TW202040896A - Laser diode apparatus including a laser diode component, a lens, a first bearing member, a driver chip and a second bearing member - Google Patents

Abstract

Disclosed is a laser diode apparatus, including a laser diode component, a lens, a first bearing member, a driver chip and a second bearing member, wherein the first bearing member is configured to accommodate the laser diode component and the lens, and the second bearing member is configured to accommodate the driver chip, is configured underneath the first bearing member to hold the first bearing member, and is electrically connected to the first bearing member.

Description

Laser diode device

This application relates to a laser diode device, especially a laser diode device that reduces the signal transmission distance.

Laser diodes are widely used in the fields of reading, communication, measurement or sensing due to their advantages such as linear propagation, low light spots, and high optical density. In recent years, they have been widely used in mobile devices (such as smart Face recognition or object recognition applications in mobile phones, tablet computers, etc., for example, with time of flight (ToF) technology for face recognition. The conventional laser diode often cooperates with the drive signal generated by the drive chip to perform corresponding operations, that is, the laser diode system emits light according to the received drive signal, so the drive speed of the laser diode depends on the received drive signal. The driving signal of the laser diode is controlled by the driving signal. Among them, the driving speed of the laser diode directly affects the identification effect. The faster the driving speed, the faster the identification speed, which can improve the accuracy of identification.

As the traces used to transmit the driving signal are longer, the driving signal will lose and decrease the signal strength due to the electrical properties (such as impedance) of the trace itself, resulting in a slowdown in the driving speed of the laser diode, and thus Can not improve the speed and effect of recognition. Therefore, in order to reduce the signal transmission distance between the laser diode and the driver chip to increase the driving speed of the laser diode, this application proposes a laser diode device, which includes a laser diode element and a lens , The first carrier, the driving chip and the second carrier, the laser diode module and the driving chip module, wherein the first carrier is used for accommodating the laser diode element and the lens, and the second carrier is used for The driving chip is accommodated and arranged under the first carrier to carry the first carrier, and is electrically connected to the first carrier.

In this way, the directly superimposed first carrier and second carrier greatly reduce the wiring distance between the laser diode element and the driver chip, and reduce the signal loss caused by the excessively long wiring distance. In addition, direct superimposition The method also greatly reduces the surface area occupied by the laser diode element and the driver chip on the circuit, and improves the convenience of wiring. Furthermore, the laser diode element and the driver chip are combined with two carriers. Thermal and electrical isolation from each other can prevent the thermal energy of the laser diode components from affecting the performance of the drive chip.

Optionally, the first carrier includes a first ceramic carrier, a first metal layer, a first side wall, a first support part, and a first electrode part, wherein the first metal layer is disposed above the first ceramic carrier, and the first side wall Is arranged above the first metal layer, the first support portion protrudes from the inner side of the first side wall, and defines a first accommodating space and a second accommodating space with the first side wall and the first metal layer, and the first electrode portion is configured Below the first ceramic carrier.

Optionally, the first accommodating space is used to accommodate the laser diode element, and the second accommodating space is used to accommodate the lens.

Optionally, the first ceramic carrier includes a plurality of first through holes, and the plurality of first through holes are used to provide wires connected between the metal layer and the first electrode portion.

Optionally, the first electrode part includes a first electrode and a second electrode for electrically connecting with the laser diode element separately.

Optionally, the second carrier includes a second ceramic carrier, a second metal layer, a second side wall, a second support part, and a second electrode part, wherein the second metal layer is disposed above the second ceramic carrier, and the second The side wall is disposed above the second metal layer, the second support portion protrudes from the inner side of the second side wall, and defines a third accommodation space and a fourth accommodation space with the second metal layer and the second side wall, and the second electrode portion , Arranged below the second ceramic carrier.

Optionally, the third accommodating space is used for accommodating the driving chip, the fourth accommodating space is used for accommodating the first electrode part, and the first electrode part is electrically connected to the second side wall.

Optionally, the second ceramic carrier includes a plurality of second through holes, and the plurality of second through holes are used to provide wires connected between the second metal layer and the second electrode part.

Optionally, the second ceramic carrier, the second metal layer, the second side wall and the second support part are integrally formed.

Optionally, the height of the laser diode device is the same as the image sensor.

In order to fully understand the purpose, features, and effects of this application, the following specific embodiments are used in conjunction with the accompanying drawings to give a detailed description of this application. The description is as follows:

Please refer to FIG. 1, FIG. 2 and FIG. 3 at the same time. FIG. 1 is a schematic diagram of the package structure of a laser diode device 1000 according to an embodiment of the present application, which includes a laser diode module 100 and a driver chip module 200. FIG. 2 is a schematic diagram of a separate structure of a laser diode module 100 according to an embodiment of the present application, and FIG. 3 is a schematic diagram of a separate structure of a driver chip module 200 according to an embodiment of the present application.

The laser diode module 100 includes a first carrier for accommodating and carrying a laser diode element 180 (for example, a laser diode chip) and a lens 190, wherein the first carrier The member includes a first ceramic carrier 110, a first metal layer 120, a first side wall 130, a first support part 140 and a first electrode part 150. A first metal layer 120 is disposed above the first ceramic carrier 110, and a first electrode portion 150 is disposed below the first ceramic carrier 110. The first electrode portion 150 includes a first electrode 150a and a second electrode 150b, The first electrode 150a and the second electrode 150b are used to electrically connect the positive electrode and the negative electrode of the laser diode element 180 respectively. The first side wall 130 is disposed above the first metal layer 120 and connected to the first metal layer 120. The first side wall 130 surrounds the first metal layer 120 to form a accommodating space. At the same time, the first support portion 140 is disposed on the first side wall The inner side of 130 protrudes from the first side wall 130 in the direction of the accommodating space, and the top of the first supporting portion 140 is lower than the top of the first side wall 130, so the first supporting portion 140 and the first metal layer 120 define a An accommodating space 160, and a second accommodating space 170 located above the first accommodating space 160 is defined between the top of the first supporting portion 140 and the top of the first side wall 130. In other words, the accommodating space of the first carrier includes the first accommodating space 160 and the second accommodating space 170, wherein the first accommodating space 160 is used to accommodate the laser diode element 180, The second accommodating space 170 is used for accommodating the lens 190. The laser diode element 180 is disposed above the first metal layer 120 and connected to the first metal layer 120, and the lens 190 is disposed and fixed (for example, bonded) on the top of the first support portion 140, so the laser diode The light emitted by the body element 180 can be aggregated into a specific pattern through the lens 190 to be emitted to the outside of the laser diode module 100.

The first ceramic carrier 110 further includes a plurality of first through holes 111. The first through holes 111 penetrate through the top and bottom of the first ceramic carrier 110 and are used to connect between the first metal layer 120 and the first electrode portion 150. Therefore, the positive electrode and negative electrode of the laser diode element 180 can be connected to the first metal layer 120 and the first through hole 111 separately from the first electrode part 150. The electrode 150a and the second electrode 150b are electrically connected.

The laser diode element 180 may be a Vertical-Cavity Surface-Emitting Laser (VCSEL), and the lens 190 may be a Diffractive Optical Element (DOE) Or a microlens, and this application is not limited by this.

The material of the first metal layer 120 may be copper, and the present application is not limited thereto. The material of the first metal layer 120 may be replaced with other metal materials or conductive materials as required.

The material of the first side wall 130 and the first supporting portion 140 may be PPA resin, LCP (LIQUID CRYSTAL POLYMER) or metal material, and the application is not limited thereto.

The driver chip module 200 includes a second carrier for accommodating the driver chip 280, wherein the second carrier includes a second ceramic carrier 210, a second metal layer 220, a second side wall 230, and a second support part 240 and the second electrode part 250. The driving chip 280 is used to generate a driving signal for the laser diode element 180, so that the laser diode element 180 can emit light according to the driving signal. A second metal layer 220 is disposed above the second ceramic carrier 210, and a second electrode portion 250 is disposed below the second ceramic carrier 210. The second electrode portion 250 is used to interact with the driving chip 280 and an external circuit (not shown). ) Electrical connection. The second sidewall 230 is disposed above the second metal layer 220 and connected to the second metal layer 220, and the second sidewall 230 surrounds the second metal layer 220 to form an accommodation space. The second supporting portion 240 is disposed on the inner side of the second side wall 230 and protrudes from the second side wall 230 in the direction of the accommodation space, and the top of the second supporting portion 240 is lower than the top of the second side wall 230, so the second supporting portion 240 A third accommodating space 260 is defined with the second metal layer 220. The top of the second supporting portion 240 and the top of the second side wall 230 define a fourth accommodating space 270 located above the third accommodating space 260. The three accommodating spaces 260 are used for accommodating the driving chip 280, the fourth accommodating space 270 is for accommodating and carrying the first electrode portion 150 of the laser diode module 100, and the driving chip 280 is disposed on the second metal layer 220 On and connected to the second metal layer 220. Thereby, the first electrode portion 150 can be electrically connected to the second side wall 230 and the second support portion 240, and the driving chip 280 can be electrically connected to the second side wall 230 through the second metal layer 220, and drive through the second side wall 230 The signal is transmitted to the electrically connected first electrode portion 150, so the driving signal can be transmitted to the laser diode element 180 through the first electrode portion 150.

The second ceramic carrier 210 further includes a plurality of second through holes 211. The second through holes 211 penetrate through the top and bottom of the second ceramic carrier 210 and are used to connect to the second metal layer 220 and the second electrode portion 250. Therefore, the driving chip 280 can be electrically connected to the second electrode part 250 through the connected second metal layer 220 and the second through hole 211.

The material of the second metal layer 220 may be copper, and the present application is not limited thereto. The material of the second metal layer 220 may be replaced with other metal materials or conductive materials as required.

In an embodiment, the second side wall 230 and the second support portion 240 may be integrally formed with the second metal layer 220 and the second ceramic carrier 210. For example, the second metal layer 220, the second side wall 230 and the second support portion 240 may It is directly produced on the second ceramic carrier 210 and integrally formed. In this embodiment, the material of the second sidewall 230, the second support portion 240, and the second metal layer 220 is copper, and the application is not limited thereto.

In another embodiment, the second side wall 230 and the second supporting portion 240 may be implemented by ceramic, PPA resin or LCP (LIQUID CRYSTAL POLYMER) coated with metal, and the application is not limited thereto.

According to the laser diode device 1000 of the present application, the height of the first side wall 130 and the second side wall 230 can be selected according to the height H of the laser diode device 1000, so that the laser diode device 1000 is configured The height H of the circuit is the same as that of the corresponding image sensor. Therefore, when the laser diode device 1000 is placed on the circuit, there is no need to re-print to meet the height of the image sensor, which greatly reduces the need for electronic product manufacturing. Time and cost, wherein the image sensor and the laser diode device 1000 are configured in the same electronic device (for example, a smart phone), which is used to receive reflected light, which is a laser diode device The light emitted by the 1000 laser diode element 180 irradiates the surface of the test object (for example, a human face) and reflects the light, so that the electronic device can determine the different positions on the surface of the test object according to the time of light reflection. The distance in turn constructs the three-dimensional structure of the surface of the object to be measured. The image sensor is, for example, a Charge Coupled Device (CCD) lens, and the application is not limited thereto.

In summary, in the embodiment of the present application, the laser diode module 100 and the driver chip module 200 are combined and electrically connected to each other in the vertical direction, which can greatly reduce the transmission of the driving signal to the laser diode element 180. At the same time, it reduces the energy loss caused by the transmission path, thus effectively increasing the driving speed of the laser diode element 180, thus greatly reducing the surface area of the laser diode device 1000, and improving the convenience of wiring. In addition, the laser diode element 180 and the driving chip 280 are thermoelectrically separated from each other by two supporting members, which can effectively prevent the heat generated during the operation of the laser diode element 180 from affecting the performance of the driving chip 280.

This application has been disclosed in the above with preferred embodiments, but those skilled in the art should understand that the embodiments are only used to describe the application and should not be interpreted as limiting the scope of the application. It should be noted that all changes and substitutions equivalent to this embodiment should be included in the scope of this application. Therefore, the scope of protection of this application shall be subject to the scope of the patent application.

100: Laser diode module 110: The first ceramic carrier 111: first through hole 120: first metal layer 130: first side wall 140: First support 150: first electrode part 150a: first electrode 150b: second electrode 160: first housing space 170: second housing space 180: Laser diode element 190: lens 200: drive chip module 210: second ceramic carrier 211: second through hole 220: second metal layer 230: second side wall 240: second support 250: second electrode part 260: third accommodation space 270: Fourth Housing Space 280: driver chip 1000: Laser diode device H: height

Fig. 1 is a schematic diagram of a package structure of a laser diode device according to an embodiment of the present application; 2 is a schematic diagram of a separate structure of a laser diode module according to an embodiment of the present application; and 3 is a schematic diagram of a separate structure of a driver chip module according to an embodiment of the present application.

100: Laser diode module

110: The first ceramic carrier

111: first through hole

120: first metal layer

130: first side wall

140: First support

150a: first electrode

150b: second electrode

160: The first housing space

180: Laser diode element

190: lens

200: drive chip module

210: second ceramic carrier

211: second through hole

220: second metal layer

230: second side wall

240: second support

250: second electrode part

260: third accommodation space

280: driver chip

1000: Laser diode device

H: height

Claims (10)

A laser diode device, which includes: A laser diode element; A lens A first carrier for accommodating the laser diode element and the lens; A driver chip; and A second carrier is used for accommodating the driving chip, and is disposed under the first carrier to carry the first carrier, and is electrically connected to the first carrier. In the laser diode device according to claim 1, the first carrier includes: A first ceramic carrier; A first metal layer disposed above the first ceramic carrier; A first side wall disposed above the first metal layer; A first supporting portion protruding from the inner side of the first side wall and defining a first accommodating space and a second accommodating space with the first side wall and the first metal layer; and A first electrode part is arranged under the first ceramic carrier. The laser diode device according to claim 2, wherein the first accommodating space is used for accommodating the laser diode element, and the second accommodating space is used for accommodating the lens. The laser diode device according to claim 2, wherein the first ceramic carrier includes a plurality of first through holes, and the first through holes are configured to be connected between the metal layer and the first electrode portion Wire. The laser diode device according to claim 2, wherein the first electrode portion includes a first electrode and a second electrode for electrically connecting with the laser diode element. In the laser diode device according to claim 1, the second carrier includes: A second ceramic carrier; A second metal layer disposed above the second ceramic carrier; A second side wall disposed above the second metal layer; A second supporting portion protruding from the inner side of the second side wall and defining a third accommodating space and a fourth accommodating space with the second metal layer and the second side wall; A second electrode part is arranged under the second ceramic carrier. The laser diode device according to claim 6, wherein the third accommodating space is used for accommodating the driving chip, the fourth accommodating space is used for accommodating the first electrode part, and the first electrode part It is electrically connected to the second side wall. The laser diode device according to claim 6, wherein the second ceramic carrier includes a plurality of second through holes, and the second through holes are configured to be connected to the second metal layer and the second electrode portion Between the wires. The laser diode device according to claim 6, wherein the second ceramic carrier, the second metal layer, the second side wall and the second support portion are integrally formed. The laser diode device according to claim 1, wherein the height of the laser diode device is the same as that of an image sensor.

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