TW202006861A - Processing device for processing substrates - Google Patents
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- TW202006861A TW202006861A TW108116054A TW108116054A TW202006861A TW 202006861 A TW202006861 A TW 202006861A TW 108116054 A TW108116054 A TW 108116054A TW 108116054 A TW108116054 A TW 108116054A TW 202006861 A TW202006861 A TW 202006861A
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- 239000000758 substrate Substances 0.000 title claims abstract description 82
- 238000007639 printing Methods 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 8
- 235000012431 wafers Nutrition 0.000 claims abstract description 3
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 abstract 3
- 238000009434 installation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
本發明涉及一種處理設備,尤其印刷設備,用於處理平坦基材,尤其電路板、太陽能電池、晶圓等,該處理設備具有:處理裝置,該處理裝置具有處理頭(尤其印刷頭)和處理槽(尤其印刷槽(Drucknest)),至少一個基材能夠放置在該處理槽上以便執行處理過程;用於送入基材之送入裝置;用於送出基材之送出裝置;以及用於將基材從送入裝置運輸到處理裝置並從處理裝置運輸到送出裝置的轉盤,其中該轉盤具有在外側中部的用於接納至少一個基材的至少一個裝置。The present invention relates to a processing device, especially a printing device, for processing flat substrates, especially circuit boards, solar cells, wafers, etc. The processing device has a processing device having a processing head (especially a printing head) and a processing device Tank (especially a printing tank (Drucknest)), at least one substrate can be placed on the processing tank in order to perform the processing process; the feeding device for feeding the substrate; the feeding device for feeding the substrate; and The substrate is transported from the feeding device to the processing device and from the processing device to the carousel of the feeding device, wherein the carousel has at least one device for receiving at least one substrate in the middle of the outside.
開篇所述類型的處理設備在先前技術中是已知的。為了確保在例如印刷設備中基材的高產量,已知的是設置轉盤,在該轉盤上佈置多個印刷槽作為用於接納基材的同步移動的裝置。藉由圍繞豎直軸線旋轉轉盤,將印刷槽彼此相繼地送入處理裝置,使得在位於相應印刷槽的基材上可以進行處理過程。另外,為了確保將基材可靠地運輸到印刷槽上,已知的是為印刷槽設置運輸裝置,例如在公開文件WO 2009/153160 A1中公開的。其中印刷槽可移動地佈置到轉盤處並且承載運輸裝置,該運輸裝置具有供應輥(傳送帶可以從其中滾動出來)以及接收輥(傳送帶可以滾入其上)。傳送帶在此可以藉由由印刷槽構成的工作面從供應輥被拉動到接收輥。借助於傳送帶,可以簡單地操作基材並且還可以將基材定向。在傳送帶髒污的情況下,可以簡單地將其在接收輥的方向上繼續運輸,使得在工作面上有新的乾淨的傳送帶可供使用。類似的處理設備還從公開文件EP 2 581 951 B1、US 2013/0052334 A1和US 2012/0244702 A1已知。其缺點在於,整個運輸裝置都必須隨轉盤同步移動,由此轉盤的移動速度且因此處理設備的週期頻率受到不利影響,因為最大可實現的產量受到運輸裝置的慣性和質量限制。Processing devices of the type mentioned in the opening paragraph are known in the prior art. In order to ensure a high yield of substrates in, for example, printing equipment, it is known to provide a turntable on which a plurality of printing grooves are arranged as means for receiving the synchronous movement of the substrate. By rotating the turntable around the vertical axis, the printing tanks are successively fed into the processing device, so that the processing process can be performed on the substrates located in the corresponding printing tanks. In addition, in order to ensure that the substrate is reliably transported to the printing tank, it is known to provide a transportation device for the printing tank, for example, disclosed in the publication WO 2009/153160 A1. The printing tank is movably arranged at the turntable and carries a transport device having a supply roller (from which the conveyor belt can roll out) and a receiving roller (from which the conveyor belt can roll on). The conveyor belt can be pulled from the supply roller to the receiving roller by the working surface formed by the printing groove. With the aid of a conveyor belt, the substrate can be easily handled and the substrate can also be oriented. In the case of dirty conveyor belts, it can simply be transported in the direction of the receiving roller, so that a new, clean conveyor belt is available on the working surface. Similar processing devices are also known from the published
因此本發明之基本目的係創造一種改良的處理設備,該處理設備保證了高處理產量。The basic object of the present invention is therefore to create an improved processing device which guarantees a high processing throughput.
本發明的基本目的係藉由具有申請專利範圍第1項特徵的處理設備來實現的。其優點在於,待被轉盤移動的質量有所降低並且由此能夠實現更高的速度和加速度,這保證了處理設備的提高的產量。根據本發明這係藉由如下方式實現的:該裝置具有至少一個至少基本上徑向突出的承載指形件,該至少一個基材能夠放置到該承載指形件上,並且與該處理頭永久相對的該處理槽具有用於該至少一個承載指形件的挖空部,使得該處理槽與被引入到相應的挖空部中的承載指形件一起構成用於該至少一個基材的至少基本上連續的支承面。由此實現了,處理槽無須隨轉盤同步移動,而是處理槽現在永久地與處理頭相對地佈置並且藉由轉盤僅移動承載指形件。基材可以放置在該至少一個承載指形件上,使得基材在轉盤移動時隨承載指形件同步移動。在此,藉由與該裝置相關聯的視需要的固持裝置,基材可以鎖定在承載指形件上,以便即使在轉盤加速時也可靠地被固持在承載指形件上。由於可以將承載指形件如下引入挖空部中,使得承載指形件與處理槽構成至少基本上連續的支承面,在處理過程期間,基材可靠地平放在處理槽上並且確保更可靠且更高效的處理過程。在進行處理過程之後,該裝置隨承載指形件從挖空部中移出並且帶有現在經處理的基材的轉盤在送出裝置的方向上旋轉,使得在那裡可以將經處理、尤其經印刷的基材取走並且送至另外的處理和/或儲存。由於轉盤的較小的質量,確保了處理設備的高工作速度和因此高產量。The basic object of the present invention is achieved by a processing device having the first feature of the patent application. This has the advantage that the mass to be moved by the turntable is reduced and thus higher speeds and accelerations can be achieved, which guarantees increased throughput of the processing device. According to the invention this is achieved by the device having at least one carrying finger that protrudes at least substantially radially, the at least one substrate can be placed on the carrying finger and is permanently connected to the processing head The opposite processing tank has cutouts for the at least one bearing finger, so that the processing tank together with the bearing fingers introduced into the corresponding cutout constitute at least one for the at least one substrate A substantially continuous bearing surface. This achieves that the processing tank does not need to move synchronously with the turntable, but that the processing tank is now permanently arranged opposite the processing head and only the carrying finger is moved by the turntable. The substrate can be placed on the at least one carrying finger, so that the substrate moves synchronously with the carrying finger when the turntable moves. Here, with an optional holding device associated with the device, the substrate can be locked on the carrying finger so that it can be reliably held on the carrying finger even when the turntable is accelerating. Since the load-bearing fingers can be introduced into the cutout as follows, so that the load-bearing fingers and the processing tank form an at least substantially continuous support surface, during the processing process, the substrate is reliably placed on the processing tank and ensures a more reliable and More efficient processing. After carrying out the treatment process, the device is removed from the cutout with the carrying fingers and the turntable with the now treated substrate rotates in the direction of the delivery device, so that the treated, especially printed The substrate is removed and sent to additional processing and/or storage. Due to the lower mass of the turntable, a high working speed of the processing equipment and therefore a high output are ensured.
根據本發明的一個較佳的改良方案提出,該承載指形件在其面向該基材的頂側處具有至少一個抽吸開口,該至少一個抽吸開口與負壓生成裝置相連或能夠相連。抽吸開口與負壓生成裝置一起構成先前所述的固持裝置,借助於該固持裝置可以將放置在承載指形件上的基材可靠地鎖定在承載指形件上。在此利用了負壓或真空,藉由該負壓或真空將基材抽吸到承載指形件的頂側處並由此固持在其上。由此確保了用於將基材鎖定在承載指形件上的簡單且成本低廉的解決方案。According to a preferred improvement of the present invention, it is proposed that the bearing finger has at least one suction opening at its top side facing the substrate, and the at least one suction opening is connected to or can be connected to the negative pressure generating device. Together with the negative pressure generating device, the suction opening constitutes the holding device previously described, by means of which the substrate placed on the carrying finger can be reliably locked on the carrying finger. Here, a negative pressure or vacuum is used, by which the base material is sucked to the top side of the carrying finger and is thereby held thereon. This ensures a simple and cost-effective solution for locking the base material on the carrying finger.
根據一個較佳的改良方案,該轉盤具有至少一個抽吸管道,該抽吸管道將該抽吸開口與該負壓生成裝置相連。由此確保由負壓生成裝置提供的負壓作用在抽吸開口處並且因此將位於其上的基材可靠地抽吸到承載指形件的頂側上並且固持在其上。According to a preferred improvement, the turntable has at least one suction duct, which connects the suction opening to the negative pressure generating device. This ensures that the negative pressure provided by the negative pressure generating device acts on the suction opening and therefore reliably sucks the substrate located thereon onto the top side of the carrying finger and holds it thereon.
另外較佳的是提出,抽吸開口形成為穿過轉盤向承載指形件處延伸的抽吸通道。由此抽吸通道尤其形成為整合到轉盤和承載指形件中,使得可以省去另外的軟管連接(Verschlauchen)。由此實現了進一步降低轉盤的重量並且由此確保提高的產量。It is also preferably provided that the suction opening is formed as a suction channel extending through the turntable to the bearing finger. In this way, the suction channel is formed in particular to be integrated into the turntable and the bearing fingers, so that additional hose connections can be omitted. In this way, a further reduction in the weight of the turntable is achieved and thus an increased output is ensured.
另外,本發明較佳的是具有至少兩個彼此間隔開佈置的承載指形件。這兩個承載指形件至少基本上徑向地從轉盤突出並且提供用於基材的可靠支承部,該支承部尤其防止基材在承載指形件上圍繞水平軸線的傾翻和轉動。視需要,承載指形件如下形成,使得其相對彼此的間距係可設定的。為此例如在轉盤處的軌道中引導承載指形件中的至少一個,以便增大或減小與同一個裝置的相鄰承載指形件的間距。In addition, the present invention preferably has at least two bearing fingers arranged spaced apart from each other. The two load-bearing fingers protrude at least essentially radially from the turntable and provide a reliable support for the substrate, which in particular prevents the base material from tipping and turning around the horizontal axis on the load-bearing fingers. If necessary, the load-bearing fingers are formed as follows, so that their spacing relative to each other can be set. For this purpose, for example, at least one of the bearing fingers is guided in the track at the turntable in order to increase or decrease the distance from adjacent bearing fingers of the same device.
特別較佳的是,承載指形件相對彼此平行地定向,從而確保承載指形件的可靠且明確的支承面以及簡單地將承載指形件引入處理槽的挖空部中。It is particularly preferred that the load-bearing fingers are oriented parallel to each other, so as to ensure a reliable and clear bearing surface of the load-bearing fingers and to simply introduce the load-bearing fingers into the hollow of the treatment tank.
另外較佳的是提出,送入裝置具有至少一個傳送帶,該傳送帶可以定位在這一個裝置的承載指形件之間。由此確保將基材簡單地送入和送出到承載指形件。It is also preferably provided that the feeding device has at least one conveyor belt, which can be positioned between the bearing fingers of this device. This ensures that the substrate is simply fed into and out of the carrying fingers.
特別較佳的是,送入裝置和/或送出裝置具有至少兩個相對彼此平行且間隔開地佈置的傳送帶,這些傳送帶可以佈置在承載指形件之間或者在該至少一個裝置的至少一個承載指形件的兩側。藉由這兩個相對彼此平行佈置的傳送帶確保了借助於傳送帶將基材可靠地送入和/或送出。依據傳送帶彼此間隔開的距離,以及依據承載指形件彼此間隔開的距離,將傳送帶定位在承載指形件外部或承載指形件之間,以便將基材運輸到承載指形件上或者在進行處理過程之後從其上移走。Particularly preferably, the feed-in device and/or the feed-out device have at least two conveyor belts arranged parallel to and spaced apart from each other, which conveyor belts can be arranged between the bearing fingers or at least one bearing of the at least one device Fingers on both sides. With these two conveyor belts arranged parallel to each other, it is ensured that the substrate is reliably fed in and/or out by means of the conveyor belt. Depending on the distance between the conveyor belts and the distance between the carrier fingers, the conveyor belt is positioned outside or between the carrier fingers in order to transport the substrate onto the carrier fingers or on Remove from it after proceeding.
另外較佳的是提出,相應的傳送帶和/或相應的裝置在高度方面是可調的,以便放置或接納這些基材。藉由高度調節,確保了簡單地放置基材,該基材例如已經借助於傳送帶移動到了承載指形件的高度上。特別較佳的是,相應的傳送帶在高度方面是可調的,使得單獨的承載指形件或者整個轉盤可以省去高度調節器,該高度調節器在其他情況下可能導致轉盤的提高的質量。In addition, it is preferably provided that the corresponding conveyor belt and/or the corresponding device are adjustable in height in order to place or receive these substrates. The height adjustment ensures a simple placement of the substrate, which has been moved to the height of the carrying finger by means of a conveyor belt, for example. It is particularly preferred that the corresponding conveyor belt is adjustable in height, so that the individual load-bearing fingers or the entire turntable can omit the height adjuster, which in other cases may lead to an increased quality of the turntable.
此外,轉盤較佳的是具有多個尤其在周邊上均勻分佈地佈置的裝置,這些裝置分佈用於接納一個或多個基材。由此例如可以在一個裝置處送入基材、在另一個裝置處送出經印刷的基材並且在又一個裝置處同時進行處理過程。In addition, the turntable preferably has a plurality of devices, which are evenly distributed on the periphery, which are distributed for receiving one or more substrates. Thus, for example, the substrate can be fed in at one device, the printed substrate can be sent out at another device, and the processing can be performed simultaneously at another device.
較佳的是該處理槽在高度方面是可調的,以便將該承載指形件或這些承載指形件引入到相應的挖空部中。這個實施方式還涉及以下情況,即,轉盤在一個高度上是不可調的。由此確保藉由處理槽的高度調節來將承載指形件引入挖空部中。It is preferable that the treatment tank is adjustable in height in order to introduce the load-bearing fingers or the load-bearing fingers into the corresponding hollows. This embodiment also relates to the case where the turntable is not adjustable in one height. This ensures that the carrying fingers are introduced into the cutout by adjusting the height of the treatment tank.
另外,較佳的是將機電直接驅動器與轉盤相關聯,以便圍繞豎直軸線進行旋轉。由此確保以高調節速度和準確的轉盤定向或準確的旋轉角度設定來可靠地操作處理設備。In addition, it is preferable to associate the electromechanical direct drive with the turntable to rotate about a vertical axis. This ensures that the processing device is reliably operated with high adjustment speeds and accurate turntable orientation or accurate rotation angle settings.
另外較佳的是提出,在該轉盤的旋轉方向上看,該處理裝置佈置在該送入裝置與該送出裝置之間。由此產生了自然的處理順序的優點。It is also preferable to provide that the processing device is arranged between the feed-in device and the feed-out device when viewed in the direction of rotation of the turntable. This has the advantage of a natural processing sequence.
另外較佳的是提出,在該轉盤的旋轉方向上看,在該送出裝置與該送入裝置之間尤其與該處理裝置相對地佈置有用於清潔相應的裝置的清潔設備。由此實現,在已經將經印刷的基材從裝置中移走並且已經將轉盤繼續旋轉之後,藉由清潔裝置將現在空閒的裝置清掃或清潔或可以將其清掃或清潔(如果存在這種需要的話)。由此在進一步的操作中將待印刷的基材運輸到經清潔的裝置上,由此可靠地防止了基材在該裝置和/或處理槽上的錯誤定位以及基材的髒污。In addition, it is preferably provided that, viewed in the direction of rotation of the turntable, a cleaning device for cleaning the corresponding device is arranged between the feed-out device and the feed-in device, especially opposite the processing device. In this way, after the printed substrate has been removed from the device and the carousel has continued to rotate, the currently free device can be cleaned or cleaned by the cleaning device or can be cleaned or cleaned (if such a need exists) if). As a result, the substrate to be printed is transported to the cleaned device in further operations, thereby erroneous positioning of the substrate on the device and/or the processing tank and contamination of the substrate are reliably prevented.
附圖以簡化透視圖示出了有利的處理設備1(在當前情況下為印刷設備),該處理設備具有處理裝置2(在當前情況下為印刷裝置、尤其是網版印刷裝置),該處理裝置具有處理槽3(尤其是印刷槽)和處理頭4(尤其印刷頭)。印刷頭例如形成為網版印刷頭。印刷槽佈置為與印刷頭永久相對,並且如藉由雙箭頭5所標示的,在高度方面是可調的。在印刷槽上可以放置基材以藉由印刷頭進行印刷。尤其是印刷頭也是在高度方面可調的,以便移動印刷頭靠近位於印刷槽上的基材,以便對該基材進行印刷。The drawing shows in a simplified perspective view an advantageous processing device 1 (in the present case, a printing device) with a processing device 2 (in the present case, a printing device, in particular a screen printing device), which processes The device has a processing tank 3 (especially a printing tank) and a processing head 4 (especially a printing head). The printing head is formed as a screen printing head, for example. The printing slot is arranged to be permanently opposite to the printing head and, as indicated by the
印刷設備還具有轉盤6,該轉盤承載有多個(在當前情況下為四個)在轉盤6的周邊上均勻分佈地佈置的運輸臂7、8、9和10。運輸臂7至10在此徑向地從轉盤6向外延伸並且在其自由末端處分別具有裝置11、12、13、14,這些裝置用於接納和運輸基材。裝置11至14形成為相同的:裝置11至14中的每一個具有兩個相對彼此平行定向且相對彼此間隔開地佈置的承載指形件15和16,這些承載指形件徑向地從相應的運輸臂7至10並因此徑向地從轉盤6向外延伸。由於承載指形件15、16相對彼此平行定向,它們並不是正好沿著一條延伸到轉盤6的中心的徑向線,而是平行於一條徑向線延伸。承載指形件15、16在此尤其與相應的運輸臂7至10一體式形成,其中相應的運輸臂7至10尤其是還與轉盤6一體式形成。此外,機電直接驅動器17與轉盤6相關聯,該直接驅動器具有可旋轉地支承的轉子軸,該轉子軸直接與轉盤6防扭轉地相連。The printing apparatus also has a
承載指形件15、16分別具有多個(在當前情況下在一行中彼此前後佈置的)抽吸開口18。為了進行展示,圖2示出了承載指形件15的縱截面圖。如已經提及的,抽吸開口18尤其沿著承載指形件15以行的形式形成。抽吸開口18通過抽吸管道19與負壓生成裝置20相連,該負壓生成裝置例如佈置在機電直接驅動器17的殼體中或殼體處。抽吸管道19至少在相應的運輸臂7至10以及承載指形件15、16的區域中較佳的是形成為整合到材料中的抽吸通道21。在此抽吸通道21尤其(如圖2所示)與這些抽吸開口18中的多個相連,使得該抽吸通道用作彙集通道。抽吸開口18在承載指形件15、16的頂側22處匯合,在該表面上還可以放置待印刷的基材。The bearing
如果將基材放置在頂側22上並且控制負壓生成裝置20,則這在抽吸開口18處產生負壓,藉由該負壓抽吸基材抵靠頂側22並且由此鎖定在承載指形件15、16處或相應的運輸臂7至10處。抽吸開口18由此與負壓生成裝置20形成用於基材的固持裝置。If the substrate is placed on the
印刷設備另外具有用於基材的送入裝置23和送出裝置24。送入裝置23和送出裝置24因此基本上相同地形成。兩者分別具有兩個傳送帶25,這些傳送帶相對彼此平行定向並且相對彼此間隔開地佈置。傳送帶25在此在高度方面是可調的或是豎直地可調的,如藉由相應的雙箭頭26所示的。傳送帶25在此以如下距離相對彼此佈置,使得它們根據當前的實施例可以佈置在裝置11的承載指形件15、16之間。The printing apparatus additionally has a feed-in
為了送入基材,首先將基材定位在送入裝置23的傳送帶25上。借助於傳送帶25,在裝置11至14之一(在當前情況下為裝置11)的承載指形件15、16的方向上送入基材,其中傳送帶25為此佈置在如下高度,在該高度上基材佈置在承載指形件15、16之上。藉由根據箭頭26使傳送帶25下降穿過承載指形件15、16之間,將基材放置在承載指形件15、16上並且在那裡借助於如先前所述的固持裝置進行鎖定,然後根據箭頭27在工作方向上旋轉轉盤6。In order to feed the substrate, the substrate is first positioned on the
藉由在工作方向上旋轉轉盤6,在處理裝置2的方向上輸送放置在裝置11的承載指形件15、16上的基材。為此,在當前情況下將轉盤6旋轉90°。其結果係,現在裝置14與送入裝置23相關聯並且裝置11與印刷裝置相關聯。By rotating the
為了在印刷設備中印刷基材,現在將印刷槽根據箭頭5豎直地或向上移動。在此,處理槽具有挖空部28,其形狀對應於承載指形件15、16,使得承載指形件15、16分別在挖空部28之一中可以齊平地佈置。藉由印刷槽的向上移動,承載指形件15、16移動到挖空部28中,從而藉由印刷槽和承載指形件15、16構成幾乎連續的支承面,現在待處理的基材支承在該支承面上。由此基材可靠地支撐在處理槽3或印刷槽上,並且處理過程可以借助於印刷頭以常規方式和方法進行。在完成處理過程之後將印刷槽降低,使得基材僅支承在現在空置的承載指形件15、16上。較佳的是與處理過程同時藉由送入裝置23將新的基材推到裝置14的承載指形件15、16上。In order to print the substrate in the printing apparatus, the printing tank is now moved vertically or upward according to
在下一步驟中將轉盤6再次旋轉90°,使得裝置11現在與送出裝置24相關聯,並且新放置到裝置14上的基材與印刷設備相關聯。In the next step, the
如已經提及的,送出裝置24與送入裝置23對應地形成,使得其傳送帶25還可以在承載指形件15、16之間豎直穿過。因此,藉由送出裝置24或送出裝置24的傳送帶25的升高,將基材從承載指形件16、16升高並且可以藉由控制傳送帶25與基材分離並且可供用於進一步處理。同時,在印刷裝置處較佳的是進行處理過程並且在送入裝置23處進行另外的基材的送入,這次送入到裝置13。As already mentioned, the feed-out
然後將轉盤6再次轉動90°,使得裝置11現在空置,裝置14與送出裝置24相關聯,裝置12與送入裝置23相關聯,並且裝置13與處理裝置2相關聯。視需要,與印刷裝置相對地佈置有清潔設備29,該清潔設備從現在空置的裝置11去除某些情況下殘留的印刷殘餘物並且因此準備好用於處理新的基材。The
替代於送入裝置23、印刷槽和送出裝置24的高度調節,提出將轉盤6形成為高度可調的,從而藉由單一的高度調節裝置可以進行基材的放置、接納以及承載指形件15、16與處理槽3的表面的齊平佈置。Instead of adjusting the height of the
藉由印刷設備的有利設計實現了:轉盤6具有較小的質量,由此可以將其迅速加速和移動,使得處理設備1實現高基材產量。By the advantageous design of the printing device, it is realized that the
雖然根據當前實施例處理裝置2形成為處理設備,根據另一個實施例該處理裝置可以形成為雷射處理裝置、分離裝置、切割裝置、鑽孔裝置、清潔裝置、檢驗裝置等。Although the
1‧‧‧處理設備
2‧‧‧處理裝置
3‧‧‧處理槽
4‧‧‧處理頭
5‧‧‧雙箭頭
6‧‧‧轉盤
7‧‧‧運輸臂
8‧‧‧運輸臂
9‧‧‧運輸臂
10‧‧‧運輸臂
11‧‧‧裝置
12‧‧‧裝置
13‧‧‧裝置
14‧‧‧裝置
15‧‧‧承載指形件
16‧‧‧承載指形件
17‧‧‧機電直接驅動器
18‧‧‧抽吸開口
19‧‧‧抽吸管道
20‧‧‧負壓生成裝置
21‧‧‧抽吸通道
22‧‧‧頂處
23‧‧‧送入裝置
24‧‧‧送出裝置
25‧‧‧傳送帶
26‧‧‧雙箭頭
27‧‧‧箭頭
28‧‧‧挖空部
29‧‧‧清潔設備1‧‧‧
下面應借助附圖詳細解釋本發明。在附圖中: [圖1] 以簡化透視圖示出有利的處理設備,並且 [圖2] 示出來自圖1的處理設備之縱截面圖。The invention will be explained in detail below with the aid of the drawings. In the drawings: [Fig. 1] shows an advantageous processing device in a simplified perspective view, and [Fig. 2] A longitudinal sectional view showing the processing apparatus from Fig. 1.
1‧‧‧處理設備 1‧‧‧Processing equipment
2‧‧‧處理裝置 2‧‧‧Processing device
3‧‧‧處理槽 3‧‧‧Treatment tank
4‧‧‧處理頭 4‧‧‧Processing head
5‧‧‧雙箭頭 5‧‧‧double arrow
6‧‧‧轉盤 6‧‧‧Turntable
7‧‧‧運輸臂 7‧‧‧Transport arm
8‧‧‧運輸臂 8‧‧‧Transport arm
9‧‧‧運輸臂 9‧‧‧Transport arm
10‧‧‧運輸臂 10‧‧‧Transport arm
11‧‧‧裝置 11‧‧‧ Installation
12‧‧‧裝置 12‧‧‧ Installation
13‧‧‧裝置 13‧‧‧ Installation
14‧‧‧裝置 14‧‧‧ Installation
15‧‧‧承載指形件 15‧‧‧bearing finger
16‧‧‧承載指形件 16‧‧‧Finger bearing
17‧‧‧機電直接驅動器 17‧‧‧Electromechanical direct drive
18‧‧‧抽吸開口 18‧‧‧Suction opening
23‧‧‧送入裝置 23‧‧‧Sending device
24‧‧‧送出裝置 24‧‧‧Sending device
25‧‧‧傳送帶 25‧‧‧Conveyor belt
26‧‧‧雙箭頭 26‧‧‧double arrow
27‧‧‧箭頭 27‧‧‧arrow
28‧‧‧挖空部 28‧‧‧Knockout Department
29‧‧‧清潔設備 29‧‧‧Cleaning equipment
Claims (15)
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DE102018207336.8A DE102018207336B4 (en) | 2018-05-09 | 2018-05-09 | Processing device for processing substrates |
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TW202006861A true TW202006861A (en) | 2020-02-01 |
TWI793320B TWI793320B (en) | 2023-02-21 |
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CN (1) | CN112088437A (en) |
DE (1) | DE102018207336B4 (en) |
TW (1) | TWI793320B (en) |
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US5944940A (en) * | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
FR2899840B1 (en) * | 2006-04-12 | 2008-07-04 | Mach Dubuit Soc Par Actions Si | PRINTING MACHINE WITH SCREEN PRINTING |
ITUD20080141A1 (en) * | 2008-06-19 | 2009-12-20 | Baccini S P A | PRECISION TRANSPORT SYSTEM FOR SCREEN PRINTING |
US20120244702A1 (en) | 2011-03-22 | 2012-09-27 | Applied Materials Italia S.R.L. | Method for printing a substrate |
ITUD20110135A1 (en) | 2011-08-25 | 2013-02-26 | Applied Materials Italia Srl | METHOD AND CONTROL SYSTEM FOR THE PRINTING OF A MULTILAYER SCHEME |
ITUD20110162A1 (en) * | 2011-10-13 | 2013-04-14 | Applied Materials Italia Srl | METHOD AND APPARATUS FOR THE CREATION OF SOLAR CELLS WITH SELECTIVE EMITTERS |
CN103400783A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Charging device and blanking device for encapsulating equipment and encapsulating equipment comprising same |
DE102016214095A1 (en) * | 2016-07-29 | 2018-02-01 | Asys Automatisierungssysteme Gmbh | Device for gripping and transporting substrates |
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DE102018207336B4 (en) | 2021-06-24 |
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