TW202046658A - Electronic apparatus - Google Patents

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TW202046658A
TW202046658A TW108120355A TW108120355A TW202046658A TW 202046658 A TW202046658 A TW 202046658A TW 108120355 A TW108120355 A TW 108120355A TW 108120355 A TW108120355 A TW 108120355A TW 202046658 A TW202046658 A TW 202046658A
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electronic device
display
device described
signal trace
trace
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TW108120355A
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Chinese (zh)
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TWI753265B (en
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黃巧綾
李瑞倪
洪毅瑋
許家銘
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奇景光電股份有限公司
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Abstract

A display apparatus is provided, which includes a display panel, a display driving chip and a connection component. The display driver chip is coupled to the display panel. A signal trace of the connection component has a first portion and a second portion, in which the first portion is arranged for receiving an image data signal, and the second portion is coupled to the display driving chip. The impedence per unit of the second portion of the signal trace is greater than that that of the first portion of the signal trace.

Description

電子裝置 Electronic device

本發明是指一種電子裝置,且特別是指一種可降低影像資料訊號傳輸對無線通訊之干擾的電子裝置。 The present invention refers to an electronic device, and in particular to an electronic device that can reduce the interference of image data signal transmission to wireless communication.

對於具有顯示面板的電子裝置而言,顯示驅動電路通常是透過印刷電路板接收影像資料訊號,並對影像資料訊號進行處理後輸出至將顯示面板,使得顯示面板據以顯示畫面。此外,現今許多電子裝置,特別是行動電子裝置,同時具備畫面顯示及無線通訊功能,例如蜂巢式(cellular)行動通訊、無線區域網路(wireless local area network;WLAN)通訊、藍牙(bluetooth)通訊、近場通訊(near field communication;NFC)、全球導航衛星系統(global navigation satellite system;GNSS)定位等。在一些常見的電子裝置中,應用處理器是透過柔性印刷電路板將影像資料訊號傳輸至顯示驅動電路。然而,柔性印刷電路板在傳輸訊號時產生電場的可能對無線通訊造成干擾,而導致無線通訊的靈敏度下降(desense)。 For electronic devices with a display panel, the display driving circuit usually receives image data signals through a printed circuit board, processes the image data signals and outputs them to the display panel, so that the display panel displays images accordingly. In addition, many electronic devices, especially mobile electronic devices, have screen display and wireless communication functions at the same time, such as cellular mobile communication, wireless local area network (WLAN) communication, and Bluetooth (bluetooth) communication. , Near field communication (NFC), global navigation satellite system (GNSS) positioning, etc. In some common electronic devices, the application processor transmits image data signals to the display driving circuit through a flexible printed circuit board. However, the electric field generated by the flexible printed circuit board during signal transmission may cause interference to wireless communication, resulting in a desense of wireless communication.

本發明的目的是在於提供一種電子裝置,其可有效降低在影像資料訊號傳輸時對無線通訊之干擾,確保無線通訊的品質。 The purpose of the present invention is to provide an electronic device which can effectively reduce the interference to wireless communication during image data signal transmission and ensure the quality of wireless communication.

本發明之一方面是有關於一種電子裝置,包含顯示面板、顯示驅動晶片和連接部件。顯示驅動晶片耦接至顯示面板。連接部件具有第一部分和第二部分,其中第一部分用以接收影像資料訊號,且第二部分耦接至顯示驅動晶片。第二部分之訊號跡線的單位長度阻抗值大於第一部分之訊號跡線的單位長度阻抗值。 One aspect of the present invention relates to an electronic device including a display panel, a display driving chip and connecting components. The display driver chip is coupled to the display panel. The connecting component has a first part and a second part. The first part is used for receiving the image data signal, and the second part is coupled to the display driver chip. The impedance per unit length of the signal trace in the second part is greater than the impedance per unit length of the signal trace in the first part.

依據本發明之一或多個實施例,上述第二部分的訊號跡線寬度小於上述第一部分的訊號跡線寬度。 According to one or more embodiments of the present invention, the signal trace width of the second part is smaller than the signal trace width of the first part.

依據本發明之一或多個實施例,上述顯示驅動晶片為觸控顯示驅動整合(touch with display driver integration;TDDI)晶片。 According to one or more embodiments of the present invention, the above-mentioned display driver chip is a touch with display driver integration (TDDI) chip.

依據本發明之一或多個實施例,上述顯示驅動晶片是直接設置於上述顯示面板上。 According to one or more embodiments of the present invention, the display driver chip is directly disposed on the display panel.

依據本發明之一或多個實施例,上述連接部件為柔性印刷電路板(flexible printed circuit;FPC)或柔性扁平排線(flexible flat cable;FFC)。 According to one or more embodiments of the present invention, the above-mentioned connecting component is a flexible printed circuit (FPC) or a flexible flat cable (FFC).

依據本發明之一或多個實施例,上述連接部件更包含柔性基材。在上述連接部件的第一部分中,上述連接部件的訊號跡線與接地跡線位於柔性基材的相對兩側,且在上述連接部件的第二部分中,上述連接部件的訊號跡線與接地跡線位於柔性基材的同側。 According to one or more embodiments of the present invention, the above-mentioned connecting member further includes a flexible substrate. In the first part of the connecting component, the signal trace and the ground trace of the connecting component are located on opposite sides of the flexible substrate, and in the second part of the connecting component, the signal trace and the ground trace of the connecting component The thread is on the same side of the flexible substrate.

依據本發明之一或多個實施例,上述電子裝置更包含應用處理器(application processor),其耦接至上述連接部件的第二部分,且用以提供上述影像資料訊號。 According to one or more embodiments of the present invention, the above-mentioned electronic device further includes an application processor, which is coupled to the second part of the above-mentioned connecting member and used for providing the above-mentioned image data signal.

依據本發明之一或多個實施例,上述應用處理器與上述顯示驅動晶片之間的訊號傳輸符合行動產業處理器介面(Mobile Industry Processor Interface;MIPI)聯盟制定之顯示器串列介面(Display Serial Interface;DSI)規格。 According to one or more embodiments of the present invention, the signal transmission between the application processor and the display driver chip conforms to the Display Serial Interface (Display Serial Interface) defined by the Mobile Industry Processor Interface (MIPI) alliance. ; DSI) specifications.

依據本發明之一或多個實施例,上述電子裝置更包含無線通訊模組,其用以發射或接收無線訊號。 According to one or more embodiments of the present invention, the aforementioned electronic device further includes a wireless communication module for transmitting or receiving wireless signals.

依據本發明之一或多個實施例,上述無線通訊模組為蜂巢式(cellular)行動通訊模組、無線區域網路(wireless local area network;WLAN)模組、藍牙(bluetooth)模組、近場通訊(near field communication;NFC)模組或全球導航衛星系統(global navigation satellite system;GNSS)模組。 According to one or more embodiments of the present invention, the above-mentioned wireless communication module is a cellular mobile communication module, a wireless local area network (WLAN) module, a bluetooth module, a proximity Near field communication (NFC) module or global navigation satellite system (GNSS) module.

100‧‧‧電子裝置 100‧‧‧Electronic device

110‧‧‧顯示面板 110‧‧‧Display Panel

120‧‧‧驅動顯示晶片 120‧‧‧Drive the display chip

130‧‧‧無線通訊模組 130‧‧‧Wireless communication module

140‧‧‧應用處理器 140‧‧‧Application Processor

150‧‧‧連接部件 150‧‧‧Connecting parts

150A‧‧‧第一區段 150A‧‧‧First section

150B‧‧‧第二區段 150B‧‧‧Second section

150C‧‧‧第三區段 150C‧‧‧Section 3

152‧‧‧柔性基板 152‧‧‧Flexible substrate

154‧‧‧訊號跡線 154‧‧‧Signal trace

156‧‧‧接地跡線 156‧‧‧Ground trace

W1、W2‧‧‧寬度 W1, W2‧‧‧Width

為了更完整了解實施例及其優點,現參照結合所附圖式所做之下列描述,其中:〔圖1〕為依據本發明實施例之電子裝置的示意圖;〔圖2〕為依據一些示例之〔圖1〕之電子裝置的部分結構側視圖; 〔圖3〕為〔圖2〕之連接部件的部分平面結構示意圖;〔圖4A〕和〔圖4B〕為〔圖3〕之區域連接部件的部分區域放大平面視圖的不同示例;以及〔圖5〕為本發明實施例與比較例之連接部件的阻抗分布曲線圖。 For a more complete understanding of the embodiments and their advantages, now refer to the following description in conjunction with the accompanying drawings, in which: [FIG. 1] is a schematic diagram of an electronic device according to an embodiment of the present invention; [FIG. 2] is based on some examples [Figure 1] A side view of the partial structure of the electronic device; [Fig. 3] is a schematic diagram of a partial plan structure of the connection member of [Fig. 2]; [Fig. 4A] and [Fig. 4B] are different examples of enlarged plan views of a partial area of the area connection member of [Fig. 3]; and [Fig. 5 ] Is the impedance distribution curve diagram of the connecting part of the embodiment of the present invention and the comparative example.

以下將以圖式及詳細敘述清楚說明本揭示內容之精神,任何所屬技術領域中具有通常知識者在瞭解本揭示內容之較佳實施例後,當可由本揭示內容所教示之技術,加以改變及修飾,其並不脫離本揭示內容之精神與範圍。 The following will clearly illustrate the spirit of the present disclosure with figures and detailed descriptions. Anyone with ordinary knowledge in the technical field who understands the preferred embodiments of the present disclosure can make changes and changes based on the techniques taught in the present disclosure. Modifications do not depart from the spirit and scope of this disclosure.

在本文中所使用的用語僅是為了描述特定實施例,非用以限制申請專利範圍。除非另有限制,否則單數形式的「一」或「該」用語也可用來表示複數形式。此外,空間相對性用語的使用是為了說明元件在使用或操作時的不同方位,而不只限於圖式所繪示的方向。元件也可以其他方式定向(旋轉90度或在其他方向),而在此使用的空間相對性描述也可以相同方式解讀。 The terms used in this text are only for describing specific embodiments and not for limiting the scope of patent applications. Unless otherwise restricted, the term "one" or "the" in the singular form can also be used to indicate the plural form. In addition, the use of the terms of spatial relativity is to describe the different orientations of the elements in use or operation, and is not limited to the directions shown in the drawings. Elements can also be oriented in other ways (rotated by 90 degrees or in other directions), and the spatial relativity description used here can also be interpreted in the same way.

為了簡化和明確說明,本文可能會在各種實施例中重複使用元件符號和/或字母,但這並不表示所討論的各種實施例及/或配置之間有因果關係。 In order to simplify and clarify the description, component symbols and/or letters may be repeatedly used in various embodiments herein, but this does not mean that there is a causal relationship between the various embodiments and/or configurations discussed.

另外,在本文中可能會使用空間相對用語,例如「上方(over)」、「上(on)」、「下方(under)」、「下(below)」等等,以方便說明如圖式所繪示之一元件 或一特徵與另一元件或特徵之關係。除了在圖式中所繪示之方向外,這些空間相對用詞意欲含括元件在使用或操作中的不同方位。 In addition, spatial relative terms may be used in this article, such as "over", "on", "under", "below", etc., to facilitate the description of the diagram. Shows a component Or the relationship between a feature and another element or feature. In addition to the directions shown in the drawings, these spatial relative terms are intended to include different orientations of the elements in use or operation.

請參照圖1,圖1為依據本發明實施例之電子裝置100的示意圖。電子裝置100為具有顯示螢幕及無線通訊功能的裝置,例如平板電腦、智慧型手機等,但不限於此。電子裝置100包含顯示面板110、顯示驅動晶片120、無線通訊模組130和應用處理器140。 Please refer to FIG. 1. FIG. 1 is a schematic diagram of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 is a device with a display screen and wireless communication functions, such as a tablet computer, a smart phone, etc., but is not limited thereto. The electronic device 100 includes a display panel 110, a display driver chip 120, a wireless communication module 130 and an application processor 140.

顯示面板110用以顯示畫面,其可以是任何類型的液晶顯示面板、無機或有機發光二極體顯示面板,或是其他合適的顯示面板。 The display panel 110 is used to display images, and it can be any type of liquid crystal display panel, an inorganic or organic light emitting diode display panel, or other suitable display panels.

顯示驅動晶片120耦接至顯示面板110,其用以對影像資料訊號進行處理後輸出畫素訊號至顯示面板110,使得顯示面板110據以顯示畫面。顯示驅動晶片120包含資料驅動電路,其用以對影像資料訊號依序輸出畫素訊號至顯示面板110的各個畫素行或畫素列。在一些實施例中,顯示驅動晶片120另包含掃描驅動電路和時序控制電路等,即顯示驅動晶片120為整合資料驅動、掃描驅動和時序控制等功能的晶片。 The display driver chip 120 is coupled to the display panel 110, and is used for processing the image data signal and outputting the pixel signal to the display panel 110, so that the display panel 110 displays a picture accordingly. The display driver chip 120 includes a data driver circuit for sequentially outputting pixel signals to each pixel row or pixel column of the display panel 110 for the image data signal. In some embodiments, the display driver chip 120 further includes a scan driver circuit, a timing control circuit, etc., that is, the display driver chip 120 is a chip that integrates functions such as data driving, scan driving, and timing control.

此外,在一些實施例中,顯示面板110另具有觸控感測功能,且顯示驅動晶片120為觸控顯示驅動整合(touch with display driver integration;TDDI)晶片,其對顯示面板110提供顯示驅動訊號及觸控感測訊號。 In addition, in some embodiments, the display panel 110 further has a touch sensing function, and the display driver chip 120 is a touch with display driver integration (TDDI) chip, which provides display driving signals to the display panel 110 And touch sensing signal.

無線通訊模組130用以發射和/或接收無線訊號,且可與其他實體進行無線通訊連接和/或傳輸。無線通訊模組130可以是蜂巢式(cellular)行動通訊模組、無線區域網路(wireless local area network;WLAN)模組、藍牙(bluetooth)模組、近場通訊(near field communication;NFC)模組、全球導航衛星系統(global navigation satellite system;GNSS)模組,上述組合和/或其他具無線通訊功能的模組。依據上述類型,無線通訊模組130可用於各種無線通訊系統,例如蜂巢式網路、無線區域網路、藍牙網路、物聯網(Internet of Things;IoT)、衛星通訊系統、上述組合和/或其他無線通訊系統,其中蜂巢式網路可以是全球行動通訊系統(Global System for Mobile Communications;GSM)、分碼多重存取系統(Code Division Multiple Access;CDMA)、寬頻分碼多重存取系統(Wideband Code Division Multiple Access;WCDMA)、長程演進系統(Long Term Evolution;LTE)、進階長程演進系統(Advanced Long Term Evolution;LTE-A),上述組合和/或其他蜂巢式網路。 The wireless communication module 130 is used for transmitting and/or receiving wireless signals, and can perform wireless communication connection and/or transmission with other entities. The wireless communication module 130 may be a cellular mobile communication module, a wireless local area network (WLAN) module, a bluetooth module, a near field communication (NFC) module Group, global navigation satellite system (GNSS) module, the above combination and/or other modules with wireless communication function. According to the above types, the wireless communication module 130 can be used in various wireless communication systems, such as cellular networks, wireless local area networks, Bluetooth networks, Internet of Things (IoT), satellite communication systems, combinations of the above and/or Other wireless communication systems, among which the cellular network can be the Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), and Wideband Multiple Access System (Wideband). Code Division Multiple Access; WCDMA), Long Term Evolution (LTE), Advanced Long Term Evolution (LTE-A), the above combination and/or other cellular networks.

應用處理器140用以透過不同的傳輸介面控制電子裝置100中各個功能模組(例如顯示面板110、顯示驅動晶片120、無線通訊模組130和/或其他功能模組)的操作。舉例而言,應用處理器140提供影像資料訊號,且經由一傳輸介面傳輸至顯示驅動電路120。應用處理器140可由 積體電路、系統晶片、微處理器或其他相似元件實現,且可設置在一主板(圖未繪示)上。在一些實施例中,應用處理器140與顯示驅動晶片120之間的訊號傳輸符合行動產業處理器介面(Mobile Industry Processor Interface;MIPI)聯盟制定之顯示器串列介面(Display Serial Interface;DSI)規格,且應用處理器140與無線通訊模組120之間的訊號傳輸符合行動產業處理器介面聯盟制定之虛擬通用型輸入輸出介面(Virtual GPIO Interface;VGI)規格、低延遲介面(Low Latency Interface;LLI)規格和/或I3C(Improved Inter-Integrated Circuit)規格等。 The application processor 140 is used to control the operation of various functional modules (such as the display panel 110, the display driver chip 120, the wireless communication module 130 and/or other functional modules) of the electronic device 100 through different transmission interfaces. For example, the application processor 140 provides an image data signal and transmits it to the display driving circuit 120 through a transmission interface. The application processor 140 can be The integrated circuit, system chip, microprocessor or other similar components can be implemented, and can be set on a motherboard (not shown in the figure). In some embodiments, the signal transmission between the application processor 140 and the display driver chip 120 conforms to the Display Serial Interface (DSI) specification formulated by the Mobile Industry Processor Interface (MIPI) Alliance. And the signal transmission between the application processor 140 and the wireless communication module 120 conforms to the Virtual GPIO Interface (VGI) specification and Low Latency Interface (LLI) specified by the Mobile Industry Processor Interface Alliance Specifications and/or I3C (Improved Inter-Integrated Circuit) specifications, etc.

圖2為依據一些示例之電子裝置100的部分結構側視圖。如圖2所示,顯示驅動晶片120設置於顯示面板110的顯示側且耦接連接部件150,且連接部件150由顯示面板110的一側向外延伸,並折彎至顯示面板110的背面。顯示驅動晶片120設置於顯示面板110的顯示區外,以避免阻擋顯示面板110的畫面顯示。連接部件150可以是柔性印刷電路板(flexible printed circuit;FPC)、柔性扁平排線(flexible flat cable;FFC)或其他具訊號傳輸功能的柔性部件,其包含柔性基材152、訊號跡線154和接地跡線156,其中訊號跡線154和接地跡線156在顯示面板110的背面側分別位於柔性基材152的相對兩側。訊號跡線154和接地跡線156在連接部件150的折彎處和顯示側位於柔性基材152的相同側。在其他實施例中,訊號跡線154和接地跡線156在顯示面板110的背面側分別位於柔性基材152的 相同側。而在其他示例中,驅動顯示晶片120可以是直接設置在連接部件150上,且經由連接部件150電性連接至顯示面板110。 FIG. 2 is a side view of a partial structure of the electronic device 100 according to some examples. As shown in FIG. 2, the display driving chip 120 is disposed on the display side of the display panel 110 and is coupled to the connecting member 150, and the connecting member 150 extends from one side of the display panel 110 and is bent to the back of the display panel 110. The display driver chip 120 is disposed outside the display area of the display panel 110 to avoid blocking the image display of the display panel 110. The connecting component 150 can be a flexible printed circuit (FPC), a flexible flat cable (FFC), or other flexible components with signal transmission function, which includes a flexible substrate 152, signal traces 154, and The ground trace 156, wherein the signal trace 154 and the ground trace 156 are respectively located on opposite sides of the flexible substrate 152 on the back side of the display panel 110. The signal trace 154 and the ground trace 156 are located on the same side of the flexible substrate 152 at the bend of the connecting member 150 and the display side. In other embodiments, the signal trace 154 and the ground trace 156 are respectively located on the back side of the display panel 110 on the flexible substrate 152 The same side. In other examples, the driving display chip 120 may be directly disposed on the connecting component 150 and electrically connected to the display panel 110 via the connecting component 150.

圖3為連接部件150的部分平面結構示意圖。連接部件150分為第一至第三區段150A~150C,其中第一區段150A耦接至包含應用處理器140的主板(圖未繪示),以從應用處理器140接收影像資料訊號,第二區段150B為連接部件150的折彎處,而第三區段150C與顯示面板110接合。當連接部件150折彎時,第一至第三區段150A~150C分別位於顯示面板110的背面側、邊側和顯示側。連接部件150的第三區段150C可透過例如薄膜覆晶(chip on film;COF)或捲帶承載封裝(tape carrier package;TCP)等封裝技術與顯示面板110接合。如圖3所示,驅動顯示晶片120設置在連接部件150的第三區段150C上,且經由連接部件150耦接至顯示面板110。在其他實施例中,驅動顯示晶片120透過玻璃覆晶(chip on glass;COG)等封裝方式直接與顯示面板110接合,且耦接連接部件150的第三區段150C。 FIG. 3 is a schematic diagram of a partial plan structure of the connecting member 150. The connecting component 150 is divided into first to third sections 150A~150C, where the first section 150A is coupled to a motherboard (not shown in the figure) containing the application processor 140 to receive image data signals from the application processor 140, The second section 150B is the bending part of the connecting member 150, and the third section 150C is joined with the display panel 110. When the connecting member 150 is bent, the first to third sections 150A to 150C are respectively located on the back side, side and display side of the display panel 110. The third section 150C of the connecting member 150 can be joined to the display panel 110 through packaging technologies such as chip on film (COF) or tape carrier package (TCP). As shown in FIG. 3, the driving display chip 120 is disposed on the third section 150C of the connecting member 150 and is coupled to the display panel 110 via the connecting member 150. In other embodiments, the driving display chip 120 is directly connected to the display panel 110 through a chip on glass (COG) packaging method, and is coupled to the third section 150C of the connecting component 150.

訊號跡線154在連接部件150的第一至第三區段150A~150C中可具有不同的寬度,且如此一來,訊號跡線154在連接部件150的第一至第三區段150A~150C中的單位長度阻抗值也會隨之改變。訊號跡線154的第一部分在連接部件150的第一區段150A中,而訊號跡線154的第二部分在連接部件150的第二和第三區段150B、150C中。在本 發明實施例中,訊號跡線154的第一部分相較於第二部分具有較大的單位長度阻抗值。舉例而言,圖4A為圖3之連接部件150的部分區域放大平面視圖的一示例。如圖4A所示,訊號跡線154位於柔性基材152的中間,而接地跡線156分別位於柔性基材152的左右兩側。在連接部件150的第一區段150A中,訊號跡線154的第一部分的寬度為W1,而在連接部件150的第二區段150B中,訊號跡線154的第二部分的寬度由W1漸縮至W2。圖4B為圖3之連接部件150的部分區域放大平面視圖的另一示例。圖4B與圖4A的差異在於,在連接部件150的第二區段150B中,訊號跡線154的第二部分的寬度為W2。依據圖4A和圖4B的示例,訊號跡線154在連接部件150的第一區段150A中的單位長度阻抗值較在連接部件150的第二區段150B中的單位長度阻抗值大。圖4A和圖4B的示例。其他依據圖4A或圖4B之內容衍生的示例亦可達成上述訊號跡線154的第一和第二部分在連接部件150的第一和第二區段150A、150B中的單位長度阻抗值關係。 The signal trace 154 may have different widths in the first to third sections 150A to 150C of the connecting member 150, and in this way, the signal trace 154 is in the first to third sections 150A to 150C of the connecting member 150 The impedance per unit length in will also change accordingly. The first part of the signal trace 154 is in the first section 150A of the connecting member 150, and the second part of the signal trace 154 is in the second and third sections 150B, 150C of the connecting member 150. In this In the embodiment of the invention, the first part of the signal trace 154 has a larger impedance per unit length than the second part. For example, FIG. 4A is an example of an enlarged plan view of a partial area of the connecting member 150 in FIG. 3. As shown in FIG. 4A, the signal trace 154 is located in the middle of the flexible substrate 152, and the ground trace 156 is located on the left and right sides of the flexible substrate 152, respectively. In the first section 150A of the connecting member 150, the width of the first portion of the signal trace 154 is W1, and in the second section 150B of the connecting member 150, the width of the second portion of the signal trace 154 gradually changes from W1. Shrink to W2. FIG. 4B is another example of an enlarged plan view of a partial area of the connecting member 150 in FIG. 3. The difference between FIG. 4B and FIG. 4A is that, in the second section 150B of the connecting member 150, the width of the second portion of the signal trace 154 is W2. According to the examples of FIGS. 4A and 4B, the impedance value per unit length of the signal trace 154 in the first section 150A of the connecting member 150 is larger than the impedance value per unit length in the second section 150B of the connecting member 150. Examples of Figures 4A and 4B. Other examples derived from the content of FIG. 4A or FIG. 4B can also achieve the unit length impedance relationship of the first and second portions of the signal trace 154 in the first and second sections 150A, 150B of the connecting member 150.

圖5為本發明實施例與比較例之連接部件的阻抗分布曲線圖,其中本發明實施例之連接部件的訊號跡線的第二部分寬度小於第一部分寬度(如圖4B所示),而比較例之連接部件的訊號跡線的第一部分和第二部分具有相同的寬度。在圖5之阻抗分布曲線圖中,第一至第三區段分別對應圖3之連接部件的150第一至第三區段150A~150C。如圖5所示,在第二區段中,本發明實施例之連接部件的阻抗大於比較例之連接部件的阻抗。此外,比較例之連接部件所 產生的電場強度約為6.88×10-3伏特/公尺(v/m),而本發明實施例之連接部件所產生的電場強度約為3.00×10-3伏特/公尺(V/m),其為比較例之連接部件所產生之電場強度的一半以下。相較於比較例之連接部件,本發明實施例之連接部件產生的電場強度下降超過3dB,故有效降低對無線通訊的干擾。 5 is a graph showing the impedance distribution of the connecting component of the embodiment of the present invention and the comparative example, wherein the width of the second part of the signal trace of the connecting component of the embodiment of the present invention is smaller than the width of the first part (as shown in FIG. 4B), and the comparison For example, the first part and the second part of the signal trace of the connecting part have the same width. In the impedance distribution curve of FIG. 5, the first to third sections correspond to the first to third sections 150A to 150C of the connecting member 150 of FIG. 3, respectively. As shown in FIG. 5, in the second section, the impedance of the connecting member of the embodiment of the present invention is greater than the impedance of the connecting member of the comparative example. In addition, the electric field intensity generated by the connecting component of the comparative example is about 6.88×10 -3 volts/meter (v/m), while the electric field intensity generated by the connecting component of the embodiment of the present invention is about 3.00×10 -3 volts /Meter (V/m), which is less than half of the electric field intensity generated by the connecting member of the comparative example. Compared with the connecting part of the comparative example, the electric field intensity generated by the connecting part of the embodiment of the present invention is reduced by more than 3dB, so the interference to wireless communication is effectively reduced.

由上述可知,本發明之電子裝置可有效降低其在影像資料訊號傳輸至其顯示面板時產生的的電場強度,進而降低對無線通訊的干擾,進而確保無線通訊品質。 It can be seen from the above that the electronic device of the present invention can effectively reduce the intensity of the electric field generated when the image data signal is transmitted to its display panel, thereby reducing the interference to wireless communication and ensuring the quality of wireless communication.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone familiar with the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be subject to those defined in the attached patent scope.

100‧‧‧電子裝置 100‧‧‧Electronic device

110‧‧‧顯示面板 110‧‧‧Display Panel

120‧‧‧驅動顯示晶片 120‧‧‧Drive the display chip

130‧‧‧無線通訊模組 130‧‧‧Wireless communication module

140‧‧‧應用處理器 140‧‧‧Application Processor

Claims (10)

一種電子裝置,包含:一顯示面板;一顯示驅動晶片,耦接至該顯示面板;以及一連接部件,包含一訊號跡線,該訊號跡線具有一第一部分和一第二部分,其中該訊號跡線的第一部分用以接收影像資料訊號,且該訊號跡線的第二部分耦接至該顯示驅動晶片,該訊號跡線之第二部分的單位長度阻抗值大於該訊號跡線之第一部分的單位長度阻抗值。 An electronic device includes: a display panel; a display driver chip coupled to the display panel; and a connecting component including a signal trace, the signal trace having a first part and a second part, wherein the signal The first part of the trace is used to receive the image data signal, and the second part of the signal trace is coupled to the display driver chip, and the second part of the signal trace has a higher impedance per unit length than the first part of the signal trace The impedance value per unit length. 如申請專利範圍第1項所述之電子裝置,其中該訊號跡線之第二部分的寬度小於該訊號跡線之第一部分的寬度。 In the electronic device described in claim 1, wherein the width of the second part of the signal trace is smaller than the width of the first part of the signal trace. 如申請專利範圍第1項所述之電子裝置,其中該顯示驅動晶片係一觸控顯示驅動整合(touch with display driver integration;TDDI)晶片。 The electronic device described in claim 1, wherein the display driver chip is a touch with display driver integration (TDDI) chip. 如申請專利範圍第1項所述之電子裝置,其中該顯示驅動晶片直接設置於該顯示面板上。 According to the electronic device described in item 1 of the scope of patent application, the display driver chip is directly arranged on the display panel. 如申請專利範圍第1項所述之電子裝置,其中該連接部件係一柔性印刷電路板(flexible printed circuit;FPC)或一柔性扁平排線(flexible flat cable;FFC)。 According to the electronic device described in item 1 of the scope of patent application, the connecting component is a flexible printed circuit (FPC) or a flexible flat cable (FFC). 如申請專利範圍第5項所述之電子裝置,其中該連接部件更包含一柔性基材,且在該連接部件中,該訊號跡線之第一部分與接地跡線位於該柔性基材之相對兩側,且該訊號跡線之第二部分與一接地跡線位於該柔性基材之同側。 The electronic device described in claim 5, wherein the connecting component further comprises a flexible substrate, and in the connecting component, the first part of the signal trace and the ground trace are located on opposite sides of the flexible substrate The second part of the signal trace and a ground trace are located on the same side of the flexible substrate. 如申請專利範圍第1項所述之電子裝置,更包含:一應用處理器(application processor),耦接至該連接部件之第二部分,該應用處理器用以提供該影像資料訊號。 For example, the electronic device described in claim 1 further includes an application processor (application processor) coupled to the second part of the connecting component, and the application processor is used to provide the image data signal. 如申請專利範圍第7項所述之電子裝置,其中該應用處理器與該顯示驅動晶片之間的訊號傳輸符合行動產業處理器介面(Mobile Industry Processor Interface;MIPI)聯盟制定之顯示器串列介面(Display Serial Interface;DSI)規格。 For the electronic device described in item 7 of the scope of patent application, the signal transmission between the application processor and the display driver chip conforms to the display serial interface (MIPI) specified by the Mobile Industry Processor Interface (MIPI) Alliance Display Serial Interface; DSI) specifications. 如申請專利範圍第1項所述之電子裝置,更包含:一無線通訊模組,用以發射或接收無線訊號。 The electronic device described in item 1 of the scope of patent application further includes: a wireless communication module for transmitting or receiving wireless signals. 如申請專利範圍第9項所述之電子裝置,其中該無線通訊模組係一蜂巢式(cellular)行動通訊模 組、一無線區域網路(wireless local area network;WLAN)模組、一藍牙(bluetooth)模組、一近場通訊(near field communication;NFC)模組或一全球導航衛星系統(global navigation satellite system;GNSS)模組。 The electronic device described in claim 9, wherein the wireless communication module is a cellular mobile communication module Group, a wireless local area network (WLAN) module, a bluetooth module, a near field communication (NFC) module or a global navigation satellite system ; GNSS) module.
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