TW202102822A - Spectrum detection equipment, End Point Detector, and method wherein the system includes a diffraction grating, an image sensor, and a baffle between the diffraction grating and the image sensor - Google Patents
Spectrum detection equipment, End Point Detector, and method wherein the system includes a diffraction grating, an image sensor, and a baffle between the diffraction grating and the image sensor Download PDFInfo
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Abstract
Description
本發明涉及半導體技術領域,更具體地說,涉及一種光譜檢測設備、終點檢測系統和方法。The invention relates to the field of semiconductor technology, and more specifically, to a spectrum detection equipment, an endpoint detection system and a method.
隨著半導體製造製程的發展,人們對元器件整合度和性能的要求越來越高。由於蝕刻的精準度直接關係到元器件的特徵尺寸和性能,因此,人們通常給蝕刻製程配備終點檢測系統(End Point Detector,簡稱EPD),以跟蹤製程進程,判斷蝕刻終點。With the development of semiconductor manufacturing processes, people have higher and higher requirements for the integration and performance of components. Since the accuracy of etching is directly related to the feature size and performance of the components, people usually equip the etching process with an End Point Detector (EPD) to track the process progress and determine the etching end point.
習知技術中,終點檢測系統主要藉由光學檢測、驅動馬達電流檢測、溫度檢測等方法進行終點檢測。其中,光學發射光譜法(Optical Emission Spectroscopy,簡稱OES)是最常用也是最有效的光學檢測方法,其藉由光譜檢測設備對被蝕刻物體蝕刻時產生的光譜進行實時檢測,由於蝕刻到不同材料時光譜會出現明顯的變化,因此,藉由連續監測光譜就可以判斷當前蝕刻材料是否被完全蝕刻掉,即判斷是否到達蝕刻終點。In the conventional technology, the endpoint detection system mainly uses optical detection, drive motor current detection, temperature detection and other methods to perform endpoint detection. Among them, Optical Emission Spectroscopy (OES) is the most commonly used and most effective optical inspection method. It uses spectral inspection equipment to detect the spectrum generated by the etching of the etched object in real time. There will be obvious changes in the spectrum. Therefore, by continuously monitoring the spectrum, it can be determined whether the current etching material is completely etched, that is, whether the etching end point has been reached.
但是,習知的光譜檢測設備的信噪比較低,導致習知的採用OES方法的終點檢測系統的檢測靈敏度較低,不利用蝕刻終點的準確檢測。However, the signal-to-noise ratio of the conventional spectroscopic detection equipment is low, resulting in low detection sensitivity of the conventional endpoint detection system using the OES method, and does not use accurate detection of the etching endpoint.
有鑑於此,本發明提供了一種光譜檢測設備、終點檢測系統和方法,以提高光譜檢測設備的信噪比。In view of this, the present invention provides a spectrum detection device, an endpoint detection system and a method to improve the signal-to-noise ratio of the spectrum detection device.
為實現上述目的,本發明提供如下技術方案:In order to achieve the above objectives, the present invention provides the following technical solutions:
一種光譜檢測設備,用於對電漿進行光譜檢測,包括衍射光柵、圖像感測器以及位於所述衍射光柵和圖像感測器之間的擋板,所述擋板具有至少一個狹縫;A spectrum detection device for performing spectrum detection on plasma, comprising a diffraction grating, an image sensor, and a baffle between the diffraction grating and the image sensor, the baffle having at least one slit ;
所述衍射光柵用於將入射光分成沿一特定方向依次排列的多個光分量,每個所述光分量中的光束具有不同的波長;The diffraction grating is used to divide incident light into a plurality of light components arranged in sequence along a specific direction, and the light beam in each of the light components has a different wavelength;
所述狹縫的位置與一個所述光分量的位置對應,所述狹縫朝向所述圖像感測器的一側具有光學透鏡,所述光學透鏡用於對與所述狹縫位置對應的光分量進行擴束;The position of the slit corresponds to the position of one of the light components, the side of the slit facing the image sensor has an optical lens, and the optical lens is used to adjust the position corresponding to the slit Beam expansion of light components;
所述圖像感測器用於採集擴束後的所述光分量,以獲得所述擴束後的光分量對應的特徵光譜的光強。The image sensor is used to collect the light component after the beam expansion, so as to obtain the light intensity of the characteristic spectrum corresponding to the light component after the beam expansion.
可選地,所述擋板具有第一狹縫;所述多個光分量包括第一光分量;Optionally, the baffle has a first slit; the plurality of light components includes a first light component;
所述第一狹縫的位置與所述第一光分量的位置對應,所述第一狹縫朝向所述圖像感測器的一側具有第一光學透鏡,所述第一光學透鏡用於對所述第一光分量進行擴束;The position of the first slit corresponds to the position of the first light component, the side of the first slit facing the image sensor has a first optical lens, and the first optical lens is used for Performing beam expansion on the first light component;
所述圖像感測器用於採集擴束後的所述第一光分量獲得所述第一光分量對應的第一特徵光譜的光強。The image sensor is used to collect the expanded first light component to obtain the light intensity of the first characteristic spectrum corresponding to the first light component.
可選地,所述擋板具有第二狹縫;所述多個光分量包括第二光分量;Optionally, the baffle has a second slit; the plurality of light components includes a second light component;
所述第二狹縫的位置與所述第二光分量的位置對應,所述第二狹縫朝向所述圖像感測器的一側具有第二光學透鏡,所述第二光學透鏡用於對所述第二光分量進行擴束;The position of the second slit corresponds to the position of the second light component, the side of the second slit facing the image sensor has a second optical lens, and the second optical lens is used for Performing beam expansion on the second light component;
所述圖像感測器用於採集擴束後的所述第二光分量獲得所述第二光分量對應的第二特徵光譜的光強。The image sensor is used to collect the expanded second light component to obtain the light intensity of the second characteristic spectrum corresponding to the second light component.
可選地,所述擋板具有第一狹縫和第二狹縫;所述多個光分量包括第一光分量和第二光分量;Optionally, the baffle has a first slit and a second slit; the multiple light components include a first light component and a second light component;
所述第一狹縫的位置與所述第一光分量的位置對應,所述第一狹縫朝向所述圖像感測器的一側具有第一光學透鏡,所述第一光學透鏡用於對所述第一光分量進行擴束;The position of the first slit corresponds to the position of the first light component, the side of the first slit facing the image sensor has a first optical lens, and the first optical lens is used for Performing beam expansion on the first light component;
所述第二狹縫的位置與所述第二光分量的位置對應,所述第二狹縫朝向所述圖像感測器的一側具有第二光學透鏡,所述第二光學透鏡用於對所述第二光分量進行擴束;The position of the second slit corresponds to the position of the second light component, the side of the second slit facing the image sensor has a second optical lens, and the second optical lens is used for Performing beam expansion on the second light component;
所述圖像感測器用於採集擴束後的所述第一光分量獲得所述第一光分量對應的第一特徵光譜的光強,採集擴束後的所述第二光分量獲得所述第二光分量對應的第二特徵光譜的光強,以根據所述第一特徵光譜的光強與所述第二特徵光譜的光強之比,判斷是否到達蝕刻終點。The image sensor is used to collect the expanded first light component to obtain the light intensity of the first characteristic spectrum corresponding to the first light component, and collect the expanded second light component to obtain the The light intensity of the second characteristic spectrum corresponding to the second light component is determined based on the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum to determine whether the etching end point is reached.
可選地,所述擋板具有可移動的第三狹縫;所述多個光分量包括第一光分量和第二光分量;Optionally, the baffle has a movable third slit; the plurality of light components include a first light component and a second light component;
所述第三狹縫包括第一位置和第二位置,所述第一位置與所述第一光分量的位置對應,所述第二位置與所述第二光分量的位置對應;The third slit includes a first position and a second position, the first position corresponds to the position of the first light component, and the second position corresponds to the position of the second light component;
所述第三狹縫朝向所述圖像感測器的一側具有第三光學透鏡,所述第三光學透鏡隨所述第三狹縫移動,用於對所述第一光分量和所述第二光分量進行擴束;The third slit has a third optical lens on the side facing the image sensor, and the third optical lens moves with the third slit for controlling the first light component and the Expand the second light component;
所述圖像感測器用於採集擴束後的所述第一光分量獲得所述第一光分量對應的第一特徵光譜的光強,採集擴束後的所述第二光分量獲得所述第二光分量對應的第二特徵光譜的光強,以根據所述第一特徵光譜的光強與所述第二特徵光譜的光強之比,判斷是否到達蝕刻終點。The image sensor is used to collect the expanded first light component to obtain the light intensity of the first characteristic spectrum corresponding to the first light component, and collect the expanded second light component to obtain the The light intensity of the second characteristic spectrum corresponding to the second light component is determined based on the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum to determine whether the etching end point is reached.
可選地,還包括反光鏡;Optionally, it also includes a reflector;
所述反光鏡圍繞所述光分量在所述圖像感測器上的投影設置,且所述反光鏡在所述擋板和所述圖像感測器之間延伸。The reflector is arranged around the projection of the light component on the image sensor, and the reflector extends between the baffle and the image sensor.
一種終點檢測系統,包括第一光譜檢測設備、第二光譜檢測設備、分光元件和處理元件;An endpoint detection system, including a first spectrum detection device, a second spectrum detection device, a spectroscopic element, and a processing element;
所述分光元件用於將被蝕刻物體蝕刻時產生的光線分成第一光線和第二光線,並使所述第一光線入射到所述第一光譜檢測設備,使所述第二光線入射到所述第二光譜檢測設備,所述被蝕刻物體包括在蝕刻方向上依次排列的第一介質層和第二介質層;The spectroscopic element is used to divide the light generated when the etched object is etched into a first light and a second light, and make the first light enter the first spectrum detection device, and make the second light enter the In the second spectrum detection device, the etched object includes a first dielectric layer and a second dielectric layer sequentially arranged in an etching direction;
所述第一光譜檢測設備為如上所述的光譜檢測設備;所述第一光譜檢測設備用於根據所述第一光線獲得第一特徵光譜的光強,所述第一特徵光譜為所述第一介質層的特徵光譜;The first spectrum detection device is the spectrum detection device as described above; the first spectrum detection device is used to obtain the light intensity of a first characteristic spectrum according to the first light, and the first characteristic spectrum is the first The characteristic spectrum of a dielectric layer;
所述第二光譜檢測設備為如上所述的光譜檢測設備;所述第二光譜檢測設備用於根據所述第二光線獲得第二特徵光譜的光強,所述第二特徵光譜為第二介質層的特徵光譜;The second spectrum detection device is the spectrum detection device as described above; the second spectrum detection device is used to obtain the light intensity of a second characteristic spectrum according to the second light, and the second characteristic spectrum is the second medium Characteristic spectrum of the layer;
所述處理元件用於根據所述第一特徵光譜的光強與所述第二特徵光譜的光強之比,判斷是否到達所述第一介質層的蝕刻終點。The processing element is used for judging whether the etching end point of the first dielectric layer is reached according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum.
可選地,所述分光元件的分光比為1:1。Optionally, the light splitting ratio of the light splitting element is 1:1.
一種終點檢測方法,應用於如上所述的終點檢測系統,所述方法包括:An endpoint detection method, applied to the endpoint detection system as described above, and the method includes:
分光元件將被蝕刻物體蝕刻時產生的光線分成第一光線和第二光線,並使所述第一光線入射到第一光譜檢測設備,使所述第二光線入射到第二光譜檢測設備,所述被蝕刻物體包括在蝕刻方向上依次排列的第一介質層和第二介質層;The spectroscopic element divides the light generated by the etching of the object to be etched into a first light and a second light, and makes the first light enter the first spectrum detection device, and the second light enters the second spectrum detection device, so The etched object includes a first dielectric layer and a second dielectric layer sequentially arranged in an etching direction;
所述第一光譜檢測設備根據所述第一光線獲得第一特徵光譜的光強,所述第一特徵光譜為所述第一介質層的特徵光譜;The first spectrum detection device obtains the light intensity of a first characteristic spectrum according to the first light, and the first characteristic spectrum is the characteristic spectrum of the first medium layer;
所述第二光譜檢測設備根據所述第二光線獲得第二特徵光譜的光強,所述第二特徵光譜為第二介質層的特徵光譜;The second spectrum detection device obtains the light intensity of a second characteristic spectrum according to the second light, and the second characteristic spectrum is the characteristic spectrum of the second dielectric layer;
處理元件根據所述第一特徵光譜的光強與所述第二特徵光譜的光強之比,判斷是否到達所述第一介質層的蝕刻終點。The processing element determines whether the etching end point of the first dielectric layer is reached according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum.
一種終點檢測系統,包括光譜檢測設備和處理元件;An endpoint detection system, including spectrum detection equipment and processing elements;
所述光譜檢測設備為如上所述的光譜檢測設備;所述光譜檢測設備用於根據被蝕刻物體蝕刻時產生的光線獲得第一特徵光譜的光強和第二特徵光譜的光強,所述被蝕刻物體包括在蝕刻方向上依次排列的第一介質層和第二介質層,所述第一特徵光譜為所述第一介質層的特徵光譜,所述第二特徵光譜為第二介質層的特徵光譜;The spectrum detection device is the spectrum detection device as described above; the spectrum detection device is used to obtain the light intensity of the first characteristic spectrum and the light intensity of the second characteristic spectrum according to the light generated when the etched object is etched. The etched object includes a first dielectric layer and a second dielectric layer sequentially arranged in the etching direction, the first characteristic spectrum is a characteristic spectrum of the first dielectric layer, and the second characteristic spectrum is a characteristic of the second dielectric layer spectrum;
所述處理元件用於根據所述第一特徵光譜的光強與所述第二特徵光譜的光強之比,判斷是否到達所述第一介質層的蝕刻終點。The processing element is used for judging whether the etching end point of the first dielectric layer is reached according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum.
一種終點檢測方法,應用於如上所述的終點檢測系統,所述方法包括:An endpoint detection method, applied to the endpoint detection system as described above, and the method includes:
光譜檢測設備根據被蝕刻物體蝕刻時產生的光線獲得第一特徵光譜的光強和第二特徵光譜的光強,所述被蝕刻物體包括在蝕刻方向上依次排列的第一介質層和第二介質層,所述第一特徵光譜為所述第一介質層的特徵光譜,所述第二特徵光譜為第二介質層的特徵光譜;The spectrum detection device obtains the light intensity of the first characteristic spectrum and the light intensity of the second characteristic spectrum according to the light generated when the etched object is etched. The etched object includes a first medium layer and a second medium arranged in sequence in the etching direction. Layer, the first characteristic spectrum is the characteristic spectrum of the first dielectric layer, and the second characteristic spectrum is the characteristic spectrum of the second dielectric layer;
處理元件根據所述第一特徵光譜的光強與所述第二特徵光譜的光強之比,判斷是否到達所述第一介質層的蝕刻終點。The processing element determines whether the etching end point of the first dielectric layer is reached according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum.
可選地,當所述擋板具有可移動的第三狹縫時,光譜檢測設備根據被蝕刻物體蝕刻時產生的光線獲得第一特徵光譜的光強和第二特徵光譜的光強包括:Optionally, when the baffle has a movable third slit, the spectrum detection device obtains the light intensity of the first characteristic spectrum and the light intensity of the second characteristic spectrum according to the light generated when the etched object is etched, including:
衍射光柵將採集的被蝕刻物體蝕刻時產生的光分成沿一特定方向依次排列的多個光分量,每個所述光分量中的光束具有不同的波長,其中,所述多個光分量包括第一光分量和第二光分量;The diffraction grating divides the collected light generated when the etched object is etched into a plurality of light components arranged in sequence along a specific direction, and the light beam in each of the light components has a different wavelength, wherein the multiple light components include the first A light component and a second light component;
使所述第三狹縫位於第一位置,第三光學透鏡對第一光分量進行擴束,圖像感測器採集擴束後的第一光分量獲得所述第一光分量對應的第一特徵光譜的光強;The third slit is located at the first position, the third optical lens expands the first light component, and the image sensor collects the expanded first light component to obtain the first light component corresponding to the first light component. The light intensity of the characteristic spectrum;
使所述第三狹縫位於第二位置,第三光學透鏡對第二光分量進行擴束,所述圖像感測器採集擴束後的第二光分量獲得所述第二光分量對應的第二特徵光譜的光強。The third slit is located at the second position, the third optical lens expands the second light component, and the image sensor collects the expanded second light component to obtain the corresponding The light intensity of the second characteristic spectrum.
與習知技術相比,本發明所提供的技術方案具有以下優點:Compared with the conventional technology, the technical solution provided by the present invention has the following advantages:
本發明所提供的光譜檢測設備、終點檢測系統和方法,在衍射光柵和圖像感測器之間設置了擋板,該擋板具有狹縫,該狹縫的位置與需要採集的光分量的位置對應,且狹縫朝向圖像感測器的一側具有光學透鏡,該光學透鏡用於對光分量進行擴束,以擴大光分量在圖像感測器上的投影面積,使得圖像感測器利用更多的像素來採集光分量,從而可以採用較低的成本提高圖像感測器的信噪比,進而可以提高終點檢測系統的檢測靈敏度。In the spectrum detection equipment, endpoint detection system and method provided by the present invention, a baffle is arranged between the diffraction grating and the image sensor. The baffle has a slit. The position of the slit is different from the light component to be collected. The positions are corresponding, and the side of the slit facing the image sensor has an optical lens, which is used to expand the light component to enlarge the projection area of the light component on the image sensor, so that the image sensor The detector uses more pixels to collect light components, so that the signal-to-noise ratio of the image sensor can be improved at a lower cost, and the detection sensitivity of the endpoint detection system can be improved.
正如背景技術,習知的光譜檢測設備的信噪比較低。如第1圖所示,習知的一種光譜檢測設備包括衍射光柵11和圖像感測器12,如第2圖所示,衍射光柵11用於將被蝕刻物體10發出的光線分成沿Z方向依次排列的多個光分量,每個光分量具有各自的特定波長。圖像感測器12用於採集多個光分量中的兩個光分量A和B,其中,一個光分量A包括正在蝕刻的第一介質層101的第一特徵光譜,另一個光分量B包括第一介質層101底部的第二介質層102的第二特徵光譜。由於對第一介質層101進行蝕刻時第一特徵光譜的光強較大,對第二介質層102進行蝕刻時第二特徵光譜的光強較大,因此,藉由對這兩個特徵光譜的光強進行對比,即可判斷正在蝕刻的第一介質層101是否到達了蝕刻終點。As in the background art, the signal-to-noise ratio of the conventional spectral detection equipment is low. As shown in Figure 1, a conventional spectrum detection device includes a diffraction grating 11 and an
但是,由於第一特徵光譜和第二特徵光譜的頻譜寬度較窄,約為20nm,因此,圖像感測器12中僅有6%的有效像素用來採集所需的光分量A和B,其餘像素採集的信號都作為噪音干擾需要去除,從而使得圖像感測器12的信噪比較低,使得終點檢測系統的檢測靈敏度較低。However, since the spectral widths of the first characteristic spectrum and the second characteristic spectrum are relatively narrow, about 20 nm, only 6% of the effective pixels in the
基於此,本發明提供了一種光譜檢測設備,以克服習知技術存在的上述問題,包括衍射光柵、圖像感測器以及位於衍射光柵和圖像感測器之間的擋板,擋板具有至少一個狹縫;Based on this, the present invention provides a spectrum detection device to overcome the above-mentioned problems in the prior art, including a diffraction grating, an image sensor, and a baffle between the diffraction grating and the image sensor. The baffle has At least one slit;
衍射光柵用於將入射光分成沿一特定方向依次排列的多個光分量,每個所述光分量中的光束具有不同的波長;The diffraction grating is used to divide the incident light into a plurality of light components arranged in sequence along a specific direction, and the light beam in each of the light components has a different wavelength;
狹縫的位置與一個光分量的位置對應,狹縫朝向圖像感測器的一側具有光學透鏡,光學透鏡用於對一個光分量進行擴束;The position of the slit corresponds to the position of a light component, the side of the slit facing the image sensor has an optical lens, and the optical lens is used to expand the beam of one light component;
圖像感測器用於採集擴束後的一個光分量,以獲得一個光分量對應的特徵光譜的光強。The image sensor is used to collect a light component after beam expansion to obtain the light intensity of a characteristic spectrum corresponding to a light component.
本發明提供的光譜檢測設備、終點檢測系統和方法,在衍射光柵和圖像感測器之間設置了擋板,該擋板具有狹縫,該狹縫的位置與需要採集的光分量的位置對應,且狹縫朝向圖像感測器的一側具有光學透鏡,該光學透鏡用於對光分量進行擴束,以擴大光分量在圖像感測器上的投影面積,使得圖像感測器利用更多的像素來採集光分量,從而可以採用較低的成本提高圖像感測器的信噪比,提高終點檢測系統的檢測靈敏度。In the spectrum detection equipment, endpoint detection system and method provided by the present invention, a baffle is arranged between the diffraction grating and the image sensor, the baffle has a slit, and the position of the slit is the same as the position of the light component to be collected Correspondingly, and the side of the slit facing the image sensor has an optical lens, which is used to expand the light component to expand the projection area of the light component on the image sensor, so that the image sensor The detector uses more pixels to collect light components, so that the signal-to-noise ratio of the image sensor can be improved at a lower cost, and the detection sensitivity of the endpoint detection system can be improved.
以上是本發明的核心思想,為使本發明的上述目的、特徵和優點能夠更加明顯易懂,下面將結合本發明實施例中的圖式,對本發明實施例中的技術方案進行清楚、完整地描述,顯然,所描述的實施例僅僅是本發明一部分實施例,而不是全部的實施例。基於本發明中的實施例,所屬技術領域具有通常知識者在沒有做出進步性勞動前提下所獲得的所有其他實施例,都屬本發明保護的範圍。The above is the core idea of the present invention. In order to make the above objectives, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Description, obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person with ordinary knowledge in the technical field without making progressive work shall fall within the protection scope of the present invention.
本發明實施例提供了一種光譜檢測設備,如第3圖所示,包括衍射光柵31、圖像感測器32以及位於衍射光柵31和圖像感測器32之間的擋板33,該擋板33具有至少一個狹縫330,當然,本發明實施例中的光譜檢測設備還包括改變光路的反射鏡等器件,在此不再贅述。The embodiment of the present invention provides a spectrum detection device, as shown in Figure 3, comprising a
其中,衍射光柵31用於將光源30發出的入射光分成沿一特定方向依次排列的多個光分量,每個光分量中的光束具有不同的波長。多個光分量的排列方式可以為沿Z方向從上往下依次排列,也可以從紙面內往紙面外依次排列,本發明實施例中僅以沿Z方向從上往下依次排列為例進行說明,但並不僅限於此,其中多個光分量的排列方向由衍射光柵31的光柵結構決定。Wherein, the
需要說明的是,本發明實施例中的光源30可以是面向電漿處理腔的光學接收器,使得電漿處理腔中產生的光被接收器接收後經過光纖傳導進入本發明的光譜檢測裝置。電漿處理腔中發出的光譜會隨著蝕刻材料層、蝕刻氣體、反應副產物成分的變化而變化。It should be noted that the
本發明實施例中,每個狹縫330的位置與一個光分量的位置對應,其中,狹縫330能夠透光,而狹縫330四周的擋板能夠遮光,也就是說,狹縫330的作用是透射位置對應的光分量。並且,狹縫330朝向圖像感測器32的一側具有光學透鏡331,如第4圖所示,光學透鏡在擋板33上的投影完全覆蓋狹縫330,該光學透鏡331用於對狹縫330位置對應的光分量進行擴束,以擴大該光分量在圖像感測器32上的投影面積,使得圖像感測器32利用更多的像素來採集該光分量,從而提高了圖像感測器32的信噪比,提高了終點檢測系統的檢測靈敏度。可選地,光學透鏡331為散射透鏡。In the embodiment of the present invention, the position of each slit 330 corresponds to the position of a light component, wherein the
需要說明的是,當多個光分量從上往下排列時,狹縫330為橫向寬度大於縱向寬度的條狀狹縫,當多個光分量為從左往右排列時,狹縫330為橫向寬度小於縱向寬度的條狀狹縫,以藉由狹縫330使所需的光分量透射至圖像感測器32上,使不需要的光分量不能透射至圖像感測器32上,以避免擴束後的光分量與其他光分量混淆,影響圖像感測器32的檢測精準度。還需要說明的是,本發明實施例中狹縫330的位置可以根據需要設定,以便採集所需的光譜。It should be noted that when the multiple light components are arranged from top to bottom, the
本發明實施例中,圖像感測器32用於採集擴束後的光分量,以獲得擴束後的光分量對應的特徵光譜的光強。可選地,圖像感測器32為CCD(Charge-coupled Device,電荷耦合元件)。可選地,本發明實施例中的光譜檢測設備為光譜儀。當然,本發明並不僅限於此。In the embodiment of the present invention, the
本發明實施例中,在衍射光柵31和圖像感測器32之間設置了擋板33,該擋板33具有狹縫330,該狹縫330的位置與需要採集的光分量的位置對應,且狹縫330朝向圖像感測器32的一側具有光學透鏡331,該光學透鏡331用於對光分量進行擴束,以擴大光分量在圖像感測器32上的投影面積,使得圖像感測器32利用更多的像素來採集光分量,由於圖像感測器32的信噪比與像素數的平方根成比例增加,因此,可以藉由增大圖像感測器32利用的像素數增大圖像感測器32的信噪比,並且,本發明實施例中,擋板33和光學透鏡331的成本較低,也就是說,本發明實施例中採用較低的成本提高了圖像感測器32的信噪比,提高了終點檢測系統的檢測靈敏度。In the embodiment of the present invention, a
在本發明的另一實施例中,如第3圖所示,擋板33具有兩個狹縫,這兩個狹縫分別是第一狹縫330a和第二狹縫330b,衍射光柵31分成的多個光分量包括第一光分量A和第二光分量B。In another embodiment of the present invention, as shown in Figure 3, the
其中,第一狹縫330a的位置與第一光分量A的位置對應,第一狹縫330a朝向圖像感測器32的一側具有第一光學透鏡331a,第一光學透鏡331a用於對第一光分量A進行擴束。Wherein, the position of the
第二狹縫330b的位置與第二光分量B的位置對應,第二狹縫330b朝向圖像感測器32的一側具有第二光學透鏡331b,第二光學透鏡331b用於對第二光分量B進行擴束。The position of the
圖像感測器32用於採集擴束後的第一光分量A,獲得第一光分量A對應的第一特徵光譜的光強,採集擴束後的第二光分量B,獲得第二光分量B對應的第二特徵光譜的光強,以根據第一特徵光譜的光強與第二特徵光譜的光強之比,判斷是否到達蝕刻終點。The
由於第一特徵光譜是第一介質層的特徵光譜,第二特徵光譜是第一介質層底部的第二介質層的特徵光譜,且在對第一介質層進行蝕刻時,第一特徵光譜與第二特徵光譜的光強之比在第一範圍內,當第一介質層蝕刻完對第二介質層蝕刻時,第一特徵光譜與第二特徵光譜的光強之比在第二範圍內,基於此,只要獲得第一特徵光譜的光強與第二特徵光譜的光強之比,並將該光強之比與第一範圍和第二範圍進行對比,若在第一範圍內,且接近第一範圍的邊界值,則第一介質層即將被蝕刻完,也就是即將到達第一介質層的蝕刻終點,若在第二範圍內,則第一介質層已經蝕刻完成,也就是已經到達蝕刻終點。Since the first characteristic spectrum is the characteristic spectrum of the first dielectric layer, the second characteristic spectrum is the characteristic spectrum of the second dielectric layer at the bottom of the first dielectric layer, and when the first dielectric layer is etched, the first characteristic spectrum is The light intensity ratio of the two characteristic spectra is within the first range. When the first dielectric layer is etched and the second dielectric layer is etched, the light intensity ratio of the first characteristic spectrum to the second characteristic spectrum is within the second range, based on Therefore, as long as the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum is obtained, and the ratio of the light intensity is compared with the first range and the second range, if it is within the first range and close to the first range, Within a range of boundary values, the first dielectric layer is about to be etched, that is, the etching end point of the first dielectric layer is about to be reached. If it is within the second range, the first dielectric layer has been etched, that is, the etching end point has been reached. .
在本發明的另一實施例中,如第5圖所示,擋板33具有一個可移動的第三狹縫330c,衍射光柵31分成的多個光分量包括第一光分量A和第二光分量B。In another embodiment of the present invention, as shown in FIG. 5, the
其中,第三狹縫330c包括第一位置a和第二位置b,第一位置a與第一光分量A的位置對應,第二位置b與第二光分量B的位置對應。Wherein, the
第三狹縫330c朝向圖像感測器32的一側具有第三光學透鏡331c,第三光學透鏡331c隨第三狹縫330c移動,用於對第一光分量A和第二光分量B進行擴束。The side of the
圖像感測器32用於採集擴束後的第一光分量獲得第一光分量對應的第一特徵光譜的光強,採集擴束後的第二光分量獲得第二光分量對應的第二特徵光譜的光強,以根據第一特徵光譜的光強與第二特徵光譜的光強之比,判斷是否到達蝕刻終點。The
也就是說,當第三狹縫330c移動到第一位置a時,第三光學透鏡331c隨第三狹縫330c移動到第一位置a,第三狹縫330c的位置與第一光分量A的位置對應,第三光學透鏡331c對第一光分量A進行擴束,圖像感測器32採集擴束後的第一光分量A獲得第一光分量A對應的第一特徵光譜的光強;That is, when the
當第三狹縫330c移動到第二位置b時,第三光學透鏡331c隨第三狹縫330c移動到第二位置b,第三狹縫330c的位置與第二光分量B的位置對應,第三光學透鏡331c對第二光分量B進行擴束,圖像感測器32採集擴束後的第二光分量B獲得第二光分量B對應的第二特徵光譜的光強。When the
本實施例中,可以藉由馬達等驅動部件帶動擋板33在Z方向上移動,來改變第三狹縫330c的位置,當然,本發明並不僅限於此,在其他實施例中,也可以在第一位置a和第二位置b分別設置一個狹縫,並藉由遮擋其中一個狹縫,來實現第三狹縫330c在第一位置a和第二位置b之間的移動。In this embodiment, the position of the
此外,本實施例中,可以根據預設時間或特徵光譜的光強等,控制第三狹縫330c的移動時間。例如,在開始蝕刻時,先令第三狹縫330c處於第一位置a,採集第一特徵光譜的光強,當到達預設時間或第一特徵光譜的光強達到預設值後,移動第三狹縫330c,使第三狹縫330c處於第二位置b,採集第二特徵光譜的光強。In addition, in this embodiment, the movement time of the
在本發明的一個實施例中,如第6圖所示,一個光譜檢測設備中的擋板33僅具有一個狹縫,即擋板具有第一狹縫330a;多個光分量包括第一光分量A。In an embodiment of the present invention, as shown in Figure 6, the
第一狹縫330a的位置與第一光分量A的位置對應,第一狹縫330a朝向圖像感測器32的一側具有第一光學透鏡331a,第一光學透鏡331a用於對第一光分量A進行擴束;圖像感測器32用於採集擴束後的第一光分量A,獲得第一光分量A對應的第一特徵光譜的光強。The position of the
在本發明的另一個實施例中,如第7圖所示,另一個光譜檢測設備中的擋板33具有第二狹縫330b;多個光分量包括第二光分量B。In another embodiment of the present invention, as shown in FIG. 7, the
第二狹縫330b的位置與第二光分量B的位置對應,第二狹縫330b朝向圖像感測器32的一側具有第二光學透鏡331b,第二光學透鏡331b用於對第二光分量B進行擴束。The position of the
圖像感測器32用於採集擴束後的第二光分量B獲得第二光分量B對應的第二特徵光譜的光強。The
也就是說,本發明實施例中可以藉由一個光譜檢測設備獲得第一特徵光譜的光強,藉由另一個光譜檢測設備獲得第二特徵光譜的光強,然後再根據第一特徵光譜的光強與第二特徵光譜的光強之比,判斷是否到達蝕刻終點。That is to say, in the embodiment of the present invention, the light intensity of the first characteristic spectrum can be obtained by one spectrum detection device, the light intensity of the second characteristic spectrum can be obtained by another spectrum detection device, and then the light intensity of the first characteristic spectrum can be obtained according to the The ratio of the intensity to the light intensity of the second characteristic spectrum determines whether the etching end point is reached.
可選地,如第8圖所示,本發明實施例中的光譜檢測設備還包括反光鏡332;反光鏡332圍繞光分量在圖像感測器32上的投影設置,且反光鏡332在擋板33和圖像感測器32之間延伸。Optionally, as shown in Figure 8, the spectrum detection device in the embodiment of the present invention further includes a
具體地,反光鏡332不僅圍繞光分量A在圖像感測器32上的投影,還圍繞光分量B在圖像感測器32上的投影。基於此,被圖像感測器32反射逸出的光被反光鏡332反射回圖像感測器32上,從而可以減少光損失。Specifically, the
本發明實施例還提供了一種終點檢測系統,如第9圖所示,包括光譜檢測設備和處理元件。可選地,本發明實施例中的光譜檢測設備為光譜儀,處理元件為處理器或電腦等。The embodiment of the present invention also provides an endpoint detection system, as shown in Figure 9, including a spectrum detection device and a processing element. Optionally, the spectrum detection device in the embodiment of the present invention is a spectrometer, and the processing element is a processor or a computer.
其中,光譜檢測設備為第3圖所示的光譜檢測設備,也就是說,光譜檢測設備中的擋板33具有第一狹縫330a和第二狹縫330b。或者,光譜檢測設備為第5圖所示的光譜檢測設備,該光譜檢測設備具有可移動的第三狹縫330c。The spectrum detection device is the spectrum detection device shown in FIG. 3, that is, the
該光譜檢測設備用於根據被蝕刻物體蝕刻時產生的光線獲得第一特徵光譜λ1的光強和第二特徵光譜λ2的光強,被蝕刻物體包括在蝕刻方向上依次排列的第一介質層301和第二介質層302,如第10圖所示,第一特徵光譜λ1為第一介質層301的特徵光譜,第二特徵光譜λ2為第二介質層302的特徵光譜,其中,在蝕刻方向上依次排列是指對第一介質層301蝕刻完後會對第二介質層302進行蝕刻。處理元件用於根據第一特徵光譜λ1的光強與第二特徵光譜λ2的光強之比,判斷是否到達第一介質層301的蝕刻終點。The spectrum detection equipment is used to obtain the light intensity of the first characteristic spectrum λ1 and the light intensity of the second characteristic spectrum λ2 according to the light generated when the etched object is etched. The etched object includes the
本發明實施例中,藉由在衍射光柵和圖像感測器之間設置具有狹縫的擋板,且狹縫處具有放大光束的光學透鏡,從而可以採用較低的成本提高光譜檢測設備的信噪比,提高終點檢測系統的靈敏度。雖然習知技術中也有藉由算法或採用昂貴的高靈敏度的圖像感測器提高終點檢測系統的靈敏度的方案,但是,與其相比,本發明實施例中的高信噪比的光譜檢測設備的成本較低。In the embodiment of the present invention, by arranging a baffle with a slit between the diffraction grating and the image sensor, and an optical lens for amplifying the beam at the slit, it is possible to increase the performance of the spectrum detection equipment at a lower cost. The signal-to-noise ratio improves the sensitivity of the endpoint detection system. Although there are also schemes in the prior art to improve the sensitivity of the endpoint detection system by algorithms or by using expensive and high-sensitivity image sensors, compared with them, the spectral detection device with high signal-to-noise ratio in the embodiment of the present invention The cost is lower.
本發明實施例還提供了一種終點檢測方法,應用於第9圖所示的終點檢測系統,如第11圖所示,方法包括:The embodiment of the present invention also provides an endpoint detection method, which is applied to the endpoint detection system shown in Figure 9. As shown in Figure 11, the method includes:
S101:光譜檢測設備根據被蝕刻物體蝕刻時發出的光線獲得第一特徵光譜的光強和第二特徵光譜的光強,被蝕刻物體包括在蝕刻方向上依次排列的第一介質層和第二介質層,第一特徵光譜為第一介質層的特徵光譜,第二特徵光譜為第二介質層的特徵光譜;S101: The spectrum detection device obtains the light intensity of the first characteristic spectrum and the light intensity of the second characteristic spectrum according to the light emitted when the etched object is etched, and the etched object includes the first medium layer and the second medium arranged in sequence in the etching direction Layer, the first characteristic spectrum is the characteristic spectrum of the first dielectric layer, and the second characteristic spectrum is the characteristic spectrum of the second dielectric layer;
S102:處理元件根據第一特徵光譜的光強與第二特徵光譜的光強之比,判斷是否到達第一介質層的蝕刻終點。S102: The processing element determines whether the etching end point of the first dielectric layer is reached according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum.
具體地,被蝕刻物體如第一介質層被蝕刻時,被蝕刻的材料會被射頻電場激發解離形成電漿,發射的光被光譜檢測設備採集後,會獲得各個波長的光譜的光強,從其中可以獲得需要的第一特徵光譜的光強和第二特徵光譜的光強,之後處理元件根據第一特徵光譜的光強與第二特徵光譜的光強之比,即可判斷是否到達第一介質層的蝕刻終點。Specifically, when the etched object, such as the first dielectric layer, is etched, the etched material will be excited and dissociated by the radio frequency electric field to form plasma. After the emitted light is collected by the spectrum detection device, the light intensity of the spectrum of each wavelength will be obtained. The light intensity of the first characteristic spectrum and the light intensity of the second characteristic spectrum can be obtained, and then the processing element can judge whether it reaches the first characteristic spectrum according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum. The etching end point of the dielectric layer.
當光譜檢測設備為第3圖所示的光譜檢測設備時,光譜檢測設備根據被蝕刻物體蝕刻時產生的光線獲得第一特徵光譜的光強和第二特徵光譜的光強包括:When the spectrum detection device is the spectrum detection device shown in Figure 3, the spectrum detection device obtains the light intensity of the first characteristic spectrum and the light intensity of the second characteristic spectrum according to the light generated when the etched object is etched, including:
衍射光柵31將採集的被蝕刻物體蝕刻時產生的光分成沿特定方向Z依次排列的多個光分量,每個光分量中的光束具有不同的波長,其中,多個光分量包括第一光分量A和第二光分量B;第一狹縫330a透射第一光分量A,第一光學透鏡331a對第一光分量A進行擴束,第二狹縫330b透射第二光分量B,第二光學透鏡331b對第二光分量B進行擴束;圖像感測器32採集擴束後的第一光分量A,獲得第一光分量A對應的第一特徵光譜的光強,採集擴束後的第二光分量B,獲得第二光分量B對應的第二特徵光譜的光強。The
當光譜檢測設備為第5圖所示的光譜檢測設備時,即當擋板33具有可移動的第三狹縫330c時,光譜檢測設備根據被蝕刻物體蝕刻時產生的光線獲得第一特徵光譜的光強和第二特徵光譜的光強包括:When the spectrum detection device is the spectrum detection device shown in Figure 5, that is, when the
衍射光柵31將採集的被蝕刻物體蝕刻時產生的光分成沿特定方向Z依次排列的多個光分量,每個光分量中的光束具有不同的波長,其中,多個光分量包括第一光分量A和第二光分量B;The
使第三狹縫330c位於第一位置a,第三光學透鏡331c對第一光分量A進行擴束,圖像感測器32採集擴束後的第一光分量A獲得第一光分量A對應的第一特徵光譜的光強;The
使第三狹縫330c位於第二位置b,第三光學透鏡331c對第二光分量B進行擴束,圖像感測器32採集擴束後的第二光分量B獲得第二光分量B對應的第二特徵光譜的光強。The
本實施例中,可以藉由馬達等驅動部件帶動擋板33在Z方向上移動,來改變第三狹縫330c的位置,當然,本發明並不僅限於此,在其他實施例中,也可以在第一位置a和第二位置b分別設置一個狹縫,並藉由遮擋其中一個狹縫,來實現第三狹縫330c在第一位置a和第二位置b之間的移動。In this embodiment, the position of the
此外,本實施例中,可以根據預設時間或特徵光譜的光強等,控制第三狹縫330c的移動時間。例如,在開始蝕刻時,先令第三狹縫330c處於第一位置a,採集第一特徵光譜的光強,當到達預設時間或第一特徵光譜的光強達到預設值後,移動第三狹縫330c,使第三狹縫330c處於第二位置b,採集第二特徵光譜的光強。In addition, in this embodiment, the movement time of the
本發明實施例還提供了一種終點檢測系統,如第12圖所示,包括第一光譜檢測設備、第二光譜檢測設備、分光元件和處理元件。可選地,本發明實施例中的第一光譜檢測設備和第二光譜檢測設備都為光譜儀,處理元件為處理器或電腦等。The embodiment of the present invention also provides an endpoint detection system, as shown in Figure 12, including a first spectrum detection device, a second spectrum detection device, a spectroscopic element, and a processing element. Optionally, both the first spectrum detection device and the second spectrum detection device in the embodiment of the present invention are spectrometers, and the processing element is a processor or a computer.
其中,分光元件用於將被蝕刻物體蝕刻時產生的光線分成第一光線和第二光線,並使第一光線入射到第一光譜檢測設備,使第二光線入射到第二光譜檢測設備;可選地,分光元件的分光比為1:1,也就是說,分光元件將發出的光線中的一半光線分給了第一光譜檢測設備,將另一半光線分給了第二光譜檢測設備。Wherein, the spectroscopic element is used to divide the light generated when the etched object is etched into the first light and the second light, and make the first light enter the first spectrum detection device, and make the second light enter the second spectrum detection device; Optionally, the light splitting ratio of the light splitting element is 1:1, that is, the light splitting element distributes half of the emitted light to the first spectrum detection device and the other half to the second spectrum detection device.
第一光譜檢測設備為第6圖所示的光譜檢測設備;第一光譜檢測設備用於根據第一光線獲得第一特徵光譜λ1的光強,第一特徵光譜λ1為第一介質層301的特徵光譜;The first spectrum detection device is the spectrum detection device shown in Figure 6; the first spectrum detection device is used to obtain the light intensity of the first characteristic spectrum λ1 according to the first light, and the first characteristic spectrum λ1 is the characteristic of the
第二光譜檢測設備為第7圖的光譜檢測設備;第二光譜檢測設備用於根據第二光線獲得第二特徵光譜λ2的光強,第二特徵光譜λ2為第二介質層302的特徵光譜,第二介質層302在蝕刻方向上位於第一介質層301的底部;The second spectrum detection device is the spectrum detection device of Figure 7; the second spectrum detection device is used to obtain the light intensity of the second characteristic spectrum λ2 according to the second light, and the second characteristic spectrum λ2 is the characteristic spectrum of the
處理元件用於根據第一特徵光譜λ1的光強與第二特徵光譜λ2的光強之比,判斷是否到達第一介質層301的蝕刻終點。The processing element is used to determine whether the etching end point of the
本發明實施例還提供了一種終點檢測方法,如第13圖所示,應用於第12圖所示的終點檢測系統,方法包括:The embodiment of the present invention also provides an endpoint detection method, as shown in FIG. 13, which is applied to the endpoint detection system shown in FIG. 12, and the method includes:
S201:分光元件將被蝕刻物體蝕刻時發出的光線分成第一光線和第二光線,並使第一光線入射到第一光譜檢測設備,使第二光線入射到第二光譜檢測設備,被蝕刻物體包括在蝕刻方向上依次排列的第一介質層和第二介質層;S201: The spectroscopic element divides the light emitted during the etching of the etched object into a first light and a second light, and makes the first light enter the first spectrum detection device, and the second light enters the second spectrum detection device, and the etched object Comprising a first dielectric layer and a second dielectric layer arranged in sequence in the etching direction;
S202:第一光譜檢測設備根據第一光線獲得第一特徵光譜的光強,第一特徵光譜為第一介質層的特徵光譜;S202: The first spectrum detection device obtains the light intensity of the first characteristic spectrum according to the first light, and the first characteristic spectrum is the characteristic spectrum of the first medium layer;
S203:第二光譜檢測設備根據第二光線獲得第二特徵光譜的光強,第二特徵光譜為第二介質層的特徵光譜,第二介質層在蝕刻方向上位於第一介質層的底部;S203: The second spectrum detection device obtains the light intensity of the second characteristic spectrum according to the second light, the second characteristic spectrum is the characteristic spectrum of the second dielectric layer, and the second dielectric layer is located at the bottom of the first dielectric layer in the etching direction;
S204:處理元件根據第一特徵光譜的光強與第二特徵光譜的光強之比,判斷是否到達第一介質層的蝕刻終點。S204: The processing element determines whether the etching end point of the first dielectric layer is reached according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum.
具體地,被蝕刻物體如第一介質層被蝕刻時,被蝕刻的材料會被射頻電場激發解離形成電漿,發射的光被分光元件分成第一光線和第二光線,並使第一光線入射到第一光譜檢測設備,使第二光線入射到第二光譜檢測設備,之後第一光譜檢測設備根據第一光線獲得第一特徵光譜的光強,第二光譜檢測設備根據第二光線獲得第二特徵光譜的光強,處理元件根據第一特徵光譜的光強與第二特徵光譜的光強之比,判斷是否到達第一介質層的蝕刻終點。其中,光譜檢測設備獲得特徵光譜光強的過程與上類似,在此不再贅述。Specifically, when the etched object, such as the first dielectric layer, is etched, the etched material will be excited and dissociated by the radio frequency electric field to form a plasma, and the emitted light is divided into the first light and the second light by the light splitting element, and the first light is incident To the first spectrum detection device, the second light is incident on the second spectrum detection device, and then the first spectrum detection device obtains the light intensity of the first characteristic spectrum according to the first light, and the second spectrum detection device obtains the second light according to the second light. According to the light intensity of the characteristic spectrum, the processing element judges whether it reaches the etching end point of the first dielectric layer according to the ratio of the light intensity of the first characteristic spectrum to the light intensity of the second characteristic spectrum. Among them, the process of obtaining the characteristic spectral light intensity by the spectral detection device is similar to the above, and will not be repeated here.
需要說明的是,若判定到達第一介質層的蝕刻終點之後,處理元件可以發出提示,提醒工作人員停止蝕刻設備,或處理元件可以直接控制蝕刻設備停止工作,以保證蝕刻精準度,避免出現過蝕刻的情況。It should be noted that if it is determined that the etching end point of the first dielectric layer is reached, the processing element can issue a prompt to remind the staff to stop the etching equipment, or the processing element can directly control the etching equipment to stop working to ensure the accuracy of etching and avoid excessive occurrence. Etching situation.
還需要說明的是,本發明實施例中不僅可以藉由設置狹縫和光學透鏡提高終點檢測系統的檢測靈敏度,還可以藉由提高衍射光柵31的精度提高終點檢測系統的檢測靈敏度,在此不再贅述。It should also be noted that in the embodiment of the present invention, not only can the detection sensitivity of the endpoint detection system be improved by setting slits and optical lenses, but also the detection sensitivity of the endpoint detection system can be improved by increasing the accuracy of the
本說明書中各個實施例採用遞進的方式描述,每個實施例重點說明的都是與其他實施例的不同之處,各個實施例之間相同相似部分互相參見即可。對於實施例公開的裝置而言,由於其與實施例公開的方法相對應,所以描述的比較簡單,相關之處參見方法部分說明即可。The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the method part.
對所公開的實施例的上述說明,使本領域專業技術人員能夠實現或使用本發明。對這些實施例的多種修改對本領域的專業技術人員來說將是顯而易見的,本文中所定義的一般原理可以在不脫離本發明的精神或範圍的情況下,在其它實施例中實現。因此,本發明將不會被限制於本文所示的這些實施例,而是要符合與本文所公開的原理和新穎特點相一致的最寬的範圍。The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown in this document, but should conform to the widest scope consistent with the principles and novel features disclosed in this document.
10:被蝕刻物體
11:衍射光柵
12:圖像感測器
30:光源
31:衍射光柵
32:圖像感測器
33:擋板
101:第一介質層
102:第二介質層
301:第一介質層
302:第二介質層
330:狹縫
330a:第一狹縫
330b:第二狹縫
330c:第三狹縫
331:光學透鏡
331a:第一光學透鏡
331b:第二光學透鏡
331c:第三光學透鏡
332:反光鏡
A:第一光分量
a:第一位置
B:第二光分量
b:第二位置
S101、S102、S201、S202、S203、S204:步驟
Z:方向10: Object to be etched
11: Diffraction grating
12: Image sensor
30: light source
31: Diffraction grating
32: Image sensor
33: bezel
101: The first dielectric layer
102: second dielectric layer
301: The first dielectric layer
302: second dielectric layer
330:
為了更清楚地說明本發明實施例或習知技術中的技術方案,下面將對實施例或習知技術描述中所需要使用的圖式作簡單地介紹,顯而易見地,下面描述中的圖式僅僅是本發明的實施例,對於所屬技術領域具有通常知識者而言,在不付出進步性勞動的前提下,還可以根據提供的圖式獲得其他的圖式。 第1圖為習知的一種光譜檢測設備的結構示意圖; 第2圖為第1圖所示的多個光分量的排列方式示意圖; 第3圖為本發明實施例提供的一種光譜檢測設備的結構示意圖; 第4圖為第3圖所示擋板的局部結構放大圖; 第5圖為本發明實施例提供的另一種光譜檢測設備的結構示意圖; 第6圖為本發明實施例提供的另一種光譜檢測設備的結構示意圖; 第7圖為本發明實施例提供的另一種光譜檢測設備的結構示意圖; 第8圖為本發明實施例提供的另一種光譜檢測設備的結構示意圖; 第9圖為本發明實施例提供的一種終點檢測系統的結構示意圖; 第10圖為本發明實施例提供的一種特徵光譜的曲線圖; 第11圖為本發明實施例提供的一種終點檢測方法的流程圖; 第12圖為本發明實施例提供的另一種終點檢測系統的結構示意圖; 第13圖為本發明實施例提供的另一種終點檢測方法的流程圖。In order to more clearly describe the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are merely It is an embodiment of the present invention. For those with ordinary knowledge in the technical field, other schemas can be obtained according to the provided schema without making progressive labor. Figure 1 is a schematic diagram of the structure of a conventional spectrum detection equipment; Figure 2 is a schematic diagram of the arrangement of multiple light components shown in Figure 1; Figure 3 is a schematic structural diagram of a spectrum detection device provided by an embodiment of the present invention; Figure 4 is an enlarged view of the partial structure of the baffle shown in Figure 3; Figure 5 is a schematic structural diagram of another spectrum detection device provided by an embodiment of the present invention; Figure 6 is a schematic structural diagram of another spectrum detection device provided by an embodiment of the present invention; Figure 7 is a schematic structural diagram of another spectrum detection device provided by an embodiment of the present invention; Figure 8 is a schematic structural diagram of another spectrum detection device provided by an embodiment of the present invention; Figure 9 is a schematic structural diagram of an endpoint detection system provided by an embodiment of the present invention; Figure 10 is a graph of a characteristic spectrum provided by an embodiment of the present invention; Figure 11 is a flowchart of an endpoint detection method provided by an embodiment of the present invention; Figure 12 is a schematic structural diagram of another endpoint detection system provided by an embodiment of the present invention; Figure 13 is a flowchart of another endpoint detection method provided by an embodiment of the present invention.
30:光源 30: light source
31:衍射光柵 31: Diffraction grating
32:圖像感測器 32: Image sensor
330:狹縫 330: slit
330a:第一狹縫 330a: first slit
330b:第二狹縫 330b: second slit
331:光學透鏡 331: optical lens
331a:第一光學透鏡 331a: the first optical lens
331b:第二光學透鏡 331b: second optical lens
A:第一光分量 A: The first light component
B:第二光分量 B: second light component
Z:方向 Z: direction
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JP3035388B2 (en) * | 1991-09-02 | 2000-04-24 | オリンパス光学工業株式会社 | Plasma etcher endpoint detection device |
JP3242526B2 (en) * | 1994-05-24 | 2001-12-25 | オリンパス光学工業株式会社 | Plasma etcher endpoint detection device |
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JP3250426B2 (en) * | 1995-09-27 | 2002-01-28 | 安藤電気株式会社 | Optical spectrum measurement device |
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US6812452B2 (en) * | 2000-10-18 | 2004-11-02 | Fibera, Inc. | Apparatus and method for measuring the wavelength of light present in a light beam |
CN100381799C (en) * | 2001-03-23 | 2008-04-16 | 东京电子株式会社 | Method and appts. for endpoint detection using partial least squares |
KR100426988B1 (en) * | 2001-11-08 | 2004-04-14 | 삼성전자주식회사 | end point detector in semiconductor fabricating equipment and method therefore |
US20080176149A1 (en) * | 2006-10-30 | 2008-07-24 | Applied Materials, Inc. | Endpoint detection for photomask etching |
JP5655437B2 (en) * | 2009-09-14 | 2015-01-21 | 株式会社リコー | Spectral characteristics acquisition device |
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