TW202028692A - System and method for measuring the profile of a part - Google Patents
System and method for measuring the profile of a part Download PDFInfo
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- TW202028692A TW202028692A TW108144147A TW108144147A TW202028692A TW 202028692 A TW202028692 A TW 202028692A TW 108144147 A TW108144147 A TW 108144147A TW 108144147 A TW108144147 A TW 108144147A TW 202028692 A TW202028692 A TW 202028692A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
- G01B11/005—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates coordinate measuring machines
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/2433—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures for measuring outlines by shadow casting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/004—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points
- G01B5/008—Measuring arrangements characterised by the use of mechanical techniques for measuring coordinates of points using coordinate measuring machines
- G01B5/012—Contact-making feeler heads therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/20—Measuring arrangements characterised by the use of mechanical techniques for measuring contours or curvatures
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/20—Analysis of motion
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
- G06T7/64—Analysis of geometric attributes of convexity or concavity
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10016—Video; Image sequence
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
Abstract
Description
發明領域Invention field
本發明係關於測量一物件或一部件之尺寸的領域。詳言之,本發明係關於使用一感測器(觸敏式或非觸敏式)測定一物件或一部件之尺寸的領域。The present invention relates to the field of measuring the size of an object or a part. In detail, the present invention relates to the field of measuring the size of an object or a part using a sensor (touch-sensitive or non-touch-sensitive).
此類型之測量用於應用尺寸計量學之眾多領域中,其特別包括(但不排他)機械加工部件之領域,詳言之,使用一機器工具或藉由移除材料的任一其他形式之機械加工,但亦用於藉由添加材料之製造。此測量亦特別適用於監視磨損之情況,或在維修操作期間使用。This type of measurement is used in many fields of applied dimensional metrology, including in particular (but not exclusive) the field of machined parts, in detail, the use of a machine tool or any other form of machinery by removing material Processing, but also used for manufacturing by adding materials. This measurement is also particularly suitable for monitoring wear and tear, or during maintenance operations.
在機器工具之領域中,存在準確知曉一部件之尺寸及/或輪廓以便提供與在開發期間開發之機械加工圖紙一致的程序之一計劃之需求。In the field of machine tools, there is a need to accurately know the size and/or contour of a part in order to provide a plan consistent with the machining drawings developed during development.
發明背景Background of the invention
已提議旨在以一光學觸敏式方式測量一物件之座標的各種系統,詳言之,包含一可撓性探針之系統。Various systems have been proposed for measuring the coordinates of an object in an optical touch-sensitive manner, in detail, a system including a flexible probe.
文獻US2005259271A利用呈安裝於一可撓性探針延伸部上之一測隙頭之形式的一掃描器。與該掃描器成整塊地形成一單元之一第一光學系統偵測該測隙頭在一平面x, y中之位置,而一自主第二光學系統偵測該測隙頭在方向z上之位置。The document US2005259271A utilizes a scanner in the form of a feeler head mounted on a flexible probe extension. Form a unit integrally with the scanner. A first optical system detects the position of the feeler head in a plane x, y, and an autonomous second optical system detects that the feeler head is in the direction z The location.
文獻US2016370172A及US2005000102A描述包含一測隙頭之座標測量系統,該測隙頭之位置由與探針同軸安裝之一光學感測器追蹤。在文獻US2016370172A中,探針具備一可撓性延伸部,其具有與部件接觸且攜載與探針之觸敏部件垂直對準地坐落之一參考標記的一接觸元件。在文獻US2005000102A中,座標測量器具包括一測隙頭,其安裝於一延伸部上且其位置由一光學系統識別,該光學系統之光軸與該測隙頭對準。Documents US2016370172A and US2005000102A describe a coordinate measuring system including a feeler head whose position is tracked by an optical sensor mounted coaxially with the probe. In the document US2016370172A, the probe is provided with a flexible extension, which has a contact element which contacts the component and carries a reference mark in vertical alignment with the touch sensitive component of the probe. In the document US2005000102A, the coordinate measuring instrument includes a gap head, which is mounted on an extension and its position is recognized by an optical system whose optical axis is aligned with the gap head.
在此等解決方案中,並不可能或並不始終可能測量測隙頭在空間中之三個方向上的移動,詳言之,若該測隙頭經隱藏,詳言之,在部件中之一凹座或一孔中。In these solutions, it is impossible or not always possible to measure the movement of the feeler head in three directions in space. In detail, if the feeler head is hidden, in detail, in the component In a recess or a hole.
文獻US2009144999A描述一種用於測量一中空部件之內部形廓線(contour)之探針。彼探針包括一棒,其下部端攜載與待測量之表面接觸的一測隙頭,且其上部端自該部件顯露且攜載其位置由一光學感測器(詳言之,一雷射感測器)識別之一目標。藉由將該棒安裝於一球形關節上來致使該棒行動,亦提供平移時之自由度。此佈置需要對安裝於待測量之部件上的球形關節之支撐,此產生一額外操縱。此外,校準探針需要探針/支撐件在待測量之部件上的精確且可再現安裝。The document US2009144999A describes a probe for measuring the inner contour of a hollow part. The probe includes a rod, the lower end of which carries a feeler head in contact with the surface to be measured, and the upper end of which is exposed from the part and carries its position by an optical sensor (in detail, a mine Radio sensor) to identify a target. The rod is mounted on a spherical joint to cause the rod to move, and also provides freedom of translation. This arrangement requires support for the spherical joint mounted on the part to be measured, which creates an additional manipulation. In addition, the calibration probe requires an accurate and reproducible installation of the probe/support on the part to be measured.
先前技術解決方案依賴於相對於在部件及測量系統外部之標記進行測量,亦即,涉及相對於測量程序中之精確軸線的中間測量。此在進行測量時增添了步驟,且導致累加的不確定性,或甚至測量錯誤,由此最終結果之提供係關於不如所需要般準確的測量。Prior art solutions rely on measuring relative to markings on the outside of the component and measuring system, that is, involving intermediate measurements relative to the precise axis in the measuring procedure. This adds steps to the measurement, and leads to accumulated uncertainty, or even measurement errors, so that the final result is provided with regard to measurements that are not as accurate as needed.
此等解決方案因此不使使快速設置及使用之裝置可用有可能,並且最主要地,實現物件或部件(且詳言之,一中空部件)之輪廓(詳言之,內部輪廓)之容易測量。These solutions therefore do not make it possible to quickly set up and use the device, and most importantly, realize the easy measurement of the contour (more specifically, the internal contour) of an object or part (and more specifically, a hollow part) .
此外,對於一些應用,以上解決方案並不始終具有足夠精確度。In addition, for some applications, the above solutions are not always accurate enough.
發明概要Summary of the invention
本發明之一目標為提議一種測量技術,其無實現一物件或一部件之輪廓(且詳言之,內部輪廓)之測量的已知測量技術之限制。One of the objectives of the present invention is to propose a measurement technique that does not have the limitations of known measurement techniques that realize the measurement of the contour (and in detail, the internal contour) of an object or a part.
本發明之另一目標為提議一種實現一物件或一部件之輪廓(且詳言之,內部輪廓)之測量的技術,其提供一部件之部分之非常準確測量。Another object of the present invention is to propose a technique for realizing the measurement of the contour (and more specifically, the internal contour) of an object or a part, which provides a very accurate measurement of a part of a part.
本發明之另一目標為提議一種實現一物件或一部件之輪廓(且詳言之,內部輪廓)之測量的技術,其具有最少測量步驟。Another object of the present invention is to propose a technique for realizing the measurement of the contour (and more specifically, the internal contour) of an object or a part, which has a minimum of measurement steps.
根據本發明,以上目標詳言之藉由一種用於測量一部件之一外部輪廓或一中空部件之一內部輪廓的測量系統來達成,該系統包含: -一部件(50),其內部或外部輪廓係待測量, -一感測器,其包括一探針及扣緊至該探針之一第一參考元件、一基底及連接該探針與該基底之一導引系統,從而允許至少根據界定一測量方向之一個自由度在其間之相對移動, -該感測器經佈置使得在該感測器相對於該部件在與該測量方向不同之一方向的該移動期間,該探針能夠依循該部件之該內部或外部形廓線,而該第一參考元件在該部件外且實行再現該探針沿著該部件之該內部或外部形廓線的路徑之一路徑,及 -一成像裝置,其適於擷取代表該部件之外部之至少一部分及該第一參考元件的影像,藉此藉由比對該成像裝置拍攝之該等影像,偵測該第一參考元件與該部件之該外部之該部分之間在該測量方向上的相對移動,且自其推導該探針與該基底之間的一相對移動,其對應於在沿著該部件之該測量的輪廓之該測量方向上之一偏移。According to the present invention, the above objectives are achieved in detail by a measuring system for measuring an outer contour of a part or an inner contour of a hollow part, the system comprising: -A part (50) whose internal or external contour is to be measured, -A sensor comprising a probe and a first reference element fastened to the probe, a substrate and a guiding system connecting the probe and the substrate, thereby allowing at least a measurement direction to be defined according to A degree of freedom moves relative to each other, -The sensor is arranged so that during the movement of the sensor relative to the component in a direction different from the measuring direction, the probe can follow the internal or external profile of the component, and the first A reference element is outside the component and performs a path that reproduces the probe's path along the internal or external profile of the component, and -An imaging device adapted to capture images that replace at least a part of the exterior of the component and the first reference element, thereby detecting the first reference element and the first reference element by comparing the images taken by the imaging device The relative movement between the outer part of the component in the measurement direction, and a relative movement between the probe and the substrate is derived therefrom, which corresponds to the measurement along the contour of the component Offset in one of the measurement directions.
此解決方案特別具有較之先前技術之優勢——不需要直接識別將與部件之輪廓接觸的探針或一測隙頭之位置,因為在測量期間,在部件外之所有情況中存在的第一參考元件適於再現該探針之移動,且充當用於確定該部件之面與該探針之間的接觸點之位置之一參考元件。因此,該第一參考元件充當用於該探針相對於為部件自身之參考系統之位置的一參考元件。This solution particularly has the advantage over the prior art-there is no need to directly identify the position of a probe or a feeler head that will be in contact with the contour of the part, because during the measurement, the first place exists in all situations outside the part. The reference element is suitable for reproducing the movement of the probe and serves as a reference element for determining the position of the contact point between the surface of the part and the probe. Therefore, the first reference element serves as a reference element for the position of the probe relative to the reference system which is the component itself.
在測定一部件之外部輪廓或測定一中空部件之內部輪廓之情況中,此首先發生,不管該中空部件具有還是不具有一開口(開孔或盲孔)。又,其次,在測定一部件之該內部輪廓之情況中,由於該探針與該第一參考元件之間的空間偏移,該探針可留存該部件內部,在一中空部分中,而該第一參考元件保留在於該部件之外,此使得有可能維持對該第一參考元件之接取(例如,光學或藉由接觸)及因此極大地有助於經由該第一參考元件相對於該部件之該位置之該測定來測定該探針之該位置。In the case of measuring the outer contour of a part or measuring the inner contour of a hollow part, this occurs first, regardless of whether the hollow part has or does not have an opening (open hole or blind hole). Also, secondly, in the case of measuring the internal contour of a component, the probe can remain inside the component in a hollow part due to the spatial offset between the probe and the first reference element, and the The first reference element remains outside of the component, which makes it possible to maintain access to the first reference element (for example, optically or by contact) and thus greatly facilitates the passage of the first reference element relative to the The measurement of the position of the part determines the position of the probe.
當該測量系統在位置中不動以測量一部件之該輪廓時及在該部件相對於該測量系統之移動期間,該探針因此具有相對於該部件之至少一個自由度。探針(或感測器之行動部件)相對於測量系統之其餘部分的移動之此可能性使其能夠依循待檢驗的部件之形廓線(內部輪廓或外部輪廓)。顯然,該成像裝置具有一光場(或視野),此使查看及因此擷取包括該部件之外部之一部分及該第一參考元件兩者的一影像有可能。以此方式,當部件相對於測量系統移動時擷取連續影像使成像裝置有可能經由第一參考元件在視野中之移動看到何輪廓對應於該第一參考元件之此行進。When the measurement system is not moving in position to measure the profile of a part and during movement of the part relative to the measurement system, the probe therefore has at least one degree of freedom relative to the part. This possibility of movement of the probe (or the moving part of the sensor) relative to the rest of the measurement system makes it possible to follow the profile (internal or external) of the component to be inspected. Obviously, the imaging device has a light field (or field of view), which makes it possible to view and thus capture an image that includes both an external part of the component and the first reference element. In this way, capturing continuous images when the component moves relative to the measurement system makes it possible for the imaging device to see through the movement of the first reference element in the field of view which contour corresponds to this travel of the first reference element.
根據一安置,該部件之該內部形廓線或該外部形廓線或該內部形廓線及該外部形廓線兩者形成圍繞一軸線之一繞轉面。此軸線為例如平行於感測器之主軸的一軸線。According to an arrangement, the inner profile or the outer profile or both the inner profile and the outer profile of the component form a revolving surface around an axis. This axis is, for example, an axis parallel to the main axis of the sensor.
根據一個佈置,該感測器進一步包含一基底及連接該探針與該基底之一導引系統。此產生當測量系統處於相對於部件之一測量位置中時該探針相對於測量系統之其餘部分的受控制移動。According to one arrangement, the sensor further includes a base and a guiding system connecting the probe and the base. This produces a controlled movement of the probe relative to the rest of the measurement system when the measurement system is in a measurement position relative to the component.
根據一個可能佈置,該導引系統僅允許在該探針與該基底之間的一個自由度。因此,其設計簡單且使探針有可能依循在該自由度允許之一方向上的部件之形廓線之變化(其在大多數情況中係必要且足夠的)的一測量系統係可用的。According to one possible arrangement, the guidance system allows only one degree of freedom between the probe and the substrate. Therefore, a measurement system whose design is simple and makes it possible for the probe to follow the change of the profile of the component in a direction allowed by the degree of freedom (which is necessary and sufficient in most cases) is available.
根據另一佈置,該測量系統進一步包含扣緊至該基底且安置於該部件外之一第二參考元件,該第二參考元件經置放使得該成像裝置能夠同時看到該第一參考元件、該第二參考元件及該部件之該外部之該部分。事實上,該第二參考元件在所有情況中保持於該部件之外,測量其內或外輪廓。此佈置實現與測量系統之一不動元件之第二參考元件一起使用,該第二參考元件充當另一固定標記,可相對於該另一固定標記檢視該第一參考元件之移動(經由成像裝置),及因此探針之移動,詳言之,在由該導引系統允許之至少一個方向上。According to another arrangement, the measurement system further comprises a second reference element fastened to the substrate and arranged outside the component, the second reference element being placed so that the imaging device can see the first reference element, The second reference element and the outer part of the component. In fact, the second reference element remains outside the part in all cases, measuring its inner or outer contour. This arrangement can be used with a second reference element of a stationary element of the measurement system. The second reference element serves as another fixed mark, and the movement of the first reference element can be viewed (via the imaging device) relative to the other fixed mark. , And therefore the movement of the probe, in detail, in at least one direction allowed by the guidance system.
根據本發明之一第一可能實施例中,該探針包括一測隙頭,其能夠依循及藉由接觸來偵測該部件之該內部或外部形廓線。此種類之一測隙頭實體地依循待測量的部件之形廓線,且詳言之,內部及因此隱藏之輪廓(當測量該內部輪廓時)。According to a first possible embodiment of the present invention, the probe includes a feeler head which can follow and detect the internal or external profile of the component by contact. A feeler head of this type physically follows the profile of the part to be measured, and in detail, the internal and therefore hidden contours (when measuring the internal contour).
根據本發明之一第二可能實施例中,該探針包括一偵測頭,其適於依循且偵測該部件之該內部或外部形廓線而無接觸。舉例而言,且以一非限制性方式,此為一以光學方式發揮功能之探針(光學偵測頭),或例如,一近接感測器(距離或近接偵測頭)或再次一電磁或聲波感測器(電磁或聲波偵測頭)。According to a second possible embodiment of the present invention, the probe includes a detection head adapted to follow and detect the internal or external profile of the component without contact. For example, and in a non-limiting manner, this is a probe that functions optically (optical detection head), or, for example, a proximity sensor (distance or proximity detection head) or again an electromagnetic Or acoustic wave sensor (electromagnetic or acoustic wave detecting head).
根據一個佈置,該成像裝置包括一錄影攝像機及一光源,其適於同時照射該部件之該外部之該部分及該第一參考元件。此佈置使該錄影攝像機能夠提供一充分對比之影像,詳言之,若該探針安置於一中空部件中且該第一參考元件安置於該部件之外。According to one arrangement, the imaging device includes a video camera and a light source adapted to simultaneously illuminate the part of the exterior of the component and the first reference element. This arrangement enables the video camera to provide a sufficiently contrasting image, in particular, if the probe is placed in a hollow part and the first reference element is placed outside the part.
根據一個佈置,該錄影攝像機具有一視野,使其能夠看到該部件之該外部之該部分及該第一參考元件。此佈置使得有可能使該錄影攝像機能夠產生該部件之該外部之該部分或該第一參考元件的一影像,詳言之,當該探針安置於一中空部件中且該第一參考元件安置於該部件之外時。According to one arrangement, the video camera has a field of view that enables it to see the part of the exterior of the component and the first reference element. This arrangement makes it possible for the video camera to produce an image of the outer part of the part or the first reference element, in detail, when the probe is placed in a hollow part and the first reference element is placed When outside the component.
根據一個佈置,該導引系統包括返回構件,其實現當該探針不再與該部件之該內部或外部形廓線互動時,該感測器(及因此,該探針)之該行動部件返回至相對於該基底之一擱置位置。在該探針與該部件之該形廓線之該互動期間,即,詳言之,觸摸,或當探針為一測隙頭時,使一起與軸承接觸,保證有效互動(詳言之,有效接觸),從而保證對應於該部件之該形廓線的該探針及因此該第一參考元件之一位置。在一無接觸互動之情況中,保證該探針與該第一參考元件之間的有效偵測以實現該測量。此外,當已實行此測量時,此等返回構件使該感測器之該行動部件及因此該探針能夠返回至一擱置位置,其中在該測量系統中,詳言之,在該第一參考元件與該探針之間的傳輸子系統(詳言之,影片子系統)中,不存在應力(機械或其他)。此等返回構件可呈許多形式,包括且不限於下列元件中之至少一或多者:可變形及彈性元件、板簧(平面、曲線、螺旋或其他)、盤簧等。此等返回構件亦可自導引系統之結構得到,僅歸因於重力,其引起自然返回至此擱置位置。According to one arrangement, the guidance system includes a return member that enables the moving part of the sensor (and therefore the probe) when the probe no longer interacts with the internal or external profile of the part Return to a resting position relative to the base. During the interaction between the probe and the profile of the component, that is, in detail, touch, or when the probe is a feeler head, make contact with the bearing together to ensure effective interaction (in detail, Effective contact), so as to ensure a position of the probe and therefore the first reference element corresponding to the profile of the component. In a non-contact interaction situation, effective detection between the probe and the first reference element is ensured to achieve the measurement. In addition, when the measurement has been carried out, these return members enable the moving part of the sensor and therefore the probe to return to a resting position, wherein in the measurement system, in detail, in the first reference There is no stress (mechanical or other) in the transmission subsystem (in detail, the film subsystem) between the element and the probe. These return members can take many forms, including but not limited to at least one or more of the following elements: deformable and elastic elements, leaf springs (planar, curved, spiral or other), coil springs, and the like. These return members can also be obtained from the structure of the guidance system, due only to gravity, which causes a natural return to this resting position.
根據一個佈置,該導引系統在該探針(該感測器之行動部件)與該基底之間包括一滑動連接或一樞轉連接,諸如,具有機械元件、磁性元件、液壓元件等之一樞軸。According to one arrangement, the guiding system includes a sliding connection or a pivoting connection between the probe (the moving part of the sensor) and the substrate, such as having one of mechanical elements, magnetic elements, hydraulic elements, etc. Pivot.
本發明亦係關於一種用於測量一部件之輪廓之方法,詳言之,使用如在本文中描述的用於測量或測定一部件之輪廓之系統。詳言之,本發明係關於一種使用如在本文中描述之一測量系統測量一部件之內部輪廓之方法。根據一個可能性,測量一中空部件之一輪廓之測量方法包含以下步驟: i)提供一感測器,其包括一探針及扣緊至該探針之一第一參考元件、一基底及連接該探針與該基底之一導引系統,從而允許至少根據界定一測量方向之一個自由度在其間之相對移動;及一成像裝置, ii)提供一中空部件,待測定其輪廓, iii)置放該感測器,使得該探針偵測該部件之形廓線上的一點,同時第一參考元件在該部件之外且在該成像裝置之視野中, iv)觸發該成像系統及形成代表該部件之該外部之至少一部分及該參考元件的一影像, v)在於與測量方向不同之一方向上的一移動中相對於該部件移動該感測器,且使該探針能夠保持於該部件內部並依循該部件之該形廓線,同時該第一參考元件保持在該部件之外且實行與該探針相同之移動, vi)針對該部件之該形廓線上的其他點實行步驟iv)及v)。The present invention also relates to a method for measuring the contour of a part, in detail, using the system for measuring or determining the contour of a part as described herein. In detail, the present invention relates to a method of measuring the internal profile of a part using a measurement system as described herein. According to one possibility, the measurement method for measuring a profile of a hollow part includes the following steps: i) Provide a sensor, which includes a probe and a first reference element fastened to the probe, a substrate, and a guiding system connecting the probe and the substrate, thereby allowing at least a measurement according to the definition The relative movement of one degree of freedom of direction; and an imaging device, ii) Provide a hollow part whose contour is to be measured, iii) Place the sensor so that the probe detects a point on the profile of the part, while the first reference element is outside the part and in the field of view of the imaging device, iv) triggering the imaging system and forming an image representing at least a part of the exterior of the component and the reference element, v) Move the sensor relative to the component in a movement in a direction different from the measurement direction, and enable the probe to be held inside the component and follow the profile of the component, while the first reference The component remains outside the part and performs the same movement as the probe, vi) Perform steps iv) and v) for other points on the profile of the component.
本發明亦係關於一種用於測量一部件之外部輪廓之測量方法,詳言之,使用如在本文中描述之一測量系統。根據一個可能性,測量一部件之一外部輪廓之方法包含以下步驟: i)提供一感測器,其包括一探針、扣緊至該探針之一第一參考元件、一基底及連接該探針與該基底之一導引系統,從而允許至少根據界定一測量方向之一個自由度在其間之相對移動,及提供一成像裝置, ii)提供一中空部件,待測定其外部輪廓, iii)置放該感測器,使得該探針在該部件之外且偵測該部件之該外部輪廓上的一點,而該第一參考元件亦在該部件之外且在該成像裝置之視野中, iv)觸發該成像系統及形成代表該部件之該外部之至少一部分及該參考元件的一影像, v)在於與測量方向不同之一方向上的一移動中相對於該部件移動該感測器,且使該探針能夠依循該部件之該外部形廓線,同時該第一參考元件保持在該部件之外且實行與該探針相同之移動, vi)針對該部件之該外部形廓線上的其他點實行步驟iv)及v)。The present invention also relates to a measuring method for measuring the outer contour of a part. In detail, a measuring system as described in this document is used. According to one possibility, the method of measuring the outer contour of a part includes the following steps: i) A sensor is provided, which includes a probe, a first reference element fastened to the probe, a substrate, and a guiding system connecting the probe and the substrate, thereby allowing at least a measurement according to the definition One degree of freedom of direction relative movement between them, and an imaging device is provided, ii) Provide a hollow part whose outer contour is to be measured, iii) Place the sensor so that the probe is outside the part and detects a point on the outer contour of the part, and the first reference element is also outside the part and in the field of view of the imaging device in, iv) triggering the imaging system and forming an image representing at least a part of the exterior of the component and the reference element, v) Move the sensor relative to the part in a movement in a direction different from the measurement direction, and enable the probe to follow the outer profile of the part, while the first reference element remains on the part And perform the same movement as the probe, vi) Perform steps iv) and v) for other points on the outer contour line of the component.
一般而言,本發明亦係關於一種測量一部件之輪廓(詳言之,內部或外部輪廓)之測量方法。根據一個可能性,一種用於測量一部件之一輪廓的此種類之方法包含以下步驟: i)提供一感測器,其包括一探針、扣緊至該探針之一第一參考元件、一基底及連接該探針與該基底之一導引系統,從而允許至少根據界定一測量方向之一個自由度在其間之相對移動,及提供一成像裝置, ii)提供一中空部件,待測定其輪廓, iii)置放該感測器,使得該探針偵測該部件之形廓線上的一點,同時第一參考元件在該部件之外且在該成像裝置之視野中, iv)觸發該成像系統及形成代表該部件之該外部之至少一部分及該參考元件的一影像, v)在於與測量方向不同之一方向上的一移動中相對於該部件移動該感測器,且使該探針能夠依循該部件之該形廓線,同時該第一參考元件保持在該部件之外且實行與該探針相同之移動, vi)針對該部件之該形廓線上的其他點實行步驟iv)及v)。Generally speaking, the present invention also relates to a measuring method for measuring the contour (in detail, the internal or external contour) of a component. According to one possibility, a method of this kind for measuring the contour of a part comprises the following steps: i) A sensor is provided, which includes a probe, a first reference element fastened to the probe, a substrate, and a guiding system connecting the probe and the substrate, thereby allowing at least a measurement according to the definition One degree of freedom of direction relative movement between them, and an imaging device is provided, ii) Provide a hollow part whose contour is to be measured, iii) Place the sensor so that the probe detects a point on the profile of the part, while the first reference element is outside the part and in the field of view of the imaging device, iv) triggering the imaging system and forming an image representing at least a part of the exterior of the component and the reference element, v) Move the sensor relative to the part in a movement in a direction different from the measurement direction, and enable the probe to follow the profile of the part, while the first reference element is held on the part Outside and perform the same movement as the probe, vi) Perform steps iv) and v) for other points on the profile of the component.
根據以上測量方法中之一個或其他的一個佈置,進一步實行以下步驟: a)對於由該成像裝置形成之各影像,計算該第一參考元件與該部件之該外部之該部分之間的相對位置,及 b)基於連續計算的該第一參考元件之該相對位置,重構該部件之該測量的(內部或外部)輪廓。According to one of the above measurement methods or another arrangement, further implement the following steps: a) For each image formed by the imaging device, calculate the relative position between the first reference element and the part of the exterior of the component, and b) Based on the continuously calculated relative position of the first reference element, reconstruct the measured (internal or external) profile of the part.
較佳實施例之詳細說明Detailed description of the preferred embodiment
參看圖1,將根據本發明的包含一感測器110之一測量系統100在其擱置位置中表示,不與待測量的一部件接觸。感測器110包括一基底112,此處呈為剛性且實際上不可變形之一矩形平行立面體稜柱之形式。此基底112之較大尺寸界定軸線Y或測量軸線。沿著此軸線Y,在此基底112上看到的為一第一端112a(在圖1至圖7中右邊)及一第二端112b(在圖1至圖7中左邊)。Referring to FIG. 1, a
與該基底112垂直成直線,感測器110包括一支撐部分114,其具有靠近基底112之形狀和尺寸的一形狀和尺寸。支撐部分114亦為剛性且實際上不可變形。沿著此軸線Y,在此支撐部分114上看到的為一第一端114a(在圖1至圖7中右邊)及一第二端114b(在圖1至圖7中左邊)。In a straight line perpendicular to the
一可變形且彈性導標系統140沿著感測器110之軸線Z或主軸連接感測器110之基底112與支撐部分114,此軸線Z在該等圖中且在進行測量時為垂直。基底112與支撐部分114沿著軸線Z在感測器110之擱置位置中相互對準。A deformable and
與感測器110之軸線Z成直線,藉由一測隙桿122及藉由第一參考元件之一桿131(亦為感測器110之部件)使支撐部分114自其背對基底112之側延伸。此測隙桿122及第一參考元件之此桿131藉由其自由端中之一者安裝於支撐部分114上。在擱置位置中,測隙桿122與第一參考元件之桿131相互平行且平行於主軸Z。測隙桿122與第一參考元件之桿131沿著測量軸線Y按距離Y0(見圖6)相互隔離一段距離(且等距)。測隙桿122及第一參考元件之桿131因此界定一平面(Y, Z)。In line with the axis Z of the
在感測器110之擱置位置中,與測隙桿122及第一參考元件之桿131正交且穿過此等兩個桿122及131的方向為測量軸線Y。定義一橫軸X,其與平面(Z, Y)正交且與測隙桿122及第一參考元件之桿131正交。軸線X、Y及Z定義一正交(較佳地,標準正交)之軸線系統。此等桿122及131為例如金屬,詳言之,特定鋼、桿。In the resting position of the
測隙桿122之自由端(圖1及圖2至圖8中之下部端)端接於一測隙頭123中,從而形成用於測量系統100之感測器110的一探針頭120。此測隙頭123由例如金屬製成,且詳言之,由與測隙桿122相同之金屬或金屬合金製成。測隙頭123例如(見圖6)與穿過測隙桿21之軸線形成為一球體,該測隙桿穿過球體之中心。在可在圖1、圖3至圖5及圖7中看出之一替代實施例中,測隙頭123呈球體部分(在此實例中,一半球)之形式,其安裝於測隙桿122之自由端之面向第一參考元件之桿131的側上:換言之,該半球(測隙頭123)之軸線沿著軸線Y定向。在所有情況中,測隙頭123包括在方向Y上自測隙桿122突起且朝向第一參考元件之桿131突起之一部分。亦即,存在測隙頭123之沿著軸線Y延伸超出測隙桿122的一部分,測隙頭123之此突起部分面向參考桿24(參考頭25)。以此方式,如下文將顯現,可使測隙頭123與一部件之一表面接觸,而測隙桿122亦不與該部件之該表面接觸。The free end of the feeler rod 122 (the lower end in FIGS. 1 and 2 to 8) is terminated in a
第一參考元件之桿131之自由端(圖1及圖3至圖8中之下部端)端接於一第一參考元件130中。此第一參考元件130由例如金屬製成,且詳言之,由與第一參考元件之桿131相同之金屬或金屬合金製成。第一參考元件130例如(見圖1至圖7)呈一球體之形式,其中第一參考元件之桿131之軸線穿過球體之中心。The free end (the lower end in FIGS. 1 and 3 to 8) of the
在圖1至圖8中表示之實施例中,測隙頭123因此安裝於測隙桿122之自由端,且第一參考元件130安裝於第一參考元件之桿131之自由端。又,在圖1至圖8中表示之實施例中,測隙桿122與第一參考元件之桿131為相同長度,或更精確言之,沿著軸線Z延伸超出支撐部分114相同距離。測隙頭123與第一參考元件130因此處於距支撐部分114相同距離Z0(見圖6)處。換言之,測隙頭123及第一參考元件130在支撐部分114下方且處於距支撐部分114相同距離處。In the embodiment shown in FIGS. 1 to 8, the
為了使測隙頭123沿著軸線Y之移動能夠被賦予至第一參考元件130,將支撐部分114連接至基底112之導引系統140至少沿著軸線Y可變形且為彈性。包括安裝於支撐部分114與基底112之間的一或多個彈性元件之各種實施例係可能的。在圖1至圖8中展示之實施例之情況中,兩個板簧141、142用作導引系統140。此等兩個板簧141、142係相同的,且相互平行、平行於主軸Z且平行於橫軸X在感測器110之擱置位置中。換言之,靜止的板簧141、142之平面平行於平面X, Z,且靜止的板簧141、142之平面與軸線Y正交。如可在圖1中看出,一第一板簧141安裝於基底112之第一端112a與支撐部分114之第一端114a之間。第二板簧142安裝於基底112之第二端112b與支撐部分114之第二端114b之間。替代地,可使用相互平行且平行於軸線Z及X之四個板簧,其兩兩安裝,一對板簧安裝於基底112之第一端112a與支撐部分114之第一端114a之間,且另一對板簧安裝於基底112之第二端112b與支撐部分114之第二端114b之間。In order that the movement of the
藉由此佈置,在感測器110之擱置位置(測量系統100之擱置位置)中,一框架與基底112、支撐部分114及兩個板簧141及142形成在一起。此框架形成在感測器110之擱置位置中在平面(Y, Z)中形成一矩形,其中該矩形之長度平行於軸線Z且該矩形之寬度平行於軸線Y。藉由此佈置,在感測器110之測量位置中,可使此矩形變形,如可在圖5中看出。在此情形中,基底112及支撐部分114保持相互平行且平行於軸線Y,具有沿著支撐部分114之軸線Y的一偏移dY1,且第一參考元件131 (130)及第二參考元件151 (150)之桿(頭部)以及板簧141及142經變形。在此測量位置中,板簧141及142之經變形輪廓包括在平面(X, Z)中的兩個實質上直線端部件及與一轉折點形成一曲線之一中央部件。With this arrangement, in the resting position of the sensor 110 (the resting position of the measurement system 100), a frame, the
因此,感測器110之行動部分形成一探針120,其包括支撐部分114及附接至其之元件:測隙桿122、測隙頭123、第一參考元件(桿130及頭131)及導引系統140(板簧141及142)。當自測量位置傳至擱置位置時,亦即,測隙頭123不再與部件之面接觸,板簧141及142恢復其初始直線形式且支撐部分114返回至基底112之垂直向。Therefore, the moving part of the
根據圖1至圖5及圖8中表示之實施例,導引系統140進一步包括一棒143,其第一端143a(在該等圖中,上部端)牢固地固定至基底112,且其第二端143b(在該等圖中,下部端)藉由至少在方向Y上之一滑動連接而安裝於支撐部分114上。在此實施例中,棒140c之第二端143b與支撐部分114之間的連接亦為在方向Z上之一滑動連接,此使吸收在板簧141、142或更通常地導引系統140之在方向Z上的變形有可能。According to the embodiment shown in Figures 1 to 5 and Figure 8, the guiding
實務上,在圖1至圖5及圖8表示之佈置中,支撐部分114包括一凹槽114c,其面向通往支撐部分114之上部面的基底112。如可在圖2中看出,凹槽114c具有沿著軸線X之一寬度l0,其足以無遊隙地容納棒143之自由端或第二端143a。如可在圖2中看出,凹槽114c具有沿著軸線Y之一長度L0以容納及允許棒143之自由端或第二端143b朝向支撐部分114之第一端114a或第二端114b移動對應於准許之最大偏移dY1 (dY1max
)的一預定最大距離。若棒143具有一圓柱形形狀,具有直徑D之一圓形剖面,則凹槽114c因此具有等於或實質上大於D之一寬度l0(l0在D與1.05D之間,包括D及1.05D)及等於D+2(dY1max
)之一長度L0。此凹槽114c因此具有沿著軸線Y之細長大致形狀。以實例說明,此凹槽114c可為矩形、卵形或長方形(鈕扣孔形狀)。此凹槽114c通往或不通往(盲凹槽)支撐部分114之下部面。以實例說明,最大偏移dY1 (dY1max
)為數毫米,例如,2、5、7或10毫米,在圖2至圖5中向右或向左。In practice, in the arrangement shown in FIGS. 1 to 5 and 8, the supporting
參看圖3至圖5,展示在測量部件50之外部輪廓之情況中的感測器110,因此該部件之面51形成一外部面51。較佳地,此部件50為圍繞軸線Z繞轉之一部件,用於待測量的面,亦即,用於外部面51(且任擇地,亦用於內部面54)。Referring to FIGS. 3 to 5, the
更通常地,一種用於測量一部件之外部輪廓的以上種類之方法包括以下步驟: a)如在本文中所描述獲取一感測器110, b)獲取一部件50,其外部輪廓,即,待測量面51(外部面)之輪廓係待測定, c)獲取一成像裝置160(如在圖7中之外部感測器),其適於測定第一參考元件130之位置(此處,如可在圖3中看出,感測器110處於一擱置位置中,其中支撐部分114與基底112處於沿著軸線Z一個堆在一個上對準之一初始位置中), d)抵靠外部面51置放測隙頭123,同時第一參考元件130保持處於距該部件50一段距離(亦即,在該部件50外)(沿著圖3中之箭頭F1移動,藉由感測器110與部件50之外部面51之間沿著軸線Y朝向彼此之移動,以結束於來自圖4之中間位置中,在該位置中導引系統140不變形), e)移動感測器110,使得測隙頭123保持與部件之外部面51接觸,其中基底112相對於支撐部分114且相對於部件50沿著軸線Y移動(探針120與基底112之間的相對移動),(在圖4中之箭頭F1之方向上的移動,其中感測器110之基底112相對於部件50沿著軸線Y移動一段距離dY1,以結束於感測器110之測量位置中),及 f)第一參考元件130之位置由該成像裝置160識別,此使測定在部件50之面51上的測隙頭123之位置有可能,及 g)移動感測器110,使得探針120之測隙頭123行進至部件50之外部面51上的另一位置,同時維持測隙頭123與部件50之外部面51之間的接觸(在圖5中,在沿著軸線Z的箭頭F2之方向上之垂直移動,但此可為在方向X及/或方向Y上之移動,取決於部件50之幾何尺寸),在此之後,重複步驟f)及g),直至完成部件50之外部輪廓(或外部輪廓之部分)之測定。More generally, a method of the above types for measuring the outer contour of a part includes the following steps: a) Obtain a sensor 110 as described herein, b) Obtain a part 50 whose outer contour, that is, the contour of the surface 51 (outer surface) to be measured is to be measured, c) Obtain an imaging device 160 (such as the external sensor in FIG. 7), which is suitable for determining the position of the first reference element 130 (here, as can be seen in FIG. 3, the sensor 110 is in a position In the resting position, in which the support portion 114 and the base 112 are in an initial position aligned one on top of the other along the axis Z), d) Place the feeler head 123 against the outer surface 51, while the first reference element 130 is kept at a distance from the part 50 (that is, outside the part 50) (moving along the arrow F1 in FIG. 3, by The sensor 110 and the outer surface 51 of the component 50 move toward each other along the axis Y to end in the intermediate position from FIG. 4, in which the guiding system 140 is not deformed), e) Move the sensor 110 so that the feeler head 123 remains in contact with the outer surface 51 of the component, wherein the base 112 moves relative to the supporting portion 114 and relative to the component 50 along the axis Y (between the probe 120 and the base 112 Relative movement), (movement in the direction of arrow F1 in FIG. 4, where the base 112 of the sensor 110 moves a distance dY1 relative to the component 50 along the axis Y to end in the measurement position of the sensor 110 ),and f) The position of the first reference element 130 is recognized by the imaging device 160, which makes it possible to determine the position of the feeler head 123 on the face 51 of the component 50, and g) Move the sensor 110 so that the feeler head 123 of the probe 120 travels to another position on the outer surface 51 of the component 50 while maintaining the contact between the feeler head 123 and the outer surface 51 of the component 50 (in In Figure 5, the vertical movement in the direction of the arrow F2 along the axis Z, but this can be the movement in the direction X and/or the direction Y, depending on the geometric size of the component 50), after that, repeat the steps f) and g) until the outer contour (or part of the outer contour) of the component 50 is measured.
在中空件50(孔、凹座、孔洞、開口、外殼52)之情況中,該程序係類似的,將探針120之測隙頭123抵靠部件50之內部面54置放於部件50內部(在外殼52中),同時第一參考元件130保持在部件50外,如參看圖6及圖7所解釋。在圖6中,部件50包括一開口孔洞52,作為一外殼,且在圖7中,該部件包括一盲孔52,作為一外殼。較佳地,此部件50為圍繞軸線Z繞轉之一部件,用於待測量的面,亦即,用於內部面54(且任擇地,亦用於外部面51)。In the case of the hollow member 50 (holes, recesses, holes, openings, housing 52), the procedure is similar, placing the
在此情況中,一種用於測量一部件50之內部輪廓的此種類之方法包括以下步驟(見圖6及圖7): a)獲取一感測器110, b)獲取一中空部件50,其內部輪廓(外殼52之內部面54)係待測定, c)獲取一成像裝置160(如在圖7中之外部感測器),其能夠測定第一參考元件130之位置, d)將測隙頭123置放於該中空部件50內部,其中測隙頭123抵靠內部面54,同時第一參考元件130保持於該中空部件50之外(此處,如在圖6中看出,感測器110在擱置位置中,其中探針120,且詳言之,支撐部分114及基底112在初始位置中,支撐部分114與基底112在軸線Z上一個堆在一個上地對準), e)移動感測器110,使得測隙頭123變得(或保持)與部件50之內部面54接觸,及 f)第一參考元件130之新位置由該成像裝置160識別,此實現測定在部件50中的測隙頭123之新位置,及 g)將感測器110移動至部件50之內部面54上的另一位置,同時維持測隙頭123與部件50之內部面54之間的接觸,在此之後,重複步驟f)及g),直至完成部件50之內部輪廓之測定。In this case, a method of this type for measuring the internal profile of a part 50 includes the following steps (see Figures 6 and 7): a) Obtain a sensor 110, b) Obtain a hollow part 50 whose internal contour (the internal surface 54 of the housing 52) is to be measured, c) Obtain an imaging device 160 (such as the external sensor in FIG. 7), which can determine the position of the first reference element 130, d) Place the feeler head 123 inside the hollow part 50, wherein the feeler head 123 abuts against the inner surface 54 while the first reference element 130 is kept outside the hollow part 50 (here, as in FIG. 6 It can be seen that the sensor 110 is in the resting position, where the probe 120, and in detail, the supporting portion 114 and the base 112 are in the initial position, and the supporting portion 114 and the base 112 are stacked on top of each other on the axis Z. quasi), e) Move the sensor 110 so that the feeler head 123 becomes (or remains) in contact with the inner surface 54 of the component 50, and f) The new position of the first reference element 130 is recognized by the imaging device 160, which realizes the determination of the new position of the feeler head 123 in the part 50, and g) Move the sensor 110 to another position on the inner surface 54 of the component 50, while maintaining the contact between the feeler head 123 and the inner surface 54 of the component 50, after that, repeat steps f) and g) , Until the determination of the internal contour of the component 50 is completed.
每當相對於待測量的部件50之面51或54移動感測器110時,且因此每當在待測量的面51或54上移動測隙頭123時,使用成像裝置(外部感測器)160定位及測定第一參考元件130之位置及其位置之變化。事實上,在圖7之情況中,若第一參考元件130之新位置根據感測器110之位置嚴格對應於沿著Z之移動,則測隙頭123之新位置,因此部件50之內部輪廓的新測量之點,保持在與先前相同的在Y上之位置(dY = 0)。在未展示之另一情況中,其中待測量之面54不平行於垂直方向Z,但例如對應於軸線Z之錐的截錐體,接著在於感測器110之垂直軸線Z上移動後,第一參考元件130之新位置不僅對應於根據感測器110之位置沿著Z之移動,且亦對應於沿著Y之移動,測隙頭123之新位置,因此部件50之內部輪廓的新測量之點,來到相對於感測器之先前位置的在Y上之新位置(dY並非0)。為此目的,成像裝置160包括一可選感測器。在此情況中,一成像裝置160可連同其光軸O使用,其光軸O以與平面(Y, Z)正交之一方式安置(見圖7),以便能夠偵測第一參考元件130(及因此,間接地,測隙頭123)沿著軸線Y之移動。Whenever the
一個此成像裝置160例如由一光學系統(詳言之,一居中之光學系統)形成,該光學系統包含一組光學組件及一影像獲取系統。此種影像獲取系統實現相片及/或視訊之擷取,且為例如錄影攝像機或靜態相機,詳言之,數位靜態相機。An
成像裝置160具有內在性質,使其能夠使用覆蓋安置於部件50外之第一參考元件130的一視野162。在圖6中可看出至視野162之平面(Y, Z)的突起,或成像裝置160對電磁輻射(光)敏感時之立體角。在圖6中表示之情形中,成像裝置160之視野162包括第一參考元件130,且亦覆蓋或涵蓋部件50或部件50之包括待測量的面54(內部面54)之至少部分,詳言之,坐落於視野162之平面(Y, Z)中且對應於待測量的面(若其為外部面51)或與待測量的面54(若其為內部面54)相對之外部面之部分。The
根據在圖8中展示的第一實施例之一變體,感測器110'進一步包含一第二參考元件150,其安裝於基底112上且扣緊至基底112,且坐落於第一參考元件130附近,且在所有情況中,在部件50之外(在圖8佈置中,在第一參考元件130前方且上方)。更精確言之,第二參考元件之桿151固定至基底112之形成基底之第一端112a的側,且與支撐部分114之第一端及第一參考元件130垂直成在線地坐落。此外,將基底112剛性連接至第二參考元件150的第二參考元件之桿151之形狀及長度經佈置以便避免與第一參考元件130及第二參考元件150之任何接觸及基間之任何碰撞。在此實施例中,第二參考元件150為與構成第一參考元件130之球體類似大小之一球體。在本文中,具有參考110'之感測器因此對應於存在與第一參考元件130互動之一第二參考元件150以允許進行測量的情況。事實上,應理解,第二參考元件150扣緊至基底112(且與基底112成整體),其相對此基底112固定,而探針120,且詳言之,第一參考元件130,相對於基底112為行動式。According to a variant of the first embodiment shown in FIG. 8, the sensor 110' further includes a
由於此第二參考元件150,可偵測沿著測隙頭123之軸線Y的偏移,該偏移(未展示)為當測隙頭123抵靠待測量之面51或54時使測隙桿122撓曲之結果。在此情況中,在以上描述之測量方法中,進一步獲得一第二參考元件150,其安裝於基底112上且扣緊至基底112,且坐落於第一參考元件130附近,且其中在測量步驟f)期間,進一步偵測第一參考元件130與第二參考元件150之間的相對移動(詳言之,沿著軸線Y),且在測定測隙頭123之位置時考量此相對移動。因此,顯然,成像裝置160之視野162亦包括第二參考元件150。Due to this
此種第二參考元件150亦適用於測量外部輪廓,因為圍繞測隙桿122之軸線Y的相同撓曲現象易於發生,再次,無第一參考元件之桿131的任何撓曲,此係由於第一參考元件130不與任一表面接觸,且因此不經受可在表面之部件上產生返回力的任何承載力及因此因第一參考元件之桿131之撓曲的變形。This
在第一實施例之此變體之情況中,用於測量一部件50之內部輪廓的方法包括以下步驟(見圖9、圖10A及圖10B):
a)獲取如上所述之一感測器110',
b)獲取一中空部件50,其內部輪廓(外殼52之內部面54)係待測定,
c)獲取一成像裝置160(如在圖9中之外部感測器),其能夠測定第一參考元件130與第二參考元件150之間的相對位置,
d)將測隙頭123置放於該中空部件50內部,其中測隙頭123抵靠內部面54,同時第一參考元件130及第二參考元件150保持於該中空部件50之外(此處,如在圖10A中看出,感測器110'在擱置位置中,其中支撐部分114及基底112在初始位置中,在軸線Z上一個堆在一個上地對準,且其中第一參考元件130與第二參考元件150在參考線R上之軸線Z上一個堆在一個上地對準),
e)沿著軸線Y相對於部件50移動感測器110'(箭頭F1,圖10B),使得測隙頭123變得(或保持)與部件50之內部面54接觸:此產生抵靠內部面54的第一參考元件130之支承力(箭頭A)及板簧141及142之變形,具有支撐部分114相對於基底112之相等且相反移動(箭頭F3),此在第一參考元件130之方向Y上產生相對於第二參考元件150之一偏移dY1(圖10B,具有在方向Y上、在全部探針120之箭頭F3之方向上之一偏移),及
f)第一參考元件130相對於第二參考元件150之位置由該成像裝置160識別,此實現測定在部件50中的測隙頭123之位置,及
g)在方向Z(垂直方向)上將感測器110'移動至部件50之內部面54上的另一位置,同時維持測隙頭123與部件50之內部面54之間的接觸,在此之後,重複步驟f)及g),直至完成部件50之內部輪廓之測定。以此方式,如在圖9中看出,隨著及當連續位置由第一參考元件130採用時,逐點建構一測量線M,其表示內部面54之內部形廓線。顯然,將穿過第二參考元件150(例如,穿過其中心或某一其他點)之垂直參考線R用作一參考,且測量線M為至待測量的內部形廓線(內部輪廓)之線C(圖9)之部件50之外部的換位。In the case of this variation of the first embodiment, the method for measuring the internal profile of a
在此第一實施例中,感測器110或110'與形成感測器中之固定參考的基底112一起形成一平行變形結構,其包含一個堆在一個上且平行的各不可變形之基底112與支撐部分114,及在水平方向Y上可變形之兩個板簧141與142。此實現一測量軸線(此處,軸線Y)之定義,並在部件50上施加測隙頭123之一支承力。此支承力取決於板簧141及142之特性(長度、寬度、厚度)及其變形。In the first embodiment, the
在此第一實施例中,但亦通常地,且如在圖11中看出,本發明實現由保持與部件50接觸的探針120之測隙頭123沿著內部面54(外部面51)非常準確地依循部件50之內部(或外部)形廓線。在描述之實施例中,形廓線之重構及依循在垂直方向Z(測量線M及待重構之形廓線線C的定向)上實行,但可預見到在某一其他方向上的形廓線之此重構及此依循,詳言之,在一水平方向上,例如,在方向X或平面(X, Y)中之某一其他方向上,或再次在針對形廓線部分的前述方向中之一第一者及接著前述方向中之一第二者上,以改變形廓線部分且返回至前述方向中之第一者以檢視此新形廓線部分。儘管有此測隙頭123自部件50外不可見之事實,但歸因於其在外殼52內部之位置,本發明使其在待測量之面54上之移動能夠經由第一參考元件130觀測到。導引系統140實現測隙頭123相對於基底112在一或多個方向上之移動。In this first embodiment, but also generally, and as seen in FIG. 11, the present invention realizes that the
經由具有包括第一參考元件130及該部件及/或第二參考元件150之外部形廓線的一視野162之成像裝置160,本發明實現在第一參考元件130之移動期間的連續影像之擷取及其相對於部件50之外部形廓線(且可能相對於第二參考元件150)的位置之測量。彼等影像實現重構待測量之內部形廓線之線C的測量線M之逐點生產。因為測量系統轉移至在部件外之第一參考元件130,所以使測隙頭123在其依循部件50之內部(或外部)形廓線及因此部件50之內部(或外部)輪廓時之移動有可能。圖9中之測量線M對應於部件50在垂直方向Z上在平行於平面(X, Y)之一水平面中的部件(外殼52)上之一位置(一點)處之內部輪廓。為了重構部件50之所有內部(或外部)輪廓,亦即,內部(外部)面54 (51)之所有表面,必須重複測量步驟以重構穿過在平行於平面(X, Y)之彼水平面中的該部件(外殼52)之另一位置(點)之另一測量線M',等等針對必要數目個點。重構測量線M等於是在部件50外再現在平行於垂直軸Z且與平面(X, Y)正交之一平面中的部件50之「切片」之形廓線。藉由亦重構其他切片,坐落於與垂直軸Z平行且與平面(X, Y)正交之另一平面中的部件20之形廓線之各切片與先前重構的切片之平面偏移一角度θ,藉由影像添加獲得測量線M、M'等在三維空間中之並置。在可重構有少量切片的繞轉(旋轉對稱)之部件50之情況中,此更加迅速。Through the
實行初步校準之一初步步驟,以便準確地測定第一參考元件130與測隙頭123之位置之間的相對位置,此使其後待轉移之測量線M能夠獲得待測量且自部件之外不可見的內部形廓線之線C。為此目的,根據一個可能性,使用成像裝置160擷取無部件50的感測器110或110'之一影像,以便界定第一參考元件130及測隙頭123在感測器110或110'之擱置位置中的相對位置。Perform a preliminary step of preliminary calibration to accurately determine the relative position between the
感測器110或110'可由一固持件或一支撐件(在圖12中圖解表示)藉由其基底112固持,且由任一移動系統(諸如,由控制系統及機動化之軸桿170控制之鉸接臂)移動,以便實現感測器110或110'與部件50之間的相對移動:
-在圖12中之箭頭F1之方向上沿著軸線Y水平地,
及/或
-在圖12中之箭頭F2之方向上沿著軸線Z垂直地。The
現在參看表示根據本發明之一第二實施例的一測量系統200之圖13A及圖13B。在此情況中,類似於以上描述的第一實施例之測量系統(測量系統100)之元件的測量系統200之元件攜一參考符號,其為第一實施例之元件之參考符號增大100。存在一感測器210,其包含:
-一支撐部分214,其朝向測隙桿222(在其自由端攜載一測隙頭223)及第一參考元件之一平行桿231(在其自由端攜載第一參考元件230)之底部垂直延伸,
-一基底232,其朝向第二參考元件之一桿251(在其自由端攜載第二參考元件250)之底部垂直延伸。未展示之一變體可不包括此第二參考元件250,而是僅包括基底232。Now refer to FIG. 13A and FIG. 13B showing a
藉由一導引系統240將支撐部分214與基底212一個排在一個前(在水平方向X上)地置放,該導引系統240允許其間圍繞平行於水平方向X之一軸線P的旋轉移動。此方向X與分開測隙頭223與第一參考元件230之水平測量方向Y正交。為此目的,連接支撐部分214與基底212之導引系統240可按許多方式設計,且詳言之,包括平行於軸線P且與測隙頭223成直線地安置(在圖13A及圖13B中垂直地,亦即,在方向Z上)之一軸桿(未展示)。此軸桿穿過支撐部分214及基底212,且相對於支撐部分214或基底212固定安裝,且相對於支撐部分214或基底212中之另一者行動地安裝,此構成一軸承。導引系統240進一步任擇地包括一螺旋彈簧(未展示),其中其平行於軸線P(且可能與軸線P同軸)之軸線包圍該軸桿,其中其內端固定至該軸桿且其外端固定至支撐部分214或基底212中之另一者。導引系統240圍繞軸線P之此旋轉移動(見圖13A及圖13B中之箭頭F3)因存在連接至支撐部分214之外部的一配重物241而受到促進,在支撐部分214與配重物241之間在方向Y上具有一偏移。此配重物241因此充當對由測隙頭223及第一參考元件230形成之總成的一平衡重量。此配重物241之質量可經修改,且同樣地,將其與軸桿(軸線P)及因此與測隙頭223分開之距離L1可經修改,以便形成一可調整杠桿臂。The supporting
在此情況中,探針220(在測隙桿222之自由端處的測隙頭223)由一導引系統240連接至測量系統之固定部件,從而允許僅相對於與測量方向Y正交之一軸線P的旋轉。此處,其因此為樞轉導引系統240之一問題。其他設計自然地可用於在探針220與感測器210之固定部件(例如,基底212)之間樞轉之此導引系統,從而形成允許其間圍繞平行於水平方向X之一軸線P的旋轉移動之一導引系統240。In this case, the probe 220 (the
因此,形成一鐘擺型結構,其以與根據第一實施例之變體的感測器110'相同之方式發揮功能且實現在方向Y上界定一測量軸線。此結構實現在部件之內部面54(或外部面51)上提供測隙頭223之一恆定且極其弱的支承力A,與螺旋彈簧之變形無關。在此情況中,導引系統240允許探針220之一自由度,其為圍繞平行於軸線X之軸線P的一旋轉移動。一旦測隙頭223不再與部件50之面接觸,則藉由簡單之重力使探針220(詳言之,支撐部分214及附接至其之元件)返回至其擱置位置。此感測器210與一成像裝置160之組合的使用使一部件輪廓測量系統能夠使用與已參考第一實施例描述之測量方法相同的一測量方法形成。Therefore, a pendulum-type structure is formed that functions in the same manner as the
此佈置形成一測量系統200,其中:
-部件50係中空的且部件50之內部形廓線形成圍繞一繞轉軸線之一繞轉面54(此繞轉軸線例如平行於感測器110之主軸,例如,沿著軸線Z),
-探針220包括一測隙頭223,其能夠藉由接觸偵測部件50之內部形廓線,且能夠按照在垂直於該繞轉軸線之一測量方向(方向Y)上之一自由度依循部件50之內部形廓線,此測量方向(方向Y)將測隙頭223與第一參考元件230相互分開,
-導引系統240包括探針220與基底212之間圍繞垂直於該繞轉軸線且與測量方向(方向Y)正交之一軸線(P)的一樞轉連接。
應理解,此測量系統200進一步包括扣緊至基底212(且與其成整體)且坐落於該部件外之一第二參考元件250,該成像裝置160能夠拍攝進一步包含第二參考元件250之一影像,藉此第一參考元件230與第二參考元件250之間的相對位置之變化允許測量部件50之內部形廓線之輪廓。This arrangement forms a
諸如根據圖13A及圖13B之佈置的一佈置允許實施如上所述之一測量方法,其中進一步實行以下步驟:
-比對由成像裝置160拍攝之影像,以偵測第一參考元件130與部件50之外部之部分之間在該測量方向上的相對移動,及
-自其推導探針120與基底112之間的相對移動,其對應於在沿著部件50之測量的輪廓之測量方向上的一偏移。
詳言之,當部件50為中空且部件50之內部形廓線形成圍繞一繞轉軸線(值得注意地,平行於感測器110之該主軸Z的一繞轉軸線)之一繞轉面54時,
-探針220包括一測隙頭223,其能夠藉由接觸偵測部件50之內部形廓線,且能夠按照在垂直於該繞轉軸線之一測量方向Y(值得注意地,垂直於感測器110之該主軸Z的一測量方向Y)上之一自由度依循部件50之內部形廓線,該測量方向Y將測隙頭223與第一參考元件230相互分開,
-導引系統240包括探針220與基底212之間圍繞垂直於該繞轉軸線且與測量方向Y正交之一軸線P的一樞轉連接。
在圖13A及圖13B中說明之實施例中,感測器210進一步包括扣緊至基底212且坐落於該部件50外之一第二參考元件250,該成像裝置160能夠拍攝進一步包含第二參考元件250之一影像,藉此第一參考元件230與第二參考元件250之間的相對位置之變化允許測量部件50之內部形廓線之輪廓。An arrangement such as the arrangement according to FIGS. 13A and 13B allows the implementation of one of the measurement methods described above, wherein the following steps are further carried out:
-Compare the images taken by the
現在參看表示根據本發明之一第三實施例的一測量系統300之圖14A及圖14B。在此情況中,類似於以上描述的第一實施例之測量系統之元件的測量系統300之元件攜一參考標號,其為第一實施例之元件之參考標號增大200。存在一感測器310,其包含:
-一支撐部分314,其朝向測隙桿322(在其自由端攜載一測隙頭323)及第一參考元件之一平行桿331(在其自由端攜載第一參考元件330)之底部垂直延伸,此支撐部分314具有一L大致形狀,其中L之桿在垂直方向Z上定向,且L之底邊平行於方向Y且攜載測隙頭323及第一參考元件330,
-一基底312,其朝向第二參考元件桿351(在其自由端攜載第二參考元件350)之底部垂直延伸。未展示之一變體可不包括此第二參考元件350,而是僅包括基底312。Now refer to FIG. 14A and FIG. 14B showing a
支撐部分314與基底312在水平測量軸線Y之方向上相對於彼此平移行動。此處,基底312為馬鐙形,詳言之,呈倒U之形狀,其中U之底邊平行於方向Y且U之兩個分支平行於方向Z。將基底312的U之兩個分支中之一者延長第二參考元件桿351及延長第二參考元件350。相互平行且平行於方向Y之兩個導引部件將U之兩個分支相互連接以實現支撐部分314之平移移動。更精確言之,一軌道344形成呈桿之形式的第一導引部件,其較佳地具有一圓形剖面,且支撐部分314安裝於其上,在穿過L之桿之部分的一開口之層面。又,滑塊345形成呈平行於軌道344之桿的形式之第二導引部件。為了與滑塊345平移合作,L之桿之其他部分包括例如一凹口以便部分包圍滑塊345,或形成用於滑塊345之一過道的一通孔。The supporting
為了測隙頭323在該部件之內部(或外部)面54 (51)上施加例如在垂直方向上定向的一支承力(箭頭A)且實現沿著軸線Y相對於基底返回至支撐部分314之擱置位置(圖14A)內,使用兩個壓縮彈簧346及347,其形成用於支撐部分314之返回構件。此等彈簧346及347安裝於支撐部分314之各別相對側上之軌道上。此等彈簧346及347具有與支撐部分314接觸(一個彈簧一個面地接觸)且支承於支撐部分314上之一端及與基底312接觸且支承於基底312(各彈簧變得支承於基底312之U之不同分支上)上之一端。如在圖14A及圖14B中展示之實例中,此等為例如兩個盤簧346及347。在圖14A及圖14B中展示之實例中,此等為相同長度且每單位長度相同的抗壓縮性之兩個盤簧346及347,此將支撐部分314之擱置位置(見圖14A)置放於基底312之兩個臂(在測量方向Y上之端部)之間。然而,可根據具體要求調適各彈簧346及347之幾何及/或物理特性。顯然,藉由此佈置,部件50上的測隙頭323之支承力A取決於彈簧346及347之變形:因此,在圖14B之情況中,測隙頭323支承於部件50之內部面54上,在該圖中右邊區域中,在垂直內部面54之一部分上,如由成像裝置看到;在此情況中,感測器310相對於部件50朝向右平移偏移,此已將支撐部分314相對於基底312朝向左移動距離dY1(見圖14B)且壓縮(更多)坐落於支撐部分314之左邊的第一彈簧346。此距離dY1在扣緊至支撐部分314之第一參考元件330與扣緊至基底312之第二參考元件350之間。In order for the
現在參看表示根據本發明之一第四實施例的一測量系統400之圖15A及圖15B。在此情況中,類似於以上描述的根據第三實施例之測量系統300之元件的測量系統400之元件攜一參考標號,其為第三實施例之參考標號增大100。存在一感測器410,其包含:
-一支撐部分414,其朝向測隙桿422(在其自由端攜載一測隙頭423)之底部且平行地按照一第一參考元件桿431(在其自由端攜載第一參考元件430)垂直延伸,此支撐部分414在其側上具有大致形狀U,其中U之底邊在垂直方向Z上定向,U之上部分支在方向Y上定向且U之下部分支(載有測隙頭423及第一參考元件430)亦平行於方向Y定向;
-一基底412,其朝向第二參考元件桿451(在其自由端攜載第二參考元件450)之底部垂直延伸。未展示之一變體可不包括此第二參考元件450,而是僅包括基底412。Now refer to FIG. 15A and FIG. 15B showing a
支撐部分414與基底412朝向此次為垂直軸Z之測量軸線相對於彼此平移行動。此處,基底412亦為馬鐙形,詳言之,呈其側邊躺下的U之形狀,其中U之底邊平行於垂直軸線Z且U之兩個分支平行於軸線Y之方向;支撐部分414之U之開口面朝向基底412;基底412之U之開口面朝向支撐部分414。基底412之U之兩個分支中之一者(下部分支)延伸第二參考元件桿451且延伸第二參考元件450,且部分安置於由支撐部分414定界之外殼中,至少突起至圖15A或圖15B之平面內,亦即,如由成像裝置160(未展示)在方向X上看到。相互平行且平行於方向Z之兩個導引部件將基底412之U之兩個分支相互連接以實現支撐部分414之平移移動。更精確言之,一軌道444形成呈桿之形式的第一導引部件,其較佳地具有一圓形剖面,且支撐部分414安裝於其上,在穿過基底412之U之兩個分支中之另一個(上部分支)之部分的開口之層面。又,滑塊445形成呈平行於軌道444之桿之形式的第二導引部分。為了與滑塊445平移合作,基底412之U之兩個分支中之另一個(上部分支)之此其他部分包括例如一凹口以便部分包圍滑塊445,或形成用於滑塊445之一過道的一通孔。The supporting
為了測隙頭423在該部件之內部(或外部)面54 (51)之一部分上施加例如在水平方向上定向的一支承力(箭頭A)且實現沿著垂直軸線Z相對於基底412返回至支撐部分414之擱置位置(圖15A),使用兩個壓縮彈簧446及447,其形成用於支撐部分412之返回構件。此等彈簧446及447安裝於支撐部分414之上部分支之各別相對側上之軌道444上。此等彈簧446及447具有與支撐部分414接觸且支承於支撐部分414上之一端及與基底412接觸且支承於基底412(各環變得支承於基底412之不同分支上)上之一端。如在圖15A及圖15B中表示之實例中,此等為例如兩個盤簧446及447。在圖15A及圖15B中表示之實例中,此等為相同長度且每單位長度相同的抗壓縮性之兩個盤簧446及447,此將支撐部分414之擱置位置(見圖15A)置放於基底412之兩個臂(在測量方向Z上之端部)之間。然而,可根據具體要求調適各彈簧446及447之幾何及/或物理特性。顯然,藉由此佈置,部件50上的測隙頭423之支承力A取決於彈簧之變形:因此,在圖15B之情況中,測隙頭423支承於在該圖中右邊區域中的部件50之內部面54上,在此由如由成像裝置看到之一水平表面部分上,該測隙頭包括一凹入肩;在此情況中,已存在感測器410相對於部件50在方向Z上向上平移之偏移,此已將支撐部分414相對於基底412向下移動距離dZ1(見圖15B)且壓縮(更多)坐落於支撐部分414之上部分支下的第二彈簧447。此距離dZ1在扣緊至支撐部分414之第一參考元件430與扣緊至基底412之第二參考元件450之間。In order for the
如在圖16中圖解表示,在根據本發明(例如,根據在該等圖中表示且以上描述的實施例中之一者)之測量系統中使用之一成像裝置160包括:
-一錄影攝像機及一組鏡頭,其使此成像裝置160之焦平面能夠置放於部件50上及第一參考元件130 (230、330、430)上,但在適用時,亦在第二參考元件150 (250、350、450)上。為了改良由成像裝置160在其視野162中擷取的影像之對比度,在如在圖16中表示之一實施例中,置放一光源164以相對於由成像裝置160觀測之該物件(或該等物件)提供背光。以此方式,在成像裝置160(之錄影攝像機)之視野162中存在之該或該等物件置放於成像裝置160與光源164之間。此背光產生一影像,諸如在圖17A中之影像(對於為例如測隙頭之一球體部分),在部件與部件之外部之間具有一灰色或深色/淡色分級。處理此影像(圖17B至17F)使一影像能夠在處理I後獲得,處理I實現由成像裝置160(圖17F)看到的彼物件或彼等物件之形廓線之位置之非常準確劃界。As shown diagrammatically in FIG. 16, an
以上已描述第一參考元件130之位置(且在適用時,第二參考元件150之位置)之測定由成像裝置160以一光學方式實行的一技術。本發明可同等地適用於以某一其他方式且詳言之按照某一其他類型之感測器與第一參考元件130及在適用時第二參考元件150之位置之間的接觸來測定第一參考元件130之位置(且在適用時,第二參考元件150之位置)。應注意到,若第一參考元件130之位置及在適用時第二參考元件150之位置係以一光學方式測定,則此實現免除第一參考元件130(第二參考元件150)之桿131 (151)之額外變形及因此將修改測量結果的第一參考元件130(第二參考元件150)之偏移。The above has described a technique in which the determination of the position of the first reference element 130 (and where applicable, the position of the second reference element 150) is performed by the
可指出此等實施例中之一些或所有之間、詳言之第一實施例之測量系統100(具有與第二參考元件150耦接之感測器110或感測器110'之變體)、第二實施例之測量系統200與第三實施例之測量系統300之間的共同點,該導引系統140、240、340為至少在方向Y上之一可撓系統。在第四實施例之測量系統400之情況中,該導引系統440為至少在方向Z上之一可撓系統。It can be pointed out that some or all of these embodiments, in detail, the
又,詳言之,在第一實施例之測量系統100、第二實施例之測量系統200、第三實施例之測量系統300與第四實施例之測量系統400之間,以下安排A至J中之任何一或多者適用於亦構成本發明之標的的一感測器或構造本發明之標的且包括彼種類之一感測器的一測量系統。Also, in detail, between the
*安排A:感測器形成一機械測隙裝置,其適於用以測定部件50之內部輪廓且包含:
-一基底,
-一支撐部分,其由一導引系統彈性連接至該基底,
-一測隙頭,其經由一測隙桿安裝於該支撐部分上,
-一參考頭,其經由一參考桿安裝於該支撐部分上,其中:
-該參考頭及該測隙頭坐落於與該基底相對的該支撐部分之該相對側上,
-該參考桿及該測隙桿安置於一平面Y, Z中,且在該裝置之擱置位置中,相互平行且平行於一方向Z。*Arrangement A: The sensor forms a mechanical gap measuring device, which is suitable for measuring the internal contour of the
*安排B:該導引系統使得當該測隙頭變得且保持與該部件之一表面接觸時,該測隙頭與該基底之間的相對移動至少部分經由該導引系統傳輸至該參考頭。* Arrangement B: The guidance system is such that when the feeler head becomes and remains in contact with a surface of the component, the relative movement between the feeler head and the substrate is at least partially transmitted to the reference via the guidance system head.
*安排C:該導引系統使得當該測隙頭變得且保持與不平行於平面Y, Z之一表面接觸時,該測隙頭與該基底之間在方向Y上的任何相對移動至少部分經由該導引系統傳輸至該參考頭。* Arrangement C: The guiding system makes any relative movement between the feeler head and the substrate in direction Y at least when the feeler head becomes and remains in contact with one of the surfaces that are not parallel to the plane Y, Z Part of it is transmitted to the reference head via the guidance system.
*安排D:該導引系統包括形成一彈簧之至少一個元件。詳言之,該導引系統包括將該支撐部分連接至該基底之兩個平行板簧,在裝置之擱置位置中,各板簧之平面與方向Y正交。*Arrangement D: The guiding system includes at least one element forming a spring. In detail, the guiding system includes two parallel leaf springs connecting the support part to the base. In the resting position of the device, the plane of each leaf spring is orthogonal to the direction Y.
*安排E:該測隙頭安裝於測隙桿之自由端處,且該參考頭(第一參考元件)安裝於參考桿之自由端處。*Arrangement E: The feeler head is installed at the free end of the feeler rod, and the reference head (first reference element) is installed at the free end of the reference rod.
*安排F:該測隙桿與該參考桿為相同長度。* Arrangement F: The feeler rod and the reference rod are the same length.
*安排G:該裝置進一步包含一校準指示器(第二參考元件),其安裝於基底上且扣緊至基底且坐落於參考頭附近。 此校準指示器(第二參考元件)實現偵測測隙頭在方向Y(或在方向Z上,或在方向X上)上之偏移。*Arrangement G: The device further includes a calibration indicator (second reference element) installed on the base and fastened to the base and located near the reference head. This calibration indicator (second reference element) realizes the detection of the offset of the feeler head in the direction Y (or in the direction Z, or in the direction X).
*安排H:一測量系統包括以上種類之一機械測隙裝置及具有一外部感測器之一外部裝置(諸如,一成像裝置),該外部裝置適於測定參考頭(第一參考元件)之位置。* Arrangement H: A measurement system includes one of the above types of mechanical gap measurement devices and an external device with an external sensor (such as an imaging device), the external device is suitable for measuring the reference head (first reference element) position.
*安排I:以上種類之一測量系統,其中該外部感測器為具有一光學感測器之一光學裝置,其光軸以與平面(Y, Z)之一正交方式安置。* Arrangement I: One of the above types of measurement systems, where the external sensor is an optical device with an optical sensor, and its optical axis is arranged in a way orthogonal to one of the planes (Y, Z).
*安排J:測量方向與感測器(110)之該主軸(Z)正交,例如,在水平方向Y上。* Arrangement J: The measurement direction is orthogonal to the main axis (Z) of the sensor (110), for example, in the horizontal direction Y.
如上所述的測量系統之第一實施例100、第二實施例200、第三實施例300及第四實施例400包括一機械感測器,且因此為一接點輪廓測定技術之實例。然而,根據本發明之測量系統可同等地呈無接點系統之形式。The
以上種類的根據本發明之一測量系統可裝備一測量台或一站用於檢查機械加工期間之部件,且可甚至為一機器工具之一整合模組。The above kind of measuring system according to the present invention can be equipped with a measuring table or a station for inspecting parts during machining, and can even be an integrated module of a machine tool.
X:橫軸 Y:測量軸線 Z:主(垂直)軸線 Y0:分開測隙桿與第一參考元件桿之距離 Z0:分開測隙頭及第一參考元件與支撐部分之距離 dY1:在測量位置中的基底與支撐部分之間的偏移 l0:凹槽114c寬度 L0:凹槽114c長度 F1,F2:箭頭(感測器110之移動) F3:箭頭(支撐部分相對於基底112之移動) A:箭頭(第一參考元件130在部件50上之支承力) R:參考線(穿過第二參考元件150之垂直線) M:內部面54之內部輪廓之測量線 C:依循待測量之內部輪廓的線 50:部件 51:待測量之面(外部面) 52:外殼(孔洞、孔等) 54:待測量之面(內部面) 100:測量系統(第一實施例) 110,110',210,310,410:感測器 112,212:基底 112a:第一端 112b:第二端 114,214:支撐部分 114a:支撐部分之第一端 114b:支撐部分之第二端 114c:凹槽 120,220,320,420:探針 122,222,322,422:測隙桿 123,223,323,423:測隙頭 130,230,330,430:第一參考元件 131,231,331,431:第一參考元件桿 140,240,340,440:導引系統 141:第一板簧 142:第二板簧 143:棒 143a:棒之第一端 143b:棒之第二端 150,250,350,450:第二參考元件 151,251,351,451:第二參考元件桿 160:成像裝置 162:成像裝置之視野 164:光源 I:處理後之影像 200:測量系統(第二實施例) 241:配重物 P:214與212之間的旋轉軸線 L1:杠桿臂之長度 300:測量系統(第三實施例) 312,412:基底(馬鐙形) 314:支撐部分(L形滑動行動車架) 344,444:軌道 345,445:滑塊 346,446:第一盤簧 347,447:第二盤簧 400:測量系統(第三實施例) 414:支撐部分(U形滑動行動車架)X: horizontal axis Y: measuring axis Z: main (vertical) axis Y0: Separate the distance between the feeler rod and the first reference element rod Z0: Separate the distance between the feeler head and the first reference element and the supporting part dY1: Offset between the base and the supporting part in the measurement position l0: groove 114c width L0: Length of groove 114c F1, F2: Arrow (movement of sensor 110) F3: Arrow (movement of supporting part relative to base 112) A: Arrow (the supporting force of the first reference element 130 on the component 50) R: Reference line (the vertical line passing through the second reference element 150) M: Measuring line of the internal contour of the internal surface 54 C: Follow the line of the internal contour to be measured 50: Parts 51: Surface to be measured (external surface) 52: Shell (holes, holes, etc.) 54: Surface to be measured (internal surface) 100: Measuring system (first embodiment) 110, 110', 210, 310, 410: sensor 112,212: base 112a: first end 112b: second end 114,214: supporting part 114a: The first end of the supporting part 114b: The second end of the supporting part 114c: groove 120, 220, 320, 420: probe 122,222,322,422: feeler rod 123,223,323,423: feeler head 130, 230, 330, 430: the first reference element 131,231,331,431: first reference element rod 140, 240, 340, 440: guidance system 141: The first leaf spring 142: second leaf spring 143: Stick 143a: The first end of the stick 143b: The second end of the stick 150, 250, 350, 450: second reference element 151, 251, 351, 451: second reference element rod 160: imaging device 162: Field of Vision of Imaging Device 164: light source I: Processed image 200: measurement system (second embodiment) 241: Counterweight P: Rotation axis between 214 and 212 L1: Length of lever arm 300: measurement system (third embodiment) 312,412: Base (Stirrup-shaped) 314: Support part (L-shaped sliding action frame) 344,444: Orbit 345,445: Slider 346,446: first coil spring 347,447: second coil spring 400: measurement system (third embodiment) 414: Support part (U-shaped sliding action frame)
本發明之實施例指示於由附圖繪示之描述中,其中: 圖1為根據本發明之一第一實施例的測量系統之透視圖, 圖2為根據本發明之第一實施例的測量系統之在圖1中之箭頭II之方向上的部分透視圖, 圖3至圖5為使用來自圖1測量系統的測量之各種步驟之正視圖, 圖6為展示使用來自圖1之測量系統測量一部件之內部輪廓的原理之剖面正視圖, 圖7為在測量一部件之內部輪廓之情況中使用來自圖1的根據本發明之第一實施例的測量系統之測量方法之原理之圖解透視圖, 圖8為根據本發明之該第一實施例的測量系統之一變體之正視圖, 圖9為展示在一部件之內部輪廓之情況中實現的測量之原理的根據本發明之第一實施例的測量系統之變體之更圖解性正視圖, 圖10A及圖10B展示使用根據本發明之第一實施例的測量系統之圖9變體的測量方法之步驟, 圖11及圖12圖解展示根據本發明的測量系統之一般原理, 圖13A及圖13B展示使用根據本發明之一第二實施例的一測量系統之測量之步驟, 圖14A及圖14B展示使用根據本發明之一第三實施例的一測量系統之測量之步驟, 圖15A及圖15B展示使用根據本發明之一第四實施例的一測量系統之測量之步驟, 圖16及圖17A至圖17F分別展示可在根據本發明之測量系統中使用之成像裝置及處理或分析當使用根據本發明之測量方法時由該成像裝置擷取的影像之可能步驟。The embodiments of the present invention are indicated in the description illustrated by the drawings, in which: Fig. 1 is a perspective view of a measurement system according to a first embodiment of the present invention, 2 is a partial perspective view of the measurement system according to the first embodiment of the present invention in the direction of arrow II in FIG. 1, Figures 3 to 5 are front views of various steps of using the measurement system of Figure 1, Fig. 6 is a sectional front view showing the principle of measuring the internal profile of a component using the measuring system from Fig. 1, Fig. 7 is a schematic perspective view of the principle of the measuring method using the measuring system according to the first embodiment of the present invention from Fig. 1 in the case of measuring the internal profile of a component, Fig. 8 is a front view of a variation of the measurement system according to the first embodiment of the present invention, Fig. 9 is a more diagrammatic front view of a variation of the measurement system according to the first embodiment of the present invention showing the principle of measurement achieved in the case of the internal profile of a component, 10A and 10B show the steps of a measurement method using a variant of FIG. 9 of the measurement system according to the first embodiment of the present invention, 11 and 12 diagrammatically show the general principle of the measurement system according to the present invention, 13A and 13B show the steps of measurement using a measurement system according to a second embodiment of the present invention, 14A and 14B show the steps of measurement using a measurement system according to a third embodiment of the present invention, 15A and 15B show the steps of measurement using a measurement system according to a fourth embodiment of the present invention, FIGS. 16 and 17A to 17F respectively show an imaging device that can be used in the measurement system according to the present invention and possible steps for processing or analyzing images captured by the imaging device when using the measurement method according to the present invention.
50:部件 50: Parts
52:外殼(孔洞、孔等) 52: Shell (holes, holes, etc.)
54:待測量之面(內部面) 54: Surface to be measured (internal surface)
100:測量系統(第一實施例) 100: Measuring system (first embodiment)
110:感測器 110: Sensor
112:基底 112: Base
112a:第一端 112a: first end
112b:第二端 112b: second end
114:支撐部分 114: support part
114a:支撐部分之第一端 114a: The first end of the supporting part
114b:支撐部分之第二端 114b: The second end of the supporting part
114c:凹槽 114c: groove
122:測隙桿 122: feeler rod
123:測隙頭 123: feeler head
130:第一參考元件 130: The first reference element
131:第一參考元件桿 131: first reference element rod
140:導引系統 140: Guidance System
141:第一板簧 141: The first leaf spring
142:第二板簧 142: second leaf spring
143:棒 143: Stick
160:成像裝置 160: imaging device
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2018
- 2018-12-04 CH CH01490/18A patent/CH715610A1/en unknown
-
2019
- 2019-11-28 US US17/299,456 patent/US11854220B2/en active Active
- 2019-11-28 WO PCT/IB2019/060289 patent/WO2020115621A1/en unknown
- 2019-11-28 CA CA3157829A patent/CA3157829A1/en active Pending
- 2019-11-28 EP EP19817418.7A patent/EP3890922B1/en active Active
- 2019-11-28 CN CN201980080027.7A patent/CN113260482B/en active Active
- 2019-11-28 KR KR1020217020728A patent/KR20210131993A/en active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
JP2022510150A (en) | 2022-01-26 |
CH715610A1 (en) | 2020-06-15 |
EP3890922B1 (en) | 2024-01-03 |
US11854220B2 (en) | 2023-12-26 |
JP7220788B2 (en) | 2023-02-10 |
KR20210131993A (en) | 2021-11-03 |
CN113260482A (en) | 2021-08-13 |
CA3157829A1 (en) | 2020-06-11 |
EP3890922A1 (en) | 2021-10-13 |
CN113260482B (en) | 2023-09-22 |
US20220028106A1 (en) | 2022-01-27 |
WO2020115621A1 (en) | 2020-06-11 |
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