TW202041548A - Styrene resin composition, molded article, and light guide plate - Google Patents

Styrene resin composition, molded article, and light guide plate Download PDF

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TW202041548A
TW202041548A TW109108981A TW109108981A TW202041548A TW 202041548 A TW202041548 A TW 202041548A TW 109108981 A TW109108981 A TW 109108981A TW 109108981 A TW109108981 A TW 109108981A TW 202041548 A TW202041548 A TW 202041548A
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resin composition
styrene resin
tert
styrene
butyl
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TW109108981A
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西野廣平
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日商電化股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005Stabilisers against oxidation, heat, light, ozone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • C08K5/134Phenols containing ester groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • C08K5/52Phosphorus bound to oxygen only
    • C08K5/524Esters of phosphorous acids, e.g. of H3PO3
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02Homopolymers or copolymers of hydrocarbons
    • C08L25/04Homopolymers or copolymers of styrene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form

Abstract

Provided are a styrene resin composition and a molded article thereof having excellent moist-heat resistance, and a light guide plate. Through the present invention, there is provided a styrene resin composition in which t1 - t2 is 20 minutes or less, where t1 is the oxidation induction time measured in an oxygen atmosphere at 200 DEG C, and t2 is the oxidation induction time measured in an oxygen atmosphere at 200 DEG C after 500 hours of moist heat treatment in an air atmosphere at 80 DEG C and 90% humidity.

Description

苯乙烯系樹脂組成物、成型品以及導光板Styrene resin composition, molded product, and light guide plate

本發明涉及一種苯乙烯系樹脂組成物、其成型品以及導光板。The invention relates to a styrene resin composition, its molded product and a light guide plate.

液晶顯示裝置的背光包括在顯示裝置的正表面配置光源的直下型和配置在側面的邊緣光型。在邊緣光型中使用將配置在側面的光源的光引導到顯示裝置的正面的被稱作為導光板的部件。 導光板的材料使用以聚甲基丙烯酸甲酯(PMMA)為代表的丙烯酸系樹脂。但由於PMMA吸水性高,會有因吸水造成導光板翹曲或尺寸變化的情況。此外,由於在成型時容易熱分解,因此在用高溫成型時,會容易發生成型體外觀不良的問題。 為了改善這些問題,提案將苯乙烯-(甲基)丙烯酸甲酯共聚物作為導光板的材料(例如參照專利文件1)。 [現有技術文獻] [專利文件]The backlight of the liquid crystal display device includes a direct type in which the light source is arranged on the front surface of the display device and an edge light type in which the light source is arranged on the side surface. In the edge light type, a member called a light guide plate that guides the light of a light source arranged on the side to the front of the display device is used. The material of the light guide plate uses acrylic resin represented by polymethyl methacrylate (PMMA). However, due to the high water absorption of PMMA, the light guide plate may warp or change in size due to water absorption. In addition, since it is easily thermally decomposed during molding, when molding at high temperature, the appearance of the molded body is likely to be poor. In order to improve these problems, it is proposed to use styrene-methyl (meth)acrylate copolymer as the material of the light guide plate (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Document]

專利文件1:日本特開2003-075648號公報Patent Document 1: Japanese Patent Application Publication No. 2003-075648

[發明所要解決的課題][Problems to be Solved by Invention]

本發明以提供一種耐濕熱性優異的苯乙烯系樹脂組成物、其成型品以及導光板為課題。 [解決課題的技術手段]The subject of the present invention is to provide a styrene-based resin composition having excellent moisture and heat resistance, a molded product thereof, and a light guide plate. [Technical means to solve the problem]

即,本發明如下: (1)一種苯乙烯系樹脂組成物,設200℃的氧氣氣氛下測定的氧化誘導時間為t1,設在80℃且90%濕度的空氣氣氛下進行了500小時濕熱處理後,在200℃的氧氣氣氛下測定的氧化誘導時間為t2,t1-t2為20分鐘以下。 (2)根據(1)所述的苯乙烯系樹脂組成物,所述t1為50分鐘以上。 (3)根據(1)或(2)所述的苯乙烯系樹脂組成物,含有受阻酚系抗氧化劑(B)、不具有酚系羥基的磷系抗氧化劑(C2)。 (4)根據(1)~(3)中任一項所述的苯乙烯系樹脂組成物,含有具有苯乙烯系單體單元和(甲基)丙烯酸酯系單體單元的苯乙烯系樹脂(A)。 (5)根據(1)~(4)中任一項所述的苯乙烯系樹脂組成物,含有具有酚系羥基的磷系抗氧化劑(C1)。 (6)根據(3)所述的苯乙烯系樹脂組成物,所述受阻酚系抗氧化劑(B)是選自十八烷基-3-(3,5-而-叔丁基-4-羥基苯基)丙酸酯、亞乙基雙(氧乙烯基)雙〔3-(5-叔丁基-4-羥基-間甲苯基)丙酸酯〕、季戊四醇四[3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯]中的至少一種化合物。 (7)根據(3)所述的苯乙烯系樹脂組成物,其中,所述磷系抗氧化劑(C2)是選自2,2‘-亞甲基雙(4,6-二-叔丁基苯基)2-乙基己基亞磷酸酯、三(2,4-二-叔丁基苯基)亞磷酸酯中的至少一種化合物。 (8)根據(5)中所述的苯乙烯系樹脂組成物,所述磷系抗氧化劑(C1)是6-[3-(3-叔丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四-叔丁基二苯並[d,f][1,3,2]二氧磷雜七環(dioxaphosphepin)。 (9)根據(1)~(8)中任一項所述的苯乙烯系樹脂組成物,其初期的光路長115mm下的YI值是2.5以下。 (10)使用了(1)~(9)中任一項所述的苯乙烯系樹脂組成物的成型品。 (11)使用了(10)所述的成型品的導光板。 [發明的效果]That is, the present invention is as follows: (1) A styrene-based resin composition, set the oxidation induction time measured in an oxygen atmosphere at 200°C as t1, set at 80°C and 90% humidity in an air atmosphere for 500 hours after wet heat treatment, and then at 200°C The oxidation induction time measured under an oxygen atmosphere is t2, and t1-t2 is less than 20 minutes. (2) The styrene resin composition according to (1), wherein the t1 is 50 minutes or more. (3) The styrene-based resin composition according to (1) or (2), which contains a hindered phenol-based antioxidant (B) and a phosphorus-based antioxidant (C2) that does not have a phenolic hydroxyl group. (4) The styrene resin composition according to any one of (1) to (3), which contains a styrene resin having a styrene monomer unit and a (meth)acrylate monomer unit ( A). (5) The styrene-based resin composition according to any one of (1) to (4), which contains a phosphorus-based antioxidant (C1) having a phenol-based hydroxyl group. (6) The styrene-based resin composition according to (3), wherein the hindered phenol-based antioxidant (B) is selected from octadecyl-3-(3.5-and -tert-butyl-4- Hydroxyphenyl) propionate, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl) propionate], pentaerythritol tetra[3-(3,5) -Di-tert-butyl-4-hydroxyphenyl) propionate] at least one compound. (7) The styrene resin composition according to (3), wherein the phosphorus antioxidant (C2) is selected from 2,2'-methylenebis(4,6-di-tert-butyl Phenyl) at least one compound of 2-ethylhexyl phosphite and tris(2,4-di-tert-butylphenyl) phosphite. (8) The styrene-based resin composition described in (5), wherein the phosphorus-based antioxidant (C1) is 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl) ) Propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2] dioxaphosphepin. (9) The styrene-based resin composition according to any one of (1) to (8), wherein the YI value at an initial optical path length of 115 mm is 2.5 or less. (10) A molded article using the styrene resin composition described in any one of (1) to (9). (11) The light guide plate of the molded product described in (10) is used. [Effects of the invention]

根據本發明,得到一種耐濕熱性優異的苯乙烯系樹脂組成物、其成型品以及導光板。According to the present invention, a styrene-based resin composition having excellent moisture and heat resistance, a molded product thereof, and a light guide plate are obtained.

本申請說明書中的“A~B”的意思是A以上且B以下。"A-B" in this application specification means more than A and less than B.

本發明的苯乙烯系樹脂組成物在200℃的氧氣氣氛下測定的氧化誘導時間為t1,在80℃且90%濕度的空氣氣氛下進行濕熱處理500小時後再在200℃的氧氣氣氛下測定的氧化誘導時間為t2時,t1-t2為20分鐘以下,優選為15分鐘以下,更優選為10分鐘以下。若t1-t2在該範圍,則可以抑制在高溫高濕環境下保存時的色相劣化。此外,雖然增加抗氧化劑的添加量有助於維持氧化誘導時間,但另一方面也會對色相造成不利影響,所以在考慮其平衡時,優選t1-t2為1分鐘以上,更優選為2分鐘以上,進一步優選為4分鐘以上。t1-t2具體例如是0、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、16、17、18、19、20分鐘,也可以是這裡例示的數值中的任意2個之間的範圍。The styrenic resin composition of the present invention has an oxidation induction time of t1 measured in an oxygen atmosphere at 200°C. It is subjected to wet heat treatment for 500 hours in an air atmosphere at 80°C and 90% humidity, and then measured in an oxygen atmosphere at 200°C. When the oxidation induction time is t2, t1-t2 is 20 minutes or less, preferably 15 minutes or less, and more preferably 10 minutes or less. If t1-t2 is in this range, the hue deterioration during storage in a high temperature and high humidity environment can be suppressed. In addition, although increasing the amount of antioxidant added helps to maintain the oxidation induction time, on the other hand, it will also adversely affect the hue. Therefore, when considering the balance, t1-t2 is preferably 1 minute or more, more preferably 2 minutes Above, more preferably 4 minutes or more. t1-t2 is, for example, 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20 minutes. It can be a range between any two of the numerical values exemplified here.

t1優選為50分鐘以上,更優選為70分鐘以上,進一步優選為90分鐘以上。當t1是該範圍時,可以抑制在高溫環境下黃化。雖然增加抗氧化劑的添加量能夠延長氧化誘導時間,但另一方面也會對色相造成不利影響,因此,考慮到平衡的情況,t1優選為500分鐘以下,更優選為200分鐘以下。t1 is preferably 50 minutes or more, more preferably 70 minutes or more, and still more preferably 90 minutes or more. When t1 is in this range, yellowing in a high temperature environment can be suppressed. Although increasing the amount of antioxidants can prolong the oxidation induction time, on the other hand it will also adversely affect the hue. Therefore, considering the balance, t1 is preferably 500 minutes or less, and more preferably 200 minutes or less.

氧化誘導時間是通過化學發光法測定的數值。用以下條件,測定苯乙烯系樹脂組成物的發光量的時間變化,通過測定時間與發光量的關係計算如圖1所示的發光量變化前的直線與發光量增大後的之間的焦點的時間。苯乙烯系樹脂組成物在氧存在下加熱後會逐漸被氧化。當在試樣中存在抗氧化劑時,因氧化抗氧化劑被逐漸消耗,在存在抗氧化劑的情況下顯示一定發光量。當抗氧化劑變沒後,則樹脂本身被氧化,會一度出現發光增加的情況。也就是說,氧化誘導時間是表示抗氧化劑被消耗,且樹脂組成物的氧化急劇進行時的時間。 化學發光測定儀:CLA-FS4(東北電子產業公司製造) 測定溫度:200℃ 氧氣流量:100mL/分鐘The oxidation induction time is a value measured by the chemiluminescence method. Use the following conditions to measure the time change of the luminous amount of the styrene resin composition, and calculate the focal point between the straight line before the change in the luminous amount and the increase in the luminous amount as shown in Figure 1 by measuring the relationship between the time and the luminous amount time. The styrene resin composition is gradually oxidized after being heated in the presence of oxygen. When antioxidants are present in the sample, the antioxidants are gradually consumed due to oxidation, and a certain amount of luminescence is shown in the presence of antioxidants. When the antioxidants disappear, the resin itself is oxidized, and the luminescence will increase for a while. That is, the oxidation induction time means the time when the antioxidant is consumed and the oxidation of the resin composition progresses rapidly. Chemiluminescence analyzer: CLA-FS4 (manufactured by Tohoku Electronics Industry Co., Ltd.) Measuring temperature: 200℃ Oxygen flow rate: 100mL/min

本發明的苯乙烯系樹脂組成物優選含有苯乙烯系樹脂(A),其是苯乙烯系單體和(甲基)丙烯酸酯系單體的共聚物。The styrene resin composition of the present invention preferably contains a styrene resin (A), which is a copolymer of a styrene monomer and a (meth)acrylate monomer.

苯乙烯系單體是指芳香族乙烯系單體,其是苯乙烯、α-甲基苯乙烯、o-甲基苯乙烯、m-甲基苯乙烯、乙基苯乙烯、p-叔丁基苯乙烯等單獨或2種以上的混合物。在這些單體中,從色相好的觀點來看,優選使用苯乙烯。Styrenic monomers refer to aromatic vinyl monomers, which are styrene, α-methylstyrene, o-methylstyrene, m-methylstyrene, ethylstyrene, and p-tert-butyl Styrene alone or a mixture of two or more. Among these monomers, styrene is preferably used from the viewpoint of good hue.

(甲基)丙烯酸酯系單體是指(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸2-乙基己酯的甲基丙烯酸酯、丙烯酸甲酯、丙烯酸乙酯、丙烯酸正丁酯、丙烯酸2-甲基己酯、丙烯酸2-乙基己酯、丙烯酸癸酯單獨或2種以上的混合物。從色相或耐熱性優異的觀點來看,優選使用(甲基)丙烯酸甲酯。(Meth)acrylate-based monomers refer to methacrylic acid of methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate Ester, methyl acrylate, ethyl acrylate, n-butyl acrylate, 2-methylhexyl acrylate, 2-ethylhexyl acrylate, and decyl acrylate alone or a mixture of two or more. From the viewpoint of excellent hue and heat resistance, methyl (meth)acrylate is preferably used.

苯乙烯系樹脂(A)優選苯乙烯系單體單元的含量為20~80質量%、(甲基)丙烯酸酯系單體單元的含量為80~20質量%,優選苯乙烯系單體單元的含量為30~60質量%、(甲基)丙烯酸酯系單體單元的含量為70~40質量%。若單體單元的含量在該範圍內,則吸水率和變形率(吸水性)低,從而能夠抑制因吸濕引起的翹曲和尺寸變化變大,從而能夠抑制色相惡化或表面硬度降低引起的劃痕。The styrene-based resin (A) preferably has a styrene-based monomer unit content of 20 to 80% by mass, and a (meth)acrylate ester-based monomer unit content of 80-20% by mass. The content is 30-60% by mass, and the content of (meth)acrylate monomer units is 70-40% by mass. If the content of the monomer unit is within this range, the water absorption rate and the deformation rate (water absorption) are low, and the warpage and dimensional change caused by moisture absorption can be suppressed, and the deterioration of the hue or the decrease of the surface hardness can be suppressed. Scratches.

苯乙烯系樹脂(A)可在5質量%以下的範圍與除(甲基)丙烯酸酯系單體以外的單體共聚。作為共聚的單體是可以與苯乙烯系單體和(甲基)丙烯酸酯系單體共聚的乙烯基單體,其是丙烯腈、甲基丙烯酸、丙烯酸、馬來酸酐等。The styrene-based resin (A) can be copolymerized with monomers other than (meth)acrylate-based monomers in a range of 5% by mass or less. The monomer to be copolymerized is a vinyl monomer copolymerizable with a styrene-based monomer and a (meth)acrylate-based monomer, which is acrylonitrile, methacrylic acid, acrylic acid, maleic anhydride, and the like.

苯乙烯系樹脂的苯乙烯系單體單元和(甲基)丙烯酸酯系單體單元的含量可以通過熱分解氣相色譜法在以下條件下測定。 熱解爐:PYR-2A(株式會社島津製作所製造) 熱解爐溫度設定:525℃ 氣相色譜儀:GC-14A(株式會社島津製作所製造) 柱:玻璃製直徑為3mm×3m 填充劑:FFAP Chromsorb WAW 柱溫度:120℃ 載氣:氮氣The content of the styrene-based monomer unit and the (meth)acrylate-based monomer unit of the styrene-based resin can be measured under the following conditions by thermal decomposition gas chromatography. Pyrolysis furnace: PYR-2A (manufactured by Shimadzu Corporation) Pyrolysis furnace temperature setting: 525℃ Gas chromatograph: GC-14A (manufactured by Shimadzu Corporation) Column: 3mm×3m in diameter made of glass Filler: FFAP "Chromsorb" WAW Column temperature: 120℃ Carrier gas: nitrogen

作為苯乙烯系樹脂的製造方法可以通過公知的本體聚合、溶液聚合、懸浮聚合、乳化聚合等方式製造。作為反應裝置的操作法可以適用連續式、分批式(批次式)、辦批次式中的任意一種。從透明性等品質面或生產性的方面來看,優選本體聚合或溶液聚合,且優選連續式。作為本體聚合或溶液聚合的溶劑是苯、甲苯、乙苯以及二甲苯等烷基苯類、或丙酮、甲基乙基酮等酮類、己烷、環己烷等脂肪族烴等。As a manufacturing method of the styrene-based resin, it can be manufactured by known methods such as bulk polymerization, solution polymerization, suspension polymerization, and emulsion polymerization. As the operation method of the reaction device, any one of continuous type, batch type (batch type), and batch type can be applied. From the viewpoint of quality aspects such as transparency and productivity, bulk polymerization or solution polymerization is preferable, and continuous type is preferable. As a solvent for bulk polymerization or solution polymerization, alkylbenzenes such as benzene, toluene, ethylbenzene, and xylene, ketones such as acetone and methyl ethyl ketone, and aliphatic hydrocarbons such as hexane and cyclohexane.

苯乙烯系樹脂的聚合方法可以採用公知的方法。優選自由基聚合法,因其工藝簡單且具有優異的生產性。The polymerization method of styrene resin can adopt a well-known method. The radical polymerization method is preferred because of its simple process and excellent productivity.

在苯乙烯系樹脂的本體聚合或溶液聚合中可以使用聚合引發劑、鏈轉移劑、聚合溫度優選為110~170℃的範圍。用連續式進行本體聚合或溶液聚合時,從生產性的觀點來看,優選以苯乙烯系單體和(甲基)丙烯酸酯系單體的轉化率在聚合工序出口處達到60%以上。A polymerization initiator and a chain transfer agent can be used in the bulk polymerization or solution polymerization of the styrene resin, and the polymerization temperature is preferably in the range of 110 to 170°C. In the case of continuous bulk polymerization or solution polymerization, from the viewpoint of productivity, it is preferable that the conversion rate of the styrene-based monomer and the (meth)acrylate-based monomer be 60% or more at the exit of the polymerization step.

聚合引發劑是過氧化苯甲醯、過氧化苯甲酸叔丁酯、1,1-二(叔丁基過氧)環己烷、1,1-雙(叔丁基過氧)-3,3,5-三甲基環己烷、1,1-雙(叔丁基過氧)-3,3,5-三甲基環己烷、2,2-雙(4,4-二-叔丁基過氧環己基)丙烷、叔丁基過氧碳酸異丙酯、二枯基過氧化物、叔丁基枯基過氧化物、過氧乙酸叔丁酯、叔丁基過氧-2-乙基己酸酯、聚醚四(過氧碳酸叔丁酯)、3,3-二(叔丁基過氧)丁酸乙酯、過氧異丁酸叔丁酯等有機過氧化物。The polymerization initiator is benzoyl peroxide, tert-butyl peroxybenzoate, 1,1-bis(tert-butylperoxy)cyclohexane, 1,1-bis(tert-butylperoxy)-3,3 ,5-Trimethylcyclohexane, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 2,2-bis(4,4-di-tert-butyl Peroxycyclohexyl) propane, tert-butylperoxyisopropyl carbonate, dicumyl peroxide, tert-butylcumyl peroxide, tert-butyl peroxyacetate, tert-butylperoxy-2-ethyl Organic peroxides such as hexanoate, polyether tetra(tert-butyl peroxycarbonate), 3,3-bis(tert-butylperoxy) ethyl butyrate, tert-butyl peroxyisobutyrate.

聚合引發劑的添加量相對於單體合計100質量%優選為0.001~0.2質量%,更優選為0.001~0.05質量%。當聚合引發劑的添加量過多時,則色相劣化。The addition amount of the polymerization initiator is preferably 0.0001 to 0.2% by mass, and more preferably 0.0001 to 0.05% by mass relative to 100% by mass of the total monomers. When the addition amount of the polymerization initiator is too large, the hue deteriorates.

鏈轉移劑是脂肪族硫醇、芳香族硫醇、五苯乙烷、α-甲基苯乙烯二聚體以及萜品油烯等。Chain transfer agents are aliphatic mercaptans, aromatic mercaptans, pentaphenylethane, α-methylstyrene dimer and terpinolene.

鏈轉移劑的添加量優選相對於單體合計100質量%為0.001~0.5質量%,更優選為0.005~0.2質量%。當鏈轉移劑的添加量為0.001~0.5質量%時,熱穩定變得良好。The addition amount of the chain transfer agent is preferably 0.0001 to 0.5% by mass relative to 100% by mass of the total monomers, more preferably 0.005 to 0.2% by mass. When the addition amount of the chain transfer agent is 0.001 to 0.5% by mass, the thermal stability becomes good.

從苯乙烯系樹脂聚合結束後的溶液去除未反應的單體和適用於溶液聚合的溶劑等揮發成分的脫揮方法可以採用公知的手法,例如可以使用裝備了預熱器的真空脫揮槽或帶排氣口的脫揮擠出機。在脫揮工序中的苯乙烯系樹脂的溫度優選為200℃~300℃,更優選為220℃~260℃。當在脫揮工序中的苯乙烯系樹脂的溫度過高時,則會有色相劣化的情況。脫揮後的熔融狀態的苯乙烯系樹脂被移送到造粒工序,並用多孔模押出成股線狀,通過冷切方式、空氣中熱切方式、水中熱切方式價加工成顆粒狀。The devolatilization method for removing volatile components such as unreacted monomers and solvents suitable for solution polymerization from the solution after the polymerization of the styrene-based resin can be performed by a known method. For example, a vacuum devolatilization tank equipped with a preheater or Devolatilization extruder with vent. The temperature of the styrene-based resin in the devolatilization step is preferably 200°C to 300°C, and more preferably 220°C to 260°C. When the temperature of the styrene-based resin in the devolatilization step is too high, the hue may be deteriorated. The styrenic resin in the molten state after devolatilization is transferred to the granulation process, and extruded into strands with a porous mold, and processed into pellets by cold cutting, air cutting, and water cutting.

優選在脫揮工序中被除去的未反應的單體以及使用在溶液聚合中的溶劑被回收,並在精製去除聚合抑制劑等不純物後,作為回收原料與新鮮的原料混合使用。通過將回收原料與不含有聚合抑制劑的新鮮原料混合使用,能夠減少供給到聚合工序中的原料中的聚合抑制劑的含量。被供給到聚合工序中的原料中的聚合抑制劑的含量優選為低於12ppm,更優選為低於9ppm,進一步優選為低於6ppm,最優選為低於4ppm。當供給到聚合工序中的原料中的聚合抑制劑的含量低於12ppm時,則透光率和透明性變得良好。應予說明,難以去除所有聚合抑制劑,通常會含有0.01ppm以上。為了與回收原料區別,這裡將新供給到苯乙烯-(甲基)丙烯酸酯系共聚物的製造工序的原料稱為新鮮原料。Preferably, the unreacted monomers removed in the devolatilization step and the solvent used in the solution polymerization are recovered, and after purification and removal of impurities such as polymerization inhibitors, they are mixed and used as recovered raw materials with fresh raw materials. By mixing recycled raw materials with fresh raw materials that do not contain polymerization inhibitors, the content of polymerization inhibitors in the raw materials supplied to the polymerization step can be reduced. The content of the polymerization inhibitor in the raw material supplied to the polymerization step is preferably less than 12 ppm, more preferably less than 9 ppm, still more preferably less than 6 ppm, and most preferably less than 4 ppm. When the content of the polymerization inhibitor in the raw material supplied to the polymerization step is less than 12 ppm, the light transmittance and transparency become good. It should be noted that it is difficult to remove all polymerization inhibitors and usually contains more than 0.01 ppm. In order to distinguish it from recycled raw materials, the raw materials newly supplied to the production process of the styrene-(meth)acrylate copolymer are referred to as fresh raw materials here.

在脫揮工序中除去未反應的單體以及使用在溶液聚合中的溶劑的回收以及精製方法可以採用公知的方法,例如可以是將脫揮工序中去除的未反應的單體以及溶劑氣體通過冷凝機壓縮液化,並利用閃蒸塔精製分離出高沸點的成分的方法。此外,也可以是先從在脫揮工序中除去的未反應的單體以及溶劑氣體中先用冷凝器或噴霧塔只將高沸點成分凝縮分離,再將殘餘的氣體用冷凝器整體凝縮的方法。聚合抑制劑的4-叔丁基苯二酚的沸點為285℃,6-叔丁基-2,4-二甲苯酚的沸點為249℃,從而能夠從作為高沸點成分的單體以及溶劑中分離去除(苯乙烯的沸點為145℃、(甲基)丙烯酸甲酯的沸點為101℃、乙苯的沸點為136℃)。The removal of unreacted monomers in the devolatilization step and the recovery and purification of the solvent used in the solution polymerization can be performed by known methods. For example, the unreacted monomers and solvent gases removed in the devolatilization step can be condensed. It is a method of compressing and liquefying by machine and using a flash tower to refine and separate high-boiling components. In addition, it is also possible to first condense and separate only the high boiling point components from the unreacted monomer and solvent gas removed in the devolatilization step with a condenser or spray tower, and then condense the remaining gas as a whole with a condenser . The boiling point of 4-tert-butyl diphenol, which is a polymerization inhibitor, is 285°C, and the boiling point of 6-tert-butyl-2,4-xylenol is 249°C, so it can be extracted from monomers and solvents that are high boiling point components. Separate and remove (the boiling point of styrene is 145°C, the boiling point of methyl (meth)acrylate is 101°C, and the boiling point of ethylbenzene is 136°C).

苯乙烯系樹脂的重均分子量(Mw)優選為5萬~45萬,更優選為7萬~30萬,進一步優選為7萬~20萬。當重均分子量(Mw)低於5萬時,則導光板的強度可能降低。當重均分子量(Mw)超過20萬時,則流動性減低,成型加工性變差。重均分子量(Mw)可以根據聚合工序的反應溫度、滯留時間、聚合引發劑的種類以及添加量、鏈轉移劑的種類以及添加量、以及在聚合時使用的溶劑的種類和量來進行控制。The weight average molecular weight (Mw) of the styrene resin is preferably 50,000 to 450,000, more preferably 70,000 to 300,000, and still more preferably 70,000 to 200,000. When the weight average molecular weight (Mw) is less than 50,000, the strength of the light guide plate may decrease. When the weight average molecular weight (Mw) exceeds 200,000, the fluidity decreases and the molding processability deteriorates. The weight average molecular weight (Mw) can be controlled according to the reaction temperature, residence time, type and amount of polymerization initiator in the polymerization process, type and amount of chain transfer agent, and type and amount of solvent used during polymerization.

重均分子量(Mw)可以在以下條件下使用凝膠滲透色譜法(GPC)測定。 GPC型號:昭和電工株式會社製造的Shodex GPC-101 柱:Polymer Laboratories製造的 PLgel 10μm MIXED-B 流動相:四氫呋喃 試樣濃度:0.2質量% 溫度:烘箱40℃、注入口35℃、檢測器35℃ 檢測器:示差折光儀 本發明的分子量是通過從單分散聚苯乙烯的洗脫曲線算出各洗脫時間的分子量計算得出的,其以聚苯乙烯換算的分子量計算得出。The weight average molecular weight (Mw) can be measured using gel permeation chromatography (GPC) under the following conditions. GPC model: Shodex from Showa Denko Co., Ltd. GPC-01 Column: "PLGel" 10μm" MIXED-B made by Polymer" Labatories Mobile phase: Tetrahydrofuran Sample concentration: 0.2% by mass Temperature: oven 40℃, injection port 35℃, detector 35℃ Detector: Differential Refractometer The molecular weight of the present invention is calculated by calculating the molecular weight at each elution time from the elution curve of monodisperse polystyrene, which is calculated by the molecular weight in terms of polystyrene.

苯乙烯系樹脂的殘留單體以及聚合溶劑的總量優選為0.5質量%以下,更優選為0.2質量%。當殘留單體以及聚合溶劑的總量超過0.5質量%時,則耐熱性不足。The total amount of the residual monomers of the styrene resin and the polymerization solvent is preferably 0.5% by mass or less, and more preferably 0.2% by mass. When the total amount of residual monomers and polymerization solvent exceeds 0.5% by mass, heat resistance is insufficient.

殘留單體和聚合溶劑是殘留在苯乙烯系樹脂中的單體和聚合溶劑的量,其是苯乙烯、(甲基)丙烯酸甲酯、乙苯等。殘留單體以及聚合溶劑的量可以用脫揮工序的構成或脫揮工序的條件來調整。Residual monomer and polymerization solvent are the amounts of monomer and polymerization solvent remaining in the styrene-based resin, which are styrene, methyl (meth)acrylate, ethylbenzene, and the like. The amount of the residual monomer and the polymerization solvent can be adjusted by the configuration of the devolatilization step or the conditions of the devolatilization step.

殘留單體和聚合溶劑的量通過精確稱量苯乙烯系樹脂0.2g,並將其溶解在作為內標物質的包含對二乙苯的四氫呋喃10mL中後,利用毛細管氣相色譜儀在以下條件測定。 毛細管氣相色譜儀:GC-4000(GL Sciences Inc.製造) 柱:GL Sciences Inc.製造的InertCap WAX、內徑為0.25mm、長度為 30m、膜厚為 50μm 注射溫度:180℃ 柱溫度:60℃~170℃ 探測器溫度:210℃ 分流比:5/1The amount of residual monomer and polymerization solvent was accurately weighed 0.2g of styrene-based resin, and dissolved in 10mL of tetrahydrofuran containing p-diethylbenzene as an internal standard substance, and then used capillary gas chromatograph under the following conditions Determination. Capillary gas chromatograph: GC-4000 (manufactured by GL "Sciences" Inc.) Column: GL   Sciences   Inc. The manufactured InertCap "WAX, the inner diameter is 0.25mm, the length is "30m, and the film thickness is "50μm Injection temperature: 180℃ Column temperature: 60℃~170℃ Detector temperature: 210℃ Split ratio: 5/1

苯乙烯系樹脂的苯乙烯系單體以及(甲基)丙烯酸酯系單體的二聚體或三聚體(以下稱為低聚物) 總量優選為2質量%以下,更優選為1質量%以下。若低聚物的總量超過1質量%,則作為導光板的耐熱性不足。Dimers or trimers of styrene-based monomers and (meth)acrylate-based monomers (hereinafter referred to as oligomers) of styrene resin %the following. If the total amount of oligomers exceeds 1% by mass, the heat resistance as a light guide plate is insufficient.

低聚物的測定是通過將苯乙烯系樹脂200mg溶解在2mL的1,2-二氯甲烷中,並加入2mL甲醇使共聚物析出靜置後,用氣相色譜儀在以下條件下測定上清液得到的。 氣相色譜儀:HP-5890(惠普公司製造) 柱:DB-1(ht) 0.25mm×30m 膜厚0.1μm 注射溫度:250℃ 柱溫度:100-300℃ 檢測器溫度:300℃ 分流比:50/1 內標物質:正二十烷 載氣:氮氣The oligomer is measured by dissolving 200 mg of styrene-based resin in 2 mL of 1,2-dichloromethane, adding 2 mL of methanol to precipitate the copolymer and letting it stand, and then measure the supernatant with a gas chromatograph under the following conditions Liquid obtained. Gas chromatograph: HP-5890 (manufactured by Hewlett-Packard Company) Column: DB-1 (ht) "0.25mm×30m" film thickness 0.1μm Injection temperature: 250℃ Column temperature: 100-300℃ Detector temperature: 300℃ Split ratio: 50/1 Internal standard substance: n-eicosane Carrier gas: nitrogen

本發明的苯乙烯系樹脂組成物優選含有受阻酚系抗氧化劑(B)。苯乙烯系樹脂組成物中所含有的受阻酚系抗氧化劑(B)是在基本骨架上具有酚羥基的抗氧化劑。受阻酚系抗氧化劑是十八烷基-3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯、亞乙基雙(氧乙烯基)雙〔3-(5-叔丁基-4-羥基間甲苯基)丙酸酯〕、3,9-雙[2-〔3-(3-叔丁基-4-羥基-5-甲基苯基)丙醯氧基〕-1,1-二甲基乙基]-2,4,8,10-四氧雜螺[5.5]十一烷、季戊四醇四[3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯]、4,6-雙(辛基硫代甲基)-鄰甲酚、4,6-雙〔(十二烷基硫基)甲基〕-鄰甲酚、2,4-二甲基-6-(1-甲基十五烷基)苯酚、四〔亞甲基-3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯〕甲烷、4,4’-硫代雙(6-叔丁基-3-甲基苯酚)、1,1,3-三(2-甲基-4-羥基-5-叔丁基苯基)丁烷、4,4’-亞丁基雙(3-甲基-6-叔丁基苯酚)、雙-[3,3-雙-(4’-羥基-3’-叔丁基苯酚)-丁酸]-乙二醇酯、2-叔丁基-6-(3-叔丁基-2-羥基-5-甲基苄基)-4-甲基苯基丙烯酸酯、2-〔1-(2-羥基-3,5-二-叔丁基苯基)乙基〕-4,6-二-叔戊基苯基丙烯酸酯等。受阻酚系抗氧化劑可以單獨使用也可以將2種以上組合使用。The styrene-based resin composition of the present invention preferably contains a hindered phenol-based antioxidant (B). The hindered phenolic antioxidant (B) contained in the styrene resin composition is an antioxidant having a phenolic hydroxyl group in the basic skeleton. The hindered phenol antioxidants are octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, ethylene bis(oxyethylene) bis[3-(5- Tert-butyl-4-hydroxy-m-tolyl)propionate], 3,9-bis[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy] -1,1-Dimethylethyl]-2,4,8,10-Tetraoxaspiro[5.5]Undecane, pentaerythritol tetra[3-(3,5-di-tert-butyl-4) -Hydroxyphenyl) propionate], 4,6-bis(octylthiomethyl)-o-cresol, 4,6-bis[(dodecylthio)methyl]-o-cresol, 2,4-Dimethyl-6-(1-methylpentadecyl)phenol, tetrakis[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate ]Methane, 4,4'-thiobis(6-tert-butyl-3-methylphenol), 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl) Butane, 4,4'-butylene bis(3-methyl-6-tert-butylphenol), bis-[3,3-bis-(4'-hydroxy-3'-tert-butylphenol)-butane Acid]-ethylene glycol ester, 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-( 2-hydroxy-3,5-di-tert-butylphenyl) ethyl]-4,6-di-tert-amyl phenyl acrylate, etc. The hindered phenol antioxidants can be used alone or in combination of two or more.

受阻酚系抗氧化劑(B)的含量優選相對於苯乙烯系樹脂(A)100質量份為0.001~0.3質量份,更優選為0.03~0.09質量份。通過將受阻酚系抗氧化劑(B)的含量調整在該範圍,可以得到色相優異的苯乙烯系樹脂組成物。The content of the hindered phenol-based antioxidant (B) is preferably 0.0001 to 0.3 parts by mass relative to 100 parts by mass of the styrene resin (A), more preferably 0.03 to 0.09 parts by mass. By adjusting the content of the hindered phenol-based antioxidant (B) within this range, a styrene-based resin composition having an excellent hue can be obtained.

本發明的苯乙烯系樹脂組成物優選含有具有酚系羥基的磷系抗氧化劑(C1)。苯乙烯系樹脂組成物中所含有的磷系抗氧化劑(C1)是在基本骨架上具有酚系羥基的三價的磷化合物。磷系抗氧化劑(C1)與其他磷系抗氧化劑相比具有容易水解的性質,因此得到的苯乙烯系樹脂組成物的色相改善效果高。磷系抗氧化劑(C1)是6-[3-(3-叔丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四-叔丁基二苯並[d,f][1,3,2]二氧磷雜七環等。The styrene resin composition of the present invention preferably contains a phosphorus antioxidant (C1) having a phenolic hydroxyl group. The phosphorus antioxidant (C1) contained in the styrene resin composition is a trivalent phosphorus compound having a phenolic hydroxyl group in the basic skeleton. Phosphorus antioxidant (C1) has the property of being easily hydrolyzed compared with other phosphorus antioxidants, so the obtained styrene resin composition has a high hue improvement effect. Phosphorus antioxidant (C1) is 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyl two Benzo [d, f] [1, 3, 2] dioxaphosphorane etc.

磷系抗氧化劑(C1)的含量優選相對於苯乙烯系樹脂(A)100質量份為0.001~0.3質量份,更優選為0.03~0.09質量份,進一步優選為0.05~0.08質量份。通過將磷系抗氧化劑(C1)的含量調整為該範圍,則可以得到色相優異的苯乙烯系樹脂組成物。The content of the phosphorus antioxidant (C1) is preferably 0.0001 to 0.3 parts by mass relative to 100 parts by mass of the styrene resin (A), more preferably 0.03 to 0.09 parts by mass, and still more preferably 0. .05~0.08 parts by mass. By adjusting the content of the phosphorus antioxidant (C1) within this range, a styrene resin composition with excellent hue can be obtained.

本發明的苯乙烯系樹脂組成物優選含有具有酚系羥基的磷系抗氧化劑(C1)以外的磷系抗氧化劑(C2)。苯乙烯系樹脂組成物中所含有的磷系抗氧化劑(C2)是在基本骨架上沒有酚系羥基的三價的磷化合物。磷系抗氧化劑(C2)與磷系抗氧化劑(C1)相比更難以水解,但可以長時間保持改善苯乙烯系樹脂組成物色相效果。也就是說,特別有助於耐濕熱性。磷系抗氧化劑(C2)是3,9-雙(2,6-二-叔丁基-4-甲基苯氧基)-2,4,8,10-四惡唑-3,9-二磷雜螺〔5.5〕十一烷、雙(2,4-二枯基苯基)季戊四醇二亞磷酸酯、2,2’-亞甲基雙(4,6-二-叔丁基苯基)2-乙基己基亞磷酸酯、三(2,4-二-叔丁基苯基)亞磷酸酯、亞磷酸雙〔2,4-雙(1,1-二甲基乙基)-6-甲基苯基〕乙酯、雙(2,4-二-叔丁基苯基)季戊四醇二亞磷酸酯、環新戊烷四基雙(十八烷基亞磷酸酯)、雙(壬基苯基)季戊四醇二亞磷酸酯、4,4’-聯苯二亞磷酸四(2,4-二-叔丁基苯酯)、9,10-二氫-9-氧雜-10-磷菲-10-氧化物、四(2,4-二-叔丁基-5-甲基苯基)-4,4’-聯苯二亞膦酸酯等,從持續改善色相效果的觀點來看,優選使用2,2’-亞甲基雙(4,6-二-叔丁基苯基)2-亞磷酸酯、三(2,4-二-叔丁基苯基)亞磷酸酯。磷系抗氧化劑(C2)可以單獨使用也可以將2種以上組合使用。The styrene resin composition of the present invention preferably contains a phosphorus antioxidant (C2) other than the phosphorus antioxidant (C1) having a phenolic hydroxyl group. The phosphorus antioxidant (C2) contained in the styrene resin composition is a trivalent phosphorus compound without a phenolic hydroxyl group in the basic skeleton. Phosphorus antioxidant (C2) is more difficult to hydrolyze than phosphorus antioxidant (C1), but it can maintain the effect of improving the color of the styrene resin composition for a long time. In other words, it contributes particularly to heat and humidity resistance. Phosphorus antioxidant (C2) is 3,9-bis(2,6-di-tert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxazole-3,9-bis Phosaspiro[5.5]undecane, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-tert-butylbenzene) Base) 2-ethylhexyl phosphite, tris(2,4-di-tert-butylphenyl) phosphite, bis[2,4-bis(1,1-dimethylethyl)- 6-methylphenyl] ethyl ester, bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, cycloneopentane tetrayl bis(octadecyl phosphite), bis(nonane) (Phenyl) pentaerythritol diphosphite, 4,4'-biphenyl diphosphite tetrakis (2,4-di-tert-butyl phenyl ester), 9,10-dihydro-9-oxa-10-phosphorus Phenanthrene-10-oxide, tetrakis(2,4-di-tert-butyl-5-methylphenyl)-4,4'-biphenyl diphosphonite, etc., from the viewpoint of continuous improvement of hue effect Preferably, 2,2'-methylene bis(4,6-di-tert-butylphenyl) 2-phosphite and tris(2,4-di-tert-butylphenyl) phosphite are used. Phosphorus antioxidants (C2) can be used alone or in combination of two or more.

磷系抗氧化劑(C2)的含量優選相對於苯乙烯系樹脂(A)100質量份為0.001~0.3質量份,更優選為0.03~0.09質量份,進一步優選為0.05~0.08質量份。通過將磷系抗氧化劑(C2)的含量調整為該範圍,則可以從初期到長期均具有優異的色相的苯乙烯系樹脂組成物。The content of the phosphorus antioxidant (C2) is preferably 0.0001 to 0.3 parts by mass relative to 100 parts by mass of the styrene resin (A), more preferably 0.03 to 0.09 parts by mass, and still more preferably 0. .05~0.08 parts by mass. By adjusting the content of the phosphorus antioxidant (C2) within this range, a styrene resin composition having an excellent hue from the initial stage to the long term can be obtained.

磷系抗氧化劑(C1)與磷系抗氧化劑(C2)的混合比例優選其質量比為3:1~1:3的範圍,更優選為2:1~1:2。通過調整成該範圍,得到的苯乙烯系樹脂組成物的色相與耐久性的平衡變好。The mixing ratio of the phosphorus antioxidant (C1) and the phosphorus antioxidant (C2) is preferably in the range of 3:1 to 1:3, and more preferably 2:1 to 1:2. By adjusting to this range, the balance between the hue and durability of the obtained styrene-based resin composition becomes better.

製造苯乙烯系樹脂組成物的方法可以採用公知的方法。在苯乙烯系樹脂的聚合工序、脫揮工序、造粒工序等製造工序中添加受阻酚系抗氧化劑(B)、磷系抗氧化劑(C1)、以及磷系抗氧化劑(C2),優選在脫揮工序中去除未反應的單體和溶劑後添加。在使用真空脫揮槽時,向從脫揮槽中提取的苯乙烯系樹脂中添加熔融狀態的受阻酚系抗氧化劑(B)、磷系抗氧化劑(C1)和磷系抗氧化劑(C2),並利用靜態混合器混合,在利用帶排氣口的脫揮擠出機時,向排氣口後方添加受阻酚系抗氧化劑(B)、磷系抗氧化劑(C1)和磷系抗氧化劑(C2)並使之混合。使用擠出機,可以向造粒後的苯乙烯系樹脂(A)中熔融混合受阻酚系抗氧化劑(B)、磷系抗氧化劑(C)和磷系抗氧化劑(C2)。A known method can be adopted for the method of manufacturing the styrene resin composition. Hindered phenol antioxidants (B), phosphorus antioxidants (C1), and phosphorus antioxidants (C2) are added to the production processes such as the polymerization process, devolatilization process, and granulation process of the styrene resin. In the volatilization step, unreacted monomer and solvent are removed and then added. When using a vacuum devolatilizer, add molten hindered phenol antioxidant (B), phosphorus antioxidant (C1) and phosphorus antioxidant (C2) to the styrene resin extracted from the devolatilizer. And use a static mixer to mix, when using a devolatilization extruder with a vent, add hindered phenol antioxidant (B), phosphorus antioxidant (C1) and phosphorus antioxidant (C2) behind the vent ) And make it mixed. Using an extruder, it is possible to melt-mix hindered phenol-based antioxidants (B), phosphorus-based antioxidants (C) and phosphorus-based antioxidants (C2) into the pelletized styrene-based resin (A).

在不損害透明性的範圍內,也可以在苯乙烯系樹脂組成物中添加礦物油。此外,還可以添加硬脂酸、乙烯雙硬質醯胺等內部潤滑劑;硫基系抗氧化劑、內酯基系抗氧化劑、紫外線吸收劑、受阻胺基系穩定劑、抗靜電劑、以及乙烯雙硬酯醯胺等外部潤滑劑。As long as the transparency is not impaired, mineral oil may be added to the styrene resin composition. In addition, internal lubricants such as stearic acid and ethylene bis-hard amide can be added; sulfur-based antioxidants, lactone-based antioxidants, ultraviolet absorbers, hindered amine-based stabilizers, antistatic agents, and ethylene double External lubricants such as stearylamine.

紫外線吸收劑是具有抑制因紫外線造成的劣化或著色功能的添加劑,其是二苯甲酮系、苯並三唑系、三嗪系、苯甲酸酯系、水楊酸酯系、氰基丙烯酸酯系、丙二酸酯系、甲脒系等紫外線吸收劑。它們可以單獨使用也可以將2種以上組合使用,並且還可以與受阻胺等光穩定劑並用。Ultraviolet absorbers are additives that have the function of inhibiting deterioration or coloring caused by ultraviolet rays, and are benzophenone series, benzotriazole series, triazine series, benzoate series, salicylate series, and cyanoacrylic acid Ester-based, malonate-based, and formamidine-based ultraviolet absorbers. These can be used alone or in combination of two or more, and can also be used in combination with light stabilizers such as hindered amines.

苯乙烯系樹脂的維卡軟化點優選為95℃以上,更優選為98℃以上。當維卡軟化點低於95℃時,耐熱性不足,根據使用環境成型品可能會變形。(維卡軟化溫度根據JIS K 7206以升溫速度為50℃/hr、試驗負荷為50N進行試驗。)The Vicat softening point of the styrene resin is preferably 95°C or higher, and more preferably 98°C or higher. When the Vicat softening point is lower than 95°C, the heat resistance is insufficient, and the molded product may be deformed depending on the use environment. (The Vicat softening temperature is tested according to JIS "K" 7206 with a heating rate of 50°C/hr and a test load of 50N.)

苯乙烯系樹脂組成物可以通過利用擠出成型、注射成型、壓縮成型、吹塑成型等公知的方法製作板狀的成型品,並加工成導光板等來使用。The styrene-based resin composition can be used by producing a plate-shaped molded product by a known method such as extrusion molding, injection molding, compression molding, and blow molding, and processing it into a light guide plate.

本發明的苯乙烯系樹脂組成物的熱穩定性優異,因此可以將非產品零件,如擠出成型時的片屑、注射成型時的線軸以及流道收集並將其粉碎,然後與原始材料混合使用。The styrene-based resin composition of the present invention has excellent thermal stability, so non-product parts such as chips during extrusion molding, bobbins and runners during injection molding can be collected and crushed, and then mixed with original materials use.

導光板通過在板狀成型品的一側面上形成反射圖案將從板狀成型品端面入射的光引導至板狀成型品的表面側並使之具有發光性能的部件。反射圖案可以通過絲網印刷法、鐳射加工法、以及噴墨法等方法形成。此外,還可以在與形成反射圖案的面相反的面(發光面)設置棱鏡圖案等。板狀成型品的反射圖案和棱鏡圖案可以在板狀成型品成型時形成,可以在注射成型時由模具形狀,在擠出成型由輥轉印等方式形成。The light guide plate is a member that guides the light incident from the end surface of the plate-shaped molded product to the surface side of the plate-shaped molded product by forming a reflective pattern on one side surface of the plate-shaped molded product and makes it have light-emitting performance. The reflective pattern can be formed by methods such as screen printing, laser processing, and inkjet. In addition, a prism pattern or the like may be provided on the surface (light emitting surface) opposite to the surface on which the reflection pattern is formed. The reflection pattern and prism pattern of the plate-shaped molded product can be formed when the plate-shaped molded product is molded, can be formed by a mold shape during injection molding, or formed by roll transfer during extrusion molding.

苯乙烯系樹脂組成物的初期的在光路長115mm下測定的YI值優選為2.5以下,更優選為2.0以下。這裡所謂的“初期”指的是在80℃、90%濕度的空氣氣氛下進行500小時濕熱處理之前的狀態。測定是通過測定在光路長115mm下波長為350nm~800nm處的光譜透光率,並且是在C光源2°的視野內的YI值根據JIS K7105計算得出的值。當用光路長115mm測定的YI值高於2.5時,顏色隨光路長變化,所以當作為背光使用時,可能會在液晶顯示裝置的面發生顏色不均勻。此外,優選在光路長115mm下測定的波長為350nm~800nm的光譜透光率的平均值為87%以上,更優選88%以上,進一步優選89%以上。 [實施例]The YI value measured at an optical path length of 115 mm at the initial stage of the styrene-based resin composition is preferably 2.5 or less, and more preferably 2.0 or less. The so-called "initial stage" here refers to the state before the wet heat treatment is performed for 500 hours in an air atmosphere of 80°C and 90% humidity. The measurement is performed by measuring the spectral transmittance at the wavelength of 350nm~800nm under the light path length of 115mm, and the YI value in the 2° field of view of the C light source is calculated according to JIS   K7105. When the YI value measured with the optical path length of 115mm is higher than 2.5, the color changes with the optical path length, so when used as a backlight, color unevenness may occur on the surface of the liquid crystal display device. In addition, it is preferable that the average value of the spectral transmittance at a wavelength of 350 nm to 800 nm measured at an optical path length of 115 mm is 87% or more, more preferably 88% or more, and still more preferably 89% or more. [Example]

以下,列舉實施例具體說明本發明,但本發明不限定於這些實施例。Hereinafter, the present invention will be specifically explained with examples, but the present invention is not limited to these examples.

<苯乙烯系樹脂A-1的製造例> 苯乙烯系樹脂通過及自由基法並利用連續式溶液聚合製造。將完全混合槽型攪拌槽用作第1反應器,將裝配了靜態混合器的活塞流型反應器用作第2反應器,並將其串聯構成聚合工序。第1反應器的容量為30L,第2反應器的容量為12L。作為苯乙烯系單體,在準備工業上使用的苯乙烯(以下稱為新鮮Sty)時,4-叔丁基鄰苯二酚(以下稱為TBC)的濃度是10.2ppm。作為(甲基)丙烯酸酯系單體,在準備工業上使用的(甲基)丙烯酸甲酯(以下稱為新鮮MMA)時,6-叔丁基-2,4-二甲苯酚(以下稱為TBX)的濃度是4.9ppm。作為聚合溶劑,準備工業上使用的乙苯(以下稱為新鮮EB)。此外,從稍後將要描述的真空脫揮槽分離出的單體和聚合溶劑等氣體通過冷凝器凝縮,並利用閃蒸塔等精製後作為回收原料使用。回收原料中的TBX和TBC的濃度低於檢測下限。使用新鮮Sty、新鮮MMA以及回收原料,並按照Sty:49質量%、MMA:41質量%、EB:10質量%的組成製備原料溶液,並以8.0kg/h的流量供給到聚合工序。原料溶液中的回收原料的使用比例為33質量%。此外,將原料溶液連續地向原料溶液供給線添加,以使作為聚合引發劑的叔丁基過氧異丙基單碳酸酯的濃度為150ppm,作為鏈轉移劑的正十二烷基硫醇的濃度為500ppm的。調整第1反應器的溫度為135℃,在第2反應器中沿流動方向形成溫度梯度,並將中間部分調整成130℃,出口部分調整成145℃。在聚合工序出口處的聚合物濃度為65%,苯乙烯與(甲基)丙烯酸甲酯的轉化率為72%。從反應器連續提取的聚合物溶液被供給到裝備了預熱器的真空脫揮槽,分離未反應的苯乙烯、(甲基)丙烯酸甲酯、以及乙苯等。調整預熱器溫度以使脫揮槽內的聚合物溫度為240℃,脫揮槽內的壓力為1kPa。通過齒輪泵從真空脫揮槽提取聚合物,擠成股線狀並用冷卻水冷卻後,切斷得到顆粒狀的苯乙烯系樹脂A-1。A-1的組成是Sty:50質量%、MMA:50質量%。此外,A-1的重均分子量為14.5萬,殘留單體和聚合溶劑的總量是0.07質量%,殘留低聚物的總量是0.35質量%。<Production example of styrene resin A-1> Styrenic resins are produced by continuous solution polymerization and the free radical method. A complete mixing tank type stirring tank is used as the first reactor, and a plug flow type reactor equipped with a static mixer is used as the second reactor, which are connected in series to form the polymerization process. The capacity of the first reactor is 30L, and the capacity of the second reactor is 12L. As a styrene-based monomer, when preparing styrene for industrial use (hereinafter referred to as fresh Sty), the concentration of 4-tert-butylcatechol (hereinafter referred to as TBC) is 10.2 ppm. As a (meth)acrylate-based monomer, when preparing methyl (meth)acrylate for industrial use (hereinafter referred to as fresh MMA), 6-tert-butyl-2,4-xylenol (hereinafter referred to as The concentration of TBX) is 4.9 ppm. As a polymerization solvent, ethylbenzene (hereinafter referred to as fresh EB) used in industry is prepared. In addition, gases such as monomers and polymerization solvents separated from a vacuum devolatilization tank to be described later are condensed by a condenser and purified by a flash tower or the like to be used as recycled raw materials. The concentration of TBX and TBC in the recycled raw materials is lower than the detection limit. Using fresh Sty, fresh MMA, and recycled raw materials, a raw material solution was prepared in accordance with the composition of Sty: 49% by mass, MMA: 41% by mass, and EB: 10% by mass, and was supplied to the polymerization process at a flow rate of 8.0 kg/h. The use ratio of recycled raw materials in the raw material solution is 33% by mass. In addition, the raw material solution was continuously added to the raw material solution supply line so that the concentration of tert-butylperoxyisopropyl monocarbonate as the polymerization initiator was 150 ppm, and the concentration of n-dodecyl mercaptan as the chain transfer agent The concentration is 500 ppm. Adjust the temperature of the first reactor to 135°C, form a temperature gradient along the flow direction in the second reactor, and adjust the middle part to 130°C and the outlet part to 145°C. The polymer concentration at the exit of the polymerization process is 65%, and the conversion rate of styrene to methyl (meth)acrylate is 72%. The polymer solution continuously extracted from the reactor is supplied to a vacuum devolatilizer equipped with a preheater, and unreacted styrene, methyl (meth)acrylate, ethylbenzene, etc. are separated. Adjust the temperature of the preheater so that the polymer temperature in the devolatilization tank is 240°C and the pressure in the devolatilization tank is 1kPa. The polymer was extracted from the vacuum devolatilization tank by a gear pump, extruded into strands, cooled with cooling water, and cut to obtain pelletized styrene resin A-1. The composition of A-1 is Style: 50% by mass and MMA: 50% by mass. In addition, the weight average molecular weight of A-1 is 145,000, the total amount of residual monomers and polymerization solvent is 0.07% by mass, and the total amount of residual oligomers is 0.35% by mass.

<苯乙烯系樹脂A-2的製造例> 將原料組成變更為Sty:77質量%、MMA:13質量%、EB:10質量%,停止添加正十二烷基硫醇,並將第1反應器的溫度設定成140℃,第2反應器的中間部分的溫度設定成140℃,出口部分的溫度設定成160℃以外,以與A-1相同的方式實施。在原料溶液中的回收原料的使用比例為33質量%。A-2的組成為Sty:82質量%、MMA:18質量%。此外,A-2的重均分子量為24萬,殘留單體和聚合溶劑的總量為0.06質量%,殘留低聚物的總量為0.33質量%。<Production example of styrene resin A-2> The composition of the raw materials was changed to Type: 77% by mass, MMA: 13% by mass, and EB: 10% by mass, the addition of n-dodecyl mercaptan was stopped, and the temperature of the first reactor was set to 140°C, and the second reactor The temperature of the middle part of the A-1 is set to 140°C, and the temperature of the outlet part is set to 160°C, which is implemented in the same manner as A-1. The use ratio of recycled raw materials in the raw material solution is 33% by mass. The composition of A-2 is Style: 82% by mass and MMA: 18% by mass. In addition, the weight average molecular weight of A-2 was 240,000, the total amount of residual monomers and polymerization solvent was 0.06% by mass, and the total amount of residual oligomers was 0.33% by mass.

<苯乙烯系樹脂A-3的製造例> 將原料組成變更為Sty:8質量%、MMA:79質量%、EB:13質量%,並將進料流量設定為5.7kg/h,過氧異丙基一碳酸叔丁基酯的濃度設定為100ppm,正十二烷基硫醇的濃度設定為3000ppm,第1反應器的溫度設定為122℃,第2反應器的中間部分的溫度設定為140℃,出口部分的溫度設定為150℃以外,以與A-1同樣的方式實施。在原料溶液中回收原料的使用比例為34質量%。A-3的組成為Sty:10質量%、MMA:90質量%。此外,A-3的重均分子量為8萬,殘留單體和聚合溶劑的總量為0.06質量%,殘留低聚物的總量為0.34質量%。<Production example of styrene resin A-3> The composition of the raw materials was changed to Type: 8% by mass, MMA: 79% by mass, and EB: 13% by mass, and the feed flow rate was set to 5.7 kg/h, and the concentration of peroxyisopropyl tert-butyl monocarbonate was set The concentration of n-dodecyl mercaptan is set to 3,000 ppm, the temperature of the first reactor is set to 122°C, the temperature of the middle part of the second reactor is set to 140°C, and the temperature of the outlet part is set to other than 150°C , Implement in the same way as A-1. The use ratio of recycled raw materials in the raw material solution is 34% by mass. The composition of A-3 is System: 10% by mass and MMA: 90% by mass. In addition, the weight average molecular weight of A-3 is 80,000, the total amount of residual monomers and polymerization solvent is 0.06% by mass, and the total amount of residual oligomers is 0.34% by mass.

<實施例1~10・比較例1・參考例1~2> 在製造例中得到的苯乙烯系樹脂A-1~A-3按照表1所示含量緩和如下所示的受阻酚系抗氧化劑(B)、磷系抗氧化劑(C1)以及磷系抗氧化劑(C2-1)、(C2-2),並利用LEADER公司製造的片擠出機熔融混煉抗氧化劑,得到450mm×500mm×2mm的片狀成型品。片擠出機是由50mmφ單軸擠出機、T型模、3根鏡面輥構成的,在單軸擠出機的筒溫度為225℃、螺杆旋轉數為120rpm的條件下進行片擠出。T型模的寬度為450mm,開口為3mm。 (B)十八烷基-3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯 (BASF日本公司製造的Irganox 1076) (C1)6-[3-(3-叔丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四-叔丁基二苯並[d,f][1,3,2]二氧磷雜七環(住友化學株式會社製造的Sumilizer GP) (C2-1)2,2‘-亞甲基雙(4,6-二-叔丁基苯基)2-乙基己基亞磷酸酯(株式會社ADEKA製造的Adekastab HP-10) (C2-2)(2,4-二-叔丁基苯基)亞磷酸酯(BASF日本公司製造的 Irgafos 168)<Examples 1 to 10, Comparative Example 1, Reference Examples 1 to 2> The styrene-based resins A-1 to A-3 obtained in the production example were reduced in content as shown in Table 1. The hindered phenol-based antioxidant (B), phosphorus-based antioxidant (C1), and phosphorus-based antioxidant ( C2-1), (C2-2), and use a sheet extruder manufactured by LEADER to melt and knead antioxidants to obtain a sheet-like molded product of 450mm×500mm×2mm. The sheet extruder is composed of a 50mmφ single-screw extruder, a T-die, and 3 mirror rollers. The sheet extruder is carried out under the condition that the barrel temperature of the single-screw extruder is 225℃ and the number of screw rotations is 120 rpm. The width of the T-die is 450mm and the opening is 3mm. (B) Octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate" (Irganox 1076 manufactured by BASF Japan) (C1) 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d, f] [1, 3, 2] Dioxaphos heptacyclic (Sumilizer GP manufactured by Sumitomo Chemical Co., Ltd.) (C2-1) 2,2'-methylenebis(4,6-di-tert-butylphenyl) 2-ethylhexyl phosphite (Adekastab, HP-10 manufactured by ADEKA Co., Ltd.) (C2-2) (2,4-Di-tert-butylphenyl) phosphite ("Irgafos" 168 manufactured by BASF Japan)

(氧化誘導時間) 從製得的片狀成型品切出30mm×30mm×2mm厚的試驗片,並利用東北電子產業公司製造的化學發光分析儀CLA-FS4,在200℃、氧氣流量100mL/分鐘的條件下測定發光量,並根據測定時間與發光量的關係,用如圖1所示的方法求得氧化誘導時間。剛擠出的片狀成型品的氧化誘導時間(t1)和在80℃、90%濕度的空氣氣氛下濕熱處理500小時後的片狀成型品的氧化誘導時間(t2)的測定結果如表1所示。應予說明,參考例1和參考例2在開始測定後立即出現發光量持續增加的情況,因此無法測量氧化誘導時間。(Oxidation induction time) A 30mm×30mm×2mm thick test piece was cut out of the obtained sheet-like molded product, and the luminescence was measured using a chemiluminescence analyzer CLA-FS4 manufactured by Tohoku Electronics Industry Co., Ltd. at 200°C and an oxygen flow rate of 100 mL/min. According to the relationship between the measurement time and the amount of luminescence, use the method shown in Figure 1 to obtain the oxidation induction time. The oxidation induction time (t1) of the sheet-shaped molded product just extruded and the oxidation induction time (t2) of the sheet-shaped molded product after being heat-treated for 500 hours in an air atmosphere at 80°C and 90% humidity are shown in Table 1. Shown. It should be noted that the amount of luminescence continued to increase immediately after the start of the measurement in Reference Example 1 and Reference Example 2, so the oxidation induction time cannot be measured.

(在光路長115mm下的光學特性) 從製得的片狀成型品切出115mm×85mm×2mm厚的試驗片,對端面進行拋光,製成在端面具有鏡面的板狀成型品。使用日本分光株式會社製造的紫外可見分光光度計V-670,拋光後的板狀成型品用大小為20×1.6mm、入射光擴散角度為0°,且在光路長115mm下波長為350nm~800nm的範圍下測定光譜透光率,在C光源處2°視野的範圍內根據JIS K7373計算YI值。表1中所示的透光率表示的是波長在380nm~780nm的平均透光率。對剛擠出的片狀成型品(初期)、在80℃、90%濕度的空氣氣氛下進行了500小時濕熱處理後的片狀成型品、以及它們在80℃環境下保管1000小時後的片狀成型品的測定結果如表1所示。(Optical characteristics under the light path length of 115mm) A 115mm×85mm×2mm thick test piece was cut out from the obtained sheet-shaped molded product, and the end surface was polished to produce a plate-shaped molded product with a mirror surface on the end surface. Using the UV-Vis spectrophotometer V-670 manufactured by JASCO Corporation, the polished plate-shaped molded product has a size of 20×1.6mm, an incident light diffusion angle of 0°, and a wavelength of 350nm under the light path length of 115mm. The spectral transmittance was measured in the range of 800 nm, and the YI value was calculated according to the JIS   K 7373 within the 2° field of view at the C light source. The light transmittance shown in Table 1 represents the average light transmittance at a wavelength between 380nm and 780nm. Sheet-shaped molded products that have just been extruded (initial stage), sheet-shaped molded products that have been heat-treated for 500 hours in an air atmosphere of 80°C and 90% humidity, and sheets that have been stored for 1,000 hours at 80°C The measurement results of shaped molded products are shown in Table 1.

(吸水性) 將製得的片狀成型品切割得到尺寸為200mm×300mm的成型品。將該成型品在溫度60℃、濕度90%的條件下保管500小時,測定保管前後的質量以及長邊的尺寸變化,作為吸水性的指標並利用如下公式計算吸水率和變形率。 (吸水率)=((保管後的質量)-(保管前的質量))÷(保管前的質量)×100(%) (變形率)=((保管後的長邊長度)-(保管前的長邊長度))÷(保管前的長邊長度)×100(%) 評價結果如表1所示。吸水率為1.0以下的情況判斷為良好,變形率為0.30以下的情況判斷為良好。(Water absorption) The obtained sheet-shaped molded product was cut to obtain a molded product with a size of 200mm×300mm. The molded product was stored for 500 hours under the conditions of a temperature of 60°C and a humidity of 90%. The mass before and after storage and the dimensional change of the long sides were measured as an index of water absorption, and the water absorption and deformation rate were calculated using the following formula. (Water absorption) = ((Quality after storage)-(Quality before storage)) ÷ (Quality before storage)×100 (%) (Deformation rate) = ((Long side length after storage)-(Long side length before storage)) ÷ (Long side length before storage)×100 (%) The evaluation results are shown in Table 1. The case where the water absorption rate is 1.0 or less is judged as good, and the case where the deformation rate is less than 0.30 is judged as good.

[表1]

Figure 02_image001
[產業上的可利用性][Table 1]
Figure 02_image001
[Industrial availability]

本發明的苯乙烯系樹脂組成物及其成型品耐濕熱性優異,色相和透明性不易劣化,因此可以適用於電視機、臺式電腦、筆記本電腦、行動電話、汽車導航系統、以及室內照明燈導光板。The styrene-based resin composition of the present invention and its molded article have excellent heat and humidity resistance, and the hue and transparency are not easily deteriorated, so it can be applied to televisions, desktop computers, notebook computers, mobile phones, car navigation systems, and indoor lighting Light guide plate.

[圖1]通過化學發光法(Chemiluminescence method)測定氧化誘導時間的方法的概念圖。[Figure 1] A conceptual diagram of a method for determining the oxidation induction time by chemiluminescence (Chemiluminencescence  method).

Claims (11)

一種苯乙烯系樹脂組成物, 設200℃的氧氣氣氛下測定的氧化誘導時間為t1, 設在80℃且90%濕度的空氣氣氛下進行了500小時濕熱處理後,在200℃的氧氣氣氛下測定的氧化誘導時間為t2,t1-t2為20分鐘以下。A styrene resin composition, Suppose the oxidation induction time measured under an oxygen atmosphere at 200°C is t1, After 500 hours of wet heat treatment is performed in an air atmosphere of 80°C and 90% humidity, the oxidation induction time measured in an oxygen atmosphere of 200°C is t2, and t1-t2 is less than 20 minutes. 根據請求項1所述的苯乙烯系樹脂組成物,其中 所述t1為50分鐘以上。The styrene resin composition according to claim 1, wherein The t1 is more than 50 minutes. 根據請求項1或2所述的苯乙烯系樹脂組成物, 含有受阻酚系抗氧化劑(B)和不具有酚系羥基的磷系抗氧化劑(C2)。According to the styrene resin composition described in claim 1 or 2, Contains hindered phenolic antioxidant (B) and phosphorus antioxidant (C2) without phenolic hydroxyl. 根據請求項1或2所述的苯乙烯系樹脂組成物, 含有具有苯乙烯系單體單元和(甲基)丙烯酸酯系單體單元的苯乙烯系樹脂(A)。According to the styrene resin composition described in claim 1 or 2, Contains styrene resin (A) having styrene monomer units and (meth)acrylate monomer units. 根據請求項1或2所述的苯乙烯系樹脂組成物, 含有具有酚系羥基的磷系抗氧化劑(C1)。According to the styrene resin composition described in claim 1 or 2, Contains phosphorus antioxidants (C1) with phenolic hydroxyl groups. 根據請求項3所述的苯乙烯系樹脂組成物, 所述受阻酚系抗氧化劑(B)是選自十八烷基-3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯、亞乙基雙(氧乙烯基)雙〔3-(5-叔丁基-4-羥基-間甲苯基)丙酸酯〕、季戊四醇四[3-(3,5-二-叔丁基-4-羥基苯基)丙酸酯]中的至少一種化合物。According to the styrene resin composition described in claim 3, The hindered phenol-based antioxidant (B) is selected from octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate, ethylenebis(oxyethylene) Bis[3-(5-tert-butyl-4-hydroxy-m-tolyl) propionate], pentaerythritol tetra[3-(3.5-di-tert-butyl-4-hydroxyphenyl) propionate] At least one compound in. 根據請求項3所述的苯乙烯系樹脂組成物,其中 所述磷系抗氧化劑(C2)是選自2,2‘-亞甲基雙(4,6-二-叔丁基苯基)2-乙基己基亞磷酸酯、三(2,4-二-叔丁基苯基)亞磷酸酯中的至少一種化合物。The styrene resin composition according to claim 3, wherein The phosphorus antioxidant (C2) is selected from 2,2'-methylene bis(4,6-di-tert-butylphenyl) 2-ethylhexyl phosphite, tris(2,4-di -At least one compound of tert-butyl phenyl) phosphite. 根據請求項5所述的苯乙烯系樹脂組成物,其中, 所述磷系抗氧化劑(C1)是6-[3-(3-叔丁基-4-羥基-5-甲基苯基)丙氧基]-2,4,8,10-四-叔丁基二苯並[d,f][1,3,2]二氧磷雜七環。The styrene resin composition according to claim 5, wherein The phosphorus antioxidant (C1) is 6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyl Base dibenzo [d, f] [1, 3, 2] dioxaphosphorane. 根據請求項1或2所述的苯乙烯系樹脂組成物, 初期的光路長115mm下的YI值為2.5以下。According to the styrene resin composition described in claim 1 or 2, The YI value under the initial light path length of 115mm is 2.5 or less. 一種成型品,使用了請求項1~9中任一項所述的苯乙烯系樹脂組成物。A molded article using the styrene resin composition described in any one of claims 1 to 9. 一種導光板,使用了請求項10所述的成型品。A light guide plate using the molded product described in claim 10.
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JP7064827B2 (en) * 2017-03-06 2022-05-11 東洋スチレン株式会社 Optical styrene resin composition, molded product and light guide
WO2019138997A1 (en) * 2018-01-09 2019-07-18 デンカ株式会社 Styrene-based resin composition, molded article, and light-guide plate

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