TW202038069A - Touch module device and manufacturing method thereof - Google Patents
Touch module device and manufacturing method thereof Download PDFInfo
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- TW202038069A TW202038069A TW108113063A TW108113063A TW202038069A TW 202038069 A TW202038069 A TW 202038069A TW 108113063 A TW108113063 A TW 108113063A TW 108113063 A TW108113063 A TW 108113063A TW 202038069 A TW202038069 A TW 202038069A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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Abstract
Description
本揭露相關於一種觸控模組以及其製造方式。The disclosure relates to a touch module and its manufacturing method.
觸控模組,例如說電容式觸控螢幕,是通過透明觸控感應層來實現,當使用者的指尖觸碰到觸控螢幕,觸控螢幕的透明觸控感應層便會感受到手指所帶來的局部電容變化,相應的訊號便可經由電性連接透明觸控感應層與觸控螢幕的軟性印刷電路傳遞到對應的驅動元件,藉此驅動顯示器,而達成觸控的功能。Touch modules, such as capacitive touch screens, are implemented through a transparent touch sensing layer. When the user’s fingertips touch the touch screen, the transparent touch sensing layer of the touch screen will feel the finger The local capacitance change brought about by the corresponding signal can be transmitted to the corresponding driving element through the flexible printed circuit electrically connecting the transparent touch sensing layer and the touch screen, thereby driving the display to achieve the touch function.
在現有的技術中,在完成軟性印刷電路與透明觸控感應層的電性連接後,會在裸露的軟性印刷電路上塗上矽利康(Silicone)加以保護。通常矽利康是使用點膠的方式覆蓋於軟性印刷電路上。然而,使用點膠方式覆蓋軟性印刷電路的矽利康,後續所貼用以保護透明觸控感應層的蓋板玻璃上會出現凹痕的不良現象,也會產生泡泡狀的外觀不良問題。甚至,部分觸控模組會無足夠空間做點膠,將無法使用矽利康保護線路。In the prior art, after the electrical connection between the flexible printed circuit and the transparent touch sensing layer is completed, the exposed flexible printed circuit is coated with silicone for protection. Silicone usually uses glue to cover the flexible printed circuit. However, for Silicone that uses a dispensing method to cover the flexible printed circuit, the cover glass used to protect the transparent touch sensor layer will have the undesirable phenomenon of dents and bubble-like appearance. Moreover, some touch modules will not have enough space for glue dispensing and will not be able to use Silicone protection circuits.
本揭露之一技術態樣為一種觸控模組。One technical aspect of this disclosure is a touch module.
根據本揭露一實施方式,一種觸控模組包含觸控感應層、保護板、透光膠區、軟性印刷電路以及網印絕緣膠層。觸控感應層電極區。保護板位於觸控感應層上方。透光膠區位於觸控感應層與該保護層之間。軟性印刷電路位於觸控感應層上,而軟性印刷電路的電連接區以導電膠電性附貼於觸控感應層的電極區上。網印絕緣膠層位於軟性印刷電路上並與透光膠區相鄰,並且填入透光膠區與軟性印刷電路之間。According to an embodiment of the present disclosure, a touch module includes a touch sensing layer, a protective plate, a transparent adhesive area, a flexible printed circuit, and a screen-printed insulating adhesive layer. Touch sensing layer electrode area. The protective plate is located above the touch sensing layer. The transparent adhesive area is located between the touch sensing layer and the protective layer. The flexible printed circuit is located on the touch sensing layer, and the electrical connection area of the flexible printed circuit is electrically attached to the electrode area of the touch sensing layer with conductive glue. The screen-printed insulating glue layer is located on the flexible printed circuit and is adjacent to the transparent glue area, and is filled between the transparent glue area and the flexible printed circuit.
在本揭露一實施方式中,上述觸控模組的觸控感應層是具有氧化銦錫薄膜圖樣或是金屬網膜圖樣的絕緣層。In an embodiment of the present disclosure, the touch sensing layer of the above-mentioned touch module is an insulating layer with an indium tin oxide film pattern or a metal mesh pattern.
在本揭露一實施方式中,上述觸控模組之軟性印刷電路的導電膠是異方性導電膠。In an embodiment of the present disclosure, the conductive adhesive of the flexible printed circuit of the touch module is anisotropic conductive adhesive.
在本揭露一實施方式中,上述觸控模組的網印絕緣層是冷紫外光固化絕緣膠。其中,網印絕緣膠層的厚度介於6微米到75微米之間,網印絕緣膠層的厚度小於透光膠層之厚度。此外,網印絕緣膠層的表面阻抗介於1x1010 Ω/□到1x1013 Ω/□之間。In an embodiment of the present disclosure, the screen-printed insulating layer of the above-mentioned touch module is a cold ultraviolet curable insulating glue. The thickness of the screen-printed insulating glue layer is between 6 μm and 75 μm, and the thickness of the screen-printed insulating glue layer is smaller than the thickness of the transparent glue layer. In addition, the surface impedance of the screen-printed insulating adhesive layer is between 1x10 10 Ω/□ to 1x10 13 Ω/□.
在本揭露一實施方式中,上述觸控模組的保護板是蓋板玻璃。In an embodiment of the present disclosure, the protective plate of the touch module is a cover glass.
在本揭露一實施方式中,上述觸控模組的透光膠區是光學透明膠。In one embodiment of the present disclosure, the light-transmitting glue area of the touch module is optically transparent glue.
本揭露之另一技術態樣為一種製造觸控模組的方法。Another technical aspect of the present disclosure is a method of manufacturing a touch module.
根據本揭露一實施方式,一種製造觸控模組的方法包含提供觸控感應層,形成光學透明膠區於觸控感應層上,貼附軟性印刷電路至觸控感應層,隨後網印絕緣膠層覆蓋軟性印刷電路與觸控感應層的電性連接區上,並使用冷紫外光固化絕緣膠層,使絕緣膠層的厚度小於光學透明膠區的厚度。According to one embodiment of the present disclosure, a method of manufacturing a touch module includes providing a touch sensing layer, forming an optically transparent glue area on the touch sensing layer, attaching a flexible printed circuit to the touch sensing layer, and then screen printing insulating glue The layer covers the electrical connection area between the flexible printed circuit and the touch sensing layer, and uses cold ultraviolet light to cure the insulating glue layer so that the thickness of the insulating glue layer is smaller than the thickness of the optically transparent glue area.
在本揭露一實施方式中,上述製造觸控模組的方法裡關於使用冷紫外光固化絕緣膠層的步驟,此步驟的溫度是介於25o C到50o C的範圍之間。In one embodiment of the present disclosure, the method for producing the module's touch on the use of UV curable insulating adhesive layer cooling step, the temperature of this step is within a range from 25 o C to 50 o C to.
在本揭露上述實施方式中,使用網印絕緣膠層保護線路,並具有絕緣與防水的作用。而相較於點膠的方式,網印絕緣膠層的厚度較為一致而均勻,使得觸控結構在保護線路的空間使用上獲得改善,因此減少部分類型的觸控結構因空間不足而使得裸露的金屬線路無法被保護的問題。此外,由於網印絕緣膠層的均勻厚度小於黏膠區的厚度,因此原先點膠的部分不均勻厚度超過觸控模組的黏膠層厚度,所導致的凹痕外觀不良問題與泡沫狀外觀不良問題,亦能獲得改善。In the above-mentioned embodiments of the present disclosure, a screen-printed insulating adhesive layer is used to protect the circuit, and has the functions of insulation and waterproofing. Compared with the dispensing method, the thickness of the screen-printed insulating adhesive layer is more consistent and uniform, which improves the use of the touch structure in the space of the protection circuit, and therefore reduces the exposure of some types of touch structures due to insufficient space. The problem that metal lines cannot be protected. In addition, since the uniform thickness of the screen-printed insulating adhesive layer is less than the thickness of the adhesive area, the original uneven thickness of the glue layer exceeds the thickness of the adhesive layer of the touch module, resulting in poor appearance of dents and foamy appearance Bad problems can also be improved.
本發明參考附圖作說明,其中相似的參考數字使用在相近或是等價的元件上。這些附圖並未按照實際尺寸繪製,僅僅是提供用於說明本發明。The present invention is described with reference to the accompanying drawings, in which similar reference numerals are used for similar or equivalent components. The drawings are not drawn according to actual size, but are merely provided to illustrate the present invention.
第1圖繪示本揭露之一實施方式之觸控模組100的上視示意圖。第2圖繪示第1圖沿線段2-2之剖面圖。同時參考第1圖與第2圖,在本實施方式中,觸控模組100包含觸控感應層110、保護板120、透光膠區130、軟性印刷電路142以及網印絕緣膠層146。如第1圖所示,觸控感應層110具有電極區110a,軟性印刷電路142電性連接於觸控感應層110的電極區110a。FIG. 1 is a schematic top view of the
如第2圖所示,保護板120位於觸控感應層110上方。在本實施方式中,觸控模組100所使用保護板120是蓋板玻璃(Cover lens)。As shown in FIG. 2, the
如第2圖所示,透光膠區130位於觸控感應層110與保護板120之間,用以使保護板120貼合於觸控感應層110上,以保護觸控感應層110。在本實施方式中,透光膠區130是光學透明膠(Optical clear adhesive 1,OCA1),當觸控模組100應用於顯示模組上,透明的光學透明膠將不會影響顯示模組太多的功能。As shown in FIG. 2, the light-transmitting
在第2圖中,軟性印刷電路142位於觸控感應層110上,而軟性印刷電路142的電連接區142a使用導電膠144電性附貼於觸控感應層110的電極區110a上。而如第1圖與第2圖所繪示,在本實施方式中,軟性印刷電路142僅有電連接區142a是連接於觸控感應層110上,觸控感應層110藉軟性印刷電路142連接至外部的控制元件及/或驅動元件,藉以傳送電子訊號。In FIG. 2, the flexible printed
在本實施方式中,軟性印刷電路142所使用的導電膠144是異方性導電膠(Anisotropic Conductive Film,ACF),這種異方性導電膠是一種在垂直方向導電的黏膠,因此軟性印刷電路142便可以與觸控感應層110電性的連接在一起,以實現觸控的功能。In this embodiment, the
網印絕緣膠層146位於軟性印刷電路142上,並與透光膠區130相鄰,並且網印絕緣膠層146會填入透光膠區130與軟性印刷電路142之間的空隙。而如第2圖所示,在一些實施方式中,網印絕緣膠層146會填滿透光膠區130與軟性印刷電路142之間所有的空隙,但僅僅是示例性的,而不應以此為限。網印絕緣膠層146具有防水的作用,可以保護軟性印刷電路142。而在一些實施方式中,網印絕緣膠層146的表面阻抗介於1x1010
Ω/□到1x1013
Ω/□之間,因此也能在絕緣方面保護軟性印刷電路142。The screen-printed
在本實施方式中,觸控模組100的網印絕緣膠層146是使用網印的方式覆蓋於軟性印刷電路142,而此網印絕緣膠層146是冷紫外光固化絕緣膠。這種冷紫外光固化絕緣膠使用冷紫外光固化製程做固化,而冷紫外光固化製程的製程溫度範圍介於25o
C到50o
C之間。在一些實施方式中,網印絕緣膠層146是丙烯酸酯低聚物/壓克力樹脂與單體壓克力樹脂的混合物。而在一些實際方式中,網印絕緣膠層146的材料可是是具有透明絕緣性質的材料。In this embodiment, the screen-printed
如第2圖所示,網印絕緣膠層146還具有上表面146a,表面146a是平整的。相較於傳統利用點膠的方式保護軟性電路,使用網印的方式形成網印絕緣膠層146的表面146a較為均勻平整,使得觸控結構在保護線路的空間使用上獲得改善,因此減少部分類型的觸控結構因空間不足而使得裸露的金屬線路無法被保護的問題。As shown in Figure 2, the screen-printed insulating
回到第2圖,網印絕緣膠層146具有厚度W1,透光膠區130具有厚度W2。其中,厚度W1介於6微米到75微米之間,並且厚度W1是小於透光膠區130的厚度W2,因此網印絕緣膠層146的上表面146a將不會與保護板120接觸。如此一來,網印絕緣膠層146與保護板120之間將會具有空隙而保持彼此不接觸,保護板120的凹痕外觀不良問題與泡沫狀外觀不良問題將能獲得改善。Returning to FIG. 2, the screen-printed insulating
在本實施方式中,觸控模組100的觸控感應層110是是具有氧化銦錫薄膜圖樣或是金屬網膜圖樣的絕緣層。其中,氧化銦錫薄膜與金屬網膜都是透明的導電薄膜。在一些實施方式中,氧化銦錫薄膜與金屬網膜這些導電薄膜能夠相應觸控感應層110的電容變化,產生相應的電訊號,並通過軟性印刷電路142實現觸控的功能。當觸控模組100是應用於顯示模組時,透明的觸控感應層110將不會影響顯示模組太多的功能。In this embodiment, the
第3圖繪示本實施方式的觸控模組100應用於顯示模組150的結構示意圖,本實施方式的觸控模組100結構參考第2圖。根據第3圖,顯示模組150位於觸控感應層110下方,並使用全平面貼合(Diret-bonding)的方式貼合觸控感應層110。在一些實施方式,顯示模組150是液晶顯示模組(LCM)或是有機發光二極體(OLED)。在使用全平面貼合的方式做貼合時,所使用的是光學透明膠152a,光學透明膠152a將不會太影響顯示模組150的顯示功能。FIG. 3 is a schematic diagram showing the structure of the
第4圖繪示本實施方式的觸控模組100另一種應用於顯示模組150的結構示意圖。第4圖之應用方式,與第3圖之差異在於顯示模組150與觸控模組100之間的貼合方式。在第4圖中,顯示模組150與觸控模組100之間是使用口字膠貼合(Air-bonding)的方式做貼合。在使用口字膠貼合時,所使用的是框膠152b,而框膠152b只會部分地覆蓋於顯示模組150上,而不會使用顯示模組150與觸控模組100之間的所有空間。FIG. 4 is a schematic diagram showing another structure of the
如此一來,根據第3圖與第4圖,便可將本揭露之觸控模組100應用於顯示模組150上,整合為具備觸控功能之顯示裝置。In this way, according to FIGS. 3 and 4, the
本揭露之另一實施方式,為一種製造觸控模組的方法,這種方法首先提供觸控感應層。隨後,形成光學透明膠區於觸控感應層上,並貼附軟性印刷電路至觸控感應層。在一些實施方式中,貼附軟性印刷電路至觸控感應層的方法,是使用一種貼附軟性印刷電路於玻璃(Flexible printed circuit on glass,FOG)的製程。接下來,網印絕緣膠層覆蓋軟性印刷電路與觸控感應層的電性連接區上,並使用冷紫外光固化絕緣膠層,使絕緣膠層的厚度小於光學透明膠區的厚度。Another embodiment of the present disclosure is a method of manufacturing a touch module. This method first provides a touch sensing layer. Subsequently, an optically transparent glue area is formed on the touch sensing layer, and a flexible printed circuit is attached to the touch sensing layer. In some embodiments, the method of attaching the flexible printed circuit to the touch sensing layer is to use a flexible printed circuit on glass (FOG) process. Next, the screen-printed insulating glue layer covers the electrical connection area between the flexible printed circuit and the touch sensing layer, and the insulating glue layer is cured with cold ultraviolet light to make the thickness of the insulating glue layer smaller than the thickness of the optically transparent glue area.
根據上述製造觸控模組的方法,在一些實施方式中,使用冷紫外光固化絕緣膠層這一步驟,其溫度是介於25o C到50o C的範圍之間。如此一來,便可在軟性印刷電路上,形成一厚度介於6微米到75微米之間,此厚度是小於光學透明膠的厚度。而且,絕緣膠層的表面是平整的。The method for producing the above-described touch module, in some embodiments, the insulating adhesive layer using a cold UV curing this step, the temperature is within a range from 25 o C to 50 o C to. In this way, a thickness between 6 microns and 75 microns can be formed on the flexible printed circuit, which is smaller than the thickness of the optical transparent glue. Moreover, the surface of the insulating glue layer is flat.
當使用上述之製造觸控模組的方法形成觸控模組,當要於此觸控模組上方連接其他保護材時,由於絕緣膠層的厚度小於光學透明膠區的厚度,絕緣膠層將不會接觸保護材,而在絕緣層與保護材之間留有空隙,因此不會有傳統使用點膠方式保護軟性印刷電路所產生的問題,例如保護層凹痕外觀不良問題,或是泡沫狀外觀不良問題。此外,由於觸控結構在保護線路的空間使用上獲得改善,因此減少部分類型的觸控結構由於空間不足,而使得裸露的金屬線路無法被保護的問題。When using the above-mentioned method of manufacturing a touch module to form a touch module, when other protective materials are to be connected above the touch module, since the thickness of the insulating glue layer is less than the thickness of the optically transparent glue area, the insulating glue layer will Will not touch the protective material, but leave a gap between the insulating layer and the protective material, so there will be no problems caused by the traditional use of dispensing to protect the flexible printed circuit, such as the appearance of the dent of the protective layer, or foam Poor appearance problem. In addition, since the touch structure has improved the use of space for the protection circuit, the problem that some types of touch structures cannot be protected due to insufficient space is reduced.
前面描述了若干實施方式的特徵,使得本領域技術人員可以各方面更好地理解本說明。本領域的技術人員應理解到,他們可以很容易的使用本說明作為基礎,設計或修改其他的過程與結構,以實現與本文介紹實施方式相同的目的或優點。本領域的技術人員也應理解到,這樣等價的結構不脫離本說明相通的精神與範圍,並在不脫離本說明的精神與範圍的情況下,可以進行各種變化、替換或是變更。The features of several embodiments are described above so that those skilled in the art can better understand the description in various aspects. Those skilled in the art should understand that they can easily use this description as a basis to design or modify other processes and structures to achieve the same purposes or advantages as the embodiments introduced herein. Those skilled in the art should also understand that such an equivalent structure does not depart from the common spirit and scope of this description, and various changes, substitutions or alterations can be made without departing from the spirit and scope of this description.
100:觸控模組
110:觸控感應層
110a:電極區
120:保護板
130:透光膠區
142:軟性印刷電路
142a:電連接區
144:導電膠
146:網印絕緣膠層
146a:表面
150:顯示模組
152a:光學透明膠
152b:框膠
2-2:線段
W1:厚度
W2:厚度100: Touch module
110:
本揭露的優點與圖式,應由接下來列舉的實施方式,並參考附圖,以獲得更好的理解。這些圖式的說明僅僅是列舉的實施方式,因此不該認為是限制了個別實施方式,或是限制了發明申請專利範圍的範圍。 第1圖繪示本揭露之一實施方式之觸控模組的上視示意圖。 第2圖繪示第1圖沿線段2-2之剖面圖。 第3圖繪示本揭露之一實施方式之觸控模組應用於顯示模組的結構示意圖。 第4圖繪示本揭露另一實施方式之觸控模組應用於顯示模組的結構示意圖。The advantages and drawings of the present disclosure should be understood by the following embodiments and with reference to the accompanying drawings. The descriptions of these drawings are only examples of implementations, and therefore should not be considered as limiting individual implementations or limiting the scope of patent applications for inventions. FIG. 1 is a schematic top view of a touch module according to an embodiment of the disclosure. Figure 2 shows a cross-sectional view of Figure 1 along line 2-2. FIG. 3 is a schematic diagram showing the structure of the touch module according to one embodiment of the disclosure applied to the display module. FIG. 4 is a schematic structural diagram of a touch module according to another embodiment of the present disclosure applied to a display module.
100:觸控模組 100: Touch module
110:觸控感應層 110: Touch sensing layer
110a:電極區 110a: electrode area
120:保護層 120: protective layer
130:透光膠區 130: Transparent plastic area
142:軟性印刷電路 142: Flexible printed circuit
142a:電連接區 142a: Electrical connection area
144:黏膠 144: viscose
146:網印絕緣膠層 146: Screen printing insulating adhesive layer
146a:表面 146a: Surface
W1、W2:厚度 W1, W2: thickness
Claims (10)
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TWI703479B TWI703479B (en) | 2020-09-01 |
TW202038069A true TW202038069A (en) | 2020-10-16 |
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CN110518050A (en) * | 2019-08-30 | 2019-11-29 | 昆山国显光电有限公司 | Display panel and preparation method thereof and display device |
CN110703949B (en) * | 2019-10-10 | 2022-05-13 | 业成科技(成都)有限公司 | Improved structure for insulation glue protection |
CN112625614B (en) * | 2020-12-10 | 2023-03-17 | 业成科技(成都)有限公司 | Conductive structure, preparation method thereof and touch display device |
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TWI575281B (en) * | 2009-08-19 | 2017-03-21 | Elan Microelectronics Corp | Capacitive touch panel and manufacturing method thereof |
JP5840598B2 (en) * | 2012-12-17 | 2016-01-06 | 株式会社ジャパンディスプレイ | Display device with touch detection function, electronic device, and manufacturing method of display device with touch detection function |
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KR102361436B1 (en) * | 2017-06-13 | 2022-02-11 | 삼성디스플레이 주식회사 | Display apparatus |
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TWI703479B (en) | 2020-09-01 |
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