TW201944650A - Low noise block down-converter with integrated feed, housing structure thereof, and assembling method thereof - Google Patents

Abstract

The present disclosure provides a low noise block down-converter with integrated feed, a housing structure of the same, and a method of assembing the same. In some embodiments of the present disclosure, the housing structure of low noise block down-converter with integrated feed includes first part having a recess, second part adjacent to the first part; wherein the second part has some conducting slots in its interior and some first holes on its outside surface. The first holes connect to the recess through the conducting slots.

Description

Wave collector, shell structure thereof, and assembly method thereof

This disclosure relates to a current collector, a housing structure thereof, and an assembly method thereof, and more particularly to a housing structure of a current collector through which the wires of several F-type connectors can be connected to the same printed circuit board.

A low noise block down-converter with integrated feed (LNBF) is an important component used to receive satellite communication signals. After the horn-shaped feeder receives the signal from the satellite, the down-converting circuit board on the concentrator can down-frequency the received signal and convert it into an intermediate frequency signal, and the F-type connector transmits the intermediate frequency signal to the regulator. Converter / demodulator. In the prior art, a plurality of F-type connectors are connected to a plurality of frequency-reducing circuit boards. The plurality of frequency-reducing circuit boards need to be connected by thru pins, and soldering and waterproof silicon adhesive are required to connect The wires of the F-type connector are connected to the down-frequency circuit board located on different planes. Under the circumstances, the present invention proposes a wave collector, which only needs to use a frequency-reducing circuit board. In this way, it can achieve miniaturization, reduce cost, facilitate assembly, and improve electrical characteristics. The above description of the "prior art" is only for providing background technology. It does not recognize that the above description of the "prior technology" reveals the subject of this disclosure, does not constitute the prior technology of this disclosure, and any description of the "prior technology" above. Neither shall be part of this case.

Some embodiments of the present disclosure provide a housing structure of a current collector. The housing structure of the current collector includes: a first portion having a groove; and a second portion adjacent to the first portion; wherein the inside of the second portion has a plurality of guide grooves, and a portion of the second portion There are a plurality of first holes on the outer surface; wherein the first holes communicate with the grooves through the guide grooves. In some embodiments of the present disclosure, the shell structure of the current collector further includes a horn-shaped power feeder connected to the first part. In some embodiments of the present disclosure, a plurality of second holes are formed on a side surface of the first portion, and communicate with the grooves. In some embodiments of the present disclosure, an outer surface of the second portion is coplanar with a side surface of the first portion. In some embodiments of the present disclosure, when viewed from a direction facing the groove, the positions of the second holes and the first holes are staggered. In some embodiments of the present disclosure, when viewed from a direction facing the groove, the second holes are located forward and the first holes are located rearward. In some embodiments of the present disclosure, the guide grooves are at an angle, so that when the wire enters from the first holes and passes through the guide grooves, it is automatically guided to the groove along the angle. In some embodiments of the present disclosure, the wire is a wire of an F-type connector. Some embodiments of the present disclosure provide a current collector. The current collector includes: a shell structure, a horn-shaped feeder, a plurality of first F-type connectors, and a frequency reduction circuit board. The housing structure includes: a first portion having a groove; and a second portion adjacent to the first portion; wherein the inside of the second portion has a plurality of guide grooves, and an outer surface of the second portion has A plurality of first holes; wherein the first holes communicate with the grooves through the guide grooves. The horn-shaped feeder is connected to the first part. The first F-type connectors are disposed on the housing structure through the first holes. The frequency reduction circuit board is disposed in the groove, wherein the wires of the first F-type connectors pass through the guide grooves and are electrically connected to the frequency reduction circuit board. In some embodiments of the present disclosure, the frequency reduction circuit board is a printed circuit board. In some embodiments of the present disclosure, a plurality of second holes are formed on a side surface of the first portion, and communicate with the grooves. In some embodiments of the present disclosure, the current collector further includes: a plurality of second F-type connectors disposed on the housing structure through the second holes; wherein the wires of the F-type connectors are electrically connected to The down frequency circuit board. In some embodiments of the present disclosure, the outer surface of the second portion is coplanar with the side of the first portion, and the F-type connectors disposed on the housing structure are disposed on a coplanar surface. In some embodiments of the present disclosure, when viewed from a direction facing the groove, the F-type connectors disposed in the second holes are staggered from the F-type connectors disposed in the first holes. In some embodiments of the present disclosure, when viewed from a direction facing the groove, the second F-type connectors disposed in the second holes are located in the front, and the first F-type connectors disposed in the first holes An F-type connector is located at the rear. Some embodiments of the present disclosure provide a method for assembling a current collector. The assembling method includes providing a shell structure including a first part having a groove; and a second part adjacent to the first part; wherein the second part has a plurality of guide grooves inside, and the second part There are a plurality of first holes on an outer surface of, wherein the first holes communicate with the grooves through the guide grooves. The assembling method then passes the wires of several first F-type connectors through the guide groove to reach the groove; after that, the assembling method sets a frequency-reducing circuit board in the groove and the first F-type connectors The lead of the type connector is electrically connected to the down-frequency circuit board. In some embodiments of the present disclosure, there are a plurality of second holes on a side surface of the first portion, which communicate with the grooves; the assembly method further includes: setting a plurality of second F-type connectors through the second holes On the shell structure, the wires of the second F-type connectors are electrically connected to the frequency reduction circuit board. The technical features and advantages of this disclosure have been outlined quite extensively above, so that the detailed description of this disclosure below can be better understood. Other technical features and advantages that constitute the subject matter of the patent application of this disclosure will be described below. Those with ordinary knowledge in the technical field to which this disclosure belongs should understand that the concepts and specific embodiments disclosed below can be used quite easily to modify or design other structures or processes to achieve the same purpose as this disclosure. Those with ordinary knowledge in the technical field to which this disclosure belongs should also understand that such equivalent constructions cannot be separated from the spirit and scope of this disclosure as defined by the scope of the attached patent application.

The following description of this disclosure is accompanied by the drawings incorporated in and constitutes a part of the description to explain the embodiment of this disclosure, but this disclosure is not limited to this embodiment. In addition, the following embodiments can be appropriately integrated with the following embodiments to complete another embodiment. "One embodiment", "embodiment", "exemplified embodiment", "other embodiment", "another embodiment", etc. refer to the embodiment described in this disclosure may include specific features, structures, or characteristics, however Not every embodiment must include the particular feature, structure, or characteristic. Furthermore, the repeated use of the phrase "in the embodiment" does not necessarily refer to the same embodiment, but may be the same embodiment. In order that this disclosure may be fully understood, the following description provides detailed steps and structures. Obviously, the implementation of this disclosure does not limit the specific details known to those skilled in the art. In addition, the known structures and steps are not described in detail, so as not to unnecessarily limit the present disclosure. The preferred embodiments of the present disclosure are detailed below. However, in addition to the embodiments, the disclosure can be widely implemented in other embodiments. The scope of this disclosure is not limited to the content of the embodiments, but is defined by the scope of patent application. "One embodiment", "embodiment", "exemplified embodiment", "other embodiment", "another embodiment", etc. refer to the embodiment described in this disclosure may include specific features, structures, or characteristics, however Not every embodiment must include the particular feature, structure, or characteristic. Furthermore, the repeated use of the phrase "in the embodiment" does not necessarily refer to the same embodiment, but may be the same embodiment. The present disclosure relates to a wave collector, a shell structure thereof, and an assembling method thereof. The shell structure has a number of holes on the outer surface and a plurality of guide grooves in the inside. The guide grooves communicate the holes with the grooves for the down-frequency circuit board. The groove reaches the groove, so it can be electrically connected to the same down frequency circuit board. In order that this disclosure may be fully understood, the following description provides detailed steps and structures. Obviously, the implementation of this disclosure does not limit the specific details known to those skilled in the art. In addition, the known structures and steps are not described in detail, so as not to unnecessarily limit the present disclosure. The preferred embodiments of the present disclosure are detailed below. However, in addition to the embodiments, the disclosure can be widely implemented in other embodiments. The scope of this disclosure is not limited to the content of the embodiments, but is defined by the scope of patent application. One aspect of the housing structure of the current collector of the present disclosure is described below with reference to FIGS. 1 to 6. FIG. 1 and FIG. 2 are full views, illustrating the housing structure 100 of the wave collector of some embodiments of the present disclosure from different perspectives. Referring to FIG. 1, in some embodiments, the housing structure 100 includes a first portion 102 (a body) and a second portion 104 (a guide portion). In some embodiments, the first portion 102 has a groove 108 (see FIG. 5, which is further described below), and the down-converting circuit board 109 may be disposed in the groove 108. In some embodiments, the housing structure 100 may be a one-piece structure or a structure assembled from components (such as a body and a guide portion). The term "assembly" is not limited to any assembly method, and can be any assembly method that prevents relative movement between parts, such as bolts, snaps, gluing, etc. With continued reference to FIG. 1, in some embodiments, the housing structure 100 further includes a horn-shaped power feeder 106 connected to the first portion 102 and configured to receive signals from satellites. In some embodiments, the horn-shaped feeder 106 may include a single horn-shaped feeding structure configured to receive microwave signals from a single satellite. In some embodiments, the horn-shaped feeder 106 may include a plurality of horn-shaped feeding structures configured to receive microwave signals from a plurality of satellites. The horn-shaped power feeder 106 exemplarily illustrated in the present disclosure has a single horn-shaped power feeding structure. However, the disclosure is not limited to this. For example, the housing structure 100 may include other horn feeders in addition to the horn feeder 106. With continued reference to FIG. 1, in some embodiments, several F-type connectors may be disposed on the second portion 104, such as the first F-type connectors 112-2 and 112-4. In some embodiments, several F-type connectors may be disposed on the first portion 102, such as the second F-type connectors 112-1 and 112-3. Referring to FIG. 2, in some embodiments, the relative positional relationship between the first portion 102 and the second portion 104 may be an “L” shape, but is not limited thereto. It should be noted that from this perspective, the second F-type connector 112-3 and the first F-type connector 112-4 are blocked by the second F-type connector 112-1 and the first F-type connector 112-2. , So it is not shown. 3 and 4 are cross-sectional views illustrating the internal structure of the casing structure 100 of FIG. 1 after being sectioned along lines A-A and B-B. It should be noted that the cross-sectional view taken along the line AA in FIG. 3 is a cross-section taken from where the first F-type connector 112-2 is located, the second F-type connector 112-1 is not shown, and the first F-type connector 112 -4 is blocked by the first F-type connector 112-2 (not shown). 4 is a cross-sectional view taken along the line B-B, which is a cross-section taken from the place where the first F-type connector 112-4 is located. The F-type connectors 112-1 to 112-3 are not shown. Referring to FIGS. 3 and 4, in some embodiments, the outer surface of the second portion 104 has a first hole 110. In some embodiments, the F-type connector may be mounted on the housing structure 100 through the first hole 110, such as the first F-type connectors 112-2 and 112-4. With continued reference to FIGS. 3 and 4, in some embodiments, a second hole 114 (114 is indicated in FIG. 5) is formed on the side of the first portion 102. In some embodiments, the F-type connector can be mounted on the housing structure 100 through the second hole 114, such as the second F-type connectors 112-1 and 112-3 (see FIG. 1). In some embodiments, the outer surface of the second portion 104 is coplanar with the side of the first portion 102, so the first hole 110 and the second hole 114 are coplanar, and the F-type connectors 112-1 to 112-4 are all coplanar , But not limited to this. In some embodiments, the outer surface of the second portion 104 and the side of the first portion 102 are coplanar on different horizontal planes. For example, the horizontal plane of the two has a height difference, but is not limited thereto. It should be noted that the number of the first holes and the second holes may be any number, and the number of the F-type connectors provided on the housing structure 100 may also be any number. The present disclosure exemplifies that the housing structure 100 has two first holes 110 and two second holes 114, and four F-type connectors are installed on the housing structure 100, but the invention is not limited thereto. In some embodiments, the shell structure 100 has N first holes and M second holes, where N is an integer greater than one and M is an integer greater than zero, where N and M may be the same or different. Referring back to FIGS. 1 and 2, in some embodiments, the positions of the first hole 110 and the second hole 114 are staggered when viewed from a direction facing the groove 108. That is, when viewed from the direction facing the groove 108, the F-type connectors 112-1 to 112-4 do not block each other. In some embodiments, viewed from the direction facing the groove 108, the second hole 114 is located forward and the first hole 110 is located rearward. With continued reference to FIGS. 3 and 4, the second portion 104 (also referred to as the guide portion) has a guide groove 105 inside, and the first hole 110 communicates with the groove 108 through the guide groove 105. The second hole 114 directly communicates with the groove 108 without the guide groove 105. Referring back to FIG. 2, in some embodiments, the guide groove 105 is at an angle, viewed from the outside, such as an angle emphasized by the dashed line 120. Referring to the cross-sectional views of FIGS. 3 and 4, the internal structure of the angle can be further seen. FIG. 5 is a full view illustrating the housing structure 100 and the printed circuit board 109 of the wave collector of FIG. 1 from different perspectives. Referring to FIG. 5, in some embodiments, the first portion 102 (also referred to as the body) has a recess 108 configured to provide a circuit board. In some embodiments, the groove 108 may be configured to provide a printed circuit board 109, but is not limited thereto. Continuing to refer to FIG. 5, and referring to FIG. 3 and FIG. 4 at the same time, in some embodiments, the first F-type connectors 112-2 and 112-4 are mounted on the housing structure 100 through the first hole 110. A hole 110 communicates with the groove 108 through the guide groove 105, so the wires 116-2 and 116-4 of the first F-type connector 112-2 and 112-4 can be automatically followed by the angle of the guide groove 105. Guided to the groove 108. It should be noted that the guide groove 105 leads from the first hole 110 to the groove 108, and does not include other openings except for opening at both ends. Continuing to refer to FIG. 5, and referring to FIG. 3 and FIG. 4 at the same time, in some embodiments, the second F-type connectors 112-1 and 112-3 are mounted on the housing structure 100 through the second hole 114. The two holes 114 are directly communicated with the grooves 108, so the wires 116-1 and 116-3 of the second F-type connectors 112-1 and 112-3 can directly enter the grooves 108 without passing through the guide grooves 105. With continued reference to FIG. 5, the wires 116-2 and 116-4 guided by the guide groove 105 are further electrically connected to the printed circuit board grooves 117-2 and 117-4. The wires 116-1 and 116-3 that are not guided by the guide groove 105 are further electrically connected to the printed circuit board grooves 117-1 and 117-3. In this way, the wires 116-1 to 116-4 are all electrically connected to the same printed circuit board 109. FIG. 6 is a full view illustrating a state in which the wires 116-1 to 116-4 are electrically connected to the printed circuit board 109 in some embodiments of the present disclosure. Referring to FIG. 5 and FIG. 6, in some embodiments, when viewed from the direction facing the groove 108, the F-type connectors 112-1 to 112-4 are staggered from each other so as not to block each other. In some embodiments, when viewed from the direction facing the groove 108, the second F-type connectors 112-1 and 112-3 are located in the front, and the first F-type connectors 112-2 and 112-4 are located in the rear, where the first The wires 116-2 and 116-4 of the F-type connector 112-2 and 112-4 extend forward and can be electrically connected to the same printed circuit board 109 as the wires 116-1 and 116-3. The following describes the current collector of the present disclosure with reference to FIGS. 7 and 8. FIG. 7 is a full view illustrating a wave collector 700 according to some embodiments of the present disclosure. FIG. 8 is an exploded view illustrating the components of the current collector 700 of FIG. 7. It should be noted that the F-type connectors 112-1 to 112-4 are not marked for the sake of simplicity. Please refer to Figure 1 for their relative positions. Referring to FIG. 8, in some embodiments, the current collector 700 includes a housing structure 100 and a printed circuit board 109. In some embodiments, the current collector 700 includes an F-type connector, such as the F-type connectors 112-1 to 112-4 of FIG. It should be noted that in FIG. 8, the F-type connector has been provided on the housing structure 100, and the inner liner of the F-type connector (the cylinder connected by the wires 116-1 to 116-4) can be placed in the F-type The connector is installed along a path shown by a dotted line, for example, so that the wires 116-1 to 116-4 are electrically connected to the printed circuit board 109 on the housing structure 100. During assembly, the liner can be placed in the F-type connector, and then the F-type connector can be set on the housing structure 100. The detailed assembly process is described later. It should be noted that in FIG. 8, the wires 116-2 and 116-4 are in a bent state, but the wires 116-2 and 116-4 are passed through the guide groove after the first F-type connector is disposed in the first hole. Automatically bends at 105 o'clock. In some embodiments, after the wires 116-2 and 116-4 are installed in the first hole, they are bent by using an assembly tool. Referring to FIG. 8, in some embodiments, the current collector 700 further includes housings 702-1 to 702-4 configured to protect the current collector 700. The following describes another aspect of the housing structure of the current collector with reference to FIG. 9 and FIG. 10, wherein the same symbols represent the same components, and will not be described again. FIG. 9 and FIG. 10 are full views, illustrating the housing structure 400 of the wave collector of some embodiments of the present disclosure from different perspectives. Referring to FIGS. 9 and 10, the housing structure 400 and the housing structure 100 have similar structures, the difference is only that the guide grooves of the second portion 104 (also referred to as the guide portion) of the housing structure 400 have different angles, for example, as shown in FIG. An angle emphasized by the dashed line 120, wherein the angle does not automatically guide the wire to the groove 108, and an assembly tool may be used to guide the wire to the groove 108 at this time, but is not limited thereto. It should be noted that, in this disclosure, the first and second parts of the housing structure 400 and the housing structure 100 have the same characteristics. For example, the first part has a groove and is configured to provide a frequency reduction circuit board. The outer surfaces of the two parts each have a first hole, and a first F-type connector can be provided, and each has a guide groove, which is configured to communicate the first hole with the groove. Therefore, the shell structure 400 and the shell structure 100 can achieve the same technical effect: the wires of the F-type connector can be electrically connected to the same frequency reduction circuit board. It should be noted that, on the housing structure 400, the first F-type connectors 112-2 and 112-4 are offset to the right relative to the second F-type connectors 112-1 and 112-3, as shown in FIG. 9 . In the housing structure 100, the first F-type connectors 112-2 and 112-4 are offset to the left relative to the second F-type connectors 112-1 and 112-3, as shown in FIG. However, the disclosure is not limited to this. For example, on the housing structure 400, the first F-type connectors 112-2 and 112-4 may be offset to the left relative to the second F-type connectors 112-1 and 112-3. Referring to FIGS. 9 and 10, in some embodiments, the second F-type connectors 112-1 and 112-3 are mounted on the housing structure 400 through the second holes 114. The wires of the second F-type connectors 112-1 and 112-3 enter from the second hole 114 and directly reach the groove 108. In some embodiments, the first F-type connectors 112-2 and 112-4 are mounted on the housing structure 400 through the first hole 110, and the wires of the first F-type connectors 112-2 and 112-4 are After the first hole 110 is entered, the guide groove does not automatically guide the wire to the groove 108. At this time, the assembly tool can be used to pull the wire to the groove 108. In this way, the F-type connector 112-1 to 112-4 Can be electrically connected to the same down-converting circuit board. The method of assembling the current collector 700 according to the present disclosure is described below with reference to FIG. 8, where the current collector 700 uses a housing structure 100. Referring to FIG. 8, in some embodiments, a method of assembling the current collector 700 includes providing a housing structure 100. Pass the wires 116-2 and 116-4 of the first F-type connector through the guide groove 105 and reach the groove 108 (see FIGS. 3 and 4). A printed circuit board 109 is disposed in the groove 108. The wires 116-2 and 116-4 are electrically connected to the printed circuit board 109. It should be noted that, during the assembly process, the inner liner (connected with the lead) can be put into the first F-type connector, and then the first F-type connector is set on the housing structure 100. With continued reference to FIG. 8, in some embodiments, a second F-type connector is disposed on the housing structure 100 via a second hole. The wires 116-1 and 116-3 of the second F-type connector are electrically connected to the printed circuit board 109. The method of assembling the wave collector 700 using the case structure 400 is described below with reference to FIG. 8. It should be noted that the casing structure 400 and the casing structure 100 have similar structures, the difference is only that the guide grooves of the second part of the casing structure 400 have different angles. Referring to FIG. 8, in some embodiments, the method of assembling the current collector 700 includes providing a housing structure 400 and using an assembly tool to pull the wires 116-2 and 116-4 of the first F-type connector to the groove 108. A printed circuit board 109 is disposed in the groove 108. The wires 116-2 and 116-4 are electrically connected to the printed circuit board 109. It should be noted that, during the assembly process, the inner liner (connected with the lead) can be put into the first F-type connector, and then the first F-type connector is set on the housing structure 400. With continued reference to FIG. 8, in some embodiments, the second F-type connectors 112-1 and 112-3 are disposed on the housing structure 400 via the second holes. The wires 116-1 and 116-3 of the second F-type connector are electrically connected to the printed circuit board 109. Some embodiments of the present disclosure provide a housing structure of a current collector. The housing structure of the current collector includes: a first portion having a groove; and a second portion adjacent to the first portion; wherein the inside of the second portion has a plurality of guide grooves, and a portion of the second portion There are a plurality of first holes on the outer surface; wherein the first holes communicate with the grooves through the guide grooves. Some embodiments of the present disclosure provide a current collector. The current collector includes: a shell structure, a horn-shaped feeder, a plurality of first F-type connectors, and a frequency reduction circuit board. The housing structure includes: a first portion having a groove; and a second portion adjacent to the first portion; wherein the inside of the second portion has a plurality of guide grooves, and an outer surface of the second portion has A plurality of first holes; wherein the first holes communicate with the grooves through the guide grooves. The horn-shaped feeder is connected to the first part. The first F-type connectors are disposed on the housing structure through the first holes. The frequency reduction circuit board is disposed in the groove, wherein the wires of the first F-type connectors pass through the guide grooves and are electrically connected to the frequency reduction circuit board. Some embodiments of the present disclosure provide a method for assembling a current collector. The assembling method includes providing a shell structure including a first part having a groove; and a second part adjacent to the first part; wherein the second part has a plurality of guide grooves inside, and the second part There are a plurality of first holes on an outer surface of, wherein the first holes communicate with the grooves through the guide grooves. The assembling method then passes the wires of several first F-type connectors through the guide groove to reach the groove; after that, the assembling method sets a frequency-reducing circuit board in the groove and the first F-type connectors The lead of the type connector is electrically connected to the down-frequency circuit board. Although the disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and substitutions can be made without departing from the spirit and scope of the disclosure as defined by the scope of the patent application. For example, many of the processes described above can be implemented in different ways, and many of the processes described above can be replaced with other processes or combinations thereof. Moreover, the scope of the present application is not limited to the specific embodiments of the processes, machinery, manufacturing, material compositions, means, methods and steps described in the description. Those skilled in the art can understand from the disclosure of this disclosure that according to this disclosure, they can use existing, or future developmental processes, machinery, manufacturing, materials that have the same functions or achieve substantially the same results as the corresponding embodiments described herein. Composition, means, method, or step. Accordingly, such processes, machinery, manufacturing, material compositions, means, methods, or steps are included in the scope of the patent application of this application.

100‧‧‧shell structure

102‧‧‧ Part I

104‧‧‧ Part Two

105‧‧‧Guide

106‧‧‧ Angular Feeder Structure

108‧‧‧ groove

109‧‧‧printed circuit board

110‧‧‧The first hole

112-1‧‧‧Second F-type connector

112-2‧‧‧The first F-type connector

112-3‧‧‧Second F-type connector

112-4‧‧‧The first F-type connector

114‧‧‧Second Hole

116-1‧‧‧Wire

116-2‧‧‧Wire

116-3‧‧‧Wire

116-4‧‧‧Wire

117-1‧‧‧Printed circuit board groove

117-2‧‧‧Printed circuit board groove

117-3‧‧‧ printed circuit board groove

117-4‧‧‧ printed circuit board groove

120‧‧‧ dotted line

400‧‧‧shell structure

700‧‧‧concentrator

702-1‧‧‧Shell

702-2‧‧‧shell

702-3‧‧‧Shell

702-4‧‧‧Shell

When referring to the drawings combined with the embodiments and the scope of the patent application, the disclosure in this application can be understood more fully. The same component symbols in the drawings refer to the same components. 1 and 2 are full views, illustrating the housing structure of the wave collector of some embodiments of the present disclosure from different perspectives. 3 and 4 are cross-sectional views illustrating the internal structure of the casing structure of FIG. 1 after being sectioned along lines A-A and B-B. FIG. 5 is a full view illustrating the housing structure and the printed circuit board of the wave collector of FIG. 1 from different perspectives. FIG. 6 is a full view illustrating a state in which the wires are electrically connected to the printed circuit board in some embodiments of the present disclosure. FIG. 7 is a full view illustrating a wave collector of some embodiments of the present disclosure. FIG. 8 is an exploded view illustrating the components of the current collector of FIG. 7. FIG. 9 and FIG. 10 are full views, illustrating the housing structure of the wave collector of some embodiments of the present disclosure from different perspectives.

Claims (17)

A housing structure of a current collector includes: a first portion having a groove; and a second portion adjacent to the first portion, wherein the second portion has a plurality of guide grooves in the interior, and the second portion has A plurality of first holes are formed on an outer surface; wherein the first holes communicate with the grooves through the guide grooves. The housing structure of the current collector according to claim 1, further comprising a horn-shaped power feeder connected to the first part. The housing structure of the wave collector according to claim 1, wherein a side surface of the first part has a plurality of second holes, which communicate with the grooves. The housing structure of the wave collector according to claim 3, wherein an outer surface of the second portion is coplanar with a side surface of the first portion. The housing structure of the wave collector according to claim 3, wherein the positions of the second holes and the first holes are staggered when viewed from a direction facing the groove. The housing structure of the wave collector according to claim 3, wherein the second holes are located in the front and the first holes are located in the rear when viewed from a direction facing the groove. The housing structure of the wave collector according to claim 1, wherein the guide grooves are at an angle so that when the wire enters from the first holes and passes through the guide grooves, it is automatically guided along the angle. To the groove. The housing structure of the wave collector according to claim 5, wherein the wire is a wire of an F-type connector. A wave collector, comprising: the shell structure of the wave collector according to claim 1; a horn-shaped power feeder connected to the first part; a plurality of first F-type connectors provided through the first holes On the housing structure; and a frequency reduction circuit board disposed in the groove; wherein the wires of the first F-type connectors pass through the guide grooves and are electrically connected to the frequency reduction circuit board. The wave collector according to claim 9, wherein the frequency reduction circuit board is a printed circuit board. The wave collector according to claim 9, wherein a side surface of the first portion has a plurality of second holes, which communicate with the grooves. The wave collector according to claim 11, further comprising: a plurality of second F-type connectors provided on the housing structure through the second holes; wherein the wires of the F-type connectors are electrically connected to the dropout Frequency circuit board. The wave collector according to claim 12, wherein the outer surface of the second part is coplanar with the side of the first part, and the F-type connectors provided on the housing structure are provided on a coplanar surface. The wave collector according to claim 12, wherein the F-type connectors provided in the second holes and the F-type connectors provided in the first holes are staggered when viewed from a direction facing the groove. The wave collector according to claim 12, wherein when viewed from a direction facing the groove, the second F-type connectors provided in the second holes are located in the front and are disposed in the first holes. The first F-type connectors are located at the rear. A method for assembling a current collector, comprising: providing a housing structure as described in claim 1; passing the wires of a plurality of first F-type connectors through the guide groove to reach the groove; and setting a frequency reduction circuit board In the groove; and electrically connecting the wires of the first F-type connectors to the frequency reduction circuit board. The method for assembling the wave collector according to claim 18, wherein one side surface of the first part has a plurality of second holes communicating with the grooves; the assembling method further includes: passing a plurality of second F-type connectors through the The second holes are arranged on the housing structure; and the wires of the second F-type connectors are electrically connected to the frequency reduction circuit board.