TW202026137A - A curved composite panel and a manufacturing method thereof - Google Patents

Abstract

A curved composite panel including a substrate and a curved coating layer is provided. The curved coating layer extends outward from an edge of the substrate. The hardness of the substrate is greater than the hardness of the curved coating layer. A manufacturing method of a curved composite panel is also provided.

Description

Curved composite board and manufacturing method thereof

The invention relates to a composite board and a manufacturing method thereof, and particularly relates to a curved composite board and a manufacturing method thereof.

Generally, curved glass used to cover electronic components has a high cost and is difficult to control dimensional accuracy. In addition, the edges and corners of the glass are prone to brittle fracture under a slight external force.

The invention provides a method for manufacturing a curved composite board, which has low manufacturing cost and is relatively simple.

The invention provides a curved composite board whose surface hardness is relatively large to reduce scratches or scratches, and the brittleness of the corners is relatively small, thereby reducing the possibility of fracture due to collision or carelessness.

The manufacturing method of the curved composite board of the present invention includes the following steps. Fix the substrate in the concave mold. The convex mold and the concave mold are used to form a glue layer between the convex mold and the concave mold, and the glue layer covers at least the edge of the substrate. The adhesive layer is cured to form a coating, and the coating extends from the edge of the substrate to a direction away from the substrate.

The curved composite board of the present invention includes a substrate and a curved coating. The curved coating extends outward from the edge of the substrate, and the hardness of the substrate is greater than the hardness of the curved coating.

Based on the above, the manufacturing method of the curved composite board is composed of a coating formed by a hardened substrate and a cured adhesive layer, so the manufacturing cost is relatively low and simple. In addition, a substrate with a higher hardness can reduce scratches or scratches, and the brittleness of the coating is smaller, which can reduce the possibility of fracture due to collision or carelessness.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

The description of the text is only in the direction of matching the diagram, and is not used to limit the present invention. For example, FIG. 1A to FIG. 1E, FIG. 2A to FIG. 2D, FIG. 3 or FIG. 4 can be upside down, rotated 90° clockwise or 90° counterclockwise. Therefore, in the subsequent text description, the narrative method similar to "one component or one component is on another component or another component" will be described in Figure 1A to Figure 1E, Figure 2A to Figure 2D, Figure 3 or Figure 4 After being turned upside down, it can be interpreted as similar to "a component or a component is under another component or another component." When Figure 1A to Figure 1E, Figure 2A to Figure 2D, Figure 3 or Figure 4 are rotated clockwise by 90° Later, it can be interpreted as something like "a component or a component is on the right of another component or another component." It can be interpreted as after turning Figure 1A to Figure 1E, Figure 2A to Figure 2D, Figure 3 or Figure 4 upside down. Similar to "One element or one component is on the left of another element or another component."

1A to 1E are schematic cross-sectional views of a method for manufacturing a curved composite board according to a first embodiment of the present invention. Fig. 1F is a schematic top view of a part of a method for manufacturing a curved composite board according to the first embodiment of the present invention. Fig. 1G is a schematic top view of a part of a method for manufacturing a curved composite board according to the first embodiment of the present invention.

Fig. 1F may be a schematic top view of Fig. 1A. For example, FIG. 1A may be a schematic cross-sectional view on the AA' section line in FIG. 1F.

Fig. 1G may be a schematic top view of Fig. 1C. For example, FIG. 1C may be a schematic cross-sectional view on the BB' section line in FIG. 1G.

For clarity of illustration, some elements or components may be omitted from the illustration in FIGS. 1A to 1G, or part of the elements or components may be exaggeratedly illustrated. For example, in FIG. 1G, the punch 160 shown in FIG. 1C is omitted.

1A and 1F, a substrate 110 and a concave mold 150 are provided. The concave mold 150 has a depression 151, and the substrate 110 can be placed in the depression 151 of the concave mold 150.

In this embodiment, the substrate 110 may be a rigid plate-shaped body. For example, the substrate 110 may be a metal plate, a glass plate, a plastic plate, or other suitable rigid flat plates.

In an embodiment, the substrate 110 may be a rigid insulating plate, but the invention is not limited thereto. In other words, the substrate 110 may be a hard bare substrate. For example, the substrate 110 may be a chemically strengthened glass plate or a thermally strengthened glass plate. Generally speaking, the pencil hardness of strengthened glass can reach 9H or above, and it can have good application, hard, scratch-resistant and easy-to-clean characteristics.

In this embodiment, the recess 151 of the die 150 may have a plurality of vent holes 152, but the present invention is not limited thereto. In one embodiment, after the substrate 110 is placed in the recess 151 of the concave mold 150, the substrate 110 may be fixed in the recess 151 of the concave mold 150 by the vent 152, but the present invention is not limited to this . In other embodiments not shown, the substrate 110 may be fixed in the recess 151 of the concave mold 150 by an adhesive film.

In this embodiment, the concave mold 150 may further have a plurality of injection channels 153, but the present invention is not limited to this. The glue channel 153 may communicate with the recess 151.

1B, in this embodiment, after the substrate 110 is fixed in the concave mold 150, the convex mold 160 can be brought close to the substrate 110 on the concave mold 150. The male mold 160 has a protrusion 161, and the protrusion 161 of the male mold 160 can directly contact the substrate 110 on the female mold 150. In other words, there may be a distance D1 between the protrusion 161 of the male mold 160 and the recess 151 of the female mold 150, and the aforementioned distance D1 may be substantially the same as the thickness 110h of the substrate 110. In this way, the convex mold 160, the substrate 110 and the concave mold 150 can form the glue filling space 170.

1C and 1G, after the convex mold 160, the substrate 110, and the concave mold 150 form the glue space 170 (shown in FIG. 1B), an uncured glue layer 122 is formed in the glue space 170.

In this embodiment, the glue used to form the glue layer 122 can be poured into the recess 151 of the concave mold 150 from at least one glue channel 153 of the concave mold 150 by one or more potting methods. . In other words, the glue layer 122 is located between the convex mold 160 and the concave mold 150, and the glue layer 122 covers at least the edge 113 of the substrate 110. For example, the material of the glue layer 122 is epoxy resin, and the glue material used to form the glue layer 122 can be commonly known as A glue and B glue, or uncured A/B glue (A Glue and glue B). Compared with acrylic resins, epoxy resins have better fluidity and are suitable for potting.

In this embodiment, the adhesive layer 122 may only cover the edge 113 of the substrate 110, and not the upper surface 111 of the substrate 110 (that is, the surface of the substrate 110 closest to the protrusion 161 of the convex mold 160) and the lower surface of the substrate 110 112 (ie, the substrate 110 is closest to the surface of the recess 151 of the concave mold 150), but the present invention is not limited thereto.

In one embodiment, the process of pouring the glue for forming the glue layer 122 from the glue channel 153 of the concave mold 150 into the recess 151 of the concave mold 150 by means of glue can be performed in an almost vacuum environment. Or inside the cavity. The aforementioned method can be referred to as a vacuum suction infusion technique, which can reduce the possibility of bubble generation.

1D, after the glue layer 122 (shown in Figure 1C) is formed in the glue space 170 (shown in Figure 1B), the glue layer 122 in the glue space 170 is cured to form a cured glue Layer 123. The glue layer 122 in the glue filling space 170 can be cured by standing at room temperature, standing by heating or illuminating according to its material, but the invention is not limited to this. For example, if the material of the adhesive layer 122 is epoxy resin, it can be cured by standing at room temperature or by heating.

1D, after the cured adhesive layer 123 is formed, the substrate 110 and the cured adhesive layer 123 can be separated from the convex mold 160 (shown in FIG. 1C) and the concave mold 150 (shown in FIG. 1C). Moreover, for example, a part of the cured adhesive layer 123 can be removed from the cutting line DL by cutting to form the coating 131 (shown in FIG. 1E). For example, the removed part of the cured adhesive layer 123 may correspond to the part of the glue channel 153 (shown in FIG. 1D) of the die 150, but the present invention is not limited thereto. In other words, in this embodiment, the coating 131 may correspond to a part of the recess 151 (shown in FIG. 1C) of the die 150, and may be referred to as a curved coating 131.

After the above-mentioned manufacturing process, the manufacturing of the curved composite board 100 of the first embodiment can be substantially completed.

The curved composite board 100 includes a substrate 110 and a curved coating 131. The curved coating 131 extends outward from the edge 113 of the substrate 110 and is curved. The substrate 110 may be a hard plate-shaped body, and the curved coating 131 may be formed by a cured adhesive layer 122 (shown in FIG. 1C or FIG. 1G). In other words, the curved composite board 100 may be a rigid insulating board, and the hardness of the substrate 110 is greater than the hardness of the curved coating 131.

In this embodiment, the thickness 110h of the substrate 110 is substantially the same as the thickness 131h of the curved coating 131, but the invention is not limited thereto.

In this embodiment, the brittleness of the substrate 110 is greater than the brittleness of the curved coating 131. Generally speaking, brittleness refers to the property that a substance breaks without significant plastic deformation when subjected to force. Even if the brittle material has higher hardness, it may still be brittle fracture due to some external force. Taking one non-specific application of the curved composite board 100 as an example, the curved composite board 100 can be configured on an electronic component (such as a display panel or a touch display panel), and a substrate 110 with a higher hardness can protect the curved surface. The electronic components covered by the composite board 100 are scratched or scratched during use or manufacturing, and the curved coating 131 with less brittleness can protect the electronic components covered by the curved composite board 100 from collision or failure during use or manufacturing. A break caused by caution.

2A to 2D are schematic cross-sectional views of a method for manufacturing a curved composite board according to a second embodiment of the present invention. The manufacturing method of the curved composite board 200 of the second embodiment is similar to the manufacturing method of the curved composite board 100 of the first embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials or formation methods, and are omitted description.

Please refer to FIG. 2A, a substrate 110 and a concave mold 250 are provided. The concave mold 250 has a depression 251, and the substrate 110 can be fixed in the depression 251 of the concave mold 250.

In this embodiment, the recess 251 of the concave mold 250 may have a plurality of vent holes 252, and the concave mold 250 may not have a glue channel (for example, the glue channel 153 of the concave mold 150 similar to the previous embodiment) . The use or configuration of the vent hole 252 of the concave mold 250 can be the same or similar to the vent hole 152 of the concave mold 150 in the foregoing embodiment, so it will not be repeated.

2B, in this embodiment, after the substrate 110 is fixed in the concave mold 250, a glue 221 may be formed on the substrate 110 in the concave mold 250. In this embodiment, the glue 221 used to form the glue layer 222 (shown in FIG. 2C) can be dotted or coated on the substrate 110 in the concave mold 250 by dispensing. For example, the material of the glue layer 222 is epoxy resin, and the glue material 221 used to form the glue layer 222 can be commonly known as A glue and B glue, or uncured A/B glue (A glue and B glue). Mixed glue). Compared with acrylic resin, epoxy resin has better fluidity and is suitable for dispensing.

In this embodiment, the glue 221 may only cover the upper surface 111 of the substrate 110, but the invention is not limited to this. In other embodiments not shown, the adhesive 221 may further cover the edge 113 of the substrate 110 or the concave mold 250.

2C, in this embodiment, after the adhesive 221 (shown in FIG. 2B) is formed on the substrate 110 in the concave mold 250, the convex mold 260 can be brought close to the substrate 110 on the concave mold 250, and the convex mold The 260 may directly contact the glue 221 covering the upper surface 111 of the substrate 110. In this way, the glue 221 covering the upper surface 111 of the substrate 110 can overflow the upper surface 111 of the substrate 110 after being pressed by the convex mold 260 to further cover the edge 113 of the substrate 110 and the concave mold 250. In other words, the glue layer 222 formed by the overflow glue 221 may be located between the convex mold 260 and the concave mold 250 and cover at least the edge 113 of the substrate 110.

In an embodiment not shown, the male mold 260 and/or the female mold 250 may have an overflow channel, but the invention is not limited thereto. The excess glue 221 can overflow through the overflow channel.

In this embodiment, the protrusion 261 of the male mold 260 may not contact the substrate 110 on the female mold 250. In other words, there may be a distance D2 between the protrusion 261 of the male mold 260 and the recess 251 of the female mold 250, and the aforementioned distance D2 is greater than the thickness 110h of the substrate 110. In other words, the uncured adhesive layer 222 may further cover the upper surface 111 of the substrate 110, but the invention is not limited to this.

In one embodiment, the process of bringing the convex mold 260 close to the substrate 110 on the concave mold 250 and making the convex mold 260 directly contact the adhesive material 221 covering the upper surface 111 of the substrate 110 may be in an almost vacuum environment or Carried out in the cavity. The aforementioned method can be referred to as a vacuum pressure forming technique, which can reduce the possibility of bubble generation.

Please continue to refer to FIG. 2C, after forming the adhesive layer 222 covering at least the edge 113 of the substrate 110, the adhesive layer 222 may be cured to form a cured adhesive layer. According to the material of the adhesive layer 222, it can be cured by standing at room temperature, standing under heating, or irradiating light, and the present invention is not limited to this. For example, if the material of the adhesive layer 222 is epoxy resin, it can be cured by standing at room temperature or heating.

2D, after curing the adhesive layer 222, the substrate 110 and the cured adhesive layer can be separated from the convex mold 260 (shown in FIG. 2C) and the concave mold 250 (shown in FIG. 2C). The cured adhesive layer may correspond to a part of the recess 251 (shown in FIG. 2C) of the concave mold 250 and/or a part of the protrusion 261 (shown in FIG. 2C) of the convex mold 260. The cured adhesive layer covers the substrate A part of the surface 110 may be referred to as a flat coating 232, and another part of the adhesive layer connected to the edge 113 of the substrate 110 and the edge 232a of the flat coating 232 after curing may be referred to as a curved coating 231.

In this embodiment, since the curved coating 231 and the flat coating 232 can be formed of the same material and through the same steps, the curved coating 231 and the flat coating 232 are connected to each other, and the flat coating 232 The edge 232a of is basically a virtual edge used to define the boundary between the curved coating 231 and the planar coating 232.

After the above-mentioned manufacturing process, the production of the curved composite board 200 of the second embodiment can be substantially completed.

The curved composite board 200 includes a substrate 110, a flat coating 232 and a curved coating 231. The flat coating 232 covers the substrate 110 and is connected to the curved coating 231. The curved coating 231 extends from the edge 113 of the substrate 110 and the edge 232a of the planar coating 232 in a direction away from the substrate 110. The substrate 110 may be a hard plate-shaped body, and the curved coating 231 may be formed by a cured glue layer 222. In other words, the curved composite board 200 may be a rigid insulating board, and the hardness of the substrate 110 is greater than the hardness of the curved coating 231 and the hardness of the planar coating 232.

In this embodiment, the sum of the thickness 110h of the substrate 110 and the thickness 232h of the planar coating 232 is substantially the same as the thickness 231h of the curved coating 231. In other words, the thickness 110h of the substrate 110 is smaller than the thickness 231h of the curved coating 231.

In this embodiment, the brittleness of the substrate 110 is greater than the brittleness of the curved coating 231. Taking one of the non-specific application modes of the curved composite board 200 as an example, the curved composite board 200 may be disposed on it in such a way that the curved coating 231 faces an electronic component (such as a display panel or a touch display panel), and has The substrate 110 with greater hardness can protect the electronic components covered by the curved composite board 200 from scratches or scratches during use or manufacture, while the curved coating 231 with less brittleness can protect the electronic components covered by the curved composite board 200 from scratches. The corners are broken due to collision or carelessness during use or manufacture.

3 is a schematic cross-sectional view of a part of a method for manufacturing a curved composite board according to a third embodiment of the present invention. The manufacturing method of the curved composite board (not shown) of the third embodiment is similar to the manufacturing method of the curved composite board 100 of the first embodiment. Similar components are indicated by the same reference numerals and have similar functions, materials or formations. Way, and omit the description. Specifically, FIG. 3 is a schematic cross-sectional view of the method for manufacturing a curved composite board following the steps of FIG. 1A.

Please refer to FIG. 3, in this embodiment, after the substrate 110 is fixed in the concave mold 150, the convex mold 360 can be brought close to the substrate 110 on the concave mold 150. The convex mold 360 has a protrusion 361, and the protrusion 361 of the convex mold 360 may not contact the substrate 110 on the concave mold 150. In other words, there may be a distance D3 between the protrusion 361 of the male mold 360 and the recess 151 of the female mold 150, and the aforementioned distance D3 may be greater than the thickness 110h of the substrate 110. In this way, the convex mold 360, the substrate 110 and the concave mold 150 can form the glue filling space 270.

Similar to the steps in FIG. 1C, after the convex mold 360, the substrate 110, and the concave mold 150 form the glue filling space 370, a glue layer is formed in the glue filling space 370 (not shown, it may be the same or similar to the glue layer in FIG. 1C 122).

In this embodiment, the glue used to form the glue layer can be poured into the recess 151 of the concave mold 150 from at least one glue channel 153 of the concave mold 150 by one or more glue injections. In other words, the glue layer is located between the convex mold 360 and the concave mold 150, and the glue layer covers the edge 113 of the substrate 110 and the upper surface 111 of the substrate 110 (that is, the surface of the substrate 110 closest to the protrusion 361 of the convex mold 360) . For example, the material of the glue layer is epoxy resin, and the glue material used to form the glue layer can be commonly known as A glue and B glue, or uncured A/B glue (a mixture of A glue and B glue) glue).

After forming the adhesive layer on the edge 113 of the substrate 110 and the upper surface 111 of the substrate 110, the adhesive layer can be cured first, and then the substrate 110 and the cured adhesive layer can be removed from the convex mold 360 and the concave mold through the steps similar to FIG. 1D. 150 separate. Of course, it is also possible to selectively remove part of the cured adhesive layer by cutting to form a flat coating (not shown, which may be the same or similar to the flat coating 232 in FIG. 2D) and a curved coating (not shown) As shown, it may be the same or similar to the curved coating 231 in FIG. 2D). In this way, the curved composite board (not shown) completed by the method of manufacturing the curved composite board (not shown) of this embodiment is substantially similar in appearance to the curved composite board 200 of the second embodiment, so here Do not repeat it again.

4 is a schematic cross-sectional view of a part of a method for manufacturing a curved composite board according to a fourth embodiment of the present invention. The manufacturing method of the curved composite board (not shown) of the fourth embodiment is similar to the manufacturing method of the curved composite board 200 of the second embodiment, and similar components are denoted by the same reference numerals and have similar functions, materials or formations. Way, and omit the description. Specifically, FIG. 4 is a schematic cross-sectional view of the method for manufacturing a curved composite board following the steps of FIG. 2B.

4, in this embodiment, after forming a plastic material (not shown, which may be the same as or similar to the plastic material 221 in FIG. 2B) on the substrate 110 in the concave mold 250, the convex mold 460 can be brought close to the concave The substrate 110 on the mold 250 and the protrusion 461 of the male mold 460 directly contact the adhesive material covering the upper surface 111 of the substrate 110 and then directly contact the substrate 110 on the female mold 250. In this way, the glue covering the upper surface 111 of the substrate 110 can completely overflow the upper surface 111 of the substrate 110 after being pressed by the convex mold 460 to cover the edge 113 of the substrate 110 and the concave mold 250. That is to say, the glue layer formed by the overflow glue material (not shown, may be the same or similar to the glue layer in FIG. 1C) can only cover the edge 113 of the substrate 110, and not the upper surface of the substrate 110 111 (that is, the surface of the substrate 110 closest to the protrusion 461 of the punch 460).

After the adhesive layer covering the edge 113 of the substrate 110 is formed, the adhesive layer may be cured. According to the material of the adhesive layer, it can be cured by standing at room temperature, standing by heating or irradiating light, and the present invention is not limited to this. For example, if the material of the adhesive layer is epoxy resin, it can be cured by standing at room temperature or heating. Then, the substrate 110 and the cured adhesive layer are separated from the convex mold 460 and the concave mold 250. In this way, the curved composite board (not shown) completed by the method of manufacturing the curved composite board (not shown) of this embodiment is substantially similar in appearance to the curved composite board 100 of the first embodiment, so here Do not repeat it again.

In summary, the manufacturing method of the curved composite board of the present invention is composed of a hardened substrate and a coating formed by a cured adhesive layer, so the manufacturing cost is relatively low and simple. In addition, a substrate with a higher hardness can reduce scratches or scratches, and the brittleness of the coating is smaller, which can reduce the possibility of fracture due to collision or carelessness.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

100, 200: curved composite board 110: substrate 111: upper surface 112: lower surface 113: Edge 110h: thickness 150, 250: Die 151, 251: depression 152, 252: Vent 153: Glue channel 160, 260, 360, 460: punch 161, 261, 361, 461: protrusion 170, 370: Glue filling space 221: plastic 122, 222: glue layer 123: Adhesive layer after curing 131, 231: curved surface coating 131h, 231h: thickness 232: Flat coating 232a: Edge 232h: thickness D1, D2, D3: spacing DL: Cutting line

1A to 1E are schematic cross-sectional views of a method for manufacturing a curved composite board according to a first embodiment of the present invention. Fig. 1F is a schematic top view of a part of a method for manufacturing a curved composite board according to the first embodiment of the present invention. Fig. 1G is a schematic top view of a part of a method for manufacturing a curved composite board according to the first embodiment of the present invention. 2A to 2D are schematic cross-sectional views of a method for manufacturing a curved composite board according to a second embodiment of the present invention. 3 is a schematic cross-sectional view of a part of a method for manufacturing a curved composite board according to a third embodiment of the present invention. 4 is a schematic cross-sectional view of a part of a method for manufacturing a curved composite board according to a fourth embodiment of the present invention.

100: Curved composite board

110: substrate

113: Edge

110h: thickness

131: Curved coating

131h: thickness

Claims (11)

A method for manufacturing a curved composite board includes: Fix a substrate in a concave mold; Forming a glue layer between the convex mold and the concave mold by a convex mold and the concave mold, and the glue layer covers at least the edge of the substrate; and The adhesive layer is cured to form a coating, and the coating extends from the edge of the substrate in a direction away from the substrate. According to the method for manufacturing a curved composite board as described in item 1 of the scope of patent application, the material of the adhesive layer includes epoxy resin. According to the method for manufacturing a curved composite board as described in item 1 of the scope of patent application, the step of forming the adhesive layer by the convex mold and the concave mold includes: Bringing the convex mold close to the substrate on the concave mold, so that the convex mold, the substrate, and the concave mold form a glue filling space; and The glue layer is formed in the glue filling space. According to the method for manufacturing a curved composite board as described in item 1 of the scope of patent application, the step of forming the adhesive layer by the convex mold and the concave mold includes: Forming a glue material on the substrate in the concave mold; and The convex mold is approached to the substrate on the concave mold and contacts the glue, so that the glue overflows to cover at least the edge of the substrate. The method for manufacturing a curved composite board according to any one of item 3 or item 4 of the scope of patent application, wherein the step of bringing the convex mold close to the concave mold is to make the convex mold contact the concave mold Substrate. A curved composite board, including: A substrate; and A curved coating extends outward from the edge of the substrate, and the hardness of the substrate is greater than the hardness of the curved coating. The curved composite board according to item 6 of the scope of patent application, wherein the brittleness of the substrate is greater than the brittleness of the curved coating. According to the curved composite board described in item 6 of the scope of patent application, the thickness of the substrate is substantially the same as the thickness of the curved coating. The curved composite board described in item 6 of the scope of patent application further includes: A plane coating layer covers the substrate and is connected with the curved surface coating layer, and the curved surface coating layer extends from the edge of the substrate and the edge of the plane coating layer in a direction away from the substrate. According to the curved composite board described in item 9 of the scope of patent application, the sum of the thickness of the substrate and the thickness of the flat coating is substantially the same as the thickness of the curved coating. The curved composite board described in item 1 of the scope of patent application, wherein the curved composite board is a rigid insulating board.

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