TW202011496A - Device for supporting plate-shaped workpiece and electroplating apparatus - Google Patents

Abstract

The present invention relates to a device for supporting a plate-shaped workpiece. The device includes a first member, an electrically conductive member, a second member and a fastening member. The first member is formed with a through-hole and provided with a first magnetic portion. The second member is provided with a second magnetic portion corresponding to the first magnetic portion. During assembly, the second member is placed at a lateral side of the first member in such a manner that one end of the through-hole is sealed by the second member, and secured to the first member by the first and the second magnetic portions and the fastening member. The electrically conductive member includes an annular flexible insulative body disposed peripherally around the through-hole, and a plurality of resilient conductive portions exposed from the annular flexible insulative body. The device disclosed herein is adapted for holding a workpiece in an electroplating chamber, while the through-hole exposes an area of the workpiece subjected to electroplating.

Description

Plate supporting member and electroplating device

The invention relates to a plate supporting member capable of supporting an object to be plated for electroplating.

The conventionally used wafer electroplating devices can be roughly divided into two types, one is an upright electroplating device (Rack plater), and the other is a flat-type electroplating device (Cup plater). In the conventional conventional electroplating equipment (Rack plater), before the electroplating, the back of the wafer needs to be pressed with a layer of blue tape (blue tape). In addition, a photoresist must be coated on the edge of the wafer to prevent The edges of the wafer are plated with unwanted metal. Then, the electroplating probe on the wafer electroplating jig is in contact with the edge of the wafer to provide the current required for electroplating of each wafer, and then the wafer is immersed in the electroplating bath with a high-temperature electroplating solution, After a predetermined period of time, the wafer is taken out, and the electroplating is completed. After electroplating, remove the blue film. However, pressing a blue adhesive film on the back of the wafer, tearing the film after electroplating, and applying photoresist on the edge of the wafer are not only time-consuming but also very easy to contaminate and damage the wafer, affecting the yield of the product.

Therefore, such as the Republic of China Patent Announcement No. 461015, the patent name "wafer electroplating fixture", which has a vacuum system, a lower cover, a suction line and two upper covers, the two upper covers have a circular opening, respectively The two surfaces of the cover are combined to expose the plating area of the wafer, and a plurality of plating points and probes are respectively provided on the edge of the circular opening for electrically connecting with the wafer, and the lower cover has a plurality of through holes The gas lines are connected, and the vacuum system can be used to suck the wafer stably on the lower cover through the suction line and the plurality of through holes, and then the upper cover is bolted to both sides of the lower cover. After the upper cover is locked to the lower cover, and then fixed with a supporting device, it can be placed in an electroplating solution for electroplating.

Although the above-mentioned conventional patents can save the cumbersome steps of pressing the blue film, tearing the film and photoresist on the edge of the wafer plating surface; but there are still the following defects: 1. The upper cover and the lower cover must be manually locked with each other by bolt locking Locking, not only time-consuming and labor-intensive, but also difficult to control the force of manual locking, it is easy to break the risk of breaking due to the force of the ambassador upper cover exerting force on the wafer; 2. When the force of each bolt is different, the upper cover and the crystal There is a gap on the round surface, and the plating solution will infiltrate from the gap and leak to the back of the wafer; 3. Due to the inflexibility of the plating point and the probe, after the bolt is locked, it is easy to generate stress on the wafer surface and fragments may occur .

The main purpose of the present invention is to provide a plate supporting member, which provides a better clamping and supporting effect, which can not only support the object to be plated but also avoid the risk of chipping due to stress.

The secondary object of the present invention is to provide a plate support member that provides a better sealing effect, can ensure that the plating solution does not leak to the non-plating area of the object to be plated, and ensures the product yield.

The plate supporting member of the present invention includes at least: a first part provided with an opening and a plurality of first magnetically attracting parts looped around the periphery of the opening; a conductive part having a ring-shaped flexible insulating body and exposed to A plurality of elastic conductive parts of the flexible insulation body, the flexible insulation main system ring is arranged at the periphery of the opening; the second part is provided with a plurality of second magnetic attraction parts, the number and position of which are the same as the first magnetic attraction Corresponding to the part, the second part is arranged on the side of the first part and can close the opening side; and a fixing part is arranged between the first part and the second part for fixing the first part 1. The second part.

Wherein, the board supporting member can hold and fix an object to be plated in an electroplating tank, and the opening exposes a plating area of the object to be plated, and is contacted by a flexible insulating body and a plurality of elastic conductive parts The surface of the object to be plated does not cause a risk of chipping of the object to be plated, and can effectively prevent non-plating areas such as edges and back surfaces other than the plating area from coming into contact with the plating solution.

According to the above technical features, the conductive member further has at least two hangers and a conductor connected to the two hangers, the hanger extends to be exposed above the first member, and the side of the conductor has a comb arrangement A plurality of pieces, and a free end of the plurality of pieces is respectively bent inward to form the elastic conductive portion.

According to the above technical feature, the fixed part has a fixed part, a movable part and a pivot connecting the fixed part and the movable part, the movable part is pivoted by the pivot, and the free end of the movable part is provided with an elastic fixation unit.

According to the above technical features, the fixing member is disposed on the second member, and the first member has a groove for fixing the movable member.

According to the above technical features, the groove is also provided with a groove portion for catching the elastic fixing portion.

According to the above technical features, a vacuum system and a first suction port connected to the vacuum system are further provided, the first suction port is disposed on the second component, and the second component is further provided with a second suction port Communicating with the first suction port, the second suction port faces the opening.

According to the above technical features, the first magnetic attraction portion is a magnetic body disposed on the first member, and the second magnetic attraction portion is a magnetic body disposed on the second member.

According to the above technical features, the first and second components are respectively provided with first and second assembly parts that can be joined to each other.

The present invention further provides an electroplating apparatus, which at least includes: the above-mentioned plate support member; and an electroplating tank for storing electroplating solution therein.

According to the above technical features, the plate support member is used to clamp an object to be plated in the electroplating bath for electroplating, the object to be plated is supported and fixed between the first and second parts, and the opening and A plating area of the object is exposed, and at least a part of the object is in contact with the plurality of elastic conductive parts.

Unless otherwise stated, the following terms used in the specification and patent scope of this application have the definitions given below. Please note that the singular term "a" used in the specification and patent scope of this application is intended to cover one or more of the items contained, such as at least one, at least two, or at least three, and does not mean to have only The single item contained. In addition, open connection terms such as "include", "have", etc. used in the scope of patent application mean that the combination of elements or components described in the request does not exclude other components or components not specified in the request. It should also be noted that the term "or" also generally includes "and/or" in the sense, unless the content clearly indicates otherwise. The terms "about" or "substantially" used in the specification and patent scope of this application are used to modify any slight variation error, but such slight variation will not change its essence.

First of all, the method of this case involves a board support member. Please refer to FIG. 1 for a schematic diagram of the board handling device of the present invention, which at least includes: a first part 1, a conductive part 2, a second part 3 and a fixing part 4.

The first component 1 has a rigid body, which is provided with an opening 11 and a plurality of first magnetic attraction portions 12 looped around the periphery of the opening 11, the first magnetic attraction portion 12 may be disposed on the first component 1 of the magnetic body.

The conductive member 2 has a ring-shaped flexible insulating body 21 and a plurality of elastic conductive parts 22 exposed on the flexible insulating body 21, please also refer to FIGS. 2 to 4, the flexible insulating body 21 is looped At the periphery of the opening 11, the flexible insulating body 21 can be made of silicone or other materials. The conductive member 2 further has at least two hangers 23 and a conductor 24 connected to the two hangers 23. The hanger 23 extends and is exposed above the first member 1. The side of the conductor 24 has a comb shape The plurality of arranged pieces 241, and one of the free ends of the plurality of pieces 241 are respectively bent inwards, and the elastic conductive portion 22 is formed at the bent portion.

The second component 3 has a rigid body. As shown in FIG. 1, it is provided with a plurality of second magnetic attraction portions 31, the number and position of which correspond to the first magnetic attraction portion 12, the second magnetic attraction portion 31 may be a magnetic body disposed on the second member 3, the second member 3 is disposed on the side of the first member 1, and may close the opening 11 side.

The fixing member 4 is arranged between the first member 1 and the second member 3 for fixing the first and second members 1, 3, please also refer to FIG. 1 and FIG. 5, the fixing member 4 It has a fixed member 41, a movable member 42 and a pivot 43 connecting the fixed member 41 and the movable member 42. The movable member 42 is pivoted by the pivot 43. The free end of the movable member 42 is provided with an elastic fixing portion 421, the elastic fixing portion 421 may be an elastic sheet configuration; in the illustrated embodiment, the fixing member 41 is disposed on the second component 3, and the first component 1 has a groove 13 for fixing the The movable member 42 and the groove 13 are also provided with a groove portion 14 for catching the elastic fixing portion 421.

The plate supporting member of the present invention can be used to clamp an object to be plated 5 in an electroplating tank (not shown) in which the plating solution is stored for electroplating. As shown in FIGS. 6 and 7, the object to be plated 5 is supported and fixed between the first and second parts 1 and 3, the opening 11 exposes one of the plating areas 51 of the object to be plated 5, and the non-plating areas such as the edge and back surface other than the plating area 51 52 is in contact with the second member 3 and is in a closed shape, in particular, the first magnetic part 12 and the second magnetic part 31 are fixed by mutual magnetic attraction, and the first and second parts 1 are fixed by the fixing part 4 , 3 are fixed to each other, not only can support the object to be plated 5 but also avoid the risk of chipping due to stress, and at least a part of the object to be plated 5 is in contact with the flexible insulating body 21 and the plurality of elastic conductive parts 22, and The current is passed through the hanger 23, the electrical conductor 24 and the plurality of elastic conductive parts 22 onto the object 5 to facilitate the electroplating; wherein, due to the configuration of the flexible insulating body 21, the object 5 is not plated in the area 52 Close to the second part 3, and the edge of the object to be plated 5 is closely attached to the flexible insulating body 21, which not only avoids the risk of chipping of the object to be plated, but also effectively prevents the non-plating of edges and backsides other than the plating area The area is exposed to the plating solution.

The present invention further includes a vacuum system (not shown) and a first suction port 61 connected to the vacuum system. As shown in FIG. 8, the first suction port 61 is disposed on the second part 3, the The second component 3 is further provided with a second suction port 62 which can communicate with the first suction port 61. Please refer to FIGS. 1 and 6 at the same time, the second suction port 62 faces the opening 11 , The object to be plated 5 can be preliminarily sucked and fixed to the second component 3 by using the vacuum system and the vacuum suction of the first and second suction ports 61 and 62, and the plating area 51 of the object to be plated 5 is sucked outward The first and second magnetic parts 12, 31 and the fixing member 4 fix the first and second members 1, 3 to each other; furthermore, the first and second members 1, 3 are provided 1. Second assembly parts 71, 72. In the illustrated embodiment, the first assembly part 71 is a bump configuration disposed on the surface of the first component 1, and the second assembly part 72 is disposed on the first The configuration of the recesses on the surface of the two parts 3 can be assembled and aligned with each other by utilizing the first and second assembly parts 71 and 72 to engage with each other.

In summary, the present invention provides a plate support member and an electroplating device, and an application for an invention patent is filed according to law; the technical content and technical features of the present invention have been disclosed as above, but those familiar with this technology may still be based on the present invention The disclosure made various substitutions and modifications without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various replacements and modifications without departing from the present invention, and be covered by the following patent application scope.

1: the first part 11: opening 12: The first magnetic part 13: groove 14: Ditch 2: conductive parts 21: Flexible insulation body 22: Elastic conductive part 23: Hanger 24: conductor 241: piece 3: the second part 31: Second magnetic attraction 4: fixed parts 41: fixings 42: moving parts 421: Elastic fixing part 43: pivot 5: Object to be plated 51: plating area 52: Non-plating area 61: The first suction port 62: Second suction port 71: The first assembly 72: second assembly

Fig. 1 is an exploded view of the structure of a plate supporting member in the present invention. FIG. 2 is an enlarged perspective view of the structure of the first component in the present invention. FIG. 3 is an enlarged perspective view of the structure of the conductive member in the present invention. FIG. 4 is an enlarged perspective view of the structure of the conductor in the present invention. Fig. 5 is an enlarged perspective view of the structure of the fixing member in the present invention. Fig. 6 is a schematic diagram of the structure of a plate supporting member in the present invention. Fig. 7 is a perspective view of the structure of a plate support member in the present invention. Figure 8 is a schematic diagram of the structure of the vacuum system in the present invention.

1: the first part

11: opening

12: The first magnetic part

2: conductive parts

21: Flexible insulation body

3: the second part

31: Second magnetic attraction

4: fixed parts

5: Object to be plated

52: Non-plating area

62: Second suction port

71: The first assembly

72: second assembly

Claims (10)

A plate supporting member includes at least: a first component provided with an opening and a plurality of first magnetic suction parts looped around the periphery of the opening; a conductive component having a ring-shaped flexible insulating body and exposed to the A plurality of elastic conductive parts of the flexible insulation body, the flexible insulation main system ring is arranged at the periphery of the opening; the second part is provided with a plurality of second magnetic attraction parts, the number and position of which are the same as the first magnetic attraction parts Correspondingly, the second part is arranged on the side of the first part and can close the side of the opening; and a fixing part is arranged between the first part and the second part for fixing the first 2. The second part. The board support member according to claim 1, wherein the conductive member further has at least two hangers and an electrical conductor connected to the two hangers, the hanger is extended and exposed above the first member, the conductive One side of the body has a plurality of teeth arranged in a comb shape, and one of the free ends of the plurality of bodies is respectively bent inward to form the elastic conductive portion. The plate member supporting member according to claim 1, wherein the fixed part has a fixed member, a movable member, and a pivot connecting the fixed member and the movable member, the movable member is pivoted by the pivot, the movable The free end of the piece is provided with an elastic fixing part. The plate member supporting member according to claim 3, wherein the fixed member is disposed on the second component, and the first component has a groove for fixing the movable component. The plate member supporting member according to claim 4, wherein the groove is provided with a groove portion for catching the elastic fixing portion. The plate support member according to any one of claims 1 to 5, wherein a vacuum system and a first suction port connected to the vacuum system are further provided, the first suction port is disposed on the second component The second component is further provided with a second suction port that can communicate with the first suction port, and the second suction port is directed toward the opening. The plate support member according to any one of claims 1 to 5, wherein the first magnetic attraction portion is a magnetic body disposed on the first member, and the second magnetic attraction portion is disposed on the second The magnetic body of the component. The plate member supporting member according to any one of claims 1 to 5, wherein the first and second parts are provided with first and second assembly parts that can be joined to each other. An electroplating apparatus at least includes: the plate member supporting member according to any one of claims 1 to 5; and an electroplating tank for storing electroplating solution therein. The electroplating apparatus according to claim 9, wherein the plate support member is used to clamp an object to be plated in the electroplating bath for electroplating, and the object to be plated is supported and fixed to the first and second parts At the time, the opening exposes a plating area of the object to be plated, and at least a part of the object to be plated is in contact with the plurality of elastic conductive portions.

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