TW201945822A - Laser projection module, depth camera and electronic device - Google Patents

Laser projection module, depth camera and electronic device Download PDF

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Publication number
TW201945822A
TW201945822A TW108106938A TW108106938A TW201945822A TW 201945822 A TW201945822 A TW 201945822A TW 108106938 A TW108106938 A TW 108106938A TW 108106938 A TW108106938 A TW 108106938A TW 201945822 A TW201945822 A TW 201945822A
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Taiwan
Prior art keywords
laser
projection module
laser projection
collimating
transmitter
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TW108106938A
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Chinese (zh)
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TWI697729B (en
Inventor
白劍
唐城
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大陸商Oppo廣東移動通信有限公司
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Priority claimed from CN201810164305.4A external-priority patent/CN108388072B/en
Priority claimed from CN201810201629.0A external-priority patent/CN108490630B/en
Application filed by 大陸商Oppo廣東移動通信有限公司 filed Critical 大陸商Oppo廣東移動通信有限公司
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Publication of TWI697729B publication Critical patent/TWI697729B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/48Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus
    • G03B17/54Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus with projector
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4205Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive optical element [DOE] contributing to image formation, e.g. whereby modulation transfer function MTF or optical aberrations are relevant
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • G03B21/2006Lamp housings characterised by the light source
    • G03B21/2033LED or laser light sources
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • G03B21/206Control of light source other than position or intensity
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00Projectors or projection-type viewers; Accessories therefor
    • G03B21/14Details
    • G03B21/20Lamp housings
    • G03B21/208Homogenising, shaping of the illumination light
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50Constructional details
    • H04N23/55Optical parts specially adapted for electronic image sensors; Mounting thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00Special procedures for taking photographs; Apparatus therefor
    • G03B15/02Illuminating scene

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Semiconductor Lasers (AREA)
  • Measurement Of Optical Distance (AREA)
  • Projection Apparatus (AREA)

Abstract

The present disclosure discloses a laser projection module, a depth camera and an electronic device. The laser projection module includes a laser emitter, a collimating element, a diffractive element, a detecting element, and a processor. The laser emitter is configured for emitting laser. The collimating element is configured for collimating the laser. The diffractive element is configured for diffracting the laser collimated by the collimating element, thereby forming a laser pattern. The detecting element is disposed on the collimating element, and/or the detecting element is disposed on the diffractive element. The detecting element is configured for outputting an electrical signal. The processor is connected to the detecting element. The processor is configured to receive the electrical signal, and detect whether the collimating element is abnormal, and/or detect whether the diffractive element is abnormal, according to the electrical signal.

Description

鐳射投射模組、深度相機和電子裝置Laser projection module, depth camera and electronic device

本發明涉及光學及電子技術領域,更具體而言,涉及一種鐳射投射模組、深度相機和電子裝置。The present invention relates to the field of optical and electronic technologies, and more particularly, to a laser projection module, a depth camera, and an electronic device.

多數手機配置有鐳射投射模組。鐳射投射模組包括鐳射發射器、準直元件和繞射元件。繞射元件置於準直元件上方。當手機意外摔落時,準直元件和繞射元件可能會脫落和/或破裂。Most mobile phones are equipped with a laser projection module. The laser projection module includes a laser emitter, a collimating element, and a diffractive element. The diffractive element is placed above the collimating element. When the phone is accidentally dropped, the collimating element and the diffractive element may fall off and / or crack.

本發明的實施例提供了一種鐳射投射模組、深度相機和電子裝置。Embodiments of the present invention provide a laser projection module, a depth camera, and an electronic device.

本發明實施方式的鐳射投射模組包括鐳射發射器、準直元件、繞射元件、檢測元件和處理器。所述鐳射發射器用於發射鐳射。所述準直元件用於準直所述鐳射。所述繞射元件用於繞射經所述準直元件準直後的所述鐳射以形成鐳射圖案。所述檢測元件設置在所述準直元件和/或所述繞射元件上,所述檢測元件用於輸出電訊號。所述處理器與所述檢測元件連接,所述處理器用於接收所述電訊號、並根據所述電訊號檢測所述準直元件和/或所述繞射元件是否異常。A laser projection module according to an embodiment of the present invention includes a laser emitter, a collimating element, a diffractive element, a detecting element, and a processor. The laser emitter is used to emit laser light. The collimating element is used for collimating the laser. The diffractive element is used to diffract the laser beam collimated by the collimating element to form a laser pattern. The detecting element is disposed on the collimating element and / or the diffractive element, and the detecting element is used for outputting an electric signal. The processor is connected to the detection element, and the processor is configured to receive the electrical signal and detect whether the collimation element and / or the diffractive element is abnormal according to the electrical signal.

本發明實施方式的深度相機包括上述的鐳射投射模組、圖像採集器和處理器。所述圖像採集器用於採集由所述鐳射投射模組向目標空間中投射的鐳射圖案。所述處理器用於處理所述鐳射圖案以獲得深度圖像。A depth camera according to an embodiment of the present invention includes the above-mentioned laser projection module, an image collector, and a processor. The image collector is used to collect a laser pattern projected by the laser projection module into a target space. The processor is configured to process the laser pattern to obtain a depth image.

本發明實施方式的電子裝置包括殼體和深度相機。所述深度相機設置在所述殼體內並從所述殼體暴露以獲取深度圖像。An electronic device according to an embodiment of the present invention includes a housing and a depth camera. The depth camera is disposed inside the casing and is exposed from the casing to acquire a depth image.

本發明的附加方面和優點將在下面的描述中部分給出,部分將從下面的描述中變得明顯,或藉由本發明的實踐瞭解到。Additional aspects and advantages of the present invention will be given in part in the following description, and part of them will become apparent from the following description, or be learned through the practice of the present invention.

下面詳細描述本發明的實施例,所述實施例的示例在附圖中示出,其中自始至終相同或類似的標號表示相同或類似的元件或具有相同或類似功能的元件。下面藉由參考附圖描述的實施例係示例性的,旨在用於解釋本發明,而不能理解為對本發明的限制。Hereinafter, embodiments of the present invention will be described in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention, but should not be construed as limiting the present invention.

在本發明的描述中,需要理解的係,術語“第一”、“第二”僅用於描述目的,而不能理解為指示或暗示相對重要性或者隱含指明所指示的技術特徵的數量。由此,限定有“第一”、“第二”的特徵可以明示或者隱含地包括一個或者更複數所述特徵。在本發明的描述中,“複數”的含義係兩個或兩個以上,除非另有明確具體的限定。In the description of the present invention, it is necessary to understand that the terms “first” and “second” are only used for descriptive purposes, and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless specifically defined otherwise.

在本發明的描述中,需要說明的係,除非另有明確的規定和限定,術語“安裝”、“相連”、“連接”應做廣義理解,例如,可以係固定連接,也可以係可拆卸連接,或一體地連接;可以係機械連接,也可以係電連接或可以相互通信;可以係直接相連,也可以藉由中間媒介間接相連,可以係兩個元件內部的連通或兩個元件的相互作用關係。對於本領域的普通技術人員而言,可以根據具體情況理解上述術語在本發明中的具體含義。In the description of the present invention, unless otherwise specified and limited, the terms "installation", "connected", and "connected" should be understood in a broad sense. For example, they can be fixed connections or detachable. Connected or integrated; can be mechanically connected, electrically connected, or can communicate with each other; can be directly connected, or indirectly connected through an intermediate medium, can be the internal communication of two elements or the mutual connection of two elements Effect relationship. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

下文的公開提供了許多不同的實施方式或例子用來實現本發明的不同結構。為了簡化本發明的公開,下文中對特定例子的部件和設置進行描述。當然,它們僅僅為示例,並且目的不在於限制本發明。此外,本發明可以在不同例子中重複參考數位和/或參考字母,這種重複係為了簡化和清楚的目的,其本身不指示所討論各種實施方式和/或設置之間的關係。此外,本發明提供了的各種特定的工藝和材料的例子,但係本領域普通技術人員可以意識到其他工藝的應用和/或其他材料的使用。The following disclosure provides many different implementations or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may repeat reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

請參閱圖1,本發明實施方式的電子裝置3000包括殼體2000和深度相機1000。電子裝置3000可以係手機、平板電腦、手提電腦、遊戲機、頭顯設備、門禁系統、櫃員機等,本發明實施例以電子裝置3000係手機為例進行說明,可以理解,電子裝置3000的具體形式可以係其他,在此不作限制。深度相機1000設置在殼體2000內並從殼體2000暴露以獲取深度圖像,殼體2000可以給深度相機1000提供防塵、防水、防摔等的保護,殼體2000上開設有與深度相機1000對應的孔,以使光線從孔中穿出或穿入殼體2000。Referring to FIG. 1, an electronic device 3000 according to an embodiment of the present invention includes a housing 2000 and a depth camera 1000. The electronic device 3000 can be a mobile phone, a tablet computer, a laptop computer, a game console, a headset device, an access control system, a teller machine, etc. The embodiment of the present invention is described using the electronic device 3000 mobile phone as an example. It can be understood that the specific form of the electronic device 3000 Can be other, there is no limitation here. The depth camera 1000 is disposed in the casing 2000 and is exposed from the casing 2000 to obtain a depth image. The casing 2000 can provide protection to the depth camera 1000 from dust, water, and drops. The casing 2000 is provided with the depth camera 1000. Corresponding holes to allow light to pass through the holes or into the housing 2000.

請參閱圖2,深度相機1000包括鐳射投射模組100、圖像採集器200和處理器70。深度相機1000上可以形成有與鐳射投射模組100對應的投射視窗901,和與圖像採集器200對應的採集視窗902。鐳射投射模組100用於藉由投射視窗901向目標空間投射鐳射圖案,圖像採集器200用於藉由採集視窗902採集被標的物調製後的鐳射圖案。在一個例子中,鐳射投射模組100投射的鐳射為紅外光,圖像採集器200為紅外攝像頭。處理器70與鐳射投射模組100及圖像採集器200均連接,處理器70用於處理鐳射圖案以獲得深度圖像。具體地,處理器70採用圖像匹配演算法計算出該鐳射圖案中各畫素點與參考圖案中的對應各個畫素點的偏離值,再根據該偏離值進一步獲得該鐳射圖案的深度圖像。其中,圖像匹配演算法可為數位圖像相關(Digital Image Correlation,DIC)演算法。當然,也可以採用其它圖像匹配演算法代替DIC演算法。下面將對鐳射投射模組100的結構作進一步介紹。Referring to FIG. 2, the depth camera 1000 includes a laser projection module 100, an image collector 200 and a processor 70. The depth camera 1000 may be formed with a projection window 901 corresponding to the laser projection module 100 and an acquisition window 902 corresponding to the image collector 200. The laser projection module 100 is configured to project a laser pattern onto a target space through a projection window 901, and the image collector 200 is configured to acquire a modulated laser pattern by a target object through a collection window 902. In one example, the laser light projected by the laser projection module 100 is infrared light, and the image collector 200 is an infrared camera. The processor 70 is connected to both the laser projection module 100 and the image collector 200. The processor 70 is configured to process a laser pattern to obtain a depth image. Specifically, the processor 70 uses an image matching algorithm to calculate a deviation value between each pixel point in the laser pattern and a corresponding pixel point in the reference pattern, and further obtains a depth image of the laser pattern according to the deviation value. . The image matching algorithm may be a Digital Image Correlation (DIC) algorithm. Of course, other image matching algorithms can be used instead of the DIC algorithm. The structure of the laser projection module 100 will be further described below.

請參閱圖3,鐳射投射模組100包括鐳射發射器10、準直元件20、繞射元件30、檢測元件40、鏡筒50、基板組件60和處理器70。準直元件20和繞射元件30依次設置在鐳射發射器10的光路上,具體地,鐳射發射器10發出的光依次穿過準直元件20和繞射元件30後出射到目標空間中。鐳射投射模組100的處理器70可以係深度相機1000的處理器70,此時,鐳射投射模組100與深度相機1000共用一個處理器70,此時處理器70可以用於處理鐳射圖案以獲得深度圖像,並且可以用於下文所述的接收檢測元件40輸出的電訊號並根據檢測元件40輸出的電訊號檢測準直元件20和/或繞射元件30是否異常。當鐳射投射模組100的處理器70不為深度相機1000的處理器70時,此時鐳射投射模組100與深度相機1000未共用一個處理器,鐳射投射模組100的處理器70用於接收檢測元件40輸出的電訊號並根據檢測元件40輸出的電訊號檢測準直元件20和/或繞射元件30是否異常,而深度相機1000的處理器70用於處理鐳射圖案以獲得深度圖像。在本申請的實施例中,以鐳射投射模組100與深度相機1000共用一個處理器70為例進行說明。Referring to FIG. 3, the laser projection module 100 includes a laser emitter 10, a collimating element 20, a diffractive element 30, a detecting element 40, a lens barrel 50, a substrate assembly 60 and a processor 70. The collimating element 20 and the diffractive element 30 are sequentially disposed on the optical path of the laser emitter 10. Specifically, the light emitted by the laser emitter 10 passes through the collimating element 20 and the diffractive element 30 in order and exits into the target space. The processor 70 of the laser projection module 100 may be the processor 70 of the depth camera 1000. At this time, the laser projection module 100 and the depth camera 1000 share a processor 70. At this time, the processor 70 may be used to process the laser pattern to obtain The depth image can be used to receive the electric signal output from the detection element 40 and detect whether the collimation element 20 and / or the diffractive element 30 is abnormal according to the electric signal output from the detection element 40 described below. When the processor 70 of the laser projection module 100 is not the processor 70 of the depth camera 1000, at this time, the laser projection module 100 and the depth camera 1000 do not share a processor, and the processor 70 of the laser projection module 100 is used for receiving The electric signal output by the detecting element 40 is detected and whether the collimating element 20 and / or the diffractive element 30 is abnormal according to the electric signal output by the detecting element 40. The processor 70 of the depth camera 1000 is configured to process a laser pattern to obtain a depth image. In the embodiment of the present application, an example is described in which the laser projection module 100 and the depth camera 1000 share one processor 70 as an example.

請再參閱圖3,基板組件60包括基板62及承載在基板62上的電路板61。基板62用於承載鏡筒50、鐳射發射器10和電路板61。基板62的材料可以係塑膠,比如聚對苯二甲酸乙二醇酯(Polyethylene Glycol Terephthalate,PET)、聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)、聚碳酸酯(Polycarbonate,PC)、聚醯亞胺(Polyimide,PI)中的至少一種。也就係說,基板62可以採用PET、PMMA、PC或PI中任意一種的單一塑膠材質製成。如此,基板62品質較輕且具有足夠的支撐強度。Please refer to FIG. 3 again, the substrate assembly 60 includes a substrate 62 and a circuit board 61 carried on the substrate 62. The substrate 62 is used to carry the lens barrel 50, the laser emitter 10, and the circuit board 61. The material of the substrate 62 can be plastic, such as Polyethylene Glycol Terephthalate (PET), Polymethyl Methacrylate (PMMA), Polycarbonate (PC), Polyfluorene At least one of polyimide (PI). That is to say, the substrate 62 may be made of a single plastic material of any one of PET, PMMA, PC, or PI. As such, the substrate 62 is light in weight and has sufficient support strength.

電路板61可以係印刷電路板、柔性電路板、軟硬結合板中的任意一種。電路板61上可以開設有過孔611,過孔611內可以用於容納鐳射發射器10,電路板61一部分被鏡筒50罩住,另一部分延伸出來並可以與處理器70連接,處理器70可以將鐳射投射模組10連接到電子裝置3000的主機板上。The circuit board 61 may be any one of a printed circuit board, a flexible circuit board, and a rigid-flexible board. The circuit board 61 can be provided with a via hole 611, and the via hole 611 can be used to receive the laser emitter 10. One part of the circuit board 61 is covered by the lens barrel 50, and the other part extends out and can be connected to the processor 70. The processor 70 The laser projection module 10 can be connected to a motherboard of the electronic device 3000.

請再參閱圖3,鏡筒50設置在基板組件60上並與基板組件60共同形成收容腔51。具體地,鏡筒50設置在基板組件60的電路板61上並與電路板61圍成收容腔51(也即鏡筒50的側壁53設置在電路板61上並與電路板61圍成收容腔51)。其中,鏡筒50可以與基板組件60的電路板61連接,鏡筒50與電路板61可以藉由粘膠粘接,以提高收容腔51的氣密性。當然,鏡筒50與基板組件60的具體連接方式可以有其他,例如藉由卡合連接。收容腔51可以用於容納準直元件20、繞射元件30等元器件,收容腔51同時形成鐳射投射模組10的光路的一部分。在本發明實施例中,鏡筒50呈中空的筒狀。Please refer to FIG. 3 again, the lens barrel 50 is disposed on the substrate assembly 60 and forms a receiving cavity 51 together with the substrate assembly 60. Specifically, the lens barrel 50 is disposed on the circuit board 61 of the substrate assembly 60 and forms a receiving cavity 51 with the circuit board 61 (that is, the side wall 53 of the lens barrel 50 is disposed on the circuit board 61 and forms a receiving cavity with the circuit board 61. 51). The lens barrel 50 may be connected to the circuit board 61 of the substrate assembly 60, and the lens barrel 50 and the circuit board 61 may be adhered with an adhesive to improve the airtightness of the receiving cavity 51. Of course, there may be other specific connection methods of the lens barrel 50 and the substrate assembly 60, for example, by a snap connection. The accommodating cavity 51 can be used for accommodating components such as the collimating element 20 and the diffractive element 30. The accommodating cavity 51 forms a part of the optical path of the laser projection module 10 at the same time. In the embodiment of the present invention, the lens barrel 50 has a hollow cylindrical shape.

請一併參閱圖7和圖15,在某些實施方式中,鏡筒50還包括自鏡筒50的側壁53向收容腔51延伸的承載台52(即限位凸起52)。具體地,承載台52自鏡筒50的側壁51向收容腔51內突出。承載台52可以呈連續的環狀;或者,承載台52包括複數,複數承載台52間隔分佈。承載台52圍成過光孔1231,過光孔1231可以作為收容腔121的一部分,鐳射穿過過光孔1231後穿入繞射元件30。同時,在組裝鐳射投射模組100時,當繞射元件30與承載台52相抵,可以認為繞射元件30安裝到位,當準直元件20與承載台52相抵,可以認為準直元件20安裝到位。承載台52包括限位面1232,當繞射元件30安裝在承載台52上時,限位面1232與繞射元件30結合。Please refer to FIG. 7 and FIG. 15 together. In some embodiments, the lens barrel 50 further includes a supporting platform 52 (ie, a limiting protrusion 52) extending from the sidewall 53 of the lens barrel 50 to the receiving cavity 51. Specifically, the supporting platform 52 protrudes from the side wall 51 of the lens barrel 50 into the receiving cavity 51. The supporting platforms 52 may be in a continuous ring shape. Alternatively, the supporting platforms 52 may include a plurality of supporting platforms 52 spaced apart from each other. The light-emitting hole 1231 is enclosed by the supporting platform 52. The light-emitting hole 1231 can be used as a part of the receiving cavity 121. The laser beam passes through the light-through hole 1231 and penetrates into the diffractive element 30. At the same time, when assembling the laser projection module 100, when the diffractive element 30 and the supporting table 52 abut, it can be considered that the diffractive element 30 is installed in place, and when the collimating element 20 and the supporting table 52 abut, the collimating element 20 can be considered as installed. . The supporting platform 52 includes a limiting surface 1232. When the diffractive element 30 is mounted on the supporting platform 52, the limiting surface 1232 is combined with the diffractive element 30.

請參閱圖3,鐳射發射器10設置在基板組件60上,具體地,鐳射發射器10可以設置在電路板61上並與電路板61電連接,鐳射發射器10也可以設置在基板62上並與過孔611對應(即鐳射發射器10承載在基板62上並收容在過孔611內),此時,可以藉由佈置導線將鐳射發射器10與電路板61電連接。鐳射發射器10經由電路板61與處理器70電連接。鐳射發射器10用於發射鐳射,鐳射可以係紅外光。在一個例子中,鐳射發射器10可以包括半導體襯底及設置在半導體襯底上的發射鐳射器,半導體襯底設置在基板62上,發射鐳射器可以係垂直腔面發射鐳射器(Vertical Cavity Surface Emitting Laser, VCSEL)。半導體襯底上可以設置單個發射鐳射器,也可以設置由複數發射鐳射器組成的陣列鐳射器,具體地,複數發射鐳射器可以以規則或者不規則的二維圖案的形式排布在半導體襯底上。基板62上還開設有散熱孔621(圖17所示),鐳射發射器10或電路板61工作產生的熱量可以由散熱孔621散出,散熱孔621內還可以填充導熱膠,以進一步提高基板62的散熱性能。Referring to FIG. 3, the laser emitter 10 is disposed on the substrate assembly 60. Specifically, the laser emitter 10 may be disposed on the circuit board 61 and electrically connected to the circuit board 61, and the laser emitter 10 may also be disposed on the substrate 62 and Corresponds to the via 611 (that is, the laser emitter 10 is carried on the substrate 62 and accommodated in the via 611). At this time, the laser emitter 10 can be electrically connected to the circuit board 61 by arranging wires. The laser transmitter 10 is electrically connected to the processor 70 via a circuit board 61. The laser emitter 10 is used to emit laser light, and the laser light may be infrared light. In one example, the laser emitter 10 may include a semiconductor substrate and an emitting laser disposed on the semiconductor substrate. The semiconductor substrate is disposed on the substrate 62. The emitting laser may be a vertical cavity surface emitting laser (Vertical Cavity Surface). Emitting Laser, VCSEL). The semiconductor substrate may be provided with a single emission laser or an array laser composed of a plurality of emission lasers. Specifically, the plurality of emission lasers may be arranged on the semiconductor substrate in a regular or irregular two-dimensional pattern. on. The substrate 62 is also provided with a heat dissipation hole 621 (shown in FIG. 17). The heat generated by the laser emitter 10 or the circuit board 61 can be dissipated through the heat dissipation hole 621, and the heat dissipation glue can be filled in the heat dissipation hole 621 to further improve the substrate. Thermal performance of 62.

請再參閱圖3,準直元件20可以係光學透鏡,準直元件20用於準直鐳射發射器10發射的鐳射,準直元件20收容在收容腔51內。準直元件20包括光學部和安裝部,安裝部用於與鏡筒50的側壁53結合並固定準直元件20,在本發明實施例中,光學部包括位於準直元件20相背兩側的準直入射面201和準直出射面202。Please refer to FIG. 3 again, the collimating element 20 may be an optical lens. The collimating element 20 is used to collimate the laser emitted by the laser emitter 10, and the collimating element 20 is contained in the receiving cavity 51. The collimating element 20 includes an optical portion and a mounting portion. The mounting portion is used to combine with the side wall 53 of the lens barrel 50 and fix the collimating element 20. In the embodiment of the present invention, the optical portion includes two sides located on opposite sides of the collimating element 20. A collimated incidence surface 201 and a collimated emission surface 202.

請一併參閱圖7和圖15,當鏡筒50包括承載台52時,繞射元件30安裝在承載台52上,具體地,繞射元件30與限位面1232結合以安裝在承載台52上。繞射元件30的外表面包括繞射出射面302及繞射入射面301。繞射出射面302和繞射入射面301相背,當繞射元件30安裝在承載台52上時,繞射入射面301與限位面1232結合。本發明實施例中,繞射入射面301上形成有繞射結構,繞射出射面302可以係光滑的平面,繞射元件30可以將經準直元件20準直後的鐳射投射出與繞射結構對應的鐳射圖案。繞射元件30可以由玻璃製成,也可以說由複合塑膠(如PET)製成。Please refer to FIG. 7 and FIG. 15 together. When the lens barrel 50 includes the supporting platform 52, the diffractive element 30 is mounted on the supporting platform 52. Specifically, the diffractive element 30 is combined with the limiting surface 1232 to be mounted on the supporting platform 52. on. The outer surface of the diffractive element 30 includes a diffractive emitting surface 302 and a diffractive incident surface 301. The diffraction exit surface 302 and the diffraction incidence surface 301 are opposite to each other. When the diffraction element 30 is mounted on the supporting table 52, the diffraction incidence surface 301 is combined with the limiting surface 1232. In the embodiment of the present invention, a diffraction structure is formed on the diffraction incident surface 301, the diffraction exit surface 302 can be a smooth plane, and the diffraction element 30 can project the laser beam collimated by the collimation element 20 and the diffraction structure. Corresponding laser pattern. The diffractive element 30 may be made of glass, or it may be said to be made of a composite plastic (such as PET).

請參閱圖3,檢測元件40設置在準直元件20和/或繞射元件30上。檢測元件40用於輸出電訊號。處理器70與檢測元件40連接。處理器70可用於接收檢測元件40輸出的電訊號並根據檢測元件40輸出的電訊號檢測準直元件20和/或繞射元件30是否異常。其中,準直元件20異常指的係準直元件20出現破裂、傾斜或從鐳射投射模組100中脫落,繞射元件30異常指的係繞射元件30出現破裂、傾斜或從鐳射投射模組100中脫落。Referring to FIG. 3, the detecting element 40 is disposed on the collimating element 20 and / or the diffractive element 30. The detecting element 40 is used for outputting an electric signal. The processor 70 is connected to the detection element 40. The processor 70 may be configured to receive the electrical signal output from the detecting element 40 and detect whether the collimating element 20 and / or the diffractive element 30 is abnormal according to the electrical signal output from the detecting element 40. Among them, the collimation element 20 that is abnormally pointed by the collimation element 20 is cracked, tilted or detached from the laser projection module 100, and the diffraction element 30 that is abnormally pointed by the diffraction element 30 is cracked, tilted, or detached from the laser projection module 100 100 drops off.

在一個實施例中,檢測元件40設置在準直元件20和繞射元件30上,檢測元件40用於檢測準直元件20和繞射元件30之間的距離並輸出電訊號。處理器70與檢測元件40連接。處理器70用於接收檢測元件40輸出的電訊號,判斷電訊號是否在預設範圍內,並在電訊號不在預設範圍內時確定準直元件20和繞射元件30之間的距離變化超過預定區間。In one embodiment, the detecting element 40 is disposed on the collimating element 20 and the diffractive element 30. The detecting element 40 is used to detect the distance between the collimating element 20 and the diffractive element 30 and output an electrical signal. The processor 70 is connected to the detection element 40. The processor 70 is configured to receive the electrical signal output by the detection element 40, determine whether the electrical signal is within a preset range, and determine that the distance between the collimating element 20 and the diffractive element 30 exceeds a change when the electrical signal is not within the preset range. Scheduled interval.

可以理解,鐳射投射模組100正常使用時,鐳射發射器10發射的鐳射依次經過準直元件20和繞射元件30出射,準直元件20和繞射元件30對鐳射具有一定的能量衰減作用,可以保證出射的鐳射能量不會過大以致傷害人眼。但當鐳射投射模組100遇到摔落等情況時,設置在鐳射投射模組100中的準直元件20和繞射元件30可能從鐳射投射模組100中脫落或傾斜,此時可能導致鐳射發射器10的鐳射不經過或不完全經過準直元件20和/或繞射元件30直接出射,如此,出射的鐳射未經過準直元件20和/或繞射元件30的衰減,可能導致到達人眼的鐳射的能量過高,對人眼產生傷害。It can be understood that when the laser projection module 100 is in normal use, the laser emitted by the laser emitter 10 is sequentially emitted through the collimating element 20 and the diffractive element 30. The collimating element 20 and the diffractive element 30 have a certain energy attenuation effect on the laser. It can ensure that the emitted laser energy will not be too large to hurt the human eye. However, when the laser projection module 100 encounters a fall or the like, the collimating element 20 and the diffractive element 30 provided in the laser projection module 100 may fall off or tilt from the laser projection module 100, and at this time, the laser may be caused. The laser of the transmitter 10 does not pass through or completely passes through the collimating element 20 and / or the diffractive element 30. In this way, the emitted laser does not pass through the attenuation of the collimating element 20 and / or the diffractive element 30, and may reach a person. Eye laser energy is too high, causing damage to the human eye.

本發明實施方式的鐳射投射模組100藉由在準直元件20和繞射元件30上設置檢測元件40,利用檢測元件40檢測準直元件20和繞射元件30之間的距離,在二者之間的距離發生變化且變化值超過預定區間時確定準直元件20和/或繞射元件30傾斜或脫落,此時,處理器70可立即關閉鐳射發射器10或減小鐳射發射器10的發射功率,從而避免因準直元件20和/或繞射元件30傾斜或脫落而出現出射的鐳射能量過大,對用戶的眼睛產生危害的問題,提升鐳射投射模組100使用的安全性。In the laser projection module 100 according to the embodiment of the present invention, a detecting element 40 is provided on the collimating element 20 and the diffractive element 30, and the distance between the collimating element 20 and the diffractive element 30 is detected by the detecting element 40. When the distance between them changes and the change value exceeds a predetermined interval, it is determined that the collimating element 20 and / or the diffractive element 30 are inclined or falling off. At this time, the processor 70 may immediately turn off the laser emitter 10 or reduce the laser emitter 10 Transmitting power, thereby avoiding the problem that the emitted laser energy is too large due to the tilting or falling of the collimating element 20 and / or the diffractive element 30, which causes harm to the eyes of the user, and improves the safety of the laser projection module 100.

具體地,請一併參閱圖3至圖6,在某些實施方式中,在鏡筒50的側壁53未向收容腔51延伸有承載台52時,檢測元件40可包括以下情形:Specifically, please refer to FIG. 3 to FIG. 6 together. In some embodiments, when the side wall 53 of the lens barrel 50 does not extend to the receiving cavity 51 with the supporting platform 52, the detecting element 40 may include the following situations:

(1)請一併參閱圖3和圖4,檢測元件40可以為兩個檢測電極41,兩個檢測電極41相對設置以形成電容。準直元件20包括準直入射面201和準直出射面202,繞射元件30包括繞射入射面301和繞射出射面302。兩個檢測電極41的位置可以係:一個檢測電極41設置在準直出射面202上,一個檢測電極41設置在繞射入射面301上(如圖3所示);或者,一個檢測電極41設置在準直出射面202上,一個檢測電極41設置在繞射出射面302上(圖未示);或者,一個檢測電極41設置在準直入射面201上,一個檢測電極41設置在繞射入射面301上(圖未示);或者,一個檢測電極41設置在準直入射面201上,一個檢測電極41設置在繞射出射面302上(圖未示)。檢測電極41可以係由ITO(氧化銦錫)、IZO(氧化銦鋅)等透光導電材料製成以不影響準直元件20和繞射元件30的發光光路;或者,檢測電極41可以設置在準直元件20和繞射元件30的非光學作用部(例如,準直元件20的非凸部分及繞射元件30的非繞射光柵部部分)。其中,檢測電極41的對數可以為一對或複數對。檢測電極41為複數對時,複數對的檢測電極41可均勻分佈在準直元件20及繞射元件30的周緣位置(如圖4所示)。可以理解,兩個相對的檢測電極41之間形成電容,兩個檢測電極41之間的距離改變後,電容的電容值也相應改變,輸出至處理器70的電訊號可以反映兩個檢測電極41的電容值,從而根據電訊號即可得到兩個檢測電極41之間的距離,進一步地得到準直元件20和繞射元件30之間的距離。在準直元件20和繞射元件30未脫落或未傾斜時,準直元件20和繞射元件30之間的距離沒有變化或變化在預定區間內;而當準直元件20和繞射元件30中的任意一個脫落或傾斜時,準直元件20和繞射元件30之間的距離會發生變化,處理器70獲得的電訊號可以反映出該變化並指示變化後的準直元件20和繞射元件30之間的距離。具體地,若準直元件20和繞射元件30之間的距離變化在預定區間內,即準直元件20和繞射元件30之間的距離變化較小時,準直元件20和繞射元件30仍舊能夠正常工作,此時處理器70無需關閉鐳射發射器10或減小鐳射發射器10的發射功率;而若準直元件20和繞射元件30之間的距離變化較大,即變化的距離超出了預定區間,則處理器70需執行關閉鐳射發射器10或減小鐳射發射器10的發射功率的操作,以避免出射的鐳射能量過大傷害用戶眼睛的問題。(1) Please refer to FIG. 3 and FIG. 4 together. The detection element 40 may be two detection electrodes 41, and the two detection electrodes 41 are oppositely disposed to form a capacitor. The collimating element 20 includes a collimating incidence surface 201 and a collimating exit surface 202, and the diffractive element 30 includes a diffraction incident surface 301 and a diffraction exit surface 302. The positions of the two detection electrodes 41 may be: one detection electrode 41 is disposed on the collimated emission surface 202, one detection electrode 41 is disposed on the diffraction incident surface 301 (as shown in FIG. 3); or one detection electrode 41 is disposed On the collimated emission surface 202, a detection electrode 41 is disposed on the diffraction emission surface 302 (not shown); or, a detection electrode 41 is disposed on the collimated incidence surface 201, and a detection electrode 41 is disposed on the diffraction incidence surface. On the surface 301 (not shown); or, a detection electrode 41 is provided on the collimated incidence surface 201 and a detection electrode 41 is provided on the diffraction exit surface 302 (not shown). The detection electrode 41 may be made of a light-transmitting conductive material such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) so as not to affect the light-emitting optical path of the collimating element 20 and the diffractive element 30; or, the detecting electrode 41 may be provided at Non-optical active portions of the collimating element 20 and the diffractive element 30 (for example, a non-convex portion of the collimating element 20 and a non-diffractive grating portion portion of the diffractive element 30). The number of pairs of detection electrodes 41 may be one or a plurality of pairs. When the detection electrodes 41 are a plurality of pairs, the detection electrodes 41 of the plurality of pairs may be uniformly distributed at the peripheral positions of the collimating element 20 and the diffractive element 30 (as shown in FIG. 4). It can be understood that a capacitance is formed between two opposite detection electrodes 41. After the distance between the two detection electrodes 41 is changed, the capacitance value of the capacitance is also changed accordingly. The electrical signal output to the processor 70 can reflect the two detection electrodes 41. And the distance between the two detection electrodes 41 can be obtained according to the electrical signal, and the distance between the collimating element 20 and the diffractive element 30 can be further obtained. When the collimating element 20 and the diffractive element 30 are not detached or not inclined, the distance between the collimating element 20 and the diffractive element 30 does not change or changes within a predetermined interval; and when the collimating element 20 and the diffractive element 30 When any of them falls off or is inclined, the distance between the collimating element 20 and the diffractive element 30 will change. The electrical signal obtained by the processor 70 can reflect the change and indicate the changed collimating element 20 and the diffractive element. The distance between the elements 30. Specifically, if the change in the distance between the collimating element 20 and the diffractive element 30 is within a predetermined interval, that is, when the change in the distance between the collimating element 20 and the diffractive element 30 is small, the collimating element 20 and the diffractive element 30 30 can still work normally. At this time, the processor 70 does not need to turn off the laser transmitter 10 or reduce the transmission power of the laser transmitter 10; and if the distance between the collimating element 20 and the diffractive element 30 changes greatly, the change If the distance exceeds a predetermined interval, the processor 70 needs to perform an operation of turning off the laser transmitter 10 or reducing the transmission power of the laser transmitter 10 to avoid the problem that the emitted laser energy is too large to hurt the eyes of the user.

(2)請一併參閱圖5和圖6,檢測元件40還可以係發射器421和接收器422。發射器421和接收器422分別設置在準直元件20和繞射元件30上,具體地,發射器421設置在準直出射面202,接收器422設置在繞射入射面301(如圖5所示)。或者,發射器421和接收器422分別設置在繞射元件30和準直元件20上,具體地,發射器421設置在繞射入射面301,接收器422設置在準直出射面202(圖未示)。發射器421和接收器422應設置在準直元件20和繞射元件30的非光學作用部(例如,準直元件20的非凸部分及繞射元件30的非繞射光柵部部分),以避免對準直元件20和繞射元件30的發光光路產生影響。發射器421和接收器422的對數可以係一對或複數對。發射器421和接收器422的對數為複數對時,複數對發射器421和接收器422可以均勻分佈在準直元件20和繞射元件30的周緣位置(如圖6所示)。其中,發射器421可以用於發射光線或超聲波,接收器422可以用於接收對應的發射器421發射的光線或超聲波。接收器422接收到的光線或超聲波可轉化為電訊號,電訊號的強弱可用於表徵光線或超聲波的強弱,並進一步表徵準直元件20和繞射元件30之間的距離大小。另外,也可基於發射器421發射光線或超聲波的時間點與接收器422接收光線或超聲波的時間點二者之間的時間差來計算準直元件20和繞射元件30之間的距離;或者,也可基於發射器421發射的光線與接收器422接收的光線二者之間的相位差來計算準直元件20和繞射元件30之間的距離。在準直元件20和繞射元件30未脫落或未傾斜時,準直元件20和繞射元件30之間的距離沒有變化或變化在預定區間內;而當準直元件20和繞射元件30中的任意一個脫落或傾斜時,準直元件20和繞射元件30之間的距離會發生變化,處理器70從發射器421和接收器422處獲得的電訊號可以反映出該變化並指示變化後的準直元件20和繞射元件30之間的距離。具體地,若準直元件20和繞射元件30之間的距離變化在預定區間內,即準直元件20和繞射元件30之間的距離變化較小時,準直元件20和繞射元件30仍舊能夠正常工作,此時處理器70無需關閉鐳射發射器10或減小鐳射發射器10的發射功率;而若準直元件20和繞射元件30之間的距離變化較大,即變化的距離超出了預定區間,則處理器70需執行關閉鐳射發射器10或減小鐳射發射器10的發射功率的操作,以避免出射的鐳射能量過大傷害用戶眼睛的問題。另外,當發射器421發射光線時,該光線的波長應與鐳射發射器10發射的鐳射的波長不一致,以避免對鐳射圖案形成產生影響。(2) Please refer to FIG. 5 and FIG. 6 together. The detecting element 40 may also be a transmitter 421 and a receiver 422. The transmitter 421 and the receiver 422 are disposed on the collimating element 20 and the diffractive element 30, respectively. Specifically, the transmitter 421 is disposed on the collimating exit surface 202, and the receiver 422 is disposed on the diffraction incident surface 301 (as shown in FIG. 5). Show). Alternatively, the transmitter 421 and the receiver 422 are disposed on the diffractive element 30 and the collimation element 20, respectively. Specifically, the transmitter 421 is disposed on the diffractive incident surface 301, and the receiver 422 is disposed on the collimated exit surface 202 (not shown in the figure). Show). The transmitter 421 and the receiver 422 should be disposed at the non-optical active portions of the collimating element 20 and the diffractive element 30 (for example, the non-convex portion of the collimating element 20 and the non-diffractive grating portion of the diffractive element 30) to Avoid the influence of the light emitting light paths of the alignment element 20 and the diffractive element 30. The number of pairs of the transmitter 421 and the receiver 422 may be a pair or a complex number. When the logarithm of the transmitter 421 and the receiver 422 is a complex number, the transmitter 421 and the receiver 422 of the complex pair may be evenly distributed at the peripheral positions of the collimating element 20 and the diffractive element 30 (as shown in FIG. 6). The transmitter 421 may be used to transmit light or ultrasonic waves, and the receiver 422 may be used to receive light or ultrasonic waves emitted by the corresponding transmitter 421. The light or ultrasonic waves received by the receiver 422 can be converted into electrical signals. The strength of the electrical signals can be used to characterize the strength of light or ultrasonic waves, and further characterize the distance between the collimating element 20 and the diffractive element 30. In addition, the distance between the collimating element 20 and the diffractive element 30 may also be calculated based on the time difference between the time point when the transmitter 421 emits light or ultrasonic waves and the time point when the receiver 422 receives light or ultrasonic waves; or, The distance between the collimating element 20 and the diffractive element 30 may also be calculated based on the phase difference between the light emitted by the transmitter 421 and the light received by the receiver 422. When the collimating element 20 and the diffractive element 30 are not detached or not inclined, the distance between the collimating element 20 and the diffractive element 30 does not change or changes within a predetermined interval; and when the collimating element 20 and the diffractive element 30 When any one of them falls off or tilts, the distance between the collimating element 20 and the diffractive element 30 changes, and the electrical signals obtained by the processor 70 from the transmitter 421 and the receiver 422 can reflect the change and indicate the change. The distance between the rear collimating element 20 and the diffractive element 30. Specifically, if the change in the distance between the collimating element 20 and the diffractive element 30 is within a predetermined interval, that is, when the change in the distance between the collimating element 20 and the diffractive element 30 is small, the collimating element 20 and the diffractive element 30 30 can still work normally. At this time, the processor 70 does not need to turn off the laser transmitter 10 or reduce the transmission power of the laser transmitter 10; and if the distance between the collimating element 20 and the diffractive element 30 changes greatly, the change If the distance exceeds a predetermined interval, the processor 70 needs to perform an operation of turning off the laser transmitter 10 or reducing the transmission power of the laser transmitter 10 to avoid the problem that the emitted laser energy is too large to hurt the eyes of the user. In addition, when the emitter 421 emits light, the wavelength of the light should be different from the wavelength of the laser emitted by the laser emitter 10 to avoid affecting the laser pattern formation.

請一併參閱圖7至圖12,在某些實施方式中,當鏡筒50的側壁53向收容腔51延伸有承載台52時,檢測元件40可包括以下情形:Please refer to FIG. 7 to FIG. 12 together. In some embodiments, when the side wall 53 of the lens barrel 50 extends to the receiving cavity 51 with the supporting platform 52, the detecting element 40 may include the following situations:

(1)請一併參閱圖7至圖9,檢測元件40可以為兩個檢測電極41,兩個檢測電極41相對設置以形成電容。準直元件20包括準直入射面201和準直出射面202,繞射元件30包括繞射入射面301和繞射出射面302,承載台52開設有通孔521。兩個檢測電極41的位置可以係:一個檢測電極41設置在準直出射面202上,一個檢測電極41設置在繞射入射面301上,且兩個檢測電極41均收容在通孔521中以形成電容(如圖7所示)。此時,檢測電極41可以係由ITO(氧化銦錫)、IZO(氧化銦鋅)等透光導電材料製成以不影響準直元件20和繞射元件30的發光光路,也可以係任意的不透光材料製成。其中,檢測電極41的對數可以為一對或複數對。檢測電極41為複數對時,複數對的檢測電極41可均勻分佈在準直元件20和繞射元件30的周緣位置,此時,承載台52的通孔521的個數可為複數,複數通孔521與複數對的檢測電極41一一對應,每對檢測電極41收容在一個通孔521中(如圖8所示),或者承載台52的通孔521為一個環形的通孔521,複數對檢測電極41均收容在環形的通孔521中(如圖9所示)。可以理解,兩個相對的檢測電極41之間形成電容,兩個檢測電極41之間的距離改變後,電容的電容值也相應改變,輸出至處理器70的電訊號可以反映兩個檢測電極41的電容值,從而根據電訊號即可得到兩個檢測電極41之間的距離,進一步地得到準直元件20和繞射元件30之間的距離。在準直元件20和繞射元件30未脫落或未傾斜時,準直元件20和繞射元件30之間的距離沒有變化或變化在預定區間內;而當準直元件20和繞射元件30中的任意一個脫落或傾斜時,準直元件20和繞射元件30之間的距離會發生變化,處理器70獲得的電訊號可以反映出該變化並指示變化後的準直元件20和繞射元件30之間的距離。具體地,若準直元件20和繞射元件30之間的距離變化在預定區間內,即準直元件20和繞射元件30之間的距離變化較小時,準直元件20和繞射元件30仍舊能夠正常工作,此時處理器70無需關閉鐳射發射器10或減小鐳射發射器10的發射功率;而若準直元件20和繞射元件30之間的距離變化較大,即變化的距離超出了預定區間,則處理器70需執行關閉鐳射發射器10或減小鐳射發射器10的發射功率的操作,以避免出射的鐳射能量過大傷害用戶眼睛的問題。(1) Please refer to FIG. 7 to FIG. 9 together. The detection element 40 may be two detection electrodes 41, and the two detection electrodes 41 are oppositely disposed to form a capacitor. The collimating element 20 includes a collimating incident surface 201 and a collimating exit surface 202. The diffractive element 30 includes a diffractive incident surface 301 and a diffractive exit surface 302. The supporting platform 52 is provided with a through hole 521. The positions of the two detection electrodes 41 may be: one detection electrode 41 is disposed on the collimated emission surface 202, one detection electrode 41 is disposed on the diffraction incident surface 301, and both detection electrodes 41 are housed in the through hole 521 to Form a capacitor (as shown in Figure 7). At this time, the detection electrode 41 may be made of a light-transmitting conductive material such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) so as not to affect the light emitting optical path of the collimating element 20 and the diffractive element 30, or may be any Made of opaque material. The number of pairs of detection electrodes 41 may be one or a plurality of pairs. When the detection electrodes 41 are a plurality of pairs, the detection electrodes 41 of the plurality of pairs may be uniformly distributed at the peripheral positions of the collimating element 20 and the diffractive element 30. At this time, the number of the through holes 521 of the bearing platform 52 may be a plurality. The holes 521 correspond to the plurality of pairs of detection electrodes 41, and each pair of detection electrodes 41 is housed in a through hole 521 (as shown in FIG. 8), or the through hole 521 of the bearing platform 52 is a ring-shaped through hole 521. The pair of detection electrodes 41 are all accommodated in the annular through hole 521 (as shown in FIG. 9). It can be understood that a capacitance is formed between two opposite detection electrodes 41. After the distance between the two detection electrodes 41 is changed, the capacitance value of the capacitance is also changed accordingly. The electrical signal output to the processor 70 can reflect the two detection electrodes 41. And the distance between the two detection electrodes 41 can be obtained according to the electrical signal, and the distance between the collimating element 20 and the diffractive element 30 can be further obtained. When the collimating element 20 and the diffractive element 30 are not detached or not inclined, the distance between the collimating element 20 and the diffractive element 30 does not change or changes within a predetermined interval; and when the collimating element 20 and the diffractive element 30 When any of them falls off or is inclined, the distance between the collimating element 20 and the diffractive element 30 will change. The electrical signal obtained by the processor 70 can reflect the change and indicate the changed collimating element 20 and the diffractive element. The distance between the elements 30. Specifically, if the change in the distance between the collimating element 20 and the diffractive element 30 is within a predetermined interval, that is, when the change in the distance between the collimating element 20 and the diffractive element 30 is small, the collimating element 20 and the diffractive element 30 30 can still work normally. At this time, the processor 70 does not need to turn off the laser transmitter 10 or reduce the transmission power of the laser transmitter 10; and if the distance between the collimating element 20 and the diffractive element 30 changes greatly, the change If the distance exceeds a predetermined interval, the processor 70 needs to perform an operation of turning off the laser transmitter 10 or reducing the transmission power of the laser transmitter 10 to avoid the problem that the emitted laser energy is too large to hurt the eyes of the user.

(2)請一併參閱圖10至圖12,檢測元件40還可以係發射器421和接收器422。發射器421和接收器422分別設置在準直元件20和繞射元件30上。承載台52開設有通孔521。具體地,發射器421設置在準直出射面202,接收器422設置在繞射入射面301,發射器421和接收器422均收容在通孔521中(圖10所示)。此時,發射器421和接收器422設置在準直元件20和繞射元件30的非光學作用部(例如,準直元件20的非凸部分及繞射元件30的非繞射光柵部部分),以避免對準直元件20和繞射元件30的發光光路產生影響。發射器421和接收器422的對數可以係一對或複數對。發射器421和接收器422的對數為複數對時,複數對發射器421和接收器422可以均勻分佈在準直元件20和繞射元件30的周緣位置,此時,承載台52的通孔521的個數可為複數,複數通孔521與複數檢測元件40一一對應,每個檢測元件40收容在一個通孔521中(如圖11所示),或者承載台52的通孔521為一個環形通孔521,複數檢測元件40均收容在環形通孔521中(如圖12所示)。其中,發射器421可以用於發射光線或超聲波,接收器422可以用於接收對應的發射器421發射的光線或超聲波。接收器422接收到的光線或超聲波可轉化為電訊號,電訊號的強弱可用於表徵光線或超聲波的強弱,並進一步表徵準直元件20和繞射元件30之間的距離大小。另外,也可基於發射器421發射光線或超聲波的時間點與接收器422接收光線或超聲波的時間點之間的時間差來計算準直元件20和繞射元件30之間的距離;或者,也可基於發射器421發射的光線與接收器422接收的光線之間的相位差來計算準直元件20和繞射元件30之間的距離。在準直元件20和繞射元件30未脫落或未傾斜時,準直元件20和繞射元件30之間的距離沒有變化或變化在預定區間內;而當準直元件20和繞射元件30中的任意一個脫落或傾斜時,準直元件20和繞射元件30之間的距離會發生變化,處理器70從發射器421和接收器422處獲得的電訊號可以反映出該變化並指示變化後的準直元件20和繞射元件30之間的距離。具體地,若準直元件20和繞射元件30之間的距離變化在預定區間內,即準直元件20和繞射元件30之間的距離變化較小時,準直元件20和繞射元件30仍舊能夠正常工作,此時處理器70無需關閉鐳射發射器10或減小鐳射發射器10的發射功率;而若準直元件20和繞射元件30之間的距離變化較大,即變化的距離超出了預定區間,則處理器70需執行關閉鐳射發射器10或減小鐳射發射器10的發射功率的操作,以避免出射的鐳射能量過大傷害用戶眼睛的問題。另外,當發射器421發射光線時,該光線的波長應與鐳射發射器10發射的鐳射的波長不一致,以避免對鐳射圖案形成產生影響。(2) Please refer to FIG. 10 to FIG. 12 together. The detecting element 40 may also be a transmitter 421 and a receiver 422. The transmitter 421 and the receiver 422 are disposed on the collimating element 20 and the diffractive element 30, respectively. The supporting platform 52 is provided with a through hole 521. Specifically, the transmitter 421 is disposed on the collimated emission surface 202, the receiver 422 is disposed on the diffraction incident surface 301, and both the transmitter 421 and the receiver 422 are received in the through hole 521 (shown in FIG. 10). At this time, the transmitter 421 and the receiver 422 are provided at the non-optical active portions of the collimating element 20 and the diffractive element 30 (for example, the non-convex portion of the collimating element 20 and the non-diffractive grating portion of the diffractive element 30) In order to avoid the influence of the light emitting light paths of the alignment element 20 and the diffractive element 30. The number of pairs of the transmitter 421 and the receiver 422 may be a pair or a complex number. When the logarithm of the transmitter 421 and the receiver 422 is a complex number, the transmitter 421 and the receiver 422 may be evenly distributed at the peripheral positions of the collimating element 20 and the diffractive element 30. At this time, the through hole 521 of the carrier 52 The number may be plural. The plural through holes 521 correspond to the plural detecting elements 40 one by one. Each detecting element 40 is received in one through hole 521 (as shown in FIG. 11), or the through hole 521 of the supporting table 52 is one. The annular through hole 521 and the plurality of detection elements 40 are all received in the annular through hole 521 (as shown in FIG. 12). The transmitter 421 may be used to transmit light or ultrasonic waves, and the receiver 422 may be used to receive light or ultrasonic waves emitted by the corresponding transmitter 421. The light or ultrasonic waves received by the receiver 422 can be converted into electrical signals. The strength of the electrical signals can be used to characterize the strength of light or ultrasonic waves, and further characterize the distance between the collimating element 20 and the diffractive element 30. In addition, the distance between the collimating element 20 and the diffractive element 30 may also be calculated based on the time difference between the time point when the transmitter 421 emits light or ultrasonic waves and the time point when the receiver 422 receives light or ultrasonic waves; or, The distance between the collimating element 20 and the diffractive element 30 is calculated based on the phase difference between the light emitted by the transmitter 421 and the light received by the receiver 422. When the collimating element 20 and the diffractive element 30 are not detached or not inclined, the distance between the collimating element 20 and the diffractive element 30 does not change or changes within a predetermined interval; and when the collimating element 20 and the diffractive element 30 When any one of them falls off or tilts, the distance between the collimating element 20 and the diffractive element 30 changes, and the electrical signals obtained by the processor 70 from the transmitter 421 and the receiver 422 can reflect the change and indicate the change. The distance between the rear collimating element 20 and the diffractive element 30. Specifically, if the change in the distance between the collimating element 20 and the diffractive element 30 is within a predetermined interval, that is, when the change in the distance between the collimating element 20 and the diffractive element 30 is small, the collimating element 20 and the diffractive element 30 30 can still work normally. At this time, the processor 70 does not need to turn off the laser transmitter 10 or reduce the transmission power of the laser transmitter 10; and if the distance between the collimating element 20 and the diffractive element 30 changes greatly, the change If the distance exceeds a predetermined interval, the processor 70 needs to perform an operation of turning off the laser transmitter 10 or reducing the transmission power of the laser transmitter 10 to avoid the problem that the emitted laser energy is too large to hurt the eyes of the user. In addition, when the emitter 421 emits light, the wavelength of the light should be different from the wavelength of the laser emitted by the laser emitter 10 to avoid affecting the laser pattern formation.

請一併參閱圖13至圖16,在另一個實施例中,檢測元件40可以係檢測電極對,分別設置在準直入射面201和準直出射面202和/或繞射出射面302和繞射入射面301。即,準直元件20上設置有檢測電極對,檢測電極對中的兩個電極分別設置在準直入射面201和準直出射面202上;或者,繞射元件30上設置有檢測電極對,檢測電極對中的兩個電極分別設置在繞射入射面301和繞射出射面302上;或者,準直元件20和繞射元件30上均設有檢測電極對,準直元件20上的檢測電極對中的兩個電極分別設置在準直入射面201和準直出射面202上,繞射元件30上的檢測電極對中的兩個電極分別設置在繞射入射面301和繞射出射面302上。檢測電極對在通電後輸出電訊號,處理器70根據設置在準直元件20上的檢測電極對輸出的電訊號的變化以檢測準直元件20的狀態,根據設置在衍元件30上的檢測電極對輸出的電訊號的變化以檢測繞射元件30的狀態。具體地,處理器70根據輸出的電訊號的變化以分別檢測準直元件20以及繞射元件30是否破裂。可以理解,鐳射投射模組100正常使用時,鐳射發射器10發射的鐳射依次經過準直元件20和繞射元件30出射,準直元件20和繞射元件30對鐳射具有一定的能量衰減作用,可以保證出射的鐳射能量不會過大以致傷害人眼。但當鐳射投射模組100遇到摔落等情況時,設置在鐳射投射模組100中的準直元件20和繞射元件30可能破損,此時可能導致鐳射發射器100的鐳射不經過準直元件20和/或繞射元件30而經破損位置處直接出射,如此,出射的鐳射未經過準直元件20和/或繞射元件30的衰減,可能導致到達人眼的鐳射的能量過高,對人眼產生傷害。Please refer to FIG. 13 to FIG. 16 together. In another embodiment, the detection element 40 may be a pair of detection electrodes, which are respectively disposed on the collimated incidence surface 201 and the collimated emission surface 202 and / or the diffraction emission surface 302 and the diffraction射 pleasant face 301. That is, a detection electrode pair is provided on the collimating element 20, and two electrodes of the detection electrode pair are respectively provided on a collimating incidence surface 201 and a collimating emission surface 202; or, a diffraction electrode 30 is provided with a detection electrode pair, The two electrodes in the detection electrode pair are respectively disposed on the diffractive incident surface 301 and the diffractive output surface 302; or, both the collimating element 20 and the diffractive element 30 are provided with a detecting electrode pair, and The two electrodes in the electrode pair are disposed on the collimated incidence surface 201 and the collimated emission surface 202, respectively, and the two electrodes in the detection electrode pair on the diffraction element 30 are disposed on the diffraction incident surface 301 and the diffraction emission surface, respectively. 302 on. The detection electrode pair outputs an electric signal after being energized, and the processor 70 detects the state of the collimation element 20 according to a change in the electric signal output by the detection electrode pair provided on the collimation element 20, and according to the detection electrode provided on the derivative element 30 The change of the output electrical signal is used to detect the state of the diffractive element 30. Specifically, the processor 70 detects whether the collimating element 20 and the diffractive element 30 are broken according to changes in the output electrical signal. It can be understood that when the laser projection module 100 is in normal use, the laser emitted by the laser emitter 10 is sequentially emitted through the collimating element 20 and the diffractive element 30. The collimating element 20 and the diffractive element 30 have a certain energy attenuation effect on the laser. It can ensure that the emitted laser energy will not be too large to hurt the human eye. However, when the laser projection module 100 encounters a fall or the like, the collimating element 20 and the diffractive element 30 provided in the laser projection module 100 may be damaged. At this time, the laser of the laser transmitter 100 may not be collimated. The element 20 and / or the diffractive element 30 emit directly at the damaged position. In this way, the emitted laser does not pass through the attenuation of the collimating element 20 and / or the diffractive element 30, which may cause the energy of the laser reaching the human eye to be too high. Harm to human eyes.

在一些示例中,承載台52開設有通孔521,位於準直出射面202和/或位於繞射入射面301的檢測元件40收容在通孔521中。In some examples, the supporting platform 52 is provided with a through hole 521, and the detection element 40 located on the collimated emission surface 202 and / or the diffraction incident surface 301 is received in the through hole 521.

具體地,通孔521的個數可為複數,複數通孔521與複數對的檢測元件40一一對應,位於準直出射面202和/或位於繞射入射面301的檢測元件40收容在一個通孔521中。Specifically, the number of the through-holes 521 may be plural. The plural through-holes 521 correspond to the detection elements 40 in a plurality of pairs, and the detection elements 40 located on the collimated emission surface 202 and / or the diffraction incident surface 301 are housed in one. In the through hole 521.

本發明實施方式的鐳射投射模組100藉由在鐳射投射模組100的準直元件20和/或繞射元件30上設置檢測元件40,利用檢測元件40檢測準直元件20和/或繞射元件30的電訊號以檢測準直元件20和/或繞射元件30是否破裂,在破裂時處理器70可立即關閉鐳射發射器10或減小鐳射發射器10的發射功率,從而避免因準直元件20和/或繞射元件30破損而出現出射的鐳射能量過大,對用戶的眼睛產生危害的問題,提升鐳射投射模組100使用的安全性。In the laser projection module 100 according to the embodiment of the present invention, a detection element 40 is provided on the collimation element 20 and / or the diffraction element 30 of the laser projection module 100, and the detection element 40 is used to detect the collimation element 20 and / or the diffraction. The electrical signal of the element 30 is used to detect whether the collimating element 20 and / or the diffractive element 30 is broken. When the processor 70 breaks, the processor 70 can immediately turn off the laser emitter 10 or reduce the transmitting power of the laser emitter 10, thereby avoiding collimation. The component 20 and / or the diffractive component 30 are damaged and the emitted laser energy is too large, which causes a problem to the eyes of the user, and improves the safety of the laser projection module 100.

在一些實施方式中,檢測電極對形成電容,處理器70用於根據電容的電容值變化判斷準直元件20和/或繞射元件30是否破裂。In some embodiments, the detection electrode pair forms a capacitance, and the processor 70 is configured to determine whether the collimating element 20 and / or the diffractive element 30 is broken according to a change in the capacitance value of the capacitance.

具體地,檢測電極對可以係由ITO(氧化銦錫)、IZO(氧化銦鋅)等透光導電材料製成以不影響準直元件20和繞射學元件30的發光光路;或者,檢測電極對可以設置在準直元件20和/或繞射元件30的非光學作用部(例如,準直元件20的非凸部分及繞射學元件30的非繞射光柵部部分)。其中,檢測電極對的數量可以為一對或複數對。檢測電極對為複數對時,複數對的檢測電極對可均勻分佈在準直元件20和/或繞射元件30的周緣位置。可以理解,每對檢測電極對中的兩個電極之間形成電容,當元件破損時,每對檢測電極對中的兩個電極之間的距離發生改變,電容的電容值也相應改變,輸出至處理器70的電訊號可以反映兩個電極的電容值,從而判斷準直元件20和/或繞射元件30是否破裂。在準直元件20和繞射元件30未破損時,設置在準直元件20和繞射元件30上的每對檢測電極對中的兩個電極之間的距離沒有變化;而當準直元件14和繞射元件30中的任意一個破損時,設置在其上的檢測電極對中的兩個電極之間的距離會發生變化,處理器70獲得的電訊號可以反映出該變化並指示變化後的準直元件20和繞射元件30是否破裂。具體地,檢測電極對中兩個電極之間的距離變化在預定區間內,即準直元件20和/或繞射元件30各自的檢測電極對得兩個電極之間的距離變化較小時,準直元件20和繞射元件30仍舊能夠正常工作,此時處理器30無需關閉鐳射發射器10或減小鐳射發射器10的發射功率;而若設置在準直元件20和繞射元件30上的任意一個檢測電極對中兩個電極之間的距離變化較大,即變化的距離超出了預定區間,則處理器70需執行關閉鐳射發射器10或減小鐳射發射器10的發射功率的操作,以避免出射的鐳射能量過大傷害用戶眼睛的問題。Specifically, the detection electrode pair may be made of a light-transmitting conductive material such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) so as not to affect the light-emitting optical path of the collimating element 20 and the diffractive element 30; or, the detecting electrode The pair may be disposed on a non-optical active portion of the collimating element 20 and / or the diffractive element 30 (for example, a non-convex portion of the collimating element 20 and a non-diffractive grating portion portion of the diffractive element 30). The number of the detection electrode pairs may be one or a plurality of pairs. When the detection electrode pairs are a plurality of pairs, the detection electrode pairs of the plurality of pairs may be uniformly distributed at the peripheral positions of the collimating element 20 and / or the diffractive element 30. It can be understood that a capacitance is formed between two electrodes in each pair of detection electrode pairs. When the element is damaged, the distance between the two electrodes in each pair of detection electrode pairs changes, and the capacitance value of the capacitor changes accordingly. The electrical signals of the processor 70 can reflect the capacitance values of the two electrodes, so as to determine whether the collimating element 20 and / or the diffractive element 30 are broken. When the collimating element 20 and the diffractive element 30 are not damaged, the distance between the two electrodes in each pair of detection electrode pairs provided on the collimating element 20 and the diffractive element 30 does not change; and when the collimating element 14 When any one of the diffraction elements 30 is damaged, the distance between the two electrodes in the pair of detection electrodes provided thereon changes, and the electrical signal obtained by the processor 70 can reflect the change and indicate the changed Whether the collimating element 20 and the diffractive element 30 are broken. Specifically, the change in the distance between the two electrodes in the detection electrode pair is within a predetermined interval, that is, when the change in the distance between the two electrodes by the respective detection electrodes of the collimating element 20 and / or the diffractive element 30 is small, The collimating element 20 and the diffractive element 30 can still work normally. At this time, the processor 30 does not need to turn off the laser emitter 10 or reduce the transmitting power of the laser emitter 10; and if it is disposed on the collimating element 20 and the diffractive element 30, The distance between the two electrodes in any one of the detection electrode pairs varies greatly, that is, the changed distance exceeds a predetermined interval, the processor 70 needs to perform an operation of turning off the laser transmitter 10 or reducing the transmission power of the laser transmitter 10 In order to avoid the problem that the emitted laser energy is too large to hurt the user's eyes.

在一些實施方式中,檢測元件40還可以係發射器和接收器。發射器和接收器分別設置在準直入射面201和準直出射面202和/或繞射入射面301和繞射出射面302上。具體地,發射器和接收器應設置在準直元件20和繞射元件30的非光學作用部(例如,準直元件20的非凸部分及繞射元件30的非繞射光柵部部分),以避免對準直元件20和繞射元件30的發光光路產生影響。發射器和接收器的對數可以係一對或複數對。發射器和接收器的對數為複數對時,複數對發射器和接收器可以均勻分佈在準直元件20和/或繞射元件30的周緣位置。其中,發射器可以用於發射光線或超聲波,接收器可以用於接收對應的發射器發射的光線或超聲波。接收器接收到的光線或超聲波可轉化為電訊號,電訊號的強弱可用於表徵光線或超聲波的強弱,並進一步表徵準直元件20和繞射元件30各自的入射面與出射面之間的距離大小。另外,也可基於發射器發射光線或超聲波的時間點與接收器接收光線或超聲波的時間點二者之間的時間差來計算準直元件20和繞射元件30各自入射面與出射面之間的距離;或者,也可基於發射器發射的光線與接收器接收的光線二者之間的相位差來計算準直元件20和繞射元件30各自的入射面與出射面之間的距離。在準直元件20和繞射元件30未破損時,準直元件20和繞射元件30各自的入射面與出射面之間的距離沒有變化;而當準直元件20和繞射元件30中的任意一個破損時,準直元件20或繞射元件30的入射面與出射面之間的距離會發生變化,處理器70從發射器和接收器處獲得的電訊號可以反映出該變化並指示變化後的準直元件20和/或繞射元件30各自的入射面與出射面之間的距離。具體地,若準直元件20和/或繞射元件30各自的入射面和出射面之間的距離變化在預定區間內,即距離變化較小時,準直元件20和繞射元件30仍舊能夠正常工作,此時處理器70無需關閉鐳射發射器10或減小鐳射發射器10的發射功率;而若準直元件20和/或繞射元件30各自的入射面和出射面之間的距離變化較大,即變化的距離超出了預定區間,則處理器70需執行關閉鐳射發射器10或減小鐳射發射器10的發射功率的操作,以避免出射的鐳射能量過大傷害用戶眼睛的問題。另外,當發射器發射光線時,該光線的波長應與鐳射發射器發射的鐳射的波長不一致,以避免對鐳射圖案形成產生影響。In some embodiments, the detection element 40 may also be a transmitter and a receiver. The transmitter and the receiver are disposed on the collimated incidence surface 201 and the collimated emission surface 202 and / or the diffractive incidence surface 301 and the diffractive emission surface 302, respectively. Specifically, the transmitter and the receiver should be disposed at the non-optical active portions of the collimating element 20 and the diffractive element 30 (for example, the non-convex portion of the collimating element 20 and the non-diffractive grating portion of the diffractive element 30), In order to avoid the influence of the light emission light paths of the alignment element 20 and the diffractive element 30. The number of pairs of transmitter and receiver can be a pair or a complex number. When the number of pairs of the transmitter and the receiver is a complex number, the transmitter and the receiver of the complex pair may be evenly distributed at the peripheral positions of the collimating element 20 and / or the diffractive element 30. The transmitter may be used to transmit light or ultrasonic waves, and the receiver may be used to receive light or ultrasonic waves emitted by the corresponding transmitter. The light or ultrasonic waves received by the receiver can be converted into electrical signals. The strength of the electrical signals can be used to characterize the strength of light or ultrasonic waves, and further characterize the distance between the incident surface and the exit surface of the collimating element 20 and the diffractive element 30. size. In addition, the time between the incident surface and the exit surface of the collimating element 20 and the diffractive element 30 can also be calculated based on the time difference between the time point at which the transmitter emits light or ultrasonic waves and the time point at which the receiver receives light or ultrasonic waves. Alternatively, the distance between the incident surface and the exit surface of the collimating element 20 and the diffractive element 30 may be calculated based on the phase difference between the light emitted by the transmitter and the light received by the receiver. When the collimating element 20 and the diffractive element 30 are not damaged, the distance between the incident surface and the exit surface of the collimating element 20 and the diffractive element 30 does not change; and when the When any one is broken, the distance between the incident surface and the exit surface of the collimating element 20 or the diffractive element 30 will change. The electrical signals obtained by the processor 70 from the transmitter and the receiver can reflect the change and indicate the change. The distance between the incident surface and the exit surface of the rear collimating element 20 and / or the diffractive element 30 respectively. Specifically, if the distance between the incident surface and the exit surface of the collimating element 20 and / or the diffractive element 30 changes within a predetermined interval, that is, when the distance change is small, the collimating element 20 and the diffractive element 30 can still Normal operation, at this time, the processor 70 does not need to turn off the laser emitter 10 or reduce the transmission power of the laser emitter 10; and if the distance between the incident surface and the exit surface of the collimating element 20 and / or the diffractive element 30 changes, If the variation distance is larger than a predetermined interval, the processor 70 needs to perform an operation of turning off the laser transmitter 10 or reducing the transmission power of the laser transmitter 10 to avoid the problem that the emitted laser energy is too large to damage the eyes of the user. In addition, when the emitter emits light, the wavelength of the light should not be the same as the wavelength of the laser emitted by the laser emitter to avoid affecting the formation of the laser pattern.

請一併參閱圖17和圖18,在某些實施方式中,鐳射發射器10還可為邊發射鐳射器,具體地,鐳射發射器10可以為分佈回饋式鐳射器(Distributed Feedback Laser,DFB)。鐳射發射器10用於向收容腔51內發射鐳射。鐳射發射器10整體呈柱狀,鐳射發射器10遠離基板62的一個端面形成發光面11,鐳射從發光面11發出,發光面11朝向準直元件20。鐳射投射模組100採用邊發射鐳射器作為鐳射發射器10,一方面邊發射鐳射器較VCSEL陣列的溫漂較小,另一方面,由於邊發射鐳射器為單點發光結構,無需設計陣列結構,製作簡單,鐳射投射模組100的成本較低。Please refer to FIG. 17 and FIG. 18 together. In some embodiments, the laser emitter 10 may also be a side-emitting laser. Specifically, the laser emitter 10 may be a distributed feedback laser (DFB). . The laser emitter 10 is used to emit laser light into the containing cavity 51. The laser emitter 10 has a column shape as a whole, and one end surface of the laser emitter 10 away from the substrate 62 forms a light emitting surface 11. Laser is emitted from the light emitting surface 11 and the light emitting surface 11 faces the collimating element 20. The laser projection module 100 uses a side-emitting laser as the laser emitter 10. On the one hand, the side-emitting laser has a lower temperature drift than the VCSEL array. On the other hand, because the side-emitting laser is a single-point light emitting structure, there is no need to design an array structure. It is simple to make and the cost of the laser projection module 100 is low.

分佈回饋式鐳射器的鐳射在傳播時,經過光柵結構的回饋獲得功率的增益。要提高分佈回饋式鐳射器的功率,需要藉由增大注入電流和/或增加分佈回饋式鐳射器的長度,由於增大注入電流會使得分佈回饋式鐳射器的功耗增大並且出現發熱嚴重的問題,因此,為了保證分佈回饋式鐳射器能夠正常工作,需要增加分佈回饋式鐳射器的長度,導致分佈回饋式鐳射器一般呈細長條結構。當邊發射鐳射器的發光面11朝向準直元件20時,邊發射鐳射器呈豎直放置,由於邊發射鐳射器呈細長條結構,邊發射鐳射器容易出現跌落、移位或晃動等意外,可以藉由設置固定件以將邊發射鐳射器固定住,防止邊發射鐳射器發生跌落、移位或晃動等意外。When the laser of the distributed feedback laser is propagating, the gain of the power is obtained through the feedback of the grating structure. To increase the power of the distributed feedback laser, it is necessary to increase the injection current and / or increase the length of the distributed feedback laser. As the increase of the injection current will increase the power consumption of the distributed feedback laser and cause severe heat generation. Therefore, in order to ensure that the distributed feedback laser can work normally, the length of the distributed feedback laser needs to be increased, resulting in the distributed feedback laser generally having a slender structure. When the light emitting surface 11 of the side emitting laser faces the collimating element 20, the side emitting laser is placed vertically. Because the side emitting laser has a slender structure, the side emitting laser is prone to accidents such as dropping, shifting or shaking. The side-emitting laser can be fixed by setting a fixing member to prevent the side-emitting laser from falling, shifting or shaking.

請一併參閱圖17至圖20,在某些實施方式中,固定件可為封膠15,鐳射發射器10可以藉由封膠15粘接在基板62上,例如鐳射發射器10與發光面11相背的一面粘接在基板62上。鐳射發射器10的側面12也可以粘接在基板62上,封膠15包裹住四周的側面,也可以僅粘結側面的某一個面與基板62或粘結某幾個面與基板62。此時封膠15可以為導熱膠,以將鐳射發射器10工作產生的熱量傳導至基板62中。Please refer to FIG. 17 to FIG. 20 together. In some embodiments, the fixing member may be the sealant 15, and the laser emitter 10 may be adhered to the substrate 62 through the sealant 15, such as the laser emitter 10 and the light emitting surface. The 11 opposite sides are bonded to the substrate 62. The side surface 12 of the laser emitter 10 may also be adhered to the substrate 62, the sealant 15 may surround the surrounding side surfaces, or only one of the side surfaces and the substrate 62 or several surfaces and the substrate 62 may be bonded. At this time, the sealant 15 may be a thermally conductive adhesive to conduct heat generated by the operation of the laser emitter 10 into the substrate 62.

請參閱圖17、圖18和圖21,在某些實施方式中,鐳射發射器10也可採用如圖21所示的固定方式固定在基板62上。具體地,固定件還可為彈性的支撐架16。支撐架16的個數為兩個或兩個以上。複數支撐架16共同形成收容空間161。收容空間161用於收容鐳射發射器10,複數支撐架16用於支撐住鐳射發射器10。如此,可以防止鐳射發射器10發生晃動。Please refer to FIG. 17, FIG. 18, and FIG. 21. In some embodiments, the laser emitter 10 may also be fixed on the substrate 62 in a fixing manner as shown in FIG. 21. Specifically, the fixing member may also be an elastic support frame 16. The number of the support frames 16 is two or more. The plurality of supporting frames 16 collectively form a receiving space 161. The receiving space 161 is used to receive the laser transmitter 10, and the plurality of supporting frames 16 are used to support the laser transmitter 10. In this way, shaking of the laser emitter 10 can be prevented.

在某些實施方式中,基板111可以省去,鐳射發射器10可以直接固定在電路板112上以減小鐳射投射模組10的整體厚度。In some embodiments, the substrate 111 may be omitted, and the laser emitter 10 may be directly fixed on the circuit board 112 to reduce the overall thickness of the laser projection module 10.

綜上,本發明實施方式的鐳射投射模組100、深度相機1000和電子裝置3000藉由在鐳射投射模組100的準直元件20和繞射元件30上設置檢測元件40,利用檢測元件40檢測準直元件20和繞射元件30之間的距離,在二者之間的距離發生變化且變化值超過預定區間時確定準直元件20和/或繞射元件30脫落或傾斜,此時,處理器70可立即關閉鐳射發射器10或減小鐳射發射器10的發射功率,從而避免因準直元件20和/或繞射元件30脫落而出現出射的鐳射能量過大,對用戶的眼睛產生危害的問題,提升鐳射投射模組100使用的安全性。In summary, the laser projection module 100, the depth camera 1000, and the electronic device 3000 according to the embodiments of the present invention are provided with a detection element 40 on the collimation element 20 and the diffraction element 30 of the laser projection module 100, and the detection element 40 is used for detection. The distance between the collimating element 20 and the diffractive element 30. When the distance between the two changes and the change value exceeds a predetermined interval, it is determined that the collimating element 20 and / or the diffractive element 30 fall off or tilt. The transmitter 70 can immediately turn off the laser transmitter 10 or reduce the transmission power of the laser transmitter 10, thereby avoiding excessive laser energy emitted due to the fall of the collimating element 20 and / or the diffractive element 30, which may be harmful to the eyes of the user. The problem is that the security of the laser projection module 100 is improved.

本發明實施方式的鐳射投射模組100、深度相機1000和電子裝置3000藉由在鐳射投射模組100的準直元件20和/或繞射元件30上設置檢測元件40,利用檢測元件40檢測準直元件20和/或繞射元件30的電訊號以檢測準直元件20和/或繞射元件30是否破裂,在準直元件20和繞射元件30中的任意一個破裂時處理器70可立即關閉鐳射發射器10或減小鐳射發射器10的發射功率,從而避免因準直元件20和/或繞射元件30損壞而出現出射的鐳射能量過大,對用戶的眼睛產生危害的問題,提升鐳射投射模組使用的安全性。The laser projection module 100, the depth camera 1000, and the electronic device 3000 according to the embodiments of the present invention are provided with a detection element 40 on the collimation element 20 and / or the diffraction element 30 of the laser projection module 100, and the detection element 40 is used to detect the collimation. The electrical signal of the collimating element 20 and / or the diffractive element 30 is used to detect whether the collimating element 20 and / or the diffractive element 30 is broken. The processor 70 may immediately when any of the collimating element 20 and the diffractive element 30 is broken. Turn off the laser transmitter 10 or reduce the transmission power of the laser transmitter 10, so as to avoid the problem that the emitted laser energy is too large due to the damage of the collimating element 20 and / or the diffractive element 30, which will cause harm to the eyes of the user, and improve the laser Security used by the projection module.

在本說明書的描述中,參考術語“一個實施例”、“一些實施例”、“示例”、“具體示例”、或“一些示例”等的描述意指結合該實施例或示例描述的具體特徵、結構、材料或者特點包含于本發明的至少一個實施例或示例中。在本說明書中,對上述術語的示意性表述不必須針對的係相同的實施例或示例。而且,描述的具體特徵、結構、材料或者特點可以在任一個或複數實施例或示例中以合適的方式結合。此外,在不相互矛盾的情況下,本領域的技術人員可以將本說明書中描述的不同實施例或示例以及不同實施例或示例的特徵進行結合和組合。In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “examples”, “specific examples”, or “some examples” and the like means specific features described in conjunction with the embodiments or examples , Structure, material, or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, without any contradiction, those skilled in the art may combine and combine different embodiments or examples and features of the different embodiments or examples described in this specification.

儘管上面已經示出和描述了本發明的實施例,可以理解的係,上述實施例係示例性的,不能理解為對本發明的限制,本領域的普通技術人員在本發明的範圍內可以對上述實施例進行變化、修改、替換和變型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can understand the above within the scope of the present invention. Embodiments are subject to change, modification, substitution, and modification.

1000‧‧‧深度相機1000‧‧‧ Depth Camera

100‧‧‧鐳射投射模組 100‧‧‧laser projection module

10‧‧‧鐳射發射器 10‧‧‧Laser Launcher

11‧‧‧發光面 11‧‧‧ light emitting surface

12‧‧‧側面 12‧‧‧ side

15‧‧‧封膠 15‧‧‧ Sealant

16‧‧‧支撐架 16‧‧‧ support

161‧‧‧收容空間 161‧‧‧Containment space

20‧‧‧準直元件 20‧‧‧ Collimation element

201‧‧‧準直入射面 201‧‧‧ Collimated incidence surface

202‧‧‧準直出射面 202‧‧‧ Collimated exit surface

30‧‧‧繞射元件 30‧‧‧ Diffraction Element

301‧‧‧繞射入射面 301‧‧‧diffraction incident surface

302‧‧‧繞射出射面 302‧‧‧ Diffraction exit surface

40‧‧‧檢測元件 40‧‧‧Detection element

41‧‧‧檢測電極 41‧‧‧detection electrode

421‧‧‧發射器 421‧‧‧ launcher

422‧‧‧接收器 422‧‧‧Receiver

50‧‧‧鏡筒 50‧‧‧ lens barrel

51‧‧‧收容腔 51‧‧‧ Containment Chamber

52‧‧‧承載台 52‧‧‧bearing platform

521‧‧‧通孔 521‧‧‧through hole

53‧‧‧側壁 53‧‧‧ sidewall

60‧‧‧基板組件 60‧‧‧ substrate assembly

61‧‧‧電路板 61‧‧‧Circuit Board

611‧‧‧過孔 611‧‧‧via

62‧‧‧基板 62‧‧‧ substrate

621‧‧‧散熱孔 621‧‧‧Ventilation holes

70‧‧‧處理器 70‧‧‧ processor

200‧‧‧圖像採集器 200‧‧‧Image Collector

901‧‧‧投射視窗 901‧‧‧ Projection window

902‧‧‧採集視窗 902‧‧‧Collection window

1231‧‧‧過光孔 1231‧‧‧light hole

1232‧‧‧限位面 1232‧‧‧ limit surface

2000‧‧‧殼體 2000‧‧‧shell

3000‧‧‧電子裝置 3000‧‧‧ electronic device

圖1係本發明某些實施方式的電子裝置的結構示意圖。FIG. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present invention.

圖2係本發明某些實施方式的深度相機的結構示意圖。 FIG. 2 is a schematic structural diagram of a depth camera according to some embodiments of the present invention.

圖3係本發明某些實施方式的鐳射投射模組的結構示意圖。 FIG. 3 is a schematic structural diagram of a laser projection module according to some embodiments of the present invention.

圖4係圖3所示的鐳射投射模組沿IV-IV線的截面示意圖。 FIG. 4 is a schematic cross-sectional view of the laser projection module shown in FIG. 3 along the line IV-IV.

圖5係本發明某些實施方式的鐳射投射模組的結構示意圖。 FIG. 5 is a schematic structural diagram of a laser projection module according to some embodiments of the present invention.

圖6係圖5所示的鐳射投射模組沿VI-VI線的截面示意圖。 6 is a schematic cross-sectional view of the laser projection module shown in FIG. 5 along the VI-VI line.

圖7係本發明某些實施方式的鐳射投射模組的結構示意圖。 FIG. 7 is a schematic structural diagram of a laser projection module according to some embodiments of the present invention.

圖8係圖7所示的鐳射投射模組沿VIII-VIII線的截面示意圖。 FIG. 8 is a schematic cross-sectional view of the laser projection module shown in FIG. 7 along the line VIII-VIII.

圖9係另一實施方式的鐳射投射模組被與圖7的所示的VIII-VIII線相同的截面線的截面示意圖。 FIG. 9 is a schematic cross-sectional view of a laser projection module according to another embodiment taken along the same cross-sectional line as the line VIII-VIII shown in FIG. 7.

圖10係本發明某些實施方式的鐳射投射模組的結構示意圖。 FIG. 10 is a schematic structural diagram of a laser projection module according to some embodiments of the present invention.

圖11係圖10所示的鐳射投射模組沿XI-XI線的截面示意圖。 11 is a schematic cross-sectional view of the laser projection module shown in FIG. 10 along the XI-XI line.

圖12係另一實施方式的鐳射投射模組被與圖10所示的XI-XI線相同的截面線的截面示意圖。 FIG. 12 is a schematic cross-sectional view of a laser projection module according to another embodiment, taken along the same cross-sectional line as the XI-XI line shown in FIG. 10.

圖13係本發明某些實施方式的鐳射投射模組的結構示意圖。 FIG. 13 is a schematic structural diagram of a laser projection module according to some embodiments of the present invention.

圖14係圖13所示的鐳射投射模組沿XIV-XIV線的截面示意圖。 14 is a schematic cross-sectional view of the laser projection module shown in FIG. 13 along the XIV-XIV line.

圖15係本發明某些實施方式的鐳射投射模組的結構示意圖。 FIG. 15 is a schematic structural diagram of a laser projection module according to some embodiments of the present invention.

圖16係圖15所示的鐳射投射模組沿XVI-XVI線的截面示意圖。 16 is a schematic cross-sectional view of the laser projection module shown in FIG. 15 along the XVI-XVI line.

圖17和圖18係本發明某些實施方式的鐳射投射模組的結構示意圖。 17 and 18 are schematic structural diagrams of a laser projection module according to some embodiments of the present invention.

圖19至圖21係本發明某些實施方式的鐳射投射模組的部分結構示意圖。 19 to 21 are partial structural schematic diagrams of a laser projection module according to some embodiments of the present invention.

Claims (20)

一種鐳射投射模組,其改進在於,所述鐳射投射模組包括: 鐳射發射器,所述鐳射發射器用於發射鐳射; 準直元件,所述準直元件用於準直所述鐳射; 繞射元件,所述繞射元件用於繞射經所述準直元件準直後的所述鐳射以形成鐳射圖案; 檢測元件,所述檢測元件設置在所述準直元件和/或所述繞射元件上,所述檢測元件用於輸出電訊號; 與所述檢測元件連接的處理器,所述處理器用於接收所述電訊號、並根據所述電訊號檢測所述準直元件和/或所述繞射元件是否異常。A laser projection module is improved in that the laser projection module includes: A laser emitter for emitting laser light; A collimating element for collimating the laser; A diffractive element for diffracting the laser beam collimated by the collimating element to form a laser pattern; A detection element, which is disposed on the collimation element and / or the diffractive element, and the detection element is used to output an electric signal; A processor connected to the detection element, the processor is configured to receive the electrical signal and detect whether the collimation element and / or the diffractive element is abnormal according to the electrical signal. 根據申請專利範圍第1項之鐳射投射模組,其中,所述檢測元件設置在所述準直元件和所述繞射元件上,所述檢測元件用於檢測所述準直元件和所述繞射元件之間的距離並輸出電訊號,所述處理器用於判斷所述電訊號是否在預設範圍內、以及在所述電訊號不在所述預設範圍內時確定所述準直元件和所述繞射元件之間的距離變化超過預定區間。The laser projection module according to item 1 of the scope of patent application, wherein the detection element is disposed on the collimation element and the diffraction element, and the detection element is used to detect the collimation element and the diffraction element. The processor is used to determine whether the electrical signal is within a preset range, and to determine the collimating element and the electrical signal when the electrical signal is not within the preset range. The change in the distance between the diffraction elements exceeds a predetermined interval. 根據申請專利範圍第2項之鐳射投射模組,其中,所述鐳射投射模組還包括基板組件和鏡筒,所述基板組件包括基板和設置在所述基板上的電路板,所述鏡筒設置在所述電路板上並與所述電路板圍成收容腔,所述準直元件和所述繞射元件收容在所述收容腔內,且沿所述鐳射發射器的發光光路依次設置。The laser projection module according to item 2 of the patent application scope, wherein the laser projection module further includes a substrate assembly and a lens barrel, and the substrate assembly includes a substrate and a circuit board disposed on the substrate, and the lens barrel The collimating element and the diffractive element are received in the receiving cavity and arranged on the circuit board, and are arranged along the light emitting light path of the laser emitter in sequence. 根據申請專利範圍第3項之鐳射投射模組,其中,所述檢測元件包括兩個檢測電極;兩個所述檢測電極分別設置在所述準直元件和所述繞射元件上以形成電容。According to the laser projection module of claim 3, wherein the detecting element includes two detecting electrodes; the two detecting electrodes are respectively disposed on the collimating element and the diffractive element to form a capacitor. 根據申請專利範圍第3項之鐳射投射模組,其中,所述檢測元件包括發射器和接收器,所述發射器和所述接收器分別設置在所述準直元件和所述繞射元件上,所述發射器與所述接收器對應設置,所述發射器用於發射光線或超聲波,所述接收器用於接收所述發射器發射的光線或超聲波;或 所述檢測元件包括發射器和接收器,所述發射器和所述接收器分別設置在所述繞射元件和所述準直元件上,所述發射器與所述接收器對應設置,所述發射器用於發射光線或超聲波,所述接收器用於接收所述發射器發射的光線或超聲波。The laser projection module according to item 3 of the patent application scope, wherein the detection element includes a transmitter and a receiver, and the transmitter and the receiver are respectively disposed on the collimating element and the diffractive element. , The transmitter is arranged corresponding to the receiver, the transmitter is used to transmit light or ultrasonic waves, and the receiver is used to receive the light or ultrasonic waves emitted by the transmitter; or The detection element includes a transmitter and a receiver, and the transmitter and the receiver are respectively disposed on the diffractive element and the collimation element, and the transmitter and the receiver are disposed correspondingly, and The transmitter is used for transmitting light or ultrasonic waves, and the receiver is used for receiving light or ultrasonic waves emitted by the transmitter. 根據申請專利範圍第2項之鐳射投射模組,其中,所述鐳射投射模組還包括基板組件和鏡筒,所述基板組件包括基板和設置在所述基板上的電路板,所述鏡筒設置在所述電路板上並與所述電路板圍成收容腔,所述準直元件和所述繞射元件收容在所述收容腔內,且沿所述鐳射發射器的發光光路依次設置,所述鏡筒的側壁向所述收容腔的中心延伸有承載台,所述繞射元件放置在所述承載台上。The laser projection module according to item 2 of the patent application scope, wherein the laser projection module further includes a substrate assembly and a lens barrel, and the substrate assembly includes a substrate and a circuit board disposed on the substrate, and the lens barrel The collimating element and the diffractive element are received in the receiving cavity, and arranged along the light-emitting optical path of the laser emitter in sequence, A bearing platform extends from the sidewall of the lens barrel toward the center of the receiving cavity, and the diffraction element is placed on the bearing platform. 根據申請專利範圍第6項之鐳射投射模組,其中,所述承載台開設有通孔,所述檢測元件包括兩個檢測電極;兩個所述檢測電極分別設置在所述準直元件和所述繞射元件上,且收容在所述通孔中以形成電容。The laser projection module according to item 6 of the patent application scope, wherein the bearing platform is provided with a through hole, and the detection element includes two detection electrodes; the two detection electrodes are respectively disposed on the collimation element and the detector. The diffraction element is received in the through hole to form a capacitor. 根據申請專利範圍第1項之鐳射投射模組,其中,所述準直元件包括位於相背兩側的準直入射面和準直出射面,所述繞射元件包括位於相背兩側的繞射入射面和繞射出射面,所述檢測元件包括分別設置在所述準直入射面與所述準直出射面和/或所述繞射入射面與所述繞射出射面之間的檢測電極對,所述檢測電極對通電後輸出所述電訊號,所述處理器用於根據所述電訊號的變化檢測所述準直元件和/或所述繞射元件是否破裂。According to the laser projection module of the first patent application scope, wherein the collimating element includes a collimating incident surface and a collimating exit surface on opposite sides, and the diffractive element includes a The incident surface and the diffraction exit surface, and the detection element includes detections respectively disposed between the collimated incidence surface and the collimated exit surface and / or the diffraction incident surface and the diffraction exit surface An electrode pair, and the detection electrode pair outputs the electric signal after being energized, and the processor is configured to detect whether the collimating element and / or the diffractive element is broken according to a change in the electric signal. 根據申請專利範圍第8項之鐳射投射模組,其中,所述檢測電極對形成電容,所述處理器用於根據所述電容的電容值變化判斷所述準直元件和/或所述繞射元件是否破裂。The laser projection module according to item 8 of the scope of patent application, wherein the detection electrode pair forms a capacitor, and the processor is configured to determine the collimating element and / or the diffractive element according to a change in the capacitance value of the capacitor. Whether it is cracked. 根據申請專利範圍第8項之鐳射投射模組,其中,所述鐳射投射模組還包括: 基板組件,所述基板組件包括基板和承載在所述基板上的電路板,所述電路板開設有過孔,所述鐳射發射器承載在所述基板上並收容在所述過孔內; 鏡筒,所述鏡筒包括側壁,所述側壁設置在所述基板組件上並與所述基板組件共同形成收容腔,所述鐳射發射器、所述準直元件和所述繞射元件均收容在所述收容腔內並依次設置在所述鐳射發射器的發光光路上;以及 保護蓋,所述保護蓋與所述鏡筒結合,所述保護蓋包括保護頂壁,所述保護頂壁開設有通光孔,所述通光孔與所述繞射元件對應。The laser projection module according to item 8 of the patent application scope, wherein the laser projection module further includes: A substrate assembly comprising a substrate and a circuit board carried on the substrate, the circuit board is provided with a via hole, and the laser emitter is carried on the substrate and accommodated in the via hole; A lens barrel including a side wall, the side wall being disposed on the substrate assembly and forming a receiving cavity together with the substrate assembly, and the laser emitter, the collimating element, and the diffractive element all receiving In the receiving cavity and sequentially arranged on the light emitting path of the laser emitter; and The protective cover is combined with the lens barrel, the protective cover includes a protective top wall, and the protective top wall is provided with a light through hole, and the light through hole corresponds to the diffraction element. 根據申請專利範圍第10項之鐳射投射模組,其中,所述鏡筒還包括自所述鏡筒的側壁向所述收容腔的中心延伸的承載台,所述繞射元件安裝在所述承載台上。According to the laser projection module of claim 10, wherein the lens barrel further comprises a bearing platform extending from the sidewall of the lens barrel to the center of the receiving cavity, and the diffraction element is mounted on the bearing On stage. 根據申請專利範圍第11項之鐳射投射模組,其中,所述承載台開設有通孔,所述位於所述準直出射面和/或位於所述繞射入射面的所述檢測元件收容在所述通孔中。The laser projection module according to item 11 of the patent application scope, wherein the bearing platform is provided with a through hole, and the detection element located on the collimated emission surface and / or the diffraction incident surface is housed in In the through hole. 根據申請專利範圍第1項之鐳射投射模組,其中,所述鐳射發射器包括邊發射鐳射器,所述邊發射鐳射器包括發光面,所述發光面朝向所述準直元件。The laser projection module according to item 1 of the scope of patent application, wherein the laser emitter includes a side-emitting laser, the side-emitting laser includes a light emitting surface, and the light emitting surface faces the collimating element. 根據申請專利範圍第13項之鐳射投射模組,其中,所述鐳射投射模組還包括固定件和基板組件,所述固定件用於將所述邊發射鐳射器固定在所述基板組件上。The laser projection module according to item 13 of the patent application scope, wherein the laser projection module further includes a fixing member and a substrate assembly, and the fixing member is used for fixing the edge emitting laser on the substrate assembly. 根據申請專利範圍第14項之鐳射投射模組,其中,所述固定件包括封膠,所述封膠設置在所述邊發射鐳射器與所述基板組件之間,所述封膠為導熱膠。The laser projection module according to item 14 of the patent application scope, wherein the fixing member includes a sealant, the sealant is disposed between the edge emitting laser and the substrate assembly, and the sealant is a thermally conductive adhesive . 根據申請專利範圍第14項之鐳射投射模組,其中,所述固定件包括設置在所述基板組件上的至少兩個彈性的支撐架,至少兩個所述支撐架共同形成收容空間,所述收容空間用於收容所述鐳射發射器,至少兩個所述支撐架用於支撐住所述鐳射發射器。The laser projection module according to item 14 of the scope of the patent application, wherein the fixing member includes at least two elastic supporting frames provided on the substrate assembly, and at least two of the supporting frames collectively form a receiving space. The accommodating space is used for accommodating the laser transmitter, and at least two of the supporting frames are used for supporting the laser transmitter. 根據申請專利範圍第2項或第8項之鐳射投射模組,其中,所述鐳射投射模組還包括基板組件,所述基板組件包括基板和承載在所述基板上的電路板,所述基板開設有散熱孔。The laser projection module according to item 2 or item 8 of the patent application scope, wherein the laser projection module further includes a substrate assembly including a substrate and a circuit board carried on the substrate, and the substrate A cooling hole is provided. 一種深度相機,其改進在於,所述深度相機包括: 申請專利範圍第1項至第17項中任意一項所述的鐳射投射模組; 圖像採集器,所述圖像採集器用於採集由所述鐳射投射模組向目標空間中投射的鐳射圖案;以及 所述處理器用於處理所述鐳射圖案以獲得深度圖像。A depth camera is improved in that the depth camera includes: The laser projection module described in any one of the scope of application for items 1 to 17; An image collector for collecting a laser pattern projected by the laser projection module into a target space; and The processor is configured to process the laser pattern to obtain a depth image. 根據申請專利範圍第18項之深度相機,其中,所述處理器還用於根據所述檢測元件的電訊號判斷所述鐳射投射模組的工作狀態以控制所述鐳射投射模組的鐳射發射器發射或關閉。The depth camera according to claim 18, wherein the processor is further configured to determine a working state of the laser projection module according to an electrical signal of the detection element to control a laser emitter of the laser projection module. Launch or close. 一種電子裝置,其改進在於,所述電子裝置包括: 殼體;以及 申請專利範圍第19項所述的深度相機,所述深度相機設置在所述殼體內並從所述殼體暴露以獲取深度圖像。An electronic device is improved in that the electronic device includes: Housing; and The depth camera according to item 19 of the patent application scope, the depth camera is disposed in the casing and exposed from the casing to acquire a depth image.
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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108490632B (en) * 2018-03-12 2020-01-10 Oppo广东移动通信有限公司 Laser projection module, depth camera and electronic device
CN110596909A (en) * 2018-06-13 2019-12-20 三赢科技(深圳)有限公司 Optical projection device
US11733598B2 (en) * 2019-12-04 2023-08-22 Liqxtal Technology Inc. Tunable light projector
CN111596507B (en) * 2020-05-11 2022-04-22 常州纵慧芯光半导体科技有限公司 Camera module and manufacturing method thereof
CN111443497B (en) * 2020-05-13 2023-11-28 东莞埃科思科技有限公司 Laser projection module, depth imaging device and method for selecting conversion lens
CN112379530B (en) * 2020-11-24 2022-06-10 北京华捷艾米科技有限公司 Light source device of depth camera and depth camera

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101501442B (en) * 2006-03-14 2014-03-19 普莱姆传感有限公司 Depth-varying light fields for three dimensional sensing
EP1850210B1 (en) 2006-04-05 2012-02-01 Société Civile "GALILEO 2011" Optoelectronic device for determining relative movements or relative positions of two objects
US20070242358A1 (en) 2006-04-18 2007-10-18 Xerox Corporation Fabry-perot tunable filter
JP5588310B2 (en) 2009-11-15 2014-09-10 プライムセンス リミテッド Optical projector with beam monitor
JP5488908B2 (en) 2010-06-14 2014-05-14 カシオ計算機株式会社 projector
JP5833546B2 (en) 2010-11-09 2015-12-16 パナソニック株式会社 Distance measuring device and distance measuring method
TW201245842A (en) 2011-05-05 2012-11-16 Asia Optical Co Inc Laser projection system
JP6314553B2 (en) 2014-03-07 2018-04-25 株式会社リコー Laser light source device and projection display device
WO2015148604A1 (en) * 2014-03-25 2015-10-01 Massachusetts Institute Of Technology Space-time modulated active 3d imager
DE102015101424B4 (en) 2015-01-30 2017-04-27 pmdtechnologies ag lighting device
US11218688B2 (en) 2016-01-04 2022-01-04 Occipital, Inc. Apparatus and methods for three-dimensional sensing
WO2017149092A2 (en) * 2016-03-02 2017-09-08 Optotune Ag Optical device, particularly camera, particularly comprising autofocus, image stabilization and super resolution
US10362295B2 (en) * 2016-09-19 2019-07-23 Apple Inc. Optical apparatus with beam steering and position feedback
CN107102506B (en) * 2017-07-07 2022-08-02 奥比中光科技集团股份有限公司 Optical projection device and depth camera thereof
CN107515503A (en) * 2017-09-30 2017-12-26 广东欧珀移动通信有限公司 Optical filter, camera lens module and imaging modules
CN107608167A (en) * 2017-10-11 2018-01-19 深圳奥比中光科技有限公司 Laser projection device and its method of controlling security
CN107942612A (en) * 2017-11-24 2018-04-20 深圳奥比中光科技有限公司 The optical projection apparatus and its method for packing of the film containing monitoring
CN108490630B (en) * 2018-03-12 2019-10-22 Oppo广东移动通信有限公司 Laser projection mould group, depth camera and electronic device
CN108388072B (en) * 2018-02-27 2020-01-10 Oppo广东移动通信有限公司 Laser projection module, depth camera and electronic device
CN108508687B (en) * 2018-03-12 2021-06-18 Oppo广东移动通信有限公司 Laser projection module, depth camera and electronic device

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