TW202023726A - 雷射加工裝置 - Google Patents

雷射加工裝置 Download PDF

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Publication number
TW202023726A
TW202023726A TW108139286A TW108139286A TW202023726A TW 202023726 A TW202023726 A TW 202023726A TW 108139286 A TW108139286 A TW 108139286A TW 108139286 A TW108139286 A TW 108139286A TW 202023726 A TW202023726 A TW 202023726A
Authority
TW
Taiwan
Prior art keywords
laser processing
processing head
laser
light
line
Prior art date
Application number
TW108139286A
Other languages
English (en)
Chinese (zh)
Inventor
坂本剛志
奥間惇治
Original Assignee
日商濱松赫德尼古斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商濱松赫德尼古斯股份有限公司 filed Critical 日商濱松赫德尼古斯股份有限公司
Publication of TW202023726A publication Critical patent/TW202023726A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW108139286A 2018-10-30 2019-10-30 雷射加工裝置 TW202023726A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-203675 2018-10-30
JP2018203675A JP7219590B2 (ja) 2018-10-30 2018-10-30 レーザ加工装置

Publications (1)

Publication Number Publication Date
TW202023726A true TW202023726A (zh) 2020-07-01

Family

ID=70463748

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139286A TW202023726A (zh) 2018-10-30 2019-10-30 雷射加工裝置

Country Status (5)

Country Link
JP (1) JP7219590B2 (ja)
KR (1) KR20210082486A (ja)
CN (1) CN113039036B (ja)
TW (1) TW202023726A (ja)
WO (1) WO2020090891A1 (ja)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56129340A (en) * 1980-03-13 1981-10-09 Toshiba Corp Method of dividing platelike material
JP4110219B2 (ja) * 2002-08-30 2008-07-02 株式会社東京精密 レーザーダイシング装置
JP2004276101A (ja) * 2003-03-18 2004-10-07 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
KR100641716B1 (ko) * 2005-02-16 2006-11-10 토파즈엘시디 주식회사 레이저를 이용한 도광판 제조방법
GB0622232D0 (en) * 2006-11-08 2006-12-20 Rumsby Philip T Method and apparatus for laser beam alignment for solar panel scribing
JP2010010209A (ja) * 2008-06-24 2010-01-14 Tokyo Seimitsu Co Ltd レーザーダイシング方法
CN101826575B (zh) * 2010-02-20 2012-01-04 英利能源（中国）有限公司 一种光伏组件的敷设方法
JP5456510B2 (ja) 2010-02-23 2014-04-02 株式会社ディスコ レーザ加工装置
JP5284299B2 (ja) * 2010-03-04 2013-09-11 シャープ株式会社 薄膜太陽電池の製造方法、および薄膜太陽電池製造用のレーザ加工装置
JP5789802B2 (ja) * 2011-03-22 2015-10-07 株式会社ソシオネクスト 半導体チップの製造方法
DE102011079739A1 (de) * 2011-07-25 2013-01-31 Lpkf Laser & Electronics Ag Vorrichtung und Verfahren zur Durchführung und Überwachung eines Kunststoff-Laserdurchstrahl-Schweißprozesses
CN102637012B (zh) * 2012-04-01 2013-12-18 深圳市联赢激光股份有限公司 一种用于激光加工设备的双路功率负反馈系统
JP6559477B2 (ja) * 2015-06-23 2019-08-14 株式会社ディスコ ウェーハの加工方法
CN205166178U (zh) * 2015-10-26 2016-04-20 惠州市杰普特电子技术有限公司 激光焊接装置
CN205290076U (zh) * 2015-12-16 2016-06-08 深圳市联懋塑胶有限公司 一种手机壳加工用激光焊接装置

Also Published As

Publication number Publication date
WO2020090891A1 (ja) 2020-05-07
CN113039036A (zh) 2021-06-25
KR20210082486A (ko) 2021-07-05
CN113039036B (zh) 2023-08-29
JP2020069488A (ja) 2020-05-07
JP7219590B2 (ja) 2023-02-08

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