TW202043816A - Method for manufacturing machined optical laminate with attached adhesive layer - Google Patents
Method for manufacturing machined optical laminate with attached adhesive layer Download PDFInfo
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- TW202043816A TW202043816A TW108143233A TW108143233A TW202043816A TW 202043816 A TW202043816 A TW 202043816A TW 108143233 A TW108143233 A TW 108143233A TW 108143233 A TW108143233 A TW 108143233A TW 202043816 A TW202043816 A TW 202043816A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/12—Trimming or finishing edges, e.g. deburring welded corners
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
- B23C3/16—Working surfaces curved in two directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/10—Shank-type cutters, i.e. with an integral shaft
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/02—Milling-cutters characterised by the shape of the cutter
- B23C5/12—Cutters specially designed for producing particular profiles
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/30—Polarising elements
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- Optics & Photonics (AREA)
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Abstract
Description
本發明涉及一種經切削加工之附黏著劑層光學積層體的製造方法。The invention relates to a method for manufacturing an optical laminate with an adhesive layer after cutting.
手機、筆記型個人電腦等影像顯示裝置為了實現影像顯示及/或提高該影像顯示性能,而使用各種光學積層體(例如偏光板)。代表上,係於光學積層體設置黏著劑層作為最外層,而可將光學積層體貼合至影像顯示裝置。在實際使用時,於該黏著劑層上以可剝離之狀態暫時黏著有分離件,可於至實際使用前之期間保護黏著劑層。並且,於光學積層體之與黏著劑層相反之側代表上以可剝離之狀態暫時黏著有表面保護薄膜。近年來,期望將光學積層體之形狀加工成所期望之形狀。所述加工方法可舉例如使用端銑刀之端面切削加工。In order to realize image display and/or improve the image display performance of image display devices such as mobile phones and notebook personal computers, various optical laminates (for example, polarizing plates) are used. Representatively, the optical laminate is provided with an adhesive layer as the outermost layer, and the optical laminate can be bonded to the image display device. In actual use, a separation member is temporarily attached to the adhesive layer in a peelable state, which can protect the adhesive layer before actual use. In addition, a surface protective film is temporarily attached to the representative of the side of the optical laminate opposite to the adhesive layer in a peelable state. In recent years, it has been desired to process the shape of the optical laminate into a desired shape. The processing method may include, for example, end face cutting using an end mill.
先前技術文獻 專利文獻 專利文獻1:日本專利特開2018-22140號公報Prior art literature Patent literature Patent Document 1: Japanese Patent Laid-Open No. 2018-22140
發明欲解決之課題 在此,將光學積層體與其他光學構件貼合時,係要求表面保護薄膜之易剝離性(以下有時僅稱剝離性)。本發明係為了解決所述課題而成者,其主要目在於提供一種可簡便低價製造表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體的方法。Problems to be solved by the invention Here, when bonding the optical layered body to another optical member, the easy peelability of the surface protection film is required (hereinafter, simply referred to as peelability). The present invention was made in order to solve the above-mentioned problems, and its main object is to provide a method of cutting an adhesive layer-attached optical laminate with suppressed peeling defects of a surface protective film easily and inexpensively.
用以解決課題之手段 本發明之經切削加工之附黏著劑層光學積層體的製造方法包含:將多片附黏著劑層光學積層體疊合而形成工件;及,使用具有螺旋刃之端銑刀來切削該工件之外周面。該附黏著劑層光學積層體包含光學薄膜、黏著劑層、分離件及表面保護薄膜,該黏著劑層配置於該光學薄膜之一側,該分離件係以可剝離之狀態配置暫時黏著於該黏著劑層,而該表面保護薄膜係以可剝離之狀態暫時黏著於該光學薄膜之另一側。本發明的製造方法係以使該分離件位於該端銑刀之切屑排出方向的方式疊合該附黏著劑層光學積層體而形成該工件。 在一實施形態中,上述端銑刀為右刃右螺旋或左刃左螺旋,並且係以使上述分離件位於上側之方式疊合上述附黏著劑層光學積層體,而形成工件。在另一實施形態中,上述端銑刀為右刃左螺旋或左刃右螺旋,並且係以使上述分離件位於下側之方式疊合上述附黏著劑層光學積層體,而形成工件。 在一實施形態中,上述分離件與上述黏著劑層之剝離力較上述光學薄膜與上述表面保護薄膜之剝離力更小。更具體而言,上述分離件與上述黏著劑層之剝離力為0.001N/10mm~1.0N/10mm,上述光學薄膜與上述表面保護薄膜之剝離力為0.01N/10mm~5.0N/10mm。 在一實施形態中,上述表面保護薄膜之厚度較上述分離件之厚度更大。 在一實施形態中,上述表面保護薄膜具有基材與黏著劑層,且該黏著劑層在25℃下之儲存彈性模數G’為0.5×106 (Pa)~3.0×106 (Pa)。 在一實施形態中,上述製造方法藉由上述切削使上述表面保護薄膜產生浮凸。在一實施形態中,上述表面保護薄膜之浮凸量為1μm~1000μm。 在一實施形態中,上述製造方法包含:將上述工件之外周面進行非直線切削。在一實施形態中,上述非直線切削包含:形成在俯視上述附黏著劑層光學積層體時包含曲線部之凹部。在一實施形態中,上述曲線部的半徑在5mm以下。 在一實施形態中,上述光學薄膜為偏光件或偏光板。Means to Solve the Problem The method for manufacturing a cutting-processed adhesive layer optical laminate of the present invention includes: stacking a plurality of adhesive layer optical laminates to form a workpiece; and using an end mill with a spiral blade To cut the outer peripheral surface of the workpiece. The adhesive layer optical laminate includes an optical film, an adhesive layer, a separator, and a surface protection film. The adhesive layer is arranged on one side of the optical film, and the separator is temporarily attached to the optical film in a peelable state. The adhesive layer, and the surface protection film is temporarily adhered to the other side of the optical film in a peelable state. In the manufacturing method of the present invention, the optical laminate with the adhesive layer is laminated so that the separator is positioned in the chip discharge direction of the end mill to form the workpiece. In one embodiment, the end mill is a right-edge right spiral or a left-edge left spiral, and the adhesive layer optical laminate is laminated so that the separating member is located on the upper side to form a workpiece. In another embodiment, the end mill is a right-blade left screw or a left-blade right screw, and the adhesive layer optical laminate is laminated so that the separator is positioned on the lower side to form a workpiece. In one embodiment, the peeling force of the separator and the adhesive layer is smaller than the peeling force of the optical film and the surface protection film. More specifically, the peeling force between the separator and the adhesive layer is 0.001N/10mm to 1.0N/10mm, and the peeling force between the optical film and the surface protection film is 0.01N/10mm to 5.0N/10mm. In one embodiment, the thickness of the surface protection film is greater than the thickness of the separator. In one embodiment, the above-mentioned surface protection film has a substrate and an adhesive layer, and the storage elastic modulus G'of the adhesive layer at 25° C. is 0.5×10 6 (Pa)~3.0×10 6 (Pa) . In one embodiment, in the manufacturing method, the surface protection film is embossed by the cutting. In one embodiment, the relief amount of the surface protection film is 1 μm to 1000 μm. In one embodiment, the manufacturing method includes non-linear cutting of the outer peripheral surface of the workpiece. In one embodiment, the non-linear cutting includes forming a concave portion including a curved portion when the optical laminate with an adhesive layer is formed in a plan view. In one embodiment, the radius of the curved portion is 5 mm or less. In one embodiment, the above-mentioned optical film is a polarizer or a polarizer.
發明效果 根據本發明,係一種附黏著劑層光學積層體的製造方法,該方法包含:將多片附黏著劑層光學積層體疊合而形成工件,並使用具有螺旋刃之端銑刀來切削該工件之外周面;並且,以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件,藉此可實現一種可簡便低價製造表面保護薄膜之剝離不良經抑制的經切削加工之附黏著劑層光學積層體的方法。Invention effect According to the present invention, a method for manufacturing an optical laminate with an adhesive layer is provided. The method includes: stacking a plurality of optical laminates with an adhesive layer to form a workpiece, and cutting the workpiece with an end mill with a spiral blade The outer peripheral surface; and the adhesive layer optical laminate is laminated so that the separating piece is located in the chip discharge direction of the end mill to form a workpiece, which can realize a simple and low-cost manufacturing of surface protection film. A method of suppressed cutting-processed optical laminates with adhesive layers.
以下參照圖式針對本發明具體實施形態進行說明,惟本發明不受該等實施形態限定。此外,為了便於觀看而示意顯示圖式,並且圖式中之長度、寬度、厚度等比率、以及角度等與實際有所差異。The following describes specific embodiments of the present invention with reference to the drawings, but the present invention is not limited by these embodiments. In addition, the drawings are schematically shown for ease of viewing, and the ratios of length, width, thickness, etc., and angles in the drawings are different from actual ones.
本發明附黏著劑層光學積層體的製造方法包含:將多片附黏著劑層光學積層體疊合而形成工件;及,使用具有螺旋刃之端銑刀來切削該工件之外周面。附黏著劑層光學積層體包含光學薄膜、黏著劑層、分離件及表面保護薄膜,該黏著劑層配置於光學薄膜之一側,該分離件係以可剝離之狀態配置暫時黏著於黏著劑層,而保護薄膜係以可剝離之狀態暫時黏著於光學薄膜之另一側。本發明之實施形態中,係以使分離件位於端銑刀之切屑排出方向的方式疊合該附黏著劑層光學積層體而形成該工件。為求方便,首先說明可用於本發明附黏著劑層光學積層體的製造方法之附黏著劑層光學積層體之具體構成,接著再針對本發明附黏著劑層光學積層體的製造方法進行說明。The method for manufacturing the adhesive layer optical laminate of the present invention includes: stacking a plurality of adhesive layer optical laminates to form a workpiece; and using an end mill with a spiral blade to cut the outer peripheral surface of the workpiece. The adhesive layer optical laminate includes an optical film, an adhesive layer, a separator, and a surface protection film. The adhesive layer is arranged on one side of the optical film, and the separator is temporarily attached to the adhesive layer in a peelable state. , And the protective film is temporarily adhered to the other side of the optical film in a peelable state. In the embodiment of the present invention, the optical laminate with the adhesive layer is laminated so that the separator is positioned in the chip discharge direction of the end mill to form the workpiece. For convenience, the specific structure of the adhesive layer optical laminate that can be used in the manufacturing method of the adhesive layer optical laminate of the present invention will be described first, and then the manufacturing method of the adhesive layer optical laminate of the present invention will be described.
A.附黏著劑層光學積層體
圖1係說明可用於本發明製造方法之附黏著劑層光學積層體之一例的概略截面圖。圖式例之附黏著劑層光學積層體100包含光學薄膜10、黏著劑層20、分離件30及表面保護薄膜40,黏著劑層20配置於光學薄膜10之一側,分離件30係以可剝離之狀態配置暫時黏著於黏著劑層20,而表面保護薄膜40係以可剝離之狀態暫時黏著於光學薄膜10之另一側。附黏著劑層光學積層體應用於影像顯示裝置時,代表上分離件30係配置於影像顯示單元側。附黏著劑層光學積層體在實際使用時會將分離件30剝離去除,而黏著劑層20可用於將附黏著劑層光學積層體貼合至影像顯示裝置(實質上為影像顯示單元)。表面保護薄膜40代表上具有基材41與黏著劑層42。此外,為區別黏著劑層20,有時會將表面保護薄膜之黏著劑層42稱為「PF黏著劑層」。表面保護薄膜40亦會在實際使用附黏著劑層光學積層體時被剝離去除。本發明實施形態中,藉由採用如後述的製造方法,可實現表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。即,根據本發明實施形態可抑制包含黏著劑層、分離件與表面保護薄膜之附黏著劑層光學積層體特有的課題,亦即可抑制表面保護薄膜之剝離不良。A. Adhesive layer optical laminate
Fig. 1 is a schematic cross-sectional view illustrating an example of an optical laminate with an adhesive layer that can be used in the manufacturing method of the present invention. The adhesive layer
光學薄膜10可舉可用於需進行切削加工(尤其非直線加工)之用途上之任意適當之光學薄膜。光學薄膜可為單層構成之薄膜亦可為積層體。單層構成之光學薄膜的具體例可舉如偏光件、相位差薄膜。以積層體形式構成之光學薄膜的具體例可舉偏光板(代表上為偏光件與保護薄膜之積層體)、觸控面板用導電性薄膜、表面處理薄膜、以及因應目的將由該等單層構成之光學薄膜及/或以積層體形式構成的光學薄膜適當積層而成之積層體(例如抗反射用圓偏光板、附觸控面板用導電層之偏光板)。The
黏著劑層20可採用任意適當之構成。構成黏著劑層之黏著劑之具體例可舉丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、胺甲酸酯系黏著劑、環氧系黏著劑及聚醚系黏著劑。藉由調整形成黏著劑的基底樹脂之單體種類、數量、組合及摻混比、以及交聯劑的摻混量、反應溫度、反應時間等,可調製出具有因應目的之所期望特性的黏著劑。黏著劑的基底樹脂可單獨使用亦可組合2種以上來使用。由透明性、加工性及耐久性等觀點宜為丙烯酸系黏著劑。構成黏著劑層之黏著劑的詳細內容例如記載於日本特開2014-115468號公報,本說明書即援用該公報之記載作為參考。黏著劑層20之厚度可為例如10μm~100μm。黏著劑層20在25℃下之儲存彈性模數G’例如可為1.0×104
(Pa)~1.0×106
(Pa)。此外,儲存彈性模數例如可由動態黏彈性測定求得。The
分離件30可採用任意適當之分離件。具體例可舉藉由剝離劑進行過表面塗佈之塑膠薄膜、不織布或紙。剝離材之具體例可舉聚矽氧系剝離劑、氟系剝離劑、長鏈烷基丙烯酸酯系剝離劑。塑膠薄膜之具體例可舉聚對苯二甲酸乙二酯(PET)薄膜、聚乙烯薄膜、聚丙烯薄膜。分離件之厚度例如可為10μm~100μm。The separating
表面保護薄膜40如上述,代表上具有基材41與黏著劑層42。基材41的形成材料可舉例如聚對苯二甲酸乙二酯系樹脂等酯系樹脂、降莰烯系樹脂等環烯烴系樹脂、聚丙烯等烯烴系樹脂、聚醯胺系樹脂、聚碳酸酯系樹脂及其等之共聚物樹脂等。較理想的是酯系樹脂(尤為聚對苯二甲酸乙二酯系樹脂)。只要為所述材料,便具有彈性模數夠高且即便於輸送及/或貼合時加諸張力亦不易發生變形之優點。The
基材41之彈性模數例如可為2.2kN/mm2
~4.8kN/mm2
。基材之彈性模數只要為所述範圍,便具有即便於輸送及/或貼合時加諸張力亦不易發生變形之優點。此外,彈性模數係依循JIS K 6781來測定。The elastic modulus of the
基材41之厚度例如為30μm~70μm。The thickness of the
黏著劑層(PF黏著劑層)42可採用任意適當之構成。具體例可舉丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、胺甲酸酯系黏著劑、環氧系黏著劑及聚醚系黏著劑。藉由調整形成黏著劑的基底樹脂之單體種類、數量、組合及摻混比、以及交聯劑的摻混量、反應溫度、反應時間等,可調製出具有因應目的之所期望特性的黏著劑。黏著劑的基底樹脂可單獨使用亦可組合2種以上來使用。構成PF黏著劑層之黏著劑具有以下特徵:基底樹脂包含具有含活性氫之官能基的聚合物。只要為所述基底樹脂,便可獲得具有所期望儲存彈性模數之PF黏著劑層。構成PF黏著劑層之黏著劑的詳細內容例如記載於日本特開2018-123281號公報,本說明書即援用該公報之記載作為參考。PF黏著劑層42之厚度可為例如10μm~100μm。PF黏著劑層42在25℃下之儲存彈性模數G’例如可為0.5×106
(Pa)~3.0×106
(Pa)。只要儲存彈性模數為所述範圍,便可獲得黏著性與剝離性之平衡優異之黏著劑層(結果為表面保護薄膜)。並且,透過後述製造方法,可使表面保護薄膜產生浮凸,結果可以浮凸部分作為抓握緣而輕易使應力集中於剝離點,因此可在維持可容許之黏著性的同時實現更優異之剝離性。The adhesive layer (PF adhesive layer) 42 may have any appropriate configuration. Specific examples include acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives, and polyether adhesives. By adjusting the monomer type, quantity, combination and blending ratio of the base resin forming the adhesive, as well as the blending amount of the crosslinking agent, the reaction temperature, the reaction time, etc., an adhesive with the desired characteristics according to the purpose can be prepared Agent. The base resin of the adhesive may be used alone or in combination of two or more kinds. The adhesive constituting the PF adhesive layer has the following characteristics: the base resin contains a polymer having a functional group containing active hydrogen. As long as it is the base resin, a PF adhesive layer with a desired storage elastic modulus can be obtained. The detailed content of the adhesive constituting the PF adhesive layer is described in, for example, Japanese Patent Application Laid-Open No. 2018-123281, and the description in this publication is used for reference in this specification. The thickness of the
表面保護薄膜40之厚度例如可為40μm~120μm。此外,表面保護薄膜之厚度係指基材與PF黏著劑層之合計厚度。The thickness of the
在一實施形態中,分離件30與黏著劑層20之剝離力(以下亦稱分離件之剝離力)較光學薄膜10與表面保護薄膜40(實質上為PF黏著劑層42)之剝離力(以下亦稱表面保護薄膜之剝離力)更小。大多情況,表面保護薄膜之剝離力較分離件之剝離力更大,而易發生表面保護薄膜之剝離不良,但依據後述製造方法,可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。更具體而言,分離件之剝離力宜為0.001N/10mm~1.0N/10mm,表面保護薄膜之剝離力宜為0.01N/10mm~5.0N/10mm。分離件之剝離力宜為0.001~0.1N/10mm,更宜為0.005~0.03N/10mm。表面保護薄膜之剝離力宜為0.01~0.5N/10mm,更宜為0.035~0.1N/10mm。分離件之剝離力與表面保護薄膜之剝離力之差(表面保護薄膜之剝離力-分離件之剝離力)宜為0.01N/10mm~1.0N/10mm。依據後述的製造方法,即便剝離力有所述之差,仍可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。In one embodiment, the peeling force of the
在一實施形態中,表面保護薄膜40之厚度較分離件30之厚度更大。藉由所述製造方法,即便是在如所述般表面保護薄膜之厚度很厚需要很大的剝離力時,仍可實現優異剝離性。表面保護薄膜之厚度與分離件之厚度之差(表面保護薄膜之厚度-分離件之厚度)宜為5μm~60μm。依據後述的製造方法,即便厚度有所述之差,仍可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。In one embodiment, the thickness of the
B.附黏著劑層光學積層體的製造方法 以下,說明附黏著劑層光學積層體的製造方法的代表例。首先,說明本發明之特徴部分的端銑刀之構成與工件之積層狀態之關係,再說明製造方法之概略。B. Manufacturing method of adhesive layer optical laminate Hereinafter, a representative example of the manufacturing method of the adhesive layer-attached optical laminate will be described. First, the relationship between the structure of the end mill of the characteristic part of the present invention and the layered state of the workpiece will be explained, and then the outline of the manufacturing method will be explained.
B-1.端銑刀之構成與工件之積層狀態之關係 本發明之實施形態中,係如同上述,以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件,再切削該工件之外周面。參照圖2及圖3來具體說明。圖2係說明可用於本發明製造方法之端銑刀之構成的代表例的概略圖。圖3係說明端銑刀為右刃時與為左刃時切削方向的不同的概略俯視圖。如圖2所示,端銑刀之構成大致分成右刃右螺旋、右刃左螺旋、左刃右螺旋、左刃左螺旋。如圖2所示,所謂右刃係指從上側(柄側)看去可在順時針旋轉時切削的構成;所謂左刃則係指從上側(柄側)看去可在逆時針旋轉時切削的構成。如圖2進一步所示,所謂右螺旋係指刀鋒從側邊看去沿右斜上方延伸的構成;所謂左螺旋則係指刀鋒從側邊看去沿左斜上方延伸的構成。右刃右螺旋及左刃左螺旋之切屑的排出方向為上方;右刃左螺旋及左刃右螺旋之切屑的排出方向為下方。此外,如圖3所示,右刃之切削方向代表上為逆時針旋轉,左刃之切削方向代表上為順時針旋轉。B-1. The relationship between the composition of the end mill and the layered state of the workpiece In the embodiment of the present invention, as described above, the adhesive layer optical laminate is superimposed so that the separating member is positioned in the chip discharge direction of the end mill to form a workpiece, and the outer peripheral surface of the workpiece is cut. This will be specifically described with reference to FIGS. 2 and 3. Fig. 2 is a schematic diagram illustrating a representative example of the configuration of an end mill that can be used in the manufacturing method of the present invention. Fig. 3 is a schematic plan view illustrating the difference in the cutting direction between the end mill with the right edge and the left edge. As shown in Figure 2, the structure of the end mill is roughly divided into right-edge right spiral, right-edge left spiral, left-edge right spiral, and left-edge left spiral. As shown in Figure 2, the so-called right edge refers to the structure that can be cut when viewed from the upper side (shank side) when rotating clockwise; the so-called left edge refers to the structure that can be cut when viewed from the upper side (shank side) when rotating counterclockwise The composition. As further shown in Fig. 2, the so-called right spiral refers to the formation of the blade extending diagonally upward to the right when viewed from the side; the so-called left spiral refers to the formation of the blade extending diagonally upward to the left when viewed from the side. The chip discharge direction of the right screw on the right blade and the left screw on the left blade is upward; the chip discharge direction of the left screw on the right blade and the right screw on the left blade is downward. In addition, as shown in Figure 3, the cutting direction of the right blade represents counterclockwise rotation, and the cutting direction of the left blade represents clockwise rotation.
本發明之實施形態中,係如同上述,以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件,再切削該工件之外周面。例如在端銑刀為右刃右螺旋或左刃左螺旋時,係如圖4(a)所示,以使分離件位於上側之方式疊合附黏著劑層光學積層體而形成工件W。另一方面,在端銑刀為右刃左螺旋或左刃右螺旋時,係如圖4(b)所示,以使分離件位於下側之方式疊合附黏著劑層光學積層體而形成工件W。本發明人等發現:依具有螺旋刃之端銑刀的切屑排出方向與工件中附黏著劑層光學積層體的表面保護薄膜之配置的關係,會有表面保護薄膜會產生浮凸的情形與不會產生浮凸的情形;並且,藉由使表面保護薄膜產生浮凸,可解決表面保護薄膜之剝離不良的問題。只要為如上述之構成,就會將附黏著劑層光學積層體從表面保護薄膜側往分離件側削起(或削下),結果可使在斜向被賦予強勁切削力的表面保護薄膜產生浮凸。藉此可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。表面保護薄膜之浮凸量宜為1μm以上,且宜為20μm以上,更宜為50μm以上。另一方面,浮凸量宜為1000μm以下,更宜為500μm以下。只要浮凸量在所述範圍內,便可在不造成其他不良情況且將外觀品質維持在可容許範圍內的同時,實現表面保護薄膜的良好剝離性。浮凸會降低外觀品質,故在本業界會盡可能避免其產生,但根據本發明之實施形態,藉由積極使表面保護薄膜產生浮凸此一完全違背本業界技術常識的技術思想,可獲得一種剝離不良經抑制的經切削加工之附黏著劑層光學積層體。另外,若將端銑刀之構成與工件之積層狀態的關係顛倒(亦即若在端銑刀為右刃右螺旋或左刃左螺旋時如圖4(b)所示形成工件,而在端銑刀為右刃左螺旋或左刃右螺旋時如圖4(a)所示形成工件),則分離件會產生浮凸但表面保護薄膜卻不會產生浮凸。結果,會有無法消除表面保護薄膜之剝離不良之問題的情形。In the embodiment of the present invention, as described above, the adhesive layer optical laminate is superimposed so that the separating member is positioned in the chip discharge direction of the end mill to form a workpiece, and the outer peripheral surface of the workpiece is cut. For example, when the end mill is a right-edge right spiral or a left-edge left spiral, as shown in FIG. 4(a), the adhesive layer optical laminate is laminated so that the separator is located on the upper side to form the workpiece W. On the other hand, when the end mill is a right-edge left-helix or a left-edge right-helix, as shown in Figure 4(b), the adhesive layer optical laminate is laminated so that the separator is located on the lower side. Workpiece W. The inventors found that depending on the relationship between the chip discharge direction of an end mill with a spiral blade and the arrangement of the surface protection film of the optical laminate with the adhesive layer in the workpiece, there may be cases where the surface protection film may be raised or not. There will be embossments; and by making the surface protection film embossed, the problem of poor peeling of the surface protection film can be solved. As long as it is configured as described above, the optical laminate with the adhesive layer will be shaved (or shaved) from the side of the surface protection film to the side of the separator. As a result, a surface protection film that is given a strong cutting force in an oblique direction can be produced. Embossed. Thereby, a cutting-processed optical laminate with an adhesive layer in which peeling defects of the surface protection film are suppressed can be obtained. The relief amount of the surface protection film is preferably 1 μm or more, preferably 20 μm or more, and more preferably 50 μm or more. On the other hand, the amount of relief is preferably 1000 μm or less, more preferably 500 μm or less. As long as the amount of embossment is within the above range, it is possible to achieve good peelability of the surface protection film without causing other problems and maintaining the appearance quality within the allowable range. The embossing will reduce the appearance quality, so it will be avoided as much as possible in the industry. However, according to the embodiment of the present invention, by actively making the surface protective film embossed, a technical idea that completely violates the common knowledge of the industry can be obtained A cutting-processed optical laminate with an adhesive layer in which peeling defects are suppressed. In addition, if the relationship between the composition of the end mill and the layered state of the workpiece is reversed (that is, if the end mill is a right-edge right spiral or a left-edge left spiral, the workpiece is formed as shown in Figure 4(b), and the end When the milling cutter is a right-edge left-helix or a left-edge right-helix, the workpiece is formed as shown in Fig. 4(a)), the separation part will produce relief but the surface protection film will not. As a result, the problem of poor peeling of the surface protective film may not be eliminated.
B-2.形成工件 接著,說明切削加工之概略。圖5係用以說明本發明製造方法之切削加工的概略立體圖,於本圖係顯示工件W。如圖5所示,係形成疊合有多片附黏著劑層光學積層體而成之工件W。如在B-1項所說明,係因應端銑刀之構成而如圖4(a)或圖4(b)所示來設定工件W之積層狀態。附黏著劑層光學積層體在形成工件時,代表上係裁切成任意適當之形狀。具體而言,附黏著劑層光學積層體可裁切成矩形形狀,亦可裁切成類似矩形形狀之形狀,而亦可裁切成因應目的之適當形狀(例如圓形)。工件W具有彼此相對向的外周面(切削面)1a、1b及與該等正交的外周面(切削面)1c、1d。工件W宜被鉗夾機構(未圖示)從上下鉗著。工件的總厚度宜為8mm~20mm,且宜為9mm~15mm,更宜為約10mm。只要為所述厚度,便可防止鉗夾機構之擠壓或切削加工時之衝撃造成損傷。附黏著劑層光學積層體係疊合成使工件成為所述之總厚度。構成工件之附黏著劑層光學積層體的片數例如可為10片~50片。鉗夾機構(例如夾具)可以軟質材料構成亦可以硬質材料構成。以軟質材料構成時,其硬度(JIS A)宜為60°~80°。若硬度過高,則會有鉗夾機構所造成之壓痕殘留的情形。若硬度過低,則會因夾具之變形造成位置偏移,而有切削精度不足之情形。B-2. Form a workpiece Next, the outline of the cutting process will be explained. 5 is a schematic perspective view for explaining the cutting process of the manufacturing method of the present invention, and the workpiece W is shown in this figure. As shown in FIG. 5, a work W is formed by stacking a plurality of optical laminates with adhesive layers. As explained in item B-1, the layered state of the workpiece W is set as shown in Fig. 4(a) or Fig. 4(b) according to the configuration of the end mill. When the optical laminate with an adhesive layer is formed into a workpiece, it means that the upper system is cut into any appropriate shape. Specifically, the adhesive layer optical laminate can be cut into a rectangular shape, can also be cut into a shape similar to a rectangular shape, or can be cut into an appropriate shape (such as a circle) according to the purpose. The workpiece W has outer peripheral surfaces (cutting surfaces) 1a, 1b facing each other, and outer peripheral surfaces (cutting surfaces) 1c, 1d orthogonal to these. The workpiece W is preferably clamped from top to bottom by a clamp mechanism (not shown). The total thickness of the workpiece should be 8mm~20mm, and should be 9mm~15mm, more preferably about 10mm. As long as the thickness is the above-mentioned thickness, it can prevent the clamping mechanism from being damaged by pressing or punching during cutting. The adhesive layer optical layering system is laminated to make the workpiece become the total thickness described. The number of sheets of the adhesive layer optical laminate constituting the workpiece can be, for example, 10 to 50 sheets. The clamping mechanism (such as a clamp) can be composed of soft materials or hard materials. When it is made of soft materials, its hardness (JIS A) should be 60°~80°. If the hardness is too high, there will be residual indentation caused by the clamping mechanism. If the hardness is too low, the position will shift due to the deformation of the fixture, and the cutting accuracy will be insufficient.
B-3.切削加工
接著,利用端銑刀60來切削工件W的外周面。切削代表上係藉由使端銑刀之切削刃抵接工件W之外周面來進行。切削可涵蓋工件之外周面的全周進行,而亦可僅於預定之位置進行。B-3. Cutting
Next, the
端銑刀60如圖6所示,具有:旋轉軸61,係沿工件W之積層方向(鉛直方向)延伸;及切削刃62,係構成為以旋轉軸61為中心旋轉的本體之最外徑。在圖式例中,切削刃62係構成為沿旋轉軸61扭轉之最外徑,顯示為右刃右螺旋。切削刃62包含刀鋒62a、前刀面62b與後刀面62c。切削刃62的刃數可因應目的適當設定。圖示例中之切削刃為3片構成,但刃數可為連續的1片,可為2片,可為4片,亦可為5片以上。端銑刀的刃角度(圖式例中的切削刃之螺旋角θ)宜為20°~60°,且30°~45°更佳。只要為所述刃角度,便可藉由切削使表面保護薄膜良好地產生浮凸。切削刃之後刀面宜經粗面化處理。粗面化處理可採用任意適當之處理。代表例可舉噴砂處理。藉由對後刀面施行粗面化處理,可抑制黏著劑附著至切削刃,結果可抑制黏結。端銑刀之外徑宜為3mm~20mm。另外,本說明書中所謂「黏結」係指工件之附黏著劑層光學積層體彼此因端面之黏著劑接著之現象,附著於端面的黏著劑之切屑會助長附黏著劑層光學積層體彼此接著。又,所謂「端銑刀之外徑」係指將旋轉軸61至刀鋒62a的距離乘以2倍而得者。端銑刀可為一端(上端)經固定之單側固定端銑刀,亦可為兩端(上端與下端)經固定之雙側固定端銑刀。As shown in FIG. 6, the
在一實施形態中,本發明製造方法包含:將工件之外周面進行非直線切削。非直線切削例如如圖7所示,包含:形成在俯視附黏著劑層光學積層體時包含曲線部之凹部4c。要製作圖7所示之俯視形狀的附黏著劑層光學積層體時,係將工件之外周進行直線切削,同時於工件外周的兩個隅部形成去角部4a、4b,並於形成有去角部4a、4b的外周面之中央部形成凹部(包含曲線部之凹部)4c。藉由形成所述凹部,可使表面保護薄膜在凹部附近產生浮凸。結果,可提升從凹部剝離去除表面保護薄膜時之剝離性。針對所述切削加工之一例,參照圖8(a)~圖8(c)進行說明。首先,如圖8(a)所示,將要形成圖7之去角部4a之部分進行去角加工,接著如圖8(b)所示,將要形成去角部4b之部分進行去角加工。最後,如圖8(c)所示,切削形成凹部(包含曲線部之凹部)4c。曲線部的半徑宜為5mm以下,且宜為4mm以下,更宜為3mm以下。另外,去角部4a及4b以及凹部4c的形成順序(切削順序)無限定,該等可以任意適當之順序形成。In one embodiment, the manufacturing method of the present invention includes non-linear cutting of the outer peripheral surface of the workpiece. The non-linear cutting includes, for example, as shown in FIG. 7, a
切削加工的條件可因應所期望之形狀適當設定。端銑刀的旋轉數宜為1000rpm~60000rpm,且宜為10000rpm~40000rpm。端銑刀的進給速度宜為500mm/分鐘~10000mm/分鐘,更宜為500mm/分鐘~2500mm/分鐘。切削處的切削次數可削1次、削2次、削3次或其以上。The cutting conditions can be appropriately set according to the desired shape. The rotation number of the end mill should be 1000rpm~60,000rpm, and should be 10000rpm~40,000rpm. The feed speed of the end mill should be 500mm/min~10000mm/min, more preferably 500mm/min~2500mm/min. The number of cuts at the cutting point can be cut once, cut twice, cut 3 times or more.
依上述方式,可獲得經切削加工之附黏著劑層光學積層體。藉由本發明製造方法獲得之附黏著劑層光學積層體,其表面保護薄膜之剝離不良經抑制。 實施例In the above manner, a cut-processed optical laminate with an adhesive layer can be obtained. In the optical laminate with an adhesive layer obtained by the manufacturing method of the present invention, the peeling failure of the surface protective film is suppressed. Example
以下,以實施例來具體說明本發明,惟本發明不受該等實施例限定。實施例之評估項目如下。Hereinafter, the present invention will be specifically described with examples, but the present invention is not limited by these examples. The evaluation items of the embodiment are as follows.
(1)表面保護薄膜之浮凸發生率 準備任意數量(宜為100以上)的切削加工後之附黏著劑層光學積層體,並使用放大鏡或顯微鏡觀察表面保護薄膜之浮凸。觀察每個附黏著劑層光學積層體的全周圍,若觀察到1μm以上的浮凸,該附黏著劑層光學積層體便計為有浮凸試樣,並由「(有浮凸試樣/觀察數量)×100」來算出浮凸產生率。 (2)剝離成功率 隨機抽出50片實施例及比較例所得經切削加工之附黏著劑層光學積層體,並對各片分別進行表面保護薄膜之剝離(起始剝離力2.9N)。以百分率表示在50次剝離之中成功剝離而無問題的次數,以其作為剝離成功率。 (3)浮凸量 以放大鏡或顯微鏡測定實施例及比較例所得經切削加工之附黏著劑層光學積層體中表面保護薄膜之浮凸量。將一工件之浮凸量的最大值作為浮凸量。(1) The incidence of embossment of surface protective film Prepare any number (preferably 100 or more) of optical laminates with adhesive layers after cutting, and use a magnifying glass or microscope to observe the relief of the surface protection film. Observe the entire circumference of each optical laminate with an adhesive layer. If an embossment of 1 μm or more is observed, the optical laminate with an adhesive layer is counted as an embossed sample, and is determined by "( embossed sample/ The number of observations) × 100" to calculate the bump generation rate. (2) Stripping success rate Fifty sheets of the optical laminates with adhesive layers obtained in the examples and comparative examples were randomly selected, and the surface protective films were peeled off for each sheet (initial peeling force 2.9N). The number of times of successful peeling without problems among 50 peelings is expressed as a percentage, and this is taken as the peeling success rate. (3) Amount of relief The amount of relief of the surface protective film in the cut-processed optical laminates with adhesive layers obtained in the examples and comparative examples was measured with a magnifying glass or a microscope. The maximum value of the relief amount of a workpiece is regarded as the relief amount.
>實施例1> 依常規方法,製出從視辨側起依序具有表面保護薄膜(60μm)/環烯烴系保護薄膜(47μm)/偏光件(5μm)/環烯烴系保護薄膜(24μm)/黏著劑層(20μm)/分離件之構成的附黏著劑層之偏光板。另外,表面保護薄膜係製作具有PET基材(50μm)/PF黏著劑層(10μm)之構成的表面保護薄膜,並進行驗證。此時,黏著劑層(黏著劑)之儲存彈性模數係調整成0.5MPa~3.0MPa。將依上述方式獲得之附黏著劑層之偏光板沖裁成5.7吋尺寸(長140mm及寬65mm左右)後,疊合多片經沖裁之偏光板製成工件(總厚度約10mm)。在將所得工件以鉗夾(夾具)夾住的狀態下,藉由端銑刀加工於工件之外周的兩個隅部形成去角部,並於形成有去角部的外周面之中央部形成凹部(包含曲線部之凹部),而獲得如圖7所示之經切削加工之附黏著劑層之偏光板。端銑刀的進給速度為500mm/分鐘~2000mm/分鐘,旋轉數為5000rpm~30000rpm。且,端銑刀係使用右刃右螺旋且螺旋角30°者。該端銑刀之切屑的排出方向為上方。附黏著劑層之偏光板係以使分離件位於上側之方式疊合而形成工件。利用切削所得表面保護薄膜之浮凸發生率為100%。針對所得經切削加工之附黏著劑層之偏光板進行上述(2)及(3)之評估。將結果列於表1。>Example 1> According to the conventional method, a surface protective film (60μm)/cycloolefin-based protective film (47μm)/polarizer (5μm)/cycloolefin-based protective film (24μm)/adhesive layer (20μm) )/A polarizing plate with an adhesive layer composed of separate parts. In addition, the surface protection film is a surface protection film with a PET substrate (50μm)/PF adhesive layer (10μm) structure, and it is verified. At this time, the storage elastic modulus of the adhesive layer (adhesive) is adjusted to 0.5MPa~3.0MPa. After punching the polarizer with the adhesive layer obtained in the above manner into a size of 5.7 inches (length 140mm and width 65mm), stack multiple punched polarizers to make a workpiece (total thickness about 10mm). In the state where the obtained workpiece is clamped by a clamp (fixture), the two corners of the outer circumference of the workpiece are processed by an end mill to form a chamfered part, and the chamfered part is formed at the center of the outer peripheral surface. Recesses (including the recesses of the curved portion) to obtain a polarizing plate with an adhesive layer after cutting as shown in FIG. 7. The feed speed of the end mill is 500mm/min~2000mm/min, and the rotation number is 5000rpm~30000rpm. In addition, the end mill uses the right helix and the helix angle of 30°. The chip discharge direction of this end mill is upward. The polarizing plate with the adhesive layer is superimposed so that the separating part is located on the upper side to form a workpiece. The embossing rate of the surface protective film obtained by cutting is 100%. The evaluation of (2) and (3) above was performed on the obtained polarizing plate with an adhesive layer after cutting. The results are listed in Table 1.
>比較例1> 以使附黏著劑層之偏光板的分離件位於下側之方式疊合而形成工件,除此之外依與實施例1相同方式進行切削加工。將所得經切削加工之附黏著劑層之偏光板供於進行與實施例1相同之評估。將結果列於表1。>Comparative Example 1> The workpiece was formed by stacking the separator of the polarizing plate with the adhesive layer on the lower side, except that the cutting process was performed in the same manner as in Example 1. The cut-processed polarizing plate with an adhesive layer was used for the same evaluation as in Example 1. The results are listed in Table 1.
>實施例2> 除了使用右刃右螺旋且螺旋角45°之端銑刀外,依與實施例1相同方式進行切削加工。將所得經切削加工之附黏著劑層之偏光板供於進行與實施例1相同之評估。將結果列於表1。>Example 2> The cutting process was performed in the same manner as in Example 1, except that an end mill with a right-edge helix and a helix angle of 45° was used. The cut-processed polarizing plate with an adhesive layer was used for the same evaluation as in Example 1. The results are listed in Table 1.
>比較例2> 以使附黏著劑層之偏光板的分離件位於下側之方式疊合而形成工件,除此之外依與實施例2相同方式進行切削加工。將所得經切削加工之附黏著劑層之偏光板供於進行與實施例1相同之評估。將結果列於表1。>Comparative Example 2> The workpiece was formed by superimposing the separator of the polarizing plate with the adhesive layer on the lower side, except that the cutting process was performed in the same manner as in Example 2. The cut-processed polarizing plate with an adhesive layer was used for the same evaluation as in Example 1. The results are listed in Table 1.
[表1] [Table 1]
>評估> 由表1可知,根據本發明之實施例,藉由以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件,可簡便低價實現表面保護薄膜之剝離不良經抑制的經切削加工之附黏著劑層光學積層體。>Evaluation> It can be seen from Table 1 that according to the embodiment of the present invention, by stacking the optical laminate with the adhesive layer so that the separating piece is positioned in the chip discharge direction of the end mill to form a workpiece, the surface protection film can be easily and inexpensively realized. A cut-off optical laminate with an adhesive layer with suppressed peeling defects.
產業上之可利用性 本發明製造方法可適用於製造需進行切削加工(尤其非直線加工)之附黏著劑層光學積層體。藉由本發明製造方法獲得之附黏著劑層光學積層體可適用於以汽車儀表面板或智慧手錶為代表之異形影像顯示部。Industrial availability The manufacturing method of the present invention is suitable for manufacturing optical laminates with adhesive layers that require cutting processing (especially non-linear processing). The optical laminate with an adhesive layer obtained by the manufacturing method of the present invention can be applied to special-shaped image display parts represented by automobile instrument panels or smart watches.
W:工件
10:光學薄膜
20:黏著劑層
30:分離件
40:表面保護薄膜
41:基材
42:黏著劑層(PF黏著劑層)
60:端銑刀
61:旋轉軸
62:切削刃
62a:刀鋒
62b:前刀面
62c:後刀面
100:附黏著劑層光學積層體
1a,1b,1c,1d:外周面(切削面)
θ:螺旋角
4a,4b:去角部
4c:凹部(包含曲線部之凹部)W: Workpiece
10: Optical film
20: Adhesive layer
30: separate parts
40: Surface protection film
41: Substrate
42: Adhesive layer (PF adhesive layer)
60: end mill
61: Rotation axis
62: cutting
圖1係說明可用於本發明製造方法之附黏著劑層光學積層體之一例的概略截面圖。 圖2係說明可用於本發明製造方法之端銑刀之構成的代表例的概略圖。 圖3係說明可用於本發明製造方法之端銑刀為右刃時與為左刃時切削方向的不同的概略俯視圖。 圖4(a)係說明本發明之一實施形態的工件之形成方法的重要部分概略前視圖;(b)係說明另一實施形態的工件之形成方法的重要部分概略前視圖。 圖5係用以說明本發明製造方法中之切削加工的概略立體圖。 圖6係用以說明本發明製造方法中切削加工所用端銑刀之結構的概略圖。 圖7係顯示可利用本發明製造方法獲得之經切削加工之附黏著劑層光學積層體之形狀一例的概略俯視圖。 圖8(a)~(c)係說明本發明製造方法中切削加工之一連串程序的概略俯視圖。Fig. 1 is a schematic cross-sectional view illustrating an example of an optical laminate with an adhesive layer that can be used in the manufacturing method of the present invention. Fig. 2 is a schematic diagram illustrating a representative example of the configuration of an end mill that can be used in the manufacturing method of the present invention. Fig. 3 is a schematic plan view illustrating the difference in the cutting direction between the right edge and the left edge of the end mill applicable to the manufacturing method of the present invention. Fig. 4 (a) is a schematic front view of important parts for explaining a method of forming a workpiece according to an embodiment of the present invention; (b) is a schematic front view of important parts for explaining a method of forming a workpiece according to another embodiment. Fig. 5 is a schematic perspective view for explaining the cutting process in the manufacturing method of the present invention. Fig. 6 is a schematic diagram for explaining the structure of an end mill used for cutting in the manufacturing method of the present invention. FIG. 7 is a schematic plan view showing an example of the shape of an optical laminate with an adhesive layer that can be cut by the manufacturing method of the present invention. 8(a) to (c) are schematic plan views illustrating a series of cutting processes in the manufacturing method of the present invention.
W:工件 W: Workpiece
10:光學薄膜 10: Optical film
20:黏著劑層 20: Adhesive layer
30:分離件 30: separate parts
40:表面保護薄膜 40: Surface protection film
100:附黏著劑層光學積層體 100: Optical laminate with adhesive layer
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