TW202040435A - Patterned smart card module, smart card including the patterned smart card module, method for manufacturing the patterned smart card module, and method of verifying authentication of the patterned smart card module - Google Patents
Patterned smart card module, smart card including the patterned smart card module, method for manufacturing the patterned smart card module, and method of verifying authentication of the patterned smart card module Download PDFInfo
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- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/4097—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by using design data to control NC machines, e.g. CAD/CAM
- G05B19/4099—Surface or curve machining, making 3D objects, e.g. desktop manufacturing
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- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/33—User authentication using certificates
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- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
- G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
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- G05B2219/45212—Etching, engraving, sculpturing, carving
Abstract
Description
本揭示相關於一種嵌有一積體電路(IC)晶片的智慧卡模組,特別是相關於一圖案化智慧卡模組。The present disclosure relates to a smart card module embedded with an integrated circuit (IC) chip, and more particularly to a patterned smart card module.
現有的智慧卡,像是信用卡、用戶身分模組(SIM)卡、健康卡、社會福利卡、所有種類的IC卡及其類似者,各包含有一被一鑲嵌在一塑膠卡體內的晶片模組所封裝的IC晶片, 並且除了傳統的接觸式通訊之外,現今通常也能夠進行非接觸式通訊,像是無線射頻辨識(RFID)的操作。當這樣的智慧卡放在口袋裡的時候,儲存在IC卡裡的資料會有在卡片持有者不知情的情況下被用非接觸介面竊取的風險。此外,晶片模組的接觸墊通常是暴露在外的,其佔用了智慧卡外表面本來可用來提供其他資訊的一部分,並使得在視覺上有點不有趣。Existing smart cards, such as credit cards, subscriber identity module (SIM) cards, health cards, social welfare cards, all types of IC cards and the like, each contain a chip module embedded in a plastic card body The packaged IC chip, in addition to the traditional contact communication, is now usually capable of non-contact communication, such as radio frequency identification (RFID) operations. When such a smart card is placed in a pocket, the data stored in the IC card may be stolen through a contactless interface without the card holder’s knowledge. In addition, the contact pads of the chip module are usually exposed, which occupies a part of the outer surface of the smart card that could be used to provide other information, and makes it visually uninteresting.
因此,本揭示的一目的為提供一圖案化智慧卡模組,其可改善先前技藝中的至少一個缺點。 依據本揭示,該圖案化智慧卡模組包括了一晶片模組及一塗佈在該晶片模組的一導電表面上圖案化墨層。該晶片模組嵌有一儲存晶片資料在其內的IC晶片,且其導電表面形成有多個用於給一資料讀取機讀取儲存在該晶片模組內的晶片資料的接觸墊。該晶片資料包括持有者相關資料。該圖案化墨層具有一相關於該持有者相關資料的圖案。Therefore, an object of the present disclosure is to provide a patterned smart card module that can improve at least one of the shortcomings in the prior art. According to the present disclosure, the patterned smart card module includes a chip module and a patterned ink layer coated on a conductive surface of the chip module. The chip module is embedded with an IC chip storing chip data in it, and its conductive surface is formed with a plurality of contact pads for reading the chip data stored in the chip module for a data reader. The chip information includes information about the holder. The patterned ink layer has a pattern related to relevant information of the holder.
本揭示的另一目的為提供一智慧卡,其可改善先前技藝中的至少一個缺點。Another object of the present disclosure is to provide a smart card that can improve at least one of the shortcomings in the prior art.
依據本揭示,該智慧卡包括了一卡體,及一嵌有一儲存晶片資料在其內的IC晶片並嵌在該卡體之中的圖案化智慧卡模組。該圖案化智慧卡模組包括了一晶片模組及一塗佈在該晶片模組的一導電表面上的圖案化墨層。該晶片模組嵌有該IC晶片,且其導電表面形成有多個用於給一資料讀取機讀取儲存在該晶片模組內的晶片資料的接觸墊。該晶片資料包括持有者相關資料。該圖案化墨層具有一相關於該持有者相關資料的圖案。According to the present disclosure, the smart card includes a card body and a patterned smart card module embedded with an IC chip storing chip data therein and embedded in the card body. The patterned smart card module includes a chip module and a patterned ink layer coated on a conductive surface of the chip module. The chip module is embedded with the IC chip, and its conductive surface is formed with a plurality of contact pads for reading the chip data stored in the chip module for a data reader. The chip information includes information about the holder. The patterned ink layer has a pattern related to relevant information of the holder.
本揭示的另一目的為提供一用於製造一圖案化智慧卡模組的方法。該方法包括:提供一電腦裝置,其儲存有要被寫入嵌在一智慧卡模組之中的一積體電路(IC)晶片裡的晶片資料,其中該晶片資料包括持有者相關資料,且該智慧卡模組包括一嵌有該IC晶片並具有一形成有多個接觸墊的導電表面的晶片模組,及一塗佈於該晶片模組的該導電表面上的導電墨層;由該電腦裝置控制一連接到該電腦裝置的雷射雕刻機台來雕刻一表示該持有者相關資料的圖案在該智慧卡模組的該導電墨層上,以形成一圖案化墨層並因而形成該圖案化智慧卡模組;以及由該電腦裝置控制一連接到該電腦裝置的資料寫入機台來將該晶片資料寫入到該嵌在該晶片模組之中的該IC晶片裡。Another object of the present disclosure is to provide a method for manufacturing a patterned smart card module. The method includes: providing a computer device that stores chip data to be written into an integrated circuit (IC) chip embedded in a smart card module, wherein the chip data includes owner-related data, And the smart card module includes a chip module embedded with the IC chip and having a conductive surface formed with a plurality of contact pads, and a conductive ink layer coated on the conductive surface of the chip module; The computer device controls a laser engraving machine connected to the computer device to engrave a pattern representing relevant information of the holder on the conductive ink layer of the smart card module to form a patterned ink layer and thus Forming the patterned smart card module; and controlling a data writing machine connected to the computer device by the computer device to write the chip data into the IC chip embedded in the chip module.
本揭示的另一目的為提供一驗證一圖案化智慧卡模組之認證之方法。該圖案化智慧卡模組包括:一晶片模組,其嵌有一儲存晶片資料在其內的積體電路(IC)晶片,並具有一形成有多個接觸墊的導電表面,該晶片資料包括持有者相關資料;及一圖案化墨層,其塗佈於該晶片模組的該導電表面上,並具有一相關於該持有者相關資料的圖案。該方法包含:由一資料讀取機從該晶片模組的該IC晶片中讀取該持有者相關資料;由一相機裝置取得該圖案化墨層的一影像;由一電腦裝置基於由該相機裝置取得的影像來獲得該圖案化墨層的該圖案所表示的資料;及由該電腦裝置把該圖案所表示的資料與從該晶片模組的該IC晶片中所讀取的該持有者相關資料作比較。當該圖案所表示的資料匹配於從該晶片模組的該IC晶片中所讀取的該持有者相關資料時,該電腦裝置被准許執行相關於該圖案化智慧卡模組的下一個動作。Another object of the present disclosure is to provide a method for verifying the authentication of a patterned smart card module. The patterned smart card module includes: a chip module, which is embedded with an integrated circuit (IC) chip storing chip data therein, and has a conductive surface formed with a plurality of contact pads, and the chip data includes There are related data; and a patterned ink layer coated on the conductive surface of the chip module and has a pattern related to the holder related data. The method includes: reading the holder-related data from the IC chip of the chip module by a data reader; obtaining an image of the patterned ink layer by a camera device; and using a computer device based on the The image obtained by the camera device is used to obtain the data represented by the pattern of the patterned ink layer; and the computer device combines the data represented by the pattern with the holding data read from the IC chip of the chip module Comparing with relevant data. When the data represented by the pattern matches the holder-related data read from the IC chip of the chip module, the computer device is permitted to perform the next action related to the patterned smart card module .
在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are represented by the same numbers.
參照圖1,依據本揭示的一智慧卡的實施例包括一個卡體1及一個將一IC晶片23封裝其內且嵌在該卡體1中的圖案化智慧卡模組2。該智慧卡可以是,舉例來說,一信用卡、一SIM卡、一健康卡、一社會福利卡、一ID卡等等,其卡體1通常是由塑膠所製成。1, an embodiment of a smart card according to the present disclosure includes a
該圖案化智慧卡模組2是由一(裸)晶片模組20及一圖案化墨層25所形成。該晶片模組20中嵌有該IC晶片23,且具有一形成有多個接觸墊22的導電表面21(通常是一金屬表面,但不限定於此),該等接觸墊22用於給一資料讀取機(圖未示)讀取儲存在嵌於晶片模組20中的IC晶片23的晶片資料。該圖案化墨層25是塗佈在該晶片模組20的該導電表面21上。在這實施例中,該晶片資料包含了相關於該智慧卡的一持卡人的持有者相關資料,其可能為,例如,該持卡人的姓名、該持卡人的電話號碼、用於該持卡者的管理資料 (例如密鑰、憑證,諸如此類) 等等,但本揭示並不受限於這方面。該圖案化墨層25具有一相關於該持有者相關資料的圖案。The patterned
實作時,該晶片模組20的該導電表面被施用一導電油墨,以在其上形成一素面的導電墨層。接著,現有的雷射雕刻技術可以用來在該導電墨層上形成想要的圖案,以嵌有該IC晶片的該晶片模組20仍可正常發揮功用的方式來創造出該圖案化墨層25。在這實施例中,該圖案化墨層25是一個半透明的有色層,但本揭示不受限於這方面。在圖1中,該圖案是一個包含了該持有者相關資料的二維條碼(例如一快速響應矩陣圖碼,QR碼) ,但本揭示不受限於這方面。在一例子中,該圖案可以是直接用文字顯示出該持有者相關資料的字元。在一例子中,該圖案可以表示一經加密的資料件,其是用,舉例來說,資料加密標準(data encryption standard, DES)、進階加密標準(advanced encryption standard, AES)等等來對該持有者相關資料加密而產生出來的。在一例子中,該圖案可以表示一標記化資料件(tokenized data piece),其是藉由使用一被認知為”標記化(tokenization)”的方法來標記化該使用者相關資料而產生,而該”標記化”係被使用來以一標記替代敏感資料。因該圖案表示了該使用者相關資料,該圖案化智慧卡模組自己本身即可指示出其所有權,也因此該卡體1在一些實施例中可被省略,在卡體1被省略的情況下,該圖案化智慧卡模組2本身即可當成是智慧卡,達到智慧卡的小型化。而且,除了表示該持有者相關資料之外,該圖案還可具有例如背景圖案及背景顏色等等個人化的設計,使得該圖案化智慧卡模組2能有一獨特且個人化的整體外觀。In practice, a conductive ink is applied to the conductive surface of the
實作時,該圖案化墨層25及該持有者相關資料是用做該圖案化智慧卡模組2之認證(authentication)或驗證(verification)。舉例來說,當該圖案化智慧卡模組2在使用時,需要一電腦裝置來讀取持有者相關資料及取得由該圖案化墨層25的圖案所表示的資料。只有在當該圖案化墨層25所表示的資料匹配於該持有者相關資料時,該電腦裝置才被准許來執行相關於該圖案化智慧卡模組2的下一個動作(例如註冊、登入系統、讀取敏感資料或憑證、某種處理、或任何需要認證的動作)。In practice, the patterned
在一實施態樣裡,儲存在該智慧卡IC晶片裡的該晶片資料可以包含敏感資料(例如持卡者的個人資訊、信用卡號碼、存款資訊等等),且該持有者相關資料可被設計用來作為資料讀取機對於該敏感資料的存取的認證。舉例來說,當一商店店員收取了這樣具有圖案化智慧卡模組2的智慧卡,該商店店員可以透過該圖案化智慧卡模組2的圖案來直接對持卡者確認身分或執行人工認證/驗證。在另一例子裡,當使用資料讀取機(圖未示)來讀取儲存在晶片模組20的IC晶片中的敏感資料時,該資料讀取機首先會被要求至少以圖像識別(像是光學字元辨識OCR、QR碼識別等等)來辨識出隱藏在晶片模組20上的圖案中的資料。因此,該資料讀取機可以包含或是連接到一個攝影裝置以取得該智慧卡之該圖案化智慧卡模組2的圖案化墨層25的影像,並且可以包含一處理單元用以基於該攝影單元取得的影像來獲得該圖案化墨層25的圖案所表示的資料。若是該圖案表示一加密資料件,該資料讀取機可能還需要一解密密鑰來解密並辨識藏在圖案中的資料。若是該圖案表示一標記化資料,該資料讀取機可能需要連接到一標記服務供應商(token service provider, TSP)來把標記化資料解除標記化,從而辨識隱藏在圖案中的資料。接著,該資料讀取機讀取儲存在該晶片模組20的IC晶片中的作為該晶片資料一部分的該持有者相關資料,並把辨識出的資料與該持有者相關資料作比較。只有當該被辨識出的資料匹配於該持有者相關資料時,該資料讀取機才被准許存取該敏感資料。因此,該敏感資料只有當持卡者拿出該智慧卡來例如完成交易時才可被存取,而當該智慧卡是放在口袋、包包或諸如此類的東西裡時,該敏感資料不會被未授權的非接觸式讀取操作所竊取。In an implementation aspect, the chip data stored in the smart card IC chip can contain sensitive information (such as the cardholder’s personal information, credit card number, deposit information, etc.), and the holder’s related information can be It is designed to be used as the authentication for the access of the sensitive data by the data reader. For example, when a store clerk receives such a smart card with a patterned
圖2展示了一個用以在生產線上製造根據本揭示的該智慧卡之實施例的第一示例系統。該系統包括了一個裝有一空白模組捲帶201的輸入滾輪100、一資料寫入機台200、一雷射雕刻機台300(例如一光纖雷射)、一電連接到該資料寫入機台200及該雷射雕刻機台300的電腦裝置400、和一輸出滾輪500。該空白模組捲帶201包含了多個空白智慧卡模組2’,其每一個嵌有一IC晶片在內,並且是由一內嵌有該IC晶片且其上塗佈有導電墨層的一空白(且裸的)晶片模組20所形成。該電腦裝置400儲存有多筆對應該等空白晶片模組20的晶片資料。該輸入滾輪100及該輸出滾輪500協力將該空白模組捲帶201給進該資料寫入機台200,且該電腦裝置400控制該資料寫入機台200來對每一個被給進該資料寫入機台200的空白晶片模組20,將對應的晶片資料寫入到嵌在該空白晶片模組20裡的IC晶片中。有了資料已寫入的晶片模組20的該空白模組捲帶201接著被給進了雷射雕刻機台300,其中該電腦裝置400控制該雷射雕刻機台300朝向塗佈在該等資料已寫入的晶片模組20上的該導電墨層發出一雷射光,來對於每一個被給進該雷射雕刻機台300的該等資料已寫入的晶片模組20在導電墨層上雕刻出相關於該對應晶片資料的該持有者相關資料的一圖案,從而形成該圖案化墨層25(見圖1)並創造出該(圖案化)智慧卡模組2。需注意該電腦裝置400是在雕刻製程之前對該持有者相關資料進行處理以創造出該圖案(例如把該持有者相關資料轉換成一QR碼、把該持有者相關資料進行加密、及/或把該持有者相關資料標記化)。接著,包含了複數個圖案化智慧卡模組2的該經處理模組捲帶201,被該輸出轉輪500給進下一個製造站點以進行處理,像是從該模組捲帶201中切割出該等圖案化智慧卡模組2,以及把該等圖案化智慧卡模組2嵌入對應的卡體1。需注意在其他實施例中資料寫入及雷射雕刻操作的順序可以交換,而本揭示並不受限於這方面。Figure 2 shows a first example system for manufacturing the smart card embodiment according to the present disclosure on a production line. The system includes an
圖3根據本揭示展示了一個用以在生產線上製造該智慧卡實施例的第二示例系統。該系統包括一送卡機110、一雷射雕刻機台300、一資料寫入機台200、一電連接到該資料寫入機台200及該雷射雕刻機台300的電腦裝置400、一卡片處理系統600、一資料讀取機台700、一影像檢查機台800、和一輸出盤510。需注意在這裡所揭示的示例生產線具有一包含了該資料讀取機台700和該影像檢查機台800的一檢查站,但在其他生產線裡,該檢查站可被省略。該送卡機110存有多張空白智慧卡,其每一張都是由一空白卡體1(見圖1)及一嵌在空白卡體中的空白智慧卡模組所組成。該空白智慧卡晶片是由一空白(且裸)的晶片模組20及一塗佈在該空白晶片模組20上的導電墨層所形成。該電腦裝置400儲存有多筆對應該等空白晶片模組20的晶片資料。該送卡機110把該等空白智慧卡例如一個接一個地送進雷射雕刻機台300內,且該電腦裝置400控制該雷射雕刻機台300朝向塗佈在該等晶片模組20上的該導電墨層發出一雷射光,來對於每一個被給進該雷射雕刻機台300的該等空白智慧卡,在該空白智慧卡的該智慧卡晶片的該導電墨層上,雕刻出相關於該對應晶片資料的該持有者相關資料的一圖案,以形成該圖案化墨層25(見圖1)及該空白智慧卡的該(圖案化)智慧卡模組2(見圖1)。然後,具有該等圖案化智慧卡模組2的該等空白智慧卡被給進該資料寫入機台200,其中該電腦裝置400控制該資料寫入機台200來對每一個被給進的空白智慧卡,將對應的晶片資料寫入到嵌在該空白智慧卡的該空白晶片模組20裡的該IC晶片中。接著,具有該空白卡體1的該等智慧卡被送到該卡片處理系統600以圖案化該等卡體1,來完成該等智慧卡的製造。需注意在其他實施例中,雷射雕刻、資料寫入及卡片處理操作的順序是可以更改的,且本揭示並不受限於這方面。Figure 3 shows a second example system for manufacturing the smart card embodiment on a production line according to the present disclosure. The system includes a
在此示例生產線中,完成的智慧卡接著可被送到檢查站。該資料讀取機台700為一資料讀取機,其使用接觸式或非接觸式的方法對於每一張智慧卡讀取儲存在該智慧卡之該圖案化智慧卡模組2的該IC晶片裡的晶片資料中的持有者相關資料。該影像檢查機台800包括一攝影裝置來對於每一張智慧卡取得該智慧卡之該圖案化智慧卡模組2的該圖案化墨層25的一影像,且包括一處理單元或電腦裝置來基於由該攝影裝置所取得的影像獲得該圖案化墨層25的該圖案所表示的資料。該檢查站的一電腦裝置或一處理器,其可被包含在該資料讀取機台700或是該影像檢查器台800中,或可以是一連接到該資料讀取機台700及該影像檢查機台800的分開的電腦裝置,接著對於該智慧卡比較該圖案所表示的資料與從該晶片模組20的該IC晶片中所讀出的持有者相關資料。當該圖案所表示的資料匹配於從該晶片模組20的該IC晶片讀出的晶片資料時,該圖案化智慧卡晶片被送到下一個製造站點(例如本實施例中的輸出盤510),否則可能會從生產線被移除或是進行重工。In this example production line, the completed smart card can then be sent to the checkpoint. The
總結來說,因為該圖案化智慧卡模組2的實施例在其表面上具有一表示該持有者相關資料的圖案,該圖案化智慧卡模組2可單獨展示出其所有權,且該卡體1可被省略,從而縮小該智慧卡的尺寸。在一些實施態樣中,因為該圖案所表示的資料表示了儲存在該晶片模組20的IC晶片中且用於認證對於敏感資料存取的該持有者相關資料,加強了儲存在該晶片模組20的該IC晶片中的資料的安全性。In summary, because the embodiment of the patterned
惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。However, the above are only examples of the present invention. When the scope of implementation of the present invention cannot be limited by this, all simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the content of the patent specification still belong to This invention patent covers the scope.
1:卡體 2:圖案化智慧卡模組 20:晶片模組 201:模組捲帶 21:導電表面 22:接觸墊 23:IC晶片 25:圖案化墨層 100:輸入滾輪 110:送卡機 200:資料寫入機台 300:雷射雕刻機台 400:電腦裝置 500:輸出滾輪 510:輸出盤 600:卡片處理系統 700:資料讀取機台 800:影像檢查機台1: card body 2: Patterned smart card module 20: Chip module 201: Modular tape 21: Conductive surface 22: Contact pad 23: IC chip 25: Patterned ink layer 100: input scroll wheel 110: Card feeder 200: Data writing machine 300: Laser engraving machine 400: computer device 500: output roller 510: output disk 600: Card Processing System 700: Data reading machine 800: image inspection machine
本揭露的其他特徵及優點在以下詳細的實施例描述參照所附圖式將會更清楚,且其中︰ 圖1係為說明根據本揭示之一智慧卡的一示例實施例的示意圖; 圖2係為說明一用來製造一根據該實施例之圖案化智慧卡模組的一第一示例系統的示意圖;及 圖3係為說明一用來製造一根據該實施例之圖案化智慧卡模組的一第二示例系統的示意圖。Other features and advantages of the present disclosure will be more apparent in the following detailed embodiment description with reference to the accompanying drawings, and among them: FIG. 1 is a schematic diagram illustrating an exemplary embodiment of a smart card according to the present disclosure; 2 is a schematic diagram illustrating a first example system for manufacturing a patterned smart card module according to this embodiment; and 3 is a schematic diagram illustrating a second example system for manufacturing a patterned smart card module according to this embodiment.
1:卡體 1: card body
2:圖案化智慧卡模組 2: Patterned smart card module
20:晶片模組 20: Chip module
21:導電表面 21: Conductive surface
22:接觸墊 22: Contact pad
23:IC晶片 23: IC chip
25:圖案化墨層 25: Patterned ink layer
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