JP2017069138A - Connector, transmission/reception module, and manufacturing method of transmission/reception module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector capable of implementing connector connection inside of a transmission/reception module in a surface-mounted manner while maintaining a structure for suppressing unwanted radiation.SOLUTION: The connector comprises: a connector center conductor 11 including a first end 11a constituting a connector pin, a second end 11b surface-mounted on a printed circuit board 20 constituting a circuit board inside of a transmission/reception module, and a main body part 11c; a connector dielectric 12 covering a periphery of the main body part 11c while exposing the first end 11a and the second end 11b of the connector center conductor 11; and a connector outer conductor 13 formed outside of the connector dielectric 12 and constituting a part of a connector outer wall. The connector center conductor 11 includes a deformation part 11d having lower rigidity than that of the main body part 11c between the second end 11b and the main body part 11c. The connector outer conductor 13 encloses the entire periphery while being opened only in an axial direction of the connector center conductor 11.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a connector, a transmission / reception module, and a method for manufacturing the transmission / reception module, and more particularly to suppression of electromagnetic interference and improvement of mountability in a coaxial connector used in the transmission / reception module.

  The transmission / reception module uses a seed signal amplified and distributed by an exciter (EXR: Exited Resonator) or a solid state power amplifier (SSPA) as a transmission function as an input signal as a transmission function, and a high power amplifier (HPA: High Power Amplifier). Thus, the signal is amplified and output, delivered to the antenna element, and radiated from the antenna element. Further, as a reception function, a signal received from an antenna element is input as an input signal, and the signal is amplified by a low noise amplifier (LNA: Low Noise Amplifier) and transmitted to a receiver. In this specification, a module having a transmission function, a module having a reception function, and a module having a transmission function and a reception function are referred to as a transmission / reception module.

  Coaxial connectors are used for the connection between these transmission / reception modules and related devices, and functions such as suppression of radio wave radiation are required in addition to electrical and mechanical connections.

  Connection with related equipment is supported by a pair of connectors consisting of pins and jacks, and various standards exist. The electrical connection here is achieved by using a holding structure with high contact properties, such as holding the connector pins with springy metal, and the electrical characteristics are such that the contact resistance is reduced and the loss is low It has become. In addition, unnecessary radio waves radiated from the connection portion are structured to prevent leakage as much as possible by the fitting of the center conductor and the shielding effect by the outer conductor.

  As an example of the mechanical connection, as shown in Patent Document 1, it is generally possible to fix a screw by forming a flange having a thread groove in a connector itself such as a panel mount system. . In addition, as for those which are required to save space, there is a case in which the housing itself constituting the connector is subjected to male screw processing and is fixed to the housing subjected to female screw processing.

  A metal casing is used for the transmission / reception module, and there are many configurations in which a ceramic substrate on which a circuit is formed is housed in the metal casing. The ceramic substrate is fixed to a metal plate by bonding or soldering, and the metal plate is installed in a metal casing. In recent years, there are cases where a circuit is formed by a high-performance printed board instead of a ceramic board.

  Conventionally, the connection between the board in the transmission / reception module and the connector center conductor has been generally made by making a surplus length using a wire or a ribbon. A method has been adopted in which the stress of the connection portion due to temperature change is deformed and absorbed by the extra length of the wire or ribbon.

  However, in the connection method using the ceramic substrate or the printed circuit board, there is much unnecessary radiation at the connection portion, and another method for suppressing unnecessary radiation, such as covering the connection portion with a metal cover, is necessary. Further, as printed circuit boards are increasingly used as substrates in transmission / reception modules, connections around semiconductor chips are molded and packaged to form modules. Component connection in the module has been achieved by mounting the component on the printed circuit board to enable electrical connection simultaneously with mechanical fixation, and there are cases where there is no connection other than the connector.

  In that case, it is necessary to connect using a connecting member such as a wire or a ribbon only for connection with the connector, which complicates the module manufacturing process and hinders the reduction of the module manufacturing unit cost.

JP 9-129316 A

  As described above, there is a demand for a structure that suppresses unnecessary radiation for connector connection inside a transmission / reception module such as a transmission / reception module. However, since a stress relaxation structure for the connection portion is required, there is a problem that mounting workability is poor. there were.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a connector that can be realized by surface mounting while having a structure that suppresses unnecessary radiation for connector connection inside a transmission / reception module.

  In order to solve the above-described problems and achieve the object, the present invention includes a first end part constituting a connector pin, a second end part surface-mounted on a circuit board in a transmission / reception module, and a main body. A connector center conductor having a portion, a connector dielectric that exposes the first end and the second end of the connector center conductor, and covers the periphery of the connector, and a part of the connector outer wall formed outside the connector dielectric The connector center conductor is characterized in that a deformed portion having a rigidity lower than that of the main body portion is provided between the second end portion and the main body portion.

  ADVANTAGE OF THE INVENTION According to this invention, the connector which can be implement | achieved by surface mounting can be obtained, having the structure which suppresses unnecessary radiation | emission about the connector connection inside a transmission / reception module.

Sectional drawing which shows the connector of the transmission / reception module of Embodiment 1 It is sectional drawing which shows the connector of the transmission / reception module of Embodiment 1, and is AA sectional drawing of FIG. It is sectional drawing which shows the connector of the transmission / reception module of Embodiment 1, and is BB sectional drawing of FIG. A main part enlarged view of the connector center conductor of the transmission and reception modules of the first embodiment, (a) is a top view, (b) is, C ₁ -C ₁ cross-sectional view of (a) The figure which shows the transmission / reception module of Embodiment 1. The perspective view which shows the connection screw used with the transmission / reception module of Embodiment 1 (A)-(d) is process sectional drawing which shows the mounting process of the connector and transmission / reception module of Embodiment 1. A main part enlarged view of the connector center conductor of the transmission and reception modules according to the second embodiment, (a) is top view, (b) is, C ₂ -C ₂ cross-sectional view of (a) A main part enlarged view of the connector center conductor of the transmission and reception modules of the third embodiment, (a) is a top view, (b) is, C ₃ -C ₃ cross-sectional view of (a) A main part enlarged view of the connector center conductor of the transmission and reception modules of the fourth embodiment, (a) is a top view, (b) is, C ₄ -C ₄ cross-sectional view of (a) The figure which shows the transmission / reception module of Embodiment 5.

  Hereinafter, a connector and a transceiver module according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited by this embodiment, In the range which does not deviate from the summary, it can change suitably. In the drawings shown below, the scale of each layer or each member may be different from the actual for easy understanding, and the same applies to the drawings. Further, even a cross-sectional view may not be hatched for easy viewing of the drawing.

Embodiment 1 FIG.
Below, the connector and transmission / reception module of Embodiment 1 of this invention are demonstrated in detail based on drawing. FIG. 1 is a cross-sectional view showing a connector of the transmission / reception module according to the first embodiment, and FIGS. 2 and 3 are cross-sectional views taken along lines AA and BB in FIG. FIG. 1 is a cross-sectional view of the connector parallel to the substrate. 4A is a top view of the connector center conductor of the transmission / reception module according to the first embodiment, and FIG. 4B is a C ₁ -C ₁ cross-sectional view of the connector center conductor. FIG. 1 shows a cross-sectional view of the surface including the connector center conductor, and the printed circuit board 20 can be seen in a portion where the connector outer conductor 13 is not present.

  The connector 10 according to the first embodiment includes a connector center conductor 11 having a first end portion 11a constituting a connector pin, a second end portion 11b constituting a connector connecting portion, and a main body portion 11c, and a main body portion. A connector dielectric 12 covering the periphery of the connector 11c and a connector outer conductor 13 formed outside the connector dielectric 12 and constituting the connector outer wall are provided. The second end is surface-mounted on a printed circuit board 20 as a circuit board in the transmission / reception module. The connector dielectric 12 covers the periphery of the main body portion 11c and exposes the first end portion 11a and the second end portion 11b of the connector center conductor 11. The connector outer conductor 13 has a structure that opens only in the axial direction of the connector center conductor 11 and surrounds the entire periphery. And the deformation | transformation part 11d which consists of a narrow part whose rigidity is lower than the main-body part 11c was provided between the 2nd end part 11b of the connector center conductor 11, and the main-body part 11c, It is characterized by the above-mentioned.

  The printed circuit board 20 is configured by forming a wiring portion 22 made of a conductive thin film on the surface of an insulating substrate 21. As for the wiring pattern constituting the wiring part 22, only the wiring pattern around the connection pad 22P for connection with the connector center conductor 11 is shown in FIG. 1, and the other is omitted. Further, surface mount components composed of functional components such as a transmission chip and a reception chip are mounted on the printed circuit board 20, but these surface mount components are also omitted.

  The connector 10 according to the first embodiment includes a wall portion 13A that surrounds the connector connection portion so as not to diffuse unnecessary radiation generated from the printed circuit board 20 and the second end portion 11b that forms the connector connection portion, a connector outer conductor 13, and the like. Is an integral structure.

Further, as shown in FIGS. 4 (a) and 4 (b), which are enlarged views of the main part of the connector center conductor of the transmission / reception module according to the first embodiment, the connector center conductor 11 includes a deformed portion 11d composed of a narrow portion. 4A is a top view and FIG. 4B is a C ₁ -C ₁ cross-sectional view of FIG. 4A. The deformed portion 11d is narrower and thinner than the second end portion 11b, and is a portion that is less rigid than the main body portion 11c, the first end portion 11a, and the second end portion 11b. Due to the presence of the deforming portion 11d, the structure is such that stress due to temperature change can be deformed and absorbed even when soldered to the connection pad 22P formed by the wiring portion 22 of the printed circuit board 20. The connector center conductor 11 is formed by cutting phosphor bronze.

  The connector outer conductor 13 is a metal conductor made of a copper alloy having a linear expansion coefficient close to that of the printed circuit board 20. It is desirable that the copper alloy is subjected to an appropriate surface treatment to prevent corrosion. The connector outer conductor 13 has a wall portion 13A for shielding unnecessary radiated radio waves in the vicinity of the connector connecting portion. The wall portion 13A has a U-shaped portion 13B having a U-shaped cross section that is open only in the direction in which the wiring portion 22 is extended, and the connector is used for the U-shaped tip portion. The shape is changed according to the frequency so that unnecessary radiation generated from the connection portion is not propagated inside the transmission / reception module. Further, the connection portion between the second end portion 11 b of the connector center conductor 11 and the wiring portion 22 of the printed circuit board 20 is opened only in the direction in which the wiring portion 22 is extended, and is entirely surrounded by the connector outer conductor 13. Therefore, unnecessary radiation is prevented from propagating inside the transmission / reception module.

FIG. 5 is a diagram illustrating the transmission / reception module 100 according to the first embodiment. The transmission / reception module 100 configures the transmission connector 10 _I on the right side of FIG. 5 and the reception connector 10 _O on the left side. A printed circuit board 20 is arranged in a concave portion inside the metal module case 1 and is electrically connected to the connector 10, and an EMI (Electro) made of a metal module cover 3 and an elastic body such as a metal mesh or conductive rubber. It is connected via a gasket (Magnetic Interface) 2. Regarding the electrical connection, the printed circuit board 20 installed inside the transmission / reception module 100 is connected by the second end portion 11 b of the connector center conductor 11 and the wiring portion 22. Here, as the substrate material, a low-loss printed circuit board in which an insulating substrate 21 such as a resin excellent in high frequency characteristics is formed with a wiring portion 22 made of a thin film wiring or a thick film wiring is employed. On the printed circuit board 20, the transmitting chip 30 and the receiving chip 32 mounted on the surface mounting package are connected to the wiring part 22 by solder bonding with the terminals 31 and 33, respectively. As for the wiring connection between the connector center conductor and the wiring portion, the wiring portion 22 and the second end portion 11b of the connector center conductor 11 are connected by solder bonding.

  Furthermore, since unnecessary radiation of radio waves is generated from the connector connecting portion, a structure that shields the space is necessary to prevent these from affecting the outside of the transmission / reception module 100 or other devices in the transmission / reception module 100. As a structure for shielding the space, the module cover 3 separates the inside and the outside of the module, and the EMI gasket 2 can shield a slight gap between the module cover 3 and the module case 1. The EMI gasket 2 also needs elasticity to improve shielding properties while maintaining conductivity.

  In the connector 10 according to the first embodiment, as shown in FIG. 2, the connector outer conductor 13 covers the connecting portion including the second end portion 11b of the connector center conductor 11 and constitutes a contact pin. The wall portion covering the first end portion 11a of the eleventh body has an integral structure. The connector outer conductor 13 is fixed by inserting a connection screw 14 made of a hexagon socket set screw into a screw hole h provided in the connector outer conductor 13 and pressing the printed board 20 from above. As shown in the perspective view of the connection screw used in the transmission / reception module of Embodiment 1, FIG. 6 shows a thread groove formed on the outer surface of the connection screw 14 and a hexagonal hole 14h formed inside. By inserting a jig into the hole 14h and rotating it, the connection screw 14 is screwed into the screw hole h formed in the connector outer conductor 13. The connector outer conductor 13 is made of a copper alloy having a linear expansion coefficient close to that of the printed circuit board 20. The copper alloy shall be subjected to appropriate surface treatment to prevent corrosion. Furthermore, it shall have a wall part for shielding the unnecessary radiation | emission radio | wires near the connection part of a connector. The wall part shall have a U-shaped cross section that is open only in the direction in which the wiring is extended, and the tip of the U-shaped part changes depending on the frequency at which the connector is used, and is generated from the connection part. The unnecessary radiation is prevented from propagating into the transceiver module 100.

  Further, the wall portion of the connector outer conductor 13 is covered with the module cover 3 on the upper side. However, if necessary, the connector may be inserted into a case covering the entire connector outer conductor 13 and the case covered. .

  The connector dielectric 12 portion of the connector 10 is made of fluororesin such as tetrafluoroethylene or glass called “Teflon (registered trademark)”, and the connector outer conductor 13 and the connector center conductor 11 are electrically required. It is only necessary to be able to configure the coaxial structure.

  The connector center conductor 11 is made of phosphor bronze having spring properties, but other materials such as beryllium copper may be used. In the case of beryllium copper, it is desirable to form by press working because it has malleability. Further, like the connector outer conductor, the connector center conductor 11 is also subjected to an appropriate surface treatment for preventing corrosion, and at the same time is used for soldering. As for the shape, a narrow portion constituted by the deformed portion 11d serving as a stress absorbing portion is created when entering the inside of the module from the dielectric. By adopting such a structure, the structure absorbs deformation against temperature stress during and after mounting. Moreover, since the connection tip is soldered at the time of surface mounting with the connection pad, the shape is made easy to solder.

  As shown in FIG. 2, the printed circuit board 20 may expose the wiring portion 22 made of the wiring conductor at the contact portion with the connector outer conductor 13, particularly the portion where the connection screw 14 made of a hexagon socket set screw contacts. It is necessary and it is necessary to be grounded by the conductor part which comprises the wiring part 22. FIG. The connection pad 22P has a shape that can be supplied by solder printing and can be connected to the connector center conductor 11 during surface mounting.

  Next, a method for mounting the connector and the transmission / reception module will be described. FIG. 7A to FIG. 7D are process cross-sectional views illustrating a method of mounting the connector and the transmission / reception module. First, as shown in FIG. 7A, an insulating substrate 21 made of resin is prepared, and a printed circuit board 20 is obtained by forming a wiring portion 22. Here, solder printing is performed on the connection pads of the wiring portion 22.

  Next, as shown in FIG. 7B, the terminal 31 of the transmission chip 30 and the terminal 33 of the reception chip 32 made of surface mount components are temporarily connected to the wiring portion 22 of the printed circuit board 20. Here, as surface mount components, there are SOP (Small Outline Package), SOJ (Small Outline J-leaded), CFP (Ceramic Flat Package), QFP (Quad Flat Package), QFJ (Quad Flat J-Readed GA). Ball Grid Array) can be selected as appropriate from components having various surface mounting structures.

  Thereafter, as shown in FIG. 7C, the connector outer conductor 13 with the connector center conductor 11 attached is set from both ends of the printed circuit board 20, and the second end portion 11 b of the connector center conductor 11 is set in the wiring portion 22. Is temporarily fixed, and the connector outer conductor 13 is fixed to the printed circuit board 20. At the time of fixing, a connection screw 14 consisting of a hexagon socket set screw is attached to the screw hole h of the connector outer conductor 13, a jig is inserted into the internal hexagonal hole 14 h and rotated to thereby connect the connection screw 14. Are fixed by screwing.

  Then, solder reflow is performed, and the transmission chip 30 and the reception chip 32 that are surface-mounted components and the second end portion 11 b of the connector center conductor 11 are soldered and fixed to the wiring portion 22 of the printed circuit board 20.

  Finally, as shown in FIG. 7 (d), the printed circuit board 20 and the connector outer conductor 13 of the connector 10 are fitted into the recesses of the module case 1, and the module cover 3 is fixed via the EMI gasket 2.

  As described above, after mounting the transmitting chip 30 and the receiving chip 32 made of surface mounting components on the wiring portion 22 of the printed circuit board 20 on which solder is printed, the connector 10 is set on the printed circuit board 20 and the connection screw 14 Secure with. At this time, solder printing is performed on the connection pad 22P, and the connector center conductor 11 is disposed so as to be in contact with the connection pad 22P. The solder is melted by being heated in the reflow furnace, and the connector center conductor 11 and the connection pad 22P are connected.

  Through the above steps, positioning is easy, and the center of the connector 10 can be installed at a predetermined height. Further, the mechanical connection is realized by pressing the printed circuit board 20 with a connection screw 14 as shown in FIG. Due to the difference in coefficient of linear expansion, the stress applied to the connection pad 22P and the connector center conductor 11 is absorbed by the material of the connector center conductor 11 and the base of the deformed portion 11d located in the protruding portion inside the module. can do. For electrical connection, the connection pad 22P and the connector center conductor 11 are connected by soldering at the second end portion 11b. Since these connections are carried out at the same time during surface mounting, it is not necessary to perform a separate operation for connection.

  The wall formed integrally with the connector outer conductor 13 can limit unnecessary radiation from the connection portion around the connection portion of the connector center conductor 11.

  According to the first embodiment, the wall portion that does not diffuse unnecessary radiation generated from the connector outer conductor and the connector connecting portion has an integral structure. Further, the connector center conductor has a structure capable of deforming and absorbing stress due to temperature change even if it is soldered to the connection pad. As a result, assembly is facilitated, and an inexpensive and excellent quality connector can be obtained.

  As described above, according to the first embodiment, the connection in the transmission / reception module can be simultaneously performed when the surface mounting is performed on the printed circuit board. In addition, unnecessary radiation countermeasures can be taken at the same time as mounting. As a result, it is possible to improve the connectivity in the transmission / reception module and the unnecessary radiation suppression while maintaining the connectivity with the related equipment.

Embodiment 2. FIG.
As shown in FIGS. 8 (a) and 8 (b), which are enlarged views of the main part of the connector center conductor of the transmission / reception module of the second embodiment, the connector center conductor 211 of the connector of the second embodiment is a deformed portion consisting of a narrow portion. 211d. 8A is a top view, and FIG. 8B is a C ₂ -C ₂ cross-sectional view of FIG. 8A. In the first embodiment, the connector center conductor 211 of the connector is a deformed portion having the same thickness as the second end portion 11b and a narrow portion between the second end portion 211b and the main body portion 211c. In the second embodiment, the deformed portion 211d having a constant thickness and a small width is formed. Other parts are the same as those of the connector of the first embodiment. Other parts are the same as those in the first embodiment, and detailed description thereof is omitted.

  The connector of the second embodiment includes a connector center conductor 211 having a first end portion 211a constituting a connector pin, a second end portion 211b constituting a connector connection portion, and a main body portion 211c, and a connector center conductor. The first end portion 211a and the second end portion 211b that cover the main body portion 211c of the 211, and a connector dielectric that covers the periphery, and a connector outer conductor that is formed outside the connector dielectric and forms the connector outer wall; It has. The second end portion 211b is surface-mounted on the printed circuit board 20 in the transmission / reception module. The connector dielectric covers the main body part 211c of the connector center conductor 211 and exposes the first end part 211a and the second end part 211b. A deformable portion 211d including a narrow portion having a lower rigidity than the main body portion 211c is provided between the second end portion 211b and the main body portion 211c. Here, the connector dielectric and the connector outer conductor are omitted.

  In the second embodiment, in addition to the effect of the connector of the first embodiment, the deformed portion 211d has the same thickness as the second end portion 211b, and thus is stable in strength. In addition, the connector center conductor 211 according to the second embodiment can be easily formed by press working, can reduce the number of manufacturing steps, and has the effect of being easy to manufacture.

Embodiment 3 FIG.
As shown in FIGS. 9 (a) and 9 (b), which are enlarged views of the main part of the connector center conductor of the transmission / reception module of the third embodiment, the connector center conductor 311 of the connector of the third embodiment is a deformed portion having a narrow portion. 311d. 9A is a top view, and FIG. 9B is a C ₃ -C ₃ cross-sectional view of FIG. 9A. In the second embodiment, the connector center conductor 211 of the connector has a deformed portion that is the same thickness as the second end portion 211b and is a narrow portion between the second end portion 211b and the main body portion 211c. In the third embodiment, the deformed portion 311d is configured by forming a concavo-convex portion by bending instead of reducing the width. The thickness and width are the same as those of the second end portion 211b, and a deformed portion 311d is formed by bending. Other parts are the same as those of the connector of the second embodiment. Other parts are the same as those in the second embodiment, and detailed description thereof is omitted.

  The connector according to Embodiment 3 includes a connector center conductor 311 having a first end 311a constituting a connector pin, a second end 311b constituting a connector connecting portion, and a main body 311c, and a connector center conductor. 311 includes a connector dielectric covering the periphery of the main body 311c of 311 and a connector outer conductor formed outside the connector dielectric and constituting the connector outer wall. A deformable portion 311d formed of a bent portion having rigidity lower than that of the main body portion 311c is provided between the second end portion 311b and the main body portion 311c. The second end 311b of the connector center conductor 311 is surface-mounted on the printed circuit board 20 in the transmission / reception module. The connector dielectric covers the periphery of the main body 311c of the connector center conductor 311, and exposes the first end 311a and the second end 311b. Here, the connector dielectric and the connector outer conductor are omitted.

  In the third embodiment, in addition to the effect of the connector of the second embodiment, the deformed portion 311d has the same thickness and the same width as the second end portion 311b, so that the strength is further stabilized. In addition, the connector center conductor 311 of the third embodiment can be easily formed by press working, can reduce the number of manufacturing steps, and has the effect of being easy to manufacture.

Embodiment 4 FIG.
As shown in FIGS. 10 (a) and 10 (b), which are enlarged views of the main part of the connector center conductor of the transmission / reception module according to the fourth embodiment, the connector center conductor 411 of the connector according to the fourth embodiment has irregularities formed by dimple processing. A deformation portion 411d is provided. 10A is a top view, and FIG. 10B is a C ₄ -C ₄ cross-sectional view of FIG. 10A. In the second embodiment, the connector center conductor 211 of the connector has a deformed portion that is the same thickness as the second end portion 211b and is a narrow portion between the second end portion 211b and the main body portion 211c. In the third embodiment, the deformed portion 411d is configured by forming a concavo-convex portion by dimple processing instead of reducing the width. A feature is that a deformed portion 411d having the same thickness and width as those of the second end portion 411b and having an uneven portion is formed. Other parts are the same as those of the connector of the second embodiment. Other parts are the same as those in the second embodiment, and detailed description thereof is omitted.

  The connector of the fourth embodiment includes a first end portion 411a that constitutes a connector pin, a second end portion 411b that constitutes a connector connection portion and is surface-mounted on the printed circuit board 20 in the transmission / reception module, and a main body portion. A connector center conductor 411 having a 411c, a connector dielectric covering the periphery of the main body 411c of the connector center conductor 411, and a connector outer conductor formed outside the connector dielectric and constituting the connector outer wall. A deformed portion 411d made of an uneven portion having rigidity lower than that of the main body portion 411c is provided between the second end portion 411b and the main body portion 411c. The second end 411b of the connector center conductor 411 is surface-mounted on the printed circuit board 20 in the transmission / reception module. The connector dielectric covers the periphery of the main body 411c of the connector center conductor 411 and exposes the first end 411a and the second end 411b. Here, the connector dielectric and the connector outer conductor are omitted.

  In the fourth embodiment, in addition to the effect obtained by the connector of the second embodiment, the deformed portion 411d has the same thickness and the same width as the second end portion 411b, so that the strength is further stabilized. In addition, the connector center conductor 411 according to the fourth embodiment can be easily formed by press working, can reduce the number of manufacturing steps, and has the effect of being easy to manufacture.

  Note that through-holes may be formed instead of the uneven portions by dimple processing. Further, a notch or other notch may be formed instead of the through hole.

Embodiment 5. FIG.
As shown in FIG. 11, the connector and transmission / reception module 100S of the fifth embodiment are integrated with the connector outer conductor and the module case, and the module case 1S is similar to the connector outer conductor 13 of the connector 10 of the first embodiment. A wall portion 13SA having a shape for shielding unnecessary radiated radio waves in the vicinity of the connector connecting portion is provided. The wall portion 13SA has a U-shaped section 13SB having a U-shaped cross section that is open only in the direction in which the wiring is extended, and the distal end portion of the U-shape is shaped according to the frequency at which the connector is used. To prevent unwanted radiation generated from the connection from propagating inside the module.

  By adopting the above configuration, the connector and transmission / reception module 100S of Embodiment 5 can further reduce unnecessary radiation.

  As described above, according to the connectors of the first to fifth embodiments, the deformable portion that can be deformed between the main body portion of the connector center conductor 11 and the second end portion that is a connection portion with the circuit board is provided. Therefore, reliable surface mounting is possible. Therefore, the connector used in the transmission / reception module is useful in that it has a structure that suppresses unnecessary radiation with respect to the connector connection inside the transmission / reception module, and can be surface-mounted and easily assembled. However, not all of the components mounted on the circuit board need be surface mounted components.

  Further, a multilayer wiring board may be used for the printed board 20 constituting the circuit board, and the circuit board and the module case may be integrally formed. With this configuration, the number of parts can be reduced, the assembly workability is good, and unnecessary radiation can be further suppressed. As the insulating substrate constituting the printed circuit board 20, it is desirable to apply a substrate having excellent high frequency performance such as a resin substrate or an alumina ceramic substrate.

  The connection between the circuit board and the connector center conductor is realized by solder bonding, but a bonding method using a conductive paste or a bonding method such as welding can also be applied. In particular, a bonding method that can be simultaneously bonded by heating is useful.

  Further, in the first and fifth embodiments, the connector outer conductor 13 is configured as an integral structure, but it may be formed in a two-divided structure that is divided on the surface including the connector center conductor 11 and may be fixed with a conductive paste or the like. With this configuration, the number of parts increases, but the mounting workability is improved.

  Furthermore, the connector outer conductor is made of metal, but a molded body made of an insulator such as resin may be subjected to metallization.

  Alternatively, one of the two-part connector outer conductors 13 and the module case may be configured as an integral structure. Furthermore, a multilayer wiring board is used as the printed circuit board constituting the circuit board, and a conductive thin film is formed by a sputtering method or a plating method in a recess formed by cutting out a part of the multilayer wiring substrate. It is also possible to configure a connector outer conductor that surrounds. Alternatively, the module case and the connector outer conductor are integrally formed by resin molding to obtain a three-dimensional case, and then a conductor thin film is formed at a necessary portion, thereby easily forming the connector outer conductor integrated module case. It is also possible. By adopting such a configuration, it is possible to further reduce the number of parts, further improve the assembly workability, and further suppress unnecessary radiation.

  The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

  1, 1S module case, 2 EMI gasket, 3 module cover, 10 connector, 11, 211, 311, 411 connector center conductor, 11a, 211a, 311a, 411a first end, 11b, 211b, 311b, 411b second 11c, 211c, 311c, 411c body part, 11d, 211d, 311d, 411d deformation part, 12 connector dielectric, 13 connector outer conductor, 13A, 13SA wall part, 13B, 13SB U-shaped part, 14 Connection screw, 14h hole, h screw hole, 20 printed circuit board, 21 insulating substrate, 22 wiring part, 22P connection pad, 100, 100S transceiver module.

Claims (12)

A connector center conductor having a first end that constitutes a connector pin, a second end that is surface-mounted on a circuit board in the transceiver module, and a main body;
A connector dielectric that exposes and surrounds the first and second ends of the connector center conductor;
A connector outer conductor formed outside the connector dielectric, opening only in the axial direction of the connector center conductor to surround the entire periphery, and constituting a part of the connector outer wall; and
The connector center conductor is provided with a deformed portion having a rigidity lower than that of the main body between the second end and the main body.   The connector according to claim 1, wherein the deformable portion is narrower than the second end portion.   The connector according to claim 1, wherein the deformable portion includes a bent portion.   The connector according to claim 1, wherein the deformable portion has an uneven portion.   5. The connector according to claim 1, wherein the second end portion of the connector center conductor is soldered to a circuit pattern on the circuit board. A module case made of a conductor having a recess,
A module cover made of a conductor that closes the module case;
A circuit board installed in the recess and mounted with electronic components;
A connector center conductor having a first end portion constituting a connector pin, a second end portion surface-mounted on the circuit board, and a main body portion;
A connector dielectric that exposes and surrounds the first and second ends of the connector center conductor;
A connector having a connector outer conductor formed on the outer side of the connector dielectric and constituting a part of an outer wall of the module case; and
A transmission / reception module comprising a deforming portion having a rigidity lower than that of the main body portion between the second end portion and the main body portion.   The transmission / reception module according to claim 6, wherein the deformation portion is narrower than the second end portion.   The transmission / reception module according to claim 6, wherein the deformable portion includes a bent portion.   The transmission / reception module according to claim 6, wherein the deformable portion has an uneven portion.   The transceiver module according to any one of claims 6 to 9, wherein the second end portion of the connector center conductor is soldered to a circuit pattern on the circuit board.   The transmission / reception module according to any one of claims 6 to 10, wherein a transmission / reception module is configured by including a transmission unit and a reception unit on the circuit board. Forming a connector center conductor having a first end portion constituting the connector pin, a second end portion surface-mounted on the circuit board, and a main body portion;
Placing the electronic component and the second end of the connector center conductor on the circuit board, and surface-mounting the electronic component and the second end by solder reflow;
A step of exposing the first end and the second end of the connector center conductor and attaching a connector outer conductor via a connector dielectric covering the periphery to form a connector;
Mounting the circuit board on which the connector is mounted in a recess of a module case made of a conductor, and mounting a module cover made of a conductor that closes the module case;
And the connector outer conductor forms a part of the module case.

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