TW202006861A - Processing device for processing substrates - Google Patents

Processing device for processing substrates Download PDF

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TW202006861A
TW202006861A TW108116054A TW108116054A TW202006861A TW 202006861 A TW202006861 A TW 202006861A TW 108116054 A TW108116054 A TW 108116054A TW 108116054 A TW108116054 A TW 108116054A TW 202006861 A TW202006861 A TW 202006861A
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processing
substrate
processing device
turntable
patent application
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TW108116054A
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Chinese (zh)
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TWI793320B (en
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佛羅里安 溫思勒
羅倫斯 寇伯
克勞斯 歐培特
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德商亞席斯自動化系統有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The present invention relates to a processing equipment (1) for processing flat substrates, especially circuit boards, solar cells, wafers, etc. The processing equipment has a processing device (2), especially a printing device. The processing device has a processing head (4), especially a printing head and a processing tank (3), especially a printing tank, and at least one substrate can be placed on the processing tank in order to perform the processing process; a feeding device (23) for feeding the substrate; a discharging device (24) for discharging the substrate; and a turntable (6) for transporting the substrate from the feeding device (23) to the processing device (2) and from the processing device (2) to the discharging device (24). The turntable (6) has at least one device (11-14) in the middle of the outer side for receiving at least one substrate. It is proposed that the device (11-14) has at least one load-bearing finger member (15, 16) protruding at least basically radially, and the at least one substrate can be placed on the load-bearing finger member. A processing tank (3) which is permanently opposed to the processing head has a hollowed-out part (28) for the at least one load-bearing finger member (15, 16), so that the processing tank (3) and the load-bearing finger member (15, 16) introduced into the corresponding hollowed-out part (28) together form at least a basically continuous support surface for the at least one substrate.

Description

用於處理基材之處理設備Processing equipment for processing substrates

本發明涉及一種處理設備,尤其印刷設備,用於處理平坦基材,尤其電路板、太陽能電池、晶圓等,該處理設備具有:處理裝置,該處理裝置具有處理頭(尤其印刷頭)和處理槽(尤其印刷槽(Drucknest)),至少一個基材能夠放置在該處理槽上以便執行處理過程;用於送入基材之送入裝置;用於送出基材之送出裝置;以及用於將基材從送入裝置運輸到處理裝置並從處理裝置運輸到送出裝置的轉盤,其中該轉盤具有在外側中部的用於接納至少一個基材的至少一個裝置。The present invention relates to a processing device, especially a printing device, for processing flat substrates, especially circuit boards, solar cells, wafers, etc. The processing device has a processing device having a processing head (especially a printing head) and a processing device Tank (especially a printing tank (Drucknest)), at least one substrate can be placed on the processing tank in order to perform the processing process; the feeding device for feeding the substrate; the feeding device for feeding the substrate; and The substrate is transported from the feeding device to the processing device and from the processing device to the carousel of the feeding device, wherein the carousel has at least one device for receiving at least one substrate in the middle of the outside.

開篇所述類型的處理設備在先前技術中是已知的。為了確保在例如印刷設備中基材的高產量,已知的是設置轉盤,在該轉盤上佈置多個印刷槽作為用於接納基材的同步移動的裝置。藉由圍繞豎直軸線旋轉轉盤,將印刷槽彼此相繼地送入處理裝置,使得在位於相應印刷槽的基材上可以進行處理過程。另外,為了確保將基材可靠地運輸到印刷槽上,已知的是為印刷槽設置運輸裝置,例如在公開文件WO 2009/153160 A1中公開的。其中印刷槽可移動地佈置到轉盤處並且承載運輸裝置,該運輸裝置具有供應輥(傳送帶可以從其中滾動出來)以及接收輥(傳送帶可以滾入其上)。傳送帶在此可以藉由由印刷槽構成的工作面從供應輥被拉動到接收輥。借助於傳送帶,可以簡單地操作基材並且還可以將基材定向。在傳送帶髒污的情況下,可以簡單地將其在接收輥的方向上繼續運輸,使得在工作面上有新的乾淨的傳送帶可供使用。類似的處理設備還從公開文件EP 2 581 951 B1、US 2013/0052334 A1和US 2012/0244702 A1已知。其缺點在於,整個運輸裝置都必須隨轉盤同步移動,由此轉盤的移動速度且因此處理設備的週期頻率受到不利影響,因為最大可實現的產量受到運輸裝置的慣性和質量限制。Processing devices of the type mentioned in the opening paragraph are known in the prior art. In order to ensure a high yield of substrates in, for example, printing equipment, it is known to provide a turntable on which a plurality of printing grooves are arranged as means for receiving the synchronous movement of the substrate. By rotating the turntable around the vertical axis, the printing tanks are successively fed into the processing device, so that the processing process can be performed on the substrates located in the corresponding printing tanks. In addition, in order to ensure that the substrate is reliably transported to the printing tank, it is known to provide a transportation device for the printing tank, for example, disclosed in the publication WO 2009/153160 A1. The printing tank is movably arranged at the turntable and carries a transport device having a supply roller (from which the conveyor belt can roll out) and a receiving roller (from which the conveyor belt can roll on). The conveyor belt can be pulled from the supply roller to the receiving roller by the working surface formed by the printing groove. With the aid of a conveyor belt, the substrate can be easily handled and the substrate can also be oriented. In the case of dirty conveyor belts, it can simply be transported in the direction of the receiving roller, so that a new, clean conveyor belt is available on the working surface. Similar processing devices are also known from the published documents EP 2 581 951 B1, US 2013/0052334 A1 and US 2012/0244702 A1. The disadvantage is that the entire conveyor must move synchronously with the carousel, whereby the speed of the carousel movement and therefore the cycle frequency of the processing equipment is adversely affected, because the maximum achievable output is limited by the inertia and quality of the conveyor.

因此本發明之基本目的係創造一種改良的處理設備,該處理設備保證了高處理產量。The basic object of the present invention is therefore to create an improved processing device which guarantees a high processing throughput.

本發明的基本目的係藉由具有申請專利範圍第1項特徵的處理設備來實現的。其優點在於,待被轉盤移動的質量有所降低並且由此能夠實現更高的速度和加速度,這保證了處理設備的提高的產量。根據本發明這係藉由如下方式實現的:該裝置具有至少一個至少基本上徑向突出的承載指形件,該至少一個基材能夠放置到該承載指形件上,並且與該處理頭永久相對的該處理槽具有用於該至少一個承載指形件的挖空部,使得該處理槽與被引入到相應的挖空部中的承載指形件一起構成用於該至少一個基材的至少基本上連續的支承面。由此實現了,處理槽無須隨轉盤同步移動,而是處理槽現在永久地與處理頭相對地佈置並且藉由轉盤僅移動承載指形件。基材可以放置在該至少一個承載指形件上,使得基材在轉盤移動時隨承載指形件同步移動。在此,藉由與該裝置相關聯的視需要的固持裝置,基材可以鎖定在承載指形件上,以便即使在轉盤加速時也可靠地被固持在承載指形件上。由於可以將承載指形件如下引入挖空部中,使得承載指形件與處理槽構成至少基本上連續的支承面,在處理過程期間,基材可靠地平放在處理槽上並且確保更可靠且更高效的處理過程。在進行處理過程之後,該裝置隨承載指形件從挖空部中移出並且帶有現在經處理的基材的轉盤在送出裝置的方向上旋轉,使得在那裡可以將經處理、尤其經印刷的基材取走並且送至另外的處理和/或儲存。由於轉盤的較小的質量,確保了處理設備的高工作速度和因此高產量。The basic object of the present invention is achieved by a processing device having the first feature of the patent application. This has the advantage that the mass to be moved by the turntable is reduced and thus higher speeds and accelerations can be achieved, which guarantees increased throughput of the processing device. According to the invention this is achieved by the device having at least one carrying finger that protrudes at least substantially radially, the at least one substrate can be placed on the carrying finger and is permanently connected to the processing head The opposite processing tank has cutouts for the at least one bearing finger, so that the processing tank together with the bearing fingers introduced into the corresponding cutout constitute at least one for the at least one substrate A substantially continuous bearing surface. This achieves that the processing tank does not need to move synchronously with the turntable, but that the processing tank is now permanently arranged opposite the processing head and only the carrying finger is moved by the turntable. The substrate can be placed on the at least one carrying finger, so that the substrate moves synchronously with the carrying finger when the turntable moves. Here, with an optional holding device associated with the device, the substrate can be locked on the carrying finger so that it can be reliably held on the carrying finger even when the turntable is accelerating. Since the load-bearing fingers can be introduced into the cutout as follows, so that the load-bearing fingers and the processing tank form an at least substantially continuous support surface, during the processing process, the substrate is reliably placed on the processing tank and ensures a more reliable and More efficient processing. After carrying out the treatment process, the device is removed from the cutout with the carrying fingers and the turntable with the now treated substrate rotates in the direction of the delivery device, so that the treated, especially printed The substrate is removed and sent to additional processing and/or storage. Due to the lower mass of the turntable, a high working speed of the processing equipment and therefore a high output are ensured.

根據本發明的一個較佳的改良方案提出,該承載指形件在其面向該基材的頂側處具有至少一個抽吸開口,該至少一個抽吸開口與負壓生成裝置相連或能夠相連。抽吸開口與負壓生成裝置一起構成先前所述的固持裝置,借助於該固持裝置可以將放置在承載指形件上的基材可靠地鎖定在承載指形件上。在此利用了負壓或真空,藉由該負壓或真空將基材抽吸到承載指形件的頂側處並由此固持在其上。由此確保了用於將基材鎖定在承載指形件上的簡單且成本低廉的解決方案。According to a preferred improvement of the present invention, it is proposed that the bearing finger has at least one suction opening at its top side facing the substrate, and the at least one suction opening is connected to or can be connected to the negative pressure generating device. Together with the negative pressure generating device, the suction opening constitutes the holding device previously described, by means of which the substrate placed on the carrying finger can be reliably locked on the carrying finger. Here, a negative pressure or vacuum is used, by which the base material is sucked to the top side of the carrying finger and is thereby held thereon. This ensures a simple and cost-effective solution for locking the base material on the carrying finger.

根據一個較佳的改良方案,該轉盤具有至少一個抽吸管道,該抽吸管道將該抽吸開口與該負壓生成裝置相連。由此確保由負壓生成裝置提供的負壓作用在抽吸開口處並且因此將位於其上的基材可靠地抽吸到承載指形件的頂側上並且固持在其上。According to a preferred improvement, the turntable has at least one suction duct, which connects the suction opening to the negative pressure generating device. This ensures that the negative pressure provided by the negative pressure generating device acts on the suction opening and therefore reliably sucks the substrate located thereon onto the top side of the carrying finger and holds it thereon.

另外較佳的是提出,抽吸開口形成為穿過轉盤向承載指形件處延伸的抽吸通道。由此抽吸通道尤其形成為整合到轉盤和承載指形件中,使得可以省去另外的軟管連接(Verschlauchen)。由此實現了進一步降低轉盤的重量並且由此確保提高的產量。It is also preferably provided that the suction opening is formed as a suction channel extending through the turntable to the bearing finger. In this way, the suction channel is formed in particular to be integrated into the turntable and the bearing fingers, so that additional hose connections can be omitted. In this way, a further reduction in the weight of the turntable is achieved and thus an increased output is ensured.

另外,本發明較佳的是具有至少兩個彼此間隔開佈置的承載指形件。這兩個承載指形件至少基本上徑向地從轉盤突出並且提供用於基材的可靠支承部,該支承部尤其防止基材在承載指形件上圍繞水平軸線的傾翻和轉動。視需要,承載指形件如下形成,使得其相對彼此的間距係可設定的。為此例如在轉盤處的軌道中引導承載指形件中的至少一個,以便增大或減小與同一個裝置的相鄰承載指形件的間距。In addition, the present invention preferably has at least two bearing fingers arranged spaced apart from each other. The two load-bearing fingers protrude at least essentially radially from the turntable and provide a reliable support for the substrate, which in particular prevents the base material from tipping and turning around the horizontal axis on the load-bearing fingers. If necessary, the load-bearing fingers are formed as follows, so that their spacing relative to each other can be set. For this purpose, for example, at least one of the bearing fingers is guided in the track at the turntable in order to increase or decrease the distance from adjacent bearing fingers of the same device.

特別較佳的是,承載指形件相對彼此平行地定向,從而確保承載指形件的可靠且明確的支承面以及簡單地將承載指形件引入處理槽的挖空部中。It is particularly preferred that the load-bearing fingers are oriented parallel to each other, so as to ensure a reliable and clear bearing surface of the load-bearing fingers and to simply introduce the load-bearing fingers into the hollow of the treatment tank.

另外較佳的是提出,送入裝置具有至少一個傳送帶,該傳送帶可以定位在這一個裝置的承載指形件之間。由此確保將基材簡單地送入和送出到承載指形件。It is also preferably provided that the feeding device has at least one conveyor belt, which can be positioned between the bearing fingers of this device. This ensures that the substrate is simply fed into and out of the carrying fingers.

特別較佳的是,送入裝置和/或送出裝置具有至少兩個相對彼此平行且間隔開地佈置的傳送帶,這些傳送帶可以佈置在承載指形件之間或者在該至少一個裝置的至少一個承載指形件的兩側。藉由這兩個相對彼此平行佈置的傳送帶確保了借助於傳送帶將基材可靠地送入和/或送出。依據傳送帶彼此間隔開的距離,以及依據承載指形件彼此間隔開的距離,將傳送帶定位在承載指形件外部或承載指形件之間,以便將基材運輸到承載指形件上或者在進行處理過程之後從其上移走。Particularly preferably, the feed-in device and/or the feed-out device have at least two conveyor belts arranged parallel to and spaced apart from each other, which conveyor belts can be arranged between the bearing fingers or at least one bearing of the at least one device Fingers on both sides. With these two conveyor belts arranged parallel to each other, it is ensured that the substrate is reliably fed in and/or out by means of the conveyor belt. Depending on the distance between the conveyor belts and the distance between the carrier fingers, the conveyor belt is positioned outside or between the carrier fingers in order to transport the substrate onto the carrier fingers or on Remove from it after proceeding.

另外較佳的是提出,相應的傳送帶和/或相應的裝置在高度方面是可調的,以便放置或接納這些基材。藉由高度調節,確保了簡單地放置基材,該基材例如已經借助於傳送帶移動到了承載指形件的高度上。特別較佳的是,相應的傳送帶在高度方面是可調的,使得單獨的承載指形件或者整個轉盤可以省去高度調節器,該高度調節器在其他情況下可能導致轉盤的提高的質量。In addition, it is preferably provided that the corresponding conveyor belt and/or the corresponding device are adjustable in height in order to place or receive these substrates. The height adjustment ensures a simple placement of the substrate, which has been moved to the height of the carrying finger by means of a conveyor belt, for example. It is particularly preferred that the corresponding conveyor belt is adjustable in height, so that the individual load-bearing fingers or the entire turntable can omit the height adjuster, which in other cases may lead to an increased quality of the turntable.

此外,轉盤較佳的是具有多個尤其在周邊上均勻分佈地佈置的裝置,這些裝置分佈用於接納一個或多個基材。由此例如可以在一個裝置處送入基材、在另一個裝置處送出經印刷的基材並且在又一個裝置處同時進行處理過程。In addition, the turntable preferably has a plurality of devices, which are evenly distributed on the periphery, which are distributed for receiving one or more substrates. Thus, for example, the substrate can be fed in at one device, the printed substrate can be sent out at another device, and the processing can be performed simultaneously at another device.

較佳的是該處理槽在高度方面是可調的,以便將該承載指形件或這些承載指形件引入到相應的挖空部中。這個實施方式還涉及以下情況,即,轉盤在一個高度上是不可調的。由此確保藉由處理槽的高度調節來將承載指形件引入挖空部中。It is preferable that the treatment tank is adjustable in height in order to introduce the load-bearing fingers or the load-bearing fingers into the corresponding hollows. This embodiment also relates to the case where the turntable is not adjustable in one height. This ensures that the carrying fingers are introduced into the cutout by adjusting the height of the treatment tank.

另外,較佳的是將機電直接驅動器與轉盤相關聯,以便圍繞豎直軸線進行旋轉。由此確保以高調節速度和準確的轉盤定向或準確的旋轉角度設定來可靠地操作處理設備。In addition, it is preferable to associate the electromechanical direct drive with the turntable to rotate about a vertical axis. This ensures that the processing device is reliably operated with high adjustment speeds and accurate turntable orientation or accurate rotation angle settings.

另外較佳的是提出,在該轉盤的旋轉方向上看,該處理裝置佈置在該送入裝置與該送出裝置之間。由此產生了自然的處理順序的優點。It is also preferable to provide that the processing device is arranged between the feed-in device and the feed-out device when viewed in the direction of rotation of the turntable. This has the advantage of a natural processing sequence.

另外較佳的是提出,在該轉盤的旋轉方向上看,在該送出裝置與該送入裝置之間尤其與該處理裝置相對地佈置有用於清潔相應的裝置的清潔設備。由此實現,在已經將經印刷的基材從裝置中移走並且已經將轉盤繼續旋轉之後,藉由清潔裝置將現在空閒的裝置清掃或清潔或可以將其清掃或清潔(如果存在這種需要的話)。由此在進一步的操作中將待印刷的基材運輸到經清潔的裝置上,由此可靠地防止了基材在該裝置和/或處理槽上的錯誤定位以及基材的髒污。In addition, it is preferably provided that, viewed in the direction of rotation of the turntable, a cleaning device for cleaning the corresponding device is arranged between the feed-out device and the feed-in device, especially opposite the processing device. In this way, after the printed substrate has been removed from the device and the carousel has continued to rotate, the currently free device can be cleaned or cleaned by the cleaning device or can be cleaned or cleaned (if such a need exists) if). As a result, the substrate to be printed is transported to the cleaned device in further operations, thereby erroneous positioning of the substrate on the device and/or the processing tank and contamination of the substrate are reliably prevented.

附圖以簡化透視圖示出了有利的處理設備1(在當前情況下為印刷設備),該處理設備具有處理裝置2(在當前情況下為印刷裝置、尤其是網版印刷裝置),該處理裝置具有處理槽3(尤其是印刷槽)和處理頭4(尤其印刷頭)。印刷頭例如形成為網版印刷頭。印刷槽佈置為與印刷頭永久相對,並且如藉由雙箭頭5所標示的,在高度方面是可調的。在印刷槽上可以放置基材以藉由印刷頭進行印刷。尤其是印刷頭也是在高度方面可調的,以便移動印刷頭靠近位於印刷槽上的基材,以便對該基材進行印刷。The drawing shows in a simplified perspective view an advantageous processing device 1 (in the present case, a printing device) with a processing device 2 (in the present case, a printing device, in particular a screen printing device), which processes The device has a processing tank 3 (especially a printing tank) and a processing head 4 (especially a printing head). The printing head is formed as a screen printing head, for example. The printing slot is arranged to be permanently opposite to the printing head and, as indicated by the double arrow 5, is adjustable in height. The substrate can be placed on the printing tank to print by the printing head. In particular, the print head is also adjustable in height, so as to move the print head close to the substrate on the printing tank, so as to print on the substrate.

印刷設備還具有轉盤6,該轉盤承載有多個(在當前情況下為四個)在轉盤6的周邊上均勻分佈地佈置的運輸臂7、8、9和10。運輸臂7至10在此徑向地從轉盤6向外延伸並且在其自由末端處分別具有裝置11、12、13、14,這些裝置用於接納和運輸基材。裝置11至14形成為相同的:裝置11至14中的每一個具有兩個相對彼此平行定向且相對彼此間隔開地佈置的承載指形件15和16,這些承載指形件徑向地從相應的運輸臂7至10並因此徑向地從轉盤6向外延伸。由於承載指形件15、16相對彼此平行定向,它們並不是正好沿著一條延伸到轉盤6的中心的徑向線,而是平行於一條徑向線延伸。承載指形件15、16在此尤其與相應的運輸臂7至10一體式形成,其中相應的運輸臂7至10尤其是還與轉盤6一體式形成。此外,機電直接驅動器17與轉盤6相關聯,該直接驅動器具有可旋轉地支承的轉子軸,該轉子軸直接與轉盤6防扭轉地相連。The printing apparatus also has a turntable 6 carrying a plurality of (in the present case, four) transport arms 7, 8, 9 and 10 evenly distributed on the periphery of the turntable 6. The transport arms 7 to 10 here extend radially outwards from the turntable 6 and at their free ends have devices 11, 12, 13, 14 respectively, which are used to receive and transport the substrate. The devices 11 to 14 are formed identical: each of the devices 11 to 14 has two bearing fingers 15 and 16 oriented parallel to each other and spaced apart from each other, these bearing fingers radially from the respective The transport arms 7 to 10 and thus extend radially outward from the turntable 6. Since the bearing fingers 15, 16 are oriented parallel to each other, they do not extend exactly along a radial line extending to the center of the turntable 6, but extend parallel to a radial line. The load-bearing fingers 15, 16 are in particular formed integrally with the respective transport arms 7 to 10, wherein the respective transport arms 7 to 10 are also formed integrally with the turntable 6. In addition, an electromechanical direct drive 17 is associated with the turntable 6 which has a rotatably supported rotor shaft which is directly connected to the turntable 6 in a rotationally fixed manner.

承載指形件15、16分別具有多個(在當前情況下在一行中彼此前後佈置的)抽吸開口18。為了進行展示,圖2示出了承載指形件15的縱截面圖。如已經提及的,抽吸開口18尤其沿著承載指形件15以行的形式形成。抽吸開口18通過抽吸管道19與負壓生成裝置20相連,該負壓生成裝置例如佈置在機電直接驅動器17的殼體中或殼體處。抽吸管道19至少在相應的運輸臂7至10以及承載指形件15、16的區域中較佳的是形成為整合到材料中的抽吸通道21。在此抽吸通道21尤其(如圖2所示)與這些抽吸開口18中的多個相連,使得該抽吸通道用作彙集通道。抽吸開口18在承載指形件15、16的頂側22處匯合,在該表面上還可以放置待印刷的基材。The bearing fingers 15, 16 each have a plurality of suction openings 18 (in the present case arranged one behind the other in a row). For the sake of illustration, FIG. 2 shows a longitudinal sectional view of the bearing finger 15. As already mentioned, the suction openings 18 are especially formed in rows along the bearing fingers 15. The suction opening 18 is connected via a suction duct 19 to a negative pressure generating device 20 which is arranged, for example, in or at the housing of the electromechanical direct drive 17. The suction duct 19 is preferably formed as a suction channel 21 integrated into the material, at least in the area of the respective transport arms 7 to 10 and the carrying fingers 15, 16. In particular, the suction channel 21 is connected to several of these suction openings 18 (as shown in FIG. 2 ), so that the suction channel serves as a collecting channel. The suction opening 18 meets at the top side 22 of the carrying fingers 15, 16 on which the substrate to be printed can also be placed.

如果將基材放置在頂側22上並且控制負壓生成裝置20,則這在抽吸開口18處產生負壓,藉由該負壓抽吸基材抵靠頂側22並且由此鎖定在承載指形件15、16處或相應的運輸臂7至10處。抽吸開口18由此與負壓生成裝置20形成用於基材的固持裝置。If the substrate is placed on the top side 22 and the negative pressure generating device 20 is controlled, this creates a negative pressure at the suction opening 18, by which the substrate is sucked against the top side 22 and thus locked in the load Fingers 15, 16 or corresponding transport arms 7 to 10. The suction opening 18 thus forms a holding device for the substrate with the negative pressure generating device 20.

印刷設備另外具有用於基材的送入裝置23和送出裝置24。送入裝置23和送出裝置24因此基本上相同地形成。兩者分別具有兩個傳送帶25,這些傳送帶相對彼此平行定向並且相對彼此間隔開地佈置。傳送帶25在此在高度方面是可調的或是豎直地可調的,如藉由相應的雙箭頭26所示的。傳送帶25在此以如下距離相對彼此佈置,使得它們根據當前的實施例可以佈置在裝置11的承載指形件15、16之間。The printing apparatus additionally has a feed-in device 23 and a feed-out device 24 for the substrate. The feed-in device 23 and the feed-out device 24 are therefore formed substantially the same. Both have two conveyor belts 25 which are oriented parallel to each other and are arranged spaced apart from each other. The conveyor belt 25 is adjustable in height here or vertically, as indicated by the corresponding double arrow 26. The conveyor belts 25 are arranged relative to each other at such a distance that they can be arranged between the bearing fingers 15, 16 of the device 11 according to the current embodiment.

為了送入基材,首先將基材定位在送入裝置23的傳送帶25上。借助於傳送帶25,在裝置11至14之一(在當前情況下為裝置11)的承載指形件15、16的方向上送入基材,其中傳送帶25為此佈置在如下高度,在該高度上基材佈置在承載指形件15、16之上。藉由根據箭頭26使傳送帶25下降穿過承載指形件15、16之間,將基材放置在承載指形件15、16上並且在那裡借助於如先前所述的固持裝置進行鎖定,然後根據箭頭27在工作方向上旋轉轉盤6。In order to feed the substrate, the substrate is first positioned on the conveyor belt 25 of the feeding device 23. By means of the conveyor belt 25, the substrate is fed in the direction of the carrying fingers 15, 16 of one of the devices 11 to 14 (in the present case, the device 11 ), the conveyor belt 25 being arranged for this purpose at a height at which The upper substrate is arranged above the carrying fingers 15,16. By lowering the conveyor belt 25 through the bearing fingers 15, 16 according to the arrow 26, the substrate is placed on the bearing fingers 15, 16 and locked there by means of the holding device as previously described, then According to the arrow 27, the turntable 6 is rotated in the working direction.

藉由在工作方向上旋轉轉盤6,在處理裝置2的方向上輸送放置在裝置11的承載指形件15、16上的基材。為此,在當前情況下將轉盤6旋轉90°。其結果係,現在裝置14與送入裝置23相關聯並且裝置11與印刷裝置相關聯。By rotating the turntable 6 in the working direction, the substrate placed on the carrying fingers 15, 16 of the device 11 is transported in the direction of the processing device 2. For this purpose, in the present case, the turntable 6 is rotated by 90°. As a result, the device 14 is now associated with the feeding device 23 and the device 11 is associated with the printing device.

為了在印刷設備中印刷基材,現在將印刷槽根據箭頭5豎直地或向上移動。在此,處理槽具有挖空部28,其形狀對應於承載指形件15、16,使得承載指形件15、16分別在挖空部28之一中可以齊平地佈置。藉由印刷槽的向上移動,承載指形件15、16移動到挖空部28中,從而藉由印刷槽和承載指形件15、16構成幾乎連續的支承面,現在待處理的基材支承在該支承面上。由此基材可靠地支撐在處理槽3或印刷槽上,並且處理過程可以借助於印刷頭以常規方式和方法進行。在完成處理過程之後將印刷槽降低,使得基材僅支承在現在空置的承載指形件15、16上。較佳的是與處理過程同時藉由送入裝置23將新的基材推到裝置14的承載指形件15、16上。In order to print the substrate in the printing apparatus, the printing tank is now moved vertically or upward according to arrow 5. In this case, the treatment tank has a cutout 28 whose shape corresponds to the bearing fingers 15, 16, so that the bearing fingers 15, 16 can be arranged flush in one of the cutouts 28, respectively. By the upward movement of the printing tank, the carrying fingers 15, 16 move into the hollow 28, so that the printing tank and the carrying fingers 15, 16 constitute an almost continuous support surface, which is now supported by the substrate to be processed On this support surface. As a result, the substrate is reliably supported on the processing tank 3 or the printing tank, and the processing can be carried out in a conventional manner by means of the printing head. After finishing the process, the printing bath is lowered, so that the substrate only bears on the now-free bearing fingers 15, 16. Preferably, the new substrate is pushed onto the supporting fingers 15 and 16 of the device 14 by the feeding device 23 at the same time as the processing.

在下一步驟中將轉盤6再次旋轉90°,使得裝置11現在與送出裝置24相關聯,並且新放置到裝置14上的基材與印刷設備相關聯。In the next step, the turntable 6 is rotated again by 90°, so that the device 11 is now associated with the feed-out device 24, and the substrate newly placed on the device 14 is associated with the printing apparatus.

如已經提及的,送出裝置24與送入裝置23對應地形成,使得其傳送帶25還可以在承載指形件15、16之間豎直穿過。因此,藉由送出裝置24或送出裝置24的傳送帶25的升高,將基材從承載指形件16、16升高並且可以藉由控制傳送帶25與基材分離並且可供用於進一步處理。同時,在印刷裝置處較佳的是進行處理過程並且在送入裝置23處進行另外的基材的送入,這次送入到裝置13。As already mentioned, the feed-out device 24 is formed corresponding to the feed-in device 23 so that its conveyor belt 25 can also pass vertically between the carrying fingers 15, 16. Therefore, by raising the delivery device 24 or the conveyor belt 25 of the delivery device 24, the substrate is raised from the carrying fingers 16, 16 and can be separated from the substrate by controlling the conveyor belt 25 and available for further processing. At the same time, it is preferable to carry out the processing at the printing device and the feeding of the additional substrate at the feeding device 23, this time feeding to the device 13.

然後將轉盤6再次轉動90°,使得裝置11現在空置,裝置14與送出裝置24相關聯,裝置12與送入裝置23相關聯,並且裝置13與處理裝置2相關聯。視需要,與印刷裝置相對地佈置有清潔設備29,該清潔設備從現在空置的裝置11去除某些情況下殘留的印刷殘餘物並且因此準備好用於處理新的基材。The turntable 6 is then turned again by 90°, so that the device 11 is now empty, the device 14 is associated with the sending device 24, the device 12 is associated with the feeding device 23, and the device 13 is associated with the processing device 2. If necessary, a cleaning device 29 is arranged opposite the printing device, which removes the printing residues remaining in some cases from the now empty device 11 and is therefore ready for processing new substrates.

替代於送入裝置23、印刷槽和送出裝置24的高度調節,提出將轉盤6形成為高度可調的,從而藉由單一的高度調節裝置可以進行基材的放置、接納以及承載指形件15、16與處理槽3的表面的齊平佈置。Instead of adjusting the height of the feeding device 23, the printing tank and the sending device 24, it is proposed to form the turntable 6 to be height-adjustable, so that the placement, receiving and carrying of the substrate 15 can be carried out by a single height adjusting device , 16 is flush with the surface of the treatment tank 3.

藉由印刷設備的有利設計實現了:轉盤6具有較小的質量,由此可以將其迅速加速和移動,使得處理設備1實現高基材產量。By the advantageous design of the printing device, it is realized that the turntable 6 has a smaller mass, whereby it can be quickly accelerated and moved, so that the processing device 1 achieves a high substrate yield.

雖然根據當前實施例處理裝置2形成為處理設備,根據另一個實施例該處理裝置可以形成為雷射處理裝置、分離裝置、切割裝置、鑽孔裝置、清潔裝置、檢驗裝置等。Although the processing device 2 is formed as a processing device according to the current embodiment, the processing device may be formed as a laser processing device, a separation device, a cutting device, a drilling device, a cleaning device, an inspection device, etc. according to another embodiment.

1‧‧‧處理設備 2‧‧‧處理裝置 3‧‧‧處理槽 4‧‧‧處理頭 5‧‧‧雙箭頭 6‧‧‧轉盤 7‧‧‧運輸臂 8‧‧‧運輸臂 9‧‧‧運輸臂 10‧‧‧運輸臂 11‧‧‧裝置 12‧‧‧裝置 13‧‧‧裝置 14‧‧‧裝置 15‧‧‧承載指形件 16‧‧‧承載指形件 17‧‧‧機電直接驅動器 18‧‧‧抽吸開口 19‧‧‧抽吸管道 20‧‧‧負壓生成裝置 21‧‧‧抽吸通道 22‧‧‧頂處 23‧‧‧送入裝置 24‧‧‧送出裝置 25‧‧‧傳送帶 26‧‧‧雙箭頭 27‧‧‧箭頭 28‧‧‧挖空部 29‧‧‧清潔設備1‧‧‧Processing equipment 2‧‧‧Processing device 3‧‧‧Treatment tank 4‧‧‧Processing head 5‧‧‧double arrow 6‧‧‧Turntable 7‧‧‧Transport arm 8‧‧‧Transport arm 9‧‧‧Transport arm 10‧‧‧Transport arm 11‧‧‧ Installation 12‧‧‧ Installation 13‧‧‧ Installation 14‧‧‧ Installation 15‧‧‧bearing finger 16‧‧‧Finger bearing 17‧‧‧Electromechanical direct drive 18‧‧‧Suction opening 19‧‧‧Suction pipe 20‧‧‧Negative pressure generating device 21‧‧‧Suction channel 22‧‧‧Top 23‧‧‧Sending device 24‧‧‧Sending device 25‧‧‧Conveyor belt 26‧‧‧double arrow 27‧‧‧arrow 28‧‧‧Knockout Department 29‧‧‧Cleaning equipment

下面應借助附圖詳細解釋本發明。在附圖中: [圖1] 以簡化透視圖示出有利的處理設備,並且 [圖2] 示出來自圖1的處理設備之縱截面圖。The invention will be explained in detail below with the aid of the drawings. In the drawings: [Fig. 1] shows an advantageous processing device in a simplified perspective view, and [Fig. 2] A longitudinal sectional view showing the processing apparatus from Fig. 1.

1‧‧‧處理設備 1‧‧‧Processing equipment

2‧‧‧處理裝置 2‧‧‧Processing device

3‧‧‧處理槽 3‧‧‧Treatment tank

4‧‧‧處理頭 4‧‧‧Processing head

5‧‧‧雙箭頭 5‧‧‧double arrow

6‧‧‧轉盤 6‧‧‧Turntable

7‧‧‧運輸臂 7‧‧‧Transport arm

8‧‧‧運輸臂 8‧‧‧Transport arm

9‧‧‧運輸臂 9‧‧‧Transport arm

10‧‧‧運輸臂 10‧‧‧Transport arm

11‧‧‧裝置 11‧‧‧ Installation

12‧‧‧裝置 12‧‧‧ Installation

13‧‧‧裝置 13‧‧‧ Installation

14‧‧‧裝置 14‧‧‧ Installation

15‧‧‧承載指形件 15‧‧‧bearing finger

16‧‧‧承載指形件 16‧‧‧Finger bearing

17‧‧‧機電直接驅動器 17‧‧‧Electromechanical direct drive

18‧‧‧抽吸開口 18‧‧‧Suction opening

23‧‧‧送入裝置 23‧‧‧Sending device

24‧‧‧送出裝置 24‧‧‧Sending device

25‧‧‧傳送帶 25‧‧‧Conveyor belt

26‧‧‧雙箭頭 26‧‧‧double arrow

27‧‧‧箭頭 27‧‧‧arrow

28‧‧‧挖空部 28‧‧‧Knockout Department

29‧‧‧清潔設備 29‧‧‧Cleaning equipment

Claims (15)

一種處理設備(1),用於處理平坦基材,尤其是電路板、太陽能電池、晶圓等,該處理設備具有:處理裝置(2)、尤其是印刷裝置,該處理裝置具有處理頭(4)、尤其印刷頭以及處理槽(3)、尤其是印刷槽,至少一個基材能夠放置在該處理槽上以便執行處理過程;用於送入該基材之送入裝置(23);用於送出該基材之送出裝置(24);以及用於將該基材從該送入裝置(23)運輸到該處理裝置(2)並從該處理裝置(2)運輸到該送出裝置(24)的轉盤(6),其中該轉盤(6)具有在外側中部的用於接納至少一個基材的至少一個裝置(11-14),其特徵在於,該裝置(11-14)具有至少一個至少基本上徑向突出的承載指形件(15,16),該至少一個基材能夠放置到該承載指形件上,並且與該處理頭永久相對的該處理槽(3)具有用於該至少一個承載指形件(15,16)的挖空部(28),使得該處理槽(3)與被引入到相應的挖空部(28)中的承載指形件(15,16)一起構成用於該至少一個基材的至少基本上連續的支承面。A processing device (1) for processing flat substrates, especially circuit boards, solar cells, wafers, etc. The processing device has: a processing device (2), especially a printing device, the processing device has a processing head (4 ), especially the printing head and the processing tank (3), especially the printing tank, at least one substrate can be placed on the processing tank in order to perform the processing process; the feeding device (23) for feeding the substrate; A sending-out device (24) for sending out the substrate; and for transporting the substrate from the feeding-in device (23) to the processing device (2) and from the processing device (2) to the sending-out device (24) Turntable (6), wherein the turntable (6) has at least one device (11-14) for receiving at least one substrate in the middle of the outside, characterized in that the device (11-14) has at least one at least substantially On the radially protruding bearing fingers (15, 16), the at least one substrate can be placed on the bearing fingers, and the processing tank (3) permanently opposed to the processing head has The cutouts (28) of the load-bearing fingers (15, 16), so that the treatment tank (3) and the load-bearing fingers (15, 16) introduced into the corresponding cut-outs (28) are used together At least a substantially continuous bearing surface of the at least one substrate. 如申請專利範圍第1項所述之處理設備,其中該承載指形件(15,16)在其面向該基材的頂側處具有至少一個抽吸開口(18),該至少一個抽吸開口與負壓生成裝置(20)相連或能夠相連。The processing device as described in item 1 of the patent application scope, wherein the bearing finger (15, 16) has at least one suction opening (18) at its top side facing the substrate, the at least one suction opening It may be connected to the negative pressure generating device (20). 如申請專利範圍第1或2項所述之處理設備,其中該轉盤(6)具有至少一個抽吸管道(19),該抽吸管道將該抽吸開口(18)與該負壓生成裝置(20)相連。The processing device as described in item 1 or 2 of the patent application scope, wherein the turntable (6) has at least one suction duct (19), which connects the suction opening (18) and the negative pressure generating device ( 20) Connected. 如申請專利範圍第3項所述之處理設備,其中該抽吸管道(19)形成為延伸穿過該轉盤(6)和該承載指形件(15,16)的抽吸通道(21)。The processing device as described in item 3 of the patent application scope, wherein the suction duct (19) is formed as a suction channel (21) extending through the turntable (6) and the bearing fingers (15, 16). 如申請專利範圍第1至4項中任一項所述之處理設備,其中每個承載指形件(15,16)具有多個抽吸開口(18)。The processing device according to any one of items 1 to 4 of the patent application range, wherein each carrying finger (15, 16) has a plurality of suction openings (18). 如申請專利範圍第1至5項中任一項所述之處理設備,其中相應的裝置(11-14)具有至少兩個彼此間隔開地佈置的承載指形件(15,16)。The processing device according to any one of items 1 to 5 of the patent application range, wherein the corresponding device (11-14) has at least two bearing fingers (15, 16) arranged at a distance from each other. 如申請專利範圍第6項所述之處理設備,其中相應的裝置(11-14)的這些承載指形件(15,16)相對彼此平行地定向。A processing device as described in item 6 of the scope of the patent application, wherein the bearing fingers (15, 16) of the corresponding devices (11-14) are oriented parallel to each other. 如申請專利範圍第1至7項中任一項所述之處理設備,其中該送入裝置(23)和/或該送出裝置(24)分別具有至少一個傳送帶(25),該傳送帶能夠定位在這些裝置(11-14)之一的這些承載指形件(15,16)之間。The processing device according to any one of the items 1 to 7 of the patent application scope, wherein the feeding device (23) and/or the sending device (24) each have at least one conveyor belt (25), which can be positioned at Between the load-bearing fingers (15, 16) of one of these devices (11-14). 如申請專利範圍第1至8項中任一項所述之處理設備,其中該送入裝置(23)和/或該送出裝置(24)具有至少兩個相對彼此平行且間隔開地佈置的傳送帶(25),這些傳送帶能夠佈置在相應的裝置(10-14)的這些承載指形件(15,16)之間或者能夠佈置在至少一個承載指形件(15,16)的兩側。The processing device according to any one of the items 1 to 8 of the patent application scope, wherein the feed-in device (23) and/or the feed-out device (24) have at least two conveyor belts arranged parallel to and spaced apart from each other (25) The conveyor belts can be arranged between the bearing fingers (15, 16) of the corresponding device (10-14) or can be arranged on both sides of at least one bearing finger (15, 16). 如申請專利範圍第8或9項之一所述之處理設備,其中相應的傳送帶(25)和/或相應的裝置(10-14)在高度方面是可調的,以便放置或接納這些基材。The processing equipment as described in one of the items 8 or 9 of the patent application, wherein the corresponding conveyor belt (25) and/or the corresponding device (10-14) are adjustable in height in order to place or receive these substrates . 如申請專利範圍第1至10項中任一項所述之處理設備,其中該轉盤(6)具有多個尤其在周邊上均勻分佈地佈置的裝置(11-14)。The processing device according to any one of the items 1 to 10 of the patent application range, wherein the turntable (6) has a plurality of devices (11-14) evenly distributed on the periphery. 如申請專利範圍第1至11項中任一項所述之處理設備,其中該處理槽(3)在高度方面是可調的,以便將該承載指形件或這些承載指形件(15,16)豎直引入到相應的挖空部(28)中。The processing device according to any one of the items 1 to 11 of the patent application range, wherein the processing tank (3) is adjustable in height in order to facilitate the load-bearing fingers or the load-bearing fingers (15, 16) Lead vertically into the corresponding hollow (28). 如申請專利範圍第1至12項中任一項所述之處理設備,其中將用於使該轉盤(6)圍繞豎直軸線旋轉的機電直接驅動器(17)與該轉盤(6)相關聯。The processing device as described in any one of claims 1 to 12, wherein an electromechanical direct drive (17) for rotating the turntable (6) about a vertical axis is associated with the turntable (6). 如申請專利範圍第1至13項中任一項所述之處理設備,其中在該轉盤(6)的旋轉方向上看,該處理裝置(2)佈置在該送入裝置(23)與該送出裝置(24)之間。The processing device as described in any one of the items 1 to 13 of the patent application range, wherein the processing device (2) is arranged between the feeding device (23) and the sending device as viewed in the rotation direction of the turntable (6) Between devices (24). 如申請專利範圍第1至14項中任一項所述之處理設備,其中在該轉盤(6)的旋轉方向上看,在該送出裝置(24)與該送入裝置(23)之間尤其與該處理裝置(2)相對地佈置有用於清潔相應的裝置(11-14)的清潔設備(29)。The processing apparatus as described in any one of the items 1 to 14 of the patent application range, wherein, as viewed in the direction of rotation of the turntable (6), in particular between the feed-out device (24) and the feed-in device (23) A cleaning device (29) for cleaning the corresponding device (11-14) is arranged opposite the processing device (2).
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US5944940A (en) * 1996-07-09 1999-08-31 Gamma Precision Technology, Inc. Wafer transfer system and method of using the same
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ITUD20080141A1 (en) * 2008-06-19 2009-12-20 Baccini S P A PRECISION TRANSPORT SYSTEM FOR SCREEN PRINTING
US20120244702A1 (en) 2011-03-22 2012-09-27 Applied Materials Italia S.R.L. Method for printing a substrate
ITUD20110135A1 (en) 2011-08-25 2013-02-26 Applied Materials Italia Srl METHOD AND CONTROL SYSTEM FOR THE PRINTING OF A MULTILAYER SCHEME
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