TW202032804A - Three-dimension circuit structure for optical device and process thereof - Google Patents

Abstract

A three-dimension circuit structure for optical device includes a circuit board, a carrying plastic cup, an LDS means, a chemical copper layer and a plating layer. The circuit board includes a ceramic substrate and metal circuits. The ceramic substrate has a first surface and a second surface located oppositely. The metal circuits includes first conductive pads located on the first surface, second conductive pads located on the second surface, and a conductive through hole connected the first conductive pads and the second conductive pads. The first conductive pads includes function circuits and conduction circuits; the conduction circuits and the second conductive pads are electrically connected through the conductive through hole. The carrying plastic cup disposed on the first surface of the ceramic substrate by insert molding includes a concave cup and a bearing portion, and the concave cup connects the conduction circuits. The LDS means is performed on the concave cup and the bearing portion. The chemical copper layer is formed on the concave cup, the bearing portion and the first conductive pads enclosed by the concave cup. The plating layer is coated on the concave cup, the portion, and the conduction circuits with the chemical copper layer for strengthening the electrical connection structure between the circuit board and the carrying plastic cup. The present invention also discloses processes of three-dimension circuit structure for optical device.

Description

Three-dimensional circuit structure and manufacturing process for optical device

The invention relates to a three-dimensional circuit structure and a manufacturing method thereof, in particular to a three-dimensional circuit structure for a ceramic substrate and a manufacturing method thereof.

With the rapid development of electronic technology, electronic products continue to introduce new ones, and are moving towards the trend of light, thin, short and small. In addition, the heat generation of general electronic components will increase with the improvement of performance, so choose a circuit with good heat dissipation efficiency As a circuit carrier board, the board has gradually formed design options.

Furthermore, in order to meet the appearance of light, thin, short and small electronic products, a design method that directly forms metal circuits on a three-dimensional structure to replace the conventional circuit board was developed to save the internal space of the case. Therefore, electronic products can be miniaturized. However, most commonly used three-dimensional structures currently use multilayer ceramic stacking sintering technology to form a three-dimensional structure for placing conductive glass. However, this process has a higher cost and a longer process time, so it does not meet production requirements and needs to be improved.

In view of this, the inventor of the present invention focused on the above-mentioned prior art, especially concentrated research and the application of scientific theory, and tried to solve the above-mentioned problems, which became the goal of the present inventor's improvement.

One objective of the present invention is to provide a three-dimensional circuit structure and manufacturing process for an optical device, so as to reduce production costs and process time, thereby improving production efficiency.

Another object of the present invention is to provide a three-dimensional circuit structure and manufacturing process for an optical device, which strengthens the electrical connection structure between the circuit board and the carrier plastic cup, so as to ensure the electrical connection of the three-dimensional circuit structure for the optical device. Sexual conduction effect.

In order to achieve the above objective, the present invention is a three-dimensional circuit structure for optical devices, including a circuit board, a carrier plastic cup, a laser direct molding method, a chemical copper layer and an electroplating layer. The circuit board includes a ceramic substrate and a plurality of metal circuits. The ceramic substrate has opposite first and second surfaces. The metal circuit includes a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, and At least one conductive via connecting the first surface and the second surface, the first conductive pad includes a plurality of conductive lines for connecting and a plurality of functional circuits for arranging optical elements, and the conductive line and the second conductive line The pads are electrically connected through conductive through holes; the carrier plastic cup is arranged on the first surface of the ceramic substrate in a way of embedding and exiting. The carrier plastic cup includes a concave cup and a carrying portion connected to the concave cup, and the concave cup is connected to the first surface. The conductive line of the conductive pad; the laser direct molding method acts on the concave cup and the carrying part; the electroless copper layer is formed on the first conductive pad enclosed by the concave cup, the carrying part and the carrying rubber cup; the electroplating layer is covered A concave cup with a chemical copper layer, a carrying portion and a conductive line of the first conductive pad.

In order to achieve the above-mentioned object, the present invention is a process for manufacturing a three-dimensional circuit structure for an optical device, which includes: providing a circuit board including a ceramic substrate with opposed first and second surfaces, and molding on the ceramic substrate A plurality of metal circuits. The metal circuit includes a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, and at least one conductive via connecting the first surface and the second surface. The pad includes a plurality of conductive lines for conducting connections and a plurality of functional lines for arranging optical elements, and the conductive lines and the second conductive pad are electrically connected through conductive through holes; a plastic cup is provided to bury the incident light The molding method is set on the circuit board. The carrier plastic cup includes a concave cup and a carrying part connected to the concave cup. The concave cup is connected to the conductive line of the first conductive pad; the laser direct molding process is provided, which acts on the concave cup and the carrier Provides an electroless copper process to form an electroless copper layer on the first conductive pad enclosed by the concave cup, the carrying part and the carrying rubber cup; provides an electroplating process to form an electroless copper layer on the concave cup and the carrying part And the lead wires are covered with electroplating layer.

Compared with the prior art, the three-dimensional circuit structure for an optical device of the present invention includes a circuit board and a plastic-carrying cup. The plastic-carrying cup is arranged on the first surface of the ceramic substrate in a manner of embedding and exiting, and on the ceramic substrate A metal circuit is formed. The metal circuit includes a first conductive pad, a second conductive pad and a conductive through hole connecting the first conductive pad and the second conductive pad on the opposite side of the ceramic substrate, wherein the first conductive pad includes Connect the conductive circuit of the plastic cup and the functional circuit used to set up the optical element; in addition, the laser direct molding process acts on the plastic cup to form a rough surface, and deposits on the rough surface and the surface of the conductive pad enclosed by the plastic cup The electroless copper layer makes the carrying rubber cup connect to the conductive line through the electroless copper layer; finally, the electroless copper layer is covered with an electroplated layer on the carrying rubber cup and the conductive wire to enhance the strength and strength of the electroless copper layer through the arrangement of the electroless copper layer. The chemical copper layer is prevented from cracking, thereby ensuring the electrical connection effect between the carrier rubber cup and the conductive line, thereby reducing production cost and time, thereby improving production efficiency and increasing the practicability of the present invention.

The detailed description and technical content of the present invention are described as follows in conjunction with the drawings. However, the drawings are only provided for reference and description, and are not intended to limit the present invention.

Please refer to FIG. 1, which is a schematic diagram of the three-dimensional appearance of the three-dimensional circuit structure for the optical device of the present invention. The present invention is a three-dimensional circuit structure 1 used in an optical device, which includes a circuit board 10 and a supporting plastic cup 20. The carrier plastic cup 20 is combined on the circuit board 10, and the three-dimensional circuit structure 1 for optical devices is completed through a laser direct molding process, an electroless copper process, and an electroplating process. A more detailed description is given below.

Please continue to refer to FIGS. 2 to 6, which are schematic diagrams of the manufacturing process of the three-dimensional circuit structure for the optical device of the present invention. 2, the manufacturing process of the three-dimensional circuit structure for optical devices of the present invention first provides a circuit board 10, the circuit board 10 includes a ceramic substrate 11 and a plurality of metal circuits 12. The ceramic substrate 11 may be made of materials such as aluminum oxide or aluminum nitride, and has a first surface 111, a second surface 112 opposite to each other, and a through hole 110 connecting the first surface 111 and the second surface 112. The metal lines 12 include a plurality of first conductive pads 121 on the first surface 111, a plurality of second conductive pads 122 on the second surface 112, and a connection between the first conductive pad 121 and the second conductive pad At least one conductive via 123 of the pad 122. The first conductive pads 121 include a plurality of conductive wires 1211 for connecting and a plurality of functional wires 1212 for arranging an optical element (not shown), and the conductive wires 1211 and the second conductive wires 1211 The pad 122 is electrically connected through the conductive via 123.

Next, referring to FIG. 3, a plastic-bearing cup 20 is provided, and the plastic-bearing cup 20 is arranged on the circuit board 10 in a manner of embedding and ejecting. It should be noted that, in this embodiment, the conductive lines 1211 are used to electrically connect the carrier plastic cup 20, and the functional lines 1212 are used to install optical electronic components such as sensors. In addition, the conductive circuit 1211 located inside the plastic-carrying cup 20 can be used for the connection of optical and electronic components, for example, as a connection location for wire bonding.

The supporting rubber cup 20 is arranged on the ceramic substrate 11 in a manner of embedding and ejecting. The plastic-carrying cup 20 includes a concave cup 21 and a supporting portion 22 connected to the concave cup 21, and the concave cup 21 is connected to the conductive lines 1211 of the first conductive pads 121. Specifically, the supporting portion 22 is a flat surface, and the supporting portion 22 is located above the concave cup 21 of the supporting rubber cup 20 and parallel to the ceramic substrate 11.

4, another laser direct structuring (Laser Direct Structuring, LDS) process is provided. The laser direct structuring process acts on the concave cup 21 of the carrier plastic cup 20 and the carrier portion 22, thereby making the concave cup 21 Rough surfaces 21' and 22' are respectively formed on the surface of the carrying portion 22.

Referring again to FIG. 5, next, an electroless copper process is provided to make the concave cup 21 with the rough surface 21', 22", the carrying portion 22, and the first conductive pad 121 enclosed by the carrying rubber cup 20 A chemical copper layer 30 is deposited on the surface of the alloy. The rubber-bearing cup 20 can be connected to the conductive lines 1211 through the arrangement of the chemical copper layer 30.

6, finally, an electroplating process is provided to coat an electroplating layer 40 on the concave cup 21 with the electroless copper layer, the carrying portion 22 and the conductive lines 1211. The arrangement of the electroplating layer 40 can enhance the strength of the electroless copper layer 30 to prevent the electroless copper layer 30 from cracking and reducing the electrical connection effect between the carrier rubber cup 20 and the conductive lines 1211.

It is worth noting that the electroplating layer 40 is only formed on the surface of the object with laser direct molding (LDS) and the conductive lines 1211, so the thickness of the conductive lines 1211 will be greater than the thickness of the functional lines 1212.

Another point to note is that in this electroplating process, the electrode is in contact with the second conductive pad 122 on the conductive via 123 for electroplating, that is, on the concave cup 21 and the carrying portion 22 of the electroless copper layer. And an electroplating layer 40 is formed on the conductive lines 1211.

Finally, referring to FIG. 7 again, a surface treatment process is provided to form a surface treatment layer 50 on the electroplating layer 40 and the functional circuit 1212 on which the chemical copper layer 30 is formed. Preferably, the surface treatment layer 50 is electroless nickel-palladium-gold, which has good adhesion and can protect the electroplating layer 40 from corrosion, thereby improving the three-dimensional circuit structure 1 for optical devices. Reliability.

8 and 9 again, in an embodiment of the present invention, the manufacturing process of the three-dimensional circuit structure 1 for an optical device further includes providing a conductive glass 60, the conductive glass 60 is disposed on the carrying portion 22 The concave cup 21 is covered. In more detail, the conductive glass 60 is provided with a transparent conductive layer 61 on the side facing the metal circuits 11, and the conductive glass 60 is electrically connected to the supporting plastic cup 20 through the transparent conductive layer 61. Preferably, the transparent conductive layer 61 is made of indium tin oxide (ITO).

The foregoing descriptions are only preferred embodiments of the present invention, and are not intended to determine the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all belong to the patent scope of the present invention.

1: Three-dimensional circuit structure for optical devices

10: Circuit board

11: Ceramic substrate

110: Through hole

111: first surface

112: second surface

12: Metal circuit

121: first lead pad

1211: lead wire

1212: functional line

122: second lead pad

123: conductive via

20: Carrying plastic cup

21: concave cup

21’, 22’: rough surface

22: Bearing Department

30: Chemical copper layer

40: Plating layer

50: Surface treatment layer

60: Conductive glass

61: Transparent conductive layer

FIG. 1 is a schematic diagram of the three-dimensional appearance of the three-dimensional circuit structure for the optical device of the present invention.

2 to 7 are schematic diagrams of the manufacturing process of the three-dimensional circuit structure for the optical device of the present invention.

8 and 9 are schematic diagrams and combined cross-sectional views of the combination of the three-dimensional circuit structure for the optical device and the conductive glass of the present invention.

1: Three-dimensional circuit structure for optical devices

10: Circuit board

11: Ceramic substrate

110: Through hole

111: first surface

112: second surface

12: Metal circuit

121: first lead pad

1211: lead wire

1212: functional line

122: second lead pad

123: conductive via

20: Carrying plastic cup

21: concave cup

22: Bearing Department

30: Chemical copper layer

40: Plating layer

50: Surface treatment layer

60: Conductive glass

61: Transparent conductive layer

Claims (11)

A three-dimensional circuit structure for an optical device, including: A circuit board includes a ceramic substrate and a plurality of metal circuits. The ceramic substrate has a first surface and a second surface opposite to each other. The metal circuits include a plurality of first conductive pads on the first surface and A plurality of second conductive pads on two surfaces and at least one conductive through hole connecting the first conductive pad and the second conductive pad, the first conductive pads include a plurality of conductive lines for conductive connection and To provide a plurality of functional circuits of an optical element, and the conductive lines and the second conductive pads are electrically connected through the conductive through holes; A plastic-carrying cup is arranged on the first surface of the ceramic substrate in a manner of embedding and exiting. The plastic-carrying cup includes a concave cup and a carrying portion connected to the concave cup, and the concave cup is connected to the first The lead wire of the lead pad; A laser direct forming method acts on the concave cup and the carrying part; An electroless copper layer is formed on the first conductive pad enclosed by the concave cup, the carrying portion and the carrying rubber cup; and An electroplating layer is coated on the concave cup with the chemical copper layer, the carrying portion and the conductive wire path of the first conductive pads. The three-dimensional circuit structure for an optical device according to claim 1, wherein the bearing portion is a flat surface, and the bearing portion is located above the concave cup of the plastic cup and parallel to the ceramic substrate. The three-dimensional circuit structure for an optical device according to claim 1, further comprising a conductive glass, and the conductive glass is arranged on the carrying portion to cover the concave cup. The three-dimensional circuit structure for an optical device according to claim 3, wherein the conductive glass is provided with a transparent conductive layer on the side facing the metal circuits. The three-dimensional circuit structure for an optical device according to claim 4, wherein the transparent conductive layer is made of indium tin oxide. The three-dimensional circuit structure for an optical device according to claim 1, which further includes a surface treatment layer provided on the electroplating layer and the functions of the first conductive pads on which the chemical copper layer is formed On the line. The three-dimensional circuit structure for an optical device according to claim 6, wherein the surface treatment layer is electroless nickel palladium gold. A manufacturing process of laser direct molding optical device, including: A circuit board is provided, including a ceramic substrate having a first surface and a second surface opposite to each other, and a plurality of metal circuits are formed on the ceramic substrate, the metal circuits including a plurality of first conductive connections on the first surface Pads, a plurality of second conductive pads located on the second surface, and at least one conductive via connecting the first surface and the second surface, the first conductive pads include a plurality of conductive wirings for conductive connection and A plurality of functional circuits for arranging an optical element, and the conductive lines and the second conductive pads are electrically connected through the conductive through holes; A carrier plastic cup is provided, which is arranged on the circuit board in a way of embedding and exiting. The carrier plastic cup includes a concave cup and a carrying portion connected to the concave cup, and the concave cup is connected to the first conductive pads. Lead wire Provide a laser direct molding process, which acts on the concave cup and the carrying part; Providing an electroless copper manufacturing process to form an electroless copper layer on the first conductive pad enclosed by the concave cup, the carrying portion and the carrying rubber cup; and An electroplating process is provided to coat the concave cup with the chemical copper layer, the carrying portion and the conductive wires with an electroplating layer. The manufacturing process of the laser direct molding optical device according to claim 8, further comprising providing a conductive glass, the conductive glass is arranged on the carrying part to cover the concave cup. The laser direct molding optical device manufacturing process according to claim 8, which further includes providing a surface treatment process to form a surface treatment layer, the surface treatment layer being disposed on the electroplating layer and the functional circuit on which the chemical copper layer is formed . The process of laser direct molding optical device according to claim 8, wherein the electroplating process is to contact the electrode with the second conductive pad on the conductive via.

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