TW202012867A - Method for producing intermediate product of vapor chamber and vapor chamber - Google Patents

Abstract

A method for producing an intermediate product of vapor chamber comprises the following steps: a printing step, an attaching step, a curing step and a cutting step. In the printing step, printing a solder on a sheet with heat conduction. In the attaching step, arranging a plurality of heat conduction assembly on the sheet. In the curing step, curing the solder. In the cutting step, cutting the sheet to form intermediate product of vapor chamber.

Description

Method for manufacturing intermediate products of multiple temperature equalizing plates and temperature equalizing plates

The invention relates to a method for manufacturing a temperature equalizing plate and a temperature equalizing plate, in particular to a method for manufacturing an intermediate product of a plurality of temperature equalizing plates and a temperature equalizing plate.

The existing common temperature averaging plate (Vapor Chamber) generally includes an upper thermal conductive sheet body, a lower thermal conductive sheet body and a capillary structure. In the existing manufacturing process, the upper thermally conductive sheet body and the lower thermally conductive component are produced by two different manufacturers, and then the upper thermally conductive sheet body and the lower thermally conductive component are bonded to each other by a foundry or brand manufacturer of the temperature equalizing plate. Since the upper thermal conductive sheet body and the lower thermal conductive component are respectively produced by different manufacturers, the foundry manufacturers or brand manufacturers of the temperature equalization board get multiple single-piece upper thermal conductive sheet bodies and multiple single-piece The lower heat conduction component, so, the foundry manufacturer or brand manufacturer of the temperature equalization board must use additional equipment to fix the two at the predetermined position during the process of bonding the upper heat conduction sheet body and the lower heat conduction component to each other; The overall production of the temperature-average plate is high, and the production yield is not easy to control.

For this reason, the present inventor has devoted himself to study and cooperate with the application of theory, and proposes a reasonable design and effectively improves the above problems.

The main purpose of the present invention is to provide a method for manufacturing intermediate products of a plurality of temperature equalizing plates, to improve the problems of high production cost of the existing temperature equalizing plates and difficult control of production yield.

In order to achieve the above object, the present invention provides a method for manufacturing intermediate products for manufacturing multiple temperature equalizing plates, which includes: a printing step: printing and forming a plurality of solder structures on a plurality of predetermined positions of a thermally conductive material strip; wherein, The thermally conductive material band defines a plurality of predetermined areas, and a plurality of protruding structures are formed in each predetermined area; a plurality of solder structures are arranged around the plurality of predetermined areas; a bonding step: a plurality of lower thermally conductive components are arranged on the thermally conductive material A plurality of lower heat conducting components through a plurality of solder structures fixed to one side of the heat conducting material belt; wherein, the lower heat conducting component includes a heat conducting sheet body, and a recess is formed on one side of the lower heat conducting sheet body. The groove has a capillary structure; the portion of the lower thermally conductive sheet that is not recessed to form the lower groove is defined as a top surface. When each lower thermally conductive component is fixed to the thermally conductive material tape, each top surface corresponds to at least one solder structure; One curing step: The heat conductive material tape provided with a plurality of lower heat conductive components is fed into a baking device to cure the multiple solder structures into multiple solder bodies; one cutting step: cutting the heat conductive material tape to Intermediate products forming a plurality of temperature equalizing plates, each intermediate product of the temperature equalizing plate includes an upper thermally conductive sheet body and a lower thermally conductive component, and the upper thermal sheet body and the lower thermally conductive component are fixed to each other through at least one welded body. The groove and the upper thermally conductive sheet body jointly form an accommodating space; wherein, the upper thermally conductive sheet body is formed by cutting the thermally conductive material tape.

An embodiment of the present invention discloses a temperature-equalizing plate, which includes: an upper thermally conductive sheet body having a plurality of protruding structures on one side; a lower thermally conductive component includes a lower thermally conductive sheet body, and one side of the lower thermally conductive sheet body is concavely formed The groove, the part of the lower heat conduction sheet body which is not depressed to form the lower groove is defined as a top surface, the lower groove has a capillary structure; a welded body, which is arranged between the upper heat conduction sheet body and the lower heat conduction sheet body, welded The body is used to fix the upper thermal conduction sheet body and the lower thermal conduction sheet body to each other; wherein, the welding body is adjacent to the end surface of the inner side wall of the lower groove, and there is a distance from the inner wall of the lower groove closest to the welding body, The spacing is between 0.1 mm and 0.3 mm; where the upper and lower thermally conductive sheets are sealed and fixed to each other, and the upper and lower thermally conductive sheets that are sealed and fixed to each other form a sealed space in which the sealed space is filled There is working fluid.

The beneficial effect of the present invention may be that: before the upper thermal conductive sheet body is connected to the lower thermal conductive component, they are all located on the thermal conductive material band together. Therefore, the relevant manufacturer only needs to perform related fixing operations on the thermal conductive material band to effectively Control production yield, and can greatly reduce production costs.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.

200‧‧‧average temperature plate

100‧‧‧ intermediate products

10‧‧‧Lower thermal component

11‧‧‧Lower thermal conductive sheet

111‧‧‧Lower groove

112‧‧‧Top

113‧‧‧Notch

12‧‧‧Capillary structure

20‧‧‧Upper thermal conductive sheet

201‧‧‧Convex structure

30A‧‧‧Solder structure

30‧‧‧welded body

D1‧‧‧thickness

D2‧‧‧ Height

D3‧‧‧Distance

D4‧‧‧Width

E1‧‧‧Conveying device

E2‧‧‧Transfer device

E21‧‧‧Mobile unit

E22‧‧‧Lifting unit

E23‧‧‧Sucker

E24‧‧‧ detection unit

M‧‧‧Heat conduction tape

M1‧‧‧Reserved area

OP‧‧‧ opening

SP1‧‧‧accommodation space

SP2‧‧‧sealed space

S‧‧‧Gap

H‧‧‧spacing

FIG. 1 is a perspective schematic view of an intermediate product of a temperature-equalizing plate of the present invention.

FIG. 2 is a schematic cross-sectional view of the intermediate product of the temperature equalizing plate of the present invention.

FIG. 3 is an exploded schematic view of the intermediate product of the temperature equalizing plate of the present invention.

4 is a schematic flow chart of a first embodiment of a method for manufacturing an intermediate product of a temperature-averaged plate of the present invention.

FIG. 5 is a schematic diagram of a thermally conductive material tape of the method for manufacturing an intermediate product of a temperature-averaged plate of the present invention.

6 is a schematic diagram of a solder structure printed on a heat conductive material tape of the method for manufacturing an intermediate product of a temperature-averaged plate of the present invention.

7 is a schematic side view of a solder structure printed on a heat conductive material tape of a method for manufacturing an intermediate product of a temperature-averaged plate of the present invention.

FIG. 8 is a schematic diagram of the bonding step of the method for manufacturing the intermediate product of the temperature-averaged plate of the present invention.

9 is a schematic diagram of the method for manufacturing a temperature-averaged intermediate product of the present invention before a cutting step.

10 is a schematic flow chart of a second embodiment of a method for manufacturing an intermediate product of a temperature-averaged plate of the present invention.

FIG. 11 is a schematic cross-sectional view of the temperature equalizing plate of the present invention.

The following is a specific specific example to illustrate the manufacturing method and implementation of the temperature equalizing plate of the intermediate products of the plurality of temperature equalizing plates of the present invention. Those skilled in the art can easily understand other advantages of the present invention from the contents disclosed in this specification With efficacy. The present invention can also be implemented or applied through other different specific examples. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple description, and are not depicted according to actual sizes, that is, the actual sizes of related components are not reflected, and will be described first. The following embodiments further describe the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint. In the following description, if you are instructed to refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize in the subsequent description, most of the related content mentioned in this specific drawing, However, it does not limit that only specific patterns can be referred to in the subsequent description.

Please refer to FIG. 1 to FIG. 3 together. FIG. 1 is a perspective schematic view of the intermediate product of the temperature equalizing plate manufactured by the method for manufacturing the intermediate product of the temperature equalizing plate of the present invention; FIG. 2 is the intermediate product of the temperature equalizing plate. Sectional schematic diagram; Figure 3 is an exploded schematic diagram of the intermediate product of the temperature equalizing plate. As shown in the figure, the intermediate product 100 of the temperature equalizing plate includes a lower heat conducting component 10 and an upper heat conducting sheet body 20. The lower heat conducting component 10 includes a heat conducting sheet body 11 and a capillary structure 12. A partial groove 111 is recessed in a part of a side surface of the lower heat conductive sheet body 11, and the remaining area where the lower groove 111 is not recessed corresponds to a top surface 112, that is, the top surface 112 surrounds the recess Slot 111 is set. The capillary structure 12 may be, for example, a metal mesh structure, which may be a member independent of the lower thermally conductive sheet body 11 and fixed in the lower groove 111 by an appropriate method, but the capillary structure 12 is not limited to be independent of the lower thermally conductive sheet body 11 In different applications, the capillary structure 12 may also be formed integrally with the lower heat conductive sheet body 11. The upper heat-conducting sheet body 20 has a plurality of protruding structures 201, and the related geometric relationships such as the spacing distance and the arrangement of the plurality of protruding structures 201 may vary according to needs, and are not limited to those shown in the figure; In the drawings of the present embodiment, each convex structure 201 is roughly presented as a hemisphere as an example, but the appearance of each convex structure 201 protrudes from the height of the upper thermal conductive sheet body 20, etc., which can be changed according to needs. It is not limited to what is shown in the figure. For example, in different implementations, each protruding structure 201 may also be a cylindrical structure, a corner column structure, a semi-ellipsoid, etc., which is not limited herein.

As shown in FIG. 2, the lower thermally conductive sheet body 11 and the upper thermally conductive sheet body 20 fixed to each other through the welding body 30 may jointly form an accommodating space SP1, and the accommodating space SP1 may pass through the middle of the temperature equalizing plate An opening OP of the product 100 communicates with the outside. Specifically, as shown in FIGS. 1 and 3, the lower thermally conductive sheet body 11 may have a notch 113. When the upper thermally conductive sheet body 20 and the lower thermally conductive sheet body 11 are fixed to each other by the welding body 30, the lower thermally conductive sheet body 11 The notch 113 will be formed together with the upper thermal conductive sheet body 20 as the opening OP. In different applications, the upper thermally conductive sheet body 20 may also have a notch (not shown), and the opening OP may be formed by the notch of the upper thermally conductive sheet body 20 and the notch 113 of the lower thermally conductive sheet body 11 . The geometrical conditions such as the appearance, installation position, and caliber of the notch 113 and the opening OP can be changed according to requirements, and are not limited to those shown in the figure.

It is worth mentioning that, as shown in FIG. 2, when the upper heat-conducting sheet body 20 and the lower heat-conducting component 10 are fixed to each other through the welding body 30, the plurality of protruding structures 201 correspond to the capillary structures 12. Among them, a plurality of protruding structures 201 are used to support the upper thermal conductive sheet body 20 and the lower thermal conductive sheet body 11, therefore, in special applications, the protruding structure 201 may not be pressed against the capillary structure 12, for example, The capillary structure 12 may be a metal mesh body with multiple perforations, and when the upper thermal conductive sheet body 20 and the lower thermal conductive sheet body 11 are fixed to each other, the multiple protruding structures 201 correspond to the multiple perforations passing through the metal sheet body.

The intermediate product 100 of the temperature-equalizing plate mentioned above may be subsequently subjected to steps of tube placement, vacuuming, injection of working liquid, pipe cutting and sealing to form a temperature-equalizing plate 200 (as shown in FIG. 11 ). Specifically, the intermediate product 100 of the temperature-equalizing plate described above may use related members to expand the opening OP (as shown in FIG. 1) to a predetermined diameter, and then fix one end of a hollow tube body to the opening OP, accordingly, the accommodating space SP1 (as shown in FIG. 2) can only communicate with the outside through the hollow tube. Then, the related mechanical equipment or personnel will be able to sequentially evacuate the storage space SP1 and inject the working liquid through the hollow tube. Finally, after cutting the hollow pipe body, relevant personnel and mechanical equipment can seal the opening OP by welding or the like, so that the production of the temperature equalizing plate 200 (as shown in FIG. 11) can be completed.

As shown in FIG. 4, the method for manufacturing an intermediate product of a temperature-equalizing board of the present invention includes: a printing step S1: printing and forming a plurality of solder structures on a plurality of predetermined positions of a heat conductive material strip; wherein, the heat conductive material The belt defines a plurality of predetermined regions, and a plurality of protrusion structures are formed in each predetermined region; a plurality of solder structures are disposed around the plurality of predetermined regions; a bonding step S2: a plurality of lower thermally conductive components are disposed on the thermally conductive material belt , And fix the plurality of lower thermally conductive components to one side of the thermally conductive material belt through a plurality of solder structures; wherein, the lower thermally conductive component includes a thermally conductive sheet body, and a recess is formed on one side of the lower thermally conductive sheet body The groove has a capillary structure; the portion of the lower thermally conductive sheet that is not recessed to form a recess is defined as a top surface. When each thermally conductive component is fixed to the thermally conductive material strip, each top surface corresponds to at least one solder structure; a curing Step S3: The heat conductive material tape provided with a plurality of lower heat conductive components is fed into a baking device to solidify the multiple solder structures into a solder body; a cutting step S4: the heat conductive material tape is cut to form multiple Intermediate products of each temperature equalizing plate, each intermediate product of the temperature equalizing plate includes an upper thermal conductive sheet body and a lower thermal conductive component, and the upper thermal component and the lower thermal conductive component are fixed to each other through at least one welded body, and the lower groove of the lower thermal conductive component is The upper thermally conductive sheet body collectively forms an accommodating space; wherein, the upper thermally conductive sheet body is formed by cutting the thermally conductive material tape.

As shown in FIG. 5, it is a schematic diagram of the thermal conductive material tape M referred to in the printing step. The thermally conductive material tape M will eventually become the upper thermally conductive sheet body 20 of the temperature equalizing plate 200 (as shown in FIGS. 1 to 4 ). Therefore, the material of the thermally conductive material tape M can be selected according to requirements, and any material with good thermal conductivity properties All materials are available. The number, appearance, arrangement, etc. of the plurality of protruding structures 201 formed on the thermal conductive material belt M are not limited to those shown in the figures. The distance reserved between the two predetermined areas M1 may also vary according to demand. In practical applications, the edge of the predetermined area M1 of the thermally conductive material tape M may also be provided with an auxiliary positioning structure (not shown), for example, it may be formed on the thermally conductive material tape M by printing or the like; in the bonding step S2 It may be that the image capturing unit is used to capture the auxiliary positioning structure, and according to the auxiliary device, the lower heat conducting component 10 is correctly set on the heat conducting material belt M.

As shown in FIGS. 2 and 6, it is a schematic diagram of the thermally conductive material tape M after the printing step S2 is performed. Each solder structure 30A is to be printed on the periphery of the plurality of protruding structures 201, and each solder structure 30A is disposed substantially around the plurality of protruding structures 201 located in the same predetermined area M1. Each solder structure 30A may be in a strip shape and a rectangular cube. Regarding the solder structure 30A, which surrounds a plurality of protruding structures 201 in each predetermined area M1, the correspondingly formed appearance may be changed according to needs. In the figure, a similar mouth shape is taken as an example, but not limited to this; examples In other words, the shape of the solder structure 30A formed around the plurality of convex structures 201 of each predetermined area M1 may be determined according to the shape of the lower thermal conductive sheet 11 and the shape of the lower groove 111, and is round Shape, oval, etc.

As shown in FIG. 7, it is shown as a side view of FIG. 6. In the printing step S2, the thickness D1 of each solder structure 30A is smaller than the height D2 of each of the protruding structures 201 protruding from the thermal conductive ribbon M. The distance D3 between the solder structure 30A and its closest protruding structure 201 and the width D4 of the solder structure 30A may vary according to needs, for example, it may be based on the top surface of the lower heat conductive sheet body 11 as shown in FIG. 3 The geometrical conditions such as the width of 112 determine the distance D3 and the width D4. In addition, as shown in FIGS. 6 and 7, the distance between the two solder structures 30A of the plurality of protruding structures 201 that respectively surround different predetermined regions M1 may be based on the width of the top surface 112 of the lower thermal conductive sheet body 11 It is determined by other relevant conditions, and is not restricted here.

Please refer to FIGS. 8 and 9 together. FIG. 8 shows the execution process of the above-mentioned bonding step S3, and FIG. 9 shows a schematic diagram after the above-mentioned bonding step S3 is performed. As shown in FIG. 8, in the process of performing the bonding step S3, the thermal conductive material belt M may be disposed on a conveying device E1 (for example, a conveying belt device), and may use a transfer device E2 to The plurality of lower heat-conducting components 10 are placed on the heat-conducting material tape M one by one.

As shown in FIG. 8, the transfer device E2 may include a plurality of moving units E21, each moving unit E21 may include a plurality of lifting units E22 and a plurality of suction cups E23, and the plurality of suction cups E23 are disposed on the plurality of lifting units E22 Of the end. Each moving unit E21 may use a plurality of suction cups E23 to adsorb a single lower heat conductive component 10, and through the cooperation of the moving unit E21 and the lifting unit E22, the lower heat conductive component 10 is correspondingly disposed on the heat conductive material that has been provided with the solder structure 30A Take M. Wherein, the moving unit E21 can be any member that can move according to a predetermined path and can mount the suction cup E23, such as a robot arm, etc., which is not limited herein. In addition, in FIG. 8, it is exemplified that two moving units E21 are provided with two lower heat conductive components 10 on the heat conductive material belt M at the same time, but not limited to this. In actual applications, when performing the above bonding step S3, It may be that only a single lower heat conducting component 10 is provided on the heat conducting material belt M at a time.

As shown in FIGS. 2, 3 and 9, after the bonding step S2 is completed, a plurality of lower thermally conductive components 10 are provided on the thermally conductive material belt M, and then, the relevant conveying device can be used to make the thermally conductive material belt M and fixed The lower heat-conducting components 10 on it enter the baking device one by one, so that the plurality of solder structures 30A are cured into the solder body 30. After the curing step is completed, the same or different conveying devices can be used to move the thermally conductive material belt M below the relevant cutting unit to cut the thermally conductive material belt M using the cutting unit to form a plurality of The intermediate product 100 of the temperature-average plate. The baking device may be, for example, a continuous furnace, or may be any device that can be used to cure the solder structure.

In different applications, depending on the baking device, the thermal conductive material strip M may be first cut into a plurality of segment bodies, and each segment body may include, for example, three or more lower thermal conductive components 10 ; Then, in the curing step S3, the baking device is used to bake the plurality of block bodies one by one.

Please refer to FIG. 10, which shows a schematic flow chart of a second embodiment of the intermediate product of the temperature equalizing plate of the present invention. As shown in the figure, the biggest difference between this embodiment and the previous embodiment is that between the printing step S1 and the bonding step S2, it may further include: a detection step S11: using a detection unit on the transfer device to detect The position of the lower thermally conductive component carried by the transfer device relative to the at least one solder structure to determine whether the top surface of the lower thermally conductive component carried by the transfer device is directly above the at least one solder structure; when the detection unit determines the position of the transfer device The top surface of the lower heat-conducting component carried is located directly above the at least one solder structure, and the transfer device will move in the direction of the heat-conducting material strip, so that the lower heat-conducting component and the at least one solder structure are connected to each other.

As shown in FIG. 8, in the above-mentioned detection step S11, in a specific application, the detection unit E24 may be an image capturing unit, and the image capturing unit can capture the image of at least one solder structure 30A of the thermal conductive tape M. The detection unit E24 may be disposed on the mobile unit E21, but not limited to this. The position of the detection unit E24 disposed on the mobile unit E21 may be changed according to requirements, as long as the image of the solder structure 30A of the thermal conductive tape M can be captured That's it. A control unit (such as a microprocessor) provided in the transfer device E2 or a control device (such as a computer) connected to the transfer device E2 can determine the location of the transfer device E2 according to the image captured by the image capture unit Is the top surface 112 of the lower heat conducting component 10 carried directly above the at least one solder structure 30A?

In different applications, the heat conductive material tape M is formed with a plurality of side surfaces of the protruding structure 201, which may have an auxiliary positioning structure (not shown), for example, it may be formed on the heat conductive material tape M by printing or other methods with a predetermined pattern The figure (for example, a cross-shaped) structure; and the image capturing unit may be used to capture the image of the auxiliary positioning structure, rather than capturing the image of the solder structure 30A of the thermally conductive tape M.

As shown in FIG. 8 and FIG. 10, in the detection step S11, when the relevant control unit or control device, according to the detection result of the detection unit E24, the top of the lower thermal conductive component 10 carried by the transfer device E2 is found When the surface 112 is not located directly above the at least one solder structure 30A, the relevant control unit or control device may be to control the transfer device E2 to move relative to the thermal conductive tape M, or to control the thermal conductive tape M relative to the transfer device E2 Move, and then perform the detection step S11 again.

Please refer to FIG. 1, FIG. 3 and FIG. 6 again, in the above printing step S1, each solder structure 30A is presented in a strip shape, and a gap S is formed between the two ends of each solder structure 30A; in the bonding step S2, the lower thermal conductive sheet The top surface 112 of the body 11 is correspondingly connected to at least one solder structure 30A, and the solder structure 30A is not filled in the notch 113. In other words, in the bonding step S2, the related transfer device E2 will make the notch 113 of the lower thermal conductive sheet body 11 correspond to the position directly above the gap S of the solder structure 30A.

Please refer to FIG. 11, which is a schematic cross-sectional view of the temperature equalizing plate of the present invention. As shown in the figure, the temperature equalizing plate 200 includes an upper heat-conducting sheet body 20, a lower heat-conducting component 10 and a welding body 30. The upper heat conductive sheet body 20 has a plurality of protruding structures 201 on one side. The lower heat conduction component 10 includes a lower heat conduction sheet body 11, a lower groove 111 is formed on one side of the lower heat conduction sheet body 11 and a portion of the lower heat conduction sheet body 11 that is not recessed to form the lower groove is defined as a top surface 112, The lower groove 111 has a capillary structure 12. The welded body 30 is disposed between the upper thermal conductive sheet body 20 and the top surface 112 of the lower thermally conductive sheet body 11. The welded body 30 is used to fix the upper thermally conductive sheet body 20 and the lower thermally conductive sheet body 11 to each other. Wherein, the welding body 30 is adjacent to the end surface of the inner side wall of the lower groove 111, and there is a distance H between the lower groove 111 and the inner wall of the welding body 30 closest to each other, and the distance H is between 0.1 mm and 0.3 mm. Among them, the upper thermal conductive sheet body 20 and the lower thermal conductive sheet body 11 are sealed and fixed to each other, and the upper thermal conductive sheet body 20 and the lower thermal conductive sheet body 11 sealed and fixed to each other form a sealed space SP2, and the sealed space SP2 is filled with working liquid (Figure Not shown).

The working mode of the temperature equalizing plate 200 is generally as follows: when the lower heat conductive sheet body 11 of the temperature equalizing plate 200 contacts a heat generating member (not shown, such as a CPU, etc.) away from the contact surface of the upper heat conducting sheet body 20, the heat generating member The generated thermal energy will convert the working liquid in the temperature equalizing plate 200 from the liquid state to the gaseous state and become the working gas. After the working gas contacts the thermal conductive sheet body 20, the thermal energy of the working gas will pass through the upper thermal conductive sheet body 20 It is transferred outward, and then the working gas will be condensed into a working liquid, which can be pulled by the capillary adsorption force provided by the capillary structure 12 and flow to the contact surface of the lower heat conductive sheet body 11.

For a detailed description of the above-mentioned upper heat-conducting sheet body 20 and lower heat-conducting component 10, please refer to the foregoing embodiments, and no more details will be given here. In addition, at least a part of the method for manufacturing the temperature equalizing plate 200 may be manufactured by the method for manufacturing the intermediate product for the temperature equalizing plate according to any of the above embodiments.

The above are only the preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

S1~S4‧‧‧Process steps

Claims (10)

A method for manufacturing intermediate products of multiple temperature-equalizing plates, comprising: a printing step: printing a plurality of solder structures on a plurality of predetermined positions of a thermally conductive material strip; wherein the thermally conductive material strip is defined by A plurality of predetermined regions, a plurality of protruding structures are formed in each of the predetermined regions; a plurality of the solder structures are arranged around a plurality of the predetermined regions; a bonding step: a plurality of lower thermally conductive components are arranged on the A heat conductive material belt, and a plurality of the lower heat conductive components are fixed to one side of the heat conductive material belt through the plurality of solder structures; wherein, the lower heat conductive component includes a lower heat conductive sheet body, and the lower heat conductive sheet body A recess is formed in one side of the recess, and the lower recess has a capillary structure; the portion of the lower thermally conductive sheet that is not recessed to form the lower recess is defined as a top surface, and each of the lower thermal conductivity When the component is fixed to the thermally conductive material tape, each of the top surfaces is correspondingly connected to at least one of the solder structures; a curing step: feeding the thermally conductive material tape provided with a plurality of the lower thermally conductive components into a In the baking device, a plurality of the solder structures are solidified into a plurality of solder bodies; a cutting step: cutting the heat conductive material tape to form a plurality of intermediate products of the temperature equalizing plate, each of the The intermediate product of the warm plate includes an upper thermally conductive sheet body and the lower thermally conductive component, and the upper thermal sheet body and the lower thermally conductive component are fixed to each other through at least one of the welded bodies, and the lower groove of the lower thermally conductive component An accommodating space is formed together with the upper thermally conductive sheet body; wherein the upper thermally conductive sheet body is formed by cutting the thermally conductive material tape. The method of manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 1, wherein, in the printing step, each of the solder structures presents a strip shape, and each of the solder structures surrounds each of the predetermined A plurality of the protruding structures in the area are arranged. The method for manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 1, wherein in the bonding step, a transfer device is used to first move each of the lower heat conducting components to the heat conducting material Above the belt, the transfer device is used again to connect the lower heat-conducting component with at least one of the solder structures; between the printing step and the bonding step, it also includes: a detection step: using the A detection unit on the transfer device detects the position of the lower thermally conductive component carried by the transfer device relative to at least one of the solder structures to determine the lower thermally conductive component carried by the transfer device Whether the top surface is located directly above at least one of the solder structures; when the detection unit determines that the top surface of the lower heat conducting component carried by the transfer device is located at least one of the solder structures Above, the bonding step is performed. The method for manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 3, wherein the detection unit is an image capture unit, and the detection unit can capture at least one of the solders of the thermally conductive material tape Structured image; a control unit provided in the transfer device or a control device connected to the transfer device can determine the load carried by the transfer device according to the image captured by the detection unit Whether the top surface of the heat conducting component is located directly above at least one of the solder structures. The method for manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 1, wherein the lower thermally conductive sheet has a gap; in the bonding step, the top surface of the lower thermally conductive sheet Correspondingly connected to at least one of the solder structures, and the solder structure is not filled in the notch; for the intermediate product of the temperature equalizing plate made after the cutting step, the accommodating space is only It can communicate with the outside through the gap. The method for manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 5, wherein in the printing step, each of the solders is in the form of a strip, and a gap is formed between both ends of each of the solders ; In the bonding step, the gap corresponds to the gap. The method for manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 1, wherein in the printing step, the thickness of each solder structure is smaller than the height of each protrusion structure. The method for manufacturing an intermediate product for manufacturing a plurality of temperature equalizing plates according to claim 1, wherein in the printing step, each of the solder structures is a rectangular cube. The method for manufacturing a plurality of temperature-regulating intermediate products according to claim 1, wherein each of the temperature-regulating intermediate products has the welded body adjacent to the inner side wall of the lower groove There is a gap between the end surface of the bottom groove and the inner side wall of the lower groove closest to the welded body. A temperature-equalizing plate, comprising: an upper heat-conducting sheet body with a plurality of protruding structures on one side; and a lower heat-conducting component comprising a lower heat-conducting sheet body, and a recess is formed on one side of the lower heat-conducting sheet body, The portion of the lower thermally conductive sheet body that is not recessed to form the lower groove is defined as a top surface, and the lower groove has a capillary structure; a welded body disposed on the upper thermally conductive sheet body and the lower Between the heat conductive sheet bodies, the welded body is used to fix the upper heat conductive sheet body and the lower heat conductive sheet body to each other; wherein, the welded body is adjacent to the end surface of the inner side wall of the lower groove, and The lower groove is closest to the inner side wall of the welded body with a distance between 0.1 mm and 0.3 mm; wherein, the upper thermal conductive sheet and the lower thermal conductive sheet The upper heat conductive sheet body and the lower heat conductive sheet body sealed and fixed to each other together form a sealed space, and the sealed space is filled with working liquid.

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