TW201946712A - Molding system, and, molding method - Google Patents

Abstract

This molding system comprises an irradiation device which irradiates an energy beam, and a supply device which supplies a material, wherein: the energy beam is irradiated onto a first molded surface to melt the material and form a first structured layer; the energy beam is irradiated onto a second molded surface, which is at least a portion of a surface of the first structured layer, to melt the material and form a second structured layer on the first structured layer; and energy transmitted from the energy beam to the first molded surface per a unit area or per a unit of time is different from energy transmitted from the energy beam to the second molded surface per a unit area or per a unit of time.

Description

Shaping system and method

The present invention relates to a technical field of, for example, a forming system and a forming method for forming a shaped object.

Patent Document 1 describes a forming system that melts a powdery material by an energy beam, and then solidifies the molten material to form a shape on a substrate. In such a forming system, after forming a shaped object on a base material, it is a technical problem to appropriately separate the shaped object from the base material (as an example, remove it).
[Prior Art Literature]
[Patent Literature]

[Patent Document 1] US Patent Application Publication No. 2017/014909

According to a first aspect, there is provided a forming system including an irradiating device for irradiating an energy beam and a supply device for supplying a material, and irradiating the first forming surface with the energy beam, thereby melting the supplied material and forming the material. A first structure layer, and irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structure layer, thereby melting the supplied material and depositing the material on the first structure layer A second structure layer is formed thereon, and the energy transferred from the energy beam to the first shaping surface per unit area or unit time, and from the energy beam to the first shaping surface per unit area or unit time. The two shaped surfaces transfer different energies.

According to a second aspect, there is provided a forming system including an irradiating device for irradiating an energy beam, and a supply device for supplying a material, and irradiating the first forming surface with the energy beam, thereby melting the supplied material and forming the material. A first structure layer, and irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structure layer, thereby melting the supplied material and causing the first structure to A second structure layer having a size different from that of the first structure layer in at least one of the directions along the surface of the first structure layer is formed on the layer.

According to a third aspect, there is provided a forming system including an irradiating device for irradiating an energy beam and a supplying device for supplying a material, and irradiating the first forming surface with the energy beam having a first beam characteristic, thereby causing the supplied The material melts to form a first structural layer, and irradiates the second beam forming surface, which is at least a part of the surface of the first structural layer, with the energy beam having a second beam characteristic different from the first beam characteristic. Thereby, the supplied material is melted to form a second structure layer on the first structure layer.

According to a fourth aspect, there is provided a forming system including an irradiating device for radiating an energy beam, and a supplying device for supplying a material, irradiating the energy beam to a first forming surface, and supplying the material in a first supply form to form a first The structure layer irradiates the energy beam onto a second shaping surface that is at least a part of a surface of the first structure layer, and supplies the material in a second supply form different from the first supply form. A second structure layer is formed on the first structure layer.

According to a fifth aspect, there is provided a shaping system including: an irradiation device that irradiates an energy beam on a shaping surface; a supply device that supplies a material; and a moving device that causes at least one of the first shaping surface and an irradiation position of the energy beam to be One moves to change the relative positional relationship between the irradiation position of the energy beam and the shaping surface, irradiates the energy beam to a first shaping surface, and causes the first shaping surface and the structure to be moved in a first moving form. At least one of the irradiation positions of the energy beam is moved to form a first structure layer, and the second shaping surface that is at least a part of a surface of the first structure layer is irradiated with the energy beam, and A second moving form having a different moving form moves at least one of the second forming surface and the irradiation position of the energy beam to form a second structure layer on the first structure layer.

According to a sixth aspect, there is provided a forming system including an irradiating device for irradiating an energy beam and a supply device for supplying a material, and irradiating the first forming surface with the energy beam to melt the supplied material and form A first melting pool, thereby forming a first structural layer, and melting the supplied material by irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structural layer, A second molten pool having a size different from that of the first molten pool in at least one of the directions along the surface of the first structural layer is formed, thereby forming a second structure on the first structural layer. Floor.

According to a seventh aspect, there is provided a forming system including an irradiating device for radiating an energy beam, and a supplying device for supplying a material, the first forming surface is irradiated with the energy beam, and the first supply amount is per unit time or per unit area. The material is supplied to form a first molten pool, thereby forming a first structure layer, and irradiating the second beam forming surface, which is at least a part of the surface of the first structure layer, with the energy beam, and per unit time or per unit time. A unit area is supplied with the material at a second supply amount different from the first supply amount to form a second melting pool on the second forming surface, thereby forming a second structure layer on the first structure layer.

According to an eighth aspect, there is provided a shaping system including an irradiation device for irradiating an energy beam and a supply device for supplying a material, the first shaping surface is irradiated with the energy beam to form a first structure layer, and the first structure layer is provided as the first structure. The second shaping surface of at least a part of the surface of the layer irradiates the energy beam to form a second structure layer on the first structure layer, and makes the first structure layer more resistant to damage than the second structure. The layer has low resistance to destruction.

According to a ninth aspect, there is provided a shaping system including an irradiation device for irradiating an energy beam and a supply device for supplying a material, the first shaping surface is irradiated with the energy beam, and a first material is supplied as the material to form a first The structure layer irradiates the energy beam onto a second shaping surface that is at least a part of a surface of the first structure layer, and supplies a second material as the material to form a second structure on the first structure layer. Layer, and the bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface.
The function and other benefits of the present invention will be made clear by the embodiments for implementation described below.

Hereinafter, embodiments of the forming system and the forming method will be described with reference to the drawings. Hereinafter, a shaping system 1 capable of forming a shape by using an additional process using the shaping material M using a laser build-up welding method (Laser Metal Deposition (LMD)) is used. Embodiments of the processing system and the processing method will be described. Moreover, the laser surfacing method (LMD) can also be referred to as Direct Metal Deposition, Direct Energy Deposition, Laser Cladding, Laser Engineered Net Shaping), Direct Light Fabrication, Laser Consolidation, Shape Deposition Manufacturing, Wire Feed Laser Deposition, Gas Through Wire, Laser Powder Fusion, Laser Metal Forming, Selective Laser Powder Remelting, Laser Direct Casting, Laser Powder Deposition Powder Deposition), Laser Additive Manufacturing, Laser Rapid Forming.

In the following description, the positional relationship of various constituent elements constituting the shaping system 1 will be described using an XYZ orthogonal coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. Furthermore, in the following description, for convenience of explanation, the X-axis direction and the Y-axis direction are set to a horizontal direction (that is, a predetermined direction in a horizontal plane), and the Z-axis direction is set to a vertical direction (that is, positively aligned with the horizontal plane The direction of intersection is essentially the vertical direction or the direction of gravity). In addition, the rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be set to the direction of gravity. Alternatively, the XY plane may be set in the horizontal direction.
(1) Overall configuration of the forming system 1 First, the overall configuration of the forming system 1 according to the present embodiment will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view showing an example of a configuration of a forming system 1 according to the present embodiment.

The shaping system 1 can form a three-dimensional structure (that is, a three-dimensional object or a three-dimensional object having a size in any direction of the three-dimensional direction, in other words, an object having a size in the X direction, the Y direction, and the Z direction) ST. The shaping system 1 can form the three-dimensional structure ST on a workpiece W that serves as a basis for forming the three-dimensional structure ST (for example, at least one of a base material, a material to be processed, and a workpiece). The shaping system 1 can form a three-dimensional structure ST by performing additional processing on the workpiece W. When the workpiece W is a platform 13 described later, the forming system 1 can form a three-dimensional structure ST on the platform 13. In the case where the workpiece W is an existing structure held by the platform 13 (in addition, the existing structure may also be another three-dimensional structure ST already formed by the shaping system 1), the shaping system 1 may form a three-dimensional structure on the existing structure.物 ST. In this case, the shaping system 1 may also form a three-dimensional structure ST integrated with an existing structure. The operation of forming the three-dimensional structure ST that has been integrated with the existing structure is equivalent to the operation of adding a new structure to the existing structure. Alternatively, the shaping system 1 may form a three-dimensional structure ST that can be separated from an existing structure. In addition, FIG. 1 shows an example in which the workpiece W is a conventional structure held by the platform 13. In addition, an example in which the workpiece W is a conventional structure held by the platform 13 will be described below.

As described above, the shaping system 1 can form a shaped object by a laser surfacing method. That is, it can also be said that the forming system 1 is a 3D printer that uses an overlay forming technique to form an object. Moreover, the multilayer forming technology is also called Rapid Prototyping, Rapid Manufacturing, or Additive Manufacturing.

The shaping system 1 processes the shaping material M using the light EL to form a shaped object. As such light EL, for example, at least one of infrared light, visible light, and ultraviolet light may be used, but other types of light may be used. Light EL is laser light. The shaping material M is a material that can be melted by irradiation with light EL having a predetermined intensity or more. As such a shaping material M, for example, at least one of a metallic material and a resinous material can be used. However, as the molding material M, other materials different from metallic materials and resinous materials may be used. The molding material M is a powdery or granular material. That is, the molding material M is a powder or a granular material. However, the molding material M may not be a powder or granular material, and for example, a linear molding material or a gas-shaped molding material may be used. In addition, the shaping system 1 may process the shaping material M using an energy beam such as a charged particle beam to form a shaped object.

In order to process the forming material M, as shown in FIG. 1, the forming system 1 includes a forming head 11, a forming head driving system 12, a platform 13, and a control device 14. Further, the shaping head 11 includes an irradiation system 111 and a material nozzle (that is, at least a part of a supply system that supplies the shaping material M) 112.

The irradiation system 111 is an optical system (for example, a condensing optical system) for emitting light EL from the emitting section 113. Specifically, the irradiation system 111 is optically connected to a light source (not shown) that emits light EL via a light transmission member (not shown) such as an optical fiber. The irradiation system 111 emits light EL propagating from a light source through a light transmitting member. The irradiation system 111 irradiates the light EL from the irradiation system 111 downward (ie, the -Z side). A platform 13 is arranged below the irradiation system 111. When the work W is mounted on the stage 13, the irradiation system 111 can irradiate the light EL to the work W. Specifically, the irradiation system 111 irradiates the light EL to the irradiation area EA of a predetermined shape set on the workpiece W as a region to be irradiated with light EL (typically condensed). Further, under the control of the control device 14, the state of the irradiation system 111 can be switched between a state where the light EL is irradiated to the irradiation area EA and a state where the light EL is not irradiated to the irradiation area EA. In addition, the direction of the light EL emitted from the self-illumination system 111 is not limited to directly below (that is, a direction consistent with the Z axis), and may be a direction inclined only by a predetermined angle with respect to the Z axis, for example. The irradiation area EA may be, for example, a circular area, or may be another shape (for example, a rectangular shape).

The material nozzle 112 has a supply outlet (ie, a supply port) 114 for supplying the shaping material M. The material nozzle 112 supplies (for example, sprays, ejects, or ejects) the shaping material M from the supply outlet 114. The material nozzle 112 is physically connected to a material supply device (not shown) as a supply source of the molding material M. At this time, a powder conveying member such as a tube (not shown) may be interposed between the material supply device and the material nozzle. The material nozzle 112 is supplied with the shaping material M supplied from the material supply device via the powder transfer member. Furthermore, in FIG. 1, the material nozzle 112 is drawn into a tube shape. However, the shape of the material nozzle 112 is not limited to the shape of the tube. The material nozzle 112 supplies the forming material M downward (ie, the -Z side). A platform 13 is arranged below the material nozzle 112. When the workpiece W is mounted on the table 13, the material nozzle 112 supplies the molding material M to the workpiece W. The advancing direction of the forming material M supplied from the material nozzle 112 is a direction inclined only by a predetermined angle (for example, an acute angle) with respect to the Z axis, but may be directly below (that is, coincide with the Z axis). direction). Furthermore, a plurality of material nozzles 112 may be provided.

In this embodiment, the material nozzle 112 is aligned with respect to the irradiation system 111 so that the shaping material M is supplied to the irradiation area EA that irradiates the light EL with the irradiation system 111. That is, the material nozzle 112 is aligned with the irradiation system 111 so that the supply area MA set on the workpiece W as the area where the material nozzle 112 supplies the shaping material M and the irradiation area EA coincides (or at least partially overlaps). Bit. Furthermore, the material nozzle 112 can be aligned so that the molding material M is supplied to the molten pool MP formed on the workpiece W by the light EL emitted from the irradiation system 111. In addition, alignment can also be performed so that the supply region MA where the material nozzle 112 supplies the molding material M and the region of the melting pool MP partially overlap.

The shaping head driving system 12 moves the shaping head 11. The shaping head driving system 12 moves the shaping head 11 along each of the X-axis, Y-axis, and Z-axis. The shaping head drive system 12 may move the shaping head 11 along at least one of the θX direction, the θY direction, and the θZ direction, in addition to each of the X-axis, Y-axis, and Z-axis. The shaping head drive system 12 includes, for example, a motor and the like. When the shaping head driving system 12 moves the shaping head 11, the irradiation area EA on the workpiece W also moves relative to the workpiece W. Therefore, the shaping head driving system 12 can change the positional relationship between the workpiece W and the irradiation area EA by moving the shaping head 11 (in other words, the positional relationship between the stage 13 and the irradiation area EA that maintains the workpiece W). In addition, the forming head drive system 12 can change the positional relationship between the workpiece W and the supply area MA by moving the forming head 11 (in other words, the positional relationship between the stage 13 holding the work W and the supply area MA).

In addition, the shaping head driving system 12 can move the irradiation system 111 and the material nozzle 112 separately. Specifically, for example, the shaping head drive system 12 may also adjust at least one of the position of the injection portion 113, the direction (or posture) of the injection portion 113, the position of the supply outlet 114, and the direction (or posture) of the supply outlet 114. In this case, the irradiation area EA where the irradiation optical system 111 irradiates the light EL and the supply area MA where the material nozzle 112 supplies the shaping material M can be controlled separately.

The platform 13 can hold the workpiece W. The platform 13 can in turn release the held workpiece W. The irradiation system 111 irradiates light EL on at least a part of the period during which the stage 13 holds the workpiece W. Furthermore, the material nozzle 112 supplies the shaping material M in at least a part of the period in which the stage 13 holds the workpiece W. Furthermore, there is a possibility that a part of the shaping material M that has been supplied from the material nozzle 112 is scattered or dropped from the surface of the workpiece W toward the outside of the workpiece W (for example, around the platform 13). Therefore, the forming system 1 may also include a recovery device for recovering the scattered or spilled forming material M around the platform 13.

The control device 14 controls the operation of the shaping system 1. The control device 14 may include, for example, a computing device such as a central processing unit (CPU) or a graphics processing unit (GPU), or a memory device such as a memory. The control device 14 functions as a device that controls the operation of the shaping system 1 by executing a computer program by a computing device. This computer program is a computer program for causing the control device 14 (for example, a computing device) to perform (that is, execute) an operation to be described later that the control device 14 should perform. That is, this computer program is a computer program for causing the control system 14 to function so that the shaping system 1 may perform the operation mentioned later. The computer program executed by the computing device may be recorded in a memory (ie, a recording medium) included in the control device 14, or may be recorded in any storage medium that is already built in the control device 14 or can be externally placed on the control device 14. (For example, hard drives or semiconductor memory). Alternatively, the computing device may download a computer program to be executed from a device external to the control device 14 through a network interface.

The control device 14 may not be provided inside the shaping system 1. For example, the control device 14 may be provided outside the shaping system 1 as a server or the like. In this case, the control device 14 and the shaping system 1 may also be connected through a wired and / or wireless network (or, a data bus and / or a communication line). As a wired network, for example, a string represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and Universal Serial Bus (USB) can be used. A network of bus-based interfaces. As a wired network, a network using an interface of a parallel bus method can also be used. As a wired network, a network using an Ethernet (registered trademark) interface based on at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T can be used. As a wireless network, a network using electric waves can also be used. As an example of a network using radio waves, a network based on IEEE802.1x (for example, at least one of a local area network (LAN) and Bluetooth (registered trademark)) can be cited. As a wireless network, a network using infrared rays can also be used. As a wireless network, a network using optical communication can also be used. In this case, the control device 14 and the shaping system 1 can also be configured so that various kinds of information can be transmitted and received via the network. In addition, the control device 14 can also send information such as instructions and control parameters to the shaping system 1 via a network. The shaping system 1 may also include a receiving device that receives information such as instructions or control parameters from the control device 14 via the network. Alternatively, a first control device that executes a part of the processing performed by the control device 14 may be provided inside the shaping system 1 and on the other hand, a second control that executes another part of the processing performed by the control device 14 may be provided. The device is provided outside the shaping system 1.

Furthermore, as a recording medium for a computer program executed by a recording and computing device, a compact disc-read only memory (CD-ROM), a compact disc-recordable (CD-R), Compact Disc-Rewritable (CD-RW) or floppy disk, Magnetic Optical (MO), Digital Versatile Disc-Read Only Memory (DVD-ROM), digital Function Disc Random Access Memory (Digital Versatile Disc-Random Access Memory (DVD-RAM)), Digital Versatile Disc-Recordable (DVD-R), Digital Versatile (Digital Versatile Disc + Recordable (DVD + R), Digital Versatile Disc-Rewritable (DVD-RW), Digital Versatile Disc + Rewritable (DVD + RW), and Blu-ray (Blu -ray) (registered trademark) At least one of optical discs such as magnetic discs, magnetic media such as magnetic tapes, magneto-optical discs, semiconductor memories such as USB memories, and other arbitrary media that can store programs . The recording medium may include a device capable of recording a computer program (for example, a general-purpose device or a special-purpose device in which the computer program is installed in a state capable of being executed in at least one of software and firmware). Further, each process or function included in the computer program may be implemented by a logical processing block implemented in the control device 14 by executing the computer program by the control device 14 (ie, a computer), or may be included in the control device 14 The specified gate array (Field Programmable Gate Array (FPGA), Application Specific Integrated Circuit (ASIC)) and other hardware can be used to implement the logic processing block and the hardware. The components of the body are partly implemented in the form of a mixed hardware module.

In particular, in the present embodiment, the control device 14 controls the emission form of the light EL emitted from the irradiation system 111. The emission form includes, for example, at least one of the intensity of the light EL and the emission timing of the light EL. When the light EL is pulsed light, the emission form may include at least one of the length of the pulsed light emission time and the ratio of the pulsed light emission time to the extinction time (so-called duty cycle). Furthermore, the control device 14 controls the movement form of the shaping head 11 which is moved by the shaping head drive system 12. The movement form includes, for example, at least one of a movement amount, a movement speed, a movement direction, and a movement sequence. Furthermore, the control device 14 controls the supply form of the shaping material M supplied from the material nozzle 112. The supply form includes, for example, a supply amount (especially a supply amount per unit time). In addition, the control device 14 may simultaneously control the emission form of the light EL emitted from the irradiation system 111 and the supply form of the shaping material M supplied from the material nozzle 112.
(2) Operation of the shaping system 1

Next, the operation of the shaping system 1 will be described. In this embodiment, the shaping system 1 performs a shaping operation for forming the three-dimensional structure ST as described above. In particular, the shaping system 1 performs at least one of a first shaping action and a second shaping action, the first shaping action being a basic shaping action for forming a three-dimensional structure ST on the workpiece W, and the second shaping action is The forming operation for forming the three-dimensional structure ST that is easier to separate (in other words, remove) from the workpiece W than the three-dimensional structure ST formed by the first forming operation. Hereinafter, the first shaping operation and the second shaping operation will be described in order.
(2-1) First forming action (basic forming action)

First, the first shaping operation will be described. As described above, the forming system 1 uses a laser surfacing method to form the three-dimensional structure ST. Therefore, the forming system 1 can also perform the existing forming operation according to the laser surfacing method as the first forming operation, thereby forming the three-dimensional structure ST. An example of the forming operation of the three-dimensional structure ST by the laser surfacing method will be briefly described below.

The shaping system 1 forms a three-dimensional structure ST on the workpiece W based on the three-dimensional model data (for example, computer aided design (CAD) data) of the three-dimensional structure ST to be formed. The three-dimensional model data includes data representing a shape (especially a three-dimensional shape) of the three-dimensional structure ST. As the three-dimensional model data, measurement data of a three-dimensional object measured by a measurement device provided in the shaping system 1 may be used. As the three-dimensional model data, measurement data of a three-dimensional shape measuring machine provided separately from the forming system 1 may be used. Examples of such a three-dimensional shape measuring machine include at least one of a contact-type three-dimensional measuring machine and a non-contact-type three-dimensional measuring machine having a probe that can move with respect to the workpiece W and can contact the workpiece W. Examples of the non-contact three-dimensional measuring machine include a three-dimensional measuring machine of a pattern projection method, a three-dimensional measuring machine of a light cutting method, a three-dimensional measuring machine of a time of flight method, and moire topography. At least one of a three-dimensional measuring machine based on a method, a three-dimensional measuring machine based on a holographic interference method, a three-dimensional measuring machine based on a computed tomography (CT) method, and a three-dimensional measuring machine based on a magnetic resonance imaging (MRI) . As the three-dimensional model data, design data of the three-dimensional structure ST can also be used.

In order to form the three-dimensional structure ST, the shaping system 1 forms, for example, a plurality of layered partial structures (hereinafter, referred to as “structural layers”) SL that are aligned along the Z-axis direction. For example, the forming system sequentially forms a plurality of structural layers SL obtained by cutting a three-dimensional structure ST into a wafer along the Z-axis direction one by one. As a result, a three-dimensional structure ST is formed as a laminated structure in which a plurality of structural layers SL are laminated. Hereinafter, a flow of an operation of forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described.

First, an operation of forming each structural layer SL will be described with reference to FIGS. 2 (a) to 2 (c). Under the control of the control device 14, the shaping system 1 sets an irradiation area EA on a desired area on the shaping surface MS corresponding to the surface of the workpiece W or the surface of the formed structural layer SL, and the irradiation area 111 is set by the irradiation system 111. EA irradiates light EL. The area occupied by the light EL emitted from the irradiation system 111 on the shaping surface MS may be referred to as an irradiation area EA. In addition, the shaping system 1 may not set the irradiation area EA on a desired area on the shaping surface MS. At this time, an area occupied by the light EL emitted from the irradiation system 111 on the shaping surface MS may be referred to as an irradiation area EA. In the present embodiment, the focusing position FP of the light EL (that is, the light condensing position, in other words, the position where the light EL is most concentrated in the Z-axis direction or the forward direction of the light EL) coincides with the shaping surface MS. Furthermore, the focusing position FP of the light EL may be set to a position that has been deviated from the shaping surface MS in the Z-axis direction. As a result, as shown in FIG. 2 (a), a melting pool is formed in a desired region on the molding surface MS by the light EL that has been emitted from the irradiation system 111 (that is, a liquid state that has been melted by the light EL. Of metal or resin, etc.) MP. Further, under the control of the control device 14, the forming system 1 sets a supply area MA on a desired area on the forming surface MS, and supplies the forming material M to the supply area MA from the material nozzle 112. In addition, the forming system 1 may not set the supply area MA in a desired area on the forming surface MS. At this time, a region where the forming material M is supplied from the material nozzle 112 may be referred to as a supply region MA. Here, as described above, since the irradiation area EA and the supply area MA coincide, the supply area MA is set as an area in which the melting pool MP is formed. In other words, the supply area MA coincides with the area where the molten pool MP is formed. Therefore, as shown in FIG. 2 (b), the forming system 1 supplies the forming material M from the material nozzle 112 to the melting pool MP. As a result, the molding material M supplied to the melting pool MP is melted. When the melting pool MP is not irradiated with light EL as the shaping head 11 moves, the shaping material M that has been melted in the melting pool MP is cooled and solidified (that is, solidified). As a result, as shown in FIG. 2 (c), the solidified molding material M is deposited on the molding surface MS. In other words, the shaped object is formed by the accumulation of the solidified shaped material M. The forming process is performed by adding the deposit of the forming material M to the forming surface MS as described above.

While changing the position in the XY plane of the forming head 11 with respect to the forming surface MS, the formation of the molten pool MP including irradiation with light EL, the supply of the forming material M to the molten pool MP, and the supplied A series of shaping processes for melting the shaping material M and solidifying the molten shaping material M. In other words, the forming head 11 is moved along the XY plane with respect to the forming surface MS, and the formation of the molten pool MP, the supply of the forming material M, the melting of the forming material M, and the solidification of the molten forming material M are repeated. A series of shaping processes. When the shaping head 11 moves relative to the shaping surface MS, the irradiation area EA also moves relative to the shaping surface MS. Therefore, it can be said that a series of forming processes are repeated while moving the irradiation area EA along the XY plane with respect to the forming surface MS. At this time, the light EL is selectively irradiated to the irradiation area EA that has been set in the area where the formation should be formed, and the light EL is selectively not irradiated to the irradiation area EA that has been set in the area where the formation should not be formed. . In addition, it can be said that the irradiation area EA is not set in a region where no shaped object should be formed. That is, the shaping system 1 moves the irradiation area EA along the predetermined movement trajectory on the shaping surface MS, and simultaneously shapes the shaping surface with the timing corresponding to the distribution of the area where the shaped object should be formed (that is, the pattern of the structural layer SL). The MS irradiates light EL. In other words, the forming system 1 moves a predetermined area of the illuminated light EL along the predetermined movement trajectory on the forming surface MS, and irradiates the forming surface MS with light when the area is already in the area where the formation object is to be formed. EL. As a result, a structural layer SL is formed on the forming surface MS, which is equivalent to an aggregate of forming objects formed from the solidified forming material M. In the above description, the irradiation area EA is moved relative to the shaping surface MS, but the shaping surface MS may be moved relative to the irradiation area EA.

Under the control of the control device 14, the shaping system 1 repeatedly performs an operation for forming such a structural layer SL according to the three-dimensional model data. 3 (a) to 3 (f), specifically, first, the control device 14 performs slice processing on the three-dimensional model data at the layer pitch to create slice data. In addition, the control device 14 may also modify the slice data at least partially according to the characteristics of the shaping system 1. Under the control of the control device 14, the shaping system 1 performs a process for forming a surface WS corresponding to the workpiece W on the basis of the three-dimensional model data corresponding to the structural layer SL # 1 (that is, the slice data corresponding to the structural layer SL # 1). The operation of forming the first structural layer SL # 1 on the forming surface MS. As a result, as shown in FIGS. 3 (a) and 3 (b), a structural layer SL # 1 is formed on the forming surface MS. Thereafter, the forming system 1 sets the surface (typically, the upper surface) of the structural layer SL # 1 to a new forming surface MS, and then forms a second structural layer SL # 2 on the new forming surface MS. To form the structural layer SL # 2, the control device 14 first controls the shaping head driving system 12 so that the shaping head 11 moves along the Z axis. Specifically, the control device 14 controls the shaping head driving system 12 such that the irradiation area EA and the supply area MA are set on the surface of the structural layer SL # 1 (ie, the new shaping surface MS), so that the shaping head 11 faces + Z. Side to move. Thereby, the focus position FP of the light EL coincides with the new shaping surface MS. Thereafter, under the control of the control device 14, the shaping system 1 forms a structural layer on the structural layer SL # 1 based on the slice data corresponding to the structural layer SL # 2 in the same operation as the operation of forming the structural layer SL # 1. SL # 2. As a result, as shown in FIGS. 3 (c) and 3 (d), a structural layer SL # 2 is formed. Thereafter, the same operation is repeated until all the structural layers SL constituting the three-dimensional structure to be formed on the workpiece W are formed. As a result, as shown in FIG. 3 (e) and FIG. 3 (f), a plurality of structural layers SL are laminated along the Z axis (that is, along the direction from the bottom surface to the upper surface of the molten pool MP). Structure to form a three-dimensional structure ST.
(2-2) The second shaping operation (the shaping operation of the three-dimensional structure ST that is easy to separate from the workpiece W)

Next, a description will be given of a second shaping operation for forming a three-dimensional structure that is easier to separate (in other words, remove) from the workpiece W than the three-dimensional structure ST formed by the first shaping operation. ST shape action. Similar to the first forming operation, the second forming operation is a forming operation for forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL. However, the second forming operation is different from the first forming operation in that it includes an operation for forming a three-dimensional structure ST that is easily separated from the workpiece W. Other features of the second shaping action may be the same as those of the first shaping action. Hereinafter, an operation for forming the three-dimensional structure ST that is easily separated from the workpiece W will be described.

In this embodiment, under the control of the control device 14, the shaping system 1 adopts the following characteristic changing operation as an operation for forming a three-dimensional structure ST that is easy to separate from the workpiece W, and the characteristic changing operation will constitute a three-dimensional structure A characteristic of a part of the plurality of structural layers SL of the object ST is changed to a characteristic different from a characteristic of the other part of the plurality of structural layers SL. Specifically, the forming system 1 adopts the following operation as a characteristic changing operation that uses the lowermost structural layer SL (typically, the first structural layer MS formed on the surface WS equivalent to the surface WS) of the plurality of structural layers SL. The characteristics of the structural layer SL # 1 of the first layer are changed to the structural layer SL other than the structural layer SL of the lowermost structural layer SL (typically other structural layers formed on the structural layer SL of the lowermost layer). SL) different characteristics. However, as will be described in detail later in the modification example, the shaping system 1 may also adopt, for example, an operation for changing the characteristics, which includes a plurality of structural layers SL including the structural layer SL that is the lowermost layer in the lower layer. The characteristics of the plurality of structural layers SL are changed to the other structural layers SL other than the plurality of structural layers SL located in the lower layer (that is, the structural layer SL located in the upper layer compared to the structural layer SL located in the lower layer). ) Different characteristics.

The characteristics of the structure layer SL may also include the size of the structure layer SL. In particular, the characteristics of the structural layer SL may also include the size of the structural layer SL along at least one direction of the forming surface MS (typically at least one direction that intersects the lamination direction of the plurality of structural layers SL). In this case, the size of the structure layer SL may also be referred to as the width of the structure layer SL. In the following description, unless otherwise stated, the size of the structural layer SL refers to the size of the structural layer SL in at least one direction along the forming surface MS. For example, the size of the structural layer SL may be the size of the structural layer SL in an arbitrary direction in the XY plane. In this case, the shaping system 1 performs a first characteristic changing operation as a characteristic changing operation for reducing the size of the lowermost structural layer SL (hereinafter, appropriately referred to as the “structural layer SL_lowest”). The size is changed to a size different from that of the other structural layers SL (hereinafter, appropriately referred to as “structural layer SL_upper”) other than the structural layer SL_lowest. When the sizes of the structural layers SL are compared, the size of each structural layer SL may be the size of the structural layer SL in the same direction. More specifically, the shaping system 1 performs, for example, an operation as a first characteristic changing operation for reducing the size of the structural layer SL_lowest to be smaller than the size of the structural layer SL_upper. As detailed later, when the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, the structure layer SL_lowest is smaller than the case where the size of the structure layer SL_lowest does not become smaller than the size of the structure layer SL_upper. Easily separated from the workpiece W. If the structural layer SL_lowest is separated from the workpiece W, the structural layer SL_upper that has been integrated with the workpiece W via the structural layer SL_lowest is also separated from the workpiece W. In this way, separation of the three-dimensional structure ST from the workpiece W becomes easier than when the three-dimensional structure ST is formed by the first shaping operation.

The characteristics of the structural layer SL may also include the resistance of the structural layer SL to damage (in other words, the difficulty of breaking, such as toughness). In other words, the characteristics of the structural layer SL may also include the brittleness (in other words, brittleness) of the structural layer SL. In this case, the shaping system 1 performs a second characteristic changing operation as a characteristic changing operation, which changes the resistance of the lowermost structural layer SL_lowest to destruction to a structural layer other than the structural layer SL_lowest. SL_upper has different resistance to destruction. More specifically, the shaping system 1 performs, for example, an operation for changing the characteristic resistance of the structural layer SL_lowest to destruction lower than the structural layer SL_upper's resistance to destruction as a second characteristic changing operation. The structure layer SL_upper may be formed in the same manner as the structure layer SL formed by the first shaping operation. In this case, the shaping system 1 may also perform the following actions as the second characteristic changing action, which is to make the structural layer SL_lowest resistant to destruction and to form the structural layer SL (typically by the first shaping action) It is the structure layer SL_lowest). As detailed later, when the structural layer SL_lowest has a low resistance to destruction, and when the structural layer SL_lowest has a low resistance to destruction (that is, the structural layer SL is formed by the first shaping operation). (Typically the case of the structure layer SL_lowest) Compared with the structure layer SL_lowest, it is easy to be destroyed. Therefore, it can be said that the second characteristic changing operation is an operation for making the structural layer SL_lowest more likely to be destroyed than the structural layer SL_upper. If the structural layer SL_lowest is destroyed, the structural layer SL_upper that has been integrated with the workpiece W via the structural layer SL_lowest is separated from the workpiece W. In this way, separation of the three-dimensional structure ST from the workpiece W becomes easy.

The characteristics of the structural layer SL may also include the binding force (in other words, adhesion) of the structural layer SL to the workpiece W. In this case, the shaping system 1 performs a third characteristic changing operation as a characteristic changing operation that changes the binding force of the lowermost structural layer SL_lowest to the workpiece W to a structure other than the structural layer SL_lowest. The binding force of the layer SL_upper to the workpiece W is different. More specifically, the shaping system 1 performs an operation as a third characteristic changing operation for making the bonding force of the structural layer SL_lowest to the workpiece W weaker than the bonding force of the structural layer SL_upper to the workpiece W. The structure layer SL_upper may be formed in the same manner as the structure layer SL formed by the first shaping operation. In this case, the forming system 1 may also perform the following operation as a third characteristic changing operation for making the binding force of the structural layer SL_lowest to the workpiece W and forming the structural layer SL by the first forming operation ( It is typically weaker in the structure layer SL_lowest). As described in detail later, when the binding force of the structural layer SL_lowest to the workpiece W becomes weak, the binding force of the structural layer SL_lowest to the workpiece W does not become weak (that is, the structure is formed by the first shaping operation). Compared to the case of the layer SL (typically the structure layer SL_lowest), the structure layer SL_lowest is easier to separate from the workpiece W. If the structural layer SL_lowest is separated from the workpiece W, the structural layer SL_upper that has been combined with the workpiece W via the structural layer SL_lowest is also separated from the workpiece W. In this way, separation of the three-dimensional structure ST from the workpiece W becomes easier than when the three-dimensional structure ST is formed by the first shaping operation.
Details of the first to third characteristic changing operations will be described below in order.
(2-2-1) First characteristic change operation

First, a first characteristic changing operation for changing the size of the structural layer SL will be described. In order to change the size of the structure layer SL, the shaping system 1 may change the formation conditions when forming the structure layer SL, for example. For example, the forming system 1 may change the formation conditions when forming the structural layer SL_lowest to formation conditions different from the formation conditions when forming the structural layer SL_upper.

The formation conditions of the first characteristic changing operation may include the size of the molten pool MP. In particular, the forming conditions may include the size of the molten pool MP in at least one direction along the forming surface MS. In this case, the size of the melting pool MP may also be referred to as the width of the melting pool MP. In the following description, unless otherwise stated, the size of the melting pool MP refers to the size of the melting pool MP along at least one direction along the forming surface MS. For example, the size of the molten pool MP can be set to an arbitrary direction in the XY plane. In this case, the shaping system 1 may change the size of the melting pool MP for forming the structural layer SL_lowest to a size different from the size of the melting pool MP for forming the structural layer SL_upper. When the sizes of the melting pools MP are compared, the sizes of the melting pools MP may be set to the sizes of the melting pools MP in the same direction. Specifically, in order to make the size of the structural layer SL_lowest smaller than the size of the structural layer SL_upper, the size of the melting pool MP used to form the structural layer SL_lowest may also be smaller than that of the molten pool MP used to form the structural layer SL_upper. small. For example, as shown in FIG. 4 (a), when the structural layer SL_lowest is formed on the forming surface MS, the forming system 1 may also follow at least one direction along the forming surface MS (shown in FIG. 4 (a)). In the example, the molten pool MP having a size in at least one direction along the XY plane (for example, the X-axis direction and / or the Y-axis direction) becomes the first size R1 is formed on the forming surface MS. On the other hand, as shown in FIG. 4 (b), when the structural layer SL_upper is formed on the forming surface MS, the forming system 1 can also change the size along at least one direction along the forming surface MS to be larger than the first dimension R1. The molten pool MP of the large second size R2 is formed on the forming surface MS. In addition, as shown in FIGS. 4 (a) and 4 (b), the molten pool MP formed on the forming surface MS may become circular in a direction along the forming surface MS. In this case, the size of the melting pool MP may also be referred to as the diameter of the melting pool MP. In addition, when the size of the melting pool MP is different in two mutually orthogonal directions along the forming surface MS, for example, when the melting pool MP has an oval shape, the size of the melting pool MP in either direction may be changed. The size of the melting pool MP is set. As an example, the size in the Y direction of the molten pool MP for forming the structural layer SL_lowest and the size in the X direction of the melting pool MP for forming the structural layer SL_upper are not compared, and the structural layer SL_lowest is not compared. The size of the molten pool MP in the Y direction is compared with the size of the molten pool MP in the Y direction to form the structural layer SL_upper.

In order to change the size of the melting pool MP, the shaping system 1 may also control the characteristics of the light EL irradiated by the irradiation system 111. In this case, the shaping system 1 may change the characteristics of the light EL used to form the structural layer SL_lowest to a characteristic different from the characteristics of the light EL used to form the structural layer SL_upper. That is, when the forming system 1 forms the structural layer SL_lowest, the characteristics of the light EL can also be set as the first characteristic for forming the structural layer SL_lowest (that is, for forming the small-sized molten pool MP). On the other hand, when the forming system 1 forms the structural layer SL_upper, the characteristics of the light EL can also be set to the second characteristic (typically, used to form the structural layer SL_upper (that is, used to form a large-scale molten pool MP)). Is the second characteristic is different from the first characteristic). In addition, the second characteristic may also be referred to as a characteristic of the light EL for forming the melting pool MP having a larger size than the small-sized melting pool MP formed by the light EL of the first characteristic.

The characteristics of the light EL in the first characteristic changing operation may include the intensity (or energy per unit area) of the light EL per unit area on the forming surface MS. Furthermore, energy can also be referred to as the amount of energy. In this case, as shown in FIG. 5, when the forming system 1 forms the structural layer SL_lowest, the intensity of the light EL per unit area may be set to the first intensity. On the other hand, as shown in FIG. 5, when the forming system 1 forms the structural layer SL_upper, the intensity of the light EL per unit area may be set to a second intensity greater than the first intensity. As a result, when the structural layer SL_lowest is formed, at least one of the energy transferred from the light EL to the shaping surface MS per unit area and the energy transferred from the light EL to the shaping surface MS per unit time becomes a more appropriate structure. In the layer SL_upper, at least one of the energy transferred from the light EL to the shaping surface MS per unit area and the energy transferred from the light EL to the shaping surface MS per unit time is small. The less the energy transferred from the light EL to the shaping surface MS per unit area or the unit time, the less the shaping material M melted on the shaping surface MS by the irradiation of the light EL. Therefore, the forming material M melted on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the forming material M melted on the forming surface MS when the structural layer SL_upper is formed. The smaller the amount of the molding material M to be melted on the molding surface MS, the smaller the size of the melting pool MP containing the molten molding material M becomes. Therefore, the size of the molten pool MP formed on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the size of the molten pool MP formed on the forming surface MS when the structural layer SL_upper is formed. Moreover, the characteristic of the light EL may be the intensity (or energy per unit area) of the light EL per unit area per unit time on the shaping surface MS.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

The characteristics of the light EL of the first characteristic changing operation may include a defocus amount with respect to the light EL of the shaping surface MS. Furthermore, the "defocus amount of the light EL with respect to the shaping surface MS" described herein may also indicate a direction (typically an orthogonal direction) that intersects the shaping surface MS, such as the Z-axis direction or the advancement of the light EL The amount of deviation of the shaping surface MS from the focusing position FP of the light EL. In this case, when the shaping system 1 forms the structural layer SL_lowest, the defocus amount of the light EL can also be set to the first defocus amount. On the other hand, when the shaping system 1 forms the structural layer SL_upper, the defocus amount of the light EL can be set to a second defocus amount smaller than the first defocus amount. For example, when the forming system 1 (i) forms the structural layer SL_lowest, as shown in FIG. 6 (a), the defocus amount of the light EL becomes larger than zero (that is, the focus position FP of the light EL is set to Position of the self-shaping surface MS in the Z-axis direction), the defocus amount of the light EL is set, and when (ii) the structural layer SL_upper is formed, as shown in FIG. 6 (b), the defocus amount of the light EL becomes In a manner of zero (that is, the focal position FP of the light EL is set to the shaping surface MS), the defocus amount of the light EL is set. Alternatively, for example, when the forming system 1 (i) forms the structure layer SL_lowest, the defocus amount of the light EL becomes larger than that when the structure layer SL_upper is formed (in other words, the focal position FP of the light EL is set to be equal to that of the formation of the light EL). In the case of the structure layer SL_upper, the defocus amount of the light EL is set compared to the position where the self-shaping surface MS has deviated significantly in the Z-axis direction). (Ii) When the structure layer SL_upper is formed, the defocus amount of the light EL is set. Compared with the case where the structure layer SL_lowest is formed (ie, the focusing position FP of the light EL is set to a position that has shifted slightly from the shaping surface MS in the Z axis direction compared with the case where the structure layer SL_lowest is formed), Set the defocus amount of the light EL. In the case where the defocus amount of the light EL is large, as shown in FIG. 6 (c), the intensity distribution of the light EL on the shaping surface MS becomes such that it has an intensity that can melt the shaping material M (specifically, a predetermined intensity). A range in which the range of light EL of the intensity (intensity or more than the threshold value) becomes smaller. Therefore, in the case where the defocus amount of the light EL is large, although the range of the light EL irradiated on the shaping surface MS becomes large, as a whole, only the light EL having a small intensity is irradiated. The energy transmitted from the self-light EL to the forming surface MS becomes smaller. On the other hand, when the defocus amount of the light EL is small, as shown in FIG. 6 (d), the intensity distribution of the light EL on the forming surface MS becomes a range of the light EL having an intensity such that the forming material M is melted. Relatively large distribution. Therefore, in the case where the defocus amount of the light EL is small, although the range of the light EL irradiated on the shaping surface MS becomes small, the light EL having a large intensity is irradiated as a whole. The energy transferred from the light EL to the shaping surface MS becomes larger than that described above. As a result, the energy transferred from the light EL with a large defocus amount per unit area or unit time to the shaping surface MS is greater than that from the light EL with a small defocus amount per unit area or unit time. Less energy. That is, the energy transferred from the light EL to the shaping surface MS per unit area or unit time when the structural layer SL_lowest is formed becomes larger than the energy transferred from the light EL to the shaping surface MS per unit area or unit time when the structural layer SL_upper is formed Less energy. Therefore, the size of the molten pool MP formed on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the size of the molten pool MP formed on the forming surface MS when the structural layer SL_upper is formed.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

The characteristics of the light EL in the first characteristic changing operation may include the irradiation time of the light EL per unit area. In this case, when the forming system 1 forms the structural layer SL_lowest, the irradiation time of the light EL may be set to a short first irradiation time. On the other hand, when the forming system 1 forms the structural layer SL_upper, the irradiation time of the light EL may be set to a second irradiation time longer than the first irradiation time. For example, when the forming system 1 forms the structural layer SL_lowest, as shown in FIG. 7 (a), pulse light that is intermittently switched on and off may be irradiated as light EL. That is, the forming system 1 may irradiate the light EL intermittently or pulsed when the structural layer SL_lowest is formed. On the other hand, when the forming system 1 forms the structural layer SL_upper, as shown in FIG. 7 (b), continuous light that is continuously switched between irradiation and non-irradiation (that is, continuous irradiation) can be used as the light EL. Irradiation. In other words, when the forming system 1 forms the structural layer SL_upper, the light EL can be continuously irradiated. As a result, when the structural layer SL_lowest is formed, compared with the case where the structural layer SL_upper is formed, the time during which the light EL is not irradiated is generated, and accordingly, the irradiation time of the light EL is shortened. Alternatively, for example, when the forming system 1 forms the structural layer SL_lowest, as shown in FIG. 8 (a), pulsed light having a small duty ratio indicating the ratio of the time of the irradiation light EL may be irradiated as the light EL. On the other hand, when the forming system 1 forms the structural layer SL_upper, as shown in FIG. 8 (b), pulsed light having a larger duty ratio than that in the case of FIG. 8 (a) may be irradiated as the light EL. Here, in a case where the light EL is repeatedly irradiated and not irradiated periodically, the duty ratio of the light EL may be set as a ratio of the irradiation time to the period period. As a result, in the case where the structural layer SL_lowest is formed, the duty ratio becomes smaller than in the case where the structural layer SL_upper is formed, and accordingly, the irradiation time of the light EL becomes shorter. The shorter the irradiation time of the light EL per unit area becomes, the smaller the energy transferred from the light EL to the shaping surface MS per unit area or per unit time becomes. That is, in the case where the irradiation time is short, as compared with the case where the irradiation time is long, the energy transferred from the light EL to the shaping surface MS per unit area or unit time is reduced. Therefore, the energy transferred from the light EL to the shaping surface MS per unit area or unit time when the structural layer SL_lowest is formed becomes larger than the energy transferred from the light EL to the shaping surface MS per unit area or per unit time when the structural layer SL_upper is formed. Less energy. Therefore, the size of the molten pool MP formed on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the size of the molten pool MP formed on the forming surface MS when the structural layer SL_upper is formed.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

In order to change the size of the melting pool MP, the forming system 1 may also control the supply form of the forming material M supplied from the material nozzle 112. In this case, the forming system 1 may change the supply form of the forming material M when the structural layer SL_lowest is formed to a supply form different from the supply form when the structural layer SL_upper is formed. That is, when the forming system 1 forms the structural layer SL_lowest, the supply form of the forming material M can also be set to the first supply form for forming the structural layer SL_lowest (that is, for forming the molten pool MP with a small size). On the other hand, when the forming system 1 forms the structural layer SL_upper, the supply form of the forming material M can also be set to be used to form the structural layer SL_upper (that is, to form a smaller size than that used to form the structural layer SL_lowest. The second supply mode (of which the melting pool MP is large) (typically, the second supply mode is different from the first supply mode).

The supply form of the forming material M in the first characteristic changing operation may include at least one of the supply amount of the forming material M per unit time and the supply amount of the forming material M per unit area (that is, the supply rate of the forming material M). ). In this case, as shown in FIG. 9 (a), when the forming system 1 forms the structural layer SL_lowest, the supply amount of the forming material M may be set to the first supply amount. On the other hand, as shown in FIG. 9 (a), when the forming system 1 forms the structural layer SL_upper, the supply amount of the forming material M can also be set smaller than that in FIG. 9 (a) (that is, compared with the first supply). Small amount) of the second supply. When the supply amount of the shaping material M is large, as shown in FIG. 9 (b), the light EL is easily shielded by the shaping material M supplied to the shaping surface MS. The reason is that although the shaping material M is melted by irradiation with light EL, at least a part of the supplied shaping material M is supplied to the shaping surface MS when a larger amount of the shaping material M is supplied to the shaping surface MS. It can be melted without being irradiated with light EL, and can function as a shield for shielding light EL. As a result, the intensity of the light EL until it reaches the shaping surface MS is reduced, so that the energy transmitted from the light EL to the shaping surface MS per unit area or unit time is reduced. That is, in order to reduce the energy transferred from the light EL to the forming surface MS per unit area or unit time, the forming system 1 uses at least a part of the supplied forming material M as a shield for the light EL. On the other hand, when the supply amount of the shaping material M is small, as shown in FIG. 9 (c), the light EL is difficult to be shielded by the shaping material M supplied to the shaping surface MS. As a result, the intensity of the light EL reaching the forming surface MS is larger than that in the case of FIG. 9 (b). Therefore, the energy transferred from the light EL to the forming surface MS per unit area or unit time is the same as that of FIG. 9 (b) Compared to the situation becomes larger. Therefore, in the case where the supply amount of the molding material M is large, the energy transferred from the light EL to the molding surface MS per unit area or unit time becomes smaller than the supply amount of the molding material M per unit area. The area or unit of energy transferred from the light EL to the shaping surface MS is small. That is, the energy transferred from the light EL to the shaping surface MS per unit area or unit time when the structural layer SL_lowest is formed becomes larger than the energy transferred from the light EL to the shaping surface MS per unit area or per unit time when the structural layer SL_upper is formed. Less energy. Therefore, the size of the molten pool MP formed on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the size of the molten pool MP formed on the forming surface MS when the structural layer SL_upper is formed.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

Furthermore, if the supply amount of the molding material M is increased in a state where the molten pool MP is already formed, the possibility that the molten pool MP is cooled by the supplied molding material M becomes high. As a result, the molding material M cooled and solidified increases, and accordingly, the size of the molten pool MP including the molding material M that is not solidified and remains molten is reduced. Therefore, in addition to using at least a part of the supplied shaping material M as a shield for the light EL, it can also be used as a cooling material for cooling the melting pool MP, or it can be used as cooling for cooling the melting pool MP. Materials are used instead as a shield for light EL. In this case, the size of the molten pool MP formed on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the size of the molten pool MP formed on the forming surface MS when the structural layer SL_upper is formed.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

The supply form of the forming material M in the first characteristic changing operation may include a supply timing (or supply timing) of the forming material M. In this case, as shown in FIG. 10 (a), when the forming system 1 forms the structural layer SL_lowest, the forming material M may be supplied to the forming surface MS in advance before the light EL is irradiated. In particular, the shaping system 1 may supply, to the entire surface (or a part) of the shaping surface MS, an amount of the shaping material M to such an extent that at least a portion can function as a shield for shielding the light EL before the light EL is irradiated. As shown in FIG. 10 (b), the shaping system 1 may also irradiate light EL after the shaping material M is supplied to the shaping surface MS. At this time, as shown in FIG. 10 (b), the shaping system 1 may not supply the shaping material M during the period in which the light EL is irradiated. As a result, the molding material M supplied in advance is not caused by the supply from the material nozzle 112 (for example, the newly supplied molding material M and / or the gas ejected from the material nozzle 112 for the new supply of the molding material M) Was blown away. However, the shaping system 1 may supply the shaping material M in at least a part of the period during which the light EL is irradiated. As a result, at least a part of the forming material M supplied to the forming surface MS in advance is melted and integrated with the forming surface MS, thereby forming the structural layer SL_lowest. Here, when the shaping material M is supplied to the shaping surface MS in advance, at least a part of the shaping material M supplied in advance can function as a shield to shield the light EL. Therefore, the energy transferred from the light EL to the shaping surface MS per unit area or unit time becomes smaller than that in the case where there is no shield. Therefore, the size of the melting pool MP becomes smaller than that in the case where no shield is present. On the other hand, as shown in FIG. 10 (c), when the forming system 1 forms the structural layer SL_upper, the forming material M may not be supplied to the forming surface MS in advance before the light EL is irradiated. That is, as shown in FIG. 10 (d), when the forming system 1 forms the structural layer SL_upper, the forming material M may be partially supplied to the irradiation area EA (or the melting pool MP) of the light EL while irradiating the light EL. In the case where the shaping material M is not supplied to the shaping surface MS in advance, the shaping material M is locally supplied, and therefore the possibility that at least a part of the locally supplied shaping material M functions as a shield that shields the light EL may change. small. Therefore, the energy transferred from the light EL to the shaping surface MS per unit area or unit time becomes larger than that in the case where a shield is present. Therefore, the size of the molten pool MP becomes larger compared with the case where a shield exists.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

In order to change the size of the melting pool MP, the shaping system 1 may also control the moving form of the shaping head 11. In this case, the forming system 1 may change the moving form of the forming head 11 when forming the structural layer SL_lowest to a moving form different from the moving form when forming the structural layer SL_upper. That is, when the forming system 1 forms the structural layer SL_lowest, the moving form of the forming head 11 can also be set to the first moving form for forming the structural layer SL_lowest (that is, for forming the molten pool MP with a small size). On the other hand, when the forming system 1 forms the structural layer SL_upper, the moving form of the forming head 11 can also be set to form the structural layer SL_upper (that is, used to form a melt having a size larger than that formed when the first moving form is formed. The second moving form of the molten pool MP having a large size of the pool MP (typically, the second moving form is different from the first moving form).

The moving form of the first characteristic changing operation may also include a moving speed (for example, a moving speed in a direction along the forming surface MS. As an example, the moving speed in an arbitrary direction in the XY plane is typically the X-axis direction and (Or Y-axis movement speed). In this case, as shown in FIG. 11, when the forming system 1 forms the structural layer SL_lowest, the moving speed of the forming head 11 may be set to the first moving speed. On the other hand, as shown in FIG. 11, when the forming system 1 forms the structural layer SL_upper, the moving speed of the forming head 11 can also be set to a second moving speed that is slower than the first moving speed. The faster the moving speed of the shaping head 11 becomes, the faster the moving speed of the irradiation area EA on the shaping surface MS (that is, the relative moving speed of the irradiation area EA with respect to the shaping surface MS) becomes faster. The faster the moving speed of the irradiation area EA on the shaping surface MS becomes, the shorter the irradiation time of light EL per unit area of the shaping surface MS becomes. Therefore, the faster the moving speed of the irradiation area EA on the shaping surface MS becomes, the smaller the energy transferred from the light EL to the shaping surface MS per unit area or unit time becomes. Therefore, under the condition that the moving speed of the shaping head 11 is fast (that is, the moving speed of the irradiation area EA is fast), the energy transferred from the light EL to the shaping surface MS per unit area or unit time becomes larger than that of the shaping head 11. In a situation where the moving speed of d is slower than the moving speed in the situation (ie, the moving speed of the irradiation area EA is slow), less energy is transferred from the light EL to the shaping surface MS per unit area or unit time. That is, the energy transferred from the light EL to the shaping surface MS per unit area or unit time when the structural layer SL_lowest is formed becomes larger than the energy transferred from the light EL to the shaping surface MS per unit area or per unit time when the structural layer SL_upper is formed. Less energy. Therefore, the size of the molten pool MP formed on the forming surface MS when the structural layer SL_lowest is formed becomes smaller than the size of the molten pool MP formed on the forming surface MS when the structural layer SL_upper is formed.

As a result, the size of the structure layer SL_lowest becomes smaller than the size of the structure layer SL_upper, and the structure layer SL_lowest is easily separated from the workpiece W.

In addition, the faster the moving speed of the shaping head 11 is, the smaller the supply amount of the shaping material M per unit time supplied to at least one of the irradiation area EA and the melting pool MP on the shaping surface MS becomes. Here, when the supply amount of the forming material M per unit time is lower than the amount of the forming material M that can be melted per unit time, the size of the structural layer SL becomes smaller than when it is exceeded. As a result, the structural layer SL_lowest is easily separated from the workpiece W. As such, the size of the melting pool MP may not be proportional to the size of the structure ST.

When the platform 13 can be moved as described later, in order to change the size of the melting pool MP, the forming system 1 may also control the moving form of the platform 13 (and further, the moving form of the forming surface MS). The reason is that if the platform 13 moves, it can be considered that the irradiation area EA moves relative to the forming surface MS. In addition, the control method of the movement form of the platform 13 may be the same as the control method of the movement form of the shaping head 11, and therefore detailed description thereof is omitted. Alternatively, as described later, in a case where the irradiation area EA can be moved relative to the shaping surface MS by deflecting the light EL with a galvanometer or the like, the shaping system 1 can also change the irradiation area in order to change the size of the melting pool MP. The movement pattern of the EA is controlled. In addition, the method of controlling the moving form of the irradiation area EA may be the same as the method of controlling the moving form of the shaping head 11, and thus detailed description thereof is omitted.

Next, referring to FIGS. 12 (a) to 12 (f) and FIGS. 13 (a) to 13 (f), the first characteristic changing operation for changing the size of the structural layer SL by changing the size of the molten pool MP is described. A specific example will be described.

First, as shown in FIG. 12 (a), in order to form the lowest structural layer SL_lowest (that is, the structural layer SL # 1) on the forming surface MS corresponding to the surface WS of the workpiece W, the irradiation system 111 irradiates light to the forming surface MS. EL. As a result, a melting pool MP is formed on the forming surface MS. Further, as shown in FIG. 12 (b), while the light EL is irradiated, the material nozzle 112 supplies the shaping material M to the irradiation area EA (or the melting pool MP) of the light EL. As a result, as shown in FIG. 12 (c), the forming material M supplied to the melting pool MP is melted, and a melting pool MP including the molten forming material M and rising from the forming surface MS is formed on the forming surface MS. During the formation of the structural layer SL_lowest, the forming system 1 controls the characteristics of the light EL and the forming material M under the control of the control device 14 so that the size of the melting pool MP becomes smaller (for example, the first size R1). At least one of a supply form and a moving form of the forming head 11.

Thereafter, if the melting pool MP is no longer irradiated with light EL as the shaping head 11 moves, the shaping material M that has been melted in the melting pool MP is cooled and solidified (that is, solidified). As a result, as shown in FIG. 12 (d), on the workpiece W, a molded article constituting the lowermost structural layer SL_lowest is formed from the deposited material of the cured molding material M.

Thereafter, in order to form the structural layer SL_upper (specifically, the structural layer SL # 2) on the structural layer SL_lowest of the lowermost layer, the surface of the structural layer SL_lowest of the lowermost layer is set as a new forming surface MS. Thereafter, as shown in FIG. 12 (e), the irradiation system 111 irradiates the shaping surface MS (ie, the surface of the structural layer SL_lowest) with light EL. As a result, a molten pool MP is formed in the structural layer SL_lowest. Further, as shown in FIG. 12 (f), while the light EL is irradiated, the material nozzle 112 supplies the shaping material M to the irradiation area EA (or the melting pool MP) of the light EL. As a result, as shown in FIG. 13 (a), the forming material M supplied to the melting pool MP is melted, and a melting pool MP including the molten forming material M and raised from the forming surface MS is formed on the forming surface MS. That is, on the surface of the structural layer SL_lowest, a melting pool MP including the molten forming material M and raised from the surface of the structural layer SL_lowest is formed. During the formation of the structural layer SL_upper, the shaping system 1 controls the characteristics of the light EL and the shaping material M such that the size of the melting pool MP becomes larger (for example, the second dimension R2) under the control of the control device 14. At least one of a supply form and a moving form of the forming head 11.

Thereafter, if the melting pool MP is no longer irradiated with light EL as the shaping head 11 moves, the shaping material M that has been melted in the melting pool MP is cooled and solidified (that is, solidified). As a result, as shown in FIG. 13 (b), on the structural layer SL_lowest, the shaped material constituting the structural layer SL_upper is formed by the accumulation of the solidified shaped material M. The larger the melting pool MP is, the more the molding material M is cooled and solidified. The more the molding material M cooled and solidified, the larger the size of the solidified molding material M (especially the dimension along at least one direction along the molding surface MS) becomes larger. Therefore, as shown in FIG. 13 (b), the size of the structural layer SL_upper formed by forming the molten pool MP having a large size becomes larger than the size of the structural layer SL_lowest formed by forming the molten pool MP having a small size.

Thereafter, in order to form a new structural layer SL_upper (specifically, the structural layer SL # 3) on the formed structural layer SL_upper, the surface of the formed structural layer SL_upper is set as a new forming surface MS. Thereafter, as shown in FIG. 13 (c), the self-illumination system 111 irradiates the shaping surface MS (ie, the surface of the structural layer SL_upper that has been formed) with light EL. As a result, a molten pool MP is formed on the formed structural layer SL_upper. Further, as shown in FIG. 13 (d), while the light EL is irradiated, the shaping material M is supplied from the material nozzle 112 to the irradiation area EA (or the melting pool MP) of the light EL. As a result, as shown in FIG. 13 (e), the forming material M supplied to the melting pool MP is melted, and a melting pool MP including the molten forming material M and raised from the forming surface MS is formed on the forming surface MS. That is, on the surface of the formed structural layer SL_upper, a melting pool MP including the molten forming material M and raised from the surface of the formed structural layer SL_upper is formed. In this case, the forming system 1 is also controlled by the control device 14 to control the characteristics of the light EL and the supply form of the forming material M such that the size of the melting pool MP becomes larger (for example, the second size R2). And at least one of the moving patterns of the shaping head 11. Thereafter, if the melting pool MP is no longer irradiated with light EL as the shaping head 11 moves, the shaping material M that has been melted in the melting pool MP is cooled and solidified (that is, solidified). As a result, as shown in FIG. 13 (f), on the already formed structural layer SL_upper, a shaped object constituting a new structural layer SL_upper is formed from a deposit of the solidified forming material M.

Thereafter, the operation for forming a new structural layer SL_upper on the uppermost structural layer SL_upper among the plurality of formed structural layers SL_upper is repeated. As a result, as shown in FIG. 14 (a), a second shaping operation including such a first characteristic changing operation is formed on the structure layer SL_lowest having a small size and has a plurality of sizes larger than the size of the structure layer SL_lowest. The three-dimensional structure ST of the structural layer SL_upper. That is, the three-dimensional structure ST formed on the narrow structure layer SL_lowest and having a plurality of structure layers SL_upper wider than the width of the structure layer SL_lowest is formed. Therefore, the three-dimensional structure ST in which the portion where the structural layer SL_lowest is formed becomes substantially a cutout (in other words, an intermediate thinned portion, a recessed portion, a crack, a slit, or a groove) is formed. In other words, a three-dimensional structure ST is formed in which a notch is substantially formed in a portion bonded to the workpiece W. In other words, a three-dimensional structure ST having a small contact area (or an area of a bonding portion) with the workpiece W is formed.

As an example, if the box-shaped three-dimensional structure ST shown in Figs. 3 (a) to 3 (f) is formed by the second shaping operation, as shown in Figs. 15 (a) to 15 (c) A three-dimensional structure ST including a wall-shaped structure ST1, a wall-shaped structure ST2, a wall-shaped structure ST3, and a wall-shaped structure ST4 is formed, and the wall-shaped structure ST1 is extended along the X-axis direction. The wall-shaped structure ST2 is extended along the X-axis direction and faces the structure ST1 along the Y-axis direction, and the wall-shaped structure ST3 is extended along the Y-axis direction, and the + Y side and the -Y side The end portions of are connected to the -X side ends of the structures ST1 and ST2, the wall-shaped structure ST4 is extended along the Y-axis direction, and the ends of the + Y side and the -Y side are connected to the structure, respectively. The ends of the object ST1 and the structure ST2 on the + X side face the structure ST3 along the Y-axis direction. In this case, as shown in FIG. 15 (b), the size in the Y-axis direction of the structural layer SL_lowest constituting the structure ST1 becomes smaller than the size in the Y-axis direction of the structural layer SL_upper constituting the structure ST1. Further, as shown in FIG. 15 (b), the size in the Y-axis direction of the structural layer SL_lowest constituting the structure ST2 becomes smaller than the size in the Y-axis direction of the structural layer SL_upper constituting the structure ST2. Further, as shown in FIG. 15 (c), the size in the X-axis direction of the structural layer SL_lowest constituting the structure ST3 becomes smaller than the size in the X-axis direction of the structural layer SL_upper constituting the structure ST3. Furthermore, as shown in FIG. 15 (c), the size in the X-axis direction of the structural layer SL_lowest constituting the structure ST4 becomes smaller than the size in the X-axis direction of the structural layer SL_upper constituting the structure ST4.

On the other hand, when the shaping operation of the first comparative example is performed in which the size of the structure layer SL_lowest and the size of the structure layer SL_upper are made the same, as shown in FIG. Three-dimensional structure ST with no cuts. In other words, a three-dimensional structure ST having a large contact area (or an area of a bonding portion) with the workpiece W is formed.

Compared with the three-dimensional structure ST formed by the forming operation of the first comparative example, the three-dimensional structure ST formed by the second forming operation including the first characteristic changing operation can be used in the formation with the workpiece W. The cut of the joint portion is easily separated from the workpiece W. Specifically, as shown in FIG. 14 (c), the three-dimensional structure ST can also be separated from the workpiece W in a state including the structural layer SL_lowest and the structural layer SL_upper by separating the structural layer SL_lowest from the workpiece W. Alternatively, as shown in FIG. 14 (d), the three-dimensional structure ST may separate the remaining part of the structural layer SL_lowest from the workpiece W in a state where the structural layer SL_lowest is broken and a part of the structural layer SL_lowest has been combined with the workpiece W. Thereby, in a state where a part of the structural layer SL_lowest is removed from the three-dimensional structure ST, the structure W can be separated from the workpiece W. Alternatively, the structural layer SL_lowest of the three-dimensional structure ST may be broken at the boundary with the structural layer SL_upper. Thereby, the three-dimensional structure ST (that is, the three-dimensional structure ST including the structure layer SL_upper) can be separated from the workpiece W in a state where the entire structure layer SL_lowest has been combined with the workpiece W. In this case, at least a part of the structural layer SL_lowest that has been combined with the workpiece W may not be the structural layer SL constituting the three-dimensional structure ST. As an example, the forming system 1 may be formed with the structural layer SL for separating the three-dimensional structure ST from the workpiece W as the structural layer SL_lowest, and thereafter, the structural layer SL constituting the three-dimensional structure ST may be formed as the structural layer SL_upper. On the structure layer SL_lowest. In this way, the three-dimensional structure ST that can be easily separated from the workpiece W can be formed by the second shaping operation including the first characteristic changing operation.
(2-2-2) Second characteristic change operation

Next, a second characteristic changing operation for changing the resistance of the structural layer SL to damage will be described. The "damage" in this embodiment may also include damage caused by a physical action (for example, external force, as an example, impact), damage caused by an electric action, damage caused by a magnetic action, and heat caused by a heat action. At least one of the damage caused, the damage caused by optical effects, and the damage caused by chemical effects. The "brittleness" of the present embodiment may include at least one of brittleness to physical action, brittleness to electric action, brittleness to magnetic action, brittleness to thermal action, brittleness to optical action, and brittleness to chemical action.

In order to change the resistance of the structural layer SL to destruction, the shaping system 1 may change the formation conditions when the structural layer SL is formed, for example. As an example, the forming system 1 may change the formation conditions when forming the structural layer SL_lowest to formation conditions different from the formation conditions when forming the structural layer SL_upper.

The formation conditions of the second characteristic changing operation may include characteristics of the light EL irradiated by the irradiation system 111. In this case, the shaping system 1 may change the characteristics of the light EL used to form the structural layer SL_lowest to a characteristic different from the characteristics of the light EL used to form the structural layer SL_upper. For example, when the forming system 1 forms the structural layer SL_lowest, the characteristics of the light EL may be set to a third characteristic for forming the structural layer SL_lowest with low resistance to destruction. On the other hand, when the forming system 1 forms the structural layer SL_upper, the characteristics of the light EL can also be set to the fourth characteristic (typically the fourth characteristic and the third characteristic) for forming the structural layer SL_upper with high resistance to destruction. Different characteristics).

The characteristics of the light EL in the second characteristic changing operation may include the intensity of the light EL per unit area (or the energy of the light EL per unit area) on the shaping surface MS. In this case, as shown in FIG. 16, when the forming system 1 forms the structural layer SL_lowest, the intensity of the light EL per unit area may be set to a third intensity. The third intensity is greater than the fourth intensity described later. The third intensity may also be set based on the intensity at which the shaping material M can be evaporated. For example, the third intensity may be set to an intensity at which the shaping material M can be evaporated. As a result, at the time of forming the structural layer SL_lowest, at least a part of the forming material M supplied to the forming surface MS is evaporated by irradiation of light EL. Therefore, the amount of the molding material M that melts without evaporation is reduced. As a result, only a sufficient amount of the shaping material M for forming the structural layer SL_lowest is melted (and further becomes non-solidified). If the sufficient amount of the shaping material M is not cured to form the structural layer SL_lowest, many voids may be formed inside the structural layer SL_lowest due to the lack of the shaping material M. The more such voids become, the more brittle the structural layer SL_lowest becomes. In other words, the more the voids become, the higher the brittleness of the structural layer SL_lowest becomes. Therefore, the structural layer SL_lowest has a low resistance to destruction. On the other hand, as shown in FIG. 16, when the forming system 1 forms the structural layer SL_upper, the intensity of the light EL per unit area may be set to a fourth intensity that is lower than the third intensity. The fourth intensity may be set based on the intensity at which the molding material M can be evaporated. For example, the fourth strength may be set to a strength that is less than the strength at which the molding material M can be evaporated. As a result, at the time of forming the structural layer SL_upper, the possibility that at least a part of the forming material M supplied to the forming surface MS is evaporated by the irradiation of the light EL almost disappears. Therefore, there is less possibility that the molten molding material M will be reduced. Therefore, the structural layer SL_upper is formed of a sufficient amount of the shaping material M for forming the structural layer SL_upper, and thus the voids formed inside the structural layer SL_upper become smaller than the voids formed inside the structural layer SL_lowest. As a result, the structural layer SL_upper becomes hard. In other words, the brittleness of the structural layer SL_upper becomes low. Therefore, the structural layer SL_upper has a higher resistance to destruction than the structural layer SL_lowest. That is, the resistance of the structural layer SL_lowest to destruction becomes lower than the resistance of the structural layer SL_upper to destruction.

The formation condition of the second characteristic changing operation may include a supply form of the forming material M supplied from the material nozzle 112. In this case, the forming system 1 may change the supply form of the forming material M when the structural layer SL_lowest is formed to a supply form different from the supply form when the structural layer SL_upper is formed. For example, when the forming system 1 forms the structural layer SL_lowest, the supply form of the forming material M may be set to a third supply form for forming the structural layer SL_lowest having a low resistance to destruction. On the other hand, when the forming system 1 forms the structural layer SL_upper, the supply form of the forming material M can also be set to a fourth supply form (typically, for forming the structural layer SL_upper having higher resistance to destruction than the structural layer SL_lowest (typical (It is different from the fourth supply form).

The supply form of the forming material M in the second characteristic changing operation may include a supply amount of the forming material M per unit time or unit area (that is, a supply rate of the forming material M). In this case, as shown in FIG. 17, when the forming system 1 forms the structural layer SL_lowest, the supply amount of the forming material M may be set to a third supply amount. The third supply amount is smaller than the fourth supply amount described later. The third supply amount may be set based on a component of the forming material M necessary for forming the structural layer SL_lowest. For example, the third supply amount may be set to be less than the amount of the forming material M necessary for forming the structural layer SL_lowest. As a result, when the structural layer SL_lowest is formed, only a sufficient amount of the shaping material M for forming the structural layer SL_lowest is melted (and further, only a sufficient amount of the shaping material M for forming the structural layer SL_lowest is solidified) . For this reason, the structural layer SL_lowest has a low resistance to destruction. On the other hand, as shown in FIG. 17, when the forming system 1 forms the structural layer SL_upper, the supply amount of the forming material M may be set to a fourth supply amount which is greater than the third supply amount. The fourth supply amount may be set based on a component of the shaping material M necessary for forming the structural layer SL_upper. For example, the fourth supply amount may be set to be equal to or greater than the amount of the shaping material M necessary for forming the structural layer SL_upper. As a result, when the structural layer SL_upper is formed, a sufficient amount of the shaping material M for forming the structural layer SL_upper is melted (and further, a sufficient amount of the shaping material M for forming the structural layer SL_upper is solidified). For this reason, the structural layer SL_upper has a high resistance to destruction. That is, the resistance of the structural layer SL_lowest to destruction becomes lower than the resistance of the structural layer SL_upper to destruction.

The formation condition of the second characteristic changing operation may include the type of the forming material M supplied from the material nozzle 112. In this case, the forming system 1 may change the type of the forming material M supplied to form the structural layer SL_lowest to a different type from the type of the forming material M supplied to form the structural layer SL_upper. For example, when the forming system 1 forms the structural layer SL_lowest, the first forming material M for forming the structural layer SL_lowest having a low resistance to destruction can also be supplied. On the other hand, when forming the structural layer SL_upper, the forming system 1 can also supply a second forming material M for forming a structural layer SL_upper having higher resistance to destruction than the structural layer SL_lowest. For example, the brittleness of the first shaping material M may also be higher than that of the second shaping material M. For example, the first forming material M may be more brittle than the second forming material M. As a result, the structural layer SL_lowest formed by the first forming material M has a lower resistance to destruction than the structural layer SL_upper formed by the second forming material M has a lower resistance to destruction.

As shown in FIG. 18 (a), a three-dimensional structure ST is formed by the second shaping operation including such a second characteristic changing operation, and the three-dimensional structure ST is formed on the structural layer SL_lowest having low resistance to destruction. A plurality of structural layers SL_upper having higher resistance to destruction than the structural layers SL_lowest are formed thereon. Therefore, if an external force is applied to the structural layer SL_lowest that can damage the structural layer SL_lowest, but does not damage the structural layer SL_upper, as shown in FIG. 18 (b), the structural layer SL_lowest can be destroyed without damaging the structural layer SL_upper. If the structural layer SL_lowest is destroyed, the structural layer SL_upper that has been integrated with the workpiece W via the structural layer SL_lowest is separated from the workpiece W. As a result, separation of the three-dimensional structure ST from the workpiece W becomes easy. Compared with the three-dimensional structure ST formed by the shaping operation of the second comparative example in which the structural layer SL_lowest resistance to destruction and the structural layer SL_upper resistance to destruction are made the same, The three-dimensional structure ST formed by the second shaping operation can be easily separated from the workpiece W. Therefore, the second shaping operation including the second characteristic changing operation can form a three-dimensional structure ST that can be easily separated from the workpiece W.

When the structural layer SL_lowest is destroyed in order to separate the three-dimensional structure ST from the workpiece W, the structural layer SL_lowest may not be the structural layer SL constituting the three-dimensional structure ST. For example, the shaping system 1 may also form a predetermined structural layer SL that is destroyed to separate the three-dimensional structure ST from the workpiece W as the structural layer SL_lowest, and thereafter, use the structural layer SL that constitutes the three-dimensional structure ST as a structural layer. SL_upper is formed on the structure layer SL_1owest.
(2-2-3) The third characteristic change operation

Next, a third characteristic changing operation for changing the binding force of the structural layer SL to the workpiece W will be described. In order to change the bonding force of the structural layer SL to the workpiece W, the shaping system 1 may change the formation conditions when forming the structural layer SL, for example. As an example, the forming system 1 may change the formation conditions when forming the structural layer SL_lowest to formation conditions different from the formation conditions when forming the structural layer SL_upper.

The formation condition of the third characteristic changing operation may include the type of the molding material M supplied from the material nozzle 112. In this case, the forming system 1 may change the type of the forming material M supplied to form the structural layer SL_lowest to a different type from the type of the forming material M supplied to form the structural layer SL_upper. As an example, when the forming system 1 forms the structural layer SL_lowest, the third forming material M for forming the structural layer SL_lowest having a weak binding force to the workpiece W can also be supplied. On the other hand, when forming the structural layer SL_upper, the forming system 1 can also supply a fourth forming material M for forming the structural layer SL_upper having a stronger binding force to the workpiece W than the structural layer SL_lowest.

For example, the third shaping material M may be a material having a weaker binding force with the workpiece W than the fourth shaping material M. Specifically, the lower the wettability of the shaping material M with respect to the surface WS of the workpiece W, the weaker the bonding force between the shaping material M and the workpiece W becomes. In addition, the "state where the wettability of the shaping material M is low" of this embodiment can also mean the "state where the contact angle of the molten shaping material M is large." Therefore, as shown in FIG. 19 (a), the third shaping material M may also have lower wettability than the fourth shaping material M (that is, the contact angle is larger than that of the fourth shaping material M).的 shaped material M. On the other hand, as shown in FIG. 19 (b), the fourth shaping material M may be a shaping material M having higher wettability than the third shaping material M. As an example, when the workpiece W includes stainless steel, the third shaping material M may also include at least one of aluminum, titanium, copper, and tungsten, and the fourth shaping material M may also include stainless steel (or, The same material). As a result, the binding force of the structural layer SL_lowest formed by the third shaping material M to the workpiece W becomes weaker than the binding force of the structural layer SL_upper formed by the fourth shaping material M on the workpiece W.

As shown in FIG. 20 (a), a second forming operation including such a third characteristic changing operation is performed to form a three-dimensional structure ST on the structural layer having a weak binding force to the workpiece W. SL_lowest is formed with a plurality of structural layers SL_upper having a stronger binding force to the workpiece W than the structural layer SL_lowest. Therefore, the structural layer SL_lowest can be easily separated from the workpiece W compared with a case where the structural layer SL_lowest having a strong bonding force to the workpiece W is formed on the workpiece W. If the structural layer SL_lowest is separated from the workpiece W, the structural layer SL_upper that has been integrated with the workpiece W via the structural layer SL_lowest is also separated from the workpiece W. In this way, the three-dimensional structure ST formed by the second shaping operation including the third characteristic changing operation can be easily separated from the workpiece W compared with the three-dimensional structure ST including the structural layer SL_lowest having a strong binding force to the workpiece W. . Therefore, the second shaping operation including the third characteristic changing operation can form a three-dimensional structure ST that can be easily separated from the workpiece W.
(3) Modification (3-1) First modification

In the description, the shaping system 1 changes the characteristics of the lowermost structural layer SL_lowest among the plurality of structural layers SL to the characteristics of the other structural layers SL_upper other than the lowermost structural layer SL_lowest among the plurality of structural layers SL. Different characteristics. However, when a plurality of structural layers SL_upper are formed on the structural layer SL_lowest, as shown in FIG. 20, the shaping system 1 may also change the characteristics of the structural layer SL_lowest to be at least one of the multiple structural layers SL_upper. On the other hand, different characteristics may be set to the same characteristics as those of at least one other structural layer SL_upper among the plurality of structural layers SL_upper. For example, when the forming system 1 forms multiple structural layers SL_upper, the characteristics of at least one structural layer SL_upper among the multiple structural layers SL_upper may be changed to characteristics different from those of the structural layer SL_lowest. The characteristics of at least one other structural layer SL_upper among the plurality of structural layers SL_upper are set to the same characteristics as those of the structural layer SL_lowest. For example, as shown in FIG. 21, the shaping system 1 may also change the characteristics of the structural layer SL_upper1 (that is, the lowest structural layer SL_upper1 among the multiple structural layers SL_upper) in contact with the structural layer SL_lowest among the multiple structural layers SL_upper. The characteristics of the structural layer SL_lowest are different from those of the structural layer SL_lowest. On the other hand, the characteristics of the remaining structural layer SL_upper2 among the multiple structural layers SL_upper may be set to the same characteristics as those of the structural layer SL_lowest. Alternatively, for example, the shaping system 1 may also change the characteristics of the multiple structural layers SL_upper including the lowest structural layer SL_upper1 in contact with the structural layer SL_lowest among the multiple structural layers SL_upper to characteristics different from those of the structural layer SL_lowest, and On the one hand, the characteristics of the remaining structural layers SL_upper2 among the plurality of structural layers SL_upper may be set to the same characteristics as those of the structural layers SL_lowest.
(3-2) Second modification

In the description, the shaping system 1 changes the characteristics of the lowermost structural layer SL_lowest among the plurality of structural layers SL to the characteristics of the other structural layers SL_upper other than the lowermost structural layer SL_lowest among the plurality of structural layers SL. Different characteristics. However, the shaping system 1 may also change a plurality of structural layer SLs including the structural layer SL_lowest (hereinafter, the characteristics of the "structural layer SL_lower" to other structural layers SL other than the multiple structural layers SL_lower). The structure layer SL (that is, the structure layer SL located in an upper layer compared with the structure layer SL_lower, hereinafter referred to as "structure layer SL_upper") has different characteristics.

For example, as shown in FIGS. 22 (a) and 22 (b), the shaping system 1 may also make the size of each of the plurality of structural layers SL_lower smaller than the size of the structural layer SL_upper ′. In this case, as shown in FIG. 22 (a), the sizes of the plurality of structural layers SL_lower may be the same as each other. Alternatively, at least two of the plurality of structural layers SL_lower may have different sizes. For example, as shown in FIG. 22 (b), the sizes of the plurality of structural layers SL_lower can be made different so that the size of the structural layer SL_lower becomes larger toward the upper layer. Such a structural layer SL_lower that becomes larger in size toward the upper layer can be formed by forming the molten pool MP that becomes larger in size toward the upper layer on the forming surface MS.

For example, as shown in FIG. 22 (c), the shaping system 1 can also make the resistance of each of the plurality of structural layers SL_lower to destruction lower than the resistance of the structural layer SL_upper ′ to destruction. In this case, the resistances of the multiple structural layers SL_lower to the damage may be the same as each other. Alternatively, at least two of the plurality of structural layers SL_lower may have different resistances to destruction. For example, it is also possible to make the structural layers SL_lower have different resistances to destruction so that the structural layers SL_lower have higher resistance to destruction.

For example, as shown in FIG. 22 (d), the forming system 1 may also make the bonding force of each of the plurality of structural layers SL_lower to the workpiece W weaker than the bonding force of the structural layer SL_upper ′ to the workpiece W. In this case, the binding forces of the plurality of structural layers SL_lower to the workpiece W may be the same as each other. Alternatively, at least two of the plurality of structural layers SL_lowerr may have different binding forces to the workpiece W. For example, the bonding force of the structural layers SL_lower to the workpiece W can be made to be different as the toward the upper layer becomes stronger.

Furthermore, in the second modified example, as in the first modified example, when a plurality of structural layers SL_upper 'are formed on the structural layer SL_lower, the shaping system 1 may also include at least one of the plurality of structural layers SL_upper'. The characteristic of the structural layer SL_upper 'is changed to a characteristic different from the characteristic of the structural layer SL_lower. On the other hand, at least one of the multiple structural layers SL_upper' may also have the characteristic of the other structural layer SL_upper 'as the characteristic of the structural layer SL_lower. Same characteristics.
(3-3) Third modification

In the above description, the first structural layer SL # 1 formed on the forming surface MS corresponding to the surface WS of the workpiece W is used as the lowermost structural layer SL_lowest. However, the structural layer SL after the second layer may be used as the lowermost structural layer SL_lowest. For example, the structural layer SL formed on at least one existing structural layer SL_exist already formed on the workpiece W may be used as the lowermost structural layer SL_lowest. In this case, the shaping system 1 may also change the characteristics of the structural layer SL_lowest into and form (in other words, build up) at least one structural layer SL (hereinafter, referred to as "structural layer SL_upper") on the structural layer SL_lowest. Different characteristics.

For example, as shown in FIG. 23 (a), the shaping system 1 can also make the size of the structural layer SL_lowest formed on the plurality of existing structural layers SL_exist already formed on the workpiece W larger than that of the structural layer SL_lowest. The size of the multiple structural layers SL_upper '' is small. For example, as shown in FIG. 23 (b), the shaping system 1 can also make the structural layer SL_lowest formed on a plurality of existing structural layers SL_exist already formed on the workpiece W more resistant to damage than the structural layer. The multiple structural layers SL_upper '' on SL_lowest have low resistance to damage. For example, as shown in FIG. 23 (c), the shaping system 1 can also make the bonding force of the structural layer SL_lowest to the structural layer SL_exist formed on the plurality of existing structural layers SL_exist already formed on the workpiece W less. The multiple structural layers SL_upper '' on the structural layer SL_lowest have a weak binding force to the structural layer SL_exist. As a result, the three-dimensional structure ST including at least the structural layer SL_upper '' can be easily separated from the existing structure SL_exist.

Furthermore, in the third modified example, as in the first modified example, when a plurality of structural layers SL_upper '' are formed on the structural layer SL_lowest, the shaping system 1 may also include the structural layers SL_upper ''. The characteristics of at least one structural layer SL_upper '' are changed to characteristics different from the characteristics of structural layer SL_lowest. On the other hand, the characteristics of at least one other structural layer SL_upper '' among the multiple structural layers SL_upper '' may be set to be the same as The structural layer SL_lowest has the same characteristics.

In addition, in the third modification, as in the second modification, the forming system 1 may change the characteristics of each of the plurality of structural layers SL_lower formed on the existing structural layer SL_exist formed on the workpiece W. Forming and forming (in other words, stacking) at least one structural layer SL_upper '' on the structural layer SL_lower has different characteristics.
(3-4) Fourth modification

In the description, in order to easily separate the formed object ST from the workpiece W, the size of the structural layer SL (that is, the lowest structural layer SL_lowest) that contacts the workpiece W, the resistance to destruction, and the binding force to the workpiece W It is assumed that at least one of the size of the structure layer SL (ie, the structure layer SL_upper), the resistance to the damage, and the bonding force to the workpiece W are changed so that at least one of them is changed. However, in order to improve the shape-related freedom of the three-dimensional structure ST or to improve the accuracy of the shape of the three-dimensional structure ST, the size of the melting pool MP when forming one of the plurality of structure layers SL may be changed. And the size of the molten pool MP when the other structural layer SL of the plurality of structural layers SL is formed. Alternatively, the characteristics of the light EL when forming one of the plurality of structural layers SL and the characteristics of the light EL when forming the other one of the plurality of structural layers SL may be changed. Alternatively, the supply form of the forming material M when one structural layer SL of the plurality of structural layers SL is formed, and the supply form of the forming material M when the other structural layer SL of the plurality of structural layers SL is formed may be changed. In addition, the moving form of the shaping head 11 when one structural layer SL of the plurality of structural layers SL is formed and the moving form of the shaping head 11 when another structural layer SL of the plurality of structural layers SL is formed may be changed.

Here, as the characteristics of the light EL, the intensity (or energy per unit area) of the light EL per unit area on the shaping surface MS, the defocus amount of the light EL per unit area of the shaping surface MS, and the unit At least one of the irradiation times of the area light EL. In addition, as the supply form of the molding material M, at least one of the supply amount of the molding material M per unit time and the supply amount of the molding material M per unit area may be at least one of the supply timing of the molding material M. One. The moving form of the shaping head 11 may be at least one of the moving speed of the shaping head 11 and the moving speed of the workpiece W.

For example, as shown in FIG. 24 (a), the shaping system 1 can also be shaped so that the sizes of the plurality of structural layers SL # 1 to SL # 10 gradually increase as they go upward. In addition, as shown in FIG. 24 (b), the forming system 1 can also perform forming such that the sizes of the plurality of structural layers SL # 1 to SL # 10 gradually decrease as they go upward. Alternatively, as shown in FIG. 24 (c), the shaping system 1 can also be shaped in such a manner that the sizes of the plurality of structural layers SL # 1 to SL # 10 gradually become smaller as they move upward. . Furthermore, in the examples of FIGS. 24 (a) to 24 (c), the sizes of the plurality of structural layers SL # 1 to SL # 10 are continuously changed, but they may also be as shown in FIG. 23 (a). , Discontinuously (discretely) changing.

If the example shown in FIG. 24 (a) is rephrased, it can also be said that when a certain structural layer SL (for example, the structural layer SL # 2) is formed among a plurality of structural layers SL # 1 to SL # 10. Compared with the size of the molten pool MP, the size of the molten pool MP when forming a structural layer SL (for example, the structural layer SL # 1 or the structural layer SL # 3) adjacent to the structural layer SL becomes smaller (focusing on the structural layer SL #). 1), or becomes larger (looking at the case of the structural layer SL # 3).

The shaping operation of the example shown in FIG. 24 (a) will be briefly described. First, the forming system MS of the workpiece W (the surface facing the + Z side of the workpiece W) is irradiated with the light EL by the irradiation system 111, and a melting pool MP is formed on the shaping surface MS of the workpiece W. A molding material M is supplied to the melting pool MP. As a result, the molding material M supplied to the melting pool MP is melted, and thereafter, it is cooled and solidified (that is, solidified). As a result, the lowermost structural layer SL # 1 is formed by the deposit of the solidified molding material M. Then, the surface facing the + Z side of the structural layer SL # 1 is irradiated with light EL by the irradiation system 111, and a melting pool MP is formed on the forming surface MS that is at least a part of the surface of the structural layer SL # 1. A molding material M is supplied to the melting pool MP. As a result, the molding material M supplied to the melting pool MP is melted, and thereafter, it is cooled and solidified (that is, solidified). As a result, the structure layer SL # 2 of the second layer is formed by the deposit of the solidified molding material M. Here, the intensity of the light EL when the lowermost structural layer SL # 1 is formed is weaker than the intensity of the light EL when the second structural layer SL # 2 is formed. In addition, the size of the molten pool MP formed when the lowermost structural layer SL # 1 is formed is smaller than the size of the molten pool MP formed when the second structural layer SL # 2 is formed. Therefore, the size (typically the size in the Y direction) of the structural layer SL # 2 formed as the second layer becomes larger than the size (typically the size in the Y direction) of the lowermost structural layer SL # 1. Shape. The intensity of the light EL when forming each structural layer SL is set in such a manner that it gradually increases in accordance with the manufacturing sequence of the structural layer SL (as the Z-direction position of the structural layer SL becomes higher). A workpiece that is separated from the workpiece W in the + Z axis direction and gradually becomes larger in the Y direction. In addition, the size of the melting pool MP when forming each structural layer SL can be set so that it gradually becomes larger as the fabrication order of the structural layer SL goes backward (as the position of the structural layer SL in the Z direction becomes higher), and can be formed. As the workpiece moves away from the workpiece W in the + Z direction, the shape in the Y direction gradually becomes larger.

In the example of FIG. 24 (b), the time when each structural layer SL is formed is set so that it gradually becomes smaller as the fabrication order of the structural layer SL goes backward (as the position of the structural layer SL in the Z direction becomes higher). The intensity of the light EL forms a shape that gradually decreases in size in the Y direction as it moves away from the workpiece W in the + Z axis direction.

In addition, in the example of FIG. 24 (c), it is set such that it gradually becomes smaller and then becomes larger as the fabrication order of the structural layer SL goes backward (as the position of the structural layer SL in the Z direction becomes higher) and then becomes larger. The intensity of the light EL at the time of forming each structural layer SL forms a shape that gradually decreases in size in the Y direction as it moves away from the workpiece W in the + Z axis direction.

Furthermore, in the examples of FIGS. 24 (a) to 24 (c), the three-dimensional structure ST may have a shape extending in the X direction. At this time, the size of the melting pool MP and the size of the structural layer SL may be a size in a direction crossing the extended direction (X direction). Here, the size of the direction crossing the extended direction (X direction) may be a direction along the structural layer SL (as an example, the Y direction), or a direction in which a plurality of structural layers SL are laminated (as an example, the Z direction). ). For example, the Y-direction dimension of the structural layer SL # 1 extended in the X direction and the Y-direction dimension of the structural layer SL # 2 extended in the X direction adjacent to the structural layer SL # 1 may be different from each other. For example, the Z-direction dimension of the structural layer SL # 1 extended in the X direction and the Z-direction dimension of the structural layer SL # 2 extended in the X direction adjacent to the structural layer SL # 1 may be different from each other.

In addition, in the example of FIG. 24 (a), each structure can be set to be formed so that it gradually becomes slower as the fabrication order of the structure layer SL goes backward (as the position of the structure layer SL in the Z direction becomes higher). The moving speed of the forming head 11 at the time of layer SL forms a forming object whose size gradually increases in the Y direction as it moves away from the workpiece W in the + Z axis direction. In addition, in the example of FIG. 24 (b), each structure can be set to be formed in such a manner that it gradually becomes faster as the fabrication order of the structural layer SL goes backward (as the position of the structural layer SL in the Z direction becomes higher). The moving speed of the forming head 11 at the time of layer SL forms a forming object that gradually decreases in size in the Y direction as it moves away from the workpiece W in the + Z axis direction. Moreover, in the example of FIG. 24 (c), it can also be gradually increased and then gradually slowed down as the fabrication order of the structural layer SL goes backward (as the position of the structural layer SL in the Z direction becomes higher). The moving speed of the forming head 11 when forming each structural layer SL is set to form a forming object that gradually decreases in size in the Y direction as it moves away from the workpiece W in the + Z axis direction.

As such, in the fourth modification, the degree of freedom of the shape of the three-dimensional structure ST or the accuracy of the shape of the three-dimensional structure ST can be improved. Furthermore, the accuracy of the shape of the three-dimensional structure ST may be the difference between the design data (as an example, the design size) of the three-dimensional structure ST and the actual shape of the three-dimensional structure ST.
Furthermore, the fourth modification shown in FIGS. 24 (a) to 24 (c) may be combined with the embodiment and the first to third modifications.
(3-5) Other modifications

In the description, the shaping system 1 includes a shaping head driving system 12 that moves the shaping head 11. However, in addition to the forming head driving system 12, the forming system 1 may include a platform driving system that moves the platform 13 or a platform driving system that moves the platform 13 instead of the forming head driving system 12. The platform driving system can also move the platform 13 in at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. By moving the platform 13 using the platform driving system, the relative positional relationship between the platform 13 and the forming head 11 is changed in the same manner as the movement of the forming head 11 using the forming head driving system 12, and the workpiece W and the irradiation area EA are changed. The relative positional relationship between.

In the description, the shaping system 1 moves the shaping head 11 to move the irradiation area EA relative to the shaping surface MS. However, in addition to moving the shaping head 11, the shaping system 1 can also move the irradiation area EA relative to the shaping surface MS by deflecting the light EL, or deflect the light EL to cause the irradiation area EA relative to the shaping. The surface MS moves instead of moving the shaping head 11. In this case, the irradiation system 111 may include, for example, an optical system (for example, a galvano mirror) capable of deflecting the light EL.

In the description, the shaping system 1 irradiates the shaping material M with light EL, thereby melting the shaping material M. However, the shaping system 1 may irradiate the shaping material M with an arbitrary energy beam, thereby melting the shaping material M. In this case, in addition to the irradiation system 111, the shaping system 1 may include a beam irradiation device capable of irradiating an arbitrary energy beam, or a beam irradiation device capable of irradiating an arbitrary energy beam instead of the irradiation system 111. The arbitrary energy beam is not limited, but includes a charged particle beam such as an electron beam, an ion beam, or an electromagnetic wave.

In the above description, the forming system 1 can form a three-dimensional structure ST by a laser surfacing method. However, the forming system 1 may use another method capable of forming the three-dimensional structure ST to form the three-dimensional structure ST from the forming material M. As an example of another method, for example, a powder bed fusion method (Powder Bed Fusion) such as a powder sintering lamination method (Selective Laser Sintering (SLS)) may be mentioned. The powder bed fusion bonding method is different from the laser surfacing method in which the shaping material M is supplied with one side of the light EL and one side of the irradiation area EA with light EL, and the three-dimensional structure ST is formed by irradiating the shaping material M that has been supplied in advance with light EL or the like. As another example of another method, a binder jetting method (Laser Metal Fusion) or a laser metal fusion method (LMF) may be mentioned.

In the description, the shaping system 1 includes a control device 14. However, the shaping system 1 may not include the control device 14. The control device 14 may also be provided outside the shaping system 1. In this case, the control device 14 and the shaping system 1 may also be connected through a wired or wireless communication line. Instead of the control device 14, a recording medium in which a signal indicating the operation sequence of the shaping system 1 is recorded in advance may be used to operate the shaping system 1. In addition, other parts (for example, the forming head drive system 12) may be provided with functions of a part of the control device 14.

(5) Additional notes
Regarding the embodiment described above, the following additional notes are further disclosed.
[Supplementary note 1]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
The first shaping surface is irradiated with the energy beam, thereby melting the supplied material to form a first structural layer, and irradiating a second shaping surface that is at least a part of a surface of the first structural layer The energy beam, thereby melting the supplied material to form a second structure layer on the first structure layer, and
The energy transferred from the energy beam to the first shaping surface per unit area or unit time is different from the energy transferred from the energy beam to the second shaping surface per unit area or unit time.
[Supplementary note 2]
The shaping system as described in Supplementary Note 1, wherein the energy transferred from the energy beam to the first shaping surface per unit area or unit time is greater than that per unit area or unit time from the energy beam pair. The second shaping surface transfers less energy.
[Supplementary note 3]
The shaping system as described in Supplementary Note 1 or 2, wherein the size of the second structural layer in at least one of the directions along the surface of the first structural layer is the same as that of The dimensions of the first structural layer are different.
[Supplementary note 4]
The shaping system according to any one of Supplementary Notes 1 to 3, wherein a size of the second structural layer in at least one of directions along a surface of the first structural layer is larger than the at least one direction The size of the first structural layer is large.
[Supplementary note 5]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
The first shaping surface is irradiated with the energy beam, thereby melting the supplied material to form a first structural layer, and irradiating a second shaping surface that is at least a part of a surface of the first structural layer. The energy beam, thereby melting the supplied material, and forming a second structure layer on the first structure layer, the second structure layer along a surface of the first structure layer A dimension in at least one of the directions is different from the first structure layer.
[Supplementary note 6]
The shaping system described in Supplementary Note 5, wherein a size of the second structural layer is larger than that of the first structural layer in at least one of directions along a surface of the first structural layer.
[Supplementary note 7]
The shaping system according to any one of appendices 3 to 7, wherein the first structure layer and the second structure layer have a cross-section that intersects the at least one direction toward a surface of the first structure layer. Directional extended shape.
[Supplementary note 8]
The shaping system according to any one of Supplementary Notes 1 to 7, wherein the size of the first structural layer and the second structure are in a direction from the first structural layer toward the second structural layer. The dimensions of the layers are different from each other.
[Supplementary note 9]
The forming system according to any one of Supplementary Notes 1 to 8, irradiating the energy beam having a first beam characteristic to form the first structure layer, and
The second structure layer is formed by irradiating the energy beam having a second beam characteristic different from the first beam characteristic.
[Supplementary note 10]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
Irradiating the first shaping surface with the energy beam having a first beam characteristic, thereby melting the supplied material to form a first structural layer, and
Irradiating the second shaping surface, which is at least a part of the surface of the first structural layer, with the energy beam having a second beam characteristic different from the first beam characteristic, thereby causing the supplied material The second structure layer is formed on the first structure layer by melting.
[Supplementary note 11]
The shaping system described in Supplementary Note 9 or 10, wherein the beam characteristic includes an intensity or energy of the energy beam per unit area.
[Supplementary note 12]
The shaping system described in Supplementary Note 11, which irradiates the energy beam having a first intensity or a first energy per unit area to form the first structure layer, and
The second structure layer is formed by irradiating the energy beam having a second intensity different from the first intensity or a second energy different from the first energy per unit area.
[Supplementary note 13]
The shaping system described in Appendix 12, wherein the second intensity is greater than the first intensity per unit area.
[Supplementary note 14]
The shaping system described in Supplementary Note 12 or 13, wherein the second energy is greater than the first energy per unit area.
[Supplementary note 15]
The shaping system according to any one of appendixes 9 to 14, wherein the beam characteristics include a defocus amount of the energy beam.
[Supplementary note 16]
The shaping system according to any one of appendices 9 to 15, which irradiates the energy beam whose defocus amount with respect to the first shaping surface is set to a first set amount to form the first structural layer. , And
The second structural layer is formed by irradiating the energy beam with a defocus amount set to a second set amount different from the first set amount with respect to the second shaping surface.
[Supplementary note 17]
The shaping system described in Supplementary Note 16, wherein the second set amount is smaller than the first set amount.
[Supplementary note 18]
The shaping system according to any one of appendixes 9 to 17, wherein the beam characteristics include an irradiation time for irradiating the energy beam.
[Supplementary note 19]
The shaping system described in Supplementary Note 18, in a state where the unit area on the first shaping surface is irradiated with only the energy beam for a first irradiation time, the energy beam is irradiated to form the first structure. Layers, and
The second structure layer is formed by irradiating the energy beam in a state where the unit area on the second shaping surface is irradiated with the energy beam only for a second irradiation time different from the first irradiation time. .
[Supplementary note 20]
The shaping system described in Supplementary Note 19, wherein the second irradiation time is longer than the first irradiation time.
[Supplementary note 21]
The forming system according to any one of Supplementary Note 18 to Supplementary Note 20, which irradiates the energy beam intermittently or in a pulse form to form the first structure layer, and
The energy beam is continuously irradiated to form the second structure layer.
[Supplementary note 22]
The shaping system according to any one of Supplementary Notes 9 to 21, wherein the first light beam characteristic and the second light beam characteristic are set as follows: the first light beam characteristic is provided per unit area or unit time. The energy transmitted by the energy beam to the first shaping surface is different from the energy transmitted from the energy beam having the second beam characteristic to the second shaping surface per unit area or unit time .
[Supplementary note 23]
The shaping system as described in Appendix 22, wherein the first beam characteristic and the second beam characteristic are set as follows: the energy beam pair having the first beam characteristic per unit area or unit time The energy transferred by the first shaping surface becomes smaller than the energy transferred from the energy beam having the second beam characteristic to the second shaping surface per unit area or unit time.
[Supplementary Note 24]
The shaping system according to any one of Supplementary Notes 1 to 23, wherein the supply device supplies a material to an irradiation position of the energy beam.
[Supplementary note 25]
The shaping system according to any one of Supplementary Notes 1 to 24, wherein the irradiation device irradiates the energy beam to the material that has been supplied by the supply device.
[Supplementary note 26]
The forming system according to any one of Supplementary Notes 1 to 25, which irradiates the energy beam and supplies the material in a first supply form to form the first structural layer,
The second structural layer is formed by irradiating the energy beam and supplying the material in a second supply form different from the first supply form.
[Supplementary note 27]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
Irradiating the first shaping surface with the energy beam, and supplying the material in a first supply form to form a first structural layer,
Irradiating the energy beam onto a second shaping surface that is at least a part of the surface of the first structure layer, and supplying the material in a second supply form different from the first supply form to the first structure A second structural layer is formed on the layer.
[Supplementary note 28]
The shaping system described in Supplementary Note 26 or 27, wherein the supply form includes a supply amount of the material per unit time or per unit area.
[Supplementary note 29]
The shaping system described in Supplementary Note 26 or 27, which irradiates the energy beam and supplies the material at a first supply amount per unit time or per unit area to form the first structural layer,
The energy beam is irradiated and the material is supplied at a second supply amount different from the first supply amount per unit time or per unit area to form the second structure layer.
[Supplementary note 30]
The shaping system as described in Appendix 29, wherein the second supply amount is smaller than the first supply amount.
[Supplementary note 31]
The shaping system according to any one of appendixes 26 to 29, wherein the supply form includes a supply timing of the material.
[Supplementary note 32]
The forming system described in Appendix 31, which supplies the material to the first forming surface and irradiates the energy beam to form the first structural layer, and
The material is locally supplied to the second shaping surface and irradiated with the energy beam to form the second structure layer.
[Supplementary note 33]
The shaping system described in Supplementary Note 32, which supplies the material to the first shaping surface without supplying the material and irradiates the energy beam to form the first structural layer.
[Supplementary note 34]
The shaping system described in Supplementary Note 32 or 33, which supplies the material to the first shaping surface and irradiates the energy beam to form the first structure that has been integrated with the first shaping surface. Floor.
[Supplementary note 35]
The shaping system according to any one of Appendixes 26 to 34, wherein at least a part of the material is used as a shield that shields the energy beam.
[Supplementary note 36]
The shaping system described in any one of Supplementary Notes 26 to 35, wherein the first supply form and the second supply form are set as follows: When the material is supplied in the first supply form, the Energy transferred from the energy beam to the first shaping surface per unit area or unit time, and from the energy per unit area or unit time when the material is supplied in the second supply form The energy transmitted by the light beam to the second shaping surface is different.
[Supplementary note 37]
The shaping system as described in Supplementary Note 36, wherein the first supply form and the second supply form are set as follows: when the material is supplied in the first supply form, in a unit area or a unit time The energy transferred from the energy beam to the first shaping surface becomes smaller than when the material is supplied in the second supply form, the energy beam is applied to the second unit area per unit area or unit time. Shaping surfaces transfer less energy.
[Supplementary note 38]
The shaping system described in any one of Supplementary Notes 1 to 37, further comprising a moving device that causes at least one of the first forming surface, the second forming surface, and an irradiation position of the energy beam. One moves to change the relative positional relationship between at least one of the first shaping surface and the second shaping surface and the irradiation position of the energy beam,
Irradiating the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form the first structure layer,
Irradiating the energy beam and moving at least one of the second shaping surface and the irradiation position of the energy beam in a second movement form different from the first movement form to form the second structure layer .
[Supplementary note 39]
A shaping system includes:
An irradiating device, which irradiates an energy beam on the forming surface;
Supply device, supply material; and
A moving device that moves at least one of the first shaping surface and the irradiation position of the energy beam to change a relative positional relationship between the irradiation position of the energy beam and the shaping surface;
Irradiating the first shaping surface with the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form a first structure layer,
Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structural layer, and causing the second shaping surface and the energy to be in a second moving form different from the first moving form At least one of the irradiation positions of the light beam moves, and a second structure layer is formed on the first structure layer.
[Supplementary note 40]
The shaping system described in Supplementary Note 38 or 39, wherein the moving form includes a moving speed of at least one of the first forming surface, the second forming surface, and an irradiation position of the energy beam.
[Supplementary note 41]
The shaping system described in Supplementary Note 40, which irradiates the energy beam and moves at least one of the first shaping surface and the irradiation position of the energy beam at a first moving speed to form the first structural layer. ,
The second structural layer is formed by irradiating the energy beam and moving at least one of the second shaping surface and the irradiation position of the energy beam at a second moving speed different from the first moving speed.
[Supplementary note 42]
The shaping system as described in Appendix 40, wherein the second moving speed is slower than the first moving speed.
[Supplementary note 43]
The shaping system described in any one of Supplementary Notes 38 to 42, wherein the first moving form and the second moving form are set as follows: when the first forming surface and the irradiation position of the energy beam are The energy transferred from the energy beam to the first shaping surface per unit area or unit time when at least one of the moving in the first moving form, and the second shaping surface and the energy per unit area or unit time When at least one of the irradiation positions of the light beam moves in the second movement form, the energy transmitted from the energy beam to the second shaping surface per unit area or per unit time is different.
[Supplementary note 44]
The shaping system described in Supplementary Note 43, wherein the first moving form and the second moving form are set as follows: when at least one of the first shaping surface and the irradiation position of the energy beam is set as the When the first moving form moves, the energy transferred from the energy beam to the first shaping surface per unit area or unit time becomes at least as large as the irradiation position of the second shaping surface and the energy beam When one moves in the second moving form, less energy is transmitted from the energy beam to the second shaping surface per unit area or per unit time.
[Supplementary note 45]
The forming system according to any one of Supplementary Notes 1 to 44, wherein the first forming surface is irradiated with the energy beam to form a first molten pool, thereby forming the first structural layer, and Two shaped surfaces irradiate the energy beam to form a second melting pool having a size different from that of the first melting pool in at least one of the directions along the surface of the first structure layer, thereby applying The second structure layer is formed on the first structure layer.
[Supplementary note 46]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
Irradiating the energy beam onto the first shaping surface to melt the supplied material to form a first melting pool, thereby forming a first structural layer,
Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structure layer to melt the supplied material, thereby forming a material along the surface of the first structure layer A second molten pool having a size different from that of the first molten pool in at least one of the directions, thereby forming a second structural layer on the first structural layer.
[Supplementary note 47]
The shaping system as described in supplementary note 45 or 46, wherein the size of the second melting pool in the at least one direction is larger than the size of the first melting pool in the at least one direction.
[Supplementary note 48]
The forming system according to any one of Supplementary Notes 45 to 47, wherein when the first structural layer is formed, the first molten pool is moved toward a first direction within the first forming surface,
When forming the second structural layer, moving the second molten pool toward a second direction within the second forming surface,
The first direction and the second direction are parallel to each other, and
The at least one direction intersects the first direction and the second direction.
[Supplementary note 49]
The shaping system according to any one of Supplementary Notes 45 to 48, which irradiates the energy beam having a first beam characteristic to form the first molten pool, and
The energy beam having a second beam characteristic different from the first beam characteristic is irradiated to form the second molten pool.
[Supplementary note 50]
The shaping system described in Appendix 49, wherein the beam characteristic includes an intensity or energy of the energy beam per unit area.
[Supplementary note 51]
The shaping system described in Supplementary Note 50, which irradiates the energy beam having a first intensity or a first energy per unit area to form the first molten pool, and
The second molten pool is formed by irradiating the energy beam having a second intensity different from the first intensity or a second energy different from the first energy per unit area.
[Supplementary note 52]
The shaping system described in Supplementary Note 51, wherein the second intensity per unit area is greater than the first intensity per unit area.
[Supplementary note 53]
The shaping system described in Supplementary Note 51 or 52, wherein the second energy per unit area is greater than the first energy per unit area.
[Supplementary note 54]
The shaping system according to any one of appendixes 49 to 53, wherein the beam characteristic includes a defocus amount of the energy beam.
[Supplementary note 55]
The shaping system described in Supplementary Note 54, which irradiates the energy beam whose defocus amount with respect to the first shaping surface is set to a first set amount to form the first molten pool, and
The second molten pool is formed by irradiating the energy beam whose defocus amount with respect to the second shaping surface is set to a second set amount different from the first set amount.
[Supplementary note 56]
The shaping system described in Supplementary Note 55, wherein the second set amount is smaller than the first set amount.
[Supplementary note 57]
The shaping system according to any one of appendixes 49 to 56, wherein the beam characteristic includes an irradiation time for irradiating the energy beam.
[Supplementary note 58]
The shaping system described in Supplementary Note 57, in which the unit area on the first shaping surface is irradiated with the energy beam only for a first irradiation time, the energy beam is irradiated to form the first melt Pool, and
In a state where a unit area area on the second shaping surface is irradiated with the energy beam only for a second irradiation time different from the first irradiation time, the energy beam is irradiated to form the second molten pool .
[Supplementary note 59]
The shaping system according to Supplementary Note 58, wherein the second irradiation time is longer than the first irradiation time.
[Supplementary note 60]
The forming system according to any one of Supplementary Notes 57 to 59, which irradiates the energy beam intermittently or in a pulse form to form the first molten pool, and
The energy beam is continuously irradiated to form the second molten pool.
[Supplementary note 61]
The shaping system according to any one of Supplementary 49 to Supplementary 60, wherein the first light beam characteristic and the second light beam characteristic are set as follows: the first light beam characteristic is provided per unit area or unit time. The energy transmitted by the energy beam to the first shaping surface is different from the energy transmitted from the energy beam having the second beam characteristic to the second shaping surface per unit area or unit time .
[Supplementary note 62]
The shaping system as described in Appendix 61, wherein the first beam characteristic and the second beam characteristic are set as follows: the energy beam pair having the first beam characteristic per unit area or unit time The energy transferred by the first shaping surface becomes smaller than the energy transferred from the energy beam having the second beam characteristic to the second shaping surface per unit area or unit time.
[Supplementary note 63]
The shaping system according to any one of Supplementary Notes 45 to 62, wherein the supply device supplies the material to an irradiation position of the energy beam.
[Supplementary note 64]
The shaping system according to any one of Supplementary Notes 45 to 63, wherein the irradiation device irradiates the energy beam to the material that has been supplied by the supply device.
[Supplementary note 65]
The forming system according to any one of Supplementary Notes 45 to 64, which irradiates the energy beam and supplies the material in a first supply form to form the first molten pool,
The second molten pool is formed by irradiating the energy beam and supplying the material in a second supply form different from the first supply form.
[Supplementary note 66]
The forming system according to Supplementary Note 65, wherein the supply form includes a supply amount of the material per unit time or per unit area.
[Supplementary note 67]
The shaping system described in Appendix 66, which irradiates the energy beam and supplies the material at a first supply amount per unit time or per unit area to form the first molten pool,
The energy beam is irradiated, and the material is supplied at a second supply amount different from the first supply amount per unit time or per unit area to form the second molten pool.
[Supplementary note 68]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
Irradiating the first shaping surface with the energy beam, and supplying the material at a first supply amount per unit time or per unit area to form a first molten pool, thereby forming a first structural layer,
Irradiating the second beam forming surface that is at least a part of the surface of the first structural layer, and supplying the energy beam at a second supply amount different from the first supply amount per unit time or per unit area. The material forms a second molten pool on the second forming surface, thereby forming a second structural layer on the first structural layer.
[Supplementary note 69]
The shaping system according to Supplementary Note 67 or 68, wherein the second supply amount is smaller than the first supply amount.
[Supplementary note 70]
The forming system according to any one of Supplementary Notes 65 to 69, wherein the supply form includes a supply timing of the material.
[Supplementary note 71]
The forming system according to Supplement 70, which supplies the material to the first forming surface and irradiates the energy beam to form the first molten pool, and
The material is locally supplied to the second shaping surface and irradiated with the energy beam to form the second molten pool.
[Supplementary note 72]
The shaping system described in Supplementary Note 71, which supplies the material to the first shaping surface without supplying the material and irradiates the energy beam to form the first molten pool.
[Supplementary note 73]
The forming system described in Supplementary 71 or 72, which supplies the material to the first forming surface and irradiates the energy beam to form the first molten pool, thereby forming the first molten pool. The first structural layer is integrated on a surface.
[Supplementary note 74]
The shaping system according to any one of Supplementary Notes 65 to 73, wherein at least a part of the material is used as a shield that shields the energy beam.
[Supplementary note 75]
The shaping system described in any one of Supplementary Notes 65 to 74, wherein the first supply form and the second supply form are set as follows: When the material is supplied in the first supply form, the Energy transferred from the energy beam to the first shaping surface per unit area or unit time, and from the energy per unit area or unit time when the material is supplied in the second supply form The energy transmitted by the light beam to the second shaping surface is different.
[Supplementary note 76]
The shaping system described in Supplementary Note 75, wherein the first supply form and the second supply form are set as follows: When the material is supplied in the first supply form, in a unit area or a unit time The energy transferred from the energy beam to the first shaping surface becomes smaller than when the material is supplied in the second supply form, the energy beam is applied to the second unit area per unit area or unit time. Shaping surfaces transfer less energy.
[Supplementary note 77]
The shaping system described in any one of Supplementary Notes 45 to 74, further comprising a moving device that causes at least one of the first forming surface, the second forming surface, and an irradiation position of the energy beam. One moves to change the relative positional relationship between at least one of the first shaping surface and the second shaping surface and the irradiation position of the energy beam,
Irradiating the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form the first molten pool,
Irradiate the energy beam and move at least one of the second shaping surface and the irradiation position of the energy beam in a second movement form different from the first movement form to form the second molten pool .
[Supplementary note 78]
The forming system according to Supplementary Note 77, wherein the moving form includes a moving speed of at least one of the first forming surface, the second forming surface, and an irradiation position of the energy beam.
[Supplementary note 79]
The shaping system described in Supplementary Note 78, which irradiates the energy beam and moves at least one of the first shaping surface and the irradiation position of the energy beam at a first moving speed to form the first molten pool. ,
The second molten pool is formed by irradiating the energy beam and moving at least one of the second shaping surface and the irradiation position of the energy beam at a second moving speed different from the first moving speed.
[Supplementary note 80]
The shaping system described in Appendix 79, wherein the second moving speed is slower than the first moving speed.
[Supplementary note 81]
The forming system described in any one of Supplementary 77 to Supplementary 80, wherein the first moving form and the second moving form are set as follows: when the first forming surface and the irradiation position of the energy beam are The energy transferred from the energy beam to the first shaping surface per unit area or unit time when at least one of the moving in the first moving form, and the second shaping surface and the energy per unit area or unit time When at least one of the irradiation positions of the light beam moves in the second movement form, the energy transmitted from the energy beam to the second shaping surface per unit area or per unit time is different.
[Supplementary Note 82]
The shaping system described in Appendix 81, wherein the first moving form and the second moving form are set as follows: when at least one of the first shaping surface and the irradiation position of the energy beam is set as the When the first moving form moves, the energy transferred from the energy beam to the first shaping surface per unit area or unit time becomes at least as large as the irradiation position of the second shaping surface and the energy beam. When one moves in the second moving form, less energy is transmitted from the energy beam to the first shaping surface per unit area or unit time.
[Supplementary note 83]
The forming system according to any one of Supplementary Notes 1 to 82, wherein at least a part of the surface of the first structural layer that has been formed on the first forming surface is set as a new first forming surface. Forming a new first structure layer on the formed first structure layer, thereby forming a plurality of laminated first structure layers, and
At least a part of a surface of a first structure layer located at the uppermost layer among the plurality of first structure layers is set as the second shaping surface, and the second structure layer is formed on the one first structure layer .
[Supplementary note 84]
The shaping system as described in Supplement 83, wherein the size of the plurality of first structural layers becomes larger in at least one of the directions along the surface of the plurality of first structural layers as they are directed toward the upper layer. Way, forming the plurality of first structural layers.
[Supplementary note 85]
The forming system described in Supplementary Note 83 or 84, which irradiates the first beam forming surface with the energy beam to form a first melting pool, thereby forming the first structural layer, and
The first molten pool is formed such that the size of the first molten pool in a direction along at least one of the directions of the surfaces of the plurality of first structural layers becomes larger as it goes toward the upper layer.
[Supplementary note 86]
The shaping system as described in Supplement 83, wherein the size of the plurality of first structural layers becomes smaller in at least one of the directions along the surface of the plurality of first structural layers as they go toward the upper layer. Way, forming the plurality of first structural layers.
[Supplementary note 87]
The forming system described in Supplementary Note 83 or 86, which irradiates the first beam forming surface with the energy beam to form a first molten pool, thereby forming the first structural layer, and
The first molten pool is formed in such a manner that the size of the first molten pool in a direction along at least one of the directions of the surfaces of the plurality of first structural layers becomes smaller as it goes toward the upper layer.
[Supplementary note 88]
The shaping system according to any one of Supplementary Notes 1 to 87, wherein the resistance of the first structural layer to damage is made lower than the resistance of the second structural layer to damage.
[Supplementary note 89]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
The first forming surface is irradiated with the energy beam to form a first structure layer, and the second forming surface that is at least a part of the surface of the first structure layer is irradiated with the energy beam, and the first structure layer is A second structural layer is formed thereon, and
The resistance of the first structure layer to damage is made lower than the resistance of the second structure layer to damage.
[Supplementary note 90]
The shaping system as described in Supplementary Note 88 or 89, wherein the first structural layer is more brittle than the first structural layer by forming more voids in the first structural layer than in the second structural layer. The two structural layers have high brittleness.
[Supplementary note 91]
The shaping system according to any one of supplementary notes 88 to 90, wherein a first material having a higher brittleness than a second material that is formed as the second structural layer and is supplied as the material is supplied as the material. To form the first structure layer, thereby making the brittleness of the first structure layer higher than that of the second structure layer.
[Supplementary note 92]
The shaping system according to any one of supplementary notes 88 to 91, wherein the first structural layer is formed by irradiating the energy beam having a first beam characteristic, and
The second structure layer is formed by irradiating the energy beam having a second beam characteristic different from the first beam characteristic.
[Supplementary Note 93]
The shaping system described in Supplementary Note 92, wherein the beam characteristic includes an intensity or energy of the energy beam per unit area.
[Supplementary note 94]
The shaping system described in Supplementary Note 93, which irradiates the energy beam having a third intensity or a third energy per unit area to form the first structural layer, and
The second structural layer is formed by irradiating the energy beam having a fourth intensity greater than the third intensity or a fourth energy lower than the third energy per unit area.
[Supplementary note 95]
The shaping system according to any one of appendixes 92 to 94, wherein the first structural layer is formed by irradiating the energy beam having an intensity or energy capable of evaporating the material.
[Supplementary Note 96]
The shaping system according to any one of supplementary notes 88 to 95, which irradiates the energy beam and supplies the material in a third supply form to form the first structural layer,
The second structural layer is formed by irradiating the energy beam and supplying the material in a fourth supply form different from the third supply form.
[Supplementary note 97]
The shaping system according to Appendix 96, wherein the supply form includes a supply amount of the material per unit time or per unit area.
[Supplementary note 98]
The shaping system described in Appendix 97, which irradiates the energy beam and supplies the material at a third supply amount per unit time or per unit area to form the first structural layer,
The energy beam is irradiated and the material is supplied at a fourth supply amount more than the third supply amount per unit time or per unit area to form the second structure layer.
[Supplementary note 99]
The forming system according to any one of Supplementary Notes 1 to 98, which supplies the first material as the material to form the first structural layer,
Supplying a second material as the material to form the second structural layer, and
The bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface.
[Supplementary note 100]
A shaping system includes:
An irradiation device that irradiates an energy beam; and
Supply device
The first shaping surface is irradiated with the energy beam, a first material is supplied as the material to form a first structure layer, and a second shaping surface that is at least a part of a surface of the first structure layer is irradiated with the An energy beam, and a second material is supplied as the material to form a second structure layer on the first structure layer,
The bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface.
[Supplementary note 101]
The shaping system described in Supplementary Note 99 or Supplementary Note 100, wherein the wettability of the first material to the first shaping surface is lower than the wettability of the second material to the first shaping surface.
[Supplementary note 102]
The forming system according to any one of supplementary notes 99 to 100, wherein the object having the first shaping surface on at least a part of the surface includes stainless steel,
The first material includes at least one of aluminum, titanium, copper, and tungsten, and
The second material includes the same material as the object.
[Supplementary note 103]
The forming system according to any one of Supplementary Notes 88 to 102, wherein at least a part of the surface of the first structural layer that has been formed on the first forming surface is set as a new first forming surface. Forming a new first structure layer on the formed first structure layer, thereby forming a plurality of laminated first structure layers, and
At least a part of a surface of a first structure layer located at the uppermost layer among the plurality of first structure layers is set as the second shaping surface, and the second structure layer is formed on the one first structure layer .
[Supplementary Note 104]
A shaping method includes:
Irradiating the first shaping surface with an energy beam to form a first structure layer; and
Irradiating a second shaping surface that is at least a part of a surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and
The energy transferred from the energy beam to the first shaping surface per unit area or unit time is different from the energy transferred from the energy beam to the second shaping surface per unit area or unit time. .
[Supplementary note 105]
The shaping method described in Supplementary Note 104, wherein the energy transferred to the first shaping surface per unit area or unit time is less than the energy transferred to the second shaping surface per unit area or unit time.
[Supplementary note 106]
A shaping method includes:
Irradiating the first shaping surface with an energy beam to form a first structure layer; and
Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structure layer, and forming at least one of directions along the surface of the first structure layer on the first structure layer A second structure layer having a different dimension in the direction from the first structure layer.
[Supplementary note 107]
The forming method described in Supplementary Note 106, wherein the size of the second structure layer is larger than that of the first structure layer in at least one of directions along a surface of the first structure layer.
[Supplementary Note 108]
A shaping method includes:
Irradiating the first forming surface with an energy beam to form a first molten pool, thereby forming a first structural layer; and
The second shaping surface is irradiated with the energy beam to form a second melting pool having a size different from that of the first melting pool in at least one of the directions along the surface of the first structure layer. A second structure layer is formed on the first structure layer.
[Supplementary note 109]
The forming method described in Supplementary Note 108, wherein the second molten pool is larger than the first molten pool.
[Supplementary note 110]
A shaping method includes:
Irradiating the first shaping surface with an energy beam to form a first structure layer; and
Irradiating a second shaping surface that is at least a part of a surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and
The resistance of the first structure layer to damage is made higher than the resistance of the second structure layer to damage.
[Supplementary note 111]
A shaping method includes:
Irradiating the first forming surface with an energy beam and supplying a first material to form a first structural layer; and
Irradiating the second beam forming surface that is at least a part of the surface of the first structure layer, and supplying a second material to form a second structure layer on the first structure layer; and
The bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface.
[Supplementary note 112]
The forming method described in any one of Supplementary Notes 104 to 111 further includes separating the second structural layer from the first forming surface.
[Supplementary note 113]
The forming method described in Supplementary Note 112, wherein separating the second structure layer includes separating the first structure layer by damaging the first structure layer or separating the first structure layer from the first forming surface. The two structural layers are separated from the first forming surface.
[Supplementary Note 114]
A shaping method includes:
Supplying material to at least the first forming surface and the second forming surface;
Irradiating the first shaping surface with the energy beam having a first beam characteristic, thereby melting the supplied material to form a first structural layer; and
Irradiating the second shaping surface that is at least a part of the surface of the first structural layer with the energy beam having a second beam characteristic different from the first beam characteristic, thereby causing the supplied The material is melted to form a second structure layer on the first structure layer.
[Supplementary note 115]
A shaping method includes:
Supplying material to at least the first forming surface and the second forming surface;
Irradiating the first shaping surface with the energy beam and supplying the material in a first supply form to form a first structure layer; and
Irradiating the energy beam onto the second shaping surface that is at least a part of the surface of the first structure layer, and supplying the material in a second supply form different from the first supply form, A second structure layer is formed on a structure layer.
[Supplementary note 116]
A shaping method includes:
Irradiating an energy beam on the forming surface;
Supply materials
Moving at least one of the first shaping surface and the irradiation position of the energy beam to change the relative positional relationship between the irradiation position of the energy beam and the shaping surface;
Irradiating the first shaping surface with the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form a first structure layer; and
Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structural layer, and causing the second shaping surface and the energy to be in a second moving form different from the first moving form At least one of the irradiation positions of the light beam moves, and a second structure layer is formed on the first structure layer.
[Supplementary note 117]
A shaping method includes:
Irradiate energy beam
Supply materials
Irradiating the first forming surface with the energy beam and supplying the material at a first supply amount per unit time or per unit area to form a first molten pool, thereby forming a first structural layer; and
Irradiating the second beam forming surface that is at least a part of the surface of the first structural layer, and supplying the energy beam at a second supply amount different from the first supply amount per unit time or per unit area. The material forms a second molten pool on the second forming surface, thereby forming a second structural layer on the first structural layer.
[Supplementary Note 118]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device performs the following by the shaping system Control the way of processing:
A process of irradiating the first shaping surface with the energy beam to form a first structure layer; and
A process of irradiating the second shaping surface that is at least a part of the surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and
In the control, the energy transferred from the energy beam to the first shaping surface per unit area or unit time is controlled to the second shaping surface from the energy beam to the second unit area or unit time. Shaped surfaces transfer different energies.
[Supplementary note 119]
A control device is a control device for controlling a shaping system. The shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material. Control the way of processing:
A process of irradiating the first shaping surface with the energy beam to form a first structure layer; and
A process of irradiating the second beam forming surface that is at least a part of the surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer, the second structure layer A dimension in at least one of the directions of the surface of the first structure layer is different from that of the first structure layer.
[Supplementary note 120]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
Processing of at least a first forming surface and a second forming surface; and
A process of irradiating the first shaping surface with the energy beam having a first beam characteristic, thereby melting the supplied material to form a first structural layer; and
In the controlling, the second shaping surface, which is at least a part of the surface of the first structural layer, is irradiated with the energy beam having a second beam characteristic different from the first beam characteristic, whereby The supplied material is melted to form a second structure layer on the first structure layer.
[Supplementary note 121]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
Processing of at least the first forming surface and the second forming surface;
A process of irradiating the first shaping surface with the energy beam and supplying the material in a first supply form to form a first structure layer; and
Irradiating the energy beam onto the second shaping surface that is at least a part of the surface of the first structure layer, and supplying the material in a second supply form different from the first supply form, A process of forming a second structure layer on a structure layer.
[Supplementary note 122]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
A process of irradiating the forming surface with the energy beam;
Handling of supplied materials;
A process of moving at least one of the first shaping surface and the irradiation position of the energy beam to change a relative positional relationship between the irradiation position of the energy beam and the shaping surface;
A process of irradiating the first shaping surface with the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form a first structure layer; and
Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structural layer, and causing the second shaping surface and the energy to be in a second moving form different from the first moving form A process of forming at least one of the irradiation positions of the light beam to form a second structure layer on the first structure layer.
[Supplementary note 123]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
A process of irradiating the first shaping surface with the energy beam to form a first molten pool, thereby forming a first structural layer; and
The second shaping surface is irradiated with the energy beam to form a second melting pool having a size different from that of the first melting pool in at least one of the directions along the surface of the first structure layer. A process of forming a second structure layer on the first structure layer.
[Supplementary note 124]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
A process of irradiating the first forming surface with the energy beam and supplying the material at a first supply amount per unit time or per unit area to form a first molten pool, thereby forming a first structural layer; and
Irradiating the second beam forming surface that is at least a part of the surface of the first structural layer, and supplying the energy beam at a second supply amount different from the first supply amount per unit time or per unit area. Material to form a second molten pool on the second forming surface, thereby forming a second structural layer on the first structural layer.
[Supplementary note 125]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
A process of irradiating the first shaping surface with the energy beam to form a first structure layer; and
A process of irradiating the second shaping surface that is at least a part of the surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and
The resistance of the first structure layer to damage is made higher than the resistance of the second structure layer to damage.
[Supplementary note 126]
A control device is a control device for controlling a shaping system, the shaping system includes an irradiation device for irradiating an energy beam, and a supply device for supplying a material, and the control device executes the following by the shaping system Control the way of processing:
A process of irradiating the first shaping surface with the energy beam and supplying a first material to form a first structural layer; and
A process of irradiating the second shaping surface that is at least a part of the surface of the first structure layer with the energy beam and supplying a second material to form a second structure layer on the first structure layer; and
The bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface.
[Supplementary note 127]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the first shaping surface with the energy beam to form a first structure layer;
A process of irradiating a second shaping surface that is at least a part of a surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and
In the control, the energy transferred from the energy beam to the first shaping surface per unit area or unit time is controlled to the second shaping surface from the energy beam to the second unit area or unit time. Different processing of the energy transferred by the shaping surface.
[Supplementary note 128]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the first shaping surface with the energy beam to form a first structure layer; and
A process of irradiating the second beam forming surface that is at least a part of the surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer, the second structure layer A dimension in at least one of the directions of the surface of the first structure layer is different from that of the first structure layer.
[Supplementary note 129]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
Processing of at least the first forming surface and the second forming surface;
A process of irradiating the first shaping surface with the energy beam having a first beam characteristic, thereby melting the supplied material to form a first structural layer; and
In the controlling, the second shaping surface, which is at least a part of the surface of the first structural layer, is irradiated with the energy beam having a second beam characteristic different from the first beam characteristic, whereby A process in which the supplied material is melted to form a second structure layer on the first structure layer.
[Supplementary note 130]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
Processing of at least the first forming surface and the second forming surface;
A process of irradiating the first shaping surface with the energy beam and supplying the material in a first supply form to form a first structure layer; and
Irradiating the energy beam onto the second shaping surface that is at least a part of the surface of the first structure layer, and supplying the material in a second supply form different from the first supply form, A process of forming a second structure layer on a structure layer.
[Supplementary note 131]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the forming surface with the energy beam;
Handling of supplied materials;
A process of moving at least one of the first shaping surface and the irradiation position of the energy beam to change a relative positional relationship between the irradiation position of the energy beam and the shaping surface;
A process of irradiating the first shaping surface with the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form a first structure layer; and
Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structural layer, and causing the second shaping surface and the energy to be in a second moving form different from the first moving form A process of forming at least one of the irradiation positions of the light beam to form a second structure layer on the first structure layer.
[Supplementary note 132]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the first shaping surface with the energy beam to form a first molten pool, thereby forming a first structural layer; and
The second shaping surface is irradiated with the energy beam to form a second melting pool having a size different from that of the first melting pool in at least one of the directions along the surface of the first structure layer. A process of forming a second structure layer on the first structure layer.
[Supplementary note 133]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the first forming surface with the energy beam and supplying the material at a first supply amount per unit time or per unit area to form a first molten pool, thereby forming a first structural layer; and
Irradiating the second beam forming surface that is at least a part of the surface of the first structural layer, and supplying the energy beam at a second supply amount different from the first supply amount per unit time or per unit area. Material to form a second molten pool on the second forming surface, thereby forming a second structural layer on the first structural layer.
[Supplementary note 134]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the first shaping surface with the energy beam to form a first structure layer;
A process of irradiating a second shaping surface that is at least a part of a surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and
A treatment for making the first structure layer more resistant to damage than the second structure layer being resistant to damage.
[Supplementary note 135]
A program is a program executed by a computer that controls a shaping system, the shaping system includes an irradiation device that irradiates an energy beam, and a supply device that supplies materials, and the program causes the computer to perform the following processing:
A process of irradiating the first shaping surface with the energy beam and supplying a first material to form a first structural layer; and
A process of irradiating the second shaping surface that is at least a part of the surface of the first structure layer with the energy beam and supplying a second material to form a second structure layer on the first structure layer; and
The bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface.
[Supplementary note 136]
A recording medium having recorded thereon a computer program as described in any one of Appendixes 127 to 135.

At least a part of the constituent elements of the respective embodiments may be appropriately combined with at least another part of the constituent elements of the respective embodiments. It is not necessary to use a part of the constituent elements of each of the embodiments described above. In addition, as long as permitted by law, all publications and U.S. patents cited in the above-mentioned embodiments are cited as a part of the description herein.

The present invention is not limited to the embodiments described above, and may be appropriately modified within a range that does not violate the spirit or idea of the invention that can be appreciated from the scope of the patent application and the entire specification. The shaping system, shaping method, control device, Computer programs and recording media are also included in the technical scope of the present invention.

1‧‧‧Shaping System

11‧‧‧Shaping head

12‧‧‧Shaping head drive system

13‧‧‧platform

14‧‧‧Control device

111‧‧‧ irradiation system

112‧‧‧Material Nozzle

113‧‧‧ Injection Department

114‧‧‧Supply export

EA‧‧‧ Irradiated area

EL‧‧‧Light

FP‧‧‧Focus position

M‧‧‧Shaping Materials

MA‧‧‧ Supply Area

MP‧‧‧ Molten Pool

MS‧‧‧Shaping Surface

R1‧‧‧first size

R2‧‧‧Second size

SL, SL # 1 ～ SL # 10, SL_lowest, SL_lower, SL_upper, SL_upper1, SL_upper2, SL_upper ', SL_upper' ', SL_exist‧‧‧ Structure layer

ST‧‧‧Three-dimensional structure

ST1, ST2, ST3, ST4‧‧‧wall-like structures

W‧‧‧ Workpiece

WS‧‧‧ surface

X, Y, Z‧‧‧ directions

FIG. 1 is a cross-sectional view showing a configuration of a forming system according to the present embodiment.

Each of FIGS. 2 (a) to 2 (c) is a cross-sectional view showing a state where light is irradiated to a certain area on a workpiece and a molding material is supplied.

Each of FIGS. 3 (a), 3 (c), and 3 (e) is a cross-sectional view showing a process of forming a three-dimensional structure. FIGS. 3 (b), 3 (d), and 3 (f) Each figure is a plan view showing a process of forming a three-dimensional structure.

FIG. 4 (a) is a plan view showing a molten pool used to form a lowermost structural layer, and FIG. 4 (b) is a plan view showing a molten pool used to form a structural layer other than the lowermost structural layer.

FIG. 5 is a graph showing the intensity of light for forming the lowermost structural layer and the intensity of light for other structural layers other than the lowermost structural layer.

FIG. 6 (a) is a cross-sectional view showing the amount of defocus of light used to form the lowermost structural layer, and FIG. 6 (b) is a diagram showing the defocus of light of other structural layers other than the lowermost structural layer. Fig. 6 (c) is a graph showing the intensity distribution of light on the forming surface for forming the lowermost structural layer, and Fig. 6 (d) is a diagram showing the other than the lowermost structural layer. Graph of the intensity distribution of light on the forming surface of other structural layers.

FIG. 7 (a) is a timing chart showing the irradiation time of light for forming the lowermost structural layer, and FIG. 7 (b) is a diagram showing the irradiation time of light for other structural layers other than the lowermost structural layer. Timing diagram.

FIG. 8 (a) is a timing chart showing the irradiation time of light for forming the lowermost structural layer, and FIG. 8 (b) is a diagram showing the irradiation time of light for other structural layers other than the lowermost structural layer. Timing diagram.

FIG. 9 (a) is a graph showing the supply amount of the molding material when forming the lowest structural layer and the supply amount of the molding material when forming a structural layer other than the lowest structural layer. FIG. 9 (b) A cross-sectional view of the forming material supplied when the lowermost structural layer is formed is shown on the surface. FIG. 9 (c) is a cross-sectional view of the forming material supplied when the other structural layers other than the lowermost structural layer are formed on the forming surface. .

Each of FIGS. 10 (a) and 10 (b) is a cross-sectional view showing a case where the lowermost structural layer is formed, and each of FIGS. 10 (c) and 10 (d) is a diagram showing the lowermost structural layer. A cross-sectional view of a case other than a structural layer.

FIG. 11 is a graph showing the moving speed of the forming head when forming the lowermost structural layer and the moving speed of the forming head when forming other structural layers other than the lowermost structural layer.

12 (a) to 12 (f) are cross-sectional views showing one step of a first characteristic changing operation for changing the size of a structural layer by changing the size of a molten pool.

13 (a) to 13 (f) are cross-sectional views showing one step of a first characteristic changing operation of changing the size of the structural layer by changing the size of the molten pool.

14 (a) is a cross-sectional view showing a three-dimensional structure formed by a second forming operation including a first characteristic changing operation, and FIG. 14 (b) is a three-dimensional structure formed by a forming operation of a first comparative example 14 (c) and 14 (d) are cross-sectional views showing a case where a three-dimensional structure formed by a second shaping operation including a first characteristic changing operation is separated from the workpiece W Illustration.

FIG. 15 (a) is a plan view showing a three-dimensional structure formed by a second shaping operation including a first characteristic changing operation, and each of FIGS. 15 (b) and 15 (c) is a view showing that A cross-sectional view of a three-dimensional structure formed by the second shaping operation of the characteristic changing operation.

FIG. 16 is a graph showing the intensity of light for forming the lowermost structural layer and the intensity of light for other structural layers other than the lowermost structural layer.

FIG. 17 is a graph showing a supply amount of a molding material when a lowermost structural layer is formed, and a supply amount of a molding material when a structural layer other than the lowermost structural layer is formed.

FIG. 18 (a) is a plan view showing a three-dimensional structure formed by a second shaping operation including a second characteristic changing operation, and FIG. 18 (b) is a diagram showing a second shaping operation including a second characteristic changing operation A sectional view of a case where the formed three-dimensional structure is separated from a workpiece.

FIG. 19 (a) is a cross-sectional view showing the wettability of a forming material used to form the lowermost structural layer, and FIG. 19 (b) is a drawing showing a forming material of other structural layers other than the lowermost structural layer Wetting profile.

FIG. 20 (a) is a plan view showing a three-dimensional structure formed by a second shaping operation including a third characteristic changing operation, and FIG. 20 (b) is a diagram showing a second shaping operation including a third characteristic changing operation A sectional view of a case where the formed three-dimensional structure is separated from a workpiece.

21 is a cross-sectional view showing a three-dimensional structure according to a first modification.

22 (a) to 22 (d) are cross-sectional views showing a three-dimensional structure according to a second modification.

23 (a) to 23 (c) are cross-sectional views showing a three-dimensional structure according to a third modification.

Each of FIGS. 24 (a) to 24 (c) is a cross-sectional view showing a three-dimensional structure according to a fourth modification.

Claims (71)

A shaping system includes: An irradiation device that irradiates an energy beam; and Supply device The first shaping surface is irradiated with the energy beam, thereby melting the supplied material to form a first structural layer, and irradiating a second shaping surface that is at least a part of a surface of the first structural layer. The energy beam, thereby melting the supplied material to form a second structure layer on the first structure layer, and The energy transferred from the energy beam to the first shaping surface per unit area or unit time is different from the energy transferred from the energy beam to the second shaping surface per unit area or unit time. The shaping system according to item 1 of the patent application scope, wherein The energy transferred from the energy beam to the first shaping surface per unit area or unit time is less than the energy transferred from the energy beam to the second shaping surface per unit area or unit time. . The shaping system as described in claim 1 or 2, The size of the second structure layer in at least one of the directions along the surface of the first structure layer is different from the size of the first structure layer in the at least one direction. The shaping system according to any one of claims 1 to 3, wherein The size of the second structure layer in at least one of the directions along the surface of the first structure layer is larger than the size of the first structure layer in the at least one direction. A shaping system includes: An irradiation device that irradiates an energy beam; and Supply device The first shaping surface is irradiated with the energy beam, thereby melting the supplied material to form a first structural layer, and irradiating a second shaping surface that is at least a part of a surface of the first structural layer. The energy beam, thereby melting the supplied material, and forming a second structure layer on the first structure layer, the second structure layer along a surface of the first structure layer A dimension in at least one of the directions is different from the first structure layer. The shaping system according to item 5 of the patent application scope, wherein In at least one of the directions along the surface of the first structure layer, the size of the second structure layer is larger than that of the first structure layer. The shaping system according to any one of claims 3 to 6 in the scope of patent application, wherein The first structure layer and the second structure layer have a shape extending toward a direction intersecting the at least one direction within a surface of the first structure layer. The shaping system according to any one of claims 1 to 7, wherein In a direction from the first structure layer toward the second structure layer, a size of the first structure layer and a size of the second structure layer are different from each other. The shaping system according to any one of claims 1 to 8 of the scope of patent application, which irradiates the energy beam having a first beam characteristic to form the first structure layer, and The second structure layer is formed by irradiating the energy beam having a second beam characteristic different from the first beam characteristic. A shaping system includes: An irradiation device that irradiates an energy beam; and Supply device Irradiating the first shaping surface with the energy beam having a first beam characteristic, thereby melting the supplied material to form a first structural layer, and Irradiating the second shaping surface, which is at least a part of the surface of the first structural layer, with the energy beam having a second beam characteristic different from the first beam characteristic, thereby causing the supplied material The second structure layer is formed on the first structure layer by melting. The shaping system as described in claim 9 or 10, The beam characteristic includes the intensity or energy of the energy beam per unit area. The shaping system according to item 11 of the scope of patent application, wherein the shaping beam is irradiated with the energy beam having a first intensity or a first energy per unit area to form the first structure layer, and The second structure layer is formed by irradiating the energy beam having a second intensity different from the first intensity or a second energy different from the first energy per unit area. The shaping system according to item 12 of the patent application scope, wherein The second intensity is greater than the first intensity per unit area. The shaping system as described in claim 12 or 13, The second energy is greater than the first energy per unit area. The shaping system according to any one of claims 9 to 14, in which: The beam characteristic includes a defocus amount of the energy beam. The shaping system according to any one of claims 9 to 15 in the scope of patent application, which irradiates the energy beam whose defocus amount with respect to the first shaping surface is set to a first set amount to form the energy beam. Mentioned first structural layer, and The second structural layer is formed by irradiating the energy beam with a defocus amount set to a second set amount different from the first set amount with respect to the second shaping surface. The shaping system according to item 16 of the patent application scope, wherein The second set amount is smaller than the first set amount. The shaping system according to any one of claims 9 to 17, wherein The beam characteristic includes an irradiation time for irradiating the energy beam. The shaping system according to item 18 of the scope of application for a patent, wherein the unit area on the first shaping surface is irradiated with the energy beam only for a first irradiation time to form the energy beam. Mentioned first structural layer, and The second structure layer is formed by irradiating the energy beam in a state where the unit area on the second shaping surface is irradiated with the energy beam only for a second irradiation time different from the first irradiation time. . The shaping system according to item 19 of the scope of patent application, wherein the second irradiation time is longer than the first irradiation time. The shaping system according to any one of claims 18 to 20 in the scope of the patent application, which irradiates the energy beam intermittently or pulsed to form the first structure layer, The energy beam is continuously irradiated to form the second structure layer. The shaping system according to any one of claims 9 to 21 in the scope of patent application, wherein The first beam characteristic and the second beam characteristic are set as follows: the energy transferred from the energy beam having the first beam characteristic to the first shaping surface per unit area or unit time, It is different from the energy transmitted from the energy beam having the second beam characteristic to the second shaping surface per unit area or unit time. The shaping system as described in claim 22, wherein The first beam characteristic and the second beam characteristic are set in such a manner that the energy transferred from the energy beam having the first beam characteristic to the first shaping surface per unit area or unit time is changed. The energy transferred to the second shaping surface from the energy beam having the second beam characteristic per unit area or unit time is less. The shaping system according to any one of claims 1 to 23, wherein The supply device supplies a material to an irradiation position of the energy beam. The shaping system according to any one of claims 1 to 24, wherein The irradiation device irradiates the energy beam with the material that has been supplied by the supply device. The shaping system according to any one of claims 1 to 25 in the scope of patent application, which irradiates the energy beam and supplies the material in a first supply form to form the first structural layer, The second structural layer is formed by irradiating the energy beam and supplying the material in a second supply form different from the first supply form. A shaping system includes: An irradiation device that irradiates an energy beam; and Supply device Irradiating the first shaping surface with the energy beam, and supplying the material in a first supply form to form a first structural layer, Irradiating the energy beam onto a second shaping surface that is at least a part of the surface of the first structure layer, and supplying the material in a second supply form different from the first supply form to the first structure A second structural layer is formed on the layer. The shaping system as described in claim 26 or 27, The supply form includes a supply amount of the material per unit time or per unit area. The shaping system according to item 26 or 27 of the scope of patent application, which irradiates the energy beam and supplies the material at a first supply amount per unit time or per unit area to form the first structure layer. , The energy beam is irradiated and the material is supplied at a second supply amount different from the first supply amount per unit time or per unit area to form the second structure layer. The shaping system as described in claim 29, wherein The second supply amount is smaller than the first supply amount. The shaping system according to any one of claims 26 to 29, wherein The supply form includes a supply timing of the material. The shaping system according to item 31 of the scope of patent application, which supplies the material to the first shaping surface and irradiates the energy beam to form the first structure layer, and The material is locally supplied to the second shaping surface and irradiated with the energy beam to form the second structure layer. According to the forming system according to item 32 of the scope of application for a patent, after the material is supplied to the first forming surface, the energy beam is irradiated without supplying the material to form the first structural layer. The forming system according to item 32 or 33 of the scope of application for a patent, which supplies the material to the first forming surface and irradiates the energy beam to form a unit integrated with the first forming surface. The first structural layer is described. The shaping system according to any one of claims 26 to 34 in the scope of patent application, which uses at least a part of the material as a shield to shield the energy beam. The shaping system according to any one of claims 26 to 35 in the scope of patent application, wherein The first supply form and the second supply form are set in such a manner that, when the material is supplied in the first supply form, the first beam form is applied to the first beam from the energy beam per unit area or unit time. The energy transferred by the shaping surface is different from the energy transferred from the energy beam to the second shaping surface per unit area or unit time when the material is supplied in the second supply form. The shaping system as described in claim 36, wherein The first supply form and the second supply form are set as follows: when the material is supplied in the first supply form, the first beam form The energy transferred by the shaping surface becomes less than the energy transferred from the energy beam to the second shaping surface per unit area or unit time when the material is supplied in the second supply form. The shaping system according to any one of claims 1 to 37 in the scope of the patent application, further comprising a moving device, which moves the first shaping surface, the second shaping surface, and the energy beam. Moving at least one of the irradiation positions to change the relative positional relationship between at least one of the first shaping surface and the second shaping surface and the irradiation position of the energy beam, Irradiating the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form the first structure layer, Irradiating the energy beam and moving at least one of the second shaping surface and the irradiation position of the energy beam in a second movement form different from the first movement form to form the second structure layer . A shaping system includes: An irradiating device, which irradiates an energy beam on the forming surface; Supply device, supply material; and A moving device that moves at least one of the shaping surface and the irradiation position of the energy beam to change a relative positional relationship between the irradiation position of the energy beam and the shaping surface; Irradiating the first shaping surface with the energy beam, and moving at least one of the first shaping surface and the irradiation position of the energy beam in a first moving form to form a first structure layer, Irradiating the energy beam onto a second shaping surface that is at least a part of a surface of the first structural layer, and causing the second shaping surface and the energy to be in a second moving form different from the first moving form At least one of the irradiation positions of the light beam moves, and a second structure layer is formed on the first structure layer. The shaping system as described in claim 38 or 39, The moving form includes a moving speed of at least one of the first forming surface, the second forming surface, and an irradiation position of the energy beam. The shaping system according to item 40 of the patent application scope, wherein the energy beam is irradiated, and at least one of the first shaping surface and the irradiation position of the energy beam is moved at a first moving speed to form the First structural layer, The second structural layer is formed by irradiating the energy beam and moving at least one of the second shaping surface and the irradiation position of the energy beam at a second moving speed different from the first moving speed. The shaping system according to item 41 of the patent application scope, wherein The second moving speed is slower than the first moving speed. The shaping system according to any one of claims 38 to 42 in the scope of patent application, wherein The first movement form and the second movement form are set as follows: when at least one of the first shaping surface and the irradiation position of the energy beam moves in the first movement form, Area or energy transferred from the energy beam to the first shaping surface per unit time, and when at least one of the second shaping surface and the irradiation position of the energy beam moves in the second moving form The energy transmitted from the energy beam to the second shaping surface per unit area or unit time is different. The shaping system according to item 43 of the patent application scope, wherein The first movement form and the second movement form are set as follows: when at least one of the first shaping surface and the irradiation position of the energy beam moves in the first movement form, The area or the energy transferred from the energy beam to the first shaping surface per unit time becomes more moved in at least one of the second shaping surface and the irradiation position of the energy beam in the second moving form. , The energy transferred from the energy beam to the second shaping surface per unit area or unit time is small. According to the forming system according to any one of the scope of claims 1 to 44, the first forming surface is irradiated with the energy beam to form a first melting pool, thereby forming the first structural layer. Irradiating the energy beam onto the second shaping surface to form a second melting pool having a size different from that of the first melting pool in at least one of the directions along the surface of the first structural layer, Thereby, the second structure layer is formed on the first structure layer. A shaping system includes: An irradiation device that irradiates an energy beam; and Supply device Irradiating the energy beam onto the first shaping surface to melt the supplied material to form a first melting pool, thereby forming a first structural layer, Irradiating the energy beam onto a second shaping surface that is at least a part of the surface of the first structural layer to melt the supplied material, thereby forming a A second molten pool having a size different from that of the first molten pool in at least one of the directions, thereby forming a second structural layer on the first structural layer. The shaping system as described in claim 45 or 46, The size of the second melting pool in the at least one direction is larger than the size of the first melting pool in the at least one direction. The shaping system according to any one of claims 45 to 47, wherein When forming the first structural layer, moving the first molten pool toward a first direction in the first forming surface, When forming the second structural layer, moving the second molten pool toward a second direction within the second forming surface, The first direction and the second direction are parallel to each other, and The at least one direction intersects the first direction and the second direction. The shaping system according to any one of claims 45 to 48 in the scope of patent application, which irradiates the energy beam having a first beam characteristic to form the first molten pool, and The energy beam having a second beam characteristic different from the first beam characteristic is irradiated to form the second molten pool. The shaping system as described in claim 49, wherein The beam characteristic includes the intensity or energy of the energy beam per unit area. The shaping system according to item 50 of the scope of patent application, which irradiates the energy beam having a first intensity or a first energy per unit area to form the first molten pool, and The second molten pool is formed by irradiating the energy beam having a second intensity different from the first intensity or a second energy different from the first energy per unit area. The shaping system according to item 51 of the scope of patent application, wherein The second intensity per unit area is greater than the first intensity per unit area. The shaping system as described in claim 51 or 52, The second energy per unit area is greater than the first energy per unit area. The shaping system according to any one of claims 49 to 53 in the scope of patent application, wherein The beam characteristic includes a defocus amount of the energy beam. The shaping system according to item 54 of the scope of the patent application, which irradiates the energy beam whose defocus amount with respect to the first shaping surface is set to a first set amount to form the first molten pool, and The second molten pool is formed by irradiating the energy beam whose defocus amount with respect to the second shaping surface is set to a second set amount different from the first set amount. The shaping system as described in claim 55, wherein The second set amount is smaller than the first set amount. The shaping system according to any one of claims 49 to 56 in the scope of patent application, wherein The beam characteristic includes an irradiation time for irradiating the energy beam. The shaping system according to item 57 of the scope of patent application, in a state in which a unit area on the first shaping surface is irradiated with only the energy beam for a first irradiation time, irradiating the energy beam to form Mentioned first molten pool, and In a state where a unit area area on the second shaping surface is irradiated with the energy beam only for a second irradiation time different from the first irradiation time, the energy beam is irradiated to form the second molten pool. . The shaping system according to item 58 of the patent application, wherein The second irradiation time is longer than the first irradiation time. The shaping system according to any one of claims 57 to 59 in the scope of the patent application, which irradiates the energy beam intermittently or in pulses to form the first molten pool, and The energy beam is continuously irradiated to form the second molten pool. The shaping system according to any one of claims 49 to 60, wherein The first beam characteristic and the second beam characteristic are set as follows: the energy transferred from the energy beam having the first beam characteristic to the first shaping surface per unit area or unit time, It is different from the energy transmitted from the energy beam having the second beam characteristic to the second shaping surface per unit area or unit time. The shaping system according to item 61 of the patent application, wherein The first beam characteristic and the second beam characteristic are set in such a manner that the energy transferred from the energy beam having the first beam characteristic to the first shaping surface per unit area or unit time is changed. The energy transferred to the second shaping surface from the energy beam having the second beam characteristic per unit area or unit time is less. The shaping system according to any one of claims 45 to 62 in the scope of patent application, wherein The supply device supplies the material to an irradiation position of the energy beam. The shaping system according to any one of claims 45 to 63, wherein The irradiation device irradiates the energy beam with the material that has been supplied by the supply device. The shaping system according to any one of claims 45 to 64, Irradiating the energy beam and supplying the material in a first supply form to form the first molten pool, The second molten pool is formed by irradiating the energy beam and supplying the material in a second supply form different from the first supply form. The shaping system as described in claim 65, wherein The supply form includes a supply amount of the material per unit time or per unit area. The shaping system according to item 66 of the scope of patent application, which irradiates the energy beam and supplies the material at a first supply amount per unit time or per unit area to form the first molten pool, The energy beam is irradiated, and the material is supplied at a second supply amount different from the first supply amount per unit time or per unit area to form the second molten pool. A shaping method includes: Irradiating the first shaping surface with an energy beam to form a first structure layer; and Irradiating a second shaping surface that is at least a part of a surface of the first structure layer with the energy beam to form a second structure layer on the first structure layer; and The resistance of the first structure layer to damage is made higher than the resistance of the second structure layer to damage. A shaping method includes: Irradiating the first forming surface with an energy beam and supplying a first material to form a first structural layer; and Irradiating the second beam forming surface that is at least a part of the surface of the first structure layer, and supplying a second material to form a second structure layer on the first structure layer; and The bonding force between the first material and the first shaping surface is weaker than the bonding force between the second material and the first shaping surface. The forming method according to item 68 or item 69 of the scope of patent application, further comprising separating the second structural layer from the first forming surface. The forming method according to the scope of application for patent 70, wherein Separating the second structure layer includes separating the second structure layer from the first shaping surface by damaging the first structure layer or separating the first structure layer from the first shaping surface. separate.