TW202018846A - Substrate supply system and substrate processing device - Google Patents

Abstract

This substrate supply system (1) supplies substrates (W) to a conveyance path from a cassette (10) which houses a plurality of substrates (W) in a state stacked separated by a prescribed interval, and is provided with: a first storage unit (101) which detachably stores a first cassette (10); a second storage unit (102) which detachably stores a second cassette (20); a pull-out mechanism (200) which pulls substrates (W) out of the first cassette (10) and the second cassette (20) in a direction perpendicular to the direction of stacking of the substrates (W) and transfers these to the conveyance path; and a moving mechanism (300) which moves the pull-out mechanism (200) between the first storage unit (101) and the second storage unit (102).

Description

Substrate supply system and substrate processing device

The invention relates to a substrate supply system for supplying substrates.

Conventionally, semiconductor elements widely used in electronic equipment and the like are manufactured from wafers, and the wafer is respectively assembled with optical elements and the like in each of the areas divided into a plurality of areas. Here, the semiconductor element is manufactured by the following steps, for example. First, the outer peripheral surface of the single crystal ingot was ground in such a way that the diameter of the single crystal ingot was uniform, and sliced into a disk shape with a thickness of about 1 mm. It is a so-called wafer. Grinding both sides of the wafer, and finishing to a predetermined thickness (grinding step). Secondly, the two surfaces of the wafer are polished, and a mirror polishing with high flatness is performed (grinding step). Then, the polished wafer is washed (washing step) to complete the wafer. After that, the circuit pattern is burned on the surface of the wafer and divided along a predetermined line.

Patent Document 1 below discloses a cutting device that cuts a wafer along a predetermined line provided on the wafer. In the cutting device, a cassette containing a plurality of wafers (unprocessed wafers) before being cut, and a cassette for containing wafers after being cut (processed wafers) are placed on a work tray on. The unprocessed wafers are transferred and cut from the cassette in sequence, and then transferred to the cassette that houses the processed wafers. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Unexamined Patent Publication No. 2014-175422

[Problems to be solved by the invention]

In Patent Document 1, if all unprocessed wafers are removed from the cassette and the cassette becomes empty, the cassette is removed from the device and the unprocessed wafers are accommodated in the cassette again. Then, the cassette is installed in the device again, and the wafer cutting step is performed again.

Here, the removal and installation of the cassette with respect to the device requires a predetermined time. Therefore, at this time, the wafer cannot be supplied to the device, and the operation rate of the device is reduced. In particular, when the cartridge is removed, it can also be assumed that the safety mechanism is operated so that the hand does not enter the inside of the device by mistake. In this case, the time required for the removal and installation of the cassette relative to the device is further increased, and as a result, the operation rate of the device is further reduced.

In view of this problem, an object of the present invention is to provide a substrate supply system capable of improving the operation rate of the device, and a substrate processing device provided with the substrate supply system. [Technical means to solve the problem]

The first aspect of the present invention relates to a substrate supply system that supplies a plurality of substrates to a conveying path from a cassette that accommodates a plurality of substrates stacked at a predetermined interval. The substrate supply system of this aspect includes: a first storage section that detachably stores the first cassette; a second storage section that detachably stores the second cassette; and an extraction mechanism that removes the substrate from the first cassette And the second cassette is drawn in a direction perpendicular to the stacking direction of the substrate and transferred to the transport path; and a moving mechanism that moves the drawing mechanism between the first storage portion and the second storage portion.

According to this configuration, for example, during the period when the extraction mechanism extracts the substrate from the second cassette and supplies it to the transport path, the first cassette that finishes the substrate supply first can be taken out from the first storage section, and the substrate can be accommodated in the first cassette. The first case is stored in the first storage unit again. Thereby, when all the substrates have been supplied to the transport path from the first cassette, the supply operation of the extraction mechanism can be temporarily stopped, and the substrates can be accommodated in the first cassette, and the first cassette can be stored in the first storage section . Thereby, the substrate can be continuously supplied to the conveyance path from the first cassette and the second cassette, and the operation rate of the substrate supply system can be improved.

In addition, in the substrate supply system of this aspect, the storage device that detachably stores the cassette is not limited to two, and three or more storage devices may be provided.

In addition, the substrate supplied from the second cassette to the transfer path may be returned to the second cassette through the same transfer path after being processed by a predetermined device. In this case, after all the substrates supplied from the second cassette to the transport path are returned to the second cassette, the second cassette can be taken out from the second storage section, the processed substrate can be recovered from the second cassette, and the unprocessed substrate can be collected It is stored in the second case and stored in the second storage unit again.

In the substrate supply system of this aspect, the extraction mechanism may include: a hand that holds the substrate; a drive mechanism that moves the hand in a direction perpendicular to the stacking direction; and a guide portion, which Supporting and guiding the drawn substrate; when the hand draws the substrate from the first cassette and the second cassette, the moving mechanism positions the hand so as to face the substrate to be supplied.

In general, substrates like semiconductor wafers are thin films and are relatively brittle and not resistant to impact. When such a substrate is supplied to the conveyance path, if the storage portion or the cassette is moved up, down, left, or right, the substrate may be damaged in the cassette due to shaking or vibration. In this respect, in this configuration, the storage portion and the cassette do not move, and the hand is moved in the stacking direction by the moving mechanism to extract the substrate to be supplied from the cassette. This can reliably prevent the substrate from being damaged in the case. In addition, the extraction mechanism includes a guide. Thereby, when the extraction mechanism extracts the substrate from the cassette, the substrate is extracted while being supported by the guide. Thus, the substrate can be smoothly drawn out.

In the substrate supply system of this aspect, the first storage portion and the second storage portion may be arranged in the stacking direction, and the moving mechanism may move the extraction mechanism in the stacking direction.

According to this configuration, by moving the extraction mechanism only in the stacking direction, the extraction mechanism can be positioned at the storage position of each substrate of the first cassette and the second cassette. Thus, the structure and control of the moving mechanism can be simplified.

In this case, the above-mentioned stacking direction may be the up-down direction.

With this configuration, the substrate can be stored in the cassette in a stable state. In addition, since the substrate is horizontally drawn out of the cassette, the substrate can be stably drawn out of the cassette.

In the substrate supply system of this aspect, it may be configured to include a control unit that controls the movement mechanism, and the control unit moves the extraction mechanism in one of the stacking directions by the movement mechanism.

With this configuration, the extraction mechanism does not move back and forth in the stacking direction, but moves in one direction. With this, the substrate is sequentially supplied to the transport path from one of the first cassette or the second cassette. Moreover, the empty cassette can be quickly taken out from the storage device, a new substrate can be stored in the cassette, and stored in the storage device again.

In addition, if the substrate supplied to the transport path is recovered to the original cassette, the substrate supplied to the transport path is processed by a predetermined device and then transferred to the original cassette, and then the cassette containing the processed substrate Remove from storage device. In addition, in the same manner as described above, the unprocessed substrate can be stored in the cassette and stored in the storage device again. In this way, the substrate is smoothly and efficiently supplied.

The stacking direction may be an up-down direction, and the control unit may move the draw-out mechanism from below to one direction by the moving mechanism.

With this configuration, the extraction mechanism sequentially extracts the substrates from the lowermost substrate accommodated in the lower cassette to the uppermost substrate accommodated in the upper cassette. With this, the substrate can be efficiently supplied to the transport path from one cassette. Thereby, the cycle of the operation of emptying or containing the processed substrates from the storage device after taking out the unprocessed substrates from the storage device and storing them again in the storage device can be accelerated.

The second aspect of the present invention relates to a substrate processing device for processing a substrate. The substrate processing apparatus of this aspect includes a substrate supply system that supplies the above substrates to a transport path from a cassette that accommodates a plurality of substrates in a state of being stacked at a predetermined interval, and includes: a first storage section, which The first cassette is detachably stored; the second storage section detachably stores the second cassette; and the extracting mechanism moves the substrate from the first cassette and the second cassette perpendicular to the stacking direction of the substrate The direction is extracted and transferred to the conveyance path; and a moving mechanism that moves the extraction mechanism between the first storage portion and the second storage portion. Further, the substrate processing apparatus of this aspect includes: a scoring unit that forms a scribe line on the surface of the substrate; a thin film lamination unit that attaches a thin film to the surface of the substrate on which the scribe line is formed; an inversion unit, which Inverting the substrate so that the surface to which the film is attached becomes the lower side; a breaking unit that applies a predetermined force to the surface to which the film is not attached to break the substrate along the scribe line; and transport Part, which transports the substrate to a predetermined position.

With this configuration, the same effect as the first aspect is exerted. [Effect of invention]

As described above, according to the present invention, it is possible to provide a substrate supply system capable of improving the operation rate of the device and a substrate processing device provided with the substrate supply system.

The effect or meaning of the present invention will be further clarified by the description of the embodiments shown below. However, the embodiments shown below are only an example when the present invention is put into practice, and the present invention is not limited by the contents described in the following embodiments.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, in each figure, X-axis, Y-axis, and Z-axis orthogonal to each other are added for the sake of convenience. The X-Y plane is parallel to the horizontal plane, and the Z-axis direction is vertical. The positive side of the Z axis is upward, and the negative side of the Z axis is downward. In addition, in this embodiment, the Z-axis direction is the "stacking direction" described in the scope of the patent application. In this embodiment, this stacking direction may be expressed as "up and down direction". In addition, the Y-axis direction is the "direction perpendicular to the stacking direction" described in the scope of the patent application. This Y-axis direction may be expressed as "horizontal direction" in this embodiment.

<Embodiment> [Structure of Substrate Supply System] The substrate supply system 1 of the present embodiment is used to supply a wafer to a transport path to be transported to a predetermined device when manufacturing a semiconductor wafer, which is a material widely used for semiconductor devices such as electronic equipment. In this embodiment, the substrate to be supplied by the substrate supply system 1 is a semiconductor wafer attached to a ring-shaped frame using a dicing protection tape. In the following, the "semiconductor wafer attached to the ring-shaped frame with dicing protection tape" is simply referred to as "wafer W". In the description of this embodiment, the position where the wafer W is completely extracted from the substrate supply system 1 is referred to as the “extraction position”, and the position transferred from the extraction position to the transport path is referred to as the “transfer position”.

Examples of the material of the wafer W include single crystal silicon (Si), silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide (GaAs). The material, thickness, and size of the semiconductor wafer as described above are appropriately selected and designed according to the type, function, etc. of the semiconductor element for the purpose of manufacturing.

1(a) to (c) are perspective views showing the configuration of the substrate supply system 1. FIG. 1(a) is a perspective view of a substrate supply system 1, FIG. 1(b) is a perspective view showing a cassette containing wafers W, and FIG. 1(c) is a perspective view of a storage device 100. FIG.

As shown in FIG. 1( a ), the substrate supply system 1 includes a storage device 100, an extraction mechanism 200, and a moving mechanism 300. In addition, the entire storage device 100 is covered by a case, but for convenience of description, the case is omitted. Hereinafter, in all the drawings, the case covering the entire storage device 100 is omitted.

The storage device 100 stores the wafer W to be supplied to the transfer path. Specifically, as shown in FIG. 1( b ), a plurality of wafers W are stored in a cassette in a stacked state, and the cassette is stored in the storage device 100. In this embodiment, two of the first cassette 10 and the second cassette 20 are prepared. On the inner side surfaces of the side walls 11a and 11b of the first box 10, grooves 12 are provided at predetermined intervals. The wafer W is accommodated in the first cassette 10 in a supported state by being inserted into the groove 12.

On the upper part of the first cassette 10, a handle 13 for an operator to carry the first cassette 10 is provided. Since the second cassette 20 has the same configuration as the first cassette 10, its description is omitted. In addition, in the above, the first cassette 10 and the second cassette 20 have been described as common cassettes, but in the first cassette 10 and the second cassette 20, the grooves 12 provided on the inner sides of the side walls 11a, 11b may also be used The interval is different, and the number of wafers W accommodated can also be different.

The storage device 100 stores the first cassette 10 and the second cassette 20 described above. As shown in FIG. 1( c ), the storage device 100 includes a first storage portion 101 and a second storage portion 102 arranged in the stacking direction of the wafer W, that is, in the vertical direction. In addition, the storage device 100 includes a mounting portion 110 for detachably mounting the first cassette 10 in the first storage portion 101, a housing 103 covering the first storage portion 101, a door 104, and a handle provided in the mounting portion 110 112, and a baffle 140 that blocks the storage device 100 and the extraction position.

As described above, in the storage device 100, the first storage portion 101 is covered by the casing 103, and the door 104 that is opened and closed in the horizontal direction is provided. The door 104 is attached to a case that covers the entire storage device 100, not shown in FIGS. 1(a) and (c), and when the door 104 is opened and closed, the first storage unit 101 can be accessed. In addition, the door 104 may be constituted by a transparent member so that the operator can visually recognize the first cassette 10 and the second cassette 20 during the operation of the substrate supply system 1. In FIG. 1(c), the case where the door 104 is transparent is shown.

The housing 103, the door 104, the placement portion 110, and the handle 112 are also provided in the second storage portion 102 in the same manner.

In this way, the storage device 100 includes the first storage portion 101 and the second storage portion 102, and the door 104 is provided in each of the first storage portion 101 and the second storage portion 102. Therefore, for example, while the wafer W is supplied to the transfer path from the first cassette 10 stored in the first storage section 101, the operator can open the door 104 of the second storage section 102 to load the second storage section 102. The placement portion 110 is drawn in the negative direction of the Y axis. At this time, when the second cassette 20 does not store the second cassette 20 or the wafer W is not stored in the second cassette 20 (that is, all wafers W have been supplied from the second cassette 20 to the transport In the case of a road), the operator stores the wafer W in the second cassette 20, appropriately places the second cassette 20 on the mounting section 110 of the second storage section 102, and then positions the mounting section 110 toward the Y axis Pull in the direction to the second storage section 102. In this way, the second cassette 20 can be stored in the second storage section 102.

As shown in FIG. 1( a ), the shutter 140 is opened in the storage device 100 when the wafer W is supplied to the transport path. For example, in the case described above, since the wafer W is being supplied from the first storage section 101 to the transport path, the shutter 140 provided in the first storage section 101 is opened. On the other hand, in the second storage section 102, the second cassette 20 is being taken out. In this case, if the baffle 140 of the second storage section 102 is opened, there is a risk that the operator's hand may enter the back side (positive side of the Y axis) of the second storage section 102 by mistake. Alternatively, when the second cassette 20 storing the new wafer W is stored in the second storage section 102, the wafer W may fly out from the second cassette 20 and fall. Therefore, in order to block the second storage portion 102 from the drawing position, the shutter 140 of the second storage portion 102 is closed. In addition, in FIG. 1(c), for convenience of explanation, the inside of each storage section is shown so that the baffle 140 of the first storage section 101 and the second storage section 102 are shown. The baffle 140 is open, but it does not correspond to the actual movement. This situation is the same in FIGS. 3(a) to 4(b).

As shown in FIG. 1(c), the storage device 100 includes a moving part 120, a restricting part 130, a lifting mechanism 150, a supporting part 160, a link mechanism 170, and a detection means 180. In addition, the moving part 120 is not shown in FIG. 1(c), and is shown in FIG. The detailed configuration of the storage device 100 will be described later with reference to FIGS. 6 to 14(b).

Next, the extraction mechanism 200 will be described.

2(a) and (b) are perspective views showing the structure of the extraction mechanism 200 and the moving mechanism 300. FIG.

Since the extraction mechanism 200 supplies the wafer W to the transfer path, the wafer W is extracted from the first cassette 10 and the second cassette 20. The extraction mechanism 200 includes a hand 210, a drive mechanism 220, a guide 230, a retraction mechanism 240, and a sensor 250.

The hand 210 grips the peripheral portion of the wafer W. The driving mechanism 220 moves the hand 210 in the horizontal direction.

The guide 230 guides the wafer W drawn out from the cassette to the transport path. The guide 230 includes rails 231a and 231b, and guide support members 232a to 232c that support the rails 231a and 231b. The rails 231a and 231b are arranged on the positive side and the negative side of the X axis. At the lower part of each of the rails 231a, 231b, guide support members 232a, 232b are in contact. The guide support member 232c is connected to the lower part of each of the guide support members 232a and 232b.

The guide support members 232a to 232c are rectangular plate members. In FIGS. 2(a) and (b), the guide support member 232a is divided into two bodies, but it may be integrated. The retreating mechanism 240 avoids interference between the member 210 (for example, the holding member on the side of the conveyance path) that receives the wafer W at the transfer position and the hand 210 when transferring the wafer W extracted from the storage device 100 to the conveyance path.

The sensor 250 detects the wafer W to be supplied when the hand 210 draws the wafer W from the cassette. The hand 210, the sensor 250, and the retreat mechanism 240 are connected in this order from the negative side of the Y axis via a connecting member. In addition, the retreat mechanism 240 is disposed below the hand 210 and the sensor 250.

In addition, specifically, the retraction mechanism 240 is an air cylinder. When a predetermined pressure is applied to the retreat mechanism 240 from the cylinder drive unit 405, the retreat mechanism 240 moves downward integrally with the hand 210 and the sensor 250 connected via the connecting member. In addition, the cylinder drive part 405 is shown in FIG. 5(a).

The driving mechanism 220 moves the wafer W held by the hand 210 in the horizontal direction. The drive mechanism 220 includes: an extraction guide 221 that moves the wafer W in the horizontal direction; and a moving member 222 that moves the extraction guide 221. As shown in FIGS. 2( a) and (b ), the extraction guide 221 is arranged in a space surrounded by the guide support members 232 a to 232 c and is installed on the guide support member 232 c. In addition, a retracting mechanism 240 is installed on the moving member 222.

In the extraction mechanism 200, if the moving member 222 moves the extraction guide 221 in the horizontal direction, the retreat mechanism 240, the sensor 250, the hand 210, the guide 230, and the wafer W move integrally in the horizontal direction .

The moving mechanism 300 moves the drawing mechanism 200 up and down between the first storage section 101 and the second storage section 102. The moving mechanism 300 includes a lifting rail 310 that lifts the extraction mechanism 200 up and down, and a lifting member 320 that lifts on the lifting rail 310.

The lifting member 320 is mounted on the guide support member 232b. In the moving mechanism 300, the lifting mechanism 320 moves on the lifting rail 310, and the extraction mechanism 200 moves up and down integrally via the lifting member 320.

Next, the supply of the wafer W to the transport path by the substrate supply system 1 will be described. Here, the case where the substrate supply system 1 supplies the wafer W to the transport path 500 will be described.

Moreover, in this embodiment, the wafer W accommodated in the lowermost part of the first cassette 10 stored in the first storage section 101 is sequentially supplied to the transport path.

3(a) to 4(b) are perspective views showing the configuration of the substrate supply system 1 and the transport path 500. FIG. 3(a) is the case where the wafer W is extracted by the extraction mechanism 200, and FIG. 3(b) is the case where the extraction of the wafer W by the extraction mechanism 200 has been completed. FIG. 4(a) shows that the extraction mechanism 200 is about to transfer the wafer W to the transfer position of the transfer path 500, and FIG. 4(b) shows the transfer of the wafer W to the transfer position of the transfer path 500.

As shown in FIGS. 3(a) to 4(b), the transport path 500 includes a transport mechanism 510, two transport rails 520, a guide member 530, and a transport hand 540. The transfer hand 540 holds the wafer W transferred from the substrate supply system 1. A transport hand 540 is installed on the transport rail 520 and the guide member 530, and when the transport mechanism 510 is driven, the guide member 530 moves according to the guidance of the transport mechanism 510. With this, the wafer W is transferred along the transfer rail 520.

As shown in FIG. 3(a), the moving mechanism 300 moves the extraction mechanism 200 integrally downward and positions it at a predetermined height. At this time, the moving mechanism 300 moves the extraction mechanism 200 integrally to a position where the hand 210 faces the wafer W to be supplied accommodated in the first cassette 10 or the second cassette 20. Then, the hand 210 positioned at the height position of the wafer W of the supply target is moved to the negative side of the Y axis by the driving mechanism 220 to hold the wafer W of the supply target. At this time, the sensor 250 detects the wafer W to be supplied. This operation of the substrate supply system 1 is called a "drawing operation".

As shown in FIG. 3(b), when the wafer W is held by the hand 210, the drive mechanism 220 draws the wafer W toward the positive side of the Y axis. The extracted wafer W is positioned at the extraction position while being supported and guided by the rails 231a and 231b. At this time, the hand 210 is in a state of holding the wafer W. This operation of the substrate supply system 1 is called "extraction completion operation".

As shown in FIG. 4( a ), when the wafer W is positioned at the extraction position, the moving mechanism 300 moves the extraction mechanism 200 integrally upward. At this time, the moving mechanism 300 moves the extraction mechanism 200 integrally so that the height positions of the rails 231a and 231b coincide with the height positions of the transport rails 520 of the transport path 500. In addition, the hand 210 is in a state of holding the wafer W. This operation of the substrate supply system 1 is called "handover preparation operation".

As shown in FIG. 4( b ), when the rails 231 a and 231 b of the extraction mechanism 200 are positioned at the height position of the transport rail 520, that is, the transfer position, the hand 210 releases the wafer W. Then, a predetermined pressure is applied to the retreat mechanism 240 to move the hand 210 and the sensor 250 below the conveyance rail 520. Thereby, the hand 210 and the sensor 250 do not interfere with the conveying hand 540. Furthermore, in this state, the wafer W is still supported by the rails 231a, 231b. This operation of the substrate supply system 1 is called "handover completion operation".

When the hand 210 releases the wafer W, the transfer mechanism 510 is driven, whereby the guide member 530 provided with the transfer hand 540 moves according to the guidance of the transfer mechanism, and the transfer hand 540 holds the wafer W. Then, the wafer W is transferred to a predetermined place while being supported by the transfer rail 520.

In the manner described above, the substrate supply system 1 supplies the wafer W to the transfer path. The substrate supply system 1 repeatedly executes the above-mentioned extraction operation, extraction completion operation, handover preparation operation, and handover completion operation while the wafer W to be supplied is present.

In the present embodiment, when all the wafers W stored in the first cassette 10 have been supplied to the transport path, the extraction mechanism 200 and the moving mechanism 300 extract crystals from the second cassette 20 stored in the second storage section 102 Circle W and supply it to the transport path. At this time, the extraction mechanism 200 and the moving mechanism 300 are sequentially extracted from the wafer W accommodated in the lowermost portion of the second cassette 20 in the same manner as when the wafer W is extracted from the first cassette 10.

While the substrate supply system 1 draws the wafer W from the second cassette 20 and supplies it to the transport path, the operator opens the door 104 of the first storage section 101 and moves the placement section 110 of the first storage section 101 in the negative direction of the Y axis Withdrawing, the mounting part 110 is positioned at the attachment/detachment position. Then, the operator can take out the first cassette 10 from the mounting section 110 of the first storage section 101 and store the new wafer W in the first cassette 10 and place it on the mounting section 110 of the first storage section 101. The first storage portion 101 is again positioned at the storage position. In this way, even during the period when the first cassette is taken out from the first storage section 101, the wafer W is drawn out from the second cassette 20, and the operation of supplying to the transport path is continued. Thus, the operation rate of the substrate supply system 1 can be improved.

In addition, the transfer of the wafer W on the transport path is not only grasping the wafer W by the hand as described above, but for example, the wafer W may be sucked and held by a member provided with an adsorption pad.

[Supply operation of substrate supply system] Next, the supply operation of the wafer W by the substrate supply system 1 will be described. FIG. 5(a) is a block diagram showing the configuration of the substrate supply system 1. As shown in FIG. 5( a ), the substrate supply system 1 includes a storage device 100, an extraction mechanism 200, and a moving mechanism 300, and further includes a control unit 400, an input unit 401, and a detection unit 402. In addition, an extraction guide drive unit 403, an elevator guide drive unit 404, and a cylinder drive unit 405 are provided as drive units of the extraction guide unit 221, the elevating guide rail 310, and the retraction mechanism 240.

The control unit 400 includes an arithmetic processing circuit such as a CPU, or a memory such as a ROM, RAM, and hard disk. The control part controls each part according to the program stored in the memory.

The input unit 401 accepts the start of when the substrate supply system 1 supplies the wafer W to the transport path. The detection unit 402 detects the position of the wafer W to be supplied in the substrate supply system 1. In addition, the detection unit 402 may be configured to detect that the wafer W has been supplied to the transport path. The detection unit 402 can use, for example, a sensor, an imaging device, or the like.

FIG. 5(b) is a flowchart showing the operation of the substrate supply system 1 of this embodiment. This control is executed by the control unit 400 shown in FIG. 5(a). Here, as described above, the operation when the wafer W is supplied from the substrate supply system 1 to the transport path 500 will be described.

Moreover, in the flowchart of FIG. 5(b), "start" refers to the time point at which the supply of the wafer W to the transport path is accepted by the input unit. In addition, the first cassette 10 and the second cassette 20 in which the wafer W is accommodated are stored in the first storage section 101 and the second storage section 102 of the storage apparatus 100, respectively. In addition, the wafers W that are accommodated in the lowermost portion of the first cassette 10 are sequentially supplied upward.

In step S11, the lift guide driving unit 404 drives the lift rail 310 to move the extraction mechanism 200 to the height position of the wafer W to be supplied, and the sensor 250 to detect the wafer W to be supplied. This is the extraction operation described above and corresponds to the state shown in FIG. 3(a).

In step S12, if the sensor 25 detects the supply target wafer W, the control unit 400 causes the extraction guide drive unit 403 to drive the hand 210 to hold the supply target wafer W, extract it in the horizontal direction, and position it In the withdrawn position. This is the extraction completion operation described above, and corresponds to the state shown in FIG. 3(b).

In step S13, the control unit 400 causes the elevating guide driving unit 404 to drive the elevating rail 310, and positions the extraction mechanism 200 at the height position of the transport rail 520 of the transport path 500. This is the above-mentioned handover preparation operation and corresponds to the state shown in FIG. 4(a).

In step S14, if the detection unit 402 detects that the wafer W is located at the height position of the transport rail 520, the control unit 400 causes the extraction guide driving unit 403 to drive the hand 210 to stop the grip of the wafer W by the hand 210 . Then, the control unit 400 causes the cylinder driving unit 405 to apply a predetermined pressure to the retreat mechanism 240, and moves the hand 210 downward. Thereby, the interference between the hand 210 and the conveying hand 540 is avoided. This is the handover completion operation described above, and corresponds to the state shown in FIG. 4(b).

After step S14, the wafer W is transferred to the transfer path 500 (refer to FIG. 4(b)) and transferred to a predetermined place. In step S15, if the detection unit 402 detects that the transfer of the wafer W has been completed, the control unit 400 determines whether the wafer W to be supplied is in the first cassette 10 or the second cassette 20. When there is a wafer W to be supplied (S15; YES), the above steps S11 to S14 are repeatedly executed. When there is no wafer W to be supplied (S15; No), the supply of the wafer W to the transport path by the substrate supply system 1 is ended.

Furthermore, the substrate supply system 1 may be configured to include a display unit that displays the states of the first cassette 10 and the second cassette 20. For example, when a display screen (not shown) is connected to the substrate supply system 1, and an unprocessed, ie, supply target wafer W remains in any of the first cassette 10 and the second cassette 20, it is displayed on the display screen "Processing". From this display, the operator can grasp the situation in which the wafer W is supplied to the transfer path from the first cassette 10 or the second cassette 20.

In addition, when the first cassette 10 is empty, or when a predetermined number of wafers W have been supplied to the transport path, and when the unprocessed wafer W remains in the second cassette 20, it is displayed as " Box 1 10: Processing complete." From this display, the operator immediately takes the first cassette 10 out of the first storage section 101, re-stors the wafer W in the first cassette 10, and stores the first cassette 10 in the first storage section 101 again.

In addition, when the first cassette 10 and the second cassette 20 are empty, or when a predetermined number of wafers W have been supplied to the transport path, it is displayed as "processing completed". With this display, the operator can grasp that the supply of the wafer W has been completed.

In this way, when the display unit is provided, the operator can quickly grasp the state of the first cassette 10 and the second cassette 20 stored in the storage device 100, so the operation can be performed smoothly.

[Structure of storage device] Next, the configuration of the storage device 100 will be described.

6(a) to (c) are perspective views showing different states of the storage device 100, and the left-hand side drawing corresponds to the right-hand side drawing.

As shown in FIGS. 6(a) to (c), the storage device 100 mainly has four states. FIG. 6(a) shows a state (first state) in which the placement unit 110 has been drawn out from the second storage unit 102. FIG. At this time, the shutter 140 of the second storage unit 102 is closed, so the operator cannot put his hand into the storage device 100. FIG. 6(b) shows a state in which the placement unit 110 is stored in the second storage unit 102 (second state). FIG. 6(c) shows a preparation state (third state) for opening the shutter 140 of the second storage section 102. FIG. The state where the opening of the shutter 140 of the second storage section 102 is completed (fourth state) corresponds to (a) and (c) of FIG. 1. In the following, the configuration of the storage device 100 will be described by dividing into these four states. Here, the baffle 140 of the first storage portion 101 is opened upward, and the baffle 140 of the second storage portion 102 is opened downward. In this way, although the opening direction is different from above and below, the structure for opening the baffle 140 is the same. Therefore, in the following description, the second storage portion 102 disposed in the upper stage will be explained.

In addition, when the storage device 100 is in the first state (the state shown in FIG. 6( a )), the second cassette 20 is detachably mounted on the mounting portion 110 of the second storage portion 102. At this time, the position of the mounting portion 110 of the second storage portion 102 is referred to as a "mounting position". When the storage device 100 is in the second state (the state shown in FIG. 6( b )), the second cassette 20 is stored in the second storage part 102 in a state where it is placed on the mounting part 110 of the second storage part 102. The position of the placement portion 110 of the second storage portion 102 at this time is referred to as "storage position".

First, the case where the storage device 100 is in the first state, that is, the mounting portion 110 is located at the attaching and detaching position will be described.

7 and 8 are perspective views showing the configuration of the storage device 100 and showing the storage device 100 in the first state. In FIGS. 7 and 8, the second cassette 20, the housing 103, and the door 104 are omitted. In FIG. 8, the detection means 180 is further omitted.

As shown in FIGS. 7 and 8, the storage device 100 includes the above-mentioned placing part 110, moving part 120, restricting part 130, baffle 140, lifting mechanism 150, supporting part 160, link mechanism 170, and detection means 180 In addition, a pedestal 190 is also provided. In addition, in the mounting portion 110 of FIG. 7, a portion surrounded by a dotted line is an area where the second cassette 20 is mounted.

Four positioning members 111 for positioning the second cassette 20 are provided on the upper surface of the mounting portion 110. When placing the second cassette 20 on the placing portion 110, the two end portions of the side walls 11a, 11b of the second cassette 20 are fitted to the four positioning members 111 (see FIG. 1(c)).

The moving part 120 moves the placement part 110 in the horizontal direction between the attachment and detachment position and the storage position. The moving unit 120 includes a link 121, horizontal slide members 122a, 122b, a guide member 123, and a protruding member 124. Furthermore, the coupling member 121 is not shown in FIG. 7 and is shown in FIG. 8.

The linking member 121 is composed of a member 121a with a cross section in the X-axis direction and a transfer roller 121b. In the lower part of the member 121a, a hole is formed in the X-axis direction, and the rotation axis of the transfer roller 121b passes through the hole. A baffle 140 is installed on the rising portion of the upper part of the member 121a (see FIG. 10(c)).

The horizontal sliding member 122a is provided on the mounting portion 110 side, and the horizontal sliding member 122b is provided on the pedestal 190 side. When the mounting portion 110 moves in the horizontal direction, the horizontal sliding member 122a moves relative to the horizontal sliding member 122b. Thereby, the mounting portion 110 can move in the horizontal direction.

The guide member 123 is an elongated rectangular member, and is provided on the base 190. The positive and negative sides of the Y-axis of the guide member 123 are formed with gentle slopes toward the center, and a V-shaped concave portion 123a is formed at the end of the positive side of the Y-axis. The lower end of the protruding member 124 provided on the mounting portion 110 is formed in a hemispherical shape (not shown). When the mounting portion 110 moves to the storage position in the horizontal direction by the horizontal sliding members 122 a and 122 b, the hemispherical portion of the protrusion member 124 slides on the inclined surface of the guide member 123. Thereby, the mounting part 110 can be appropriately braked to smoothly move to the pedestal 190 while decelerating. In addition, by fitting the hemispherical portion of the protruding member 124 into the concave portion 123 a, the placement portion 110 is positioned in the second storage portion 102.

The restricting portion 130 moves in the horizontal direction between the mounting portion 110 between the attaching and detaching position (first state) and the storage position (second state), and when the mounting portion 110 is in the storage position (second state), The wafer W is prevented from flying out from the second cassette 20 toward the back side (positive side of the Y axis) and falling. The restricting portion 130 abuts the end surface of the second cassette 20 on the back side. That is, it comes into contact with the wafer W accommodated in the second cassette 20. The restricting portion 130 is a plate-shaped member, and in the present embodiment, two are provided. The restricting portion 130 is supported by the support plate 131.

The baffle 140 blocks the second storage portion 102 from the extraction position. In the second storage section 102, when the wafer W is drawn from the second cassette 20, the shutter 140 is opened, and when the placement section 110 is moved from the storage position to the loading and unloading position, the shutter 140 is closed.

The lifting mechanism 150 raises and lowers the baffle 140. The lifting mechanism 150 includes a driving unit 151, a supporting member 152, and lifting sliding members 153a and 153b.

The driving unit 151 is a cylinder. A support member 152 is connected to the lower end of the rod 151a of the driving part 151. The support member 152 is composed of a frame-shaped member that opens on the negative side of the Y axis. The gap 152a above and below the support member 152 is fitted by the transfer roller 121b. Although described below, when the storage device 100 is in the second to fourth states, the transfer roller 121b is fitted into the gap 152a of the support member 152 (for example, see FIG. 10(c)). Since the support member 152 is connected to the rod 151a, when the drive unit 151 is driven, the support member 152 and the drive unit 151 are integrated and moved up and down.

The up-and-down sliding members 153a and 153b are provided between the baffle 140 and the support portion 160, and move the baffle 140 up and down. The baffle 140 is provided with a lifting slide member 153a, and the support portion 160 is provided with a lifting slide member 153b.

The support portion 160 is a member with a sectional shape in the Y-axis direction (see FIG. 9 ), and is provided on the placement portion 110. The restricting portion 130 is supported via a link mechanism 170 which will be described next.

The link mechanism 170 is composed of a link base 171, a link plate 172, two link bars 173, and a link roller 174.

The link base 171 and the link plate 172 are plate-shaped members, and are connected by two link rods 173. The link base 171 is mounted on the baffle 140, and the link plate 172 is mounted on the support plate 131. A link roller 174 is rotatably provided below the link plate 172. The link roller 174 abuts on the horizontal surface of the lower portion of the support portion 160. In addition, the two link rods 173 are not shown in FIG. 7 and are shown in FIG. 8.

As described above, the baffle 140 is supported by the support portion 160 via the horizontal slide members 122a and 122b. The baffle 140 is provided with a link base 171, and the link plate 172 connected to the link base 171 via the link bar 173 is mounted on the support plate 131. The link base 171 and the link plate 172 constitute a four-bar link by two link bars 173. With this link mechanism, the link plate 172 slides while maintaining a vertical state. Moreover, the support plate 131 supports the restricting portion 130. Therefore, the restricting portion 130 is supported by the baffle 140 via the link mechanism 170, and the restricting portion 130 is supported by the support portion 160 via the link mechanism 170.

As shown in FIGS. 7 and 8, in the first state, the link rod 173 of the link mechanism 170 is horizontal with respect to the mounting portion 110. Therefore, the link base 171 and the link plate 172 are slightly spaced apart. That is, the baffle 140 provided with the link base 171 is separated from the support plate 131 provided with the link plate 172. Since the restricting portion 130 is installed on the support plate 131, the baffle 140 is separated from the restricting portion 130.

The detection means 180 is a sensor disposed on the positive side of the Y axis of the base 190. The detection means 180 detects whether the wafer W flew out of the second cassette 20.

As shown in FIGS. 7 and 8, in the first state, when the placing portion 110 is drawn out and is in the attaching and detaching position, the restricting portion 130, the support plate 131, and the baffle 140 are also level with the placing portion 110 Direction of movement. As shown in FIG. 6( a ), especially the right diagram of FIG. 6( a ), this is a state where the restricting portion 130 abuts on the wafer W. Therefore, when the second cassette 20 is taken out from the placement section 110 and when the second cassette 20 is placed on the placement section 110, the operator can only put his hand into the area of the placement section 110. The hand will not enter the transport road. As a result, the operator can safely attach and detach the second cassette 20.

Next, the case where the storage device 100 is in the second state, that is, the mounting portion 110 is located at the storage position will be described.

9 and 10 (a) to (c) are perspective views showing the configuration of the storage device 100, and show the storage device 100 in the second state. 10(a) and (b) are enlarged views of the periphery of the linkage mechanism, and FIG. 10(b) omits the baffle 140. Fig. 10(c) is a perspective view corresponding to Fig. 9. In FIGS. 9 and 10(a) to (c), the second cassette 20, the case 103, the door 104, and the detection means 180 are omitted.

As shown in FIG. 9, when the placement part 110 is moved to the storage position, the link member 121, the restricting part 130, the support plate 131, the baffle 140, and the support part 160 maintain the state shown in FIGS. 7 and 8. One side moves horizontally together with the mounting part 110. At this time, as shown in FIG. 10( b ), the transfer roller 121 b of the link structure 121 that moves horizontally together with the shutter 140 is fitted into the gap 152 a of the support member 152. At this time, if the transfer roller 121b rolls on the pedestal 190, the width of the transfer roller 121b is set to be wider so that it can be continuously attached to the support member 152. Also, as shown in FIGS. 10( a) and (c ), the upper frame of the support member 152 does not interfere with the baffle 140.

As shown in FIGS. 10( a) and (b ), when the storage device 100 is in the second state, since the link mechanism 170 is the same as the first state, the restricting portion 130 and the baffle 140 are still slightly spaced apart, and the restricting portion 130 Contact with wafer W. This is the case where the restricting portion 130 abuts on the wafer W, which is shown in FIG. 6(b).

In this way, when the mounting portion 110 moves horizontally from the mounting position to the storage position from the first state to the second state, the positional relationship between the restricting portion 130 and the baffle plate 140 does not change, and it is together with the mounting portion 110 Move horizontally. As a result, during the horizontal movement of the mounting portion 110 from the loading and unloading position to the storage position, the restricting portion 130 continues to contact the wafer W. Thereby, the wafer-free W may fly out from the second cassette 20 toward the supply area side and fall. In addition, since the baffle 140 blocks the supply area side, the hand of the operator is reliably prevented from entering the storage device 100.

Next, a description will be given of the storage device 100 in the third state, that is, immediately before the placement portion 110 is located at the storage position and the shutter 140 is opened.

FIGS. 11 and 12 (a) to (c) are perspective views showing the configuration of the storage device 100 and showing the storage device 100 in the third state. 12(a) and (b) are enlarged views of the periphery of the linkage mechanism, and FIG. 12(b) omits the baffle 140. Fig. 12(c) is a perspective view corresponding to Fig. 11. In addition, in FIGS. 11 and 12(a) to (c), the second cassette 20, the case 103, the door 104, and the detection means 180 are omitted.

When the placement unit 110 is positioned at the storage position, the storage device 100 prepares to open the shutter 140 so that the wafer W can be supplied from the second cassette 20. Here, when the baffle 140 is moved up and down instantaneously, the restricting portion 130 also moves up and down integrally with the baffle 140. Since the restricting portion 130 abuts on the wafer W, the restricting portion 130 moves up and down while rubbing the wafer W. For the wafer W, the quality of the wafer W is reduced, so the wafer W must be separated from the restricting portion 130 to raise the baffle 140. Therefore, as shown in FIGS. 7 and 8 (a) to (c ), in the storage device 100, in preparation for opening the shutter 140, the wafer W is separated from the restricting portion 130 (third state).

As shown in FIGS. 11 and 12 (a) to (c), when a predetermined pressure is applied to the drive unit 151, the rod 151a rises by a predetermined stroke. With this, the support member 152 connected to the rod 151a is raised by a predetermined stroke in a state where the transfer roller 121b of the coupling member 121 is embedded. Since the member 121a of the link structure 121 is installed on the baffle 140, as the support member 152 rises, the link structure 121 and the baffle 140 rise integrally by a predetermined stroke. At this time, the baffle 140 is guided so as to be movable up and down by the up and down sliding members 153a and 153b.

As shown in FIGS. 12( a) and (b ), a link base 171 is installed on the baffle 140. Therefore, when the baffle 140 rises, the link base 171 also rises, and the two link rods 173 in the horizontal direction (refer to FIG. 10(b)) are rotated. At this time, the link roller 174 rotatably provided on the link plate 172 rolls toward the positive side of the Y axis on the horizontal surface at the lower portion of the support portion 160, and moves the link plate 172 toward the positive side of the Y axis. Since the link plate 172 is installed on the support plate 131, the support plate 131 also moves to the positive side of the Y axis. The link plate 172 is moved in the horizontal direction while maintaining the vertical state by the four-bar link. As a result, the restricting portion 130 supported by the support plate 131 moves slightly from the state shown in FIGS. 9 and 10 (a) to (c) toward the positive side of the Y axis. Furthermore, the restricting portion 130 also moves in the horizontal direction, so that the restricting portion 130 is separated from the wafer W. Thereby, the restricting portion 130 can be raised without leaving the wafer W without contacting the wafer W, that is, without shifting the position of the wafer W.

Next, the case where the storage device 100 is in the fourth state, that is, the mounting portion 110 is located at the storage position and the shutter 140 is opened will be described.

13 and 14 (a) and (b) are perspective views showing the configuration of the storage device 100, and showing the storage device 100 in the fourth state. Fig. 14(a) is an enlarged view of the periphery of the link mechanism, and Fig. 14(b) is a perspective view corresponding to Fig. 13. In addition, in FIGS. 13 and 14 (a) and (b), the second cassette 20, the case 103, the door 104, and the detection means 180 are omitted.

As shown in FIGS. 13, 14 (a), (b), if the predetermined pressure is continuously applied to the drive unit 151 from the third state, the rod 151a further rises by a predetermined stroke. As a result, the state in which the transfer roller 121b of the linking member 121 is fitted into the support member 152 connected to the rod 151a is maintained, and the predetermined stroke is raised. As a result, the baffle 140 can be raised integrally with the restricting portion 130 to open the second storage portion 102 to the supply area.

Furthermore, the shutter 140 of the first storage portion 101 moves downward. The first storage section 101 is composed of the same members and mechanisms as the second storage section 102. In the first storage portion 101, the support portion 160 and the link mechanism 170 are provided in the opposite vertical direction to the support portion 160 and the link mechanism 170 of the second storage portion 102. Other configurations are provided in the same manner as the second storage unit 102.

As described above, in the first storage section 101, the link mechanism 170 is provided in a state opposite to the vertical direction of the state provided in the second storage section 102. The link roller 174 of the second storage portion 102 is stably positioned on the horizontal surface of the step portion of the support portion 160 by its own weight, even if no energizing member is provided in the link mechanism 170.

On the other hand, in the first storage portion 101, the link roller 174 is located below the horizontal plane of the step portion of the support portion 160. Thereby, the link roller 174 can move by its own weight. When the link roller 174 moves, the link plate 172 also moves, so the link mechanism 170 becomes unstable. Therefore, the link mechanism 170 of the second storage section 102 is provided with an energizing member (not shown) for energizing the link roller 174 upward. As a result, the link mechanism 170 of the first storage portion 101 is stabilized.

In the case of the storage device 100 configured as described above, when the placement portion 110 is drawn out to the attachment/detachment position side from each storage portion, the restriction portion 130 and the baffle 140 are also drawn out. The same applies when returning the placement unit 110 to the storage position. Therefore, during the movement of the mounting portion 110, the restricting portion 130 continues to face the wafer W, which can reliably prevent the wafer W from falling out of the cassette. In addition, when positioning the mounting portion 110 at the attaching and detaching position, since the back side of each storage portion is blocked by the baffle 140, it is possible to prevent the operator from inserting his hand into the storage device 100.

<Effects of the implementation form> As shown in FIGS. 3( a) to 4 (b ), during the period when the extraction mechanism 200 extracts the wafer W from the second cassette stored in the second storage section 102 and supplies it to the transport path, the first cassette 10 is When empty, the operator pulls out the placement unit 110 from the first storage unit 101, takes out the first cassette 10 from the placement unit 110, and stores the wafer W to be supplied in the first cassette 10. Then, the first cassette 10 can be stored in the first storage portion 101 again. Thereby, when all the wafers W have been supplied to the transport path from the first cassette 10, the wafer W can be stored in the first cassette 10 and stored in the first cassette without temporarily stopping the supply operation of the extraction mechanism 200. 1 Storage 101. Thereby, the wafer W can be continuously supplied from the first cassette 10 and the second cassette 20 to the transport path, and the operation rate of the substrate supply system 1 can be improved.

In addition, the substrate supply system 1 does not move the storage device 100 in the vertical and horizontal directions. Generally speaking, semiconductor wafers are thin films and are relatively brittle and not resistant to impact. Therefore, if the storage device 100 moves, the wafer W to be supplied may be damaged due to shaking or vibration. In this regard, in the substrate supply system 1, the extraction of the wafer W is performed by the extraction mechanism 200 and the moving mechanism 300. This can reliably prevent the wafer W from being damaged in the storage device 100.

In addition, the extraction mechanism 200 includes rails 231a and 231b. Thereby, when the wafer W is extracted by the hand 210, the wafer W is extracted while being supported by the rails 231a, 231b. Thus, the wafer W can be smoothly extracted.

In the storage device 100, the first storage portion 101 and the second storage portion 102 are arranged in the stacking direction of the wafer W. As a result, the extraction mechanism 200 can be moved only in the stacking direction to position the hand 210 on the wafer W of the first cassette 10 and the second cassette 20. Thus, the structure and control of the moving mechanism 300 can be simplified.

In addition, it may be configured to return the wafer W supplied to the transfer path to the cassette housed before the supply. In this case, the wafer W is transferred to the hand 210 of the extraction mechanism 200 at the transfer position of the transfer path. The moving mechanism 300 positions the extraction mechanism 200 before the wafer W is supplied. Furthermore, the wafer W is inserted into the cassette by the extraction mechanism 200.

In the case of such a configuration, the wafers W that have been subjected to predetermined processing may be collectively recovered and transferred to other steps.

In addition, in the substrate supply system 1, the stacking direction is the up-down direction. As a result, the wafer W can be stored in the first cassette 10 and the second cassette 20 in a stable state. In addition, the wafer W can be stably drawn out from the first cassette 10 and the second cassette 20 in the horizontal direction.

In addition, in the substrate supply system 1, the wafer W is supplied from the first cassette 10 of the first storage section 101. That is, the drawing mechanism 200 does not go back and forth in the stacking direction, but moves from below to one direction above. Thus, when the first cassette 10 is empty, the first cassette 10 can be quickly taken out from the storage device 100, a new wafer W can be stored in the first cassette 10, and stored again in the first storage section 101 . Thus, the wafer W is smoothly and efficiently supplied.

Furthermore, the wafer W may be supplied from the second cassette 20. In this case, the extraction mechanism 200 may be supplied in order from the wafer W accommodated in the uppermost part of the second cassette 20 in such a manner that the extraction mechanism 200 moves in one direction in the stacking direction.

In addition, in the substrate supply system 1, when the wafer W is supplied from the first cassette 10 of the first storage section 101 via the horizontal slide members 122 a and 122 b, the wafer W stored in the lowermost portion of the first cassette 10 is self-contained The wafer W is supplied sequentially. Thereby, the wafer W can be efficiently supplied to the transfer path from one cassette. Thereby, the cycle of the operation of emptying or storing the processed wafer W in the cassette and storing the unprocessed wafer W in the cassette and storing it again in the storage device 100 can be accelerated.

In addition, the substrate supply system 1 described above may be combined with a plurality of units for processing wafers to form a substrate processing device 30.

FIG. 15 is a perspective view showing the structure of the substrate processing apparatus 30 provided with the substrate supply system 1. As shown in FIG. 15, the substrate processing apparatus 30 includes: a scoring unit 40 that forms a scribe line on the surface of the wafer W; and a thin film lamination unit 50 that attaches a film to the surface of the wafer W where the scribe line is formed; The inversion unit 60 inverts the wafer W so that the surface to which the film is attached becomes the lower side; the rupture unit 70 applies a predetermined force to the surface to which the film is not attached and moves the wafer W along the scribe line Breaking; and the transfer section 80, which transfers the wafer W to a predetermined position. Furthermore, in FIG. 15, the substrate supply system 1 is covered by the housing. Since the substrate processing apparatus 30 configured as described above smoothly supplies the wafer W by the substrate supply system 1, the operation rate of the apparatus can be improved.

The embodiments of the present invention can be appropriately modified within the scope of the technical idea shown in the patent application scope.

1: substrate supply system 10: Box 1 11a, 11b: side wall 12: slot 13: handle 20: Box 2 30: substrate processing device 40: Scribing unit 50: film lamination unit 60: reverse unit 70: Breaking unit 80: Transportation Department 100: storage device 101: The first storage section 102: Second storage section 103: Shell 104: door 110: Mounting section 112: handle 130: Restriction Department 131: Support plate 140: bezel 150: lifting mechanism 160: Support 170: Linkage mechanism 180: detection method 200: Withdrawal mechanism 210: hand 220: Drive mechanism 221: Pull out the guide 230: Guide 231a, 231b: track 232a～232c: guide support member 240: retreat agency 250: sensor 300: mobile mechanism W: substrate (wafer)

1(a) to (c) are perspective views showing the structure of a substrate supply system according to an embodiment. FIG. 1(a) is a perspective view showing the structure of a substrate supply system. FIG. 1(b) is a perspective view showing the configuration of a cassette housed in a substrate supply system. FIG. 1(c) is a perspective view showing the configuration of the storage device of the substrate supply system, and corresponds to FIG. 1(a). 2(a) and (b) are perspective views showing the configuration of the drawing mechanism and the moving mechanism of the substrate supply system of the embodiment. 3(a) and (b) are perspective views showing the substrate supply system and the conveyance path of the embodiment. 4(a) and (b) are perspective views showing a substrate supply system and a transport path according to an embodiment. FIG. 5(a) is a block diagram showing the configuration of the substrate supply system of the embodiment. 5(b) is a flowchart showing the operation of the substrate supply system of the embodiment. 6(a) to (c) are perspective views showing the configuration of the storage device of the substrate supply system of the embodiment. 7 is a perspective view showing the configuration of the storage device of the substrate supply system of the embodiment. 8 is a perspective view showing the configuration of the storage device of the substrate supply system of the embodiment. 9 is a perspective view showing the configuration of the storage device of the substrate supply system of the embodiment. 10(a) to (c) are perspective views showing the configuration of the storage device of the substrate supply system of the embodiment. Fig. 10 (a) and (b) are enlarged views of the periphery of the linkage mechanism. Fig. 10(c) is a perspective view corresponding to Fig. 9. 11 is a perspective view showing the configuration of the storage device of the substrate supply system of the embodiment. 12(a) to (c) are perspective views showing the configuration of the storage device of the substrate supply system of the embodiment. Fig. 12 (a) and (b) are enlarged views of the periphery of the linkage mechanism. Fig. 12(c) is a perspective view corresponding to Fig. 11. 13 is a perspective view showing the configuration of the storage device of the substrate supply system of the embodiment. 14(a) and (b) are perspective views showing the configuration of the storage device of the substrate supply system of the embodiment. Fig. 14(a) is an enlarged view of the periphery of the tie rod mechanism. Fig. 14(b) is a perspective view corresponding to Fig. 13. 15 is a perspective view showing the structure of a substrate processing apparatus provided with the substrate supply system of the embodiment.

1: substrate supply system

10: Box 1

11a, 11b: side wall

12: slot

13: handle

20: Box 2

100: storage device

101: The first storage section

102: Second storage section

103: Shell

104: door

110: Mounting section

112: handle

130: Restriction Department

131: Support plate

140: bezel

150: lifting mechanism

160: Support

170: Linkage mechanism

180: detection method

200: Withdrawal mechanism

210: hand

220: Drive mechanism

221: Pull out the guide

230: Guide

231a, 231b: track

232a~232c: guide support member

240: retreat agency

250: sensor

300: mobile mechanism

W: substrate (wafer)

Claims (9)

A substrate supply system that supplies a plurality of substrates to a conveying path from a cassette housed in a state where the substrates are stacked at a predetermined interval is characterized in that: A first storage portion, which detachably stores the first box; A second storage section that detachably stores the second cassette; An extraction mechanism that extracts the substrate from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrate and transfers it to the transport path; and A moving mechanism that moves the extraction mechanism between the first storage portion and the second storage portion. The substrate supply system according to claim 1, wherein, The above-mentioned extraction institutions are equipped with: The hand, which holds the above substrate; A driving mechanism that moves the hand in a direction perpendicular to the stacking direction; and A guide part, which supports and guides the above-mentioned substrate drawn out; When the hand draws the substrate from the first cassette and the second cassette, the moving mechanism positions the hand so as to face the substrate to be supplied. The substrate supply system according to claim 1 or 2, wherein, The first storage portion and the second storage portion are arranged side by side in the stacking direction, The moving mechanism moves the drawing mechanism in the stacking direction. The substrate supply system according to claim 3, wherein, The above-mentioned stacking direction is the up-down direction. The substrate supply system according to claim 3, which includes a control unit that controls the moving mechanism, The control unit moves the extraction mechanism in one of the stacking directions by the movement mechanism. The substrate supply system according to claim 4, which includes a control unit that controls the moving mechanism, The control unit moves the extraction mechanism in one of the stacking directions by the movement mechanism. The substrate supply system according to claim 5, wherein, The above stacking direction is up and down direction, The control unit moves the drawing mechanism from below to one direction upward by the moving mechanism. The substrate supply system according to claim 6, wherein, The above stacking direction is up and down direction, The control unit moves the drawing mechanism from below to one direction upward by the moving mechanism. A substrate processing device, characterized by comprising a substrate supply system, a scoring unit, a film laminating unit, a reversing unit, a breaking unit, and a conveying section, The substrate supply system supplies a plurality of substrates in a state where they are stacked at a predetermined interval to supply the substrates to the transport path, and includes: A first storage portion, which detachably stores the first box; A second storage section that detachably stores the second cassette; An extraction mechanism that extracts the substrate from the first cassette and the second cassette in a direction perpendicular to the stacking direction of the substrate and transfers it to the transport path; and A moving mechanism that moves the extraction mechanism between the first storage portion and the second storage portion; The scribing unit forms a scribing line on the surface of the substrate, The film lamination unit is to attach a film to the surface of the substrate on which the scribe line is formed, The inverting unit inverts the substrate so that the surface to which the film is attached becomes the lower side, The breaking unit divides the substrate along the scribe line by applying a predetermined force to the surface to which the film is not attached. The transport unit transports the substrate to a predetermined position.

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