TW202028885A - Method for manufacturing structure body, method for manufacturing color filter, method for manufacturing solid-state imaging element, and method for manufacturing image display device - Google Patents

Abstract

The present invention provides a method for manufacturing a structure body, the method including: a step for applying a coloring photosensitive composition on a support body to which a plurality of regions are provided, the regions being demarcated by partition walls, and for forming a coloring photosensitive composition layer on the support body including inside the regions demarcated by the partition walls; a step for exposing, in a pattern shape, the coloring photosensitive composition layer formed on the support body, through a mask having openings that allow simultaneous exposure of the coloring photosensitive composition layer formed in adjacent regions; and a step for developing and removing the coloring photosensitive composition layer in unexposed sections, also developing and removing a part of the coloring photosensitive composition layer in the exposed sections so that at least a part of the surface of the partition walls is exposed, forming pixels in the regions demarcated by the partition walls, and forming, in a pattern shape, pixel regions which are configured from a plurality of pixels of the same color and in which at least a portion of the surface of the partition walls between pixels is exposed through the pixels. The present invention also provides methods for manufacturing a color filter, a solid state imaging element, and an image display device, the methods including the method for manufacturing the structure body.

Description

Manufacturing method of structural body, manufacturing method of color filter, manufacturing method of solid-state imaging device, and manufacturing method of image display device

The present invention relates to a method of manufacturing a structure in which a pixel region composed of a plurality of pixels of the same color is formed into a pattern. Furthermore, the present invention relates to a method of manufacturing a color filter, a solid-state imaging device, and an image display device including the manufacturing method of the aforementioned structure.

In recent years, due to the popularization of digital cameras and mobile phones with cameras, the demand for solid-state imaging devices such as charge-coupled device (CCD) image sensors has increased significantly. Use color filters as the core components of displays and optical components. The color filter is manufactured by, for example, using a colored photosensitive composition and forming a pattern by a photolithography method. For example, Patent Document 1 describes the following: In an atmosphere with an oxygen concentration greater than 21% by volume, exposure energy is irradiated to a radical polymerization type colored photosensitive composition to make it a pattern with a width of 5 μm or less, and then The exposed portion is developed to form the pixel portion of the color filter.

In addition, in recent years, it has been studied to provide partitions between pixels of each color of the color filter for use. For example, Patent Document 2 describes an invention related to a solid-state imaging element in which a transparent planarization layer is sequentially laminated on a semiconductor substrate on which a plurality of photoelectric conversion elements are arranged, and the photoelectric conversion elements are respectively arranged corresponding to each other. A plurality of color filters, a plurality of microlenses respectively arranged corresponding to the photoelectric conversion element, and the transparent planarization layer side of the boundary of the color filters adjacent to each other is formed with a refractive index higher than that of the resin of the color filter Pixel partition walls with low refractive index. Among them, the color filter has a color filter main body portion arranged on a transparent flattening layer and a convex lens portion formed on the color filter main body portion. The height of the color filter main body portion is higher than that of the pixel partition wall. The height is more than 2 times higher, and the convex lens part is formed into a convex lens shape with a convex surface facing the micro lens. Paragraph No. 0006 of Patent Document 2 describes the following: Since the height of the color filter body is set to be more than twice the height of the pixel barrier, light outside the transmitted wavelength can be fully absorbed, and the color resolution can be improved. .

In addition, in recent years, in order to make the color filter have a plurality of pixels, improve the dynamic range, the sensitivity of the imaging pixels, and form the phase difference detection pixels for autofocus, it has been studied to set a plurality of adjacent pixels to the same color, and to use A plurality of pixel regions of the same color are arranged in a pattern and used (see FIGS. 3 and 4 of Patent Document 3). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Application Publication No. 2015-052753 [Patent Document 2] JP 2017-120816 A [Patent Document 3] JP 2016-213622 A

As one aspect of the color filter, there is known a structure in which partitions are provided between pixels of each color of the color filter. However, in the previously known color filter in which a structure having partition walls are provided between pixels, adjacent pixels are set as pixels of other colors. In addition, in Patent Document 3, adjacent pixels are also used as pixels of other colors.

In addition, in recent years, the pixel size has gradually become smaller. Therefore, when a colored photosensitive composition is used to form pixels between the partition walls by photolithography, it becomes difficult to form the pixels in such a way that the pixels are buried between the partition walls and the pixels are exposed from the upper surface of the partition walls. For example, the design or pattern formation process of the mask used for exposure easily becomes complicated. In addition, in Patent Document 2, since the height of the pixel is set to be more than twice the height of the partition wall, as shown in FIG. 1 and the like, the upper surface of the partition wall between the pixels is also covered by the pixel.

On the other hand, Patent Document 3 describes a color filter in which a plurality of adjacent pixels are set to the same color, and pixel regions composed of pixels of the same color are arranged in a pattern, but in Patent Document 4, There is no detailed description of the manufacturing method of the color filter. In addition, there is no description or suggestion regarding the formation of pixels on the support provided with partitions.

In addition, Patent Document 1 also does not describe or suggest that pixels are formed on a support provided with partition walls.

Therefore, the object of the present invention is to provide a new method for manufacturing a structure in which a pixel region composed of a plurality of pixels of the same color is formed into a pattern. Furthermore, an object of the present invention is to provide a method of manufacturing a color filter, a method of manufacturing a solid-state imaging device, and a method of manufacturing an image display device including the manufacturing method of the aforementioned structure.

The present invention provides the following. <1> A method of manufacturing a structure, comprising: coating a colored photosensitive composition on a support provided with a plurality of regions partitioned by partitions to include the support within the region partitioned by partitions The process of forming a colored photosensitive composition layer on the upper surface; the colored photosensitive composition layer formed on the support is exposed through a mask with an opening that can simultaneously expose the colored photosensitive composition layer formed in the adjacent area The process of exposing the layer of the sexual composition into a pattern; and removing the colored photosensitive composition layer in the unexposed part by development, and also developing and removing part of the colored photosensitive composition layer in the exposed part to make at least part of the surface of the partition wall Exposure is a process of forming pixels in the area divided by the partition wall and forming at least a part of the surface of the partition wall between the pixels composed of a plurality of pixels of the same color into a pattern from the pixel area exposed by the pixels. <2> The method of manufacturing a structure as described in <1>, wherein the opening of the mask is provided with a light shielding part that shields at least a part of the position corresponding to the partition. <3> The method of manufacturing a structure as described in <2>, wherein the width of the light shielding portion is 1.0 to 5.0 times the width of the partition wall. <4> The method for producing a structure according to any one of <1> to <3>, wherein the colored photosensitive composition contains a radical polymerizable compound and a photo radical polymerization initiator, and the oxygen concentration is greater than 21 Expose the colored photosensitive composition layer formed on the support into a pattern in an atmosphere of volume %. <5> The method of manufacturing a structure as described in <4>, wherein the oxygen concentration is 55 vol% or less. <6> The manufacturing method of the structure as described in any one of <1> to <5>, wherein under the condition of exposure illuminance of 2500 to 50000 W/m ² , the colored photosensitive composition formed on the support The object layer is exposed into a pattern. <7> The method for manufacturing a structure according to any one of <1> to <6>, wherein the height of the partition wall is 0.3 to 1.2 μm. <8> The method for manufacturing a structure according to any one of <1> to <7>, wherein the width of the partition wall is 0.05 to 0.2 μm. <9> A method of manufacturing a color filter, comprising the method of manufacturing the structure described in any one of <1> to <8>. <10> A method of manufacturing a solid-state imaging device, including the method of manufacturing the structure described in any one of <1> to <8>. <11> A method of manufacturing an image display device, comprising the method of manufacturing the structure described in any one of <1> to <8>. [Invention Effect]

The present invention can provide a new manufacturing method for forming a pattern-like structure in a pixel region composed of a plurality of pixels of the same color. Furthermore, it is possible to provide a method of manufacturing a color filter, a method of manufacturing a solid-state imaging device, and a method of manufacturing an image display device including the manufacturing method of the aforementioned structure.

Hereinafter, the main embodiment of the present invention will be described. However, the present invention is not limited to the illustrated embodiment.

In this specification, a numerical range indicated by a symbol such as "～" means a range that includes the numerical values described before and after "～" as the lower limit and the upper limit, respectively.

The term "process" in this specification refers not only to an independent process, but also includes processes that cannot be clearly distinguished from other processes as long as the expected effects of the process can be achieved.

In the label of the group (atomic group) in this specification, the label not marked with substituted and unsubstituted includes those that do not have a substituent, and also includes those that have a substituent. For example, when it is simply described as "alkyl", its meaning includes both an unsubstituted alkyl group (unsubstituted alkyl group) and a substituted alkyl group (substituted alkyl group).

In this specification, "exposure" includes not only drawing using light, but also drawing using particle beams such as electron beams and ion beams, unless otherwise specified. In addition, as the energy rays used in the exposure, there can be cited the bright line spectrum of a mercury lamp, extreme ultraviolet rays (ArF, KrF, etc.) represented by excimer lasers, extreme ultraviolet rays (EUV light), and actinic rays such as X-rays. , And particle beams such as electron beams and ion beams.

In this specification, “(meth)acrylate” refers to both or either of “acrylate” and “methacrylate”, and “(meth)acrylic acid” refers to “acrylic acid” and “methacrylate”. Both or either of "acrylic acid" and "(meth)acryl" refer to both or either of "acryl" and "methacryl".

In this specification, the concentration of the solid content in the composition is expressed by the mass percentage of the components other than the solvent relative to the total mass of the composition.

In this specification, the weight average molecular weight (Mw) and the number average molecular weight (Mn) are expressed as polystyrene conversion values according to gel permeation chromatography (GPC measurement) unless otherwise specified. For the weight average molecular weight (Mw) and number average molecular weight (Mn), for example, HLC-8220 (manufactured by TOSOH CORPORATION) can be used, and guard columns HZ-L, TSKgel Super HZM-M, TSKgel Super HZ4000, TSKgel Super HZ3000 can be used as the column. And TSKgel Super HZ2000 (manufactured by TOSOH CORPORATION). In addition, unless otherwise specified, the measurement is performed using THF (tetrahydrofuran) as the eluent. In addition, unless otherwise specified, a UV ray (ultraviolet) wavelength 254 nm detector is used as a detection for GPC measurement.

In this specification, unless otherwise specified, the direction in which the layers are stacked on the support is referred to as "up", and the opposite direction is referred to as "down". In addition, in this kind of vertical direction setting, for convenience in this specification, in an actual aspect, the "up" direction in this specification may be different from vertical upward.

＜Method of manufacturing structure＞ The characteristics of the manufacturing method of the structure of the present invention include: A process of forming a colored photosensitive composition layer on the support including the area divided by the partition wall by coating the colored photosensitive composition on the support provided with a plurality of areas divided by the partition wall; A process of exposing the colored photosensitive composition layer formed on the support into a pattern through a mask with an opening that can simultaneously expose the colored photosensitive composition layer formed in the adjacent area; as well as The colored photosensitive composition layer in the unexposed area is removed by development, and a part of the colored photosensitive composition layer in the exposed area is also developed to expose at least a part of the surface of the partition wall, thereby forming pixels in the area divided by the partition wall And a process of forming at least a part of the surface of the partition wall between the pixels which are composed of a plurality of pixels of the same color into a pattern from the pixel area exposed by the pixels.

According to the present invention, it is possible to manufacture a structure in which a plurality of pixels of the same color are formed and at least a part of the surface of the partition wall between the pixels is formed into a pattern from the pixel area where the pixels are exposed. In addition, since at least a part of the surface of the barrier ribs between the respective pixels constituting the above-mentioned pixel area in the structure is exposed from the pixels, it is also possible to effectively suppress the color separation ability and light leakage to adjacent pixels.

In addition, according to the present invention, the exposure is performed by using a mask having openings that can simultaneously expose the colored photosensitive composition layer formed in a plurality of adjacent areas, and the unexposed portions are removed by development. The composition layer and a part of the colored photosensitive composition layer of the exposure part form pixels, so each pixel constituting one pixel area can be formed at the same time, and the manufacturing process of the structure is simple. Furthermore, even if the size of each pixel constituting one pixel area becomes finer, the processing design and pattern formation process of the mask can be made simple. This is because, for example, as shown in FIGS. 8 and 10, when the pixel area 35 composed of 4 pixels 30 is formed in a pattern, the area for 4 pixels is regarded as one exposure area and divided by development Each pixel is formed for 4 equal parts.

It is also preferable that the opening of the mask used in the method of manufacturing the structure of the present invention is provided with a light shielding portion which shields at least a part of the position corresponding to the partition wall. By using this kind of mask, it is easier to effectively remove the colored photosensitive composition layer on the partition wall during development.

As a mechanism for developing and removing a part of the colored photosensitive composition layer of the exposure part so that at least a part of the surface of the partition wall is exposed during development, for example, a mechanism containing a radical polymerizable compound and a photoradical polymer can be mentioned. The initiator is used as a method of coloring the photosensitive composition and exposing to deactivate the radical polymerization reaction of the surface layer of the coloring photosensitive composition layer. By deactivating the radical polymerization reaction of the colored photosensitive composition layer on the surface layer, the surface layer of the colored photosensitive composition layer in the exposed part can be easily removed by development during development, and the colored photosensitive composition in the exposed part can be removed. A part of the object layer is developed and removed together with the unexposed part so that at least a part of the surface of the partition wall is exposed.

As a mechanism for exposing in a way that the radical polymerization reaction of the surface layer of the colored photosensitive composition layer is inactivated, there can be mentioned a method of exposing in an atmosphere with an oxygen concentration greater than 21% by volume, and the composition of raw materials in oxygen. A method of using a photo-radical polymerization initiator with high radical quenching ability under an environment, a method of using a radical polymerizable compound with a small ethylenically unsaturated bond group value, etc.

As a preferred aspect of the manufacturing method of the structure of the present invention, it can be mentioned that the colored photosensitive composition contains a radical polymerizable compound and a photoradical polymerization initiator, and is in an atmosphere with an oxygen concentration greater than 21% by volume. Next, the colored photosensitive composition layer formed on the support is exposed in a patterned state. According to this aspect, the radical polymerization reaction of the surface layer of the colored photosensitive composition layer is easily inactivated by being hindered by oxygen, and the surface layer of the colored photosensitive composition layer is easily removed during development. The aforementioned oxygen concentration is preferably 25% by volume or more, and more preferably 30% by volume or more. From the viewpoints of the oxygen concentration control ability of the exposure device, safety, and ease of controlling polymerization inactivation, the upper limit is preferably 55% by volume or less, more preferably 50% by volume or less, and more preferably 40% by volume or less. In addition, the exposure illuminance during exposure is preferably 2500 to 50000 W/m ² . As long as the exposure illuminance is in the above range, it is easier to effectively deactivate the radical polymerization reaction of the colored photosensitive composition layer of the surface layer. From the reason easier to obtain the effect of inactivation caused by free radicals of oxygen inhibition of the polymerization reaction, the upper limit of 30000W / m ² or less is preferred, 15000W / m ² or less is more preferred. From the viewpoint of forming a pixel, a lower limit of 3000W / m ² or more is preferred, 5000W / m ² or more is more preferable. In addition, the exposure energy during exposure is preferably 1,000 to 10,000 J/m ² . From the reasons significantly more easily obtained due to oxygen inhibition of the radical polymerization reaction of the inactivating effect, the upper limit of 8000J / m ² or less is preferred, 6000J / m ² or less is more preferred. From the viewpoint of adhesiveness, the lower limit of 2000J / m ² or more is preferred, 3000J / m ² or more is more preferable.

Hereinafter, the method of manufacturing the structure of the present invention will be described in further detail using drawings.

In the manufacturing method of the structure of the present invention, a support having partition walls on the surface is used as a support, and the surface of the support is divided into a plurality of regions by the partitions. First, the support body with partitions will be described using drawings. Fig. 1 is a plan view viewed from directly above the support 1, and Fig. 2 is a sectional view taken along the line A-A in Fig. 1.

In Figures 1 and 2, the symbol 1 refers to the support. The material of the support 1 is not particularly limited. It can be appropriately selected according to the purpose. For example, a glass substrate, a silicon substrate, etc. can be mentioned, and a silicon substrate is preferable. In addition, a charge coupled device (CCD), a complementary metal oxide film semiconductor (CMOS), a transparent conductive film, etc. can be formed on a silicon substrate. In addition, an undercoat layer may be provided on the silicon substrate. The undercoat layer is used to improve the adhesion to the upper layer, prevent the diffusion of substances, or flatten the surface of the substrate.

As shown in FIGS. 1 and 2, a partition wall 2 is provided on the support 1, and the surface of the support 1 is divided into a plurality of regions by the partition wall 2. In addition, the aforementioned "area" refers to a space surrounded by partitions on the support. The partition wall 2 may be provided on the support body 1 in direct contact. In addition, when an undercoat layer is provided on the support 1, a partition wall may be provided on the undercoat layer. In addition, in FIGS. 1 and 2, the shape of the region surrounded by the partition wall 2 on the support 1 (hereinafter also referred to as the shape of the opening of the partition wall) is rectangular, but it may be a shape other than the rectangular shape. For example, a circular shape, an elliptical shape, and a polygonal shape of pentagon or more can be given.

The material of the partition wall 2 is not particularly limited. For example, organic materials such as silicone resins and fluororesins, and inorganic particles such as silicon dioxide particles can be cited. As the silica particles, a plurality of spherical silica particles connected in a bead shape is preferably used. In addition, in the present specification, "spherical" means that it is substantially spherical, and it can be deformed within the scope of the effect of the present invention. For example, it refers to a shape with uneven surface or a flat shape with a long axis in a specific direction. In addition, "a plurality of spherical silica particles are connected in a beaded shape" refers to a structure in which a plurality of spherical silica particles are connected in a linear and/or branched form. For example, there may be a structure in which a plurality of spherical silica particles are connected to each other by a joint having a smaller outer diameter. In addition, in the present invention, the structure in which "a plurality of spherical silica particles are connected in a beaded shape" includes not only a structure in the form of being connected in a ring shape, but also a structure in the form of a chain with ends.

In addition, the partition wall 2 may be made of metal such as tungsten and aluminum. In addition, it may be a laminate of metal and black matrix. In the case of a laminate, the order in which the metal and the black matrix are layered is not particularly limited.

The height H1 of the partition wall 2 is preferably 0.3 to 1.2 μm. The lower limit is preferably 0.35 μm or more, and more preferably 0.4 μm or more. The upper limit is preferably 1.1 μm or less, more preferably 1.0 μm or less, and even more preferably 0.8 μm or less.

The width W1 of the partition wall 2 is preferably 0.05 to 0.2 μm. The lower limit is preferably 0.06 μm or more, more preferably 0.08 μm or more, and even more preferably 0.10 μm or more. The upper limit is preferably 0.18 μm or less, more preferably 0.15 μm or less, and even more preferably 0.12 μm or less.

The ratio of the height H1 to the width W1 of the partition wall 2 (height H1/width W1) is preferably 1.5 to 20.0. The lower limit is preferably 1.8 or more, more preferably 2.0 or more, and even more preferably 4.0 or more. The upper limit is preferably 15.0 or less, more preferably 10.0 or less, and even more preferably 8.0 or less.

The pitch width P1 of the partition wall 2 is preferably 0.5 to 2.0 μm. The lower limit is preferably 0.6 μm or more, more preferably 0.7 μm or more, and even more preferably 0.8 μm or more. The upper limit is preferably 1.8 μm or less, more preferably 1.4 μm or less, and even more preferably 1.2 μm or less. In addition, the pitch width P1 of the partition wall 2 refers to the arrangement pitch of adjacent partition walls. The shorter the pitch width P1, the smaller the pixel size.

The surface of the partition wall 2 may be provided with a protective layer. As the material of the protective layer, various inorganic materials or organic materials can be used. For example, as an organic material, acrylic resin, polystyrene resin, polyimide resin, organic spin-on glass (Spin On Glass) resin, etc. are mentioned. In addition, it is also possible to form a protective layer using a composition containing a compound having a group having an ethylenically unsaturated bond. Examples of groups having ethylenically unsaturated bonds include vinyl, (meth)allyl, (meth)acryloyl, styryl, etc., (meth)allyl, (methyl) Acrylic is preferred. The compound having an ethylenically unsaturated bond may be a monomer or a resin such as a polymer. As the inorganic material, silicon dioxide and the like can be cited.

The protective layer can use a previously known method. In the case of forming a protective layer made of an organic material, for example, a composition containing an organic material can be coated on the partition wall and dried. In the case of forming a protective layer composed of an inorganic material, for example, chemical vapor deposition (CVD), vacuum vapor deposition or other methods such as sputtering can be used to form a film on the surface of the protective layer to form the inorganic protective layer. material.

The partition wall 2 can be formed using a conventionally known method. For example, the partition wall 2 can be formed as follows. First, a barrier rib material layer is formed on the support. Regarding the barrier rib material layer, for example, after coating a composition containing inorganic particles such as silicon dioxide particles on the support, a film is formed by curing or the like to form the barrier rib material layer. Examples of such a composition include the composition for forming an optical functional layer described in paragraph numbers 0012 to 0133 of International Publication No. 2015/190374, and the content is incorporated in this specification. In addition, it is possible to form a barrier rib material layer by forming a film of an inorganic material such as silicon dioxide on the support by a vapor deposition method such as chemical vapor deposition (CVD), vacuum vapor deposition, or a method such as sputtering. Next, a photoresist pattern is formed on the barrier rib material layer by using a mask having a pattern along the shape of the barrier rib. Next, the photoresist pattern is used as a mask and a pattern is formed by etching the barrier rib material layer. Examples of the etching method include dry etching and wet etching. The etching by the dry etching method can be performed under the conditions described in paragraph numbers 0114 to 0120, 0129, and 0130 of JP 2016-014856 A. Next, the photoresist pattern is peeled off from the barrier rib material layer. The partition wall 2 can be formed in this way.

(The process of forming the colored photosensitive composition layer) In the manufacturing method of the structure of the present invention, as shown in FIG. 3, a colored photosensitive composition is applied to the support 1 provided with a plurality of regions partitioned by the partition wall 2 to include the region partitioned by the partition wall 2. A colored photosensitive composition layer 10 is formed on the inner support 1. As the colored photosensitive composition, those containing a radical polymerizable compound and a photo radical polymerization initiator can be preferably used. As the type of the colored photosensitive composition, for example, there can be exemplified a pixel formation selected from a red pixel, a green pixel, a blue pixel, a yellow pixel, a cyan pixel, a magenta pixel, a transparent pixel, an infrared transmission pixel, and a light-shielding pixel. The composition is preferably a composition for forming a pixel selected from the group consisting of red pixels, green pixels, and blue pixels. The details of the colored photosensitive composition will be described later. In addition, in this specification, the "coloring" in the colored photosensitive composition includes the concept of "transparent".

As the coating method of the colored photosensitive composition, a known method can be used. For example, the drop method (drop casting); slit coating method; spray method; roll coating method; spin coating method (spin coating); cast coating method; slit spin coating method; pre-wet method ( For example, the method described in Japanese Patent Application Publication No. 2009-145395); inkjet (for example, on-demand method, piezoelectric method, thermal method), nozzle jet and other ejection system printing, flexographic printing, screen printing, gravure Printing, reverse offset printing, metal mask printing and other printing methods; transfer method using molds, etc.; nanoimprinting method, etc. The application method in inkjet is not particularly limited. For example, the "Widely Used Inkjet-Unlimited Possibilities in Japanese Patent-Issued in February 2005, SB RESEARCH CO., LTD." Methods (especially from pages 115 to 133) and JP 2003-262716 A, JP 2003-185831, JP 2003-261827, JP 2012-126830, JP 2006 -The method described in Bulletin No. 169325. In addition, the coating method of the colored photosensitive composition can use the methods described in International Publication No. 2017/030174 and International Publication No. 2017/018419, and these contents are incorporated in this specification.

The colored photosensitive composition layer 10 formed on the support 1 may be dried (pre-baked). When pre-baking is performed, the pre-baking temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 110°C or lower. The lower limit can be set to 50°C or higher or 80°C or higher, for example. The pre-baking time is preferably 10 to 300 seconds, more preferably 40 to 250 seconds, and even more preferably 80 to 220 seconds. Pre-baking can be performed using a hot plate, a baking box, etc.

(Exposure process) Next, as shown in FIG. 4, the colored photosensitive composition formed on the support 1 is exposed through the mask 20 having the opening 25 of the colored photosensitive composition layer 10a formed in the adjacent area. Layer 10 (exposure process). That is, in this process, a plurality of pixels are used as one exposure area for exposure. For example, in FIGS. 4 and 5, four pixels corresponding to the opening 25 of the mask 20 are the exposure areas. In addition, as shown in FIGS. 6 and 7, even when the light shielding portion 22 is formed in a part of the opening 25a of the mask 20a, the 4 pixels corresponding to the position corresponding to the opening 25a of the mask 20a also correspond to Exposure area.

The number of colored photosensitive composition layers 10a that are simultaneously exposed in one exposure area can be selected appropriately. For example, when the number of pixels constituting one pixel area is four, four adjacent colored photosensitive composition layers are exposed at the same time. That is, the colored photosensitive composition layer 10a for 4 pixels is simultaneously exposed.

Fig. 5 is an embodiment of a mask capable of exposing the openings of four adjacent colored photosensitive composition layers at the same time, and the mask 20 shown in Fig. 4 is viewed from directly above the support 1 by including The top view of the part enclosed by the dotted line of the opening 25. In the mask 20, openings 25 are formed in the colored photosensitive composition layer 10a in four adjacent regions divided by the partition wall 2 and the positions corresponding to the partition wall 2a between the colored photosensitive composition layers 10a. By using this kind of mask 20, the colored photosensitive composition layer 10a formed in the four adjacent areas can be irradiated with light h for exposure.

In addition, as shown in FIG. 6, in the present invention, as the mask 20a, it is possible to use a mask 20a with a light-shielding portion 22 provided in the opening 25a of the mask 20a, and the light-shielding portion 22 shields the partition wall 2a between the colored photosensitive composition layer 10a At least part of the corresponding location. The light-shielding portion 22 may be made of a material constituting the mask 20a. When this type of mask is used, it is easier to effectively remove the colored photosensitive composition layer on the partition wall 2a during development. The width of the light shielding portion 22 is preferably 0.5 to 5.0 times the width of the partition wall, more preferably 1.0 to 4.0 times, and even more preferably 1.0 to 3.0 times. In the light shielding portion 22, the transmittance of light of the wavelength used for exposure is preferably 1.0% or less, more preferably 0.5% or less, and more preferably 0.1% or less.

FIG. 7 is an embodiment in which four adjacent colored photosensitive composition layers can be simultaneously exposed to the openings, and the openings are provided with a mask of the above-mentioned light-shielding portion, and is viewed from directly above the support 1 The top view of the part enclosed by the broken line including the opening 25a of the mask 20a is shown. The mask 20a is provided with a light-shielding portion 22 at a position corresponding to the partition wall 2a between the colored photosensitive composition layers 10a.

Examples of radiation (light) that can be used for exposure include g-rays, h-rays, and i-rays. In addition, light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light having a wavelength of 300 nm or less include KrF rays (wavelength 248 nm), ArF rays (wavelength 193 nm), and the like. KrF rays (wavelength 248 nm) are preferred. In addition, a light source with a long wavelength of 300 nm or more can also be used. In addition, at the time of exposure, light may be continuously irradiated for exposure, or pulsed irradiation may be used for exposure (pulse exposure).

The exposure illuminance during exposure (the average value during the exposure time during pulse exposure) is preferably 2500 to 50000W/m ² . The upper limit of 30000W / m ² or less is preferred, 15000W / m ² or less is more preferred. The lower limit of 3000W / m ² or more is preferred, 5000W / m ² or more is more preferable.

The exposure energy during exposure is preferably 1,000 to 10,000 J/m ² . The upper limit of 8000J / m ² or less is preferred, 6000J / m ² or less is more preferred. The lower limit of 2000J / m ² or more is preferred, 3000J / m ² or more is more preferable.

Regarding the oxygen concentration during exposure, it can be appropriately selected. The exposure can be carried out in the atmosphere (the oxygen concentration is 20-21% by volume), the exposure can also be carried out in an oxygen atmosphere with an oxygen concentration of less than 20% by volume, or it can be exposed in an oxygen concentration greater than Exposure is carried out in an oxygen atmosphere of 21% by volume. In the present invention, exposure is preferably performed in an oxygen atmosphere with an oxygen concentration greater than 21% by volume. Among them, in the case of using a radical polymerizable compound and a photoradical polymerization initiator as a colored photosensitive composition to form a colored photosensitive composition layer, exposure is performed in an oxygen atmosphere with an oxygen concentration of more than 21% by volume For better. By exposing in a high oxygen concentration atmosphere, the radical polymerization reaction of the surface layer of the colored photosensitive composition layer is easily deactivated by oxygen hindered, and the surface layer of the colored photosensitive composition layer is likely to interact with unexposed areas during development. Are removed together. The aforementioned oxygen concentration is preferably 25% by volume or more, and more preferably 30% by volume or more. From the viewpoints of the oxygen concentration control ability of the exposure device, safety, and ease of controlling polymerization inactivation, the upper limit is preferably 55% by volume or less, more preferably 50% by volume or less, and even more preferably 40% by volume or less.

(Process of forming the pixel area into a pattern (development process)) Next, as shown in Figures 8 and 9, development removes the colored photosensitive composition layer in the unexposed part, and also develops and removes part of the colored photosensitive composition layer in the exposed part so that at least a part of the surface of the partition wall (preferably Is the upper surface) exposed to form pixels 30 in the area divided by the partition wall, whereby at least a part of the surface of the partition wall 2a between the pixels 30 is exposed from the pixel 30, which is composed of a plurality of pixels of the same color 35 is formed in a pattern shape. Fig. 8 is a plan view viewed from directly above the support 1, and Fig. 9 is a cross-sectional view taken along the line A-A in Fig. 8.

The development and removal of the colored photosensitive composition layer can be performed using a developing solution. The temperature of the developer is preferably 20 to 30°C, for example. The development time is preferably 20 to 180 seconds. In addition, in order to improve the residue removal, the process of shaking off the developer every 60 seconds and supplying new developer can be repeated several times.

Examples of the developer include an organic solvent, an alkaline developer, and the like, and an alkaline developer is preferably used. As the alkaline developer, an alkaline aqueous solution (alkali developer) obtained by diluting an alkaline agent with pure water is preferred. Examples of alkaline agents include ammonia, ethylamine, diethylamine, dimethylethanolamine, diglycolamine, diethanolamine, hydroxylamine, ethylenediamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, Tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, ethyltrimethylammonium hydroxide, benzyltrimethylammonium hydroxide, dimethylbis(2-hydroxyethyl)ammonium hydroxide, choline, Organic basic compounds such as pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium bicarbonate, sodium silicate, Inorganic alkaline compounds such as sodium metasilicate. From the environmental and safety aspects, the alkali agent is preferably a compound with a large molecular weight. The concentration of the alkali agent in the alkaline aqueous solution is preferably 0.001 to 10% by mass, and more preferably 0.01 to 1% by mass. In addition, the developer may further contain a surfactant. As the surfactant, a nonionic surfactant is preferred. From the viewpoint of convenient transportation and storage, the developer can be made temporarily as a concentrated solution and diluted to the required concentration during use. The dilution ratio is not particularly limited, but it can be set in the range of 1.5 to 100 times, for example.

As a development method, a well-known method can be utilized. For example, immersion development, spin immersion development, spray development, spray development, ultrasonic development, dipping development, etc. can be cited. Spin immersion development and spray development are preferred, because it is easier and more effective to remove residue. , Spray development is better. In addition, spray development refers to a method of spraying a developing solution applied pressure by gas such as N ₂ , air, etc. from a nozzle to spray the developing solution onto a target material for development. In spray development, the spray-like developer sprayed from the nozzle is filled on the target, and the target is developed by spray pressure. It can also be a composite development method including a process of spin-on immersion development after liquid discharge by spray development.

The flow rate of the developer in spray development, the flow rate ratio of the developer to the gas, the spray pressure, etc. can be appropriately adjusted. For example, as the flow rate of the developer, 30 to 500 mL/min is preferable, 50 to 400 mL/min is more preferable, and 200 to 350 mL/min is more preferable. In addition, as the flow rate ratio of the developer to the gas, for example, developer: gas=1:1.5 to 1:50 is preferable, 1:2 to 1:30 is more preferable, and 1:2.5 to 1:20 is more preferable. good. In addition, as the spray pressure, 3 to 15 MPa is preferable, 5 to 12 MPa is more preferable, and 7 to 9 MPa is still more preferable.

It is also better to wash (rinse) with pure water after development. In addition, it is preferable to supply a rinse liquid to the developed support while rotating the developed support to perform washing. Moreover, it is also preferable to perform it by moving the nozzle which sprays a rinse liquid from the center part of a support body to the peripheral part of a support body. At this time, when moving from the center part of the support body of the nozzle to the peripheral edge part, you may move while gradually reducing the moving speed of the nozzle. By rinsing in this way, it is possible to suppress in-plane deviation during rinsing. In addition, the same effect can be obtained by gradually reducing the rotation speed of the support while moving the nozzle from the center of the support to the peripheral edge.

After development, it is preferable to perform additional exposure treatment and heat treatment (post-baking) after drying. The additional exposure treatment or post-baking is a curing treatment after development for making the composition layer completely cured. The heating temperature during the post-baking is preferably 100 to 240°C, and more preferably 200 to 240°C. The post-baking can be performed continuously or intermittently using heating mechanisms such as a heating plate, a convection oven (hot air circulating dryer), or a high-frequency heater so as to meet the above-mentioned conditions. When performing additional exposure processing, the light used in the exposure is preferably light with a wavelength of 400 nm or less. In addition, the method described in Korean Patent Publication No. 10-2017-0122130 can be used to perform additional exposure processing.

In this way, it is possible to form at least a part (preferably the upper surface) of the surface of the partition wall 2a between the pixels 30, which is composed of a plurality of pixels of the same color, into a pattern shape from the pixel area 35 exposed from the pixel 30. In addition, in FIG. 8, one pixel area 35 is composed of four pixels 30, but the number of pixels constituting one pixel area may be two, three, or five or more. In addition, in FIG. 8, each pixel 30 constituting one pixel area 35 is arranged in parallel in the x direction and two in parallel in the y direction in FIG. 8, but the arrangement of the pixels 30 constituting the pixel area is not Particularly limited, various arrangements can be adopted. For example, if one pixel area is formed by 4 pixels as an example, in addition to the arrangement shown in FIG. 8, 4 pixels can be arranged in the x direction to form 1 pixel area, or in y Four pixels are continuously arranged in the direction to form one pixel area.

In addition, in FIG. 9, the height H1 of the partition wall 2 is approximately the same as the thickness (height) H2 of the pixel 30, and it may be the height H1 of the partition wall 2>the thickness (height) H2 of the pixel 30, or the height H1 of the partition wall 2<pixel The thickness (height) of 30 is H2. In view of the ease of suppressing mixing, the thickness (height) H2 of the pixel 30 is preferably 0.8 to 1.3 times the height H1 of the partition wall 2, more preferably 0.9 to 1.2 times, and even more preferably 0.9 to 1.1 times. In addition, in FIG. 9, the upper surface of the pixel 30 is substantially flat, but there are cases where the surface is uneven.

In addition, in the case of forming a plurality of color pixel regions as shown in FIG. 10 into a pattern-like structure, it can be manufactured by repeatedly performing the above-mentioned processes for each pixel of each color. FIG. 10 is a plan view of a structure in which the pixel regions 35, 45, and 55 of three colors are respectively formed in a pattern. The pixels 30, 40, and 50 are pixels of different hues. For example, the pixel 30 may be a green pixel, the pixel 40 may be a red pixel, and the pixel 50 may be a blue pixel. The type and arrangement of pixels can be appropriately selected according to the use or purpose.

The structure manufactured by the present invention can be preferably used in color filters and the like. In addition, the structure manufactured by the present invention can be incorporated into a solid-state imaging device, an image display device, or the like, and used. As the image display device, a liquid crystal display device, an organic electroluminescence (organic EL) display device, and the like can be cited. In addition, it can also be used in imaging components such as digital still cameras, digital video cameras, surveillance cameras, and car cameras.

＜Colored photosensitive composition＞ Next, the colored photosensitive composition used in the manufacturing method of the structure of the present invention will be described. The colored photosensitive composition includes a pixel forming composition selected from the group consisting of red pixels, green pixels, blue pixels, yellow pixels, cyan pixels, magenta pixels, transparent pixels, infrared transmission pixels, and light-shielding pixels, selected from red The pixel formation composition of the pixel, the green pixel, and the blue pixel are preferable. In addition, when a colored photosensitive composition is used to form a film with a thickness of 0.3 to 1.0 μm, in at least one of the aforementioned film thicknesses, the transmittance of light at a wavelength of 365 nm is preferably 0.5% or more, and 1.0% or more is More preferably, it is more preferably 5.0% or more.

＜＜Colorant＞＞ The coloring photosensitive composition preferably contains a coloring agent. As a coloring agent, color coloring agents, such as a red coloring agent, a green coloring agent, a blue coloring agent, a yellow coloring agent, a purple coloring agent, and an orange coloring agent, can be mentioned. The colorant may be a pigment or a dye. Pigments and dyes can also be used together. In addition, the pigment may be any of an inorganic pigment and an organic pigment. In addition, a material obtained by substituting an organic chromophore for a part of an inorganic pigment or an organic-inorganic pigment can also be used for the pigment. By replacing inorganic pigments or organic-inorganic pigments with organic chromophores, hue design can be easily performed.

The average primary particle diameter of the pigment is preferably 1 to 200 nm. The lower limit is preferably 5 nm or more, and more preferably 10 nm or more. The upper limit is preferably 180 nm or less, more preferably 150 nm or less, and even more preferably 100 nm or less. As long as the average primary particle diameter of the pigment is in the above range, the dispersion stability of the pigment in the colored photosensitive composition is good. In addition, in the present invention, the primary particle size of the pigment can be obtained from the obtained image photograph by observing the primary particle of the pigment with a transmission electron microscope. Specifically, the projected area of the primary particle of the pigment is obtained, and the equivalent circle diameter corresponding to it is calculated as the primary particle diameter of the pigment. In addition, the average primary particle diameter in the present invention is the arithmetic average value of the primary particle diameters of 400 pigments. In addition, the primary particles of a pigment refer to independent particles that are not aggregated.

The coloring agent used in the present invention preferably contains a pigment. The content of the pigment in the colorant is preferably 50% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, and particularly preferably 90% by mass or more. As the pigment, the following can be mentioned.

Color Index (CI) Pigment Yellow (Pigment Yellow) 1, 2, 3, 4, 5, 6, 10, 11, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128,129,137,138,139,147,148,150,151,152,153,154,155,156,161,162,164,166,167,168,169,170,171,172,173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214, 231, 232 (methine series), etc. (above are yellow pigments), CI Pigment Orange 2, 5, 13, 16, 17:1, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64 , 71, 73, etc. (the above are orange pigments), CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 9, 10, 14, 17, 22, 23, 31, 38, 41, 48:1, 48:2, 48:3 , 48:4, 49, 49:1, 49:2, 52:1, 52:2, 53:1, 57:1, 60:1, 63:1, 66, 67, 81:1, 81:2 , 81: 3, 83, 88, 90, 105, 112, 119, 122, 123, 144, 146, 149, 150, 155, 166, 168, 169, 170, 171, 172, 175, 176, 177, 178 , 179, 184, 185, 187, 188, 190, 200, 202, 206, 207, 208, 209, 210, 216, 220, 224, 226, 242, 246, 254, 255, 264, 270, 272, 279 , 294 (xanthene series, Organo Ultamarine, Bluish Red) etc. (the above are red pigments), C.I. Pigment Green 7, 10, 36, 37, 58, 59, 62, 63, etc. (the above are green pigments), C.I. Pigment Violet 1, 19, 23, 27, 32, 37, 42, 60 (triarylmethane series), 61 (koushankou galaxy), etc. (the above are purple pigments), CI Pigment Blue 1, 2, 15, 15:1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 29, 60, 64, 66, 79, 80, 87 (Monoazo series), 88 (methine series), etc. (the above are blue pigments).

In addition, as the green pigment, a zinc phthalocyanine halide pigment having an average of 10 to 14 halogen atoms, an average of 8 to 12 bromine atoms, and an average of 2 to 5 chlorine atoms in one molecule can be used. As a specific example, the compound described in International Publication No. 2015/118720 can be cited. In addition, as the green pigment, the compound described in the specification of Chinese Patent Application No. 106909027, the phthalocyanine compound having a phosphate ester as a ligand described in International Publication No. 2012/102395, and the like can also be used.

In addition, as the blue pigment, an aluminum phthalocyanine compound having a phosphorus atom can also be used. As specific examples, the compounds described in paragraphs 0022 to 0030 of JP 2012-247591 A and Paragraph 0047 of JP 2011-157478 A can be cited.

Moreover, as the yellow pigment, the pigments described in JP 2017-201003 A, the pigments described in JP 2017-197719, and paragraphs 0011 to 0062 of JP 2017-171912 can also be used. , The pigments described in paragraphs 0137 to 0276, the pigments described in paragraphs 0010 to 0062 of JP 2017-171913, and paragraphs 0138 to 0295, paragraphs 0011 to 0062 of JP 2017-171914, 0139 The pigment described in paragraph 0190, and the pigment described in paragraphs 0010 to 0065 and paragraph 0142 to 0222 of JP 2017-171915 A.

In addition, as the yellow pigment, the compound described in JP 2018-062644 A can also be used. The compound can also be used as a pigment derivative.

As the red pigment, the diketopyrrolopyrrole compound in which at least one bromine atom has been substituted in the structure described in JP 2017-201384, and the diketone described in paragraphs 0016 to 0022 of Japanese Patent No. 6248838 can also be used. Pyrrolopyrrole compounds, diketopyrrolopyrrole compounds described in International Publication No. 2012/102399, diketopyrrolopyrrole compounds described in International Publication No. 2012/117965, and those described in JP 2012-229344 Naphthol azo compounds, etc. In addition, as the red pigment, a compound having a structure in which an aromatic ring group formed by introducing a group bonding an oxygen atom, a sulfur atom, or a nitrogen atom to the aromatic ring is bonded to the diketopyrrolopyrrole skeleton can also be used.

In the present invention, dyes can also be used in colorants. The dye is not particularly limited, and known dyes can be used. For example, pyrazole azo series, anilino azo series, triaryl methane series, anthraquinone series, anthrapyridine quinone series, benzylidene series, oxacyanine series, pyrazolotriazole azo series , Pyridone azo series, cyanine series, phenanthrene series, pyrrolopyrazole methine azo series, Kouyamakou galaxy, phthalocyanine series, benzopyran series, indigo series, pyrromethene series And other dyes. Moreover, the thiazole compound described in JP 2012-158649 A, the azo compound described in JP 2011-184493 A, and the azo compound described in JP 2011-145540 A can also be preferably used. The azo compound. In addition, as the yellow dye, the quinoline yellow compound described in paragraph numbers 0011 to 0034 of JP 2013-054339 A, and the quinoline described in paragraph numbers 0013 to 0058 of JP 2014-026228 A can also be used. Yellow compounds and so on.

In the present invention, pigment multimers can also be used in the colorant. The pigment polymer is preferably a dye used by dissolving in a solvent. In addition, pigment multimers can form particles. When the pigment polymer is a particle, it is usually used in a state dispersed in a solvent. The pigment multimer in the particle state can be obtained, for example, by emulsion polymerization, and as a specific example, the compound and the production method described in JP 2015-214682 A can be cited. The dye multimer has two or more dye structures in one molecule, and preferably has three or more dye structures. The upper limit is not particularly limited, but can also be 100 or less. A plurality of pigment structures in a molecule can be the same pigment structure or different pigment structures. The weight average molecular weight (Mw) of the pigment polymer is preferably 2,000 to 50,000. The lower limit is more preferably 3000 or more, and more preferably 6000 or more. The upper limit is more preferably 30,000 or less, and more preferably 20,000 or less. The pigment polymer can also use Japanese Patent Application Publication No. 2011-213925, Japanese Patent Application Publication No. 2013-041097, Japanese Patent Application Publication No. 2015-028144, Japanese Patent Application Publication No. 2015-030742, International Publication No. 2016/031442 The compound described in etc.

In addition, as the coloring agent, the condensed quinoline yellow compound described in International Publication No. 2012/128233 and the coloring agent described in International Publication No. 2011/037195 can also be used.

The content of the colorant in the total solid content of the colored photosensitive composition is preferably 10% by mass or more, more preferably 15% by mass or more, more preferably 20% by mass or more, and particularly preferably 40% by mass or more. The upper limit is preferably 80% by mass or less, and more preferably 75% by mass or less.

＜＜Pigment derivatives＞＞ The colored photosensitive composition can contain a pigment derivative. As the pigment derivative, a compound having a structure in which a part of the chromophore is substituted with an acid group, a basic group, or a phthalimide methyl group can be mentioned. Examples of the chromophore constituting the pigment derivative include quinoline skeleton, benzimidazolone skeleton, diketopyrrolopyrrole skeleton, azo skeleton, phthalocyanine skeleton, anthraquinone skeleton, quinacridone skeleton, and diketone skeleton. Well skeleton, perinone skeleton, perylene skeleton, Thioindigo skeleton, isoindoline skeleton, isoindolinone skeleton, quinoline yellow skeleton, threne skeleton, metal complex System skeleton, etc., quinoline skeleton, benzimidazolone skeleton, diketopyrrolopyrrole skeleton, azo skeleton, quinoline yellow skeleton, isoindoline skeleton and phthalocyanine skeleton are preferred, azo skeleton and benzimidazole The ketone skeleton is more preferable. As the acid group possessed by the pigment derivative, a sulfo group and a carboxyl group are preferred, and a sulfo group is more preferred. As the basic group possessed by the pigment derivative, an amino group is preferred, and a tertiary amino group is more preferred.

In the present invention, as a pigment derivative, a pigment derivative having excellent visible transparency (hereinafter, also referred to as a transparent pigment derivative) can also be contained. The maximum molar absorption coefficient (εmax) of the transparent pigment derivative in the wavelength region of 400 to 700 nm is preferably 3000L･mol ^-1 ･cm ^-1 or less, and more preferably 1000L･mol ^-1 ･cm ^-1 or less Preferably, 100L･mol ^-1 ･cm ^-1 or less is more preferable. The lower limit of εmax is, for example, 1L･mol ^-1 ･cm ^-1 or more, and may be 10L･mol ^-1 ･cm ^-1 or more.

Specific examples of pigment derivatives include the compounds described in paragraphs 0162 to 0183 of Japanese Patent Application Publication No. 2011-252065, the compounds described in Japanese Patent Application Publication No. 2003-081972, and Japanese Patent No. 5299151 The compound described in the bulletin.

The content of the pigment derivative is preferably 1-30 parts by mass relative to 100 parts by mass of the pigment, and more preferably 3-20 parts by mass. In addition, the total content of the pigment derivative and the colorant is preferably 25% by mass or more in the total solid content of the colored photosensitive composition, more preferably 30% by mass or more, and even more preferably 40% by mass or more. The upper limit is preferably 70% by mass or less, and more preferably 65% by mass or less. The pigment derivative may use only 1 type, and may use 2 or more types together.

＜＜Free radical polymerizable compound＞＞ It is preferable that the colored photosensitive composition contains a radically polymerizable compound. The radically polymerizable compound is preferably a compound having an ethylenically unsaturated bond group. Examples of ethylenically unsaturated bond groups include vinyl groups, (meth)allyl groups, and (meth)acrylic groups.

The polymerizable compound may be in any chemical form such as monomers, prepolymers, and oligomers, but monomers are preferred. The molecular weight of the radical polymerizable compound is preferably 100 to 3000. The upper limit is more preferably 2000 or less, and more preferably 1500 or less. The lower limit is more preferably 150 or more, and more preferably 250 or more.

The radically polymerizable compound is preferably a compound containing 3 or more ethylenically unsaturated bond groups, and a compound containing 3 to 15 ethylenically unsaturated bond groups is more preferred, and contains 3 to 6 ethylenic unsaturated bond groups. The base compound is further preferred. Moreover, it is preferable that the polymerizable compound is a 3-15 functional (meth)acrylate compound, and a 3-6 functional (meth)acrylate compound is more preferable. Specific examples of polymerizable compounds include paragraphs 0095 to 0108 of Japanese Patent Application Publication No. 2009-288705, paragraphs 0227 of Japanese Patent Application Publication No. 2013-029760, and paragraphs 0254 to 0257 of Japanese Patent Application Publication No. 2008-292970. , Japanese Patent Application Publication No. 2013-253224, paragraphs 0034 to 0038, Japanese Patent Application Publication No. 2012-208494, paragraph 0477, Japanese Patent Application Publication No. 2017-048367, Japanese Patent No. 6057891, Japanese Patent No. 6031807, For the compounds described in JP 2017-194662 A, these contents are incorporated in this specification.

As a radically polymerizable compound, dineopentylene erythritol triacrylate (as a commercially available product is KAYARAD D-330; manufactured by Nippon Kayaku Co., Ltd.), and dineopentaerythritol tetraacrylate (as a commercially available product is KAYARAD D-320; manufactured by Nippon Kayaku Co., Ltd.), dineopentyl pentaerythritol penta(meth)acrylate (as commercially available product is KAYARAD D-310; manufactured by Nippon Kayaku Co., Ltd.), Nissin Pentaerythritol hexa(meth)acrylate (as a commercially available product is KAYARADDPHA; manufactured by Nippon Kayaku Co., Ltd., NK Ester A-DPH-12E; manufactured by Shin Nakamura Chemical Co., Ltd.) and these (A A compound having a structure in which a propylene group is bonded via an ethylene glycol and/or propylene glycol residue (for example, SR454 and SR499 sold by SARTOMER) is preferred.

In addition, as a radical polymerizable compound, diglycerol EO (ethylene oxide) modified (meth)acrylate (M-460 as a commercial product; manufactured by TOAGOSEI CO., LTD.), Neopentyl Tetraol tetraacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK ESTER A-TMMT), 1,6-hexanediol diacrylate (manufactured by Nippon Kayaku Co., Ltd., KAYARAD HDDA), RP- 1040 (manufactured by Nippon Kayaku Co., Ltd.), ARONIX TO-2349 (manufactured by TOAGOSEI CO., LTD.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 8UH-1006, 8UH- 1012 (manufactured by TAISEI FINE CHEMICAL CO., LTD.), LIGHT ACRYLATE POB-A0 (manufactured by KYOEISHA CHEMICAL CO., LTD.), etc.

In addition, as the radical polymerizable compound, trimethylolpropane tri(meth)acrylate, trimethylolpropane propylene oxide was used to modify tri(meth)acrylate, trimethylolpropane ethylene oxide Trifunctional (meth)acrylate compounds such as modified tri(meth)acrylate, isocyanuric acid ethylene oxide modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, etc. good. Commercial products of trifunctional (meth)acrylate compounds include ARONIX M-309, M-310, M-321, M-350, M-360, M-313, M-315, M- 306, M-305, M-303, M-452, M-450 (manufactured by TOAGOSEI CO., Ltd.), NK ESTER A9300, A-GLY-9E, A-GLY-20E, A-TMM-3, A -TMM-3L, A-TMM-3LM-N, A-TMPT, TMPT (manufactured by Shin Nakamura Chemical Co., Ltd.), KAYARAD GPO-303, TMPTA, THE-330, TPA-330, PET-30 (Nippon Kayaku Co., Ltd.) etc.

The radically polymerizable compound can also use a compound having an acid group. By using a radically polymerizable compound having an acid group, the colored photosensitive composition layer in the unexposed portion during development can be easily removed, and the occurrence of development residue can be suppressed. As the acid group, a carboxyl group, a sulfo group, a phosphoric acid group, etc. can be mentioned, and a carboxyl group is preferred. Examples of commercially available products of radically polymerizable compounds having acid groups include ARONIX M-305, M-510, M-520, ARONIXTO-2349 (manufactured by TOAGOSEI CO., LTD.), and the like. The preferable acid value of the polymerizable compound having an acid group is 0.1 to 40 mgKOH/g, and more preferably 5 to 30 mgKOH/g. If the acid value of the polymerizable compound is 0.1 mgKOH/g or more, the solubility to the developer is good, and if it is 40 mgKOH/g or less, it is advantageous in terms of production and handling.

It is also preferable that the polymerizable compound is a compound having a caprolactone structure. The polymerizable compound having a caprolactone structure is, for example, sold by Nippon Kayaku Co., Ltd. as the KAYARAD DPCA series, and examples thereof include DPCA-20, DPCA-30, DPCA-60, and DPCA-120.

As the radical polymerizable compound, a radical polymerizable compound having an alkoxy group can also be used. The radically polymerizable compound having an ethyleneoxy group is preferably a radically polymerizable compound having an ethyleneoxy group and/or an ethyleneoxy group, and a radically polymerizable compound having an ethyleneoxy group is more preferred. Preferably, 3 to 6 functional (meth)acrylate compounds having 4 to 20 ethyleneoxy groups are further preferred. Examples of commercially available products of radically polymerizable compounds having ethyleneoxy groups include SR-494 manufactured by Sartomer Company, Inc as a 4-functional (meth)acrylate having 4 ethyleneoxy groups, KAYARAD TPA-330 of trifunctional (meth)acrylate with 3 isobutoxy groups.

As the radically polymerizable compound, a radically polymerizable compound having a 茀 skeleton can also be used. As a commercially available product of a polymerizable compound having a stilbene skeleton, OGSOL EA-0200, EA-0300 (manufactured by Osaka Gas Chemicals Co., Ltd., a (meth)acrylate monomer having a stilbene skeleton) and the like can be mentioned.

As the polymerizable compound, it is also preferable to use a compound that does not substantially contain environmentally regulated substances such as toluene. As commercially available products of these compounds, KAYARAD DPHA LT, KAYARAD DPEA-12 LT (manufactured by Nippon Kayaku Co., Ltd.), and the like can be cited.

As the radically polymerizable compound, for example, amine groups described in Japanese Patent Publication No. 48-041708, Japanese Patent Application Publication No. 51-037193, Japanese Patent Publication No. 02-032293, and Japanese Patent Application Publication No. 02-016765 Formate acrylates or ethylene oxide as described in Japanese Patent Publication No. 58-049860, Japanese Patent Publication No. 56-017654, Japanese Patent Publication No. 62-039417, and Japanese Patent Publication No. 62-039418 Urethane compounds with an alkane-based skeleton are also preferred. In addition, the radical polymerization described in JP-A 63-277653, JP-A 63-260909, and JP-A 01-105238, which has an amino group structure or a thioether structure in the molecule, was used. Sexual compounds are also preferred. In addition, the radical polymerizable compound can also be used UA-7200 (manufactured by Shin-Nakamura Chemical Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA- Commercial products such as 306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by KYOEISHA CHEMICAL CO., LTD.).

The content of the radically polymerizable compound in the total solid content of the colored photosensitive composition is preferably 0.1 to 50% by mass. The lower limit is more preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is more preferably 45% by mass or less, and more preferably 40% by mass or less. The radically polymerizable compound may be used alone or in combination of two or more kinds.

＜＜Light radical polymerization initiator＞＞ The colored photosensitive composition preferably contains a radical photopolymerization initiator. The radical photopolymerization initiator is not particularly limited, and it can be appropriately selected from known radical photopolymerization initiators. For example, a compound having photosensitivity for the pipeline from the ultraviolet region to the visible region is preferable.

As the photoradical polymerization initiator, halogenated hydrocarbon derivatives (for example, compounds having a three-well framework, compounds having an oxadiazole framework, etc.), phosphine compounds, hexaarylbisimidazole, oxime compounds, Organic peroxides, sulfur compounds, ketone compounds, aromatic onium salts, α-hydroxy ketone compounds, α-amino ketone compounds, etc. From the viewpoint of exposure sensitivity, the photo-radical polymerization initiator is selected from the group consisting of trihalomethyl three-well compound, benzyl dimethyl ketal compound, α-hydroxy ketone compound, α-amino ketone compound, and phosphine Compounds, phosphine oxide compounds, metallocene compounds, oxime compounds, triaryl imidazole dimers, onium compounds, benzothiazole compounds, diphenyl ketone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes , Halomethyl oxadiazole compounds and 3-aryl substituted coumarin compounds are preferred, and compounds selected from oxime compounds, α-hydroxy ketone compounds, α-amino ketone compounds and phosphine compounds are more preferred, An oxime compound is further preferred. As the photoradical polymerization initiator, the compounds described in paragraphs 0065 to 0111 of JP 2014-130173 A and Japanese Patent No. 6301489 can be cited, and this content is incorporated in this specification.

As commercially available products of the α-hydroxy ketone compound, IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, IRGACURE-127 (above, made by BASF Corporation), etc. can be mentioned. Examples of commercially available products of the α-amino ketone compound include IRGACURE-907, IRGACURE-369, IRGACURE-379, and IRGACURE-379EG (manufactured by BASF Corporation above). Examples of commercially available products of the phosphine compound include IRGACURE-819, DAROCUR-TPO (the above are made by BASF Corporation), and the like.

Examples of oxime compounds include the compounds described in Japanese Patent Application Publication No. 2001-233842, the compounds described in Japanese Patent Application Publication No. 2000-080068, the compounds described in Japanese Patent Application Publication No. 2006-342166, and JCS Perkin II ( The compound described in 1979, pp.1653-1660), the compound described in JCS Perkin II (1979, pp.156-162), the Journal of Photopolymer Science and Technology (1995, pp.202-232) The compound, the compound described in JP 2000-066385, the compound described in JP 2000-080068, the compound described in JP 2004-534797, the JP 2006-342166 The compound described in JP 2017-019766 A, the compound described in Japanese Patent No. 6065596, the compound described in International Publication No. 2015/152153, the compound described in International Publication No. 2017/051680 The compound described in JP 2017-198865 A, the compound described in Paragraph Nos. 0025 to 0038 of International Publication No. 2017/164127, etc. As specific examples of the oxime compound, 3-benzyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxy Aminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzyl Oxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutyl-2-one and 2-ethoxycarbonyloxyimino-1 -Phenylpropane-1-one, etc. As commercial products, IRGACURE-OXE01, IRGACURE-OXE02, IRGACURE-OXE03, IRGACURE-OXE04 (above, manufactured by BASF Corporation), TR-PBG-304 (manufactured by Changzhou Tronly New Electronic Materials CO., LTD.), ADEKA OPTOMERN-1919 (manufactured by ADEKA CORPORATION, photopolymerization initiator 2 described in JP 2012-014052 A). In addition, as the oxime compound, it is also preferable to use a non-coloring compound or a compound with high transparency and not easy to change color. As a commercially available product, ADEKA ARKLS NCI-730, NCI-831, NCI-930 (above, manufactured by ADEKA CORPORATION), etc. can be mentioned.

In the present invention, as the photoradical polymerization initiator, an oxime compound having a sulphur ring can be used. As a specific example of the oxime compound which has a sulphur ring, the compound described in Unexamined-Japanese-Patent No. 2014-137466 can be mentioned.

In addition, as the photoradical polymerization initiator, an oxime compound in which at least one benzene ring having a carbazole ring becomes the skeleton of the naphthalene ring can also be used. As a specific example of such an oxime compound, the compound described in International Publication No. 2013/083505 can be mentioned.

In the present invention, as the photoradical polymerization initiator, an oxime compound having a fluorine atom can also be used. Specific examples of the oxime compound having a fluorine atom include the compounds described in JP 2010-262028 A, the compounds 24, 36 to 40 described in JP 2014-500852 A, and JP 2013- Compound (C-3) described in 164471 bulletin, etc.

In the present invention, as the photoradical polymerization initiator, an oxime compound having a nitro group can be used. An oxime compound having a nitro group is also preferable as a dimer. Specific examples of oxime compounds having a nitro group include paragraphs 0031 to 0047 of JP 2013-114249 A, and paragraphs 0008 to 0012, 0070 to 0079 of JP 2014-137466. The compound described in paragraph numbers 0007 to 0025 of Japanese Patent No. 4223071, ADEKA ARKLSNCI-831 (manufactured by ADEKA CORPORATION).

In the present invention, as the photopolymerization initiator, an oxime compound having a benzofuran skeleton can also be used. As a specific example, OE-01 to OE-75 described in International Publication No. 2015/036910 can be cited.

Specific examples of oxime compounds preferably used in the present invention are shown below, but the present invention is not limited to these.

[化學式2]

[Chemical formula 1]

[Chemical formula 2]

The oxime compound is preferably a compound having a maximum absorption wavelength in the wavelength range of 350 to 500 nm, and more preferably a compound having a maximum absorption wavelength in the wavelength range of 360 to 480 nm. Also, from the viewpoint of sensitivity, the oxime compound preferably has a high molar absorption coefficient at a wavelength of 365 nm or a wavelength of 405 nm, more preferably 1,000 to 300,000, more preferably 2,000 to 300,000, and particularly preferably 5,000 to 200,000. The molar absorption coefficient of the compound can be measured by a known method. For example, a spectrophotometer (Cary-5 spectrophotometer manufactured by Varian), using ethyl acetate solvent, is preferably measured at a concentration of 0.01 g/L.

As the photoradical polymerization initiator, a bifunctional or trifunctional or more photoradical polymerization initiator can be used. Since two or more radicals are generated from one molecule of the photoradical polymerization initiator by using this kind of photoradical polymerization initiator, good sensitivity can be obtained. In addition, when a compound having an asymmetric structure is used, the crystallinity is lowered and the solubility in solvents and the like is improved, and it becomes difficult to precipitate over time, and the temporal stability of the colored photosensitive composition can be improved. As specific examples of the photoradical polymerization initiators having difunctional or trifunctional or higher functions, Japanese Special Publication No. 2010-527339, Japanese Special Publication No. 2011-524436, International Publication No. 2015/004565, Japanese Special Table 2016-532675, Paragraph Nos. 0412 to 0417, International Publication No. 2017/033680, Paragraph Nos. 0039 to 0055, Dimers of oxime compounds, compounds described in JP 2013-522445 No. (E) and compound (G), Cmpd1-7 described in International Publication No. 2016/034963, oxime ester-based photoinitiator described in Paragraph No. 0007 of Japanese Special Publication No. 2017-523465, Japanese Special The photoinitiator described in paragraph numbers 0020 to 0033 of JP 2017-167399 A, the photopolymerization initiator (A) described in paragraph numbers 0017 to 0026 of JP 2017-151342 A, etc.

The content of the radical photopolymerization initiator in the total solid content of the colored photosensitive composition is preferably 0.1 to 30% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The upper limit is preferably 20% by mass or less, and more preferably 15% by mass or less. Only 1 type may be used for a radical photopolymerization initiator, and 2 or more types may be used for it.

＜＜Resin＞＞ The colored photosensitive composition preferably contains a resin. For example, the resin is blended for the purpose of dispersing particles such as pigments in the colored photosensitive composition or the use of a binder. In addition, resins used mainly to disperse particles such as pigments are also called dispersants. However, this kind of use of resin is an example, and it can also be used for purposes other than these uses.

The weight average molecular weight (Mw) of the resin is preferably 3000-2000000. The upper limit is more preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is more preferably 4000 or more, and more preferably 5000 or more.

Examples of resins include (meth)acrylic resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polyether resins, polyether sulfide resins, polyphenylene resins, and polyarylene resins. Ether phosphine oxide resin, polyimide resin, polyimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, etc. From these resins, one type may be used alone, or two or more types may be mixed and used. In addition, the resins described in paragraph numbers 0041 to 0060 of JP 2017-206689, the resins described in paragraph numbers 0022 to 0071 of JP 2018-010856, and JP 2017-057265 can also be used. The resin described in the publication, the resin described in JP 2017-032685, the resin described in JP 2017-075248, and the resin described in JP 2017-066240.

In the present invention, it is preferable to use a resin having an acid group as the resin. According to this aspect, the developability of the colored photosensitive composition can be improved. As an acid group, a carboxyl group, a phosphoric acid group, a sulfo group, a phenolic hydroxyl group, etc. are mentioned, and a carboxyl group is preferable. A resin having an acid group can be used as an alkali-soluble resin, for example.

The resin with an acid group preferably contains a repeating unit having an acid group on the side chain, and it is more preferable to include 5 to 70 mol% of the repeating unit having an acid group on the side chain in all the repeating units of the resin. The upper limit of the content of the repeating unit having an acid group in the side chain is more preferably 50 mol% or less, and particularly preferably 30 mol% or less. The lower limit of the content of the repeating unit having an acid group in the side chain is more preferably 10 mol% or more, and particularly preferably 20 mol% or more.

As the resin having an acid group, for example, a resin containing repeating units derived from ether dimers described in paragraph numbers 0313 to 0317 of JP 2013-029760 A can be used.

Regarding the resin having an acid group, refer to paragraphs 0558-0571 of JP 2012-208494 (corresponding to paragraphs 0685-0700 of US Patent Application Publication No. 2012/0235099), JP 2012 -The paragraphs 0076 to 0099 of the 198408 Bulletin are incorporated into this manual. Moreover, the resin which has an acid group can also use a commercial item.

The acid value of the resin having an acid group is preferably 30 to 500 mgKOH/g. The lower limit is more preferably 50 mgKOH/g or more, and more preferably 70 mgKOH/g or more. The upper limit is more preferably 400 mgKOH/g or less, more preferably 300 mgKOH/g or less, and particularly preferably 200 mgKOH/g or less. The weight average molecular weight (Mw) of the resin having an acid group is preferably 5,000 to 100,000. In addition, the number average molecular weight (Mn) of the resin having an acid group is preferably 1,000 to 20,000.

The colored photosensitive composition can also contain resin as a dispersant. Examples of the dispersant include acidic dispersants (acidic resins) and basic dispersants (alkaline resins). Here, the acidic dispersant (acidic resin) means a resin having more acid groups than basic groups. The acidic dispersant (acidic resin) is preferably a resin with the amount of acid groups occupies 70 mol% or more when the total amount of acid groups and basic groups is set to 100 mol%, and essentially only contains acid The base resin is better. The acidic carboxyl group of the acidic dispersant (acidic resin) is preferable. The acid value of the acidic dispersant (acid resin) is preferably 40-105 mgKOH/g, more preferably 50-105 mgKOH/g, and still more preferably 60-105 mgKOH/g. In addition, the basic dispersant (basic resin) means a resin in which the amount of basic groups is greater than the amount of acid groups. The alkaline dispersant (alkaline resin) is preferably a resin in which the total amount of the amount of acid groups and the amount of basic groups is 100 mol%, and the amount of basic groups exceeds 50 mol%. The basic amino group possessed by the basic dispersant is preferably.

The resin used as the dispersant preferably contains a repeating unit having an acid group. Since the resin used as a dispersant contains a repeating unit having an acid group, it is possible to further suppress the generation of development residues when patterning by photolithography.

The resin used as the dispersant is also preferably a graft resin. As the graft resin, the resins described in paragraph numbers 0025 to 0094 of JP 2012-255128 A can be cited, and this content is incorporated in this specification.

The resin used as the dispersant is also preferably a polyimine-based dispersant containing a nitrogen atom in at least one of the main chain and the side chain. As a polyimine-based dispersant, it has a main chain and a side chain, the main chain includes a partial structure having a functional group with pKa14 or less, the number of atoms in the side chain is 40 to 10,000, and at least one of the main chain and the side chain A resin having a basic nitrogen atom is preferred. As long as the basic nitrogen atom is a basic nitrogen atom, it is not particularly limited. As the polyimine-based dispersant, the resins described in paragraphs 0102 to 0166 of JP 2012-255128 A can be cited, and the content is incorporated in this specification.

The resin used as the dispersant is also preferably a resin with a structure in which a plurality of polymer chains are bonded to the core. Examples of such resins include dendritic polymers (including star polymers). Moreover, as a specific example of a dendrimer, the polymer compound C-1-C-31 etc. which are described in the paragraph number 0196-0209 of JP 2013-043962 A, etc. are mentioned.

Moreover, the resin (alkali-soluble resin) which has the said acid group can also be used as a dispersing agent.

In addition, the resin used as a dispersant is preferably a resin containing a repeating unit having an ethylenically unsaturated bond group in the side chain. The content of repeating units with ethylenically unsaturated bond groups in the side chain is preferably 10 mol% or more in all repeating units of the resin, 10 to 80 mol% is more preferably, and 20 to 70 mol% is further Better.

The dispersant can also be obtained as a commercially available product. Specific examples of this include the DISPERBYK series manufactured by BYK Chemie GmbH (for example, DISPERBYK-111, 161, etc.), and the SOLSPERSE series manufactured by Lubrizol Japan Limited. (for example, SOLSPERSE76500, etc.) )Wait. In addition, the pigment dispersant described in paragraphs 0041 to 0130 of JP 2014-130338 A can also be used, and this content is incorporated in this specification. In addition, the resin explained as the above-mentioned dispersant can also be used for purposes other than the dispersant. For example, it can also be used as an adhesive.

When the colored photosensitive composition contains a resin, the content of the resin in the total solid content of the colored photosensitive composition is preferably 5 to 50% by mass. The lower limit is more preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is more preferably 40% by mass or less, more preferably 35% by mass or less, and particularly preferably 30% by mass or less. In addition, the content of the resin having an acid group in the total solid content of the colored photosensitive composition is preferably 5 to 50% by mass. The lower limit is more preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is more preferably 40% by mass or less, more preferably 35% by mass or less, and particularly preferably 30% by mass or less. Also, from the viewpoint of the ease of obtaining excellent developability, the content of the acid group-containing resin in the total resin is preferably 30% by mass or more, more preferably 50% by mass or more, and more preferably 70% by mass or more , More than 80% by mass is particularly good The upper limit may be 100% by mass, 95% by mass, or 90% by mass or less.

In addition, from the viewpoints of curability, developability, and film formation properties, the total content of the radical polymerizable compound and the resin in the total solid content of the colored photosensitive composition is preferably 10 to 65% by mass. The lower limit is more preferably 15% by mass or more, more preferably 20% by mass or more, and particularly preferably 30% by mass or more. The upper limit is more preferably 60% by mass or less, more preferably 50% by mass or less, and particularly preferably 40% by mass or less. Moreover, it is preferable to contain 30-300 mass parts of resin with respect to 100 mass parts of polymerizable compounds. The lower limit is more preferably 50 parts by mass or more, and more preferably 80 parts by mass or more. The upper limit is more preferably 250 parts by mass or less, and more preferably 200 parts by mass or less.

＜＜Compounds with cyclic ether groups＞＞ The colored photosensitive composition can contain a compound having a cyclic ether group. As the cyclic ether group, an epoxy group, an oxetanyl group, and the like can be mentioned. The compound having a cyclic ether group is preferably a compound having an epoxy group. Examples of the compound having an epoxy group include a compound having one or more epoxy groups in one molecule, and a compound having two or more epoxy groups is preferred. It is preferable to have 1 to 100 epoxy groups in one molecule. The upper limit of epoxy groups can also be set to, for example, 10 or less, or 5 or less. The lower limit of epoxy groups is more preferably 2 or more. As the compound having an epoxy group, paragraph numbers 0034 to 0036 of JP 2013-011869 A, paragraph numbers 0147 to 0156 of JP 2014-043556 and JP 2014-089408 can also be used. The compound described in paragraph numbers 0085 to 0092 and the compound described in JP 2017-179172 A. These contents are incorporated into this manual.

The compound with epoxy group can be a low molecular compound (for example, less than a molecular weight of 2000, and then less than a molecular weight of 1000), or a macromolecule (for example, a molecular weight of 1000 or more, when it is a polymer, the weight average molecular weight is 1000 or more). The weight average molecular weight of the compound having an epoxy group is preferably 200 to 100,000, and more preferably 500 to 50,000. The upper limit of the weight average molecular weight is more preferably 10000 or less, particularly preferably 5000 or less, and even more preferably 3000 or less.

Examples of commercially available products of compounds having cyclic ether groups include EHPE3150 (manufactured by Daicel Corporation), EPICLON N-695 (manufactured by DIC CORPORATION), MARPROOF G-0150M, G-0105SA, G-0130SP, and G-0250SP , G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, G-01758 (the above are NOF CORPORATION products, epoxy-containing polymers), etc.

When the colored photosensitive composition contains a compound having a cyclic ether group, the content of the compound having a cyclic ether group in the total solid content of the colored photosensitive composition is preferably 0.1 to 20% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. For example, the upper limit is more preferably 15% by mass or less, and more preferably 10% by mass or less. The compound having a cyclic ether group may be only one type or two or more types.

＜＜Silane coupling agent＞＞ The colored photosensitive composition can contain a silane coupling agent. In the present invention, the silane coupling agent refers to a silane compound having a hydrolyzable group and other functional groups. In addition, the hydrolyzable group refers to a substituent capable of directly connecting with a silicon atom and generating a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. As the hydrolyzable group, for example, a halogen atom, an alkoxy group, an acyloxy group, etc. can be mentioned, and an alkoxy group is preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Furthermore, as functional groups other than the hydrolyzable group, for example, vinyl, (meth)allyl, (meth)acryl, mercapto, epoxy, oxetanyl, amino, Urea groups, thioether groups, isocyanate groups, phenyl groups, etc., preferably amino groups, (meth)acrylic groups, and epoxy groups. Specific examples of the silane coupling agent include the compounds described in paragraphs 0018 to 0036 of JP 2009-288703, and the compounds described in paragraphs 0056 to 0066 of JP 2009-242604, and These contents are incorporated into this manual.

The content of the silane coupling agent in the total solid content of the colored photosensitive composition is preferably 0.1 to 5% by mass. The upper limit is preferably 3% by mass or less, and more preferably 2% by mass or less. The lower limit is preferably 0.5% by mass or more, and more preferably 1% by mass or more. The silane coupling agent may be only one type or two or more types.

＜＜Surface active agent＞＞ The colored photosensitive composition can contain a surfactant. As the surfactant, various surfactants such as fluorine-based surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, and silicon-based surfactants can be used. Regarding surfactants, the surfactants described in paragraph numbers 0238 to 0245 of International Publication No. 2015/166779 can be cited, and this content is incorporated in this specification.

The surfactant is preferably a fluorine-based surfactant. By including a fluorine-based surfactant in the colored photosensitive composition, liquid properties (especially, fluidity) can be further improved, and liquid-saving properties can be further improved. In addition, it is also possible to form a film with a small uneven thickness.

上述化合物的重量平均分子量較佳為3000～50000，例如為14000。上述化合物中，表示重複單元的比例之%為莫耳%。Examples of fluorine-based surfactants include those described in paragraphs 0060 to 0064 of JP 2014-041318 (corresponding to paragraphs 0060 to 0064 of International Publication No. 2014/017669), etc., and Japanese The surfactants described in paragraph numbers 0117-0132 of JP 2011-132503 A, and these contents are incorporated into this specification. In addition, the fluorine-containing surfactants or the following compounds described in paragraphs 0016 to 0037 of JP 2010-032698 A are also exemplified as the fluorine-based surfactant used in the present invention. [Chemical formula 3]

The weight average molecular weight of the above compound is preferably 3,000 to 50,000, for example, 14,000. In the above compound, the% representing the proportion of the repeating unit is mole %.

In the total solid content of the colored photosensitive composition, the content of the surfactant is preferably 0.001% to 5.0% by mass, more preferably 0.005 to 3.0% by mass. The surfactant may be only one type or two or more types.

＜＜Ultraviolet absorber＞＞ The colored photosensitive composition can contain an ultraviolet absorber. UV absorbers can use conjugated diene compounds, aminobutadiene compounds, salicylate compounds, diphenyl ketone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyl three-well compounds, and indole compounds , Three Well Compounds, etc. Examples of such compounds include paragraph numbers 0038 to 0052 of Japanese Patent Application Publication No. 2009-217221, paragraph numbers 0052 to 0052 of Japanese Patent Application Publication No. 2012-208374, paragraph numbers 0317 of Japanese Patent Application Publication No. 2013-068814 ～0334, JP 2016-162946 A, Paragraph Nos. 0061 to 0080 of the compound, these contents are incorporated in this specification. As a commercial item of the ultraviolet absorber, UV-503 (made by DAITO CHEMICAL CO., LTD.) etc. are mentioned, for example. Also, as the benzotriazole compound, the MYUA series manufactured by MIYOSHI & FAT CO., LTD. (Chemical Industry Daily, February 1, 2016) can be used. In addition, as the ultraviolet absorber, the compound described in paragraphs 0049 to 0059 of Japanese Patent No. 6268967 can be used.

In the total solid content of the colored photosensitive composition, the content of the ultraviolet absorber is preferably 0.01 to 10% by mass, and more preferably 0.01 to 5% by mass. In the present invention, only one type of ultraviolet absorber may be used, or two or more types may be used.

＜＜Organic solvent＞＞ The colored photosensitive composition preferably contains an organic solvent. Basically, the organic solvent is not particularly limited as long as the solubility of each component and the coatability of the colored photosensitive composition are satisfied. Examples of organic solvents include ester solvents, ketone solvents, alcohol solvents, amide solvents, ether solvents, hydrocarbon solvents, and the like. Regarding these details, the solvents described in paragraph number 0223 of International Publication No. 2015/166779 can be cited, and this content is incorporated into this specification. In addition, an ester solvent substituted with a cyclic alkyl group and a ketone solvent substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, 3-ethoxy methyl propionate, ethyl 3-ethoxy propionate, and ethyl cellosolve acetate. , Ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, cyclohexanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol Acetate, butyl carbitol acetate, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, 3-methoxy-N,N-dimethyl propanamide, 3-butoxy-N , N-Dimethylpropanamide and so on. Among them, for environmental reasons, it may be preferable to reduce aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) as organic solvents (for example, relative to the total amount of organic solvents) It can be set to 50 mass ppm (parts per million: one part per million) or less, can also be set to 10 mass ppm or less, or can be set to 1 mass ppm or less).

The content of the organic solvent in the colored photosensitive composition is preferably 10 to 95% by mass, more preferably 20 to 90% by mass, and more preferably 30 to 90% by mass.

＜＜Other ingredients＞＞ The colored photosensitive composition of the present invention may contain sensitizers, hardening accelerators, fillers, thermosetting accelerators, plasticizers, and other auxiliary agents (for example, conductive particles, fillers, defoamers, Flame retardant, leveling agent, peeling accelerator, fragrance, surface tension regulator, chain transfer agent, etc.). By appropriately containing these components, the physical properties of the film can be adjusted. These ingredients can be referred to, for example, the description of paragraph 0183 and later of Japanese Patent Application Laid-Open No. 2012-003225 (corresponding to paragraph 0237 of US Patent Application Publication No. 2013/0034812), and paragraphs of Japanese Patent Application Publication No. 2008-250074 No. 0101 to 0104, 0107 to 0109, etc., and these contents are incorporated into this specification. Moreover, the colored photosensitive composition may contain a latent antioxidant as needed. As a potential antioxidant, a compound in which the part that functions as an antioxidant is protected by a protective group can be cited. The compound is heated at 100 to 250°C, or in the presence of an acid/base catalyst at a temperature of 80 to 200 It is a compound that functions as an antioxidant by heating at ℃ to release the protective group. Examples of potential antioxidants include compounds described in International Publication No. 2014/021023, International Publication No. 2017/030005, and Japanese Patent Application Publication No. 2017-008219. As a commercially available product of a potential antioxidant, ADEKA ARKLSGPA-5001 (manufactured by ADEKA CORPORATION) and the like can be cited.

＜Method of manufacturing color filter＞ Next, the manufacturing method of the color filter of this invention is demonstrated. The color filter of the present invention includes the above-mentioned method of manufacturing the structure of the present invention. Color filters can be used in solid-state imaging devices such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Film Semiconductor) and image display devices.

＜Method of manufacturing solid-state imaging device＞ The manufacturing method of the solid-state imaging device of the present invention includes the above-mentioned manufacturing method of the structure of the present invention. The structure of the solid-state imaging element is not particularly limited as long as it functions as a solid-state imaging element.

＜Manufacturing method of image display device＞ The manufacturing method of the image display device of the present invention includes the above-mentioned manufacturing method of the structure of the present invention. Examples of the image display device include a liquid crystal display device, an organic electroluminescence display device, and the like. The definition of the image display device and the details of each image display device are described in, for example, "(Akio Sasaki, Kogyo Chosakai Publishing Co., Ltd., published in 1990)", "Display Device (Jun Ibuki) , Sanyo Tosho Publishing Co., Ltd. issued in 1989)” etc. In addition, the liquid crystal display device is described in, for example, "Next Generation Liquid Crystal Display Technology (Edited by Tatsuo Uchida, Kogyo Chosakai Publishing Co., Ltd., published in 1994)". The liquid crystal display device that can be applied to the present invention is not particularly limited. For example, it can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology". [Example]

Hereinafter, the present invention will be further specifically described with examples. The materials, usage amount, ratio, processing content, processing procedure, etc. shown in the following examples can be appropriately changed as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. "Parts" and "%" are quality standards unless otherwise specified. The weight average molecular weight and the number average molecular weight are the polystyrene conversion values measured based on the GPC method as described above.

<Production of support with partition> The following partition formation composition was spin-coated on a silicon wafer with a diameter of 8 inches (20.32cm), and heated at 100°C for 2 minutes using a hot plate, and then at 230°C After heating for 2 minutes, a barrier rib material layer with a thickness of 0.5 μm was formed. A positive photoresist (FFPS-0283, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was spin-coated on the aforementioned barrier rib material layer, and heated at 90° C. for 1 minute to form a photoresist layer with a thickness of 1.0 μm. Next, a KrF scanner exposure machine (FPA6300ES6a, manufactured by Canon Inc.) was used to expose with an exposure energy of 16 J/cm ² through a mask, and then heat treatment was performed at 100° C. for 1 minute. Then, the developer (FHD-5, manufactured by FUJIFILM Electronic Materials Co., Ltd.) was developed for 1 minute, and then heated at 100°C for 1 minute to form a line width of 0.12 μm and a pitch width of 1 μm. Grid-like pattern. Using this pattern as a mask, patterning was performed by dry etching under the conditions described in paragraphs 0129 to 0130 of JP 2016-014856 A, so that the partition wall with a width of 0.1 μm and a height of 0.5 μm was 1 μm The interval of is formed into a grid shape, and the partition wall of the shape shown in Figure 1 and Figure 2 is formed (W1=0.1μm, H1=0.5μm, P1=1μm in Figure 2). The opening size of the partition wall on the silicon wafer (the area of 1 pixel divided by the partition wall on the silicon wafer) is 0.9 μm in length × 0.9 μm in width. Corresponding to the width of the partition wall of 0.1 μm, this embodiment is defined as a pixel size of 1.0 μm.

[Composition for forming partition wall] The composition for forming partition wall was prepared by the following method. First, tetraethoxysilane (TEOS) was prepared as the silane oxide (A), and trifluoropropyltrimethoxysilane (TFPTMS) was prepared as the fluoroalkyl-containing silane oxide (B). When the mass of the silane alkoxide (A) is set to 1, the ratio (mass ratio) of the fluoroalkyl group-containing silane alkoxide (B) becomes 0.6, and these are weighed into a separable flask and mixed , Thereby obtaining a mixture. Propylene glycol monomethyl ether (PGME) was added in an amount of 1.0 part by mass with respect to 1.0 part by mass of the mixture, and stirred at 30° C. for 15 minutes to prepare a first liquid. Also, unlike the first liquid, by adding 1.0 parts by mass of ion-exchanged water and 0.01 parts by mass of formic acid to 1.0 parts by mass of the above mixture and mixing them, the temperature at 30°C The second liquid was prepared by stirring at temperature for 15 minutes. Next, after the first liquid prepared above was maintained at a temperature of 55°C in a water bath, the second liquid was added to the first liquid, and stirred for 60 minutes while maintaining the temperature. Thereby, a solution F containing the hydrolyzate of the above-mentioned silane oxide (A) and the above-mentioned fluoroalkyl group-containing silane oxide (B) was obtained. The solid content concentration of the solution F was 10% by mass in terms of SiO ₂ . Next, in a stainless steel autoclave, the following mixed solution was heated at 120°C for 5 hours. The mixed solution contained 30% by mass of commercially available colloidal silica with an average diameter of 15nm (NISSAN CHEMICAL INDUSTRIES. LTD., product name ST-30) 100 parts by mass of the aqueous dispersion is a mixture obtained by adding 0.1 part by mass of a 30% by mass calcium nitrate aqueous solution. This mixed solution was replaced with propylene glycol monomethyl ether by the ultrafiltration method, and then stirred with a homomixer (manufactured by PRIMIX Corporation) at 14,000 rpm for 30 minutes, and then propylene glycol monomethyl ether was added to obtain a solid content concentration of 15% by mass colloidal silica particle liquid G. 30 parts by mass of the above-mentioned solution F and 70 parts by mass of the above-mentioned colloidal silica particle liquid G were mixed, and then heated at 40° C. for 10 hours, and centrifuged at 1000 G for 10 minutes to remove precipitates to obtain balls The average particle size (the equivalent circular diameter of the projected image of the spherical part measured by a transmission electron microscope (TEM)) is 15nm and that of the colloidal silica particles measured by the dynamic light scattering method Colloidal silica particle liquid P1 with an average particle size of 80nm.

Next, using the colloidal silica particle liquid obtained in the above, each component was mixed into the composition described in the following table to obtain a composition for forming a partition wall. In addition, after preparing the above-mentioned colloidal silica particle liquid and preparing the composition, they were filtered using DFA4201NIEY (0.45 μm nylon filter) manufactured by Nihon Pall Ltd.. [Table 1] Colloidal silica particle liquid Surfactant Solvent Composition for forming partition species P1 F1 PGME PGMEA LC-OH W Blending amount 10 0.02 50 35 4 1

The value of the blending amount described in the above table is parts by mass. In addition, the blending amount of the colloidal silica particle liquid is the amount of SiO ₂ parts in the particle liquid. The value of the blending amount of the solvent is a value obtained by adding up the amount of solvent contained in the colloidal silica particle liquid. The raw materials listed in the above table are as follows.

[溶劑] PGME：丙二醇單甲醚 PGMEA：丙二醇單甲醚乙酸酯 LC-OH：乙醇、甲醇或這些的混合物 W：水(Colloidal silica particle liquid) P1: the above-mentioned colloidal silica particle liquid P1 (surfactant) F1: a compound of the following structure (Mw=14000, the percentage of the repeating unit is represented by mole%) [Chemical formula 4 ]

[Solvent] PGME: propylene glycol monomethyl ether PGMEA: propylene glycol monomethyl ether acetate LC-OH: ethanol, methanol or a mixture of these W: water

<Preparation of colored photosensitive composition> (Green colored photosensitive composition) The following raw materials were mixed and dispersed for 3 hours using a bead mill (diameter of zirconia beads: 0.1 mm) to prepare a pigment dispersion. Then, a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism was used, and the dispersion treatment was carried out under the conditions of a pressure of 2000 kg/cm ³ and a flow rate of 500 g/min. This dispersion treatment was repeated 10 times in total to obtain a pigment dispersion liquid G1. ･PG58 ……8.5 parts by mass ･PY185 …2.9 parts by mass ･Pigment derivative 1 1.6 parts by mass ･Dispersant 1 4.7 parts by mass･PGMEA (propylene glycol monomethyl ether acetate) 82.3 parts by mass

Next, after stirring the mixed liquid mixed with the following raw materials, it filtered with the nylon filter (made by Pall Corporation) with a pore diameter of 0.45 micrometers, and obtained the green coloring photosensitive composition. ･Pigment Dispersion Liquid G1 ... 69.0 parts by mass ･40% by mass PGMEA solution of resin 1 ……1.2 parts by mass ･Polymerizable monomer 1 ……1.1 parts by mass ･Photopolymerization initiator 1 ……0.5 parts by mass ･1% by mass PGMEA solution of surfactant 1 ……4.2 parts by mass ･Ultraviolet absorber 1 ……0.5 parts by mass ･Compound with epoxy group 1 ……0.2 parts by mass ･PGMEA ……23.3 parts by mass

(Red Colored Photosensitive Composition) Using a bead mill (the diameter of the zirconia beads is 0.1 mm), a mixed solution containing the following raw materials was mixed and dispersed for 3 hours to prepare a pigment dispersion. Then, a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism was used, and the dispersion treatment was carried out under the conditions of a pressure of 2000 kg/cm ³ and a flow rate of 500 g/min. This dispersion treatment was repeated 10 times in total to obtain a pigment dispersion liquid R1. ･PR254 10.5 parts by mass･PY139 0.9 parts by mass･Pigment derivative 1 1.6 parts by mass･Dispersant 1 4.7 parts by mass･PGMEA 82.3 parts by mass

Next, after stirring the mixed liquid mixed with the following raw materials, it filtered with the nylon filter (made by Pall Corporation) with a pore diameter of 0.45 micrometers, and obtained the red coloring photosensitive composition. Raw materials of composition: ･Pigment dispersion liquid R1 ... 58.9 parts by mass ･40% by mass PGMEA solution of resin 1 ……2.0 parts by mass ･Polymerizable monomer 1 ……0.9 parts by mass ･Photopolymerization initiator 1 ……0.5 parts by mass ･1% by mass PGMEA solution of surfactant 1 ……4.2 parts by mass ･Ultraviolet absorber 1 ……0.1 parts by mass ･Compound with epoxy group 1 ……0.1 parts by mass ･PGMEA ……33.3 parts by mass

(Blue Colored Photosensitive Composition) Using a bead mill (the diameter of zirconia beads is 0.1 mm), a mixture of the following raw materials was mixed and dispersed for 3 hours to prepare a pigment dispersion. Then, a high-pressure disperser NANO-3000-10 (manufactured by Nippon BEE Co., Ltd.) with a pressure reducing mechanism was used, and the dispersion treatment was carried out under the conditions of a pressure of 2000 kg/cm ³ and a flow rate of 500 g/min. This dispersion treatment was repeated 10 times in total to obtain a pigment dispersion liquid B1. ･PB15:6 9.6 parts by mass･PV23 2.4 parts by mass･Pigment derivative 1 1.0 parts by mass･Dispersant 1 4.7 parts by mass･PGMEA 82.3 parts by mass

Next, after stirring the mixed liquid mixed with the following raw materials, it filtered with the nylon filter (made by Pall Corporation) with a pore diameter of 0.45 micrometers, and obtained the blue coloring photosensitive composition. ･Pigment Dispersion Liquid B1 ……54.1 parts by mass ･40% by mass PGMEA solution of resin 1 ……1.0 parts by mass ･Polymerizable monomer 1 ……0.9 parts by mass ･Photopolymerization initiator 1 ……0.6 parts by mass ･1% by mass PGMEA solution of surfactant 1 ……4.2 parts by mass ･Ultraviolet absorber 1 ……0.1 parts by mass ･Compound with epoxy group 1 ……0.1 parts by mass ･PGMEA ……39.0 parts by mass

･分散劑1:下述結構的樹脂。在主鏈上標記之數值為重複單元的莫耳比，在側鏈上標記之數值為重複單元的數量。Mw=20000。 [化學式6]

The contents of the raw materials used in the colored photosensitive composition are as follows. ･PG58: CIPigment Green 58 ･PY185: CIPigment Yellow 185 ･PR254: CIPigment Red 254 ･PY139: CIPigment Yellow 139 ･PB15:6: CIPigment Blue 15:6 ･PV23: CIPigment Violet 23 ･pigment derivative 1 of the following structure Compound [Chemical Formula 5]

･Dispersant 1: Resin with the following structure. The value marked on the main chain is the molar ratio of the repeating unit, and the value marked on the side chain is the number of the repeating unit. Mw=20000. [Chemical formula 6]

･聚合性單體1：下述結構的化合物 [化學式8]

･光聚合起始劑1：下述結構的化合物 [化學式9]

･界面活性劑1:下述結構的化合物（Mw=14000、表示重複單元的比例之%為莫耳%） [化學式10]

･紫外線吸收劑1:下述結構的化合物 [化學式11]

･Resin 1: Resin with the following structure. The value marked on the main chain is the molar ratio of the repeating unit. Mw=60000. [Chemical formula 7]

･Polymerizable monomer 1: A compound of the following structure [Chemical formula 8]

･Photopolymerization initiator 1: The compound of the following structure [Chemical formula 9]

･Surface active agent 1: A compound of the following structure (Mw=14000, the% representing the proportion of the repeating unit is mole %) [Chemical formula 10]

･Ultraviolet absorber 1: A compound with the following structure [Chemical formula 11]

･Compound with epoxy group 1: EHPE3150 (manufactured by Daicel Corporation, 1,2-epoxy-4-(2-oxiranyl) of 2,2'-bis(hydroxymethyl)-1-butanol) Cyclohexane adduct)

＜Manufacture of structure＞ The colored photosensitive composition described in the following table was spin-coated on the support with the partition wall prepared as above, and heated at 100°C for 2 minutes using a hot plate to form a colored photosensitive composition with a film thickness of 0.6μm Floor. Next, a reduction projection type stepper (i-ray stepper FPA5510iZs, manufactured by Canon Inc.) capable of controlling oxygen concentration was used, and exposure was performed under the exposure conditions shown below through the mask shown below. Next, a 0.3% by mass aqueous solution of tetramethylammonium hydroxide (TMAH) was used to perform spin immersion development at 23°C for 60 seconds. Then, it is rinsed with a rotating spray, and further rinsed with pure water. Next, using a hot plate, it was heated at 200°C for 5 minutes to form a pattern to form a pixel, and a structure was manufactured.

(Mask used) Mask 1: The opening of 1.9μm square is masked by the Bayer array, and the binary mask with the opening 25 shown in Fig. 5 and Fig. 11 (a mask with an opening of 4 pixels) Mask 2: The 1.9μm square opening is masked by the Bayer array (a mask with 4 pixel openings), and the opening 25a is formed with a light-shielding portion 22 (line Width (W10 in Figure 12) = 0.10μm) binary mask. The line width of the light shielding part is 1.0 times the line width of the partition wall. Mask 3: The 1.9μm square opening is masked by the Bayer array (a mask with 4 pixel openings), and the opening 25a is formed with a light-shielding portion 22 (line Width (W10 in Figure 12) = 0.20μm) binary mask. The line width of the shading part is 2.0 times the line width of the partition wall. Mask 4: The opening of 1.9μm square is masked by the Bayer array (a mask with an opening of 4 pixels), and the opening 25a is formed with a light-shielding portion 22 (line Width (W10 in Figure 12) = 0.30μm) binary mask. The line width of the shading part is 3.0 times the line width of the partition wall. Mask 5: The opening of 1.9μm square is masked by the Bayer array (a mask with an opening of 4 pixels), and the opening 25a is formed with a light-shielding portion 22 (line Width (W10 in Figure 12) = 0.35μm) binary mask. The line width of the shading part is 3.5 times the line width of the partition wall. Mask 6: The opening of 1.9μm square is masked by the Bayer array (a mask with an opening of 4 pixels), and the opening 25a is formed with a light-shielding portion 22 (line Width (W10 in Figure 12) = 0.50μm) binary mask. The line width of the light-shielding part is 5.0 times the line width of the partition wall.

11 is a cross-sectional view of the mask 1, and FIG. 12 is a cross-sectional view of the masks 2-6. In Figure 11 and Figure 12, the size of the partition is marked together. The pitch of the partition walls is 1.0 μm, and the area for two pixels is 2.0 μm. The overlap was adjusted so that the edge of the opening of each mask was set on the center line of the partition wall.

(Exposure conditions) Illumination conditions: NA/σ=0.57/0.50 Exposure illuminance: 7500W/m ² , 10000W/m ² , 20000W/m ² , 30000W/m ² , 36000W/m ² Exposure energy: 100mJ/cm ² , 200mJ /cm ² , 400mJ/cm ² , 600mJ/cm ² , 800mJ/cm ² , 1000mJ/cm ² Oxygen concentration: 22% by volume, 30% by volume, 40% by volume, 50% by volume, 55% by volume

＜Evaluation 1＞ Regarding the obtained structure, a length measuring SEM (Critical Dimension-Scanning Electron Microscope) (manufactured by Hitachi High-Technologies Corporation, S9260A) was used to observe the pixels formed at a magnification of 30,000 times. surface. The observation area is the center of the wafer and the vicinity of the notch of the wafer. The evaluation was performed based on the following criteria. A: The partition between the pixels is exposed from the pixels and each pixel is sufficiently separated by the partition. There is no residue on the partition, no voids are generated in the partition, and pixels of the target size are formed. B: The partition between the pixels is exposed from the pixels and each pixel is sufficiently separated by the partition, there is no residue on the partition, and a minute gap occurs in the corner portion of the pixel (the edge of the corner of the pattern). There is no problem level in practical application. C: The partition between the pixels is exposed from the pixels and each pixel is separated by the partition, but there is a little residue on the partition. There is no problem level in practical application. D: There are residues of some components on the partition wall, or there is a gap between the pixel and the partition wall. E: No pixels are formed. Or, the partition wall is buried in the pixel, and the pixel cannot be separated. Or, the thickness of the pixel formed between the partition walls is too thin, and the pixel of the target size cannot be formed.

＜Evaluation 2＞ The cross section of the obtained structure was observed under the condition of 30,000 times magnification using SEM (manufactured by Hitachi High-Technologies Corporation, S4800A), and the height of the partition wall (H1 in FIG. 8) and the adjacent The absolute value (ΔH) of the difference between the height of the pixel of the neighboring wall (H2 in Fig. 9), and the maximum value of ΔH was obtained. The evaluation was performed based on the following criteria. A: The maximum value of ΔH is 0.05 μm or less. B: The maximum value of ΔH is greater than 0.05 μm.

[Table 2] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 1-1 Green colored photosensitive composition Mask 1 twenty two 7500 100 C A Manufacturing example 1-2 Green colored photosensitive composition Mask 1 30 7500 100 A B Manufacturing example 1-3 Green colored photosensitive composition Mask 1 30 7500 200 A A Manufacturing example 1-4 Green colored photosensitive composition Mask 1 30 7500 400 A A Manufacturing example 1-5 Green colored photosensitive composition Mask 1 30 7500 600 C A Manufacturing example 1-6 Green colored photosensitive composition Mask 1 30 10000 100 C A Manufacturing example 1-7 Green colored photosensitive composition Mask 1 30 10000 200 B A Manufacturing example 1-8 Green colored photosensitive composition Mask 1 30 10000 400 A A Manufacturing example 1-9 Green colored photosensitive composition Mask 1 30 10000 600 A A Manufacturing example 1-10 Green colored photosensitive composition Mask 1 30 10000 800 B A Manufacturing example 1-11 Green colored photosensitive composition Mask 1 30 10000 1000 B A Manufacturing example 1-12 Green colored photosensitive composition Mask 1 30 20000 100 C A Manufacturing example 1-13 Green colored photosensitive composition Mask 1 30 20000 200 B A Manufacturing example 1-14 Green colored photosensitive composition Mask 1 30 20000 400 C A Manufacturing example 1-15 Green colored photosensitive composition Mask 1 30 20000 600 B A Manufacturing example 1-16 Green colored photosensitive composition Mask 1 30 20000 800 B B Manufacturing example 1-17 Green colored photosensitive composition Mask 1 30 20000 1000 C B Manufacturing example 1-18 Green colored photosensitive composition Mask 1 30 30000 200 C B Manufacturing example 1-19 Green colored photosensitive composition Mask 1 30 30000 800 C B Manufacturing example 1-20 Green colored photosensitive composition Mask 1 30 30000 1000 B B Manufacturing example 1-21 Green colored photosensitive composition Mask 1 40 7500 400 A B Manufacturing example 1-22 Green colored photosensitive composition Mask 1 40 7500 600 A A Manufacturing example 1-23 Green colored photosensitive composition Mask 1 40 7500 800 A A Manufacturing example 1-24 Green colored photosensitive composition Mask 1 40 7500 1000 A A Manufacturing example 1-25 Green colored photosensitive composition Mask 1 40 10000 100 A B Manufacturing example 1-26 Green colored photosensitive composition Mask 1 40 10000 200 A A Manufacturing example 1-27 Green colored photosensitive composition Mask 1 40 10000 400 A A Manufacturing example 1-28 Green colored photosensitive composition Mask 1 40 10000 600 A A Manufacturing example 1-29 Green colored photosensitive composition Mask 1 40 10000 800 A A Manufacturing example 1-30 Green colored photosensitive composition Mask 1 40 10000 1000 A A Manufacturing example 1-31 Green colored photosensitive composition Mask 1 40 20000 100 B A Manufacturing example 1-32 Green colored photosensitive composition Mask 1 40 20000 200 B A Manufacturing example 1-33 Green colored photosensitive composition Mask 1 40 20000 400 A A Manufacturing example 1-34 Green colored photosensitive composition Mask 1 40 20000 600 A A Manufacturing example 1-35 Green colored photosensitive composition Mask 1 40 20000 800 C B Manufacturing example 1-36 Green colored photosensitive composition Mask 1 40 20000 1000 C B Manufacturing example 1-37 Green colored photosensitive composition Mask 1 40 30000 100 C A Manufacturing example 1-38 Green colored photosensitive composition Mask 1 40 30000 200 C B Manufacturing example 1-39 Green colored photosensitive composition Mask 1 40 30000 400 B B Manufacturing example 1-40 Green colored photosensitive composition Mask 1 40 30000 600 B B Manufacturing example 1-41 Green colored photosensitive composition Mask 1 40 36000 200 C B Manufacturing example 1-42 Green colored photosensitive composition Mask 1 40 36000 400 C B Manufacturing example 1-43 Green colored photosensitive composition Mask 1 50 7500 800 B A Manufacturing example 1-44 Green colored photosensitive composition Mask 1 50 7500 1000 B A Manufacturing example 1-45 Green colored photosensitive composition Mask 1 50 10000 400 A A Manufacturing example 1-46 Green colored photosensitive composition Mask 1 50 10000 600 A A Manufacturing example 1-47 Green colored photosensitive composition Mask 1 50 10000 800 A A Manufacturing example 1-48 Green colored photosensitive composition Mask 1 50 10000 1000 A A Manufacturing example 1-49 Green colored photosensitive composition Mask 1 50 20000 200 A A Manufacturing example 1-50 Green colored photosensitive composition Mask 1 50 20000 400 A A

[table 3] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 1-51 Green colored photosensitive composition Mask 1 50 20000 600 A A Manufacturing example 1-52 Green colored photosensitive composition Mask 1 50 20000 800 C A Manufacturing example 1-53 Green colored photosensitive composition Mask 1 50 20000 1000 C B Manufacturing example 1-54 Green colored photosensitive composition Mask 1 50 30000 100 B A Manufacturing example 1-55 Green colored photosensitive composition Mask 1 50 30000 200 B A Manufacturing example 1-56 Green colored photosensitive composition Mask 1 50 30000 400 B A Manufacturing example 1-57 Green colored photosensitive composition Mask 1 50 30000 600 B B Manufacturing example 1-58 Green colored photosensitive composition Mask 1 50 36000 100 C A Manufacturing example 1-59 Green colored photosensitive composition Mask 1 50 36000 200 C B Manufacturing example 1-60 Green colored photosensitive composition Mask 1 50 36000 400 C B Manufacturing example 1-61 Green colored photosensitive composition Mask 1 50 36000 600 C B Manufacturing example 1-62 Green colored photosensitive composition Mask 1 55 7500 800 B B Manufacturing example 1-63 Green colored photosensitive composition Mask 1 55 7500 1000 B A Manufacturing example 1-64 Green colored photosensitive composition Mask 1 55 10000 400 A B Manufacturing example 1-65 Green colored photosensitive composition Mask 1 55 10000 600 A A Manufacturing example 1-66 Green colored photosensitive composition Mask 1 55 10000 800 B A Manufacturing example 1-67 Green colored photosensitive composition Mask 1 55 10000 1000 C A Manufacturing example 1-68 Green colored photosensitive composition Mask 1 55 20000 400 A A Manufacturing example 1-69 Green colored photosensitive composition Mask 1 55 20000 600 B A Manufacturing example 1-70 Green colored photosensitive composition Mask 1 55 20000 800 C A Manufacturing example 1-71 Green colored photosensitive composition Mask 1 55 30000 200 B A Manufacturing example 1-72 Green colored photosensitive composition Mask 1 55 30000 400 C A Manufacturing example 1-73 Green colored photosensitive composition Mask 1 55 30000 600 C B Manufacturing example 1-74 Green colored photosensitive composition Mask 1 55 36000 200 C A

[Table 4] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 2-1 Green colored photosensitive composition Mask 2 twenty two 7500 100 B A Manufacturing example 2-2 Green colored photosensitive composition Mask 2 twenty two 7500 200 C A Manufacturing example 2-3 Green colored photosensitive composition Mask 2 twenty two 10000 100 C A Manufacturing example 2-4 Green colored photosensitive composition Mask 2 twenty two 10000 200 C A Manufacturing example 2-5 Green colored photosensitive composition Mask 2 twenty two 10000 400 C A Manufacturing example 2-6 Green colored photosensitive composition Mask 2 30 7500 100 A B Manufacturing example 2-7 Green colored photosensitive composition Mask 2 30 7500 200 A A Manufacturing example 2-8 Green colored photosensitive composition Mask 2 30 7500 400 A A Manufacturing example 2-9 Green colored photosensitive composition Mask 2 30 7500 600 A A Manufacturing example 2-10 Green colored photosensitive composition Mask 2 30 10000 100 B A Manufacturing example 2-11 Green colored photosensitive composition Mask 2 30 10000 200 B A Manufacturing example 2-12 Green colored photosensitive composition Mask 2 30 10000 400 A A Manufacturing example 2-13 Green colored photosensitive composition Mask 2 30 10000 600 A A Manufacturing example 2-14 Green colored photosensitive composition Mask 2 30 10000 800 B A Manufacturing example 2-15 Green colored photosensitive composition Mask 2 30 10000 1000 B A Manufacturing example 2-16 Green colored photosensitive composition Mask 2 30 20000 100 C A Manufacturing example 2-17 Green colored photosensitive composition Mask 2 30 20000 200 B A Manufacturing example 2-18 Green colored photosensitive composition Mask 2 30 20000 400 C A Manufacturing example 2-19 Green colored photosensitive composition Mask 2 30 20000 600 B A Manufacturing example 2-20 Green colored photosensitive composition Mask 2 30 20000 800 B B Manufacturing example 2-21 Green colored photosensitive composition Mask 2 30 20000 1000 C B Manufacturing example 2-22 Green colored photosensitive composition Mask 2 30 30000 200 C B Manufacturing example 2-23 Green colored photosensitive composition Mask 2 30 30000 800 C B Manufacturing example 2-24 Green colored photosensitive composition Mask 2 30 30000 1000 B B Manufacturing example 2-25 Green colored photosensitive composition Mask 2 40 7500 400 A B Manufacturing example 2-26 Green colored photosensitive composition Mask 2 40 7500 600 A A Manufacturing example 2-27 Green colored photosensitive composition Mask 2 40 7500 800 A A Manufacturing example 2-28 Green colored photosensitive composition Mask 2 40 7500 1000 A A Manufacturing example 2-29 Green colored photosensitive composition Mask 2 40 10000 100 A B Manufacturing example 2-30 Green colored photosensitive composition Mask 2 40 10000 200 A A Manufacturing example 2-31 Green colored photosensitive composition Mask 2 40 10000 400 A A Manufacturing example 2-32 Green colored photosensitive composition Mask 2 40 10000 600 A A Manufacturing example 2-33 Green colored photosensitive composition Mask 2 40 10000 800 A A Manufacturing example 2-34 Green colored photosensitive composition Mask 2 40 10000 1000 A A Manufacturing example 2-35 Green colored photosensitive composition Mask 2 40 20000 100 B A Manufacturing example 2-36 Green colored photosensitive composition Mask 2 40 20000 200 B A Manufacturing example 2-37 Green colored photosensitive composition Mask 2 40 20000 400 A A Manufacturing example 2-38 Green colored photosensitive composition Mask 2 40 20000 600 A A Manufacturing example 2-39 Green colored photosensitive composition Mask 2 40 20000 800 B B Manufacturing example 2-40 Green colored photosensitive composition Mask 2 40 20000 1000 B B Manufacturing example 2-41 Green colored photosensitive composition Mask 2 40 30000 100 C A Manufacturing example 2-42 Green colored photosensitive composition Mask 2 40 30000 200 C B Manufacturing example 2-43 Green colored photosensitive composition Mask 2 40 30000 400 A B Manufacturing example 2-44 Green colored photosensitive composition Mask 2 40 30000 600 B B Manufacturing example 2-45 Green colored photosensitive composition Mask 2 40 36000 200 C B Manufacturing example 2-46 Green colored photosensitive composition Mask 2 40 36000 400 C B Manufacturing example 2-47 Green colored photosensitive composition Mask 2 40 36000 600 C B Manufacturing example 2-48 Green colored photosensitive composition Mask 2 50 7500 800 B A Manufacturing example 2-49 Green colored photosensitive composition Mask 2 50 7500 1000 B A Manufacturing example 2-50 Green colored photosensitive composition Mask 2 50 10000 200 C A

[table 5] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 2-51 Green colored photosensitive composition Mask 2 50 10000 400 A A Manufacturing example 2-52 Green colored photosensitive composition Mask 2 50 10000 600 A A Manufacturing example 2-53 Green colored photosensitive composition Mask 2 50 10000 800 A A Manufacturing example 2-54 Green colored photosensitive composition Mask 2 50 10000 1000 A A Manufacturing example 2-55 Green colored photosensitive composition Mask 2 50 20000 200 A A Manufacturing example 2-56 Green colored photosensitive composition Mask 2 50 20000 400 A A Manufacturing example 2-57 Green colored photosensitive composition Mask 2 50 20000 600 A A Manufacturing example 2-58 Green colored photosensitive composition Mask 2 50 20000 800 B A Manufacturing example 2-59 Green colored photosensitive composition Mask 2 50 20000 1000 B B Manufacturing example 2-60 Green colored photosensitive composition Mask 2 50 30000 100 B A Manufacturing example 2-61 Green colored photosensitive composition Mask 2 50 30000 200 B A Manufacturing example 2-62 Green colored photosensitive composition Mask 2 50 30000 400 B A Manufacturing example 2-63 Green colored photosensitive composition Mask 2 50 30000 600 B B Manufacturing example 2-64 Green colored photosensitive composition Mask 2 50 36000 100 C A Manufacturing example 2-65 Green colored photosensitive composition Mask 2 50 36000 200 C B Manufacturing example 2-66 Green colored photosensitive composition Mask 2 50 36000 400 C B Manufacturing example 2-67 Green colored photosensitive composition Mask 2 50 36000 600 C B Manufacturing example 2-68 Green colored photosensitive composition Mask 2 55 7500 800 B B Manufacturing example 2-69 Green colored photosensitive composition Mask 2 55 7500 1000 B A Manufacturing example 2-70 Green colored photosensitive composition Mask 2 55 10000 400 A B Manufacturing example 2-71 Green colored photosensitive composition Mask 2 55 10000 600 A A Manufacturing example 2-72 Green colored photosensitive composition Mask 2 55 10000 800 A A Manufacturing example 2-73 Green colored photosensitive composition Mask 2 55 10000 1000 B A Manufacturing example 2-74 Green colored photosensitive composition Mask 2 55 20000 400 A A Manufacturing example 2-75 Green colored photosensitive composition Mask 2 55 20000 600 B A Manufacturing example 2-76 Green colored photosensitive composition Mask 2 55 20000 800 B A Manufacturing example 2-77 Green colored photosensitive composition Mask 2 55 30000 200 B A Manufacturing example 2-78 Green colored photosensitive composition Mask 2 55 30000 400 C A Manufacturing example 2-79 Green colored photosensitive composition Mask 2 55 30000 600 C B Manufacturing example 2-80 Green colored photosensitive composition Mask 2 55 36000 200 C A

[Table 6] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 3-1 Green colored photosensitive composition Mask 3 twenty two 7500 100 B A Manufacturing example 3-2 Green colored photosensitive composition Mask 3 twenty two 7500 200 C A Manufacturing example 3-3 Green colored photosensitive composition Mask 3 twenty two 10000 100 C A Manufacturing example 3-4 Green colored photosensitive composition Mask 3 twenty two 10000 200 C A Manufacturing example 3-5 Green colored photosensitive composition Mask 3 30 7500 100 A B Manufacturing example 3-6 Green colored photosensitive composition Mask 3 30 7500 200 A A Manufacturing example 3-7 Green colored photosensitive composition Mask 3 30 7500 400 A A Manufacturing example 3-8 Green colored photosensitive composition Mask 3 30 7500 600 A A Manufacturing example 3-9 Green colored photosensitive composition Mask 3 30 10000 100 B A Manufacturing example 3-10 Green colored photosensitive composition Mask 3 30 10000 200 B A Manufacturing example 3-11 Green colored photosensitive composition Mask 3 30 10000 400 A A Manufacturing example 3-12 Green colored photosensitive composition Mask 3 30 10000 600 A A Manufacturing example 3-13 Green colored photosensitive composition Mask 3 30 10000 800 B A Manufacturing example 3-14 Green colored photosensitive composition Mask 3 30 10000 1000 B A Manufacturing example 3-15 Green colored photosensitive composition Mask 3 30 20000 100 C A Manufacturing example 3-16 Green colored photosensitive composition Mask 3 30 20000 200 B A Manufacturing example 3-17 Green colored photosensitive composition Mask 3 30 20000 400 C A Manufacturing example 3-18 Green colored photosensitive composition Mask 3 30 20000 600 B A Manufacturing example 3-19 Green colored photosensitive composition Mask 3 30 20000 800 B B Manufacturing example 3-20 Green colored photosensitive composition Mask 3 30 20000 1000 C B Manufacturing example 3-21 Green colored photosensitive composition Mask 3 30 30000 200 C B Manufacturing example 3-22 Green colored photosensitive composition Mask 3 30 30000 800 C B Manufacturing example 3-23 Green colored photosensitive composition Mask 3 30 30000 1000 B B Manufacturing example 3-24 Green colored photosensitive composition Mask 3 40 7500 400 A B Manufacturing example 3-25 Green colored photosensitive composition Mask 3 40 7500 600 A A Manufacturing example 3-26 Green colored photosensitive composition Mask 3 40 7500 800 A A Manufacturing example 3-27 Green colored photosensitive composition Mask 3 40 7500 1000 A A Manufacturing example 3-28 Green colored photosensitive composition Mask 3 40 10000 100 A B Manufacturing example 3-29 Green colored photosensitive composition Mask 3 40 10000 200 A A Manufacturing example 3-30 Green colored photosensitive composition Mask 3 40 10000 400 A A Manufacturing example 3-31 Green colored photosensitive composition Mask 3 40 10000 600 A A Manufacturing example 3-32 Green colored photosensitive composition Mask 3 40 10000 800 A A Manufacturing example 3-33 Green colored photosensitive composition Mask 3 40 10000 1000 A A Manufacturing example 3-34 Green colored photosensitive composition Mask 3 40 20000 100 B A Manufacturing example 3-35 Green colored photosensitive composition Mask 3 40 20000 200 B A Manufacturing example 3-36 Green colored photosensitive composition Mask 3 40 20000 400 A A Manufacturing example 3-37 Green colored photosensitive composition Mask 3 40 20000 600 A A Manufacturing example 3-38 Green colored photosensitive composition Mask 3 40 20000 800 B B Manufacturing example 3-39 Green colored photosensitive composition Mask 3 40 20000 1000 B B Manufacturing example 3-40 Green colored photosensitive composition Mask 3 40 30000 100 C A Manufacturing example 3-41 Green colored photosensitive composition Mask 3 40 30000 200 C B Manufacturing example 3-42 Green colored photosensitive composition Mask 3 40 30000 400 A B Manufacturing example 3-43 Green colored photosensitive composition Mask 3 40 30000 600 B B Manufacturing example 3-44 Green colored photosensitive composition Mask 3 40 36000 200 C B Manufacturing example 3-45 Green colored photosensitive composition Mask 3 40 36000 400 C B Manufacturing example 3-46 Green colored photosensitive composition Mask 3 40 36000 600 C B Manufacturing example 3-47 Green colored photosensitive composition Mask 3 50 7500 800 B A Manufacturing example 3-48 Green colored photosensitive composition Mask 3 50 7500 1000 B A Manufacturing example 3-49 Green colored photosensitive composition Mask 3 50 10000 200 C A Manufacturing example 3-50 Green colored photosensitive composition Mask 3 50 10000 400 A A

[Table 7] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 3-51 Green colored photosensitive composition Mask 3 50 10000 600 A A Manufacturing example 3-52 Green colored photosensitive composition Mask 3 50 10000 800 A A Manufacturing example 3-53 Green colored photosensitive composition Mask 3 50 10000 1000 A A Manufacturing example 3-54 Green colored photosensitive composition Mask 3 50 20000 200 A A Manufacturing example 3-55 Green colored photosensitive composition Mask 3 50 20000 400 A A Manufacturing example 3-56 Green colored photosensitive composition Mask 3 50 20000 600 A A Manufacturing example 3-57 Green colored photosensitive composition Mask 3 50 20000 800 B A Manufacturing example 3-58 Green colored photosensitive composition Mask 3 50 20000 1000 B B Manufacturing example 3-59 Green colored photosensitive composition Mask 3 50 30000 100 B A Manufacturing example 3-60 Green colored photosensitive composition Mask 3 50 30000 200 B A Manufacturing example 3-61 Green colored photosensitive composition Mask 3 50 30000 400 B A Manufacturing example 3-62 Green colored photosensitive composition Mask 3 50 30000 600 B B Manufacturing example 3-63 Green colored photosensitive composition Mask 3 50 36000 100 C A Manufacturing example 3-64 Green colored photosensitive composition Mask 3 50 36000 200 C B Manufacturing example 3-65 Green colored photosensitive composition Mask 3 50 36000 400 C B Manufacturing example 3-66 Green colored photosensitive composition Mask 3 50 36000 600 C B Manufacturing example 3-67 Green colored photosensitive composition Mask 3 55 7500 800 B B Manufacturing example 3-68 Green colored photosensitive composition Mask 3 55 7500 1000 B A Manufacturing example 3-69 Green colored photosensitive composition Mask 3 55 10000 400 A B Manufacturing example 3-70 Green colored photosensitive composition Mask 3 55 10000 600 A A Manufacturing example 3-71 Green colored photosensitive composition Mask 3 55 10000 800 A A Manufacturing example 3-72 Green colored photosensitive composition Mask 3 55 10000 1000 B A Manufacturing example 3-73 Green colored photosensitive composition Mask 3 55 20000 400 A A Manufacturing example 3-74 Green colored photosensitive composition Mask 3 55 20000 600 B A Manufacturing example 3-75 Green colored photosensitive composition Mask 3 55 20000 800 B A Manufacturing example 3-76 Green colored photosensitive composition Mask 3 55 30000 200 B A Manufacturing example 3-77 Green colored photosensitive composition Mask 3 55 30000 400 C A Manufacturing example 3-78 Green colored photosensitive composition Mask 3 55 30000 600 C B Manufacturing example 3-79 Green colored photosensitive composition Mask 3 55 36000 200 C A

[Table 8] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 4-1 Green colored photosensitive composition Mask 4 twenty two 7500 200 B A Manufacturing example 4-2 Green colored photosensitive composition Mask 4 twenty two 7500 400 B A Manufacturing example 4-3 Green colored photosensitive composition Mask 4 twenty two 7500 600 B A Manufacturing example 4-4 Green colored photosensitive composition Mask 4 twenty two 7500 800 C A Manufacturing example 4-5 Green colored photosensitive composition Mask 4 twenty two 10000 100 B A Manufacturing example 4-6 Green colored photosensitive composition Mask 4 twenty two 10000 200 C A Manufacturing example 4-7 Green colored photosensitive composition Mask 4 twenty two 10000 400 B A Manufacturing example 4-8 Green colored photosensitive composition Mask 4 twenty two 10000 600 C A Manufacturing example 4-9 Green colored photosensitive composition Mask 4 twenty two 20000 400 C B Manufacturing example 4-10 Green colored photosensitive composition Mask 4 30 7500 400 A A Manufacturing example 4-11 Green colored photosensitive composition Mask 4 30 7500 600 A A Manufacturing example 4-12 Green colored photosensitive composition Mask 4 30 7500 800 A A Manufacturing example 4-13 Green colored photosensitive composition Mask 4 30 7500 1000 A A Manufacturing example 4-14 Green colored photosensitive composition Mask 4 30 10000 200 A A Manufacturing example 4-15 Green colored photosensitive composition Mask 4 30 10000 400 A A Manufacturing example 4-16 Green colored photosensitive composition Mask 4 30 10000 600 A A Manufacturing example 4-17 Green colored photosensitive composition Mask 4 30 10000 800 A A Manufacturing example 4-18 Green colored photosensitive composition Mask 4 30 10000 1000 B A Manufacturing example 4-19 Green colored photosensitive composition Mask 4 30 20000 100 C A Manufacturing example 4-20 Green colored photosensitive composition Mask 4 30 20000 200 B A Manufacturing example 4-21 Green colored photosensitive composition Mask 4 30 20000 400 A A Manufacturing example 4-22 Green colored photosensitive composition Mask 4 30 20000 600 B A Manufacturing example 4-23 Green colored photosensitive composition Mask 4 30 20000 800 B B Manufacturing example 4-24 Green colored photosensitive composition Mask 4 30 20000 1000 C B Manufacturing example 4-25 Green colored photosensitive composition Mask 4 30 30000 200 B B Manufacturing example 4-26 Green colored photosensitive composition Mask 4 30 30000 400 B B Manufacturing example 4-27 Green colored photosensitive composition Mask 4 30 30000 800 C B Manufacturing example 4-28 Green colored photosensitive composition Mask 4 30 30000 1000 B B Manufacturing example 4-29 Green colored photosensitive composition Mask 4 40 7500 600 A A Manufacturing example 4-30 Green colored photosensitive composition Mask 4 40 7500 800 A A Manufacturing example 4-31 Green colored photosensitive composition Mask 4 40 7500 1000 A A Manufacturing example 4-32 Green colored photosensitive composition Mask 4 40 10000 200 A A Manufacturing example 4-33 Green colored photosensitive composition Mask 4 40 10000 400 A A Manufacturing example 4-34 Green colored photosensitive composition Mask 4 40 10000 600 A A Manufacturing example 4-35 Green colored photosensitive composition Mask 4 40 10000 800 A A Manufacturing example 4-36 Green colored photosensitive composition Mask 4 40 10000 1000 A A Manufacturing example 4-37 Green colored photosensitive composition Mask 4 40 20000 100 A A Manufacturing example 4-38 Green colored photosensitive composition Mask 4 40 20000 200 A A Manufacturing example 4-39 Green colored photosensitive composition Mask 4 40 20000 400 A A Manufacturing example 4-40 Green colored photosensitive composition Mask 4 40 20000 600 A A Manufacturing example 4-41 Green colored photosensitive composition Mask 4 40 20000 800 A B Manufacturing example 4-42 Green colored photosensitive composition Mask 4 40 20000 1000 B B Manufacturing example 4-43 Green colored photosensitive composition Mask 4 40 30000 100 B A Manufacturing example 4-44 Green colored photosensitive composition Mask 4 40 30000 200 C B Manufacturing example 4-45 Green colored photosensitive composition Mask 4 40 30000 400 B B Manufacturing example 4-46 Green colored photosensitive composition Mask 4 40 30000 600 B B Manufacturing example 4-47 Green colored photosensitive composition Mask 4 40 36000 200 C B Manufacturing example 4-48 Green colored photosensitive composition Mask 4 40 36000 400 C B Manufacturing example 4-49 Green colored photosensitive composition Mask 4 40 36000 600 C B Manufacturing example 4-50 Green colored photosensitive composition Mask 4 50 7500 800 B A

[Table 9] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 4-51 Green colored photosensitive composition Mask 4 50 7500 1000 A A Manufacturing example 4-52 Green colored photosensitive composition Mask 4 50 10000 200 B A Manufacturing example 4-53 Green colored photosensitive composition Mask 4 50 10000 400 A A Manufacturing example 4-54 Green colored photosensitive composition Mask 4 50 10000 600 A A Manufacturing example 4-55 Green colored photosensitive composition Mask 4 50 10000 800 A A Manufacturing example 4-56 Green colored photosensitive composition Mask 4 50 10000 1000 A A Manufacturing example 4-57 Green colored photosensitive composition Mask 4 50 20000 200 A A Manufacturing example 4-58 Green colored photosensitive composition Mask 4 50 20000 400 A A Manufacturing example 4-59 Green colored photosensitive composition Mask 4 50 20000 600 A A Manufacturing example 4-60 Green colored photosensitive composition Mask 4 50 20000 800 A A Manufacturing example 4-61 Green colored photosensitive composition Mask 4 50 20000 1000 A B Manufacturing example 4-62 Green colored photosensitive composition Mask 4 50 30000 100 A A Manufacturing example 4-63 Green colored photosensitive composition Mask 4 50 30000 200 B A Manufacturing example 4-64 Green colored photosensitive composition Mask 4 50 30000 400 B A Manufacturing example 4-65 Green colored photosensitive composition Mask 4 50 30000 600 B B Manufacturing example 4-66 Green colored photosensitive composition Mask 4 50 30000 800 B B Manufacturing example 4-67 Green colored photosensitive composition Mask 4 50 30000 1000 B B Manufacturing example 4-68 Green colored photosensitive composition Mask 4 50 36000 100 B A Manufacturing example 4-69 Green colored photosensitive composition Mask 4 50 36000 200 C B Manufacturing example 4-70 Green colored photosensitive composition Mask 4 50 36000 400 C B Manufacturing example 4-71 Green colored photosensitive composition Mask 4 50 36000 600 C B Manufacturing example 4-72 Green colored photosensitive composition Mask 4 55 7500 600 B B Manufacturing example 4-73 Green colored photosensitive composition Mask 4 55 7500 800 B B Manufacturing example 4-74 Green colored photosensitive composition Mask 4 55 7500 1000 B A Manufacturing example 4-75 Green colored photosensitive composition Mask 4 55 10000 400 A B Manufacturing example 4-76 Green colored photosensitive composition Mask 4 55 10000 600 A A Manufacturing example 4-77 Green colored photosensitive composition Mask 4 55 10000 800 A A Manufacturing example 4-78 Green colored photosensitive composition Mask 4 55 10000 1000 A A Manufacturing example 4-79 Green colored photosensitive composition Mask 4 55 20000 200 B B Manufacturing example 4-80 Green colored photosensitive composition Mask 4 55 20000 400 A A Manufacturing example 4-81 Green colored photosensitive composition Mask 4 55 20000 600 A A Manufacturing example 4-82 Green colored photosensitive composition Mask 4 55 20000 800 A A Manufacturing example 4-83 Green colored photosensitive composition Mask 4 55 20000 1000 B A Manufacturing example 4-84 Green colored photosensitive composition Mask 4 55 30000 200 B A Manufacturing example 4-85 Green colored photosensitive composition Mask 4 55 30000 400 B A Manufacturing example 4-86 Green colored photosensitive composition Mask 4 55 30000 600 C B Manufacturing example 4-87 Green colored photosensitive composition Mask 4 55 36000 200 C A

[Table 10] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 5-1 Green colored photosensitive composition Mask 5 twenty two 7500 800 C A Manufacturing example 5-2 Green colored photosensitive composition Mask 5 twenty two 10000 100 B A Manufacturing example 5-3 Green colored photosensitive composition Mask 5 twenty two 10000 200 B A Manufacturing example 5-4 Green colored photosensitive composition Mask 5 twenty two 10000 400 A A Manufacturing example 5-5 Green colored photosensitive composition Mask 5 twenty two 10000 600 B A Manufacturing example 5-6 Green colored photosensitive composition Mask 5 twenty two 10000 800 B B Manufacturing example 5-7 Green colored photosensitive composition Mask 5 twenty two 20000 100 A A Manufacturing example 5-8 Green colored photosensitive composition Mask 5 twenty two 20000 200 A A Manufacturing example 5-9 Green colored photosensitive composition Mask 5 twenty two 20000 400 A B Manufacturing example 5-10 Green colored photosensitive composition Mask 5 twenty two 20000 600 A B Manufacturing example 5-11 Green colored photosensitive composition Mask 5 twenty two 20000 800 C B Manufacturing example 5-12 Green colored photosensitive composition Mask 5 twenty two 30000 100 A B Manufacturing example 5-13 Green colored photosensitive composition Mask 5 30 7500 400 A A Manufacturing example 5-14 Green colored photosensitive composition Mask 5 30 7500 600 A A Manufacturing example 5-15 Green colored photosensitive composition Mask 5 30 7500 800 A A Manufacturing example 5-16 Green colored photosensitive composition Mask 5 30 7500 1000 A A Manufacturing example 5-17 Green colored photosensitive composition Mask 5 30 10000 200 A A Manufacturing example 5-18 Green colored photosensitive composition Mask 5 30 10000 400 A A Manufacturing example 5-19 Green colored photosensitive composition Mask 5 30 10000 600 A A Manufacturing example 5-20 Green colored photosensitive composition Mask 5 30 10000 800 A A Manufacturing example 5-21 Green colored photosensitive composition Mask 5 30 10000 1000 B A Manufacturing example 5-22 Green colored photosensitive composition Mask 5 30 20000 100 A A Manufacturing example 5-23 Green colored photosensitive composition Mask 5 30 20000 200 B A Manufacturing example 5-24 Green colored photosensitive composition Mask 5 30 20000 400 A A Manufacturing example 5-25 Green colored photosensitive composition Mask 5 30 20000 600 B A Manufacturing example 5-26 Green colored photosensitive composition Mask 5 30 20000 800 B B Manufacturing example 5-27 Green colored photosensitive composition Mask 5 30 20000 1000 C B Manufacturing example 5-28 Green colored photosensitive composition Mask 5 30 30000 200 B B Manufacturing example 5-29 Green colored photosensitive composition Mask 5 30 30000 400 B B Manufacturing example 5-30 Green colored photosensitive composition Mask 5 30 30000 800 C B Manufacturing example 5-31 Green colored photosensitive composition Mask 5 30 30000 1000 B B Manufacturing example 5-32 Green colored photosensitive composition Mask 5 40 10000 600 B A Manufacturing example 5-33 Green colored photosensitive composition Mask 5 40 10000 800 B A Manufacturing example 5-34 Green colored photosensitive composition Mask 5 40 10000 1000 A A Manufacturing example 5-35 Green colored photosensitive composition Mask 5 40 20000 200 A A Manufacturing example 5-36 Green colored photosensitive composition Mask 5 40 20000 400 A A Manufacturing example 5-37 Green colored photosensitive composition Mask 5 40 20000 600 A A Manufacturing example 5-38 Green colored photosensitive composition Mask 5 40 20000 800 A B Manufacturing example 5-39 Green colored photosensitive composition Mask 5 40 20000 1000 A B Manufacturing example 5-40 Green colored photosensitive composition Mask 5 40 30000 100 C A Manufacturing example 5-41 Green colored photosensitive composition Mask 5 40 30000 200 A B Manufacturing example 5-42 Green colored photosensitive composition Mask 5 40 30000 400 B B Manufacturing example 5-43 Green colored photosensitive composition Mask 5 40 30000 600 A B Manufacturing example 5-44 Green colored photosensitive composition Mask 5 40 30000 800 B B Manufacturing example 5-45 Green colored photosensitive composition Mask 5 40 30000 1000 B B Manufacturing example 5-46 Green colored photosensitive composition Mask 5 40 36000 200 C B Manufacturing example 5-47 Green colored photosensitive composition Mask 5 40 36000 400 C B Manufacturing example 5-48 Green colored photosensitive composition Mask 5 40 36000 600 C B Manufacturing example 5-49 Green colored photosensitive composition Mask 5 50 7500 800 B A Manufacturing example 5-50 Green colored photosensitive composition Mask 5 50 7500 1000 A A

[Table 11] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 5-51 Green colored photosensitive composition Mask 5 50 10000 400 A A Manufacturing example 5-52 Green colored photosensitive composition Mask 5 50 10000 600 B A Manufacturing example 5-53 Green colored photosensitive composition Mask 5 50 10000 800 A A Manufacturing example 5-54 Green colored photosensitive composition Mask 5 50 10000 1000 A A Manufacturing example 5-55 Green colored photosensitive composition Mask 5 50 20000 400 A A Manufacturing example 5-56 Green colored photosensitive composition Mask 5 50 20000 600 A A Manufacturing example 5-57 Green colored photosensitive composition Mask 5 50 20000 800 A A Manufacturing example 5-58 Green colored photosensitive composition Mask 5 50 20000 1000 A B Manufacturing example 5-59 Green colored photosensitive composition Mask 5 50 30000 200 B A Manufacturing example 5-60 Green colored photosensitive composition Mask 5 50 30000 400 B A Manufacturing example 5-61 Green colored photosensitive composition Mask 5 50 30000 600 B B Manufacturing example 5-62 Green colored photosensitive composition Mask 5 50 30000 800 B B Manufacturing example 5-63 Green colored photosensitive composition Mask 5 50 30000 1000 B B Manufacturing example 5-64 Green colored photosensitive composition Mask 5 50 36000 100 B A Manufacturing example 5-65 Green colored photosensitive composition Mask 5 50 36000 200 C B Manufacturing example 5-66 Green colored photosensitive composition Mask 5 50 36000 400 C B Manufacturing example 5-67 Green colored photosensitive composition Mask 5 50 36000 600 C B Manufacturing example 5-68 Green colored photosensitive composition Mask 5 55 7500 1000 B A Manufacturing example 5-69 Green colored photosensitive composition Mask 5 55 10000 600 B A Manufacturing example 5-70 Green colored photosensitive composition Mask 5 55 10000 800 A A Manufacturing example 5-71 Green colored photosensitive composition Mask 5 55 10000 1000 A A Manufacturing example 5-72 Green colored photosensitive composition Mask 5 55 20000 600 A A Manufacturing example 5-73 Green colored photosensitive composition Mask 5 55 20000 800 A A Manufacturing example 5-74 Green colored photosensitive composition Mask 5 55 20000 1000 A A Manufacturing example 5-75 Green colored photosensitive composition Mask 5 55 30000 400 B A Manufacturing example 5-76 Green colored photosensitive composition Mask 5 55 30000 600 B B Manufacturing example 5-77 Green colored photosensitive composition Mask 5 55 30000 800 A B Manufacturing example 5-78 Green colored photosensitive composition Mask 5 55 36000 200 C A

[Table 12] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 6-1 Green colored photosensitive composition Mask 6 twenty two 7500 800 C A Manufacturing example 6-2 Green colored photosensitive composition Mask 6 twenty two 10000 200 B A Manufacturing example 6-3 Green colored photosensitive composition Mask 6 twenty two 10000 400 A A Manufacturing example 6-4 Green colored photosensitive composition Mask 6 twenty two 10000 600 B A Manufacturing example 6-5 Green colored photosensitive composition Mask 6 twenty two 10000 800 B B Manufacturing example 6-6 Green colored photosensitive composition Mask 6 twenty two 20000 100 A A Manufacturing example 6-7 Green colored photosensitive composition Mask 6 twenty two 20000 200 A A Manufacturing example 6-8 Green colored photosensitive composition Mask 6 twenty two 20000 400 A B Manufacturing example 6-9 Green colored photosensitive composition Mask 6 twenty two 20000 600 A B Manufacturing example 6-10 Green colored photosensitive composition Mask 6 twenty two 20000 800 C B Manufacturing example 6-11 Green colored photosensitive composition Mask 6 twenty two 30000 100 A B Manufacturing example 6-12 Green colored photosensitive composition Mask 6 30 7500 800 A A Manufacturing example 6-13 Green colored photosensitive composition Mask 6 30 7500 1000 A A Manufacturing example 6-14 Green colored photosensitive composition Mask 6 30 10000 600 A A Manufacturing example 6-15 Green colored photosensitive composition Mask 6 30 10000 800 A A Manufacturing example 6-16 Green colored photosensitive composition Mask 6 30 10000 1000 B A Manufacturing example 6-17 Green colored photosensitive composition Mask 6 30 20000 200 B A Manufacturing example 6-18 Green colored photosensitive composition Mask 6 30 20000 400 A A Manufacturing example 6-19 Green colored photosensitive composition Mask 6 30 20000 600 B A Manufacturing example 6-20 Green colored photosensitive composition Mask 6 30 20000 800 B B Manufacturing example 6-21 Green colored photosensitive composition Mask 6 30 20000 1000 C B Manufacturing example 6-22 Green colored photosensitive composition Mask 6 30 30000 200 B B Manufacturing example 6-23 Green colored photosensitive composition Mask 6 30 30000 400 B B Manufacturing example 6-24 Green colored photosensitive composition Mask 6 30 30000 800 C B Manufacturing example 6-25 Green colored photosensitive composition Mask 6 30 30000 1000 B B Manufacturing example 6-26 Green colored photosensitive composition Mask 6 40 10000 800 B A Manufacturing example 6-27 Green colored photosensitive composition Mask 6 40 10000 1000 A A Manufacturing example 6-28 Green colored photosensitive composition Mask 6 40 20000 600 A A Manufacturing example 6-29 Green colored photosensitive composition Mask 6 40 20000 800 A B Manufacturing example 6-30 Green colored photosensitive composition Mask 6 40 20000 1000 A B Manufacturing example 6-31 Green colored photosensitive composition Mask 6 40 30000 200 A B Manufacturing example 6-32 Green colored photosensitive composition Mask 6 40 30000 400 B B Manufacturing example 6-33 Green colored photosensitive composition Mask 6 40 30000 600 A B Manufacturing example 6-34 Green colored photosensitive composition Mask 6 40 30000 800 B B Manufacturing example 6-35 Green colored photosensitive composition Mask 6 40 30000 1000 B B Manufacturing example 6-36 Green colored photosensitive composition Mask 6 40 36000 200 C B Manufacturing example 6-37 Green colored photosensitive composition Mask 6 40 36000 400 C B Manufacturing example 6-38 Green colored photosensitive composition Mask 6 40 36000 600 C B Manufacturing example 6-39 Green colored photosensitive composition Mask 6 50 7500 1000 A A Manufacturing example 6-40 Green colored photosensitive composition Mask 6 50 10000 600 B A Manufacturing example 6-41 Green colored photosensitive composition Mask 6 50 10000 800 A A Manufacturing example 6-42 Green colored photosensitive composition Mask 6 50 10000 1000 A A Manufacturing example 6-43 Green colored photosensitive composition Mask 6 50 20000 400 A A Manufacturing example 6-44 Green colored photosensitive composition Mask 6 50 20000 600 A A Manufacturing example 6-45 Green colored photosensitive composition Mask 6 50 20000 800 A A Manufacturing example 6-46 Green colored photosensitive composition Mask 6 50 20000 1000 A B Manufacturing example 6-47 Green colored photosensitive composition Mask 6 50 30000 400 B A Manufacturing example 6-48 Green colored photosensitive composition Mask 6 50 30000 600 B B Manufacturing example 6-49 Green colored photosensitive composition Mask 6 50 30000 800 B B Manufacturing example 6-50 Green colored photosensitive composition Mask 6 50 30000 1000 B B

[Table 13] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 6-51 Green colored photosensitive composition Mask 6 50 36000 200 C B Manufacturing example 6-52 Green colored photosensitive composition Mask 6 50 36000 400 C B Manufacturing example 6-53 Green colored photosensitive composition Mask 6 50 36000 600 C B Manufacturing example 6-54 Green colored photosensitive composition Mask 6 55 7500 1000 B A Manufacturing example 6-55 Green colored photosensitive composition Mask 6 55 10000 800 A A Manufacturing example 6-56 Green colored photosensitive composition Mask 6 55 10000 1000 A A Manufacturing example 6-57 Green colored photosensitive composition Mask 6 55 20000 600 A A Manufacturing example 6-58 Green colored photosensitive composition Mask 6 55 20000 800 A A Manufacturing example 6-59 Green colored photosensitive composition Mask 6 55 20000 1000 A A Manufacturing example 6-60 Green colored photosensitive composition Mask 6 55 30000 400 B A Manufacturing example 6-61 Green colored photosensitive composition Mask 6 55 30000 600 B B Manufacturing example 6-62 Green colored photosensitive composition Mask 6 55 30000 800 A B Manufacturing example 6-63 Green colored photosensitive composition Mask 6 55 36000 200 C A

[Table 14] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 7-1 Blue colored photosensitive composition Mask 3 twenty two 7500 200 B A Manufacturing example 7-2 Blue colored photosensitive composition Mask 3 twenty two 7500 400 B A Manufacturing example 7-3 Blue colored photosensitive composition Mask 3 twenty two 10000 200 C A Manufacturing example 7-4 Blue colored photosensitive composition Mask 3 twenty two 20000 100 C A Manufacturing example 7-5 Blue colored photosensitive composition Mask 3 30 7500 100 A B Manufacturing example 7-6 Blue colored photosensitive composition Mask 3 30 7500 200 B B Manufacturing example 7-7 Blue colored photosensitive composition Mask 3 30 7500 400 B A Manufacturing example 7-8 Blue colored photosensitive composition Mask 3 30 7500 600 A A Manufacturing example 7-9 Blue colored photosensitive composition Mask 3 30 7500 800 A A Manufacturing example 7-10 Blue colored photosensitive composition Mask 3 30 7500 1000 B A Manufacturing example 7-11 Blue colored photosensitive composition Mask 3 30 10000 100 B A Manufacturing example 7-12 Blue colored photosensitive composition Mask 3 30 10000 200 B A Manufacturing example 7-13 Blue colored photosensitive composition Mask 3 30 10000 400 B A Manufacturing example 7-14 Blue colored photosensitive composition Mask 3 30 10000 600 B A Manufacturing example 7-15 Blue colored photosensitive composition Mask 3 30 10000 800 B A Manufacturing example 7-16 Blue colored photosensitive composition Mask 3 30 10000 1000 B A Manufacturing example 7-17 Blue colored photosensitive composition Mask 3 30 20000 100 C A Manufacturing example 7-18 Blue colored photosensitive composition Mask 3 30 20000 200 B A Manufacturing example 7-19 Blue colored photosensitive composition Mask 3 30 20000 400 C A Manufacturing example 7-20 Blue colored photosensitive composition Mask 3 30 20000 600 B A Manufacturing example 7-21 Blue colored photosensitive composition Mask 3 30 20000 800 C B Manufacturing example 7-22 Blue colored photosensitive composition Mask 3 30 20000 1000 C B Manufacturing example 7-23 Blue colored photosensitive composition Mask 3 30 30000 200 C B Manufacturing example 7-24 Blue colored photosensitive composition Mask 3 40 7500 400 A B Manufacturing example 7-25 Blue colored photosensitive composition Mask 3 40 7500 600 A A Manufacturing example 7-26 Blue colored photosensitive composition Mask 3 40 7500 800 A A Manufacturing example 7-27 Blue colored photosensitive composition Mask 3 40 7500 1000 A A Manufacturing example 7-28 Blue colored photosensitive composition Mask 3 40 10000 100 A B Manufacturing example 7-29 Blue colored photosensitive composition Mask 3 40 10000 200 A A Manufacturing example 7-30 Blue colored photosensitive composition Mask 3 40 10000 400 A A Manufacturing example 7-31 Blue colored photosensitive composition Mask 3 40 10000 600 A A Manufacturing example 7-32 Blue colored photosensitive composition Mask 3 40 10000 800 B A Manufacturing example 7-33 Blue colored photosensitive composition Mask 3 40 10000 1000 B A Manufacturing example 7-34 Blue colored photosensitive composition Mask 3 40 20000 100 B A Manufacturing example 7-35 Blue colored photosensitive composition Mask 3 40 20000 200 B A Manufacturing example 7-36 Blue colored photosensitive composition Mask 3 40 20000 400 A A Manufacturing example 7-37 Blue colored photosensitive composition Mask 3 40 20000 600 A A Manufacturing example 7-38 Blue colored photosensitive composition Mask 3 40 20000 800 B B Manufacturing example 7-39 Blue colored photosensitive composition Mask 3 40 20000 1000 B B Manufacturing example 7-40 Blue colored photosensitive composition Mask 3 40 30000 100 C A Manufacturing example 7-41 Blue colored photosensitive composition Mask 3 40 30000 200 C B Manufacturing example 7-42 Blue colored photosensitive composition Mask 3 40 30000 400 A B Manufacturing example 7-43 Blue colored photosensitive composition Mask 3 40 30000 600 B B Manufacturing example 7-44 Blue colored photosensitive composition Mask 3 40 36000 200 C B Manufacturing example 7-45 Blue colored photosensitive composition Mask 3 40 36000 400 C B Manufacturing example 7-46 Blue colored photosensitive composition Mask 3 40 36000 600 C B Manufacturing example 7-47 Blue colored photosensitive composition Mask 3 50 7500 200 B - Manufacturing example 7-48 Blue colored photosensitive composition Mask 3 50 7500 400 B B Manufacturing example 7-49 Blue colored photosensitive composition Mask 3 50 7500 600 B B Manufacturing example 7-50 Blue colored photosensitive composition Mask 3 50 7500 800 A A

[Table 15] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 7-51 Blue colored photosensitive composition Mask 3 50 7500 1000 B A Manufacturing example 7-52 Blue colored photosensitive composition Mask 3 50 10000 200 B A Manufacturing example 7-53 Blue colored photosensitive composition Mask 3 50 10000 400 A A Manufacturing example 7-54 Blue colored photosensitive composition Mask 3 50 10000 600 A A Manufacturing example 7-55 Blue colored photosensitive composition Mask 3 50 10000 800 A A Manufacturing example 7-56 Blue colored photosensitive composition Mask 3 50 10000 1000 A A Manufacturing example 7-57 Blue colored photosensitive composition Mask 3 50 20000 200 A A Manufacturing example 7-58 Blue colored photosensitive composition Mask 3 50 20000 400 A A Manufacturing example 7-59 Blue colored photosensitive composition Mask 3 50 20000 600 A A Manufacturing example 7-60 Blue colored photosensitive composition Mask 3 50 20000 800 B A Manufacturing example 7-61 Blue colored photosensitive composition Mask 3 50 20000 1000 B B Manufacturing example 7-62 Blue colored photosensitive composition Mask 3 50 30000 100 B A Manufacturing example 7-63 Blue colored photosensitive composition Mask 3 50 30000 200 B A Manufacturing example 7-64 Blue colored photosensitive composition Mask 3 50 30000 400 B A Manufacturing example 7-65 Blue colored photosensitive composition Mask 3 50 30000 600 B B Manufacturing example 7-66 Blue colored photosensitive composition Mask 3 50 36000 100 C A Manufacturing example 7-67 Blue colored photosensitive composition Mask 3 50 36000 200 C B Manufacturing example 7-68 Blue colored photosensitive composition Mask 3 50 36000 400 C B Manufacturing example 7-69 Blue colored photosensitive composition Mask 3 50 36000 600 C B Manufacturing example 7-70 Blue colored photosensitive composition Mask 3 55 7500 800 C B Manufacturing example 7-71 Blue colored photosensitive composition Mask 3 55 7500 1000 B A Manufacturing example 7-72 Blue colored photosensitive composition Mask 3 55 10000 400 C B Manufacturing example 7-73 Blue colored photosensitive composition Mask 3 55 10000 600 A A Manufacturing example 7-74 Blue colored photosensitive composition Mask 3 55 10000 800 A A Manufacturing example 7-75 Blue colored photosensitive composition Mask 3 55 10000 1000 A A Manufacturing example 7-76 Blue colored photosensitive composition Mask 3 55 20000 400 A A Manufacturing example 7-77 Blue colored photosensitive composition Mask 3 55 20000 600 A A Manufacturing example 7-78 Blue colored photosensitive composition Mask 3 55 20000 800 B A Manufacturing example 7-79 Blue colored photosensitive composition Mask 3 55 30000 200 B A Manufacturing example 7-80 Blue colored photosensitive composition Mask 3 55 30000 400 C A Manufacturing example 7-81 Blue colored photosensitive composition Mask 3 55 30000 600 C B Manufacturing example 7-82 Blue colored photosensitive composition Mask 3 55 36000 200 C A

[Table 16] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 8-1 Red colored photosensitive composition Mask 1 twenty two 7500 100 C B Manufacturing example 8-2 Red colored photosensitive composition Mask 1 30 7500 100 A B Manufacturing example 8-3 Red colored photosensitive composition Mask 1 30 7500 200 A B Manufacturing example 8-4 Red colored photosensitive composition Mask 1 30 7500 400 A A Manufacturing example 8-5 Red colored photosensitive composition Mask 1 30 7500 600 C A Manufacturing example 8-6 Red colored photosensitive composition Mask 1 30 10000 100 C A Manufacturing example 8-7 Red colored photosensitive composition Mask 1 30 10000 200 B A Manufacturing example 8-8 Red colored photosensitive composition Mask 1 30 10000 400 A A Manufacturing example 8-9 Red colored photosensitive composition Mask 1 30 10000 600 A A Manufacturing example 8-10 Red colored photosensitive composition Mask 1 30 10000 800 B A Manufacturing example 8-11 Red colored photosensitive composition Mask 1 30 10000 1000 B A Manufacturing example 8-12 Red colored photosensitive composition Mask 1 30 20000 100 C A Manufacturing example 8-13 Red colored photosensitive composition Mask 1 30 20000 200 B A Manufacturing example 8-14 Red colored photosensitive composition Mask 1 30 20000 400 C A Manufacturing example 8-15 Red colored photosensitive composition Mask 1 30 20000 600 B A Manufacturing example 8-16 Red colored photosensitive composition Mask 1 30 20000 800 B B Manufacturing example 8-17 Red colored photosensitive composition Mask 1 30 20000 1000 C B Manufacturing example 8-18 Red colored photosensitive composition Mask 1 30 30000 200 C B Manufacturing example 8-19 Red colored photosensitive composition Mask 1 30 30000 800 C B Manufacturing example 8-20 Red colored photosensitive composition Mask 1 30 30000 1000 B B Manufacturing example 8-21 Red colored photosensitive composition Mask 1 40 7500 400 A B Manufacturing example 8-22 Red colored photosensitive composition Mask 1 40 7500 600 A A Manufacturing example 8-23 Red colored photosensitive composition Mask 1 40 7500 800 A A Manufacturing example 8-24 Red colored photosensitive composition Mask 1 40 7500 1000 A A Manufacturing example 8-25 Red colored photosensitive composition Mask 1 40 10000 100 A B Manufacturing example 8-26 Red colored photosensitive composition Mask 1 40 10000 200 A A Manufacturing example 8-27 Red colored photosensitive composition Mask 1 40 10000 400 A A Manufacturing example 8-28 Red colored photosensitive composition Mask 1 40 10000 600 A A Manufacturing example 8-29 Red colored photosensitive composition Mask 1 40 10000 800 A A Manufacturing example 8-30 Red colored photosensitive composition Mask 1 40 10000 1000 A A Manufacturing example 8-31 Red colored photosensitive composition Mask 1 40 20000 100 B A Manufacturing example 8-32 Red colored photosensitive composition Mask 1 40 20000 200 B A Manufacturing example 8-33 Red colored photosensitive composition Mask 1 40 20000 400 A A Manufacturing example 8-34 Red colored photosensitive composition Mask 1 40 20000 600 A A Manufacturing example 8-35 Red colored photosensitive composition Mask 1 40 20000 800 C A Manufacturing example 8-36 Red colored photosensitive composition Mask 1 40 20000 1000 C A Manufacturing example 8-37 Red colored photosensitive composition Mask 1 40 30000 100 C A Manufacturing example 8-38 Red colored photosensitive composition Mask 1 40 30000 200 C A Manufacturing example 8-39 Red colored photosensitive composition Mask 1 40 30000 400 B A Manufacturing example 8-40 Red colored photosensitive composition Mask 1 40 30000 600 B A Manufacturing example 8-41 Red colored photosensitive composition Mask 1 40 36000 200 C B Manufacturing example 8-42 Red colored photosensitive composition Mask 1 40 36000 400 C B Manufacturing example 8-43 Red colored photosensitive composition Mask 1 40 36000 600 C B Manufacturing example 8-44 Red colored photosensitive composition Mask 1 50 7500 400 B B Manufacturing example 8-45 Red colored photosensitive composition Mask 1 50 7500 600 A B Manufacturing example 8-46 Red colored photosensitive composition Mask 1 50 7500 800 B A Manufacturing example 8-47 Red colored photosensitive composition Mask 1 50 7500 1000 B A Manufacturing example 8-48 Red colored photosensitive composition Mask 1 50 10000 400 A A Manufacturing example 8-49 Red colored photosensitive composition Mask 1 50 10000 600 A A Manufacturing example 8-50 Red colored photosensitive composition Mask 1 50 10000 800 A A

[Table 17] Types of colored photosensitive composition Type of mask Conditions at exposure Evaluation 1 Evaluation 2 Oxygen concentration (vol%) Exposure illumination (W/m ² ) Exposure energy (mJ/cm ² ) Manufacturing example 8-51 Red colored photosensitive composition Mask 1 50 10000 1000 A A Manufacturing example 8-52 Red colored photosensitive composition Mask 1 50 20000 100 B B Manufacturing example 8-53 Red colored photosensitive composition Mask 1 50 20000 200 A A Manufacturing example 8-54 Red colored photosensitive composition Mask 1 50 20000 400 A A Manufacturing example 8-55 Red colored photosensitive composition Mask 1 50 20000 600 A A Manufacturing example 8-56 Red colored photosensitive composition Mask 1 50 20000 800 C A Manufacturing example 8-57 Red colored photosensitive composition Mask 1 50 20000 1000 C A Manufacturing example 8-58 Red colored photosensitive composition Mask 1 50 30000 100 B A Manufacturing example 8-59 Red colored photosensitive composition Mask 1 50 30000 200 B A Manufacturing example 8-60 Red colored photosensitive composition Mask 1 50 30000 400 B A Manufacturing example 8-61 Red colored photosensitive composition Mask 1 50 30000 600 B A Manufacturing example 8-62 Red colored photosensitive composition Mask 1 50 36000 100 C A Manufacturing example 8-63 Red colored photosensitive composition Mask 1 50 36000 200 C B Manufacturing example 8-64 Red colored photosensitive composition Mask 1 50 36000 400 C B Manufacturing example 8-65 Red colored photosensitive composition Mask 1 50 36000 600 C B Manufacturing example 8-66 Red colored photosensitive composition Mask 1 55 7500 400 B B Manufacturing example 8-67 Red colored photosensitive composition Mask 1 55 7500 800 B B Manufacturing example 8-68 Red colored photosensitive composition Mask 1 55 7500 1000 B A Manufacturing example 8-69 Red colored photosensitive composition Mask 1 55 10000 400 A A Manufacturing example 8-70 Red colored photosensitive composition Mask 1 55 10000 600 A A Manufacturing example 8-71 Red colored photosensitive composition Mask 1 55 10000 800 B A Manufacturing example 8-72 Red colored photosensitive composition Mask 1 55 10000 1000 C A Manufacturing example 8-73 Red colored photosensitive composition Mask 1 55 20000 400 A A Manufacturing example 8-74 Red colored photosensitive composition Mask 1 55 20000 600 B A Manufacturing example 8-75 Red colored photosensitive composition Mask 1 55 20000 800 C A Manufacturing example 8-76 Red colored photosensitive composition Mask 1 55 30000 200 B A Manufacturing example 8-77 Red colored photosensitive composition Mask 1 55 30000 400 C A Manufacturing example 8-78 Red colored photosensitive composition Mask 1 55 30000 600 C A Manufacturing example 8-79 Red colored photosensitive composition Mask 1 55 36000 200 C A

As shown in the above table, according to the present invention, it is possible to form a structure in which at least a part of the surface of the partition wall between the pixels is formed into a pattern from the pixel area where the pixels are exposed from a plurality of pixels of the same color. In addition, in each test example, although a mask with an opening size of 1.9μm was used, considering the relationship between exposure illuminance, exposure energy, and oxygen concentration, the size of the opening of the mask does not have to be 1.9μm, and can be set To have an appropriate deviation. For example, the size of the opening of the mask can be 1.95 μm square or 1.85 μm square. In addition, in the present invention, a partition wall structure of a low-refractive index material is shown, but it is also useful to laminate a partition wall of a metal (tungsten, aluminum, etc.) and a low-refractive index material, and a metal partition.

In the above-mentioned embodiment, a green coloring photosensitive composition, a blue coloring photosensitive composition, or a red coloring photosensitive composition was used as the colored photosensitive composition to produce a plurality of pixels of the same color and between the pixels. At least a part of the surface of the partition wall is formed into a patterned structure from the pixel area where the pixel is exposed, but as the colored photosensitive composition, a colored photosensitive composition for forming yellow pixels and a colored photosensitive composition for forming cyan pixels can also be used A colored photosensitive composition for forming magenta pixels, a colored photosensitive composition for forming transparent pixels, a colored photosensitive composition for forming infrared transmission pixels, and a colored photosensitive composition for forming light-shielding pixels are used to manufacture the above-mentioned structure.

1: Support 2, 2a: Next door 10.10a: Colored photosensitive composition layer 20, 20a: mask 22: Shading part 25, 25a: opening 30, 40, 50: pixels 35, 45, 55: pixel area H1, H2: height P1, W1: width h: irradiation light

FIG. 1 is a plan view viewed from directly above the support 1. Fig. 2 is a sectional view taken along the line A-A in Fig. 1. Fig. 3 is a diagram showing a state in which a colored photosensitive composition layer is formed on a support. Fig. 4 is a diagram showing an embodiment of the exposure process. FIG. 5 is a diagram showing an embodiment of the mask, and is a plan view viewed from directly above the support body 1 in the portion enclosed by the broken line in FIG. 4. Fig. 6 is a diagram showing another embodiment of the exposure process. FIG. 7 is a diagram showing an embodiment of a mask used in the exposure process, and is a plan view viewed from directly above the support body 1 in the part enclosed by the dotted line in FIG. 6. FIG. 8 is a diagram showing the state after the development process, and is a plan view viewed from directly above the support 1. Fig. 9 is a sectional view taken along the line A-A in Fig. 8. Fig. 10 is a diagram showing an embodiment of the structure. FIG. 11 is a cross-sectional view of the mask 1. Fig. 12 is a cross-sectional view of masks 2-6.

30, 40, 50: pixels

35, 45, 55: pixel area

Claims (11)

A method of manufacturing a structure, which includes: A process of forming a colored photosensitive composition layer on the support including the region partitioned by the partition wall by coating the colored photosensitive composition on the support provided with a plurality of regions partitioned by the partition wall; A process of exposing the colored photosensitive composition layer formed on the support into a pattern through a mask having an opening that can simultaneously expose the colored photosensitive composition layer formed in the adjacent area ;as well as The colored photosensitive composition layer in the unexposed part is removed by development, and part of the colored photosensitive composition layer in the exposed part is also developed and removed to expose at least a part of the surface of the partition wall to form in the area divided by the partition wall A pixel is a process of forming at least a part of the surface of the partition wall between the pixels that are formed by a plurality of pixels of the same color into a pattern from the pixel area exposed by the pixel. The manufacturing method of the structure according to claim 1, wherein A light shielding portion is provided in the opening of the shield, and the light shielding portion shields at least a part of a position corresponding to the partition wall. The manufacturing method of the structure according to claim 2, wherein The width of the light shielding portion is 1.0 to 5.0 times the width of the partition wall. The manufacturing method of the structure according to claim 1 or claim 2, wherein The colored photosensitive composition contains a radical polymerizable compound and a photo radical polymerization initiator, The colored photosensitive composition layer formed on the support is exposed to a pattern in an atmosphere with an oxygen concentration greater than 21% by volume. The manufacturing method of the structure according to claim 4, wherein The oxygen concentration is 55% by volume or less. The method for manufacturing a structure according to claim 1 or claim 2, wherein the colored photosensitive composition layer formed on the support is under the condition of an exposure illuminance of 2500W/m ² to 50000W/m ² Expose into a pattern. The manufacturing method of the structure according to claim 1 or claim 2, wherein The height of the partition wall is 0.3 μm to 1.2 μm. The manufacturing method of the structure according to claim 1 or claim 2, wherein The width of the partition wall is 0.05 μm to 0.2 μm. A method for manufacturing a color filter, which includes a method for manufacturing the structure according to any one of claims 1 to 8. A method of manufacturing a solid-state imaging device, which includes a method of manufacturing the structure according to any one of claims 1 to 8. A method for manufacturing an image display device, which includes a method for manufacturing the structure according to any one of claims 1 to 8.

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