TW202102088A - Electronic device - Google Patents

Abstract

The invention discloses a manufacturing method of shell structure and electronic device. The manufacturing method of shell structure comprises the steps of: providing a plurality of memory molecular materials; heating the plurality of the memory molecular materials; and forming the plurality of heated memory molecular materials to be the shell structure of a first form by means of a printing method.

Description

Manufacturing method of shell structure and electronic device

The present invention relates to the technical field of 4D printing, in particular to a manufacturing method and electronic device of a housing structure using 4D printing technology.

4D printing refers to the addition of time elements on the basis of 3D printing, thereby becoming 4D technology; in fact, it is a 3D printing technology that uses materials that can automatically deform. 4D printing technology will bring revolutionary changes to the fields of software, robotics, art and even space exploration.

The technical problem to be solved by the present invention is to provide a method for manufacturing a housing structure and an electronic device for the disadvantages of the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a method for manufacturing a shell structure, which includes the following steps: providing a plurality of memory molecular materials; heating a plurality of the memory polymer materials; And by a printing method, a plurality of the memory alloy materials after heating form the shell structure with a first form.

In order to solve the above technical problem, another technical solution adopted by the present invention is to provide an electronic device, which includes a main body structure, a housing structure manufactured according to the above manufacturing method, a roller module, and a processing module . The shell structure can be detachably joined to the main structure, and defines an accommodation space with the main structure. The roller module can be movably arranged on the shell structure. The processing module is arranged in the containing space and can be electrically connected to an external device.

One of the beneficial effects of the present invention is that the manufacturing method of the housing structure provided by the present invention can be achieved by "providing a plurality of memory molecular materials", "heating a plurality of memory polymer materials" and "by a row The printing method enables the heated plurality of the memory alloy materials to form the “shell structure with a first form” to improve the structural performance of the shell structure.

Another beneficial effect of the present invention is that the electronic device provided by the present invention can pass "an electronic device, which includes a main body structure, a shell structure made according to the above manufacturing method, a roller module, and a processing "Module", "The shell structure has a first form, and the shell structure is detachably joined to the main structure, and defines an accommodation space with the main structure", "The roller module can be movably arranged in the The technical solutions of "shell structure" and "the processing module is arranged in the accommodating space and can be electrically connected to an external device" to improve the structural performance of the electronic device.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

The following is a specific embodiment to illustrate the implementation of the "housing structure manufacturing method and electronic device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

It should be understood that although terms such as “first”, “second”, and “third” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIG. 1, which is a flowchart of a manufacturing method of a housing structure according to a first embodiment of the present invention. As shown in the figure, the first embodiment of the present invention provides a manufacturing method of a housing structure, which includes the following steps:

First, a plurality of memory molecular materials are provided (step S100). For example, memory molecular materials include polyamide 12 and hydrogel. Polyamide 12 (PA 12) can be a shape memory polymer.

Next, heat a plurality of memory polymer materials (step S102). For example, after mixing the polyamide 12 and the hydrogel, heating is performed to fully mix the polyamide 12 and the hydrogel; wherein the heating temperature is between 150 and 180 degrees, and the heating time is 12 hours.

Next, the heated memory alloy materials are formed into a shell structure having a first form by a printing method (step S104). For example, the mixed polyamide 12 and hydrogel are printed through a 3D printing device to form a shell structure S. The shell structure S has a first form (as shown in FIG. 3), that is, not The deformed state. Among them, the housing structure S can be applied to any technical field of electronic devices, such as a mouse, a mobile phone, a tablet, a keyboard, a headset, etc. The mouse is taken as an example in the present invention, but is not limited thereto.

Further, the manufacturing method of the housing structure of the present invention further includes the following steps:

A heating means is applied to the shell structure S of the first form to change the shell structure S from the first form to a second form (step S106). For example, when the user heats the shell structure by heating means, that is, heats the shell structure S by means of hand, lamp or light, the shell structure S will change from the first form (that is, without The deformed state) changes to the second form (that is, the deformed state, as shown in Figure 4). Among them, in this step, the heating temperature is between 30 and 35 degrees.

In the above, the heating means may include heating the shell structure by hand, light or light, but it is not limited to this.

However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

[Second Embodiment]

Please refer to FIG. 2, which is a flowchart of the manufacturing method of the housing structure according to the second embodiment of the present invention, and please also refer to FIG. 1. As shown in the figure, the manufacturing method of the housing structure of the present invention further includes the following steps:

By performing a cooling means on the housing structure S of the second form, the housing structure S is changed from the second form to the first form (step S108). For example, when the user cools the shell structure by cooling means, that is, when the shell structure S is left to cool and the temperature is lower than 30 degrees, the shell structure S will change from the second form (ie, deform The state, as shown in Figure 4), returns to the first form (that is, the undeformed state, as shown in Figure 3).

In the above, the cooling means includes a static shell structure S or other cooling means to cool the shell structure S.

However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

[Third Embodiment]

Please refer to FIGS. 3 to 5, which are respectively a first structural diagram, a second structural diagram, and a functional block diagram of the electronic device according to the third embodiment of the present invention. Please also refer to FIGS. 1 and 2 together. As shown in the figure, the third embodiment of the present invention provides an electronic device Z, which includes a main structure 1, a housing structure S manufactured according to the above-mentioned manufacturing method, a roller module 2 and a processing module 3. The housing structure S has a first form. The housing structure S is detachably connected to the main structure 1 and defines an accommodation space M with the main structure 1. The roller module 2 can be movably arranged on the housing structure S. The processing module 3 is disposed in the accommodating space M, and can be electrically connected to an external device A.

Specifically, the electronic device Z provided by the third embodiment of the present invention includes a main body structure 1, a housing structure S, a roller module 2, and a processing module 3. The housing structure S is determined by the above-mentioned manufacturing method of the housing structure. It is prepared and has the first form (that is, the undeformed state, as shown in Figure 3); wherein, the shell structure S contains a plurality of memory molecular materials, and the memory molecular materials include polyamide 12 and hydrogel, but Not limited to this. The main structure 1 may be a lower cover structure, and the housing structure S may be an upper cover structure. The housing structure S is detachably connected to the main structure 1, and defines a housing for accommodating the processing module 3 with the main structure 1 Space M; Among them, the processing module 3 can include a circuit board, a processor and a sensor, and can be electrically connected to an external device A. The roller module 2 can be movably arranged on the housing structure S and movably connected with the processing module 3.

Furthermore, the electronic device Z provided by the present invention can be a mouse device. The user can connect to an external device A (such as a computer) through the electronic device Z. The processing module 3 can generate a corresponding signal according to the displacement of the electronic device Z or the rotation of the wheel module 2 and send it to the external device A.

In addition, when the user heats the shell structure S by hand, lamp or light, the shell structure S will change from the first form (that is, the undeformed state) to the second form (that is, the deformed state). State); Among them, the shell structure S in the second form, the surface will present a special network-like structure (as shown in Figure 4). In this way, the special structure produced by the second form of the shell structure S can reduce the area of the user's palm contacting the shell structure S and achieve the effect of heat dissipation.

Conversely, when the user cools the housing structure S by standing the housing structure S or other cooling means, the housing structure S will change from the second form to the first form; wherein, the housing structure S is in the first form. In one form, the surface will show a smooth structure (as shown in Figure 4).

However, the above-mentioned example is only one of the feasible embodiments and is not intended to limit the present invention.

[Beneficial effects of the embodiment]

One of the beneficial effects of the present invention is that the manufacturing method of the housing structure provided by the present invention can be achieved by "providing a plurality of memory molecular materials", "heating a plurality of memory polymer materials", and "using a print In this way, the heated multiple memory alloy materials form a technical solution with a first form of the shell structure S", so as to improve the structural performance of the shell structure S.

Another beneficial effect of the present invention is that the electronic device provided by the present invention can be achieved by "the electronic device Z includes a main body structure 1, a housing structure S manufactured according to the above manufacturing method, a roller module 2 and a The processing module 3" and "the housing structure S have a first form. The housing structure S is detachably connected to the main structure 1, and defines an accommodation space M with the main structure 1", the "roller module 2 can be The technical solutions of movably disposed in the housing structure S" and "the processing module 3 is disposed in the accommodating space M and can be electrically connected to an external device A" to improve the structural performance of the electronic device Z.

Furthermore, the manufacturing method of the housing structure and the electronic device of the present invention can provide a housing structure S that can actively change the structure shape with time and external factors through the above technical solutions; and, by providing the housing The electronic device Z of the structure S can achieve the effect of light weight, and has the function of changing the shape, and can be contracted and expanded, thereby improving the structural performance of the electronic device Z.

The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and schematic content of the present invention are included in the present invention. Within the scope of patent application.

Z: Electronic device 1: main structure S: Shell structure 2: Wheel module 3: Processing module M: accommodation space A: External device

Fig. 1 is a flowchart of a manufacturing method of a housing structure according to a first embodiment of the present invention.

Fig. 2 is a flowchart of a manufacturing method of a housing structure according to a second embodiment of the present invention.

FIG. 3 is a schematic diagram of a first structure of an electronic device according to a third embodiment of the present invention.

4 is a schematic diagram of a second structure of the electronic device according to the third embodiment of the present invention.

FIG. 5 is a functional block diagram of an electronic device according to a third embodiment of the invention.

Claims (10)

A manufacturing method of a shell structure includes the following steps: providing a plurality of memory molecular materials; heating a plurality of the memory polymer materials; and forming a plurality of the memory alloy materials after heating by a printing method. The housing structure of the first form. The manufacturing method of the shell structure as described in the scope of the patent application, further includes the following steps: by heating the shell structure of the first form, so that the shell structure is replaced by the first The form changes to a second form. According to the manufacturing method of the shell structure described in the scope of the patent application, the heating means includes heating the shell structure with a hand. The manufacturing method of the shell structure as described in the scope of the patent application, further includes the following steps: by performing a cooling means on the shell structure of the second form, so that the shell structure is removed from the second form The form changes to this first form. According to the manufacturing method of the shell structure described in item 4 of the scope of the patent application, the cooling means includes standing the shell structure to cool it. According to the manufacturing method of the shell structure described in item 1 of the scope of patent application, the memory molecule material includes polyamide 12 and hydrogel. An electronic device, comprising: a main body structure; a housing structure manufactured according to the manufacturing method of items 1 to 6 of the scope of patent application, the housing structure having a first form, and the housing structure can be detachably joined to The main structure and the main structure define an accommodating space; a roller module, which can be movably arranged in the housing structure; and a processing module, which is arranged in the accommodating space and can be electrically connected Sexually connect an external device. According to the electronic device described in claim 7, wherein the housing structure is subjected to a heating means to change from the first form to the second form. The electronic device described in item 8 of the scope of patent application, wherein the housing structure is subjected to a cooling means to change from the second form to the first form. According to the electronic device described in claim 7, wherein the housing structure includes a plurality of memory molecular materials, and the memory molecular materials include polyamide 12 and hydrogel.

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