TW202034040A - Backlight module and light bar used for the same - Google Patents

Backlight module and light bar used for the same Download PDF

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Publication number
TW202034040A
TW202034040A TW108111860A TW108111860A TW202034040A TW 202034040 A TW202034040 A TW 202034040A TW 108111860 A TW108111860 A TW 108111860A TW 108111860 A TW108111860 A TW 108111860A TW 202034040 A TW202034040 A TW 202034040A
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Taiwan
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light
emitting diode
guide plate
backlight module
emitting diodes
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TW108111860A
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Chinese (zh)
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TWI705286B (en
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姜培生
袁冬梅
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大陸商蘇州璨宇光學有限公司
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • F21V2200/20—Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

A backlight module includes a first light guide plate, a second light guide plate, multiple first LEDs and multiple second LEDs. The first light guide plate has at least one light incident surface, and the second light guide plate is disposed under the first light guide plate and has at least one light incident surface. The first LEDs are disposed beside the light incident surface of the first light guide plate and electrically connected to a printed circuit board. The second LEDs are disposed beside the light incident surface of the second light guide plate and electrically connected to a flexible board.

Description

背光模組及用於背光模組的發光二極體燈條 Backlight module and light-emitting diode light bar for backlight module

本發明關於一種背光模組及用於背光模組的發光二極體燈條。 The invention relates to a backlight module and a light emitting diode light bar used for the backlight module.

於目前的背光模組設計中，為了因應特定需求例如提供局部調光(Local dimming)的效果，會使用具有雙排發光二極體(LED)的燈條結構。如圖1A及1B所示，於一習知背光模組100中，上排發光二極體106及下排發光二極體108分別設於一上導光板104a及一下導光板104b旁，且單一印刷電路板102需同時分佈上排發光二極體106、下排發光二極體108及其線路。然而，因背光模組100本身的厚度限制，印刷電路板102的寬度不能過寬，故難以排佈所有發光二極體的線路且容易導致上下排發光二極體的間距G過小，且發光二極體及其線路密集分佈於有限的電路板空間，會導致散熱不佳，降低成品使用壽命。 In the current backlight module design, in order to meet specific requirements, such as providing local dimming effects, a light bar structure with double-row light emitting diodes (LED) is used. As shown in FIGS. 1A and 1B, in a conventional backlight module 100, the upper row of light-emitting diodes 106 and the lower row of light-emitting diodes 108 are respectively disposed beside an upper light guide plate 104a and a lower light guide plate 104b, and a single The printed circuit board 102 needs to simultaneously distribute the upper row of light-emitting diodes 106, the lower row of light-emitting diodes 108 and their circuits. However, due to the limitation of the thickness of the backlight module 100 itself, the width of the printed circuit board 102 cannot be too wide, so it is difficult to arrange all the lines of the light-emitting diodes and it is easy to cause the distance G between the upper and lower rows of light-emitting diodes to be too small, and the two light-emitting diodes The pole bodies and their circuits are densely distributed in a limited circuit board space, which will cause poor heat dissipation and reduce the service life of the finished product.

“先前技術”段落只是用來幫助了解本發明內容，因此在“先前技術”段落所揭露的內容可能包含一些沒有構成所屬技術領域中具有通常知識者所知道的習知技術。在“先前技術”段落所揭露的內容，不代表該內容或者本發明一個或多個實施例所要解決的問題，在本發明申請前已被所屬技術領域中具有通常知識者所知曉或認知。 The "prior art" paragraph is only used to help understand the content of the present invention. Therefore, the content disclosed in the "prior art" paragraph may contain some conventional technologies that do not constitute the common knowledge in the technical field. The content disclosed in the "prior art" paragraph does not represent the content or the problem to be solved by one or more embodiments of the present invention, and has been known or recognized by those with ordinary knowledge in the technical field before the application of the present invention.

本發明提供一種背光模組及用於背光模組的發光二極體燈條。 The invention provides a backlight module and a light-emitting diode light bar for the backlight module.

本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。 Other objectives and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

為達到上述之一或部份或全部目的或是其他目的，本發明一實施例提供一種背光模組，包含一第一導光板、一第二導光板、多個第一發光二極體及多個第二發光二極體。第一導光板具有至少一入光面，第二導光板設置於第一導光板的下方且具有至少一入光面。第一發光二極體設置於第一導光板的至少一入光面旁且電連接一印刷電路板，第二發光二極體設置於第二導光板的至少一入光面旁且電連接一軟性基板。 In order to achieve one or part or all of the above objects or other objects, an embodiment of the present invention provides a backlight module, which includes a first light guide plate, a second light guide plate, a plurality of first light-emitting diodes and a plurality of A second light emitting diode. The first light guide plate has at least one light incident surface, and the second light guide plate is disposed under the first light guide plate and has at least one light incident surface. The first light emitting diode is arranged beside at least one light incident surface of the first light guide plate and electrically connected to a printed circuit board, and the second light emitting diode is arranged beside at least one light incident surface of the second light guide plate and electrically connected to one Flexible substrate.

於一實施例中，多個第一發光二極體沿一方向排列成一列，且多個第二發光二極體沿同一方向排列成另一列。 In one embodiment, the plurality of first light emitting diodes are arranged in one row along one direction, and the plurality of second light emitting diodes are arranged in another row along the same direction.

於一實施例中，第一發光二極體及第二發光二極體均設置於印刷電路板上，第一發光二極體連接印刷電路板的線路且第二發光二極體不連接印刷電路板的線路。 In one embodiment, the first light emitting diode and the second light emitting diode are both arranged on the printed circuit board, the first light emitting diode is connected to the circuit of the printed circuit board and the second light emitting diode is not connected to the printed circuit The circuit of the board.

於一實施例中，多個第一發光二極體配置於第一導光板的四周，且多個第二發光二極體配置於第二導光板的四周。 In one embodiment, the plurality of first light-emitting diodes are arranged around the first light guide plate, and the plurality of second light-emitting diodes are arranged around the second light guide plate.

於一實施例中，各個第一發光二極體為向上發光型發光二極體，且各個第二發光二極體為側向發光型發光二極體。 In one embodiment, each of the first light emitting diodes is an upward emitting type light emitting diode, and each of the second light emitting diodes is a side emitting type light emitting diode.

於一實施例中，軟性基板可為一軟排線(FFC)或一撓性電路板(FPC)。 In one embodiment, the flexible substrate may be a flexible cable (FFC) or a flexible circuit board (FPC).

本發明另一實施例提供一種背光模組，包含一基板、一第一發光二極體列及一第二發光二極體列。第一發光二極體列及第二發光二極體列設於基板且彼此具有一間距。第一發光二極體列係由 多個向上發光型發光二極體組成，且第二發光二極體列係由多個側向發光型發光二極體組成。 Another embodiment of the present invention provides a backlight module including a substrate, a first light-emitting diode row and a second light-emitting diode row. The first light emitting diode row and the second light emitting diode row are arranged on the substrate and have a distance from each other. The first light-emitting diode array is composed of A plurality of upward emitting type light emitting diodes are formed, and the second array of light emitting diodes is composed of a plurality of side emitting type light emitting diodes.

本發明的實施例至少具有以下其中一個優點。藉由上述各個實施例的設計，因設有第一發光二極體及第二發光二極體的電路板僅需設置連接第一發光二極體的線路而不需針對第二發光二極體佈線，因此上排的第一發光二極體及下排的第二發光二極體間可具有較大的間距，且每一排發光二極體對應的佈線及散熱空間增大，使佈線較為容易，且可提供良好的散熱效果。 The embodiments of the present invention have at least one of the following advantages. With the design of each of the above embodiments, the circuit board provided with the first light-emitting diode and the second light-emitting diode only needs to be provided with a circuit connecting the first light-emitting diode and does not need to be directed to the second light-emitting diode Therefore, the first light-emitting diode in the upper row and the second light-emitting diode in the lower row can have a larger distance, and the wiring and heat dissipation space corresponding to each row of light-emitting diodes are increased, making the wiring more Easy and can provide good heat dissipation effect.

本發明的其他目的和優點可以從本發明所揭露的技術特徵中得到進一步的了解。為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉實施例並配合所附圖式，作詳細說明如下。 Other objectives and advantages of the present invention can be further understood from the technical features disclosed in the present invention. In order to make the above and other objectives, features and advantages of the present invention more comprehensible, the following specific embodiments and accompanying drawings are described in detail as follows.

10、30‧‧‧背光模組 10, 30‧‧‧Backlight module

12‧‧‧第一導光板 12‧‧‧First light guide plate

14‧‧‧第二導光板 14‧‧‧Second light guide plate

12a‧‧‧第一入光面 12a‧‧‧First light incident surface

14a‧‧‧第二入光面 14a‧‧‧The second light incident surface

16‧‧‧第一發光二極體 16‧‧‧First light-emitting diode

18‧‧‧第二發光二極體 18‧‧‧Second LED

20‧‧‧發光二極體燈條 20‧‧‧LED strip

22‧‧‧印刷電路板 22‧‧‧Printed Circuit Board

24‧‧‧軟排線 24‧‧‧Flexible cable

32a、32b、32c、32d‧‧‧側面 32a, 32b, 32c, 32d‧‧‧ side

R1、R2‧‧‧發光二極體列 R1, R2‧‧‧LED array

G‧‧‧間距 G‧‧‧Pitch

100‧‧‧背光模組 100‧‧‧Backlight Module

102‧‧‧印刷電路板 102‧‧‧Printed Circuit Board

104a‧‧‧上導光板 104a‧‧‧Upper light guide plate

104b‧‧‧下導光板 104b‧‧‧Lower light guide plate

106、108‧‧‧發光二極體 106、108‧‧‧Light-emitting diode

圖1A及圖1B為一習知背光模組的示意圖。 1A and 1B are schematic diagrams of a conventional backlight module.

圖2為本發明一實施例的背光模組的示意圖，圖3A及圖3B為用於圖2的背光模組的發光二極體燈條的示意圖。 2 is a schematic diagram of a backlight module according to an embodiment of the present invention, and FIGS. 3A and 3B are schematic diagrams of a light emitting diode light bar used in the backlight module of FIG. 2.

圖4為本發明另一實施例的背光模組的示意圖 4 is a schematic diagram of a backlight module according to another embodiment of the invention

有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：上、下、左、右、前或後等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明並非用來限制本發明。 The foregoing and other technical content, features, and effects of the present invention will be clearly presented in the following detailed description of the embodiments with reference to the drawings. The directional terms mentioned in the following embodiments, for example: up, down, left, right, front or back, etc., are only directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate but not to limit the present invention.

圖2為本發明一實施例的背光模組的示意圖，圖3A及圖3B為用於圖2的背光模組的發光二極體燈條的示意圖。如圖2 所示，背光模組10包含第一導光板12、第二導光板14、及設於第一導光板12及第二導光板14旁的一發光二極體燈條20。於本實施例中，發光二極體燈條20包含一印刷電路板22及設於印刷電路板22的多個第一發光二極體16及多個第二發光二極體18。第一導光板12具有至少一第一入光面12a，第二導光板14設置於第一導光板12的下方且具有至少一第二入光面14a。第一發光二極體16設置於第一導光板12的第一入光面12a旁，且第二發光二極體18設置於第二導光板14的一第二入光面14a旁。如圖3A及圖3B所示，多個第一發光二極體16可沿一方向排列成一發光二極體列R1並電連接印刷電路板22，多個第二發光二極體18可例如沿相同方向排列成另一發光二極體列R2並電連接一軟排線24。因此，請再參考圖2，於本實施例中，發光二極體16組成的發光二極體列R1及發光二極體18組成的發光二極體列R2可均設置於印刷電路板22上並具有一間距G，因第二發光二極體18可獨立連接至軟排線24的線路，故印刷電路板22僅需針對第一發光二極體16而不需針對第二發光二極體18佈線，且第二發光二極體18因連接下方具撓性的軟排線24故可位於印刷電路板22的底部，因此上排的第一發光二極體16及下排的第二發光二極體18間可具有較大的間距G。 2 is a schematic diagram of a backlight module according to an embodiment of the present invention, and FIGS. 3A and 3B are schematic diagrams of a light emitting diode light bar used in the backlight module of FIG. 2. Figure 2 As shown, the backlight module 10 includes a first light guide plate 12, a second light guide plate 14, and a light emitting diode light bar 20 arranged beside the first light guide plate 12 and the second light guide plate 14. In this embodiment, the light-emitting diode light bar 20 includes a printed circuit board 22 and a plurality of first light-emitting diodes 16 and a plurality of second light-emitting diodes 18 disposed on the printed circuit board 22. The first light guide plate 12 has at least one first light incident surface 12 a, and the second light guide plate 14 is disposed under the first light guide plate 12 and has at least one second light incident surface 14 a. The first light emitting diode 16 is disposed beside the first light incident surface 12 a of the first light guide plate 12, and the second light emitting diode 18 is disposed beside a second light incident surface 14 a of the second light guide plate 14. As shown in FIGS. 3A and 3B, a plurality of first light-emitting diodes 16 can be arranged in a light-emitting diode row R1 along a direction and electrically connected to the printed circuit board 22, and a plurality of second light-emitting diodes 18 can be arranged along Arranged in the same direction to form another light emitting diode row R2 and electrically connected to a flexible flat cable 24. Therefore, please refer to FIG. 2 again. In this embodiment, the light-emitting diode row R1 composed of the light-emitting diodes 16 and the light-emitting diode row R2 composed of the light-emitting diodes 18 can both be arranged on the printed circuit board 22 And there is a gap G. Because the second light-emitting diode 18 can be independently connected to the circuit of the flexible flat cable 24, the printed circuit board 22 only needs to target the first light-emitting diode 16 and not the second light-emitting diode 18 wiring, and the second light-emitting diode 18 can be located at the bottom of the printed circuit board 22 because it is connected to the flexible flexible cable 24 below, so the first light-emitting diode 16 in the upper row and the second light-emitting diode in the lower row There may be a larger distance G between the diodes 18.

一般而言，印刷電路板佈線需要不交叉以避免短路，如圖1A及圖1B所示的習知設計需在同一電路板同時分佈第一發光二極體16與第二發光二極體18的線路，因此整體的線路佈局及製程複雜，且線路密集分佈於有限的電路板空間會導致散熱不佳，降低成品使用壽命。藉由本實施例的設計，因第二發光二極體18獨立連接至軟排線24的線路，故印刷電路板22僅需設置連接第一發光二極體16的線路而不需針對第二發光二極體18佈線，故每一排發光二極體 對應的佈線及散熱空間增大，且兩排發光二極體間形成的間距G變大，使佈線較為容易且可提供良好的散熱效果。 Generally speaking, the printed circuit board wiring needs not to cross to avoid short circuits. The conventional design shown in FIG. 1A and FIG. 1B needs to distribute the first light-emitting diode 16 and the second light-emitting diode 18 on the same circuit board. Therefore, the overall circuit layout and manufacturing process are complicated, and the dense distribution of the circuits in the limited circuit board space will lead to poor heat dissipation and reduce the service life of the finished product. With the design of this embodiment, since the second light-emitting diode 18 is independently connected to the circuit of the flexible flat cable 24, the printed circuit board 22 only needs to be provided with a circuit connected to the first light-emitting diode 16 and does not need to be directed to the second light-emitting diode. Diode 18 wiring, so each row of LED The corresponding wiring and heat dissipation space is increased, and the gap G formed between the two rows of light-emitting diodes becomes larger, making wiring easier and providing good heat dissipation effects.

再者，於一實施例中，第一發光二極體16可為向上發光型發光二極體，且第二發光二極體18可為側向發光型發光二極體。因向上發光型發光二極體具有與電極面垂直的方向出光的特性，側向發光型發光二極體具有與電極面平行的方向出光的特性，藉由向上發光型發光二極體連接印刷電路板22且側向發光型發光二極體連接軟排線24的設計，可於寬度有限的電路板上獲得較佳的空間配置效果。 Furthermore, in one embodiment, the first light emitting diode 16 may be an upward emitting type light emitting diode, and the second light emitting diode 18 may be a side emitting type light emitting diode. Because the upward emitting type light emitting diode has the characteristic of emitting light in a direction perpendicular to the electrode surface, the side emitting type light emitting diode has the characteristic of emitting light in a direction parallel to the electrode surface, and the upward emitting type light emitting diode is connected to the printed circuit The design of the board 22 and the side-emitting light-emitting diode connected to the flexible flat cable 24 can achieve a better space configuration effect on a circuit board with a limited width.

另外，第一發光二極體16及第二發光二極體18或發光二極體列R1、R2的數量及相對第一導光板12及第二導光板14的配置關係完全不限定，且可視實際需求加以變化。舉例而言，亦可設置三列以上的發光二極體，僅需將至少一發光二極體列另外獨立佈線而不於承載所有發光二極體的基板上佈線，即可獲得對應增大每一排發光二極體的佈線及散熱空間的效果。再者，於一實施例中，如圖4所示，背光模組30的發光二極體16、18可分別配置於第一導光板12及第二導光板14的四周並分別由第一導光板12及第二導光板14的四個側面32a、32b、32c及32d入光，以利於進行整體畫面的局部區域調光。 In addition, the number of the first light-emitting diode 16 and the second light-emitting diode 18 or the number of the light-emitting diode rows R1 and R2 and the arrangement relationship with the first light guide plate 12 and the second light guide plate 14 are not limited at all, and can be seen The actual needs are changed. For example, more than three rows of light-emitting diodes can also be provided, and at least one row of light-emitting diodes needs to be separately wired instead of on the substrate carrying all the light-emitting diodes, and the corresponding increase in each row can be obtained. The wiring of a row of light-emitting diodes and the effect of heat dissipation space. Furthermore, in one embodiment, as shown in FIG. 4, the light-emitting diodes 16, 18 of the backlight module 30 can be respectively disposed around the first light guide plate 12 and the second light guide plate 14 and are respectively guided by the first The four side surfaces 32a, 32b, 32c, and 32d of the light plate 12 and the second light guide plate 14 receive light to facilitate local dimming of the overall picture.

需注意上述的印刷電路板及軟排線僅為例示而不限定，僅需將至少一發光二極體列獨立佈線於另一基板而不於承載所有發光二極體的基板上佈線，即可獲得對應增大每一排發光二極體的佈線及散熱空間的效果。另外，獨立佈線的另一基板可為軟性基板較佳，以藉由可撓曲的特性提高配置位置的選擇彈性並減少基板所佔空間。於一實施例中，軟性基板例如可為上述的軟排線(FFC)，或可為 撓性電路板(FPC)等而不限定。 It should be noted that the above-mentioned printed circuit boards and flexible cables are only examples and not limited. It is only necessary to wire at least one light-emitting diode row independently on another substrate instead of wiring on the substrate carrying all the light-emitting diodes. Obtain the effect of correspondingly increasing the wiring and heat dissipation space of each row of light-emitting diodes. In addition, another substrate with independent wiring may be a flexible substrate, so as to improve the flexibility of the selection of the arrangement position and reduce the space occupied by the substrate due to its flexibility. In one embodiment, the flexible substrate may be the above-mentioned flexible cable (FFC), or may be Flexible circuit board (FPC) etc. are not limited.

綜上所述，本發明的實施例至少具有以下其中一個優點，藉由上述各個實施例的設計，因設有第一發光二極體及第二發光二極體的電路板僅需設置連接第一發光二極體的線路而不需針對第二發光二極體佈線，因此上排的第一發光二極體及下排的第二發光二極體間可具有較大的間距，且每一排發光二極體對應的佈線及散熱空間相對增大，使得佈線較為容易，且可提供良好的散熱效果。 In summary, the embodiments of the present invention have at least one of the following advantages. Through the design of the above embodiments, the circuit board with the first light-emitting diode and the second light-emitting diode only needs to be connected to the first light-emitting diode. The wiring of a light-emitting diode does not need to be wired to the second light-emitting diode, so the first light-emitting diode in the upper row and the second light-emitting diode in the lower row can have a larger distance, and each The wiring and heat dissipation space corresponding to the row of light-emitting diodes are relatively increased, making wiring easier and providing good heat dissipation effects.

惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。另外本發明的任一實施例或申請專利範圍不須達成本發明所揭露之全部目的或優點或特點。此外，本說明書或申請專利範圍中提及的「第一」、「第二」等用語僅用以命名元件的名稱或區別不同實施例或範圍，而並非用來限制元件數量上的上限或下限。 However, the foregoing are only preferred embodiments of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made in accordance with the scope of the patent application of the present invention and the description of the invention, All are still within the scope of the invention patent. In addition, any embodiment of the present invention or the scope of the patent application does not have to achieve all the objectives or advantages or features disclosed in the present invention. In addition, the terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name the names of elements or to distinguish different embodiments or ranges, and are not used to limit the upper or lower limit of the number of elements .

10‧‧‧背光模組 10‧‧‧Backlight Module

12‧‧‧第一導光板 12‧‧‧First light guide plate

14‧‧‧第二導光板 14‧‧‧Second light guide plate

12a‧‧‧第一入光面 12a‧‧‧First light incident surface

14a‧‧‧第二入光面 14a‧‧‧The second light incident surface

16‧‧‧第一發光二極體 16‧‧‧First light-emitting diode

18‧‧‧第二發光二極體 18‧‧‧Second LED

20‧‧‧發光二極體燈條 20‧‧‧LED strip

22‧‧‧印刷電路板 22‧‧‧Printed Circuit Board

24‧‧‧軟排線 24‧‧‧Flexible cable

R1、R2‧‧‧發光二極體列 R1, R2‧‧‧LED array

G‧‧‧間距 G‧‧‧Pitch

Claims (10)

一種背光模組，包含：一第一導光板，具有至少一入光面；一第二導光板，設置於該第一導光板的下方且具有至少一入光面；多個第一發光二極體，設置於該第一導光板的該至少一入光面旁且電連接一印刷電路板；以及多個第二發光二極體，設置於該第二導光板的該至少一入光面旁且電連接一軟性基板。 A backlight module includes: a first light guide plate having at least one light incident surface; a second light guide plate disposed under the first light guide plate and having at least one light incident surface; and a plurality of first light emitting diodes Body, arranged beside the at least one light incident surface of the first light guide plate and electrically connected to a printed circuit board; and a plurality of second light emitting diodes arranged beside the at least one light incident surface of the second light guide plate And electrically connected to a flexible substrate. 如申請專利範圍第1項所述之背光模組，其中該些第一發光二極體沿一第一方向排列成一列，且該些第二發光二極體沿該第一方向排列成另一列。 The backlight module as described in claim 1, wherein the first light-emitting diodes are arranged in a row along a first direction, and the second light-emitting diodes are arranged in another row along the first direction . 如申請專利範圍第1項所述之背光模組，其中該些第一發光二極體及該些第二發光二極體均設置於該印刷電路板上，該些第一發光二極體連接該印刷電路板的線路且該些第二發光二極體不連接該印刷電路板的線路。 As for the backlight module described in claim 1, wherein the first light-emitting diodes and the second light-emitting diodes are all arranged on the printed circuit board, and the first light-emitting diodes are connected The circuit of the printed circuit board and the second light-emitting diodes are not connected to the circuit of the printed circuit board. 如申請專利範圍第1項所述之背光模組，其中該些第一發光二極體配置於該第一導光板的四周，且該些第二發光二極體配置於該第二導光板的四周。 As for the backlight module described in claim 1, wherein the first light-emitting diodes are arranged around the first light guide plate, and the second light-emitting diodes are arranged on the second light guide plate All around. 如申請專利範圍第1項所述之背光模組，其中各該第一發光二極體係為向上發光型發光二極體，且各該第二發光二極體係為側向發光型發光二極體。 The backlight module described in item 1 of the scope of patent application, wherein each of the first light emitting diode system is an upward emitting type light emitting diode, and each of the second light emitting diode system is a side emitting type light emitting diode . 如申請專利範圍第1項所述之背光模組，其中該軟性基板為一軟排線。 In the backlight module described in the first item of the scope of patent application, the flexible substrate is a flexible flat cable. 如申請專利範圍第1項所述之背光模組，其中該軟性基板為一撓性電路板。 In the backlight module described in the first item of the scope of patent application, the flexible substrate is a flexible circuit board. 一種用於背光模組的發光二極體燈條，包含：一基板；以及一第一發光二極體列及一第二發光二極體列，設於該基板且彼此具有一間距，其中該第一發光二極體列係由多個向上發光型發光二極體組成，且該第二發光二極體列係由多個側向發光型發光二極體組成。 A light-emitting diode light bar for a backlight module includes: a substrate; and a first light-emitting diode row and a second light-emitting diode row, which are arranged on the substrate and have a distance from each other, wherein the The first light emitting diode array is composed of a plurality of upward emitting type light emitting diodes, and the second light emitting diode array is composed of a plurality of side emitting type light emitting diodes. 如申請專利範圍第8項所述的發光二極體燈條，其中該基板係為印刷電路板，該第一發光二極體列連接該印刷電路板的線路且該第二發光二極體列不連接該印刷電路板的線路。 The light-emitting diode light bar according to item 8 of the scope of patent application, wherein the substrate is a printed circuit board, the first light-emitting diode row is connected to the circuit of the printed circuit board, and the second light-emitting diode row Do not connect the circuit of the printed circuit board. 如申請專利範圍第9項所述的發光二極體燈條，其中該第二發光二極體列連接一軟性基板的線路。 The light-emitting diode light bar according to item 9 of the scope of patent application, wherein the second light-emitting diode row is connected to a circuit of a flexible substrate.
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