,000~800,000, more preferably 50,000~700,000, More preferably, it is 60,000~600,000, more preferably 70,000~600,000, particularly preferably 90,000~500,000, and most preferably 130,000~450,000. If the weight average molecular weight of the block copolymer and its hydrogenated product is 15,000 or more, the heat resistance becomes high, and if it is 800,000 or less, the handleability of the adhesive composition becomes good.

[tanδ] (tanδ的峰頂溫度及強度) tanδ(損耗正切)係動態黏彈測定中之頻率1Hz的損耗模數/儲存模數之比,tanδ的峰頂溫度及強度係大大地有助於制振性、及其他物性。於此,所謂tanδ的峰頂強度,係指tanδ的峰成為最大時的tanδ的值。又,所謂tanδ的峰頂溫度,係指tanδ的峰成為最大時的溫度。[tanδ] (Peak top temperature and intensity of tanδ) Tanδ (loss tangent) is the ratio of loss modulus/storage modulus at a frequency of 1 Hz in dynamic viscoelastic measurement. The peak top temperature and strength of tanδ greatly contribute to vibration damping and other physical properties. Here, the peak top intensity of tanδ refers to the value of tanδ when the peak of tanδ becomes the maximum. In addition, the peak top temperature of tanδ refers to the temperature at which the peak of tanδ becomes the maximum.

本說明書中,嵌段共聚物或其氫化物的tanδ的峰頂溫度及強度係藉由將嵌段共聚物或其氫化物以溫度230℃、壓力10MPa加壓3分鐘,製作厚度1.0mm的單層片,將該單層片裁切成圓板形狀,將此作為試驗片而進行測定。測定條件係根據JIS K 7244-10(2005年),為應變量0.1%、頻率1Hz、測定溫度-70~100℃、升溫速度3℃/分鐘。 此外,嵌段共聚物或其氫化物的峰頂溫度及tanδ強度,更詳細而言,係根據實施例所記載之方法而測定之值。In this specification, the peak top temperature and strength of the tanδ of the block copolymer or its hydrogenated product are made by pressing the block copolymer or its hydrogenated product at a temperature of 230°C and a pressure of 10 MPa for 3 minutes to produce a unit with a thickness of 1.0 mm. For the layered piece, the single-layered piece was cut into a disc shape, and this was used as a test piece for measurement. The measurement conditions are based on JIS K 7244-10 (2005), with a strain amount of 0.1%, a frequency of 1 Hz, a measurement temperature of -70 to 100°C, and a heating rate of 3°C/min. In addition, the peak top temperature and tanδ intensity of the block copolymer or its hydrogenated product are, more specifically, values measured according to the method described in the examples.

嵌段共聚物或其氫化物藉由上述測定而能成為tanδ的峰頂強度為1.0以上。在更高者中,為1.5以上,再者亦有成為1.9以上者。tanδ的峰頂強度愈高,表示其溫度下之制振性等物性愈優異,若為1.0以上,則在實際使用環境下可獲得充分的制振性。 又,嵌段共聚物或其氫化物的tanδ的峰頂溫度較佳為-50℃以上,更佳為-40℃以上,再佳為-30℃以上,又更佳為-25℃以上,亦可為0℃以上。又,上述tanδ的峰頂溫度的上限,只要為不損及本發明效果的範圍即可,可為50℃以下,亦可為40℃以下,亦可為35℃以下。作為tanδ的峰頂溫度的範圍,例如,較佳為-50~50℃,更佳為-40~40℃,再佳為-30~30℃,又更佳為-25~25℃。只要上述tanδ的峰頂溫度為-50℃以上,則在實際使用環境下可獲得充分的制振性,若為50℃以下,則黏接著組成物可展現出所期望的接著性。The block copolymer or its hydrogenated product has a peak top intensity of 1.0 or more that can be tan δ by the above measurement. Among the higher ones, it is 1.5 or more, and some of them are 1.9 or more. The higher the peak top strength of tanδ, the better the physical properties such as vibration damping properties at temperature. If it is 1.0 or more, sufficient vibration damping properties can be obtained under actual use environments. In addition, the peak top temperature of the tanδ of the block copolymer or its hydrogenated product is preferably -50°C or higher, more preferably -40°C or higher, still more preferably -30°C or higher, and still more preferably -25°C or higher. It can be above 0°C. In addition, the upper limit of the peak top temperature of tanδ may be a range that does not impair the effects of the present invention, and may be 50°C or lower, 40°C or lower, or 35°C or lower. The range of the peak top temperature of tanδ is, for example, preferably -50 to 50°C, more preferably -40 to 40°C, still more preferably -30 to 30°C, and still more preferably -25 to 25°C. As long as the peak top temperature of tanδ is -50°C or higher, sufficient vibration damping properties can be obtained in an actual use environment, and if it is 50°C or lower, the adhesive composition can exhibit the desired adhesiveness.

(tanδ成為1.0以上的溫度區域的最大幅度) 又,嵌段共聚物或其氫化物存在由上述測定條件所測定之在-70~100℃中的tanδ成為1.0以上之連續的溫度區域,該溫度區域的最大幅度較佳為12℃以上,更佳為13℃以上,再佳為15℃以上,又更佳為17℃以上。 如同前述,在聚合物嵌段(B)的結構單元中,前述脂環式骨架(X)組入主鏈,藉由能進一步具有高的乙烯基鍵結量而分子運動變小,因此玻璃轉移溫度會上升,相對於溫度變化,玻璃轉移變得緩和。藉此,嵌段共聚物或其氫化物的tanδ顯示為1以上的溫度範圍變寬廣,變得能在寬廣的溫度範圍中顯示制振性。只要tanδ成為1.0以上的溫度區域的最大幅度為12℃以上,再者為13℃以上,則在實際使用環境下可獲得更優異的制振性。又,該溫度區域的最大幅度並無特別的上限值,但例如由生產性之觀點而言,上限值可為35℃,亦可為30℃,亦可為25℃。(tanδ becomes the maximum width of the temperature range above 1.0) In addition, the block copolymer or its hydrogenated product has a continuous temperature range in which the tanδ at -70 to 100°C measured by the above measurement conditions becomes 1.0 or more. The maximum width of the temperature range is preferably 12°C or more, and more It is preferably 13°C or higher, more preferably 15°C or higher, and still more preferably 17°C or higher. As mentioned above, in the structural unit of the polymer block (B), the aforementioned alicyclic skeleton (X) is incorporated into the main chain, and the molecular motion becomes smaller due to the higher vinyl bonding amount, so the glass transfer The temperature will rise, and the glass transition will be gentler with respect to the temperature change. Thereby, the temperature range in which the tanδ of the block copolymer or its hydrogenated product is 1 or more is widened, and it becomes possible to exhibit vibration damping properties in a wide temperature range. As long as the maximum width of the temperature range in which tanδ becomes 1.0 or more is 12°C or more, and furthermore, 13°C or more, more excellent vibration damping properties can be obtained in an actual use environment. In addition, there is no particular upper limit for the maximum width of the temperature range, but from the viewpoint of productivity, for example, the upper limit may be 35°C, 30°C, or 25°C.

[黏著賦予樹脂] 在黏接著組成物中,由提高處理性及黏接著力之觀點而言,可含有黏著賦予樹脂。 作為黏著賦予樹脂,可列舉例如:苯并呋喃-茚樹脂等苯并呋喃樹脂;對三級丁基酚-乙炔樹脂、酚-甲醛樹脂、萜烯-酚樹脂、聚萜烯樹脂、二甲苯-甲醛樹脂等酚系樹脂及萜烯系樹脂;芳香族系石油樹脂、脂肪族系石油樹脂、脂環式系石油樹脂、芳香族系石油樹脂、改質脂環式系石油樹脂等石油樹脂;以松香的新戊四醇酯及松香的甘油酯等所代表之松香酯、氫化松香、氫化松香的甲酯、聚合松香的新戊四醇酯、氫化松香酯、高熔點酯系樹脂、聚合松香、硬化松香、特殊松香酯等松香系樹脂等。其中,作為黏著賦予樹脂,可適合地使用脂環族飽和烴系樹脂。脂環族飽和烴系樹脂可列舉芳香族系石油樹脂經氫化者,亦可使用例如荒川化學工業股份有限公司製「ALCON」系列等市售品。此等黏著賦予樹脂可單獨使用,亦可併用二種以上。 又,由所得之黏接著組成物的殘膠減少、耐熱性和耐候性提升之觀點而言,以及在較佳的用途為避免密封劑等的著色之情形下,較佳為使用已氫化的黏著賦予樹脂。 上述黏著賦予樹脂的軟化點,較佳為85~160℃,更佳為90~150℃,再佳為95~145℃。只要黏著賦予樹脂的軟化點為85℃以上,則變得容易抑制在高溫(約60℃)的接著保持力的降低,只要為160℃以下,則黏接著組成物的處理性良好。[Adhesive Resin] The adhesive composition may contain an adhesion-imparting resin from the viewpoint of improving handleability and adhesive strength. Examples of the adhesion-imparting resin include: benzofuran resins such as coumarone-indene resin; p-tertiary butylphenol-acetylene resin, phenol-formaldehyde resin, terpene-phenol resin, polyterpene resin, xylene- Phenolic resins and terpene resins such as formaldehyde resins; petroleum resins such as aromatic petroleum resins, aliphatic petroleum resins, alicyclic petroleum resins, aromatic petroleum resins, and modified alicyclic petroleum resins; Rosin ester represented by neopentyl erythritol ester of rosin and glyceryl ester of rosin, hydrogenated rosin, methyl ester of hydrogenated rosin, neopentyl erythritol ester of polymerized rosin, hydrogenated rosin ester, high melting point ester resin, polymerized rosin, Rosin-based resins such as hardened rosin and special rosin esters. Among them, as the adhesion-imparting resin, an alicyclic saturated hydrocarbon-based resin can be suitably used. Examples of the alicyclic saturated hydrocarbon-based resin include hydrogenated aromatic petroleum resins, and commercial products such as the "ALCON" series manufactured by Arakawa Chemical Industry Co., Ltd. can also be used. These adhesion-imparting resins may be used alone or in combination of two or more kinds. In addition, from the viewpoints of reducing the residual glue of the resulting adhesive composition and improving the heat resistance and weather resistance, and in the case where the preferred use is to avoid the coloration of the sealant, etc., it is preferable to use a hydrogenated adhesive Give resin. The softening point of the adhesive imparting resin is preferably 85 to 160°C, more preferably 90 to 150°C, and still more preferably 95 to 145°C. As long as the softening point of the adhesion-imparting resin is 85°C or higher, it becomes easy to suppress the decrease in adhesive retention at high temperature (about 60°C), and as long as it is 160°C or lower, the handling properties of the adhesive composition are good.

[塑化劑] 在黏接著組成物中,由展現出柔軟性且變得容易賦予黏接著性之觀點而言,可含有塑化劑。 作為塑化劑,可列舉例如:石蠟系、環烷系、芳香族系的加工油;鄰苯二甲酸二辛酯、鄰苯二甲酸二丁酯等鄰苯二甲酸衍生物;白油;礦物油;乙烯與α-烯烴的液狀共寡聚物;液態石蠟;聚丁烯;低分子量聚異丁烯;液狀聚丁二烯、液狀聚異戊二烯、液狀聚異戊二烯/丁二烯共聚物、液狀苯乙烯/丁二烯共聚物、液狀苯乙烯/異戊二烯共聚物等液狀聚二烯及其氫化物等。其中,由與嵌段共聚物及其氫化物的相容性之觀點而言,較佳為石蠟系加工油;乙烯與α-烯烴的液狀共寡聚物;液態石蠟;低分子量聚異丁烯;以及此等的氫化物,更佳為石蠟系加工油的氫化物。此等塑化劑可單獨使用,亦可併用二種以上。[Plasticizer] The adhesive composition may contain a plasticizer from the viewpoint of exhibiting flexibility and making it easy to impart adhesiveness. Examples of plasticizers include: paraffin-based, naphthenic-based, and aromatic-based processing oils; phthalic acid derivatives such as dioctyl phthalate and dibutyl phthalate; white oil; minerals Oil; liquid co-oligomer of ethylene and α-olefin; liquid paraffin; polybutene; low molecular weight polyisobutylene; liquid polybutadiene, liquid polyisoprene, liquid polyisoprene/ Liquid polydienes such as butadiene copolymers, liquid styrene/butadiene copolymers, and liquid styrene/isoprene copolymers and their hydrogenated products. Among them, from the viewpoint of compatibility with block copolymers and their hydrogenated products, paraffin-based processing oils are preferred; liquid co-oligomers of ethylene and α-olefins; liquid paraffins; low molecular weight polyisobutylene; And these hydrides are more preferably hydrides of paraffin-based processing oils. These plasticizers may be used alone, or two or more types may be used in combination.

[填充劑] 在黏接著組成物中,因應各種用途中被要求的特性,可含有填充劑。 作為填充劑,可列舉例如:滑石、雲母、矽酸鈣、玻璃、玻璃薄片、玻璃珠粒、玻璃中空球、玻璃纖維、碳酸鈣、碳酸鎂、碳酸鋅、鹼性碳酸鎂、氫氧化鋁、氫氧化鎂、氫氧化鈣、硼酸鋅、碳鈉鋁石、多磷酸銨、鋁酸鈣、水滑石、矽石、矽石氧化鋁、矽藻土、矽灰石、沸石、水鋁石、鋁矽酸鈉、矽酸鎂、石墨烯、碳酸鋇、氮化矽、氮化鋁、氮化硼、鈦酸鉀、矽酸鋁(高嶺土、黏土、葉蠟石、皂土)、矽酸鎂(厄帖浦石)、硼酸鋁、硫酸鈣、硫酸鎂、氧化鋁、氧化鈦、氧化鐵、氧化鋅、氧化鎂、氧化錫、氧化銻、亞鐵酸鋇、亞鐵酸鍶、碳黑、奈米碳管、石墨、碳纖維、活性碳、碳中空球、鈦酸鈣、鋯鈦酸鉛、碳化矽等無機填料;木粉、澱粉等有機填料;有機顏料等。此等填充劑可單獨使用,亦可併用二種以上。[Filler] In the adhesive composition, fillers can be included in accordance with the characteristics required in various applications. Examples of fillers include talc, mica, calcium silicate, glass, glass flakes, glass beads, glass hollow spheres, glass fibers, calcium carbonate, magnesium carbonate, zinc carbonate, basic magnesium carbonate, aluminum hydroxide, Magnesium hydroxide, calcium hydroxide, zinc borate, dawsonite, ammonium polyphosphate, calcium aluminate, hydrotalcite, silica, silica alumina, diatomaceous earth, wollastonite, zeolite, diaspore, aluminum Sodium silicate, magnesium silicate, graphene, barium carbonate, silicon nitride, aluminum nitride, boron nitride, potassium titanate, aluminum silicate (kaolin, clay, pyrophyllite, bentonite), magnesium silicate ( Othepite), aluminum borate, calcium sulfate, magnesium sulfate, aluminum oxide, titanium oxide, iron oxide, zinc oxide, magnesium oxide, tin oxide, antimony oxide, barium ferrite, strontium ferrite, carbon black, naphthalene Rice carbon tube, graphite, carbon fiber, activated carbon, carbon hollow sphere, calcium titanate, lead zirconate titanate, silicon carbide and other inorganic fillers; wood flour, starch and other organic fillers; organic pigments, etc. These fillers may be used alone, or two or more of them may be used in combination.

[含量] 本實施形態中,黏接著組成物相對於嵌段共聚物或其氫化物100質量份包含選自1~1000質量份的黏著賦予樹脂及1~1000質量份的塑化劑之至少1種。黏著賦予樹脂及塑化劑係因應黏接著組成物的用途而可含有任一者或兩者。 若黏著賦予樹脂的上述含量小於1質量份,則無法將黏著賦予樹脂的性能賦予至黏接著組成物,若大於1000質量份,則有在低溫的黏接著力降低之虞。又,若塑化劑的上述含量小於1質量份,則無法將塑化劑的性能賦予至黏接著組成物,若大於1000質量份,則有在高溫的黏接著力降低之虞。[content] In this embodiment, the adhesive composition contains at least one selected from 1 to 1000 parts by mass of an adhesion-imparting resin and 1 to 1000 parts by mass of a plasticizer with respect to 100 parts by mass of the block copolymer or its hydrogenated product. The adhesion-imparting resin and the plasticizer may contain either or both according to the application of the adhesion composition. If the above-mentioned content of the adhesion-imparting resin is less than 1 part by mass, the performance of the adhesion-imparting resin cannot be imparted to the adhesive composition, and if it is more than 1000 parts by mass, the adhesive force at low temperatures may decrease. In addition, if the above-mentioned content of the plasticizer is less than 1 part by mass, the performance of the plasticizer cannot be imparted to the adhesive composition, and if it is more than 1000 parts by mass, the adhesive strength at high temperatures may decrease.

由即使在高溫亦容易維持黏接著力之觀點而言,相對於嵌段共聚物或其氫化物100質量份,黏著賦予樹脂的含量較佳為120~1000質量份。又,由易展現出黏接著組成物的良好處理性、容易維持更優異的黏接著力之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,黏著賦予樹脂的含量更佳為130質量份以上,再佳為140質量份以上。另一方面,由在低溫的黏接著力之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,黏著賦予樹脂的含量更佳為900質量份以下,再佳為700質量份以下,又再佳為400質量份以下。From the viewpoint of easy maintenance of adhesive force even at high temperatures, the content of the adhesion-imparting resin is preferably 120 to 1000 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product. In addition, from the viewpoints of easily exhibiting good handling properties of the adhesive composition and easily maintaining better adhesive force, the content of the adhesion-imparting resin is better than 100 parts by mass of the block copolymer or its hydrogenated product It is 130 parts by mass or more, more preferably 140 parts by mass or more. On the other hand, from the viewpoint of adhesion at low temperature, the content of the adhesion-imparting resin is more preferably 900 parts by mass or less, and more preferably 700 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product Hereinafter, it is more preferably 400 parts by mass or less.

由容易賦予柔軟性及黏接著性之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,塑化劑的含量較佳為60~1000質量份。又,由使黏接著組成物的處理性及柔軟性優異之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,塑化劑的含量更佳為70質量份以上,再佳為80質量份以上。另一方面,由適當的柔軟性與黏接著力之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,塑化劑的含量更佳為900質量份以下,再佳為700質量份以下,又再佳為400質量份以下。From the viewpoint of easily imparting flexibility and adhesiveness, the content of the plasticizer is preferably 60 to 1000 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product. In addition, from the viewpoint of excellent handling and flexibility of the adhesive composition, the content of the plasticizer is more preferably 70 parts by mass or more relative to 100 parts by mass of the block copolymer or its hydrogenated product, and even more preferably It is 80 parts by mass or more. On the other hand, from the viewpoint of proper flexibility and adhesion, the content of the plasticizer is more preferably 900 parts by mass or less, and more preferably 700 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product. Parts by mass or less, more preferably 400 parts by mass or less.

又,本實施形態中,黏接著組成物中之填充劑的含量,在不損及本發明效果的範圍中並未被特別限制,可因應黏接著組成物的用途而適當調整。 由適當地展現出黏接著組成物的柔軟性及制振性之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,填充劑的含量較佳為10~2500質量份。又,由使黏接著組成物的處理性及柔軟性優異之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,填充劑的含量更佳為15質量份以上,再佳為20質量份以上。另一方面,由優異的制振性與即使在高溫中亦容易維持黏接著性之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,填充劑的含量更佳為2400質量份以下,再佳為2200質量份以下。In addition, in this embodiment, the content of the filler in the adhesive composition is not particularly limited as long as the effect of the present invention is not impaired, and can be appropriately adjusted according to the application of the adhesive composition. From the viewpoint of appropriately exhibiting the flexibility and vibration damping properties of the adhesive composition, the content of the filler is preferably 10 to 2500 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product. In addition, from the viewpoint of excellent handling and flexibility of the adhesive composition, the content of the filler is more preferably 15 parts by mass or more with respect to 100 parts by mass of the block copolymer or its hydrogenated product, and still more preferably 20 parts by mass or more. On the other hand, from the viewpoint of excellent vibration damping properties and easy maintenance of adhesiveness even at high temperatures, the content of the filler is more preferably 2400 mass parts relative to 100 parts by mass of the block copolymer or its hydrogenated product. Parts or less, more preferably 2200 parts by mass or less.

黏接著組成物中之嵌段共聚物或其氫化物、選自黏著賦予樹脂及塑化劑之至少1種、以及填充劑的合計含量較佳為80質量%以上,更佳為85質量%以上,再佳為90質量%以上。The total content of the block copolymer or its hydrogenated product in the adhesive composition, at least one selected from adhesion-imparting resins and plasticizers, and fillers is preferably 80% by mass or more, more preferably 85% by mass or more , More preferably 90% by mass or more.

又,本實施形態中,各成分的含量可因應黏接著組成物的用途而指定較佳的範圍。以下揭示因應黏接著組成物的用途的含量之一例,但不受限於此。 (表面保護薄膜) 將黏接著組成物使用於包含黏著層的表面保護薄膜中之該黏著層之情形,相對於嵌段共聚物或其氫化物100質量份,黏著賦予樹脂的含量,由適當的黏接著力與殘膠少的平衡之觀點而言,較佳為1~100質量份,更佳為5~80質量份,再佳為10~70質量份。 又,同上之情形,由滲出抑制與黏接著力的平衡之觀點而言,相對於嵌段共聚物或其氫化物為100質量份,塑化劑的含量較佳為0~100質量份,更佳為0~90質量份,再佳為0~80質量份。In addition, in this embodiment, the content of each component can be specified in a preferable range according to the application of the adhesive composition. An example of the content corresponding to the application of the adhesive composition is disclosed below, but it is not limited to this. (Surface protection film) When the adhesive composition is used for the adhesive layer in the surface protection film containing the adhesive layer, relative to 100 parts by mass of the block copolymer or its hydrogenated product, the content of the adhesive imparting resin is determined by the appropriate adhesive force and residual From the viewpoint of the balance of less glue, it is preferably 1 to 100 parts by mass, more preferably 5 to 80 parts by mass, and still more preferably 10 to 70 parts by mass. In the same case, from the viewpoint of the balance between exudation suppression and adhesive force, the content of the plasticizer is preferably 0-100 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product, and more It is preferably 0 to 90 parts by mass, and more preferably 0 to 80 parts by mass.

(熱熔接著劑) 將黏接著組成物使用於熱熔接著劑之情形,相對於嵌段共聚物或其氫化物100質量份,黏著賦予樹脂的含量,由在常溫至高溫的黏接著力與在低溫的黏接著力的平衡之觀點而言,較佳為30~1000質量份,更佳為50~700質量份,再佳為100~500質量份。 又,同上之情形,由在低溫的黏接著力與在常溫至高溫的保持力的平衡之觀點而言,相對於嵌段共聚物或其氫化物100質量份,塑化劑的含量較佳為0~1000質量份,更佳為10~500質量份,再佳為25~300質量份。(Hot melt adhesive) When the adhesive composition is used in a hot melt adhesive, relative to 100 parts by mass of the block copolymer or its hydrogenated product, the content of the adhesive imparting resin varies from the adhesive force at room temperature to high temperature and the adhesive force at low temperature From the viewpoint of the balance of, it is preferably 30 to 1000 parts by mass, more preferably 50 to 700 parts by mass, and still more preferably 100 to 500 parts by mass. In the same situation as above, from the viewpoint of the balance of the adhesive force at low temperature and the holding force at room temperature to high temperature, the content of the plasticizer is preferably relative to 100 parts by mass of the block copolymer or its hydrogenated product 0~1000 parts by mass, more preferably 10~500 parts by mass, still more preferably 25~300 parts by mass.

[添加劑] 在黏接著組成物中,在不損及本發明效果的範圍中,可含有除了上述嵌段共聚物及其氫化物、黏著賦予樹脂、塑化劑、以及填充劑以外的各種添加劑。 作為添加劑,可列舉例如:交聯劑(異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合系交聯劑、吖𠰂系交聯劑、胺樹脂等)、熱穩定劑、光穩定劑、紫外線吸收劑、紅外線吸收劑、抗氧化劑、潤滑劑、著色劑、抗靜電劑、阻燃劑、撥水劑、防水劑、親水性賦予劑、導電性賦予劑、導熱性賦予劑、電磁波屏蔽性賦予劑、透光性調整劑、螢光劑、滑動性賦予劑、透明性賦予劑、防黏附劑(anti-blocking agent)、金屬惰性化劑、防菌劑、結晶成核劑、龜裂防止劑、臭氧劣化防止劑、防鼠劑、分散劑、增黏劑、耐光劑、耐候劑、銅害防止劑、補強劑、防霉劑、大環狀分子(環糊精、杯芳烴、葫蘆脲(cucurbituril)等)、烯烴樹脂、烯烴樹脂以外的樹脂。 作為烯烴樹脂,可列舉例如:高密度聚乙烯、中密度聚乙烯、低密度聚乙烯、直鏈低密度聚乙烯等聚乙烯;均聚聚丙烯、嵌段聚丙烯、隨機聚丙烯等聚丙烯;α-烯烴的單獨聚合物或共聚物;丙烯及/或乙烯與α-烯烴的共聚物等。作為上述α-烯烴,可列舉例如:1-丁烯、1-戊烯、3-甲基-1-丁烯、1-己烯、3-甲基-1-戊烯、4-甲基-1-戊烯、1-庚烯、1-辛烯、1-壬烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯等碳數20以下的α-烯烴,此等可使用一種或二種以上。又,亦可使用藉由順丁烯二酸等使此等烯烴樹脂進行改質之改質烯烴樹脂。 作為烯烴樹脂以外的樹脂,可列舉:聚異戊二烯、聚丁二烯、乙烯-丙烯-二烯共聚物硫化物、苯乙烯-丁二烯橡膠、苯乙烯-異戊二烯橡膠、腈橡膠、丁基橡膠、天然橡膠、乙烯-乙酸乙烯酯共聚物、乙烯-(甲基)丙烯酸酯共聚物、乙烯-(甲基)丙烯酸乙酯共聚物、乙烯-(甲基)丙烯酸共聚物、乙烯-(甲基)丙烯酸共聚物的金屬離子交聯樹脂(離子聚合物)、聚苯乙烯、AS樹脂、ABS樹脂等苯乙烯系樹脂、聚伸苯醚系樹脂、耐綸6、耐綸66等聚醯胺樹脂、聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯等聚酯系樹脂、聚胺基甲酸酯系樹脂、聚甲醛均聚物、聚甲醛共聚物等縮醛系樹脂、聚甲基丙烯酸甲酯系樹脂等丙烯酸系樹脂、聚氯乙烯、氯乙烯-乙酸乙烯酯共聚物、乙烯-氯乙烯-乙酸乙烯酯共聚物等。 在不損及本發明效果的範圍內可含有上述添加劑。另一方面,由最大限度享受本發明效果之觀點而言,在黏接著組成物中,上述添加劑的含量較佳為10質量%以下,更佳為5質量%以下,再佳為2質量%以下。只要添加劑的含量為10質量%以下,則被認為幾乎不對後述tanδ強度的表現造成影響。 黏接著組成物中之嵌段共聚物或其氫化物、選自黏著賦予樹脂及塑化劑之至少1種、以及填充劑的合計含量較佳為80質量%以上,更佳為85質量%以上,再佳為90質量%以上,亦可為95質量%以上,亦可為98質量%以上。[additive] The adhesive composition may contain various additives other than the above-mentioned block copolymer and its hydrogenated product, adhesion-imparting resin, plasticizer, and filler within a range that does not impair the effects of the present invention. Examples of additives include cross-linking agents (isocyanate-based cross-linking agents, epoxy-based cross-linking agents, metal chelate-based cross-linking agents, acridine-based cross-linking agents, amine resins, etc.), heat stabilizers, and light stabilizers. Agent, ultraviolet absorber, infrared absorber, antioxidant, lubricant, coloring agent, antistatic agent, flame retardant, water repellent, water repellent, hydrophilicity imparting agent, conductivity imparting agent, thermal conductivity imparting agent, electromagnetic wave Barrier property imparting agent, light transmittance modifier, fluorescent agent, slip property imparting agent, transparency imparting agent, anti-blocking agent, metal inertizer, antibacterial agent, crystal nucleating agent, tortoise Cracking inhibitors, ozone deterioration inhibitors, rodent inhibitors, dispersants, tackifiers, lightfast agents, weathering agents, copper damage inhibitors, reinforcing agents, antifungal agents, macrocyclic molecules (cyclodextrin, calixarene, Cucurbituril (cucurbituril, etc.), olefin resins, and resins other than olefin resins. Examples of olefin resins include polyethylenes such as high-density polyethylene, medium-density polyethylene, low-density polyethylene, and linear low-density polyethylene; polypropylenes such as homopolypropylene, block polypropylene, and random polypropylene; Single polymer or copolymer of α-olefin; propylene and/or copolymer of ethylene and α-olefin, etc. As the above-mentioned α-olefins, for example, 1-butene, 1-pentene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4-methyl- 1-pentene, 1-heptene, 1-octene, 1-nonene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1 -Eicosene and other α-olefins with a carbon number of 20 or less. One or two or more of these can be used. In addition, modified olefin resins in which these olefin resins are modified by maleic acid or the like can also be used. Examples of resins other than olefin resins include polyisoprene, polybutadiene, ethylene-propylene-diene copolymer sulfide, styrene-butadiene rubber, styrene-isoprene rubber, and nitrile Rubber, butyl rubber, natural rubber, ethylene-vinyl acetate copolymer, ethylene-(meth)acrylate copolymer, ethylene-ethyl(meth)acrylate copolymer, ethylene-(meth)acrylic acid copolymer, Metal ion cross-linked resins of ethylene-(meth)acrylic acid copolymers (ionomers), polystyrene, AS resins, ABS resins and other styrene resins, polyphenylene ether resins, nylon 6, nylon 66 Polyamide resins, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyurethane resins, polyoxymethylene homopolymers, polyoxymethylene copolymers, etc. Acrylic resins such as aldehyde resins and polymethyl methacrylate resins, polyvinyl chloride, vinyl chloride-vinyl acetate copolymers, ethylene-vinyl chloride-vinyl acetate copolymers, and the like. The above-mentioned additives may be contained within a range that does not impair the effects of the present invention. On the other hand, from the viewpoint of maximizing the effect of the present invention, in the adhesive composition, the content of the additives is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 2% by mass or less . As long as the content of the additive is 10% by mass or less, it is considered that it hardly affects the performance of the tanδ strength described later. The total content of the block copolymer or its hydrogenated product in the adhesive composition, at least one selected from adhesion-imparting resins and plasticizers, and fillers is preferably 80% by mass or more, more preferably 85% by mass or more It is more preferably 90% by mass or more, 95% by mass or more, or 98% by mass or more.

[黏接著組成物的調製方法] 黏接著組成物的調製方法未被特別限制,例如可使用混練裝置進行調製。作為混練裝置,可採用在本領域中一般使用的方法。只要將各成分例如使用亨歇爾混合機、V型摻合機、帶式摻合機、滾筒摻合機、錐形摻合機等混合機進行混合,或者在其混合後,藉由單軸或雙軸擠壓機、捏合機等而進行混練即可。熔融混練時的溫度可適當設定,但通常為150~300℃,較佳為160~250℃。 所得之黏接著組成物可因應用途、使用態樣等而製成適當形態,例如可為粒狀、小片狀、顆粒(pellet)狀。 又,黏接著組成物可在將各成分溶解於各種有機溶媒並混合後,藉由乾燥等將該有機溶媒去除而進行調製。作為有機溶媒,可列舉:乙酸乙酯、乙酸丁酯、甲基乙基酮、甲基異丁基酮、甲醇、乙醇、異丙醇、三級丁醇、二級丁醇、丙酮、乙醯基丙酮、環己酮、庚烷、異戊烷、正己烷、環己烷等脂肪族溶劑、苯、甲苯、乙基苯等芳香族溶劑等。[Preparation method of adhesive composition] The preparation method of the adhesive composition is not particularly limited, and for example, it can be prepared using a kneading device. As the kneading device, a method generally used in this field can be used. As long as the ingredients are mixed using a mixer such as a Henschel mixer, V-blender, belt blender, drum blender, cone blender, etc., or after they are mixed, use a single shaft Or a twin-screw extruder, kneader, etc. may be kneaded. The temperature during melt kneading can be appropriately set, but is usually 150 to 300°C, preferably 160 to 250°C. The resulting adhesive composition can be made into an appropriate form depending on the application, usage, etc., for example, it can be in the form of granules, flakes, or pellets. In addition, the adhesive composition can be prepared by dissolving and mixing each component in various organic solvents, and then removing the organic solvent by drying or the like. Examples of organic solvents include ethyl acetate, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropanol, tertiary butanol, secondary butanol, acetone, and acetone. Aliphatic solvents such as acetone, cyclohexanone, heptane, isopentane, n-hexane, and cyclohexane, aromatic solvents such as benzene, toluene, and ethylbenzene.

≪黏接著組成物的物性≫ [tanδ強度] 上述的嵌段共聚物或其氫化物可顯示優異的制振性。因此,含有嵌段共聚物或其氫化物的黏接著組成物,亦有其tanδ的峰頂強度較佳為1.0以上,更佳為2.0以上,再佳為2.6以上者。黏接著組成物的峰頂溫度較佳為-10℃以上,更佳為0℃以上。黏接著組成物的峰頂溫度的上限,只要為不損及本發明效果的範圍即可,可為50℃以下,亦可為40℃以下。 又,黏接著組成物在23℃的溫度中之tanδ強度,較佳能成為0.15以上,更佳能成為0.30以上,再佳能成為0.50以上。黏接著組成物在40℃的溫度中之tanδ強度,較佳能成為0.05以上,更佳能成為0.10以上,再佳能成為0.15以上。黏接著組成物在60℃的溫度中之tanδ強度,較佳能成為0.05以上,更佳能成為0.10以上,再佳能成為0.15以上。≪Physical properties of adhesive composition≫ [tanδ intensity] The above-mentioned block copolymer or its hydrogenated product can exhibit excellent vibration damping properties. Therefore, the adhesive composition containing the block copolymer or its hydrogenated product also has a peak top strength of tanδ of preferably 1.0 or more, more preferably 2.0 or more, and still more preferably 2.6 or more. The peak top temperature of the adhesive composition is preferably -10°C or higher, more preferably 0°C or higher. The upper limit of the peak top temperature of the adhesive composition may be in a range that does not impair the effects of the present invention, and may be 50°C or lower, or 40°C or lower. In addition, the tanδ strength of the adhesive composition at a temperature of 23° C. is preferably 0.15 or more, more preferably 0.30 or more, and still more preferably 0.50 or more. The tanδ strength of the adhesive composition at a temperature of 40°C is preferably 0.05 or more, more preferably 0.10 or more, and still more preferably 0.15 or more. The tanδ strength of the adhesive composition at a temperature of 60°C is preferably 0.05 or more, more preferably 0.10 or more, and still more preferably 0.15 or more.

[儲存模數] 本實施形態中,在23℃的剪切儲存模數G’(23℃)相對於剪切儲存模數G’(60℃)之比[G’(23℃)/G’(60℃)],較佳為1.3以上。 本實施形態中,黏接著組成物係藉由包含上述的嵌段共聚物或其氫化物,而上述儲存模數的比[G’(23℃)/G’(60℃)]變得容易達到1.3以上。一般而言,黏接著力在變得愈高溫時會愈降低,但本實施形態中,只要該儲存模數的比[G’(23℃)/G’(60℃)]為1.3以上,則從23℃至60℃的剝離強度的降低程度會變小,成為即使在高溫亦不易剝落之傾向。 在本實施形態中,上述儲存模數的比[G’(23℃)/G’(60℃)]係藉由調整黏接著組成物(上述的嵌段共聚物或其氫化物、上述的黏接著樹脂、上述的塑化劑、及上述的填充劑及任意成分的種類及含量)等,而亦能成為1.5以上,甚至1.7以上。 此外,剪切儲存模數,更詳細而言,係根據實施例所記載之方法而測定之值。[Storage Modulus] In this embodiment, the ratio of the shear storage modulus G'(23°C) at 23°C to the shear storage modulus G'(60°C) [G'(23°C)/G'(60°C)] , Preferably 1.3 or more. In this embodiment, the adhesive composition contains the above-mentioned block copolymer or its hydrogenated product, and the above-mentioned storage modulus ratio [G'(23℃)/G'(60℃)] becomes easy to achieve 1.3 and above. Generally speaking, the adhesive force decreases as the temperature becomes higher, but in this embodiment, as long as the storage modulus ratio [G'(23°C)/G'(60°C)] is 1.3 or more, then The degree of decrease in peel strength from 23°C to 60°C becomes smaller, and it tends to be less likely to peel even at high temperatures. In this embodiment, the ratio of the storage modulus [G'(23°C)/G'(60°C)] is adjusted by adjusting the adhesive composition (the above-mentioned block copolymer or its hydrogenated product, the above-mentioned viscosity Then the resin, the above-mentioned plasticizer, and the above-mentioned filler and the type and content of optional components), etc., can also be 1.5 or more, or even 1.7 or more. In addition, the shear storage modulus, in more detail, is a value measured according to the method described in the examples.

[剝離強度] 在本實施形態中,黏接著組成物的剝離強度係將丙烯酸樹脂板作為被接著體,根據JIS Z 0237(2009年)所測定之180度剝離強度在測定溫度23℃中較佳可成為10.0N/25mm以上,更佳可成為15.0N/25mm以上,再佳可成為20.0N/25.0mm以上,又更佳可成為25.0N/25.0mm以上。又,同條件中之剝離強度,在測定溫度60℃中較佳可成為5.0N/25mm以上,更佳可成為8.0N/25mm以上,再佳可成為11.0N/25mm以上,又再佳可成為12.0N/25mm以上,特佳可成為14.0N/25mm以上。一般而言,黏著力在變得愈高溫時會愈降低,但本實施形態中,藉由包含上述的嵌段共聚物或其氫化物,將其含量調整成較佳的範圍等,而變得容易達成上述黏著力。 又,在本實施形態中,黏接著組成物在60℃的上述剝離強度相對於在23℃的上述剝離強度之比亦能為0.2以上,甚至0.3以上,甚至0.4以上。該剝離強度的比,藉由調整黏接著組成物的組成(上述的嵌段共聚物或其氫化物、上述的黏接著樹脂、上述的塑化劑、及上述的填充劑及任意成分的種類及含量)等而變得容易達成。 此外,剝離強度,更詳細而言,係根據實施例所記載之方法而測定之值。[Peel strength] In this embodiment, the peel strength of the adhesive composition is based on the acrylic resin plate as the adherend. The 180° peel strength measured in accordance with JIS Z 0237 (2009) is preferably 10.0N at a measurement temperature of 23°C. /25mm or more, more preferably 15.0N/25mm or more, even more preferably 20.0N/25.0mm or more, and even more preferably 25.0N/25.0mm or more. In addition, the peel strength under the same conditions is preferably 5.0N/25mm or more at a measurement temperature of 60°C, more preferably 8.0N/25mm or more, even more preferably 11.0N/25mm or more, and even more preferably 12.0N/25mm or more, especially preferably 14.0N/25mm or more. Generally speaking, the adhesive force decreases as the temperature becomes higher. However, in this embodiment, by including the above-mentioned block copolymer or its hydrogenated product and adjusting its content to a preferable range, it becomes It is easy to achieve the above-mentioned adhesion. Furthermore, in this embodiment, the ratio of the peel strength at 60°C to the peel strength at 23°C of the adhesive composition can also be 0.2 or more, even 0.3 or more, or even 0.4 or more. The ratio of the peel strength is adjusted by adjusting the composition of the adhesive composition (the above-mentioned block copolymer or its hydrogenated product, the above-mentioned adhesive resin, the above-mentioned plasticizer, and the above-mentioned filler and optional component types and Content) and so on. In addition, the peel strength, in more detail, is a value measured according to the method described in the examples.

≪用途≫ 可製成包含上述的黏接著組成物的黏接著劑。 黏接著劑例如亦可進行加熱熔融而使用。又,黏接著劑例如可使用各種有機溶媒,以固體成分濃度成為約5~70質量%之方式使其溶解,作為溶液狀的黏接著劑而使用。作為有機溶媒,可列舉:乙酸乙酯、乙酸丁酯、甲基乙基酮、甲基異丁基酮、甲醇、乙醇、異丙醇、三級丁醇、二級丁醇、丙酮、乙醯基丙酮、環己酮、庚烷、異戊烷、正己烷、環己烷等脂肪族溶劑、苯、甲苯、乙基苯等芳香族溶劑等。 又,可作為包含黏接著組成物的熱熔接著劑而使用,例如包含嵌段共聚物或其氫化物、黏著賦予樹脂、再者因應需要而包含塑化劑之黏接著組成物係適於熱熔接著劑。≪Use≫ It can be made into an adhesive containing the above-mentioned adhesive composition. The adhesive can also be used by heating and melting, for example. In addition, for the adhesive, various organic solvents can be used, for example, the solid content concentration may be about 5 to 70% by mass, and the adhesive can be dissolved and used as a solution adhesive. Examples of organic solvents include ethyl acetate, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone, methanol, ethanol, isopropanol, tertiary butanol, secondary butanol, acetone, and acetone. Aliphatic solvents such as acetone, cyclohexanone, heptane, isopentane, n-hexane, and cyclohexane, aromatic solvents such as benzene, toluene, and ethylbenzene. In addition, it can be used as a hot melt adhesive containing an adhesive composition, such as a block copolymer or its hydrogenated product, an adhesion-imparting resin, and an adhesive composition containing a plasticizer as needed. Fusion agent.

[密封劑] 可製成包含上述的黏接著組成物的密封劑。 可將上述的黏接著組成物直接作為密封劑,但在不損及本發明效果的範圍內,亦可因應需要進行交聯。進行交聯之情形,可使用自由基產生劑、硫或硫化合物等交聯劑。再者,在使用硫或硫化合物進行交聯之情形,亦可因應需要使用硫化促進劑作為交聯助劑。[Sealants] It can be made into a sealant containing the above-mentioned adhesive composition. The above-mentioned adhesive composition can be directly used as a sealant, but it can also be cross-linked as needed within a range that does not impair the effect of the present invention. In the case of cross-linking, a cross-linking agent such as a radical generator, sulfur, or a sulfur compound can be used. Furthermore, in the case of using sulfur or a sulfur compound for cross-linking, a vulcanization accelerator can also be used as a cross-linking aid as needed.

作為自由基產生劑,可列舉例如:三級丁基氫過氧化物、異丙苯氫過氧化物、2,5-二甲基己烷-2,5-二氫過氧化物等氫過氧化物;二-三級丁基過氧化物、三級丁基

Figure 109117127-A0304-12-03
基過氧化物、二
Figure 109117127-A0304-12-03
基過氧化物、α,α’-雙(三級丁基過氧基)-對二異丙基苯、2,5-二甲基-2,5-二(三級丁基過氧基)己烷、2,5-二甲基-2,5-二(三級丁基過氧基)-己炔-3等二烷基過氧化物;乙醯基過氧化物、丁二酸過氧化物、苯甲醯基過氧化物等二醯基過氧化物;三級丁基過氧基乙酸酯、三級丁基過氧基異丁酸酯、三級丁基過氧基異丙基碳酸酯等過氧化酯、甲基乙基酮過氧化物、環己酮過氧化物等過氧化酮等之有機過氧化物;過氧化氫、過硫酸鹽、金屬氧化物等無機過氧化物、偶氮化合物、一及二硫化物、金屬螯合劑、氧化還原起始劑等。使用此等自由基產生劑之情形,相對於嵌段共聚物或其氫化物100質量份,較佳為在0.01~15質量份,更佳為在0.05~10質量份的範圍內使用。Examples of radical generators include hydroperoxides such as tertiary butyl hydroperoxide, cumene hydroperoxide, and 2,5-dimethylhexane-2,5-dihydroperoxide. Substances; di-tertiary butyl peroxide, tertiary butyl
Figure 109117127-A0304-12-03
Base peroxide, two
Figure 109117127-A0304-12-03
Peroxide, α,α'-bis(tertiary butylperoxy)-p-diisopropylbenzene, 2,5-dimethyl-2,5-bis(tertiary butylperoxy) Dialkyl peroxides such as hexane, 2,5-dimethyl-2,5-di(tertiary butylperoxy)-hexyne-3; Acetyl peroxide, succinic acid peroxide Diethyl peroxides such as benzyl peroxide; tertiary butyl peroxy acetate, tertiary butyl peroxy isobutyrate, tertiary butyl peroxy isopropyl Carbonate and other peroxy esters, methyl ethyl ketone peroxide, cyclohexanone peroxide and other ketone peroxides and other organic peroxides; hydrogen peroxide, persulfate, metal oxides and other inorganic peroxides, Azo compounds, mono- and disulfides, metal chelating agents, redox initiators, etc. When using these radical generators, it is preferably 0.01-15 parts by mass, more preferably 0.05-10 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product.

作為硫化合物,可列舉例如一氯化硫、二氯化硫等。 使用硫或硫化合物之情形,黏接著組成物中之硫或硫化合物的含量,相對於嵌段共聚物或其氫化物100質量份,較佳為0.1~20質量份,更佳為0.2~10質量份。As a sulfur compound, sulfur monochloride, sulfur dichloride, etc. are mentioned, for example. When sulfur or sulfur compounds are used, the content of sulfur or sulfur compounds in the adhesive composition is preferably 0.1-20 parts by mass, more preferably 0.2-10 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product Mass parts.

作為硫化促進劑,可列舉例如:N,N-二異丙基-2-苯并噻唑-次磺醯胺、2-巰基苯并噻唑、2-(4-

Figure 109117127-A0304-12-02
啉基二硫代)苯并噻唑等噻唑類;二苯基胍、三苯基胍等胍類;丁基醛-苯胺反應物、六亞甲基四胺-乙醛反應物等醛-胺系反應物或醛-氨系反應物、2-巰基咪唑啉等咪唑啉類;二苯硫脲、二乙基脲、二丁基硫脲、三甲基硫脲、二鄰甲苯基硫脲等硫脲類;四甲基秋蘭姆一硫化物、四甲基秋蘭姆二硫化物、五亞甲基秋蘭姆四硫化物等秋蘭姆(thiuram)一或多硫化物類;二甲基二硫胺甲酸鋅、乙基苯基二硫胺甲酸鋅、二甲基二硫胺甲酸鈉、二甲基二硫胺甲酸硒、二乙基二硫胺甲酸碲等二硫胺甲酸鹽類;二丁基黃原酸鋅等黃原酸鹽類、有機過氧化物、鋅華等。此等硫化促進劑可為一種,亦可併用二種以上。併用硫化促進劑之情形,其添加量,相對於嵌段共聚物或其氫化物100質量份,較佳為0.05~30質量份,更佳為0.1~20質量份,再佳為0.2~10質量份。As the vulcanization accelerator, for example, N,N-diisopropyl-2-benzothiazole-sulfenamide, 2-mercaptobenzothiazole, 2-(4-
Figure 109117127-A0304-12-02
Linyl dithio) thiazoles such as benzothiazole; Guanidines such as diphenylguanidine and triphenylguanidine; Aldehyde-amine systems such as butylaldehyde-aniline reactant, hexamethylenetetramine-acetaldehyde reactant Reactants or aldehyde-ammonia reactants, 2-mercaptoimidazoline and other imidazolines; diphenyl thiourea, diethyl urea, dibutyl thiourea, trimethyl thiourea, di-o-tolyl thiourea and other sulfur Urea; thiuram mono- or polysulfide such as tetramethylthiuram monosulfide, tetramethylthiuram disulfide, pentamethylenethiuram tetrasulfide, etc.; dimethyl Dithiocarbamates such as zinc dithiocarbamate, zinc ethyl phenyl dithiocarbamate, sodium dimethyl dithiocarbamate, selenium dimethyl dithiocarbamate, and tellurium diethyl dithiocarbamate; two Xanthogenates such as zinc butyl xanthogenate, organic peroxides, zinc blooms, etc. These vulcanization accelerators may be one type, or two or more types may be used in combination. When a vulcanization accelerator is used in combination, the amount added is preferably 0.05 to 30 parts by mass, more preferably 0.1 to 20 parts by mass, and still more preferably 0.2 to 10 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product Copies.

又,作為密封劑之情形,黏接著組成物較佳為包含選自上述的填充劑及添加劑之至少1種。 作為密封劑之情形,由制振性之觀點而言,較佳為使用填充劑。作為上述填充劑,可列舉例如:碳酸鈣、滑石、碳黑、氧化鈦、矽石、黏土、硫酸鋇、碳酸鎂、玻璃纖維、碳纖維。 含有填充劑並作為密封劑之情形,黏接著組成物中之填充劑的含量,相對於嵌段共聚物或其氫化物100質量份,較佳為10~200質量份,更佳為10~150質量份。 又,添加劑之中,由使密封劑的流動性提升且同時抑制熱劣化之觀點而言,較佳為使用潤滑劑。作為潤滑劑,可列舉例如:矽油;石蠟、微晶蠟、聚乙烯蠟等烴系潤滑劑;硬脂酸丁酯、硬脂酸單甘油酯、新戊四醇四硬脂酸酯、硬脂酸硬脂酯。 含有潤滑劑並作為密封劑之情形,黏接著組成物中之潤滑劑的含量,相對於嵌段共聚物或其氫化物100質量份,較佳為1~20質量份,更佳為1~15質量份。In the case of a sealant, the adhesive composition preferably contains at least one selected from the above-mentioned fillers and additives. In the case of a sealant, it is preferable to use a filler from the viewpoint of vibration damping properties. Examples of the above-mentioned filler include calcium carbonate, talc, carbon black, titanium oxide, silica, clay, barium sulfate, magnesium carbonate, glass fiber, and carbon fiber. In the case of containing a filler and used as a sealant, the content of the filler in the adhesive composition is preferably 10 to 200 parts by mass, and more preferably 10 to 150, relative to 100 parts by mass of the block copolymer or its hydrogenated product Mass parts. Among the additives, it is preferable to use a lubricant from the viewpoint of improving the fluidity of the sealant while suppressing thermal degradation. Examples of lubricants include: silicone oil; hydrocarbon lubricants such as paraffin wax, microcrystalline wax, and polyethylene wax; butyl stearate, stearic acid monoglyceride, neopentyl erythritol tetrastearate, and stearin. Stearyl acid. In the case of containing a lubricant and acting as a sealant, the content of the lubricant in the adhesive composition is preferably 1-20 parts by mass, more preferably 1-15 parts by mass relative to 100 parts by mass of the block copolymer or its hydrogenated product Mass parts.

[其他] 本實施態樣中,包含黏接著組成物的黏接著劑及熱熔接著劑可使用於各種用途。 黏接著劑及熱熔接著劑,可列舉例如: 在一次性尿布、大人用失禁產品、衛生棉、床墊、繃帶、外科手術單(surgical drape)、單面膠帶、雙面膠帶、轉印膠帶、標籤、塑膠片、不織布片、紙片、紙板、書籍、過濾器或具備包裝的物品中的使用; 在墊片密封劑(尤其,汽車、電機零件、技術照明領域)中的使用; 在多層薄膜的可再密封之托盤的製造中的使用; 在包含郵寄容器素材的物品中的使用; 在防振材料、緩衝材料、衝擊吸收材料、低反彈材料、防墜材料、免震材料、防震材料、或制振材料(較佳為消音材料,更佳為汽車產業中的衰減或消音墊、襯墊、片材及膠帶)中的使用; 在電子裝置(尤其,LCD顯示器、LED顯示器、觸控螢幕、或可撓性薄膜太陽能電池)中的使用; 在經皮性藥物傳遞系統中的使用; 在導管(較佳為冷卻線圈)、電子零件(較佳為發光零件、電腦設備、手機、平板電腦、觸控螢幕、汽車技術高傳真系統、及聲頻系統)、太陽熱加熱的熱管與水箱之間的結合部、燃料電池及風力機、電腦晶片的製造、光學裝置、電池、機殼、冷卻器、熱交換裝置、電線、纜線、電熱線、冰箱、洗碗機、空調設備、蓄電池、變壓器、雷射設備、功能性衣物、車座位、醫療用設備、防火裝置、電動機、飛機、及列車中之使用; 在3D印刷材料的長絲、用於密封發熱裝置的注封用密封劑或成形密封劑中的使用; 將具有由木材、金屬、聚合物塑膠、玻璃及紡織品所形成之基材的物品進行接合之用途上的使用;給水塔中之對外面的接合之用途上的使用;作為在鞋類的製造中或窗的製造中之釉料的使用、在門及建築板的製造中或可攜式裝置及顯示器的製造中的使用; 在裝訂、木材接著、平面層壓、可撓性包裝、包覆貼合(profile wrapping)、封邊、紡織品層壓、低壓成形、及鞋子中的使用; 在書籍、包裝薄膜、剛性面板、家具、窗、鞋類、汽車前照燈、汽車飾件或用於衣物之經接合布料/織物的製造中的使用; 在裝飾薄膜中的使用。 [實施例][other] In this embodiment, the adhesive and hot melt adhesive including the adhesive composition can be used for various purposes. Adhesives and hot melt adhesives, for example: Used in disposable diapers, adult incontinence products, sanitary napkins, mattresses, bandages, surgical drape (surgical drape), single-sided tape, double-sided tape, transfer tape, labels, plastic sheets, non-woven sheets, paper sheets, cardboard, Use in books, filters or articles with packaging; Use in gasket sealants (especially in the fields of automobiles, motor parts, and technical lighting); Use in the manufacture of multi-layer film resealable trays; Use in articles containing materials for mailing containers; In anti-vibration materials, cushioning materials, shock-absorbing materials, low-rebound materials, anti-falling materials, shock-proof materials, shock-proof materials, or vibration-damping materials (preferably sound-absorbing materials, more preferably attenuating or sound-absorbing mats in the automotive industry, Liner, sheet and tape); Use in electronic devices (especially LCD displays, LED displays, touch screens, or flexible thin-film solar cells); Use in transdermal drug delivery systems; Between conduits (preferably cooling coils), electronic parts (preferably light-emitting parts, computer equipment, mobile phones, tablets, touch screens, automotive technology high-fidelity systems, and audio systems), solar heating heat pipes and water tanks Combinations of fuel cells and wind turbines, computer chip manufacturing, optical devices, batteries, cabinets, coolers, heat exchange devices, wires, cables, heating wires, refrigerators, dishwashers, air-conditioning equipment, batteries, transformers , Laser equipment, functional clothing, car seats, medical equipment, fire protection devices, electric motors, airplanes, and trains; Use in filaments of 3D printing materials, sealants or molding sealants for sealing heating devices; The use of joining objects with substrates formed of wood, metal, polymer plastic, glass and textiles; the use of joining to the outside in the water supply tower; as in the manufacture of footwear Or use of glaze in the manufacture of windows, in the manufacture of doors and building panels, or in the manufacture of portable devices and displays; Used in binding, wood bonding, flat lamination, flexible packaging, profile wrapping, edge banding, textile lamination, low-pressure forming, and shoes; Use in the manufacture of books, packaging films, rigid panels, furniture, windows, footwear, car headlights, car trims, or bonded fabrics/fabrics for clothing; Use in decorative film. [Example]

以下,藉由實施例及比較例而更具體地說明本發明,但本發明不受限於此等。Hereinafter, the present invention will be explained more specifically with examples and comparative examples, but the present invention is not limited to these.

將由後述的製造例所得之嵌段共聚物的氫化物的物性評價方法揭示於以下。 (1)聚合物嵌段(A)的含量 將氫化前的嵌段共聚物溶解於CDCl3 ,進行1 H-NMR測定[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃],由來自苯乙烯的峰強度與來自二烯的峰強度之比,算出聚合物嵌段(A)的含量。The method for evaluating the physical properties of the hydrogenated block copolymer obtained in the production example described below is disclosed below. (1) Content of polymer block (A) The block copolymer before hydrogenation was dissolved in CDCl 3 and measured by 1 H-NMR [device: "ADVANCE 400 Nano bay" (manufactured by Bruker), measurement temperature: 30 °C], the content of the polymer block (A) was calculated from the ratio of the peak intensity derived from styrene to the peak intensity derived from diene.

(2)重量平均分子量(Mw) 藉由下述條件的凝膠滲透層析法(GPC)測定,針對嵌段共聚物的氫化物,求取聚苯乙烯換算的重量平均分子量(Mw)。 (GPC測定裝置及測定條件) ・裝置:GPC裝置「HLC-8020」(Tosoh股份有限公司製) ・分離管柱:將Tosoh股份有限公司製的「TSKgel GMHXL」、「G4000HXL」及「G5000HXL」串聯連接。 ・離析液   :四氫呋喃 ・離析液流量 :0.7mL/min ・樣本濃度:5mg/10mL ・管柱溫度 :40℃ ・偵測器:示差折射率(RI)偵測器 ・檢量線:使用標準聚苯乙烯而作成(2) Weight average molecular weight (Mw) According to the gel permeation chromatography (GPC) measurement under the following conditions, the weight average molecular weight (Mw) in terms of polystyrene is calculated for the hydrogenated product of the block copolymer. (GPC measuring device and measuring conditions) ・Device: GPC device "HLC-8020" (manufactured by Tosoh Co., Ltd.) ・Separation column: "TSKgel GMHXL", "G4000HXL" and "G5000HXL" manufactured by Tosoh Co., Ltd. are connected in series. ・Separation liquid: Tetrahydrofuran ・Separate flow rate: 0.7mL/min ・Sample concentration: 5mg/10mL ・Column temperature: 40℃ ・Detector: Differential refractive index (RI) detector ・Calibration line: made using standard polystyrene

(3)聚合物嵌段(B)中之氫化率 藉由1 H-NMR測定,由來自異戊二烯及/或丁二烯的殘留烯烴之峰面積與來自乙烯、丙烯及/或丁烯之峰面積的比而算出。 ・裝置:核磁共振裝置「ADVANCE 400 Nano bay」(Bruker公司製) ・溶媒:CDCl3 (3) The hydrogenation rate in the polymer block (B) was measured by 1 H-NMR, and the peak area of the residual olefin derived from isoprene and/or butadiene was compared with the peak area derived from ethylene, propylene and/or butene. Calculated by the ratio of the peak area.・Device: Nuclear magnetic resonance device "ADVANCE 400 Nano bay" (manufactured by Bruker) ・Solvent: CDCl 3

(4)聚合物嵌段(B)中之乙烯基鍵結量 將氫化前的嵌段共聚物溶解於CDCl3 ,進行1 H-NMR測定[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃]。由來自異戊二烯及/或丁二烯之結構單元的全部峰面積,與異戊二烯結構單元中之3,4-鍵結單元及1,2-鍵結單元、丁二烯結構單元中之1,2-鍵結單元、或者在來自異戊二烯與丁二烯的混合物之結構單元之情形下係對應於各前述鍵結單元的峰面積之比,算出乙烯基鍵結量(3,4-鍵結單元與1,2-鍵結單元的含量的合計)。(4) Vinyl bonding amount in polymer block (B) The block copolymer before hydrogenation is dissolved in CDCl 3 and measured by 1 H-NMR [device: "ADVANCE 400 Nano bay" (manufactured by Bruker) , Measurement temperature: 30℃]. From the total peak area of the structural unit derived from isoprene and/or butadiene, and the 3,4-bonding unit, 1,2-bonding unit and butadiene structural unit in the isoprene structural unit In the 1,2-bonding unit, or in the case of a structural unit derived from a mixture of isoprene and butadiene, the ratio of the peak area of each aforementioned bonding unit is calculated, and the vinyl bonding amount is calculated ( The total content of 3,4-bonding unit and 1,2-bonding unit).

(5)聚合物嵌段(B)中的脂環式骨架(X)的含量 將氫化前的嵌段共聚物600mg及Cr(acac)3 40mg溶解於CDCl3 4mL,使用10mmNMR管,進行定量13 C-NMR測定(脈衝程式:zgig、Inverse gated 1H decoupling法)[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃],利用下述的方法,算出聚合物嵌段(B)中的脂環式骨架X、X1、及X2各自的含量。 此外,表3中,X、X1、及X2表示以下脂環式骨架。 X    :具有以下(i)~(vi)的取代基的組合之脂環式骨架 X1   :具有以下(i)、(iv)的取代基的組合之脂環式骨架 X2   :具有以下(ii)、(iii)、(v)、(iv)的取代基的組合之脂環式骨架 (i)   :R1 =氫原子、R2 =氫原子、R3 =氫原子;(1,2Bd+Bd) (ii)  :R1 =氫原子、R2 =甲基、R3 =氫原子;(1,2Bd+1,2Ip) (iii) :R1 =氫原子、R2 =氫原子、R3 =甲基;(1,2Bd+3,4Ip) (iv)  :R1 =甲基、R2 =氫原子、R3 =氫原子;(1,2Ip+Bd) (v)   :R1 =甲基、R2 =甲基、R3 =氫原子;(1,2Ip+1,2Ip) (vi)  :R1 =甲基、R2 =氫原子、R3 =甲基;(1,2Ip+3,4Ip)(5) The content of the alicyclic skeleton (X) in the polymer block (B). Dissolve 600 mg of the block copolymer before hydrogenation and 40 mg of Cr(acac) 3 in 4 mL of CDCl 3 and use a 10 mm NMR tube to quantify 13 C-NMR measurement (pulse program: zgig, Inverse gated 1H decoupling method) [device: "ADVANCE 400 Nano bay" (manufactured by Bruker), measurement temperature: 30°C], the polymer block was calculated by the following method ( The content of each of the alicyclic skeleton X, X1, and X2 in B). In addition, in Table 3, X, X1, and X2 represent the following alicyclic skeletons. X: an alicyclic skeleton having a combination of the following (i) to (vi) substituents X1: an alicyclic skeleton having a combination of the following (i) and (iv) substituents X2: having the following (ii), (iii) The alicyclic skeleton (i) of the combination of substituents of (v) and (iv): R 1 = hydrogen atom, R 2 = hydrogen atom, R 3 = hydrogen atom; (1,2Bd+Bd) (ii): R 1 = hydrogen atom, R 2 = methyl, R 3 = hydrogen atom; (1,2Bd+1,2Ip) (iii): R 1 = hydrogen atom, R 2 = hydrogen atom, R 3 = Methyl; (1,2Bd+3,4Ip) (iv): R 1 = methyl, R 2 = hydrogen atom, R 3 = hydrogen atom; (1,2Ip+Bd) (v): R 1 = methyl , R 2 = methyl, R 3 = hydrogen atom; (1,2Ip+1,2Ip) (vi): R 1 = methyl, R 2 = hydrogen atom, R 3 = methyl; (1,2Ip+3 ,4Ip)

[算出方法] 將各峰與所來自的結構揭示於表1-1。若將各峰的積分值設為a~g,則各結構的積分值係成為如表1-2般,X、X1、X2的含量可分別以(a+g-c)/(a+b+c-d+e/2+2f)、(g-c)/(a+b+c-d+e/2+2f)、a/(a+b+c-d+e/2+2f)而算出。[Calculation method] The peaks and their derived structures are disclosed in Table 1-1. If the integral value of each peak is set as a~g, the integral value of each structure becomes as shown in Table 1-2, and the content of X, X1, and X2 can be expressed as (a+gc)/(a+b+c -d+e/2+2f), (gc)/(a+b+c-d+e/2+2f), a/(a+b+c-d+e/2+2f).

[表1] 表1-2 表1-1 結構 積分值 峰(ppm) 結構 積分值 St d-f 108~110 X2 a 1,4Ip f 110~113 3,4Ip+1,2Ip+X1 b 3,4Ip+1,2Ip b-(g-c) 113~116 1,2Bd c 1.4Bd (e-(d-f)×4)/2 122~127 1,4Ip+St d 1,2Bd c 127~132 1,4Bd×2+St×4 e X1 g-c 132~137 1,4Ip f X2 a 142~145 1,2Bd+X1 g 總計 a+b+c-d+e/2+2f [Table 1] Table 1-2 Table 1-1 structure Integral value Peak (ppm) structure Integral value St df 108~110 X2 a 1,4Ip f 110~113 3,4Ip+1,2Ip+X1 b 3,4Ip+1,2Ip b-(gc) 113~116 1,2Bd c 1.4Bd (e-(df)×4)/2 122~127 1,4Ip+St d 1,2Bd c 127~132 1,4Bd×2+St×4 e X1 gc 132~137 1,4Ip f X2 a 142~145 1,2Bd+X1 g total a+b+c-d+e/2+2f

(6)13 C-NMR的峰面積比 針對製造例1及比較製造例1的氫化物,進行上述定量13 C-NMR測定[裝置:「ADVANCE 400 Nano bay」(Bruker公司製),測定溫度:30℃,溶媒:CDCl3 ],算出峰面積比[化學位移值50.0~52.0ppm的峰面積]/[化學位移值43.0~45.0ppm的峰面積]。(6) Peak area ratio of 13 C-NMR For the hydrides of Production Example 1 and Comparative Production Example 1, the above-mentioned quantitative 13 C-NMR measurement was performed [device: "ADVANCE 400 Nano bay" (manufactured by Bruker), and measurement temperature: 30°C, solvent: CDCl 3 ], calculate the peak area ratio [peak area with chemical shift value 50.0-52.0 ppm]/[peak area with chemical shift value 43.0-45.0 ppm].

(7)tanδ的峰頂溫度、峰頂強度、tanδ成為1.0以上的溫度區域的最大幅度、在20℃及30℃的tanδ強度 為了以下的測定,將嵌段共聚物的氫化物在溫度230℃、壓力10MPa加壓3分鐘,藉此製作厚度1.0mm的單層片。將該單層片裁切成圓板形狀,將此作為試驗片。 測定中,基於JIS K 7244-10(2005年),作為平行平板振動流變計,使用圓板的直徑為8mm之應變控制型動態黏彈性裝置「ARES-G2」(TA Instruments Japan公司製)。 藉由上述試驗片,完全填充2片平板之間的間隙,以應變量0.1%,對於上述試驗片以1Hz的頻率給予振動,以3℃/分鐘的定速從-70℃升溫至100℃為止。直到剪切損耗模數及剪切儲存模數的測定值無變化為止,保持上述試驗片與圓板的溫度,求取tanδ的峰強度的最大值(峰頂強度)及獲得該最大值之溫度(峰頂溫度)。又,求取tanδ成為1.0以上的溫度區域的最大幅度、在20℃及30℃的tanδ強度。該值愈大,表示制振性愈優異。(7) Peak top temperature of tanδ, peak top intensity, the maximum width of the temperature range where tanδ becomes 1.0 or more, and the tanδ intensity at 20°C and 30°C For the following measurement, the hydrogenated product of the block copolymer was pressed at a temperature of 230°C and a pressure of 10 MPa for 3 minutes to produce a single-layer sheet with a thickness of 1.0 mm. This single-layer sheet was cut into a circular plate shape, and this was used as a test piece. In the measurement, based on JIS K 7244-10 (2005), a strain-controlled dynamic viscoelastic device "ARES-G2" (manufactured by TA Instruments Japan Co., Ltd.) with a circular plate diameter of 8 mm was used as a parallel plate vibration rheometer. With the above test piece, the gap between the two plates is completely filled, and the strain is 0.1%. The above test piece is vibrated at a frequency of 1 Hz, and the temperature is raised from -70°C to 100°C at a constant rate of 3°C/min. . Until the measured values of the shear loss modulus and the shear storage modulus do not change, keep the temperature of the test piece and the disc, and obtain the maximum value of the peak intensity of tanδ (peak top intensity) and the temperature at which the maximum value is obtained (Peak top temperature). In addition, the tanδ intensity at 20°C and 30°C, which is the maximum width of the temperature region where tanδ becomes 1.0 or more, is obtained. The larger the value, the better the vibration damping performance.

[製造例1] 氫化物(H-TPE-1)的製造 在已進行氮取代且乾燥的耐壓容器中,裝填環己烷50kg作為溶媒,裝填濃度10.5質量%的二級丁基鋰的環己烷溶液87g(二級丁基鋰的實質添加量:9.1g)作為陰離子聚合起始劑。 將耐壓容器內升溫至50℃後,添加苯乙烯(1)1.0kg,使其聚合1小時,以容器內溫度50℃,添加作為路易斯鹼的2,2-二(2-四氫呋喃基)丙烷(DTHFP)63g,將異戊二烯8.16kg及丁二烯6.48kg的混合液利用表2所示之平均二烯進料速度,耗費5小時添加後,使其聚合2小時,再添加苯乙烯(2)1.0kg,使其聚合1小時,藉此獲得包含聚苯乙烯-聚(異戊二烯/丁二烯)-聚苯乙烯三嵌段共聚物的反應液。 在該反應液中,在氫氣氣體環境下添加由辛酸鎳及三甲基鋁所形成之戚格勒系氫化觸媒,以氫壓力1MPa、80℃的條件使其反應5小時。使該反應液放置冷卻及釋放壓力後,藉由水洗而去除上述觸媒,使其真空乾燥,藉此獲得聚苯乙烯-聚(異戊二烯/丁二烯)-聚苯乙烯三嵌段共聚物的氫化物(以下,有時稱為H-TPE-1)。 關於各原料及其使用量,揭示於表2。又,將前述物性評價的結果揭示於表3。[Manufacturing Example 1] Manufacturing of hydride (H-TPE-1) In a dry pressure vessel that has been substituted with nitrogen, 50 kg of cyclohexane is filled as a solvent, and 87 g of a cyclohexane solution of secondary butyl lithium with a concentration of 10.5% by mass (the actual amount of secondary butyl lithium added: 9.1 g) As an anionic polymerization initiator. After raising the temperature in the pressure vessel to 50°C, add 1.0 kg of styrene (1) to polymerize for 1 hour, and add 2,2-bis(2-tetrahydrofuryl)propane as the Lewis base at a temperature of 50°C in the vessel (DTHFP) 63g, a mixture of 8.16kg isoprene and 6.48kg butadiene was added using the average diene feed rate shown in Table 2. After 5 hours of addition, it was polymerized for 2 hours, and then styrene was added (2) 1.0 kg was polymerized for 1 hour to obtain a reaction liquid containing a polystyrene-poly(isoprene/butadiene)-polystyrene triblock copolymer. In this reaction solution, a Chigler-based hydrogenation catalyst composed of nickel octoate and trimethylaluminum was added in a hydrogen gas atmosphere, and the reaction was carried out for 5 hours under the conditions of a hydrogen pressure of 1 MPa and 80°C. After allowing the reaction solution to cool down and releasing the pressure, the catalyst was removed by washing with water and dried in a vacuum, thereby obtaining a polystyrene-poly(isoprene/butadiene)-polystyrene triblock The hydrogenated product of the copolymer (hereinafter, sometimes referred to as H-TPE-1). About each raw material and its usage amount, it is shown in Table 2. In addition, the results of the aforementioned physical property evaluation are shown in Table 3.

[比較製造例1] 氫化物(H-TPE-1’)的製造 除了將各成分及其等的使用量、以及反應條件變更成如同表2所記載以外,與製造例1同樣地進行,製造嵌段共聚物的氫化物(H-TPE-1’)。又,將前述物性評價的結果揭示於表3。[Comparative Manufacturing Example 1] Manufacturing of hydride (H-TPE-1’) Except for changing the usage amounts of the components and the like, and the reaction conditions as described in Table 2, the same procedure as in Production Example 1 was carried out to produce a hydrogenated block copolymer (H-TPE-1'). In addition, the results of the aforementioned physical property evaluation are shown in Table 3.

[表2] 製造例 比較製造例 1 1 嵌段共聚物的氫化物 H-TPE-1 H-TPE-1’ 使用量 (kg) 環己烷 50 50 二級丁基鋰(10.5質量%環己烷溶液) 0.087 0.087 (A) 苯乙烯(1) 1.0 1.0 苯乙烯(2) 1.0 1.0 (B) 異戊二烯 8.16 14.64 丁二烯 6.48 0 路易斯鹼 DTHFP 0.063 0 反應條件 二烯聚合溫度(℃) 50 50 二烯進料時間(h) 5 5 活性末端每1mol的平均二烯進料速度(kg/h) 20.5 20.5 [Table 2] Manufacturing example Comparative manufacturing example 1 1 Hydride of block copolymer H-TPE-1 H-TPE-1' Usage (kg) Cyclohexane 50 50 Secondary butyl lithium (10.5 mass% cyclohexane solution) 0.087 0.087 (A) Styrene (1) 1.0 1.0 Styrene (2) 1.0 1.0 (B) Isoprene 8.16 14.64 Butadiene 6.48 0 Lewis base DTHFP 0.063 0 Reaction conditions Diene polymerization temperature (℃) 50 50 Diene feed time (h) 5 5 Average feed rate of diene per 1 mol of active end (kg/h) 20.5 20.5

[表3] 製造例 比較製造例 1 1 所使用的嵌段共聚物的氫化物 H-TPE-1 H-TPE-1’ 聚合物嵌段(A)的結構單元 St St 構成聚合物嵌段(B)之成分 Ip/Bd Ip 構成聚合物嵌段(B)之成分的質量比 55/45 100 構成聚合物嵌段(B)之成分的莫耳比 50/50 100 聚合物結構 A/B/A A/B/A 聚合物嵌段(A)的含量(質量%) 12 12 嵌段共聚物的氫化物的重量平均分子量 167,000 160,000 聚合物嵌段(B)中之氫化率(莫耳%) 95 99 聚合物嵌段(B)中之乙烯基鍵結量(莫耳%) 76 5 嵌段(B)中的X1或X1的氫化體的含量(莫耳%) 5 0 嵌段(B)中的X2或X2的氫化體的含量(莫耳%) 9.9 0 嵌段(B)中的X或X的氫化體的含量(莫耳%) 14.9 0 氫化後的13 C-NMR的面積比 [50~52ppm的峰面積]/[43~45ppm的峰面積] 0.21 0 tanδ的峰頂溫度(℃) 14.9 -55.2 tanδ的峰頂強度 2.24 2.35 成為tanδ≧1之溫度區域的最大幅度(℃) 17.9 6.0 20℃、1Hz中之tanδ強度 1.70 0.06 30℃、1Hz中之tanδ強度 0.81 0.07 [table 3] Manufacturing example Comparative manufacturing example 1 1 Hydrogenated block copolymer used H-TPE-1 H-TPE-1' Structural unit of polymer block (A) St St Components constituting the polymer block (B) Ip/Bd Ip The mass ratio of the components constituting the polymer block (B) 55/45 100 The molar ratio of the components constituting the polymer block (B) 50/50 100 Polymer structure A/B/A A/B/A Content of polymer block (A) (mass%) 12 12 Weight average molecular weight of hydrogenated block copolymer 167,000 160,000 Hydrogenation rate in polymer block (B) (mol%) 95 99 Vinyl bond amount in polymer block (B) (mol%) 76 5 The content of X1 or X1 hydride in block (B) (mol%) 5 0 The content of X2 or X2 hydride in block (B) (mol%) 9.9 0 The content of X or X hydride in block (B) (mol%) 14.9 0 13 C-NMR area ratio after hydrogenation [50~52ppm peak area]/[43~45ppm peak area] 0.21 0 Peak top temperature of tanδ (℃) 14.9 -55.2 Peak top intensity of tanδ 2.24 2.35 Become the maximum range of the temperature zone where tanδ≧1 (℃) 17.9 6.0 Tanδ intensity at 20℃, 1Hz 1.70 0.06 Tanδ intensity at 30℃, 1Hz 0.81 0.07

製造例1的嵌段共聚物及其氫化物顯示tanδ的峰頂強度為1.0以上,又在寬廣的溫度區域中顯示tanδ的峰頂溫度,因此可謂為適合在廣泛用途中用作為制振材料。尤其,若相較於比較製造例1,則可知製造例1中20℃及30℃的tanδ強度比較高,在室溫附近的制振性優異。The block copolymer of Production Example 1 and its hydrogenated product showed a peak top strength of tanδ of 1.0 or more, and showed a peak top temperature of tanδ in a wide temperature range, and therefore can be said to be suitable for use as a vibration damping material in a wide range of applications. In particular, when compared with Comparative Production Example 1, it can be seen that in Production Example 1, the tanδ strength at 20°C and 30°C is relatively high, and the vibration damping properties around room temperature are excellent.

<黏接著組成物> [實施例1~5][比較例1~5] (黏接著組成物的製作方法<1>) 根據表4所示之組成,相對於由前述製造例1及比較製造例1所得之嵌段共聚物的氫化物(H-TPE-1、H-TPE-1’)、黏著賦予樹脂、塑化劑、以及抗氧化劑(添加劑)的合計,添加相同質量份的甲苯,藉此製作甲苯溶液。使用貝克式塗膜器(Baker applicator)(SA-201,TESTER SANGYO股份有限公司製),將此甲苯溶液塗布在厚度50μm的聚對苯二甲酸乙二酯(PET)薄膜(商品名 Teijin Tetoron Film G2,Teijin DuPont Films股份有限公司製)後,以60℃乾燥30分鐘,藉此在PET薄膜上製作黏接著組成物。此黏接著組成物的厚度為30μm。<Adhesive composition> [Examples 1 to 5] [Comparative examples 1 to 5] (Method of making adhesive composition <1>) According to the composition shown in Table 4, compared with the hydrogenated product (H-TPE-1, H-TPE-1') of the block copolymer obtained in the aforementioned Production Example 1 and Comparative Production Example 1, adhesion-imparting resin and plasticizing The total amount of the agent and the antioxidant (additive) is added with the same parts by mass of toluene to prepare a toluene solution. Using a Baker applicator (SA-201, manufactured by TESTER SANGYO Co., Ltd.), the toluene solution was applied to a 50μm thick polyethylene terephthalate (PET) film (trade name Teijin Tetoron Film). G2, manufactured by Teijin DuPont Films Co., Ltd.), dried at 60°C for 30 minutes to produce an adhesive composition on the PET film. The thickness of the adhesive composition is 30 μm.

(黏接著組成物的製作方法<2>) 與上述(黏接著組成物的製作方法<1>)同樣地製作甲苯溶液後,將此甲苯溶液5g添加至縱5cm×橫5cm×高3cm的紙箱(離型PET面為內側),以23℃乾燥24小時,再以60℃乾燥8小時,藉此製作黏接著組成物。此黏接著組成物的厚度為1mm。(Method of making adhesive composition <2>) After preparing the toluene solution in the same manner as in the above (Method of Making Adhesive Composition <1>), add 5 g of the toluene solution to a cardboard box measuring 5 cm in length × 5 cm in width × 3 cm in height (with the release PET side as the inner side), and heat it at 23°C It was dried for 24 hours and then dried at 60° C. for 8 hours to produce an adhesive composition. The thickness of the adhesive composition is 1 mm.

[實施例6][比較例6] (黏接著組成物的製作方法<3>) 根據表4所示之組成,將由前述製造例1及比較製造例1所得之嵌段共聚物的氫化物(H-TPE-1、H-TPE-1’)、黏著賦予樹脂、塑化劑、填充劑、以及抗氧化劑(添加劑)投入塑譜儀(Brabender)(Brabender公司製,「Plastograph EC 50cc混合器」),以汽缸(cylinder)溫度200℃、螺桿(screw)旋轉數100rpm熔融混練3分鐘後,將所得之組成物在單面插入厚度50μm的聚對苯二甲酸乙二酯(PET)薄膜(商品名 Teijin Tetoron Film G2,Teijin DuPont Films股份有限公司製)並進行沖壓成形(200℃,2分鐘),藉此在PET薄膜上製造黏接著組成物。此黏接著組成物的厚度為0.5mm。[Example 6] [Comparative Example 6] (Method of making adhesive composition <3>) According to the composition shown in Table 4, the hydrogenated product (H-TPE-1, H-TPE-1') of the block copolymer obtained in the aforementioned Production Example 1 and Comparative Production Example 1, adhesion-imparting resin, plasticizer, Fillers and antioxidants (additives) are put into a Brabender (manufactured by Brabender, "Plastograph EC 50cc mixer"), and melt-kneaded for 3 minutes at a cylinder temperature of 200°C and a screw rotation speed of 100 rpm After that, the obtained composition was inserted into a 50 μm thick polyethylene terephthalate (PET) film (trade name Teijin Tetoron Film G2, manufactured by Teijin DuPont Films Co., Ltd.) on one side and press-molded (200°C, 2 minutes), thereby manufacturing an adhesive composition on the PET film. The thickness of the adhesive composition is 0.5 mm.

(黏接著組成物的製作方法<4>) 以上述(黏接著組成物的製作方法<3>)同樣地進行熔融混練後,將所得之組成物進行沖壓成形(200℃,2分鐘),藉此製作黏接著組成物。此黏接著組成物的厚度為1mm。(Method of making adhesive composition <4>) After melting and kneading in the same manner as in the above (Method of Making Adhesive Composition <3>), the obtained composition was press-molded (200°C, 2 minutes) to produce an adhesive composition. The thickness of the adhesive composition is 1 mm.

[物性評價] 將上述製作的黏接著組成物的物性評價方法揭示於以下。 (tanδ的峰頂溫度、峰頂強度、在23℃、60℃的剪切儲存模數、在23℃、40℃、60℃的tanδ強度、在60℃的複數黏度(剪切、1Hz)) 根據JIS K 7244-10(2005年),進行測定。具體而言,將由上述(黏接著組成物的製作方法<2>)(黏接著組成物的製作方法<4>)所得之黏接著組成物裁切成直徑8mm的圓板形狀者作為樣本,使用應變控制型動態黏彈性裝置「ARES-G2」(TA instruments公司製),在直徑8mm的平面板夾住前述樣本,以應變量0.1%、頻率1Hz給予振動,以3℃/分鐘從-70℃升溫至180℃並進行測定,藉此測定tanδ的峰頂溫度、峰頂強度、在23、60℃的剪切儲存模數(G’)、在23℃、40℃、60℃的tanδ強度、在60℃的複數黏度。將結果揭示於表4。[Physical Property Evaluation] The evaluation method of the physical properties of the adhesive composition produced above is disclosed below. (Tanδ peak top temperature, peak top strength, shear storage modulus at 23°C, 60°C, tanδ strength at 23°C, 40°C, 60°C, complex viscosity at 60°C (shear, 1Hz)) The measurement is performed in accordance with JIS K 7244-10 (2005). Specifically, the adhesive composition obtained by the above (Method of Making Adhesive Composition <2>) (Method of Making Adhesive Composition <4>) was cut into a disc shape with a diameter of 8 mm as a sample and used The strain-controlled dynamic viscoelastic device "ARES-G2" (manufactured by TA Instruments) clamps the aforementioned sample on a flat plate with a diameter of 8 mm, and vibrates with a strain amount of 0.1% and a frequency of 1 Hz. The temperature is 3°C/min from -70°C The temperature was raised to 180°C and the measurement was performed to measure the peak top temperature of tanδ, peak top strength, shear storage modulus (G') at 23, 60°C, tanδ intensity at 23°C, 40°C, and 60°C. Complex viscosity at 60°C. The results are shown in Table 4.

(蕭耳A硬度) 將由上述(黏接著組成物的製作方法<4>)所得之黏接著組成物分別重疊6片,作為厚度6mm的硬度測定用試驗片,根據JIS K 6253(2012年),使用自動橡膠硬度計P2-A型(高分子計器製),測定黏接著組成物的蕭耳A硬度。將結果揭示於表4。(Shore A hardness) The adhesive composition obtained by the above (Method of Making Adhesive Composition <4>) was superimposed on 6 pieces respectively, and used as a test piece for hardness measurement with a thickness of 6mm. According to JIS K 6253 (2012), an automatic rubber hardness tester P2 was used. -Type A (manufactured by Polymer Meter) to measure the hardness of the adhesive composition. The results are shown in Table 4.

(在23℃的剝離強度) 在丙烯酸擠壓板(商品名 SUMIPEX E,厚度1.5mm,SUMIKA ACRYL販售股份有限公司製),以由(黏接著組成物的製作方法<1>)(黏接著組成物的製作方法<3>)所得之黏接著組成物面對接觸丙烯酸樹脂板之方式進行貼附,將切斷成寬度25mm者作為試驗片。由此試驗片的聚對苯二甲酸乙二酯側,使用2kg橡膠輥,以10mm/分鐘的速度往復轉壓2次後,在23±1℃、濕度50±5%的氣體環境下放置24小時。其後,根據JIS Z 0237(2009年),使用INSTRON 5566(INSTRON公司製),以300mm/分鐘的剝離速度測定黏接著組成物與丙烯酸樹脂板間的180度剝離強度,作為在23℃的剝離強度。將結果揭示於表4。(Peel strength at 23°C) Acrylic extrusion sheet (trade name SUMIPEX E, thickness 1.5mm, manufactured by SUMIKA ACRYL Sales Co., Ltd.) is made of (Method of Making Adhesive Composition <1>) (Method of Making Adhesive Composition <3> ) The obtained adhesive composition was attached so as to face the acrylic resin board, and the one cut into a width of 25 mm was used as a test piece. Thus, the polyethylene terephthalate side of the test piece, using a 2kg rubber roller, was reciprocated and pressed twice at a speed of 10mm/min, and then placed in a gas environment at 23±1°C and a humidity of 50±5%. hour. Thereafter, in accordance with JIS Z 0237 (2009), using INSTRON 5566 (manufactured by INSTRON), the 180-degree peel strength between the adhesive composition and the acrylic resin plate was measured at a peeling speed of 300 mm/min, as the peeling strength at 23°C. strength. The results are shown in Table 4.

(在60℃的剝離強度) 在23±1℃、濕度50±5%的氣體環境下放置24小時後,再在60℃的氣體環境下放置10分鐘後,在60℃的氣體環境下測定剝離強度,除此以外係與上述(在23℃的剝離強度)同樣地進行,並作為在60℃的剝離強度。將結果揭示於表4。(Peel strength at 60℃) After leaving for 24 hours in a 23±1°C and 50±5% humidity gas environment, and then placing it in a 60°C gas environment for 10 minutes, measure the peel strength in a 60°C gas environment. Otherwise, it is the same as the above (Peel strength at 23°C) The same was performed, and it was taken as the peel strength at 60°C. The results are shown in Table 4.

[表4]   實施例 比較例 1 2 3 4 5 6 1 2 3 4 5 6 組成 (質量份) H-TPE-1 100 100 100 100 100 100 0 0 0 0 0 0 H-TPE-1’ 0 0 0 0 0 0 100 100 100 100 100 100 黏著賦予樹脂(1) 150 200 0 300 300 0 150 200 0 300 300 0 黏著賦予樹脂(2) 0 0 150 0 0 150 0 0 150 0 0 150 塑化劑 100 100 100 150 170 200 100 100 100 150 170 200 填充劑 0 0 0 0 0 100 0 0 0 0 0 100 抗氧化劑 1 1 1 1 1 1 1 1 1 1 1 1 物性 tanδ的峰頂溫度(℃) 5.2 13.7 13.7 14.2 12.4 -8.4 -15.9 -4.8 -11.4 4.5 2.9 -20.9 tanδ的峰頂強度 3.69 4.11 3.23 4.96 4.86 3.19 2.31 2.49 1.82 3.16 2.67 2.15 tanδ強度(23℃) 1.11 2.61 2.01 3.51 2.69 0.60 0.08 0.23 0.12 0.58 0.39 0.11 tanδ強度(40℃) 0.39 0.69 0.61 0.92 0.72 0.31 0.06 0.08 0.07 0.13 0.13 0.09 tanδ強度(60℃) 0.28 0.33 0.30 0.48 0.49 0.34 0.09 0.10 0.08 0.15 0.17 0.13 複數黏度(60℃)(Pa・s) 3000 3150 3960 1760 1300 2190 9110 9520 13700 4880 3490 9590 蕭耳A硬度 - - - - - 5 - - - - - 3 G’(23℃)(Pa) 42600 82500 84100 56400 32800 25500 55100 60200 86400 35300 25600 62800 G’(60℃)(Pa) 18200 18700 23800 9900 7300 13000 57000 59600 85900 30300 21600 59700 G’(23℃)/G’(60℃) 2.34 4.41 3.53 5.70 4.49 1.96 0.97 1.01 1.01 1.16 1.19 1.05 剝離強度(23℃)(N/25mm) 18.3 28.4 20.4 32.6 24.1 14.9 13 20.2 18.3 1.55 21.8 4.2 剝離強度(60℃)(N/25mm) 11.3 12.8 15.1 7.3 5.1 6.1 2.1 2.6 7.4 0.16 0.70 1.4 剝離強度比 (60℃/23℃) 0.62 0.45 0.74 0.22 0.21 0.41 0.16 0.13 0.40 0.10 0.03 0.33 [Table 4] Example Comparative example 1 2 3 4 5 6 1 2 3 4 5 6 Composition (parts by mass) H-TPE-1 100 100 100 100 100 100 0 0 0 0 0 0 H-TPE-1' 0 0 0 0 0 0 100 100 100 100 100 100 Adhesive imparting resin (1) 150 200 0 300 300 0 150 200 0 300 300 0 Adhesion imparting resin (2) 0 0 150 0 0 150 0 0 150 0 0 150 Plasticizer 100 100 100 150 170 200 100 100 100 150 170 200 Filler 0 0 0 0 0 100 0 0 0 0 0 100 Antioxidants 1 1 1 1 1 1 1 1 1 1 1 1 Physical properties Peak top temperature of tanδ (℃) 5.2 13.7 13.7 14.2 12.4 -8.4 -15.9 -4.8 -11.4 4.5 2.9 -20.9 Peak top intensity of tanδ 3.69 4.11 3.23 4.96 4.86 3.19 2.31 2.49 1.82 3.16 2.67 2.15 tanδ intensity (23℃) 1.11 2.61 2.01 3.51 2.69 0.60 0.08 0.23 0.12 0.58 0.39 0.11 tanδ intensity (40℃) 0.39 0.69 0.61 0.92 0.72 0.31 0.06 0.08 0.07 0.13 0.13 0.09 tanδ intensity (60℃) 0.28 0.33 0.30 0.48 0.49 0.34 0.09 0.10 0.08 0.15 0.17 0.13 Complex viscosity (60℃)(Pa·s) 3000 3150 3960 1760 1300 2190 9110 9520 13,700 4880 3490 9590 Shaw A Hardness - - - - - 5 - - - - - 3 G'(23℃)(Pa) 42600 82500 84100 56400 32800 25500 55100 60200 86400 35300 25600 62800 G'(60℃)(Pa) 18200 18700 23800 9900 7300 13000 57000 59600 85900 30300 21600 59700 G'(23℃)/G'(60℃) 2.34 4.41 3.53 5.70 4.49 1.96 0.97 1.01 1.01 1.16 1.19 1.05 Peel strength (23℃)(N/25mm) 18.3 28.4 20.4 32.6 24.1 14.9 13 20.2 18.3 1.55 21.8 4.2 Peel strength (60℃)(N/25mm) 11.3 12.8 15.1 7.3 5.1 6.1 2.1 2.6 7.4 0.16 0.70 1.4 Peel strength ratio (60℃/23℃) 0.62 0.45 0.74 0.22 0.21 0.41 0.16 0.13 0.40 0.10 0.03 0.33

表4所示之各成分係如同下述。 ・黏著賦予樹脂:Alcon P-100(脂環族飽和烴系樹脂,軟化點(環球法)100±5℃,荒川化學工業股份有限公司製) ・黏著賦予樹脂:Alcon P-125(脂環族飽和烴系樹脂,軟化點(環球法)125±5℃,荒川化學工業股份有限公司製) ・塑化劑:Diana Process Oil PW-90(氫化石蠟系加工油,出光興產股份有限公司製) ・填充劑:Escalon#200(重質碳酸鈣,三共精粉股份有限公司製) ・抗氧化劑:ADK STAB AO-60(受阻酚(hindered phenol)系抗氧化劑,ADEKA股份有限公司製)The components shown in Table 4 are as follows. ・Adhesive resin: Alcon P-100 (alicyclic saturated hydrocarbon resin, softening point (ball and ball method) 100±5°C, manufactured by Arakawa Chemical Industry Co., Ltd.) ・Adhesive resin: Alcon P-125 (alicyclic saturated hydrocarbon resin, softening point (ring and ball method) 125±5°C, manufactured by Arakawa Chemical Industry Co., Ltd.) ・Plasticizer: Diana Process Oil PW-90 (hydrogenated paraffin-based processing oil, manufactured by Idemitsu Kosan Co., Ltd.) ・Filling agent: Escalon#200 (Heavy calcium carbonate, manufactured by Sankyo Fine Powder Co., Ltd.) ・Antioxidant: ADK STAB AO-60 (hindered phenol antioxidant, manufactured by ADEKA Co., Ltd.)

由表4,相較於比較例1~6的黏接著組成物,實施例1~6的黏接著組成物之tanδ的峰頂強度的值較大,在23~60℃的溫度範圍中,tanδ強度的值較大。 又,相較於比較例1~6的黏接著組成物,實施例1~6的黏接著組成物在60℃的複數黏度較低。 再者,相較於比較例1~6的黏接著組成物,實施例1~6的黏接著組成物之儲存模數G’的比[G’(23℃)/G’(60℃)]較大,為1.5以上。如此,實施例的黏接著組成物之23℃與60℃的儲存模數之比大於比較例,23℃至60℃的剝離強度的降低變少[(在60℃中之剝離強度)/(在23℃中之剝離強度)為大]。 因此可知,實施例的黏接著組成物係藉由含有具有於主鏈包含脂環式骨架(X)之結構單元的嵌段共聚物或其氫化物,而具有優異的制振性、處理性及黏接著力,且即使在高溫條件下亦維持黏接著性。From Table 4, compared with the adhesive composition of Comparative Examples 1 to 6, the peak top strength of the tanδ of the adhesive composition of Examples 1 to 6 is larger. In the temperature range of 23 to 60°C, the tanδ The value of intensity is larger. In addition, compared with the adhesive compositions of Comparative Examples 1 to 6, the adhesive compositions of Examples 1 to 6 have a lower complex viscosity at 60°C. Furthermore, compared with the adhesive compositions of Comparative Examples 1 to 6, the storage modulus G'ratio of the adhesive compositions of Examples 1 to 6 [G'(23°C)/G'(60°C)] Larger, 1.5 or more. In this way, the ratio of the storage modulus at 23°C to 60°C of the adhesive composition of the example is greater than that of the comparative example, and the peel strength at 23°C to 60°C decreases less [(peel strength at 60°C)/(in The peel strength at 23°C) is large]. Therefore, it can be seen that the adhesive composition of the examples has excellent vibration damping properties, handling properties, and hydrides by containing the block copolymer or its hydrogenated product having a structural unit containing an alicyclic skeleton (X) in the main chain. Adhesiveness, and maintains adhesiveness even under high temperature conditions.

此外,雖未明確,但可推測含有嵌段共聚物或其氫化物之黏接著組成物因在高溫(60℃)會柔軟化,故藉由以下狀況而抑制黏接著組成物與被接著材料的接著力之降低:浸透至被接著材料(丙烯酸樹脂板)表面的微小凹凸而發揮如錨定物般的作用,或者,與被接著材面對接觸的黏接著組成物表面的微小凹凸的凸部嵌入被接著材料的凹部而發揮彈性的緊束力的作用。 再者,實施例6的黏接著組成物的蕭耳A硬度低。因此可知,包含填充劑的實施例的黏接著組成物係藉由含有具有於主鏈包含脂環式骨架(X)之結構單元的嵌段共聚物或其氫化物,而在作為密封劑時具有優異的制振性、處理性及黏接著力,且即使在高溫條件下亦維持黏接著性。 [產業可利用性]In addition, although it is not clear, it can be assumed that the adhesive composition containing the block copolymer or its hydrogenated product will be softened at high temperature (60°C). Therefore, the following conditions suppress the adhesion between the adhesive composition and the bonded material Decrease of adhesive force: It penetrates into the small irregularities on the surface of the material to be bonded (acrylic resin sheet) and acts like an anchor, or the surface of the adhesive composition is in contact with the surface of the material to be bonded. It fits into the recess of the material to be bonded and exerts an elastic tightening force. In addition, the adhesive composition of Example 6 had a low Shore A hardness. Therefore, it can be seen that the adhesive composition of the embodiment containing the filler contains the block copolymer or its hydrogenated product having a structural unit containing an alicyclic skeleton (X) in the main chain, and has a sealant Excellent vibration damping, handling and adhesion, and maintain adhesion even under high temperature conditions. [Industry Availability]

本發明的黏接著組成物因具有制振性且具有即使在高溫中亦不易剝落的黏接著性,故有用於作為黏接著劑,尤其是熱熔接著劑。又,本發明的黏接著組成物亦能利用於密封劑。Since the adhesive composition of the present invention has vibration damping properties and has adhesive properties that are not easy to peel off even at high temperatures, it is useful as an adhesive, especially a hot melt adhesive. In addition, the adhesive composition of the present invention can also be used as a sealant.

無。no.

無。no.

Figure 109117127-A0101-11-0001-1
Figure 109117127-A0101-11-0001-1

無。no.

Claims (20)

一種黏接著組成物,其相對於下述嵌段共聚物或其氫化物100質量份,包含選自1~1000質量份的黏著賦予樹脂、及1~1000質量份的塑化劑中之至少1種; 前述嵌段共聚物含有聚合物嵌段(A)及聚合物嵌段(B),該聚合物嵌段(B)為來自共軛二烯化合物之結構單元,且具有於主鏈包含以下述式(X)所示之1種以上的脂環式骨架(X)之結構單元;
Figure 03_image001
(上述式(X)中,R1 ~R3 各自獨立地表示氫原子或碳數1~11的烴基,複數個R1 ~R3 各自可相同或不同)。
An adhesive composition containing at least 1 selected from 1 to 1000 parts by mass of adhesion-imparting resin and 1 to 1000 parts by mass of plasticizer relative to 100 parts by mass of the following block copolymer or its hydrogenated product Species; The aforementioned block copolymer contains a polymer block (A) and a polymer block (B), the polymer block (B) is a structural unit derived from a conjugated diene compound, and has the following in the main chain One or more structural units of alicyclic skeleton (X) represented by formula (X);
Figure 03_image001
(In the above formula (X), R 1 to R 3 each independently represent a hydrogen atom or a hydrocarbon group having 1 to 11 carbon atoms, and a plurality of R 1 to R 3 may be the same or different).
如請求項1之黏接著組成物,其包含120~1000質量份的前述黏著賦予樹脂。Such as the adhesive composition of claim 1, which contains 120 to 1000 parts by mass of the aforementioned adhesive imparting resin. 如請求項1或2之黏接著組成物,其包含60~1000質量份的前述塑化劑。Such as the adhesive composition of claim 1 or 2, which contains 60 to 1000 parts by mass of the aforementioned plasticizer. 如請求項1至3中任一項之黏接著組成物,其進一步包含10~2500質量份的填充劑。The adhesive composition according to any one of claims 1 to 3, which further contains 10 to 2500 parts by mass of a filler. 如請求項1至4中任一項之黏接著組成物,其中,在前述脂環式骨架(X)中,包含有前述R1 ~R3 之中至少1個為碳數1~11的烴基之脂環式骨架(X’)。The adhesive composition according to any one of claims 1 to 4, wherein the aforementioned alicyclic skeleton (X) contains at least one of the aforementioned R 1 to R 3 being a hydrocarbon group with 1 to 11 carbons The alicyclic skeleton (X'). 如請求項5之黏接著組成物,其中,在前述脂環式骨架(X’)中的前述烴基為甲基。The adhesive composition of claim 5, wherein the hydrocarbon group in the alicyclic skeleton (X') is a methyl group. 如請求項1至6中任一項之黏接著組成物,其至少包含苯乙烯-氫化丁二烯/異戊二烯-苯乙烯共聚物作為前述嵌段共聚物的氫化物。The adhesive composition according to any one of claims 1 to 6, which at least contains a styrene-hydrogenated butadiene/isoprene-styrene copolymer as the hydrogenated product of the aforementioned block copolymer. 如請求項1至4中任一項之黏接著組成物,其中,前述R1 ~R3 同時為氫原子。An adhesive composition according to any one of claims 1 to 4, wherein the aforementioned R 1 to R 3 are hydrogen atoms at the same time. 如請求項1至8中任一項之黏接著組成物,其在前述聚合物嵌段(B)中含有1莫耳%以上的前述脂環式骨架(X)。The adhesive composition according to any one of claims 1 to 8, which contains 1 mol% or more of the alicyclic skeleton (X) in the polymer block (B). 如請求項5或6之黏接著組成物,其在前述聚合物嵌段(B)中含有1莫耳%以上的前述脂環式骨架(X’)。Such as the adhesive composition of claim 5 or 6, which contains 1 mol% or more of the alicyclic skeleton (X') in the polymer block (B). 如請求項1至10中任一項之黏接著組成物,其中,前述聚合物嵌段(B)的氫化率為0莫耳%以上且小於50莫耳%。The adhesive composition according to any one of claims 1 to 10, wherein the hydrogenation rate of the polymer block (B) is 0 mol% or more and less than 50 mol%. 如請求項1至10中任一項之黏接著組成物,其中,前述聚合物嵌段(B)的氫化率為50~99莫耳%。The adhesive composition according to any one of claims 1 to 10, wherein the hydrogenation rate of the polymer block (B) is 50 to 99 mol%. 如請求項1至12中任一項之黏接著組成物,其中,前述聚合物嵌段(B)中的乙烯基鍵結量為55~95莫耳%。The adhesive composition according to any one of claims 1 to 12, wherein the vinyl bond amount in the polymer block (B) is 55 to 95 mol%. 如請求項1至13中任一項之黏接著組成物,其中,前述嵌段共聚物或其氫化物存在:根據JIS K 7244-10(2005年),在應變量0.1%、頻率1Hz、測定溫度-70~100℃、升溫速度3℃/分鐘的條件下測定而得之tanδ成為1.0以上之連續的溫度區域;該溫度區域的最大幅度為13℃以上。Such as the adhesive composition of any one of claims 1 to 13, wherein the aforementioned block copolymer or its hydrogenated product exists: in accordance with JIS K 7244-10 (2005), the amount of strain is 0.1%, the frequency is 1 Hz, and the measurement The tanδ measured under the conditions of a temperature of -70 to 100°C and a temperature increase rate of 3°C/min becomes a continuous temperature range of 1.0 or more; the maximum range of this temperature range is 13°C or more. 如請求項1至14中任一項之黏接著組成物,其中,前述聚合物嵌段(A)含有大於70莫耳%的來自芳香族乙烯基化合物之結構單元。The adhesive composition according to any one of claims 1 to 14, wherein the aforementioned polymer block (A) contains more than 70 mol% of structural units derived from aromatic vinyl compounds. 如請求項15之黏接著組成物,其中,在前述嵌段共聚物中的前述聚合物嵌段(A)的含量為50質量%以下。The adhesive composition according to claim 15, wherein the content of the polymer block (A) in the block copolymer is 50% by mass or less. 如請求項15之黏接著組成物,其中,在前述嵌段共聚物中的前述聚合物嵌段(A)的含量為16質量%以下。The adhesive composition according to claim 15, wherein the content of the polymer block (A) in the block copolymer is 16% by mass or less. 如請求項1至17中任一項之黏接著組成物,其中,在23℃的剪切儲存模數G’(23℃)相對於在60℃的剪切儲存模數G’(60℃)之比[G’(23℃)/G’(60℃)]為1.3以上。The adhesive composition according to any one of claims 1 to 17, wherein the shear storage modulus G'(23°C) at 23°C is relative to the shear storage modulus G'(60°C) at 60°C The ratio [G'(23°C)/G'(60°C)] is 1.3 or more. 一種黏接著劑,其包含如請求項1至18中任一項之黏接著組成物。An adhesive comprising the adhesive composition according to any one of claims 1 to 18. 一種密封劑,其包含如請求項4之黏接著組成物。A sealant comprising the adhesive composition as claimed in claim 4.
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