TW202038300A - Semiconductor device manufacturing method and layered film for temporary fixing material - Google Patents
Semiconductor device manufacturing method and layered film for temporary fixing material Download PDFInfo
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Abstract
Description
本發明是有關於一種半導體裝置的製造方法及暫時固定材用積層膜。The present invention relates to a method of manufacturing a semiconductor device and a laminated film for temporary fixing material.
於半導體裝置的領域中,近年來與積層多個半導體元件而成的被稱為系統級封裝(System in Package,SIP)的封裝相關的技術顯著發展。於SIP型的封裝中,為了積層多個半導體元件,對半導體元件要求厚度薄化。根據該要求,於半導體元件中,將積體電路裝入至半導體構件(例如,半導體晶圓)中後,例如實施對半導體構件的背面進行研削的厚度薄化、對半導體晶圓進行切割的個別化等加工處理。關於該些半導體構件的加工處理,通常利用暫時固定材層將半導體構件暫時固定於支撐構件而進行(例如,參照專利文獻1~專利文獻3)。In the field of semiconductor devices, in recent years, technologies related to packaging called System in Package (SIP) formed by laminating a plurality of semiconductor elements have developed significantly. In the SIP type package, in order to laminate a plurality of semiconductor elements, the thickness of the semiconductor elements is required to be thin. According to this requirement, in semiconductor elements, after the integrated circuit is incorporated into a semiconductor member (for example, a semiconductor wafer), for example, the back surface of the semiconductor member is ground and the semiconductor wafer is diced. Processing and other processing. Regarding the processing of these semiconductor members, it is usually performed by temporarily fixing the semiconductor member to the supporting member using a temporary fixing material layer (for example, refer to Patent Document 1 to Patent Document 3).
實施了加工處理的半導體構件經由暫時固定材層而與支撐構件牢固地固定。因此,於半導體裝置的製造方法中,要求可防止半導體構件的損傷等,並可將加工處理後的半導體構件自支撐構件分離。於專利文獻1中,作為將此種半導體構件分離的方法,揭示了一種對暫時固定材層一面進行加熱一面進行物理分離的方法。另外,於專利文獻2、專利文獻3中揭示了一種藉由對暫時固定材層照射雷射光(相干光(coherent light))而將半導體構件分離的方法。 [現有技術文獻] [專利文獻]The processed semiconductor member is firmly fixed to the support member via the temporary fixing material layer. Therefore, in the manufacturing method of a semiconductor device, it is required that the semiconductor member can be prevented from being damaged, etc., and the processed semiconductor member can be separated from the supporting member. In Patent Document 1, as a method of separating such a semiconductor member, a method of physically separating the temporary fixing material layer while heating one side is disclosed. In addition, Patent Document 2 and Patent Document 3 disclose a method of separating semiconductor members by irradiating a temporarily fixed material layer with laser light (coherent light). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利特開2012-126803號公報 [專利文獻2]日本專利特開2016-138182號公報 [專利文獻3]日本專利特開2013-033814號公報[Patent Document 1] Japanese Patent Laid-Open No. 2012-126803 [Patent Document 2] Japanese Patent Laid-Open No. 2016-138182 [Patent Document 3] Japanese Patent Laid-Open No. 2013-033814
[發明所欲解決之課題] 但是,於專利文獻1所揭示的方法中,存在於半導體晶圓中產生由熱歷程引起的損傷等從而良率降低的問題。另一方面,於專利文獻2、專利文獻3所揭示的方法中,存在如下問題:由於雷射光的照射面積窄而對半導體構件整體反覆照射多次,因此花費時間;由於控制雷射光的焦點來進行掃描照射,故步驟變得複雜;以及需要高價的裝置。[The problem to be solved by the invention] However, in the method disclosed in Patent Document 1, there is a problem that the semiconductor wafer is damaged due to thermal history and the yield is reduced. On the other hand, in the methods disclosed in Patent Document 2 and Patent Document 3, there is a problem that the irradiation area of the laser light is narrow and the entire semiconductor member is repeatedly irradiated multiple times, which takes time; and the focus of the laser light is controlled. For scanning and irradiation, the steps become complicated; and expensive devices are required.
本發明是鑑於此種實際情況而成者,其目的在於提供一種可容易地將經暫時固定的半導體構件自支撐構件分離,且可降低將經暫時固定的半導體構件自支撐構件分離時所需要的照射能量的半導體裝置的製造方法。另外,本發明的目的在於提供一種可有效用作暫時固定材的暫時固定材用積層膜。The present invention is made in view of the actual situation, and its purpose is to provide a method that can easily separate a temporarily fixed semiconductor member from a supporting member, and can reduce the need for separating the temporarily fixed semiconductor member from a supporting member. A method of manufacturing a semiconductor device that irradiates energy. In addition, an object of the present invention is to provide a laminated film for a temporary fixing material that can be effectively used as a temporary fixing material.
[解決課題之手段] 本發明者等人進行了努力研究,結果發現,藉由在支撐構件與吸收光而產生熱的暫時固定材層之間設置絕熱層,可降低將經暫時固定的半導體構件自支撐構件分離時所需要的照射能量,從而完成了本發明。[Means to solve the problem] The inventors of the present invention conducted diligent studies and found that by providing a heat insulating layer between the support member and the temporary fixing material layer that absorbs light and generates heat, it is possible to reduce the cost of separating the temporarily fixed semiconductor member from the supporting member. The irradiation energy required to complete the present invention.
本發明的一方面提供一種半導體裝置的製造方法,包括:準備步驟,準備依序積層有支撐構件、絕熱層、吸收光而產生熱的暫時固定材層、以及半導體構件的積層體;以及分離步驟,對積層體中的暫時固定材層照射光而將半導體構件自支撐構件分離。藉由在支撐構件與吸收光而產生熱的暫時固定材層之間設置絕熱層而可減少將經暫時固定的半導體構件自支撐構件分離時所需要的施加電壓的理由未必一定,但本發明者等人認為在於:此會抑制自暫時固定材層向支撐構件的熱擴散,並促進暫時固定材層的溫度上升。An aspect of the present invention provides a method of manufacturing a semiconductor device, including: a preparation step of preparing a laminated body in which a support member, a heat insulating layer, a temporary fixing material layer that absorbs light and generates heat, and a semiconductor member are sequentially laminated; and a separation step , The temporary fixing material layer in the laminate is irradiated with light to separate the semiconductor member from the supporting member. The reason why a heat insulating layer is provided between the support member and the temporary fixing material layer that absorbs light and generates heat can reduce the applied voltage required when separating the temporarily fixed semiconductor member from the support member. However, the present inventors It is believed by others that this suppresses the heat diffusion from the temporary fixing material layer to the support member and promotes the temperature rise of the temporary fixing material layer.
暫時固定材層亦可具有吸收光而產生熱的光吸收層以及包含硬化性樹脂成分的硬化物的樹脂硬化物層。此時,積層體可為依序積層有支撐構件、絕熱層、光吸收層、樹脂硬化物層、及半導體構件的積層體。The temporary fixing material layer may have a light absorption layer that absorbs light and generates heat, and a cured resin layer containing a cured product of a curable resin component. In this case, the laminated body may be a laminated body in which a support member, a heat insulating layer, a light absorption layer, a cured resin layer, and a semiconductor member are sequentially laminated.
分離步驟中的所述光的光源可為氙燈。分離步驟中的光可為至少包含紅外光的光。The light source of the light in the separation step may be a xenon lamp. The light in the separation step may be light containing at least infrared light.
分離步驟可為經由支撐構件對暫時固定材層照射光的步驟。The separation step may be a step of irradiating the temporary fixing material layer with light via the supporting member.
本發明的另一方面提供一種用於將半導體構件暫時固定於支撐構件的暫時固定材用積層膜。Another aspect of the present invention provides a laminated film for temporary fixing material for temporarily fixing a semiconductor member to a supporting member.
該暫時固定材用積層膜的一態樣是具有絕熱層(例如,包含硬化性樹脂成分的硬化物的絕熱層)以及吸收光而產生熱的光吸收層的積層膜。該積層膜例如亦可具有以下的構成(A)、構成(B)、或構成(C)中的任一構成。再者,樹脂層為包含硬化性樹脂成分的層。 構成(A):絕熱層/光吸收層/樹脂層 構成(B):支撐構件/絕熱層/光吸收層/樹脂層 構成(C):支撐構件/絕熱層/光吸收層One aspect of this laminated film for temporary fixing materials is a laminated film having a heat insulating layer (for example, a heat insulating layer of a cured product containing a curable resin component) and a light absorbing layer that absorbs light and generates heat. This laminated film may have any one of the following structure (A), structure (B), or structure (C), for example. In addition, the resin layer is a layer containing a curable resin component. Composition (A): Thermal insulation layer/light absorption layer/resin layer Composition (B): support member/heat insulation layer/light absorption layer/resin layer Composition (C): Supporting member/Insulation layer/Light absorption layer
該暫時固定材用積層膜的另一態樣是具有包含硬化性樹脂成分的絕熱樹脂層以及吸收光而產生熱的光吸收層的積層膜。該積層膜例如亦可具有以下的構成(D)、構成(E)、或構成(F)中的任一構成。再者,樹脂層為包含硬化性樹脂成分的層。 構成(D):絕熱樹脂層/光吸收層/樹脂層 構成(E):支撐構件/絕熱樹脂層/光吸收層/樹脂層 構成(F):支撐構件/絕熱樹脂層/光吸收層Another aspect of the laminated film for temporary fixing materials is a laminated film having a heat-insulating resin layer containing a curable resin component and a light-absorbing layer that absorbs light and generates heat. This laminated film may have any of the following structure (D), structure (E), or structure (F), for example. In addition, the resin layer is a layer containing a curable resin component. Composition (D): Heat-insulating resin layer/light absorption layer/resin layer Composition (E): Supporting member/Insulation resin layer/Light absorption layer/Resin layer Composition (F): Supporting member/Insulation resin layer/Light absorption layer
再者,絕熱樹脂層是指包含硬化性樹脂成分,且藉由使所述硬化性樹脂成分硬化而可形成絕熱層的層。即,絕熱樹脂層是可稱為絕熱層的前驅物的層。絕熱層可為包含絕熱樹脂層中的硬化性樹脂成分的硬化物的層。In addition, the heat insulating resin layer refers to a layer that contains a curable resin component and can form a heat insulating layer by hardening the curable resin component. That is, the heat-insulating resin layer is a layer that can be called a precursor of the heat-insulating layer. The heat insulating layer may be a layer containing a cured product of the curable resin component in the heat insulating resin layer.
[發明的效果] 根據本發明,提供一種可容易地將經暫時固定的半導體構件自支撐構件分離,且可降低將經暫時固定的半導體構件自支撐構件分離時所需要的照射能量的半導體裝置的製造方法。另外,本發明提供一種可有效用作暫時固定材的暫時固定材用積層膜。[Effects of the invention] According to the present invention, there is provided a method for manufacturing a semiconductor device that can easily separate a temporarily fixed semiconductor member from a supporting member, and can reduce the irradiation energy required when separating the temporarily fixed semiconductor member from the supporting member. In addition, the present invention provides a laminated film for a temporary fixing material that can be effectively used as a temporary fixing material.
以下,一面適宜參照圖式一面對本發明的實施形態進行說明。其中,本發明並不限定於以下的實施形態。於以下的實施形態中,除特別明示的情況以外,其構成要素(亦包含步驟等)並非必需。各圖中的構成要素的大小是概念上的大小,構成要素間的大小的相對關係並不限定於各圖所示者。Hereinafter, the embodiments of the present invention will be described with reference to the drawings as appropriate. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including steps, etc.) are not essential unless otherwise specified. The size of the component elements in each figure is a conceptual size, and the relative size of the component elements is not limited to that shown in each figure.
本說明書中的數值及其範圍亦同樣,並非限制本發明。於本說明書中使用「~」所表示的數值範圍表示包含「~」的前後所記載的數值分別作為最小值及最大值的範圍。於本說明書中階段性地記載的數值範圍中,一個數值範圍中所記載的上限值或下限值亦可置換為另一階段的記載的數值範圍的上限值或下限值。另外,於本說明書中所記載的數值範圍中,該數值範圍的上限值或下限值亦可置換為實施例中所示的值。The numerical values and ranges in this specification are the same, and do not limit the present invention. In this specification, the numerical range indicated by "~" means a range that includes the numerical values described before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described stepwise in this specification, the upper limit or lower limit described in one numerical range may be replaced with the upper limit or lower limit of the numerical range described in another step. In addition, in the numerical range described in this specification, the upper limit or lower limit of the numerical range may be replaced with the value shown in the examples.
於本說明書中,(甲基)丙烯酸是指丙烯酸或與其對應的甲基丙烯酸。(甲基)丙烯酸酯、(甲基)丙烯醯基等其他的類似表述亦同樣。In this specification, (meth)acrylic acid means acrylic acid or its corresponding methacrylic acid. The same applies to other similar expressions such as (meth)acrylate and (meth)acryloyl.
[半導體裝置的製造方法] 本實施形態的半導體裝置的製造方法包括:準備步驟,準備依序積層有支撐構件、絕熱層、吸收光而產生熱的暫時固定材層(以下,有時簡稱為「暫時固定材層」)、以及半導體構件的積層體;以及分離步驟,對積層體中的暫時固定材層照射光而將半導體構件自支撐構件分離。[Method of Manufacturing Semiconductor Device] The manufacturing method of the semiconductor device of the present embodiment includes a preparation step of preparing a support member, a heat insulating layer, and a temporary fixing material layer that absorbs light and generates heat (hereinafter, sometimes referred to as "temporary fixing material layer"), And a laminated body of the semiconductor member; and a separation step of irradiating light to the temporary fixing material layer in the laminated body to separate the semiconductor member from the supporting member.
<積層體的準備步驟>
圖1(a)、圖1(b)是用以說明本發明的半導體裝置的製造方法的一實施形態的示意剖面圖,圖1(a)及圖1(b)是表示各步驟的示意剖面圖。如圖1(a)所示,於積層體的準備步驟中,準備依序積層有支撐構件10、絕熱層70、暫時固定材層30c、以及半導體構件40的積層體100。<Preparation steps of laminated body>
1(a) and 1(b) are schematic cross-sectional views for explaining an embodiment of the method of manufacturing a semiconductor device of the present invention, and FIGS. 1(a) and 1(b) are schematic cross-sectional views showing each step Figure. As shown in FIG. 1( a ), in the preparation step of the laminate, a
支撐構件10並無特別限制,例如可為玻璃基板(導熱率:1 W/m・K)、環氧樹脂基板(導熱率:0.2 W/m・K)等樹脂基板、矽晶圓(導熱率:168 W/m・K)、銅薄膜(導熱率:398 W/m・K)等金屬薄膜等。支撐構件10可為不妨礙光的透射(使光透射)的基板,亦可為玻璃基板。The supporting
支撐構件10的厚度例如可為0.1 mm~2.0 mm。若厚度為0.1 mm以上,則有操作變容易的傾向,若厚度為2.0 mm以下,則有可抑制材料費的傾向。The thickness of the supporting
絕熱層70並無特別限制,但就抑制自後述的暫時固定材層向支撐構件的熱擴散,並促進暫時固定材層的溫度上升的觀點而言,絕熱層70可為導熱率比支撐構件10低的層(包含導熱率比支撐構件10的材質低的材質的層)。絕熱層70可根據所使用的支撐構件10的種類,適宜選擇可形成導熱率比支撐構件10低的層者來應用。於支撐構件10為玻璃基板的情況下,絕熱層70例如可為包含丙烯腈-丁二烯-苯乙烯(acrylonitrile butadiene styrene,ABS)樹脂、環氧樹脂、聚乙烯、酚樹脂、聚醯亞胺、苯乙烯橡膠等樹脂、多孔質金屬、陶瓷等的層。另外,於支撐構件10為玻璃基板的情況下,可將後述的暫時固定材層中的包含硬化性樹脂成分的硬化物的樹脂硬化物層用作絕熱層70。即,絕熱層70可為包含硬化性樹脂成分的硬化物的層。另外,絕熱層70可為不妨礙光的透射(使光透射)的層。The
就抑制自後述的暫時固定材層向支撐構件的熱擴散,並促進暫時固定材層的溫度上升的觀點而言,絕熱層70的厚度可為0.1 μm~500 μm、0.3 μm~200 μm、或0.5 μm~100 μm。From the viewpoint of suppressing the heat diffusion from the temporary fixing material layer to the supporting member described later and promoting the temperature rise of the temporary fixing material layer, the thickness of the
於支撐構件10上形成絕熱層70的方法並無特別限制,可應用公知的方法。例如,於將後述的暫時固定材層中的包含硬化性樹脂成分的硬化物的樹脂硬化物層用作絕熱層70的情況下,可藉由與後述的樹脂層34的形成方法相同的方法形成樹脂層(以下,有時將可形成絕熱層的層、且為包含硬化前的硬化性樹脂成分的層稱為「絕熱樹脂層」),並使絕熱樹脂層中的硬化性樹脂成分硬化,藉此來形成包含硬化性樹脂成分的硬化物的絕熱層70。於使用利用溶劑進行了稀釋的硬化性樹脂成分的清漆的情況下,可藉由將硬化性樹脂成分塗佈於支撐構件10,並對溶劑進行加熱乾燥而去除,使絕熱樹脂層中的硬化性樹脂成分硬化來形成。另外,與後述的樹脂層34同樣地,絕熱層70亦可藉由使用包含硬化性樹脂成分的硬化性樹脂成分膜製作絕熱樹脂層,使絕熱樹脂層中的硬化性樹脂成分硬化來形成。於將包含硬化性樹脂成分的硬化物的樹脂硬化物層用作絕熱層70的情況下,可於絕熱層70上形成暫時固定材層30c之前使絕熱樹脂層的硬化性樹脂成分硬化,亦可於經由絕熱樹脂層及暫時固定材前驅物層30而在支撐構件10上配置半導體構件40之後,使絕熱樹脂層中的硬化性樹脂成分及暫時固定材前驅物層30中的硬化性樹脂成分一併硬化。The method of forming the
暫時固定材層30c為用以將支撐構件10與半導體構件40暫時固定的層,且為於照射光時吸收光而產生熱的層。成為暫時固定材層30c的吸收對象的光可為包含紅外光、可見光、或紫外光的任一者的光。就後述的光吸收層可效率良好地產生熱而言,成為暫時固定材層30c的吸收對象的光可為至少包含紅外光的光。另外,暫時固定材層30c可為於照射包含紅外光的光時吸收紅外光而產生熱的層。The temporary
圖1(a)所示的積層體100例如可藉由以下方式來製作:於設置有絕熱層70的支撐構件10中,於絕熱層70上形成暫時固定材前驅物層,於暫時固定材前驅物層上配置半導體構件,並使暫時固定材前驅物層中的硬化性樹脂成分硬化來形成暫時固定材層30c。The
暫時固定材前驅物層亦可具有吸收光而產生熱的光吸收層以及包含硬化性樹脂成分的樹脂層。圖2(a)及圖2(b)是表示暫時固定材前驅物層的一實施形態的示意剖面圖。作為暫時固定材前驅物層30,於具有光吸收層32以及樹脂層34的情況下,其構成並無特別限制,例如可列舉:自絕熱層70側起依序具有光吸收層32以及樹脂層34的構成(圖2(a))、自絕熱層70側起依序具有光吸收層32、樹脂層34以及光吸收層32的構成(圖2(b))等。該些中,暫時固定材前驅物層30可為自絕熱層70側起依序具有光吸收層32以及樹脂層34的構成(圖2(a))。以下,主要對使用圖2(a)所示的構成的暫時固定材前驅物層30的態樣進行詳細說明。The temporary fixing material precursor layer may have a light absorption layer that absorbs light and generates heat, and a resin layer containing a curable resin component. 2(a) and 2(b) are schematic cross-sectional views showing one embodiment of a precursor layer of a temporary fixing material. As the temporary fixing
光吸收層32的一態樣為包含吸收光而產生熱的導電體(以下,有時簡稱為「導電體」)的層(以下,有時稱為「導電體層」)。構成此種導電體層的導電體只要為吸收光而產生熱的導電體,則並無特別限制,可為吸收紅外光而產生熱的導電體。作為導電體,例如可列舉:鉻、銅、鈦、銀、鉑、金等金屬、鎳-鉻、不鏽鋼、銅-鋅等合金、氧化銦錫(ITO)、氧化鋅、氧化鈮等金屬氧化物、導電性碳等碳材料等。該些亦可單獨使用一種或者將兩種以上組合而使用。該些中,導電體可為鉻、鈦、銅、鋁、銀、金、鉑、或碳。One aspect of the light-absorbing
光吸收層32亦可包含多個導電體層。作為此種光吸收層,例如可列舉包含設置於支撐構件10上的第一導電體層、以及設置於第一導電體層的與支撐構件10為相反側的面上的第二導電體層的光吸收層等。就與支撐構件(例如,玻璃)的密接性、成膜性、導熱性、低熱容量等觀點而言,第一導電體層中的導電體可為鈦。就高膨脹係數、高導熱等觀點而言,第二導電體層中的導電體可為銅、鋁、銀、金、或鉑,該些中,亦較佳為銅或鋁。The
作為光吸收層32的導電體層可藉由真空蒸鍍、濺鍍等物理氣相沈積(physical vapor deposition,PVD)、電解鍍敷、無電解鍍敷、電漿化學蒸鍍等化學氣相沈積(chemical vapor deposition,CVD),將該些導電體直接形成於支撐構件10上。該些中,由於可大面積地形成導電體層,故導電體層可使用物理氣相沈積來形成,亦可使用濺鍍或真空蒸鍍來形成。The conductor layer as the
就輕剝離性的觀點而言,光吸收層32的一態樣的厚度可為1 nm~5000 nm(0.001 μm~5 μm)或50 nm~3000 nm(0.05 μm~3 μm)。於光吸收層32包含第一導電體層與第二導電體層的情況下,第一導電體層的厚度可為1 nm~1000 nm、5 nm~500 nm、或10 nm~100 nm,第二導電體層的厚度可為1 nm~5000 nm、10 nm~500 nm、30 nm~300 nm、或50 nm~200 nm。From the viewpoint of light peelability, the thickness of one aspect of the
光吸收層32的另一態樣為含有包含吸收光而產生熱的導電性粒子的硬化性樹脂組成物的硬化物的層。硬化性樹脂組成物可含有導電性粒子及硬化性樹脂成分。Another aspect of the
導電性粒子只要為吸收光而產生熱者,則並無特別限制,可為吸收紅外光而產生熱者。導電性粒子例如可為選自由銀粉、銅粉、鎳粉、鋁粉、鉻粉、鐵粉、黃銅粉、錫粉、鈦合金、金粉、合金銅粉、氧化銅粉、氧化銀粉、氧化錫粉、及導電性碳(carbon)粉所組成的群組中的至少一種。就操作性及安全性的觀點而言,導電性粒子可為選自由銀粉、銅粉、氧化銀粉、氧化銅粉、及碳(carbon)粉所組成的群組中的至少一種。另外,導電性粒子亦可為將樹脂或金屬設為核並藉由鎳、金、銀等金屬對該核進行鍍敷而成的粒子。進而,就與溶劑的分散性的觀點而言,導電性粒子亦可為其表面藉由表面處理劑進行了處理的粒子。The conductive particles are not particularly limited as long as they absorb light and generate heat, and they may absorb infrared light and generate heat. The conductive particles can be selected from, for example, silver powder, copper powder, nickel powder, aluminum powder, chromium powder, iron powder, brass powder, tin powder, titanium alloy, gold powder, alloy copper powder, copper oxide powder, silver oxide powder, tin oxide At least one of the group consisting of powder and conductive carbon powder. From the viewpoint of operability and safety, the conductive particles may be at least one selected from the group consisting of silver powder, copper powder, silver oxide powder, copper oxide powder, and carbon powder. In addition, the conductive particles may be particles obtained by using a resin or a metal as a core and plating the core with a metal such as nickel, gold, or silver. Furthermore, from the viewpoint of dispersibility with a solvent, the conductive particles may be particles whose surfaces are treated with a surface treatment agent.
相對於硬化性樹脂成分的總量100質量份,導電性粒子的含量可為10質量份~90質量份。再者,硬化性樹脂成分中不包含後述的有機溶劑。導電性粒子的含量亦可為15質量份以上、20質量份以上、或25質量份以上。導電性粒子的含量亦可為80質量份以下或50質量份以下。The content of the conductive particles may be 10 parts by mass to 90 parts by mass relative to 100 parts by mass of the total amount of curable resin components. In addition, the organic solvent described later is not included in the curable resin component. The content of the conductive particles may be 15 parts by mass or more, 20 parts by mass or more, or 25 parts by mass or more. The content of the conductive particles may be 80 parts by mass or less or 50 parts by mass or less.
硬化性樹脂成分可為藉由熱或光而進行硬化的硬化性樹脂成分。硬化性樹脂成分例如可包含熱硬化性樹脂、硬化劑、及硬化促進劑。熱硬化性樹脂、硬化劑、及硬化促進劑例如可使用後述的樹脂層中的硬化性樹脂成分中所例示者等。相對於硬化性樹脂組成物的導電性粒子以外的成分的總量100質量份,熱硬化性樹脂及硬化劑的合計含量可為10質量份~90質量份。相對於熱硬化性樹脂及硬化劑的總量100質量份,硬化促進劑的含量可為0.01質量份~5質量份。The curable resin component may be a curable resin component that is cured by heat or light. The curable resin component may include, for example, a thermosetting resin, a curing agent, and a curing accelerator. The thermosetting resin, curing agent, and curing accelerator may be those exemplified in the curable resin component in the resin layer described later. The total content of the thermosetting resin and the curing agent may be 10 parts by mass to 90 parts by mass relative to 100 parts by mass of the total amount of components other than the conductive particles of the curable resin composition. The content of the hardening accelerator may be 0.01 to 5 parts by mass relative to 100 parts by mass of the total amount of the thermosetting resin and hardener.
光吸收層32可由包含吸收光而產生熱的導電性粒子的硬化性樹脂組成物形成。硬化性樹脂組成物亦可作為利用有機溶劑進行了稀釋的硬化性樹脂組成物的清漆來使用。作為有機溶劑,例如可列舉:丙酮、乙酸乙酯、乙酸丁酯、甲基乙基酮(methyl ethyl ketone,MEK)等。該些有機溶劑亦可單獨使用一種或者將兩種以上組合而使用。清漆中的固體成分濃度以清漆的總質量為基準而可為10質量%~80質量%。The
光吸收層32可藉由將硬化性樹脂組成物直接塗佈於支撐構件10上而形成。於使用利用有機溶劑進行稀釋的硬化性樹脂組成物的清漆的情況下,可藉由將硬化性樹脂組成物塗佈於支撐構件10上並對溶劑進行加熱乾燥而去除來形成。The
就輕剝離性的觀點而言,光吸收層32的另一態樣的厚度可為1 nm~5000 nm(0.001 μm~5 μm)或50 nm~3000 nm(0.05 μm~3 μm)。From the viewpoint of light peelability, the thickness of another aspect of the
繼而,將樹脂層34形成於光吸收層32上。Then, the
樹脂層34為不含有導電性粒子的層,且為包含藉由熱或光而進行硬化的硬化性樹脂成分的層。樹脂層34亦可為包含硬化性樹脂成分的層。硬化性樹脂成分可為藉由熱或光而進行硬化的硬化性樹脂成分。以下,對樹脂層34為包含硬化性樹脂成分的層的情況進行詳細說明。The
硬化性樹脂成分可包含熱塑性樹脂、聚合性單體、及聚合起始劑。The curable resin component may include a thermoplastic resin, a polymerizable monomer, and a polymerization initiator.
熱塑性樹脂可為具有熱塑性的樹脂、或者至少於未硬化狀態下具有熱塑性且於加熱後形成交聯結構的樹脂。作為熱塑性樹脂,例如可列舉:彈性體、聚碳酸酯、聚苯硫醚、聚醚碸、聚醚醯亞胺、聚醯亞胺、石油樹脂、酚醛清漆樹脂等。該些可單獨使用一種或將兩種以上組合而使用。該些中,就凸塊埋入性及低溫貼附性的觀點而言,熱塑性樹脂可為彈性體。The thermoplastic resin may be a resin having thermoplasticity, or a resin having thermoplasticity at least in an uncured state and forming a crosslinked structure after heating. Examples of thermoplastic resins include elastomers, polycarbonates, polyphenylene sulfide, polyether agglomerates, polyether imines, polyimides, petroleum resins, and novolac resins. These can be used individually by 1 type or in combination of 2 or more types. Among them, the thermoplastic resin may be an elastomer from the viewpoint of bump embedding properties and low-temperature adhesion properties.
作為彈性體的具體例,可列舉:乙烯-丙烯共聚物彈性體、乙烯-1-丁烯共聚物彈性體、乙烯-丙烯-1-丁烯共聚物彈性體、乙烯-1-己烯共聚物彈性體、乙烯-1-辛烯共聚物彈性體、乙烯-苯乙烯共聚物彈性體、乙烯-降冰片烯共聚物彈性體、丙烯-1-丁烯共聚物彈性體、乙烯-丙烯-非共軛二烯共聚物彈性體、乙烯-1-丁烯-非共軛二烯共聚物彈性體、乙烯-丙烯-1-丁烯-非共軛二烯共聚物彈性體、聚異戊二烯、聚丁二烯、羧基末端聚丁二烯、羥基末端聚丁二烯、1,2-聚丁二烯、羧基末端1,2-聚丁二烯、羥基末端1,2-聚丁二烯、丙烯酸橡膠、苯乙烯-丁二烯橡膠、羥基末端苯乙烯-丁二烯橡膠、丙烯腈-丁二烯橡膠、於聚合物末端含有羧基、羥基、(甲基)丙烯醯基或嗎啉基的丙烯腈-丁二烯橡膠、羧基化腈橡膠、羥基末端聚(氧丙烯)、烷氧基矽烷基末端聚(氧丙烯)、聚(氧基四亞甲基)二醇、聚烯烴二醇、聚-ε-己內酯等。該些彈性體亦可實施氫化處理。該些中,彈性體可為包含源自苯乙烯的單體單元的彈性體。Specific examples of the elastomer include: ethylene-propylene copolymer elastomer, ethylene-1-butene copolymer elastomer, ethylene-propylene-1-butene copolymer elastomer, and ethylene-1-hexene copolymer Elastomers, ethylene-1-octene copolymer elastomer, ethylene-styrene copolymer elastomer, ethylene-norbornene copolymer elastomer, propylene-1-butene copolymer elastomer, ethylene-propylene-non-copolymer Conjugated diene copolymer elastomer, ethylene-1-butene-non-conjugated diene copolymer elastomer, ethylene-propylene-1-butene-non-conjugated diene copolymer elastomer, polyisoprene, Polybutadiene, carboxyl-terminated polybutadiene, hydroxyl-terminated polybutadiene, 1,2-polybutadiene, carboxyl-terminated 1,2-polybutadiene, hydroxyl-terminated 1,2-polybutadiene, Acrylic rubber, styrene-butadiene rubber, hydroxyl-terminated styrene-butadiene rubber, acrylonitrile-butadiene rubber, containing carboxyl, hydroxyl, (meth)acryloyl or morpholino at the end of the polymer Acrylonitrile-butadiene rubber, carboxylated nitrile rubber, hydroxyl-terminated poly(oxypropylene), alkoxysilyl-terminated poly(oxypropylene), poly(oxytetramethylene) glycol, polyolefin glycol, Poly-ε-caprolactone and so on. These elastomers can also be hydrogenated. Among these, the elastomer may be an elastomer containing a monomer unit derived from styrene.
熱塑性樹脂的Tg可為-100℃~500℃、-50℃~300℃、或-50℃~50℃。若熱塑性樹脂的Tg為500℃以下,則有於形成膜狀的暫時固定材時,容易確保柔軟性,可提高低溫貼附性的傾向。若熱塑性樹脂的Tg為-100℃以上,則有於形成膜狀的暫時固定材時,可抑制由柔軟性變得過高引起的操作性及剝離性的降低的傾向。The Tg of the thermoplastic resin may be -100°C to 500°C, -50°C to 300°C, or -50°C to 50°C. When the Tg of the thermoplastic resin is 500°C or less, it tends to be easy to ensure flexibility when forming a film-like temporary fixing material, and the low-temperature adhesiveness can be improved. When the Tg of the thermoplastic resin is -100°C or higher, when forming a film-like temporary fixing material, it is possible to suppress the decrease in handleability and releasability caused by excessively high flexibility.
熱塑性樹脂的Tg為藉由示差掃描熱量測定(differential scanning calorimetry,DSC)而獲得的中間點玻璃轉移溫度。具體而言,熱塑性樹脂的Tg為於升溫速度10℃/min、測定溫度:-80℃~80℃的條件下測定熱量變化,藉由依據日本工業標準(Japanese Industrial Standards,JIS)K 7121的方法而算出的中間點玻璃轉移溫度。The Tg of the thermoplastic resin is the midpoint glass transition temperature obtained by differential scanning calorimetry (DSC). Specifically, the Tg of the thermoplastic resin is measured at a temperature increase rate of 10°C/min and a measurement temperature of -80°C to 80°C, by a method based on Japanese Industrial Standards (JIS) K 7121 And the calculated intermediate point glass transition temperature.
熱塑性樹脂的重量平均分子量(Mw)可為1萬~500萬或10萬~200萬。若重量平均分子量為1萬以上,則有容易確保所形成的暫時固定材層的耐熱性的傾向。若重量平均分子量為500萬以下,則有於形成膜狀的暫時固定材層或樹脂層時容易抑制流動性(flow)的降低及貼附性的降低的傾向。再者,重量平均分子量是利用凝膠滲透層析法(gel permeation chromatography,GPC)並使用利用標準聚苯乙烯的校準曲線而得的聚苯乙烯換算值。The weight average molecular weight (Mw) of the thermoplastic resin can be 10,000 to 5 million or 100,000 to 2 million. If the weight average molecular weight is 10,000 or more, it tends to be easy to ensure the heat resistance of the formed temporary fixing material layer. If the weight average molecular weight is 5 million or less, when forming a film-like temporary fixing material layer or a resin layer, it tends to easily suppress a decrease in flow and adhesiveness. In addition, the weight average molecular weight is a polystyrene conversion value obtained by using gel permeation chromatography (GPC) and using a calibration curve using standard polystyrene.
相對於硬化性樹脂成分的總量100質量份,熱塑性樹脂的含量可為10質量份~90質量份。熱塑性樹脂的含量可為30質量份以上、50質量份以上、或70質量份以上,且可為88質量份以下、85質量份以下、或82質量份以下。若熱塑性樹脂的含量處於所述範圍,則有暫時固定材層的薄膜形成性及平坦性更優異的傾向。The content of the thermoplastic resin may be 10 parts by mass to 90 parts by mass relative to 100 parts by mass of the total amount of curable resin components. The content of the thermoplastic resin may be 30 parts by mass or more, 50 parts by mass or more, or 70 parts by mass or more, and may be 88 parts by mass or less, 85 parts by mass or less, or 82 parts by mass or less. If the content of the thermoplastic resin is in the above range, the film forming property and flatness of the temporary fixing material layer tend to be more excellent.
聚合性單體只要為藉由加熱或紫外光等的照射而進行聚合者,則並無特別限制。就材料的選擇性及獲取的容易度的觀點而言,聚合性單體例如可為具有乙烯性不飽和基等聚合性官能基的化合物。作為聚合性單體,例如可列舉:(甲基)丙烯酸酯、偏二鹵乙烯、乙烯基醚、乙烯基酯、乙烯基吡啶、乙烯基醯胺、芳基化乙烯基等。該些中,聚合性單體可為(甲基)丙烯酸酯。(甲基)丙烯酸酯亦可為單官能(一官能)、二官能、或三官能以上的任一種,但就獲得充分的硬化性的觀點而言,可為二官能以上的(甲基)丙烯酸酯。The polymerizable monomer is not particularly limited as long as it is polymerized by heating or irradiation with ultraviolet light or the like. From the viewpoint of material selectivity and ease of acquisition, the polymerizable monomer may be, for example, a compound having a polymerizable functional group such as an ethylenically unsaturated group. Examples of polymerizable monomers include (meth)acrylate, vinylidene halide, vinyl ether, vinyl ester, vinyl pyridine, vinyl amide, and arylated vinyl. Among these, the polymerizable monomer may be (meth)acrylate. The (meth)acrylate may be any one of monofunctional (monofunctional), difunctional, or trifunctional or higher, but from the viewpoint of obtaining sufficient curability, it may be (meth)acrylic acid having a bifunctional or higher ester.
作為單官能(甲基)丙烯酸酯,例如可列舉:(甲基)丙烯酸;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸丁氧基乙酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛基庚酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸-2-羥基乙酯、(甲基)丙烯酸-2-羥基丙酯、(甲基)丙烯酸-3-氯-2-羥基丙酯、(甲基)丙烯酸-2-羥基丁酯、甲氧基聚乙二醇(甲基)丙烯酸酯、乙氧基聚乙二醇(甲基)丙烯酸酯、甲氧基聚丙二醇(甲基)丙烯酸酯、乙氧基聚丙二醇(甲基)丙烯酸酯、丁二酸單(2-(甲基)丙烯醯氧基乙基)酯等脂肪族(甲基)丙烯酸酯;(甲基)丙烯酸苄酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸鄰聯苯酯、(甲基)丙烯酸-1-萘酯、(甲基)丙烯酸-2-萘酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸對異丙苯基苯氧基乙酯、(甲基)丙烯酸鄰苯基苯氧基乙酯、(甲基)丙烯酸-1-萘氧基乙酯、(甲基)丙烯酸-2-萘氧基乙酯、苯氧基聚乙二醇(甲基)丙烯酸酯、壬基苯氧基聚乙二醇(甲基)丙烯酸酯、苯氧基聚丙二醇(甲基)丙烯酸酯、(甲基)丙烯酸-2-羥基-3-苯氧基丙酯、(甲基)丙烯酸-2-羥基-3-(鄰苯基苯氧基)丙酯、(甲基)丙烯酸-2-羥基-3-(1-萘氧基)丙酯、(甲基)丙烯酸-2-羥基-3-(2-萘氧基)丙酯等芳香族(甲基)丙烯酸酯等。Examples of monofunctional (meth)acrylates include: (meth)acrylic acid; methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isopropyl (meth)acrylate Butyl ester, tertiary butyl (meth)acrylate, butoxyethyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, 2-ethyl (meth)acrylate Hexyl ester, heptyl (meth)acrylate, octylheptyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, (meth) )-2-hydroxypropyl acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, methoxy polyethylene glycol (meth)acrylate , Ethoxy polyethylene glycol (meth) acrylate, methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate, succinic acid mono (2-(methyl) Aliphatic (meth)acrylates such as acryloxyethyl); benzyl (meth)acrylate, phenyl (meth)acrylate, o-biphenyl (meth)acrylate, (meth)acrylic acid- 1-naphthyl ester, 2-naphthyl (meth)acrylate, phenoxyethyl (meth)acrylate, p-cumyl phenoxyethyl (meth)acrylate, o-phenyl (meth)acrylate Phenoxy ethyl, 1-naphthoxy ethyl (meth)acrylate, 2-naphthoxy ethyl (meth)acrylate, phenoxy polyethylene glycol (meth)acrylate, nonyl Phenoxy polyethylene glycol (meth)acrylate, phenoxy polypropylene glycol (meth)acrylate, (meth)acrylic acid-2-hydroxy-3-phenoxypropyl ester, (meth)acrylic acid -2-Hydroxy-3-(o-phenylphenoxy)propyl ester, (meth)acrylic acid-2-hydroxy-3-(1-naphthyloxy)propyl ester, (meth)acrylic acid-2-hydroxy- Aromatic (meth)acrylates such as 3-(2-naphthyloxy)propyl ester and the like.
作為二官能(甲基)丙烯酸酯,例如可列舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、四丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、乙氧基化聚丙二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、3-甲基-1,5-戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、2-丁基-2-乙基-1,3-丙二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、三環癸烷二甲醇(甲基)丙烯酸酯、乙氧基化2-甲基-1,3-丙二醇二(甲基)丙烯酸酯等脂肪族(甲基)丙烯酸酯;乙氧基化雙酚A二(甲基)丙烯酸酯、丙氧基化雙酚A二(甲基)丙烯酸酯、乙氧基化丙氧基化雙酚A二(甲基)丙烯酸酯、乙氧基化雙酚F二(甲基)丙烯酸酯、丙氧基化雙酚F二(甲基)丙烯酸酯、乙氧基化丙氧基化雙酚F二(甲基)丙烯酸酯、乙氧基化芴型二(甲基)丙烯酸酯、丙氧基化芴型二(甲基)丙烯酸酯、乙氧基化丙氧基化芴型二(甲基)丙烯酸酯等芳香族(甲基)丙烯酸酯等。As difunctional (meth)acrylates, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol Ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylic acid Ester, tetrapropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, ethoxylated polypropylene glycol di(meth)acrylate, 1,3-butanediol di(meth)acrylate , 1,4-butanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1, 6-hexanediol di(meth)acrylate, 2-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate , 1,10-decanediol di(meth)acrylate, glycerol di(meth)acrylate, tricyclodecane dimethanol (meth)acrylate, ethoxylated 2-methyl-1,3 -Aliphatic (meth)acrylates such as propylene glycol di(meth)acrylate; ethoxylated bisphenol A di(meth)acrylate, propoxylated bisphenol A di(meth)acrylate, ethyl Oxylated propoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol F di(meth)acrylate, propoxylated bisphenol F di(meth)acrylate, ethoxylate Alkylated propoxylated bisphenol F di(meth)acrylate, ethoxylated fluorene type di(meth)acrylate, propoxylated fluorene type di(meth)acrylate, ethoxylated propylene Aromatic (meth)acrylates such as oxyfluorene type di(meth)acrylate.
作為三官能以上的多官能(甲基)丙烯酸酯,例如可列舉:三羥甲基丙烷三(甲基)丙烯酸酯、乙氧基化三羥甲基丙烷三(甲基)丙烯酸酯、丙氧基化三羥甲基丙烷三(甲基)丙烯酸酯、乙氧基化丙氧基化三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、乙氧基化季戊四醇三(甲基)丙烯酸酯、丙氧基化季戊四醇三(甲基)丙烯酸酯、乙氧基化丙氧基化季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、乙氧基化季戊四醇四(甲基)丙烯酸酯、丙氧基化季戊四醇四(甲基)丙烯酸酯、乙氧基化丙氧基化季戊四醇四(甲基)丙烯酸酯、二-三羥甲基丙烷四丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯等脂肪族(甲基)丙烯酸酯;苯酚酚醛清漆型環氧基(甲基)丙烯酸酯、甲酚酚醛清漆型環氧基(甲基)丙烯酸酯等芳香族環氧基(甲基)丙烯酸酯等。As trifunctional or higher polyfunctional (meth)acrylates, for example, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxy Alkylated trimethylolpropane tri(meth)acrylate, ethoxylated propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated pentaerythritol Tri(meth)acrylate, propoxylated pentaerythritol tri(meth)acrylate, ethoxylated propoxylated pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ethoxy Pentaerythritol tetra(meth)acrylate, propoxylated pentaerythritol tetra(meth)acrylate, ethoxylated propoxylated pentaerythritol tetra(meth)acrylate, di-trimethylolpropane tetraacrylate , Dipentaerythritol hexa(meth)acrylate and other aliphatic (meth)acrylates; phenol novolak type epoxy (meth)acrylate, cresol novolak type epoxy (meth)acrylate and other aromatics Group epoxy (meth)acrylate and so on.
該些(甲基)丙烯酸酯可單獨使用一種或將兩種以上組合而使用。進而,該些(甲基)丙烯酸酯亦可與其他聚合性單體組合而使用。These (meth)acrylates can be used individually by 1 type or in combination of 2 or more types. Furthermore, these (meth)acrylates can also be used in combination with other polymerizable monomers.
相對於硬化性樹脂成分的總量100質量份,聚合性單體的含量可為10質量份~90質量份。聚合性單體的含量亦可為12質量份以上、15質量份以上、或18質量份以上。若聚合性單體的含量相對於硬化性樹脂成分的總量100質量份而為10質量份以上,則有暫時固定材層的耐熱性優異的傾向。聚合性單體的含量亦可為70質量份以下、50質量份以下、或30質量份以下。若聚合性單體的含量相對於硬化性樹脂成分的總量100質量份而為90質量份以下,則有可抑制製程中的剝離、破損等的傾向。The content of the polymerizable monomer may be 10 parts by mass to 90 parts by mass relative to 100 parts by mass of the total amount of curable resin components. The content of the polymerizable monomer may be 12 parts by mass or more, 15 parts by mass or more, or 18 parts by mass or more. If the content of the polymerizable monomer is 10 parts by mass or more with respect to 100 parts by mass of the total amount of the curable resin component, the temporary fixing material layer tends to have excellent heat resistance. The content of the polymerizable monomer may be 70 parts by mass or less, 50 parts by mass or less, or 30 parts by mass or less. If the content of the polymerizable monomer is 90 parts by mass or less with respect to 100 parts by mass of the total amount of the curable resin component, there is a tendency that peeling, breakage, etc. in the process can be suppressed.
聚合起始劑只要為藉由加熱或紫外光等的照射而引發聚合者,則並無特別限制。例如於使用具有乙烯性不飽和基的化合物作為聚合性單體的情況下,聚合性起始劑亦可為熱自由基聚合起始劑或光自由基聚合起始劑。The polymerization initiator is not particularly limited as long as it initiates polymerization by heating or irradiation with ultraviolet light or the like. For example, when a compound having an ethylenically unsaturated group is used as a polymerizable monomer, the polymerizable initiator may be a thermal radical polymerization initiator or a photo radical polymerization initiator.
作為熱自由基聚合起始劑,例如可列舉:辛醯基過氧化物、月桂醯基過氧化物、硬脂基過氧化物、苯甲醯基過氧化物等二醯基過氧化物;過氧化三甲基乙酸第三丁酯、過氧化三甲基乙酸第三己酯、1,1,3,3-四甲基丁基過氧化-2-乙基己酸酯、2,5-二甲基-2,5-雙(2-乙基己醯基過氧基)己烷、第三己基過氧化-2-乙基己酸酯、第三丁基過氧化-2-乙基己酸酯、第三丁基過氧化異丁酸酯、第三己基過氧化異丙基單碳酸酯、第三丁基過氧化-3,5,5-三甲基己酸酯、第三丁基過氧化月桂酸酯、第三丁基過氧化異丙基單碳酸酯、第三丁基過氧化-2-乙基己基單碳酸酯、第三丁基過氧化苯甲酸酯、第三己基過氧化苯甲酸酯、2,5-二甲基-2,5-雙(苯甲醯基過氧基)己烷、第三丁基過氧化乙酸酯等過氧化酯;2,2'-偶氮雙異丁腈、2,2'-偶氮雙(2,4-二甲基戊腈)、2,2'-偶氮雙(4-甲氧基-2'-二甲基戊腈)等偶氮化合物等。As the thermal radical polymerization initiator, for example, diamino peroxides such as octyl peroxide, lauryl peroxide, stearyl peroxide, and benzyl peroxide; Tert-butyl methyl acetate, tertiary hexyl peroxy trimethyl acetate, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2,5-dimethyl -2,5-bis(2-ethylhexylperoxy)hexane, tertiary hexylperoxy-2-ethylhexanoate, tertiary butylperoxy-2-ethylhexanoate, Tertiary butyl peroxy isobutyrate, tertiary hexyl peroxide isopropyl monocarbonate, tertiary butyl peroxy-3,5,5-trimethylhexanoate, tertiary butyl peroxide laurel Ester, tert-butylperoxy isopropyl monocarbonate, tert-butylperoxy-2-ethylhexyl monocarbonate, tert-butylperoxybenzoate, tert-hexylperoxybenzoate Acid ester, 2,5-dimethyl-2,5-bis(benzylperoxy)hexane, tert-butyl peroxyacetate and other peroxy esters; 2,2'-azobis Isobutyronitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2'-dimethylvaleronitrile), etc. Nitrogen compounds, etc.
作為光自由基聚合起始劑,例如可列舉:2,2-二甲氧基-1,2-二苯基乙烷-1-酮等安息香縮酮;1-羥基環己基苯基酮、2-羥基-2-甲基-1-苯基丙烷-1-酮、1-[4-(2-羥基乙氧基)苯基]-2-羥基-2-甲基-1-丙烷-1-酮等α-羥基酮;雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦等氧化膦等。As the photoradical polymerization initiator, for example, benzoin ketal such as 2,2-dimethoxy-1,2-diphenylethane-1-one; 1-hydroxycyclohexyl phenyl ketone, 2 -Hydroxy-2-methyl-1-phenylpropane-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propane-1- Alpha-hydroxy ketones such as ketones; bis(2,4,6-trimethylbenzyl)phenyl phosphine oxide, bis(2,6-dimethoxybenzyl)-2,4,4- Phosphine oxides such as trimethylpentyl phosphine oxide and 2,4,6-trimethylbenzyl diphenyl phosphine oxide.
該些熱自由基聚合起始劑及光自由基聚合起始劑可單獨使用一種或將兩種以上組合而使用。These thermal radical polymerization initiators and photo radical polymerization initiators can be used alone or in combination of two or more.
相對於聚合性單體的總量100質量份,聚合起始劑的含量可為0.01質量份~5質量份。聚合起始劑的含量亦可為0.03質量份以上、或0.05質量份以上。若聚合起始劑的含量相對於聚合性單體的總量100質量份而為0.01質量份以上,則有硬化性提高、耐熱性變得更良好的傾向。聚合起始劑的含量亦可為3質量份以下、1質量份以下、或0.1質量份以下。若聚合性單體的含量相對於聚合性單體的總量100質量份而為5質量份以下,則有可抑制製程中的氣體產生的傾向。The content of the polymerization initiator may be 0.01 parts by mass to 5 parts by mass relative to 100 parts by mass of the total amount of polymerizable monomers. The content of the polymerization initiator may be 0.03 parts by mass or more, or 0.05 parts by mass or more. If the content of the polymerization initiator is 0.01 parts by mass or more with respect to 100 parts by mass of the total amount of the polymerizable monomers, the curability is improved and the heat resistance tends to become better. The content of the polymerization initiator may be 3 parts by mass or less, 1 part by mass or less, or 0.1 parts by mass or less. If the content of the polymerizable monomer is 5 parts by mass or less with respect to 100 parts by mass of the total amount of the polymerizable monomer, there is a tendency that gas generation in the process can be suppressed.
硬化性樹脂成分視需要可更包含熱硬化性樹脂、硬化促進劑、絕緣性填料、增感劑、抗氧化劑等。If necessary, the curable resin component may further contain a thermosetting resin, a curing accelerator, an insulating filler, a sensitizer, an antioxidant, and the like.
熱硬化性樹脂只要為藉由熱而進行硬化的樹脂,則並無特別限制。作為熱硬化性樹脂,例如可列舉:環氧樹脂、丙烯酸樹脂、矽酮樹脂、酚樹脂、熱硬化型聚醯亞胺樹脂、聚胺基甲酸酯樹脂、三聚氰胺樹脂、脲樹脂等。該些可單獨使用一種或將兩種以上組合而使用。該些中,就耐熱性、作業性、及可靠性更優異而言,熱硬化性樹脂可為環氧樹脂。於使用環氧樹脂作為熱硬化性樹脂的情況下,亦可與環氧樹脂硬化劑組合而使用。The thermosetting resin is not particularly limited as long as it is a resin that is cured by heat. Examples of thermosetting resins include epoxy resins, acrylic resins, silicone resins, phenol resins, thermosetting polyimide resins, polyurethane resins, melamine resins, and urea resins. These can be used individually by 1 type or in combination of 2 or more types. Among these, the thermosetting resin may be an epoxy resin in terms of more excellent heat resistance, workability, and reliability. When using an epoxy resin as a thermosetting resin, it can also be used in combination with an epoxy resin hardener.
環氧樹脂只要為進行硬化而具有耐熱作用者,則並無特別限定。作為環氧樹脂,例如可列舉:雙酚A型環氧樹脂等二官能環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂等酚醛清漆型環氧樹脂等。另外,環氧樹脂亦可為多官能環氧樹脂、縮水甘油胺型環氧樹脂、含雜環的環氧樹脂、或脂環式環氧樹脂。The epoxy resin is not particularly limited as long as it has a heat-resistant effect for curing. Examples of epoxy resins include bifunctional epoxy resins such as bisphenol A epoxy resins, novolac epoxy resins such as phenol novolac epoxy resins, and cresol novolac epoxy resins. In addition, the epoxy resin may be a multifunctional epoxy resin, a glycidylamine epoxy resin, a heterocyclic epoxy resin, or an alicyclic epoxy resin.
環氧樹脂硬化劑可使用通常所使用的公知的硬化劑。作為環氧樹脂硬化劑,例如可列舉:胺、聚醯胺、酸酐、多硫醚、三氟化硼、雙酚A、雙酚F、雙酚S等在一分子中具有兩個以上的酚性羥基的雙酚、苯酚酚醛清漆樹脂、雙酚A酚醛清漆樹脂、甲酚酚醛清漆樹脂等酚樹脂等。As the epoxy resin hardener, a known hardener that is generally used can be used. Examples of the epoxy resin curing agent include: amines, polyamides, acid anhydrides, polysulfides, boron trifluoride, bisphenol A, bisphenol F, bisphenol S, etc., which have two or more phenols in one molecule Phenolic resins such as bisphenol, phenol novolak resin, bisphenol A novolak resin, cresol novolak resin, etc.
相對於硬化性樹脂成分的總量100質量份,熱硬化性樹脂及硬化劑的含量可為10質量份~90質量份。若熱硬化性樹脂及硬化劑的含量為所述範圍內,則有耐熱性變得更良好的傾向。The content of the thermosetting resin and the curing agent may be 10 parts by mass to 90 parts by mass relative to 100 parts by mass of the total amount of the curable resin component. If the content of the thermosetting resin and the curing agent is within the above range, the heat resistance tends to become better.
作為硬化促進劑,例如可列舉:咪唑衍生物、雙氰胺衍生物、二羧酸二醯肼、三苯基膦、四苯基鏻四苯基硼酸鹽、2-乙基-4-甲基咪唑-四苯基硼酸鹽、1,8-二氮雜雙環[5,4,0]十一烯-7-四苯基硼酸鹽等。該些亦可單獨使用一種或將兩種以上組合而使用。Examples of hardening accelerators include imidazole derivatives, dicyandiamide derivatives, dihydrazine dicarboxylic acid, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methyl Imidazole-tetraphenylborate, 1,8-diazabicyclo[5,4,0]undecene-7-tetraphenylborate, etc. These can also be used individually by 1 type or in combination of 2 or more types.
相對於熱硬化性樹脂及硬化劑的總量100質量份,硬化促進劑的含量可為0.01質量份~5質量份。若硬化促進劑的含量為所述範圍內,則有硬化性提高、耐熱性變得更良好的傾向。The content of the hardening accelerator may be 0.01 to 5 parts by mass relative to 100 parts by mass of the total amount of the thermosetting resin and hardener. If the content of the hardening accelerator is within the above-mentioned range, the hardening properties are improved and the heat resistance tends to become better.
絕緣性填料可出於對樹脂層賦予低熱膨脹性、低吸濕性的目的而添加。作為絕緣性填料,例如可列舉:二氧化矽、氧化鋁、氮化硼、二氧化鈦、玻璃、陶瓷等非金屬無機填料等。該些絕緣性填料亦可單獨使用一種或將兩種以上組合而使用。就與溶劑的分散性的觀點而言,絕緣性填料可為其表面藉由表面處理劑進行了處理的粒子。表面處理劑可使用與所述矽烷偶合劑相同者。The insulating filler can be added for the purpose of imparting low thermal expansion and low hygroscopicity to the resin layer. Examples of insulating fillers include non-metallic inorganic fillers such as silicon dioxide, aluminum oxide, boron nitride, titanium dioxide, glass, and ceramics. These insulating fillers can also be used individually by 1 type or in combination of 2 or more types. From the viewpoint of dispersibility with a solvent, the insulating filler may be particles whose surfaces have been treated with a surface treatment agent. The surface treatment agent can be the same as the silane coupling agent.
相對於硬化性樹脂成分的總量100質量份,絕緣性填料的含量可為5質量份~20質量份。若絕緣性填料的含量為所述範圍內,則有進一步提高耐熱性且不妨礙光透射的傾向。另外,有可能亦有助於輕剝離性。The content of the insulating filler may be 5 parts by mass to 20 parts by mass relative to 100 parts by mass of the total amount of the curable resin component. If the content of the insulating filler is within the above range, there is a tendency that heat resistance is further improved without hindering light transmission. In addition, it may also contribute to light peelability.
作為增感劑,例如可列舉:蒽、菲、1,2-苯并菲(chrysene)、苯并芘(benzopyrene)、1,2-苯并苊(fluoranthene)、紅螢烯、芘、氧雜蒽酮(xanthone)、陰丹士林、噻噸-9-酮、2-異丙基-9H-噻噸-9-酮、4-異丙基-9H-噻噸-9-酮、1-氯-4-丙氧基硫雜蒽酮等。As the sensitizer, for example, anthracene, phenanthrene, 1,2-benzopyrene (chrysene), benzopyrene (benzopyrene), 1,2-benzoacenaphthene (fluoranthene), fluorene, pyrene, oxa Anthrone (xanthone), indanthrene, thioxanthene-9-one, 2-isopropyl-9H-thioxanthene-9-one, 4-isopropyl-9H-thioxanthene-9-one, 1- Chloro-4-propoxy thioxanthone and so on.
相對於硬化性樹脂成分的總量100質量份,增感劑的含量可為0.01質量份~10質量份。若增感劑的含量為所述範圍內,則有對硬化性樹脂成分的特性及薄膜性的影響少的傾向。The content of the sensitizer may be 0.01 parts by mass to 10 parts by mass relative to 100 parts by mass of the total amount of curable resin components. If the content of the sensitizer is within the above range, there is a tendency that there is little influence on the properties of the curable resin component and film properties.
作為抗氧化劑,例如可列舉:苯醌、氫醌等醌衍生物;4-甲氧基苯酚、4-第三丁基兒茶酚等酚衍生物;2,2,6,6-四甲基哌啶-1-氧基、4-羥基-2,2,6,6-四甲基哌啶-1-氧基等胺基氧基衍生物;甲基丙烯酸四甲基哌啶酯等受阻胺衍生物等。Examples of antioxidants include: quinone derivatives such as benzoquinone and hydroquinone; phenol derivatives such as 4-methoxyphenol and 4-tert-butylcatechol; 2,2,6,6-tetramethyl Aminooxy derivatives such as piperidine-1-oxy and 4-hydroxy-2,2,6,6-tetramethylpiperidine-1-oxy; hindered amines such as tetramethylpiperidine methacrylate Derivatives, etc.
相對於硬化性樹脂成分的總量100質量份,抗氧化劑的含量可為0.1質量份~10質量份。若抗氧化劑的含量為所述範圍內,則有可抑制硬化性樹脂成分的分解而防止污染的傾向。The content of the antioxidant can be 0.1 to 10 parts by mass relative to 100 parts by mass of the total amount of the curable resin component. If the content of the antioxidant is within the above range, the decomposition of the curable resin component tends to be suppressed to prevent contamination.
樹脂層34可由硬化性樹脂成分形成。硬化性樹脂成分亦可作為利用溶劑進行了稀釋的硬化性樹脂成分的清漆來使用。溶劑只要為可溶解絕緣性填料以外的成分者,則並無特別限制。作為溶劑,例如可列舉:甲苯、二甲苯、均三甲苯、異丙苯(cumene)、對異丙基甲苯(p-cymene)等芳香族烴;己烷、庚烷等脂肪族烴;甲基環己烷等環狀烷烴;四氫呋喃、1,4-二噁烷等環狀醚;丙酮、甲基乙基酮、甲基異丁基酮、環己酮、4-羥基-4-甲基-2-戊酮等酮;乙酸甲酯、乙酸乙酯、乙酸丁酯、乳酸甲酯、乳酸乙酯、γ-丁內酯等酯;碳酸伸乙酯、碳酸伸丙酯等碳酸酯;N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮等醯胺等。該些溶劑亦可單獨使用一種或將兩種以上組合而使用。該些中,就溶解性及沸點的觀點而言,溶劑可為甲苯、二甲苯、庚烷、或環己烷。清漆中的固體成分濃度以清漆的總質量為基準而可為10質量%~80質量%。The
硬化性樹脂成分的清漆可藉由將硬化性樹脂成分及溶劑混合並加以混練而製備。混合及混練可將通常的攪拌機、擂潰機、三輥、珠磨機等分散機適宜組合而進行。The varnish of the curable resin component can be prepared by mixing and kneading the curable resin component and the solvent. Mixing and kneading can be performed by appropriately combining a dispersing machine such as a general mixer, a crusher, a three-roller, or a bead mill.
樹脂層34可藉由將硬化性樹脂成分直接塗佈於光吸收層32而形成。於使用利用溶劑進行了稀釋的硬化性樹脂成分的清漆的情況下,可藉由將硬化性樹脂成分的清漆塗佈於光吸收層32並對溶劑進行加熱乾燥而去除來形成。另外,樹脂層34亦可藉由製作包含硬化性樹脂成分的硬化性樹脂成分膜來形成。The
就應力緩和的觀點而言,樹脂層34的厚度可為0.1 μm~2000 μm(0.0001 mm~2 mm)、0.5 μm~200 μm、或1 μm~100 μm。From the viewpoint of stress relaxation, the thickness of the
暫時固定材前驅物層30及絕熱層70亦可藉由以下方式來製作:預先製作依序具有絕熱層70、吸收光而產生熱的光吸收層32、以及包含硬化性樹脂成分的樹脂層34的積層膜(以下,有時稱為「暫時固定材用積層膜」),並對其以絕熱層70與支撐構件10相接的方式進行層壓。The temporary fixing
暫時固定材用積層膜中的光吸收層32可為包含導電體的層(導電體層),亦可為含有導電性粒子的層。暫時固定材用積層膜可設置於支撐膜上,亦可於與支撐膜為相反側的表面上視需要設置保護膜。The
支撐膜並無特別限制,例如可列舉:聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯;聚乙烯、聚丙烯等聚烯烴;聚碳酸酯、聚醯胺、聚醯亞胺、聚醯胺醯亞胺、聚醚醯亞胺、聚醚硫醚、聚醚碸、聚醚酮、聚苯醚、聚苯硫醚、聚(甲基)丙烯酸酯、聚碸、液晶聚合物的膜等。該些亦可實施脫模處理。支撐膜的厚度例如可為3 μm~250 μm。The support film is not particularly limited, and examples include polyesters such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate; polyethylene, poly Polyolefins such as propylene; polycarbonate, polyamide, polyimide, polyimide imine, polyetherimine, polyether sulfide, polyether sulfide, polyether ketone, polyphenylene ether, polyphenylene Film of thioether, poly(meth)acrylate, polysulfide, liquid crystal polymer, etc. These can also be subjected to mold release treatment. The thickness of the support film can be 3 μm to 250 μm, for example.
作為保護膜,例如可列舉:聚對苯二甲酸乙二酯、聚對苯二甲酸丁二酯、聚萘二甲酸乙二酯等聚酯;聚乙烯、聚丙烯等聚烯烴等。保護膜的厚度例如可為10 μm~250 μm。Examples of the protective film include polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyolefins such as polyethylene and polypropylene. The thickness of the protective film can be, for example, 10 μm to 250 μm.
暫時固定材用積層膜可依序具有絕熱層(於將暫時固定材層中的包含硬化性樹脂成分的硬化物的樹脂硬化物層用作絕熱層70的情況下,為包含硬化性樹脂成分的硬化物的絕熱層)、光吸收層、包含硬化性樹脂成分的樹脂層,亦可依序具有包含硬化性樹脂成分的絕熱樹脂層、光吸收層、以及包含硬化性樹脂成分的樹脂層。The laminated film for the temporary fixing material may sequentially have a heat insulating layer (when a cured resin layer containing a hardened resin component in the temporary fixing material layer is used as the
圖2(b)所示的構成的暫時固定材前驅物層30例如可藉由於支撐構件10上形成絕熱層70、光吸收層32、樹脂層34、及光吸收層32來製作。該些暫時固定材前驅物層30亦可藉由預先製作所述構成的暫時固定材用積層膜並層壓於支撐構件10來製作。The temporary fixing
繼而,將半導體構件配置於所製作的暫時固定材前驅物層上,使暫時固定材前驅物層30(樹脂層34)中的硬化性樹脂成分硬化,形成具有光吸收層、以及包含硬化性樹脂成分的硬化物的樹脂硬化層的暫時固定材層,藉此製作依序積層有支撐構件10、絕熱層70、吸收光而產生熱的暫時固定材層30c、以及半導體構件40的積層體(圖1(a))。圖3(a)、圖3(b)、圖3(c)、及圖3(d)是表示使用圖2(a)所示的暫時固定材前驅物層而形成的積層體的一實施形態的示意剖面圖。Then, the semiconductor component is arranged on the prepared temporary fixing material precursor layer, and the curable resin component in the temporary fixing material precursor layer 30 (resin layer 34) is cured to form a light absorbing layer and containing a curable resin The temporary fixing material layer of the resin hardening layer of the cured product of the component, thereby producing a laminated body in which the
半導體構件40可為半導體晶圓或將半導體晶圓切斷為規定尺寸而單片化為晶片狀的半導體晶片。於使用半導體晶片作為半導體構件40的情況下,通常使用多個半導體晶片。就半導體裝置的小型化、薄型化、以及抑制搬送時、加工步驟等時的破裂的觀點而言,半導體構件40的厚度可為1 μm~1000 μm、10 μm~500 μm、或20 μm~200 μm。於半導體晶圓或半導體晶片中,亦可包括再配線層及具有外部連接端子的外部連接構件。The
半導體構件40可藉由將設置有所製作的暫時固定材前驅物層30的支撐構件10設置於真空壓製機或真空層壓機上,將半導體構件40配置於暫時固定材前驅物層30上,並藉由壓製進行壓接而積層。The
於使用真空壓製機的情況下,例如以氣壓1 hPa以下、壓接壓力1 MPa、壓接溫度120℃~200℃、保持時間100秒鐘~300秒鐘,將半導體構件40壓接於暫時固定材前驅物層30。In the case of using a vacuum press, for example, the
於使用真空層壓機的情況下,例如以氣壓1 hPa以下、壓接溫度60℃~180℃或80℃~150℃、層壓壓力0.01 MPa~0.5 MPa或0.1 MPa~0.5 MPa、保持時間1秒鐘~600秒鐘或30秒鐘~300秒鐘,將半導體構件40壓接於暫時固定材前驅物層30。In the case of using a vacuum laminator, for example, the air pressure is 1 hPa or less, the crimping temperature is 60℃~180℃ or 80℃~150℃, the lamination pressure is 0.01 MPa~0.5 MPa or 0.1 MPa~0.5 MPa, and the holding time is 1 For seconds to 600 seconds or 30 seconds to 300 seconds, the
於經由絕熱層70及暫時固定材前驅物層30將半導體構件40配置於支撐構件10上後,於規定條件下使暫時固定材前驅物層30中的硬化性樹脂成分進行熱硬化或光硬化。於將暫時固定材層中的包含硬化性樹脂成分的硬化物的樹脂硬化物層用作絕熱層70的情況下,亦可使絕熱樹脂層中的硬化性樹脂成分亦一併進行熱硬化或光硬化。熱硬化的條件例如可為300℃以下或100℃~200℃、且1分鐘~180分鐘或1分鐘~60分鐘。如此,形成硬化性樹脂成分的硬化物,半導體構件40經由包含硬化性樹脂成分的硬化物的暫時固定材層30c而被暫時固定於支撐構件10,從而獲得積層體300。暫時固定材層30c如圖3(a)所示,可包含光吸收層32與包含硬化性樹脂成分的硬化物的樹脂硬化物層34c。After arranging the
積層體例如亦可藉由於形成暫時固定材層後配置半導體構件來製作。是用以說明圖1(a)所示的積層體的製造方法的另一實施形態的示意剖面圖,圖5(a)、圖5(b)、及圖5(c)是表示各步驟的示意剖面圖。圖5(a)、圖5(b)、及圖5(c)的各步驟使用了圖2(a)所示的暫時固定材前驅物層。積層體可藉由以下方式來製作:於支撐構件10上形成絕熱層70,於所形成的絕熱層70上形成包含硬化性樹脂成分的暫時固定材前驅物層30(圖5(a)),使暫時固定材前驅物層30(樹脂層34)中的硬化性樹脂成分進行硬化而形成包含硬化性樹脂成分的硬化物的暫時固定材層30c(圖5(b)),並將半導體構件40配置於所形成的暫時固定材層30c上(圖5(c))。於此種製造方法中,可於配置半導體構件40之前,於暫時固定材層20c上設置再配線層41,因此可藉由將半導體構件40配置於再配線層41上來形成具有再配線層41的半導體構件40。The laminate can also be produced by forming a temporary fixing material layer and then arranging a semiconductor member. It is a schematic cross-sectional view for explaining another embodiment of the method of manufacturing the laminate shown in Fig. 1(a), and Fig. 5(a), Fig. 5(b), and Fig. 5(c) show the steps Schematic sectional view. The steps of Fig. 5(a), Fig. 5(b), and Fig. 5(c) use the temporary fixing material precursor layer shown in Fig. 2(a). The laminate can be produced by forming a
積層體100中的半導體構件40(暫時固定於支撐構件10的半導體構件40)亦可進一步進行加工。藉由對圖3(a)所示的積層體300中的半導體構件40進行加工,可獲得積層體310(圖3(b))、積層體320(圖3(c))、積層體330(圖3(d))等。半導體構件的加工並無特別限制,例如可列舉:半導體構件的薄化、貫通電極的製作、再配線層的形成、蝕刻處理、鍍敷回焊處理、濺鍍處理等。The semiconductor member 40 (the
半導體構件的薄化可藉由利用研磨機等對半導體構件40的與和暫時固定材層30c相接的面為相反側的面進行研削來進行。經薄化的半導體構件的厚度例如可為100 μm以下。The thinning of the semiconductor member can be performed by grinding the surface of the
研削條件可根據所期望的半導體構件的厚度、研削狀態等任意地設定。The grinding conditions can be arbitrarily set according to the thickness and grinding state of the desired semiconductor member.
貫通電極的製作可藉由在經薄化的半導體構件40的與和暫時固定材層30c相接的面為相反側的面進行乾式離子蝕刻、波希製程(Bosch process)等加工,形成貫通孔後,進行鍍銅等處理來進行。The through-electrode can be produced by performing processing such as dry ion etching, Bosch process, etc., on the surface of the thinned
以所述方式對半導體構件40實施加工,從而可獲得例如半導體構件40經薄化且設置有貫通電極44的積層體310(圖3(b))。By processing the
如圖3(c)所示,圖3(b)所示的積層體310亦可由密封層50覆蓋。密封層50的材質並無特別限制,就耐熱性、以及可靠性等觀點而言,可為熱硬化性樹脂組成物。作為密封層50中所使用的熱硬化性樹脂,例如可列舉:甲酚酚醛清漆環氧樹脂、苯酚酚醛清漆環氧樹脂、聯苯二環氧樹脂、萘酚酚醛清漆環氧樹脂等環氧樹脂等。亦可於用以形成密封層50的組成物中添加填料及/或溴化合物等阻燃性物質等添加劑。As shown in FIG. 3(c), the laminate 310 shown in FIG. 3(b) may be covered with the
密封層50的供給形態並無特別限制,可為固形材、液狀材、細顆粒材、膜材等。The supply form of the
利用由密封膜形成的密封層50對加工半導體構件42進行密封時例如可使用壓縮密封成形機、真空層壓裝置等。使用所述裝置,例如於40℃~180℃(或60℃~150℃)、0.1 MPa~10 MPa(或0.5 MPa~8 MPa)、且0.5分鐘~10分鐘的條件下,利用熱熔融的密封膜覆蓋加工半導體構件42,藉此可形成密封層50。密封膜亦可以積層於聚對苯二甲酸乙二酯(PET)膜等剝離襯墊上的狀態來準備。於該情況下,將密封膜配置於加工半導體構件42上並埋入加工半導體構件42後,將剝離襯墊剝離,藉此可形成密封層50。如此,可獲得圖3(c)所示的積層體320。When sealing the processed
密封膜的厚度是以密封層50成為加工半導體構件42的厚度以上的方式進行調整。密封膜的厚度可為50 μm~2000 μm、70 μm~1500 μm、或100 μm~1000 μm。The thickness of the sealing film is adjusted so that the
如圖3(d)所示,具有密封層50的加工半導體構件42亦可藉由切割而經單片化。如此,可獲得圖3(d)所示的積層體330。再者,藉由切割的單片化亦可於後述的半導體構件的分離步驟後實施。As shown in FIG. 3(d), the processed
<半導體構件的分離步驟>
如圖1(b)所示,於半導體構件的分離步驟中,對積層體100中的暫時固定材層30c沿方向A照射光,從而將半導體構件40自支撐構件10分離。<Separation steps of semiconductor components>
As shown in FIG. 1( b ), in the step of separating the semiconductor member, the temporary
圖4(a)、圖4(b)是用以說明使用了圖3(d)所示的積層體的本發明的半導體裝置的製造方法的一實施形態的示意剖面圖,圖4(a)及圖4(b)是表示各步驟的示意剖面圖。4(a) and 4(b) are schematic cross-sectional views for explaining one embodiment of the method of manufacturing a semiconductor device of the present invention using the laminate shown in FIG. 3(d), and FIG. 4(a) And Fig. 4(b) is a schematic cross-sectional view showing each step.
暫時固定材層30c藉由照射光,光吸收層32吸收光而瞬間產生熱,從而於界面或整體中可產生樹脂硬化物層34c或絕熱層70的熔融、支撐構件10與半導體構件40(加工半導體構件42)的應力、光吸收層32的飛散等。藉由此種現象的產生,可容易地將經暫時固定的加工半導體構件42自支撐構件10分離(剝離)。再者,於分離步驟中,亦可於光照射的同時,於平行於支撐構件10的主面的方向對加工半導體構件42稍微施加應力。When the temporary
分離步驟中的光可為非相干光。非相干光為具有不會產生干涉條紋、可干涉性低、指向性低等性質的電磁波,有光程長越長而越衰減的傾向。非相干光為並非相干光的光。雷射光一般為相干光,相對於此,太陽光、螢光燈的光等光為非相干光。非相干光亦可稱為除雷射光以外的光。非相干光的照射面積遠遠寬於相干光(即,雷射光),因此可減少照射次數(例如,一次)。The light in the separation step may be incoherent light. Incoherent light is an electromagnetic wave with properties such as no interference fringes, low interferability, and low directivity. The longer the optical path, the more attenuated it is. Incoherent light is light that is not coherent light. Laser light is generally coherent light. In contrast, light such as sunlight and fluorescent light is incoherent light. Incoherent light can also be called light other than laser light. The irradiation area of incoherent light is much wider than that of coherent light (ie, laser light), so the number of irradiations (for example, one time) can be reduced.
分離步驟中的光可為至少包含紅外光的光。分離步驟中的光的光源並無特別限制,可為氙燈。氙燈是利用封入有氙氣的發光管的藉由施加、放電而產生的發光的燈。氙燈一面反覆進行電離及激發一面進行放電,因此穩定地具有紫外光區域至紅外光區域的連續波長。與金屬鹵化物燈等燈相比,氙燈的啟動所需的時間短,因此可大幅縮短步驟所用的時間。另外,於發光時需要施加高電壓,因此會瞬間產生高熱,但冷卻時間短,可進行連續的作業。另外,氙燈的照射面積遠遠寬於雷射光,因此可減少照射次數(例如,一次)。The light in the separation step may be light containing at least infrared light. The light source of the light in the separation step is not particularly limited, and may be a xenon lamp. The xenon lamp is a lamp that emits light by applying and discharging using an arc tube enclosed with xenon gas. The xenon lamp repeatedly ionizes and excites while discharging, so it stably has a continuous wavelength from the ultraviolet region to the infrared region. Compared with lamps such as metal halide lamps, xenon lamps require less time to start, so the time required for the steps can be greatly reduced. In addition, high voltage needs to be applied during light emission, so high heat is generated instantaneously, but the cooling time is short and continuous operation is possible. In addition, the irradiation area of a xenon lamp is much wider than that of laser light, so the number of irradiations can be reduced (for example, once).
利用氙燈的照射條件可對施加電壓、脈衝寬度、照射時間、照射距離(光源與暫時固定材層的距離)、照射能量等進行任意設定。利用氙燈的照射條件可設定藉由一次照射而可分離的條件,亦可設定藉由兩次以上的照射而可分離的條件,就減少加工半導體構件42的損傷的觀點而言,利用氙燈的照射條件可設定藉由一次照射而可分離的條件。The irradiation conditions of the xenon lamp can be arbitrarily set for the applied voltage, pulse width, irradiation time, irradiation distance (the distance between the light source and the temporarily fixed material layer), and irradiation energy. The irradiation conditions with the xenon lamp can be set to be separable by one irradiation, and can also be set to be separable by two or more irradiations. From the viewpoint of reducing the damage of the processed
本實施形態的半導體裝置的製造方法可降低照射能量,因此可減少加工半導體構件42的損傷。The manufacturing method of the semiconductor device of this embodiment can reduce the irradiation energy, and therefore can reduce the damage of the processed
分離步驟可為經由支撐構件10而對暫時固定材層30c照射光的步驟(圖4(a)的方向A)。即,相對於暫時固定材層30c的利用光的照射可為自支撐構件10側的照射。藉由經由支撐構件10而對暫時固定材層30c照射光,可對暫時固定材層30c整體進行照射。The separation step may be a step of irradiating the temporary
當將半導體構件40或加工半導體構件42自支撐構件10分離時,於半導體構件40或加工半導體構件42上附著有暫時固定材層的殘渣30c'(圖4(a)、圖4(b))的情況下,該些可藉由溶劑進行清洗。溶劑並無特別限制,可列舉:乙醇、甲醇、甲苯、二甲苯、丙酮、甲基乙基酮、甲基異丁基酮、己烷等。該些可單獨使用一種或將兩種以上組合而使用。另外,可浸漬於該些溶劑中,亦可進行超音波清洗。進而,亦可於100℃以下的範圍進行加熱。When the
藉由以所述方式將半導體構件自支撐構件分離,可獲得包括半導體構件40或加工半導體構件42的半導體元件60(圖4(b))。可藉由將所獲得的半導體元件60連接於其他半導體元件或半導體元件搭載用基板而製造半導體裝置。By separating the semiconductor member from the supporting member in this manner, a
[暫時固定材用積層膜] 用於將半導體構件暫時固定於支撐構件的暫時固定材用積層膜的一態樣為具有絕熱層、以及吸收光而產生熱的光吸收層的積層膜。該積層膜可更具有包含硬化性樹脂成分的樹脂層,且依序具有絕熱層、光吸收層、及樹脂層,亦可更具有支撐構件,且依序具有支撐構件、絕熱層、光吸收層、及樹脂層。[Laminated film for temporary fixing materials] One aspect of the laminated film for temporary fixing material for temporarily fixing the semiconductor member to the support member is a laminated film having a heat insulating layer and a light absorption layer that absorbs light and generates heat. The laminated film may further have a resin layer containing a curable resin component, and have a heat insulation layer, a light absorption layer, and a resin layer in this order, or may further have a supporting member, and have a supporting member, a heat insulation layer, and a light absorption layer in this order , And resin layer.
另一方面,於具有絕熱層、以及吸收光而產生熱的光吸收層的積層膜中,該積層膜可更具有支撐構件,且依序具有支撐構件、絕熱層、及光吸收層。On the other hand, in a laminated film having a heat insulating layer and a light absorbing layer that absorbs light and generates heat, the laminated film may further have a supporting member, and sequentially have a supporting member, a heat insulating layer, and a light absorbing layer.
本態樣的暫時固定材用積層膜例如可具有以下的構成(A)、構成(B)、或構成(C)中的任一構成。具有構成(A)的暫時固定材用積層膜亦可稱為具有絕熱層70、以及暫時固定材前驅物層30的積層膜。
構成(A):絕熱層/光吸收層/樹脂層
構成(B):支撐構件/絕熱層/光吸收層/樹脂層
構成(C):支撐構件/絕熱層/光吸收層The laminated film for temporary fixing materials of this aspect may have any one of the following structure (A), structure (B), or structure (C), for example. The laminated film for temporary fixing material which has the structure (A) can also be called the laminated film which has the
於將暫時固定材層中的包含硬化性樹脂成分的硬化物的樹脂硬化物層用作絕熱層的情況下,暫時固定材用積層膜的另一態樣為具有包含硬化性樹脂成分的絕熱樹脂層、以及吸收光而產生熱的光吸收層的積層膜。該積層膜可更具有包含硬化性樹脂成分的樹脂層,且依序具有絕熱樹脂層、光吸收層、及樹脂層,亦可更具有支撐構件,且依序具有支撐構件、絕熱樹脂層、光吸收層、及樹脂層。When a cured resin layer containing a cured product of a curable resin component in the temporary fixing material layer is used as a heat insulating layer, another aspect of the laminated film for temporary fixing material has a heat insulating resin containing a curable resin component Layer and a laminated film of a light-absorbing layer that absorbs light and generates heat. The laminated film may further have a resin layer containing a curable resin component, and sequentially have a heat-insulating resin layer, a light absorption layer, and a resin layer, or may further have a supporting member, and sequentially have a supporting member, a heat-insulating resin layer, and a light Absorbing layer, and resin layer.
另一方面,於具有包含硬化性樹脂成分的絕熱樹脂層、以及吸收光而產生熱的光吸收層的積層膜中,該積層膜可更具有支撐構件,且依序具有支撐構件、絕熱樹脂層、及光吸收層。On the other hand, in a laminated film having a heat-insulating resin layer containing a curable resin component and a light-absorbing layer that absorbs light to generate heat, the laminated film may further have a supporting member, and sequentially have a supporting member and a heat-insulating resin layer , And light absorption layer.
本態樣的暫時固定材用積層膜例如可具有以下的構成(D)、構成(E)、或構成(F)中的任一構成。 構成(D):絕熱樹脂層/光吸收層/樹脂層 構成(E):支撐構件/絕熱樹脂層/光吸收層/樹脂層 構成(F):支撐構件/絕熱樹脂層/光吸收層 [實施例]The laminated film for temporary fixing materials of this aspect may have any one of the following structure (D), structure (E), or structure (F), for example. Composition (D): Heat-insulating resin layer/light absorption layer/resin layer Composition (E): Supporting member/Insulation resin layer/Light absorption layer/Resin layer Composition (F): Supporting member/Insulation resin layer/Light absorption layer [Example]
以下,列舉實施例來更具體地說明本發明。其中本發明並不限定於該些實施例。Hereinafter, the present invention will be explained more specifically by referring to examples. The present invention is not limited to these embodiments.
(實施例1) [硬化性樹脂成分膜的製作] <硬化性樹脂成分的製備> 將作為熱塑性樹脂的氫化苯乙烯-丁二烯彈性體(商品名:達那龍(Dynaron)2324P,JSR股份有限公司)80質量份、作為聚合性單體的1,9-壬二醇二丙烯酸酯(商品名:FA-129AS,日立化成股份有限公司)20質量份、及作為聚合起始劑的過氧化酯(商品名:帕海薩(Perhexa)25O,日油股份有限公司)1質量份混合。再者,氫化苯乙烯-丁二烯彈性體是利用甲苯稀釋為固體成分40質量%而使用。以所述方式製備利用作為溶劑的甲苯進行了稀釋的硬化性樹脂成分的清漆。(Example 1) [Production of curable resin component film] <Preparation of curable resin components> 80 parts by mass of hydrogenated styrene-butadiene elastomer (trade name: Dynaron 2324P, JSR Co., Ltd.) as a thermoplastic resin and 1,9-nonanediol diacrylic acid as a polymerizable monomer 20 parts by mass of ester (trade name: FA-129AS, Hitachi Chemical Co., Ltd.) and 1 part by mass of peroxy ester (trade name: Perhexa 25O, NOF Corporation) as a polymerization initiator mixing. In addition, the hydrogenated styrene-butadiene elastomer was diluted with toluene to a solid content of 40% by mass and used. In the manner described above, a varnish of a curable resin component diluted with toluene as a solvent was prepared.
<硬化性樹脂成分膜的製作> 使用精密塗敷機,將所獲得的硬化性樹脂成分的清漆以厚度成為5 μm的方式塗敷於聚對苯二甲酸乙二酯(PET)膜(皮尤萊斯(Purex)A31,帝人杜邦膜(Teijin Dupont Film)股份有限公司,厚度:38 μm)的脫模處理面上,於80℃下進行10分鐘加熱,將溶劑乾燥去除,從而製作厚度為5 μm的硬化性樹脂成分膜(樹脂層)。<Production of curable resin component film> Using a precision coater, apply the obtained varnish of the curable resin component to a polyethylene terephthalate (PET) film (Purex A31, Teijin DuPont) in a thickness of 5 μm Film (Teijin Dupont Film) Co., Ltd., thickness: 38 μm) was heated at 80°C for 10 minutes on the mold release treatment surface to dry and remove the solvent to produce a curable resin component film with a thickness of 5 μm (resin Floor).
[暫時固定材用積層膜的製作] <絕熱樹脂層的製作> 於絕熱樹脂層的製作時,使用在所述硬化性樹脂成分的製備中所製備的硬化性樹脂成分的清漆。使用精密塗敷機,將硬化性樹脂成分的清漆以厚度成為1 μm的方式塗敷於作為支撐構件的載玻片(尺寸:40 mm×40 mm,厚度:0.8 μm)的其中一個主面上的整個面,於90℃下進行10分鐘加熱,將溶劑乾燥去除,藉此製作包括厚度為1 μm的絕熱樹脂層的支撐構件。[Production of laminated film for temporary fixing material] <Production of heat-insulating resin layer> In the preparation of the heat insulating resin layer, the varnish of the curable resin component prepared in the preparation of the curable resin component is used. Using a precision coater, apply a curable resin component varnish to a thickness of 1 μm on one of the main surfaces of a glass slide (size: 40 mm×40 mm, thickness: 0.8 μm) as a support member Heat the entire surface of the film at 90°C for 10 minutes to dry and remove the solvent, thereby fabricating a support member including a heat-insulating resin layer with a thickness of 1 μm.
<光吸收層的製作>
於包括絕熱樹脂層的支撐構件的絕熱樹脂層上,藉由濺鍍製作第一導電體層為鈦、第二導電體層為銅的光吸收層,獲得自支撐構件起依序包括絕熱樹脂層及光吸收層的支撐構件。再者,該光吸收層是藉由以下方式而製作:於利用逆濺鍍進行預處理(Ar流速:1.2×10-2
Pa·m3
/s(70 sccm),射頻(radio frequency,RF)功率:300 W,時間:300秒鐘)後,於表1所示的處理條件下進行RF濺鍍,使鈦層/銅層的厚度成為50 nm/200 nm。<Preparation of the light-absorbing layer> On the heat-insulating resin layer of the supporting member including the heat-insulating resin layer, a light-absorbing layer with titanium as the first conductor layer and copper as the second conductor layer is produced by sputtering to obtain a self-supporting member The sequence includes a heat-insulating resin layer and a support member of the light absorption layer. Furthermore, the light absorbing layer is made by the following method: pre-treatment by reverse sputtering (Ar flow rate: 1.2×10 -2 Pa·m 3 /s (70 sccm), radio frequency, RF) After power: 300 W, time: 300 seconds), RF sputtering was performed under the processing conditions shown in Table 1 to make the thickness of the titanium layer/
[表1]
<樹脂層的製作> 將上述中所製作的厚度為5 μm的硬化性樹脂成分膜切出40 mm×40 mm。將所切出的硬化性樹脂成分膜配置於自支撐構件起依序包括絕熱樹脂層及光吸收層的支撐構件的光吸收層上,並進行真空層壓,藉此製作設置於支撐構件上的、依序具有包含硬化性樹脂成分的絕熱樹脂層、光吸收層、以及包含硬化性樹脂成分的樹脂層的實施例1的暫時固定材用積層膜。<Production of resin layer> The curable resin component film with a thickness of 5 μm produced above was cut out to 40 mm×40 mm. The cut-out curable resin component film is arranged on the light absorbing layer of the supporting member including the heat insulating resin layer and the light absorbing layer in sequence from the supporting member, and vacuum lamination is performed to produce a film set on the supporting member , The laminated film for temporary fixing material of Example 1 having a heat-insulating resin layer containing a curable resin component, a light absorption layer, and a resin layer containing a curable resin component in this order.
[積層體的製作] 於所獲得的暫時固定材用積層膜的硬化性樹脂成分膜的樹脂層上搭載作為半導體構件的半導體晶片(尺寸:10 mm×10 mm,厚度:150 μm),並於180℃、1小時的條件下使其熱硬化,藉此獲得依序積層有支撐構件、由包含硬化性樹脂成分的樹脂層轉變成的包含硬化性樹脂成分的硬化物的絕熱層、光吸收層、由包含硬化性樹脂成分膜的樹脂層轉變成的包含硬化性樹脂成分膜的硬化物的樹脂硬化物層、及半導體構件的實施例1的積層體。[Production of laminated body] Mount a semiconductor wafer (size: 10 mm×10 mm, thickness: 150 μm) as a semiconductor component on the resin layer of the curable resin component film of the obtained laminated film for temporary fixing material, and heat it at 180°C for 1 hour It is thermally cured under the conditions to obtain a thermal insulation layer, a light absorption layer, and a light-absorbing layer composed of a support member, a resin layer containing a curable resin component, and a cured product containing a curable resin component. The resin layer of the component film is converted into the laminated body of Example 1 including the cured resin layer of the curable resin component film and the semiconductor member.
(實施例2) 於硬化性樹脂成分膜的製作中製作厚度為20 μm的硬化性樹脂成分膜,且於絕熱樹脂層的製作中形成厚度為10 μm的絕熱樹脂層來製作厚度為10 μm的絕熱層,除此以外,與實施例1同樣地製作實施例2的暫時固定材用積層膜及積層體。(Example 2) In the production of the curable resin component film, a curable resin component film with a thickness of 20 μm is produced, and a heat insulation resin layer with a thickness of 10 μm is formed in the production of the heat insulation resin layer to produce a heat insulation layer with a thickness of 10 μm. Except that, in the same manner as in Example 1, the laminated film for temporary fixing material and the laminated body of Example 2 were produced.
(實施例3) 於硬化性樹脂成分膜的製作中製作厚度為80 μm的硬化性樹脂成分膜,且於絕熱樹脂層的製作中形成厚度為80 μm的絕熱樹脂層來製作厚度為80 μm的絕熱層,除此以外,與實施例1同樣地製作實施例3的暫時固定材用積層膜及積層體。(Example 3) In the production of the curable resin component film, a curable resin component film with a thickness of 80 μm is produced, and a heat-insulating resin layer with a thickness of 80 μm is formed in the production of the heat-insulating resin layer to produce a heat-insulating layer with a thickness of 80 μm. Except that, in the same manner as in Example 1, a laminated film for a temporary fixing material and a laminated body of Example 3 were produced.
(比較例1) 除未設置絕熱層以外,與實施例1同樣地製作比較例1的暫時固定材用積層膜及積層體。(Comparative example 1) Except that the heat insulating layer was not provided, the laminated film for temporary fixing material and the laminated body of Comparative Example 1 were produced in the same manner as in Example 1.
(比較例2) 除未設置絕熱層以外,與實施例2同樣地製作比較例2的暫時固定材用積層膜及積層體。(Comparative example 2) Except that the heat insulating layer was not provided, in the same manner as in Example 2, a laminated film for a temporary fixing material and a laminated body of Comparative Example 2 were produced.
(比較例3) 除未設置絕熱層以外,與實施例3同樣地製作比較例3的暫時固定材用積層膜及積層體。(Comparative example 3) Except that the heat insulating layer was not provided, the laminated film for temporary fixing material and the laminated body of Comparative Example 3 were produced in the same manner as in Example 3.
<剝離性試驗>
分別準備三個積層體。利用氙燈,於施加電壓3700 V、脈衝寬度200 μs、照射距離50 mm、照射次數一次、及照射時間200 μs的強照射條件;施加電壓3500 V、脈衝寬度200 μs、照射距離50 mm、照射次數一次、及照射時間200 μs的中等照射條件;以及施加電壓2700 V、脈衝寬度1000 μs、照射距離50 mm、照射次數一次、及照射時間200 μs的弱照射條件的三種照射條件下分別對積層體進行照射,來評價自支撐構件的剝離性。氙燈使用的是氙氣(Xenon)公司製造的S2300(波長範圍:270 nm~近紅外區域,每單位面積的照射能量:0.51 J/cm2
(預測值,強照射條件)、0.45 J/cm2
(預測值,中等照射條件)、0.27 J/cm2
(預測值,弱照射條件),氙燈照射是自積層體的支撐構件(載玻片)側進行。照射距離為光源與設置有載玻片的載台的距離。關於剝離性試驗的評價,將氙燈照射後半導體晶片自然地自載玻片剝離的情況評價為「A」,將於半導體晶片與載玻片之間插入鑷子時半導體晶片在不發生破損的情況下分離的情況或未分離的情況評價為「B」。將結果示於表1中。<Peelability test> Three laminates were prepared respectively. Using xenon lamp, under strong irradiation conditions of applied voltage 3700 V, pulse width 200 μs,
[表2]
如表2所示,具有絕熱層的實施例1~實施例3的積層體與不具有絕熱層的比較例1~比較例3的積層體相比,即使於降低了照射能量的情況下,自支撐構件的剝離性亦優異。根據以上的結果確認到,本發明的半導體裝置的製造方法可容易地將經暫時固定的半導體構件自支撐構件分離,且可降低將經暫時固定的半導體構件自支撐構件分離時所需要的照射能量。As shown in Table 2, the laminates of Examples 1 to 3 with a heat insulating layer are compared with the laminates of Comparative Examples 1 to 3 without a heat insulating layer, even when the irradiation energy is reduced. The releasability of the support member is also excellent. Based on the above results, it was confirmed that the semiconductor device manufacturing method of the present invention can easily separate the temporarily fixed semiconductor member from the supporting member, and can reduce the irradiation energy required when separating the temporarily fixed semiconductor member from the supporting member .
10:支撐構件
30:暫時固定材前驅物層
30c:暫時固定材層
30c':暫時固定材層的殘渣
32:光吸收層
34:樹脂層
34c:樹脂硬化物層
40:半導體構件
41:再配線層
42:加工半導體構件
44:貫通電極
50:密封層
60:半導體元件
70:絕熱層
100、300、310、320、330:積層體
A:方向10: Supporting member
30: Temporarily fix the
圖1(a)、圖1(b)是用以說明本發明的半導體裝置的製造方法的一實施形態的示意剖面圖,圖1(a)及圖1(b)是表示各步驟的示意剖面圖。 圖2(a)及圖2(b)是表示暫時固定材前驅物層的一實施形態的示意剖面圖。 圖3(a)、圖3(b)、圖3(c)、及圖3(d)是表示使用圖2(a)所示的暫時固定材前驅物層而形成的積層體的一實施形態的示意剖面圖。 圖4(a)、圖4(b)是用以說明使用圖3(d)所示的積層體的本發明的半導體裝置的製造方法的一實施形態的示意剖面圖,圖4(a)及圖4(b)是表示各步驟的示意剖面圖。 圖5(a)、圖5(b)、及圖5(c)是用以說明圖1(a)所示的積層體的製造方法的另一實施形態的示意剖面圖,圖5(a)、圖5(b)、及圖5(c)是表示各步驟的示意剖面圖。1(a) and 1(b) are schematic cross-sectional views for explaining an embodiment of the method of manufacturing a semiconductor device of the present invention, and FIGS. 1(a) and 1(b) are schematic cross-sectional views showing each step Figure. 2(a) and 2(b) are schematic cross-sectional views showing one embodiment of a precursor layer of a temporary fixing material. Figures 3(a), 3(b), 3(c), and 3(d) show an embodiment of a laminate formed using the temporary fixing material precursor layer shown in Figure 2(a) Schematic sectional view. 4(a) and 4(b) are schematic cross-sectional views for explaining one embodiment of the method of manufacturing a semiconductor device of the present invention using the laminate shown in FIG. 3(d), and FIGS. 4(a) and Fig. 4(b) is a schematic cross-sectional view showing each step. 5(a), 5(b), and 5(c) are schematic cross-sectional views for explaining another embodiment of the method of manufacturing the laminate shown in FIG. 1(a), and FIG. 5(a) Fig. 5(b) and Fig. 5(c) are schematic cross-sectional views showing each step.
10:支撐構件 10: Supporting member
30c:暫時固定材層 30c: Temporarily fix the material layer
30c':暫時固定材層的殘渣 30c': Temporarily fix the residue of the material layer
40:半導體構件 40: Semiconductor components
70:絕熱層 70: Insulation layer
100:積層體 100: layered body
A:方向 A: Direction
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