TW201942314A - Composition for electronic material, sealing agent for liquid crystal display element, vertically conducting material and liquid crystal display element - Google Patents

Abstract

A purpose of the present invention is to provide a composition for an electronic material, said composition having excellent long wavelength light-curability and being capable of protecting surrounding materials from contamination and corrosion. Another purpose of the present invention is to provide a sealing agent for a liquid crystal display element which comprises the composition for an electronic material and a vertically conducting material and a liquid crystal display element in which the composition for an electronic material is used. The composition according to the present invention for an electronic material comprises a curable resin and a photopolymerization initiator, wherein the curable resin contains a radical polymerizable compound and the photopolymerization initiator contains a donor molecule and an acceptor molecule, said donor molecule and said acceptor molecule being capable of forming together a charge transfer complex when coexisting with each other.

Description

Composition for electronic material, sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element

The present invention relates to a composition for an electronic material that is excellent in curability to long-wavelength light and can suppress contamination or corrosion of surrounding materials. The present invention also relates to a sealant for a liquid crystal display element composed of the composition for an electronic material, and a top-to-bottom conductive material and a liquid crystal display element using the composition for an electronic material.

In recent years, liquid crystal display elements, organic EL display elements, and the like have been widely used as display elements having characteristics such as thinness, light weight, and low power consumption. In such a display element or other electronic devices, a composition for an electronic material is generally used for sealing a liquid crystal or a light-emitting layer, and bonding various members.
For example, in the manufacture of liquid crystal display elements, a method called a dripping method is used from the viewpoints of shortening the takt time and optimizing the amount of liquid crystal used. The sealant disclosed in 2 is used as a composition for electronic materials.
In the dropping method, first, on one of two transparent substrates with electrodes, a frame-shaped sealing pattern is formed by dispensing. Next, in the state where the sealant is not hardened, minute droplets of liquid crystal are dropped on the entire surface of the frame of the transparent substrate, and another transparent substrate is immediately bonded, and the sealed portion is irradiated with light such as ultraviolet rays to temporarily harden. Thereafter, the liquid crystal display element is heated by heating during the liquid crystal annealing to form a hardening process. If the substrates are bonded under reduced pressure, the liquid crystal display element can be manufactured with extremely high efficiency. At present, the dropping method is becoming the mainstream of the manufacturing method of the liquid crystal display element.

However, in modern mobile phones, portable game machines, and other mobile devices with a liquid crystal panel, the miniaturization of the device is the most demanded issue in modern times. As a method of miniaturizing the device, narrow edge of the liquid crystal display portion can be cited, for example, the position of the sealing portion is arranged under a black matrix (hereinafter, also referred to as a narrow edge design).
However, in the narrow edge design, because the sealant is arranged directly below the black matrix, if the dripping method is performed, the light irradiated when the sealant is light-cured is blocked, and the light cannot reach the inside of the sealant. The problem of insufficient hardening. If the hardening of the sealant is insufficient, there is a problem that the liquid crystal is contaminated because the uncured sealant component is dissolved into the liquid crystal.

In general, irradiation of ultraviolet rays is used as a method for photo-curing the sealant. However, in the liquid crystal dropping method, since the sealant is cured after the liquid crystal is dropped, there is a problem that the liquid crystal is deteriorated due to ultraviolet rays. In order to prevent deterioration of the liquid crystal caused by ultraviolet rays, it is considered to blend a photopolymerization initiator that is excellent in reactivity to long-wavelength light in the visible light region, and to light-harden the light through long-wavelength light such as a cut filter. However, when such a photopolymerization initiator is used, there are problems such as liquid crystal contamination.

On the other hand, even in an electronic device other than a liquid crystal display element, when the composition for an electronic material is hardened by ultraviolet rays, there is a possibility of causing deterioration by light, etc., to other members of an organic system in the vicinity, so that Studies have been made to harden the composition for electronic materials by long-wavelength light. However, when a photopolymerization initiator excellent in reactivity with light of a long wavelength is used for a composition for an electronic material, there is a possibility that corrosion may occur in metals and the like used in various members.
Prior art literature patent literature

Patent Document 1: Japanese Patent Laid-Open No. 2001-133794 Patent Document 2: International Publication No. 02/092718

[Problems to be Solved by the Invention]

An object of the present invention is to provide a composition for an electronic material that is excellent in curability to long-wavelength light and can suppress contamination or corrosion of surrounding materials. Another object of the present invention is to provide a sealant for a liquid crystal display element composed of the composition for an electronic material, and a top-to-bottom conduction material and a liquid crystal display element using the composition for an electronic material.
[Technical means to solve the problem]

The present invention is a composition for an electronic material, which contains a curable resin and a photopolymerization initiator. The curable resin includes a radical polymerizable compound, and the photopolymerization initiator includes a donor molecule and an acceptor molecule. The donor molecule and the acceptor molecule form a combination that forms a charge transfer complex under the coexistence.
The present invention is described in detail below.

The present inventors have found that by using a donor molecule and an acceptor molecule as a combination to form a charge transfer complex in a coexistence as a photopolymerization initiator, it is possible to obtain excellent hardenability to light at a long wavelength in the visible light region, The composition for electronic materials can be suppressed by contamination or corrosion of surrounding materials, thereby completing the present invention.

The composition for an electronic material of the present invention contains a photopolymerization initiator.
The photopolymerization initiator includes a donor molecule and an acceptor molecule that form a combination that forms a charge transfer complex under coexistence. By including the above-mentioned donor molecule and the above-mentioned acceptor molecule in combination, the composition for an electronic material of the present invention is excellent in hardenability against long-wavelength light, and can suppress generation of contamination or corrosion of surrounding materials.
In addition, in the present specification, the aforementioned "precursor molecule" means that a charge transfer complex is formed with the aforementioned "receptor molecule", and by irradiating light, the charge transfer complex functions as a radical polymerizable compound. The effect of the reaction. In the same manner, the "acceptor molecule" means that a charge transfer complex is formed with the "precursor molecule", and the charge transfer complex reacts with a light-polymerizable compound by irradiating light. Acting compound. The detailed mechanism of the above-mentioned effect of causing the reaction of the radically polymerizable compound to occur is not determined, and it is considered that the component having a radical activity is generated from the charge transfer complex by light irradiation.

The formation of the above-mentioned charge transfer complex can be confirmed by a change in the absorption wavelength when the absorption spectrum is measured. The absorption spectrum can be measured using a spectrophotometer after dissolving a compound to be measured in a solvent so as to have a specific concentration.
Examples of the spectrophotometer include U-3900 (manufactured by Hitachi High-Tech Co., Ltd.).
The solvent used for measurement of the absorption spectrum when confirming the formation of the charge transfer complex is not particularly limited as long as it is a solvent that can dissolve the above-mentioned donor molecule and the above-mentioned acceptor molecule, and examples thereof include acetonitrile, acetone, tetrahydrofuran, Methanol and so on.

The above-mentioned donor molecule and the above-mentioned acceptor molecule are preferably combined as follows: When measuring an absorption spectrum of an acetonitrile solution containing the above-mentioned donor molecule and the above-mentioned acceptor molecule at a concentration of 2.0 × 10 ^-2 mol / L, the wavelength is 420 to The 440 nm range has an absorption wavelength with an absorbance of 0.1 or more. By using the above-mentioned donor molecule and the above-mentioned acceptor molecule as such a combination, the obtained composition for an electronic material is more excellent in hardenability against light having a long wavelength. It is more preferable that the above-mentioned donor molecule and the above-mentioned acceptor molecule have an absorption wavelength having an absorbance of 0.15 or more in a range of a wavelength of 420 to 440 nm when the absorption spectrum is measured.
In addition, in the present specification, the above-mentioned "having an absorption wavelength" means that in this wavelength region, there is at least one wavelength at which the absorbance becomes a predetermined value or more.

The above-mentioned donor molecule and the above-mentioned acceptor molecule are more excellent in the effect of suppressing contamination or corrosion of surrounding materials by the obtained electronic material composition, and are preferably compounds having no phosphorus atom and sulfur atom. The donor molecule and the acceptor molecule are preferably compounds having a carbon atom, an oxygen atom, a hydrogen atom, and a nitrogen atom.

The donor molecule is not particularly limited as long as it is a compound capable of forming a charge transfer complex with the acceptor molecule, and examples thereof include an olefin-based compound or an aromatic compound having a substituent having a high electron emission property.
Examples of the substituent having a high electron emission property include an alkyl group, an amine group, an alcohol group, an alkoxy group, and an ether bond.
Examples of the aromatic compound include a benzene compound, a naphthalene compound, and an anthracene compound.
Among these, the above-mentioned donor molecule is preferably an aromatic compound having a substituent having a high electron emission property, and more preferably an aromatic compound having an alkyl group or an alkoxy group.
Examples of the aromatic compound having an alkyl group include hexamethylbenzene.
Examples of the aromatic compound having an alkoxy group include 1,3,5-trimethoxybenzene and the like.

The acceptor molecule is not particularly limited as long as it is a compound capable of forming a charge transfer complex with the donor molecule, and examples thereof include acid anhydrides, acid sulfonimines, quinone compounds, nitro compounds, and nitrile compounds.
Among them, the above-mentioned acceptor molecule is preferably an acid anhydride or an acid imine, and more preferably an acid anhydride.
Examples of the acid anhydride include pyromellitic anhydride.
Examples of the acid hydrazone imine include 1,2,4,5-benzenetetracarboxylic acid hydrazone.

From the viewpoints of low liquid crystal contamination and low corrosivity, it is preferable that the donor molecule and the acceptor molecule are incorporated into the hardened material when the composition for an electronic material is hardened. Therefore, it is preferred that the donor molecule and the acceptor molecule have a reactive functional group capable of reacting with a curable resin described later.

The total content of the above-mentioned donor molecule and the above-mentioned acceptor molecule is preferably 0.1% by weight and 100% by weight of the curable resin, and the preferred upper limit is 20 parts by weight. When the total content of the aforementioned donor molecule and the aforementioned acceptor molecule is 0.1 part by weight or more, the obtained composition for an electronic material is more excellent in hardenability against long-wavelength light. When the total content of the above-mentioned donor molecule and the above-mentioned acceptor molecule is 20 parts by weight or less, the obtained composition for an electronic material is more effective in suppressing the occurrence of contamination or corrosion of surrounding materials. The lower limit of the total content of the donor molecule and the acceptor molecule is more preferably 0.2 parts by weight, and the more preferable upper limit is 15 parts by weight.

The composition for an electronic material of the present invention contains a curable resin.
The curable resin contains a radical polymerizable compound.
As said radically polymerizable compound, the compound which has an unsaturated double bond as a radically polymerizable group is preferable, and a (meth) acrylic compound is more preferable.
Examples of the (meth) acrylic compound include a (meth) acrylate compound, an epoxy (meth) acrylate, and an urethane (meth) acrylate. Among these, epoxy (meth) acrylate is preferable. The (meth) acrylic compound preferably has two or more (meth) acrylfluorenyl groups in the molecule, since it is highly reactive.
In addition, in the present specification, the ｢(meth) acrylic acid｣ means acrylic acid or methacrylic acid, the ｢(meth) acrylic compound｣ means a compound having a (meth) acrylic fluorenyl group, and the ｢(formaldehyde Acryl) acrylfluorenyl means acrylfluorenyl or methacrylfluorenyl. The term "(meth) acrylate" means acrylate or methacrylate. Furthermore, the above-mentioned "epoxy (meth) acrylate" means a compound obtained by reacting all epoxy groups in an epoxy compound with (meth) acrylic acid.

Examples of the monofunctional compound in the (meth) acrylate compound include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and n-butyl (meth) acrylate. , Isobutyl (meth) acrylate, tertiary butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, n-octyl (meth) acrylate, isooctyl (meth) acrylate, Isononyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, isomyristyl (meth) acrylate, stearyl (meth) acrylate, (meth) acrylic acid 2-hydroxyethyl ester, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, cyclohexyl (meth) acrylate, (formyl) (Isopropyl) acrylate, dicyclopentenyl (meth) acrylate, benzyl (meth) acrylate, 2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate , 2-butoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate, methoxypolyethylene glycol (methyl ) Acrylate, phenoxy diethylene glycol ( Base) acrylate, phenoxy polyethylene glycol (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, ethyl carbitol (meth) acrylate, (meth) acrylate 2,2, 2-trifluoroethyl, 2,2,3,3-tetrafluoropropyl (meth) acrylate, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, fluorenimine (meth) acrylate Dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, 2- (meth) acryloxyethyl succinate, 2- (hexahydrophthalate) (Meth) acrylic acid ethoxyethyl ester, 2- (hydroxy) acrylic acid ethoxyethyl 2-hydroxypropyl phthalate, 2- (meth) acrylic acid oxyethyl phosphate, (methyl) Glycidyl acrylate, etc.

Moreover, as a bifunctional among the said (meth) acrylate compounds, 1, 3- butanediol di (meth) acrylate, 1, 4- butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, ethylene glycol di ( (Meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, 2-n-butyl-2- Ethyl-1,3-propanediol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol Di (meth) acrylate, ethylene oxide-added bisphenol A di (meth) acrylate, propylene oxide-added bisphenol A di (meth) acrylate, ethylene oxide-added bisphenol F Di (meth) acrylate, dimethylol dicyclopentadiene di (meth) acrylate, ethylene oxide modified isotricyanate di (meth) acrylate, (meth) acrylic acid 2 -Hydroxy-3- (meth) acrylic acid oxypropyl ester, carbonate diol di (meth) acrylic acid , Polyether glycol di (meth) acrylate, polyester glycol di (meth) acrylate, polycaprolactone glycol di (meth) acrylate, polybutadiene glycol di (meth) Acrylate, etc.

In addition, examples of the tri- or more functional group in the (meth) acrylate compound include trimethylolpropane tri (meth) acrylate and ethylene oxide-added trimethylolpropane tri (meth). Acrylate, propylene oxide addition trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane tri (meth) acrylate, ethylene oxide addition isocyanuric acid Tri (meth) acrylate, glycerol tri (meth) acrylate, propylene oxide addition glycerol tri (meth) acrylate, neopentyl tetraol tri (meth) acrylate, tris (meth) acrylate phosphate Ethoxyethyl ester, di-trimethylolpropane tetra (meth) acrylate, neopentaerythritol tetra (meth) acrylate, dinepentaerythritol penta (meth) acrylate, dinepentaerythritol Alcohol hexa (meth) acrylate and the like.

Examples of the epoxy (meth) acrylate include those obtained by reacting an epoxy compound and (meth) acrylic acid in the presence of a basic catalyst by a conventional method.

Examples of the epoxy compound used as a raw material for synthesizing the epoxy (meth) acrylate include, for example, a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol S type epoxy compound, 2'-diallyl bisphenol A type epoxy compound, hydrogenated bisphenol type epoxy compound, propylene oxide addition bisphenol A type epoxy compound, resorcinol type epoxy compound, biphenyl type epoxy Compound, sulfide type epoxy compound, diphenyl ether type epoxy compound, dicyclopentadiene type epoxy compound, naphthalene type epoxy compound, phenol novolac type epoxy compound, o-cresol novolac type Epoxy compound, dicyclopentadiene novolac type epoxy compound, biphenol novolac type epoxy compound, naphthol novolac type epoxy compound, epoxypropylamine type epoxy compound, alkyl polyol type ring Oxygen compounds, rubber modified epoxy compounds, epoxypropyl ester compounds, etc.

Examples of commercially available bisphenol A-type epoxy compounds include jER828EL, jER1004 (both manufactured by Mitsubishi Chemical Corporation), EPICLON 850CRP (manufactured by DIC Corporation), and the like.
Examples of a commercially available bisphenol F-type epoxy compound include jER806 and jER4004 (both manufactured by Mitsubishi Chemical Corporation).
Examples of a commercially available bisphenol S-type epoxy compound include EPICLON EXA1514 (manufactured by DIC Corporation).
Examples of the commercially available 2,2'-diallyl bisphenol A type epoxy compound include RE-810NM (manufactured by Nippon Kayaku Co., Ltd.).
As a commercially available one among the said hydrogenated bisphenol-type epoxy compounds, EPICLON EXA7015 (made by DIC Corporation) etc. are mentioned, for example.
As a marketer among the said propylene oxide addition bisphenol A type epoxy compounds, EP-4000S (made by ADEKA) etc. are mentioned, for example.
As a marketer among the said resorcinol-type epoxy compounds, EX-201 (made by Nagase ChemteX company) etc. are mentioned, for example.
As a marketer of the said biphenyl type epoxy compound, jER YX-4000H (made by Mitsubishi Chemical Corporation) etc. are mentioned, for example.
Examples of a commercially available thioether-type epoxy compound include YSLV-50TE (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.).
Examples of a commercially available diphenyl ether-type epoxy compound include YSLV-80DE (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.).
Examples of a commercially available dicyclopentadiene-type epoxy compound include EP-4088S (manufactured by ADEKA).
As a commercially available one among the above naphthalene-type epoxy compounds, for example, EPICLON HP4032, EPICLON EXA-4700 (all manufactured by DIC Corporation), and the like can be cited.
As a marketer among the said phenol novolak-type epoxy compounds, Epiclon N-770 (made by DIC Corporation) etc. are mentioned, for example.
As a commercially available one among the above-mentioned ortho-cresol novolak-type epoxy compounds, EPICLON N-670-EXP-S (made by DIC Corporation) etc. can be mentioned, for example.
As a marketer among the said dicyclopentadiene novolak-type epoxy compounds, Epiclon HP7200 (made by DIC Corporation) etc. are mentioned, for example.
As a marketer of the said biphenol novolak-type epoxy compound, NC-3000P (made by Nippon Kayakusho), etc. are mentioned, for example.
As a marketer of the said naphthol novolak-type epoxy compound, ESN-165S (made by Nippon Steel & Sumikin Chemical Co., Ltd.) etc. are mentioned, for example.
Examples of a commercially available epoxy-amine-type epoxy compound include jER630 (manufactured by Mitsubishi Chemical Corporation), EPICLON 430 (manufactured by DIC Corporation), TETRAD-X (manufactured by Mitsubishi Gas Chemical Corporation), and the like.
As a marketer of the above-mentioned alkyl polyol type epoxy compounds, for example, ZX-1542 (manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), EPICLON 726 (manufactured by DIC Corporation), and Epolight 80MFA (manufactured by Kyoeisha Chemical Co., Ltd.) are mentioned. , DENACOL EX-611 (manufactured by Nagase ChemteX), etc.
Examples of commercially available rubber-modified epoxy compounds include YR-450, YR-207 (both manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), and Epolead PB (made by Daicel).
As a commercially available one among the said epoxy propyl ester compound, DENACOL EX-147 (made by Nagase ChemteX company) etc. are mentioned, for example.
Examples of other commercially available epoxy compounds include YDC-1312, YSLV-80XY, YSLV-90CR (all manufactured by Nippon Steel & Sumitomo Chemical Co., Ltd.), XAC4151 (manufactured by Asahi Kasei Corporation), jER1031, jER1032 (both Made by Mitsubishi Chemical Corporation), EXA-7120 (made by DIC Corporation), TEPIC (made by Nissan Chemical Corporation), etc.

Examples of the commercially available epoxy (meth) acrylates include epoxy (meth) acrylates manufactured by DAICEL-ALLNEX, epoxy (meth) acrylates manufactured by Shin Nakamura Chemical Industry Co., Ltd., Epoxy (meth) acrylate manufactured by Kyoeisha Chemical Co., Ltd., and epoxy (meth) acrylate manufactured by Nagase ChemteX.
Examples of the epoxy (meth) acrylate manufactured by the DAICEL-ALLNEX company include, for example, EBECRYL860, EBECRYL3200, EBECRYL3201, EBECRYL3412, EBECRYL3600, EBECRYL3700, EBECRYL3701, EBECRYL3702, EBECRYL3703, EBECRYL3800, EBECRYL60, DX, EBECRYL60, DX, EBECRYL60, DX, 182, EBECRYL60, DX, 182, EBECRYL60, DX, EBECRYL60, DX, etc.
Examples of the epoxy (meth) acrylate manufactured by the Shin-Nakamura Chemical Industry Company include EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, and EMA-1020.
Examples of the epoxy (meth) acrylate manufactured by the aforementioned Kyoeisha Chemical Company include EPOXYESTER M-600A, EPOXYESTER 40EM, EPOXYESTER 70PA, EPOXYESTER 200PA, EPOXYESTER 80MFA, EPOXYESTER 3002M, EPOXYESTER 3002A, EPOXYESTER 1600A, EPOXYESTER 3000M, EPOXYESTER 3000A, EPOXYESTER 200EA, EPOXYESTER 400EA, etc.
Examples of the epoxy (meth) acrylate manufactured by the aforementioned Nagase ChemteX company include DENACOL ACRYLATE DA-141, DENACOL ACRYLATE DA-314, DENACOL ACRYLATE DA-911, and the like.

The amine ester (meth) acrylate may have, for example, a tin-based compound having 2 equivalents of a (meth) acrylic acid derivative having a hydroxyl group in a catalytic amount by an isocyanate compound having 2 isocyanate groups per 1 equivalent. Obtained under reaction.

Examples of the isocyanate compound include isophorone diisocyanate, 2,4-methylphenyl diisocyanate, 2,6-methylphenyl diisocyanate, hexamethylene diisocyanate, and trimethylhexamethylene. Diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, ditoluidine diisocyanate, stilbyl diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanatophenyl) phosphorothioate, tetramethylstilbene diisocyanate, 1,6,11-ten Monoalkane triisocyanate and the like.

As the isocyanate compound, a chain-extended isocyanate compound obtained by a reaction between a polyol and an excessive isocyanate compound can also be used.
Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, glycerol, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, and polycaprolactone diol.

Examples of the (meth) acrylic acid derivative having a hydroxyl group include a hydroxyalkyl mono (meth) acrylate, a mono (meth) acrylate of a diol, and a mono (meth) acrylate of a triol. Or di (meth) acrylate, epoxy (meth) acrylate, and the like.
Examples of the hydroxyalkyl mono (meth) acrylate include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, ( 4-hydroxybutyl meth) acrylate and the like.
Examples of the glycol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and polyethylene glycol.
Examples of the triol include trimethylolethane, trimethylolpropane, and glycerol.
Examples of the epoxy (meth) acrylate include a bisphenol A-type epoxy acrylate.

Examples of the commercially available amine ester (meth) acrylate include amine ester (meth) acrylate manufactured by Toa Kosei Co., Ltd., amine ester (meth) acrylate manufactured by DAICEL-ALLNEX Co., Ltd., and root industry Amine esters (meth) acrylates manufactured by the company, amine esters (meth) acrylates manufactured by Shin Nakamura Chemical Industry Co., and amine esters (meth) acrylates manufactured by Kyoeisha Chemical Co., Ltd.
Examples of the amine ester (meth) acrylate manufactured by the Toa Synthesis Corporation include M-1100, M-1200, M-1210, and M-1600.
Examples of the amine ester (meth) acrylate manufactured by the DAICEL-ALLNEX company include, for example, EBECRYL210, EBECRYL220, EBECRYL230, EBECRYL270, EBECRYL1290, EBECRYL2220, EBECRYL4827, EBECRYL4842, EBECRYL6700, EBECRYL6700, EBECRYL6700, EBECRYL6700, EBECRYL6700, EBECRYL6700, EBECRYL6700, EBECRYL6700, EBECRYL9260 and so on.
Examples of the amine ester (meth) acrylate manufactured by the above Koshigami Kogyo include Art Resin UN-330, Art Resin SH-500B, Art Resin UN-1200TPK, Art Resin UN-1255, Art Resin UN-3320HB, Art Resin UN-7100, Art Resin UN-9000A, Art Resin UN-9000H, etc.
Examples of the amine ester (meth) acrylate produced by the aforementioned Shin Nakamura Chemical Industry Co., Ltd. include U-2HA, U-2PHA, U-3HA, U-4HA, U-6H, U-6HA, U-6LPA, U -10H, U-15HA, U-108, U-108A, U-122A, U-122P, U-324A, U-340A, U-340P, U-1084A, U-2061BA, UA-340P, UA-4000 , UA-4100, UA-4200, UA-4400, UA-5201P, UA-7100, UA-7200, UA-W2A, etc.
Examples of the amine ester (meth) acrylate manufactured by Kyoeisha Chemical Co., Ltd. include AH-600, AI-600, AT-600, UA-101I, UA-101T, UA-306H, UA-306I, and UA. -306T and so on.

In order that the said curable resin may improve the adhesiveness of the composition for electronic materials obtained, it is preferable to further contain an epoxy compound.
Examples of the epoxy compound include an epoxy compound that is a raw material for synthesizing the epoxy (meth) acrylate, or a partially (meth) acrylic-modified epoxy compound.
In addition, in the present specification, the above-mentioned (meth) acrylic modified epoxy compound means a compound having one or more epoxy groups and (meth) acrylfluorene groups in one molecule, for example, by using It is obtained by reacting a part of epoxy groups of an epoxy compound containing two or more epoxy groups in one molecule with (meth) acrylic acid.

As said curable resin, when the said (meth) acrylic compound and the said epoxy compound are contained, or when the said (meth) acrylic-modified epoxy compound is contained, it is preferable to make the said curable resin The ratio of the (meth) acrylfluorenyl group in the resin to the (meth) acrylfluorenyl group in the total of epoxy groups is 30 mol% or more and 95 mol% or less. When the ratio of the (meth) acrylfluorenyl group is within this range, the occurrence of contamination or corrosion of surrounding materials is suppressed, and the adhesiveness of the obtained electronic material composition is more excellent.

The above-mentioned curable resin is preferably a unit having a hydrogen bonding property such as -OH group, -NH- group, -NH ₂ group, from the viewpoint of further suppressing contamination or corrosion of surrounding materials.

These curable resins may be used alone or in combination of two or more.

The composition for an electronic material of the present invention may contain a thermal polymerization initiator as long as the object of the present invention is not hindered.
Examples of the thermal polymerization initiator include an azo compound, an organic peroxide, and the like. Among them, a polymer azo initiator composed of a polymer azo compound is preferable.
These thermal polymerization initiators may be used alone or in combination of two or more.
In addition, in the present specification, the above “polymer azo compound” means that the number average molecular weight of a radical having an azo group and capable of hardening a (meth) acryloxy group by heat is 300 or more. Compound.

A preferable lower limit of the number average molecular weight of the above-mentioned polymer azo compound is 1,000, and a preferable upper limit is 300,000. When the number average molecular weight of the polymer azo compound is within this range, liquid crystal contamination is suppressed, and it is easy to mix with the curable resin. A more preferable lower limit of the number average molecular weight of the above-mentioned polymer azo compound is 5000, a more preferable upper limit is 100,000, a further preferable lower limit is 10,000, and a more preferable upper limit is 90,000.
In addition, in this specification, the said number average molecular weight is a value measured by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent, and calculated | required by polystyrene conversion. Examples of the column for measuring the number average molecular weight obtained by polystyrene conversion by GPC include Shodex LF-804 (manufactured by Showa Denko).

Examples of the high-molecular azo compound include those having a structure in which a plurality of units such as polyalkylene oxide or polydimethylsiloxane are bonded via an azo group.
As the above-mentioned polymer azo compound having a "structure in which a plurality of units such as polyalkylene oxide are bonded via an azo group", those having a polyethylene oxide structure are preferred.
Specific examples of the polymer azo compound include a polycondensate of 4,4'-azobis (4-cyanovaleric acid) and polyalkylene glycol, or 4,4'-azo A polycondensate of bis (4-cyanovaleric acid) and polydimethylsiloxane having a terminal amine group, and the like.
Examples of commercially available polymers of the above-mentioned polymer azo compounds include VPE-0201, VPE-0401, VPE-0601, VPS-0501, and VPS-1001 (all manufactured by Fujifilm and Kogyo Pure Chemical Industries, Ltd.).
Examples of the non-polymeric azo compound include V-65 and V-501 (both are manufactured by Fujifilm and Kobo Pure Chemical Industries, Ltd.).

Examples of the organic peroxide include ketone peroxide, peroxyketal, hydrogen peroxide, dialkyl peroxide, peroxyester, difluorenyl peroxide, and peroxydicarbonate.

The lower limit of the content of the thermal polymerization initiator relative to 100 parts by weight of the curable resin is preferably 0.05 parts by weight, and the upper limit is preferably 10 parts by weight. When the content of the thermal polymerization initiator is 0.05 parts by weight or more, the composition for an electronic material of the present invention is excellent in thermosetting property. When the content of the thermal polymerization initiator is 10 parts by weight or less, the storage stability of the electronic material composition of the present invention is excellent. A more preferable lower limit of the content of the thermal polymerization initiator is 0.1 part by weight, and a more preferable upper limit is 5 parts by weight.

The composition for an electronic material of the present invention may contain a thermosetting agent.
Examples of the thermosetting agent include organic acid hydrazine, imidazole derivatives, amine compounds, polyphenol compounds, and acid anhydrides. Among them, the organic acid hydrazine is suitable.
The said thermosetting agent can be used individually or in combination of 2 or more types.

Examples of the organic acid hydrazine include dihydrazine sebacate, dihydrazine isophthalate, dihydrazine adipate, and dihydrazine malonate.
Examples of the commercially available organic acid hydrazine include organic acid hydrazine produced by Otsuka Chemical Co., organic acid hydrazine produced by Ajinomoto Fine-Techno, and organic acid hydrazine produced by Japan Finechem.
Examples of the organic acid hydrazine produced by the Otsuka Chemical Company include SDH, ADH, and the like.
Examples of the organic acid hydrazine produced by the Ajinomoto Fine-Techno company include Amicure VDH, Amicure VDH-J, Amicure UDH, Amicure UDH-J, and the like.
Examples of the organic acid hydrazine produced by Japan Finechem include MDH and the like.

The content of the above-mentioned thermosetting agent is preferably 1 part by weight with respect to 100 parts by weight of the curable resin, and the preferable upper limit is 50 parts by weight. When the content of the above-mentioned thermosetting agent is within this range, the coating properties, storage stability, and the like of the obtained electronic material composition are not deteriorated, and the thermosetting properties are further improved. A more preferable upper limit of the content of the heat curing agent is 30 parts by weight.

The composition for an electronic material of the present invention preferably contains a filler in order to improve viscosity, improve adhesion by a stress dispersion effect, improve linear expansion rate, and the like.

As the filler, an inorganic filler or an organic filler can be used.
Examples of the inorganic filler include silicon dioxide, talc, glass beads, asbestos, gypsum, diatomaceous earth, bentonite, bentonite, montmorillonite, sericite, activated clay, alumina, zinc oxide, iron oxide, Magnesium oxide, tin oxide, titanium oxide, calcium carbonate, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, aluminum nitride, silicon nitride, barium sulfate, calcium silicate, and the like.
Examples of the organic filler include polyester microparticles, polyurethane microparticles, ethylene polymer microparticles, and acrylic polymer microparticles.
These fillers may be used alone or in combination of two or more.

The preferable lower limit of the content of the filler in 100 parts by weight of the electronic material composition of the present invention is 10 parts by weight, and the preferable upper limit is 70 parts by weight. When the content of the filler is within this range, the coating properties and the like are not deteriorated, and the effect of improving the adhesion and the like is more excellent. A more preferable lower limit of the content of the filler is 20 parts by weight, and a more preferable upper limit is 60 parts by weight.

The composition for an electronic material of the present invention preferably contains a silane coupling agent. The silane coupling agent mainly functions as a bonding aid for adhering a composition for an electronic material to a substrate and the like well.

As the silane coupling agent, for example, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-isocyanate are suitably used. Propyltrimethoxysilane and the like. These effects of improving the adhesion to the substrate and the like are excellent, and it is possible to suppress the outflow of the curable resin into the liquid crystal by chemical bonding with the curable resin.
These silane coupling agents may be used alone or in combination of two or more kinds.

The lower limit of the content of the silane coupling agent in 100 parts by weight of the electronic material composition of the present invention is preferably 0.1 part by weight, and the upper limit is preferably 10 parts by weight. By setting the content of the above-mentioned silane coupling agent within this range, the occurrence of contamination or corrosion of surrounding materials is suppressed, and the effect of improving adhesion is more excellent. A more preferable lower limit of the content of the silane coupling agent is 0.3 part by weight, and a more preferable upper limit is 5 parts by weight.

The composition for an electronic material of the present invention may contain a light-shielding agent. By containing the said light-shielding agent, the composition for electronic materials of this invention can be used suitably for the electronic device which requires light-shielding property.
Since the composition for an electronic material of the present invention contains the photopolymerization initiator of the present invention which is excellent in reactivity with light having a long wavelength, even when the light-shielding agent is contained, the composition has excellent curability with respect to light having a long wavelength. .

Examples of the light-shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. Among them, a substance having a high insulating property is preferable, and titanium black is more preferable.

The above-mentioned titanium black exhibits sufficient effects even if it is not surface-treated, but it can also be treated with organic components such as coupling agents on its surface, or silicon oxide, titanium oxide, germanium oxide, alumina, zirconia, magnesium oxide, etc Surface-treated titanium black, such as those coated with inorganic components. Among them, those treated with an organic component are more preferable in terms of improving insulation properties.
In addition, for example, a liquid crystal display element manufactured by using the composition for an electronic material of the present invention containing the above-mentioned titanium black as a light-shielding agent has sufficient light-shielding properties, and thus can achieve high contrast without light leakage and excellent image display quality. Liquid crystal display element.

Examples of the commercially available titanium black include 12S, 13M, 13M-C, 13R-N, and 14M-C (all manufactured by Mitsubishi Materials Corporation), Tilack D (made by Ako Chemical Co., Ltd.), and the like.

The preferred lower limit of the specific surface area of the titanium black is 13 m ² / g, the preferred upper limit is 30 m ² / g, the more preferred lower limit is 15 m ² / g, and the more preferred upper limit is 25 m ² / g.
In addition, the preferable lower limit of the volume resistance of the titanium black is 0.5 Ω.cm, the preferable upper limit is 3 Ω.cm, the more preferable lower limit is 1 Ω.cm, and the more preferable upper limit is 2.5 Ω.cm.

The primary particle diameter of the light-shielding agent is not particularly limited as long as it is equal to or less than the distance between the substrates of the liquid crystal display element, and the lower limit is preferably 1 nm, and the upper limit is preferably 5000 nm. When the primary particle diameter of the light-shielding agent is within this range, the drawability and the like of the obtained composition for an electronic material can be prevented, and the light-shielding property can be more excellent. The lower limit of the primary particle diameter of the above-mentioned sunscreen is more preferably 5 nm, the more preferable upper limit is 200 nm, the more preferable lower limit is 10 nm, and the more preferable upper limit is 100 nm.
The primary particle size of the light-shielding agent can be measured using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS), and the light-shielding agent is dispersed in a solvent (water, organic solvent, etc.).

A preferable lower limit of the content of the light-shielding agent in 100 parts by weight of the electronic material composition of the present invention is 5 parts by weight, and a preferable upper limit is 80 parts by weight. By setting the content of the above-mentioned light-shielding agent within this range, it is possible to exhibit more excellent light-shielding properties without reducing the adhesiveness of the obtained electronic material composition to a substrate or the strength or drawability after curing. A more preferable lower limit of the content of the light-shielding agent is 10 parts by weight, a more preferable upper limit is 70 parts by weight, a more preferable lower limit is 30 parts by weight, and a more preferable upper limit is 60 parts by weight.

The composition for an electronic material of the present invention may further contain additives such as a reactive diluent, a thixotropic agent, a spacer, a hardening accelerator, an antifoaming agent, a leveling agent, and a polymerization inhibitor as needed.

As a method for manufacturing the composition for electronic materials of the present invention, for example, a mixer such as a homogeneous disperser, a homomixer, a universal mixer, a planetary mixer, a kneader, or a three-roll kneader can be used to mix the hardening resin and the preform. Molecules and acceptor molecules, and methods such as a silane coupling agent added as needed.

The composition for electronic materials of the present invention can be suitably used as a sealant for a liquid crystal display element. The sealing agent for liquid crystal display elements which consists of the composition for electronic materials of this invention is also one of this invention.

By mixing conductive fine particles in the composition for an electronic material of the present invention, a vertical conductive material can be manufactured. Such a composition for an electronic material according to the present invention and a conductive material for upper and lower conductive particles are also one aspect of the present invention.

As the conductive fine particles, metal balls, those having a conductive metal layer formed on the surface of the resin fine particles, and the like can be used. Among them, those having a conductive metal layer formed on the surface of the resin fine particles are suitable because they can be electrically connected without damaging the transparent substrate due to the excellent elasticity of the resin fine particles.

A liquid crystal display element formed by using the sealant for liquid crystal display elements of the present invention or the vertical conduction material of the present invention is also one of the present invention.

As a method for manufacturing the liquid crystal display element of the present invention, a liquid crystal dropping method is suitably used. Specifically, for example, a method having the following steps and the like can be cited.
First, the frame is formed on one of two transparent substrates having electrodes such as an ITO film and an alignment film, and the sealant for a liquid crystal display element of the present invention is applied by screen printing, dispenser application, or the like to form a frame. Step of the seal pattern. Next, in a state where the sealant for a liquid crystal display element of the present invention is not hardened, a small droplet of a liquid crystal is dripped on the frame of the sealing pattern of the substrate, and another transparent substrate is overlapped under vacuum. Thereafter, a step of hardening the sealant by irradiating the sealing pattern portion of the sealant for a liquid crystal display element of the present invention with light having a long wavelength through a cutoff filter or the like is performed, whereby a liquid crystal display element can be obtained by this method. Further, in addition to the above-mentioned step of photo-curing the sealant, a step of heating the sealant and thermally curing it may be performed.
[Effect of the invention]

According to the present invention, it is possible to provide a composition for an electronic material that is excellent in curability to long-wavelength light and can suppress contamination or corrosion of surrounding materials. Furthermore, according to the present invention, it is possible to provide a sealant for a liquid crystal display element composed of the composition for an electronic material, and a top-to-bottom conduction material and a liquid crystal display element using the composition for an electronic material.

Examples are given below to further describe the present invention in detail, but the present invention is not limited to these examples.

(Examples 1 to 5, and Comparative Examples 1 to 9)
According to the blending ratios described in Tables 1 and 2, the materials were mixed using a planetary mixer (manufactured by Thinky Co., Ltd., degassing and mixing Taro ｣), and then mixed using a three-roll kneader to prepare Examples 1 to 5. And the compositions for electronic materials of Comparative Examples 1 to 9.

The donor molecules used in Examples 1 and 2 were dissolved in acetonitrile so that the concentration became 4.0 × 10 ^-2 mol / L, and then the absorption spectrum was measured using a spectrophotometer. The absorption spectrum in the wavelength range of 250 to 500 nm is shown in Figs.
The receptor molecules used in Examples 1 and 2 were dissolved in acetonitrile so that the concentration became 4.0 × 10 ^-2 mol / L, and then the absorption spectrum was measured using a spectrophotometer. The absorption spectrum in the wavelength range of 250 to 500 nm is shown in FIG. 3.
Further, the concentration will be 4.0 × 10 ^-2 mol / L acetonitrile solution containing the molecules to the embodiments of Examples 1 and 2 and used at a concentration of 4.0 × 10 ^-2 mol / L used in Examples 1 and 2 comprising the Receptor The acetonitrile solution of the molecules was mixed to obtain an acetonitrile solution containing the donor molecule and the acceptor molecule at a concentration of 2.0 × 10 ^-2 mol / L, respectively. The absorption spectrum of the obtained acetonitrile solution was measured using a spectrophotometer. The absorption spectrum in the wavelength range of 250 to 500 nm is shown in Figs.
As the above-mentioned spectrophotometer, U-3900 (manufactured by Hitachi High-tech Co., Ltd.) was used.
In FIGS. 1 to 3 as absorption spectra of individual donor molecules or acceptor molecules, no absorption wavelength was confirmed in the range of 420 to 440 nm. On the other hand, in Figs. 4 and 5 which are absorption spectra of these combinations, the absorption in the visible light region which was not confirmed in the case of a single donor molecule or an acceptor molecule can be confirmed, and it can be known that the wavelength is 420 to 440 nm Within this range, there is an absorption wavelength with an absorbance of 0.1 or more. This change in the absorption spectrum means that a charge transfer complex is formed.

In addition, the donor molecule and the acceptor molecule used in Examples 3 to 5 were individually dissolved in acetonitrile at a concentration of 4.0 × 10 ^-2 mol / L, and the absorption spectrum was measured using a spectrophotometer. The absorption wavelength can be confirmed in the range of 420 to 440 nm.
On the other hand, the combination of the donor molecule and the acceptor molecule used in Examples 3 to 5 was dissolved in acetonitrile so that the concentration of each was 2.0 × 10 ^-2 mol / L, and then measured using a spectrophotometer. Absorption spectrum. As a result, absorption in the visible light region which was not confirmed in the case of a single donor molecule or an acceptor molecule was confirmed, and it was found that an absorption wavelength having an absorbance of 0.1 or more was within a range of 420 to 440 nm.
This change in the absorption spectrum means that a charge transfer complex is formed.

＜ Evaluation ＞
Each of the compositions for electronic materials obtained in the examples and comparative examples was evaluated as follows. The results are shown in Tables 1 and 2.

(Light hardening)
One part by weight of the spacer fine particles (manufactured by Sekisui Chemical Industry Co., Ltd., "Micropearl SI-H050") were dispersed in 100 parts by weight of the composition for each electronic material obtained in the examples and comparative examples. Next, an electronic material composition in which spacer particles are dispersed is filled in a syringe for dispensing (manufactured by Musashi Hi-Tech Co., Ltd., PSY-10E), and a defoaming treatment is performed. Thereafter, a dispensing machine (Musashi High Manufactured by a technology company, "SHOTMASTER300") is coated on a glass substrate. A glass substrate of the same size was bonded to the substrate by a vacuum bonding apparatus under a reduced pressure of 5 Pa. The composition portion for the electronic material of the bonded glass substrate was irradiated with light using a metal halide lamp for 100 seconds. The light is irradiated in the following two modes: in the case of a cut-off filter (340 nm cut-off filter) with light having a cut-off wavelength of 340 nm or less, and in the case of a cut-off filter (420 nm) with light with a cut-off wavelength of 420 nm or less Cut-off filter).
FT-IR measurement of the composition for electronic materials was performed using an infrared spectrometer ("FTS3000" manufactured by Biorad Corporation), and the amount of change before and after light irradiation from the peak area of the (meth) acrylfluorene group was measured. Let ｢○ 情形 be the case where the peak area derived from (meth) acryl fluorenyl group is reduced by 80% or more after light irradiation, and｢ △ ｣if the reduction is 60% or more and less than 80%. When the reduction of the peak area derived from the (meth) acryl fluorenyl group was less than 60%, it was set to ｢×｣, and the photohardenability was evaluated.

(Low liquid crystal pollution)
One part by weight of the spacer fine particles (manufactured by Sekisui Chemical Industry Co., Ltd., "Micropearl SI-H050") were dispersed in 100 parts by weight of the composition for each electronic material obtained in the examples and comparative examples. Next, the composition for the electronic material in which the spacer fine particles are dispersed is applied to one of two substrates with a rubbed alignment film and a transparent electrode by a dispenser using a frame having a line width of 1 mm.
Next, a small drop of liquid crystal (manufactured by Chisso Corporation, "JC-5004LA") was applied dropwise to the entire surface of the frame of the electronic material composition for a substrate with a transparent electrode, and another substrate was immediately bonded. Thereafter, the sealant portion was irradiated with light using a metal halide lamp for 100 seconds to be cured, and further heated at 120 ° C. for 1 hour to obtain a liquid crystal display element. The light is irradiated in the following two modes: in the case of a cut-off filter (340 nm cut-off filter) with light having a cut-off wavelength of 340 nm or less, and in the case of a cut-off filter (420 nm) with light with a cut-off wavelength of 420 nm or less Cut-off filter).
For the obtained liquid crystal display element, it was made to be in a state where a voltage of 500 hours was applied under an environment of 70 ° C (humidity is 25% or less), and after being left for 500 hours in an environment of 60 ° C and 90% humidity, visual inspection was performed. Confirm that the LCD alignment is disordered (the display is uneven).
Set 情形 ○ 完全 when display unevenness was not observed at all in the liquid crystal display element, and ｢△｣, display unevenness when display unevenness was present near the composition for electronic materials of the liquid crystal display element (peripheral portion). ｢×｣ was evaluated for both the peripheral part and the central part, and ｢-｣ was evaluated for the case where evaluation was not possible due to insufficient curing of the composition for electronic materials, and low liquid crystal contamination was evaluated.

[Table 1]

[Table 2]

[Industrial availability]

According to the present invention, it is possible to provide a composition for an electronic material that is excellent in curability to long-wavelength light and can suppress contamination or corrosion of surrounding materials. Furthermore, according to the present invention, it is possible to provide a sealant for a liquid crystal display element composed of the composition for an electronic material, and a top-to-bottom conduction material and a liquid crystal display element using the composition for an electronic material.

no

Figure 1 shows the absorption spectrum of hexamethylbenzene (precursor molecule).

Figure 2 shows the absorption spectrum of 1,3,5-trimethoxybenzene (precursor molecule).

Figure 3 shows the absorption spectrum of pyromellitic anhydride (acceptor molecule).

Figure 4 is the absorption spectrum of a charge transfer complex of hexamethylbenzene and pyromellitic anhydride.

Figure 5 is an absorption spectrum of a charge transfer complex of 1,3,5-trimethoxybenzene and pyromellitic anhydride.

Claims (10)

A composition for electronic materials, which contains a curable resin and a photopolymerization initiator, and is characterized in that: The curable resin contains a radical polymerizable compound, The photopolymerization initiator includes a donor molecule and an acceptor molecule, and the donor molecule and the acceptor molecule form a combination that forms a charge transfer complex under coexistence. The electronic material composition according to claim 1, wherein the above-mentioned donor molecule and the above-mentioned acceptor molecule are combined as follows: When measuring the absorption spectrum of an acetonitrile solution containing ^10-2 mol / L of the above-mentioned donor molecule and the above-mentioned acceptor molecule, it has an absorption wavelength having an absorbance of 0.1 or more in a range of 420 to 440 nm. The composition for an electronic material according to claim 1 or 2, wherein the donor molecule and the acceptor molecule are compounds having a carbon atom, an oxygen atom, a hydrogen atom, and a nitrogen atom. The composition for an electronic material according to 2 or 3, wherein the donor molecule is an aromatic compound having an alkyl group or an alkoxy group, and the acceptor molecule is an acid anhydride. The composition for an electronic material according to 2, 3 or 4, wherein the donor molecule and the acceptor molecule have a reactive functional group capable of reacting with the curable resin. The composition for an electronic material according to 2, 3, 4 or 5, wherein the curable resin further contains an epoxy compound. The composition for an electronic material according to 2, 3, 4, 5 or 6, which contains a thermosetting agent. A sealant for a liquid crystal display element, comprising the composition for an electronic material according to claim 1, 2, 3, 4, 5, 6, or 7. A vertical conduction material comprising the composition for an electronic material according to claim 1, 2, 3, 4, 5, 6, or 7 and conductive fine particles. A liquid crystal display element is obtained by using the sealant for liquid crystal display elements according to claim 8 or the conductive material described above and below.