TW202033931A - Complex inspection system of image - Google Patents

Complex inspection system of image Download PDF

Info

Publication number
TW202033931A
TW202033931A TW108107292A TW108107292A TW202033931A TW 202033931 A TW202033931 A TW 202033931A TW 108107292 A TW108107292 A TW 108107292A TW 108107292 A TW108107292 A TW 108107292A TW 202033931 A TW202033931 A TW 202033931A
Authority
TW
Taiwan
Prior art keywords
optical
cabin
image
image composite
inspection
Prior art date
Application number
TW108107292A
Other languages
Chinese (zh)
Other versions
TWI697658B (en
Inventor
黃繼震
黃祈欣
謝宏宗
黃勝茂
Original Assignee
漢民科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 漢民科技股份有限公司 filed Critical 漢民科技股份有限公司
Priority to TW108107292A priority Critical patent/TWI697658B/en
Priority to CN202010143512.9A priority patent/CN111665246A/en
Application granted granted Critical
Publication of TWI697658B publication Critical patent/TWI697658B/en
Publication of TW202033931A publication Critical patent/TW202033931A/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/2206—Combination of two or more measurements, at least one measurement being that of secondary emission, e.g. combination of secondary electron [SE] measurement and back-scattered electron [BSE] measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G01N23/2252—Measuring emitted X-rays, e.g. electron probe microanalysis [EPMA]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/03—Investigating materials by wave or particle radiation by transmission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/05—Investigating materials by wave or particle radiation by diffraction, scatter or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/071—Investigating materials by wave or particle radiation secondary emission combination of measurements, at least 1 secondary emission
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/07—Investigating materials by wave or particle radiation secondary emission
    • G01N2223/079—Investigating materials by wave or particle radiation secondary emission incident electron beam and measuring excited X-rays

Abstract

An electron microscope device and plural optical microscope device with same or different support multiplication are integrated together to form a complex inspection system of image herein. A tested object in vacuum environment is inspected by the electron microscope device, and then inspected by those optical microscope devices in atmosphere environment within an optical inspection zone for establishment of an optical overall image and an optical local image. The magnification of image identification may be efficiently enhanced by the combination of the electron microscope device and the optical microscope devices.

Description

影像複合檢測系統Image composite inspection system

本發明是有關一種影像檢測系統，特別是關於一種檢測一待測物的表面影像的影像複合檢測系統。The invention relates to an image detection system, in particular to an image composite detection system for detecting the surface image of an object to be tested.

光學影像在量測或檢測的應用極為廣泛，一般的光學影像可透過電荷耦合元件CCD來觀看，但目前的CCD的影像解析度受到限制，進而也限制了CCD鏡頭下的視野範圍。若要提高視野範圍，則CCD的倍率要調整為較小，相對地，CCD的影像解析度則必須提高。然而，當量測或檢測的解析度欲提高至奈米等級時，現有的光學CCD無法適用，必須改用解析度較高的電子顯微鏡。Optical images are widely used in measurement or inspection. General optical images can be viewed through a charge-coupled device CCD, but the current CCD image resolution is limited, which in turn limits the field of view under the CCD lens. To increase the field of view, the magnification of the CCD must be adjusted to be smaller, while the image resolution of the CCD must be increased. However, when the resolution of measurement or inspection is to be increased to the nanometer level, the existing optical CCD cannot be applied, and an electron microscope with a higher resolution must be used instead.

但，現有的電子顯微鏡的價格昂貴，且必須在真空環境下進行量測或檢測，故欲大量建置和使用有其難度。有鑑於此，提供一種兼顧費用以及提高解析度的量測或檢測是目前極需努力的目標。However, the existing electron microscopes are expensive and must be measured or inspected in a vacuum environment, so it is difficult to build and use them in large quantities. In view of this, providing a measurement or inspection that takes into account the cost and improves the resolution is a goal that needs to be worked hard at present.

於此提供一種影像複合檢測系統，包括於大氣環境下進行檢測的光學顯微裝置以及於真空環境下進行檢測的電子顯微裝置整合一起，可應用於半導體設備元件的表面檢測、半導體元件或結構的表面檢測、各式工業零組件的表面檢測、或是LED產業、電子製程、生技製藥、醫材、生醫樣品或是化工塗料等的表面檢測。Provided here is an image composite inspection system, which includes an optical microscopy device that performs inspections in an atmospheric environment and an electron microscopy device that performs inspections in a vacuum environment, which are integrated together, which can be applied to the surface inspection of semiconductor equipment components, semiconductor components or structures Surface inspection of various types of industrial components, or surface inspection of LED industry, electronic manufacturing process, biotechnology and pharmaceuticals, medical materials, biomedical samples or chemical coatings.

於此提供一種影像複合檢測系統，包括於大氣環境下進行檢測的光學顯微裝置以及於真空環境下進行檢測的桌上型電子顯微裝置，兼顧擴大影像檢測的倍率以及有效降低成本，可在光學自動檢測(AOI)的檢測應用需求中，提供一可滿足各方面需求且經濟實惠的優質方案。Provided here is an image composite detection system, which includes an optical microscopy device that performs detection in an atmospheric environment and a desktop electronic microscopy device that performs detection in a vacuum environment, which takes into account the magnification of image detection and effectively reduces the cost. In the inspection application requirements of Automatic Optical Inspection (AOI), we provide a cost-effective and high-quality solution that can meet various needs.

於此提供一種影像複合檢測系統，包括於大氣環境下進行檢測的光學顯微裝置以及於真空環境下進行檢測的桌上型電子顯微裝置，整個機台的佔地面積(footprint)可依實際的需求調整，但可檢測的待測物的尺寸可以極大化至50*50cm。An image composite inspection system is provided here, which includes an optical microscopy device for inspection in an atmospheric environment and a desktop electronic microscopy device for inspection in a vacuum environment. The footprint of the entire machine can be based on actual conditions. The size of the test object can be adjusted to 50*50cm.

依據上述，一種影像複合檢測系統，包含：一第一艙體，其提供容置一待測物的一真空環境；一電子顯微裝置設置於該第一艙體上，其在該真空環境中檢測該待測物；一光學檢測區位於該第一艙體外，其提供該待測物的一大氣環境；一第一光學顯微裝置設置於該光學檢測區的範圍內，其在該大氣環境中檢測該待測物，其中該第一光學顯微裝置包括用以建立該待測物的一光學全景影像；一第二光學顯微裝置設置於該光學檢測區的範圍內，其在該大氣環境中檢測該待測物，其中該第二光學顯微裝置包括用以建立該待測物的一光學局部影像；及一移載模組移載該待測物到該第一艙體中以進行檢測或到該光學檢測區內以進行檢測。According to the above, an image composite detection system includes: a first cabin body, which provides a vacuum environment for accommodating an object to be measured; an electron microscopy device is arranged on the first cabin body, which is in the vacuum environment Detect the object to be tested; an optical detection zone is located outside the first cabin, which provides an atmospheric environment for the object to be tested; a first optical microscopy device is arranged within the scope of the optical detection zone, which is in the atmospheric environment Detect the object under test, wherein the first optical microscope device includes an optical panoramic image for establishing the object under test; a second optical microscope device is arranged in the range of the optical detection area, which is in the atmosphere The object under test is detected in the environment, wherein the second optical microscopy device includes an optical partial image for establishing the object under test; and a transfer module transfers the object under test to the first cabin to Perform detection or go to the optical detection zone for detection.

一例中，影像複合檢測系統更包含一第二艙體安排於該第一艙體和該光學檢測區之間；以及複數個閘機構分別控制該第一艙體和該第二艙體的連通和隔絕、以及該光學檢測區和該第二艙體的連通和隔絕。In one example, the image composite detection system further includes a second cabin arranged between the first cabin and the optical detection area; and a plurality of gate mechanisms respectively control the communication and connection between the first cabin and the second cabin. Isolation, and the communication and isolation between the optical detection zone and the second cabin.

一例中，對應該第一艙體的該閘機構設置於該第一艙體上或該第二艙體上，並且對應該光學檢測區的該閘機構設置於該第二艙體上。In one example, the gate mechanism corresponding to the first cabin body is arranged on the first cabin body or the second cabin body, and the gate mechanism corresponding to the optical detection zone is arranged on the second cabin body.

一例中，在該第一艙體和該第二艙體連通時，該移載模組移載該待測物於該第一艙體和該第二艙體之間；以及在該光學檢測區和該第二艙體連通時，該移載模組移載該待測物於該光學檢測區和該第二艙體之間。In one example, when the first cabin body and the second cabin body are connected, the transfer module transfers the object to be tested between the first cabin body and the second cabin body; and in the optical detection area When communicating with the second cabin, the transfer module transfers the object to be tested between the optical detection area and the second cabin.

一例中，影像複合檢測系統更包括連接該第一艙體的一真空抽氣裝置、收集二次電子束的分析工具、對於該第一光學顯微裝置、該第二光學顯微裝置和該電子顯微裝置分別建立個別座標系統以及一參考座標系統的一影像導航模組或一自動光學檢測模組或上述任二者以上的組合。In one example, the image composite detection system further includes a vacuum pumping device connected to the first cabin, an analysis tool for collecting secondary electron beams, for the first optical microscope device, the second optical microscope device, and the electron The microscopic device respectively establishes an image navigation module or an automatic optical detection module of an individual coordinate system and a reference coordinate system or a combination of any two or more of the above.

一例中，該第一光學顯微裝置和該第二光學顯微裝置分別是電荷耦合光學顯微鏡，且該些電荷耦合光學顯微鏡的支援倍率相同或不同，該些電荷耦合光學顯微鏡的支援倍率為從0.1到500。In one example, the first optical microscopy device and the second optical microscopy device are respectively charge coupled optical microscopes, and the support magnifications of the charge coupled optical microscopes are the same or different, and the support magnifications of the charge coupled optical microscopes are from 0.1 to 500.

一例中，該電子顯微裝置包括桌上型的掃描電子顯微鏡、穿透電子顯微鏡或掃描穿透電子顯微鏡，支援倍率為從30到50000。In one example, the electron microscopy device includes a desktop scanning electron microscope, a transmission electron microscope, or a scanning transmission electron microscope, and the supporting magnification is from 30 to 50,000.

以下藉由具體實施例配合所附的圖式詳加說明，當更容易瞭解本發明之目的、技術內容、特點及其所達成之功效。The following detailed descriptions are provided with specific embodiments in conjunction with the accompanying drawings to make it easier to understand the purpose, technical content, features, and effects of the present invention.

以下將詳述本發明之各實施例，並配合圖式作為例示。除了這些詳細說明之外，本發明亦可廣泛地施行於其它的實施例中，任何所述實施例的輕易替代、修改、等效變化都包含在本發明之範圍內，並以申請專利範圍為準。在說明書的描述中，為了使讀者對本發明有較完整的瞭解，提供了許多特定細節；然而，本發明可能在省略部分或全部特定細節的前提下，仍可實施。此外，眾所周知的步驟或元件並未描述於細節中，以避免對本發明形成不必要之限制。圖式中相同或類似之元件將以相同或類似符號來表示。特別注意的是，圖式僅為示意之用，並非代表元件實際之尺寸或數量，有些細節可能未完全繪出，以求圖式之簡潔。Hereinafter, each embodiment of the present invention will be described in detail, with drawings as an example. In addition to these detailed descriptions, the present invention can also be widely implemented in other embodiments, and easy substitutions, modifications, and equivalent changes of any of the embodiments are included in the scope of the present invention, and the scope of the patent application is quasi. In the description of the specification, in order to enable the reader to have a more complete understanding of the present invention, many specific details are provided; however, the present invention may still be implemented under the premise that some or all of the specific details are omitted. In addition, well-known steps or elements are not described in details to avoid unnecessary limitations on the present invention. The same or similar elements in the drawings will be represented by the same or similar symbols. It is particularly important to note that the drawings are for illustrative purposes only, and do not represent the actual size or quantity of the components. Some details may not be completely drawn in order to keep the drawings concise.

請參照圖1、圖2和圖3，本案的影像複合檢測系統1包括一第一艙體20(chamber)、一第二艙體30、一第一光學顯微裝置12、一第二光學顯微裝置14和一電子顯微裝置22。於一例中，影像複合檢測系統1的大部分組件可設置於一基台2上，基台2上可乘載若干尺寸和高度相同或不同的基座11、基座21和基座31。第一光學顯微裝置12和第二光學顯微裝置14設置於一光學檢測區10中，其分別檢測一待測物5。光學檢測區10提供一大氣環境，並且提供一機構16設置之用，該待測物5放置或固定於機構16上，例如一掃描移動機構(scan stage)上，藉由機構16的操作變更和安排該待測物5在光學檢測區10中的位置，機構16則可放置於基座11上。再者，影像複合檢測系統1更包括可調整第一光學顯微裝置12和第二光學顯微裝置14的檢測高度的調整機構18，依據需求來調整第一光學顯微裝置12和該待測物5之間的相對位置、或是調整第二光學顯微裝置14和該待測物5之間的相對位置，藉以檢測到該待測物5的較佳表面影像。再者，調整機構18可和機構16整合一起或分開。Please refer to Figure 1, Figure 2 and Figure 3, the image composite detection system 1 of this case includes a first chamber 20 (chamber), a second chamber 30, a first optical microscope device 12, a second optical display Microdevice 14 and an electronic microdevice 22. In one example, most of the components of the image composite inspection system 1 can be arranged on a base 2, and the base 2 can carry a number of bases 11, bases 21 and 31 with the same or different sizes and heights. The first optical microscopy device 12 and the second optical microscopy device 14 are disposed in an optical detection area 10, and they respectively detect an object 5 to be tested. The optical detection area 10 provides an atmospheric environment and provides a mechanism 16 for setting. The object 5 to be tested is placed or fixed on the mechanism 16, such as a scan stage. The operation of the mechanism 16 changes and Arrange the position of the test object 5 in the optical detection area 10, and the mechanism 16 can be placed on the base 11. Furthermore, the image composite detection system 1 further includes an adjustment mechanism 18 that can adjust the detection heights of the first optical microscopy device 12 and the second optical microscopy device 14 to adjust the first optical microscopy device 12 and the to-be-tested device according to requirements. The relative position between the objects 5 or the relative position between the second optical microscopy device 14 and the object 5 to be measured is adjusted, so as to detect a better surface image of the object 5 to be measured. Furthermore, the adjustment mechanism 18 and the mechanism 16 may be integrated together or separately.

續參考圖1、圖2和圖3，影像複合檢測系統1更包括若干開關機構，例如閘機構13可設置在第二艙體30上，其控制光學檢測區10和第二艙體30之間的連通和隔絕(isolation)，第二艙體30可放置於基座31上。另，閘機構23可設置在第二艙體30上或第一艙體20上，其控制第一艙體20和第二艙體30的連通和隔絕，第一艙體20可放置於基座21上。其次，影像複合檢測系統1更包括移載模組32，例如一機械臂，其可設置於第二艙體30中。當光學檢測區10和第二艙體30之間為連通時，移載模組32移載該待測物5至光學檢測區10中或第二艙體30中。當光學檢測區10和第二艙體30之間為隔絕時，光學檢測區10和第二艙體30可分別提供不同的工作環境，例如光學檢測區10提供一大氣環境，第二艙體30提供一真空環境，但本案不限於此。同理，第一艙體20和第二艙體30之間的連通和隔絕，以及移載模組32在二者之間的移載亦是如此，於此不贅述。是以，第二艙體30為提供該待測物5進出光學檢測區10或第一艙體20的一中繼艙，於一例中，第二艙體30可以是半導體設備中的提供load/locker的艙體。可以選擇的，若省略第二艙體30，則閘機構23設置在第一艙體20上，並控制光學檢測區10和第一艙體20的連通和隔絕，此時移載模組32可設置於第一艙體20中或光學檢測區10。Continuing to refer to Figures 1, 2 and 3, the image composite detection system 1 further includes a number of switching mechanisms. For example, the gate mechanism 13 can be arranged on the second cabin 30, which controls the optical detection zone 10 and the second cabin 30. The second compartment 30 can be placed on the base 31 for the interconnection and isolation of the two. In addition, the gate mechanism 23 can be arranged on the second cabin 30 or the first cabin 20, which controls the communication and isolation of the first cabin 20 and the second cabin 30, and the first cabin 20 can be placed on the base 21 on. Secondly, the image composite inspection system 1 further includes a transfer module 32, such as a robotic arm, which can be installed in the second cabin 30. When the optical detection zone 10 and the second cabin 30 are in communication, the transfer module 32 transfers the test object 5 to the optical detection zone 10 or the second cabin 30. When the optical detection zone 10 and the second cabin 30 are isolated, the optical detection zone 10 and the second cabin 30 can respectively provide different working environments. For example, the optical detection zone 10 provides an atmospheric environment, and the second cabin 30 Provide a vacuum environment, but this case is not limited to this. In the same way, the communication and isolation between the first cabin 20 and the second cabin 30, and the transfer of the transfer module 32 between the two are also the same, which will not be repeated here. Therefore, the second cabin 30 is a relay cabin for the object 5 to enter and exit the optical detection area 10 or the first cabin 20. In one example, the second cabin 30 can be a semiconductor device that provides load/ The locker's cabin. Optionally, if the second cabin 30 is omitted, the gate mechanism 23 is arranged on the first cabin 20 and controls the communication and isolation between the optical detection zone 10 and the first cabin 20. At this time, the transfer module 32 can be It is arranged in the first cabin 20 or the optical detection area 10.

續參考圖1、圖2和圖3，第一艙體20提供可容置機構26和待測物5的一空間，其中該空間可提供對該待測物5進行處理或更包括檢測的一真空環境。其次，電子顯微裝置22可整個或一部分被容置於第一艙體20中，其對該待測物5進行檢測。又，類似機構16的，該待測物5可被放置或固定於機構26上，藉由機構26的操作變更該待測物5在第一艙體20中的位置。再者，影像複合檢測系統1更包括與第一艙體20連接的一真空抽氣裝置28，藉由真空抽氣裝置28的作用，可以創造第一艙體20的真空環境。可以理解的，當第一艙體20和第二艙體30為連通且光學檢測區10和第二艙體30為隔絕時，真空抽氣裝置28的作用可同時創造第一艙體20和第二艙體30皆為真空環境。另，可以理解的，為了配合機台的控制需求，影像複合檢測系統1可更包括適當的電控組件，例如人機介面等等。於一例中，影像複合檢測系統1更包括連接電子顯微裝置22的一分析工具(圖上未繪)，其中，分析工具可進一步對電子顯微裝置22的檢測影像進行分析。Continuing to refer to Figures 1, 2 and 3, the first cabin 20 provides a space for accommodating the mechanism 26 and the test object 5, wherein the space can provide a space for processing the test object 5 or including detection. Vacuum environment. Secondly, the whole or part of the electron microscopy device 22 can be accommodated in the first cabin 20, which detects the object 5 to be tested. Moreover, similar to the mechanism 16, the test object 5 can be placed or fixed on the mechanism 26, and the position of the test object 5 in the first cabin 20 can be changed by the operation of the mechanism 26. Furthermore, the image composite detection system 1 further includes a vacuum exhaust device 28 connected to the first cabin 20. With the function of the vacuum exhaust device 28, a vacuum environment of the first cabin 20 can be created. It is understandable that when the first cabin body 20 and the second cabin body 30 are connected and the optical detection area 10 and the second cabin body 30 are isolated, the vacuum exhaust device 28 can simultaneously create the first cabin body 20 and the second cabin body 30. The second cabin 30 is in a vacuum environment. In addition, it is understandable that, in order to meet the control requirements of the machine, the image composite inspection system 1 may further include appropriate electronic control components, such as a human-machine interface. In one example, the image composite inspection system 1 further includes an analysis tool (not shown in the figure) connected to the electron microscopy device 22, wherein the analysis tool can further analyze the inspection images of the electron microscopy device 22.

續參考圖1、圖2和圖3，於一例中，第一光學顯微裝置12和第二光學顯微裝置14可以分別是電荷耦合(Charge Coupled Device, CCD)光學顯微鏡，其中透過選配不同的倍率的鏡頭來達到第一光學顯微裝置12和第二光學顯微裝置14的支援倍率的不同，例如0.1~10以及10~500，但本案不限於此。是以，第一光學顯微裝置12和第二光學顯微裝置14可以分別建立待測物5的光學影像的全景和光學影像的局部檢視區，細節後述。其次，因應檢測影像需求，第一光學顯微裝置12和第二光學顯微裝置14可配置同一或個別的光源以優化檢測環境。其次，電子顯微裝置22可以是桌上型的掃描電子顯微鏡(Scanning Electron Microscope, SEM)、穿透電子顯微鏡(Transmission Electron Microscope, TEM)或是掃描穿透電子顯微鏡(Scanning Transmission Electron Microscope, STEM)，其支援倍率可以是30~50,000，並對該待測物5進行細部的電子束檢測。再者，依據第一光學顯微裝置12或/和第二光學顯微裝置14的光學影像，電子顯微裝置22可進一步被設定對於局部影像進行放大掃描和檢測。另外，在電子顯微裝置22兼具掃描和穿透功能的情形下，除了可檢測元素組成外，尚可配合軟體作定量分析。另外，電子顯微裝置22可結合直接液態檢測技術，例如採用對電子束透明的特殊薄膜將液體或揮發性物質保存於真空中，可同時滿足微米結構的掃描量測和奈米粒子的穿透分析。Continuing to refer to Figures 1, 2 and 3, in one example, the first optical microscopy device 12 and the second optical microscopy device 14 can be respectively charge coupled (Charge Coupled Device, CCD) optical microscopes, with different transmission options The magnification of the lens is different to achieve the different supported magnifications of the first optical microscopic device 12 and the second optical microscopic device 14, such as 0.1-10 and 10-500, but the case is not limited to this. Therefore, the first optical microscopy device 12 and the second optical microscopy device 14 can respectively establish a panoramic view of the optical image of the test object 5 and a partial viewing area of the optical image, details will be described later. Secondly, in response to the needs of detecting images, the first optical microscopic device 12 and the second optical microscopic device 14 can be configured with the same or separate light sources to optimize the detection environment. Secondly, the electron microscope device 22 can be a desktop scanning electron microscope (Scanning Electron Microscope, SEM), a transmission electron microscope (Transmission Electron Microscope, TEM), or a scanning transmission electron microscope (Scanning Transmission Electron Microscope, STEM). , Its support magnification can be 30~50,000, and perform detailed electron beam inspection on the test object 5. Furthermore, according to the optical images of the first optical microscopy device 12 or/and the second optical microscopy device 14, the electronic microscopy device 22 can be further configured to perform magnification scanning and detection of partial images. In addition, in the case that the electron microscopy device 22 has both scanning and penetrating functions, in addition to detecting element composition, it can also be used with software for quantitative analysis. In addition, the electron microscopy device 22 can be combined with direct liquid detection technology, for example, a special film transparent to the electron beam is used to store liquids or volatile substances in a vacuum, which can simultaneously meet the scanning measurement of micron structures and the penetration of nano particles. analysis.

續參考圖1、圖2和圖3，於一例中，機構16和機構26可以分別是多軸移動或更包括轉動的機械系統，其中，調整機構18可為機構16的其中一軸調整部分。是以，機構16，例如一XYZ三軸線性移動機構，行程可以是50*50*10cm，其中Z軸作為調整機構18以調整第一光學顯微裝置12和第二光學顯微裝置14的聚焦位置。機構26，例如一XYZR線性移動和轉動機構，移動行程可以是50*50*10cm，R軸提供+/-20度(deg)的旋轉角度，提供3D檢測的可能性。其次，真空抽氣裝置28可以是若干部件組合的抽氣系統，舉例但不限地，包括前級幫浦和高真空幫浦。前級幫浦可選用無油乾式迴旋幫浦或油式機械幫浦，高真空幫浦則可選用渦輪分子幫浦。另，分析工具可以是與電子顯微裝置22配合使用的分析技術，其可收集二次電子束檢測待測物5表面的微細結構，並進行材質分析。分析工具舉例但不限地，例如能量色散X-射線光譜分析(Energy Dispersive Spectrometer, EDS)工具，其利用電子顯微裝置22產生的電子束所激發的特性X光來進行待測物5的定性或半定量化學成分分析。1, 2, and 3, in one example, the mechanism 16 and the mechanism 26 may be a multi-axis movement or a mechanical system including rotation, respectively, wherein the adjustment mechanism 18 may be one of the axis adjustment parts of the mechanism 16. Therefore, the mechanism 16, such as an XYZ three-axis linear moving mechanism, may have a stroke of 50*50*10cm, and the Z axis is used as the adjustment mechanism 18 to adjust the focus of the first optical microscopic device 12 and the second optical microscopic device 14. position. The mechanism 26, for example, an XYZR linear movement and rotation mechanism, the movement stroke can be 50*50*10cm, the R axis provides a rotation angle of +/-20 degrees (deg), providing the possibility of 3D detection. Secondly, the vacuum pumping device 28 may be a pumping system composed of several components, for example, but not limited to, including a front stage pump and a high vacuum pump. The front-stage pump can choose an oil-free dry rotary pump or an oil mechanical pump, and the high vacuum pump can choose a turbomolecular pump. In addition, the analysis tool may be an analysis technology used in conjunction with the electron microscopy device 22, which can collect secondary electron beams to detect the fine structure of the surface of the object 5 and perform material analysis. The analysis tool is exemplified but not limited, such as Energy Dispersive Spectrometer (EDS) tool, which uses characteristic X-rays excited by the electron beam generated by the electron microscope 22 to perform the qualitative determination of the test object 5 Or semi-quantitative chemical composition analysis.

依據上述，本案的影像複合檢測系統1結合具有不同支援倍率的光學和電子束掃描，有效擴大影像檢測的倍率，採用桌上型電子顯微鏡進行高位率的檢視，可以擴大放大倍率，但有效降低成本。其次，結合軟體功能，例如自動光學檢測(Automatic Optical Inspection, AOI)的影像技術，更可以提高影像複合檢測系統1的功能。於一例中，本案的影像複合檢測系統1更包括一自動光學檢測模組(圖上未繪)，對於大型的待測物5而言，透過機構16的配合，自動光學檢測模組可採取影像分割擷取再拼貼的方式，取得待測物5的全景影像。首先，掃描整個待測物5的全景以建立座標軸；接著，將待測物5劃分成複數個影像分格；接著，透過第一光學顯微裝置12或第二光學顯微裝置14依序掃描待測物5的每個影像分格並擷取每個影像分格的個別影像，其中，依序掃描的方式可以是循序、往返或交替等方式；以及拼貼該些個別影像即可得到待測物5的全景影像。Based on the above, the image composite detection system 1 of this case combines optical and electron beam scanning with different supporting magnifications to effectively expand the magnification of image detection. Using a desktop electron microscope for high-rate inspection can expand the magnification, but effectively reduces the cost. . Secondly, combined with software functions, such as automatic optical inspection (Automatic Optical Inspection, AOI) imaging technology, the functions of the image composite inspection system 1 can be improved. In one example, the image composite inspection system 1 of this case further includes an automatic optical inspection module (not shown in the figure). For a large object 5, through the cooperation of the mechanism 16, the automatic optical inspection module can take images The method of segmentation, capture and collage is used to obtain a panoramic image of the test object 5. First, scan the entire panorama of the test object 5 to establish the coordinate axis; then, divide the test object 5 into a plurality of image divisions; then, scan sequentially through the first optical microscopic device 12 or the second optical microscopic device 14 Each image frame of the test object 5 is divided and an individual image of each image frame is captured. The sequential scanning method can be sequential, round-trip, or alternate; and the individual images can be collaged to obtain the Panoramic image of test object 5.

考量光學和電子顯微鏡的支援倍率差異，本案的影像複合檢測系統1更包括一影像導航模組(圖上未繪)，對於第一光學顯微裝置12、第二光學顯微裝置14和一電子顯微裝置22分別建立個別座標系統以及參考座標系統，使得光學和電子檢測系統之間順利地相互切換。要說明的是，個別座標系統以及參考座標系統彼此間的偏差量，可以在影像複合檢測系統1組裝過程中，事先調校和儲存。另，透過影像導航模組的連結，檢測的放大倍率可在第一光學顯微裝置12、第二光學顯微裝置14和一電子顯微裝置22之間相互轉換，獲得最大裕度(margin)的檢測範圍。Taking into account the difference in the supporting magnification of optical and electron microscopes, the image composite inspection system 1 of this case further includes an image navigation module (not shown in the figure) for the first optical microscope device 12, the second optical microscope device 14 and an electronic The microscopic device 22 respectively establishes an individual coordinate system and a reference coordinate system, so that the optical and electronic detection systems can be switched smoothly. It should be noted that the deviation between the individual coordinate system and the reference coordinate system can be adjusted and stored in advance during the assembly process of the image composite detection system 1. In addition, through the connection of the image navigation module, the detected magnification can be converted between the first optical microscopy device 12, the second optical microscopy device 14 and an electronic microscopy device 22 to obtain the maximum margin. The detection range.

以上所述之實施例僅是為說明本發明之技術思想及特點，其目的在使熟習此項技藝之人士能夠瞭解本發明之內容並據以實施，當不能以之限定本發明之專利範圍，即大凡依本發明所揭示之精神所作之均等變化或修飾，仍應涵蓋在本發明之專利範圍內。The above-mentioned embodiments are only to illustrate the technical ideas and features of the present invention, and their purpose is to enable those who are familiar with the art to understand the content of the present invention and implement them accordingly. When they cannot be used to limit the patent scope of the present invention, That is, all equal changes or modifications made in accordance with the spirit of the present invention should still be covered by the patent scope of the present invention.

1:影像複合檢測系統 2:基台 5:待測物 10:光學檢測區 11、21、31:基座 12:第一光學顯微裝置 13、23:閘機構 14:第二光學顯微裝置 16:、26:機構 18:調整機構 20:第一艙體 22:電子顯微裝置 28:真空抽氣裝置 30:第二艙體 32:移載模組1: Image composite detection system 2: Abutment 5: Object to be tested 10: Optical detection area 11, 21, 31: base 12: The first optical microscopy device 13, 23: gate mechanism 14: The second optical microscopy device 16:, 26: Institution 18: adjustment mechanism 20: The first cabin 22: Electron Microscope 28: Vacuum pumping device 30: second cabin 32: Transfer module

圖1為一正面透視示意圖，說明本發明的一影像複合檢測系統實施例。 圖2為一立體側透視示意圖，說明本發明的一影像複合檢測系統實施例的部分組件。 圖3為一俯視透視示意圖，說明本發明的一影像複合檢測系統實施例的部分組件。Figure 1 is a front perspective schematic diagram illustrating an embodiment of an image composite detection system of the present invention. FIG. 2 is a perspective schematic diagram of a three-dimensional side view illustrating some components of an embodiment of an image composite inspection system of the present invention. FIG. 3 is a top perspective schematic diagram illustrating some components of an embodiment of an image composite inspection system of the present invention.

1:影像複合檢測系統 1: Image composite detection system

2:基台 2: Abutment

5:待測物 5: Object to be tested

10:光學檢測區 10: Optical detection area

11、21、31:基座 11, 21, 31: base

12:第一光學顯微裝置 12: The first optical microscopy device

13、23:閘機構 13, 23: gate mechanism

14:第二光學顯微裝置 14: The second optical microscopy device

16、26:機構 16, 26: institutions

18:調整機構 18: adjustment mechanism

20:第一艙體 20: The first cabin

22:電子顯微裝置 22: Electron Microscope

28:真空抽氣裝置 28: Vacuum pumping device

30:第二艙體 30: second cabin

32:移載模組 32: Transfer module

Claims (16)

一種影像複合檢測系統，包含： 一第一艙體，其提供容置一待測物的一真空環境； 一電子顯微裝置設置於該第一艙體上，其在該真空環境中檢測該待測物； 一光學檢測區位於該第一艙體外，其提供該待測物的一大氣環境； 一第一光學顯微裝置設置於該光學檢測區的範圍內，其在該大氣環境中檢測該待測物，其中該第一光學顯微裝置包括用以建立該待測物的一光學全景影像； 一第二光學顯微裝置設置於該光學檢測區的範圍內，其在該大氣環境中檢測該待測物，其中該第二光學顯微裝置包括用以建立該待測物的一光學局部影像；及 一移載模組移載該待測物到該第一艙體中以進行檢測或到該光學檢測區內以進行檢測。An image composite detection system, including: A first cabin, which provides a vacuum environment for accommodating an object to be tested; An electron microscopy device is arranged on the first cabin, which detects the object under test in the vacuum environment; An optical detection area is located outside the first cabin, which provides an atmospheric environment for the object to be tested; A first optical microscopy device is arranged in the range of the optical detection area, and detects the object under test in the atmospheric environment, wherein the first optical microscopy device includes an optical panoramic image for establishing the object under test ； A second optical microscopy device is disposed within the range of the optical detection area, and detects the object under test in the atmospheric environment, wherein the second optical microscopy device includes an optical partial image for establishing the object under test ;and A transfer module transfers the object to be tested into the first cabin for inspection or into the optical inspection area for inspection. 如請求項1所述之影像複合檢測系統，更包括複數個掃描移動機構分別設置於該光學檢測區和該第一艙體中，其中每一該掃描移動機構承載該待測物以及變更該待測物在該光學檢測區和該第一艙體中的位置。The image composite detection system according to claim 1, further comprising a plurality of scanning moving mechanisms respectively disposed in the optical detection area and the first cabin, wherein each scanning moving mechanism carries the object to be measured and changes the waiting The position of the measured object in the optical detection zone and the first cabin. 如請求項2所述之影像複合檢測系統，其中設置在該光學檢測區的該掃描移動機構更包括調整該第一光學顯微裝置和該第二光學顯微裝置的聚焦位置。The image composite inspection system according to claim 2, wherein the scanning moving mechanism arranged in the optical inspection area further includes adjusting the focus positions of the first optical microscopic device and the second optical microscopic device. 如請求項1所述之影像複合檢測系統，更包含一第二艙體安排於該第一艙體和該光學檢測區之間；以及複數個閘機構分別控制該第一艙體和該第二艙體的連通和隔絕、以及該光學檢測區和該第二艙體的連通和隔絕。The image composite detection system according to claim 1, further comprising a second cabin arranged between the first cabin and the optical detection zone; and a plurality of gate mechanisms respectively control the first cabin and the second cabin The connection and isolation of the cabin body, and the connection and isolation of the optical detection area and the second cabin body. 如請求項4所述之影像複合檢測系統，其中對應該第一艙體的該閘機構設置於該第一艙體上或該第二艙體上，並且對應該光學檢測區的該閘機構設置於該第二艙體上。The image composite detection system according to claim 4, wherein the gate mechanism corresponding to the first cabin body is arranged on the first cabin body or the second cabin body, and the gate mechanism corresponding to the optical detection zone is arranged On the second cabin. 如請求項4所述之影像複合檢測系統，其中在該第一艙體和該第二艙體連通時，該移載模組移載該待測物於該第一艙體和該第二艙體之間；以及在該光學檢測區和該第二艙體連通時，該移載模組移載該待測物於該光學檢測區和該第二艙體之間。The image composite detection system according to claim 4, wherein when the first cabin and the second cabin are connected, the transfer module transfers the object to be measured between the first cabin and the second cabin And when the optical detection zone is connected to the second cabin, the transfer module transfers the object to be measured between the optical detection zone and the second cabin. 如請求項6所述之影像複合檢測系統，其中該移載模組包括一機械臂。The image composite inspection system according to claim 6, wherein the transfer module includes a mechanical arm. 如請求項1所述之影像複合檢測系統，更包括連接該第一艙體的一真空抽氣裝置，其對該第一艙體抽氣以創造該第一艙體的該真空環境。The image composite detection system according to claim 1, further comprising a vacuum exhaust device connected to the first cabin, which exhausts the first cabin to create the vacuum environment of the first cabin. 如請求項1所述之影像複合檢測系統，其中該第一光學顯微裝置和該第二光學顯微裝置分別是電荷耦合光學顯微鏡，且該些電荷耦合光學顯微鏡的支援倍率相同或不同。The image composite detection system according to claim 1, wherein the first optical microscopy device and the second optical microscopy device are respectively charge coupled optical microscopes, and the supporting magnifications of the charge coupled optical microscopes are the same or different. 如請求項9所述之影像複合檢測系統，其中該些電荷耦合光學顯微鏡的支援倍率為從0.1到500。The image composite detection system according to claim 9, wherein the supporting magnification of the charge-coupled optical microscopes is from 0.1 to 500. 如請求項1所述之影像複合檢測系統，其中該電子顯微裝置包括桌上型的掃描電子顯微鏡、穿透電子顯微鏡或掃描穿透電子顯微鏡。The image composite inspection system according to claim 1, wherein the electron microscopy device includes a desktop scanning electron microscope, a penetrating electron microscope, or a scanning penetrating electron microscope. 如請求項11所述之影像複合檢測系統，其中該電子顯微裝置的支援倍率為從30到50000。The image composite inspection system according to claim 11, wherein the supporting magnification of the electronic microscope device is from 30 to 50,000. 如請求項1所述之影像複合檢測系統，更包括收集二次電子束的一分析工具以分析該待測物的材質。The image composite detection system according to claim 1, further comprising an analysis tool for collecting secondary electron beams to analyze the material of the object to be measured. 如請求項1所述之影像複合檢測系統，更包括一影像導航模組，其對於該第一光學顯微裝置、該第二光學顯微裝置和該電子顯微裝置分別建立個別座標系統以及一參考座標系統，其中基於該參考座標系統切換該些個別座標系統。The image composite inspection system according to claim 1, further comprising an image navigation module, which establishes individual coordinate systems and a coordinate system for the first optical microscopy device, the second optical microscopy device, and the electronic microscopy device, respectively Reference coordinate system, wherein the individual coordinate systems are switched based on the reference coordinate system. 如請求項1所述之影像複合檢測系統，更包括一自動光學檢測模組，其採取影像分割擷取再拼貼的方式、產生該光學全景影像。The image composite inspection system described in claim 1 further includes an automatic optical inspection module, which generates the optical panoramic image by means of image segmentation capture and collage. 如請求項1所述之影像複合檢測系統，更包括承載該第一艙體的一基台，其中該光學檢測區位於該基台的佔地面積(footprint)內。The image composite inspection system according to claim 1, further comprising a base that carries the first cabin, wherein the optical inspection area is located within the footprint of the base.
TW108107292A 2019-03-05 2019-03-05 Complex inspection system of image TWI697658B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW108107292A TWI697658B (en) 2019-03-05 2019-03-05 Complex inspection system of image
CN202010143512.9A CN111665246A (en) 2019-03-05 2020-03-04 Image composite detection system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108107292A TWI697658B (en) 2019-03-05 2019-03-05 Complex inspection system of image

Publications (2)

Publication Number Publication Date
TWI697658B TWI697658B (en) 2020-07-01
TW202033931A true TW202033931A (en) 2020-09-16

Family

ID=72382601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108107292A TWI697658B (en) 2019-03-05 2019-03-05 Complex inspection system of image

Country Status (2)

Country Link
CN (1) CN111665246A (en)
TW (1) TWI697658B (en)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01147513A (en) * 1987-12-04 1989-06-09 Hitachi Ltd Foreign matter analyzer
JP3293739B2 (en) * 1996-06-13 2002-06-17 株式会社日立製作所 Scanning electron microscope
JPH10214583A (en) * 1997-01-30 1998-08-11 Hitachi Ltd Scanning electron microscope
US7564552B2 (en) * 2004-05-14 2009-07-21 Kla-Tencor Technologies Corp. Systems and methods for measurement of a specimen with vacuum ultraviolet light
JP4522251B2 (en) * 2004-12-17 2010-08-11 株式会社キーエンス Electron microscope, electron microscope operation method, electron microscope operation program, computer-readable recording medium, and recorded apparatus
JP2010008406A (en) * 2008-05-30 2010-01-14 Shinichiro Isobe Multiple light source microscope
TWI425188B (en) * 2009-08-31 2014-02-01 Zygo Corp Microscope system and imaging interferometer system
US9378921B2 (en) * 2012-09-14 2016-06-28 Delmic B.V. Integrated optical and charged particle inspection apparatus
US9449785B2 (en) * 2013-11-11 2016-09-20 Howard Hughes Medical Institute Workpiece transport and positioning apparatus
KR20150107939A (en) * 2014-03-13 2015-09-24 참엔지니어링(주) Apparatus for observating specimen
NL2013262B1 (en) * 2014-07-25 2016-09-09 Delmic B V Method for inspecting a sample using an assembly comprising a scanning electron microscope and a light microscope.
CN105651696B (en) * 2014-11-28 2019-05-14 财团法人工业技术研究院 detection instrument and detection method thereof
EP3317651A1 (en) * 2015-06-30 2018-05-09 Corning Incorporated Interferometric roll-off measurement using a static fringe pattern
EP3368932A1 (en) * 2015-10-27 2018-09-05 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Microscopic imaging system and method of forming a microscopic image of an object
CN106910665B (en) * 2017-03-01 2019-07-12 聚束科技（北京）有限公司 A kind of scanning electron microscope and its detection method of full-automation
TWI640409B (en) * 2017-08-01 2018-11-11 蔡宜興 Micro resistance inspection device and inspection method thereof

Also Published As

Publication number Publication date
CN111665246A (en) 2020-09-15
TWI697658B (en) 2020-07-01

Similar Documents

Publication Publication Date Title
US5502306A (en) Electron beam inspection system and method
TWI709745B (en) X-ray inspection system for inspecting semiconductor wafers
US5578821A (en) Electron beam inspection system and method
US9390886B2 (en) Electro-optical inspection apparatus using electron beam
KR102088734B1 (en) Inspection apparatus
KR100885940B1 (en) Charged particle beam inspection apparatus and method for fabricating device using that inspection apparatus
JP2005249745A (en) Sample surface inspecting method and inspecting apparatus
CN110006905A (en) A kind of ultra-clean smooth surface defect detecting device of heavy caliber that line area array cameras combines
CN107204268A (en) Focused Ion Beam Apparatus
JP2006244875A (en) Mapping projection type electron beam device and defect inspection system using the same
CN209992407U (en) Large-caliber ultra-clean smooth surface defect detection device combined with linear array camera
TWI697658B (en) Complex inspection system of image
US20120113243A1 (en) Inspection system
JP2020140961A (en) Multi-Beam Scanning Transmission Charged Particle Microscope
JP2005195504A (en) Apparatus for inspecting defect in sample
JP7150659B2 (en) inspection equipment
JP5302934B2 (en) Sample surface inspection method and inspection apparatus
JP7280418B2 (en) inspection equipment
KR20220130186A (en) Fluid transport system within a charged particle system
MFM flCUl MID IflTCREiTinG AT ffl&ffl 2005
CN112912988A (en) Focused ion beam system for large area substrates
Tabletop NASA partners with Air Force to test space station materials
JP2007263772A (en) Substrate inspection device and system
Companyhas MICROSCOPY TODAY March 2008∎ 57
JPH04150048A (en) Semiconductor substrate inspecting device