TW202031772A - Hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL and methods of using thereof - Google Patents

Hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL and methods of using thereof Download PDF

Info

Publication number
TW202031772A
TW202031772A TW108142732A TW108142732A TW202031772A TW 202031772 A TW202031772 A TW 202031772A TW 108142732 A TW108142732 A TW 108142732A TW 108142732 A TW108142732 A TW 108142732A TW 202031772 A TW202031772 A TW 202031772A
Authority
TW
Taiwan
Prior art keywords
organic
silicone resin
hygroscopic
resin composition
silica particles
Prior art date
Application number
TW108142732A
Other languages
Chinese (zh)
Other versions
TWI775015B (en
Inventor
大和田寛人
小材利之
松村和之
坂詰功晃
中村勉
Original Assignee
日商信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商信越化學工業股份有限公司 filed Critical 日商信越化學工業股份有限公司
Publication of TW202031772A publication Critical patent/TW202031772A/en
Application granted granted Critical
Publication of TWI775015B publication Critical patent/TWI775015B/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00Use of pretreated ingredients
    • C08K9/04Ingredients treated with organic substances
    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • C08G77/08Preparatory processes characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/544Silicon-containing compounds containing nitrogen
    • C08K5/5445Silicon-containing compounds containing nitrogen containing at least one Si-N bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic
    • C09D7/62Additives non-macromolecular inorganic modified by treatment with other compounds
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/846Passivation; Containers; Encapsulations comprising getter material or desiccants
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04Polysiloxanes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention provides a hygroscopic silicone resin composition, a transparent sealing material for organic EL, a transparent drying material for the organic EL and methods of using thereof. The hygroscopic silicone resin composition comprises silicone, and surface treatment hygroscopic silicon dioxide particles with a coating part which is obtained through combining the silicone compound and the condensate thereof, wherein the hygroscopic capacity is 1.0*10<SP>-7</SP>g/mm3, wherein the refractive index of the silicone resin and the refractive index of the silicon dioxide particles are respectively1.39-1.42. Relative to total content of the silicone resin composition, the content of the silicon dioxide particles is 1-70mass%. The silicone silicone is a trifunctional silane compound, silazane compound or one-functional silane compound which is represented by a specific formula.

Description

吸濕性矽氧樹脂組成物、有機EL用透明密封材料、有機EL用透明乾燥材,及其使用方法Hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL, and methods of use

本發明係關於吸濕性矽氧樹脂組成物、有機EL(電子發光;Electronics luminescence)用透明密封材料、有機EL用透明乾燥材及其使用方法。The present invention relates to a hygroscopic silicone resin composition, a transparent sealing material for organic EL (Electronics luminescence), a transparent drying material for organic EL, and a method of use thereof.

有機電子發光(以下簡稱為有機EL)面板因稱為自動發光型而元件本身會發光,故無須如液晶面板之背光而需要其他光源,故其為低消費電力,且具有容易薄型化、輕量化等之特徴,又與液晶面板相比被認為為高畫質。但,於面板內僅侵入微量水分,即造成元件發光面積受損的問題(暗點的產生)。Organic electronic light-emitting (hereinafter referred to as organic EL) panels are called automatic light-emitting type and the element itself emits light, so there is no need for other light sources like the backlight of liquid crystal panels, so it has low power consumption and is easy to thin and lighten Such features are considered to be of high image quality compared to LCD panels. However, only a small amount of moisture penetrates into the panel, which causes the problem of damage to the light-emitting area of the device (the generation of dark spots).

有機EL面板必須為可防止高度水分侵入的結構,故一般使用將有機EL元件以含有玻璃等所成的透過性基板等密閉的結構。該結構為,於玻璃等基板上形成層合有陽極、有機層、陰極之結構的有機EL元件,配合相向的挖掘型之玻璃等之中空封止結構,將內部以經乾燥的氮(N2 )氣等填充,且將端部以密封材料進行接著而得到。此時,作為進行除去侵入於有機EL面板內的水分之目的,將乾燥劑設置於內部之方法,或者將有機EL元件以填充材進行包覆的方法等種種研究已被報告。對於任一方法,於乾燥劑或填充材具有透光性時,將有機EL元件所產生的光自上面取出到外部,因使所謂頂部發光(top emission)成為可能,故成為更有效者。The organic EL panel must have a structure that can prevent the penetration of high levels of moisture. Therefore, a structure in which the organic EL element is sealed with a transparent substrate made of glass or the like is generally used. This structure is to form an organic EL element with an anode, an organic layer, and a cathode layered on a substrate such as glass, and a hollow sealing structure such as opposing excavation glass is formed, and the inside is filled with dried nitrogen (N 2 ) It is obtained by filling with gas, etc., and adhering the end with a sealing material. At this time, various studies such as a method of installing a desiccant inside the organic EL panel or a method of covering the organic EL element with a filler have been reported for the purpose of removing the moisture that has penetrated into the organic EL panel. In either method, when the desiccant or the filling material has translucency, the light generated by the organic EL element is taken out from the top to the outside, and the so-called top emission is possible, so it is more effective.

又,有機EL元件雖主要在蒸鍍等製程中形成,但因為微小顆粒的存在,會有陰極與陽極呈短路之所謂短路現象(Short phenomenon)產生。又,於樹脂等密封材料中混合吸濕粒子等時,即使藉由吸濕粒子的凝集等亦有產生短路現象(Short phenomenon)之情況。如此短路現象(Short phenomenon)產生時,必須將成為原因的顆粒或者吸濕粒子之凝集物的周圍元件以雷射等分離,而產生發光部分損失或步驟增加的問題。In addition, although organic EL elements are mainly formed in processes such as vapor deposition, due to the presence of fine particles, a so-called short phenomenon occurs in which the cathode and the anode are short-circuited. In addition, when moisture-absorbing particles are mixed with a sealing material such as resin, a short-circuit phenomenon (Short phenomenon) may occur even by aggregation of the moisture-absorbing particles. When such a short phenomenon occurs, it is necessary to separate the surrounding elements of the particles or aggregates of the moisture-absorbing particles that are the cause by lasers or the like, which causes the problem of loss of light-emitting parts or increase of steps.

且有機EL面板被要求為薄片化,除薄型面板以外,具有彎曲形狀的薄型面板等亦受到注目。對於如此薄型面板,有時要求其對彎曲的耐性,不僅要求薄度,亦要求其柔軟性。In addition, organic EL panels are required to be thinned. In addition to thin panels, thin panels with curved shapes are also attracting attention. For such a thin panel, resistance to bending is sometimes required, not only for thinness, but also for flexibility.

另外,對於具有可折曲的可撓性結構之有機EL面板亦受到注目,對於透光性基材或乾燥劑、填充劑等各構成構件亦同樣地被要求薄化、柔軟性。In addition, attention has also been paid to organic EL panels having a flexible structure that can be bent, and thinness and flexibility are similarly required for each constituent member such as a translucent substrate, a desiccant, and a filler.

於專利文獻1中已揭示,將沸石、矽膠等乾燥劑添加於矽氧樹脂中,填充於有機EL面板中者。該方法在添加抑制水分導致的有機EL發光元件的發光面積損失之必要量的乾燥劑時,因無法得到透光性,將產生有機EL元件的光自上面取出到外部,使得對於所謂頂部發光(top emission)之適用性變的不可能。Patent Document 1 has disclosed that a desiccant such as zeolite and silica gel is added to a silicone resin and filled in an organic EL panel. In this method, when a desiccant is added in an amount necessary to suppress the loss of the light-emitting area of the organic EL light-emitting element due to moisture, the light transmittance cannot be obtained. The applicability of top emission) becomes impossible.

又,於專利文獻2中已揭示,將有機金屬化合物作為捕水成分而與矽氧樹脂混合,填充於有機EL面板中者。該方法中,因有機金屬化合物之黏度為高,期待在處理時藉由與上矽氧樹脂之混合而可降低黏度,但有著矽氧樹脂之比率越高越無法得到透光性之問題。 [先前技術文獻] [專利文獻]In addition, Patent Document 2 discloses that an organometallic compound is mixed with a silicone resin as a water-trapping component and filled in an organic EL panel. In this method, since the viscosity of the organometallic compound is high, it is expected that the viscosity can be lowered by mixing with the upper silicone resin during processing, but there is a problem that the higher the ratio of the silicone resin, the less light transmittance can be obtained. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2017-183191號公報 [專利文獻2]日本特開2013-176751號公報[Patent Document 1] JP 2017-183191 A [Patent Document 2] JP 2013-176751 A

[發明所解決的問題][Problem Solved by Invention]

本發明為有鑑於上述事項者,提供高透明的頂部發光(top emission)成為可能,在高透明且高溫高濕下亦可抑制收縮量成長以及元件發光部之損失(暗點產生),且具有抑制短路現象(Short phenomenon)之效果的有機EL用透明密封材料及賦予有機EL用透明乾燥劑的吸濕性矽氧樹脂組成物為目的。 [解決課題的手段]In view of the above-mentioned matters, the present invention makes it possible to provide high-transparency top emission. It can also suppress the growth of shrinkage and the loss of the light-emitting part (dark spots) of the device under high transparency, high temperature and high humidity, and has The purpose is a transparent sealing material for organic EL that suppresses the effect of a short phenomenon, and a hygroscopic silicone resin composition provided with a transparent desiccant for organic EL. [Means to solve the problem]

本發明者們,欲達成上述目的而詳細進行檢討結果,發現將由具有特定折射率的矽氧樹脂及表面處理吸濕性二氧化矽微粒子所成,且顯示吸濕性的組成物作為有機EL用透明密封材料或乾燥劑使用時,可使頂部發光(top emission)成為可能,在高透明且高溫高濕下的收縮量之成長受到抑制,可抑制暗點產生,以及短路產生,而完成本發明者。The inventors of the present invention conducted detailed reviews to achieve the above-mentioned objects and found that a composition made of silicone resin with a specific refractive index and surface-treated hygroscopic silica particles and exhibiting hygroscopicity is used as an organic EL When a transparent sealing material or desiccant is used, top emission is possible, the growth of shrinkage under high transparency, high temperature and high humidity is suppressed, the generation of dark spots and the generation of short circuits can be suppressed, and the present invention is completed By.

因此,本發明為提供下述吸濕性矽氧樹脂組成物、有機EL用透明密封材料、有機EL用透明乾燥材及其使用方法。 1.一種吸濕性矽氧樹脂組成物,其為含有矽氧樹脂,及於表面的至少一部分具有鍵結有機矽化合物或該縮合物而成的被覆部之表面處理吸濕性二氧化矽微粒子,且吸濕容量為1.0×10-7 g/mm3 以上之吸濕性矽氧樹脂組成物,其特徵為上述矽氧樹脂的折射率及上述二氧化矽微粒子的折射率皆為1.39~1.42,上述二氧化矽微粒子對於上述矽氧樹脂組成物全體的含有量為1~70質量%,上述有機矽化合物為下述式(II)所示3官能性矽烷化合物及下述式(III)所示矽氮烷化合物或下述式(IV)所示1官能性矽烷化合物者;

Figure 02_image001
(但,R1 為取代或非取代之碳原子數1~6的一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基);
Figure 02_image003
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基);
Figure 02_image005
(但,R2 與上述相同,X為OH基或水解性基)。 2.上述二氧化矽微粒子為溶膠凝膠二氧化矽微粒子之上述1記載的吸濕性矽氧樹脂組成物。 3.上述表面處理吸濕性二氧化矽微粒子在體積基準粒度分布中之中間徑為0.01~0.5μm之上述1或2記載的吸濕性矽氧樹脂組成物。 4.上述矽氧樹脂為含有下述(A)~(C)成分的上述1~3中任一所記載的吸濕性矽氧樹脂組成物。 (A)於1分子中具有至少2個烯基之直鏈狀有機聚矽氧烷、 (B)於1分子中具有至少2個鍵結於矽原子的氫原子之有機氫聚矽氧烷:含有量為對於(A)成分中之鍵結於矽原子的烯基1莫耳而言,相當於(B)成分中之鍵結於矽原子的氫原子1.0~2.0莫耳之量、 (C)矽氫化觸媒 5.一種吸濕性矽氧樹脂組成物之製造方法,其為製造上述1~4中任一所記載的吸濕性矽氧樹脂組成物的方法,其特徵為上述表面處理吸濕性二氧化矽微粒子藉由下述步驟(A1)~(A4)而製造者; 步驟(A1):藉由將下述式(I)所示4官能性矽烷化合物或其部分水解生成物,或此等混合物,在鹼性物質的存在下,在親水性有機溶劑與水之混合液中進行水解、縮合,得到含有SiO2 單位之親水性球狀二氧化矽微粒子的混合溶劑分散液之步驟;
Figure 02_image007
(但,R3 為相同或相異種的碳原子數1~6之一價烴基)、 步驟(A2):藉由於上述親水性球狀二氧化矽微粒子之混合溶劑分散液中,添加下述式(II)所示3官能性矽烷化合物或其部分水解生成物,或此等混合物,處理上述親水性球狀二氧化矽微粒子之表面,而於上述親水性球狀二氧化矽微粒子之表面上導入R1 SiO3/2 單位(但,R1 與下述相同),得到第一表面處理球狀二氧化矽微粒子之混合溶劑分散液的步驟;
Figure 02_image009
(但,R1 為取代或非取代的碳原子數1~6之一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基); 步驟(A3):藉由自上述第一表面處理球狀二氧化矽微粒子的混合溶劑分散液除去上述親水性有機溶劑與水的一部分,並濃縮後得到第一表面處理球狀二氧化矽微粒子之混合溶劑濃縮分散液的步驟; 步驟(A4):於上述第一表面處理球狀二氧化矽微粒子的混合溶劑濃縮分散液中添加下述式(III)所示矽氮烷化合物,或下述式(IV)所示1官能性矽烷化合物或此等混合物,使上述第一表面處理球狀二氧化矽微粒子的表面進行處理而於上述第一表面處理球狀二氧化矽微粒子的表面上導入R2 3 SiO1/2 單位(但,R2 與下述相同),得到第二表面處理二氧化矽微粒子的步驟;
Figure 02_image011
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基);
Figure 02_image013
(但,R2 與上述相同。X為OH基或水解性基)。 6.含有如上述1~4中任一所記載的吸濕性矽氧樹脂組成物所成的有機EL用透明密封材料。 7.含有如上述1~4中任一所記載的吸濕性矽氧樹脂組成物的硬化物之有機EL用透明乾燥劑。 8.將如上述6記載的有機EL用透明密封材料塗布於有機EL元件上,並使其硬化而使用為特徵之有機EL用透明密封材料的使用方法。 9.將如上述6記載的有機EL用透明密封材料填充於內部具有有機EL元件的面板內,並使其硬化而使用為特徴之有機EL用透明密封材料的使用方法。 10.將如上述7記載的有機EL用透明乾燥劑配置於內部具有有機EL元件之面板內而使用為特徴的有機EL用透明乾燥劑之使用方法。 [發明之效果]Therefore, the present invention provides the following hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL, and methods of use thereof. 1. A hygroscopic silicone resin composition containing silicone resin, and at least a part of the surface has surface-treated hygroscopic silicon dioxide fine particles with a coating formed by bonding an organosilicon compound or the condensate A hygroscopic silicone resin composition with a moisture absorption capacity of 1.0×10 -7 g/mm 3 or more, characterized in that the refractive index of the silicone resin and the refractive index of the silica particles are both 1.39~1.42 The content of the silicon dioxide microparticles to the entire silicone resin composition is 1 to 70% by mass, and the organosilicon compound is a trifunctional silane compound represented by the following formula (II) and the following formula (III) It shows a silazane compound or a monofunctional silane compound represented by the following formula (IV);
Figure 02_image001
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms, and R 4 is the same or different kind of monovalent hydrocarbon group with 1 to 6 carbon atoms);
Figure 02_image003
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms);
Figure 02_image005
(However, R 2 is the same as above, and X is an OH group or a hydrolyzable group). 2. The above-mentioned silica fine particles are the hygroscopic silicone resin composition described in 1 above of sol-gel silica fine particles. 3. The hygroscopic silicone resin composition described in 1 or 2 above in which the intermediate diameter of the surface-treated hygroscopic silica fine particles in the volume-based particle size distribution is 0.01 to 0.5 μm. 4. The silicone resin is a hygroscopic silicone resin composition as described in any one of the above 1 to 3 containing the following components (A) to (C). (A) Linear organopolysiloxane having at least two alkenyl groups in one molecule, (B) Organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule: The content is equivalent to 1.0 to 2.0 moles of hydrogen atoms bonded to silicon atoms in component (B) for 1 mol of alkenyl groups bonded to silicon atoms in component (A), (C ) Hydrosilylation catalyst 5. A method for producing a hygroscopic silicone resin composition, which is a method for producing the hygroscopic silicone resin composition described in any one of 1 to 4, characterized by the above-mentioned surface treatment Hygroscopic silica microparticles are manufactured through the following steps (A1) to (A4); Step (A1): By hydrolyzing the tetrafunctional silane compound represented by the following formula (I) or its partial hydrolysis product , Or these mixtures, hydrolyzed and condensed in a mixture of hydrophilic organic solvents and water in the presence of alkaline substances to obtain a mixed solvent dispersion of hydrophilic spherical silica particles containing SiO 2 units step;
Figure 02_image007
(However, R 3 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different species), Step (A2): Add the following formula to the mixed solvent dispersion of the hydrophilic spherical silica particles (II) The trifunctional silane compound or its partially hydrolyzed product, or a mixture thereof, is used to treat the surface of the hydrophilic spherical silica microparticles, and introduce it on the surface of the hydrophilic spherical silica microparticles R 1 SiO 3/2 units (however, R 1 is the same as the following) to obtain a mixed solvent dispersion of the first surface-treated spherical silica particles;
Figure 02_image009
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms, and R 4 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different species); Step (A3): The step of removing a part of the hydrophilic organic solvent and water from the mixed solvent dispersion of the first surface-treated spherical silica particles, and concentrating to obtain a mixed solvent concentrated dispersion of the first surface-treated spherical silica particles; Step (A4): Add the silazane compound represented by the following formula (III) or the monofunctionality represented by the following formula (IV) to the concentrated dispersion of the mixed solvent of the first surface-treated spherical silica particles Silane compound or these mixtures, subject the surface of the first surface-treated spherical silica particles to the surface of the first surface-treated spherical silica particles to introduce R 2 3 SiO 1/2 units (but , R 2 is the same as below), the step of obtaining the second surface-treated silica particles;
Figure 02_image011
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms);
Figure 02_image013
(However, R 2 is the same as above. X is an OH group or a hydrolyzable group). 6. A transparent sealing material for organic EL containing the hygroscopic silicone resin composition as described in any one of 1 to 4 above. 7. A transparent desiccant for organic EL containing a cured product of the hygroscopic silicone resin composition as described in any one of 1 to 4 above. 8. The method of using the transparent sealing material for organic EL characterized by applying the transparent sealing material for organic EL described in 6 above to the organic EL element and curing it. 9. The transparent sealing material for organic EL as described in 6 above is filled in a panel having organic EL elements inside, and it is cured to use the characteristic transparent sealing material for organic EL. 10. It is a special method of using the transparent desiccant for organic EL as described in 7 above to be used in a panel with organic EL elements inside. [Effects of Invention]

由本發明之吸濕性矽氧樹脂組成物所得的有機EL用透明密封材料為,即使在高透明且高溫高濕下亦可使收縮量之成長變小,且可抑制有機EL元件之破損(暗點產生)。又,本發明之有機EL用透明密封材料因具有高透明,故可適用於可透過自有機EL元件發光的頂部發光(top emission)型。 又,本發明之有機EL用透明密封材料及乾燥劑的使用方法為,於有機EL元件上進行直接塗布,或配置於有機EL面板內者,因矽氧樹脂具有可撓性,故可適用於具有可撓性之有機EL面板。 且有關本發明之有機EL用透明密封材料、乾燥劑及其使用方法,其為可抑制以下效果者,該效果為該密封材料中之低分子矽氧烷於有機EL面板內擴散・堆積,使存在於有機EL元件的形成時之微小顆粒附近絶緣,抑制陰極與陽極藉由顆粒而短路等作為原因的短路現象(Short phenomenon)之效果。 另外,依據本發明之有機EL用透明密封材料及其使用方法,可得到作為吸濕材時所混合的二氧化矽微粒子之分散性為優良,故其為具有抑制吸濕材的凝集所引起的短路現象(Short phenomenon)之表現的效果者。The transparent sealing material for organic EL obtained from the hygroscopic silicone resin composition of the present invention is capable of reducing the growth of shrinkage even under high transparency, high temperature and high humidity, and suppressing damage (darkness) of organic EL elements Point generated). Furthermore, since the transparent sealing material for organic EL of the present invention has high transparency, it can be applied to a top emission type that can emit light from an organic EL element. In addition, the method of using the transparent sealing material for organic EL and the desiccant of the present invention is to directly coat the organic EL element or arrange it in the organic EL panel. Since silicone resin is flexible, it can be applied to Flexible organic EL panel. And regarding the transparent sealing material for organic EL, desiccant and method of use of the present invention, it is capable of suppressing the following effects. The effect is that the low molecular siloxane in the sealing material diffuses and accumulates in the organic EL panel, so that It has the effect of insulating the vicinity of the fine particles during the formation of the organic EL element, and suppressing the short-circuit phenomenon (Short phenomenon) caused by the particles such as the cathode and the anode being short-circuited by the particles. In addition, according to the transparent sealing material for organic EL and the method of use of the present invention, it is possible to obtain excellent dispersibility of silica particles mixed when used as a moisture absorbing material, so it has the ability to suppress aggregation of the moisture absorbing material. The effect of the performance of short phenomenon (Short phenomenon).

[實施發明的型態][Type of Implementation of Invention]

以下對於本發明進行進一步詳細說明。 本發明之吸濕性矽氧樹脂組成物,其為含有矽氧樹脂,及於表面的至少一部分具有鍵結有機矽化合物或其縮合物而成的被覆部之吸濕性二氧化矽微粒子,吸濕容量為1.0×10-7 g/mm3 以上之吸濕性矽氧樹脂組成物,其為上述矽氧樹脂的折射率及上述二氧化矽微粒子之折射率皆為1.39~1.42,上述二氧化矽微粒子對於上述密封材料的含有量為1~70質量%之吸濕性矽氧樹脂組成物。The present invention will be described in further detail below. The hygroscopic silicone resin composition of the present invention contains silicone resin, and at least a part of the surface has hygroscopic silica fine particles with a coating formed by bonding an organosilicon compound or its condensate, which absorbs A hygroscopic silicone resin composition with a moisture capacity of 1.0×10 -7 g/mm 3 or more. The refractive index of the silicone resin and the refractive index of the silica particles are both 1.39~1.42. A hygroscopic silicone resin composition in which the content of silicon fine particles relative to the sealing material is 1 to 70% by mass.

[矽氧樹脂] 對於本發明中之矽氧樹脂,含有下述(A)~(C)成分者為佳。以下對於各成分進行詳細說明。 (A)於1分子中具有至少2個烯基之直鏈狀有機聚矽氧烷 (B)於1分子中具有至少2個鍵結於矽原子的氫原子之有機氫聚矽氧烷:含有量為對於(A)成分中之矽原子所鍵結的烯基1莫耳而言,相當於(B)成分中之鍵結於矽原子的氫原子1.0~2.0莫耳之質量 (C)矽氫化觸媒[Silicone resin] The silicone resin in the present invention preferably contains the following components (A) to (C). Each component is explained in detail below. (A) Linear organopolysiloxane with at least 2 alkenyl groups in 1 molecule (B) Organohydrogen polysiloxane having at least 2 hydrogen atoms bonded to silicon atoms in a molecule: The content is for 1 mol of alkenyl groups bonded to the silicon atoms in component (A) , Equivalent to the mass of 1.0~2.0 moles of hydrogen atom bonded to silicon atom in component (B) (C) Hydrosilation catalyst

(A)含有烯基之直鏈狀有機聚矽氧烷 於本發明中之(A)成分為,於1分子中具有至少2個烯基之直鏈狀有機聚矽氧烷。(A) Linear organopolysiloxane containing alkenyl groups The (A) component in the present invention is a linear organopolysiloxane having at least two alkenyl groups in one molecule.

(A)成分中的含有烯基之直鏈狀有機聚矽氧烷為,於1分子中具有至少2個,較佳為具有至少2~8個烯基之直鏈狀有機聚矽氧烷。具體為下述式(1)

Figure 02_image015
所示有機聚矽氧烷。The linear organopolysiloxane containing alkenyl groups in the component (A) is a linear organopolysiloxane having at least two, preferably at least 2 to 8 alkenyl groups in one molecule. Specifically as the following formula (1)
Figure 02_image015
Shown organopolysiloxane.

上述式(1)中,R6 獨立為選自碳數1~10的烷基、碳數6~12的芳基、碳數2~10的烯基之1價烴基。作為1價烴基的具體例子,可舉出甲基、乙基、丙基、丁基、戊基、己基、環己基等的烷基,或乙烯基、烯丙基、丁烯基、戊烯基、己烯基、環己烯基等的烯基或苯基等的芳基等,由使矽氧樹脂之折射率設定為1.39~1.42之觀點來看,以甲基為佳。對於(A)成分中的烯基,可於分子鏈末端及側鏈中任一者具有,但以僅於末端具有烯基者為佳。x為100~50,000之整數,較佳為150~20,000之整數。In the above formula (1), R 6 is independently a monovalent hydrocarbon group selected from an alkyl group having 1 to 10 carbons, an aryl group having 6 to 12 carbons, and an alkenyl group having 2 to 10 carbons. Specific examples of monovalent hydrocarbon groups include alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, and cyclohexyl, or vinyl, allyl, butenyl, and pentenyl groups. From the viewpoint of setting the refractive index of the silicone resin to 1.39 to 1.42, the methyl group is preferred from the viewpoint of alkenyl groups such as hexenyl groups and cyclohexenyl groups or aryl groups such as phenyl groups. The alkenyl group in the component (A) may have either at the end of the molecular chain and the side chain, but it is preferable to have the alkenyl group only at the end. x is an integer of 100-50,000, preferably an integer of 150-20,000.

作為上述含有烯基之直鏈狀有機聚矽氧烷之具體例子,可舉出分子鏈兩末端三甲基矽氧基封閉二甲基矽氧烷・甲基乙烯基矽氧烷共聚物、分子鏈兩末端三甲基矽氧基封閉甲基乙烯基聚矽氧烷、分子鏈兩末端三甲基矽氧基封閉二甲基矽氧烷・甲基乙烯基矽氧烷・甲基苯基矽氧烷共聚物、分子鏈兩末端二甲基乙烯基矽氧基封閉二甲基聚矽氧烷、分子鏈兩末端二甲基乙烯基矽氧基封閉甲基乙烯基聚矽氧烷、分子鏈兩末端二甲基乙烯基矽氧基封閉二甲基矽氧烷・甲基乙烯基矽氧烷共聚物、分子鏈兩末端二甲基乙烯基矽氧基封閉二甲基矽氧烷・甲基乙烯基矽氧烷・甲基苯基矽氧烷共聚物、分子鏈兩末端二乙烯基甲基矽氧基封閉二甲基聚矽氧烷、分子鏈兩末端二乙烯基甲基矽氧基封閉二甲基矽氧烷・甲基乙烯基矽氧烷共聚物、分子鏈兩末端三乙烯基矽氧基封閉二甲基聚矽氧烷、分子鏈兩末端三乙烯基矽氧基封閉二甲基矽氧烷・甲基乙烯基矽氧烷共聚物等。Specific examples of the above-mentioned linear organopolysiloxane containing alkenyl groups include trimethylsiloxy blocked dimethylsiloxane, methylvinylsiloxane copolymers, molecular Trimethylsiloxy blocked methyl vinyl polysiloxane at both ends of the chain, trimethylsiloxy blocked dimethylsiloxane at both ends of the molecular chain, methyl vinyl siloxane, methyl phenyl silicone Oxyane copolymer, dimethyl vinyl siloxy blocked dimethyl polysiloxane at both ends of molecular chain, dimethyl vinyl siloxy blocked at both ends of molecular chain methyl vinyl polysiloxane, molecular chain Two-terminal dimethylvinylsiloxy blocked dimethylsiloxane・methylvinylsiloxane copolymer, molecular chain two-terminal dimethylvinylsiloxane blocked dimethylsiloxane・methyl Vinylsiloxane・methylphenylsiloxane copolymer, divinylmethylsiloxy block at both ends of the molecular chain, dimethylpolysiloxane, block both ends of the molecular chain with divinylmethylsiloxy Dimethylsiloxane・methylvinylsiloxane copolymer, trivinylsiloxy blocked dimethyl polysiloxane at both ends of molecular chain, trivinylsiloxy blocked dimethyl at both ends of molecular chain Silicone, methyl vinyl silicone copolymer, etc.

上述含有烯基之直鏈狀有機聚矽氧烷可使用1種,亦可並用2種以上。合併使用2種上述直鏈狀有機聚矽氧烷時,低分子量側之有機聚矽氧烷的重量平均分子量以1,000~50,000為佳,較佳為1,500~20,000。另一方面,高分子量側的有機聚矽氧烷之重量平均分子量以超過1,500~200,000者為佳,較佳為超過2,000~100,000。但其為(低分子側之重量平均分子量)<(高分子側之重量平均分子量)。The linear organopolysiloxane containing alkenyl groups may be used singly or in combination of two or more kinds. When two types of linear organopolysiloxanes are used in combination, the weight average molecular weight of the organopolysiloxane on the low molecular weight side is preferably 1,000 to 50,000, and more preferably 1,500 to 20,000. On the other hand, the weight average molecular weight of the organopolysiloxane on the high molecular weight side is preferably more than 1,500 to 200,000, preferably more than 2,000 to 100,000. However, it is (weight average molecular weight on the low molecular side) <(weight average molecular weight on the high molecular side).

且,於本發明中之重量平均分子量係作為GPC(凝膠滲透色譜儀)分析中之聚苯乙烯換算的重量平均分子量而可求得。In addition, the weight average molecular weight in the present invention can be obtained as the weight average molecular weight in terms of polystyrene in GPC (gel permeation chromatography) analysis.

又,作為(A)成分的含有烯基之直鏈狀有機聚矽氧烷以外之成分,亦可包含含有烯基之樹脂狀有機聚矽氧烷。但,由抑制硬化時的氣泡產生及光透過性惡化之觀點來看,含有烯基之樹脂狀有機聚矽氧烷之含有量以對於(A)成分而言為1質量%以下者為佳。In addition, components other than the alkenyl group-containing linear organopolysiloxane as the component (A) may include alkenyl group-containing resinous organopolysiloxanes. However, from the viewpoint of suppressing the generation of bubbles and deterioration of light transmittance during curing, the content of the alkenyl group-containing resinous organopolysiloxane is preferably 1% by mass or less with respect to the component (A).

(B)有機氫聚矽烷 於本發明中之(B)成分的有機氫聚矽氧烷為,扮演著與上述含有烯基的有機聚矽氧烷藉由矽氫化而形成交聯結構之交聯劑的角色者,其為於1分子中具有至少2個鍵結於矽原子的氫原子之有機氫聚矽氧烷。(B) Organohydrogen polysiloxane The organohydrogenpolysiloxane of component (B) in the present invention is a crosslinking agent that forms a crosslinked structure with the above-mentioned alkenyl group-containing organopolysiloxane by hydrosilation, which is An organohydrogen polysiloxane having at least two hydrogen atoms bonded to silicon atoms in one molecule.

作為該如此(B)成分之有機氫聚矽氧烷的具體例子,可舉出1,1,3,3-四甲基二矽氧烷、1,3,5,7-四甲基環四矽氧烷、參(氫二甲基矽氧基)甲基矽烷、參(氫二甲基矽氧基)苯基矽烷、甲基氫環聚矽氧烷、甲基氫矽氧烷・二甲基矽氧烷環狀共聚物、分子鏈兩末端三甲基矽氧基封閉甲基氫聚矽氧烷、分子鏈兩末端三甲基矽氧基封閉二甲基矽氧烷・甲基氫矽氧烷共聚物、分子鏈兩末端三甲基矽氧基封閉二甲基矽氧烷・甲基氫矽氧烷・甲基苯基矽氧烷共聚物、分子鏈兩末端三甲基矽氧基封閉二甲基矽氧烷・甲基氫矽氧烷・二苯基矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封閉甲基氫聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封閉二甲基聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封閉二甲基矽氧烷・甲基氫矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封閉二甲基矽氧烷・甲基苯基矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封閉二甲基矽氧烷・二苯基矽氧烷共聚物、分子鏈兩末端二甲基氫矽氧基封閉甲基苯基聚矽氧烷、分子鏈兩末端二甲基氫矽氧基封閉二苯基聚矽氧烷,或對於這些各例示化合物,可舉出甲基之一部分或全部由乙基、丙基等其他烷基進行取代者、含有式:R3 SiO1/2 所示矽氧烷單位與式:R2 HSiO1/2 所示矽氧烷單位與式:SiO4/2 所示矽氧烷單位所成有機矽氧烷共聚物、含有式:R2 HSiO1/2 所示矽氧烷單位與式:SiO4/2 所示矽氧烷單位所成的有機矽氧烷共聚物、含有式:RHSiO2/2 所示矽氧烷單位與式:RSiO3/2 所示矽氧烷單位或者式:HSiO3/2 所示矽氧烷單位所成的有機矽氧烷共聚物,及含有這些有機聚矽氧烷之2種以上所成的混合物。As a specific example of the organohydrogen polysiloxane of the component (B), 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane Silicone, ginseng (hydrodimethylsiloxy) methyl silane, ginseng (hydrodimethyl siloxy) phenyl silane, methyl hydrogen siloxane, methyl hydrogen siloxane, dimethyl -Based siloxane cyclic copolymer, trimethylsiloxy blocked methyl hydrogen polysiloxane at both ends of the molecular chain, trimethylsiloxy blocked dimethylsiloxane at both ends of the molecular chain, methyl hydrogen silicon Oxyane copolymer, trimethylsiloxy blocked dimethylsiloxane at both ends of molecular chain, methylhydrosiloxane, methylphenylsiloxane copolymer, trimethylsiloxy at both ends of molecular chain Blocked dimethylsiloxane・methylhydrosiloxane・diphenylsiloxane copolymer, dimethylhydrosiloxane at both ends of the molecular chain, blocked methylhydrosiloxane at both ends of the molecular chain, dimethyl at both ends of the molecular chain Hydrogen silyloxy-blocked dimethyl polysiloxane, dimethylhydrosiloxane blocked dimethyl siloxane at both ends of the molecular chain, copolymer of methylhydrosiloxane, dimethyl hydrogen at both ends of the molecular chain Siloxy-blocked dimethylsiloxane・methylphenylsiloxane copolymer, dimethylhydrosiloxy-blocked dimethylsiloxane・diphenylsiloxane copolymer at both ends of the molecular chain, molecule The dimethylhydrosiloxy group-blocked methylphenyl polysiloxane at both ends of the chain, the dimethylhydrosiloxy group-blocked diphenylpolysiloxane at both ends of the molecular chain, or each of these exemplified compounds can be mentioned Part or all of the methyl group is substituted by other alkyl groups such as ethyl, propyl, etc., containing the siloxane unit shown in R 3 SiO 1/2 and the siloxane unit shown in R 2 HSiO 1/2 And formula: organosiloxane copolymer formed by siloxane unit shown in SiO 4/2 , containing formula: siloxane unit shown in R 2 HSiO 1/2 and formula: siloxane unit shown in SiO 4/2 The resulting organosiloxane copolymer contains formula: siloxane unit shown in RHSiO 2/2 and formula: siloxane unit shown in RSiO 3/2 or formula: siloxane unit shown in HSiO 3/2 Organosiloxane copolymers, and mixtures containing two or more of these organopolysiloxanes.

(B)成分的配合量為,對於(A)成分中之鍵結於矽原子的烯基1莫耳而言,相當於(B)成分中之鍵結於矽原子的氫原子1.0~2.0莫耳之量,較佳為相當於1.0~1.5莫耳之量。The compounding quantity of component (B) is that, for 1 mol of alkenyl group bonded to silicon atom in component (A), it is equivalent to 1.0 to 2.0 mol of hydrogen atom bonded to silicon atom in component (B) The amount of ears is preferably an amount equivalent to 1.0 to 1.5 moles.

(C)矽氫化觸媒 於本發明中之(C)成分的矽氫化觸媒係為上述(A)成分的含有烯基的有機聚矽氧烷與上述(B)成分的有機氫聚矽氧烷藉由矽氫化反應而進行交聯時的觸媒。(C) Hydrosilation catalyst The hydrosilylation catalyst of the component (C) in the present invention is the alkenyl group-containing organopolysiloxane of the component (A) and the organohydrogenpolysiloxane of the component (B) by a hydrosilylation reaction Catalyst for cross-linking.

作為矽氫化反應用觸媒,以鉑族金屬系觸媒為佳,具體可舉出鉑黑、氯化第2鉑、氯化鉑酸、氯化鉑酸與1元醇的反應物、氯化鉑酸與烯烴類之錯合物、氯化鉑酸與含有乙烯基的(聚)矽氧烷之錯合物、鉑-乙醯丙酮錯合物、鉑-環戊二烯基錯合物等鉑族金屬系觸媒。As the catalyst for the hydrosilation reaction, platinum group metal catalysts are preferred. Specific examples include platinum black, second platinum chloride, chloroplatinic acid, chloroplatinic acid and monohydric alcohol reactants, chlorination Complexes of platinum acid and olefins, complexes of chloroplatinic acid and vinyl-containing (poly)siloxanes, platinum-acetone acetone complexes, platinum-cyclopentadienyl complexes, etc. Platinum group metal catalyst.

又,作為(C)成分,可使用在遮光下為惰性,且藉由照射波長200~500nm之光,變化為活性鉑族金屬觸媒者。作為如此(C)成分之具體例子,可舉出鉑族金屬觸媒,其中亦以釕、銠、鈀、鉑等鉑族元素化合物為佳,特別以鉑化合物為佳。作為該鉑化合物之例子,可舉出配位子具有β-二酮鉑錯合物或環狀二烯化合物之鉑錯合物等。這些化合物可為合成者,亦可使用販售品。In addition, as the (C) component, it is possible to use one that is inert under shading and is changed to an active platinum group metal catalyst by irradiating light with a wavelength of 200 to 500 nm. As a specific example of such a component (C), platinum group metal catalysts can be cited. Among them, compounds of platinum group elements such as ruthenium, rhodium, palladium, and platinum are also preferable, and platinum compounds are particularly preferable. As an example of the platinum compound, a platinum complex having a β-diketoplatinum complex or a cyclic diene compound or the like as a ligand can be cited. These compounds may be synthesized or sold.

作為上述β-二酮鉑錯合物,例如可舉出三甲基(乙醯二酮酸根)鉑錯合物、三甲基(2,4-戊二酸)鉑錯合物、三甲基(3,5-庚二酸)鉑錯合物、三甲基(甲基乙醯乙酸酯)鉑錯合物、雙(2,4-戊二酸根)鉑錯合物、雙(2,4-己二酸根)鉑錯合物、雙(2,4-庚二酸根)鉑錯合物、雙(3,5-庚二酸根)鉑錯合物、雙(1-苯基-1,3-丁二酸根)鉑錯合物、雙(1,3-二苯基-1,3-丙二酸根)鉑錯合物等,較佳為雙(β-二酮根)鉑錯合物,更佳為雙(乙醯二酮酸根)鉑錯合物。As the above-mentioned β-diketone platinum complexes, for example, trimethyl(acetyldionate) platinum complexes, trimethyl(2,4-glutaric acid) platinum complexes, trimethyl (3,5-pimelic acid) platinum complex, trimethyl (methyl acetate) platinum complex, bis(2,4-glutarate) platinum complex, bis(2, 4-adipate) platinum complex, bis(2,4-pimelate) platinum complex, bis(3,5-pimelate) platinum complex, bis(1-phenyl-1, 3-succinate) platinum complex, bis(1,3-diphenyl-1,3-malonate) platinum complex, etc., preferably bis(β-diketonate) platinum complex , More preferably bis(acetodionate) platinum complex.

作為上述的於配位子具有環狀二烯化合物之鉑錯合物,例如可舉出(η5 -環戊二烯基)二甲基鉑錯合物、(η5 -環戊二烯基)二苯基鉑錯合物、(η5 -環戊二烯基)二丙基鉑錯合物、(2,5-冰片二烯)二甲基鉑錯合物、(2,5-冰片二烯)二苯基鉑錯合物、(η5 -環戊二烯基)二甲基鉑錯合物、(η5 -甲基環戊二烯基)二乙基鉑錯合物、(η5 -三甲基矽基環戊二烯基)二苯基鉑錯合物、(η5 -甲基環辛二烯)二乙基鉑錯合物、(η5 -環戊二烯基)三甲基鉑錯合物、(η5 -環戊二烯基)乙基二甲基鉑錯合物、(η5 -環戊二烯基)乙醯二甲基鉑錯合物、(η5 -甲基環戊二烯基)三甲基鉑錯合物、(η5 -甲基環戊二烯基)三己基鉑錯合物、(η5 -三甲基矽基環戊二烯基)三甲基鉑錯合物、(η5 -二甲基苯基矽基環戊二烯基)三苯基鉑錯合物、及、(η5 -環戊二烯基)二甲基三甲基矽基甲基鉑錯合物等,較佳為(η5 -甲基環戊二烯基)三烷基鉑錯合物,更佳為(η5 -甲基環戊二烯基)三甲基鉑錯合物。Examples of the platinum complexes having a cyclic diene compound in the ligand include (η 5 -cyclopentadienyl) dimethyl platinum complex, (η 5 -cyclopentadienyl) )Diphenylplatinum complex, (η 5 -cyclopentadienyl)dipropylplatinum complex, (2,5-bornadiene)dimethylplatinum complex, (2,5-bornyl) Diene) diphenyl platinum complex, (η 5 -cyclopentadienyl) dimethyl platinum complex, (η 5 -methylcyclopentadienyl) diethyl platinum complex, ( η 5 -trimethylsilylcyclopentadienyl) diphenyl platinum complex, (η 5 -methylcyclooctadiene) diethyl platinum complex, (η 5 -cyclopentadienyl) ) Trimethylplatinum complex, (η 5 -cyclopentadienyl) ethyl dimethyl platinum complex, (η 5 -cyclopentadienyl) acetyl dimethyl platinum complex, ( η 5 -Methylcyclopentadienyl)trimethylplatinum complex, (η 5 -Methylcyclopentadienyl)trihexylplatinum complex, (η 5 -Trimethylsilylcyclopentadiene) Alkenyl) trimethylplatinum complex, (η 5 -dimethylphenylsilylcyclopentadienyl) triphenylplatinum complex, and (η 5 -cyclopentadienyl) dimethyl Yltrimethylsilylmethylplatinum complex, etc., preferably (η 5 -methylcyclopentadienyl)trialkylplatinum complex, more preferably (η 5 -methylcyclopentadiene Base) Trimethylplatinum complex.

(C)成分之配合量若為可促進本發明之樹脂組成物的硬化(矽氫化反應)之量即可,並無特別限定,但由硬化性、保存安定性及成本之觀點來看,對於(A)成分與(B)成分之質量合計而言,換算為鉑族金屬量時,以成為0.5~1,000ppm之量為佳,較佳為1~500ppm。(C) The compounding amount of the component may be an amount that can promote the curing (hydrosilation reaction) of the resin composition of the present invention, and it is not particularly limited, but from the viewpoint of curing properties, storage stability, and cost, When the total mass of the component (A) and the component (B) is converted into the amount of platinum group metal, it is preferably 0.5 to 1,000 ppm, and preferably 1 to 500 ppm.

其他成分 本發明之矽氧樹脂除上述(A)~(C)成分之以外,在不損害本發明之作用效果的範圍,可添加其他成分。具體可舉出的矽氫化反應的反應控制劑、接著性賦予材(特別為於分子中含有選自烯基、環氧基、胺基、(甲基)丙烯醯氧基、巰基等至少1種官能性基,且於分子中未含有SiH基的官能性烷氧基矽烷等有機矽化合物等)、觸變性賦予劑等。Other ingredients In addition to the above-mentioned components (A) to (C), the silicone resin of the present invention may contain other components within a range that does not impair the effects of the present invention. Specific examples include reaction control agents and adhesive-imparting materials for the hydrosilation reaction (especially containing at least one selected from alkenyl, epoxy, amino, (meth)acryloxy, mercapto, etc.) in the molecule Functional groups, and functional alkoxysilanes (organosilicon compounds such as functional alkoxysilanes that do not contain SiH groups in the molecule), thixotropy imparting agents, etc.

在本發明所使用的矽氧樹脂之折射率為1.39~1.42之範圍。折射率在此範圍外時,因與二氧化矽微粒子之折射率差變大,損害到所得之硬化物的透明性。The refractive index of the silicone resin used in the present invention is in the range of 1.39 to 1.42. When the refractive index is outside this range, the difference in refractive index with the silica particles becomes larger, which impairs the transparency of the cured product obtained.

[表面處理吸濕性二氧化矽微粒子] 在本發明所使用的表面處理吸濕性二氧化矽微粒子為,表面的至少一部分具有鍵結有機矽化合物或其縮合物而成的被覆部之吸濕性二氧化矽微粒子。[Surface treatment hygroscopic silica particles] The surface-treated hygroscopic silica fine particles used in the present invention are hygroscopic silica fine particles having at least a part of the surface having a coating formed by bonding an organosilicon compound or a condensate thereof.

上述有機矽化合物為,下述式(II)所示3官能性矽烷化合物,及下述式(III)所示矽氮烷化合物或下述式(IV)所示1官能性矽烷化合物。

Figure 02_image017
(但,R1 為取代或非取代的碳原子數1~6的一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基)
Figure 02_image019
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基)
Figure 02_image021
(但,R2 與上述相同。X為OH基或水解性基。)The organosilicon compound is a trifunctional silane compound represented by the following formula (II), a silazane compound represented by the following formula (III) or a monofunctional silane compound represented by the following formula (IV).
Figure 02_image017
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and R 4 is the same or different kind of monovalent hydrocarbon group having 1 to 6 carbon atoms)
Figure 02_image019
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms)
Figure 02_image021
(However, R 2 is the same as above. X is an OH group or a hydrolyzable group.)

上述式(II)中,R1 一般為碳原子數1~20,以碳原子數1~6為佳,較佳為碳原子數1~3,特佳為1~2的1價烴基。作為R1 所示1價烴基,例如可舉出甲基、乙基、n-丙基、異丙基、丁基、己基等的烷基等,較佳為甲基、乙基、n-丙基、異丙基,特佳為甲基、乙基。又,這些1價烴基的氫原子之一部分或全部可由氟原子、氯原子、溴原子等鹵素原子所取代,較佳為可由氟原子所取代。In the above formula (II), R 1 is generally a monovalent hydrocarbon group having 1 to 20 carbon atoms, preferably 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms, and particularly preferably 1 to 2 carbon atoms. Examples of the monovalent hydrocarbon group represented by R 1 include alkyl groups such as methyl, ethyl, n-propyl, isopropyl, butyl, and hexyl, and methyl, ethyl, and n-propyl are preferred. Group and isopropyl, particularly preferably methyl and ethyl. In addition, part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted with halogen atoms such as fluorine atoms, chlorine atoms, and bromine atoms, and preferably may be substituted with fluorine atoms.

上述式(II)中,R4 一般為碳原子數1~6,以碳原子數1~3為佳,特佳為1~2的1價烴基。作為R4 所示1價烴基,例如可舉出甲基、乙基、丙基、丁基等的烷基等,較佳可舉出甲基、乙基、丙基,特佳為甲基、乙基。In the above formula (II), R 4 is generally a monovalent hydrocarbon group having 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms, and particularly preferably 1 to 2 monovalent hydrocarbon groups. Examples of the monovalent hydrocarbon group represented by R 4 include alkyl groups such as methyl, ethyl, propyl, and butyl, preferably methyl, ethyl, and propyl, particularly preferably methyl, Ethyl.

作為上述式(II)所示3官能性矽烷化合物,例如可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、n-丙基三甲氧基矽烷、n-丙基三乙氧基矽烷、異丙基三甲氧基矽烷、異丙基三乙氧基矽烷、丁基三甲氧基矽烷、丁基三乙氧基矽烷、己基三甲氧基矽烷、三氟丙基三甲氧基矽烷、十七氟癸基三甲氧基矽烷等三烷氧基矽烷等,較佳為可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷,更佳可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷或此等部分水解縮合生成物。As the trifunctional silane compound represented by the above formula (II), for example, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n- Propyl trimethoxy silane, n-propyl triethoxy silane, isopropyl trimethoxy silane, isopropyl triethoxy silane, butyl trimethoxy silane, butyl triethoxy silane, hexyl Trialkoxysilanes such as trimethoxysilane, trifluoropropyltrimethoxysilane, and heptafluorodecyltrimethoxysilane, etc., preferably methyltrimethoxysilane, methyltriethoxy Silane, ethyl trimethoxy silane, ethyl triethoxy silane, more preferably methyl trimethoxy silane, methyl triethoxy silane, or these partial hydrolysis condensation products.

對於上述式(III)及式(IV),R2 為碳原子數1~6,較佳為碳原子數1~4,特佳為碳原子數1~2的1價烴基。作為R2 所示1價烴基,例如可舉出甲基、乙基、丙基、異丙基、丁基等的烷基等,較佳可舉出甲基、乙基、丙基,特佳為、甲基、乙基。又,這些1價烴基的氫原子之一部分或全部可由氟原子、氯原子、溴原子等鹵素原子所取代,較佳為可由氟原子所取代。Regarding the above formula (III) and formula (IV), R 2 is a carbon number of 1 to 6, preferably a carbon number of 1 to 4, and particularly preferably a carbon number of 1 to 2 monovalent hydrocarbon group. Examples of the monovalent hydrocarbon group represented by R 2 include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, etc., preferably methyl, ethyl, propyl, and particularly preferred For, methyl, ethyl. In addition, part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted with halogen atoms such as fluorine atoms, chlorine atoms, and bromine atoms, and preferably may be substituted with fluorine atoms.

作為上述式(IV)中之X所示水解性基,例如可舉出氯原子、烷氧基、胺基、醯氧基等,較佳可舉出烷氧基、胺基,特佳可舉出烷氧基。As the hydrolyzable group represented by X in the above formula (IV), for example, a chlorine atom, an alkoxy group, an amino group, an acyloxy group, etc. can be mentioned, preferably an alkoxy group, an amino group, and particularly preferred出alkoxy group.

作為上述式(III)所示矽氮烷化合物,例如可舉出六甲基二矽氮烷、六乙基二矽氮烷等,較佳可舉出六甲基二矽氮烷。Examples of the silazane compound represented by the above formula (III) include hexamethyldisilazane, hexaethyldisilazane, and the like, and preferably hexamethyldisilazane.

作為上述式(IV)所示1官能性矽烷化合物,例如可舉出三甲基矽烷醇、三乙基矽烷醇等單矽烷醇化合物、三甲基氯矽烷、三乙基氯矽烷等單氯矽烷、三甲基甲氧基矽烷、三甲基乙氧基矽烷等單烷氧基矽烷、三甲基矽基二甲基胺、三甲基矽基二乙基胺等單胺基矽烷、三甲基乙醯氧基矽烷等單醯氧矽烷,較佳可舉出三甲基矽烷醇、三甲基甲氧基矽烷、三甲基矽基二乙基胺,特佳為可舉出三甲基矽烷醇、三甲基甲氧基矽烷。Examples of monofunctional silane compounds represented by the above formula (IV) include monosilanol compounds such as trimethylsilanol and triethylsilanol, and monochlorosilanes such as trimethylchlorosilane and triethylchlorosilane. , Trimethylmethoxysilane, trimethylethoxysilane and other monoalkoxysilanes, trimethylsilyldimethylamine, trimethylsilyldiethylamine and other monoaminosilanes, trimethyl Monooxysilanes such as methyl acetoxysilane, preferably trimethylsilanol, trimethylmethoxysilane, trimethylsilyldiethylamine, particularly preferably trimethyl Silanol, trimethylmethoxysilane.

合成二氧化矽微粒子依據該製法可大略分為燃燒法二氧化矽、爆燃法二氧化矽、濕式二氧化矽、溶膠-凝膠法二氧化矽(所謂Stoeber法)。其中,藉由溶膠-凝膠法之二氧化矽為藉由存在內部的矽烷醇基可更有效率地吸收水分故較佳。Synthetic silica particles can be roughly classified into combustion silica, deflagration silica, wet silica, and sol-gel silica (the so-called Stoeber method) according to the preparation method. Among them, the silica by the sol-gel method is preferable because the silanol group existing inside can absorb water more efficiently.

以下對於藉由溶膠-凝膠法的本發明之表面處理吸濕性二氧化矽微粒子之較佳製造方法之一例子進行說明。Hereinafter, an example of a preferable method for producing the surface-treated hygroscopic silica particles of the present invention by the sol-gel method will be described.

本發明中之表面處理吸濕性二氧化矽微粒子的製造方法為含有以下步驟者; 步驟(A1):將下述式(I)

Figure 02_image023
(但,R3 為相同或相異種的碳原子數1~6之一價烴基)所示4官能性矽烷化合物或其部分水解生成物,或此等混合物,在鹼性物質的存在下,藉由在親水性有機溶劑與水之混合液中進行水解、縮合,得到含有SiO2 單位的親水性二氧化矽微粒子的混合溶劑分散液之步驟; 步驟(A2):於上述親水性二氧化矽微粒子之混合溶劑分散液中,添加下述式(II)所示3官能性矽烷化合物或其部分水解生成物,或此等混合物,藉由處理上述親水性二氧化矽微粒子之表面,於上述親水性二氧化矽微粒子之表面上導入R1 SiO3/2 單位(但,R1 與下述相同),得到第一表面處理二氧化矽微粒子之混合溶劑分散液的步驟;
Figure 02_image025
(但,R1 為取代或非取代的碳原子數1~20之一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基) 步驟(A3):藉由自上述第一表面處理二氧化矽微粒子的混合溶劑分散液除去上述親水性有機溶劑與水的一部分,並濃縮後得到第一表面處理二氧化矽微粒子之混合溶劑濃縮分散液的步驟; 步驟(A4):於上述第一表面處理二氧化矽微粒子的混合溶劑濃縮分散液中,添加下述式(III)所示矽氮烷化合物,或下述式(IV)所示1官能性矽烷化合物或此等混合物,使上述第一表面處理二氧化矽微粒子的表面進一步進行處理而於上述第一表面處理二氧化矽微粒子的表面上導入R2 3 SiO1/2 單位(但,R2 與下述相同。),得到第二表面處理二氧化矽微粒子之步驟;
Figure 02_image027
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基)
Figure 02_image029
(但,R2 與上述相同。X為OH基或水解性基)。The method for producing surface-treated hygroscopic silica microparticles in the present invention includes the following steps: Step (A1): The following formula (I)
Figure 02_image023
(However, R 3 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different species.) The tetrafunctional silane compound or its partial hydrolysis product, or a mixture of these, in the presence of a basic substance, A step of hydrolyzing and condensing in a mixed liquid of a hydrophilic organic solvent and water to obtain a mixed solvent dispersion of hydrophilic silica particles containing SiO 2 units; Step (A2): in the above hydrophilic silica particles To the mixed solvent dispersion, add the trifunctional silane compound represented by the following formula (II) or its partially hydrolyzed product, or these mixtures, and treat the surface of the hydrophilic silica particles to make the hydrophilic The step of introducing R 1 SiO 3/2 units on the surface of the silica particles (but R 1 is the same as the following) to obtain a mixed solvent dispersion of the first surface-treated silica particles;
Figure 02_image025
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group with 1 to 20 carbon atoms, and R 4 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different kind) Step (A3): from the above The step of removing a part of the hydrophilic organic solvent and water from the mixed solvent dispersion of the first surface-treated silica microparticles, and concentrating the mixed solvent dispersion of the first surface-treated silica microparticles; Step (A4): Add a silazane compound represented by the following formula (III), or a monofunctional silane compound represented by the following formula (IV), or a mixture thereof to the concentrated dispersion of the mixed solvent of the first surface-treated silica particles , The surface of the first surface-treated silica particles is further processed, and R 2 3 SiO 1/2 unit is introduced on the surface of the first surface-treated silica particles. (However, R 2 is the same as the following.) , The step of obtaining second surface-treated silica particles;
Figure 02_image027
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms)
Figure 02_image029
(However, R 2 is the same as above. X is an OH group or a hydrolyzable group).

即,本發明之二氧化矽微粒子為藉由以下步驟而得到; 步驟(A1):親水性二氧化矽微粒子之合成步驟、 步驟(A2):藉由3官能性矽烷化合物之表面處理步驟、 步驟(A3):濃縮步驟、 步驟(A4):藉由1官能性矽烷化合物之表面處理步驟; 以下依序補充說明步驟(A1)~(A4)之各步驟。That is, the silica microparticles of the present invention are obtained through the following steps; Step (A1): Synthesis step of hydrophilic silica particles, Step (A2): Surface treatment step with trifunctional silane compound, Step (A3): concentration step, Step (A4): Surface treatment step by monofunctional silane compound; The following is a supplementary explanation of each step of steps (A1) ~ (A4) in order.

-步驟(A1):親水性二氧化矽微粒子之合成步驟- 本步驟為,將式(I)所示4官能性矽烷化合物或其部分水解生成物或此等混合物在鹼性物質之存在下,在親水性有機溶劑與水之混合液中,藉由水解、縮合而得到親水性二氧化矽微粒子混合溶劑分散液;

Figure 02_image031
(但,R3 為相同或相異種的碳原子數1~6之一價烴基)。-Step (A1): Synthesis Step of Hydrophilic Silica Microparticles- In this step, the 4-functional silane compound represented by formula (I) or its partially hydrolyzed product or these mixtures are in the presence of a basic substance, In a mixed liquid of a hydrophilic organic solvent and water, a mixed solvent dispersion of hydrophilic silica particles is obtained by hydrolysis and condensation;
Figure 02_image031
(However, R 3 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different kind).

作為R3 所示1價烴基,例如可舉出甲基、乙基、丙基、丁基、苯基等,較佳可舉出甲基、乙基、丙基、丁基,特佳為可舉出甲基、乙基。較佳為碳原子數1~4的烷基,特佳為甲基、乙基。The monovalent hydrocarbon group represented by R 3 includes, for example, methyl, ethyl, propyl, butyl, phenyl, etc., preferably methyl, ethyl, propyl, butyl, and particularly preferably Examples include methyl and ethyl. Preferred are alkyl groups having 1 to 4 carbon atoms, and particularly preferred are methyl and ethyl groups.

作為上述式(I):Si(OR3 )4 所示4官能性矽烷化合物,例如可舉出四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四丁氧基矽烷等四烷氧基矽烷、四苯氧基矽烷等,較佳可舉出四甲氧基矽烷、四乙氧基矽烷、四丙氧基矽烷、四丁氧基矽烷,特佳為、四甲氧基矽烷、四乙氧基矽烷。又,作為式(I)所示4官能性矽烷化合物之部分水解縮合生成物,例如可舉出甲基矽酸鹽、乙基矽酸鹽等。As the tetrafunctional silane compound represented by the above formula (I): Si(OR 3 ) 4 , for example, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, etc. Alkoxysilane, tetraphenoxysilane, etc., preferably tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, particularly preferably, tetramethoxysilane , Tetraethoxysilane. In addition, examples of the partial hydrolysis condensation product of the tetrafunctional silane compound represented by formula (I) include methyl silicate and ethyl silicate.

作為上述親水性有機溶劑,若為溶解上述式(I):Si(OR3 )4 所示4官能性矽烷化合物、該部分水解縮合生成物與水者即可,並無特別限制,例如可舉出醇類、甲基溶纖劑、乙基溶纖劑、丁基溶纖劑、乙酸溶纖劑等溶纖劑類、丙酮、甲基乙基酮等酮類、二噁烷、四氫呋喃等醚類等,較佳可舉出醇類、溶纖劑類,特佳可舉出醇類。The hydrophilic organic solvent is not particularly limited as long as it dissolves the tetrafunctional silane compound represented by the formula (I): Si(OR 3 ) 4 , the partial hydrolysis condensation product and water, and is not particularly limited, for example, Alcohols, methyl cellosolve, ethyl cellosolve, butyl cellosolve, cellosolve acetate and other cellosolves, acetone, methyl ethyl ketone and other ketones, dioxane, tetrahydrofuran and other ethers, etc. Preferably, alcohols and cellosolves are used, and particularly preferably, alcohols are used.

作為該醇類,可舉出下述式(V)所示醇;

Figure 02_image033
(式中,R5 為碳原子數1~6的1價烴基)。Examples of the alcohols include alcohols represented by the following formula (V);
Figure 02_image033
(In the formula, R 5 is a monovalent hydrocarbon group having 1 to 6 carbon atoms).

上述式(V):R5 OH中,R5 以碳原子數1~4為佳,特佳為1~2的1價烴基。作為R5 所示1價烴基,例如可舉出甲基、乙基、丙基、異丙基、丁基等的烷基等,較佳為可舉出甲基、乙基、丙基、異丙基,更佳可舉出甲基、乙基。作為上述式(V)所示醇,例如可舉出甲醇、乙醇、丙醇、異丙醇、丁醇等,較佳可舉出甲醇、乙醇。若醇的碳原子數增加時,所生成的二氧化矽微粒子之粒子徑會變大。因此,欲得到目的之小粒徑二氧化矽微粒子時以甲醇為佳。The above formula (V): In R 5 OH, R 5 is preferably a C 1 to 4 monovalent hydrocarbon group, particularly preferably 1 to 2 monovalent hydrocarbon group. Examples of the monovalent hydrocarbon group represented by R 5 include alkyl groups such as methyl, ethyl, propyl, isopropyl, and butyl, and preferably include methyl, ethyl, propyl, and isopropyl groups. The propyl group, more preferably, a methyl group and an ethyl group. Examples of the alcohol represented by the above formula (V) include methanol, ethanol, propanol, isopropanol, butanol, and the like, preferably methanol and ethanol. If the number of carbon atoms of the alcohol increases, the particle size of the generated silica particles will increase. Therefore, it is better to use methanol when the target small particle size silica particles are to be obtained.

又,作為上述鹼性物質,可舉出氨、二甲基胺、二乙基胺等,較佳為可舉出氨、二乙基胺,特佳為可舉出氨。此等鹼性物質的所要量溶解於水後,將所得之水溶液(鹼性)與上述親水性有機溶劑進行混合即可。Moreover, as said basic substance, ammonia, dimethylamine, diethylamine, etc. are mentioned, Preferably it is ammonia, diethylamine, Especially preferably, it is ammonia. After the required amount of these alkaline substances is dissolved in water, the resulting aqueous solution (alkaline) can be mixed with the above-mentioned hydrophilic organic solvent.

此時所使用的水量,對於上述式(I):Si(OR3 )4 所示4官能性矽烷化合物及/或其部分水解縮合生成物之烴氧基的合計1莫耳而言,以0.5~5莫耳者為佳,較佳為0.6~2莫耳,更佳為0.7~1莫耳。對於水之親水性有機溶劑的莫耳比率,以質量比表示時以0.5~10者為佳,較佳為3~9,更佳為5~8。此時,親水性有機溶劑之量越多越可成為所望之小粒徑二氧化矽微粒子。The amount of water used at this time is 0.5 mol for the total of 1 mol of the tetrafunctional silane compound represented by the above formula (I): Si(OR 3 ) 4 and/or the hydrolyzed condensation product of its partial hydrolysis and condensation product. It is preferably ~5 mol, preferably 0.6 to 2 mol, more preferably 0.7 to 1 mol. The molar ratio of the hydrophilic organic solvent to water is preferably 0.5-10 in terms of mass ratio, preferably 3-9, more preferably 5-8. At this time, the larger the amount of the hydrophilic organic solvent, the more the expected small particle size silica particles.

鹼性物質之量對於上述式(I):Si(OR3 )4 所示4官能性矽烷化合物及/或其部分水解縮合生成物的烴氧基之合計1莫耳而言以0.01~2莫耳者為佳,較佳為0.02~0.5莫耳,更佳為0.04~0.12莫耳。此時,鹼性物質之量越少越可容易成為所望之小粒徑二氧化矽微粒子,若多時容易成為大粒徑二氧化矽微粒子。The amount of the basic substance is 0.01-2 moles for the total of 1 mole of the tetrafunctional silane compound represented by the above formula (I): Si(OR 3 ) 4 and/or the hydrocarbyloxy group of its partial hydrolysis condensation product Ears are preferred, preferably 0.02-0.5 mol, more preferably 0.04-0.12 mol. At this time, the smaller the amount of the alkaline substance, the easier it is to become the desired small particle size silica fine particles, and the larger the amount of the alkaline substance is, the easier it will become the large particle size silica fine particles.

上述式(I):Si(OR3 )4 所示4官能性矽烷化合物等水解及縮合可藉由廣為人知的方法,即藉由於含有鹼性物質之親水性有機溶劑與水的混合物中,添加上述式(I)所示4官能性矽烷化合物等而進行。The above formula (I): Si(OR 3 ) 4 can be hydrolyzed and condensed by a well-known method, that is, by adding the above-mentioned compound to a mixture of a hydrophilic organic solvent and water due to a basic substance. The tetrafunctional silane compound represented by formula (I) and the like are carried out.

在本步驟(A1)所得之親水性二氧化矽微粒子混合溶劑分散液中之二氧化矽微粒子的濃度一般為3~15質量%,較佳為5~10質量%。The concentration of silica particles in the mixed solvent dispersion of hydrophilic silica particles obtained in this step (A1) is generally 3-15% by mass, preferably 5-10% by mass.

-步驟(A2):藉由3官能性矽烷化合物之表面處理步驟- 於在步驟(A1)所得之親水性二氧化矽微粒子混合溶劑分散液中,添加下述式(II)所示3官能性矽烷化合物或其部分水解生成物,或此等混合物,藉此處理親水性二氧化矽微粒子表面,藉此於上述親水性二氧化矽微粒子的表面上導入R1 SiO3/2 單位(但,R1 與下述相同),得到第一表面處理二氧化矽微粒子之混合溶劑分散液。

Figure 02_image035
(但,R1 為取代或非取代的碳原子數1~6之一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基)。-Step (A2): Surface treatment step with a trifunctional silane compound- To the hydrophilic silica microparticle mixed solvent dispersion obtained in step (A1), add the trifunctional represented by the following formula (II) Silane compounds or their partially hydrolyzed products, or these mixtures, to treat the surface of hydrophilic silica particles, thereby introducing R 1 SiO 3/2 units (but R 1 is the same as below) to obtain a mixed solvent dispersion of the first surface-treated silica particles.
Figure 02_image035
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 6 carbon atoms, and R 4 is the same or different kind of monovalent hydrocarbon group having 1 to 6 carbon atoms).

本步驟(A2)對於下個步驟之濃縮步驟(A3)中欲抑制二氧化矽微粒子之凝集時為不可欠缺者。若不能抑制該凝集時,所得之二氧化矽系粉體的各個粒子無法維持一次粒子徑,故作為該結果,在有機EL元件之封止時會引起元件破損或透過率減少等問題而不佳。This step (A2) is indispensable for the next step of the concentration step (A3) to suppress the aggregation of silica fine particles. If the agglomeration cannot be suppressed, each particle of the obtained silica-based powder cannot maintain the primary particle diameter. As a result, it may cause damage to the organic EL device or decrease the transmittance when the organic EL device is sealed. .

上述式(II)中,R1 一般為碳原子數1~20,以碳原子數1~6為佳,較佳為碳原子數1~3,特佳為碳原子數1~2的1價烴基。作為R1 所示1價烴基,例如可舉出甲基、乙基、n-丙基、異丙基、丁基、己基等的烷基等,較佳可舉出甲基、乙基、n-丙基、異丙基,特佳為可舉出甲基、乙基。又,這些1價烴基的氫原子之一部分或全部可由氟原子、氯原子、溴原子等鹵素原子所取代,較佳為可由氟原子所取代。In the above formula (II), R 1 is generally 1 to 20 carbon atoms, preferably 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms, particularly preferably 1 to 2 carbon atoms monovalent Hydrocarbyl. Examples of the monovalent hydrocarbon group represented by R 1 include alkyl groups such as methyl, ethyl, n-propyl, isopropyl, butyl, hexyl, etc., preferably methyl, ethyl, n -Propyl and isopropyl, particularly preferably methyl and ethyl. In addition, part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted with halogen atoms such as fluorine atoms, chlorine atoms, and bromine atoms, and preferably may be substituted with fluorine atoms.

上述式(II)中,R4 一般為碳原子數1~6,以碳原子數1~3為佳,特佳為1~2之1價烴基。作為R4 所示1價烴基,例如可舉出甲基、乙基、丙基、丁基等的烷基等,較佳可舉出甲基、乙基、丙基,特佳為可舉出甲基、乙基。In the above formula (II), R 4 generally has 1 to 6 carbon atoms, preferably 1 to 3 carbon atoms, and particularly preferably 1 to 2 monovalent hydrocarbon groups. Examples of the monovalent hydrocarbon group represented by R 4 include alkyl groups such as methyl, ethyl, propyl, butyl, etc., preferably methyl, ethyl, and propyl, and particularly preferably Methyl, ethyl.

作為上述式(II)所示3官能性矽烷化合物,例如可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷、n-丙基三甲氧基矽烷、n-丙基三乙氧基矽烷、異丙基三甲氧基矽烷、異丙基三乙氧基矽烷、丁基三甲氧基矽烷、丁基三乙氧基矽烷、己基三甲氧基矽烷、三氟丙基三甲氧基矽烷、十七氟癸基三甲氧基矽烷等三烷氧基矽烷等,較佳可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷、乙基三甲氧基矽烷、乙基三乙氧基矽烷,更佳可舉出甲基三甲氧基矽烷、甲基三乙氧基矽烷或此等部分水解縮合生成物。As the trifunctional silane compound represented by the above formula (II), for example, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n- Propyl trimethoxy silane, n-propyl triethoxy silane, isopropyl trimethoxy silane, isopropyl triethoxy silane, butyl trimethoxy silane, butyl triethoxy silane, hexyl Trialkoxysilanes such as trimethoxysilane, trifluoropropyltrimethoxysilane, and heptafluorodecyltrimethoxysilane, etc., preferably methyltrimethoxysilane, methyltriethoxysilane , Ethyl trimethoxy silane, ethyl triethoxy silane, more preferably methyl trimethoxy silane, methyl triethoxy silane or these partial hydrolysis condensation products.

上述式(II)所示3官能性矽烷化合物之添加量對於親水性二氧化矽微粒子之Si原子1莫耳為0.001~1莫耳,較佳為0.01~0.1莫耳,特佳為0.01~0.05莫耳。若該添加量為0.01莫耳以上時,分散性會變良好而較佳。又,若上述添加量為1莫耳以下時,不會產生二氧化矽微粒子之凝集而較佳。The addition amount of the trifunctional silane compound represented by the above formula (II) is 0.001 to 1 mol, preferably 0.01 to 0.1 mol, particularly preferably 0.01 to 0.05 per mol of Si atom of the hydrophilic silica fine particles Mol. If the added amount is 0.01 mol or more, the dispersibility becomes better and better. In addition, if the above-mentioned addition amount is 1 mol or less, agglomeration of silica fine particles does not occur, which is preferable.

對於在本步驟(A2)所得的第一表面處理二氧化矽微粒子之混合溶劑分散液中的該二氧化矽微粒子之濃度,一般為3質量%以上且未達15質量%,較佳為5~10質量%。該濃度若為3質量%以上,可提高生產性而較佳,若未達15質量%時,不會產生二氧化矽微粒子之凝集而較佳。The concentration of the silica particles in the mixed solvent dispersion of the first surface-treated silica particles obtained in this step (A2) is generally 3% by mass or more and less than 15% by mass, preferably 5~ 10% by mass. If the concentration is 3% by mass or more, the productivity can be improved, and if the concentration is less than 15% by mass, agglomeration of silica fine particles is not generated, which is preferable.

-步驟(A3)濃縮步驟- 藉由自在上述步驟(A2)所得之第一表面處理二氧化矽微粒子混合溶劑分散液除去親水性有機溶劑與水的一部分而經濃縮後,可得到經所望濃縮的第一表面處理二氧化矽微粒子之混合溶劑濃縮分散液。此時,預先加入疏水性有機溶劑,或亦可於步驟中加入。對於所使用的疏水性溶劑,以烴系、酮系溶劑為佳。具體可舉出甲苯、二甲苯、甲基乙基酮、甲基異丁基酮等,較佳為甲基異丁基酮。作為除去親水性有機溶劑與水的一部分之方法,例如可舉出餾去、減壓餾去等。所得之濃縮分散液中,二氧化矽微粒子濃度以15~40質量%者為佳,較佳為20~35質量%,更佳為25~30質量%。上述二氧化矽微粒子濃度若為15質量%以上時,可順利進行後步驟之表面處理,若為40質量%以下不會產生二氧化矽微粒子之凝集故較佳。-Step (A3) Concentration Step- By removing a part of the hydrophilic organic solvent and water from the mixed solvent dispersion of the first surface-treated silica particles obtained in the above step (A2) and concentrating, the desired concentrated first surface-treated silica particles can be obtained The mixed solvent concentrates the dispersion. At this time, the hydrophobic organic solvent is added in advance, or it can also be added in the step. As for the hydrophobic solvent used, hydrocarbon-based and ketone-based solvents are preferred. Specific examples include toluene, xylene, methyl ethyl ketone, methyl isobutyl ketone, etc., and methyl isobutyl ketone is preferred. Examples of methods for removing a part of the hydrophilic organic solvent and water include distillation and vacuum distillation. In the obtained concentrated dispersion liquid, the concentration of the silica particles is preferably 15-40% by mass, preferably 20-35% by mass, and more preferably 25-30% by mass. If the concentration of the above-mentioned silica particles is 15% by mass or more, the subsequent surface treatment can be smoothly performed. If the concentration is 40% by mass or less, agglomeration of the silica particles will not occur, which is preferable.

本步驟(A3)為可抑制以下不良狀況時不可或缺的步驟,該不良狀況為下個步驟(A4)中,作為表面處理劑所使用的式(III)所示矽氮烷化合物及式(IV)所示一官能性矽烷化合物與醇或水進行反應而使得表面處理變的不充分,其後進行乾燥時產生凝集而無法使所得之二氧化矽粉體維持一次粒子徑者。This step (A3) is an indispensable step to suppress the following problems, which are the silazane compound represented by formula (III) and formula (() used as a surface treatment agent in the next step (A4) IV) The monofunctional silane compound reacts with alcohol or water to make the surface treatment insufficient, and agglomeration occurs during subsequent drying, and the obtained silica powder cannot maintain the primary particle diameter.

-步驟(A4):藉由1官能性矽烷化合物之表面處理步驟- 在步驟(A3)所得之第一表面處理二氧化矽微粒子的混合溶劑濃縮分散液中添加下述式(III)所示矽氮烷化合物,或下述式(IV)所示1官能性矽烷化合物或此等混合物,藉由使上述第一表面處理二氧化矽微粒子表面進一步進行表面處理,於上述第一表面處理二氧化矽微粒子的表面導入R2 3 SiO1/2 單位(但,R2 與下述相同),而得到第二表面處理二氧化矽微粒子。在該步驟中,使藉由上述處理於第一表面處理二氧化矽微粒子的表面上所殘存的矽烷醇基進行三有機矽基化的形式將R2 3 SiO1/2 單位導入於該表面中。

Figure 02_image037
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基)
Figure 02_image039
(但,R2 與上述相同。X為OH基或水解性基)-Step (A4): Surface treatment step by monofunctional silane compound-Add the silicon represented by the following formula (III) to the mixed solvent concentrated dispersion of the first surface-treated silica particles obtained in Step (A3) A azane compound, or a monofunctional silane compound represented by the following formula (IV), or a mixture of these, by subjecting the surface of the first surface-treated silica fine particles to further surface treatment, and then the first surface-treated silica R 2 3 SiO 1/2 units are introduced into the surface of the fine particles (however, R 2 is the same as described below) to obtain second surface-treated silica fine particles. In this step, the silanol groups remaining on the surface of the first surface-treated silicon dioxide microparticles by the above-mentioned treatment are triorganosilylated, and R 2 3 SiO 1/2 units are introduced into the surface .
Figure 02_image037
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms)
Figure 02_image039
(However, R 2 is the same as above. X is an OH group or a hydrolyzable group)

上述式(III)及(IV)中,R2 為碳原子數1~6,較佳為碳原子數1~4,特佳為碳原子數1~2的1價烴基。作為R2 所示1價烴基,例如可舉出甲基、乙基、丙基、異丙基、丁基等烷基等,較佳可舉出甲基、乙基、丙基,特佳為可舉出甲基、乙基。又,這些1價烴基之氫原子的一部分或全部可由氟原子、氯原子、溴原子等鹵素原子所取代,較佳為可由氟原子所取代。In the above formulas (III) and (IV), R 2 is a carbon number of 1 to 6, preferably a carbon number of 1 to 4, and particularly preferably a carbon number of 1 to 2 monovalent hydrocarbon group. Examples of the monovalent hydrocarbon group represented by R 2 include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, etc., preferably methyl, ethyl, and propyl, and particularly preferably Examples include methyl and ethyl. In addition, a part or all of the hydrogen atoms of these monovalent hydrocarbon groups may be substituted by halogen atoms such as fluorine atoms, chlorine atoms, and bromine atoms, and preferably may be substituted by fluorine atoms.

作為上述式(IV)中之X所示水解性基,例如可舉出氯原子、烷氧基、胺基、醯氧基等,較佳可舉出烷氧基、胺基,特佳為烷氧基。The hydrolyzable group represented by X in the above formula (IV) includes, for example, a chlorine atom, an alkoxy group, an amino group, an acyloxy group, etc., preferably an alkoxy group, an amino group, and particularly preferably an alkyl group. Oxy.

作為上述式(III)所示矽氮烷化合物,例如可舉出六甲基二矽氮烷、六乙基二矽氮烷等,較佳可舉出六甲基二矽氮烷。Examples of the silazane compound represented by the above formula (III) include hexamethyldisilazane, hexaethyldisilazane, and the like, and preferably hexamethyldisilazane.

作為上述式(IV)所示1官能性矽烷化合物,例如可舉出三甲基矽烷醇、三乙基矽烷醇等單矽烷醇化合物、三甲基氯矽烷、三乙基氯矽烷等單氯矽烷、三甲基甲氧基矽烷、三甲基乙氧基矽烷等單烷氧基矽烷、三甲基矽基二甲基胺、三甲基矽基二乙基胺等單胺基矽烷、三甲基乙醯氧基矽烷等單醯氧矽烷,較佳可舉出三甲基矽烷醇、三甲基甲氧基矽烷、三甲基矽基二乙基胺,特佳為、三甲基矽烷醇、三甲基甲氧基矽烷。Examples of monofunctional silane compounds represented by the above formula (IV) include monosilanol compounds such as trimethylsilanol and triethylsilanol, and monochlorosilanes such as trimethylchlorosilane and triethylchlorosilane. , Trimethylmethoxysilane, trimethylethoxysilane and other monoalkoxysilanes, trimethylsilyldimethylamine, trimethylsilyldiethylamine and other monoaminosilanes, trimethyl Monooxysilanes such as ethoxysilane, preferably trimethylsilanol, trimethylmethoxysilane, trimethylsilyldiethylamine, particularly preferably trimethylsilanol , Trimethylmethoxysilane.

對於上述矽氮烷化合物、1官能性矽烷化合物之使用量,對於親水性二氧化矽微粒子的Si原子1莫耳而言以0.1~0.5莫耳為佳,較佳為0.2~0.4莫耳,特佳為0.25~0.35莫耳。該使用量若為0.1莫耳以上,可使分散性變的良好故較佳。又,上述使用量若為0.5莫耳以下,經濟上為有利故較佳。The usage amount of the above-mentioned silazane compound and monofunctional silane compound is preferably 0.1-0.5 mol, preferably 0.2-0.4 mol, for 1 mol of Si atom of the hydrophilic silica fine particles. Preferably, it is 0.25 to 0.35 mol. If the usage amount is 0.1 mol or more, the dispersibility can be improved, so it is preferred. Moreover, if the above-mentioned usage amount is 0.5 mol or less, it is economically advantageous, so it is preferable.

對於所得之表面處理吸濕性二氧化矽微粒子,因乾燥後容易吸濕,故於矽氧樹脂進行添加混合時進行脫水處理者為佳。具體為,設置有將表面處理吸濕性二氧化矽微粒子在100~150℃之溫度,於常壓或減壓下使其乾燥的脫水處理步驟者為較佳。藉由該處理使表面處理吸濕性二氧化矽微粒子乾燥時,較佳為可使含有水分量調整為0.5~2.0質量%(表面處理吸濕性二氧化矽微粒子質量)。For the obtained surface-treated hygroscopic silica fine particles, since they are easy to absorb moisture after drying, it is better to perform dehydration treatment when the silicone resin is added and mixed. Specifically, it is preferable to provide a dehydration treatment step of drying surface-treated hygroscopic silica fine particles at a temperature of 100 to 150° C. under normal pressure or reduced pressure. When the surface-treated hygroscopic silica fine particles are dried by this treatment, it is preferable to adjust the moisture content to 0.5 to 2.0% by mass (the mass of the surface-treated hygroscopic silica fine particles).

本發明之表面處理吸濕性二氧化矽微粒子的折射率為1.39~1.42之範圍內。該折射率若在上述範圍以外時,因與上述矽氧樹脂之折射率差會變大而有損於所得之硬化物的透明性。The refractive index of the surface-treated hygroscopic silica fine particles of the present invention is in the range of 1.39 to 1.42. If the refractive index is out of the above range, the difference in refractive index with the silicone resin will increase and the transparency of the cured product obtained will be impaired.

本發明之表面處理吸濕性二氧化矽微粒子的1次粒子之體積基準的粒度分布中之中間徑以0.01~0.5μm者為佳。若在如此範圍時,藉由微粒子之凝集的矽氧樹脂組成物之透明性降低、元件的損傷或短路產生可受到抑制。The median diameter of the primary particle size distribution based on the volume of the surface-treated hygroscopic silica microparticles of the present invention is preferably 0.01 to 0.5 μm. If it is in this range, the transparency of the silicone resin composition due to the aggregation of fine particles is reduced, and damage to the device or generation of short circuits can be suppressed.

本發明之表面處理吸濕性二氧化矽微粒子之添加量必須為對於矽氧樹脂組成物全體而言為1~70質量%之範圍,以10~70質量%的範圍者為佳。該添加量若超過70質量%時,因粒子凝集或黏度增加等會造成處理上的困難,或變的難以進行脫泡,或因含有氣泡而產生透過率之降低。又,對於有機EL面板,因凝集體與元件接觸,可能會產生元件損傷或短路,而無法得到穩定發光。The added amount of the surface-treated hygroscopic silica fine particles of the present invention must be in the range of 1 to 70% by mass, preferably in the range of 10 to 70% by mass, for the entire silicone resin composition. If the added amount exceeds 70% by mass, it may cause difficulties in handling due to particle aggregation or increase in viscosity, or it may become difficult to defoam, or the permeability may decrease due to the inclusion of air bubbles. In addition, for an organic EL panel, since the agglomerate contacts the device, damage to the device or short circuit may occur, and stable light emission may not be obtained.

又,對於上述表面處理吸濕性二氧化矽微粒子之添加量,其為上述吸濕性矽氧樹脂組成物的吸濕容量(可吸收水分的量)成為1.0×10-7 g/mm3 以上的添加量,較佳為1.0×10-6 g/mm3 以上。該樹脂組成物的吸濕容量若未達1.0×10-7 g/mm3 時,無法得到充分的吸濕性,使用於有機EL面板時的耐久性會劣化。In addition, with regard to the added amount of the surface-treated hygroscopic silica fine particles, the hygroscopic capacity (amount capable of absorbing water) of the hygroscopic silicone resin composition is 1.0×10 -7 g/mm 3 or more The addition amount of is preferably 1.0×10 -6 g/mm 3 or more. If the moisture absorption capacity of the resin composition is less than 1.0×10 -7 g/mm 3 , sufficient moisture absorption cannot be obtained, and the durability when used in an organic EL panel may be deteriorated.

對於本發明之吸濕性矽氧樹脂組成物,作為上述矽氧樹脂與上述表面處理吸濕性二氧化矽微粒子之混合方法,雖無特別限定,例如可舉出下述惰性氣體中之混合方法。 即,對於所準備的上述矽氧樹脂及上述表面處理吸濕性二氧化矽微粒子,在減低水分量的惰性氣體中保管者為佳。作為惰性氣體,以N2 氣或Ar氣為,水分量以1ppm以下者為佳。 於上述惰性氣體中,將上述矽氧樹脂及上述表面處理吸濕性二氧化矽微粒子藉由電子天秤等進行指定量的計量並混合。經混合後,視必要使用利用離心力的轉動裝置等而使其脫泡。若氣泡不容易除去時,可進行真空脫泡等為佳。Regarding the hygroscopic silicone resin composition of the present invention, the mixing method of the silicone resin and the surface-treated hygroscopic silica fine particles is not particularly limited. For example, the following mixing method in an inert gas can be mentioned . That is, it is better to store the prepared silicone resin and the surface-treated hygroscopic silica fine particles in an inert gas with reduced moisture content. As the inert gas, N 2 gas or Ar gas is preferable, and the moisture content is 1 ppm or less. In the above-mentioned inert gas, the above-mentioned silicone resin and the above-mentioned surface-treated hygroscopic silica fine particles are measured and mixed by an electronic balance or the like. After mixing, if necessary, use a rotating device using centrifugal force to defoam. If bubbles are not easy to remove, vacuum degassing can be performed.

有機EL用透明密封材料 本發明之吸濕性矽氧樹脂組成物因容易得到透明且薄膜之硬化物,故適合作為有機EL用之透明密封材料使用。具體為使用對於厚度25μm之硬化物片材,以依據JIS K 7361-1:1997的方法進行測定的全光線透過率成為90%以上者為佳。上述硬化物片材的全光線透過率若未達90%時,若利用於具有頂部發光(top emission)結構的有機EL面板時會有變成不利之情況產生。Transparent sealing material for organic EL The hygroscopic silicone resin composition of the present invention is suitable for use as a transparent sealing material for organic EL because it is easy to obtain a transparent and thin film cured product. Specifically, it is preferable to use a cured product sheet having a thickness of 25 μm, and the total light transmittance measured by a method based on JIS K 7361-1:1997 is preferably 90% or more. If the total light transmittance of the cured product sheet is less than 90%, it may become disadvantageous if it is used in an organic EL panel having a top emission structure.

又,本發明之有機EL用透明密封材料的吸濕容量必須為1.0×10-7 g/mm3 以上者,以3.0×10-7 g/mm3 以上者為佳。若將吸濕容量未達1.0×10-7 g/mm3 者作為有機EL用的密封材料使用時,因流入於有機EL面板的水分之吸濕性為差,故成為有機EL之耐久性低者。In addition, the moisture absorption capacity of the transparent sealing material for organic EL of the present invention must be 1.0×10 -7 g/mm 3 or more, preferably 3.0×10 -7 g/mm 3 or more. If the moisture absorption capacity of less than 1.0×10 -7 g/mm 3 is used as a sealing material for organic EL, the moisture absorption of the water flowing into the organic EL panel is poor, so the durability of the organic EL is low By.

有機EL用透明密封材料之塗布方法 上述吸濕性矽氧樹脂組成物於有機EL元件上可作為透明密封材料而進行塗布。塗布方法可使用分裝法、注射法、絲網印刷法等常法。將上述有機EL用透明密封材料塗布於有機EL元件上時的膜厚並無特別限定,但使用具有可撓性結構之有機EL面板時,以1~300μm的範圍者為佳。 又,配合製造薄型面板時等狀況,亦可將上述吸濕性矽氧樹脂組成物直接塗布於有機EL元件上,或亦可藉由有機EL元件上的SiO、SiN膜而使用。Coating method of transparent sealing material for organic EL The above-mentioned hygroscopic silicone resin composition can be applied as a transparent sealing material on an organic EL element. The coating method can use common methods such as sub-packing method, injection method, and screen printing method. The film thickness when the transparent sealing material for organic EL is applied to the organic EL element is not particularly limited, but when an organic EL panel having a flexible structure is used, it is preferably in the range of 1 to 300 μm. In addition, in accordance with conditions such as the production of thin panels, the above-mentioned hygroscopic silicone resin composition may be directly coated on the organic EL device, or it may be used by the SiO or SiN film on the organic EL device.

對於有機EL用的透明密封材料之硬化方法進行說明時,作為上述吸濕性矽氧樹脂組成物的硬化觸媒,使用藉由照射波長200~500nm的光而活化的鉑觸媒,使用藉由將經紫外線照射的吸濕性矽氧樹脂組成物在所定環境下靜置而使其硬化的方法為佳。 作為紫外線照射方法,使用作為紫外光源之波長365nm的UV-LED燈、金屬鹵素燈等,照射適量紫外線的方法等可舉出,以使用波長200~500nm為佳,較佳為使用200~350nm的光。由硬化速度與變色防止的兩觀點來看,照射時的溫度以20~80℃者為佳,照射強度以30~2,000mW/cm2 者為較佳、照射線量以150~10,000mJ/cm2 者為佳。對於將經紫外線照射的組成物靜置並使其硬化時的條件並無特別限定,但以在20~60℃進行1分鐘~1天的硬化者為佳。When explaining the curing method of the transparent sealing material for organic EL, as the curing catalyst of the hygroscopic silicone resin composition, a platinum catalyst activated by irradiating light with a wavelength of 200 to 500 nm is used. The method of hardening the hygroscopic silicone resin composition irradiated with ultraviolet rays by standing in a predetermined environment is preferable. As the ultraviolet irradiation method, a UV-LED lamp with a wavelength of 365nm, a metal halide lamp, etc., is used as an ultraviolet light source. The method of irradiating an appropriate amount of ultraviolet rays can be exemplified. The wavelength is preferably 200-500nm, preferably 200-350nm. Light. From the perspectives of curing speed and discoloration prevention, the temperature during irradiation is preferably 20 to 80°C, the irradiation intensity is preferably 30 to 2,000 mW/cm 2 and the amount of irradiation is 150 to 10,000 mJ/cm 2 The one is better. There are no particular restrictions on the conditions when the composition irradiated with ultraviolet rays is allowed to stand and harden, but it is preferably hardened at 20 to 60°C for 1 minute to 1 day.

有機EL用透明密封材料之填充方法 上述吸濕性矽氧樹脂組成物在於有機EL面板內作為密封材料進行填充時為有用。適用本發明之吸濕性矽氧樹脂組成物的有機EL面板,作為該一例為,具有合併形成層合陽極、有機層、陰極的結構之有機EL元件的玻璃基板,與相對方向的挖掘型之玻璃,或者平板上的玻璃等之中空封止結構者為佳。 若要對於貼合形成有機EL元件的玻璃基板,與相對方向的挖掘型之玻璃的例子進行說明,將上述吸濕性矽氧樹脂組成物填充於內側的挖掘玻璃,藉由在真空中貼合上下面基板之設備,一邊使層合有機EL元件的玻璃基板,與上述填充吸濕性矽氧樹脂組成物的挖掘玻璃成為相對方向,一邊進行貼合。此時,於挖掘玻璃的端部,可將紫外線硬化型環氧樹脂藉由分配器等進行塗布,有機EL元件與上述吸濕性矽氧樹脂組成物成為直接接觸有機EL元件之狀態,成為周圍以環氧樹脂進行密封的填充結構體。且,對於上述吸濕性矽氧樹脂組成物,於填充前預先照射紫外線者為佳。藉由紫外線的照射條件,於紫外線照射後一定時間保持液體狀態,可於硬化後徐徐進行。 其次,一邊維持該填充結構,一邊對端部環氧樹脂部照射紫外線,完成端部密封。上述吸濕性矽氧樹脂組成物則徐徐進行硬化而使其完全固化。如此完成於面板內部填充上述吸濕性矽氧樹脂的有機EL面板。Filling method of transparent sealing material for organic EL The above-mentioned hygroscopic silicone resin composition is useful when filling the organic EL panel as a sealing material. The organic EL panel to which the hygroscopic silicone resin composition of the present invention is applied is, as an example, a glass substrate having an organic EL element in a structure that combines an anode, an organic layer, and a cathode to form a laminated anode, an organic layer, and a cathode. Hollow sealing structures such as glass or glass on a flat plate are preferred. In order to describe an example of the glass substrate of the organic EL element that is bonded to the digging glass in the opposite direction, the above-mentioned hygroscopic silicone resin composition is filled with the digging glass on the inner side, and the digging glass is laminated in a vacuum. The equipment for the upper and lower substrates is to align the glass substrate on which the organic EL element is laminated and the excavation glass filled with the hygroscopic silicone resin composition in opposing directions. At this time, at the end of the excavation glass, UV-curable epoxy resin can be applied with a dispenser or the like, and the organic EL element and the hygroscopic silicone resin composition will be in direct contact with the organic EL element and become the surrounding Filled structure sealed with epoxy resin. Furthermore, for the above-mentioned hygroscopic silicone resin composition, it is better to irradiate ultraviolet rays before filling. Under the conditions of ultraviolet irradiation, the liquid state is maintained for a certain period of time after ultraviolet irradiation, and it can be carried out slowly after curing. Next, while maintaining the filling structure, ultraviolet rays are irradiated to the end epoxy resin portion to complete the end seal. The above-mentioned hygroscopic silicone resin composition gradually hardens to be completely cured. In this way, the organic EL panel filled with the hygroscopic silicone resin inside the panel is completed.

有機EL用透明乾燥劑 本發明之吸濕性矽氧樹脂組成物的硬化物為即在於有機EL用面板內,未接觸有機EL元件之情況下,可作為使用於除濕侵入於有機EL內的水蒸氣的有機EL用透明乾燥劑使用。Transparent desiccant for organic EL The cured product of the hygroscopic silicone resin composition of the present invention is in the organic EL panel and can be used as a transparent organic EL device for dehumidifying water vapor entering the organic EL without contacting the organic EL element. Desiccant is used.

有機EL用透明乾燥劑之製造方法 作為有機EL用透明乾燥劑之成形方法,可配合作為目的之成形品的形狀或尺寸而適宜地選擇公知的成形方法。例如可例示出注入成形、壓縮成形、射出成形、壓延成型、押出成形、塗布、絲網印刷等成形方法。作為硬化條件,可為在所採用的成形方法之公知條件,一般為60~450℃,較佳為在80~400℃,更佳為在120~200℃的溫度條件下數秒~1天程度的成形時間。又,以減低殘存於硬化物中的低分子矽氧烷成分等目的下為在150~250℃,較佳為在200~240℃的烤箱內等1小時以上,較佳為1~70小時程度,更佳為亦可進行1~10小時程度之固化(Post cure)(2次加硫)。Manufacturing method of transparent desiccant for organic EL As a molding method of the transparent desiccant for organic EL, a known molding method can be appropriately selected according to the shape or size of the intended molded product. For example, molding methods such as injection molding, compression molding, injection molding, calender molding, extrusion molding, coating, and screen printing can be exemplified. The curing conditions may be well-known conditions of the molding method used, generally 60 to 450°C, preferably 80 to 400°C, more preferably 120 to 200°C for a few seconds to 1 day. Forming time. In addition, for the purpose of reducing the low-molecular-weight silicone components remaining in the cured product, the temperature is 150 to 250°C, preferably 200 to 240°C, for 1 hour or more, preferably 1 to 70 hours. , More preferably, it can also be cured for 1-10 hours (Post cure) (2 times of vulcanization).

又,上述吸濕性矽氧樹脂組成物可藉由分裝法、注射法等塗布方法以外,亦可藉由絲網印刷、壓延成型法、注射法、按下法等常法使其片材化後使用。此時,使上述吸濕性矽氧樹脂組成物片材化的矽氧橡膠片材以成形為1.0μm~2mm之厚度者為佳,較佳為1.0μm~1mm。若為如此範圍,不會使有機EL裝置的總厚度增大,而得到本發明之所望效果。In addition, the above-mentioned hygroscopic silicone resin composition can be made into a sheet by ordinary methods such as screen printing, calendering, injection, and pressing, in addition to coating methods such as sub-packaging and injection. Use after conversion. At this time, the silicone rubber sheet formed by sheeting the hygroscopic silicone resin composition is preferably formed to a thickness of 1.0 μm to 2 mm, preferably 1.0 μm to 1 mm. If it is in this range, the total thickness of the organic EL device will not increase, and the desired effect of the present invention will be obtained.

有機EL用透明乾燥劑之使用方法 上述有機EL用透明乾燥劑特別使用於有機EL用面板內者為有用。使用本發明之透明乾燥劑的有機EL用面板為,於玻璃等基板上形成層合陽極、有機層、陰極之結構的有機EL元件,具有合併相對方向的挖掘型之玻璃等的中空封止結構。又,作為使用本發明之透明乾燥劑的例子,於折入上述挖掘型玻璃的內部,藉由使所定量的上述有機聚矽氧烷組成物藉由滴入或分裝或噴墨等進行塗布而使該組成物硬化下,貼合上述挖掘型玻璃而對於所製作的有機EL用面板,可僅於有機EL元件的上方載置本發明之透明乾燥劑,又使該乾燥劑成為未與有機EL元件接觸的狀態。即對於上述有機EL用透明乾燥劑之使用方法,其並非為對於有機EL面板內在無隙間下進行填充的方法,其為欲將預先形成的透明乾燥劑,在非接觸有機EL元件下使用而步驟為容易。又,上述透明乾燥劑之使用方法為,即使透明乾燥劑於有機EL元件為非接觸,該乾燥劑中之低分子矽氧烷會於有機EL面板內擴散・堆積,使存在於有機EL元件之形成時的微小顆粒附近呈絕緣,陰極與陽極藉著顆粒而得到可抑制短路的所謂短路現象(Short phenomenon)之效果。 [實施例]How to use transparent desiccant for organic EL The above-mentioned transparent desiccant for organic EL is particularly useful when used in an organic EL panel. The organic EL panel using the transparent desiccant of the present invention is an organic EL element in which an anode, an organic layer, and a cathode are laminated on a substrate such as glass, and has a hollow sealing structure that incorporates digging glass in opposite directions. . In addition, as an example of using the transparent desiccant of the present invention, the inside of the excavation glass is folded into, and a predetermined amount of the organopolysiloxane composition is applied by dripping or dispensing or inkjet, etc. When the composition is hardened, the above-mentioned excavation glass is laminated to produce an organic EL panel, and the transparent desiccant of the present invention can be placed only on the organic EL element, and the desiccant becomes non-organic The state of EL element contact. That is, the method of using the above-mentioned transparent desiccant for organic EL is not a method of filling the organic EL panel with no gaps. It is a step to use the pre-formed transparent desiccant under non-contact organic EL elements. For easy. In addition, the method of using the above-mentioned transparent desiccant is that even if the transparent desiccant is in non-contact with the organic EL device, the low-molecular-weight siloxane in the desiccant will diffuse and accumulate in the organic EL panel, making it exist in the organic EL device. The vicinity of the fine particles at the time of formation is insulated, and the cathode and the anode have the effect of suppressing the so-called short-circuit phenomenon (Short phenomenon) through the particles. [Example]

以下表示實施例及比較例,具備說明本發明,但本發明並非限定於下述實施例者。且,對於配合量之單位,份表示質量份。又,Me表示甲基,Ph表示苯基,Vi表示乙烯基。折射率係以數位折射儀(Atago公司RX-9000α)進行測定。重量平均分子量為藉由GPC(凝膠滲透色譜儀)分析所得之聚苯乙烯換算的重量平均分子量。Examples and comparative examples are shown below to illustrate the present invention, but the present invention is not limited to the following examples. And, as for the unit of the compounding amount, part means part by mass. In addition, Me represents a methyl group, Ph represents a phenyl group, and Vi represents a vinyl group. The refractive index was measured with a digital refractometer (RX-9000α from Atago). The weight average molecular weight is the weight average molecular weight converted from polystyrene obtained by GPC (gel permeation chromatography) analysis.

[矽氧樹脂之調製(調製例1~3)] [調製例1] 作為(A)成分為使兩末端以Me2 ViSiO1/2 單位進行封閉的二甲基聚矽氧烷(重量平均分子量5,000),作為(B)成分為下述平均式(2)所示有機氫聚矽氧烷(重量平均分子量4,000),調製出對於(A)成分的矽原子所鍵結的乙烯基每單位質量中之莫耳數X(mol/g),(B)成分的矽原子所鍵結的每單位質量中之氫原子莫耳數(mol/g)成為1.2。

Figure 02_image041
[Preparation of silicone resin (Preparation examples 1 to 3)] [Preparation example 1] As component (A) is dimethyl polysiloxane (weight average molecular weight) whose ends are blocked with Me 2 ViSiO 1/2 units 5,000), as the component (B), the organohydrogen polysiloxane represented by the following average formula (2) (weight average molecular weight 4,000), prepared per unit mass of the vinyl group bonded to the silicon atom of component (A) The mole number X (mol/g), the mole number of hydrogen atoms per unit mass (mol/g) bonded by silicon atoms of component (B) becomes 1.2.
Figure 02_image041

又,作為(C)成分,對於(A)成分與(B)成分的合計使用0.4質量%的雙(乙醯二酮酸根)鉑(II)之乙酸2-(2-丁氧基乙氧基)乙酯溶液(鉑單體為1質量%),將這些(A)~(C)成分以行星式混合機(井上製作所PLMG-350)進行10分鐘混練後,得到折射率1.402之液狀矽氧樹脂。In addition, as the component (C), 0.4% by mass of bis(acetedionate)platinum (II) acetic acid 2-(2-butoxyethoxy) was used for the total of the components (A) and (B). ) Ethyl ester solution (Platinum monomer is 1% by mass), and these components (A) to (C) are mixed with a planetary mixer (PLMG-350 Inoue) for 10 minutes to obtain liquid silicon with a refractive index of 1.402 Oxy resin.

[調製例2] 作為(A)成分使用具有下述式(3)所示平均結構的有機聚矽氧烷以外,與調製例1同樣程序下得到折射率1.441之矽氧樹脂。

Figure 02_image043
[Preparation Example 2] Except for using organopolysiloxane having an average structure represented by the following formula (3) as the component (A), a silicone resin with a refractive index of 1.441 was obtained under the same procedure as in Preparation Example 1.
Figure 02_image043

[調製例3] 作為(A)成分使用具以下述式(4)所示平均結構之有機聚矽氧烷以外,與調製例1同樣程序下得到折射率1.425之矽氧樹脂。

Figure 02_image045
[Preparation Example 3] Except for using organopolysiloxane having an average structure represented by the following formula (4) as the component (A), a silicone resin with a refractive index of 1.425 was obtained under the same procedure as in Preparation Example 1.
Figure 02_image045

[表面處理吸濕性二氧化矽微粒子之合成(合成例1~5及比較合成例1~3)] [合成例1] ・步驟(A1):「親水性二氧化矽微粒子之合成步驟」 於具備攪拌機、滴液漏斗與溫度計之3公升的玻璃製反應器,混合加入甲醇989.5g、水135.5g與28質量%氨水66.5g。將該溶液調整為35℃,一邊攪拌一邊將四甲氧基矽烷436.5g(2.87莫耳)經6小時滴入。該滴入終了後,亦進一步繼續進行0.5小時攪拌,藉由進行水解而得到親水性二氧化矽微粒子之懸浮液。[Synthesis of surface-treated hygroscopic silica microparticles (Synthesis Examples 1 to 5 and Comparative Synthesis Examples 1 to 3)] [Synthesis Example 1] ・Step (A1): "Synthesis Step of Hydrophilic Silica Microparticles" In a 3 liter glass reactor equipped with a stirrer, a dropping funnel, and a thermometer, 989.5 g of methanol, 135.5 g of water, and 66.5 g of 28% by mass ammonia were mixed and added. The solution was adjusted to 35°C, and 436.5 g (2.87 mol) of tetramethoxysilane was dropped over 6 hours while stirring. After the completion of the dropping, stirring was continued for another 0.5 hour to obtain a suspension of hydrophilic silica microparticles through hydrolysis.

・步驟(A2):「藉由3官能性矽烷化合物之表面處理步驟」 於在上述步驟(A1)所得之懸浮液中,經0.5小時在25℃下滴入甲基三甲氧基矽烷4.4g(0.03莫耳),滴入後亦繼續攪拌12小時,藉由處理二氧化矽微粒子表面,得到第一表面處理二氧化矽微粒子分散液。・Step (A2): "Surface treatment step with trifunctional silane compound" In the suspension obtained in the above step (A1), 4.4 g (0.03 mol) of methyl trimethoxysilane was added dropwise at 25°C over 0.5 hours, and the stirring was continued for 12 hours after the drop, by treating the dioxide On the surface of the silicon particles, a first surface-treated silica particle dispersion liquid is obtained.

・步驟(A3):「濃縮步驟」 其次,於玻璃製反應器上安裝酯適配器(Ester adapter)與冷卻管,將在前步驟所得之分散液於60~70℃進行加熱而餾出甲醇與水之混合物1,021g,得到第一表面處理二氧化矽微粒子之混合溶劑濃縮分散液。此時,濃縮分散液中之二氧化矽微粒子含有量為28質量%。・Step (A3): "Enrichment Step" Next, install an ester adapter and a cooling tube on the glass reactor, heat the dispersion obtained in the previous step at 60 to 70°C to distill out 1,021 g of a mixture of methanol and water, and obtain the first surface treatment A mixed solvent concentrate dispersion of silica particles. At this time, the content of silica fine particles in the concentrated dispersion was 28% by mass.

・步驟(A4):「藉由1官能性矽烷化合物的表面處理步驟」 於在前步驟所得的濃縮分散液,在25℃添加六甲基二矽氮烷138.4g(0.86莫耳)後,將該分散液加熱至50~60℃,藉由使其進行9小時反應,使分散液中之二氧化矽微粒子進行三甲基矽基化。其次,將該分散液中之溶劑在130℃,減壓下(6,650Pa)餾去後,得到第二表面處理二氧化矽微粒子[1]186g。・Step (A4): "Surface treatment step with monofunctional silane compound" After adding 138.4 g (0.86 mol) of hexamethyldisilazane to the concentrated dispersion obtained in the previous step at 25°C, the dispersion was heated to 50-60°C and reacted for 9 hours. The silica particles in the dispersion are trimethylsilylized. Next, the solvent in the dispersion was distilled off at 130°C under reduced pressure (6,650 Pa) to obtain 186 g of second surface-treated silica microparticles [1].

[合成例2] 對於合成例1,在步驟(A1)將甲醇、水、及28質量%氨水之量取代為甲醇1,045.7g、水112.6g、28質量%氨水33.2g以外,其他同樣地得到表面處理二氧化矽微粒子[2]188g。[Synthesis Example 2] For Synthesis Example 1, in step (A1), the amount of methanol, water, and 28% by mass ammonia was replaced with 1,045.7 g of methanol, 112.6 g of water, and 33.2 g of 28% by mass ammonia. The others were similarly surface-treated silica particles. [2]188g.

[合成例3] ・步驟(A1):「親水性二氧化矽微粒子之合成步驟」 於具備攪拌機、滴液漏斗、溫度計之3公升的玻璃製反應器中,混合添加甲醇623.7g、水41.4g、28質量%氨水49.8g。將該溶液調整為35℃,一邊攪拌一邊同時地開始添加四甲氧基矽烷1,163.7g及5.4質量%氨水418.1g,前者經6小時,而後者經4小時進行滴入。四甲氧基矽烷滴入後亦繼續進行0.5小時攪拌而進行水解,得到親水性二氧化矽微粒子之懸浮液。[Synthesis Example 3] ・Step (A1): "Synthesis Step of Hydrophilic Silica Microparticles" In a 3 liter glass reactor equipped with a stirrer, a dropping funnel, and a thermometer, 623.7 g of methanol, 41.4 g of water, and 49.8 g of 28% by mass ammonia were mixed and added. The solution was adjusted to 35°C, and the addition of 1,163.7 g of tetramethoxysilane and 418.1 g of 5.4% by mass ammonia water was started simultaneously while stirring. The former was dropped over 6 hours and the latter was dropped over 4 hours. After the tetramethoxysilane was dropped, stirring was continued for 0.5 hours for hydrolysis to obtain a suspension of hydrophilic silica particles.

・步驟(A2):藉由3官能性矽烷化合物之表面處理步驟」 於在上述步驟(A1)所得之懸浮液中,在25℃經0.5小時滴入甲基三甲氧基矽烷11.6g(對於四甲氧基矽烷的以莫耳比計算之0.01相當量),滴入後亦再進行12小時攪拌,得到第一表面處理二氧化矽微粒子。・Step (A2): Surface treatment step with trifunctional silane compound" Into the suspension obtained in the above step (A1), 11.6g of methyltrimethoxysilane (the equivalent of 0.01 in molar ratio for tetramethoxysilane) was dropped into the suspension at 25°C over 0.5 hours, and then dropped Then, stirring was performed for another 12 hours to obtain first surface-treated silica particles.

・步驟(A3):「濃縮步驟」 其次,於玻璃製反應器安裝酯適配器與冷卻管,於在前步驟所得之分散液中添加甲基異丁基酮1,440g後,於80~110℃進行加熱,經7小時餾出甲醇與水之混合物,得到第一表面處理二氧化矽微粒子之混合溶劑濃縮分散液。・Step (A3): "Enrichment Step" Next, install an ester adapter and a cooling tube in a glass reactor, add 1,440g of methyl isobutyl ketone to the dispersion obtained in the previous step, then heat it at 80-110°C, and distill out methanol and water over 7 hours A mixed solvent concentrated dispersion liquid of the first surface-treated silica particles is obtained.

・步驟(A4):「藉由1官能性矽烷化合物之表面處理步驟」 於在前步驟所得之濃縮分散液中,在25℃添加六甲基二矽氮烷357.6g,加熱至120℃進行3小時反應,使二氧化矽微粒子進行三甲基矽基化。將此後的溶劑在減壓下進行餾去而得到第二表面處理二氧化矽微粒子[3]472g。・Step (A4): "Surface treatment step by monofunctional silane compound" To the concentrated dispersion obtained in the previous step, add 357.6 g of hexamethyldisilazane at 25°C, and heat to 120°C for 3 hours to react to trimethylsilylize the silica particles. The solvent after this was distilled off under reduced pressure to obtain 472 g of second surface-treated silica fine particles [3].

[合成例4] 對於步驟(A1),將四甲氧基矽烷的水解溫度設定在27℃以外,進行與合成例3的同樣操作,得到表面處理二氧化矽微粒子[4]469g。[Synthesis Example 4] Regarding the step (A1), the hydrolysis temperature of tetramethoxysilane was set to other than 27°C, and the same operation as in Synthesis Example 3 was performed to obtain 469 g of surface-treated silica fine particles [4].

[合成例5] 對於步驟(A1),將四甲氧基矽烷的水解溫度設定在20℃以外,進行與合成例3的同樣操作,得到表面處理二氧化矽微粒子[5]461g。[Synthesis Example 5] Regarding the step (A1), the hydrolysis temperature of tetramethoxysilane was set to other than 20°C, and the same operation as in Synthesis Example 3 was performed to obtain 461 g of surface-treated silica fine particles [5].

[比較合成例1] 於預備攪拌機與溫度計之0.3公升的玻璃製反應器中,放入爆燃法二氧化矽(商品名:SO-C1,Admatex公司製)100g,將純水1g在攪拌下添加,密閉後再於60℃下攪拌10小時。其次,冷卻至25℃後,將六甲基二矽氮烷2g在攪拌下添加,密閉後再攪拌24小時。升溫至120℃,一邊使氮氣通過,一邊除去殘存原料及所生成的氨,得到表面處理二氧化矽微粒子[6]100g。[Comparative Synthesis Example 1] Put 100g of deflagration silicon dioxide (trade name: SO-C1, manufactured by Admatex) into a 0.3-liter glass reactor with a pre-mixer and a thermometer, add 1g of pure water under stirring, and then add 60 Stir at °C for 10 hours. Next, after cooling to 25°C, 2 g of hexamethyldisilazane was added under stirring, and the mixture was sealed and stirred for another 24 hours. The temperature was raised to 120°C, and while passing nitrogen gas, the remaining raw materials and generated ammonia were removed to obtain 100 g of surface-treated silica fine particles [6].

[比較合成例2] 於具備攪拌機與溫度計之0.3公升的玻璃製反應器中,加入爆燃法二氧化矽(商品名:SO-C1,Admatex公司製)100g,將純水1g在攪拌下添加,密閉後再於60℃下攪拌10小時。其次,冷卻至25℃後,將甲基三甲氧基矽烷1g在攪拌下添加,密閉後再攪拌24小時。其次,將六甲基二矽氮烷2g在攪拌下添加,密閉後再攪拌24小時。升溫至120℃,一邊使氮氣通過,一邊除去殘存原料及所生成的氨,得到表面處理二氧化矽微粒子[7]101g。[Comparative Synthesis Example 2] In a 0.3-liter glass reactor equipped with a stirrer and a thermometer, 100 g of deflagration silicon dioxide (trade name: SO-C1, manufactured by Admatex) was added, and 1 g of pure water was added under stirring, and then sealed at 60°C. Stir for 10 hours. Next, after cooling to 25°C, 1 g of methyltrimethoxysilane was added with stirring, and the mixture was sealed and stirred for another 24 hours. Next, 2 g of hexamethyldisilazane was added under stirring, and the mixture was sealed and stirred for another 24 hours. The temperature was raised to 120°C, and while passing nitrogen gas, the remaining raw materials and generated ammonia were removed to obtain 101 g of surface-treated silica fine particles [7].

[比較合成例3] 對於步驟(A4),未添加六甲基二矽氮烷,將該分散液中之溶劑在130℃且減壓下(6,650Pa)餾去以外,進行與合成例1之同樣操作,得到表面處理二氧化矽微粒子[8]179g。[Comparative Synthesis Example 3] For step (A4), hexamethyldisilazane was not added, and the solvent in the dispersion was distilled off at 130°C under reduced pressure (6,650Pa), and the same operation as in Synthesis Example 1 was performed to obtain a surface treatment Silica particles [8]179g.

對於在合成例1~5及比較合成例1~3所得之表面處理二氧化矽微粒子(表面處理二氧化矽微粒子[1]~[8]),依據下述方法進行測定。該結果如表1所示。The surface-treated silica particles (surface-treated silica particles [1] to [8]) obtained in Synthesis Examples 1 to 5 and Comparative Synthesis Examples 1 to 3 were measured according to the following method. The results are shown in Table 1.

[粒子徑] 於甲醇添加表面處理二氧化矽微粒子至0.5質量%,藉由經10分鐘超音波,使該微粒子分散,藉由動態光散射法/激光多普勒法納米徑粒度分布測定裝置(日機裝(股)製,商品名:UPA-EX150)測定粒度分布,將該體積基準之粒度分布中的中間徑(50%累積徑)作為粒子徑。[Particle diameter] Add surface-treated silicon dioxide fine particles to 0.5% by mass in methanol, and disperse the fine particles by ultrasonic waves for 10 minutes, and use the dynamic light scattering method/laser Doppler method nanometer size distribution measuring device (Nikkiso ( (Stock) system, trade name: UPA-EX150) The particle size distribution was measured, and the median diameter (50% cumulative diameter) in the volume-based particle size distribution was used as the particle diameter.

[折射率] 於甲苯(折射率1.4962)與甲基異丁基酮(折射率1.3958)的混合溶劑20g中添加表面處理二氧化矽微粒子1g而使其分散。藉由上述溶劑之配合比率調整折射率,將分散液之可見光透過率到達最高時的混合溶劑之折射率值作為表面處理二氧化矽微粒子之折射率。且,混合溶劑的折射率為藉由數位折射儀(Atago公司RX-9000α)所測定的在25℃中之值,分散液之可見光透過率為使用分光光度計((股)Hitachi High-Tech Science Company U-3900H)所測定的在25℃中之波長380~780nm的光透過率之平均值。[Refractive Index] To 20 g of a mixed solvent of toluene (refractive index 1.4962) and methyl isobutyl ketone (refractive index 1.3958), 1 g of surface-treated silica fine particles was added and dispersed. The refractive index is adjusted by the mixing ratio of the above-mentioned solvents, and the refractive index of the mixed solvent when the visible light transmittance of the dispersion reaches the highest is used as the refractive index of the surface-treated silica particles. In addition, the refractive index of the mixed solvent is a value measured at 25°C by a digital refractometer (Atago RX-9000α), and the visible light transmittance of the dispersion liquid is measured by a spectrophotometer ((stock) Hitachi High-Tech Science Company U-3900H) The average value of the light transmittance at a wavelength of 380 to 780 nm measured at 25°C.

[水分含有率] 於鋁容器中,精秤取10mg的在合成例1~5及比較合成例1~3所得之表面處理二氧化矽微粒子(表面處理二氧化矽微粒子[1]~[8]),將此以差動型差示熱天秤(理學電機(股)製型式:TG8120)進行測定,將在25~200℃中之重量減少率作為水分含有率。 將上述表面處理二氧化矽微粒子在大氣壓下,30℃且80RH%之條件下,各測定出經3天曝光時的吸濕時水分含有率(a),與在100℃且100Pa之減壓條件的經2天乾燥時的乾燥時水分含有率(b),藉由兩者之差[(a)-(b)(wt%pt)]評估吸濕性。且,對於本發明之表面處理二氧化矽微粒子,(a)-(b)以4.0wt%pt以上者為佳。[Water content rate] In an aluminum container, finely weigh 10 mg of the surface-treated silica particles (surface-treated silica particles [1] to [8]) obtained in Synthesis Examples 1 to 5 and Comparative Synthesis Examples 1 to 3, and use them as Differential differential thermal balance (Rigaku Electric Co., Ltd. model: TG8120) is used for measurement, and the weight loss rate at 25 to 200°C is used as the moisture content rate. The above-mentioned surface-treated silica fine particles were measured under the conditions of 30°C and 80RH% under atmospheric pressure, and the moisture content (a) during moisture absorption after 3 days of exposure was measured, and the reduced pressure conditions at 100°C and 100Pa The moisture content (b) during drying after 2 days of drying is used to evaluate the hygroscopicity by the difference between the two [(a)-(b)(wt%pt)]. Moreover, for the surface-treated silica fine particles of the present invention, (a)-(b) are preferably 4.0wt%pt or more.

Figure 02_image047
Figure 02_image047

[矽氧樹脂組成物之製造方法] 將在上述各合成例所得之表面處理二氧化矽微粒子,預先在100℃且100Pa之減壓條件下進行2小時脫水,封入密閉容器後,靜置於以水分量被控制在1ppm以下的N2 氣進行取代的箱內。 又,將在上述調製例所得之矽氧樹脂,靜置於以水分量控制在1ppm以下的N2 氣所取代的箱內2小時後,添加上述表面處理二氧化矽微粒子,在轉動攪拌裝置中,使該表面處理二氧化矽微粒子進行30分鐘轉動分散。其後,進行減壓脫泡處理,得到矽氧樹脂組成物。且,上述表面處理二氧化矽微粒子之添加量為使用電子天秤的指定量秤量。[Manufacturing method of silicone resin composition] The surface-treated silica particles obtained in each of the above synthesis examples were dehydrated in advance under a reduced pressure of 100°C and 100 Pa for 2 hours, sealed in a closed container, and left to stand still. The moisture content is controlled below 1ppm in the tank where N 2 gas is substituted. In addition, the silicone resin obtained in the above preparation example was placed in a box replaced with N 2 gas whose moisture content was controlled below 1 ppm for 2 hours, and then the surface-treated silica particles were added and placed in a rotating stirring device. , The surface-treated silica particles are rotated and dispersed for 30 minutes. Thereafter, a vacuum degassing treatment was performed to obtain a silicone resin composition. In addition, the added amount of the above-mentioned surface-treated silica particles is a designated amount using an electronic balance.

[實施例1~5、比較例1~3] 依據上述矽氧樹脂組成物的製造方法準備以下矽氧樹脂組成物,該矽氧樹脂組成物為於在調製例1所得之矽氧樹脂(折射率1.402)中,添加對各組成物全體而言為「1.0質量%」、「10.0質量%」、「50.0質量%」及「70.0質量%」之各質量%的在上述合成例1~5及比較合成例1~3所得之表面處理二氧化矽微粒子(表面處理二氧化矽微粒子[1]~[8])。 其此,在於端部形成壩之聚碳酸酯平板上塗布矽氧樹脂組成物,經抹平後,使用金屬鹵素燈(ORC製HANDY UV-100),以紫外線強度10mW/cm2 照射積分照射量4,000mJ/cm2 而使其硬化。此時,調整成尺寸為38mm×38mm,且厚度為25μm之塗液量。其後,藉由聚碳酸酯平板進行剝離後得到含有表面處理二氧化矽微粒子之矽氧樹脂片材。[Examples 1 to 5, Comparative Examples 1 to 3] The following silicone resin composition was prepared according to the above-mentioned manufacturing method of the silicone resin composition. The silicone resin composition was based on the silicone resin (refracting) obtained in Preparation Example 1. Rate 1.402), the addition of each mass% of "1.0% by mass", "10.0% by mass", "50.0% by mass", and "70.0% by mass" to the entire composition is in the above Synthesis Examples 1 to 5 and Compare the surface-treated silica particles obtained in Synthesis Examples 1 to 3 (surface-treated silica particles [1] to [8]). In addition, the silicone resin composition is coated on a polycarbonate plate with a dam formed at the end, and after smoothing, a metal halide lamp (HANDY UV-100 manufactured by ORC) is used to irradiate the integrated radiation amount with an ultraviolet intensity of 10mW/cm 2 4,000mJ/cm 2 to harden it. At this time, it was adjusted to a size of 38mm×38mm and a thickness of 25μm. After that, the polycarbonate plate was peeled off to obtain a silicone resin sheet containing surface-treated silica particles.

[全光線透過率] 對於所得之矽氧樹脂片材,以透過率測定裝置(日本分光(股)製V-780)測定全光線透過率。全光線透過率為90%以上時評估為「〇」,將85%以上評估為「△」,經未達85%評估為「×」。其結果如表2所示。[Total light transmittance] For the obtained silicone resin sheet, the total light transmittance was measured with a transmittance measuring device (V-780 manufactured by JASCO Corporation). If the total light transmittance is 90% or more, it is evaluated as "〇", 85% or more is evaluated as "△", and if it is less than 85%, it is evaluated as "×". The results are shown in Table 2.

[吸濕容量] 對於所得之矽氧樹脂片材,使用恆溫槽在40℃,90%的條件下測定暴露3天前後之重量,將所得之重量增加量除以片材體積(38mm×38mm×0.025mm)算出吸濕容量(g/mm3 )。其結果如表2所示。[Moisture absorption capacity] For the obtained silicone resin sheet, the weight before and after exposure for 3 days at 40°C and 90% is measured in a constant temperature bath, and the weight gain obtained is divided by the sheet volume (38mm×38mm× 0.025mm) Calculate the moisture absorption capacity (g/mm 3 ). The results are shown in Table 2.

Figure 02_image049
Figure 02_image049

如實施例1~5所示,對於在調製例1所得之矽氧樹脂(折射率1.402),添加折射率為1.396之表面處理二氧化矽微粒子[1]~[5]時,二氧化矽微粒子之添加量在對於全體量而言到達70.0質量%為止的範圍下,全光線透過率皆超過90%。因矽氧樹脂與二氧化矽微粒子之折射率差為小,故於表面處理二氧化矽微粒子界面中之光反射為少,被認為顯示高透過率。 另一方面,如比較例1、2所示,表面處理二氧化矽微粒子[6]及[7]中雖在添加量為1.0質量%時,全光線透過率可顯示85%以上,但在10.0質量%以上時則得到全光線透過率未達85%之結果。此為表面處理二氧化矽微粒子之折射率為1.462,此表示產生藉由與矽氧樹脂之折射率差而產生透過率之損失。 又,如比較例3所示,表面處理二氧化矽微粒子[8]的折射率雖為1.396,而因二氧化矽微粒子的表面處理為不充分,故混合於矽氧樹脂時,產生二氧化矽微粒子之凝集,即使添加量為1.0質量%亦得到損失透過率之結果。故可知二氧化矽微粒子之表面處理對於欲得到難以產生凝集之效果上為重要。As shown in Examples 1 to 5, for the silicone resin (refractive index 1.402) obtained in Preparation Example 1, when surface-treated silica particles with a refractive index of 1.396 are added [1] to [5], the silica particles The total light transmittance exceeds 90% in the range up to 70.0% by mass for the total amount. Since the refractive index difference between the silicone resin and the silica particles is small, the light reflection at the interface of the surface-treated silica particles is low, and it is considered to show high transmittance. On the other hand, as shown in Comparative Examples 1 and 2, the surface-treated silica fine particles [6] and [7] can show a total light transmittance of 85% or more when the addition amount is 1.0% by mass, but it is 10.0 When the mass% is above, the total light transmittance is less than 85%. This is that the refractive index of the surface-treated silica particles is 1.462, which means that the transmittance loss is caused by the difference in refractive index with the silicone resin. Also, as shown in Comparative Example 3, although the refractive index of the surface-treated silica particles [8] is 1.396, the surface treatment of the silica particles is insufficient, so when mixed with silicone resin, silica is generated. Agglomeration of fine particles results in loss of transmittance even if the addition amount is 1.0% by mass. Therefore, it can be seen that the surface treatment of the silica particles is important for obtaining the effect of preventing aggregation.

[比較例4~8] 對於實施例1~5,對將表面處理二氧化矽微粒子之添加量設定為對於各組成物全體設定為90.0質量%之矽氧樹脂組成物,以與上述之同樣程序下做成矽氧樹脂片材,進行吸濕容量及全光線透過率之評估。其結果如表3所示。[Comparative Examples 4-8] For Examples 1 to 5, the addition amount of the surface-treated silica fine particles was set to 90.0% by mass for the total composition of each composition, and the silicone resin sheet was prepared under the same procedure as above. Materials, the moisture absorption capacity and total light transmittance are evaluated. The results are shown in Table 3.

Figure 02_image051
Figure 02_image051

如比較例4~8所示,二氧化矽微粒子的添加量為90.0質量%時,全光線透過率保持在超過85%。添加量若超過90.0質量%時,於矽氧樹脂添加疏水性二氧化矽微粒子時,流動性受損且容易存在凝集粒子,除不能得到良好分散性以外,脫泡亦變困難,得到透過率小損失之結果。因此,藉由上述表之結果,可得知欲得到極良好透過率,添加量之上限為70.0質量%。As shown in Comparative Examples 4 to 8, when the addition amount of silica fine particles is 90.0% by mass, the total light transmittance is maintained at more than 85%. If the addition amount exceeds 90.0% by mass, when hydrophobic silica particles are added to the silicone resin, the fluidity is impaired and aggregated particles are likely to be present. In addition to the failure to obtain good dispersibility, defoaming is also difficult, resulting in low transmittance. The result of the loss. Therefore, from the results of the above table, it can be known that in order to obtain an extremely good transmittance, the upper limit of the addition amount is 70.0% by mass.

[比較例9~14] 其次,對於依據上述矽氧樹脂組成物之製造方法,於在調製例2所得之矽氧樹脂(折射率1.441),及在調製例3所得之矽氧樹脂(折射率1.425)中,將在上述合成例1,3及比較合成例1所得之表面處理二氧化矽微粒子(表面處理二氧化矽微粒子[1]、[3]及[6]),以對於各組成物全體而言為「1.0質量%」、「10.0質量%」、「50.0質量%」及「70.0質量%」之各質量%進行添加的矽氧樹脂組成物,以與上述同樣之程序做成矽氧樹脂片材,進行吸濕容量及全光線透過率之評估。其結果如表4所示。[Comparative Examples 9-14] Next, with regard to the manufacturing method of the silicone resin composition described above, the silicone resin (refractive index 1.441) obtained in Preparation Example 2 and the silicone resin (refractive index 1.425) obtained in Preparation Example 3 will be The surface-treated silica particles obtained in Synthesis Examples 1, 3 and Comparative Synthesis Example 1 (surface-treated silica particles [1], [3], and [6]) are set to "1.0 mass for the entire composition %", "10.0% by mass", "50.0% by mass", and "70.0% by mass". The silicone resin composition is added with each mass%, and the silicone resin sheet is made into a silicone resin sheet by the same procedure as above to absorb moisture Evaluation of capacity and total light transmittance. The results are shown in Table 4.

Figure 02_image053
Figure 02_image053

如比較例9~11所示,對於在調製例2所得之矽氧樹脂(折射率1.441)及在調製例3所得之矽氧樹脂(折射率1.425),添加折射率為1.396之表面處理二氧化矽微粒子[1]、[3]及折射率為1.462之表面處理二氧化矽微粒子[6]時,藉由與矽氧樹脂之折射率差,得到全光線透過率未達85%之結果。As shown in Comparative Examples 9-11, for the silicone resin (refractive index: 1.441) obtained in Preparation Example 2 and the silicone resin (refractive index: 1.425) obtained in Preparation Example 3, surface treatment dioxide with a refractive index of 1.396 was added When silicon particles [1], [3] and surface-treated silicon dioxide particles [6] with a refractive index of 1.462, the difference in refractive index with the silicone resin results in a total light transmittance of less than 85%.

[有機EL元件之製造方法] 參照圖1(i)~(iv),使用本發明之有機EL用透明密封材料說明有機EL元件之製造方法。該製造方法為,於厚度1mm、尺寸50mm×50mm的無鹼玻璃(101)上,層合陽極電極(102),電洞注入層(103),電洞輸送層(104),發光層(105),電子輸送層(106),電子注入層(107)及陰極電極(108)而形成有機EL元件積層玻璃體(109)者(圖1(i)參照)。[Manufacturing method of organic EL element] 1 (i) ~ (iv), using the transparent sealing material for organic EL of the present invention to illustrate the manufacturing method of organic EL devices. The manufacturing method includes laminating an anode electrode (102), a hole injection layer (103), a hole transport layer (104), and a light emitting layer (105) on an alkali-free glass (101) with a thickness of 1mm and a size of 50mm×50mm. ), an electron transport layer (106), an electron injection layer (107) and a cathode electrode (108) to form an organic EL element laminated glass body (109) (refer to FIG. 1(i)).

其次,於將水分量控制在1ppm以下的N2 氣進行取代之箱內,於另外準備的如圖1(ii)所示的厚度1mm、尺寸42mm×42mm的凹型挖掘形狀之無鹼封止型玻璃(110)的挖掘端部2mm寬的部分上,將紫外線硬化型環氧樹脂(112)藉由分配器進行塗布。且將該挖掘形狀玻璃之挖掘部的深度設定在25μm。Next, in a box where the moisture content is controlled below 1ppm by replacing N 2 gas, a non-alkali seal type with a concave excavation shape with a thickness of 1mm and a size of 42mm×42mm as shown in Figure 1(ii) is prepared separately On the 2mm wide part of the excavated end of the glass (110), an ultraviolet-curing epoxy resin (112) is applied with a dispenser. And the depth of the excavated part of the excavated glass is set to 25 μm.

其次,在相同箱內,作為透明密封材料準備上述矽氧樹脂組成物於玻璃容器內,以金屬鹵素燈(ORC製HANDY UV-100),以紫外線強度10mW/cm2 照射紫外線成至成為積分照射量2,000mJ/cm2 。其次,將紫外線照射後之上述透明密封材料(111)填充於上述挖掘內部、尺寸38mm×38mm之部分(圖1(iii)所示狀態)。Next, in the same box, prepare the above-mentioned silicone resin composition as a transparent sealing material in a glass container, and irradiate ultraviolet rays with a metal halide lamp (ORC HANDY UV-100) at an ultraviolet intensity of 10mW/cm 2 until it becomes integral irradiation The amount is 2,000mJ/cm 2 . Next, the transparent sealing material (111) irradiated with ultraviolet rays is filled in the portion of the excavation with a size of 38mm×38mm (the state shown in Fig. 1(iii)).

其次,如圖1(iv)所示,在同箱內將上述有機EL元件積層玻璃體(109),於硬化上述透明密封材料(111)之前,貼合於有機層在玻璃內部之排列方向。其後,使用金屬鹵素燈(ORC製HANDY UV-100),以紫外線強度10mW/cm2 照射紫外線至成為積分照射量10,000mJ/cm2 ,接著環氧樹脂後,在25℃靜置3小時,使透明密封材料硬化,得到如圖2所示之有機EL面板(113)。Next, as shown in FIG. 1(iv), the organic EL element laminated glass body (109) in the same box is attached to the arrangement direction of the organic layer in the glass before the transparent sealing material (111) is cured. Then, using a metal halide lamp (HANDY UV-100 manufactured by ORC), irradiate ultraviolet rays with an ultraviolet intensity of 10mW/cm 2 to an integrated irradiation dose of 10,000mJ/cm 2 , and then after epoxy resin, let it stand at 25°C for 3 hours. The transparent sealing material is cured to obtain an organic EL panel (113) as shown in FIG. 2.

[實施例6~8、比較例15、16] 使用於在調製例1所得之矽氧樹脂(折射率1.402)混合對於各組成物全體而言為「1.0質量%」、「50.0質量%」、「70.0質量%」及「90.0質量%」之各質量%的在合成例1所得之表面處理二氧化矽微粒子[1](折射率1.396,粒子徑52nm)之矽氧樹脂組成物,以上述「有機EL元件之製造方法」欄所示程序做成有機EL面板,對於下述耐久性及短路不良發生之有無進行評估。其結果如表5所示。且,對於吸濕容量藉由與上述實施例1及比較例4之同樣方法算出。又,於比較例16所示之有機EL面板為,非以矽氧樹脂組成物進行密封者,玻璃面板之內部以乾燥N2 氣進行填充的狀態之有機EL面板。[Examples 6-8, Comparative Examples 15, 16] The silicone resin (refractive index 1.402) used in preparation example 1 was mixed with "1.0% by mass" and "50.0% by mass" for the entire composition. "70.0% by mass" and "90.0% by mass" of the surface-treated silica fine particles [1] (refractive index 1.396, particle diameter 52nm) of the silicone resin composition obtained in Synthesis Example 1, according to the above " The organic EL panel was made by the procedure shown in the "Method of Manufacturing Organic EL Device" column, and the following durability and short-circuit defects were evaluated. The results are shown in Table 5. In addition, the moisture absorption capacity was calculated by the same method as in Example 1 and Comparative Example 4 described above. In addition, the organic EL panel shown in Comparative Example 16 is an organic EL panel in which the inside of the glass panel is filled with dry N 2 gas instead of being sealed with a silicone resin composition.

[耐久性] 將所得之有機EL面板,使用高溫高濕試驗槽,曝曬於60℃且90%RH之環境下,經200小時後,在25℃且大氣下取出,以10mA/cm2 之電流密度使其發光驅動,使用光學顯微鏡(Nikon製LV150N),進行暗點之尺寸及個數之觀察。將直徑5μm以上的暗點作為對象,該暗點於發光總面積之佔有比例未達全體之3%時評估為「A:特優」,3%以上且未達5%時評估為「B:優」,5%以上時評估為「C:劣。」之耐久性。[Durability] The obtained organic EL panel is exposed to a 60℃ and 90%RH environment using a high temperature and high humidity test tank. After 200 hours, it is taken out at 25℃ in the atmosphere with a current of 10mA/cm 2 The density was driven to emit light, and an optical microscope (LV150N manufactured by Nikon) was used to observe the size and number of dark spots. A dark spot with a diameter of 5μm or more is used as the target. If the dark spot occupies less than 3% of the total light-emitting area, it is evaluated as "A: Excellent", and if it is 3% or more and less than 5%, it is evaluated as "B: Excellent", when 5% or more is evaluated as "C: Bad." Durability.

[產生短路不良之有無] 將上述有機EL面板,使用高溫高濕試驗槽,曝曬於60℃且90%RH之環境下1,000小時,在25℃之大氣下取出後,確認有機EL面板之短路產生的有無。短路產生之有無為,確認在10mA/cm2 以上的電流輸入的發光有無,未見到發光時,確認於陰極上的短路痕之有無,若有短路痕時,藉由以雷射分離上述短路痕近傍之元件,使發光重現時,該試樣定義為短路不良產生試樣。且對於各5個試樣,將產生短路不良之試樣以個數表示[短路不良產生試樣數/5]。[Presence of short-circuit failure] Put the above organic EL panel in a high-temperature and high-humidity test tank and expose it to a 60°C and 90%RH environment for 1,000 hours. After taking it out in an atmosphere of 25°C, confirm that the organic EL panel is short-circuited. The presence or absence. Whether there is a short circuit, confirm whether there is light emission at a current input of 10mA/cm 2 or more. If no light is seen, confirm whether there is a short circuit on the cathode. If there is a short circuit, separate the above short circuit by laser When the element near the trace reproduces the luminescence, the sample is defined as a sample that produces short-circuit failure. And for each of 5 samples, the number of samples with short-circuit failure is represented by the number [number of samples with short-circuit failure/5].

Figure 02_image055
Figure 02_image055

如表5所示,對於實施例6,在有機EL面板之耐久性試驗中,暗點的產生在800小時以後可見到評估「B」,大概可得到良好結果。二氧化矽微粒子之添加量為1.0質量%,該面板之吸濕量為4.0×10-7 g/mm3 。若二氧化矽微粒子之添加量變多時,吸濕量亦變多,如實施例7、實施例8所示,有機EL面板之耐久性亦提高。又,在實施例6~8,亦沒有檢測出短路產生,得到良好結果。然而,如比較例15所示,二氧化矽微粒子的添加量為90.0質量%時,見到短路的產生。此被考慮為因凝集粒子造成的有機EL元件之接觸,而使小傷損失作為原因。 又,對於以比較例16所示乾燥氮進行填充的有機EL面板,對於相同耐久性試驗,在200小時評估為「B」,在600小時以下則評估為「C」。此為表示因不具有吸收流入有機EL面板內之水分的能力而產生發光損失。As shown in Table 5, for Example 6, in the durability test of the organic EL panel, the generation of dark spots can be seen after 800 hours, and evaluation "B" can be seen, and good results may be obtained. The added amount of silica particles is 1.0% by mass, and the moisture absorption of the panel is 4.0×10 -7 g/mm 3 . When the added amount of silica fine particles increases, the moisture absorption also increases. As shown in Examples 7 and 8, the durability of the organic EL panel is also improved. Also, in Examples 6 to 8, no short circuit was detected, and good results were obtained. However, as shown in Comparative Example 15, when the addition amount of silicon dioxide fine particles was 90.0% by mass, the occurrence of short circuits was seen. This is considered to be due to the contact of the organic EL element caused by the aggregated particles, and the small damage loss is the cause. In addition, the organic EL panel filled with dry nitrogen shown in Comparative Example 16 was evaluated as "B" at 200 hours and as "C" at 600 hours or less for the same durability test. This means that the luminescence loss is caused due to the inability to absorb moisture flowing into the organic EL panel.

[實施例9~14] 對於在調製例1所得之矽氧樹脂(折射率1.402),使用將在合成例4所得之表面處理二氧化矽微粒子[4](折射率1.396,粒子徑171nm),及在合成例5所得之表面處理二氧化矽微粒子[5](折射率1.396.粒子徑482nm),對於各組成物全體,以「1.0質量%」、「50.0質量%」及「70.0質量%」之各質量%下進行混合的矽氧樹脂組成物,藉由在上述「有機EL元件之製造方法」欄所示的程序做成有機EL面板,與上述同樣地,對於耐久性及短路不良產生的有無進行評估。其結果如表6所示。[Examples 9-14] For the silicone resin (refractive index 1.402) obtained in Preparation Example 1, the surface-treated silica fine particles [4] (refractive index 1.396, particle diameter 171nm) obtained in Synthesis Example 4 were used, and those obtained in Synthesis Example 5 Surface-treated silica fine particles [5] (refractive index 1.396, particle diameter 482nm), for the entire composition, mixed at each mass% of "1.0 mass%", "50.0 mass%" and "70.0 mass%" The silicone resin composition of, was made into an organic EL panel by the procedure shown in the "Method of Manufacturing Organic EL Device" above, and the durability and short-circuit defects were evaluated in the same way as above. The results are shown in Table 6.

Figure 02_image057
Figure 02_image057

如表6所示,對於實施例9~11、實施例12~14,得到與各上述實施例6~8之同樣結果。As shown in Table 6, with respect to Examples 9 to 11 and Examples 12 to 14, the same results as in the above Examples 6 to 8 were obtained.

[比較例17~22] 於在調製例1所得之矽氧樹脂(折射率1.402),使用將在比較合成例1所得之表面處理二氧化矽微粒子[6](折射率1.462,粒子徑300nm)及在比較合成例2所得之表面處理二氧化矽微粒子[7](折射率1.462,粒子徑300nm),對於各組成物全體,以「1.0質量%」、「50.0質量%」及「70.0質量%」之各質量%進行混合的矽氧樹脂組成物,以在上述「有機EL元件之製造方法」欄所示程序做成有機EL面板,與上述同樣地,對於耐久性及短路不良產生的有無進行評估。該結果如表7所示。[Comparative Examples 17-22] For the silicone resin (refractive index 1.402) obtained in Preparation Example 1, the surface-treated silica fine particles [6] (refractive index 1.462, particle diameter 300nm) obtained in Comparative Synthesis Example 1 and obtained in Comparative Synthesis Example 2 were used Surface-treated silica fine particles [7] (refractive index 1.462, particle diameter 300nm), for the entire composition, the mass% of "1.0 mass%", "50.0 mass%" and "70.0 mass%" are mixed The silicone resin composition of was made into an organic EL panel according to the procedure shown in the "Method of Manufacturing Organic EL Device" column above, and the durability and short-circuit defects were evaluated in the same way as above. The results are shown in Table 7.

Figure 02_image059
Figure 02_image059

如表7所示,比較例17~22之有機EL面板的初期發光雖良好,但有著顯著耐久性劣化的結果。此如表1所示,因所使用的表面處理二氧化矽微粒子[6]、[7]之吸濕性缺乏,故考慮為無法吸濕流入有機EL面板之水分。此時的密封材料之吸濕容量如比較例19、比較例22所示,各為2.4×10-8 g/mm3 、2.2×10-8 g/mm3 ,與實施例6所示4.0×107 g/mm3 做比較為小於一位數的值。As shown in Table 7, although the initial light emission of the organic EL panels of Comparative Examples 17-22 was good, there was a significant deterioration in durability. As shown in Table 1, due to the lack of hygroscopicity of the surface-treated silica particles [6], [7] used, it is considered that the moisture flowing into the organic EL panel cannot be absorbed. The moisture absorption capacity of the sealing material at this time is as shown in Comparative Example 19 and Comparative Example 22, respectively 2.4×10 -8 g/mm 3 , 2.2×10 -8 g/mm 3 , and 4.0× as shown in Example 6. 10 7 g/mm 3 is compared to a value less than one digit.

101:無鹼玻璃 102:陽極電極 103:電洞注入層 104:電洞輸送層 105:發光層 106:電子輸送層 107:電子注入層 108:陰極電極 109:有機EL元件積層玻璃基板 110:無鹼挖掘玻璃 111:透明密封材料 112:紫外線硬化型環氧樹脂 113:有機EL面板 114:有機EL面板(無滴入有機聚矽氧烷組成物者)101: alkali-free glass 102: anode electrode 103: hole injection layer 104: Electric hole transport layer 105: luminescent layer 106: electron transport layer 107: Electron injection layer 108: Cathode electrode 109: Organic EL element laminated glass substrate 110: Alkali-free mining glass 111: Transparent sealing material 112: UV-curing epoxy resin 113: Organic EL panel 114: Organic EL panel (without dripping organopolysiloxane composition)

[圖1]表示欲說明適用本發明之一實施態樣的有機EL用透明密封材料於有機EL面板的方法之概略圖。 [圖2]表示藉由圖1之方法所得的有機EL面板之概略圖。 [圖3]表示對於面板內未使用有機EL用透明密封材料而製造的有機EL面板之概略圖。[Fig. 1] A schematic diagram to explain a method of applying a transparent sealing material for organic EL in an embodiment of the present invention to an organic EL panel. [Fig. 2] A schematic diagram showing the organic EL panel obtained by the method of Fig. 1. [Fig. 3] A schematic diagram showing an organic EL panel manufactured without using a transparent sealing material for organic EL in the panel.

Claims (10)

一種吸濕性矽氧樹脂組成物,其為含有矽氧樹脂,及於表面的至少一部分具有鍵結有機矽化合物或其縮合物而成的被覆部之表面處理吸濕性二氧化矽微粒子,且吸濕容量為1.0×10-7 g/mm3 以上之吸濕性矽氧樹脂組成物,其特徵為上述矽氧樹脂的折射率及上述二氧化矽微粒子的折射率皆為1.39~1.42,上述二氧化矽微粒子對於上述矽氧樹脂組成物全體的含有量為1~70質量%,上述有機矽化合物為下述式(II)所示3官能性矽烷化合物及下述式(III)所示矽氮烷化合物或下述式(IV)所示1官能性矽烷化合物者;
Figure 03_image001
(但,R1 為取代或非取代的碳原子數1~6之一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基);
Figure 03_image003
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基);
Figure 03_image005
(但,R2 與上述相同;X為OH基或水解性基)。
A hygroscopic silicone resin composition containing silicone resin, and at least a part of the surface has surface-treated hygroscopic silicon dioxide particles with a coating formed by bonding an organosilicon compound or its condensate, and The hygroscopic silicone resin composition with a moisture absorption capacity of 1.0×10 -7 g/mm 3 or more is characterized in that the refractive index of the silicone resin and the refractive index of the silica particles are both 1.39 to 1.42. The content of the silicon dioxide microparticles in the entire silicone resin composition is 1 to 70% by mass, and the organosilicon compound is a trifunctional silane compound represented by the following formula (II) and silicon represented by the following formula (III) A nitrogen compound or a monofunctional silane compound represented by the following formula (IV);
Figure 03_image001
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms, and R 4 is the same or different monovalent hydrocarbon group with 1 to 6 carbon atoms);
Figure 03_image003
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms);
Figure 03_image005
(However, R 2 is the same as above; X is an OH group or a hydrolyzable group).
如請求項1之吸濕性矽氧樹脂組成物,其中上述二氧化矽微粒子為溶膠凝膠二氧化矽微粒子。Such as the hygroscopic silicone resin composition of claim 1, wherein the silica particles are sol-gel silica particles. 如請求項1或2之吸濕性矽氧樹脂組成物,其中上述表面處理吸濕性二氧化矽微粒子在體積基準粒度分布中之中間徑為0.01~0.5μm。The hygroscopic silicone resin composition of claim 1 or 2, wherein the surface-treated hygroscopic silica fine particles have an intermediate diameter in the volume-based particle size distribution of 0.01 to 0.5 μm. 如請求項1或2之吸濕性矽氧樹脂組成物,其中上述矽氧樹脂含有下述(A)~(C)成分; (A)於1分子中具有至少2個烯基之直鏈狀有機聚矽氧烷、 (B)於1分子中具有至少2個鍵結於矽原子的氫原子之有機氫聚矽氧烷:含有量為對於(A)成分中之鍵結於矽原子的烯基1莫耳而言,相當於(B)成分中之鍵結於矽原子的氫原子1.0~2.0莫耳之量、 (C)矽氫化觸媒。The hygroscopic silicone resin composition of claim 1 or 2, wherein the silicone resin contains the following components (A) to (C); (A) Linear organopolysiloxane having at least 2 alkenyl groups in one molecule, (B) Organohydrogen polysiloxane having at least 2 hydrogen atoms bonded to silicon atoms in a molecule: The content is for 1 mole of alkenyl groups bonded to silicon atoms in component (A) , Equivalent to 1.0~2.0 moles of hydrogen atoms bonded to silicon atoms in component (B), (C) Hydrosilation catalyst. 一種吸濕性矽氧樹脂組成物之製造方法,其為製造上述請求項1~4中任1項之吸濕性矽氧樹脂組成物的方法,其特徵為上述表面處理吸濕性二氧化矽微粒子藉由下述步驟(A1)~(A4)而製造者; 步驟(A1):藉由將下述式(I)所示4官能性矽烷化合物或其部分水解生成物,或此等混合物,在鹼性物質之存在下,在親水性有機溶劑與水之混合液中進行水解、縮合,得到含有SiO2 單位之親水性球狀二氧化矽微粒子的混合溶劑分散液之步驟;
Figure 03_image007
(但,R3 為相同或相異種的碳原子數1~6之一價烴基); 步驟(A2):藉由於上述親水性球狀二氧化矽微粒子之混合溶劑分散液中,添加下述式(II)所示3官能性矽烷化合物或其部分水解生成物,或此等混合物,處理上述親水性球狀二氧化矽微粒子之表面,而於上述親水性球狀二氧化矽微粒子之表面上導入R1 SiO3/2 單位(但,R1 與下述相同),得到第一表面處理球狀二氧化矽微粒子之混合溶劑分散液的步驟;
Figure 03_image009
(但,R1 為取代或非取代的碳原子數1~6之一價烴基,R4 為相同或相異種的碳原子數1~6之一價烴基); 步驟(A3):藉由自上述第一表面處理球狀二氧化矽微粒子的混合溶劑分散液除去上述親水性有機溶劑與水的一部分,並濃縮後得到第一表面處理球狀二氧化矽微粒子之混合溶劑濃縮分散液的步驟; 步驟(A4):於上述第一表面處理球狀二氧化矽微粒子的混合溶劑濃縮分散液中添加下述式(III)所示矽氮烷化合物,或下述式(IV)所示1官能性矽烷化合物或此等混合物,使上述第一表面處理球狀二氧化矽微粒子的表面進行處理而於上述第一表面處理球狀二氧化矽微粒子之表面上導入R2 3 SiO1/2 單位(但,R2 與下述相同),得到第二表面處理二氧化矽微粒子的步驟;
Figure 03_image011
(但,R2 為相同或相異種的取代或非取代之碳原子數1~6的一價烴基);
Figure 03_image013
(但,R2 與上述相同,X為OH基或水解性基)。
A method for producing a hygroscopic silicone resin composition, which is a method for producing the hygroscopic silicone resin composition of any one of claims 1 to 4, characterized in that the surface-treated hygroscopic silica The fine particles are manufactured by the following steps (A1) to (A4); Step (A1): by hydrolyzing the 4-functional silane compound represented by the following formula (I) or its partial hydrolysis product, or a mixture of these, The step of hydrolyzing and condensing in a mixed liquid of a hydrophilic organic solvent and water in the presence of an alkaline substance to obtain a mixed solvent dispersion of hydrophilic spherical silica particles containing SiO 2 units;
Figure 03_image007
(However, R 3 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different species); Step (A2): Add the following formula to the mixed solvent dispersion of the hydrophilic spherical silica particles (II) The trifunctional silane compound or its partially hydrolyzed product, or a mixture thereof, is used to treat the surface of the hydrophilic spherical silica microparticles, and introduce it on the surface of the hydrophilic spherical silica microparticles R 1 SiO 3/2 units (however, R 1 is the same as the following) to obtain a mixed solvent dispersion of the first surface-treated spherical silica particles;
Figure 03_image009
(However, R 1 is a substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms, and R 4 is a monovalent hydrocarbon group with 1 to 6 carbon atoms of the same or different species); Step (A3): The step of removing a part of the hydrophilic organic solvent and water from the mixed solvent dispersion of the first surface-treated spherical silica particles, and concentrating to obtain a mixed solvent concentrated dispersion of the first surface-treated spherical silica particles; Step (A4): Add the silazane compound represented by the following formula (III) or the monofunctionality represented by the following formula (IV) to the concentrated dispersion of the mixed solvent of the first surface-treated spherical silica particles Silane compound or these mixtures, subject the surface of the first surface-treated spherical silica particles to the surface of the first surface-treated spherical silica particles to introduce R 2 3 SiO 1/2 units (but , R 2 is the same as below), the step of obtaining the second surface-treated silica particles;
Figure 03_image011
(However, R 2 is the same or different substituted or unsubstituted monovalent hydrocarbon group with 1 to 6 carbon atoms);
Figure 03_image013
(However, R 2 is the same as above, and X is an OH group or a hydrolyzable group).
一種有機EL用透明密封材料,其特徵為含有如請求項1~4中任1項之吸濕性矽氧樹脂組成物所成者。A transparent sealing material for organic EL, which is characterized by containing the hygroscopic silicone resin composition according to any one of claims 1 to 4. 一種有機EL用透明乾燥劑,其特徵為含有如請求項1~4中任1項之吸濕性矽氧樹脂組成物的硬化物所成者。A transparent desiccant for organic EL, which is characterized by being made of a cured product containing the hygroscopic silicone resin composition of any one of claims 1 to 4. 一種有機EL用透明密封材料之使用方法,其特徵為將如請求項6之有機EL用透明密封材料塗布於有機EL元件上,並使其硬化而使用者。A method of using a transparent sealing material for organic EL, which is characterized by coating the transparent sealing material for organic EL as claimed in claim 6 on an organic EL element and hardening it for the user. 一種有機EL用透明密封材料之使用方法,其特徵為將如請求項6之有機EL用透明密封材料填充於內部具有有機EL元件之面板內,並使其硬化而使用者。A method of using a transparent sealing material for organic EL, which is characterized by filling the transparent sealing material for organic EL as claimed in claim 6 in a panel with an organic EL element inside and hardening it for the user. 一種有機EL用透明乾燥劑之使用方法,其特徵為將如請求項7之有機EL用透明乾燥劑配置於內部具有有機EL元件之面板內而使用者。A method of using a transparent desiccant for organic EL, which is characterized by disposing the transparent desiccant for organic EL as claimed in claim 7 in a panel with organic EL elements inside and the user.
TW108142732A 2018-11-26 2019-11-25 Hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL, and method of use thereof TWI775015B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-220321 2018-11-26
JP2018220321A JP6973360B2 (en) 2018-11-26 2018-11-26 Hygroscopic silicone resin composition, transparent encapsulant for organic EL, transparent desiccant for organic EL, and its usage

Publications (2)

Publication Number Publication Date
TW202031772A true TW202031772A (en) 2020-09-01
TWI775015B TWI775015B (en) 2022-08-21

Family

ID=70830663

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108142732A TWI775015B (en) 2018-11-26 2019-11-25 Hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL, and method of use thereof

Country Status (4)

Country Link
JP (1) JP6973360B2 (en)
KR (1) KR20200062045A (en)
CN (1) CN111218204B (en)
TW (1) TWI775015B (en)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3751618B2 (en) * 2002-08-28 2006-03-01 山一電機株式会社 Nonwoven fabric, hygroscopic member, nonwoven fabric manufacturing method, nonwoven fabric manufacturing apparatus, and organic EL display device
WO2009139292A1 (en) * 2008-05-12 2009-11-19 財団法人山形県産業技術振興機構 Organic el light emitting device and process for producing the organic el light emitting device
ITMI20100080U1 (en) * 2010-03-22 2011-09-23 Getters Spa COMPOSITION FOR THE PROTECTION OF DEVICES SENSITIVE TO THE PRESENCE OF H2O.
JP5640476B2 (en) * 2010-06-08 2014-12-17 信越化学工業株式会社 Resin composition for sealing optical semiconductor element and light emitting device
KR20120021436A (en) * 2010-07-30 2012-03-09 제일모직주식회사 Moisture absorbent particles, composition for organic electroluminescence getter containing the same and organic electroluminescence device using thereof
SG187800A1 (en) * 2010-08-13 2013-04-30 Asahi Kasei E Materials Corp Photosensitive silicone resin composition
TW201235299A (en) * 2011-01-21 2012-09-01 Dainippon Ink & Chemicals Method for producing porous silica particles, resin composition for anti-reflection film and anti-reflection film
JP5889174B2 (en) 2012-01-31 2016-03-22 双葉電子工業株式会社 Desiccant and organic EL device using the same
WO2013133430A1 (en) * 2012-03-09 2013-09-12 住友大阪セメント株式会社 Surface-modified-metal-oxide-particle material, composition for sealing optical semiconductor element, and optical semiconductor device
US9777141B2 (en) * 2013-06-10 2017-10-03 Nissan Chemical Industries, Ltd. Silica-containing resin composition and method for producing same, and molded article produced from silica-containing resin composition
JP2015166075A (en) * 2014-03-04 2015-09-24 凸版印刷株式会社 Moisture absorbent, desiccant, organic el sheet and manufacturing method of moisture absorbent
WO2015145966A1 (en) * 2014-03-24 2015-10-01 株式会社Joled Organic el display panel, organic el display panel production method and organic el element sealing method
JP6389145B2 (en) * 2015-06-05 2018-09-12 信越化学工業株式会社 Addition-curing silicone resin composition and semiconductor device
WO2017057607A1 (en) * 2015-09-30 2017-04-06 富士フイルム株式会社 Hygroscopic material, method for producing same, packaging material, and package item
JP6022725B1 (en) 2016-03-31 2016-11-09 Lumiotec株式会社 Organic EL panel and manufacturing method thereof

Also Published As

Publication number Publication date
JP2020084028A (en) 2020-06-04
TWI775015B (en) 2022-08-21
JP6973360B2 (en) 2021-11-24
KR20200062045A (en) 2020-06-03
CN111218204B (en) 2022-12-30
CN111218204A (en) 2020-06-02

Similar Documents

Publication Publication Date Title
EP2196503B1 (en) Thermosetting silicone resin composition, silicone resin, silicone resin sheet and use thereof
EP2017295A1 (en) Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
CN105612219B (en) Silicone gel composition and application thereof
JP5640476B2 (en) Resin composition for sealing optical semiconductor element and light emitting device
EP3101062B1 (en) Nanoparticle, method for producing nanoparticle, addition curing silicone resin composition, and semiconductor apparatus
KR20140034122A (en) Siloxane compositions including metal-oxide nanoparticles suitable for forming encapsulants
WO2011148896A1 (en) Polysiloxane composition, hardened material and optical device
JP5643009B2 (en) Optical device using organopolysiloxane composition
JP2009024077A (en) Silicone-based composition containing silicone-based polymer particle and method for producing the same
JP6599614B2 (en) Thermosetting resin composition
US20110147722A1 (en) Semiconductor light emitting device comprising high performance resins
JP2015120888A (en) Curable organopolysiloxane composition for semiconductor light-emitting device sealing material, organopolysiloxane cured product obtained by curing the composition, and semiconductor light-emitting device sealed by using the cured product
JP2009185131A (en) Thermosetting composition for optical semiconductor, sealing agent for optical semiconductor element, and optical semiconductor device
US20220049121A1 (en) Curable silicone composition, encapsulant and optical semiconductor device
WO2015019705A1 (en) Curable resin composition
TWI775015B (en) Hygroscopic silicone resin composition, transparent sealing material for organic EL, transparent drying material for organic EL, and method of use thereof
JP7302503B2 (en) Hygroscopic silicone resin composition, transparent encapsulating material for organic EL element, transparent drying material for organic EL element, and usage thereof
JP5882729B2 (en) Silicone resin sheet, cured sheet, light-emitting diode device, and manufacturing method thereof
WO2012073899A1 (en) Kit for manufacturing cured material, composition for manufacturing cured material, and use thereof
WO2019202837A1 (en) Transparent desiccant for organic el, and method for using same
US20230101321A1 (en) Curable liquid silicone composition, cured product of curable liquid silicone composition, optical filler including curable liquid silicone composition, and display device including layer comprising cured product of curable liquid silicone composition
EP4386053A2 (en) Siloxane polymer composition, cured product, electronic component, optical component, and composite member
TW202307136A (en) Curable silicone composition, encapsulant and optical semiconductor device
US20240228706A1 (en) Curable silicone composition
TW202311437A (en) Curable silicone composition, encapsulant and optical semiconductor device

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent