TW202046022A - Shutter device, exposure device, film forming device and method of manufacturing goods enhancing strength while reducing weight of shutter blade - Google Patents

Shutter device, exposure device, film forming device and method of manufacturing goods enhancing strength while reducing weight of shutter blade Download PDF

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TW202046022A
TW202046022A TW109113605A TW109113605A TW202046022A TW 202046022 A TW202046022 A TW 202046022A TW 109113605 A TW109113605 A TW 109113605A TW 109113605 A TW109113605 A TW 109113605A TW 202046022 A TW202046022 A TW 202046022A
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shader
shutter
aforementioned
auxiliary member
blade
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TW109113605A
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Chinese (zh)
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TWI803746B (en
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村上瑞真
大田俊輔
毛利宜寛
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日商佳能股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2012Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shutters For Cameras (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

A shutter device opens and closes an optical path of exposure light through shutter blades. The shutter blade comprises a base component having a first surface in which exposure light is incident and a second surface at a side opposite to the first surface, and an auxiliary component combined to the second surface. The thermal expansion rate of the auxiliary component is different from the thermal expansion rate of the base component. The shutter blade is bent by heat generated from the exposure light.

Description

遮蔽器裝置、曝光裝置、膜形成裝置及物品製造方法Shield device, exposure device, film forming device and article manufacturing method

本發明涉及遮蔽器裝置、曝光裝置、膜形成裝置及物品製造方法。The present invention relates to a shutter device, an exposure device, a film forming device, and an article manufacturing method.

在經由原版將基板進行曝光的曝光裝置、及將基板之上的組成物與模具予以接觸並將該組成物透過光的照射予以硬化的膜形成裝置等的製造裝置方面,可為了將光路徑進行開閉而使用遮蔽器裝置。於專利文獻1,已記載將遮蔽器葉片透過鋁等的高傳熱材而形成,在光的入射側蒸鍍鋁,在其相反側以黑色的塗料進行塗抹。 [先前技術文獻] [專利文獻]In manufacturing equipment such as an exposure device that exposes a substrate via an original plate, and a film forming device that contacts a composition on the substrate with a mold and cures the composition through light irradiation, it is possible to perform light path The shutter device is used for opening and closing. In Patent Document 1, it has been described that the shutter blade is formed by passing through a high heat transfer material such as aluminum, aluminum is vapor-deposited on the incident side of light, and black paint is applied to the opposite side. [Prior Technical Literature] [Patent Literature]

[專利文獻1] 日本特開2004-240097號公報[Patent Document 1] JP 2004-240097 A

[發明所欲解決之問題][The problem to be solved by the invention]

於曝光裝置及膜形成裝置等的製造裝置方面,為了使處理量提升需要使遮蔽器葉片的速度提升。為此,需要一面縮小遮蔽器葉片的重量一面提高強度。With regard to manufacturing equipment such as exposure equipment and film forming equipment, it is necessary to increase the speed of the shutter blades in order to increase the throughput. For this reason, it is necessary to increase the strength while reducing the weight of the shutter blade.

本發明目的在於提供在為了一面縮小遮蔽器葉片的重量一面提高強度方面有利的技術。 [解決問題之技術手段]The object of the present invention is to provide a technique that is advantageous in terms of improving the strength while reducing the weight of the shutter blade. [Technical means to solve the problem]

本發明的1個方案涉及一種遮蔽器裝置,其為將曝光光的光路徑透過遮蔽器葉片進行開閉者,前述遮蔽器葉片包含具有曝光光入射的第1面和與前述第1面相反之側的第2面的基底構材、和結合於前述第2面的輔助構材,前述輔助構材的熱膨脹率與前述基底構材的熱膨脹率不同,因前述曝光光而產生的熱使前述遮蔽器葉片彎曲。 [對照先前技術之功效]One aspect of the present invention relates to a shutter device that opens and closes a light path of exposure light through a shutter blade, the shutter blade including a first surface on which exposure light enters and a side opposite to the first surface The second surface of the base member and the auxiliary member bonded to the second surface, the coefficient of thermal expansion of the auxiliary member is different from the coefficient of thermal expansion of the base member, and the heat generated by the exposure light causes the shade The blade is bent. [Compared with the effects of previous technologies]

依本發明時,提供在為了一面縮小遮蔽器葉片的重量一面提高強度方面有利的技術。According to the present invention, an advantageous technology is provided in order to reduce the weight of the shader blade and increase the strength.

以下,參照圖式詳細說明實施方式。另外,以下的實施方式非限定申請專利範圍的發明者。於實施方式雖記載複數個特徵,惟不限於此等複數個特徵的全部為發明必須者,此外複數個特徵亦可任意進行組合。再者,圖式中,對相同或同樣的構成標注相同的參考符號,重複之說明省略。Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the following embodiments are not inventors who limit the scope of patent applications. Although a plurality of features are described in the embodiment, it is not limited to that all of the plurality of features are required for the invention, and a plurality of features can be combined arbitrarily. In addition, in the drawings, the same or the same components are denoted by the same reference symbols, and repeated descriptions are omitted.

於圖1,示出第1實施方式的遮蔽器裝置1的構成例。遮蔽器裝置1可被構成為具備遮蔽器葉片2,將曝光光4的光路徑透過遮蔽器葉片2進行開閉。遮蔽器裝置1可具備驅動遮蔽器葉片2的驅動機構,例如可具備將遮蔽器葉片2繞旋轉軸RA予以旋轉的旋轉機構3。旋轉軸RA例如可為與曝光光4的光軸(主光線)平行。另外,遮蔽器葉片2的驅動方向可為直線方向。在以下,可透過使與曝光光4的光軸平行的方向為Z方向的XYZ座標系而說明方向。FIG. 1 shows a configuration example of the shutter device 1 of the first embodiment. The shutter device 1 may be configured to include a shutter blade 2 and open and close the light path of the exposure light 4 through the shutter blade 2. The shutter device 1 may be provided with a driving mechanism for driving the shutter blade 2, for example, may be provided with a rotation mechanism 3 for rotating the shutter blade 2 around a rotation axis RA. The rotation axis RA may be parallel to the optical axis (principal ray) of the exposure light 4, for example. In addition, the driving direction of the shutter blade 2 may be a linear direction. In the following, the directions can be explained through the XYZ coordinate system in which the direction parallel to the optical axis of the exposure light 4 is the Z direction.

於圖2,示出第1實施方式的遮蔽器裝置1的遮蔽器葉片2的構成例。在示於圖2之例,相對於輪轂HB設置2個遮蔽器葉片2。遮蔽器葉片2的個數可任意定之。遮蔽器葉片2可包含具有曝光光4入射的第1面S1和與第1面S1相反之側的第2面S2的基底構材21、和結合於第2面S2的輔助構材22。基底構材21例如雖可由鋁或鋁合金等的金屬而構成,惟亦可由其他材料而構成。輔助構材22例如可透過黏合劑23而固定於基底構材21。黏合劑23的熱導率比基底構材21的熱導率高為優選。於他例,輔助構材22例如可透過螺絲等的緊固件而固定於基底構材21,可透過焊接而固定於基底構材21,亦可透過其他方法而固定於基底構材21。In FIG. 2, a configuration example of the shutter blade 2 of the shutter device 1 of the first embodiment is shown. In the example shown in FIG. 2, two shutter blades 2 are provided with respect to the hub HB. The number of shutter blades 2 can be arbitrarily determined. The shutter blade 2 may include a base member 21 having a first surface S1 on which the exposure light 4 enters, and a second surface S2 opposite to the first surface S1, and an auxiliary member 22 coupled to the second surface S2. The base member 21 may be made of metals such as aluminum or aluminum alloy, but may be made of other materials. The auxiliary member 22 can be fixed to the base member 21 through an adhesive 23, for example. It is preferable that the thermal conductivity of the adhesive 23 be higher than the thermal conductivity of the base member 21. In other examples, the auxiliary member 22 can be fixed to the base member 21 by fasteners such as screws, can be fixed to the base member 21 by welding, or can be fixed to the base member 21 by other methods.

輔助構材22可包含沿著基底構材21的第2面S2而變寬的板狀部分。輔助構材22的熱膨脹率與基底構材21的熱膨脹率不同,因曝光光4而產生的熱可使遮蔽器葉片2彎曲。透過此彎曲,使得遮蔽器葉片2的剛性,例如Z方向上的剛性可提升。此有利於遮蔽器葉片2的高速驅動。The auxiliary member 22 may include a plate-shaped portion that widens along the second surface S2 of the base member 21. The thermal expansion rate of the auxiliary member 22 is different from the thermal expansion rate of the base member 21, and the heat generated by the exposure light 4 can cause the shutter blade 2 to bend. Through this bending, the rigidity of the shutter blade 2, for example, the rigidity in the Z direction can be improved. This facilitates the high-speed drive of the shutter blade 2.

輔助構材22的熱導率比基底構材21的熱導率高為優選。此在為了抑制曝光光4的照射所致的遮蔽器葉片2的溫度上升方面有利。輔助構材22的密度比基底構材21的密度小為優選。此在為了將遮蔽器葉片2輕量化並將遮蔽器葉片2高速驅動方面有利。輔助構材22的反射率比基底構材21的反射率小為優選。此在為了防止可能因多重反射而入射於輔助構材22的曝光光4的反射從而防止曝光光從遮蔽器裝置1漏至曝光對象物之側方面有利。It is preferable that the thermal conductivity of the auxiliary member 22 be higher than the thermal conductivity of the base member 21. This is advantageous in order to suppress the temperature rise of the shutter blade 2 caused by the irradiation of the exposure light 4. It is preferable that the density of the auxiliary member 22 be smaller than the density of the base member 21. This is advantageous in order to reduce the weight of the shutter blade 2 and drive the shutter blade 2 at a high speed. It is preferable that the reflectance of the auxiliary member 22 be smaller than the reflectance of the base member 21. This is advantageous in order to prevent reflection of the exposure light 4 that may be incident on the auxiliary member 22 due to multiple reflections, and to prevent the exposure light from leaking from the shutter device 1 to the side of the exposure target.

輔助構材22例如能以石墨而構成。或者,輔助構材22以碳纖維而構成,該碳纖維的方向是沿著繞旋轉軸RA的圓周方向C為優選。可成為因曝光光4而產生的熱致使遮蔽器葉片2彎曲的狀態。此可因輔助構材22的熱膨脹率與基底構材21的熱膨脹率的差而造成。於如此的狀態下,沿著繞旋轉軸RA的圓周方向的剖面下的遮蔽器葉片2的彎曲量(平行於旋轉軸RA的方向上的位移量)比沿著以旋轉軸RA為中心的半徑方向的剖面下的遮蔽器葉片2的彎曲量大為優選。此可有助於被透過旋轉機構3而旋轉驅動的遮蔽器葉片2的剛性的提升。The auxiliary member 22 can be made of graphite, for example. Alternatively, the auxiliary member 22 is formed of carbon fiber, and the direction of the carbon fiber is preferably along the circumferential direction C around the rotation axis RA. It may be in a state where the shutter blade 2 is bent by the heat generated by the exposure light 4. This may be caused by the difference between the thermal expansion rate of the auxiliary member 22 and the thermal expansion rate of the base member 21. In this state, the amount of curvature (the amount of displacement in the direction parallel to the rotation axis RA) of the shader blade 2 in the cross section in the circumferential direction around the rotation axis RA is greater than that along the radius centered on the rotation axis RA It is preferable that the amount of curvature of the shutter blade 2 in the cross section of the direction is large. This can contribute to the improvement of the rigidity of the shutter blade 2 rotatably driven by the rotation mechanism 3.

於圖3,示出第2實施方式的遮蔽器裝置1的構成例。第2實施方式中未言及的事項可遵照第1實施方式。輔助構材22可包含1或複數個長條部ST。1或複數個長條部ST是圓周方向C上的尺寸比半徑方向R上的尺寸大。長條ST例如可具有圓弧狀。因曝光光4而產生的熱致使遮蔽器葉片2可成為彎曲的形狀。於如此的狀態下,1或複數個長條部ST可作用為沿著繞旋轉軸RA的圓周方向的剖面下的遮蔽器葉片2的彎曲量比沿著以旋轉軸RA為中心的半徑方向的剖面下的遮蔽器葉片2的彎曲量大。在圖3之例,旋轉軸RA與遮蔽器葉片2的最外周端之間的長條部ST的個數雖為3個,惟此數可任意決定為如2、3、4、5…等。FIG. 3 shows a configuration example of the shutter device 1 of the second embodiment. Matters not mentioned in the second embodiment can follow the first embodiment. The auxiliary member 22 may include one or a plurality of elongated portions ST. One or more elongated portions ST have a size in the circumferential direction C that is larger than the size in the radial direction R. The long strip ST may have an arc shape, for example. The heat generated by the exposure light 4 causes the shutter blade 2 to have a curved shape. In such a state, one or a plurality of elongated portions ST can act as the curvature of the shader blade 2 in the cross section along the circumferential direction of the rotation axis RA than that along the radial direction centered on the rotation axis RA The amount of curvature of the shader blade 2 in the section is large. In the example of FIG. 3, although the number of elongated portions ST between the rotation axis RA and the outermost peripheral end of the shutter blade 2 is three, the number can be arbitrarily determined as 2, 3, 4, 5... etc. .

於圖8,示出第2實施方式的遮蔽器裝置1的遮蔽器葉片2的解析例。在此例,以鋁合金而構成基底構材21,以石墨而構成輔助構材22。遮蔽器葉片2設計為在23℃時不發生彎曲。於圖8,示出遮蔽器葉片2的溫度從23℃上升至80℃時的遮蔽器葉片2的變形。於圖8,橫軸為圓周方向R的位置,縱軸為曝光光4的光軸方向(Z方向)上的位置。R=0mm表示從旋轉軸RA的距離為r+0mm的周上的變形量,R=3mm表示從旋轉軸RA的距離為r+30mm的圓的周上的變形量,R=60mm表示從旋轉軸RA的距離為r+60 mm的圓的周上的變形量。r為支撐遮蔽器葉片2的輪轂HB的半徑。換言之,R=0mm為沿著從旋轉軸RA的距離為r+0mm的圓的圓周方向的剖面下的遮蔽器葉片2的彎曲量(往Z方向的位移量)。此外,R=30mm為沿著從旋轉軸RA的距離為r+30mm的圓的圓周方向的剖面下的遮蔽器葉片2的彎曲量(往Z方向的位移量)。此外,R=60mm為沿著從旋轉軸RA的距離為r+60mm的圓的圓周方向的剖面下的遮蔽器葉片2的彎曲量(往Z方向的位移量)。圖8中的「彎曲量」示出沿著繞旋轉軸RA的圓周方向的剖面下的遮蔽器葉片2的彎曲量的最大值。透過如此的彎曲,使得遮蔽器葉片2的剖面2次軸矩增加,剛性提升。在解析例,相對於因曝光光4而產生的熱致使的變形前(23℃)的遮蔽器葉片2的固有振動頻率,因曝光光4而產生的熱致使的變形後(80℃)的遮蔽器葉片2的固有振動頻率成為1.26倍。亦即,熱致使的彎曲使得遮蔽器葉片2的剛性提升。FIG. 8 shows an analysis example of the shutter blade 2 of the shutter device 1 of the second embodiment. In this example, the base member 21 is made of aluminum alloy, and the auxiliary member 22 is made of graphite. The shutter blade 2 is designed to not bend at 23°C. Fig. 8 shows the deformation of the shutter blade 2 when the temperature of the shutter blade 2 rises from 23°C to 80°C. In FIG. 8, the horizontal axis is the position in the circumferential direction R, and the vertical axis is the position in the optical axis direction (Z direction) of the exposure light 4. R=0mm represents the amount of deformation on the circumference of a circle with a distance of r+0mm from the rotation axis RA, R=3mm represents the amount of deformation on the circumference of a circle with a distance of r+30mm from the rotation axis RA, R=60mm represents the amount of deformation from the rotation The distance of the axis RA is the amount of deformation on the circumference of a circle of r+60 mm. r is the radius of the hub HB supporting the shutter blade 2. In other words, R=0 mm is the amount of curvature of the shutter blade 2 (the amount of displacement in the Z direction) in a cross section along the circumferential direction of a circle with a distance of r+0 mm from the rotation axis RA. In addition, R=30 mm is the amount of curvature of the shutter blade 2 (the amount of displacement in the Z direction) in a cross section along the circumferential direction of a circle with a distance of r+30 mm from the rotation axis RA. In addition, R=60mm is the amount of curvature of the shutter blade 2 (amount of displacement in the Z direction) in a cross section along the circumferential direction of a circle with a distance of r+60mm from the rotation axis RA. The "bending amount" in FIG. 8 shows the maximum value of the bending amount of the shutter blade 2 in the cross section along the circumferential direction around the rotation axis RA. Through such bending, the secondary axial moment of the cross section of the shutter blade 2 is increased, and the rigidity is improved. In the analysis example, compared to the natural frequency of the shutter blade 2 before deformation (23°C) caused by the heat generated by the exposure light 4, the shielding after the deformation (80°C) caused by the heat generated by the exposure light 4 The natural vibration frequency of the blade 2 becomes 1.26 times. That is, the bending caused by heat increases the rigidity of the shutter blade 2.

於圖4,示出第3實施方式的遮蔽器裝置1的遮蔽器葉片2的構成例。第3實施方式中未言及的事項可遵照第1或第2實施方式。輔助構材22包含沿著基底構材21的第2面S2而變寬的板狀部分PT,板狀部分PT可具有1或複數個溝T。於一例中,1或複數個溝T是圓周方向C上的尺寸比半徑方向R上的尺寸大。可成為因曝光光4而產生的熱致使遮蔽器葉片2彎曲的狀態。於如此的狀態下,1或複數個溝T可作用為沿著繞旋轉軸RA的圓周方向的剖面下的遮蔽器葉片2的彎曲量比沿著以旋轉軸RA為中心的半徑方向的剖面下的遮蔽器葉片2的彎曲量大。於第3實施方式,由1或複數個溝T而界定的板狀部分PT亦可理解為具有1或複數個長條部ST者。FIG. 4 shows a configuration example of the shutter blade 2 of the shutter device 1 of the third embodiment. Matters not mentioned in the third embodiment can follow the first or second embodiment. The auxiliary member 22 includes a plate-shaped portion PT that widens along the second surface S2 of the base member 21, and the plate-shaped portion PT may have one or more grooves T. In one example, one or more grooves T have a size in the circumferential direction C larger than the size in the radial direction R. It may be in a state where the shutter blade 2 is bent by the heat generated by the exposure light 4. In such a state, one or more grooves T can function as the amount of curvature of the shader blade 2 in a section along the circumferential direction around the rotation axis RA than in a section along the radius direction around the rotation axis RA. The bending amount of the shutter blade 2 is large. In the third embodiment, the plate-shaped portion PT defined by one or more grooves T can also be understood as having one or more elongated portions ST.

於圖5,示出第4實施方式的遮蔽器裝置1的遮蔽器葉片2的構成例。第4實施方式為第3實施方式的變形例,第4實施方式中未言及的事項可遵照第3實施方式。輔助構材22包含沿著基底構材21的第2面S2而變寬的板狀部分PT,板狀部分PT可具有1或複數個溝T。於一例中,1或複數個溝T是圓周方向C上的尺寸比半徑方向R上的尺寸大。FIG. 5 shows a configuration example of the shutter blade 2 of the shutter device 1 of the fourth embodiment. The fourth embodiment is a modification of the third embodiment, and matters not mentioned in the fourth embodiment can follow the third embodiment. The auxiliary member 22 includes a plate-shaped portion PT that widens along the second surface S2 of the base member 21, and the plate-shaped portion PT may have one or more grooves T. In one example, one or more grooves T have a size in the circumferential direction C larger than the size in the radial direction R.

於圖6,示出第5實施方式的遮蔽器裝置1的遮蔽器葉片2的構成例。第5實施方式中未言及的事項可遵照第1~第4實施方式。於第5實施方式,輔助構材22亦具有1或複數個長條部ST及/或1或複數個溝T。1或複數個長條部ST可為矩形狀。FIG. 6 shows a configuration example of the shutter blade 2 of the shutter device 1 of the fifth embodiment. Matters not mentioned in the fifth embodiment can follow the first to fourth embodiments. In the fifth embodiment, the auxiliary member 22 also has one or more elongated portions ST and/or one or more grooves T. One or a plurality of long strip parts ST may be rectangular.

於圖7,示出第6實施方式的遮蔽器裝置1的遮蔽器葉片2的構成例。第6實施方式中未言及的事項可遵照第1~第5實施方式。於第6實施方式,輔助構材22亦具有1或複數個長條部ST及/或1或複數個溝T。此外,在第6實施方式,輔助構材22可包含將複數個長條部ST連接的連接部CN。FIG. 7 shows a configuration example of the shutter blade 2 of the shutter device 1 of the sixth embodiment. Matters not mentioned in the sixth embodiment can follow the first to fifth embodiments. In the sixth embodiment, the auxiliary member 22 also has one or more elongated portions ST and/or one or more grooves T. In addition, in the sixth embodiment, the auxiliary member 22 may include a connecting portion CN connecting a plurality of elongated portions ST.

於圖9,例示裝入有作為第1~第6實施方式而例示的遮蔽器裝置1的曝光裝置100。曝光裝置100對被塗佈感光材PR的基板S經由原版R照射曝光光從而將感光材PR進行曝光。曝光裝置100具備將原版R進行照明的照明光學系統110,遮蔽器裝置1被裝入於照明光學系統110。In FIG. 9, the exposure apparatus 100 in which the shutter device 1 exemplified as the first to sixth embodiments is incorporated is illustrated. The exposure device 100 irradiates the substrate S on which the photosensitive material PR is applied with exposure light via the original plate R to expose the photosensitive material PR. The exposure apparatus 100 includes an illumination optical system 110 that illuminates the original plate R, and the shutter device 1 is incorporated in the illumination optical system 110.

曝光裝置100可利用於半導體裝置等的物品的製造。一實施方式的物品製造方法可包含將感光材塗佈於基板S的塗佈程序、將歷經該塗佈程序的基板S透過曝光裝置100進行曝光的曝光程序、將歷經該曝光程序的基板S的感光材進行顯影的顯影程序、和將歷經該顯影程序的基板S進行處理的處理程序。該處理程序例如可為離子植入程序、蝕刻程序等。該物品製造方法可從歷經如此的程序的基板S製造物品。The exposure apparatus 100 can be used in the manufacture of articles such as semiconductor devices. The article manufacturing method of one embodiment may include a coating process of applying a photosensitive material to the substrate S, an exposure process of exposing the substrate S that has undergone the coating process through the exposure device 100, and an exposure process of the substrate S that has undergone the exposure process. A development program in which the photosensitive material is developed, and a processing program in which the substrate S that has undergone the development program is processed. The processing procedure may be, for example, an ion implantation procedure, an etching procedure, and the like. The article manufacturing method can manufacture articles from the substrate S that has undergone such procedures.

於圖10,例示裝入有作為第1~第6實施方式而例示的遮蔽器裝置1的膜形成裝置200。膜形成裝置200使模具M接觸於基板S之上的組成物IM並透過曝光光4的照射使組成物IM硬化從而在基板S之上形成由組成物IM的硬化物所成的膜。膜形成裝置200具備對組成物IM照射曝光光4的光學系統210,遮蔽器裝置1被裝入於光學系統210。膜形成裝置200例如可被構成為,在基板S之上形成由組成物IM的硬化物所成的圖案的壓印裝置、或在基板S之上形成由組成物IM的硬化物所成的平坦化膜的平坦化裝置。In FIG. 10, the film forming apparatus 200 which incorporated the shutter apparatus 1 illustrated as 1st-6th embodiment is illustrated. The film forming apparatus 200 brings the mold M into contact with the composition IM on the substrate S, and cures the composition IM through the irradiation of the exposure light 4 to form a film of the cured product of the composition IM on the substrate S. The film forming apparatus 200 includes an optical system 210 that irradiates the composition IM with exposure light 4, and the shutter device 1 is incorporated in the optical system 210. The film forming apparatus 200 can be configured, for example, as an imprint apparatus that forms a pattern formed by a cured product of the composition IM on the substrate S, or a flat surface formed by a cured product of the composition IM is formed on the substrate S. The flattening device of the film.

膜形成裝置200可利用於半導體裝置等的物品的製造。一實施方式的物品製造方法包含在基板S透過膜形成裝置200形成膜的膜形成程序、和將歷經該膜形成程序的基板S進行處理的處理程序,可從歷經如此的程序的基板S製造物品。The film forming apparatus 200 can be used in the manufacture of articles such as semiconductor devices. The article manufacturing method of one embodiment includes a film formation process of forming a film on the substrate S through the film forming apparatus 200 and a processing process of processing the substrate S that has undergone the film formation process. The article can be manufactured from the substrate S that has undergone such a process .

以上,雖就本發明的優選實施方式進行說明,惟本發明不限定於此等實施方式,在其要旨的範圍內可進行各種的變化及變更。Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various changes and modifications can be made within the scope of the gist.

1:遮蔽器裝置 2:遮蔽器葉片 3:旋轉機構 4:曝光光 21:基底構材 22:輔助構材 ST:長條部 T:溝 PT:板狀構材1: shader device 2: shader blade 3: Rotating mechanism 4: Exposure light 21: base material 22: auxiliary members ST: Long section T: groove PT: Plate structure

[圖1]就第1實施方式的遮蔽器裝置的構成進行繪示的圖。 [圖2]就第1實施方式的遮蔽器裝置的遮蔽器葉片的構成進行繪示的圖。 [圖3]就第2實施方式的遮蔽器裝置的遮蔽器葉片的構成進行繪示的圖。 [圖4]就第3實施方式的遮蔽器裝置的遮蔽器葉片的構成進行繪示的圖。 [圖5]就第4實施方式的遮蔽器裝置的遮蔽器葉片的構成進行繪示的圖。 [圖6]就第5實施方式的遮蔽器裝置的遮蔽器葉片的構成進行繪示的圖。 [圖7]就第6實施方式的遮蔽器裝置的遮蔽器葉片的構成進行繪示的圖。 [圖8]就第2實施方式的遮蔽器裝置的遮蔽器葉片的解析例進行繪示的圖。 [圖9]就曝光裝置的構成進行例示的圖。 [圖10]就膜形成裝置的構成進行例示的圖。[Fig. 1] A diagram showing the configuration of the shutter device of the first embodiment. [Fig. 2] A diagram showing the structure of the shutter blade of the shutter device of the first embodiment. [Fig. 3] A diagram showing the structure of the shutter blade of the shutter device of the second embodiment. [Fig. 4] A diagram showing the structure of the shutter blade of the shutter device of the third embodiment. [Fig. 5] A diagram showing the structure of the shutter blade of the shutter device of the fourth embodiment. [Fig. 6] A diagram showing the structure of the shutter blade of the shutter device of the fifth embodiment. [Fig. 7] A diagram showing the structure of the shutter blade of the shutter device of the sixth embodiment. [Fig. 8] A diagram showing an analysis example of the shutter blade of the shutter device of the second embodiment. [Fig. 9] A diagram exemplifying the configuration of the exposure device. [Fig. 10] A diagram illustrating the structure of a film forming apparatus.

2:遮蔽器葉片 2: shader blade

21:基底構材 21: base material

22:輔助構材 22: auxiliary members

23:黏合劑 23: Adhesive

C:圓周方向 C: circumferential direction

HB:輪轂 HB: Wheel hub

RA:繞旋轉軸 RA: Around the axis of rotation

S1:第1面 S1: Side 1

S2:第2面 S2: Side 2

Claims (29)

一種遮蔽器裝置,其為透過遮蔽器葉片將曝光光的光路徑進行開閉者, 前述遮蔽器葉片包含具有曝光光入射的第1面和與前述第1面相反之側的第2面的基底構材、和結合於前述第2面的輔助構材, 前述輔助構材的熱膨脹率與前述基底構材的熱膨脹率不同,因前述曝光光而產生的熱使前述遮蔽器葉片彎曲。A shader device that opens and closes the light path of exposure light through shader blades, The shutter blade includes a base member having a first surface on which exposure light enters and a second surface opposite to the first surface, and an auxiliary member joined to the second surface, The thermal expansion coefficient of the auxiliary member is different from the thermal expansion coefficient of the base member, and the heat generated by the exposure light causes the shutter blade to bend. 如請求項1的遮蔽器裝置,其進一步具備使前述遮蔽器葉片繞旋轉軸而旋轉的旋轉機構。The shutter device according to claim 1, further comprising a rotation mechanism that rotates the shutter blades around a rotation axis. 如請求項2的遮蔽器裝置,其中,在前述遮蔽器葉片因前述熱而彎曲的狀態下,沿著繞前述旋轉軸的圓周方向的剖面下的前述遮蔽器葉片的彎曲量比沿著以前述旋轉軸為中心的半徑方向的剖面下的前述遮蔽器葉片的彎曲量大。The shader device of claim 2, wherein, in a state where the shader blade is bent by the heat, the bending amount of the shader blade in a section along the circumferential direction of the rotation axis is greater than that of The amount of curvature of the shutter blade in the cross section in the radial direction with the rotation axis as the center is large. 如請求項3的遮蔽器裝置,其中,前述輔助構材包含1或複數個長條部,前述1或複數個長條部在前述圓周方向上的尺寸比前述半徑方向上的尺寸大。The shader device of claim 3, wherein the auxiliary member includes one or more elongated portions, and the size of the one or more elongated portions in the circumferential direction is larger than the size in the radial direction. 如請求項4的遮蔽器裝置,其中,前述輔助構材進一步包含將前述複數個長條部進行連接的連接部。The shader device of claim 4, wherein the auxiliary member further includes a connecting portion that connects the plurality of elongated portions. 如請求項4的遮蔽器裝置,其中,前述1或複數個長條部為圓弧狀。The shutter device of claim 4, wherein the one or more long strips are arc-shaped. 如請求項4的遮蔽器裝置,其中,前述1或複數個長條部為矩形狀。The shader device of claim 4, wherein the one or more elongated portions are rectangular. 如請求項3的遮蔽器裝置,其中,前述輔助構材包含沿著前述基底構材的前述第2面而變寬的板狀部分,前述板狀部分具有1或複數個溝。The shade device according to claim 3, wherein the auxiliary member includes a plate-shaped portion that widens along the second surface of the base member, and the plate-shaped portion has one or more grooves. 如請求項8的遮蔽器裝置,其中,前述1或複數個溝為圓弧狀。The shutter device of claim 8, wherein the aforementioned one or more grooves are arc-shaped. 如請求項8的遮蔽器裝置,其中,前述1或複數個溝為矩形狀。The shader device of claim 8, wherein the aforementioned one or more grooves are rectangular. 如請求項3的遮蔽器裝置,其中,前述輔助構材以碳纖維而構成,前述碳纖維的方向為沿著前述圓周方向。The shade device of claim 3, wherein the auxiliary member is made of carbon fiber, and the direction of the carbon fiber is along the circumferential direction. 如請求項1的遮蔽器裝置,其中,前述輔助構材以石墨而構成。The shutter device of claim 1, wherein the auxiliary member is made of graphite. 如請求項1的遮蔽器裝置,其中,前述輔助構材的熱導率比前述基底構材的熱導率高。The shade device of claim 1, wherein the thermal conductivity of the auxiliary member is higher than the thermal conductivity of the base member. 如請求項1的遮蔽器裝置,其中,前述輔助構材的密度比前述基底構材的密度小。The shader device of claim 1, wherein the density of the auxiliary member is lower than the density of the base member. 如請求項1的遮蔽器裝置,其中,前述輔助構材的反射率比前述基底構材的反射率小。The shader device of claim 1, wherein the reflectance of the auxiliary member is lower than the reflectance of the base member. 一種遮蔽器裝置,其為具備將曝光光的光路徑進行開閉的遮蔽器葉片、和使前述遮蔽器葉片繞旋轉軸旋轉的旋轉機構者, 前述遮蔽器葉片包含具有曝光光入射的第1面和與前述第1面相反之側的第2面的基底構材、和結合於前述第2面的輔助構材, 前述輔助構材包含1或複數個長條部,前述1或複數個長條部在繞前述旋轉軸的圓周方向上的尺寸比以前述旋轉軸為中心的半徑方向上的尺寸大。A shader device is provided with a shader blade that opens and closes a light path of exposure light, and a rotation mechanism that rotates the shader blade about a rotation axis, The shutter blade includes a base member having a first surface on which exposure light enters and a second surface opposite to the first surface, and an auxiliary member joined to the second surface, The auxiliary member includes one or more elongated portions, and the size of the one or more elongated portions in the circumferential direction around the rotation axis is larger than the size in the radial direction centered on the rotation axis. 如請求項16的遮蔽器裝置,其中,前述輔助構材進一步包含將前述複數個長條部進行連接的連接部。The shader device of claim 16, wherein the auxiliary member further includes a connecting part that connects the plurality of elongated parts. 如請求項16的遮蔽器裝置,其中,前述1或複數個長條部為圓弧狀。Such as the shader device of claim 16, wherein the one or more elongated portions are arc-shaped. 如請求項16的遮蔽器裝置,其中,前述1或複數個長條部為矩形狀。The shader device of claim 16, wherein the one or more elongated portions are rectangular. 一種遮蔽器裝置,其為具備將曝光光的光路徑進行開閉的遮蔽器葉片、和使前述遮蔽器葉片繞旋轉軸旋轉的旋轉機構者, 前述遮蔽器葉片包含具有曝光光入射的第1面和與前述第1面相反之側的第2面的基底構材、和結合於前述第2面的輔助構材, 前述輔助構材包含沿著前述基底構材的前述第2面而變寬的板狀部分,前述板狀部分具有1或複數個溝,前述1或複數個溝在繞前述旋轉軸的圓周方向上的尺寸比以前述旋轉軸為中心的半徑方向上的尺寸大。A shader device is provided with a shader blade that opens and closes a light path of exposure light, and a rotation mechanism that rotates the shader blade about a rotation axis, The shutter blade includes a base member having a first surface on which exposure light enters and a second surface opposite to the first surface, and an auxiliary member joined to the second surface, The auxiliary member includes a plate-shaped portion that widens along the second surface of the base member, the plate-shaped portion has one or more grooves, and the one or more grooves are in the circumferential direction around the rotation axis The size of is larger than the size in the radial direction centered on the aforementioned rotating shaft. 如請求項20的遮蔽器裝置,其中,前述1或複數個溝為圓弧狀。The shutter device of claim 20, wherein the aforementioned 1 or more grooves are arc-shaped. 如請求項20的遮蔽器裝置,其中,前述1或複數個溝為矩形狀。The shutter device of claim 20, wherein the one or more grooves are rectangular. 一種遮蔽器裝置,其為透過遮蔽器葉片將曝光光的光路徑進行開閉者, 前述遮蔽器葉片包含具有曝光光入射的第1面和與前述第1面相反之側的第2面的基底構材、和結合於前述第2面的輔助構材, 前述輔助構材的熱導率比前述基底構材的熱導率高。A shader device that opens and closes the light path of exposure light through shader blades, The shutter blade includes a base member having a first surface on which exposure light enters and a second surface opposite to the first surface, and an auxiliary member joined to the second surface, The thermal conductivity of the aforementioned auxiliary member is higher than the thermal conductivity of the aforementioned base member. 如請求項23的遮蔽器裝置,其中,前述輔助構材透過黏合劑而固定於前述基底構材。The shutter device of claim 23, wherein the auxiliary member is fixed to the base member through an adhesive. 如請求項24的遮蔽器裝置,其中,前述黏著劑的熱導率比前述基底構材的熱導率高。The shutter device of claim 24, wherein the thermal conductivity of the adhesive is higher than the thermal conductivity of the base member. 一種曝光裝置,其為對塗佈有感光材的基板經由原版而照射曝光光從而將該感光材進行曝光者, 使如請求項1至15中任一項的遮蔽器裝置裝入於將前述原版進行照明的照明光學系統。An exposure device that irradiates a substrate coated with a photosensitive material with exposure light through an original plate to expose the photosensitive material, The shader device according to any one of claims 1 to 15 is incorporated in an illumination optical system that illuminates the aforementioned original plate. 一種物品製造方法,其包含: 將感光材塗佈於基板的塗佈程序、 經歷經前述塗佈程序的前述基板透過如請求項26的曝光裝置進行曝光的曝光程序、 將歷經前述曝光程序的前述基板的前述感光材進行顯影的顯影程序、和 將歷經前述顯影程序的前述基板進行處理的處理程序, 從前述基板製造物品。An article manufacturing method, which includes: The coating process of coating the photosensitive material on the substrate, The exposure process in which the aforementioned substrate subjected to the aforementioned coating process is exposed through the exposure device as in claim 26, A development process of developing the aforementioned photosensitive material of the aforementioned substrate that has undergone the aforementioned exposure process, and A processing procedure for processing the aforementioned substrate that has undergone the aforementioned development procedure, An article is manufactured from the aforementioned substrate. 一種膜形成裝置,其為使模具接觸於基板之上的組成物並透過曝光光的照射使該組成物硬化從而在該基板之上形成由該組成物的硬化物所成的膜者, 使請求項1至25中任一項的遮蔽器裝置裝入於對該組成物照射曝光光的光學系統。A film forming device is a device that brings a mold into contact with a composition on a substrate and cures the composition through exposure of exposure light to form a film of a cured product of the composition on the substrate, The shutter device of any one of claims 1 to 25 is incorporated in an optical system that irradiates the composition with exposure light. 一種物品製造方法,其包含: 在基板透過如請求項28的膜形成裝置而形成膜的膜形成程序、和 將歷經前述膜形成程序的前述基板進行處理的處理程序, 從前述基板製造物品。An article manufacturing method, which includes: A film forming procedure for forming a film on a substrate through a film forming apparatus such as claim 28, and A processing procedure for processing the aforementioned substrate that has undergone the aforementioned film formation procedure, An article is manufactured from the aforementioned substrate.
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