TW202024694A - Back-light module - Google Patents
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- TW202024694A TW202024694A TW107147534A TW107147534A TW202024694A TW 202024694 A TW202024694 A TW 202024694A TW 107147534 A TW107147534 A TW 107147534A TW 107147534 A TW107147534 A TW 107147534A TW 202024694 A TW202024694 A TW 202024694A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/009—Positioning aspects of the light source in the package
Abstract
Description
本發明涉及顯示領域,尤其是一種背光模組。The invention relates to the field of display, in particular to a backlight module.
由於LED發光度亮、整體的體積更小,對於3C產品的薄型化具有相當大的助益。但是LED為點狀的光源,為了讓光線均勻的發散,則必須透過在導光板對應LED的表面上設置微結構,例如,角柱結構、或是菱鏡結構,藉此來將光源均勻的發散,而達到面光源的效果。Due to the brighter luminosity of the LED and the smaller overall volume, it is of great help to the thinning of 3C products. However, the LED is a point-shaped light source. In order to make the light diverge uniformly, it is necessary to arrange microstructures on the surface of the light guide plate corresponding to the LED, such as a corner column structure or a rhombus mirror structure, to uniformly diverge the light source. To achieve the effect of surface light source.
隨著顯示器的設計,希望充分利用面板的利用率,以將顯示區的比例提升,此時,在顯示區周邊的非顯示區,例如,邊框等,必須縮減面積,因而,在設計上,背光模組必須更加薄化。但是,微結構的製程上面臨了尺寸的極限,在導光板與光源之間的距離至少要大於4mm。此外,若省略了微結構改以其他能散射的結構,容易有光干涉條紋(mura)的問題出現,而大幅影響了視覺效果,難以達到出貨的標準。With the design of the display, it is hoped to make full use of the utilization rate of the panel to increase the proportion of the display area. At this time, the non-display area around the display area, such as the frame, must be reduced in area. Therefore, in the design, the backlight Modules must be thinner. However, the manufacturing process of the microstructure faces the limit of size, and the distance between the light guide plate and the light source must be at least greater than 4mm. In addition, if the microstructure is omitted and replaced with another structure capable of scattering, the problem of light interference fringes (mura) is likely to occur, which greatly affects the visual effect and is difficult to meet the shipping standard.
此外,為了減少微結構的影響,現有技術中有應用兩個LED併排的設計來解決光干涉問題的方式。但是此需要將點光源排列成直線,以呈現線光源的效果,再透過導光板達到面光源的功效。但是LED需要配合打件技術來與驅動電路,再安裝LED晶粒,及與電路板打件電性連接時,都容易發生LED位置偏離的現象,受到由於打件精度的侷限,使得實際的效果並無法達到預期。In addition, in order to reduce the influence of the microstructure, there is a way to solve the problem of light interference by applying the design of two LEDs side by side in the prior art. However, it is necessary to arrange the point light sources in a straight line to present the effect of a line light source, and then achieve the effect of a surface light source through the light guide plate. However, when LEDs need to cooperate with the printing technology to connect with the drive circuit, install the LED die, and electrically connect with the circuit board, the position of the LED is prone to deviation. Due to the limitation of the printing accuracy, the actual effect is It was not up to expectations.
有鑑於此,在此提供一種背光模組。背光模組包含導光板、複數個單面出光燈源、以及複數個多面出光燈源。單面出光燈源位於導光板的入光側。多面出光燈源位於導光板的入光側,且多面出光燈源位於兩個單面出光燈源之間。In view of this, a backlight module is provided here. The backlight module includes a light guide plate, a plurality of single-sided light emitting lamp sources, and a plurality of multi-sided light emitting lamp sources. The single-side light emitting lamp source is located on the light incident side of the light guide plate. The multi-side light emitting lamp source is located on the light incident side of the light guide plate, and the multi-side light emitting lamp source is located between two single-side light emitting lamp sources.
在一些實施例中,多面出光燈源的尺寸小於單面出光燈源。In some embodiments, the size of the multi-side light emitting lamp source is smaller than the single-side light emitting lamp source.
在一些實施例中,背光模組更包含軟性電路板,單面出光燈源及多面出光燈源設置在軟性電路板的同一表面上。In some embodiments, the backlight module further includes a flexible circuit board, and the single-sided light emitting lamp source and the multi-sided light emitting lamp source are arranged on the same surface of the flexible circuit board.
在一些實施例中,導光板的入光側包含入光面及複數個延伸導光塊,延伸導光板由入光面延伸出,且延伸導光塊分別對應於多面出光燈源。In some embodiments, the light incident side of the light guide plate includes a light incident surface and a plurality of extended light guide blocks, the extended light guide plate extends from the light incident surface, and the extended light guide blocks respectively correspond to multi-sided light emitting lamp sources.
在一些實施例中,延伸導光塊包含底面及斜面,底面大致垂直於入光面,且底面面對多面出光燈源的主出光面,斜面由入光面斜向地延伸至底面。更進一步地,在一些實施例中,背光模組更包含反射片,反射片與導光板及單面出光燈源接觸。且軟性電路板與反射片位於導光板及單面出光燈源的相對兩表面。又進一步地,在一些實施例中,反射片更貼附於斜面上。在一些實施例中,反射片覆蓋導光板的基面,基面對應於該導光板的出光側。在另一些實施例中,反射片設置於導光板之出光側的一部分上,並遮蔽多面出光燈源。In some embodiments, the extended light guide block includes a bottom surface and an inclined surface, the bottom surface is substantially perpendicular to the light incident surface, and the bottom surface faces the main light emitting surface of the multi-sided light emitting lamp source, and the inclined surface extends obliquely from the light incident surface to the bottom surface. Furthermore, in some embodiments, the backlight module further includes a reflective sheet, which is in contact with the light guide plate and the single-sided light source. And the flexible circuit board and the reflective sheet are located on the opposite surfaces of the light guide plate and the single-sided light source. Furthermore, in some embodiments, the reflective sheet is further attached to the inclined surface. In some embodiments, the reflective sheet covers the base surface of the light guide plate, and the base surface corresponds to the light exit side of the light guide plate. In other embodiments, the reflective sheet is disposed on a part of the light-emitting side of the light guide plate, and shields the multi-sided light-emitting lamp source.
在一些實施例中,單面出光燈源的一出光面朝向入光面,出光面的第一法線方向與各多面出光燈源之主出光面的第二法線方向大致上成正交。In some embodiments, one light-emitting surface of the single-sided light-emitting lamp source faces the light-incident surface, and the first normal direction of the light-emitting surface is substantially orthogonal to the second normal direction of the main light-emitting surface of each multi-sided light-emitting lamp source.
在一些實施例中,單面出光燈源及多面出光燈源為藍光LED,且在入光面及底面上更分別設置有量子點膜,單面出光燈源及多面出光燈源所發出藍光激發該量子點膜中的複數個量子點為白光。In some embodiments, the single-sided light emitting lamp source and the multi-sided light emitting lamp source are blue LEDs, and a quantum dot film is further provided on the light incident surface and the bottom surface respectively, and the single-sided light emitting lamp source and the multi-sided light emitting lamp source emit blue light excitation The plurality of quantum dots in the quantum dot film are white light.
在一些實施例中,在入光面上更設置有複數個導光微結構。In some embodiments, a plurality of light guiding microstructures are further provided on the light incident surface.
在一些實施例中,多面出光燈源之間的間距為2.1至5.5mm。In some embodiments, the distance between the multi-sided light emitting lamp sources is 2.1 to 5.5 mm.
綜上所述,上述實施例主要是透過設置多面出光燈源位於兩個單面出光燈源之間,藉此克服因為用以散光之微結構尺寸極限、或是傳統LED排列精度不佳,而無法克服顯示器之非顯示區減薄的設計上所導致的問題。進而能應用在顯示器之非顯示區減薄的設計上,提供良好的視覺感受。In summary, the above-mentioned embodiments mainly provide a multi-sided light source located between two single-sided light sources to overcome the limitation of the size of the microstructure used for astigmatism or the poor accuracy of traditional LED arrangement. It is impossible to overcome the problems caused by the design of thinning the non-display area of the display. Furthermore, it can be applied to the design of thinning the non-display area of the display, providing a good visual experience.
以下在實施方式中詳細敘述本發明之詳細特徵及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。The detailed features and advantages of the present invention will be described in detail in the following embodiments, and the content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings Anyone who is familiar with relevant skills can easily understand the purpose and advantages of the present invention.
在附圖中,為了清楚起見,放大了部分元件、區域等的寬度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如元件被稱為在另一元件“上”或“連接到”另一元件時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或“直接連接到”另一元件時,不存在中間元件。In the drawings, the widths of some elements, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element is referred to as being "on" or "connected" to another element, it can be directly on or connected to the other element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements.
應當理解,儘管術語“第一”、“第二”、“第三”等在本文中可以用於描述各種元件、部件、區域、或部分,但是這些元件、部件、區域、及/或部分不應受這些術語的限制。這些術語僅用於將一個元件、部件、區域、或部分與另一個元件、部件、區域、層或部分區分開。因此,下面討論的“第一元件”、“部件”、“區域”、或“部分”可以被稱為第二元件、部件、區域、或部分而不脫離本文的教導。It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, or portions, these elements, components, regions, and/or portions are not Should be limited by these terms. These terms are only used to distinguish one element, component, region, or section from another element, component, region, layer or section. Therefore, the “first element,” “component,” “region,” or “portion” discussed below may be referred to as a second element, component, region, or portion without departing from the teachings herein.
此外,諸如“下”或“底部”和“上”或“頂部”的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其他元件的“下”側的元件將被定向在其他元件的“上”側。因此,示例性術語“下”可以包括“下”和“上”的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件“下方”的元件將被定向為在其它元件“上方”。因此,示例性術語“下面”或“下面”可以包括上方和下方的取向。In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device other than those shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.
圖1為第一實施例之背光模組的局部俯視圖。如圖1所示,第一實施例的背光模組1包含導光板10、複數個單面出光燈源20、以及複數個多面出光燈源30。單面出光燈源20位於導光板10的入光側11。複數個多面出光燈源30位於導光板10的入光側11,且各多面出光燈源30位於單面出光燈源20的兩個之間。在此,燈源可以為發光二極體(LED)。FIG. 1 is a partial top view of the backlight module of the first embodiment. As shown in FIG. 1, the
多面出光燈源30的尺寸小於單面出光燈源20。舉例而言,單面出光燈源20直徑的尺寸1.5至4.2mm,而多面出光燈源30的尺小於或等於單面出光燈源20的20%。此外,單面出光燈源20、以及複數個多面出光燈源30排列的方式,可以為鋸齒狀交錯的排列,單面出光燈源20及多面出光燈源30不為在同一水平線上。然而,這僅為示例,而非限於此。The size of the multi-side light
另外,再次參閱圖1,在此,多面出光燈源30之間的間距d為2.1至5.5mm。更詳細地,間距d是只從一個多面出光燈源30的中心點到另一個多面出光燈源30的中心點之間的距離。In addition, referring to FIG. 1 again, here, the distance d between the multi-faceted light
除此之外,如圖1所示,背光模組,更包含一軟性電路板40,單面出光燈源20及多面出光燈源30設置於軟性電路板40上的同一表面上,例如,上表面或下表面。此外,單面出光燈源20及多面出光燈源30更位於導光板10的同一側,即入光側11。一般來說,多面出光燈源30為出光方向發散的點光源,而具有多個出光方向,且多面出光燈源30位於兩個單面出光燈源20之間;因此多面出光燈源30可以透過不同方向的出光,達到補償單面出光燈源20的功效,使整個背光模組1發出的光線呈現面光源的效果。In addition, as shown in FIG. 1, the backlight module further includes a
圖2為第二實施例之背光模組的局部俯視圖。圖3A為沿圖2之A-A線剖面的剖面示意圖。圖3B為沿圖2之B-B線剖面的剖面示意圖。在圖2中,省略了覆蓋於複數個單面出光燈源20、複數個多面出光燈源30、軟性電路板40上的反射片50,以利描述相對的位置關係。如圖2、圖3A及圖3B所示,第二實施例的背光模組1包含導光板10、複數個單面出光燈源20、複數個多面出光燈源30、軟性電路板40。與第一實施例相異之處在於導光板10的入光側11具有入光面111及複數個延伸導光塊15,延伸導光板15由入光面111延伸出,且延伸導光塊15分別對應於多面出光燈源30。此,延伸導光塊15可以是方塊,並具有底面151。如圖3B所示,底面151與軟性電路板40之間距有一間隙,而多面出光燈源30位於間隙之中,底面151對應於多面出光燈源30的主出光面305,多面出光燈源30產生的光線主要由主出光面305射出進入底面151,再由延伸導光塊15可以進入導光板10的內部,導向特定方向。FIG. 2 is a partial top view of the backlight module of the second embodiment. Fig. 3A is a schematic cross-sectional view taken along the line A-A of Fig. 2. Fig. 3B is a schematic cross-sectional view taken along line B-B of Fig. 2. In FIG. 2, the reflecting
一般來說,多面出光燈源30的高度也較單面出光燈源20為低,且多面出光燈源30且其主出光面305與單面出光燈源20的出光面205方向不同。因而延伸導光塊15具有高度補償的效果,以維持主出光面305與底面151之間的間距小於或等於出光面205與入光面111之間的間距。Generally speaking, the height of the multi-side light emitting
此外,單面出光燈源20包含有發光源21及封裝體23,封裝體23可以為具有反射式的罩體,能使得發光源21所發出的光線反射、匯集而從出光面205出光,而配置為將光線都導入導光板10中,已使光線導向特定的方向,例如,使用者的視角方向。另外,多面出光燈源30可以為晶片級封裝發光二極體(Chip Scale Package LED,CSP LED),其不具有反射式罩體,因此,多面出光燈源30具有多個出光方向,但以其主出光面305的發光強度最強。In addition, the single-sided light emitting
如圖3A及圖3B所示,可以理解的是,單面出光燈源20的出光面朝205向入光面111,而出光面205對應於底面151,因此,單面出光燈源20之出光面205的第一法線方向D1與多面出光燈源30之主出光面305的第二法線方向D2大致上成正交。換言之,在圖2中,第一法線方向D1可以為由下到上的方向,而第二法線方向D2可以為出紙面的方向,大致上成正交,表示兩者之間可以與正交(90度)呈一些許的角度差,例如,正負十度。As shown in FIGS. 3A and 3B, it can be understood that the light-emitting surface of the single-sided light-emitting
圖3C為第三實施例沿圖2之B-B線剖面的剖面示意圖。第三實施例與第二實施例不同之處在於延伸導光塊15的形狀,在A-A線的面的結構大致雷同,在此不再贅述。如圖3C所示,在第三實施例中,延伸導光塊15包含底面151及斜面153,底面151大致垂直於入光面111,且面對多面出光燈源30的主出光面305,斜面153由入光面111斜向地延伸至底面151。因而,由多面出光燈源30進入延伸導光塊15的光線,會在斜面153產生反射或是折射,而導向入光面111的方向。3C is a schematic cross-sectional view of the third embodiment along the line B-B in FIG. 2. The third embodiment is different from the second embodiment in that the shape of the extended
再次參閱圖3A、圖3B及圖3C,在第二實施例與第三實施例中,背光模組1更包含反射片50,反射片50與部分的導光板10及單面出光燈源20接觸。在此,導光板10朝向第二法線方向D2的表面定義為光出側13。軟性電路板40與反射片50是位於單面出光燈源20的相對兩表面。更進一步地,如圖3B所示,反射片50位於導光板10出光側13的一部分上,且部分的導光板10位於軟性電路板40上。反射片50可以呈長條狀,遮蔽多面出光燈源30,且在對應多面出光燈源30的區域,由下而上的堆疊依據為軟性電路板40、多面出光燈源30、導光板10及反射片50。進一步地,反射片50更貼附於延伸導光塊15的側面155上。而如圖3C所示,延伸導光塊15更貼附於延伸導光塊15的斜面153上。反射片50可以將光線反射回導光板10中而導向特定方向,如此能增加出光的強度。又進一步地,如圖3A、圖3B及圖3C的底部所示,在一些實施例中,還可以貼覆另一反射片50於導光板10的底部。除此之外,軟性電路板40可以白色,以增強反射的效果。Referring again to FIGS. 3A, 3B and 3C, in the second and third embodiments, the
圖4為第四實施例之背光模組的局部俯視圖、圖5A為第四實施例沿圖4之A-A線剖面的剖面示意圖。圖5B為第四實施例沿圖4之B-B線剖面的剖面示意圖。第四實施例在俯視上,與第二實施例及第三實施例所不同之處在於,能看到軟性電路板40。如圖4、圖5A及圖5B所示,第四實施例與其他實施例相異之處在於軟性電路板40及反射片50的位置。第四實施例相較於第三實施例,其軟性電路板40及反射片50的方向倒置,另外,反射片50是覆蓋導光板10整個基面17上,以將單面出光燈源20、多面出光燈源30、以及環境光,都朝向出光面205反射。如圖5A所示,反射板50與軟性電路板40是設置在單面出光燈源20的相反表面上。如圖5B所示,在對應於多面出光燈源30的區域,由下而上的堆疊依據為反射片50、導光板10、多面出光燈源30、及軟性電路板40。此外,導光板10的一部份可以位於軟性電路板40上,且位於單面出光燈源20的同一側,且反射片50更可貼附於斜面153及部分的導光板10上。4 is a partial top view of the backlight module of the fourth embodiment, and FIG. 5A is a schematic cross-sectional view of the fourth embodiment along the line A-A in FIG. 4. 5B is a schematic cross-sectional view of the fourth embodiment taken along the line B-B in FIG. 4. The fourth embodiment differs from the second embodiment and the third embodiment from the top view in that the
圖6A為第五實施例沿圖2之A-A線局部剖面的剖面放大示意圖。圖6B為第五實施例沿圖2之B-B線局部剖面的剖面放大示意圖。如圖6A及圖6B所示,第五實施例是採圖3A、3C的配置,僅將左側部技術不同之處放大表示,第五實施例不同於前述實施例之處在於其單面出光燈源20及多面出光燈源30為藍光LED。另外,在入光面111及底面151更分別設置有量子點膜60。一般所利用的單面出光燈源20及多面出光燈源30是白光LED,而第五實施例是利用單面出光燈源20及多面出光燈源30所發出藍光激發量子點膜60中的複數個量子點61為白光。其色彩的波長較為連續,此類的背光模組1所應用的顯示器可以具有更高的色彩飽和度。在此,量子點61可以為黃色或橘色螢光粉的量子點。然而,此僅為示例,而非用以限制。6A is an enlarged schematic cross-sectional view of a partial cross-section along the line A-A in FIG. 2 of the fifth embodiment. 6B is an enlarged schematic cross-sectional view of a partial cross-section along the line B-B in FIG. 2 of the fifth embodiment. As shown in FIGS. 6A and 6B, the fifth embodiment adopts the configuration of FIGS. 3A and 3C, and only the technical difference on the left side is enlarged to show. The fifth embodiment is different from the previous embodiment in its single-sided light emitting lamp The
圖7為第六實施例沿圖2之A-A線剖面的局部剖面放大示意圖。如圖7所示,第六實施例是採圖3A的配置,僅將左側部技術不同之處放大表示,第六實施例不同於其他實施例之處在於其導光板10在入光面111上設置有複數個導光微結構70。導光微結構70可以為菱鏡片等,透過導光微結構70及多面出光燈源30的效果,可以將單面出光燈源20點光源的視覺效果減少,唯,第六實施例是應用確保導光微結構70製程精度的條件下,例如,在導光板10與單面出光燈源20間的距離大於或等於4mm時的條件下。Fig. 7 is an enlarged schematic partial cross-sectional view of the sixth embodiment taken along the line A-A in Fig. 2. As shown in FIG. 7, the sixth embodiment adopts the configuration of FIG. 3A, and only the technical difference on the left side is enlarged. The sixth embodiment is different from other embodiments in that the
綜上實施例所述,背光模組1主要是透過設置多面出光燈源30位於兩個單面出光燈源20之間,藉此克服因為用以散光之微結構尺寸極限、或是傳統LED排列精度不佳,而無法克服顯示器之非顯示區減薄的設計上所導致的問題。因此,背光模組1更可以用在更薄化的顯示器中,提供良好的視覺效果。In summary, the
雖然本發明的技術內容已經以較佳實施例揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神所作些許之更動與潤飾,皆應涵蓋於本發明的範疇內,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the technical content of the present invention has been disclosed in the preferred embodiment as above, it is not intended to limit the present invention. Anyone who is familiar with this technique and makes some changes and modifications without departing from the spirit of the present invention should be covered by the present invention Therefore, the scope of protection of the present invention shall be subject to the scope of the attached patent application.
1:背光模組 10:導光板 11:入光側 111:入光面 13:出光側 15:延伸導光塊 151:底面 153:斜面 155:側面 17:基面 20:單面出光燈源 205:出光面 21:發光源 23:封裝體 30:多面出光燈源 305:主出光面 40:軟性電路板 50:反射片 60:量子點膜 61:量子點 70:導光微結構 D1:第一法線方向 D2:第二法線方向 d:間距 1: Backlight module 10: Light guide plate 11: Light side 111: light incident surface 13: Light emitting side 15: Extended light guide block 151: Bottom 153: Slope 155: side 17: Base surface 20: Single-sided light source 205: Glossy Surface 21: Luminous source 23: Package body 30: Multi-sided light source 305: Main Glossy Surface 40: flexible circuit board 50: reflective sheet 60: Quantum dot film 61: Quantum dots 70: light guide microstructure D1: First normal direction D2: Second normal direction d: spacing
圖1為第一實施例之背光模組的局部俯視圖。 圖2為第二實施例之背光模組的局部俯視圖。 圖3A為沿圖2之A-A線剖面的剖面示意圖。 圖3B為沿圖2之B-B線剖面的剖面示意圖。 圖3C為第三實施例沿圖2之B-B線剖面的剖面示意圖。 圖4為第四實施例之背光模組的局部俯視圖。 圖5A為第四實施例沿圖4之A-A線剖面的剖面示意圖。 圖5B為第四實施例沿圖4之B-B線剖面的剖面示意圖。 圖6A為第五實施例沿圖2之A-A線局部剖面的剖面放大示意圖。 圖6B為第五實施例沿圖2之B-B線局部剖面的剖面放大示意圖。 圖7為第六實施例沿圖2之A-A線局部剖面的剖面放大示意圖。FIG. 1 is a partial top view of the backlight module of the first embodiment. FIG. 2 is a partial top view of the backlight module of the second embodiment. Fig. 3A is a schematic cross-sectional view taken along the line A-A of Fig. 2. Fig. 3B is a schematic cross-sectional view taken along line B-B of Fig. 2. 3C is a schematic cross-sectional view of the third embodiment along the line B-B in FIG. 2. 4 is a partial top view of the backlight module of the fourth embodiment. Fig. 5A is a schematic cross-sectional view of the fourth embodiment taken along the line A-A in Fig. 4. 5B is a schematic cross-sectional view of the fourth embodiment taken along the line B-B in FIG. 4. 6A is an enlarged schematic cross-sectional view of a partial cross-section along the line A-A in FIG. 2 of the fifth embodiment. 6B is an enlarged schematic cross-sectional view of a partial cross-section along the line B-B in FIG. 2 of the fifth embodiment. FIG. 7 is an enlarged schematic cross-sectional view of a partial cross-section along the line A-A in FIG. 2 of the sixth embodiment.
1:背光模組 1: Backlight module
10:導光板 10: Light guide plate
11:入光側 11: Light side
15:延伸導光塊 15: Extended light guide block
20:單面出光燈源 20: Single-sided light source
30:多面出光燈源 30: Multi-sided light source
40:軟性電路板 40: flexible circuit board
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