TW201934709A - Resin composition, resin layer, and layered sheet - Google Patents

Resin composition, resin layer, and layered sheet Download PDF

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TW201934709A
TW201934709A TW107146776A TW107146776A TW201934709A TW 201934709 A TW201934709 A TW 201934709A TW 107146776 A TW107146776 A TW 107146776A TW 107146776 A TW107146776 A TW 107146776A TW 201934709 A TW201934709 A TW 201934709A
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resin
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resin layer
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東昌嗣
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日商日東電工股份有限公司
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Abstract

Provided are a resin layer capable of strongly adhering to a rough surface and to a plastic, the resin layer having high holding power and exhibiting good adhesion even at low temperature, a resin composition suitable for forming the resin layer, and a layered sheet including the resin layer. The resin composition provided by the present invention contains a (meth)acrylic polymer having a Tg of -40 DEG C or below, and 5-40 parts by weight of a tackifying resin with respect to 100 parts by weight of the (meth)acrylic polymer. The (meth)acrylic polymer is a polymer of monomer components including: 50-97 wt% of an alkyl (meth)acrylate (A1) having a C8-18 branched alkyl group at a terminal end of an ester group, a homopolymer of the alkyl (meth)acrylate (A1) having a Tg of -50 DEG C or below; and 3-50 wt% of a (meth)acrylate (A2) having an ether bond in the molecular skeleton thereof, a homopolymer of the (meth)acrylate (A2) having a Tg of -40 DEG C or below.

Description

樹脂組合物、樹脂層及積層片材Resin composition, resin layer and laminated sheet

本發明係關於一種樹脂組合物、樹脂層及積層片材。本申請案主張基於2017年12月28日提出申請之日本專利申請案2017-254900號及2018年10月15日提出申請之日本專利申請案2018-194150號之優先權,該申請案之全部內容係作為參照併入本說明書中。The present invention relates to a resin composition, a resin layer, and a laminated sheet. This application claims priority based on Japanese Patent Application No. 2017-254900 filed on December 28, 2017 and Japanese Patent Application No. 2018-194150 filed on October 15, 2018. The entire contents of the application Is incorporated herein by reference.

一般,黏著劑(亦稱為感壓接著劑。以下相同)具有於室溫附近之溫度區域呈現柔軟之固體(黏彈性體)之狀態,藉由壓力與被接著體接著之性質。有效利用此種性質,黏著劑例如以於支持體之單面或兩面具有可作為黏著劑發揮作用之樹脂層之積層構造之黏著片材(積層片材)之形態,廣泛用於家電製品至汽車、OA(Office Automation,辦公自動化)設備等各種產業領域。作為與黏著劑或黏著片材相關之技術文獻,可列舉專利文獻1、2。
[先前技術文獻]
[專利文獻]
Generally, an adhesive (also referred to as a pressure-sensitive adhesive. The same applies hereinafter) has a state of being a soft solid (viscoelastic body) in a temperature region near room temperature, and is bonded to an adherend by pressure. Taking advantage of this property effectively, the adhesive is in the form of an adhesive sheet (laminated sheet) having a laminated structure of a resin layer that can function as an adhesive on one or both sides of a support, and is widely used in home appliances to automobiles , OA (Office Automation, Office Automation) equipment and other industrial fields. As technical documents related to an adhesive agent or an adhesive sheet, patent documents 1 and 2 are mentioned.
[Prior technical literature]
[Patent Literature]

專利文獻1:日本專利申請案公開平08-104847號公報
專利文獻2:國際公開第2013/099683號
Patent Document 1: Japanese Patent Application Publication No. Hei 08-104847 Patent Document 2: International Publication No. 2013/099683

[發明所欲解決之問題][Problems to be solved by the invention]

具有黏著劑之先前之積層片材係對混凝土、砂漿、石膏板、針葉樹合板、木質系水泥板、矽酸鈣板、磁磚及纖維強化水泥板等之類之具有粗糙面(具有凸凹形狀之表面)之被接著體、或一般識別為低極性被接著體之聚丙烯等塑膠被接著體之接著之難易度較高,接著力容易不足。因此,多數情況下對該等具有粗糙面之被接著體使用接著劑而非黏著劑。又,於將接著劑應用於低極性被接著體時,多數情況下一般必需進行底塗處理等對策。但是,近年來,隨著欲更簡便地進行具有粗糙面之被接著體彼此之接合、或與包含低極性被接著體之其他各種被接著體之貼附固定之需求之增加,強烈期望使用黏著片材等積層片材而接合具有粗糙面之被接著體或低極性被接著體,並不必須使用底塗等。Previous laminated sheets with adhesives have rough surfaces (such as those with convex and concave shapes) such as concrete, mortar, gypsum board, coniferous board, wood cement board, calcium silicate board, tile and fiber reinforced cement board, etc. Surfaces), or plastic adherends such as polypropylene, which are generally recognized as low-polarity adherends, have a high degree of difficulty in adhering, and the adhesion force tends to be insufficient. Therefore, in many cases, an adhesive is used instead of an adhesive for these adherends having a rough surface. In addition, when an adhesive is applied to a low-polar adherend, in many cases, it is generally necessary to take measures such as a primer coating treatment. However, in recent years, as the need to more easily bond the adherends having a rough surface to each other, or to attach and fix various other adherends including a low-polar adherend, the use of adhesion is strongly desired. It is not necessary to use a primer or the like to laminate a sheet such as a sheet to join an adherend having a rough surface or a low-polar adherend.

黏著片材等積層片材可基於接合如上所述之具有粗糙面之被接著體或塑膠構件之目的而使用。又,就將固定於該被接著體之重量物於該固定狀態下長期保持之觀點而言,對具有粗糙面之被接著體或塑膠構件使用之黏著片材等積層片材亦必需保持力。進而,具有粗糙面之被接著體之接合作業亦可於冬季之室外等之類之低溫環境下進行,故而較理想為黏著片材等積層片材即便於低溫下亦對粗糙面表現出良好之接著性。A laminated sheet such as an adhesive sheet can be used for the purpose of joining an adherend or a plastic member having a rough surface as described above. From the viewpoint of keeping the weight fixed to the adherend in the fixed state for a long period of time, it is also necessary to hold the laminated sheet such as an adhesive sheet used for an adherend having a rough surface or a plastic member. Furthermore, the bonding operation of the adherend having a rough surface can also be performed in a low-temperature environment such as outdoor in winter. Therefore, it is preferable that a laminated sheet such as an adhesive sheet shows a good rough surface even at a low temperature. Then sex.

因此,本發明之目的在於提供一種可與如玻璃、不鏽鋼或鋁等金屬等般一般容易接著之被接著體強力地接著,並且與粗糙面及塑膠中之任一者均牢固地接著,保持力較高,且即便於低溫下亦表現出良好之接著性之樹脂層;及適於該樹脂層之形成之樹脂組合物。相關之其他目的在於提供一種包含上述樹脂層之積層片材。
[解決問題之技術手段]
Therefore, an object of the present invention is to provide a holding force that can be strongly adhered to a generally adherent body such as glass, stainless steel, aluminum, or the like, and firmly adhered to any of a rough surface and a plastic. A resin layer that is high and exhibits good adhesion even at low temperatures; and a resin composition suitable for the formation of the resin layer. A related other object is to provide a laminated sheet including the above resin layer.
[Technical means to solve the problem]

根據該說明書,提供一種樹脂組合物,其含有玻璃轉移溫度(Tg)為-40℃以下之(甲基)丙烯酸系聚合物、及相對於上述(甲基)丙烯酸系聚合物100重量份為5重量份以上且40重量份以下之黏著賦予樹脂。上述(甲基)丙烯酸系聚合物係包含均聚物之Tg為-50℃以下且於酯基之末端具有碳數8~18之支鏈烷基之(甲基)丙烯酸烷基酯(A1)、及均聚物之Tg為-40℃以下且於分子骨架內具有醚鍵之(甲基)丙烯酸酯(A2)之單體成分之聚合物。上述單體成分係以50~97重量%之比率包含上述(甲基)丙烯酸烷基酯(A1),以3~50重量%之比率包含上述具有醚鍵之(甲基)丙烯酸酯(A2)。According to the specification, there is provided a resin composition containing a (meth) acrylic polymer having a glass transition temperature (Tg) of -40 ° C or lower, and 5 parts by weight based on 100 parts by weight of the (meth) acrylic polymer. The adhesion-imparting resin is at least 40 parts by weight. The (meth) acrylic polymer is an alkyl (meth) acrylate (A1) containing a homopolymer having a Tg of -50 ° C or lower and having a branched alkyl group having 8 to 18 carbons at the end of the ester group. And a polymer of a monomer component of (meth) acrylate (A2) having a Tg of homopolymer of -40 ° C or lower and having an ether bond in a molecular skeleton. The said monomer component contains the said (meth) acrylic acid alkyl ester (A1) in the ratio of 50-97 weight%, and contains the said (meth) acrylic acid ester (A2) which has an ether bond in the ratio of 3-50 weight%. .

再者,以下,有時將上述(甲基)丙烯酸烷基酯(A1)記載為「單體A1」。又,有時將上述具有醚鍵之(甲基)丙烯酸酯(A2)記載為「單體A2」。In addition, below, the said (meth) acrylic-acid alkylester (A1) may be described as "monomer A1." Moreover, the (meth) acrylate (A2) which has the said ether bond may be described as "monomer A2."

根據上述構成之樹脂組合物,藉由對上述(甲基)丙烯酸系聚合物包含特定量之黏著賦予樹脂,可提昇對被接著體之接著力。又,上述(甲基)丙烯酸系聚合物由於為以特定之比率包含單體A1及單體A2之單體成分之聚合物,故而容易形成保持力較高且即便於低溫下亦發揮良好之粗糙面接著性之樹脂層。因此,藉由組合使用上述(甲基)丙烯酸系聚合物與上述特定量之黏著賦予樹脂,可較佳地同時實現對粗糙面或塑膠等之較高之接著力及較高之保持力、以及低溫下之接著性。According to the resin composition having the above-mentioned configuration, by including a specific amount of the adhesion-imparting resin to the (meth) acrylic polymer, the adhesion to the adherend can be improved. In addition, since the (meth) acrylic polymer is a polymer containing monomer components of the monomers A1 and A2 at a specific ratio, it is easy to form a rough surface having a high holding force and exhibiting good roughness even at low temperatures. Surface-adhesive resin layer. Therefore, by using the above-mentioned (meth) acrylic polymer in combination with the above-mentioned specific amount of adhesion-imparting resin, it is possible to simultaneously achieve a higher adhesion force and a higher retention force to rough surfaces or plastics, and Adhesion at low temperature.

於若干態樣之樹脂組合物中,上述單體A1與上述單體A2之合計比率可為形成上述(甲基)丙烯酸系聚合物之所有單體成分的75重量%以上。此處所揭示之樹脂組合物可使用作為此種組成之單體成分之聚合物的(甲基)丙烯酸系聚合物較佳地實施。In some aspects of the resin composition, the total ratio of the monomer A1 and the monomer A2 may be 75% by weight or more of all monomer components forming the (meth) acrylic polymer. The resin composition disclosed herein can be preferably implemented using a (meth) acrylic polymer as a polymer of a monomer component having such a composition.

作為上述單體A2,可較佳地使用通式(1):
CH2 =CR1 -COO-(AO)n -R2
所表示之單體。此處,於上述通式(1)中,R1 為氫原子或甲基。AO為碳數2~3之伸烷氧基。n係表示上述伸烷氧基之平均加成莫耳數之數,例如可為1~10。R2 為芳香環、或者直鏈、支鏈或脂環式烷基。根據此種結構之單體A2,容易形成即便於低溫下接著性亦較佳,且藉由適度之凝聚性而平衡性較佳地同時實現接著力與保持力之樹脂層。
As the monomer A2, the general formula (1) can be preferably used:
CH 2 = CR 1 -COO- (AO) n -R 2 ;
The indicated monomer. Here, in the general formula (1), R 1 is a hydrogen atom or a methyl group. AO is an alkoxy group having 2 to 3 carbon atoms. n represents the number of the average addition mole number of the said alkoxy group, and it can be 1-10, for example. R 2 is an aromatic ring, or a linear, branched, or alicyclic alkyl group. According to the monomer A2 having such a structure, it is easy to form a resin layer that is excellent in adhesion even at low temperatures, and achieves a good balance of adhesion and holding force by a moderate cohesiveness.

於若干態樣中,上述黏著賦予樹脂可包含選自由松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、石油系黏著賦予樹脂及苯乙烯系黏著賦予樹脂所組成之群中之至少一種。此處所揭示之技術可使用此種黏著賦予樹脂較佳地實施。In some aspects, the adhesion-imparting resin may include at least one selected from the group consisting of a rosin-based adhesion-imparting resin, a terpene-based adhesion-imparting resin, a petroleum-based adhesion-imparting resin, and a styrene-based adhesion-imparting resin. The techniques disclosed herein can be better implemented using such adhesion-imparting resins.

此處所揭示之樹脂組合物可包含軟化點為90℃以上且160℃之至少一種黏著賦予樹脂。藉由使用軟化點處於上述範圍之黏著賦予樹脂,有形成室溫範圍下之接著性與凝聚性之平衡性較佳,且即便於低溫範圍下亦表現出對粗糙面之良好之接著性之樹脂層的傾向。The resin composition disclosed herein may include at least one adhesion-imparting resin having a softening point of 90 ° C or higher and 160 ° C. By using an adhesion-imparting resin having a softening point in the above range, a resin having a good balance between adhesiveness and cohesiveness at a room temperature range and a good adhesion to a rough surface even at a low temperature range is formed. Layer of tendencies.

構成上述(甲基)丙烯酸系聚合物之單體成分可包含選自由具有羥基之單體、具有羧基之單體及具有環氧基之單體所組成之群中之至少一種含官能基之單體。此種含官能基之單體可有助於樹脂層之凝聚性或儲存彈性模數G'之調整。The monomer component constituting the (meth) acrylic polymer may include at least one functional group-containing monomer selected from the group consisting of a monomer having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an epoxy group. body. Such a functional group-containing monomer can help adjust the cohesiveness of the resin layer or the adjustment of the storage elastic modulus G ′.

上述(甲基)丙烯酸系聚合物之重量平均分子量(Mw)較佳為35萬以上。根據具有此種Mw之(甲基)丙烯酸系聚合物,容易獲得平衡性較佳地同時實現對粗糙面及塑膠構件之接著性與凝聚性之樹脂層。The weight average molecular weight (Mw) of the (meth) acrylic polymer is preferably 350,000 or more. According to the (meth) acrylic polymer having such Mw, it is easy to obtain a resin layer having a good balance and simultaneously achieving adhesion and cohesiveness to rough surfaces and plastic members.

於上述樹脂組合物中可含有交聯劑。交聯劑可有助於樹脂層之凝聚性或儲存彈性模數G'之調整。於若干態樣中,上述交聯劑之含量相對於上述(甲基)丙烯酸系聚合物100重量份,例如可設為0.01重量份以上且5重量份以下。作為上述交聯劑,可較佳地使用異氰酸酯系交聯劑及環氧系交聯劑之一者或兩者。A crosslinking agent may be contained in the resin composition. The cross-linking agent can help adjust the cohesiveness of the resin layer or the storage elastic modulus G ′. In some aspects, content of the said crosslinking agent may be 0.01 weight part or more and 5 weight part or less with respect to 100 weight part of said (meth) acrylic-type polymers. As the crosslinking agent, one or both of an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent can be preferably used.

根據該說明書,提供一種由此處所揭示之任一樹脂組合物形成之樹脂層。此種樹脂層可成為對粗糙面或塑膠等被接著體發揮良好之接著力,藉由具有適度之凝聚性而保持力較高,且即便於低溫範圍下亦表現出良好之接著性者。According to the specification, a resin layer formed from any of the resin compositions disclosed herein is provided. Such a resin layer can exhibit good adhesion to adherends such as rough surfaces, plastics, etc., and has a high holding force by having moderate cohesiveness, and exhibits good adhesion even in a low temperature range.

於若干態樣中,上述樹脂層於23℃下之儲存彈性模數G'可為1.0×104 Pa以上且5.0×104 Pa以下,且-10℃下之儲存彈性模數G'可為3.0×104 Pa以上且7.0×105 Pa以下。具有此種特性之樹脂層由於有室溫範圍下之接著力與保持力之平衡性較佳,且即便於低溫範圍下亦表現出良好之接著性之傾向,故而較佳。In some aspects, the storage elastic modulus G 'of the resin layer at 23 ° C may be 1.0 × 10 4 Pa or more and 5.0 × 10 4 Pa or less, and the storage elastic modulus G ′ at -10 ° C may be 3.0 × 10 4 Pa or more and 7.0 × 10 5 Pa or less. A resin layer having such characteristics is preferred because it has a good balance between the adhesion force and the holding force in the room temperature range, and also exhibits a good adhesion tendency even in the low temperature range.

再者,以下,有時將23℃下之儲存彈性模數G'記載為「儲存彈性模數G'(23℃)」。同樣地,有時將-10℃下之儲存彈性模數G'記載為「儲存彈性模數G'(-10℃)」。In addition, hereinafter, the storage elastic modulus G 'at 23 ° C is sometimes referred to as "storage elastic modulus G' (23 ° C)". Similarly, the storage elastic modulus G 'at -10 ° C may be described as "storage elastic modulus G' (-10 ° C)".

於若干態樣中,上述樹脂層之聚合物凝膠分率可為20重量%以上且95重量%以下之範圍。根據聚合物凝膠分率處於上述範圍之樹脂層,容易較佳地同時實現對粗糙面之接著性(例如低溫下之接著性)與凝聚性。In some aspects, the polymer gel fraction of the resin layer may be in a range of 20% by weight to 95% by weight. According to the resin layer in which the polymer gel fraction is in the above range, it is easy and preferable to simultaneously achieve adhesion to a rough surface (for example, adhesion at low temperature) and cohesiveness.

根據該說明書,提供一種於支持體之至少單側具有此處所揭示之任一樹脂層之積層片材。此種積層片材例如可以將上述樹脂層貼附於被接著體之態樣,較佳地用於該被接著體之接合或固定。上述被接著體之非限定性之例包含如上所述之具有粗糙面之被接著體或各種塑膠材料。作為上述支持體,例如可較佳地使用包含塑膠膜、紙、不織布、及含有氣泡或粒子之片材中之至少任一者之構成者。According to the specification, there is provided a laminated sheet having any of the resin layers disclosed herein on at least one side of a support. Such a laminated sheet can be used, for example, in a state where the resin layer is attached to an adherend, and is preferably used for bonding or fixing the adherend. Non-limiting examples of the above-mentioned adherend include the adherend having a rough surface as described above or various plastic materials. As the support, for example, a constitution including at least any one of a plastic film, paper, non-woven fabric, and a sheet containing air bubbles or particles can be preferably used.

於若干態樣中,上述樹脂層於23℃之環境下且於剝離速度300 mm/分鐘之條件下所測定之180°剝離接著力可為10 N/20 mm以上。以下,有時將上述23℃下之180°剝離接著力記載為「室溫接著力」。根據此處所揭示之技術,藉由組合使用上述(甲基)丙烯酸系聚合物與特定量之黏著賦予樹脂,可較佳地達成上述室溫接著力。In some aspects, the 180 ° peeling adhesion force of the above resin layer measured at an environment of 23 ° C. and a peeling speed of 300 mm / min may be 10 N / 20 mm or more. Hereinafter, the 180 ° peeling adhesive force at 23 ° C may be described as “room temperature adhesive force”. According to the technology disclosed herein, the above-mentioned room temperature adhesion can be achieved better by using the above-mentioned (meth) acrylic polymer in combination with a specific amount of adhesion-imparting resin.

於若干態樣中,上述樹脂層於-10℃之環境下且於剝離速度300 mm/分鐘之條件下所測定之180°剝離接著力可為5 N/20 mm以上。以下,有時將上述-10℃下之180°剝離接著力記載為「低溫接著力」。上述(甲基)丙烯酸系聚合物由於為以特定之比率包含單體A1及單體A2之單體成分之聚合物,故而即便於低溫範圍下柔軟性亦優異。因此,根據此處所揭示之技術,藉由組合使用上述(甲基)丙烯酸系聚合物與特定量之黏著賦予樹脂,可較佳地達成上述低溫接著力。In some aspects, the 180 ° peeling adhesion force of the resin layer measured at an environment of -10 ° C and a peeling speed of 300 mm / min may be 5 N / 20 mm or more. Hereinafter, the 180 ° peeling adhesive force at -10 ° C may be described as "low temperature adhesive force". Since the (meth) acrylic polymer is a polymer containing monomer components of the monomer A1 and the monomer A2 at a specific ratio, it is excellent in flexibility even in a low temperature range. Therefore, according to the technology disclosed here, the above-mentioned low temperature adhesive force can be preferably achieved by using the (meth) acrylic polymer in combination with a specific amount of adhesion-imparting resin.

此處所揭示之樹脂組合物、樹脂層及積層片材例如可用作黏著劑組合物、黏著劑層及黏著片材。The resin composition, the resin layer, and the laminated sheet disclosed herein can be used as, for example, an adhesive composition, an adhesive layer, and an adhesive sheet.

再者,適當組合上述各要素者亦可包含於由本專利申請案要求專利之保護之發明之範圍。Furthermore, a proper combination of the above elements may also be included in the scope of the invention claimed by the patent application.

以下,說明本發明之較佳之實施形態。業者可基於本說明書中所記載之對發明之實施之教示及申請時之技術常識而瞭解於本說明書中特別提及之事項以外且本發明之實施所需之事情。本發明可基於本說明書所揭示之內容及該領域中之技術常識實施。
再者,於以下之圖式中,有對發揮相同之作用之構件、部位標註相同之符號進行說明之情況,且有省略或簡化重複之說明之情況。又,圖式中記載之實施形態係為了清楚地說明本發明而模式化,不一定準確地表示實際提供之製品之尺寸或縮小比例。
Hereinafter, preferred embodiments of the present invention will be described. Based on the teachings on the implementation of the invention described in this specification and the technical common sense at the time of application, practitioners can understand things other than those specifically mentioned in this specification and what is needed to implement the invention. The present invention can be implemented based on the contents disclosed in this specification and technical common sense in the field.
Furthermore, in the drawings below, the same symbols are used to describe components and parts that perform the same function, and repeated descriptions may be omitted or simplified. In addition, the embodiments described in the drawings are modeled in order to clearly explain the present invention, and do not necessarily accurately represent the size or reduction ratio of the product actually provided.

又,於該說明書中,「(甲基)丙烯酸酯」係包括性地指丙烯酸酯及甲基丙烯酸酯之含義。同樣地,於該說明書中,「(甲基)丙烯酸」係包括性地指丙烯酸及甲基丙烯酸之含義,「(甲基)丙烯醯基」係包括性地指丙烯醯基及甲基丙烯醯基之含義。In addition, in this specification, "(meth) acrylate" means the meaning of acrylate and methacrylate. Similarly, in this specification, "(meth) acrylic acid" refers to the meaning of acrylic acid and methacrylic acid, and "(meth) acrylfluorene" refers to the meaning of acrylic acid and methacrylic acid. The meaning of base.

此處所揭示之樹脂組合物係包含50~97重量%之單體A1及3~50重量%之單體A2之單體成分之聚合物,包含Tg為-40℃以下之(甲基)丙烯酸系聚合物、及相對於上述(甲基)丙烯酸系聚合物100重量份為5重量份以上且40重量份以下之黏著賦予樹脂。
上述(甲基)丙烯酸系聚合物係藉由使含有具有碳數8~18之支鏈烷基之(甲基)丙烯酸烷基酯(單體A1)之特定量、及具有醚鍵之(甲基)丙烯酸酯(單體A2)之特定量之單體成分進行聚合所獲得者。又,單體A1及單體A2之各者之均聚物之Tg較低,且所獲得之(甲基)丙烯酸系聚合物亦具有低Tg。根據包含此種(甲基)丙烯酸系聚合物之樹脂組合物,藉由單體A1及單體A2之作用,可對具有粗糙面之被接著體表現較高之接著力及較高之保持力。
The resin composition disclosed herein is a polymer containing monomer components of 50 to 97% by weight of monomer A1 and 3 to 50% by weight of monomer A2, and (meth) acrylic based on a Tg of -40 ° C or lower. The polymer and the adhesion-imparting resin are 5 parts by weight or more and 40 parts by weight or less based on 100 parts by weight of the (meth) acrylic polymer.
The (meth) acrylic polymer is obtained by adding a specific amount of (meth) acrylic acid alkyl ester (monomer A1) containing a branched alkyl group having 8 to 18 carbon atoms, and (Meth) acrylic acid ester (monomer A2) is obtained by polymerizing a specific amount of a monomer component. Moreover, the Tg of the homopolymer of each of the monomers A1 and A2 was low, and the (meth) acrylic polymer obtained also had a low Tg. According to the resin composition containing such a (meth) acrylic polymer, by the action of the monomer A1 and the monomer A2, it is possible to exhibit a higher adhesion force and a higher retention force to an adherend having a rough surface. .

單體A1具有低Tg及適度之凝聚力與黏著性。單體A2具有低Tg及適度之極性,具有與被接著體表面之較佳之相互作用。推定其結果為包含上述(甲基)丙烯酸系聚合物之樹脂組合物具有適度之柔軟性與凝聚力、及與界面之相互作用,可對具有粗糙面之被接著體發揮較高之接著力及較高之保持力。Monomer A1 has low Tg and moderate cohesion and adhesion. Monomer A2 has low Tg and moderate polarity, and has a better interaction with the surface of the adherend. As a result, it is estimated that the resin composition containing the above (meth) acrylic polymer has moderate softness and cohesion, and interaction with the interface, and can exhibit higher adhesion force and better adhesion to the adherend having a rough surface. High retention.

又,此處所揭示之樹脂組合物藉由包含黏著賦予樹脂,亦可對低極性被接著體提昇潤濕性及與被接著體界面之相互作用,又,藉由提高黏著劑塊體之彈性模數,可對樹脂層賦予適度之凝聚力。藉此,可對粗糙面或塑膠等各種被接著體表現出較高之接著力。於聚烯烴系樹脂等之類之低極性之被接著體中,尤其有效的是使用黏著賦予樹脂。而且,推定藉由將上述黏著賦予樹脂之特定量與上述(甲基)丙烯酸系聚合物加以組合而使用,可具有由使用黏著賦予樹脂所帶來之效果,並且抑制低溫下之接著性之降低。In addition, the resin composition disclosed herein can improve the wettability of the low-polar adherend and the interface with the adherend by including an adhesion-imparting resin, and by improving the elastic modulus of the adhesive block. It can impart moderate cohesion to the resin layer. Thereby, it is possible to show a high adhesion force to various adherends such as rough surfaces or plastics. In a low-polarity adherend such as a polyolefin resin, it is particularly effective to use an adhesion-imparting resin. In addition, it is estimated that by using a specific amount of the adhesion-imparting resin in combination with the (meth) acrylic polymer described above, it is possible to have an effect by using an adhesion-imparting resin and suppress a decrease in adhesiveness at low temperatures. .

<單體A1>
作為單體A1,使用均聚物之Tg為-50℃以下且於酯基之末端具有碳數8~18之支鏈烷基的(甲基)丙烯酸烷基酯。就提高對具有粗糙面之被接著體之接著力之觀點而言,單體A1之均聚物之Tg較佳為-55℃以下,更佳為-60℃以下。就提高保持力之觀點而言,單體A1之均聚物之Tg較佳為-80℃以上,更佳為-75℃以上。就對樹脂層賦予適度之柔軟性之觀點、及提高樹脂層之凝聚力之觀點而言,單體A1之烷基之碳數較佳為8~16,更佳為8~14。
< monomer A1 >
As the monomer A1, an alkyl (meth) acrylate having a Tg of a homopolymer of -50 ° C or lower and a branched alkyl group having 8 to 18 carbon atoms at the end of the ester group is used. From the viewpoint of improving the adhesion to an adherend having a rough surface, the Tg of the homopolymer of the monomer A1 is preferably -55 ° C or lower, more preferably -60 ° C or lower. From the viewpoint of improving the retention, the Tg of the homopolymer of the monomer A1 is preferably -80 ° C or higher, and more preferably -75 ° C or higher. From the viewpoint of imparting moderate flexibility to the resin layer and from the viewpoint of improving the cohesiveness of the resin layer, the number of carbon atoms in the alkyl group of the monomer A1 is preferably from 8 to 16, and more preferably from 8 to 14.

於此處所揭示之技術中,各單體之均聚物之Tg係「聚合物手冊(Polymer Handbook)」(第3版,John Wiley & Sons, Inc., 1989年)中所記載之數值。於在上述聚合物手冊中記載有複數個數值之情形時,採用常規(conventional)之值。關於上述聚合物手冊中未記載之單體,採用單體製造企業之目錄值。In the technology disclosed herein, the Tg of the homopolymer of each monomer is the value described in the "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc., 1989). When a plurality of values are described in the polymer manual, conventional values are used. For the monomers not listed in the above polymer manual, the catalog values of the monomer manufacturing companies are used.

作為於上述聚合物手冊中無記載,且亦未提供單體製造企業之目錄值之單體之均聚物之Tg,使用藉由以下之測定方法所獲得之值。即,於具備溫度計、攪拌機、氮氣導入管及回流冷卻管之反應器中,投入測定對象之單體100重量份、2,2'-偶氮二異丁腈0.1重量份、及作為聚合溶劑之乙酸乙酯200重量份,一面導入氮氣一面攪拌1小時。如此去除聚合系統內之氧氣後,升溫至60℃並反應12小時。繼而,冷卻至室溫,將該均聚物溶液流延塗佈於剝離襯墊上,進行乾燥而製作厚度約50 μm之試驗樣本(片狀之均聚物)。自所獲得之試驗樣本採集2~3 mg之試樣,放入至鋁製容器中,進行捲曲而進行DSC(differential scanning calorimetry,示差掃描熱量測定)測定(TA Instruments製造之Q-2000)。溫控程式設為-80℃~150℃(測定速度10℃/min),於氮氣(50 ml/min)氛圍氣體下進行測定。自所獲得之圖表讀取Tmg(中點玻璃轉移溫度)之數值,將該值設為均聚物之Tg。As the Tg of the homopolymer of the monomer which is not described in the polymer manual and does not provide the catalog value of the monomer manufacturing company, the value obtained by the following measurement method is used. That is, in a reactor equipped with a thermometer, a stirrer, a nitrogen introduction pipe, and a reflux cooling pipe, 100 parts by weight of the monomer to be measured, 0.1 part by weight of 2,2'-azobisisobutyronitrile, and a polymerization solvent were charged. 200 parts by weight of ethyl acetate was stirred for 1 hour while introducing nitrogen gas. After the oxygen in the polymerization system was removed in this way, the temperature was raised to 60 ° C and the reaction was performed for 12 hours. Then, it cooled to room temperature, cast this homopolymer solution on the release liner, and dried it, and produced the test sample (sheet-like homopolymer) with a thickness of about 50 micrometers. A sample of 2 to 3 mg was collected from the obtained test sample, put into an aluminum container, and rolled to perform DSC (differential scanning calorimetry) measurement (Q-2000 manufactured by TA Instruments). The temperature control program was set to -80 ° C to 150 ° C (measurement speed: 10 ° C / min), and the measurement was performed under a nitrogen (50 ml / min) atmosphere. The value of Tmg (midpoint glass transition temperature) was read from the obtained graph, and this value was set to the Tg of the homopolymer.

作為單體A1,例如可例示:丙烯酸2-乙基己酯(碳數8,均聚物之Tg=-70℃)、丙烯酸異辛酯(碳數8,均聚物之Tg=-58℃)、丙烯酸異壬酯(碳數9,均聚物之Tg=-58℃)、丙烯酸異癸酯(碳數10,均聚物之Tg=-60℃)、丙烯酸異肉豆蔻酯(碳數14,Tg=-56℃)、丙烯酸異十一烷基酯、丙烯酸異十二烷基酯、丙烯酸異十五烷基酯、丙烯酸異十六烷基酯、丙烯酸異十七烷基酯、丙烯酸異十八烷基酯、及上述例示之甲基丙烯酸酯。單體A1可單獨使用一種或者組合兩種以上而使用。再者,就提高樹脂層之黏著力之觀點、或聚合反應性之觀點而言,作為單體A1,較佳為丙烯酸烷基酯。Examples of the monomer A1 include 2-ethylhexyl acrylate (carbon number 8, Tg of homopolymer = -70 ° C), isooctyl acrylate (carbon number 8, Tg of homopolymer = -58 ° C) ), Isononyl acrylate (carbon number 9, Tg of homopolymer = -58 ° C), isodecyl acrylate (carbon number 10, Tg of homopolymer = -60 ° C), isomyristyl acrylate (carbon number 14, Tg = -56 ° C), isoundecyl acrylate, isododecyl acrylate, isopentadecyl acrylate, isohexadecyl acrylate, isoheptadecyl acrylate, acrylic acid Isooctadecyl ester, and the methacrylate ester exemplified above. The monomer A1 may be used singly or in combination of two or more kinds. In addition, from the viewpoint of improving the adhesive force of the resin layer or the viewpoint of polymerization reactivity, the monomer A1 is preferably an alkyl acrylate.

<單體A2>
作為單體A2,使用均聚物之Tg為-40℃以下且於分子骨架內具有醚鍵之(甲基)丙烯酸酯。就提高對於具有粗糙面之被接著體之接著力之觀點而言,單體A2之均聚物之Tg較佳為-45℃以下,更佳為-50℃以下。就提高對於具有粗糙面之被接著體之接著力及保持力之觀點而言,單體A2之均聚物之Tg較佳為-90℃以上,更佳為-80℃以上。再者,單體A2於分子骨架內所具有之上述醚鍵意指鏈狀醚鍵,與環氧基或氧雜環丁烷基等之類之環狀醚鍵有所區別。
< monomer A2 >
As the monomer A2, a (meth) acrylate having a Tg of a homopolymer of -40 ° C or lower and having an ether bond in a molecular skeleton is used. From the viewpoint of improving the adhesion to an adherend having a rough surface, the Tg of the homopolymer of the monomer A2 is preferably -45 ° C or lower, more preferably -50 ° C or lower. From the viewpoint of improving the adhesion and holding power of an adherend having a rough surface, the Tg of the homopolymer of the monomer A2 is preferably -90 ° C or higher, more preferably -80 ° C or higher. In addition, the above-mentioned ether bond in the molecular skeleton of the monomer A2 means a chain ether bond, which is different from a cyclic ether bond such as an epoxy group or an oxetanyl group.

作為單體A2,可無特別限制地使用具有(甲基)丙烯醯基之不飽和雙鍵,且具有鏈狀醚鍵者。作為單體A2,例如可列舉通式(1):CH2 =CR1 -COO-(AO)n -R2 ;所表示之單體等。此處,上述通式(1)中之R1 為氫原子或甲基。AO為碳數2~3之伸烷氧基。n係表示伸烷氧基之平均加成莫耳數之數。R2 係不包含醚鍵之一價有機基,較佳為烴基。單體A2可單獨使用一種或者組合兩種以上而使用。As the monomer A2, an unsaturated double bond having a (meth) acrylfluorenyl group and a chain ether bond can be used without particular limitation. Examples of the monomer A2 include the general formula (1): CH 2 = CR 1 -COO- (AO) n -R 2 ; a monomer represented by the formula, and the like. Here, R 1 in the general formula (1) is a hydrogen atom or a methyl group. AO is an alkoxy group having 2 to 3 carbon atoms. n is a number representing the average addition mole number of alkoxy groups. R 2 is a monovalent organic group which does not contain an ether bond, and is preferably a hydrocarbon group. The monomer A2 may be used singly or in combination of two or more kinds.

上述通式(1)中之n例如可為1~10。就極性等級及聚合反應性之觀點而言,於若干態樣中,上述通式(1)中之n較佳為2~8,更佳為2~5。In the general formula (1), n may be 1 to 10, for example. From the viewpoints of polarity rank and polymerization reactivity, in some aspects, n in the general formula (1) is preferably 2 to 8, more preferably 2 to 5.

上述通式(1)中之R2 較佳為未經取代之芳香環、或者直鏈、支鏈或脂環式烷基。作為R2 之芳香環之例,可列舉苯基等。作為R2 之直鏈烷基、支鏈烷基之例,可列舉:異丙基、乙基、甲基等。作為R2 之脂環式烷基之例,可列舉環己基等。就容易成為均聚物之Tg較低之含鏈狀醚鍵之(甲基)丙烯酸酯之方面而言,R2 較佳為直鏈烷基或支鏈烷基,尤佳為直鏈烷基。又,就容易成為具有適度之極性之單體A2之方面而言,R2 之碳數較佳為1~6,更佳為1~5,亦可為1~4或1~3。R 2 in the general formula (1) is preferably an unsubstituted aromatic ring, or a linear, branched, or alicyclic alkyl group. Examples of the aromatic ring of R 2 include a phenyl group and the like. Examples of the linear alkyl group and branched alkyl group of R 2 include isopropyl group, ethyl group, and methyl group. Examples of the alicyclic alkyl group of R 2 include a cyclohexyl group and the like. In terms of a (meth) acrylic acid ester containing a chain ether bond having a low Tg which is easily a homopolymer, R 2 is preferably a linear alkyl group or a branched alkyl group, and more preferably a linear alkyl group. . In addition, from the viewpoint of easily becoming a monomer A2 having a moderate polarity, the carbon number of R 2 is preferably 1 to 6, more preferably 1 to 5, or 1 to 4 or 1 to 3.

上述通式(1)所表示之單體之例包含甲氧基聚乙二醇(甲基)丙烯酸酯、乙氧基聚乙二醇(甲基)丙烯酸酯、丙氧基聚乙二醇(甲基)丙烯酸酯等AO為碳數2之伸烷氧基之單體;及甲氧基聚丙二醇(甲基)丙烯酸酯、乙氧基聚丙二醇(甲基)丙烯酸酯、丙氧基聚丙二醇(甲基)丙烯酸酯等AO為碳數3之伸烷氧基之單體。就聚合反應性之觀點而言,較佳為上述通式(1)中之R1 為氫原子之單體A2。即,單體A2較佳為丙烯酸酯。Examples of the monomer represented by the general formula (1) include methoxy polyethylene glycol (meth) acrylate, ethoxy polyethylene glycol (meth) acrylate, and propoxy polyethylene glycol ( Meth) acrylate and other AO are alkoxyoxy monomers having 2 carbon atoms; and methoxy polypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate, and propoxy polypropylene glycol AO such as (meth) acrylate is a monomer having 3 alkoxy groups. From the viewpoint of polymerization reactivity, the monomer A2 in which R 1 in the general formula (1) is a hydrogen atom is preferred. That is, the monomer A2 is preferably an acrylate.

就具有適度之極性平衡性之觀點而言,上述通式(1)中之AO較佳為碳數2之伸烷氧基、即氧乙烯基。作為具體之化合物,可列舉:乙基卡必醇丙烯酸酯(丙烯酸乙氧基乙氧基乙酯)(均聚物之Tg=-67℃)、甲氧基三乙二醇丙烯酸酯(均聚物之Tg=-57℃)等。From the viewpoint of having a moderate polarity balance, AO in the general formula (1) is preferably an alkoxy group having 2 carbon atoms, that is, an oxyethylene group. Specific compounds include ethyl carbitol acrylate (ethoxyethoxyethyl acrylate) (Tg of homopolymer = -67 ° C), and methoxytriethylene glycol acrylate (homopolymer Tg = -57 ° C) and so on.

於此處所揭示之技術中,單體A1之使用量適合為形成(甲基)丙烯酸系聚合物之所有單體成分之50~97重量%。就提高對粗糙面之接著力及保持力之觀點而言,單體A1之使用量較佳為上述單體成分之55重量%以上,更佳為58重量%以上,進而較佳為59重量%以上。又,就提高對粗糙面之接著力及保持力之觀點而言,單體A1之使用量較佳為上述單體成分之95重量%以下,更佳為93重量%以下,進而較佳為91重量%以下。In the technology disclosed herein, the amount of the monomer A1 is suitably 50 to 97% by weight of all the monomer components forming the (meth) acrylic polymer. From the viewpoint of improving the adhesion and holding power to the rough surface, the usage amount of the monomer A1 is preferably 55% by weight or more, more preferably 58% by weight or more, and still more preferably 59% by weight. the above. From the viewpoint of improving the adhesion and holding power to the rough surface, the use amount of the monomer A1 is preferably 95% by weight or less, more preferably 93% by weight or less, and still more preferably 91% by weight. % By weight or less.

於此處所揭示之技術中,單體A2之使用量適合為形成(甲基)丙烯酸系聚合物之所有單體成分之3~50重量%。就提高對粗糙面之接著力及保持力之觀點而言,單體A2之使用量較佳為上述單體成分之3.5重量%以上,更佳為4重量%以上,進而較佳為4.5重量%以上。又,就提高對粗糙面之接著力及保持力之觀點而言,單體A2之使用量較佳為上述單體成分之48重量%以下,更佳為45重量%以下,進而較佳為40重量%以下。In the technology disclosed herein, the amount of the monomer A2 is suitably 3 to 50% by weight of all the monomer components forming the (meth) acrylic polymer. From the viewpoint of improving the adhesion and holding power to the rough surface, the amount of the monomer A2 used is preferably 3.5% by weight or more, more preferably 4% by weight or more, and still more preferably 4.5% by weight. the above. From the viewpoint of improving the adhesion and holding force to the rough surface, the use amount of the monomer A2 is preferably 48% by weight or less, more preferably 45% by weight or less, and even more preferably 40% by weight. % By weight or less.

單體A1與單體A2之合計比率例如可為所有單體成分之75重量%以上。就進一步提高對具有粗糙面之被接著體之接著力及保持力之觀點而言,單體A1與單體A2之合計比率較佳為所有單體成分之80重量%以上,更佳為85重量%以上,進而較佳為90重量%以上。The total ratio of the monomers A1 and A2 may be, for example, 75% by weight or more of all the monomer components. From the viewpoint of further improving the adhesion and holding power of the adherend having a rough surface, the total ratio of the monomer A1 to the monomer A2 is preferably 80% by weight or more of all monomer components, and more preferably 85% by weight. % Or more, and more preferably 90% by weight or more.

<含官能基之單體>
形成上述(甲基)丙烯酸系聚合物之單體成分可包含選自由具有羥基之單體、具有羧基之單體及具有環氧基之單體所組成之群中的至少一種含官能基之單體。藉由包含此種含官能基之單體,可維持樹脂層之柔軟性,並且形成交聯網路且控制分子間相互作用,可提高樹脂層之凝聚力,可表現更高之保持力。上述單體成分例如可組合包含具有羥基之單體與具有羧基之單體。
< functional monomers >
The monomer component forming the (meth) acrylic polymer may include at least one functional group-containing monomer selected from the group consisting of a monomer having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an epoxy group. body. By including such a functional group-containing monomer, the flexibility of the resin layer can be maintained, and an interconnection network can be formed to control the interaction between molecules. The cohesion of the resin layer can be improved and a higher retention force can be exhibited. The monomer component may include, for example, a monomer having a hydroxyl group and a monomer having a carboxyl group.

作為上述具有羥基之單體(含羥基單體),可無特別限制地使用具有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵之聚合性之官能基且具有羥基者。作為含羥基單體,例如可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯等(甲基)丙烯酸羥基烷基酯;(甲基)丙烯酸(4-羥基甲基環己基)甲酯等羥基烷基環烷烴(甲基)丙烯酸酯等。作為其他含羥基單體,可列舉:羥基乙基(甲基)丙烯醯胺、烯丙醇、2-羥基乙基乙烯醚、4-羥基丁基乙烯醚、二乙二醇單乙烯醚等。含羥基單體可單獨使用一種或者組合兩種以上而使用。其中,較佳為(甲基)丙烯酸羥基烷基酯,尤佳為(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯。As the monomer having a hydroxyl group (a hydroxyl-containing monomer), a polymerizable functional group having an unsaturated double bond such as a (meth) acrylfluorenyl group or a vinyl group and a hydroxyl group can be used without particular limitation. Examples of the hydroxyl-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4- Hydroxybutyl, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, etc. Hydroxyalkyl acrylate; hydroxyalkylcycloalkane (meth) acrylate such as (4-hydroxymethylcyclohexyl) methyl (meth) acrylate and the like. Examples of other hydroxyl-containing monomers include hydroxyethyl (meth) acrylamide, allyl alcohol, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. The hydroxyl group-containing monomers may be used singly or in combination of two or more kinds. Among them, hydroxyalkyl (meth) acrylate is preferred, and 2-hydroxyethyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate are particularly preferred.

作為上述具有羧基之單體(含羧基單體),可無特別限制地使用具有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵之聚合性之官能基且具有羧基者。作為含羧基單體,例如可列舉:(甲基)丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等。含羧基單體可單獨使用一種或者組合兩種以上而使用。於該等中,較佳為丙烯酸、甲基丙烯酸,尤佳為丙烯酸。As the monomer having a carboxyl group (carboxyl group-containing monomer), a polymerizable functional group having an unsaturated double bond such as a (meth) acrylfluorenyl group or a vinyl group and a carboxyl group can be used without particular limitation. Examples of the carboxyl group-containing monomer include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, itaconic acid, maleic acid, fumaric acid, Butenoic acid, methacrylic acid, etc. The carboxyl group-containing monomers may be used alone or in combination of two or more. Among these, acrylic acid and methacrylic acid are preferred, and acrylic acid is particularly preferred.

作為上述具有環氧基之單體(含環氧基單體),可無特別限制地使用具有(甲基)丙烯醯基或乙烯基等具有不飽和雙鍵之聚合性之官能基且具有環氧基者。作為含環氧基單體,例如可列舉:(甲基)丙烯酸縮水甘油酯、(甲基)丙烯酸3,4-環氧環己基甲酯、(甲基)丙烯酸4-羥基丁酯縮水甘油醚等。含環氧基單體可單獨使用一種或者組合兩種以上而使用。As the above-mentioned monomer having an epoxy group (epoxy-containing monomer), a polymerizable functional group having an unsaturated double bond, such as a (meth) acrylfluorenyl group or a vinyl group, and having a ring can be used without particular limitation. Oxygen. Examples of the epoxy group-containing monomer include glycidyl (meth) acrylate, 3,4-epoxycyclohexyl methyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate glycidyl ether. Wait. The epoxy group-containing monomer may be used singly or in combination of two or more kinds.

就提高凝聚力之觀點而言,使用含羥基單體之情形時之使用量較佳為形成(甲基)丙烯酸系聚合物之所有單體成分的0.01重量%以上,更佳為0.03重量%以上。就抑制過度之黏度上升或凝膠化之觀點而言,含羥基單體之使用量適合為上述單體成分之20重量%以下,較佳為15重量%以下,更佳為10重量%以下,進而較佳為5重量%以下,進而更佳為3重量%以下,尤佳為2重量%以下。From the viewpoint of improving cohesion, when the hydroxyl-containing monomer is used, the amount used is preferably 0.01% by weight or more, and more preferably 0.03% by weight or more, of all monomer components forming the (meth) acrylic polymer. From the viewpoint of suppressing excessive viscosity increase or gelation, the amount of the hydroxyl-containing monomer used is preferably 20% by weight or less, preferably 15% by weight or less, more preferably 10% by weight or less, It is more preferably 5 wt% or less, still more preferably 3 wt% or less, and even more preferably 2 wt% or less.

就提高凝聚力之觀點、及賦予與被接著體表面之分子水準下之相互作用之觀點而言,使用含羧基單體之情形時之使用量較佳為形成(甲基)丙烯酸系聚合物之所有單體成分的0.1重量%以上,更佳為0.2重量%以上。就提高對粗糙面之追隨性之觀點、或將低溫下之黏著力維持為較高之觀點而言,含羧基單體之使用量較佳為上述單體成分之5重量%以下,更佳為3重量%以下,進而較佳為2.6重量%以下,尤佳為2.2重量%以下。From the viewpoint of improving cohesion and imparting interaction with the molecular level on the surface of the adherend, when using a carboxyl group-containing monomer, the amount used is preferably all that forms a (meth) acrylic polymer. The monomer component is 0.1% by weight or more, and more preferably 0.2% by weight or more. From the viewpoint of improving the followability to the rough surface or maintaining the adhesion at a low temperature, the use amount of the carboxyl group-containing monomer is preferably 5% by weight or less of the aforementioned monomer component, and more preferably 3% by weight or less, more preferably 2.6% by weight or less, and particularly preferably 2.2% by weight or less.

就提高凝聚力之觀點而言,使用含環氧基單體之情形時之使用量較佳為形成(甲基)丙烯酸系聚合物之所有單體成分的0.1重量%以上,更佳為0.2重量%以上。就抑制凝膠化或高黏度化之觀點而言,含環氧基單體之使用量較佳為上述單體成分之1重量%以下,更佳為0.5重量%以下。再者,於(甲基)丙烯酸系聚合物為接枝聚合物之情形時,並不限於此。From the viewpoint of improving cohesion, when the epoxy group-containing monomer is used, the amount used is preferably 0.1% by weight or more, and more preferably 0.2% by weight, of all monomer components forming the (meth) acrylic polymer. the above. From the viewpoint of suppressing gelation or high viscosity, the amount of the epoxy-containing monomer used is preferably 1% by weight or less, and more preferably 0.5% by weight or less. When the (meth) acrylic polymer is a graft polymer, it is not limited to this.

於併用含羥基單體與含羧基單體作為上述含官能基之單體之情形時,就提高對具有粗糙面之被接著體之接著力之觀點而言,含羥基單體與含羧基單體之重量比(含羥基單體/含羧基單體)較佳為0.01以上,更佳為0.02以上,又,較佳為1.0以下,更佳為0.50以下。When a hydroxyl-containing monomer and a carboxyl-containing monomer are used together as the functional group-containing monomer, from the viewpoint of improving the adhesion to a substrate having a rough surface, the hydroxyl-containing monomer and the carboxyl-containing monomer The weight ratio (hydroxyl-containing monomer / carboxyl-containing monomer) is preferably 0.01 or more, more preferably 0.02 or more, still more preferably 1.0 or less, and more preferably 0.50 or less.

<共聚合單體>
形成上述(甲基)丙烯酸系聚合物之單體成分除上述單體A1及單體A2以外,亦可視需要包含上述含官能基之單體以外之共聚合單體(相當於單體A1或單體A2者除外)。共聚合單體可單獨使用一種或者組合兩種以上而使用。
< Co-monomers >
In addition to the monomers A1 and A2, the monomer components forming the (meth) acrylic polymer may optionally include copolymerized monomers (equivalent to monomer A1 or monomers) other than the functional group-containing monomers. Except for A2). The copolymerizable monomers may be used singly or in combination of two or more kinds.

作為上述共聚合單體,例如可列舉通式(2):CH2 =CR3 -COO-R4 ;所表示之單體。此處,上述通式(2)中之R3 為氫原子或甲基。R4 係碳數1~24之未經取代之烷基或經取代之烷基。Examples of the copolymerizable monomer include a monomer represented by the general formula (2): CH 2 = CR 3 -COO-R 4 ; Here, R 3 in the general formula (2) is a hydrogen atom or a methyl group. R 4 is an unsubstituted alkyl group or a substituted alkyl group having 1 to 24 carbon atoms.

作為上述通式(2)中之R4 之碳數1~24(更佳為碳數1~18)之未經取代之烷基或經取代之烷基表示直鏈、支鏈之烷基、或環狀之環烷基。具體而言,R4 可為碳數1~18之直鏈狀烷基、碳數3~7之支鏈烷基、環狀之烷基等。於R4 為經取代之烷基之情形時,作為該取代基之較佳例,可列舉:碳數3~7之芳基、或碳數3~7之芳氧基等。作為上述芳基,並無特別限定,例如較佳為苯基。The unsubstituted alkyl group or substituted alkyl group having 1 to 24 carbon atoms (more preferably 1 to 18 carbon atoms) as R 4 in the above-mentioned general formula (2) represents a linear or branched alkyl group, Or cyclic cycloalkyl. Specifically, R 4 may be a linear alkyl group having 1 to 18 carbon atoms, a branched alkyl group having 3 to 7 carbon atoms, or a cyclic alkyl group. In the case where R 4 is a substituted alkyl group, examples of preferred substituents include an aryl group having 3 to 7 carbon atoms or an aryloxy group having 3 to 7 carbon atoms. Although it does not specifically limit as said aryl group, For example, a phenyl group is preferable.

作為上述通式(2)所表示之單體之例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸3,3,5-三甲基環己酯、(甲基)丙烯酸異基酯、萜烯(甲基)丙烯酸酯、(甲基)丙烯酸二環戊酯等。Examples of the monomer represented by the general formula (2) include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, and (meth) acrylic acid second Butyl ester, third butyl (meth) acrylate, isobutyl (meth) acrylate, n-amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, (formyl) (Heptyl) heptyl acrylate, isoamyl (meth) acrylate, n-octyl (meth) acrylate, n-nonyl (meth) acrylate, phenoxyethyl (meth) acrylate, benzyl (meth) acrylate Ester, cyclohexyl (meth) acrylate, 3,3,5-trimethylcyclohexyl (meth) acrylate, isopropyl (meth) acrylate, terpene (meth) acrylate, (meth) ) Dicyclopentyl acrylate and the like.

又,作為上述共聚合單體,例如亦可使用乙酸乙烯酯、丙酸乙烯酯、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺、N-乙烯基吡咯啶酮等乙烯基系單體;(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯或丙烯酸2-甲氧基乙酯等(甲基)丙烯酸酯系單體;(甲基)丙烯腈等含氰基單體;除此以外,亦可使用含醯胺基單體、含胺基單體、含醯亞胺基單體、N-丙烯醯啉、乙烯醚單體等。As the comonomer, for example, ethylene such as vinyl acetate, vinyl propionate, styrene, α-methylstyrene, N-vinyl caprolactam, and N-vinylpyrrolidone can be used. Basic monomers; (meth) acrylic acid esters such as tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, polysiloxane (meth) acrylate, or 2-methoxyethyl acrylate Body; cyano group-containing monomers such as (meth) acrylonitrile; in addition, fluorenylamine-containing monomers, amine-containing monomers, fluorenimine-containing monomers, N-acrylamidoline, ethylene Ether monomers, etc.

作為上述共聚合單體之其他例,可列舉含有矽原子之矽烷系單體等。作為矽烷系單體,例如可列舉:3-丙烯醯氧基丙基三乙氧基矽烷、乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷、4-乙烯基丁基三甲氧基矽烷、4-乙烯基丁基三乙氧基矽烷、8-乙烯基辛基三甲氧基矽烷、8-乙烯基辛基三乙氧基矽烷、10-甲基丙烯醯氧基癸基三甲氧基矽烷、10-丙烯醯氧基癸基三甲氧基矽烷、10-甲基丙烯醯氧基癸基三乙氧基矽烷、10-丙烯醯氧基癸基三乙氧基矽烷等。As another example of the above-mentioned copolymerized monomer, a silane-based monomer containing a silicon atom and the like can be mentioned. Examples of the silane-based monomer include 3-propenyloxypropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 4-vinylbutyltrimethoxysilane, 4-vinylbutyltriethoxysilane, 8-vinyloctyltrimethoxysilane, 8-vinyloctyltriethoxysilane, 10-methacryloxydecyltrimethoxysilane, 10-propenyloxydecyltrimethoxysilane, 10-methacryloxydecyltriethoxysilane, 10-propenyloxydecyltriethoxysilane, and the like.

上述共聚合單體之使用量較佳為形成(甲基)丙烯酸系聚合物之所有單體成分之20重量%以下,更佳為15重量%以下。若共聚合單體之含量超過20重量%,則例如有對粗糙面之接著性降低之情形。The usage-amount of the said copolymerization monomer is 20 weight% or less of all the monomer components which form a (meth) acrylic-type polymer, Preferably it is 15 weight% or less. When the content of the comonomer exceeds 20% by weight, for example, the adhesion to the rough surface may be reduced.

<多官能性單體>
形成上述(甲基)丙烯酸系聚合物之單體成分可基於凝聚力之調製等目的,視需要含有多官能性單體。多官能性單體可單獨使用一種或者組合兩種以上而使用。
< Polyfunctional monomer >
The monomer component forming the (meth) acrylic polymer may contain a polyfunctional monomer, if necessary, for the purpose of preparing cohesiveness and the like. The polyfunctional monomer may be used singly or in combination of two or more kinds.

上述多官能性單體係具有至少2個具有不飽和雙鍵之聚合性官能基((甲基)丙烯醯基、乙烯基等)之單體,例如可列舉:(聚)乙二醇二(甲基)丙烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、1,2-乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯等多元醇與(甲基)丙烯酸之酯化合物;(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯基苯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯、二(甲基)丙烯酸丁酯、二(甲基)丙烯酸己酯等。於該等中,較佳為三羥甲基丙烷三(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯。The above-mentioned polyfunctional single system is a monomer having at least two polymerizable functional groups ((meth) acrylfluorenyl group, vinyl group, etc.) having an unsaturated double bond, and examples thereof include (poly) ethylene glycol di ( (Meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol Hexa (meth) acrylate, 1,2-ethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,12-dodecanediol di (methyl) (Meth) acrylate esters of polyhydric alcohols such as acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tri (meth) acrylate, and (meth) acrylic acid; allyl (meth) acrylate Ester, vinyl (meth) acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, butyl di (meth) acrylate, hexyl di (meth) acrylate, etc. . Among these, trimethylolpropane tri (meth) acrylate, hexanediol di (meth) acrylate, and dipentaerythritol hexa (meth) acrylate are preferred.

上述多官能性單體可相對於形成(甲基)丙烯酸系聚合物之所有單體成分,以5重量%以下使用。上述多官能性單體根據其分子量或官能基數等而不同,相對於形成(甲基)丙烯酸系聚合物之所有單體成分,較佳為3重量%以下,進而較佳為2重量%以下。若多官能性單體之含量過多,則例如有樹脂組合物之彈性模數變得過高,對粗糙面之接著性(尤其是低溫範圍下之接著性)降低之情形。The polyfunctional monomer may be used in an amount of 5% by weight or less based on all the monomer components forming the (meth) acrylic polymer. The said polyfunctional monomer differs according to its molecular weight, the number of functional groups, etc., It is preferable that it is 3 weight% or less with respect to all the monomer components which form a (meth) acrylic-type polymer, and it is still more preferable that it is 2 weight% or less. If the content of the polyfunctional monomer is too large, for example, the elastic modulus of the resin composition may become too high, and the adhesion to the rough surface (especially the adhesion in a low temperature range) may be reduced.

<(甲基)丙烯酸系聚合物及其製造方法>
上述(甲基)丙烯酸系聚合物之Tg為-40℃以下。就提高對具有粗糙面之被接著體之接著力之觀點而言,上述(甲基)丙烯酸系聚合物之Tg較佳為-45℃以下,更佳為-50℃以下。就提高低溫下之接著性之觀點而言,於若干態樣中,上述(甲基)丙烯酸系聚合物之Tg例如較佳為-55℃以下,更佳為-57℃以下,進而較佳為-60℃以下。又,就提高對具有粗糙面之被接著體之接著力及保持力之觀點而言,上述(甲基)丙烯酸系聚合物之Tg較佳為-85℃以上,更佳為-80℃以上。
< (Meth) acrylic polymer and its production method >
The Tg of the (meth) acrylic polymer is -40 ° C or lower. From the viewpoint of improving the adhesion to an adherend having a rough surface, the Tg of the (meth) acrylic polymer is preferably -45 ° C or lower, more preferably -50 ° C or lower. From the viewpoint of improving the adhesion at low temperature, in some aspects, the Tg of the (meth) acrylic polymer is, for example, preferably -55 ° C or lower, more preferably -57 ° C or lower, and even more preferably Below -60 ° C. Moreover, from a viewpoint of improving the adhesive force and holding force with respect to the adherend which has a rough surface, Tg of the said (meth) acrylic-type polymer becomes like this. Preferably it is -85 degreeC or more, More preferably, it is -80 degreeC or more.

此處,上述(甲基)丙烯酸系聚合物之Tg係基於構成(甲基)丙烯酸系聚合物之單體成分之組成,根據以下之Fox之式算出之理論值。
Fox之式:1/Tg=W1 /Tg1 +W2 /Tg2 +・・・+Wn /Tgn
[式中,Tg為(甲基)丙烯酸系聚合物之玻璃轉移溫度(單位:K),Tgi (i=1、2、・・・n)係單體i形成均聚物時之玻璃轉移溫度(單位:K),Wi (i=1、2、・・・n)表示單體i於所有單體成分中之質量分率]
Here, the Tg of the (meth) acrylic polymer is a theoretical value calculated based on the composition of monomer components constituting the (meth) acrylic polymer based on the following formula of Fox.
Fox's formula: 1 / Tg = W 1 / Tg 1 + W 2 / Tg 2 + ・ ・ ・ + W n / Tg n
[In the formula, Tg is the glass transition temperature (unit: K) of the (meth) acrylic polymer, and Tg i (i = 1, 2, ...) is the glass transition when the monomer i forms a homopolymer temperature (unit: K), W i (i = 1,2, · · · n) represents the mass fraction of the monomer i in all of the monomer component]

上述(甲基)丙烯酸系聚合物之製造方法並無特別限定,可適當選擇公知之製造方法。例如可利用溶液聚合、藉由電子束或紫外線(UV)等之照射之放射線聚合、塊狀聚合、乳液聚合等各種自由基聚合法。又,所獲得之(甲基)丙烯酸系聚合物可為無規共聚物、嵌段共聚物、接枝共聚物等中之任一種。The manufacturing method of the said (meth) acrylic-type polymer is not specifically limited, A well-known manufacturing method can be selected suitably. For example, various radical polymerization methods such as solution polymerization, radiation polymerization by electron beam or ultraviolet (UV) irradiation, block polymerization, and emulsion polymerization can be used. The obtained (meth) acrylic polymer may be any of a random copolymer, a block copolymer, and a graft copolymer.

於上述自由基聚合中,可根據聚合之態樣,視需要使用公知之聚合起始劑、鏈轉移劑、乳化劑、聚合溶劑等。再者,上述(甲基)丙烯酸系聚合物之Mw可藉由聚合起始劑、鏈轉移劑、反應條件等進行控制,根據該等之種類調整適當之其使用量。In the above-mentioned radical polymerization, a known polymerization initiator, a chain transfer agent, an emulsifier, a polymerization solvent, and the like may be used as necessary according to the state of polymerization. In addition, the Mw of the (meth) acrylic polymer can be controlled by a polymerization initiator, a chain transfer agent, reaction conditions, and the like, and an appropriate amount thereof can be adjusted according to the types of these.

於溶液聚合中,作為聚合溶劑,例如可使用乙酸乙酯、甲苯、該等之混合溶劑等。上述溶液聚合例如於氮氣等惰性氣體氣流下,加入聚合起始劑,通常以50~70℃左右,於5~30小時左右之反應條件下進行。In the solution polymerization, as the polymerization solvent, for example, ethyl acetate, toluene, or a mixed solvent thereof can be used. The above-mentioned solution polymerization is carried out, for example, under a gas flow of inert gas such as nitrogen and adding a polymerization initiator, usually at a temperature of about 50 to 70 ° C. and under reaction conditions of about 5 to 30 hours.

作為上述聚合起始劑,例如可列舉:2,2'-偶氮二異丁腈(AIBN)、2,2'-偶氮雙(2-脒基丙烷)二鹽酸鹽、2,2'-偶氮雙[2-(5-甲基-2-咪唑啉-2-基)丙烷]二鹽酸鹽、2,2'-偶氮雙(2-甲基丙脒)二硫酸鹽、2,2'-偶氮雙(N,N'-二亞甲基異丁基脒)、2,2'-偶氮雙[N-(2-羧基乙基)-2-甲基丙脒]水合物(和光純藥公司製造,VA-057)等偶氮系起始劑;過硫酸鉀、過硫酸銨等過硫酸鹽;過氧化二碳酸二(2-乙基己基)酯、過氧化二碳酸二(4-第三丁基環己基)酯、過氧化二碳酸二-第二丁酯、過氧化新癸酸第三丁酯、過氧化特戊酸第三己酯、過氧化特戊酸第三丁酯、過氧化二月桂醯、過氧化二正辛醯、過氧化1,1,3,3-四甲基丁基-2-乙基己酸酯、過氧化二(4-甲基苯甲醯基)、過氧化二苯甲醯、過氧化異丁酸第三丁酯、1,1-二(過氧化第三己基)環己烷、氫過氧化第三丁基、過氧化氫等過氧化物系起始劑;過硫酸鹽與亞硫酸氫鈉之組合、過氧化物與抗壞血酸鈉之組合等組合過氧化物與還原劑之氧化還原系起始劑等,但並不限定於該等。於若干態樣中,可較佳地使用AIBN作為聚合起始劑。Examples of the polymerization initiator include 2,2'-azobisisobutyronitrile (AIBN), 2,2'-azobis (2-fluorenylpropane) dihydrochloride, and 2,2 ' -Azobis [2- (5-methyl-2-imidazolin-2-yl) propane] dihydrochloride, 2,2'-Azobis (2-methylpropionamidine) disulfate, 2 , 2'-Azobis (N, N'-dimethylmethylene isobutylphosphonium), 2,2'-azobis [N- (2-carboxyethyl) -2-methylpropylhydrazone] hydrate Compounds (manufactured by Wako Pure Chemical Industries, VA-057) and other azo initiators; persulfates such as potassium persulfate and ammonium persulfate; bis (2-ethylhexyl) peroxydicarbonate, peroxydicarbonate Di (4-third butylcyclohexyl) ester, di-second butyl peroxydicarbonate, tertiary butyl peroxydecanoate, tertiary hexyl pervalerate, tertiary pervalerate Tributyl ester, dilauryl peroxide, di-n-octyl peroxide, 1,1,3,3-tetramethylbutyl-2-ethylhexanoate, di (4-methylbenzene peroxide) (Methylamino), dibenzoylperoxide, tert-butyl isobutyrate, 1,1-bis (tertiary hexyl peroxide) cyclohexane, tertiary butyl hydroperoxide, hydrogen peroxide, etc. Peroxide-based initiator; persulfate and Oxidizing composition as sodium bisulfite, sodium peroxide composition of ascorbate in combination with a reducing agent of a peroxide redox initiator and so forth, but are not limited to such. In several aspects, AIBN can be preferably used as a polymerization initiator.

聚合起始劑可單獨使用一種或者組合兩種以上而使用。聚合起始劑之使用量通常相對於單體成分100重量份,較佳為大致0.005~1重量份左右,更佳為大致0.01~0.5重量份左右。The polymerization initiators may be used singly or in combination of two or more. The amount of the polymerization initiator used is usually about 0.005 to 1 part by weight, and more preferably about 0.01 to 0.5 part by weight, based on 100 parts by weight of the monomer component.

作為上述鏈轉移劑,例如可列舉:月桂硫醇、縮水甘油硫醇、巰基乙酸、2-巰基乙醇、硫代乙醇酸、硫代乙醇酸2-乙基己酯、2,3-二巰基-1-丙醇等。鏈轉移劑可單獨使用一種或者組合兩種以上而使用。鏈轉移劑之使用量適合為通常相對於單體成分之總量100重量份設為0.1重量份左右以下。或者亦可不使用鏈轉移劑。Examples of the chain transfer agent include lauryl mercaptan, glycidyl mercaptan, thioglycolic acid, 2-mercaptoethanol, thioglycolic acid, 2-ethylhexyl thioglycolate, and 2,3-dimercapto- 1-propanol and the like. The chain transfer agent may be used singly or in combination of two or more kinds. The amount of the chain transfer agent used is preferably set to about 0.1 parts by weight or less based on 100 parts by weight of the total amount of the monomer components. Alternatively, a chain transfer agent may not be used.

乳液聚合典型地使用公知之乳化劑進行。作為乳化劑,例如可列舉:月桂基硫酸鈉、月桂基硫酸銨、十二烷基苯磺酸鈉、聚氧乙烯烷基醚硫酸銨、聚氧乙烯烷基苯基醚硫酸鈉等陰離子系乳化劑;聚氧乙烯烷基醚、聚氧乙烯烷基苯基醚、聚氧乙烯脂肪酸酯、聚氧乙烯-聚氧丙烯嵌段聚合物等非離子系乳化劑等。Emulsion polymerization is typically performed using a known emulsifier. Examples of the emulsifier include anionic emulsifiers such as sodium lauryl sulfate, lauryl ammonium sulfate, sodium dodecylbenzenesulfonate, polyoxyethylene alkyl ether ammonium sulfate, and polyoxyethylene alkylphenyl ether sodium sulfate. Agent; non-ionic emulsifiers such as polyoxyethylene alkyl ether, polyoxyethylene alkylphenyl ether, polyoxyethylene fatty acid ester, polyoxyethylene-polyoxypropylene block polymer, etc.

作為上述乳化劑,可使用導入有丙烯基、烯丙醚基等自由基聚合性官能基之乳化劑。此種導入有聚合性官能基之乳化劑一般亦有時稱為反應性乳化劑。作為反應性乳化劑之具體例,可列舉:AQUALON HS-10、HS-20、KH-10、BC-05、BC-10、BC-20(以上均為第一工業製藥公司製造);ADEKA REASOAP SE10N(ADEKA公司製造)等。反應性乳化劑由於聚合後引入至聚合物鏈,故而耐水性變佳,從而較佳。As the emulsifier, an emulsifier into which a radical polymerizable functional group such as an propylene group or an allyl ether group is introduced can be used. Such an emulsifier having a polymerizable functional group introduced is also sometimes referred to as a reactive emulsifier. Specific examples of the reactive emulsifier include: AQUALON HS-10, HS-20, KH-10, BC-05, BC-10, BC-20 (the above are all manufactured by Daiichi Pharmaceutical Co., Ltd.); ADEKA REASOAP SE10N (manufactured by ADEKA). Since a reactive emulsifier is introduced into a polymer chain after polymerization, water resistance is improved, which is preferable.

乳化劑可單獨使用一種或者組合兩種以上而使用。乳化劑之使用量適合為相對於單體成分100重量份,通常設為0.3~5重量份左右,就聚合穩定性或機械穩定性而言,較佳為設為0.5~1重量份左右。Emulsifiers can be used alone or in combination of two or more. The amount of the emulsifier to be used is preferably about 0.3 to 5 parts by weight relative to 100 parts by weight of the monomer component. In terms of polymerization stability or mechanical stability, it is preferably set to about 0.5 to 1 part by weight.

上述(甲基)丙烯酸系聚合物係於藉由放射線聚合而製造之情形時,可藉由照射電子束、UV等放射線使上述單體成分進行聚合而製造。於藉由電子束進行上述放射線聚合之情形時,並不特別必須使上述單體成分含有光聚合起始劑。於藉由UV聚合而進行上述放射線聚合之情形時,就聚合時間縮短等觀點而言,較佳為使單體成分含有光聚合起始劑。光聚合起始劑可單獨使用一種或者組合兩種以上而使用。When the (meth) acrylic polymer is produced by radiation polymerization, it can be produced by polymerizing the monomer component by irradiating radiation such as an electron beam and UV. When the above-mentioned radiation polymerization is performed by an electron beam, it is not particularly necessary that the above-mentioned monomer component contains a photopolymerization initiator. When the above-mentioned radiation polymerization is performed by UV polymerization, from the viewpoint of shortening the polymerization time, it is preferred that the monomer component contains a photopolymerization initiator. The photopolymerization initiators may be used alone or in combination of two or more.

作為上述光聚合揭示劑,只要為可引發光聚合者,則並無特別限制,可自公知之各種光聚合起始劑中適當選擇而使用。例如可使用安息香醚系、苯乙酮系、α-酮醇系、光活性肟系、安息香系、二苯基乙二酮系、二苯甲酮系、縮酮系、9-氧硫系等之光聚合起始劑。光聚合起始劑之使用量相對於單體成分100重量份,為0.05~1.5重量份,較佳為0.1~1重量份。The photopolymerization revealing agent is not particularly limited as long as it can initiate photopolymerization, and it can be appropriately selected from various known photopolymerization initiators and used. For example, benzoin ether type, acetophenone type, α-keto alcohol type, photoactive oxime type, benzoin type, diphenylethylenedione type, benzophenone type, ketal type, 9-oxysulfide can be used. Is a photopolymerization initiator. The used amount of the photopolymerization initiator is 0.05 to 1.5 parts by weight, and preferably 0.1 to 1 part by weight based on 100 parts by weight of the monomer component.

於若干態樣中,上述(甲基)丙烯酸系聚合物之重量平均分子量(Mw)較佳為35萬以上。就提高樹脂層之耐久性及凝聚力之觀點而言,上述(甲基)丙烯酸系聚合物之Mw更佳為40萬以上,進而較佳為50萬以上。就提高低溫下之接著性之觀點、或抑制樹脂組合物之黏度上升之觀點而言,上述(甲基)丙烯酸系聚合物之Mw較佳為300萬以下,更佳為250萬以下,進而較佳為200萬以下,進而更佳為150萬以下,進而更佳為120萬以下。In some aspects, the weight average molecular weight (Mw) of the (meth) acrylic polymer is preferably 350,000 or more. From the viewpoint of improving the durability and cohesiveness of the resin layer, the Mw of the (meth) acrylic polymer is more preferably 400,000 or more, and even more preferably 500,000 or more. From the viewpoint of improving the adhesion at a low temperature or suppressing the increase in viscosity of the resin composition, the Mw of the (meth) acrylic polymer is preferably 3 million or less, more preferably 2.5 million or less, and more It is preferably 2 million or less, further preferably 1.5 million or less, and even more preferably 1.2 million or less.

上述(甲基)丙烯酸系聚合物之Mw可於以下之條件下利用GPC(Gel Permeation Chromatography,凝膠滲透層析法)進行測定,藉由聚苯乙烯換算而算出。GPC用樣本使用將試樣溶解於四氫呋喃(THF)中製成0.1重量%之溶液,將其靜置一晚後,藉由0.45 μm之薄膜過濾器進行過濾而成之濾液。於下述實施例中亦使用相同之方法。
・分析裝置:東曹公司製造,HLC-8120GPC
・管柱:東曹公司製造,GM7000HXL+GMHXL+GMHXL
・管柱尺寸:各7.8 mmf×30 cm(合計90 cm)
・樣本濃度:0.1重量%(THF溶液)
・溶離液:THF
・流量:0.8 ml/min
・入口壓:1.6 MPa
・檢測器:示差折射計(RI)
・管柱溫度:40℃
・注入量:100 μl
・標準試樣:聚苯乙烯
The Mw of the (meth) acrylic polymer can be measured by GPC (Gel Permeation Chromatography) under the following conditions, and calculated by polystyrene conversion. A sample for GPC was a filtrate obtained by dissolving a sample in tetrahydrofuran (THF) to make a 0.1% by weight solution, leaving it to stand overnight, and filtering it through a 0.45 μm membrane filter. The same method is also used in the following examples.
・ Analytical device: manufactured by Tosoh Corporation, HLC-8120GPC
・ Column: Made by Tosoh Corporation, GM7000HXL + GMHXL + GMHXL
・ Pipe size: each 7.8 mmf × 30 cm (total 90 cm)
・ Sample concentration: 0.1% by weight (THF solution)
・ Eluent: THF
・ Flow rate: 0.8 ml / min
・ Inlet pressure: 1.6 MPa
・ Detector: Differential refractometer (RI)
・ Column temperature: 40 ℃
・ Injection volume: 100 μl
・ Standard sample: polystyrene

<交聯劑>
於此處所揭示之樹脂組合物中,可視需要含有交聯劑。交聯劑之例包含異氰酸酯系交聯劑、環氧系交聯劑、聚矽氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、矽烷系交聯劑、烷基醚化三聚氰胺系交聯劑、金屬螯合劑系交聯劑、過氧化物等交聯劑,但並不限定於該等。作為上述交聯劑之較佳例,可列舉異氰酸酯系交聯劑及環氧系交聯劑。亦可組合使用異氰酸酯系交聯劑與環氧系交聯劑。
< crosslinking agent >
The resin composition disclosed herein may contain a crosslinking agent as needed. Examples of the cross-linking agent include an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, a polysiloxane-based cross-linking agent, an oxazoline-based cross-linking agent, an aziridine-based cross-linking agent, a silane-based cross-linking agent, and an alkane. Cross-linking agents such as methyl etherified melamine-based cross-linking agents, metal chelator-based cross-linking agents, and peroxides are not limited thereto. As a preferable example of the said crosslinking agent, an isocyanate type crosslinking agent and an epoxy type crosslinking agent are mentioned. An isocyanate-based crosslinking agent and an epoxy-based crosslinking agent may be used in combination.

上述交聯劑可單獨使用一種或者組合兩種以上而使用。交聯劑之使用量較佳為相對於(甲基)丙烯酸系聚合物100重量份設為0.005重量份以上且10重量份以下之範圍。交聯劑相對於(甲基)丙烯酸系聚合物100重量份之含量較佳為0.01重量份以上且4重量份以下,更佳為0.02重量份以上且3重量份以下,進而較佳為0.05重量份以上且2重量份以下。又,亦可使用上述多官能性單體作為交聯劑。於此情形時,上述多官能性單體之使用量相對於上述(甲基)丙烯酸系聚合物100重量份,較佳為設為0.001重量份以上且2重量份以下之範圍,更佳為設為0.003重量份以上且1重量份以下之範圍。These crosslinking agents may be used alone or in combination of two or more. The use amount of the crosslinking agent is preferably in a range of 0.005 parts by weight to 10 parts by weight based on 100 parts by weight of the (meth) acrylic polymer. The content of the crosslinking agent with respect to 100 parts by weight of the (meth) acrylic polymer is preferably 0.01 parts by weight or more and 4 parts by weight or less, more preferably 0.02 parts by weight or more and 3 parts by weight or less, and still more preferably 0.05 weight. Or more and not more than 2 parts by weight. Moreover, you may use the said polyfunctional monomer as a crosslinking agent. In this case, the use amount of the polyfunctional monomer is preferably set to a range of 0.001 to 2 parts by weight relative to 100 parts by weight of the (meth) acrylic polymer, and more preferably The range is 0.003 parts by weight or more and 1 part by weight or less.

作為上述異氰酸酯系交聯劑,可使用一分子中具有2個以上之異氰酸基(可為藉由封端劑或多聚物化等暫時保護異氰酸基之異氰酸酯再生型官能基)之化合物。作為異氰酸酯系交聯劑之例,可列舉:甲苯二異氰酸酯、二甲苯二異氰酸酯等芳香族異氰酸酯;異佛爾酮二異氰酸酯等脂環族異氰酸酯;六亞甲基二異氰酸酯等脂肪族異氰酸酯等。As the isocyanate-based crosslinking agent, a compound having two or more isocyanate groups in one molecule (which may be an isocyanate-regenerating functional group that temporarily protects the isocyanate group by a blocking agent, polymerization, or the like) may be used. . Examples of the isocyanate-based crosslinking agent include aromatic isocyanates such as toluene diisocyanate and xylene diisocyanate; alicyclic isocyanates such as isophorone diisocyanate; and aliphatic isocyanates such as hexamethylene diisocyanate.

作為上述異氰酸酯系交聯劑,更具體而言,例如可列舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族多異氰酸酯類;伸環戊基二異氰酸酯、環己二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯、聚亞甲基聚苯基異氰酸酯等芳香族二異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(東曹公司製造,商品名:Coronate L)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(東曹公司製造,商品名:Coronate HL)、六亞甲基二異氰酸酯之異氰尿酸酯體(東曹公司製造,商品名:Coronate HX)等異氰酸酯加成物;苯二甲基二異氰酸酯之三羥甲基丙烷加成物(三井化學公司製造,商品名:Takenate D110N)、苯二甲基二異氰酸酯之三羥甲基丙烷加成物(三井化學公司製造,商品名:Takenate D120N)、異佛爾酮二異氰酸酯之三羥甲基丙烷加成物(三井化學公司製造,商品名:Takenate D140N)、六亞甲基二異氰酸酯之三羥甲基丙烷加成物(三井化學公司製造,商品名:Takenate D160N)、聚醚多異氰酸酯、聚酯多異氰酸酯、以及該等與各種多元醇之加成物、藉由異氰尿酸酯鍵、縮二脲鍵、脲基甲酸酯鍵等進行多官能化而成之多異氰酸酯等。於該等中,為了平衡性較佳地表現與黏著力及保持力相關之特性,較佳為使用芳香族異氰酸酯或脂環式異氰酸酯。Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexane diisocyanate, and isocyanate. Aliphatic isocyanates such as phorone diisocyanate; aromatic aromatics such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate, polymethylene polyphenyl isocyanate Diisocyanates; trimethylolpropane / toluene diisocyanate terpolymer adduct (manufactured by Tosoh Corporation, trade name: Coronate L), trimethylolpropane / hexamethylene diisocyanate terpolymer adduct (Manufactured by Tosoh Corporation, trade name: Coronate HL), isocyanurate of hexamethylene diisocyanate (manufactured by Tosoh Corporation, trade name: Coronate HX), and other isocyanate adducts; xylylene diisocyanate Trimethylolpropane adduct (manufactured by Mitsui Chemicals, trade name: Takenate D110N), trimethylol propane adduct of xylylene diisocyanate (manufactured by Mitsui Chemicals, trade name: Takenat e D120N), trimethylolpropane adduct of isophorone diisocyanate (made by Mitsui Chemicals, trade name: Takenate D140N), trimethylolpropane adduct of hexamethylene diisocyanate (Mitsui Chemical Manufactured by the company, trade name: Takenate D160N), polyether polyisocyanate, polyester polyisocyanate, and the addition products with various polyols, through isocyanurate bond, biuret bond, ureidoformic acid A polyisocyanate or the like obtained by multifunctionalizing an ester bond or the like. Among these, in order to better balance the properties related to adhesion and holding force, it is preferable to use an aromatic isocyanate or an alicyclic isocyanate.

異氰酸酯系交聯劑可單獨使用一種或者組合兩種以上而使用。異氰酸酯交聯劑之使用量相對於(甲基)丙烯酸系聚合物100重量份,例如可設為0.01重量份以上且10重量份以下,較佳為通常設為0.03重量份以上且8重量份以下,進而較佳為設為0.05重量份以上且6重量份以下或0.08重量份以上且5重量份以下。異氰酸酯交聯劑之使用量可考慮凝聚力、阻止耐久性試驗中之剝離等適當設定。The isocyanate-based crosslinking agent may be used singly or in combination of two or more kinds. The usage-amount of an isocyanate crosslinking agent is 0.01 weight part or more and 10 weight part or less with respect to 100 weight part of (meth) acrylic-type polymers, Preferably it is usually 0.03 weight part or more and 8 weight part or less. It is more preferably set to 0.05 parts by weight or more and 6 parts by weight or less, or 0.08 parts by weight or more and 5 parts by weight or less. The amount of the isocyanate cross-linking agent to be used may be appropriately set in consideration of cohesive force and prevention of peeling in the durability test.

就於包含黏著賦予樹脂之組成中即便於低溫下亦容易發揮良好之接著性之觀點而言,於若干態樣中,異氰酸酯交聯劑相對於(甲基)丙烯酸系聚合物100重量份之使用量可未達5.0重量份,較佳為未達4.0重量份,更佳為未達3.0重量份,進而較佳為未達2.0重量份,進而更佳為未達1.5重量份,尤佳為未達1.0重量份。又,就於包含黏著賦予樹脂之組成中容易發揮良好之保持力之觀點而言,於若干態樣中,上述異氰酸酯交聯劑之使用量例如較佳為0.10重量份以上,更佳為0.20重量份以上。From the viewpoint that the composition containing the adhesion-imparting resin can easily exhibit good adhesion even at low temperatures, in some aspects, the isocyanate crosslinking agent is used with respect to 100 parts by weight of the (meth) acrylic polymer. The amount may be less than 5.0 parts by weight, preferably less than 4.0 parts by weight, more preferably less than 3.0 parts by weight, even more preferably less than 2.0 parts by weight, even more preferably less than 1.5 parts by weight, and even more preferably less than Up to 1.0 part by weight. In addition, from the viewpoint of easily exhibiting a good holding power in a composition containing an adhesion-imparting resin, in some aspects, the use amount of the isocyanate crosslinking agent is, for example, preferably 0.10 parts by weight or more, and more preferably 0.20 weight. More than.

再者,於使水性樹脂組合物(例如包含藉由乳液聚合所製作之(甲基)丙烯酸系聚合物之水分散液之樹脂組合物)含有異氰酸酯系交聯劑之情形時,就抑制異氰酸酯系交聯劑與水之反應而提高樹脂組合物之保存穩定性之觀點而言,可使用異氰酸基藉由封端劑或多聚物化等暫時保護之異氰酸酯交聯劑。或者亦可不使用異氰酸酯系交聯劑。When an aqueous resin composition (for example, a resin composition containing an aqueous dispersion of a (meth) acrylic polymer prepared by emulsion polymerization) is contained in an isocyanate-based crosslinking agent, the isocyanate-based resin is suppressed. From the viewpoint of improving the storage stability of the resin composition by the reaction of the cross-linking agent with water, an isocyanate cross-linking agent that is temporarily protected by a blocking agent or polymerization, etc., can be used. Alternatively, an isocyanate-based crosslinking agent may not be used.

作為上述環氧系交聯劑,可使用一分子中具有2個以上之環氧基之多官能環氧化合物。作為環氧系交聯劑,例如可列舉:N,N,N',N'-四縮水甘油基-間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷、1,6-己二醇二縮水甘油醚、新戊二醇二縮水甘油醚、乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、聚乙二醇二縮水甘油醚、聚丙二醇二縮水甘油醚、山梨醇聚縮水甘油醚、甘油聚縮水甘油醚、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚、山梨醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三縮水甘油基-三(2-羥基乙基)異氰尿酸酯、間苯二酚二縮水甘油醚、雙酚-S-二縮水甘油醚,除此以外,亦可列舉分子內具有2個以上之環氧基之環氧系樹脂等。作為上述環氧系交聯劑之市售品,例如可列舉三菱瓦斯化學公司製造之商品名「Tetrad C」、「Tetrad X」等。As the epoxy-based crosslinking agent, a polyfunctional epoxy compound having two or more epoxy groups in one molecule can be used. Examples of the epoxy-based crosslinking agent include N, N, N ', N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, and 1,3-bis (N, N-di Glycidylaminomethyl) cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol Glycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylol Polypropane glycidyl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcinol diglycidyl Examples of the ether and bisphenol-S-diglycidyl ether include epoxy resins having two or more epoxy groups in the molecule. As a commercial item of the said epoxy-type crosslinking agent, the brand name "Tetrad C" and "Tetrad X" made by Mitsubishi Gas Chemical Co., Ltd. are mentioned, for example.

環氧系交聯劑可單獨使用一種或者組合兩種以上而使用。環氧系交聯劑之使用量相對於(甲基)丙烯酸系聚合物100重量份,例如可設為0.005重量份以上且1重量份以下左右,亦可設為0.01重量份以上且0.5重量份以下左右或0.015重量份以上且0.3重量份以下左右。環氧系交聯劑之使用量可考慮凝聚力、耐久性等適當設定。The epoxy-based crosslinking agent may be used singly or in combination of two or more kinds. The amount of the epoxy-based cross-linking agent may be, for example, 0.005 parts by weight or more and 1 part by weight or less based on 100 parts by weight of the (meth) acrylic polymer, or may be 0.01 part by weight or more and 0.5 parts by weight. It is about 0.015 weight part or more and about 0.3 weight part or less. The usage-amount of an epoxy-type crosslinking agent can be set suitably considering the cohesion and durability.

作為上述過氧化物,只要為可藉由加熱而產生自由基活性種,進行樹脂組合物之上述(甲基)丙烯酸系聚合物之交聯者,則可適當使用,考慮作業性或穩定性,較佳為使用1分鐘半衰期溫度為80℃~160℃之過氧化物,更佳為使用90℃~140℃之過氧化物。As the above-mentioned peroxide, as long as a radically active species can be generated by heating and the (meth) acrylic polymer of the resin composition is crosslinked, it can be appropriately used, taking workability or stability into consideration, It is preferable to use a peroxide having a half-life temperature of 80 ° C to 160 ° C for 1 minute, and more preferably to use a peroxide of 90 ° C to 140 ° C.

作為上述過氧化物,例如可列舉:過氧化二碳酸二(2-乙基己基)酯(1分鐘半衰期溫度:90.6℃)、過氧化二碳酸二(4-第三丁基環己基)酯(1分鐘半衰期溫度:92.1℃)、過氧化二碳酸二-第二丁酯(1分鐘半衰期溫度:92.4℃)、過氧化新癸酸第三丁酯(1分鐘半衰期溫度:103.5℃)、過氧化特戊酸第三己酯(1分鐘半衰期溫度:109.1℃)、過氧化特戊酸第三丁酯(1分鐘半衰期溫度:110.3℃)、過氧化二月桂醯(1分鐘半衰期溫度:116.4℃)、過氧化二正辛醯(1分鐘半衰期溫度:117.4℃)、1,1,3,3-四甲基丁基過氧化-2-乙基己酸酯(1分鐘半衰期溫度:124.3℃)、過氧化二(4-甲基苯甲醯)(1分鐘半衰期溫度:128.2℃)、過氧化二苯甲醯(1分鐘半衰期溫度:130.0℃)、過氧化異丁酸第三丁酯(1分鐘半衰期溫度:136.1℃)、1,1-二(過氧化第三己基)環己烷(1分鐘半衰期溫度:149.2℃)等。其中,尤其就交聯反應效率優異之方面而言,可較佳地使用過氧化二碳酸二(4-第三丁基環己基)酯(1分鐘半衰期溫度:92.1℃)、過氧化二月桂醯(1分鐘半衰期溫度:116.4℃)、過氧化二苯甲醯(1分鐘半衰期溫度:130.0℃)等。Examples of the peroxide include bis (2-ethylhexyl) peroxydicarbonate (1 minute half-life temperature: 90.6 ° C), and bis (4-third butylcyclohexyl) peroxydicarbonate ( 1 minute half-life temperature: 92.1 ° C), di-second butyl peroxydicarbonate (1 minute half-life temperature: 92.4 ° C), third butyl peroxy neodecanoate (1 minute half-life temperature: 103.5 ° C), peroxide Tert-hexyl pivalate (1 minute half-life temperature: 109.1 ° C), tert-butyl pervalerate (1-minute half-life temperature: 110.3 ° C), dilaurin peroxide (1-minute half-life temperature: 116.4 ° C) , Di-n-octyl peroxide (1 minute half-life temperature: 117.4 ° C), 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate (1 minute half-life temperature: 124.3 ° C), Di (4-methylbenzidine) peroxide (1 minute half-life temperature: 128.2 ° C), Dibenzophene peroxide (1 minute half-life temperature: 130.0 ° C), tert-butyl isobutyrate peroxide (1 minute Half-life temperature: 136.1 ° C), 1,1-bis (third hexyl peroxide) cyclohexane (1 minute half-life temperature: 149.2 ° C), and the like. Among them, especially in terms of excellent cross-linking reaction efficiency, bis (4-tert-butylcyclohexyl) dicarbonate (1 minute half-life temperature: 92.1 ° C), dilaurin peroxide can be preferably used. (1 minute half-life temperature: 116.4 ° C), benzophenone peroxide (1 minute half-life temperature: 130.0 ° C), and the like.

再者,上述過氧化物之半衰期係表示過氧化物之分解速度之指標,且係指過氧化物之殘存量成為一半為止之時間。關於用以於任意之時間內獲得半衰期之分解溫度、或任意之溫度下之半衰期時間,係記載於製造商目錄等,例如記載於日本油脂股份有限公司之「有機過氧化物目錄第9版(2003年5月)」等。It should be noted that the half-life of the above-mentioned peroxide is an index indicating the decomposition rate of the peroxide, and means the time until the residual amount of the peroxide becomes half. The decomposition temperature used to obtain the half-life at any time, or the half-life time at any temperature is described in the manufacturer's catalogue, for example, in the "Organic Peroxide Catalogue 9th Edition ( May 2003) "and so on.

上述過氧化物可單獨使用一種或者組合兩種以上使用。關於上述過氧化物之使用量,適合為通常相對於上述(甲基)丙烯酸系聚合物100重量份,設為0.02~2重量份左右,較佳為設為0.05~1重量份左右。過氧化物之使用量係為了調整加工性、二次加工性、交聯穩定性、剝離性而於該範圍內適當選擇。These peroxides may be used alone or in combination of two or more. The amount of the peroxide used is preferably about 0.02 to 2 parts by weight, and preferably about 0.05 to 1 part by weight, based on 100 parts by weight of the (meth) acrylic polymer. The amount of peroxide used is appropriately selected within this range in order to adjust processability, secondary processability, crosslinking stability, and peelability.

再者,反應處理後所殘存之過氧化物量例如可藉由利用HPLC(高效液相層析儀)測定過氧化物分解量而掌握。具體而言,例如自反應處理後之樹脂層採集約0.2 g之樣本,浸漬於乙酸乙酯10 ml中,藉由振盪機於25℃下以120 rpm振盪萃取3小時後,於室溫下靜置3天。繼而,可加入乙腈10 ml,於25℃下以120 rpm振盪30分鐘,藉由薄膜過濾器(0.45 μm)進行過濾而獲得萃取液,將所獲得之萃取液約10 μl注入至HPLC中來進行分析,並設為反應處理後之過氧化物量。The amount of peroxide remaining after the reaction treatment can be grasped, for example, by measuring the amount of peroxide decomposition by HPLC (high performance liquid chromatography). Specifically, for example, a sample of about 0.2 g is collected from the resin layer after the reaction treatment, immersed in 10 ml of ethyl acetate, and extracted with a shaker at 25 ° C and 120 rpm for 3 hours, and then allowed to stand at room temperature. Set for 3 days. Next, 10 ml of acetonitrile can be added and shaken at 120 rpm for 30 minutes at 25 ° C., and then filtered through a membrane filter (0.45 μm) to obtain an extraction solution. About 10 μl of the obtained extraction solution is injected into the HPLC to perform Analyze and set the amount of peroxide after the reaction treatment.

又,作為上述金屬螯合劑系交聯劑,可使用多價金屬與有機化合物中之原子進行共價鍵結或配位鍵結之多官能性金屬螯合劑。作為多價金屬,例如可列舉:Al、Cr、Zr、Co、Cu、Fe、Ni、V、Zn、In、Ca、Mg、Mn、Y、Ce、Sr、Ba、Mo、La、Sn、Ti等。作為與此種多價金屬進行共價鍵結或配位鍵結之有機化合物中之原子,可列舉氧原子等。作為上述有機化合物,可列舉:烷基酯、醇化合物、羧酸化合物、醚化合物、酮化合物等。As the metal chelating agent-based crosslinking agent, a polyfunctional metal chelating agent in which a polyvalent metal and an atom in an organic compound are covalently bonded or coordinated may be used. Examples of the polyvalent metal include Al, Cr, Zr, Co, Cu, Fe, Ni, V, Zn, In, Ca, Mg, Mn, Y, Ce, Sr, Ba, Mo, La, Sn, Ti Wait. Examples of the atom in an organic compound that is covalently bonded or coordinated to such a polyvalent metal include an oxygen atom and the like. Examples of the organic compound include an alkyl ester, an alcohol compound, a carboxylic acid compound, an ether compound, and a ketone compound.

<黏著賦予樹脂>
此處所揭示之樹脂組合物中所使用之黏著賦予樹脂並無特別限定,可自公知之黏著賦予樹脂中適當選擇。例如可列舉:松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、酚系黏著賦予樹脂、烴系黏著賦予樹脂、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。黏著賦予樹脂可單獨使用一種或者組合兩種以上而使用。
<Adhesion imparting resin>
The adhesion-imparting resin used in the resin composition disclosed herein is not particularly limited, and can be appropriately selected from known adhesion-imparting resins. For example, rosin-based adhesion-imparting resin, terpene-based adhesion-imparting resin, phenol-based adhesion-imparting resin, hydrocarbon-based adhesion-imparting resin, ketone-based adhesion-imparting resin, polyamide-based adhesion-imparting resin, epoxy-based adhesion-imparting resin, The elastic system is provided with adhesive and the like. The adhesion-imparting resin may be used alone or in combination of two or more.

作為松香系黏著賦予樹脂,例如可列舉:松香膠、木松香、妥爾油松香等未改性松香(生松香)、或藉由聚合、歧化、氫化等使該等未改性松香進行改性而成之改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香、或經其他化學修飾之松香等),除此以外,亦可列舉各種松香衍生物等。
作為上述松香衍生物,例如可列舉:藉由利用酸觸媒對松香類(未改性松香、改性松香或各種松香衍生物等)加成苯酚並進行熱聚合所獲得之松香酚系樹脂;
藉由醇類將未改性松香進行酯化而成之松香之酯化合物(未改性松香酯);或藉由醇類將聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等改性松香進行酯化而成之改性松香之酯化合物(聚合松香酯、穩定化松香酯、歧化松香酯、完全氫化松香酯、部分氫化松香酯等)等松香酯系樹脂;
藉由不飽和脂肪酸將未改性松香或改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等)進行改性而成之不飽和脂肪酸改性松香系樹脂;
藉由不飽和脂肪酸將松香酯系樹脂進行改性而成之不飽和脂肪酸改性松香酯系樹脂;
對未改性松香、改性松香(聚合松香、穩定化松香、歧化松香、完全氫化松香、部分氫化松香等)、不飽和脂肪酸改性松香系樹脂或不飽和脂肪酸改性松香酯系樹脂中之羧基進行還原處理而成之松香醇系樹脂;
未改性松香、改性松香或各種松香衍生物等松香系樹脂(尤其是松香酯系樹脂)之金屬鹽等。
Examples of the rosin-based adhesion-imparting resin include unmodified rosin (raw rosin) such as rosin gum, wood rosin, tall oil rosin, or the unmodified rosin is modified by polymerization, disproportionation, and hydrogenation. The resulting modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, or other chemically modified rosin, etc.) may include various rosin derivatives.
Examples of the rosin derivative include: a rosin phenol resin obtained by adding phenol to an rosin (unmodified rosin, modified rosin, various rosin derivatives, etc.) using an acid catalyst and subjecting it to thermal polymerization;
Rosin ester compound (unmodified rosin ester) obtained by esterifying unmodified rosin with alcohol; or polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin by alcohol Rosin ester resins such as modified rosin ester compounds (polymerized rosin esters, stabilized rosin esters, disproportionated rosin esters, fully hydrogenated rosin esters, partially hydrogenated rosin esters, etc.) that are esterified with other modified rosins;
Unsaturated fatty acid modified rosin-based resin modified by unsaturated fatty acids by modifying unmodified rosin or modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc.);
Unsaturated fatty acid modified rosin ester resin modified by unsaturated fatty acid rosin ester resin;
For unmodified rosin, modified rosin (polymerized rosin, stabilized rosin, disproportionated rosin, fully hydrogenated rosin, partially hydrogenated rosin, etc.), unsaturated fatty acid modified rosin resin or unsaturated fatty acid modified rosin ester resin Rosin alcohol resin made by reducing carboxyl group;
Metal salts of rosin resins (especially rosin ester resins) such as unmodified rosin, modified rosin, and various rosin derivatives.

作為萜烯系黏著賦予樹脂,例如可列舉:α-蒎烯聚合物、β-蒎烯聚合物、雙戊烯聚合物等萜烯系樹脂;或將該等萜烯系樹脂進行改性(酚改性、芳香族改性、氫化改性、烴改性等)而成之改性萜烯系樹脂(例如萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂等)等。Examples of the terpene-based adhesion-imparting resin include terpene-based resins such as α-pinene polymer, β-pinene polymer, and dipentene polymer; or these terpene-based resins are modified (phenol Modified terpene resin (such as terpene phenol resin, styrene modified terpene resin, aromatic modified terpene resin) Resin, hydrogenated terpene-based resin, etc.).

作為酚系黏著賦予樹脂,例如可列舉:各種酚類(例如苯酚、間甲酚、3,5-二甲苯酚、對烷基苯酚、間苯二酚等)與甲醛之縮合物(例如烷基苯酚系樹脂、二甲苯甲醛系樹脂等);藉由鹼觸媒使上述酚類與甲醛進行加成反應而成之可溶酚醛樹脂;或藉由酸觸媒使上述酚類與甲醛進行縮合反應所獲得之酚醛清漆等。Examples of the phenol-based adhesion-imparting resin include condensates of various phenols (for example, phenol, m-cresol, 3,5-xylenol, p-alkylphenol, and resorcinol) and formaldehyde (for example, alkyl groups). Phenol-based resins, xylene-formaldehyde-based resins, etc.); soluble phenolic resins obtained by the addition reaction of the above phenols and formaldehyde by an alkali catalyst; or condensation reactions of the above phenols and formaldehyde by an acid catalyst The obtained novolac and the like.

作為烴系黏著賦予樹脂之例,可列舉石油系黏著賦予樹脂或苯乙烯系黏著賦予樹脂等。更具體而言,可列舉:脂肪族系烴樹脂、芳香族系烴樹脂、脂肪族系環狀烴樹脂、脂肪族・芳香族系石油樹脂(苯乙烯-烯烴系共聚物等)、脂肪族・脂環族系石油樹脂、氫化烴樹脂、薰草咔系樹脂、薰草咔-茚系樹脂等。Examples of the hydrocarbon-based adhesion-imparting resin include petroleum-based adhesion-imparting resin or styrene-based adhesion-imparting resin. More specifically, aliphatic hydrocarbon resins, aromatic hydrocarbon resins, aliphatic cyclic hydrocarbon resins, aliphatic and aromatic petroleum resins (styrene-olefin copolymers, etc.), and aliphatics Alicyclic petroleum resin, hydrogenated hydrocarbon resin, lavender resin, lavender-indene resin, and the like.

作為可較佳地使用之松香系黏著賦予樹脂之市售品,可例示:作為荒川化學工業公司製造之松香酯系黏著賦予樹脂之PENSEL系列、例如「PENSEL AZ」、「PENSEL D-125」、「PENSEL D-135」、「PENSEL D-160」、「PENSEL KK」、「PENSEL C」等,但並不限定於該等。Examples of commercially available rosin-based adhesion-imparting resins that can be preferably used include PENSEL series of rosin ester-based adhesion-imparting resins manufactured by Arakawa Chemical Industries, Ltd., such as "PENSEL AZ", "PENSEL D-125", "PENSEL D-135", "PENSEL D-160", "PENSEL KK", "PENSEL C", etc. are not limited to these.

作為可較佳地使用之萜烯系黏著賦予樹脂之市售品,可例示:Yasuhara Chemical公司製造之商品名「YS Polyster T130」、「YS Polyster T115」、「YS Polyster S145」、「YS Polyster G125」、「YS Polyster N125」、「YS Polyster U115」;荒川化學工業公司製造之商品名「Tamanol 803L」、「Tamanol 901」;住友電木公司製造之商品名「Sumilite Resin PR-12603」;哈利瑪化成公司製造之Haritack系列等,但並不限定於該等。Examples of commercially available terpene-based adhesion-imparting resins that can be preferably used are: "YS Polyster T130", "YS Polyster T115", "YS Polyster S145", "YS Polyster G125" manufactured by Yasuhara Chemical Co., Ltd. "," YS Polyster N125 "," YS Polyster U115 "; trade names" Tamanol 803L "," Tamanol 901 "manufactured by Arakawa Chemical Industries;" Sumilite Resin PR-12603 "trade name manufactured by Sumitomo Bakelite; Haritack series and so on manufactured by Mahuacheng, but are not limited to these.

黏著賦予樹脂適合為相對於上述(甲基)丙烯酸系聚合物100重量份於5重量份以上且40重量份以下之範圍內使用。藉由將黏著賦予樹脂之使用量設為5重量份以上,可較佳地發揮由使用黏著賦予樹脂所帶來之有利之效果。於若干態樣中,黏著賦予樹脂相對於(甲基)丙烯酸系聚合物100重量份之使用量例如較佳為7重量份以上,更佳為10重量份以上。又,藉由將黏著賦予樹脂之使用量設為40重量份以下,可具有由使用黏著賦予樹脂所帶來之有利之效果,並且抑制低溫下之接著性之降低。於若干態樣中,黏著賦予樹脂相對於(甲基)丙烯酸系聚合物100重量份之使用量例如較佳為38重量份以下,更佳為35重量份以下。The adhesion-imparting resin is suitably used in a range of 5 parts by weight or more and 40 parts by weight or less based on 100 parts by weight of the (meth) acrylic polymer. By setting the use amount of the adhesion-imparting resin to 5 parts by weight or more, the advantageous effects brought about by the use of the adhesion-imparting resin can be exhibited. In some aspects, the use amount of the adhesion-imparting resin relative to 100 parts by weight of the (meth) acrylic polymer is, for example, preferably 7 parts by weight or more, and more preferably 10 parts by weight or more. Moreover, when the usage-amount of an adhesion-imparting resin is 40 weight part or less, the advantageous effect by using an adhesion-imparting resin can be suppressed, and the fall of the adhesiveness at low temperature can be suppressed. In some aspects, the use amount of the adhesion-imparting resin with respect to 100 parts by weight of the (meth) acrylic polymer is, for example, preferably 38 parts by weight or less, and more preferably 35 parts by weight or less.

黏著賦予樹脂之軟化點(軟化溫度)並無特別限定。就即便於低溫下亦容易發揮良好之接著性之觀點而言,於若干態樣中,黏著賦予樹脂之軟化點較佳為180℃以下,更佳為160℃以下,亦可為150℃以下、140℃以下或135℃以下。又,就抑制於室溫以上之溫度區域凝聚力降低之觀點而言,於若干態樣中,黏著賦予樹脂之軟化點適合為60℃以上,較佳為80℃以上,更佳為90℃以上。此處所揭示之技術可使用軟化點處於90℃以上且160℃以下、90℃以上且150℃以下之範圍、或90℃以上且140℃以下之範圍之黏著賦予樹脂較佳地實施。於使用軟化點不同之複數種黏著賦予樹脂之情形時,較佳為至少一種黏著賦予樹脂具有上述軟化點。例如較佳為黏著賦予樹脂之合計量中之50重量%以上、70重量%以上、90重量%以上或100重量%具有上述軟化點。再者,黏著賦予樹脂之軟化點可採用製造商目錄中所記載之值,或者可基於JIS K2207中規定之軟化點試驗方法(環球法)進行測定。The softening point (softening temperature) provided by the adhesion to the resin is not particularly limited. From the viewpoint of easily exhibiting good adhesion even at low temperatures, in some aspects, the softening point of the adhesion-imparting resin is preferably 180 ° C or lower, more preferably 160 ° C or lower, or 150 ° C or lower, Below 140 ° C or below 135 ° C. From the viewpoint of suppressing a decrease in cohesive force in a temperature region above room temperature, in some aspects, the softening point of the adhesion-imparting resin is preferably 60 ° C or higher, preferably 80 ° C or higher, and more preferably 90 ° C or higher. The technique disclosed herein can be preferably implemented using an adhesion-imparting resin having a softening point in a range of 90 ° C to 160 ° C, a range of 90 ° C to 150 ° C, or a range of 90 ° C to 140 ° C. When a plurality of types of adhesion-imparting resins having different softening points are used, it is preferable that at least one adhesion-imparting resin has the above-mentioned softening point. For example, it is preferable that 50% by weight or more, 70% by weight or more, 90% by weight or more, or 100% by weight of the total amount of the adhesion-imparting resin has the above-mentioned softening point. The softening point of the adhesion-imparting resin can be measured using a value described in the manufacturer's catalog or based on a softening point test method (ring and ball method) specified in JIS K2207.

<(甲基)丙烯酸系低聚物>
於此處所揭示之樹脂組合物中,可含有(甲基)丙烯酸系低聚物。此處,(甲基)丙烯酸系低聚物係指於聚合物結構中包含源自具有(甲基)丙烯醯基之單體(即(甲基)丙烯酸系單體)之單體單元之聚合物,典型地指以超過50重量%之比率包含該單體單元之聚合物。作為上述(甲基)丙烯酸系低聚物,可較佳地使用Tg高於上述(甲基)丙烯酸系聚合物且Mw小於上述(甲基)丙烯酸系聚合物之聚合物。上述(甲基)丙烯酸系低聚物可有助於對粗糙面或塑膠等被接著體之接著力之提昇。
< (meth) acrylic oligomer >
The resin composition disclosed herein may contain a (meth) acrylic oligomer. Here, the (meth) acrylic oligomer refers to the polymerization of a polymer structure including a monomer unit derived from a monomer having a (meth) acrylfluorene group (that is, a (meth) acrylic monomer). The polymer typically refers to a polymer containing the monomer unit at a ratio of more than 50% by weight. As the (meth) acrylic oligomer, a polymer having a Tg higher than the (meth) acrylic polymer and a Mw smaller than the (meth) acrylic polymer can be preferably used. The (meth) acrylic oligomer can improve the adhesion of the adherend such as a rough surface or a plastic.

上述(甲基)丙烯酸系低聚物較理想為Tg為約0℃以上且300℃以下、較佳為約20℃以上且300℃以下、進而較佳為約40℃以上且300℃以下。若Tg未達約0℃,則有於室溫以上之溫度區域樹脂層之凝聚力降低,保持特性或高溫下之接著性降低之情形。再者,(甲基)丙烯酸系低聚物之Tg係以與(甲基)丙烯酸系聚合物之Tg相同之方式,基於Fox之式計算之理論值。The (meth) acrylic oligomer preferably has a Tg of about 0 ° C to 300 ° C, preferably about 20 ° C to 300 ° C, and more preferably about 40 ° C to 300 ° C. If the Tg does not reach about 0 ° C, the cohesive force of the resin layer may be reduced in a temperature range of room temperature or higher, and the retention characteristics or the adhesiveness at high temperatures may be reduced. The Tg of the (meth) acrylic oligomer is a theoretical value calculated based on the formula of Fox in the same manner as the Tg of the (meth) acrylic polymer.

上述(甲基)丙烯酸系低聚物之Mw例如可為1000以上且未達30000,較佳為1500以上且未達20000,進而較佳為2000以上且未達10000。若Mw為30000以上,則有無法充分地獲得接著力之提昇效果之情形。又,若Mw未達1000,則成為低分子量,故而有引起接著力或保持特性之降低之情形。
(甲基)丙烯酸系低聚物之Mw可以基於GPC之聚苯乙烯換算之值的形式求出。具體而言,可對東曹公司製造之HPLC8020,使用2根TSKgel GMH-H(20)作為管柱,使用THF溶劑於流速約0.5 ml/分鐘之條件下進行測定。
The Mw of the (meth) acrylic oligomer may be, for example, 1,000 or more and less than 30,000, preferably 1,500 or more and less than 20,000, and more preferably 2,000 or more and less than 10,000. If Mw is 30,000 or more, there is a case where the effect of improving the adhesion cannot be sufficiently obtained. Moreover, if Mw is less than 1,000, it will become a low molecular weight, and may cause a fall of adhesive force or retention characteristics.
Mw of a (meth) acrylic-type oligomer can be calculated | required based on the polystyrene conversion value of GPC. Specifically, the measurement can be performed on HPLC8020 manufactured by Tosoh Corporation using two TSKgel GMH-H (20) as a column and a THF solvent at a flow rate of about 0.5 ml / minute.

作為構成上述(甲基)丙烯酸系低聚物之單體,例如可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯之類之(甲基)丙烯酸烷基酯;(甲基)丙烯酸環己酯、(甲基)丙烯酸異基酯、(甲基)丙烯酸二環戊酯之類之(甲基)丙烯酸與脂環族醇之酯;(甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯之類之(甲基)丙烯酸芳酯;自萜烯化合物衍生物醇所獲得之(甲基)丙烯酸酯等(甲基)丙烯酸酯。此種(甲基)丙烯酸酯可單獨使用或者組合兩種以上而使用。Examples of the monomer constituting the (meth) acrylic oligomer include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and (meth) acrylic acid. Propyl ester, butyl (meth) acrylate, isobutyl (meth) acrylate, second butyl (meth) acrylate, third butyl (meth) acrylate, amyl (meth) acrylate, (formyl) Base) isoamyl acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate Ester, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, (meth) ) Alkyl (meth) acrylates such as dodecyl acrylate; cyclohexyl (meth) acrylate, isopropyl (meth) acrylate, dicyclopentyl (meth) acrylate and the like ( Esters of meth) acrylic acid and alicyclic alcohols; phenyl (meth) acrylates, aryl (meth) acrylates, such as benzyl (meth) acrylates; (a) Base) acrylate, etc. (Meth) acrylate. Such (meth) acrylates can be used alone or in combination of two or more.

上述(甲基)丙烯酸系低聚物較佳為包含以(甲基)丙烯酸異丁酯或(甲基)丙烯酸第三丁酯之類之烷基具有支鏈結構之(甲基)丙烯酸烷基酯;(甲基)丙烯酸環己酯或(甲基)丙烯酸異基酯、(甲基)丙烯酸二環戊酯之類之(甲基)丙烯酸與脂環式醇之酯;(甲基)丙烯酸苯酯或(甲基)丙烯酸苄酯之類之(甲基)丙烯酸芳酯等具有環狀結構之(甲基)丙烯酸酯等作為代表之具有體積相對較大之結構的丙烯酸系單體作為單體單元。藉由使(甲基)丙烯酸系低聚物具有此種體積較大之結構,可進一步提昇樹脂層之接著性。尤其就體積較大之方面而言,具有環狀結構者效果較高,含有複數個環者效果更高。又,於在(甲基)丙烯酸系低聚物之合成或樹脂層之製作中利用UV之情形時,就不易引起聚合抑制之方面而言,較佳為作為不包含不飽和鍵之醇與(甲基)丙烯酸之酯之(甲基)丙烯酸酯。例如可較佳地使用烷基具有支鏈結構之(甲基)丙烯酸烷基酯、或脂環式醇與(甲基)丙烯酸之酯作為構成(甲基)丙烯酸系低聚物之單體。The (meth) acrylic oligomer is preferably a (meth) acrylic alkyl group having a branched structure with an alkyl group such as isobutyl (meth) acrylate or third butyl (meth) acrylate. Esters; (meth) acrylic acid and alicyclic alcohols, such as cyclohexyl (meth) acrylate or isopropyl (meth) acrylate, dicyclopentyl (meth) acrylate; (meth) acrylic acid Acrylic monomers having a relatively large structure such as (meth) acrylates having a cyclic structure such as phenyl esters or aryl (meth) acrylates such as benzyl (meth) acrylate and the like have a relatively large volume as a unit. Body unit. When the (meth) acrylic oligomer has such a large volume structure, the adhesion of the resin layer can be further improved. Especially in terms of larger volume, those with a ring structure have a higher effect, and those with a plurality of rings have a higher effect. When UV is used in the synthesis of a (meth) acrylic oligomer or in the production of a resin layer, it is preferable to use an alcohol and ( (Meth) acrylic acid esters of (meth) acrylic acid. For example, an (meth) acrylic acid alkyl ester having a branched structure in the alkyl group, or an alicyclic alcohol and (meth) acrylic acid ester can be preferably used as a monomer constituting the (meth) acrylic oligomer.

就此種方面而言,作為較佳之(甲基)丙烯酸系低聚物,例如可列舉:甲基丙烯酸環己酯(CHMA)、丙烯酸二環戊酯(DCPA)、甲基丙烯酸二環戊酯(DCPMA)、丙烯酸異基酯(IBXA)、甲基丙烯酸異基酯(IBXMA)、丙烯酸1-金剛烷基酯(ADA)、甲基丙烯酸1-金剛烷基酯(ADMA)等各均聚物;CHMA與甲基丙烯酸異丁酯(IBMA)之共聚物、CHMA與IBXMA之共聚物、CHMA與丙烯醯啉(ACMO)之共聚物、CHMA與二乙基丙烯醯胺(DEAA)之共聚物、ADA與甲基丙烯酸甲酯(MMA)之共聚物、DCPMA與IBXMA之共聚物、DCPMA與MMA之共聚物等。尤佳為包含CHMA作為主成分之(甲基)丙烯酸系低聚物。In this regard, examples of preferred (meth) acrylic oligomers include cyclohexyl methacrylate (CHMA), dicyclopentyl acrylate (DCPA), and dicyclopentyl methacrylate ( DCPMA), isopropyl acrylate (IBXA), isopropyl methacrylate (IBXMA), 1-adamantyl acrylate (ADA), 1-adamantyl methacrylate (ADMA) and other homopolymers; Copolymer of CHMA and isobutyl methacrylate (IBMA), copolymer of CHMA and IBXMA, copolymer of CHMA and acryloline (ACMO), copolymer of CHMA and diethylacrylamide (DEAA), ADA Copolymers with methyl methacrylate (MMA), copolymers of DCPMA and IBXMA, copolymers of DCPMA and MMA, etc. A (meth) acrylic oligomer containing CHMA as a main component is particularly preferred.

於此處所揭示之樹脂組合物中,於使用上述(甲基)丙烯酸系低聚物之情形時,其使用量並無特別限定。於若干態樣中,(甲基)丙烯酸系低聚物之使用量相對於(甲基)丙烯酸系聚合物100重量份,較佳為70重量份以下,例如可為1~70重量份,更佳為2~50重量份,進而較佳為3~40重量份。若(甲基)丙烯酸系低聚物之添加量過多,則可能會有彈性模數變得過高而低溫下之粗糙面接著性降低之情況。又,藉由相對於(甲基)丙烯酸系聚合物100重量份調配1重量份以上之(甲基)丙烯酸系低聚物,可較佳地發揮接著力之提昇效果。此處所揭示之技術即便以不使用(甲基)丙烯酸系低聚物之形態亦可較佳地實施。When the (meth) acrylic oligomer is used in the resin composition disclosed herein, the amount of use thereof is not particularly limited. In some aspects, the used amount of the (meth) acrylic oligomer is preferably 70 parts by weight or less relative to 100 parts by weight of the (meth) acrylic polymer, and may be, for example, 1 to 70 parts by weight, more It is preferably 2 to 50 parts by weight, and more preferably 3 to 40 parts by weight. When the addition amount of a (meth) acrylic-type oligomer is too much, the elastic modulus may become too high, and the adhesion of the rough surface at low temperature may fall. In addition, by blending 1 part by weight or more of the (meth) acrylic oligomer with respect to 100 parts by weight of the (meth) acrylic polymer, the effect of improving the adhesion can be exhibited better. The technique disclosed here can be preferably implemented even in a form in which a (meth) acrylic oligomer is not used.

<矽烷偶合劑>
於此處所揭示之樹脂組合物中,亦可基於提昇與被接著體之界面之接著可靠性等目的而含有矽烷偶合劑。作為矽烷偶合劑,例如可列舉:3-縮水甘油氧基丙基三甲氧基矽烷、3-縮水甘油氧基丙基三乙氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、2-(3,4環氧環己基)乙基三甲氧基矽烷等含環氧基矽烷偶合劑;3-胺基丙基三甲氧基矽烷、N-2-(胺基乙基)-3-胺基丙基甲基二甲氧基矽烷、3-三乙氧基矽烷基-N-(1,3-二甲基亞丁基)丙基胺、N-苯基-γ-胺基丙基三甲氧基矽烷等含胺基矽烷偶合劑;3-丙烯醯氧基丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷等含(甲基)丙烯醯基矽烷偶合劑;3-異氰酸基丙基三乙氧基矽烷等含異氰酸基矽烷偶合劑等。
< Silane coupling agent >
The resin composition disclosed herein may contain a silane coupling agent for the purpose of improving the adhesion reliability of the interface with the adherend. Examples of the silane coupling agent include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, and 3-glycidoxypropylmethyldiethoxy Silane, 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, and other epoxy-containing silane coupling agents; 3-aminopropyltrimethoxysilane, N-2- (aminoethyl)- 3-aminopropylmethyldimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethylbutylene) propylamine, N-phenyl-γ-aminopropyl Aminosilane-containing coupling agents such as trimethoxysilane; 3-propenyloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane and other (meth) acrylic acid-containing groups Silane coupling agents; isocyanate-containing silane coupling agents such as 3-isocyanatopropyltriethoxysilane.

使用矽烷偶合劑之情形時之使用量相對於(甲基)丙烯酸系聚合物100重量份,較佳為1重量份以下,例如為0.01~1重量份,更佳為0.02~0.6重量份。若矽烷偶合劑之使用量過多,則可能會抑制交聯或者有損黏著特性。此處所揭示之技術即便以不使用矽烷偶合劑之形態亦可較佳地實施。When the silane coupling agent is used, the amount used is preferably 1 part by weight or less, for example, 0.01 to 1 part by weight, and more preferably 0.02 to 0.6 part by weight based on 100 parts by weight of the (meth) acrylic polymer. If the silane coupling agent is used in an excessive amount, cross-linking may be inhibited or adhesion characteristics may be impaired. The technique disclosed here can be preferably implemented even without using a silane coupling agent.

除此以外,於此處所揭示之樹脂組合物中,亦可視需要含有其他公知之添加劑。例如可根據用途適當添加著色劑、顏料等粉體、染料、界面活性劑、塑化劑、表面潤滑劑、調平劑、軟化劑、抗氧化劑、防老化劑、光穩定劑、紫外線吸收劑、聚合抑制劑、無機或有機之填充劑、金屬粉末、粒子狀、箔狀物等。In addition, the resin composition disclosed herein may optionally contain other known additives. For example, powders such as colorants, pigments, dyes, surfactants, plasticizers, surface lubricants, leveling agents, softeners, antioxidants, anti-aging agents, light stabilizers, ultraviolet absorbers, Polymerization inhibitor, inorganic or organic filler, metal powder, particle, foil, etc.

<樹脂層及積層片材>
根據該說明書,提供一種由此處所揭示之任一樹脂組合物形成之樹脂層。上述樹脂層之厚度並無特別限制。上述樹脂層之厚度例如可為1 μm~1000 μm左右、較佳為2 μm~500 μm左右、更佳為2 μm~300 μm。就提昇接著力或者提昇對粗糙面之凹凸之密接性之觀點而言,於若干態樣中,樹脂層之厚度例如可為5 μm以上,可為10 μm以上,可為25 μm以上,可為35 μm以上,亦可為50 μm以上或70 μm以上。又,就經濟性之觀點而言,於若干態樣中,樹脂層之厚度例如可為200 μm以下,可為150 μm以下,亦可為100 μm以下。又,此處所揭示之樹脂層可為單層構造,亦可為兩層以上之多層構造。
< Resin layer and laminated sheet >
According to the specification, a resin layer formed from any of the resin compositions disclosed herein is provided. The thickness of the resin layer is not particularly limited. The thickness of the resin layer may be, for example, about 1 μm to 1000 μm, preferably about 2 μm to 500 μm, and more preferably 2 μm to 300 μm. From the viewpoint of improving the adhesion or the adhesion to the unevenness of the rough surface, in some aspects, the thickness of the resin layer may be, for example, 5 μm or more, 10 μm or more, 25 μm or more, and may be 35 μm or more, or 50 μm or more or 70 μm or more. From the viewpoint of economy, in some aspects, the thickness of the resin layer may be, for example, 200 μm or less, 150 μm or less, or 100 μm or less. The resin layer disclosed herein may have a single-layer structure or a multilayer structure with two or more layers.

樹脂層之聚合物凝膠分率並無特別限制。就對粗糙面之接著性之觀點而言,通常適合為20~98重量%。於若干態樣中,樹脂層之聚合物凝膠分率例如可為20~95重量%。若樹脂層之聚合物凝膠分率處於上述範圍,則有較佳地表現較高之接著力及較高之保持力之傾向。推定其原因在於若樹脂層之聚合物凝膠分率處於上述範圍,則可維持樹脂層之柔軟性,且可藉由形成適度之交聯網路而賦予凝聚力。The polymer gel fraction of the resin layer is not particularly limited. From the viewpoint of adhesion to a rough surface, it is generally suitable to be 20 to 98% by weight. In some aspects, the polymer gel fraction of the resin layer may be, for example, 20 to 95% by weight. If the polymer gel fraction of the resin layer is in the above range, there is a tendency that a higher adhesion force and a higher retention force are better exhibited. The reason is presumed to be that if the polymer gel fraction of the resin layer is in the above range, the softness of the resin layer can be maintained, and cohesiveness can be imparted by forming a moderate interconnection network.

就進一步提高樹脂層之凝聚力或保持力之觀點而言,樹脂層之聚合物凝膠分率例如較佳為22重量%以上,更佳為25重量%以上,進而較佳為30重量%以上。又,就提高低溫下之粗糙面接著性之觀點而言,樹脂層之聚合物凝膠分率例如較佳為90重量%以下,更佳為85重量%以下,進而較佳為80重量%以下,進而更佳為75重量%以下,尤佳為70重量%以下。再者,於上述樹脂組合物含有交聯劑之情形時,可調整交聯劑整體之添加量,並且考慮交聯處理溫度或交聯處理時間之影響,控制凝膠分率。樹脂層之聚合物凝膠分率係藉由下述實施例中記載之方法進行測定。From the viewpoint of further improving the cohesiveness or holding power of the resin layer, the polymer gel fraction of the resin layer is, for example, preferably 22% by weight or more, more preferably 25% by weight or more, and even more preferably 30% by weight or more. From the viewpoint of improving the adhesion of the rough surface at a low temperature, the polymer gel fraction of the resin layer is, for example, preferably 90% by weight or less, more preferably 85% by weight or less, and even more preferably 80% by weight or less. It is more preferably 75% by weight or less, and even more preferably 70% by weight or less. When the resin composition contains a cross-linking agent, the total amount of the cross-linking agent can be adjusted, and the gel fraction can be controlled by considering the influence of the cross-linking treatment temperature or the cross-linking treatment time. The polymer gel fraction of the resin layer was measured by the method described in the following examples.

此處所揭示之樹脂層較佳為儲存彈性模數G'(23℃)為1.0×104 Pa以上且5.0×104 Pa以下。若樹脂層之儲存彈性模數G'(23℃)變低,則有上述樹脂層對粗糙面之凹凸之密接性(上述對凹凸形狀之追隨性)變高之傾向。若密接性變高,則該樹脂層與粗糙面之接觸面積變大,容易提昇接著力。就此種觀點而言,於若干態樣中,樹脂層之儲存彈性模數G'(23℃)例如較佳為4.8×104 Pa以下,進而較佳為4.6×104 Pa以下。又,就對樹脂層賦予適度之凝聚力而提高接著力或保持力之觀點而言,樹脂層之儲存彈性模數G'(23℃)例如可為1.2×104 Pa以上,亦可為1.5×104 Pa以上。The resin layer disclosed herein preferably has a storage elastic modulus G ′ (23 ° C.) of 1.0 × 10 4 Pa or more and 5.0 × 10 4 Pa or less. When the storage elastic modulus G ′ (23 ° C.) of the resin layer is low, the adhesiveness of the resin layer to the unevenness of the rough surface (the above-mentioned followability to the uneven shape) tends to be higher. When the adhesiveness is high, the contact area between the resin layer and the rough surface becomes large, and the adhesion force is easily increased. From this viewpoint, in some aspects, the storage elastic modulus G ′ (23 ° C.) of the resin layer is preferably 4.8 × 10 4 Pa or less, and more preferably 4.6 × 10 4 Pa or less. From the viewpoint of providing a moderate cohesive force to the resin layer to improve the adhesion or holding force, the storage elastic modulus G '(23 ° C) of the resin layer may be, for example, 1.2 × 10 4 Pa or more, and may be 1.5 × 10 4 Pa or more.

樹脂層之儲存彈性模數G'(23℃)可使用市售之動態黏彈性測定裝置進行測定,更具體而言,藉由下述實施例中記載之方法進行測定。樹脂層之儲存彈性模數G'(23℃)可藉由構成丙烯酸系聚合物之單體成分之組成、交聯劑之使用、黏著賦予樹脂之使用等進行調節。例如藉由提高單體A2占單體成分之重量分率,或者進一步減小單體A1相對於單體A2之重量比(即藉由使用相對於單體A1更多之單體A2),可降低樹脂層之儲存彈性模數G'(23℃)。作為降低儲存彈性模數G'(23℃)之效果較高之單體A2之例,可列舉上述通式(1)所表示之含鏈狀醚鍵之(甲基)丙烯酸酯,其係均聚物之Tg為-40℃以下(更佳為-45℃以下,進而較佳為-50℃以下,例如為-55℃以下)。The storage elastic modulus G '(23 ° C) of the resin layer can be measured using a commercially available dynamic viscoelasticity measuring device, and more specifically, it can be measured by a method described in the following Examples. The storage elastic modulus G '(23 ° C) of the resin layer can be adjusted by the composition of the monomer components constituting the acrylic polymer, the use of a cross-linking agent, the use of an adhesion-imparting resin, and the like. For example, by increasing the weight fraction of monomer A2 to monomer components, or further reducing the weight ratio of monomer A1 to monomer A2 (that is, by using more monomer A2 than monomer A1), Reduce the storage elastic modulus G '(23 ° C) of the resin layer. Examples of the monomer A2 having a high effect of lowering the storage elastic modulus G '(23 ° C) include a chain ether bond-containing (meth) acrylate represented by the above-mentioned general formula (1). The Tg of the polymer is -40 ° C or lower (more preferably -45 ° C or lower, even more preferably -50 ° C or lower, such as -55 ° C or lower).

此處所揭示之樹脂層較佳為儲存彈性模數G'(-10℃)為3.0×104 Pa以上且7.0×105 Pa以下。樹脂層之儲存彈性模數G'(-10℃)較低係就即便於低溫下亦容易使上述樹脂層與粗糙面之凹凸良好地密接,提高低溫下之粗糙面接著性之觀點而言較為有利。就此種觀點而言,於若干態樣中,樹脂層之儲存彈性模數G'(-10℃)例如較佳為6.5×105 Pa以下,更佳為6.0×105 Pa以下。又,就避免於室溫或其以上之溫度區域凝聚力不足之事件之觀點而言,樹脂層之儲存彈性模數G'(-10℃)例如可為5.0×104 Pa以上,亦可為7.0×104 Pa以上。樹脂層之儲存彈性模數G'(-10℃)可以與儲存彈性模數G'(23℃)相同之方式,使用市售之動態黏彈性測定裝置進行測定,更具體而言,藉由下述實施例中記載之方法進行測定。樹脂層之儲存彈性模數G'(-10℃)可藉由構成丙烯酸系聚合物之單體成分之組成、交聯劑之使用、黏著賦予樹脂之使用等進行調節。The resin layer disclosed herein preferably has a storage elastic modulus G ′ (-10 ° C.) of 3.0 × 10 4 Pa or more and 7.0 × 10 5 Pa or less. The lower the storage elastic modulus G '(-10 ° C) of the resin layer is from the viewpoint that the unevenness of the resin layer and the rough surface is easily adhered even at low temperatures, and the adhesion of the rough surface at low temperatures is improved. advantageous. From this viewpoint, in some aspects, the storage elastic modulus G ′ (-10 ° C.) of the resin layer is preferably 6.5 × 10 5 Pa or less, more preferably 6.0 × 10 5 Pa or less. In addition, from the viewpoint of avoiding an event of insufficient cohesion at room temperature or above, the storage elastic modulus G ′ (-10 ° C.) of the resin layer may be, for example, 5.0 × 10 4 Pa or more, and may be 7.0. × 10 4 Pa or more. The storage elastic modulus G '(-10 ° C) of the resin layer can be measured in the same manner as the storage elastic modulus G' (23 ° C) using a commercially available dynamic viscoelasticity measuring device, and more specifically, by the following The measurement was performed by the method described in the examples. The storage elastic modulus G '(-10 ° C) of the resin layer can be adjusted by the composition of the monomer components constituting the acrylic polymer, the use of a cross-linking agent, the use of an adhesion-imparting resin, and the like.

此處所揭示之樹脂層之霧度值並無特別限制。例如可以樹脂層之厚度為85 μm之情形時之該樹脂層之霧度值為10%以下的態樣實施。於較佳之一態樣中,厚度85 μm下之樹脂層之霧度值為1.9%以下。如此具有透明性較高之樹脂層之積層片材適於在具有支持體之構成或不具有支持體之構成中要求較高之透光性之用途、或要求可通過該積層片材良好地視認被接著體之性能之用途。又,適於在具有支持體之構成中要求可通過樹脂層良好地視認上述支持體之外觀之性質的用途。厚度85 μm下之樹脂層之霧度值更佳為1.5%以下,進而較佳為1%以下,進而較佳為0.7%以下。樹脂層之霧度值之下限並無特別限制。例如可以厚度85 μm下之樹脂層之霧度值為0%以上(例如0.05%以上)之態樣實施。The haze value of the resin layer disclosed herein is not particularly limited. For example, when the thickness of the resin layer is 85 μm, the haze value of the resin layer may be 10% or less. In a preferred aspect, the haze value of the resin layer at a thickness of 85 μm is 1.9% or less. Such a laminated sheet having a resin layer having higher transparency is suitable for a use requiring a higher light transmittance in a constitution having a support or a constitution having no support, or is required to be well recognized by the laminated sheet The use of the properties of the adherend. Moreover, it is suitable for the use which requires the property of the external appearance of the said support to be recognized well by the resin layer in the structure which has a support. The haze value of the resin layer at a thickness of 85 μm is more preferably 1.5% or less, further preferably 1% or less, and still more preferably 0.7% or less. The lower limit of the haze value of the resin layer is not particularly limited. For example, the thickness of the resin layer with a thickness of 85 μm may be implemented as a haze value of 0% or more (for example, 0.05% or more).

於以附基材(支持體)之積層片材之形態實施此處所揭示之技術的情形時,該積層片材之霧度值並無特別限制。例如可以附基材之積層片材之霧度值為15%以下之態樣實施。如此透明性較高之附基材之積層片材適於要求較高之透光性之用途、或要求可通過該積層片材良好地視認被接著體之性能之用途。於較佳之一態樣中,附基材之積層片材之霧度值為5%以下,更佳為1.9%以下,進而較佳為1.5%以下(例如1%以下)。附基材之積層片材之霧度值之下限並無特別限制。例如可以附基材之積層片材之霧度值為0%以上(例如0.05%以上)之態樣實施。In the case where the technology disclosed herein is implemented in the form of a laminated sheet with a substrate (support), the haze value of the laminated sheet is not particularly limited. For example, it can be implemented as the haze value of the laminated sheet with a base material is 15% or less. Such a laminated sheet with a substrate having higher transparency is suitable for applications requiring higher light transmittance, or applications in which the properties of the adherend can be recognized well by the laminated sheet. In a preferred aspect, the haze value of the laminated sheet with the substrate is 5% or less, more preferably 1.9% or less, and still more preferably 1.5% or less (for example, 1% or less). The lower limit of the haze value of the laminated sheet with a substrate is not particularly limited. For example, the laminated sheet with a base material may be implemented in a state where the haze value is 0% or more (for example, 0.05% or more).

此處,「霧度值」係指對測定對象照射可見光時之擴散透過光相對於全透過光之比率。亦稱為霧度值(haze value)。霧度值可由以下之式表示。
Th(%)=Td/Tt×100
於上述式中,Th為霧度值(%),Td為散射光透過率,Tt為全光透過率。霧度值之測定可按照下述實施例中記載之方法進行。
Here, the "haze value" refers to a ratio of diffused transmitted light to total transmitted light when the measurement target is irradiated with visible light. Also called a haze value. The haze value can be expressed by the following formula.
Th (%) = Td / Tt × 100
In the above formula, Th is a haze value (%), Td is a scattered light transmittance, and Tt is a total light transmittance. The haze value can be measured according to the method described in the following examples.

上述樹脂層例如可將上述樹脂組合物塗佈於支持體之單面或兩面,藉由加熱乾燥等而去除聚合溶劑等,藉此形成為積層片材。構成上述積層片材之支持體可為剝離性之(即可剝離構成上述積層片材之樹脂層)支持體,亦可為非剝離性之支持體。又,亦可由塗佈於剝離性之支持體之樹脂組合物形成樹脂層後,將該樹脂層貼合於非剝離性之支持體之單面或兩面,藉此構成積層片材。於塗佈樹脂組合物時,可基於提昇塗敷性或者調節厚度等目的,適當重新加入聚合溶劑以外之一種以上之溶劑。The resin layer can be formed into a laminated sheet by, for example, applying the resin composition to one or both sides of a support, and removing the polymerization solvent and the like by heating and drying. The support constituting the laminated sheet may be a peelable (that is, a resin layer constituting the laminated sheet described above) support, or may be a non-releasable support. Moreover, after forming a resin layer from the resin composition coated on the peelable support body, this resin layer may be bonded to one or both sides of a non-peelable support body, and a laminated sheet may be comprised. When coating the resin composition, one or more solvents other than the polymerization solvent may be appropriately added for the purpose of improving coating properties or adjusting thickness.

作為上述樹脂組合物之塗佈方法,可使用各種方法。具體而言,例如可列舉:輥式塗佈、接觸輥式塗佈、凹版塗佈、反向塗佈、輥式刷塗、噴霧塗佈、浸漬輥式塗佈、棒式塗佈、刮刀塗佈、氣刀塗佈、淋幕式塗佈、模唇塗佈、藉由模嘴塗佈機等之擠出塗佈法等方法。As a coating method of the said resin composition, various methods can be used. Specific examples include: roll coating, contact roll coating, gravure coating, reverse coating, roll brush coating, spray coating, dip roll coating, bar coating, and blade coating. Methods such as cloth, air knife coating, curtain coating, die lip coating, extrusion coating by die nozzle coater, etc.

上述加熱乾燥之溫度較佳為40~200℃,進而較佳為50~180℃,尤佳為70~170℃。藉由將加熱溫度設為上述範圍,可獲得具有優異之黏著特性之樹脂層。上述加熱乾燥之時間較佳為5秒~20分鐘,進而較佳為5秒~15分鐘,尤佳為10秒~10分鐘。The temperature of the heating and drying is preferably 40 to 200 ° C, more preferably 50 to 180 ° C, and particularly preferably 70 to 170 ° C. By setting the heating temperature to the above range, a resin layer having excellent adhesive properties can be obtained. The heating and drying time is preferably 5 seconds to 20 minutes, more preferably 5 seconds to 15 minutes, and even more preferably 10 seconds to 10 minutes.

於藉由對單體成分進行紫外線照射進行聚合而製造上述(甲基)丙烯酸系聚合物之態樣中,可由上述單體成分製造上述(甲基)丙烯酸系聚合物,並且形成樹脂層。於單體成分中,可適當調配交聯劑等可調配於上述樹脂組合物中之材料。上述單體成分可使用於紫外線照射時,事先使一部分進行聚合而製成糖漿狀者。於紫外線照射中,可使用高壓水銀燈、低壓水銀燈、金屬鹵化物燈等。In a state in which the (meth) acrylic polymer is produced by polymerizing a monomer component by ultraviolet irradiation, the (meth) acrylic polymer can be produced from the monomer component, and a resin layer can be formed. In the monomer component, materials such as a cross-linking agent that can be blended in the resin composition can be blended as appropriate. When the said monomer component can be used for ultraviolet irradiation, a part is polymerized beforehand, and it can be made into a syrup form. In the ultraviolet irradiation, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, or the like can be used.

作為上述支持體,可列舉:以聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物等聚烯烴作為主成分之聚烯烴膜、以聚對苯二甲酸乙二酯(PET)或聚對苯二甲酸丁二酯等聚酯作為主成分之聚酯膜、以聚氯乙烯作為主成分之聚氯乙烯膜,除此以外,亦可列舉:聚醚碸膜、聚苯乙烯膜、聚丙烯酸系膜、聚胺基甲酸酯膜、聚醯亞胺膜、聚醯胺膜、聚醯胺醯亞胺膜、環烯烴系膜、乙烯-乙烯醇共聚物膜等塑膠膜;紙、布、不織布等多孔質材料;網狀物;聚乙烯泡沫或丙烯酸泡沫等含氣泡片材;金屬箔;及該等之複合體等各種支持膜。上述複合體之例包含金屬箔與塑膠膜之積層體、或經玻璃纖維或碳纖維等無機纖維強化之塑膠膜等,但並不限定於該等。再者,上述含氣泡片材中之氣泡之概念包含不具有固體狀之外殼之氣泡、及具有固體狀之外殼之氣泡(例如含有中空粒子等者)。因此,於該申請案中,有時將上述含氣泡片材記載為「含有氣泡或粒子之片材」。上述含有氣泡或粒子之片材可包含不具有固體狀之外殼之氣泡、及具有固體狀之外殼之氣泡之一者或兩者。
支持膜之厚度通常適合為5 μm~3000 μm左右,可為較佳為10 μm~2500 μm、進而較佳為20 μm~2000 μm左右。於若干態樣中,上述支持膜之厚度例如可為1000 μm以下,可為500 μm以下,可為300 μm以下,亦可為100 μm以下或50 μm以下。
Examples of the support include a polyolefin film containing polyolefin such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymer as a main component, polyethylene terephthalate (PET), or In addition to polyester films such as polybutylene terephthalate as the main component, and polyvinyl chloride films based on polyvinyl chloride as the main component, polyether 碸 films, polystyrene films, Polyacrylic film, polyurethane film, polyimide film, polyimide film, polyimide film, cyclic olefin film, ethylene-vinyl alcohol copolymer film and other plastic films; paper, Porous materials such as cloth and non-woven fabrics; meshes; bubble-containing sheets such as polyethylene foam or acrylic foam; metal foils; and various supporting films such as composites. Examples of the composite include a laminated body of a metal foil and a plastic film, or a plastic film reinforced with an inorganic fiber such as glass fiber or carbon fiber, but are not limited thereto. The concept of bubbles in the bubble-containing sheet includes bubbles without a solid shell and bubbles with a solid shell (for example, those containing hollow particles). Therefore, in this application, the above-mentioned bubble-containing sheet may be described as "a sheet containing bubbles or particles". The air bubble or particle-containing sheet may include one or both of air bubbles without a solid shell and air bubbles with a solid shell.
The thickness of the supporting film is generally suitable to be about 5 μm to 3000 μm, and may be preferably 10 μm to 2500 μm, and more preferably 20 μm to 2000 μm. In some aspects, the thickness of the support film may be, for example, 1000 μm or less, 500 μm or less, 300 μm or less, or 100 μm or 50 μm or less.

可視需要對上述支持膜實施藉由聚矽氧系、氟系、長鏈烷基系或脂肪酸醯胺系脫模劑或者二氧化矽粉末等之脫模及防污處理。又,亦可對上述支持膜實施藉由防靜電劑之塗佈、混練、蒸鍍等之防靜電處理。If necessary, the above-mentioned support film may be subjected to a mold release and antifouling treatment with a silicone-based, fluorine-based, long-chain alkyl-based or fatty acid ammonium-based release agent or silicon dioxide powder. In addition, the support film may be subjected to an antistatic treatment such as coating, kneading, and vapor deposition with an antistatic agent.

將一實施形態之積層片材之構造例模式性地示於圖1。該積層片材1具備:支持膜10,其具有第一面10A及第二面10B;及黏著劑層21,其係設置於該第一面10A側之樹脂層。第一面10A為非剝離性,藉此,積層片材1構成為附基材之單面黏著片材。使用前(即貼附於被接著體之前)之積層片材1如圖1所示,可進而包含保護黏著劑層21之表面(黏著面)21A之剝離襯墊31。剝離襯墊31係至少與黏著面21A接觸之側成為剝離性表面(剝離面)。於實用時,剝離襯墊31自黏著面21A剝離。A structural example of a laminated sheet according to an embodiment is schematically shown in FIG. 1. The laminated sheet 1 includes a support film 10 having a first surface 10A and a second surface 10B, and an adhesive layer 21 which is a resin layer provided on the first surface 10A side. The first surface 10A is non-peelable, whereby the laminated sheet 1 is configured as a single-sided adhesive sheet with a base material. As shown in FIG. 1, the laminated sheet 1 before use (that is, before being attached to the adherend) may further include a release liner 31 that protects the surface (adhesive surface) 21A of the adhesive layer 21. The release liner 31 is a release surface (release surface) on at least the side that is in contact with the adhesive surface 21A. In practice, the release liner 31 is peeled from the adhesive surface 21A.

將另一實施形態之積層片材之構造例模式性地示於圖2。該積層片材2具備:支持膜10,其具有第一面10A及第二面10B;黏著劑層21,其係設置於該第一面10A側之樹脂層;及黏著劑層22,其係設置於第二面10B側之樹脂層。第一面10A及第二面10B均為非剝離性,藉此,積層片材2構成為附基材之兩面黏著片材。使用前之黏著片材2如圖2所示,可進而包含保護黏著劑層21之表面(第一黏著面)21A及黏著劑層22之表面(第二黏著面)22A之剝離襯墊31、32。剝離襯墊31、32係至少與黏著面21A、22A接觸之側成為剝離面,於實用時,自黏著面21A、22A剝離。A structural example of a laminated sheet according to another embodiment is schematically shown in FIG. 2. The laminated sheet 2 includes: a supporting film 10 having a first surface 10A and a second surface 10B; an adhesive layer 21 that is a resin layer provided on the first surface 10A side; and an adhesive layer 22 that is A resin layer provided on the second surface 10B side. Both the first surface 10A and the second surface 10B are non-peelable, whereby the laminated sheet 2 is configured as an adhesive sheet on both sides with a substrate. As shown in FIG. 2, the adhesive sheet 2 before use may further include a release liner 31 that protects the surface (first adhesive surface) 21A of the adhesive layer 21 and the surface (second adhesive surface) 22A of the adhesive layer 22, 32. The release liners 31 and 32 are at least the sides that come into contact with the adhesive surfaces 21A and 22A to become release surfaces. In practical use, the release liners 21 and 22A are peeled off.

將又一實施形態之積層片材之構造例模式性地示於圖3。該積層片材3包含:黏著劑層21,其為樹脂層;剝離襯墊31,其保護黏著劑層21之一表面(第一黏著面)21A;及剝離襯墊32,其保護黏著劑層21之另一表面(第二黏著面)21B。於實用時,剝離襯墊31、32係自黏著面21A、21B剝離。該實施形態之黏著劑層21亦可作為不具有非剝離性之支持體之黏著片材、即無基材之黏著片材掌握。A structural example of a laminated sheet according to still another embodiment is schematically shown in FIG. 3. The laminated sheet 3 includes: an adhesive layer 21 which is a resin layer; a release liner 31 which protects one surface (first adhesive surface) 21A of the adhesive layer 21; and a release liner 32 which protects the adhesive layer The other surface of 21 (the second adhesive surface) 21B. In practice, the release liners 31 and 32 are peeled from the adhesive surfaces 21A and 21B. The adhesive layer 21 of this embodiment can also be grasped as an adhesive sheet without a non-peelable support, that is, an adhesive sheet without a substrate.

作為剝離襯墊之構成材料,例如可列舉:聚乙烯、聚丙烯、聚對苯二甲酸乙二酯、聚酯膜等塑膠膜、紙、布、不織布等多孔質材料、網狀物、含氣泡片材、金屬箔及該等之層壓體等適當之薄片體等。就表面平滑性優異之方面而言,可較佳地使用塑膠膜。Examples of constituent materials of the release liner include plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films, porous materials such as paper, cloth, and non-woven fabrics, meshes, and air bubbles Suitable sheet materials such as sheets, metal foils, and the like are used. In terms of excellent surface smoothness, a plastic film can be preferably used.

作為上述塑膠膜,只要為可保護上述樹脂層之膜,則並無特別限定,例如可列舉:聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜、聚甲基戊烯膜、聚氯乙烯膜、氯乙烯共聚物膜、聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺基甲酸酯膜、乙烯-乙酸乙烯酯共聚物膜等。The plastic film is not particularly limited as long as it can protect the resin layer, and examples thereof include polyethylene films, polypropylene films, polybutene films, polybutadiene films, and polymethylpentene films. , Polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polybutylene terephthalate film, polyurethane film, ethylene-vinyl acetate copolymer film, and the like.

上述剝離襯墊之厚度通常為5~300 μm,較佳為5~200 μm左右。亦可視需要對上述剝離襯墊亦進行藉由聚矽氧系、氟系、長鏈烷基系或脂肪酸醯胺系脫模劑、二氧化矽粉末等之脫模及防污處理、或塗佈型、混練型、蒸鍍型等之防靜電處理。尤其藉由對上述剝離襯墊之表面適當進行聚矽氧處理、長鏈烷基處理、氟處理等剝離處理,可進一步提高自上述樹脂層之剝離性。The thickness of the release liner is usually 5 to 300 μm, and preferably about 5 to 200 μm. If necessary, the release liner may be subjected to a mold release, antifouling treatment, or coating with a silicone-based, fluorine-based, long-chain alkyl-based or fatty acid ammonium-based release agent, silicon dioxide powder, or the like. Type, mixed type, evaporation type and other anti-static treatment. In particular, by appropriately performing a release treatment such as a polysiloxane treatment, a long-chain alkyl treatment, or a fluorine treatment on the surface of the release liner, the releasability from the resin layer can be further improved.

此處所揭示之樹脂層(可為構成無基材之黏著片材、附基材之單面黏著片材或附基材之兩面黏著片材之樹脂層。以下相同)以聚丙烯(PP)板作為被接著體所測定之室溫180°剝離接著力(以下,亦稱為相對PP室溫接著力)較佳為10 N/20 mm以上,更佳為11 N/20 mm以上。上述樹脂層之相對PP室溫接著力例如可為12 N/20 mm以上,亦可為13 N/20 mm以上。相對PP室溫接著力之上限並無特別限制,例如可為30 N/20 mm以下左右。The resin layer disclosed herein (can be a resin layer constituting an adhesive sheet without a substrate, a single-sided adhesive sheet with a substrate, or a resin layer with both surfaces of a substrate. The same applies hereinafter) with a polypropylene (PP) board The room-temperature 180 ° peeling adhesion force (hereinafter, also referred to as relative PP room-temperature adhesion force) measured as an adherend is preferably 10 N / 20 mm or more, and more preferably 11 N / 20 mm or more. The relative PP room temperature adhesion of the resin layer may be, for example, 12 N / 20 mm or more, and may also be 13 N / 20 mm or more. The upper limit of the room temperature adhesive force with respect to PP is not particularly limited, and may be, for example, about 30 N / 20 mm or less.

此處所揭示之樹脂層較佳為以針葉樹合板作為被接著體所測定之室溫180°剝離接著力(以下,亦稱為相對合板室溫接著力)為8 N/20 mm以上。上述合板室溫接著力更佳為10 N/20 mm以上,進而較佳為15 N/20 mm以上,亦可為18 N/20 mm以上或20 N/20 mm以上。相對合板室溫接著力之上限並無特別限制,例如可為50 N/20 mm以下左右,亦可為40 N/20 mm以下左右。The resin layer disclosed herein preferably has a 180 ° peeling adhesion force (hereinafter, also referred to as relative room temperature adhesion force with respect to the plywood) measured at room temperature with a coniferous plywood as an adherend, which is 8 N / 20 mm or more. The above-mentioned plywood adhesive force at room temperature is more preferably 10 N / 20 mm or more, more preferably 15 N / 20 mm or more, and also 18 N / 20 mm or more or 20 N / 20 mm or more. There is no particular limitation on the upper limit of the room-temperature bonding force with respect to the plywood, and it may be, for example, about 50 N / 20 mm or less, or about 40 N / 20 mm or less.

此處所揭示之樹脂層較佳為以矽酸鈣板作為被接著體所測定之室溫180°剝離接著力(以下,亦稱為相對矽酸鈣板室溫接著力)為10 N/20 mm以上。上述矽酸鈣板室溫接著力更佳為15 N/20 mm以上,亦可為20 N/20 mm以上。相對矽酸鈣板室溫接著力之上限並無特別限制,例如可為50 N/20 mm以下左右,亦可為40 N/20 mm以下左右。The resin layer disclosed here is preferably a room-temperature 180 ° peeling adhesive force (hereinafter, also referred to as a relative calcium silicate plate room temperature adhesive force) measured using a calcium silicate plate as an adherend, which is 10 N / 20 mm or more. . The above-mentioned bonding force of the calcium silicate board at room temperature is more preferably 15 N / 20 mm or more, and may also be 20 N / 20 mm or more. The upper limit of the room temperature adhesion force relative to the calcium silicate board is not particularly limited, and may be, for example, about 50 N / 20 mm or less, or about 40 N / 20 mm or less.

於此處所揭示之樹脂層中,以針葉樹合板作為被接著體所測定之低溫180°剝離接著力(以下,亦稱為相對合板低溫接著力)例如可為1 N/20 mm以上或3 N/20 mm以上,較佳為5 N/20 mm以上。於若干態樣中,上述相對合板低溫接著力例如可為7 N/20 mm以上,亦可為9 N/20 mm以上。上述(甲基)丙烯酸系聚合物由於為以特定之比率包含單體A1及單體A2之單體成分之聚合物,故而於低溫範圍下柔軟性亦優異。因此,即便相對於上述(甲基)丙烯酸系聚合物調配特定量之黏著賦予樹脂,亦可對針葉樹合板等之粗糙面,於低溫範圍下發揮良好之接著性,可較佳地達成上述低溫接著力。相對合板低溫接著力之上限並無特別限制,例如可為50 N/20 mm以下左右,亦可為40 N/20 mm以下左右。In the resin layer disclosed herein, the low-temperature 180 ° peeling adhesive force (hereinafter, also referred to as low-temperature adhesive force with respect to the plywood) measured using a coniferous plywood as an adherend may be, for example, 1 N / 20 mm or more or 3 N / 20 mm or more, preferably 5 N / 20 mm or more. In some aspects, the low-temperature bonding force of the relative plywood may be, for example, 7 N / 20 mm or more, and may also be 9 N / 20 mm or more. Since the (meth) acrylic polymer is a polymer containing monomer components of the monomer A1 and the monomer A2 at a specific ratio, the polymer is also excellent in flexibility in a low temperature range. Therefore, even if a specific amount of the adhesion-imparting resin is blended with the (meth) acrylic polymer, the rough surface of the coniferous plywood and the like can exhibit good adhesion in a low temperature range, and the low temperature adhesion can be achieved better. force. The upper limit of the low-temperature bonding force to the plywood is not particularly limited, and may be, for example, about 50 N / 20 mm or less, or about 40 N / 20 mm or less.

樹脂層之室溫180°剝離接著力及低溫180°剝離接著力係藉由下述實施例中記載之方法進行測定。於構成無基材之黏著劑層之樹脂層(即不具有非剝離性之支持體之樹脂層)中,於測定180°剝離接著力時,可於上述樹脂層之單面貼附適當之襯底材料(例如厚度25 μm左右之PET膜)而加強。關於下述保持力試驗,亦相同。又,於構成附基材之單面黏著片材或附基材之兩面黏著片材之樹脂層中,亦可視需要進行相同之加強。The 180 ° peeling adhesive force at room temperature and the 180 ° peeling adhesive force at low temperature of the resin layer were measured by the methods described in the following examples. In the resin layer constituting the adhesive layer without a substrate (that is, the resin layer without a non-peelable support), when measuring the 180 ° peel adhesion, an appropriate liner can be attached to one side of the resin layer. Base material (such as a PET film with a thickness of about 25 μm). The same applies to the following holding force test. In addition, the same reinforcement can be applied to the resin layer constituting the single-sided adhesive sheet with the base material or the double-sided adhesive sheet with the base material as needed.

此處所揭示之樹脂層藉由下述實施例中記載之方法所測定之保持力試驗中之偏移距離較佳為未達1.0 mm,更佳為0.8 mm以下。此種積層片材係樹脂層具有適度較高之凝聚力。根據此種樹脂層,可牢固地接合或固定被接著體。The offset distance in the retention force test of the resin layer disclosed here by the method described in the following examples is preferably less than 1.0 mm, and more preferably 0.8 mm or less. Such a laminated sheet-based resin layer has a moderately high cohesive force. According to this resin layer, the adherend can be firmly bonded or fixed.

<用途>
此處所揭示之樹脂層可較佳地用於貼附於具有粗糙面之被接著體或塑膠之用途。作為具有粗糙面之被接著體,可例示:混凝土、砂漿、石膏板、針葉樹合板、木質系水泥板、矽酸鈣板、磁磚及纖維強化水泥板等,但並不限定於該等。上述粗糙面之算術平均粗糙度Ra例如可為1 μm~800 μm左右。上述積層片材尤其可較佳地用於具有算術平均粗糙度Ra為1 μm~500 μm之粗糙面之被接著體。上述粗糙面之算術平均粗糙度Ra例如可為3 μm~300 μm左右,亦可為5 μm~150 μm左右。又,此處所揭示之樹脂層及積層片材亦可與平滑之被接著體牢固地接著,亦可較佳地應用於此種被接著體。
< Applications >
The resin layer disclosed herein can be preferably used for attaching an adherend or a plastic having a rough surface. Examples of the adherend having a rough surface include concrete, mortar, gypsum board, coniferous board, wood-based cement board, calcium silicate board, tile, and fiber-reinforced cement board, but are not limited thereto. The arithmetic average roughness Ra of the rough surface may be, for example, about 1 μm to 800 μm. The laminated sheet is particularly preferably used for an adherend having a rough surface having an arithmetic average roughness Ra of 1 μm to 500 μm. The arithmetic average roughness Ra of the rough surface may be, for example, about 3 μm to 300 μm, or may be about 5 μm to 150 μm. In addition, the resin layer and the laminated sheet disclosed herein can be firmly adhered to a smooth adherend, and can also be preferably applied to such an adherend.

此處所揭示之樹脂層可有效利用能夠與粗糙面及塑膠中之任一者均良好地接著之特徵,較佳地用於貼附於粗糙面及塑膠兩者之用途(例如將具有粗糙面之被接著體與塑膠構件接合之用途)。上述塑膠例如可為PP、PE等聚烯烴系樹脂之類之低極性之塑膠。The resin layer disclosed herein can effectively utilize the characteristics that can be adhered to any of the rough surface and the plastic, and is preferably used for attaching to both the rough surface and the plastic (for example, Application of bonding body and plastic member). The plastic may be a low-polarity plastic such as a polyolefin resin such as PP or PE.

由該說明書所揭示之事項包含以下之事項。
[1]一種樹脂組合物,其係含有
玻璃轉移溫度為-40℃以下之(甲基)丙烯酸系聚合物、及
相對於上述(甲基)丙烯酸系聚合物100重量份為5重量份以上且40重量份以下之黏著賦予樹脂者,且
上述(甲基)丙烯酸系聚合物係包含
均聚物之玻璃轉移溫度為-50℃以下且於酯基之末端具有碳數8~18之支鏈烷基之(甲基)丙烯酸烷基酯(A1)50~97重量%、及
均聚物之玻璃轉移溫度為-40℃以下且於分子骨架內具有醚鍵之(甲基)丙烯酸酯(A2)3~50重量%
之單體成分之聚合物。
[2]如上述[1]記載之樹脂組合物,其中上述(甲基)丙烯酸烷基酯(A1)與上述具有醚鍵之(甲基)丙烯酸酯(A2)之合計比率相對於形成上述(甲基)丙烯酸系聚合物之所有單體成分為75重量%以上。
[3]如上述[1]或[2]記載之樹脂組合物,其中上述具有醚鍵之(甲基)丙烯酸酯(A2)為通式(1)所表示之單體:
CH2 =CR1 -COO-(AO)n -R2
(上述通式(1)中,R1 為氫原子或甲基,AO為碳數2~3之伸烷氧基,n係表示上述伸烷氧基之平均加成莫耳數之數且為1~10,R2 為芳香環、或者直鏈、支鏈或脂環式烷基)。
[4]如上述[3]記載之樹脂組合物,其中上述通式(1)中之AO為氧乙烯基。
[5]如上述[3]或[4]記載之樹脂組合物,其中上述通式(1)中之n為2~8。
[6]如上述[3]至[5]中任一項記載之樹脂組合物,其中上述通式(1)中之R2 之碳數為1~6。
[7]如上述[1]至[6]中任一項記載之樹脂組合物,其中上述黏著賦予樹脂包含選自由松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、石油系黏著賦予樹脂及苯乙烯系黏著賦予樹脂所組成之群中之至少一種。
[8]如上述[1]至[7]中任一項記載之樹脂組合物,其包含軟化點為90℃以上且160℃以下之至少一種黏著賦予樹脂作為上述黏著賦予樹脂。
[9]如上述[1]至[8]中任一項記載之樹脂組合物,其中上述單體成分包含選自由具有羥基之單體、具有羧基之單體及具有環氧基之單體所組成之群中之至少一種含官能基之單體。
[10]如上述[1]至[9]中任一項記載之樹脂組合物,其中上述單體成分相對於形成(甲基)丙烯酸系聚合物之所有單體成分,進而包含5重量%以下或3重量%以下之多官能性單體。
[11]如上述[1]至[10]中任一項記載之樹脂組合物,其中上述(甲基)丙烯酸系聚合物之重量平均分子量為35萬以上。
[12]如上述[1]至[11]中任一項記載之樹脂組合物,其相對於上述(甲基)丙烯酸系聚合物100重量份,進而含有0.01重量份以上且5重量份以下之交聯劑。
[13]如上述[12]記載之樹脂組合物,其中上述交聯劑包含異氰酸酯系交聯劑及環氧系交聯劑之一者或兩者。
[14]一種樹脂層,其係由如上述[1]至[13]中任一項之樹脂組合物形成。
[15]如上述[14]記載之樹脂層,其儲存彈性模數G'(23℃)為1.0×104 Pa以上且5.0×104 Pa以下。
[16]如上述[14]或[15]記載之樹脂層,其儲存彈性模數G'(-10℃)為3.0×104 Pa以上且7.0×105 Pa以下。
[17]如上述[14]至[16]中任一項記載之樹脂層,其聚合物凝膠分率為20重量%以上且98重量%以下。
[18]如上述[14]至[16]中任一項記載之樹脂層,其聚合物凝膠分率為20重量%以上且95重量%以下。
[19]如上述[14]至[18]中任一項記載之樹脂層,其中上述樹脂層之厚度為85 μm之情形時之霧度值為1.9%以下。
[20]一種積層片材,其包含:
支持體;及
設置於上述支持體之至少單側之如上述[14]至[19]中任一項記載之樹脂層。
[21]如上述[20]記載之積層片材,其中上述樹脂層於23℃之環境下且於剝離速度300 mm/分鐘之條件下所測定之180°剝離接著力為10 N/20 mm以上。
[22]如上述[20]或[21]記載之積層片材,其中上述樹脂層於-10℃之環境下且於剝離速度300 mm/分鐘之條件下所測定之180°剝離接著力為5 N/20 mm以上。
[23]如上述[20]至[22]中任一項記載之積層片材,其中上述支持體包含塑膠膜、紙、不織布、及含有氣泡或粒子之片材中之至少任一者。
[24]如上述[20]至[23]中任一項記載之積層片材,其貼附於具有粗糙面之被接著體而使用,該被接著體自混凝土、砂漿、石膏板、針葉樹合板、木質系水泥板、矽酸鈣板、磁磚及纖維強化水泥板中選擇。
[25]如上述[24]記載之積層片材,其係用於將上述具有粗糙面之被接著體與塑膠構件接合。
[26]一種積層構造體,其包含具有粗糙面之被接著體、及如上述[14]至[19]中任一項記載之樹脂層,且藉由上述樹脂層與上述粗糙面接著,上述被接著體與上述樹脂層一體化。
[27]一種積層構造體,其包含具有粗糙面之被接著體、及如上述[20]至[23]中任一項記載之積層片材,且藉由上述樹脂層與上述粗糙面接著,上述被接著體與上述積層片材一體化。
[28]如上述[26]或[27]記載之積層構造體,其中上述具有粗糙面之被接著體自混凝土、砂漿、石膏板、針葉樹合板、木質系水泥板、矽酸鈣板、磁磚及纖維強化水泥板中選擇。
[實施例]
The matters disclosed in this manual include the following matters.
[1] A resin composition comprising a (meth) acrylic polymer having a glass transition temperature of -40 ° C or lower, and 5 parts by weight or more with respect to 100 parts by weight of the (meth) acrylic polymer. Those with a viscosity of 40 parts by weight or less, and the (meth) acrylic polymer is a homopolymer having a glass transition temperature of -50 ° C or lower and a branched alkane having 8 to 18 carbons at the end of the ester group (Meth) acrylic acid alkyl ester (A1) of 50 to 97% by weight, and (meth) acrylic acid ester (A2) having a glass transition temperature of -40 ° C or lower and having an ether bond in a molecular skeleton of a homopolymer 3 to 50% by weight
Polymer of monomeric ingredients.
[2] The resin composition according to the above [1], wherein a total ratio of the (meth) acrylic acid alkyl ester (A1) and the (meth) acrylic acid ester (A2) having an ether bond with respect to the above-mentioned ( All monomer components of the (meth) acrylic polymer are 75% by weight or more.
[3] The resin composition according to the above [1] or [2], wherein the (meth) acrylate (A2) having an ether bond is a monomer represented by the general formula (1):
CH 2 = CR 1 -COO- (AO) n -R 2
(In the above general formula (1), R 1 is a hydrogen atom or a methyl group, AO is an alkoxy group having 2 to 3 carbon atoms, and n is a number representing the average addition mole number of the alkoxy group and is 1 to 10, and R 2 is an aromatic ring, or a linear, branched, or alicyclic alkyl group).
[4] The resin composition according to the above [3], wherein AO in the general formula (1) is an oxyethylene group.
[5] The resin composition according to the above [3] or [4], wherein n in the general formula (1) is 2 to 8.
[6] The resin composition according to any one of the above [3] to [5], wherein the carbon number of R 2 in the general formula (1) is 1 to 6.
[7] The resin composition according to any one of the above [1] to [6], wherein the adhesion-imparting resin comprises a resin selected from a rosin-based adhesion-imparting resin, a terpene-based adhesion-imparting resin, a petroleum-based adhesion-imparting resin, and benzene At least one of a group consisting of vinyl-based adhesion-imparting resin.
[8] The resin composition according to any one of the above [1] to [7], which contains at least one adhesion-imparting resin having a softening point of 90 ° C. or higher and 160 ° C. or lower as the adhesion-imparting resin.
[9] The resin composition according to any one of the above [1] to [8], wherein the monomer component is selected from the group consisting of a monomer having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an epoxy group. At least one functional group-containing monomer in the group.
[10] The resin composition according to any one of the above [1] to [9], wherein the monomer component further contains 5% by weight or less based on all the monomer components forming the (meth) acrylic polymer. Or 3% by weight or less of a polyfunctional monomer.
[11] The resin composition according to any one of the above [1] to [10], wherein the weight average molecular weight of the (meth) acrylic polymer is 350,000 or more.
[12] The resin composition according to any one of the above [1] to [11], which further contains 0.01 part by weight or more and 5 parts by weight or less based on 100 parts by weight of the (meth) acrylic polymer. Crosslinking agent.
[13] The resin composition according to the above [12], wherein the crosslinking agent includes one or both of an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent.
[14] A resin layer formed from the resin composition according to any one of the above [1] to [13].
[15] The resin layer according to the above [14], wherein the storage elastic modulus G ′ (23 ° C.) is 1.0 × 10 4 Pa or more and 5.0 × 10 4 Pa or less.
[16] The resin layer according to the above [14] or [15], wherein the storage elastic modulus G '(-10 ° C) is 3.0 × 10 4 Pa or more and 7.0 × 10 5 Pa or less.
[17] The resin layer according to any one of the above [14] to [16], wherein the polymer gel fraction is 20% by weight or more and 98% by weight or less.
[18] The resin layer according to any one of the above [14] to [16], wherein the polymer gel fraction is 20% by weight or more and 95% by weight or less.
[19] The resin layer according to any one of the above [14] to [18], wherein a haze value when the thickness of the resin layer is 85 μm is 1.9% or less.
[20] A laminated sheet comprising:
A support; and the resin layer as set forth in any one of [14] to [19] above, provided on at least one side of the support.
[21] The laminated sheet according to the above [20], wherein the 180 ° peeling adhesive force measured at 23 ° C and at a peeling speed of 300 mm / min is 10 N / 20 mm or more .
[22] The laminated sheet according to the above [20] or [21], wherein the 180 ° peeling adhesion force measured at a temperature of -10 ° C and a peeling speed of 300 mm / min is 5 N / 20 mm or more.
[23] The laminated sheet according to any one of the above [20] to [22], wherein the support includes at least any one of a plastic film, paper, non-woven fabric, and a sheet containing air bubbles or particles.
[24] The laminated sheet according to any one of the above [20] to [23], which is used by being attached to an adherend having a rough surface, the adherend being made of concrete, mortar, gypsum board, or conifer plywood , Wood cement board, calcium silicate board, tile and fiber reinforced cement board.
[25] The laminated sheet according to the above [24], which is used for joining the above-mentioned adherend having a rough surface to a plastic member.
[26] A laminated structure including an adherend having a rough surface and the resin layer according to any one of the above [14] to [19], wherein the resin layer is bonded to the rough surface through the resin layer, and The adherend is integrated with the resin layer.
[27] A laminated structure including an adherend having a rough surface and the laminated sheet according to any one of the above [20] to [23], and bonding the rough surface with the resin layer, The adherend is integrated with the laminated sheet.
[28] The laminated structure according to the above [26] or [27], wherein the adherend having a rough surface is made of concrete, mortar, gypsum board, coniferous wood board, wood cement board, calcium silicate board, tile And fiber reinforced cement board.
[Example]

以下,說明與本發明相關之若干實施例,但並不意欲將本發明限定於此種具體例所示者。再者,以下之說明中之「份」及「%」只要未特別說明,則以重量為基準。Hereinafter, several embodiments related to the present invention will be described, but it is not intended to limit the present invention to those shown in such specific examples. In addition, "part" and "%" in the following description are based on weight unless otherwise specified.

實施例1
((甲基)丙烯酸系聚合物之製備)
將丙烯酸2-乙基己酯(2EHA)90份、乙基卡必醇丙烯酸酯(CBA)10份、丙烯酸4-羥基丁酯(4HBA)0.25份及丙烯酸(AA)1份與作為聚合起始劑之2,2'-偶氮二異丁腈(AIBN)0.1份及乙酸乙酯160份一起添加於具備攪拌翼、溫度計、氮氣導入管、冷卻器之四口燒瓶中,一面緩慢攪拌一面導入氮氣進行1小時氮氣置換後,將燒瓶內之液溫保持為60~65℃附近進行10小時聚合反應而製備(甲基)丙烯酸系聚合物溶液。上述(甲基)丙烯酸系聚合物藉由GPC求出之Mw為85萬。上述(甲基)丙烯酸系聚合物之根據單體組成算出之Tg為-68.7℃。
Example 1
(Preparation of (meth) acrylic polymer)
90 parts of 2-ethylhexyl acrylate (2EHA), 10 parts of ethyl carbitol acrylate (CBA), 0.25 parts of 4-hydroxybutyl acrylate (4HBA), and 1 part of acrylic acid (AA) were used as polymerization initiation Add 0.1 parts of 2,2'-azobisisobutyronitrile (AIBN) and 160 parts of ethyl acetate to a four-necked flask equipped with a stirring wing, a thermometer, a nitrogen introduction tube, and a cooler, and introduce them while stirring slowly. After nitrogen was substituted for 1 hour, the temperature of the liquid in the flask was maintained at about 60 to 65 ° C. for 10 hours to perform a polymerization reaction to prepare a (meth) acrylic polymer solution. The Mw determined by GPC of the (meth) acrylic polymer was 850,000. The Tg of the (meth) acrylic polymer calculated from the monomer composition was -68.7 ° C.

繼而,於上述所獲得之(甲基)丙烯酸系聚合物溶液中,相對於聚合物之固形物成分100份,調配作為黏著賦予樹脂之聚合松香酯(荒川化學工業公司製造,商品名:PENSEL D125,軟化點120~130℃)20.0份、及作為交聯劑之2,4-甲苯二異氰酸酯之三羥甲基丙烷加成物(東曹公司製造,商品名:Coronate L)0.55份,製備樹脂組合物溶液。Next, in the (meth) acrylic polymer solution obtained above, a polymerized rosin ester (manufactured by Arakawa Chemical Industries, Inc., trade name: PENSEL D125, which is an adhesive-imparting resin) was prepared based on 100 parts of the solid content of the polymer. , Softening point: 120 to 130 ° C) 20.0 parts, and 0.55 part of trimethylolpropane adduct of 2,4-toluene diisocyanate (manufactured by Tosoh Corporation, trade name: Coronate L) as a cross-linking agent to prepare a resin Composition solution.

將該樹脂組合物溶液以乾燥後之樹脂層之厚度成為85 μm之方式塗佈於剝離襯墊之剝離面,於130℃下進行3分鐘乾燥而形成樹脂層。藉此,獲得於上述剝離襯墊(即剝離性之支持體)之單面具有樹脂層之積層片材。作為上述剝離襯墊,使用單面成為藉由聚矽氧處理之剝離面之厚度38 μm之PET膜(三菱樹脂公司製造,DIAFOIL MRF)。上述樹脂層亦可作為無基材之黏著劑層掌握。This resin composition solution was applied to the release surface of a release liner so that the thickness of the dried resin layer became 85 μm, and dried at 130 ° C. for 3 minutes to form a resin layer. Thereby, a laminated sheet having a resin layer on one side of the release liner (that is, a release support) was obtained. As the above-mentioned release liner, a PET film (manufactured by Mitsubishi Resin Co., Ltd., DIAFOIL MRF) having a thickness of 38 μm on one side which became a release surface treated with polysiloxane was used. The above resin layer can also be grasped as an adhesive layer without a substrate.

實施例2~16及比較例1~3
於實施例1中,分別如表1所示設置(甲基)丙烯酸系聚合物之製備中所使用之單體之種類及其組成比、黏著賦予樹脂之種類及其調配量、交聯劑之種類及其調配量,除此以外,藉由與實施例1相同之操作,於剝離襯墊之剝離面上製作厚度85 μm之樹脂層而獲得積層片材。將各例之(甲基)丙烯酸系聚合物之Mw及Tg示於表1。
Examples 2 to 16 and Comparative Examples 1 to 3
In Example 1, the types of monomers used in the preparation of the (meth) acrylic polymer and their composition ratios, the types of adhesion-imparting resins and their blending amounts, and the amounts of crosslinking agents were set as shown in Table 1. Except for the type and the blending amount thereof, a resin layer having a thickness of 85 μm was produced on the release surface of the release liner by the same operation as in Example 1 to obtain a laminated sheet. The Mw and Tg of the (meth) acrylic polymer of each example are shown in Table 1.

對上述實施例及比較例中所獲得之構成積層片材之樹脂層進行以下之評價。將評價結果示於表1及表2。The following evaluation was performed about the resin layer which comprises the laminated sheet obtained by the said Example and the comparative example. The evaluation results are shown in Tables 1 and 2.

<聚合物凝膠分率之測定>
自樹脂層採集特定量(初始之重量W1)之試樣,浸漬於乙酸乙酯溶液中,於室溫下放置1週後,取出不溶物,測定乾燥後之重量(W2),藉由下述式,算出樹脂層之凝膠分率。
樹脂層凝膠分率(%)=(W2/W1)×100
根據所獲得之樹脂層凝膠分率,藉由以下之式算出聚合物凝膠分率。再者,下述式中之黏著賦予樹脂份數意指相對於上述樹脂層中所包含之聚合物100份之該樹脂層中所包含之黏著賦予樹脂的份數。
聚合物凝膠分率(%)=樹脂層凝膠分率(%)×(100+黏著賦予樹脂份數)/100
< Measurement of polymer gel fraction >
A specific amount (initial weight W1) of the sample was collected from the resin layer, immersed in an ethyl acetate solution, and left at room temperature for one week, and the insoluble matter was taken out to measure the weight (W2) after drying. Formula to calculate the gel fraction of the resin layer.
Gel fraction of resin layer (%) = (W2 / W1) × 100
From the obtained gel fraction of the resin layer, a polymer gel fraction was calculated by the following formula. The number of adhesion-imparting resins in the following formula means the number of adhesion-imparting resins contained in the resin layer relative to 100 parts of the polymer contained in the resin layer.
Polymer gel fraction (%) = resin layer gel fraction (%) × (100 + number of resins given by adhesion) / 100

<儲存彈性模數G'之測定>
重疊樹脂層而製作厚度約2 mm之積層體。藉由平行板夾住將上述積層體沖裁為直徑7.9 mm之圓盤狀之試樣,使用黏彈性試驗裝置於以下之條件下進行溫度分散測定。自其結果讀取23℃及-10℃下之儲存彈性模數G'(單位;Pa)。
[試驗條件]
裝置:TA Instruments公司製造之ARES
變形模式:扭轉
測定頻率:固定頻率1 Hz(應變:0.1%)
升溫速度:5℃/分鐘
測定溫度:自-70℃至100℃進行測定
形狀:直徑8.0 mm之平行板
<Measurement of storage elastic modulus G '>
A resin layer was laminated to produce a laminated body having a thickness of about 2 mm. The laminate was punched into a disc-shaped sample having a diameter of 7.9 mm by sandwiching a parallel plate, and the temperature dispersion measurement was performed using a viscoelasticity test device under the following conditions. From the results, the storage elastic modulus G '(unit; Pa) at 23 ° C and -10 ° C was read.
[Test conditions]
Device: ARES manufactured by TA Instruments
Deformation mode: Torsion measurement frequency: fixed frequency 1 Hz (strain: 0.1%)
Heating rate: 5 ° C / min Measurement temperature: Measurement from -70 ° C to 100 ° C Shape: Parallel plate with a diameter of 8.0 mm

<室溫接著力測定>
將於各例之樹脂層之一面貼附厚度25 μm之PET膜(東麗公司製造,Lumirror S10)來襯底而成者作為評價用樣本。將上述評價用樣本剪裁為寬度20 mm、長度約100 mm而製作試片。繼而,於23℃、50%RH之標準環境下,使2 kg之輥往復1次而將上述試片之黏著面(即樹脂層之另一面)貼附於作為被接著體之針葉樹合板(自Shimachu Homes獲取,厚度12 mm)、矽酸鈣板(calcium silicate board,A&A Material股份有限公司製造之Stendo#400,厚度6 mm)或聚丙烯板(新神戸電機股份有限公司製造之Kobe Polysheet,厚度2 mm)。將其於上述標準環境下靜置30分鐘後,於相同環境下,於剝離角度180°、剝離速度300 mm/分鐘之條件下測定剝離接著力(N/20 mm)。
<Measurement of room temperature adhesion>
A PET film (Lumirror S10, manufactured by Toray Industries, Inc.) with a thickness of 25 μm was attached to one surface of each of the resin layers as a substrate and used as a sample for evaluation. The evaluation sample was cut into a width of 20 mm and a length of about 100 mm to prepare a test piece. Then, in a standard environment of 23 ° C and 50% RH, the 2 kg roller was reciprocated once to attach the adhesive surface of the test piece (that is, the other side of the resin layer) to the coniferous wood plywood as the adherend (from Acquired by Shimachu Homes, thickness 12 mm), calcium silicate board (Stendo # 400 manufactured by A & A Material Co., Ltd., thickness 6 mm) or polypropylene board (Kobe Polysheet manufactured by Shin Kobe Electric Co., Ltd., thickness 2 mm). After leaving it to stand for 30 minutes in the standard environment described above, the peeling adhesion force (N / 20 mm) was measured under the same environment at a peeling angle of 180 ° and a peeling speed of 300 mm / min.

又,於23℃、50%RH之標準環境下,使2 kg之輥往復1次而將上述試片之黏著面(即樹脂層之另一面)貼附於作為被接著體之玻璃板(松浪硝子工業股份有限公司製造,厚度1.2 mm)。將其於上述標準環境下靜置30分鐘後,於相同環境下,於剝離角度180°、剝離速度300 mm/分鐘之條件下測定剝離接著力(N/20 mm)。In a standard environment of 23 ° C and 50% RH, a 2 kg roller was reciprocated once to attach the adhesive surface of the test piece (that is, the other surface of the resin layer) to a glass plate (Songlang) as an adherend. (Manufactured by GLASS INDUSTRIAL CO., LTD., Thickness 1.2 mm). After leaving it to stand for 30 minutes in the standard environment described above, the peeling adhesion force (N / 20 mm) was measured under the same environment at a peeling angle of 180 ° and a peeling speed of 300 mm / min.

<低溫接著力測定>
將以與上述室溫接著力測定相同之方式所製備之評價用樣本剪裁為寬度20 mm、長度約100 mm而製作試片。繼而,將被接著體及評價樣本於-10℃之環境下保管1小時以上後,於相同環境下,使2 kg之輥往復1次而將上述試片之黏著面貼附於作為被接著體之針葉樹合板(自Shimachu Homes獲取,厚度12 mm)。將其於-10℃之環境下靜置30分鐘後,於相同環境下,於剝離角度180°、剝離速度300 mm/分鐘之條件下測定剝離接著力(N/20 mm)。
< Low temperature adhesive force measurement >
An evaluation sample prepared in the same manner as the above-mentioned room temperature adhesion measurement was cut into a width of 20 mm and a length of about 100 mm to prepare a test piece. Next, after the adherend and the evaluation sample were stored in an environment at -10 ° C for more than one hour, the 2 kg roller was reciprocated once under the same environment to attach the adhesive surface of the test piece as the adherend. Conifer Plywood (obtained from Shimachu Homes, thickness 12 mm). After this was left to stand in an environment at -10 ° C for 30 minutes, the peel adhesion force (N / 20 mm) was measured under the same environment at a peel angle of 180 ° and a peel speed of 300 mm / min.

<保持力測定>
將以與上述室溫接著力測定相同之方式所製備之評價用樣本剪裁為寬度10 mm、長度約100 mm而製作試片。繼而,以寬度10 mm、長度20 mm之貼附面積,使2 kg之輥往復1次而將上述試片之黏著面壓接於作為被接著體之電木板(住友電木公司製造,厚度2 mm)。將如此貼附有試片之被接著體於室溫(23℃)下靜置30分鐘後,以上述試片之長度方向成為鉛直方向之方式垂下,對上述試片之自由端賦予500 g之負載,於40℃之環境下放置1小時後,測定距上述試片之初始之貼附位置之偏移距離(mm)。
< Retention force measurement >
An evaluation sample prepared in the same manner as the above-mentioned room temperature adhesion measurement was cut into a width of 10 mm and a length of about 100 mm to prepare a test piece. Next, with a bonding area of 10 mm in width and 20 mm in length, the 2 kg roller was reciprocated once to pressure-bond the adhesive surface of the test piece to a bake board (manufactured by Sumitomo Bakelite, thickness 2 mm). After the adherend with the test piece so attached was left to stand at room temperature (23 ° C) for 30 minutes, the test piece was suspended so that the longitudinal direction of the test piece became vertical, and 500 g of the free end of the test piece was given. After the load was left in an environment at 40 ° C for 1 hour, the offset distance (mm) from the initial attachment position of the test piece was measured.

<霧度值測定>
以將各例之樹脂層貼附於全光線透過率93.3%、霧度值0.1%之無鹼玻璃之單面而成者作為試片,使用測霧計(MR-100,村上色彩技術研究所製造)測定該試片之霧度值。於測定時,以樹脂層成為光源側之方式配置上述試片。由於無鹼玻璃之霧度值為0.1%,故而將自測定值減去0.1%所得之值作為樹脂層之霧度值。
< Haze value measurement >
A test piece prepared by attaching the resin layer of each example to a single surface of an alkali-free glass having a total light transmittance of 93.3% and a haze value of 0.1% was used as a test piece, and a haze meter (MR-100, Murakami Color Technology Research Institute) was used as a test piece. (Manufacturing) The haze value of this test piece was measured. During the measurement, the test piece was arranged so that the resin layer was on the light source side. Since the haze value of the alkali-free glass is 0.1%, the value obtained by subtracting 0.1% from the measured value is taken as the haze value of the resin layer.

[表1]
[Table 1]

[表2]
[Table 2]

表1中所使用之各縮寫之含義如下所述。
2EHA:丙烯酸2-乙基己酯(東亞合成公司製造,均聚物之Tg=-70℃)。
CBA:乙基卡必醇丙烯酸酯(大阪有機化學工業公司製造,均聚物之Tg=-67℃)。
MTG:甲氧基三乙二醇丙烯酸酯(大阪有機化學工業公司製造,均聚物之Tg=-57℃)。
4HBA:丙烯酸4-羥基丁酯(大阪有機化學工業公司製造,均聚物之Tg=-32℃)。
AA:丙烯酸(東亞合成公司製造,均聚物之Tg=106℃)。
BA:丙烯酸丁酯(東亞合成公司製造,均聚物之Tg=-55℃)。
C:三羥甲基丙烷/2,4-甲苯二異氰酸酯三聚物加成物(東曹公司製造,商品名:Coronate L)。
DN:苯二甲基二異氰酸酯之三羥甲基丙烷加成物(三井化學公司製造,商品名:Takenate D110N)
D:軟化點120~130℃之聚合松香酯(荒川化學工業公司製造,商品名:PENSEL D125)。
A:軟化點95~105℃之松香酯(荒川化學工業公司製造,商品名:PENSEL AZ)。
T:軟化點125~135℃之萜酚樹脂(Yasuhara Chemical股份有限公司製造,商品名:YS Polyster T130)
ND:未評價。
The meanings of the abbreviations used in Table 1 are as follows.
2EHA: 2-ethylhexyl acrylate (manufactured by Toa Kosei, Tg of homopolymer = -70 ° C).
CBA: ethyl carbitol acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd., Tg of homopolymer = -67 ° C).
MTG: methoxytriethylene glycol acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd., Tg of homopolymer = -57 ° C).
4HBA: 4-hydroxybutyl acrylate (manufactured by Osaka Organic Chemical Industry Co., Ltd., Tg of homopolymer = -32 ° C).
AA: acrylic acid (manufactured by Toa Kosei Co., Ltd., Tg of homopolymer: 106 ° C).
BA: Butyl acrylate (manufactured by Toa Synthesis Co., Ltd., Tg of homopolymer = -55 ° C).
C: Trimethylolpropane / 2,4-toluene diisocyanate terpolymer adduct (manufactured by Tosoh Corporation, trade name: Coronate L).
DN: Trimethylolpropane adduct of xylylene diisocyanate (manufactured by Mitsui Chemicals, trade name: Takenate D110N)
D: Polymerized rosin ester with a softening point of 120 to 130 ° C (manufactured by Arakawa Chemical Industries, Ltd., trade name: PENSEL D125).
A: Rosin ester with a softening point of 95 to 105 ° C (manufactured by Arakawa Chemical Industries, Ltd., trade name: PENSEL AZ).
T: terpene phenol resin with a softening point of 125 to 135 ° C (manufactured by Yasuhara Chemical Co., Ltd., trade name: YS Polyster T130)
ND: Not evaluated.

如表2所示,由實施例1~16之樹脂組合物形成之樹脂層對於粗糙面及塑膠均表現出較高之室溫接著力,且即便於低溫下亦對粗糙面表現出良好之接著性。該等樹脂層之保持力亦優異。As shown in Table 2, the resin layer formed from the resin compositions of Examples 1 to 16 exhibited a high room-temperature adhesion to both the rough surface and the plastic, and showed good adhesion to the rough surface even at low temperatures. Sex. These resin layers are also excellent in retention.

以上,詳細地說明了本發明之具體例,但該等僅為例示,並不限定申請專利範圍。申請專利範圍中所記載之技術包含將以上例示之具體例進行各種變化、變更而成者。The specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of patent application. The technology described in the patent application scope includes various changes and modifications to the specific examples illustrated above.

1‧‧‧積層片材1‧‧‧ laminated sheet

2‧‧‧積層片材 2‧‧‧ laminated sheet

3‧‧‧積層片材 3‧‧‧ laminated sheet

10‧‧‧支持膜(支持體) 10‧‧‧ support film (support body)

10A‧‧‧第一面 10A‧‧‧First side

10B‧‧‧第二面 10B‧‧‧Second Side

21‧‧‧黏著劑層(樹脂層) 21‧‧‧Adhesive layer (resin layer)

21A‧‧‧黏著面(第一黏著面) 21A‧‧‧ Adhesive surface (first adhesive surface)

21B‧‧‧黏著面(第二黏著面) 21B‧‧‧ Adhesive surface (second adhesive surface)

22‧‧‧黏著劑層(樹脂層) 22‧‧‧Adhesive layer (resin layer)

22A‧‧‧黏著面(第二黏著面) 22A‧‧‧ Adhesive surface (second adhesive surface)

31‧‧‧剝離襯墊 31‧‧‧ Release liner

32‧‧‧剝離襯墊 32‧‧‧ Release liner

圖1係模式性地表示一實施形態之積層片材之構成之剖視圖。FIG. 1 is a cross-sectional view schematically showing the configuration of a laminated sheet according to an embodiment.

圖2係模式性地表示另一實施形態之積層片材之構成之剖視圖。 FIG. 2 is a cross-sectional view schematically showing the structure of a laminated sheet according to another embodiment.

圖3係模式性地表示又一實施形態之積層片材之構成之剖視圖。 FIG. 3 is a cross-sectional view schematically showing the configuration of a laminated sheet according to still another embodiment.

Claims (17)

一種樹脂組合物,其係含有玻璃轉移溫度為-40℃以下之(甲基)丙烯酸系聚合物、及 相對於上述(甲基)丙烯酸系聚合物100重量份為5重量份以上且40重量份以下之黏著賦予樹脂者,且 上述(甲基)丙烯酸系聚合物係包含 均聚物之玻璃轉移溫度為-50℃以下且於酯基之末端具有碳數8~18之支鏈烷基之(甲基)丙烯酸烷基酯(A1) 50~97重量%、及 均聚物之玻璃轉移溫度為-40℃以下且於分子骨架內具有醚鍵之(甲基)丙烯酸酯(A2) 3~50重量% 之單體成分之聚合物。A resin composition containing a (meth) acrylic polymer having a glass transition temperature of -40 ° C or lower, and 5 to 40 parts by weight or more of the (meth) acrylic polymer-based adhesive-imparting resin, and The (meth) acrylic polymer-based (Meth) acrylic acid alkyl ester (A1) having a glass transition temperature of -50 ° C or lower and having a branched alkyl group having 8 to 18 carbon atoms at the end of the ester group, 50 to 97% by weight, and (Meth) acrylate (A2) having a glass transition temperature of -40 ° C or lower and having an ether bond in the molecular skeleton Polymer of monomeric ingredients. 如請求項1之樹脂組合物,其中上述(甲基)丙烯酸烷基酯(A1)與上述具有醚鍵之(甲基)丙烯酸酯(A2)之合計比率相對於形成上述(甲基)丙烯酸系聚合物之所有單體成分為75重量%以上。The resin composition according to claim 1, wherein the total ratio of the (meth) acrylic acid alkyl ester (A1) to the (meth) acrylic acid ester (A2) having an ether bond is relative to the formation of the (meth) acrylic acid All monomer components of the polymer are 75% by weight or more. 如請求項1或2之樹脂組合物,其中上述具有醚鍵之(甲基)丙烯酸酯(A2)為通式(1)所表示之單體: CH2 =CR1 -COO-(AO)n -R2 (上述通式(1)中,R1 為氫原子或甲基,AO為碳數2~3之伸烷氧基,n係表示上述伸烷氧基之平均加成莫耳數之數且為1~10,R2 為芳香環、或者直鏈、支鏈或脂環式烷基)。The resin composition according to claim 1 or 2, wherein the (meth) acrylate (A2) having an ether bond is a monomer represented by the general formula (1): CH 2 = CR 1 -COO- (AO) n -R 2 (In the above general formula (1), R 1 is a hydrogen atom or a methyl group, AO is an alkoxy group having 2 to 3 carbon atoms, and n is an average addition mole number of the above alkoxy group. The number is 1 to 10, and R 2 is an aromatic ring, or a linear, branched, or alicyclic alkyl group). 如請求項1至3中任一項之樹脂組合物,其中上述黏著賦予樹脂包含選自由松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、石油系黏著賦予樹脂及苯乙烯系黏著賦予樹脂所組成之群中之至少一種。The resin composition according to any one of claims 1 to 3, wherein the adhesion-imparting resin comprises a resin selected from the group consisting of a rosin-based adhesion-imparting resin, a terpene-based adhesion-imparting resin, a petroleum-based adhesion-imparting resin, and a styrene-based adhesion-imparting resin. At least one of the group. 如請求項1至4中任一項之樹脂組合物,其包含軟化點為90℃以上且160℃以下之至少一種黏著賦予樹脂作為上述黏著賦予樹脂。The resin composition according to any one of claims 1 to 4, comprising as the above-mentioned adhesion-imparting resin at least one adhesion-imparting resin having a softening point of 90 ° C or higher and 160 ° C or lower. 如請求項1至5中任一項之樹脂組合物,其中上述單體成分包含選自由具有羥基之單體、具有羧基之單體及具有環氧基之單體所組成之群中之至少一種含官能基之單體。The resin composition according to any one of claims 1 to 5, wherein the above-mentioned monomer component comprises at least one selected from the group consisting of a monomer having a hydroxyl group, a monomer having a carboxyl group, and a monomer having an epoxy group. Functional group-containing monomer. 如請求項1至6中任一項之樹脂組合物,其中上述(甲基)丙烯酸系聚合物之重量平均分子量為35萬以上。The resin composition according to any one of claims 1 to 6, wherein the weight average molecular weight of the (meth) acrylic polymer is 350,000 or more. 如請求項1至7中任一項之樹脂組合物,其進而含有相對於上述(甲基)丙烯酸系聚合物100重量份為0.01重量份以上且5重量份以下之交聯劑。The resin composition according to any one of claims 1 to 7, further comprising a crosslinking agent in an amount of 0.01 to 5 parts by weight based on 100 parts by weight of the (meth) acrylic polymer. 如請求項8之樹脂組合物,其中上述交聯劑包含異氰酸酯系交聯劑及環氧系交聯劑之一者或兩者。The resin composition according to claim 8, wherein the crosslinking agent comprises one or both of an isocyanate-based crosslinking agent and an epoxy-based crosslinking agent. 一種樹脂層,其係由如請求項1至9中任一項之樹脂組合物形成。A resin layer formed from the resin composition according to any one of claims 1 to 9. 如請求項10之樹脂層,其於23℃下之儲存彈性模數G'為1.0×104 Pa以上且5.0×104 Pa以下,且 -10℃下之儲存彈性模數G'為3.0×104 Pa以上且7.0×105 Pa以下。If the resin layer of claim 10 has a storage elastic modulus G 'at 23 ° C of 1.0 × 10 4 Pa or more and 5.0 × 10 4 Pa or less, and a storage elastic modulus G' at -10 ° C of 3.0 × 10 4 Pa or more and 7.0 × 10 5 Pa or less. 如請求項11之樹脂層,其聚合物凝膠分率為20重量%以上且95重量%以下。For example, the resin layer of claim 11 has a polymer gel fraction of 20% by weight to 95% by weight. 如請求項10至12中任一項之樹脂層,其中上述樹脂層之厚度為85 μm之情形時之霧度值為1.9%以下。The resin layer according to any one of claims 10 to 12, wherein the haze value when the thickness of the resin layer is 85 μm is 1.9% or less. 一種積層片材,其包含: 支持體;及 設置於上述支持體之至少單側之如請求項10至13中任一項之樹脂層。A laminated sheet comprising: Support; and The resin layer according to any one of claims 10 to 13 provided on at least one side of the support. 如請求項14之積層片材,其中上述樹脂層於23℃之環境下於剝離速度300 mm/分鐘之條件下所測得之180°剝離接著力為10 N/20 mm以上。For example, the laminated sheet of claim 14, wherein the 180 ° peeling adhesive force measured at a peeling speed of 300 mm / min under the environment of the above-mentioned resin layer is 10 N / 20 mm or more. 如請求項14或15之積層片材,其中上述樹脂層於-10℃之環境下於剝離速度300 mm/分鐘之條件下所測得之180°剝離接著力為5 N/20 mm以上。For example, the laminated sheet of claim 14 or 15, wherein the 180 ° peeling adhesive force measured at a peeling speed of 300 mm / min under the environment of -10 ° C is 5 N / 20 mm or more. 如請求項14至16中任一項之積層片材,其中上述支持體包含塑膠膜、紙、不織布、及含有氣泡或粒子之片材中之至少任一者。The laminated sheet according to any one of claims 14 to 16, wherein the support comprises at least any one of a plastic film, paper, non-woven fabric, and a sheet containing air bubbles or particles.
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