TW201944087A - Test equipment for millimeter wave circuit device capable of greatly improving the alignment accuracy of the test signal thereby ensuring the correctness and reliability of the test result - Google Patents

Abstract

Provided is a test equipment for testing a millimeter wave circuit device, which includes: a test head made of a transparent material and provided with an arc-shaped protrusion at the bottom; a contact film made of a transparent material, wherein part of the contact film is coupled to the bottom of the arc-shaped protrusion of the test head, and the remaining part is located outside the test head; a test circuit component disposed on a bottom surface of the contact film; and a vertical motion mechanism operatively connected to the test head for driving the test head to move up and down. With the aforementioned structure of the invention, it is able to greatly improve the alignment accuracy of the test signal thereby ensuring the correctness and reliability of the test result, and also avoid the problem that the conventional metal probe is easily worn thereby prolonging the service life of the product, so as to achieve better practicality.

Description

   Test equipment for millimeter wave circuit device   

The invention relates to a test device for a circuit board, and more particularly to a test device for a millimeter wave circuit device.

Compared with general microwave communication components, millimeter wave (hereinafter referred to as mmw) devices have characteristics such as large bandwidth (about 20GHz ~ 300GHz), narrow beam and small size.They include automotive radar, object recognition and high-speed communication ( (Such as 5G mobile communications) and other fields have great application potential and market prospects. However, compared with radio frequency devices with frequency bands below 10GHz, when testing millimeter wave devices, due to their high frequency And small size characteristics make it more stringent on the test conditions such as the alignment accuracy of the test signal (if the test signal is not aligned with the contact of the test object, it may cause changes in the signal impedance characteristics, which may affect the signal Test results). Therefore, the test equipment of general or traditional circuit devices cannot be directly and well applied to the test operation of millimeter wave circuit devices.

In the existing test technical solutions of millimeter wave circuit devices, a radio frequency probe (RF Probe) is usually used as the main device. In the known patent literature, the Republic of China Patent No. I432745 discloses a radio frequency integrated body Circuit test systems, ROC Patent Nos. I500936, M549349 and other previous cases have disclosed a radio frequency probe. However, the existing radio frequency probes for testing millimeter wave circuit devices still have the following problems: First, It does not have a structural design that facilitates accurate alignment of a test signal by an alignment device such as an Automated Optical Inspection (AOI) device. Therefore, it is still prone to inaccurate alignment and affect test results; secondly, Because the probe is usually made of hard metal, it is a hard touch between the probe and the contact of the device under test (DUT, which is the millimeter wave circuit device), and it is easy to wear after a period of use And reduce life.

Therefore, how to improve the above problems is the technical difficulty that the applicant of this case wants to solve.

In view of the above-mentioned problems existing in existing radio frequency probes for testing millimeter wave circuit devices, the object of the present invention is to develop a low-cost and reliable test device for millimeter wave circuit devices.

In order to achieve the above object, the present invention provides a testing device for testing a millimeter wave circuit device, which includes: a test head, the test head is transparent material, and a circular arc-shaped protrusion is provided at the bottom of the test head, A lens effect used to achieve an enlarged image; a contact film, the contact film is transparent material, a part of the contact film is coupled to the bottom of the arc-shaped protrusion of the test head, the rest of the contact film Is located outside the test head; a test circuit component is disposed on the bottom surface of the contact membrane, the test circuit component includes a signal line and at least one ground line, and a signal is connected to one end of the test line component A conversion board; a vertical movement mechanism, which is dynamically connected to the test head and used to drive the test head to move up and down.

The test head is made of acrylic, glass, PET (polyethylene terephthalate), PE (polyethylene), PVC (polyvinyl chloride), or PP (polypropylene).

Wherein, the contact film is a soft film.

The vertical movement mechanism is provided with a driving mechanism and a driven mechanism connected to the driving mechanism. The driven mechanism is combined with the test head.

Further, a portion of the contact film that is not combined with the test head is coupled to one side of the driven mechanism, and the signal conversion board is also coupled to one side of the driven mechanism.

It also includes an automatic optical detection device, which is disposed above the test head.

With the above structure, the present invention can greatly improve the alignment accuracy of the test signal, thereby ensuring the correctness and reliability of the test result, and avoiding the problem of easy wear of the conventional metal probe, which can improve the use of the product. Lifetime, which in turn makes the invention more practical.

1‧‧‧test head

11‧‧‧ arc-shaped protrusion

2‧‧‧ contact diaphragm

3‧‧‧Test circuit components

31‧‧‧Signal line

32‧‧‧ ground line

33‧‧‧Signal conversion board

4‧‧‧ vertical motion mechanism

41‧‧‧ Initiative

42‧‧‧ Follower

5‧‧‧ millimeter wave circuit device

51‧‧‧Circuit Board

52‧‧‧ millimeter wave transceiver

53‧‧‧electric contact

6‧‧‧testing machine

61‧‧‧test signal line

7‧‧‧ automatic optical detection device

8‧‧‧test platform

The first diagram is a schematic side view of an embodiment of the present invention.

The second figure is a schematic perspective view of an embodiment of the present invention.

The third diagram is a schematic diagram before operation of an embodiment of the present invention.

The fourth diagram is a schematic diagram after operation of an embodiment of the present invention.

Those skilled in the art should understand that each component in the drawings mentioned in this specification is shown in a schematic and schematic size ratio for convenience, and does not represent the actual size of each component or The actual size proportional relationship between the parts.

The first diagram and the second diagram are respectively a schematic side view and a three-dimensional schematic diagram of an embodiment of a test device of the present invention. The test device is used to test a millimeter wave circuit device 5. The test device includes: a test head 1 The test head 1 is made of transparent material, so that the invention can be seen through the top of the test head 1 or see the object under test (ie, the millimeter wave circuit device 5). Specifically, The test head 1 can be made of acrylic, glass, PET (polyethylene terephthalate), PE (polyethylene), PVC (polyvinyl chloride), PP (polypropylene) or other transparent plastics. Made of material, the test head 1 is provided with an arc-shaped convex portion 11 at the bottom, so that the arc-shaped convex portion 11 can achieve the structure or effect equivalent to a convex lens. The test head 1 can also have the function of magnifying the image of the object to be tested; a contact film 2, which is a thin sheet, and the contact film 2 is a transparent material. More preferably, the contact film 2 is a soft diaphragm, and a part of the contact diaphragm 2 is bonded to, for example, the test. The bottom of the arc-shaped convex portion 11 of the head 1 is located at the bottom of the contact membrane 2 outside the test head 1; a test circuit assembly 3 is provided or bonded to the contact membrane 2 bottom surface, please cooperate with reference to the third figure. The test circuit component 3 is used to connect with a test signal line 61 of a tester 6 to receive and transmit a test signal to the DUT. In particular, the test circuit assembly 3 may be composed of a plurality of metal circuits. More specifically, please refer to the second figure. The test circuit assembly 3 includes a signal line 31 and at least one ground line 32. In this embodiment, In the test circuit assembly 3, there is one signal line 31 and two ground lines 32. In addition, one end of the test circuit assembly 3 is also connected with a signal conversion board 33, which is used to connect the test machine 6 and the test circuit assembly 3 (equivalent to The necessary signal conversion operation is performed between the conventional probes), so that the test circuit assembly 3 can be connected to the test signal line 61 through the signal conversion board 33; a vertical movement mechanism 4, the vertical movement Institution 4 and the test The test head 1 is power-connected to drive the test head 1 to move up and down. More specifically, the vertical movement mechanism 4 is provided with a driving mechanism 41 and a driven mechanism 42 connected to the driving mechanism 41. The driven mechanism 42 In combination with the test head 1, the driving mechanism 41 may be a motor, a gear, a belt, a slide rail, a screw or a combination thereof, and the driven mechanism 42 may be a support base for combining with the test head 1. Or a support frame. In addition, in a preferred embodiment, the portion of the contact film 2 that is not combined with the test head 1 can be further combined, such as being attached to the driven mechanism 42 side, and the signal conversion plate 33 is also It can be further combined with the driven mechanism 42 side. Among them, as shown in the second figure, the millimeter wave circuit device 5 (namely, the object to be measured) has a circuit board 51, and a millimeter wave transceiver is arranged on the circuit board 51 Device 52. The millimeter-wave transceiver device 52 may be a millimeter-wave transmitter, a millimeter-wave receiver, or a millimeter-wave transceiver. The millimeter-wave circuit device 5 may be on the circuit board 51. Electrically connected to the millimeter wave transceiver 52 The electrical contact 53 is connected. In addition, the millimeter-wave circuit device 5 usually also includes an antenna structure (not shown). The electrical contact 53 is actually a feeding point of the antenna or a millimeter. The output point of the wave transmitter; in addition, please refer to FIG. 3 again. In some embodiments of the present invention, it may further include an automatic optical inspection (AOI) device 7, and the automatic optical inspection device 7 is It is set above the test head 1 to realize the function of automatic alignment. This function will be further described later.

The working principle of the present invention is described below: Please refer to the third figure. At the beginning, the millimeter-wave circuit device 5 is set on the test platform 8 of the test equipment, and the test circuit assembly 3 is passed through the signal conversion board. 33 is connected to the test signal line 61 of the tester 6, and the test signal can be received and transmitted from the tester 6. Next, by the transparent characteristics of the test head 1 and the contact film 2, it is located at The automatic optical detection device 7 above can see through the test head 1 so that the test line assembly 3 and the electrical contact 53 of the millimeter wave circuit device 5 can be aligned. At this time, through the test head 1 is provided with a circular arc-shaped protrusion 11 with a magnifying glass effect, so that the automatic optical detection device 7 can more easily achieve accurate alignment. In the alignment process, the testing equipment can usually control the corresponding level through The movement mechanism (not shown) adjusts and corrects the horizontal position of the test platform 8 and / or the test head 1 as necessary, but the detailed structure and operation principle of the horizontal movement mechanism involved here are common knowledge in the field, This will not be described in detail again. Please refer to FIG. 4 for cooperation. After the alignment is completed, the driving mechanism 41 of the vertical movement mechanism 4 can drive the test head 1 downward through the driven mechanism 42. The test circuit assembly 3 can be brought into contact with the electrical contacts 53 of the millimeter wave circuit device 5 to transmit the test signal of the tester 6 to the millimeter wave circuit device 5 for test operations.

The test device of the present invention has a simple and reliable structure, which can effectively reduce the cost of manufacturing and testing operations of the device; at the same time, by using a transparent test head 1 and a contact membrane 2, and the arc-shaped protrusion 11 of the test head 1 The amplification effect of the present invention can be matched with the automatic optical detection device 7, so that the alignment accuracy of the test signal can be greatly improved, thereby ensuring the accuracy and reliability of the test result. In addition, by using a soft contact film 2 and the structure of the printed test circuit to replace the conventional hard metal probe, the present invention can effectively avoid the problem of easy wear of the metal probe, thereby improving the service life of the product, and thereby achieving better practicability; The contact film 2 and the signal conversion plate 33 that are not combined with the test head 1 are combined and fixed on the driven mechanism 42 side, so that these components can be prevented from being bent due to the action of the vertical movement mechanism 4 during the test. It is even damaged, thereby causing doubts that affect the test results, which can make the present invention have better reliability.

However, the above detailed descriptions are specific descriptions of the preferred embodiments of the present invention. These embodiments are not intended to limit the patent scope of the present invention, and any equivalent implementation or change that does not depart from the technical spirit of the present invention should be Included in the patent scope of this case.

Claims (6)

    A testing device for testing a millimeter wave circuit device, comprising: a test head, the test head is transparent material, and a circular arc-shaped convex part is arranged at the bottom of the test head to realize the lens effect of magnifying an image; A contact membrane, which is a transparent material, a part of the contact membrane is coupled to the bottom of the arc-shaped protrusion of the test head, and the rest of the contact membrane is located outside the test head; A test circuit component is disposed on the bottom surface of the contact film. The test circuit component includes a signal line and at least one ground line. One end of the test circuit component is connected with a signal conversion board. A vertical movement mechanism, the vertical A motion mechanism is dynamically connected to the test head, and is used to drive the test head to move up and down.         The test equipment according to item 1 of the scope of patent application, wherein the material of the test head is acrylic, glass, PET (polyethylene terephthalate), PE (polyethylene), PVC (poly Vinyl chloride) or PP (polypropylene).         The testing device according to item 1 of the scope of patent application, wherein the contact membrane is a soft membrane.         The testing device according to item 1 of the scope of patent application, wherein the vertical movement mechanism is provided with a driving mechanism and a driven mechanism connected to the driving mechanism, and the driven mechanism is combined with the test head.         The testing device according to item 4 of the scope of patent application, wherein the portion of the contact membrane that is not combined with the test head is coupled to one side of the driven mechanism, and the signal conversion board is also coupled to one side of the driven mechanism.         The testing device according to any one of claims 1 to 5 of the scope of patent application, further comprising an automatic optical detection device, which is disposed above the test head.