TW201934347A - Laminate production method - Google Patents

Laminate production method Download PDF

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Publication number
TW201934347A
TW201934347A TW107147158A TW107147158A TW201934347A TW 201934347 A TW201934347 A TW 201934347A TW 107147158 A TW107147158 A TW 107147158A TW 107147158 A TW107147158 A TW 107147158A TW 201934347 A TW201934347 A TW 201934347A
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TW
Taiwan
Prior art keywords
adhesive
adhesive sheet
adherend
polymer
laminated body
Prior art date
Application number
TW107147158A
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Chinese (zh)
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TWI707777B (en
Inventor
設樂浩司
野呂弘司
仲野武史
林圭治
Original Assignee
日商日東電工股份有限公司
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Publication of TW201934347A publication Critical patent/TW201934347A/en
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Publication of TWI707777B publication Critical patent/TWI707777B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284Application of adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0008Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0036Heat treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1808Handling of layers or the laminate characterised by the laying up of the layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H41/00Machines for separating superposed webs
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C09J139/04Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J139/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Adhesives based on derivatives of such polymers
    • C09J139/04Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
    • C09J139/06Homopolymers or copolymers of N-vinyl-pyrrolidones
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10Block or graft copolymers containing polysiloxane sequences
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268Release layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Textile Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

Abstract

Provided is a production method for a laminate that comprises an adherend and an adhesive piece that partially covers the adherend. The production method involves, in order: a gluing step for gluing onto the adherend an adhesive sheet, which comprises a base layer and an adhesive layer laminated on at least the adherend-side surface of the base layer; a cutting step for cutting the adhesive sheet at the boundary between a first region constituting the adhesive piece and a second region not constituting the adhesive piece; a partial removal step for peeling the second region off the adherend while leaving the first region on the adherend; and an adhesive strength-boosting step for boosting the adhesive strength of the first region to the adherend.

Description

積層體之製造方法Laminated body manufacturing method

本發明係關於一種積層體之製造方法。
本申請案係主張基於2017年12月28日提出申請之日本專利申請案2017-253310及2018年12月6日提出申請之日本專利申請案2018-228924之優先權,將該等申請案之全部內容作為參照組入至本說明書中。
The present invention relates to a method for manufacturing a laminated body.
This application claims priority based on Japanese patent applications 2017-253310 filed on December 28, 2017 and Japanese patent applications 2018-228924 filed on December 6, 2018. The content is incorporated into this specification as a reference.

根據藉由在被黏著體貼附一片或兩片以上之黏著片而利用上述黏著片局部地覆蓋該被黏著體的積層體,可對應於上述黏著劑之外形或配置而表現各種圖案。作為高精度地製造如上所述被黏著體經黏著片局部地覆蓋之積層體之方法,例如一般使用如下方法:如電路基板之保護膜貼合,將黏著片材預先切割成所需之黏著片之形狀,將該黏著片與被黏著體進行位置對準而貼附。作為與此種技術相關之技術文獻,可列舉專利文獻1。
[先前技術文獻]
[專利文獻]
By laminating one or two or more adhesive sheets to the adherend and using the above-mentioned adhesive sheet to locally cover the laminated body of the adherend, various patterns can be expressed corresponding to the shape or arrangement of the adhesive. As a method for manufacturing a laminated body that is partially covered by the adhesive body through the adhesive sheet as described above, for example, the following method is generally used: if the protective film of the circuit board is laminated, the adhesive sheet is cut into the required adhesive sheet in advance. The shape is such that the adhesive sheet and the adherend are aligned and attached. As a technical document related to such a technique, patent document 1 is mentioned.
[Prior technical literature]
[Patent Literature]

[專利文獻1]日本專利申請公開2013-38379號公報[Patent Document 1] Japanese Patent Application Publication No. 2013-38379

[發明所欲解決之問題][Problems to be solved by the invention]

然而,於上述方法中,由於預先將黏著片材切割成所需之黏著片之形狀,繼而進行位置對準而貼合於特定之被黏著體部位,故而產生切割精度與貼合精度兩者之誤差。因此,於今後之小型化、高精細化之電子零件之製造中,有為了良率良好地製造製品而需要價格非常高之設備之虞。又,例如於所切割之黏著片之尺寸較大之情形或形狀複雜之情形等時,有將該黏著片位置精度及形狀精度良好地貼附於被黏著體變得更加困難之虞。However, in the above method, since the adhesive sheet is cut into a desired shape of the adhesive sheet in advance, and then the position alignment is performed to adhere to a specific adherend part, both cutting accuracy and attaching accuracy occur. error. Therefore, in the manufacture of miniaturized and high-definition electronic parts in the future, in order to manufacture products with good yields, there may be a need for very expensive equipment. In addition, for example, when the size of the cut adhesive sheet is large or the shape is complicated, it may become more difficult to adhere the adhesive sheet with good position accuracy and shape accuracy to the adherend.

因此,本發明之目的在於提供一種高效率地製造於被黏著體上精度良好地形成有黏著片之圖案的積層體之方法。相關之其他發明提供一種適於實施該製造方法之裝置。
[解決問題之技術手段]
Therefore, an object of the present invention is to provide a method for efficiently manufacturing a laminated body having a pattern of an adhesive sheet formed on an adherend with high accuracy. Related other inventions provide a device suitable for implementing the manufacturing method.
[Technical means to solve the problem]

藉由本說明書,提供一種包含被黏著體與局部地覆蓋該被黏著體之黏著片的積層體之製造方法。該積層體製造方法依序包括:貼附步驟,其係將包含基材層與積層於該基材層之至少上述被黏著體側之面之黏著劑層的黏著片材貼附於上述被黏著體;切割步驟,其係對上述黏著片材中構成上述黏著片之第一區域與不構成上述黏著片之第二區域之邊界實施切斷加工;局部去除步驟,其係使上述第一區域殘留於上述被黏著體上並且將上述第二區域自上述被黏著體剝離去除;及黏著力上升步驟,其係使上述第一區域對上述被黏著體之黏著力上升。With this specification, a method for manufacturing a laminated body including an adherend and an adhesive sheet partially covering the adherend is provided. The laminated body manufacturing method sequentially includes: an attaching step of attaching an adhesive sheet including a base material layer and an adhesive layer laminated on at least the surface of the adherend side of the base material layer to the adherend. A cutting step for cutting the boundary between the first region constituting the adhesive sheet and the second region not constituting the adhesive sheet in the adhesive sheet; a partial removing step for leaving the first region And peeling and removing the second region from the adherend on the adherend; and an adhesion increasing step, which increases the adhesion of the first region to the adherend.

根據上述製造方法,藉由依序實施上述貼附步驟、上述切割步驟及上述局部去除步驟,可高效率地獲得於被黏著體上形狀精度及位置精度良好地配置有第一區域之構成。又,由於在將第二區域自被黏著體剝離後使第一區域之黏著力上升,故而可製造上述第一區域牢固地接合於被黏著體之積層體,且於上述局部去除步驟中容易進行將第二區域自被黏著體剝離之操作。According to the manufacturing method, by performing the attaching step, the cutting step, and the partial removal step in this order, a configuration in which the first region is arranged on the adherend with good shape accuracy and position accuracy can be obtained efficiently. In addition, since the adhesive force of the first region is increased after the second region is peeled from the adherend, the laminated body in which the first region is firmly bonded to the adherend can be manufactured, and it is easy to perform in the partial removal step. The operation of peeling the second region from the adherend.

於此處所揭示之積層體製造方法之若干種態樣中,上述黏著力上升步驟可包含加熱處理。該態樣可使用顯示出黏著力藉由加熱而大幅地上升之性質之黏著片材良好地實施。作為此種黏著片材之例,可列舉具有如下黏著劑層之黏著片材,該黏著劑層含有玻璃轉移溫度未達0℃之聚合物A、及作為具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物的聚合物B,但並不限定於此。In some aspects of the laminated body manufacturing method disclosed herein, the above-mentioned step of increasing the adhesive force may include heat treatment. This aspect can be implemented favorably using an adhesive sheet which shows the property that adhesive force rises greatly by heating. Examples of such an adhesive sheet include an adhesive sheet having an adhesive layer containing a polymer A having a glass transition temperature of less than 0 ° C. and a monomer having a polyorganosiloxane frame The polymer B, which is a copolymer with a (meth) acrylic monomer, is not limited thereto.

於若干種態樣中,構成上述聚合物A之單體成分可含有N-乙烯基環狀醯胺。於使用如上所述含有N-乙烯基環狀醯胺作為構成單體成分之組成之聚合物A的黏著片材中,可良好地發揮黏著力藉由加熱而大幅地上升之性質。In several aspects, the monomer component constituting the polymer A described above may contain N-vinyl cyclic amidine. In the adhesive sheet using the polymer A containing the N-vinyl cyclic amidine as a constituent of the monomer as described above, the property that the adhesive force is greatly increased by heating can be exhibited well.

於此處所揭示之積層體製造方法之其他若干種態樣中,上述黏著力上升步驟可包含紫外線(UV)照射處理。該態樣可使用顯示出黏著力藉由UV照射而大幅地上升之性質之黏著片材良好地實施。作為此種黏著片材之一例,可列舉具有如下黏著劑層之黏著片材,該黏著劑層包含含有基礎聚合物與光硬化劑之光硬化性組合物,上述光硬化劑為多官能(甲基)丙烯酸酯,且上述光硬化劑之含量相對於上述基礎聚合物100重量份為1重量份以上且50重量份以下,但並不限定於此。In other aspects of the method for manufacturing a laminated body disclosed herein, the above-mentioned step of increasing the adhesive force may include ultraviolet (UV) irradiation treatment. This aspect can be implemented favorably using an adhesive sheet which exhibits the property that adhesive force rises greatly by UV irradiation. An example of such an adhesive sheet is an adhesive sheet having an adhesive layer containing a photocurable composition containing a base polymer and a photohardener, and the photohardener is a polyfunctional (form Acrylate), and the content of the photocuring agent is 1 part by weight or more and 50 parts by weight or less based on 100 parts by weight of the base polymer, but is not limited thereto.

於此處所揭示之任一積層體製造方法中,於上述黏著力上升步驟中,較佳為使上述黏著片材對上述被黏著體之黏著力上升至該步驟前之2倍以上。藉此,可良好地同時實現局部去除步驟中之第二區域自被黏著體之良好之剝離性與最終所獲得之積層體中之黏著片對被黏著體之較高之黏著力。In any of the laminated body manufacturing methods disclosed herein, in the step of increasing the adhesive force, it is preferable to increase the adhesive force of the adhesive sheet to the adherend to more than twice that before the step. Thereby, the good peelability of the second region from the adherend in the partial removal step and the higher adhesion force of the adhesive sheet in the laminated body finally obtained to the adherend can be well achieved at the same time.

上述局部去除步驟較佳為於上述黏著片材對上述被黏著體之黏著力超過2 N/25 mm之前進行。藉此,可更良好地抑制伴隨第二區域之剝離之被黏著體之損傷或變形。The partial removal step is preferably performed before the adhesive force of the adhesive sheet to the adherend exceeds 2 N / 25 mm. Thereby, damage or deformation of the adherend accompanying peeling of the second region can be more favorably suppressed.

上述黏著力上升步驟例如可為使上述第一區域之黏著片材對上述被黏著體之黏著力為3 N/25 mm以上之步驟。根據包括此種黏著力上升步驟之製造方法,可製造黏著片牢固地接合於被黏著體之積層體。The step of increasing the adhesive force may be, for example, a step of making the adhesive force of the adhesive sheet in the first region to the adherend to be 3 N / 25 mm or more. According to the manufacturing method including such an adhesive force raising step, a laminated body in which an adhesive sheet is firmly bonded to an adherend can be manufactured.

上述第二區域較佳為以其至少一端到達上述黏著片材之端之方式設定。藉此,可獲得於進行上述局部去除步驟時容易進行第二區域之拾取之優點。就提高拾取性之觀點而言,上述第二區域亦可為到達上述黏著片材之端之一端朝向該黏著片材之端變寬之形狀。The second region is preferably set such that at least one end thereof reaches the end of the adhesive sheet. Thereby, the advantage of being easy to pick up the second region when performing the above-mentioned partial removal step can be obtained. From the viewpoint of improving the pick-up property, the second region may have a shape in which one end of the end of the adhesive sheet is widened toward the end of the adhesive sheet.

此處所揭示之製造方法可以如下態樣良好地實施,即,將面積為2500 cm2 以上且短邊之長度為50 cm以上之黏著片材用於上述貼附步驟。於使用如上所述面積較大且寬度較寬之黏著片材之態樣中,可更有效地發揮藉由採用此處所揭示之製造方法所產生之優點。The manufacturing method disclosed herein can be implemented well in a manner that an adhesive sheet having an area of 2500 cm 2 or more and a short side length of 50 cm or more is used for the above-mentioned attaching step. In the case of using the adhesive sheet having a large area and a wide width as described above, the advantages produced by adopting the manufacturing method disclosed herein can be more effectively utilized.

此處所揭示之製造方法亦可為,作為上述貼附步驟所使用之上述黏著片材及上述被黏著體,使用包含複數個與上述積層體對應之單元者;作為於上述貼附步驟之後進行之步驟,進而包括將上述黏著片材及上述被黏著體分割成上述單元之分割步驟。藉由如此將包含複數個單元之黏著片材貼附於被黏著體後進行分割,可高效率地製造複數個積層體。再者,上述複數個單元之構成可相同亦可不同。The manufacturing method disclosed herein may also be one in which the above-mentioned adhesive sheet and the adherend used in the above-mentioned attaching step include a plurality of units corresponding to the above-mentioned laminated body; The step further includes a dividing step of dividing the adhesive sheet and the adherend into the units. By thus sticking an adhesive sheet including a plurality of cells to an adherend and then dividing, a plurality of laminated bodies can be manufactured with high efficiency. In addition, the configuration of the plurality of units may be the same or different.

根據本說明書,提供一種用以製造包含被黏著體及局部地積層於該被黏著體之黏著片之積層體的裝置。該裝置包含貼附黏著片材之貼附機構。又,上述裝置可包含對上述黏著片材實施切斷加工之切割機構。又,上述裝置可包含將上述第二區域剝離之剝離機構。又,上述裝置可包含對上述黏著片材賦予黏著力上升刺激之黏著力上升機構。使用具有此種構成之製造裝置,可良好地實施此處所揭示之任一積層體製造方法。According to the present specification, a device for manufacturing a laminated body including an adherend and an adhesive sheet partially laminated on the adherend is provided. The device includes an attachment mechanism for attaching an adhesive sheet. The device may include a cutting mechanism for cutting the adhesive sheet. The device may include a peeling mechanism for peeling the second region. The device may include an adhesive force increasing mechanism for applying an adhesive force increase stimulus to the adhesive sheet. By using a manufacturing apparatus having such a configuration, any of the laminated body manufacturing methods disclosed herein can be well implemented.

再者,將上述各要素適當組合者亦可包含於藉由本件專利申請案要求專利保護之發明之範圍。Furthermore, a proper combination of the above-mentioned elements may also be included in the scope of the invention claimed by the patent application.

以下,對本發明之較佳之實施形態進行說明。關於本說明書中特別言及之事項以外且實施本發明所需要之事項,業者可基於本說明書所記載之關於發明之實施之指示與申請時之技術常識而理解。本發明可基於本說明書所揭示之內容與該領域之技術常識而實施。
再者,於以下之圖式中,有對發揮相同作用之構件、部位標註相同符號進行說明之情況,有省略或簡化重複之說明之情況。又,圖式所記載之實施形態係為了清楚地說明本發明而模式化,未必準確地表示出實際之尺寸或比例尺。
Hereinafter, preferred embodiments of the present invention will be described. With regard to matters other than the matters specifically mentioned in this specification and necessary for the implementation of the present invention, the operator can understand based on the instructions on the implementation of the invention and the technical common sense at the time of application. The present invention can be implemented based on the contents disclosed in this specification and technical common sense in the field.
Furthermore, in the drawings below, members and parts that perform the same function may be described with the same reference numerals, and repeated descriptions may be omitted or simplified. In addition, the embodiments described in the drawings are modeled in order to clearly explain the present invention, and do not necessarily accurately indicate actual dimensions or scales.

<<積層體之製造方法>>
圖1係表示一實施形態之積層體製造方法之流程圖,圖2係表示藉由該方法所製造之積層體之立體圖,圖3係其III-III線之剖視圖。如圖2、3所示,藉由本實施形態所製造之積層體1包含被黏著體10及局部地覆蓋該被黏著體10之表面10A之黏著片21A、21B。黏著片21A、21B係藉由在將黏著片材20貼附於被黏著體10後,使該黏著片材20中之第一區域21殘留於被黏著體10上且將第二區域22自被黏著體10剝離去除,而由殘留於被黏著體10上之第一區域21所形成。黏著片材20具有於基材層202之單面積層有黏著劑層204之構成。
<< Manufacturing method of laminated body >>
FIG. 1 is a flowchart showing a method for manufacturing a laminated body according to an embodiment, FIG. 2 is a perspective view of a laminated body manufactured by the method, and FIG. 3 is a sectional view taken along line III-III. As shown in FIGS. 2 and 3, the laminated body 1 manufactured by this embodiment includes an adherend 10 and adhesive sheets 21A and 21B that partially cover the surface 10A of the adherend 10. The adhesive sheets 21A and 21B are obtained by attaching the adhesive sheet 20 to the adherend 10 so that the first region 21 in the adhesive sheet 20 remains on the adherend 10 and the second region 22 is self-coated. The adherend 10 is peeled and removed, and is formed by the first region 21 remaining on the adherend 10. The adhesive sheet 20 has a structure in which a single area layer of the base material layer 202 has an adhesive layer 204.

如圖1所示,本實施形態之積層體製造方法依序包括貼附步驟S10、切割步驟S20、局部去除步驟S30及黏著力上升步驟S40。
貼附步驟S10中,將黏著片材20貼附於被黏著體10。該步驟中所使用之黏著片材20包含:作為黏著片21A、21B含有於積層體1之構成要素中之區域即第一區域21、及不成為積層體1之構成要素且僅在積層體1之製造過程中使用之第二區域22。圖2所示之例中,於黏著片材20之寬度之大致中央設定有自該黏著片材20之長度方向之一端呈直線狀延伸至另一端的第二區域22。於貼附步驟S10所使用之黏著片材20中,第一區域21與第二區域22物理性地相連,可將該等區域21、22作為連續之黏著片材20對待。
As shown in FIG. 1, the laminated body manufacturing method of this embodiment includes an attaching step S10, a cutting step S20, a partial removing step S30, and an adhesive force increasing step S40 in this order.
In the attaching step S10, the adhesive sheet 20 is attached to the adherend 10. The adhesive sheet 20 used in this step includes: the first region 21 which is a region included in the constituent elements of the laminated body 1 as the adhesive sheets 21A and 21B, and the constituent elements which do not become the laminated body 1 and only in the laminated body 1 The second area 22 used in the manufacturing process. In the example shown in FIG. 2, a second region 22 extending linearly from one end in the longitudinal direction of the adhesive sheet 20 to the other end is set approximately at the center of the width of the adhesive sheet 20. In the adhesive sheet 20 used in the attaching step S10, the first region 21 and the second region 22 are physically connected, and these regions 21 and 22 can be treated as a continuous adhesive sheet 20.

切割步驟S20中,對貼附於被黏著體10之黏著片材20之第一區域21與第二區域22之邊界實施切斷加工。例如,如圖4所示,進行沿構成第一區域21與第二區域22之邊界之切斷預定線C照射雷射光L之雷射切斷。再者,圖4表示雷射切斷之例,但切斷加工之方法並無特別限定,可視目的或用途自公知之各種切斷方法中適當選擇。作為此種切斷方法之例,可列舉:CO2 雷射或YAG(Yttrium Aluminium Garnet,釔鋁石榴石)雷射等使用雷射光之雷射切斷;利用湯姆森刀、尖刀、旋轉刀、切刀(knife)等刀具之切斷;刀片(blade)切斷等,但並不限定於該等。切斷方法可單獨使用一種或組合兩種以上使用。In the cutting step S20, the boundary between the first region 21 and the second region 22 of the adhesive sheet 20 attached to the adherend 10 is cut. For example, as shown in FIG. 4, laser cutting is performed by irradiating laser light L along a planned cutting line C that constitutes a boundary between the first region 21 and the second region 22. In addition, FIG. 4 shows an example of laser cutting, but the method of cutting is not particularly limited, and it can be appropriately selected from various known cutting methods depending on the purpose or application. Examples of such a cutting method include a laser cutting using a laser light such as a CO 2 laser or a YAG (Yttrium Aluminium Garnet) laser; a Thomson knife, a sharp knife, a rotary knife, Cutting of knives such as knives; cutting of blades, etc., but not limited to these. The cutting method may be used alone or in combination of two or more.

於局部去除步驟S30中,使第一區域21殘留於被黏著體10上,並且將第二區域22自被黏著體10剝離去除。例如自黏著片材20之長度方向之一端朝向另一端剝離第二區域22。藉此,如圖2、3所示,形成由第一區域21所形成之黏著片21A、21B於被黏著體10上相互隔開地配置,於該等黏著片21A、21B之間露出被黏著體10的構造。In the partial removal step S30, the first region 21 is left on the adherend 10, and the second region 22 is peeled off and removed from the adherend 10. For example, the second region 22 is peeled from one end in the longitudinal direction of the adhesive sheet 20 toward the other end. Thereby, as shown in FIGS. 2 and 3, the adhesive sheets 21A and 21B formed by the first region 21 are arranged on the adherend 10 spaced apart from each other, and the adhesive sheets are exposed and adhered between the adhesive sheets 21A and 21B. The structure of the body 10.

繼而,於黏著力上升步驟S40中,對黏著片21A、21B賦予引起黏著力上升之刺激。藉此,使黏著片21A、21B對被黏著體10之黏著力上升,可獲得黏著片21A、21B牢固地接著於被黏著體10之積層體1。上述刺激之內容可根據所使用之黏著片材之類型等而適當選擇。上述刺激之例可包含加熱、活性光線之照射、加壓(press)等。該等刺激可單獨應用一種或組合兩種以上應用。Then, in the adhesive force increasing step S40, the adhesive sheet 21A, 21B is given a stimulus that causes the adhesive force to increase. Thereby, the adhesive force of the adhesive sheets 21A and 21B to the adherend 10 is increased, and the laminated body 1 in which the adhesive sheets 21A and 21B are firmly adhered to the adherend 10 can be obtained. The content of the above stimulus can be appropriately selected according to the type of the adhesive sheet used and the like. Examples of the stimulus may include heating, irradiation with active light, press, and the like. These stimuli can be applied alone or in combination of two or more.

本實施形態之積層體製造方法中,藉由在將黏著片材20貼附於被黏著體10後將該黏著片材20中之一部分、即第二區域22自被黏著體10剝離去除,而於被黏著體10上形成包含相互隔開地配置之兩片黏著片21A、21B之被覆圖案。根據該方法,可將積層體1中構成相互隔開之兩片黏著片21A、21B之第一區域21以一片黏著片材20之形態貼附於被黏著體10,且於貼附黏著片材20時,無需調整黏著片21A與黏著片21B之相對位置關係,藉此,積層體1之製造效率提高。又,由於在將黏著片材20貼附於被黏著體10後對該黏著片材20之第一區域21與第二區域22之邊界實施切斷處理,故而容易提高第一區域21之形狀精度或相對於被黏著體10之位置精度。例如,於貼附步驟S10中,黏著片材20相對於被黏著體10之貼附位置產生略微之偏移之情形、或者因溫度變化或內部應力之釋放等而導致黏著片材20產生略微之伸縮或變形之情形等時,亦可藉由調整切割步驟S20中之切斷處理之位置或形狀,而消除或減輕該等影響。In the method for manufacturing a laminated body according to this embodiment, a portion of the adhesive sheet 20, that is, the second region 22 is peeled off from the adherend 10 after the adhesive sheet 20 is attached to the adherend 10, and A coating pattern including two adhesive sheets 21A and 21B arranged at a distance from each other is formed on the adherend 10. According to this method, the first region 21 constituting the two adhesive sheets 21A and 21B separated from each other in the laminated body 1 can be attached to the adherend 10 in the form of an adhesive sheet 20, and the adhesive sheet can be attached. At 20 o'clock, there is no need to adjust the relative positional relationship between the adhesive sheet 21A and the adhesive sheet 21B, thereby improving the manufacturing efficiency of the laminated body 1. In addition, since the boundary between the first region 21 and the second region 22 of the adhesive sheet 20 is cut after the adhesive sheet 20 is attached to the adherend 10, it is easy to improve the shape accuracy of the first region 21. Or relative to the position accuracy of the adherend 10. For example, in the attaching step S10, the adhesive sheet 20 is slightly shifted from the attachment position of the adherend 10, or the adhesive sheet 20 is slightly changed due to temperature changes or the release of internal stress. In the case of expansion and contraction, etc., it is also possible to eliminate or reduce these effects by adjusting the position or shape of the cutting process in the cutting step S20.

於此處所揭示之積層體製造方法中,於將第二區域22自被黏著體10剝離去除後,進行提高黏著片21A、21B對被黏著體10之黏著力之黏著力上升步驟S40。提高黏著片21A、21B之黏著力就抑制於使用積層體1時因例如人之手接觸黏著片21A、21B等外力、被黏著體10之變形、或積層體1被暴露於風雨或溫度變化等環境要因等而導致黏著片21A、21B自被黏著體10剝離或隆起之現象的觀點而言較佳。另一方面,於局部去除步驟S30中,若第二區域22對被黏著體10之黏著性過高,則可能產生於第二區域22剝離時被黏著體10產生伸長等變形或表面剝離等損傷、或第二區域22於剝離中途破裂等不良情況。根據上述製造方法,藉由於將第二區域22自被黏著體10剝離後實施黏著力上升步驟S40,可製造黏著片21A、21B牢固地接合於被黏著體10之積層體1,且於局部去除步驟S20中容易進行將第二區域22自被黏著體10剝離之操作。In the laminated body manufacturing method disclosed herein, after the second region 22 is peeled off and removed from the adherend 10, an adhesion increasing step S40 is performed to increase the adhesion of the adhesive sheets 21A and 21B to the adherend 10. Increasing the adhesive force of the adhesive sheets 21A and 21B is suppressed when the laminated body 1 is used, for example, a person's hand contacts the external force such as the adhesive sheet 21A, 21B, the deformation of the adherend 10, or the laminated body 1 is exposed to wind and rain or temperature changes From the viewpoint of environmental factors, it is preferable that the adhesive sheets 21A and 21B peel off or bulge from the adherend 10. On the other hand, in the partial removal step S30, if the adhesion of the second region 22 to the adherend 10 is too high, deformation such as elongation or surface peeling of the adherend 10 may occur when the second region 22 is peeled off. Or the second region 22 is broken in the middle of peeling and the like. According to the above manufacturing method, by performing the adhesive force raising step S40 after the second region 22 is peeled from the adherend 10, the laminated sheet 1 that is firmly bonded to the adherend 10 can be manufactured and partially removed. In step S20, the operation of peeling the second region 22 from the adherend 10 is easily performed.

藉由此處所揭示之方法所製造之積層體中包含之黏著片係藉由黏著劑而接合於被黏著體。典型而言,上述黏著片包含基材層與黏著劑層,且經由上述黏著劑層將黏著片接合於被黏著體。如此於黏著力上升步驟後亦利用黏著劑將黏著片與被黏著體接合、即黏著劑維持所需之黏彈性就藉由此處所揭示之方法所製造之積層體之柔軟性、耐衝擊性、應力緩和性、低溫特性、被黏著體與黏著片之密接性等觀點而言較佳。The adhesive sheet contained in the laminated body manufactured by the method disclosed here is bonded to the adherend by an adhesive. Typically, the adhesive sheet includes a base material layer and an adhesive layer, and the adhesive sheet is bonded to the adherend via the adhesive layer. In this way, after the step of increasing the adhesive force, the adhesive sheet is also used to join the adherend with the adherend, that is, the adhesive maintains the required viscoelasticity. From the viewpoints of stress relaxation properties, low-temperature properties, and adhesion between the adherend and the adhesive sheet, it is preferable.

再者,於圖2所示之例中,以覆蓋被黏著體10之單側之整面(全部區域)之方式貼附與該被黏著體10大致相同尺寸之黏著片材20,但黏著片材對被黏著體10之貼附態樣並不限定於此。例如可以黏著片材僅覆蓋被黏著體之單側之局部區域之方式貼附,亦可以黏著片材之一部分自被黏著體伸出之方式貼附。又,於貼附步驟S10所使用之黏著片材中,第一區域與第二區域只要以可將該等區域作為連續之片材操作之程度相連即可,於該範圍內,可在第一區域與第二區域之邊界設置有切縫(穿孔等)、半切等切斷輔助構造。此處,所謂半切係指不將黏著片材於厚度方向上貫通之深度之切口,典型而言,以不將基材層於厚度方向上貫通之深度之切口之形式形成。此種切口例如可藉由使加工刀自基材層之背面(與積層黏著劑層之側相反之側)進入至未貫通該基材層之深度而形成。於一態樣中,就提高黏著片材之操作性或降低製造成本等觀點而言,可良好地使用未於第一區域與第二區域之邊界設置切斷輔助構造之黏著片材。又,亦可於貼附步驟S10所使用之黏著片材設置有助於該黏著片材與被黏著體之位置對準之記號。上述記號可為如貫通孔、切口、凹陷等之構造性記號,可為由能夠進行光學檢測之標記(例如印刷或著色)等所形成之視覺性記號,亦可為基於不同構件之配置(例如識別標籤之貼附、能夠發送或反射信號之元件之固定)者。此種記號可設置於第一區域及第二區域之一者或兩者,亦可設置於第一區域與第二區域之邊界。Furthermore, in the example shown in FIG. 2, the adhesive sheet 20 having the same size as the adherend 10 is attached so as to cover the entire surface (the entire area) of one side of the adherend 10, but the adhesive sheet The attachment state of the material to the adherend 10 is not limited to this. For example, the adhesive sheet may be attached in such a manner as to cover only a partial area on one side of the adherend, or may be attached in such a manner that a part of the adhesive sheet protrudes from the adherend. In addition, in the adhesive sheet used in the attaching step S10, the first region and the second region need only be connected to such an extent that the regions can be operated as a continuous sheet. Within this range, the first region and the second region can be connected. A cutting auxiliary structure such as a slit (perforation or the like) or a half cut is provided at the boundary between the area and the second area. Here, the half cut refers to a cut of a depth that does not penetrate the adhesive sheet in the thickness direction, and is typically formed as a cut of a depth that does not penetrate the base material layer in the thickness direction. Such a cut can be formed, for example, by making a processing blade from the back surface of the base material layer (the side opposite to the side of the laminated adhesive layer) to a depth that does not penetrate the base material layer. In one aspect, from the viewpoints of improving the operability of the adhesive sheet or reducing the manufacturing cost, the adhesive sheet having no cutting auxiliary structure provided at the boundary between the first region and the second region can be used well. In addition, a mark may be provided on the adhesive sheet used in the attaching step S10 to help align the position of the adhesive sheet with the adherend. The above marks may be structural marks such as through holes, cutouts, depressions, etc., may be visual marks formed by marks (such as printing or coloring) that can be optically inspected, or they may be based on the configuration of different components (for example, Identification of the attachment of labels, fixation of components capable of transmitting or reflecting signals). Such a mark may be provided at one or both of the first area and the second area, or may be provided at a boundary between the first area and the second area.

又,於圖4所示之例中,切割步驟S20中,以貫通黏著片材至被黏著體表面之深度實施連續之線狀之切斷加工,但切斷加工之態樣並不限定於此。例如,亦可以可適當地實施局部去除步驟S30之限度將切割步驟S20後之第一區域與第二區域局部地相連。作為此種切斷加工之例,可列舉:穿孔等不連續之切斷加工、半切加工、將穿孔與半切組合之加工(例如交替地重複貫通基材層之切縫與不貫通該基材層之深度之切口之態樣之切斷加工)等。又,上述切斷加工可以貫通黏著片材至被黏著體表面之深度進行,亦可以貫通黏著片材且進而自被黏著體之表面到達一部分深度為止之方式進行,亦可以不貫通黏著片材之深度(即半切)進行。於此處所揭示之製造方法中,與黏著力上升步驟後相比,於該步驟前,黏著力得到抑制,因此較佳為以將第一區域與第二區域完全分離之方式進行切斷加工至至少貫通基材層之深度為止。該情況就提高局部去除步驟S30中之第二區域之拾取性、第一區域之隆起或偏移防止性、提高第一區域之外形精度等觀點而言可能變得有利。In the example shown in FIG. 4, in the cutting step S20, a continuous linear cutting process is performed at a depth penetrating the adhesive sheet to the surface of the adherend, but the cutting process is not limited to this. . For example, the first region and the second region after the cutting step S20 may be partially connected to each other by appropriately implementing the limit of the partial removal step S30. Examples of such cutting processing include discontinuous cutting processing such as perforation, half-cut processing, and processing that combines perforation and half-cut (for example, alternately repeating the slits that penetrate through the substrate layer and the substrate layer that does not penetrate) Depth of the cutting process). In addition, the cutting process may be performed through the depth of the adhesive sheet to the surface of the adherend, or may be performed through the adhesive sheet and further from the surface of the adherend to a certain depth, or may not be penetrated through the adhesive sheet. Depth (ie half cut). In the manufacturing method disclosed here, the adhesion is suppressed before the step compared to after the step of increasing the adhesive force, so it is preferable to perform the cutting process to completely separate the first region from the second region to At least to the depth of the substrate layer. This case may become advantageous from the viewpoints of improving the picking property of the second region in the partial removal step S30, preventing the bulge or offset of the first region, and improving the outer shape accuracy of the first region.

於圖4所示之例中,呈直線狀延伸之第二區域之一端及另一端到達黏著片材之端。如此以第二區域之至少一端到達黏著片材之端之方式設定該第二區域就局部去除步驟S30中之第二區域之拾取性之觀點而言較佳。於第二區域未到達黏著片材之端之態樣中,例如可藉由在第二區域之一端,於該第二區域之背面貼附強黏著性之黏著帶並提拉而進行第二區域之拾取。該拾取方法亦可用於第二區域之至少一端到達黏著片材之端之態樣。於此處所揭示之積層體製造方法中,與黏著力上升步驟後相比,黏著力上升步驟前之黏著力得到抑制就如上所述藉由貼附黏著帶並提拉之方法提高第二區域之拾取性之觀點而言有利。In the example shown in FIG. 4, one end and the other end of the second region extending linearly reach the end of the adhesive sheet. Setting the second area in such a manner that at least one end of the second area reaches the end of the adhesive sheet is preferable from the viewpoint of partially removing the picking property of the second area in step S30. In the state where the second region does not reach the end of the adhesive sheet, for example, the second region can be carried out by attaching a strong adhesive tape on the back of the second region at one end of the second region and pulling up. Of pickup. This picking method can also be used in a state where at least one end of the second region reaches the end of the adhesive sheet. In the laminated body manufacturing method disclosed herein, compared with after the adhesion increasing step, the adhesion before the adhesion increasing step is suppressed. As described above, the method of improving the second region by attaching the adhesive tape and pulling up is used. It is advantageous in terms of pickup.

於以第二區域到達黏著片材之端之方式設定之態樣中,就拾取性之觀點而言,上述第二區域到達上述黏著片材之端之寬度較佳為設為0.2 mm以上,可為0.5 mm以上,亦可為1 mm以上。為了提高拾取性,亦可構成為,於第二區域到達黏著片材之端之附近,該第二區域之寬度擴大。又,就包含藉由此處所揭示之製造方法所獲得之積層體之製品(電子裝置等)之小型化之觀點而言,上述第二區域到達上述黏著片材之端之寬度較佳為設為10 mm以下,進而較佳為設為8 mm以下。In the aspect set in such a way that the second region reaches the end of the adhesive sheet, from the standpoint of pickup, the width of the second region reaching the end of the adhesive sheet is preferably set to 0.2 mm or more, but It is 0.5 mm or more, or 1 mm or more. In order to improve the picking property, the width of the second region may be increased when the second region reaches the vicinity of the end of the adhesive sheet. Further, from the viewpoint of miniaturization of a product (electronic device, etc.) including the laminated body obtained by the manufacturing method disclosed herein, the width of the second region reaching the end of the adhesive sheet is preferably set to 10 mm or less, more preferably 8 mm or less.

於黏著力上升步驟中,使黏著力上升之程度並無特別限定,與該步驟前之黏著力相比,該步驟後之黏著力或經由該步驟所獲得之積層體之黏著力相對變高即可。於若干種態樣中,黏著力上升步驟較佳為以該步驟前之對被黏著體之黏著力A0 [N/25 mm]與該步驟後之對被黏著體之黏著力A1 [N/25 mm]的關係滿足比(A1 /A0 )≧2之方式進行。即,於黏著力上升步驟中,較佳為使黏著片材對被黏著體之黏著力上升至該步驟前之2倍以上。根據此種黏著力上升步驟,有良好地同時實現局部去除步驟中之第二區域之去除容易性與所製造之積層體之黏著片對被黏著體之強黏著性之傾向。於若干種態樣中,上述比(A1 /A0 )例如可為3以上,可為5以上,亦可為10以上。上述比(A1 /A0 )之上限並無特別限制,就抑制黏著力上升步驟前之第一區域之位置偏移或隆起之觀點而言,通常較佳為10000以下、5000以下或2000以下。上述黏著力A0 、A1 之各者可藉由依據JIS Z0237,於23℃、50%RH之環境下,於剝離角度180度、拉伸速度300 mm/min之條件下,測定黏著片材自被黏著體之剝離強度而把握。In the step of increasing the adhesive force, the degree of increasing the adhesive force is not particularly limited. Compared with the adhesive force before the step, the adhesive force after the step or the adhesive force of the laminated body obtained through the step becomes relatively high, that is, can. In several aspects, the step of increasing the adhesion force is preferably the adhesion force A 0 [N / 25 mm] to the adherend before the step and the adhesion force A 1 [N to the adherend after the step. / 25 mm] is performed in such a way that the ratio (A 1 / A 0 ) ≧ 2 is satisfied. That is, in the step of increasing the adhesive force, it is preferable to increase the adhesive force of the adhesive sheet to the adherend to be twice or more before the step. According to this step of increasing the adhesive force, there is a tendency that both the ease of removal of the second region in the partial removal step and the strong adhesion of the manufactured adhesive sheet of the laminated body to the adherend are achieved simultaneously. In several aspects, the ratio (A 1 / A 0 ) may be, for example, 3 or more, 5 or more, or 10 or more. The upper limit of the above ratio (A 1 / A 0 ) is not particularly limited, and from the viewpoint of suppressing the positional shift or bulge of the first region before the step of increasing the adhesive force, it is generally preferably 10,000 or less, 5000 or less, or 2000 or less . Each of the above-mentioned adhesive forces A 0 and A 1 can be measured in accordance with JIS Z0237 at 23 ° C. and 50% RH at a peeling angle of 180 degrees and a stretching speed of 300 mm / min. Grasp the peel strength of the adherend.

再者,亦考慮藉由所使用之黏著片材之選擇,於貼附於被黏著體進行局部去除步驟後,藉由於室溫下長時間放置而使對上述被黏著體之黏著力大幅地上升。但是,該態樣為了使黏著片牢固地接合於積層體而需要較長時間,因此不利於提高該積層體之生產性。根據此處所揭示之積層體製造方法,藉由於進行局部去除步驟後進行使黏著力刻意地上升之黏著力上升步驟,可高效率地獲得目標之積層體。就上述生產性之觀點而言,進行黏著力上升步驟之時間較佳可為48小時以下,更佳可為24小時以下,進而較佳可為12小時以下,尤佳可為6小時以下,最佳可為1小時以下。Furthermore, it is also considered that by using the selection of the adhesive sheet, after the partial removal step is attached to the adherend, the adhesion to the adherend is greatly increased by being left at room temperature for a long time. . However, in this aspect, it takes a long time for the adhesive sheet to be firmly bonded to the laminated body, and therefore it is not conducive to improving the productivity of the laminated body. According to the method for manufacturing a laminated body disclosed herein, a target laminated body can be obtained efficiently by performing an adhesive force increasing step for intentionally increasing the adhesive force after performing the partial removal step. From the viewpoint of the above productivity, the time for performing the adhesion increasing step is preferably 48 hours or less, more preferably 24 hours or less, even more preferably 12 hours or less, and even more preferably 6 hours or less. Good is less than 1 hour.

就第二區域之剝離容易性之觀點而言,局部去除步驟時之黏著片材對被黏著體之黏著力AP 較佳為2 N/25 mm以下,但並無特別限定。即,局部去除步驟較佳為於貼附步驟中,貼附於被黏著體之黏著片材對上述被黏著體之黏著力超過2 N/25 mm之前(換言之,於貼附後黏著力被抑制為2 N/25 mm以下之期間)進行。於若干種態樣中,黏著力AP 例如可未達2 N/25 mm,可未達1.5 N/25 mm,可為1.3 N/25 mm以下,可為1 N/25 mm以下,亦可為0.8 N/25 mm以下。黏著力AP 之下限並無特別限制,就抑制切割步驟或局部去除步驟中之第一區域之位置偏移或隆起之觀點而言,例如可為0.005 N/25 mm以上,可為0.01 N/25 mm以上,可為0.05 N/25 mm以上,可為0.1 N/25 mm以上,亦可為0.2 N/25 mm以上。The second area to release the viewpoint of easiness, the adhesive sheet when the step of partially removing the adhesive force P A is the body of the adhesive is preferably 2 N / 25 mm or less, but not particularly limited. That is, the partial removal step is preferably in the attaching step, before the adhesive force of the adhesive sheet attached to the adherend to the adherend exceeds 2 N / 25 mm (in other words, the adhesive force is suppressed after attaching). 2 N / 25 mm or less). In several aspects, the adhesion A P may be less than 2 N / 25 mm, may be less than 1.5 N / 25 mm, may be less than 1.3 N / 25 mm, and may be less than 1 N / 25 mm. 0.8 N / 25 mm or less. The lower limit of the adhesive force A P is not particularly limited. From the viewpoint of suppressing the position shift or bulging of the first region in the cutting step or the partial removal step, for example, it may be 0.005 N / 25 mm or more, and may be 0.01 N / 25 mm or more, 0.05 N / 25 mm or more, 0.1 N / 25 mm or more, or 0.2 N / 25 mm or more.

再者,黏著力上升步驟前之黏著片材對被黏著體之黏著力A0 例如可為與上述局部去除步驟時之黏著力AP 大致相同之程度。因此,上述所例示之黏著力AP 之各上限值及各下限值亦可分別獨立地應用於黏著力A0 可採用之上限值及下限值之各者。又,上述所例示之黏著力AP 之各上限值及下限值亦可分別獨立地應用於下述初期黏著力B0 可採用之上限值及下限值之各者。In addition, the adhesive force A 0 of the adhesive sheet before the adhesive force increasing step to the adherend may be, for example, approximately the same as the adhesive force A P in the local removal step. Therefore, each of the upper limit value and lower limit value of the adhesive force A P exemplified above can also be independently applied to each of the upper limit value and the lower limit value of the adhesive force A 0 . Further, each of the upper limit value and the lower limit of the above-exemplified adhesion of A P may be applied independently to each of the following initial adhesion on B 0 may be used by each of the limit value and the lower limit.

於藉由此處所揭示之方法所製造之積層體中,黏著片對被黏著體之黏著力AF 例如可為3 N/25 mm以上,可為5 N/25 mm以上,可為7 N/25 mm以上,可為10 N/25 mm以上,亦可為12 N/25 mm以上,但並無特別限定。就抑制使用上述積層體時之黏著片自被黏著體之剝離或隆起之觀點而言,較佳為黏著力AF 較高。黏著力AF 之上限並無特別限制。就容易兼顧到局部去除步驟中之第二區域之剝離容易性之觀點而言,於若干種態樣中,黏著力AF 例如可為50 N/25 mm以下,可為40 N/25 mm以下,可為35 N/25 mm以下,亦可為30 N/25 mm以下。In the laminated body manufactured by the method disclosed herein, the adhesion force A F of the adhesive sheet to the adherend may be, for example, 3 N / 25 mm or more, 5 N / 25 mm or more, and 7 N / 25 mm or more, 10 N / 25 mm or more, and 12 N / 25 mm or more are not particularly limited. From the viewpoint of suppressing the peeling or bulging of the adhesive sheet from the adherend when the laminated body is used, the adhesive force A F is preferably high. The upper limit of the adhesive force A F is not particularly limited. From the viewpoint of easily taking into account the ease of peeling of the second region in the partial removal step, the adhesive force A F may be, for example, 50 N / 25 mm or less and 40 N / 25 mm or less in several aspects. , Can be 35 N / 25 mm or less, or 30 N / 25 mm or less.

再者,黏著力上升步驟後之黏著片材對被黏著體之黏著力A1 [N/25 mm]例如可為與所製造之積層體之黏著片對被黏著體之黏著力AF 大致相同之程度。因此,上述所例示之黏著力AF 之各上限值及各下限值亦可分別獨立地應用於黏著力A1 可採用之上限值及下限值之各者。又,上述所例示之黏著力AF 之各上限值及下限值亦可分別獨立地應用於下述刺激後黏著力B1 可採用之上限值及下限值之各者。Furthermore, the adhesive force A 1 [N / 25 mm] of the adhesive sheet to the adherend after the step of increasing the adhesive force may be, for example, approximately the same as the adhesive force A F of the laminated sheet to the adherend. Degree. Therefore, the upper limit values and lower limit values of the adhesive force A F exemplified above can also be independently applied to each of the upper limit value and the lower limit value of the adhesive force A 1 . In addition, each of the upper limit value and the lower limit value of the adhesive force A F exemplified above may be independently applied to each of the upper limit value and the lower limit value of the adhesive force B 1 after the stimulation described below.

黏著力上升步驟中對黏著片材賦予之刺激之內容例如可以如下方式設定,即,以所使用之黏著片材對聚醯亞胺之初期黏著力B0 相對於刺激後黏著力B1 的比之形式定義之黏著力上升比(B1 /B0 )滿足特定之目標值。初期黏著力B0 及刺激後黏著力B1 係藉由下述實施例所記載之方法進行測定。The content of the stimulus imparted to the adhesive sheet in the step of increasing the adhesive force can be set, for example, as follows: the ratio of the initial adhesive force B 0 of the used adhesive sheet to polyimide to the adhesive force B 1 after the stimulation The adhesion rise ratio (B 1 / B 0 ) defined by the form satisfies a specific target value. The initial adhesive force B 0 and the post-stimulation adhesive force B 1 were measured by the methods described in the following examples.

於此處所揭示之製造方法中,黏著力上升步驟較佳為以黏著力上升比(B1 /B0 )成為例如2以上之方式進行,更佳為以黏著力上升比(B1 /B0 )成為3以上、5以上、10以上或15以上之方式進行。又,就減輕對黏著片材及被黏著體施加之負載或提高積層體之生產性之觀點而言,黏著力上升步驟可以黏著力上升比(B1 /B0 )成為約10000以下、5000以下或2000以下之方式實施。於若干種態樣中,黏著力上升比(B1 /B0 )例如可為1000以下,可為500以下,可為200以下,亦可為100以下。In the manufacturing method disclosed herein, the step of increasing the adhesive force is preferably performed such that the ratio of increasing the adhesive force (B 1 / B 0 ) becomes, for example, 2 or more, and more preferably, the ratio of increasing the adhesive force (B 1 / B 0 ) Is performed in a manner of 3 or more, 5 or more, 10 or more, or 15 or more. In addition, from the viewpoint of reducing the load applied to the adhesive sheet and the adherend or improving the productivity of the laminated body, the adhesive force increasing step can increase the adhesive force increasing ratio (B 1 / B 0 ) to approximately 10,000 or less and 5,000 or less. Or the implementation below 2000. In several aspects, the adhesion increase ratio (B 1 / B 0 ) may be, for example, 1,000 or less, 500 or less, 200 or less, or 100 or less.

又,於可撓性顯示面板、可撓性印刷配線板(FPC)、將顯示面板與配線板一體化而成之裝置等中,使用可撓性基板材料,就耐熱性或尺寸穩定性之觀點而言,多數情況下使用聚醯亞胺膜作為上述基板材料。對於聚醯亞胺顯示上述黏著力B0 、B1 或黏著力上升比(B1 /B0 )之黏著片材係以將聚醯亞胺作為被黏著體之態樣用於積層體之製造,於局部去除步驟中,第二區域之剝離作業性良好,且於黏著力上升步驟後或製造之積層體中可發揮與被黏著體之接著可靠性優異之性質。利用該性質,可高精度且高效率地形成FPC之膜覆蓋層。因此,此處所揭示之方法例如可良好地應用於具備膜覆蓋層之FPC之製造。In addition, in a flexible display panel, a flexible printed wiring board (FPC), and a device in which a display panel and a wiring board are integrated, a flexible substrate material is used in terms of heat resistance or dimensional stability. In many cases, a polyimide film is used as the substrate material. For polyimide, the adhesive sheet exhibiting the above-mentioned adhesive force B 0 , B 1 or the increase ratio of adhesive force (B 1 / B 0 ) is used in the manufacture of a laminated body with polyimide as an adherend. In the partial removal step, the peeling workability of the second region is good, and after the step of increasing the adhesive force or in the manufactured laminated body, the property of excellent adhesion with the adherend can be exhibited. By using this property, a film cover layer of FPC can be formed with high accuracy and efficiency. Therefore, the method disclosed herein can be favorably applied to, for example, the production of an FPC provided with a film cover layer.

於黏著力上升步驟中進行加熱作為對黏著片材賦予之刺激之情形時之加熱溫度並無特別限定,可考慮作業性、經濟性、黏著片材中可包含之基材層或被黏著體之耐熱性等而進行設定。上述加熱溫度例如可未達150℃,可為120℃以下,可為100℃以下,可為80℃以下,亦可為70℃以下。又,上述加熱溫度例如可設為40℃以上、50℃以上或60℃以上,可設為80℃以上,亦可設為100℃以上。根據更高之加熱溫度,可藉由更短時間之處理使黏著力上升。加熱時間並無特別限定,例如可為1小時以下,可為30分鐘以下,可為10分鐘以下,亦可為5分鐘以下。或者,亦可以黏著片材或被黏著體不會產生顯著之熱劣化之限度,進行更長時間之(例如2小時以上、5小時以上等之)加熱處理。再者,加熱處理可一次進行,亦可分為複數次進行。The heating temperature in the case where heating is performed in the step of increasing the adhesive force as a stimulus to the adhesive sheet is not particularly limited, and workability, economy, and the base material layer or the adherend that can be included in the adhesive sheet can be considered. The heat resistance is set. The heating temperature may be, for example, less than 150 ° C, 120 ° C or lower, 100 ° C or lower, 80 ° C or lower, or 70 ° C or lower. The heating temperature may be, for example, 40 ° C. or higher, 50 ° C. or higher, or 60 ° C. or higher, 80 ° C. or higher, or 100 ° C. or higher. According to the higher heating temperature, the adhesive force can be increased by a shorter processing time. The heating time is not particularly limited, and may be, for example, 1 hour or less, 30 minutes or less, 10 minutes or less, or 5 minutes or less. Alternatively, the adhesive sheet or the adherend may be heat-treated for a longer period of time (for example, 2 hours or longer, 5 hours or longer, etc.) to the extent that no significant thermal degradation occurs. The heat treatment may be performed once or may be performed in a plurality of times.

貼附步驟所使用之黏著片材可於一片黏著片材中僅包含一個成為構成積層體之黏著片之區域(第一區域),例如可如圖2所示包含相互隔開之兩個第一區域,亦可包含三個以上之第一區域。於一片黏著片材包含複數個第一區域之情形時,該等第一區域之形狀可相同亦可不同。同樣地,貼附步驟所使用之黏著片材於一片黏著片材中,例如可如圖4所示僅包含一個局部去除步驟中會被剝離去除之第二區域,亦可包含兩個以上或三個以上。於一片黏著片材包含複數個第二區域之情形時,該等第二區域之形狀可相同亦可不同。The adhesive sheet used in the attaching step may include only one region (the first region) in an adhesive sheet that becomes the adhesive sheet constituting the laminated body. For example, as shown in FIG. 2, it may include two first regions separated from each other. The region may also include three or more first regions. In the case where a piece of adhesive sheet includes a plurality of first regions, the shapes of the first regions may be the same or different. Similarly, the adhesive sheet used in the attaching step is contained in one adhesive sheet, for example, as shown in FIG. 4, it may include only a second region that is peeled off during the partial removal step, and may also include two or more or three More than. When a piece of adhesive sheet includes a plurality of second regions, the shapes of the second regions may be the same or different.

於若干種態樣之積層體製造方法中,作為貼附步驟所使用之黏著片材及被黏著體,可使用包含複數個與藉由該方法所製造之積層體對應之單元者。該態樣可進而包括將上述黏著片材及上述被黏著體分割為上述單元之分割步驟作為上述貼附步驟之後進行之步驟。上述分割步驟可於進行貼附步驟後於任意之時期進行。例如,可藉由在至少結束切割步驟後進行分割步驟,而針對複數個單元統一進行切割步驟。此處所揭示之製造方法例如可以(a)於切割步驟與局部去除步驟之間、(b)於局部去除步驟與黏著力上升步驟之間、(c)於黏著力上升步驟之後等任一階段進而包括上述分割步驟的態樣實施。亦可使用上述(a)~(c)之態樣之一種或組合兩種以上。再者,上述態樣(a)例如可使用具備下述黏著劑層(2)之黏著片材良好地實施。上述態樣(b)或上述態樣(c)例如可使用具備下述黏著劑層(1)或黏著劑層(2)之黏著片材良好地實施。In several methods of manufacturing a laminated body, as the adhesive sheet and the adherend used in the attaching step, a plurality of units corresponding to the laminated body manufactured by the method can be used. This aspect may further include a step of dividing the adhesive sheet and the adherend into the units as a step performed after the attaching step. The above-mentioned dividing step may be performed at an arbitrary time after performing the attaching step. For example, the cutting step can be performed for a plurality of cells by performing the dividing step after at least the cutting step is ended. The manufacturing method disclosed herein can be performed at any stage such as (a) between the cutting step and the partial removal step, (b) between the partial removal step and the adhesion increasing step, and (c) after the adhesion increasing step. Implementation including the above-mentioned segmentation steps. One of the aspects (a) to (c) described above may be used or a combination of two or more may be used. Moreover, the said aspect (a) can be implemented favorably using the adhesive sheet provided with the following adhesive layer (2), for example. The said aspect (b) or said aspect (c) can be implemented favorably using the adhesive sheet provided with the following adhesive layer (1) or adhesive layer (2), for example.

<<製造裝置>>
此處所揭示之積層體製造方法例如可使用積層體製造裝置50實施,該積層體製造裝置50如圖5所示,具備:貼附機構51,其將黏著片材20貼附於被黏著體10;切割機構52,其對黏著片材20之第一區域21與第二區域22之邊界實施切斷加工;剝離機構53,其使第一區域21殘留於被黏著體10上並且將第二區域22自被黏著體10剝離去除;及黏著力上升機構54,其對第一區域21賦予可使其黏著力上升之刺激。又,包括分割步驟之態樣之積層體製造方法所使用之製造裝置可進而包含未圖示之分割機構。
<< Manufacture Equipment >>
The laminated body manufacturing method disclosed herein can be implemented, for example, using a laminated body manufacturing apparatus 50. As shown in FIG. 5, the laminated body manufacturing apparatus 50 includes an attachment mechanism 51 that attaches an adhesive sheet 20 to an adherend 10 A cutting mechanism 52 that cuts the boundary between the first region 21 and the second region 22 of the adhesive sheet 20; a peeling mechanism 53 that causes the first region 21 to remain on the adherend 10 and the second region 22 is peeled and removed from the adherend 10; and an adhesive force increasing mechanism 54 imparts a stimulus to the first region 21 to increase its adhesive force. Moreover, the manufacturing apparatus used for the laminated body manufacturing method which includes the aspect of a division process may further include the division mechanism which is not shown in figure.

貼附機構51以可實施此處所揭示之任一製造方法中之貼附步驟之方式構成,例如可包含被黏著體供給部件、黏著片材供給部件、黏著片材對被黏著體之壓接部件等之一種或兩種以上。切割機構52以可實施此處所揭示之任一製造方法中之切割步驟之方式構成,可包含如上述所例示之切斷部件之一種或兩種以上。剝離機構53以可實施此處所揭示之任一方法中之局部去除步驟之方式構成,例如可包含第二區域之拾取部件、保持部件、剝離部件等之一種或兩種以上。黏著力上升機構54構成為,藉由對黏著片材提供可使該黏著片材之黏著力上升之刺激,而可實施此處所揭示之任一方法中之黏著力上升步驟。黏著力上升機構54例如可包含UV照射部件(UV照射燈、光路調整用鏡等)、加熱部件(熱風加熱器、紅外線加熱器、電熱器等)、加壓部件等之一種或兩種以上。又,上述分割機構可構成為,可使用利用湯姆森刀或尖刀、旋轉刀、切刀(knife)等之切斷、或雷射切斷、噴水式切斷、刀片(blade)切斷等公知之分割方法實施分割步驟。The attaching mechanism 51 is constituted so as to be able to perform the attaching step in any of the manufacturing methods disclosed herein, and may include, for example, an adherend supply member, an adhesive sheet supply member, and a pressure-contact member of the adhesive sheet to the adherend. Wait for one or two or more. The cutting mechanism 52 is configured so that the cutting step in any of the manufacturing methods disclosed herein can be performed, and may include one or two or more cutting members as exemplified above. The peeling mechanism 53 is configured to perform a partial removal step in any of the methods disclosed herein, and may include, for example, one or two or more of a pickup member, a holding member, a peeling member, and the like in the second region. The adhesive force increasing mechanism 54 is configured to perform an adhesive force raising step in any of the methods disclosed herein by providing an stimulus to the adhesive sheet to increase the adhesive force of the adhesive sheet. The adhesive force raising mechanism 54 may include, for example, one or two or more of a UV irradiating member (a UV irradiating lamp, a mirror for adjusting an optical path, etc.), a heating member (a hot air heater, an infrared heater, an electric heater, etc.), and a pressure member. In addition, the division mechanism may be configured to use a known cutting method such as a Thomson knife, a sharp knife, a rotary knife, a knife, or the like, or a laser cutting method, a water jet cutting method, or a blade cutting method. The division method implements a division step.

<<黏著片材>>
以下,對可良好地用以實施此處所揭示之積層體製造方法的黏著片材之若干例進行說明,但並非意欲限定本發明之範圍。
<< Adhesive sheet >>
In the following, some examples of the adhesive sheet that can be suitably used to implement the laminated body manufacturing method disclosed herein are described, but it is not intended to limit the scope of the present invention.

此處所揭示之積層體製造方法可使用包含基材層與積層於該基材層之至少被黏著體側之黏著劑層的構成之黏著片材良好地實施。根據黏著劑層積層於基材層之構成之黏著片材,可藉由上述基材層補強黏著劑層,因此於局部去除步驟中容易自被黏著體剝離第二區域。The laminated body manufacturing method disclosed here can be favorably implemented using an adhesive sheet comprising a base material layer and an adhesive layer laminated on at least the adherend side of the base material layer. According to the adhesive sheet composed of the adhesive layer laminated on the base material layer, the adhesive layer can be reinforced by the aforementioned base material layer, so it is easy to peel off the second region from the adherend in the partial removal step.

<基材層>
作為上述基材層,可良好地使用各種膜基材。上述膜基材可如發泡體膜或不織布片材等般為多孔質基材,可為非多孔質基材,亦可為多孔質層與非多孔質層積層而成之構造之基材。於若干種態樣中,作為上述膜基材,可良好地使用含有能夠獨立地維持形狀之(自立型或非依存性之)樹脂膜作為基底膜者。此處所謂「樹脂膜」,意指為非多孔質構造且典型而言實質上不包含氣泡之(無空隙之)樹脂膜。因此,上述樹脂膜之概念區別於發泡體膜或不織布。上述樹脂膜可為單層構造,亦可為兩層以上之多層構造(例如三層構造)。
< Base material layer >
As the base material layer, various film base materials can be favorably used. The film substrate may be a porous substrate such as a foam film or a nonwoven fabric sheet, may be a non-porous substrate, or may be a substrate having a structure in which a porous layer and a non-porous layer are laminated. In several aspects, as the above-mentioned film base material, those containing a resin film (self-supporting or non-dependent) capable of independently maintaining the shape can be favorably used as the base film. The "resin film" herein means a resin film having a non-porous structure and typically does not substantially contain air bubbles (no voids). Therefore, the concept of the resin film is different from a foam film or a nonwoven fabric. The resin film may have a single-layer structure or a multilayer structure with two or more layers (for example, a three-layer structure).

作為構成樹脂膜之樹脂材料,例如可使用:聚酯、聚烯烴、尼龍6、尼龍66、部分芳香族聚醯胺等聚醯胺(PA)、聚醯亞胺(PI)、聚醯胺醯亞胺(PAI)、聚醚醚酮(PEEK)、聚醚碸(PES)、聚苯硫醚(PPS)、聚碳酸酯(PC)、聚胺基甲酸酯(PU)、乙烯-乙酸乙烯酯共聚物(EVA)、聚四氟乙烯(PTFE)等氟樹脂、丙烯酸系樹脂、聚丙烯酸酯、聚苯乙烯、聚氯乙烯、聚偏二氯乙烯等樹脂。As the resin material constituting the resin film, for example, polyester, polyolefin, nylon 6, nylon 66, partially aromatic polyamide (PA), polyimide (PI), polyimide, etc. can be used. Imine (PAI), polyetheretherketone (PEEK), polyetherether (PES), polyphenylene sulfide (PPS), polycarbonate (PC), polyurethane (PU), ethylene-vinyl acetate Ester copolymer (EVA), fluororesin such as polytetrafluoroethylene (PTFE), acrylic resin, polyacrylate, polystyrene, polyvinyl chloride, polyvinylidene chloride and other resins.

上述樹脂膜可為使用單獨含有此種樹脂之一種之樹脂材料所形成者,亦可為使用摻合有兩種以上之樹脂材料所形成者。上述樹脂膜可未經延伸,亦可為經延伸(例如單軸延伸或雙軸延伸)者。例如可良好地使用聚對苯二甲酸乙二酯(PET)膜、聚萘二甲酸乙二酯(PEN)膜、無延伸聚丙烯(CPP)膜、雙軸延伸聚丙烯(OPP)膜、低密度聚乙烯(LDPE)膜、直鏈狀低密度聚乙烯(LLDPE)膜、PP/PE摻合膜等樹脂膜。作為就強度或尺寸穩定性之觀點而言較佳之樹脂膜之例,可列舉PET膜、PEN膜、PPS膜及PEEK膜。就獲取容易性等觀點而言,尤佳為PET膜及PPS膜,其中較佳為PET膜。The resin film may be formed using a resin material containing one of these resins alone, or may be formed using a resin material containing two or more resin materials. The resin film may be unstretched or stretched (for example, uniaxially stretched or biaxially stretched). For example, polyethylene terephthalate (PET) film, polyethylene naphthalate (PEN) film, unstretched polypropylene (CPP) film, biaxially stretched polypropylene (OPP) film, Resin films such as density polyethylene (LDPE) film, linear low density polyethylene (LLDPE) film, and PP / PE blended film. Examples of resin films that are preferred from the viewpoint of strength or dimensional stability include PET films, PEN films, PPS films, and PEEK films. From the viewpoint of availability, PET films and PPS films are particularly preferred, and PET films are particularly preferred.

於樹脂膜中,可於不明顯阻礙本發明之效果之範圍內,視需要調配光穩定劑、抗氧化劑、抗靜電劑、著色劑(染料、顏料等)、填充材、滑澤劑、抗黏連劑等公知添加劑。In the resin film, a light stabilizer, an antioxidant, an antistatic agent, a colorant (dye, pigment, etc.), a filler, a lubricating agent, and an anti-sticking agent can be blended within a range that does not significantly impede the effects of the present invention. A well-known additive such as a coupling agent.

樹脂膜之製造方法並無特別限定。例如可適當採用擠出成形、吹脹成形、T模流延成形、砑光輥成形等先前公知之一般之樹脂膜成形方法。The manufacturing method of a resin film is not specifically limited. For example, a conventionally known general resin film forming method such as extrusion molding, inflation molding, T-die cast molding, and calender roll molding can be suitably used.

上述基材層可為實質上由此種基底膜構成者。或者,上述基材層亦可為除包含上述基底膜以外,亦包含輔助層者。作為上述輔助層之例,可列舉:光學特性調整層(例如著色層、抗反射層)、用以對基材層賦予所需之外觀之印刷層或層壓層、抗靜電層、底塗層、剝離層等表面處理層。The base material layer may be substantially composed of such a base film. Alternatively, the base material layer may include an auxiliary layer in addition to the base film. Examples of the auxiliary layer include an optical property adjustment layer (e.g., a coloring layer, an anti-reflection layer), a printing layer or a laminate layer for imparting a desired appearance to a base material layer, an antistatic layer, and an undercoat layer. , Peeling layer and other surface treatment layers.

對於基材層中積層黏著劑層之側之面,亦可視需要實施電暈放電處理、電漿處理、紫外線照射處理、酸處理、鹼處理、利用底塗劑(primer)之塗佈之底塗層之形成等先前公知之表面處理。此種表面處理可為用以提高黏著劑層對基材層之抓固性之處理。用於底塗層之形成之底塗劑之組成並無特別限定,可自公知者適當選擇。底塗層之厚度並無特別限制,通常適宜為0.01 μm~1 μm左右,較佳為0.1 μm~1 μm左右。作為可視需要對基材層實施之其他處理,可列舉抗靜電層形成處理、著色層形成處理、印刷處理等。該等處理可單獨應用或組合應用。Corrosion discharge treatment, plasma treatment, ultraviolet irradiation treatment, acid treatment, alkali treatment, and primer coating using a primer can also be performed on the side of the adhesive layer in the base material layer. The formation of a layer is performed by a previously known surface treatment. This surface treatment may be a treatment for improving the grip of the adhesive layer to the substrate layer. The composition of the primer used for the formation of the primer layer is not particularly limited, and may be appropriately selected from known ones. The thickness of the undercoat layer is not particularly limited, but is generally preferably about 0.01 μm to 1 μm, and preferably about 0.1 μm to 1 μm. Examples of other processes to be performed on the substrate layer as needed include an antistatic layer forming process, a colored layer forming process, and a printing process. These processes can be applied individually or in combination.

<<黏著劑層>>
構成黏著劑層之黏著劑之組成並無特別限定。上述黏著劑可為含有黏著劑之領域中公知之丙烯酸系聚合物、橡膠系聚合物、聚酯系聚合物、胺基甲酸酯系聚合物、聚醚系聚合物、聚矽氧系聚合物、聚醯胺系聚合物、氟系聚合物等於室溫區域顯示橡膠彈性之各種聚合物之1種或2種以上作為基礎聚合物(聚合物成分中之主成分、即佔據超過50重量%之成分)者。其中,作為較佳之黏著劑,可例示丙烯酸系黏著劑及橡膠系黏著劑。此處,所謂丙烯酸系黏著劑係指含有丙烯酸系聚合物作為基礎聚合物之黏著劑。關於橡膠系黏著劑亦同樣如此。又,上述所謂丙烯酸系聚合物係指構成該丙烯酸系聚合物之單體成分總量中之50重量%以上為丙烯酸系單體之聚合物。再者,本說明書中,所謂丙烯酸系單體係指於1分子中具有至少一個(甲基)丙烯醯基之單體。又,上述所謂(甲基)丙烯醯基係包括丙烯醯基及甲基丙烯醯基之含義。
<< Adhesive layer >>
The composition of the adhesive constituting the adhesive layer is not particularly limited. The adhesive may be an acrylic polymer, a rubber polymer, a polyester polymer, a urethane polymer, a polyether polymer, a polysiloxane polymer, or the like. Polyamide-based polymers and fluorine-based polymers are equivalent to one or two or more polymers that exhibit rubber elasticity at room temperature as the base polymer (the main component of the polymer component, that is, the component occupying more than 50% by weight) )By. Among them, acrylic adhesives and rubber-based adhesives can be exemplified as preferable adhesives. Here, the acrylic adhesive refers to an adhesive containing an acrylic polymer as a base polymer. The same applies to rubber-based adhesives. The above-mentioned acrylic polymer refers to a polymer in which 50% by weight or more of the total monomer components constituting the acrylic polymer are acrylic monomers. In addition, in the present specification, an acrylic single system refers to a monomer having at least one (meth) acrylfluorenyl group in one molecule. The above-mentioned (meth) acrylfluorenyl group includes the meanings of acrylfluorenyl and methacrylfluorenyl.

可良好地用於此處所揭示之製造方法之黏著劑層之若干例中,包括:(1)含有基礎聚合物及含矽氧烷結構之聚合物之黏著劑層(以下,亦稱為「黏著劑層(1)」)、及(2)由含有基礎聚合物及光硬化劑之光硬化性組合物所形成之黏著劑層(以下,亦稱為「黏著劑層(2)」)。以下,對黏著劑層(1)及黏著劑層(2)進行詳細說明,但此處所揭示之製造方法所使用之黏著片材並不限定於具有該等黏著劑層者。Some examples of adhesive layers that can be used well in the manufacturing methods disclosed herein include: (1) an adhesive layer containing a base polymer and a polymer containing a siloxane structure (hereinafter, also referred to as "adhesive Agent layer (1) ") and (2) an adhesive layer (hereinafter, also referred to as" adhesive layer (2) ") formed of a photocurable composition containing a base polymer and a photohardener. Hereinafter, the adhesive layer (1) and the adhesive layer (2) will be described in detail, but the adhesive sheet used in the manufacturing method disclosed herein is not limited to those having these adhesive layers.

<含有基礎聚合物A及含矽氧烷結構之聚合物B之黏著劑層>
黏著劑層(1)含有基礎聚合物A及含矽氧烷結構之聚合物B,顯示出黏著力藉由加熱而高漲之性質。因此,可以於黏著力提高步驟中進行加熱作為引起黏著力上升之刺激之態樣良好地用於此處所揭示之積層體製造方法。黏著劑層(1)可由含有基礎聚合物A或其前驅物與含矽氧烷結構之聚合物B之黏著劑組合物形成。黏著劑組合物之形態並無特別限制,例如可為水分散型、溶劑型、熱熔型、活性光線硬化型(例如UV硬化型)等各種形態。
<Adhesive layer containing base polymer A and siloxane-containing polymer B>
The adhesive layer (1) contains a base polymer A and a polymer B containing a siloxane structure, and exhibits the property that the adhesive force increases by heating. Therefore, it is possible to apply the heating in the adhesion improving step as a stimulus that causes an increase in adhesion to be favorably used in the method for manufacturing a laminated body disclosed herein. The adhesive layer (1) can be formed from an adhesive composition containing a base polymer A or a precursor thereof and a polymer B containing a siloxane structure. The form of the adhesive composition is not particularly limited, and may be, for example, various forms such as a water-dispersible type, a solvent type, a hot-melt type, and an active light-curable type (for example, a UV-curable type).

(基礎聚合物A)
作為黏著劑層(1)之基礎聚合物A(以下,有時簡稱為「聚合物A」),可良好地使用丙烯酸系聚合物。若使用丙烯酸系聚合物作為聚合物A,則有容易獲得與聚合物B之良好之相溶性之傾向。聚合物A與聚合物B之相溶性良好使黏著劑層內之聚合物B之移動性提高,藉此可有助於實現兼具局部去除步驟中之低黏著性與黏著力上升處理(例如加熱處理)後之強黏著性的黏著劑層(1),故而較佳。較佳為黏著劑層(1)之50重量%以上為丙烯酸系聚合物。
(Base polymer A)
As the base polymer A (hereinafter, sometimes simply referred to as "polymer A") of the adhesive layer (1), an acrylic polymer can be suitably used. When an acrylic polymer is used as the polymer A, there is a tendency that good compatibility with the polymer B is easily obtained. The good compatibility between polymer A and polymer B improves the mobility of polymer B in the adhesive layer, which can help to achieve both the low adhesion in the local removal step and the increase in adhesion (such as heating The strong adhesive layer (1) after the treatment) is preferred. Preferably, 50% by weight or more of the adhesive layer (1) is an acrylic polymer.

作為丙烯酸系聚合物,例如可良好地使用構成該丙烯酸系聚合物之單體成分總量中之40重量%以上為(甲基)丙烯酸烷基酯者。作為(甲基)丙烯酸烷基酯,可良好地使用在酯末端具有碳數1~20之(即,C1-20 之)直鏈或支鏈狀之烷基者。就容易取得特性之平衡之方面而言,丙烯酸系聚合物之構成單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為50重量%以上,可為55重量%以上,亦可為60重量%以上。就相同之原因而言,構成單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為99.9重量%以下,可為98重量%以下,亦可為95重量%以下。於若干種態樣中,單體成分總量中之(甲基)丙烯酸C1-20 烷基酯之比率例如可為90重量%以下,可為85重量%以下,亦可為80重量%以下。As the acrylic polymer, for example, those in which 40% by weight or more of the total monomer components constituting the acrylic polymer are alkyl (meth) acrylates can be suitably used. As the (meth) acrylic acid alkyl ester may be used in the ester having a carbon number 1 to the end of the well 20 (i.e., C 1-20 of) a straight-chain or branched-chain alkyl group of persons. In terms of easily achieving a balance of characteristics, the ratio of the C 1-20 alkyl (meth) acrylate in the total amount of constituent monomer components of the acrylic polymer may be, for example, 50% by weight or more, and may be 55% by weight. % Or more may be 60% by weight or more. For the same reason, the ratio of the C 1-20 alkyl (meth) acrylate in the total constituent monomer components may be, for example, 99.9% by weight or less, 98% by weight or less, or 95% by weight. the following. In several aspects , the ratio of the (meth) acrylic acid C 1-20 alkyl ester in the total amount of the monomer components may be, for example, 90% by weight or less, 85% by weight or less, and 80% by weight or less. .

作為(甲基)丙烯酸C1-20 烷基酯之非限定性具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸新戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸異十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等。Specific non-limiting examples of the C 1-20 alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and (meth) ) Isopropyl acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, second butyl (meth) acrylate, third butyl (meth) acrylate, pentyl (meth) acrylate Ester, isoamyl (meth) acrylate, neopentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, (meth) acrylate 2 -Ethylhexyl, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, ( Undecyl (meth) acrylate, dodecyl (meth) acrylate, tridecyl (meth) acrylate, isotridecyl (meth) acrylate, decyl (meth) acrylate Tetraalkyl ester, pentadecyl (meth) acrylate, cetyl (meth) acrylate, heptadecyl (meth) acrylate, stearyl (meth) acrylate, (meth) ) Isostearyl acrylate, (meth) acrylic Nonadecyl ester, (meth) acrylate, eicosyl acrylate.

於該等中,較佳為至少使用(甲基)丙烯酸C1-18 烷基酯,更佳為至少使用(甲基)丙烯酸C1-14 烷基酯。於若干種態樣中,丙烯酸系聚合物之構成單體成分可包含選自(甲基)丙烯酸C4-12 烷基酯(較佳為丙烯酸C4-10 烷基酯、例如丙烯酸C6-10 烷基酯)之至少一種。例如較佳為包含丙烯酸正丁酯(BA)及丙烯酸2-乙基己酯(2EHA)之一者或兩者之丙烯酸系聚合物,尤佳為至少包含2EHA之丙烯酸系聚合物。作為可良好地使用之其他(甲基)丙烯酸C1-18 烷基酯之例,可列舉:丙烯酸甲酯、甲基丙烯酸甲酯(MMA)、甲基丙烯酸正丁酯(BMA)、甲基丙烯酸2-乙基己酯(2EHMA)、丙烯酸異硬脂酯(ISTA)等。Among these, at least C 1-18 alkyl (meth) acrylate is preferably used, and at least C 1-14 alkyl (meth) acrylate is more preferably used. In several aspects, the constituent monomer component of the acrylic polymer may include a C 4-12 alkyl (meth) acrylate (preferably a C 4-10 alkyl acrylate, such as a C 6- 10 alkyl esters). For example, an acrylic polymer containing one or both of n-butyl acrylate (BA) and 2-ethylhexyl acrylate (2EHA) is preferred, and an acrylic polymer containing at least 2EHA is particularly preferred. Examples of other C 1-18 alkyl (meth) acrylates that can be used well include methyl acrylate, methyl methacrylate (MMA), n-butyl methacrylate (BMA), methyl 2-ethylhexyl acrylate (2EHMA), isostearyl acrylate (ISTA), and the like.

丙烯酸系聚合物之構成單體成分亦可包含作為主成分之(甲基)丙烯酸烷基酯並且視需要包含能夠與(甲基)丙烯酸烷基酯共聚之其他單體(共聚性單體)。作為共聚性單體,可良好地使用具有極性基(例如羧基、羥基等)之單體。具有極性基之單體可有助於對丙烯酸系聚合物導入交聯點、或提高丙烯酸系聚合物之凝聚力。共聚性單體可單獨使用一種或組合兩種以上使用。The constituent monomer component of the acrylic polymer may include an alkyl (meth) acrylate as a main component and, if necessary, other monomers (copolymerizable monomers) capable of copolymerizing with the alkyl (meth) acrylate. As a copolymerizable monomer, a monomer which has a polar group (for example, a carboxyl group, a hydroxyl group, etc.) can be used conveniently. The monomer having a polar group can help to introduce a cross-linking point to the acrylic polymer, or improve the cohesion of the acrylic polymer. The copolymerizable monomer may be used singly or in combination of two or more kinds.

作為共聚性單體之非限定性之具體例,可列舉以下者。
含羧基單體:例如丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、順丁烯二酸、反丁烯二酸、丁烯酸、異丁烯酸等。
含羥基單體:例如(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸6-羥基己酯、(甲基)丙烯酸8-羥基辛酯、(甲基)丙烯酸10-羥基癸酯、(甲基)丙烯酸12-羥基月桂酯、(甲基)丙烯酸(4-羥基甲基環己基)甲酯等(甲基)丙烯酸羥基烷基酯;N-(2-羥基乙基)丙烯醯胺(HEAA)等具有羥基與醯胺基之單體等。
含氮單體:例如N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌、乙烯基吡、乙烯基吡咯、乙烯基咪唑、乙烯基㗁唑、乙烯基啉、N-乙烯基-3-啉酮、N-乙烯基-2-己內醯胺、N-乙烯基-1,3-㗁 -2-酮、N-乙烯基-3,5-啉二酮、N-丙烯醯基啉、N-乙烯基羧醯胺類等。
此外,含氰基單體、乙烯酯單體、芳香族乙烯基單體、含環氧基單體、乙烯醚單體、含磺基單體、含磷酸基單體、含酸酐基單體等。
Specific non-limiting examples of the copolymerizable monomer include the following.
Carboxyl-containing monomers: For example, acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, butenoic acid, methacrylic acid, and the like.
Hydroxyl-containing monomers: for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, (meth) acrylic acid ( 4-hydroxymethylcyclohexyl) methyl esters and other hydroxyalkyl (meth) acrylates; N- (2-hydroxyethyl) acrylamidoamine (HEAA) and other monomers having a hydroxyl group and amidino group.
Nitrogen-containing monomers: for example, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiper, vinylpyridine, vinylpyrrole Imidazole, vinyloxazole, vinylline, N-vinyl-3-olinone, N-vinyl-2-caprolactam, N-vinyl-1,3-fluoren-2-one, N- Vinyl-3,5-line dione, N-acrylamidoline, N-vinylcarboxamide and the like.
In addition, cyano-containing monomers, vinyl ester monomers, aromatic vinyl monomers, epoxy-containing monomers, vinyl ether monomers, sulfo-containing monomers, phosphate-containing monomers, anhydride-containing monomers, etc. .

於使用此種共聚性單體之情形時,其使用量並無特別限定,通常適宜設為單體成分總量之0.01重量%以上。就更良好地發揮因使用共聚性單體所產生之效果之觀點而言,可將共聚性單體之使用量設為單體成分總量之0.1重量%以上,亦可設為1重量%以上。又,共聚性單體之使用量可設為單體成分總量之50重量%以下,較佳為設為40重量%以下。藉此,可防止黏著劑之凝聚力變得過高,提高常溫(25℃)下之黏著感。When such a copolymerizable monomer is used, the amount used is not particularly limited, and it is usually suitably set to 0.01% by weight or more based on the total amount of the monomer components. From the viewpoint of better exerting the effect of using the copolymerizable monomer, the amount of the copolymerizable monomer used may be 0.1% by weight or more of the total amount of the monomer components, and may also be 1% by weight or more. . The use amount of the copolymerizable monomer may be 50% by weight or less of the total amount of the monomer components, and preferably 40% by weight or less. Thereby, the cohesive force of the adhesive can be prevented from becoming too high, and the adhesion feeling at normal temperature (25 ° C) can be improved.

於若干種態樣中,丙烯酸系聚合物較佳為含有選自由N-乙烯基環狀醯胺及含羥基單體所構成之群中之至少一種單體作為其構成單體成分。In several aspects, the acrylic polymer preferably contains at least one monomer selected from the group consisting of N-vinyl cyclic amidine and hydroxyl-containing monomers as its constituent monomer component.

藉由使用N-乙烯基環狀醯胺,可調整黏著劑之凝聚力或極性,提高進行作為使黏著力上升之刺激之加熱後之黏著力(以下,亦稱為「加熱後黏著力」)。作為N-乙烯基環狀醯胺之具體例,可列舉上述含氮單體中具有對應之結構者。作為尤佳之例,可列舉N-乙烯基-2-吡咯啶酮、N-乙烯基-2-己內醯胺。N-乙烯基環狀醯胺之使用量並無特別限制,通常適宜設為丙烯酸系聚合物之構成單體成分總量之0.01重量%以上(較佳為0.1重量%以上,例如0.5重量%以上)。於若干種態樣中,N-乙烯基環狀醯胺之使用量可設為上述單體成分總量之1重量%以上,可設為5重量%以上,可設為8重量%以上,可設為10重量%以上,亦可設為12重量%以上。又,就提高常溫(25℃)下之黏著感或提高低溫下之柔軟性之觀點而言,N-乙烯基環狀醯胺之使用量通常適宜設為上述單體成分總量之40重量%以下,可設為30重量%以下,可設為25重量份以下,可設為20重量%以下,亦可設為18重量%以下。By using N-vinyl cyclic amidine, the cohesive force or polarity of the adhesive can be adjusted, and the adhesive force after heating (hereinafter, also referred to as "adhesive force after heating") as a stimulus for increasing the adhesive force can be improved. Specific examples of the N-vinyl cyclic amidine include those having a corresponding structure among the aforementioned nitrogen-containing monomers. Particularly preferred examples include N-vinyl-2-pyrrolidone and N-vinyl-2-caprolactam. The amount of N-vinyl cyclic ammonium amine used is not particularly limited, but it is generally suitable to be 0.01% by weight or more (preferably 0.1% by weight or more, such as 0.5% by weight or more) of the total amount of constituent monomer components of the acrylic polymer. ). In several aspects, the amount of N-vinyl cyclic amidine can be set to be more than 1% by weight of the total amount of the above monomer components, can be set to be 5% by weight or more, or 8% by weight or more. It may be 10% by weight or more, and may be 12% by weight or more. In addition, from the viewpoint of improving the stickiness at room temperature (25 ° C) or improving the flexibility at low temperature, the amount of N-vinyl cyclic ammonium amine used is generally suitably set to 40% by weight of the total amount of the monomer components. Hereinafter, it may be 30% by weight or less, 25% by weight or less, 20% by weight or less, or 18% by weight or less.

藉由使用含羥基單體,可調整黏著劑之凝聚力或極性,可提高加熱後黏著力。又,含羥基單體提供與下述交聯劑(例如異氰酸酯系交聯劑)之反應點,可藉由交聯反應而提高黏著劑之凝聚力。作為含羥基單體之較佳例,可列舉:丙烯酸2-羥基乙酯(HEA)、丙烯酸4-羥基丁酯(4HBA)、N-(2-羥基乙基)丙烯醯胺(HEAA)。含羥基單體之使用量並無特別限制,通常適宜設為丙烯酸系聚合物之構成單體成分總量之0.01重量%以上(較佳為0.1重量%以上,例如0.5重量%以上)。於若干種態樣中,含羥基單體之使用量可設為上述單體成分總量之1重量%以上,可設為5重量%以上,亦可設為10重量%以上。又,就提高常溫(25℃)下之黏著感或提高低溫下之柔軟性之觀點而言,含羥基單體之使用量通常適宜設為上述單體成分總量之40重量%以下,可設為30重量%以下,可設為20重量%以下,亦可設為10重量%以下或5重量%以下。By using a hydroxyl-containing monomer, the cohesive force or polarity of the adhesive can be adjusted, and the adhesive force after heating can be improved. In addition, the hydroxyl-containing monomer provides a reaction point with the following crosslinking agent (for example, an isocyanate-based crosslinking agent), and the cohesive force of the adhesive can be improved by the crosslinking reaction. Preferred examples of the hydroxyl-containing monomer include 2-hydroxyethyl acrylate (HEA), 4-hydroxybutyl acrylate (4HBA), and N- (2-hydroxyethyl) acrylamide (HEAA). The use amount of the hydroxyl group-containing monomer is not particularly limited, and it is generally suitable to be 0.01% by weight or more (preferably 0.1% by weight or more, such as 0.5% by weight or more) of the total amount of constituent monomer components of the acrylic polymer. In several aspects, the use amount of the hydroxyl-containing monomer may be set to 1% by weight or more of the total amount of the monomer components, may be set to 5% by weight or more, and may also be set to 10% by weight or more. In addition, from the viewpoint of improving the stickiness at normal temperature (25 ° C) or improving the softness at low temperature, the amount of the hydroxyl-containing monomer used is generally suitably set to 40% by weight or less of the total amount of the above monomer components. It is 30% by weight or less, 20% by weight or less, and 10% by weight or 5% by weight or less.

於若干種態樣中,作為共聚性單體,可併用N-乙烯基環狀醯胺與含羥基單體。於此情形時,N-乙烯基環狀醯胺與含羥基單體之合計量例如可為丙烯酸系聚合物之構成單體成分總量之0.1重量%以上,可為1重量%以上,可為5重量%以上,亦可為10重量%以上、15重量%以上、20重量%以上或25重量%以上。又,N-乙烯基環狀醯胺與含羥基單體之合計量例如可設為上述單體成分總量之50重量%以下,較佳為設為40重量%以下。In several aspects, as the copolymerizable monomer, N-vinyl cyclic amidine and a hydroxyl-containing monomer may be used in combination. In this case, the total amount of the N-vinyl cyclic amidine and the hydroxyl-containing monomer may be, for example, 0.1% by weight or more of the total monomer component of the acrylic polymer, may be 1% by weight or more, and may be 5% by weight or more, 10% by weight or more, 15% by weight or more, 20% by weight or more, or 25% by weight or more. The total amount of the N-vinyl cyclic amidine and the hydroxyl-containing monomer may be, for example, 50% by weight or less of the total amount of the monomer components, and preferably 40% by weight or less.

於併用N-乙烯基環狀醯胺與含羥基單體之態樣中,N-乙烯基環狀醯胺之使用量(WN )與含羥基單體之使用量(WOH )之關係(重量基準)並無特別限定。WN /WOH 例如可為0.01以上,通常適宜為0.05以上,可為0.1以上,可為0.2以上,可為0.5以上,亦可為0.7以上。又,WN /WOH 例如可為100以下,通常適宜為20以下,可為10以下,可為5以下,可為2以下,可為1.5以下,亦可為1.3以下。And treated with N- vinyl cyclic to Amides with aspects of the hydroxyl group-containing monomer, N- vinyl Amides of cyclic amount (W N) relationship with the hydroxyl-containing monomer is used in an amount of (W OH) ( Weight basis) is not particularly limited. W N / W OH may be, for example, 0.01 or more, usually 0.05 or more, 0.1 or more, 0.2 or more, 0.5 or more, or 0.7 or more. The W N / W OH may be, for example, 100 or less, usually 20 or less, 10 or less, 5 or less, 2 or less, 1.5 or less, and 1.3 or less.

聚合物A之Tg典型而言未達0℃,較佳為未達-10℃,更佳為未達-20℃。含有Tg未達0℃之聚合物A之黏著劑顯示出適度之流動性(例如該黏著劑中所含之聚合物鏈之運動性),因此於黏著力上升步驟中藉由進行加熱處理而容易使黏著力大幅地上升。於若干種態樣中,聚合物A之Tg例如可未達-30℃,可未達-40℃,可未達-50℃,亦可未達-60℃。聚合物A之Tg之下限並無特別限制。就材料之獲取容易性或提高黏著劑層之凝聚力之觀點而言,通常可良好地採用Tg為-80℃以上之聚合物A。The Tg of polymer A is typically less than 0 ° C, preferably less than -10 ° C, and more preferably less than -20 ° C. The adhesive containing polymer A having a Tg of less than 0 ° C exhibits moderate fluidity (for example, the mobility of the polymer chain contained in the adhesive), and thus it is easy to perform a heat treatment in the adhesion increasing step. Increases the adhesive force significantly. In several aspects, the Tg of the polymer A may be, for example, less than -30 ° C, less than -40 ° C, less than -50 ° C, or less than -60 ° C. The lower limit of the Tg of the polymer A is not particularly limited. From the viewpoints of ease of material acquisition and improvement of cohesiveness of the adhesive layer, polymer A having a Tg of −80 ° C. or higher can generally be favorably used.

本說明書中,聚合物之Tg係指文獻或目錄等所記載之標稱值、或基於該聚合物之製備所使用之單體成分之組成根據Fox式所求出之Tg。Fox式係指如以下所示,共聚物之Tg與使構成該共聚物之單體各者進行均聚所獲得之均聚物之玻璃轉移溫度Tgi的關係式。
1/Tg=Σ(Wi/Tgi)
於上述Fox式中,Tg表示共聚物之玻璃轉移溫度(單位:K),Wi表示該共聚物中之單體i之重量分率(重量基準之共聚比率),Tgi表示單體i之均聚物之玻璃轉移溫度(單位:K)。於Tg特定之對象之聚合物為均聚物之情形時,該均聚物之Tg與對象之聚合物之Tg一致。
In the present specification, the Tg of a polymer refers to a nominal value described in a literature, a catalogue, or the like, or a Tg determined based on a Fox formula based on the composition of a monomer component used in the preparation of the polymer. The Fox formula is a relational formula between the Tg of the copolymer and the glass transition temperature Tgi of the homopolymer obtained by homopolymerizing each of the monomers constituting the copolymer, as shown below.
1 / Tg = Σ (Wi / Tgi)
In the above Fox formula, Tg represents the glass transition temperature (unit: K) of the copolymer, Wi represents the weight fraction of monomer i in the copolymer (copolymerization ratio on a weight basis), and Tgi represents the homopolymerization of monomer i. Glass transition temperature of the object (unit: K). In the case where the target polymer of the Tg is a homopolymer, the Tg of the homopolymer is the same as the Tg of the target polymer.

作為用於算出Tg之均聚物之玻璃轉移溫度,設為使用公知資料所記載之值者。具體而言,可列舉「Polymer Handbook」(第3版,John Wiley & Sons, Inc., 1989年)中之數值。關於上述Polymer Handbook中記載有複數種值之單體,採用最高值。As the glass transition temperature of the homopolymer used to calculate Tg, a value described in known data is used. Specifically, the values in "Polymer Handbook" (3rd edition, John Wiley & Sons, Inc., 1989) can be cited. For monomers having plural values described in the aforementioned Polymer Handbook, the highest value is adopted.

聚合物A之重量平均分子量(Mw)通常適宜為約5萬以上,但並無特別限定,就獲得顯示出更良好之凝聚性之黏著劑之觀點而言,例如可為10萬以上,可為20萬以上,可為30萬以上,可為50萬以上,亦可為70萬以上。又,聚合物A之Mw通常適宜為約500萬以下。該Mw之聚合物A容易形成顯示出適度之流動性(聚合物鏈之運動性)之黏著劑,因此適於實現黏著力上升比高之黏著片材。於若干種態樣中,聚合物A之Mw可為300萬以下,可為200萬以下,亦可為150萬以下。The weight average molecular weight (Mw) of the polymer A is generally suitably about 50,000 or more, but it is not particularly limited. From the viewpoint of obtaining an adhesive exhibiting better cohesiveness, it may be, for example, 100,000 or more, and may be 200,000 or more, 300,000 or more, 500,000 or more, or 700,000 or more. The Mw of the polymer A is generally preferably about 5 million or less. The polymer A of this Mw is easy to form an adhesive that exhibits moderate fluidity (movability of the polymer chain), and is therefore suitable for achieving an adhesive sheet having a high adhesion increase ratio. In several aspects, the Mw of the polymer A may be 3 million or less, may be 2 million or less, and may be 1.5 million or less.

於本說明書中,聚合物之Mw可藉由凝膠滲透層析法(GPC)進行聚苯乙烯換算而求出。更具體而言,可依據下述實施例中所記載之方法及條件測定Mw。In this specification, Mw of a polymer can be calculated | required by polystyrene conversion by gel permeation chromatography (GPC). More specifically, Mw can be measured according to the methods and conditions described in the following examples.

獲得丙烯酸系聚合物之方法並無特別限定,可適當採用溶液聚合法、乳液聚合法、塊體聚合法、懸濁聚合法、光聚合法等作為丙烯酸系聚合物之合成方法已知之各種聚合方法。The method for obtaining the acrylic polymer is not particularly limited, and various polymerization methods known as synthetic methods of acrylic polymers, such as a solution polymerization method, an emulsion polymerization method, a block polymerization method, a suspension polymerization method, and a photopolymerization method, can be appropriately used. .

用於聚合之起始劑可對應於聚合方法而自先前公知之熱起始劑或光起始劑等適當選擇。作為熱起始劑之非限定性之例,可列舉:2,2'-偶氮二異丁腈(AIBN)等偶氮系起始劑、過硫酸鉀等過硫酸鹽、過氧化物系起始劑、氧化還原系起始劑等。作為光起始劑之非限定性之例,可列舉:安息香醚系光起始劑、苯乙酮系光起始劑、α-酮醇系光起始劑、芳香族磺醯氯系光起始劑、光活性肟系光起始劑、安息香系光起始劑、苯偶醯系光起始劑、二苯甲酮系光起始劑、縮酮系光起始劑、9-氧硫系光起始劑、醯基氧化膦系光起始劑等。起始劑可單獨使用一種或組合兩種以上使用。The initiator used for the polymerization may be appropriately selected from previously known thermal initiators, photoinitiators, and the like in accordance with the polymerization method. Non-limiting examples of thermal initiators include azo-based initiators such as 2,2'-azobisisobutyronitrile (AIBN), persulfates such as potassium persulfate, and peroxide-based Initiator, redox-based initiator, and the like. Non-limiting examples of the photoinitiator include benzoin ether-based photoinitiator, acetophenone-based photoinitiator, α-keto alcohol-based photoinitiator, and aromatic sulfonyl chloride-based photoinitiator. Initiator, photoactive oxime-based light initiator, benzoin-based light initiator, benzoin-based light initiator, benzophenone-based light initiator, ketal-based light initiator, 9-oxysulfur Photoinitiators, fluorenylphosphine oxide photoinitiators, and the like. The initiators may be used singly or in combination of two or more.

於若干種態樣中,作為獲得丙烯酸系聚合物之方法,可良好地採用溶液聚合法。作為溶液聚合之溶劑,可使用乙酸乙酯、甲苯等。溶液濃度通常為20~80重量%左右。作為起始劑,可使用偶氮系、過氧化物系等各種公知者。為了調整分子量,亦可使用鏈轉移劑。反應溫度通常可為50~80℃左右,反應時間通常可為1~8小時左右。In several aspects, as a method for obtaining an acrylic polymer, a solution polymerization method can be favorably used. As a solvent for the solution polymerization, ethyl acetate, toluene, or the like can be used. The solution concentration is usually about 20 to 80% by weight. As the initiator, various known ones such as an azo system and a peroxide system can be used. In order to adjust the molecular weight, a chain transfer agent may be used. The reaction temperature is usually about 50 to 80 ° C, and the reaction time is usually about 1 to 8 hours.

於若干種態樣中,丙烯酸系聚合物可以對在如上所述之單體成分中調配起始劑所得之混合物照射紫外線(UV)而使該單體成分之一部分聚合之部分聚合物(丙烯酸系聚合物漿液)之形態,含有於用以形成黏著劑層之黏著劑組合物中。可將含有該丙烯酸系聚合物漿液之黏著劑組合物塗佈於特定之被塗佈體,照射UV而使聚合完成。即,上述丙烯酸系聚合物漿液可作為丙烯酸系聚合物之前驅物理解。黏著劑層(1)例如可使用含有此種丙烯酸系聚合物漿液與聚合物B之黏著劑組合物形成。In several aspects, the acrylic polymer can irradiate ultraviolet rays (UV) to the mixture obtained by formulating the initiator in the monomer component as described above to partially polymerize a part of the monomer component (acrylic Polymer slurry) in the form of an adhesive composition for forming an adhesive layer. The adhesive composition containing the acrylic polymer slurry can be applied to a specific object to be coated and irradiated with UV to complete the polymerization. That is, the above-mentioned acrylic polymer slurry can be understood as an acrylic polymer precursor. The adhesive layer (1) can be formed using the adhesive composition containing such an acrylic polymer slurry and polymer B, for example.

(含矽氧烷結構之聚合物B)
含矽氧烷結構之聚合物B(以下,有時簡稱為「聚合物B」)係具有聚有機矽氧烷骨架之單體(以下,亦稱為「單體S1」)與(甲基)丙烯酸系單體之共聚物。聚合物B藉由源自單體S1之聚有機矽氧烷結構之低極性及運動性,可發揮作為有助於抑制初期黏著力及提高黏著力上升比之黏著力上升延遲劑之功能。作為單體S1,並無特別限定,可使用含有聚有機矽氧烷骨架之任意單體。單體S1藉由源自其結構之低極性,於使用前(貼附於被黏著體前)之黏著片材中促進聚合物B偏靠於黏著劑層表面,表現出貼合初期之輕剝離性(低黏著性)。作為單體S1,可良好地使用在單末端具有聚合性反應基之結構者。根據此種單體S1與(甲基)丙烯酸系單體之共聚,形成在側鏈具有聚有機矽氧烷骨架之聚合物B。該結構之聚合物B藉由側鏈之運動性及移動容易性,而容易成為初期黏著力較低且黏著力上升比較高者。
(Silicon structure-containing polymer B)
Polymer B containing a siloxane structure (hereinafter, sometimes referred to as "polymer B") is a monomer having a polyorganosiloxane structure (hereinafter, also referred to as "monomer S1") and (methyl) Copolymer of acrylic monomers. Polymer B has a low polarity and mobility derived from a polyorganosiloxane structure derived from monomer S1, and can function as an adhesion-increasing retarder that helps suppress the initial adhesion and increase the adhesion-increasing ratio. The monomer S1 is not particularly limited, and any monomer containing a polyorganosiloxane frame can be used. The monomer S1 promotes the polymer B to lean against the surface of the adhesive layer in the adhesive sheet before use (before attaching to the adherend) by the low polarity derived from its structure, and shows light peeling in the initial stage of bonding. Sex (low adhesion). As the monomer S1, a structure having a polymerizable reactive group at a single terminal can be suitably used. According to the copolymerization of such a monomer S1 and a (meth) acrylic monomer, a polymer B having a polyorganosiloxane skeleton in a side chain is formed. The polymer B of this structure is apt to become the one with lower initial adhesive force and higher adhesive force due to the mobility and ease of movement of the side chain.

作為單體S1,例如可使用下述通式(1)或(2)所表示之化合物。更具體而言,作為信越化學工業股份有限公司製造之單末端反應性聚矽氧油,可列舉:X-22-174ASX、X-22-2426、X-22-2475、KF-2012等。單體S1可單獨使用一種或組合兩種以上使用。
[化1]

[化2]

此處,上述通式(1)、(2)中之R3 為氫或甲基,R4 為甲基或一價之有機基,m及n為0以上之整數。
As the monomer S1, for example, a compound represented by the following general formula (1) or (2) can be used. More specifically, examples of the single-end reactive silicone oil manufactured by Shin-Etsu Chemical Industry Co., Ltd. include X-22-174ASX, X-22-2426, X-22-2475, and KF-2012. The monomer S1 may be used singly or in combination of two or more kinds.
[Chemical 1]

[Chemical 2]

Here, R 3 in the general formulae (1) and (2) is hydrogen or a methyl group, R 4 is a methyl group or a monovalent organic group, and m and n are integers of 0 or more.

單體S1之官能基當量例如較佳為700 g/mol以上且未達15000 g/mol,更佳為800 g/mol以上且未達10000 g/mol,進而較佳為850 g/mol以上且未達6000 g/mol,尤佳為1500 g/mol以上且未達5000 g/mol。若單體S1之官能基當量未達700 g/mol,則可能有無法充分地抑制初期黏著力之情況。若單體S1之官能基當量為15000 g/mol以上,則可能有黏著力之上升變得不充分之情況。若單體S1之官能基當量為上述範圍內,則容易將黏著劑層內之相溶性(例如與聚合物A之相溶性)或移動性調節為適度之範圍,容易實現以較高之水準兼顧初期之低黏著性與積層體使用時之強黏著性的黏著片材。The functional group equivalent of the monomer S1 is, for example, preferably 700 g / mol or more and less than 15000 g / mol, more preferably 800 g / mol or more and less than 10,000 g / mol, and further preferably 850 g / mol or more and It is less than 6000 g / mol, particularly preferably more than 1500 g / mol and less than 5000 g / mol. If the functional group equivalent of the monomer S1 is less than 700 g / mol, the initial adhesion may not be sufficiently suppressed. When the functional group equivalent of the monomer S1 is 15000 g / mol or more, the increase in the adhesive force may become insufficient. If the functional group equivalent of the monomer S1 is within the above range, it is easy to adjust the compatibility (for example, the compatibility with the polymer A) or the mobility in the adhesive layer to a moderate range, and it is easy to achieve a high level of both. Adhesive sheet with low initial adhesion and strong adhesiveness when laminated body is used.

此處,所謂「官能基當量」,意指鍵結於每1個官能基之主骨架(例如聚二甲基矽氧烷)之重量。關於標記單位g/mol,換算成官能基1 mol。單體S1之官能基當量例如可根據基於核磁共振(NMR)之1 H-NMR(質子NMR)之光譜強度而算出。基於1 H-NMR之光譜強度之單體S1之官能基當量(g/mol)之算出可基於有關1 H-NMR光譜解析之一般結構解析方法,視需要參照日本專利第5951153號公報之記載而進行。Here, the "functional group equivalent" means the weight of a main skeleton (for example, polydimethylsiloxane) bonded to each functional group. The labeling unit g / mol is converted to 1 mol of the functional group. The functional group equivalent of the monomer S1 can be calculated from, for example, the spectral intensity of 1 H-NMR (proton NMR) based on nuclear magnetic resonance (NMR). Based on the functional group equivalent of the sum of spectral intensities monomer S1 1 H-NMR of (g / mol) can be calculated from the general structure of the analysis method of the related analytical spectroscopy based on 1 H-NMR, as necessary of Japanese Patent Publication No. 5951153 describes the get on.

再者,於使用官能基當量不同之兩種以上之單體作為單體S1之情形時,作為單體S1之官能基當量,可使用算術平均值。即,包含官能基當量不同之n種單體(單體S11 、單體S12 ……單體S1n )的單體S1之官能基當量可藉由下述式進行計算。
單體S1之官能基當量(g/mol)=(單體S11 之官能基當量×單體S11 之調配量+單體S12 之官能基當量×單體S12 之調配量+……+單體S1n 之官能基當量×單體S1n 之調配量)/(單體S11 之調配量+單體S12 之調配量+……+單體S1n 之調配量)
When two or more monomers having different functional group equivalents are used as the monomer S1, as the functional group equivalents of the monomer S1, an arithmetic average value can be used. That is, the functional group equivalent of the monomer S1 containing n kinds of monomers (monomer S1 1 , monomer S1 2, ... monomer S1 n ) having different functional group equivalents can be calculated by the following formula.
S1 functional group equivalent of the monomer (g / mol) = functionality (S1 monomer. 1 × monomers of group equivalent amount of formulation S1. 1 S1 2 + monomer having a functional group equivalent of the amount of formulation S1 × monomers of 2 + ...... the monomer S1 + n × functional group equivalent of the monomer blending amount of n-S1) / (S1 formulation. 1 the formulation amount of the monomers of the monomer S1 + 2 + ...... + the amount of the monomer formulation of n-S1)

單體S1之含量相對於用以製備聚合物B之全部單體成分,例如可為5重量%以上,就更良好地發揮作為黏著力上升延遲劑之效果之觀點而言,較佳為設為10重量%以上,可設為15重量%以上,亦可設為20重量%以上。又,就聚合反應性或相溶性之觀點而言,單體S1之含量相對於用以製備聚合物B之全部單體成分,適宜設為60重量%以下,可設為50重量%以下,可設為40重量%以下,亦可設為30重量%以下。若單體S1之含量少於5重量%,則可能有無法充分地抑制初期黏著力之情況。若單體S1之含量多於60重量%,則可能有黏著力之上升變得不充分之情況。The content of the monomer S1 may be, for example, 5% by weight or more relative to all the monomer components used to prepare the polymer B. From the viewpoint of better exerting the effect as an adhesion-increasing retarder, it is preferably set to It may be 10% by weight or more, may be 15% by weight or more, and may be 20% by weight or more. From the viewpoint of polymerization reactivity or compatibility, the content of the monomer S1 is preferably 60% by weight or less, and may be 50% by weight or less with respect to all the monomer components used to prepare the polymer B. It may be 40% by weight or less, and may be 30% by weight or less. If the content of the monomer S1 is less than 5% by weight, the initial adhesion may not be sufficiently suppressed. When the content of the monomer S1 is more than 60% by weight, the increase in the adhesive force may become insufficient.

聚合物B之製備所使用之單體成分除了含有單體S1以外,亦含有能夠與單體S1共聚之(甲基)丙烯酸系單體。藉由使一種或兩種以上之(甲基)丙烯酸系單體與單體S1進行共聚,可良好地調節黏著劑層內之聚合物B之移動性。使單體S1與(甲基)丙烯酸系單體共聚亦可有助於改善聚合物B與聚合物A(例如丙烯酸系聚合物)之相溶性。The monomer component used in the preparation of the polymer B contains, in addition to the monomer S1, a (meth) acrylic monomer capable of copolymerizing with the monomer S1. By copolymerizing one or two or more (meth) acrylic monomers with the monomer S1, the mobility of the polymer B in the adhesive layer can be well adjusted. Copolymerizing the monomer S1 with the (meth) acrylic monomer may also help improve the compatibility between polymer B and polymer A (for example, acrylic polymer).

作為(甲基)丙烯酸系單體,例如可列舉(甲基)丙烯酸烷基酯。例如可使用作為於聚合物A為丙烯酸系聚合物之情形時可使用之(甲基)丙烯酸烷基酯於上文中例示之單體之一種或兩種以上作為聚合物B之共聚成分。於若干種態樣中,聚合物B可含有(甲基)丙烯酸C4-12 烷基酯(較佳為(甲基)丙烯酸C4-10 烷基酯,例如(甲基)丙烯酸C6-10 烷基酯)之至少一種作為單體單元。於其他若干種態樣中,聚合物B可含有甲基丙烯酸C1-18 烷基酯(較佳為甲基丙烯酸C1-14 烷基酯,例如甲基丙烯酸C1-10 烷基酯)之至少一種作為單體單元。構成聚合物B之單體單元例如可含有選自MMA、BMA及2EHMA之一種或兩種以上。Examples of the (meth) acrylic monomer include alkyl (meth) acrylate. For example, one or two or more of the monomers exemplified above for the alkyl (meth) acrylate which can be used when the polymer A is an acrylic polymer can be used as a copolymerization component of the polymer B. In several aspects, the polymer B may contain a C 4-12 alkyl (meth) acrylate (preferably a C 4-10 alkyl (meth) acrylate, such as a C 6- (meth) acrylate 10 alkyl esters) as monomer units. In several other aspects, the polymer B may contain a C 1-18 alkyl methacrylate (preferably a C 1-14 alkyl methacrylate, such as a C 1-10 alkyl methacrylate) At least one of them is used as a monomer unit. The monomer unit constituting the polymer B may contain, for example, one or two or more kinds selected from MMA, BMA, and 2EHMA.

作為上述(甲基)丙烯酸系單體之其他例,可列舉具有脂環式烴基之(甲基)丙烯酸酯。例如可使用(甲基)丙烯酸環戊酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異酯、(甲基)丙烯酸二環戊酯、(甲基)丙烯酸1-金剛烷基酯等。於若干種態樣中,聚合物B可含有選自甲基丙烯酸二環戊酯、甲基丙烯酸異酯及甲基丙烯酸環己酯之至少一種作為單體單元。As another example of the said (meth) acrylic-type monomer, the (meth) acrylic acid ester which has an alicyclic hydrocarbon group is mentioned. For example, cyclopentyl (meth) acrylate, cyclohexyl (meth) acrylate, isoester (meth) acrylate, dicyclopentyl (meth) acrylate, 1-adamantyl (meth) acrylate can be used Wait. In several aspects, the polymer B may contain at least one selected from the group consisting of dicyclopentyl methacrylate, isomethacrylate, and cyclohexyl methacrylate as monomer units.

上述(甲基)丙烯酸烷基酯及上述具有脂環式烴基之(甲基)丙烯酸酯之使用量相對於用以製備聚合物B之全部單體成分,例如可為10重量%以上且95重量%以下,可為20重量%以上且95重量%以下,亦可為30重量%以上且90重量%以下、40重量%以上且90重量%以下、或50重量%以上且85重量%以下。The amount of the (meth) acrylic acid alkyl ester and the (meth) acrylic acid ester having an alicyclic hydrocarbon group may be, for example, 10% by weight or more and 95% by weight relative to the total monomer component used to prepare the polymer B. % Or less may be 20% by weight or more and 95% by weight or less, or 30% by weight or more and 90% by weight or less, 40% by weight or more and 90% by weight or less, or 50% by weight or more and 85% by weight or less.

作為構成聚合物B之單體單元中可與單體S1一起含有之單體之其他例,可列舉作為聚合物A為丙烯酸系聚合物之情形時可使用之單體於上文中例示之各種共聚性單體。As other examples of the monomer which can be contained together with the monomer S1 in the monomer units constituting the polymer B, various copolymers exemplified above can be cited as the monomers which can be used when the polymer A is an acrylic polymer. Sex monomer.

於若干種態樣中,藉由使與聚合物B中所含之單體單元共通之單體單元亦含有於聚合物A中,可改善黏著劑層內之聚合物B之移動性,提高黏著力上升比。共通之單體單元為佔據構成聚合物B之全部單體單元之5重量%以上的成分時有效,較佳為占10重量%以上(更佳為20重量%以上,例如30重量%以上)之成分。上述共通之單體單元於構成聚合物A之全部單體單元中所占之比率例如可為1重量%以上,較佳為3重量%以上,更佳為5重量%以上,亦可為7重量%以上。若共通之單體單元於構成聚合物A之全部單體單元中所占之比率變高,則有更良好地發揮改善相溶性之效果之傾向。又,考慮與其他特性之平衡性,共通之單體單元於構成聚合物A之全部單體單元中所占之比率可為50重量%以下,可為30重量%以下,亦可為15重量%以下。作為可良好地用作共通之單體單元之單體之非限定性之例,可列舉:MMA、BMA、2EHMA、丙烯酸甲酯(MA)、BA、2EHA、(甲基)丙烯酸環己酯、(甲基)丙烯酸異酯、(甲基)丙烯酸二環戊酯等。In some aspects, by making the monomer unit common to the monomer unit contained in the polymer B also contained in the polymer A, the mobility of the polymer B in the adhesive layer can be improved and the adhesion can be improved. Force rise ratio. The common monomer unit is effective when it is a component occupying 5 wt% or more of all the monomer units constituting the polymer B, and it is preferably 10 wt% or more (more preferably 20 wt% or more, such as 30 wt% or more). ingredient. The ratio of the above-mentioned common monomer units to all the monomer units constituting the polymer A may be, for example, 1% by weight or more, preferably 3% by weight or more, more preferably 5% by weight or more, and may also be 7% by weight. %the above. When the ratio of the common monomer unit to all the monomer units constituting the polymer A becomes high, the effect of improving the compatibility tends to be exhibited more favorably. In addition, considering the balance with other characteristics, the ratio of common monomer units to all monomer units constituting polymer A may be 50% by weight or less, 30% by weight or less, and 15% by weight. the following. Non-limiting examples of monomers that can be used as common monomer units include MMA, BMA, 2EHMA, methyl acrylate (MA), BA, 2EHA, cyclohexyl (meth) acrylate, (Meth) acrylate isoester, dicyclopentyl (meth) acrylate, and the like.

聚合物B之Mw並無特別限定。聚合物B之Mw例如可為1000以上,亦可為5000以上。就提高由加熱所產生之黏著力上升性之觀點而言,於若干種態樣中,聚合物B之Mw例如可為10000以上,可為12000以上,可為15000以上,可為17000以上,亦可為20000以上。又,聚合物B之Mw例如可為500000以下,亦可為350000以下。於局部去除步驟中,就容易將第二區域自被黏著體剝離之觀點而言,於若干種態樣中,聚合物B之Mw例如可為100000以下,可為70000以下,可為50000以下,可未達50000,可未達40000,可未達35000,可為30000以下,可為28000以下,亦可為25000以下。若聚合物B之Mw為上述任一上限值及下限值之範圍內,則容易將黏著劑層內之相溶性或移動性調節為適度之範圍,容易以較高之水準同時實現局部去除步驟中之低黏著性與黏著力上升步驟後之強黏著性。The Mw of the polymer B is not particularly limited. The Mw of the polymer B may be, for example, 1,000 or more, and may be 5,000 or more. From the viewpoint of improving the adhesiveness increase property caused by heating, in some aspects, the Mw of the polymer B may be, for example, 10,000 or more, 12,000 or more, 15,000 or more, or 17,000 or more. Can be more than 20,000. The Mw of the polymer B may be, for example, 500,000 or less, or may be 350,000 or less. In the partial removal step, from the viewpoint of easily peeling the second region from the adherend, in several aspects, the Mw of the polymer B may be, for example, 100,000 or less, 70,000 or less, or 50,000 or less, It can be less than 50,000, it can be less than 40,000, it can be less than 35,000, it can be less than 30,000, it can be less than 28,000, or it can be less than 25,000. If the Mw of the polymer B is within the range of any of the above upper and lower limits, it is easy to adjust the compatibility or mobility in the adhesive layer to a moderate range, and it is easy to achieve local removal at a higher level at the same time. Low adhesion in the step and strong adhesion after the step of increasing the adhesion.

聚合物B例如可藉由利用溶液聚合法、乳液聚合法、塊體聚合法、懸濁聚合法、光聚合法等公知方法使上述單體聚合而製作。The polymer B can be produced, for example, by polymerizing the monomers by a known method such as a solution polymerization method, an emulsion polymerization method, a block polymerization method, a suspension polymerization method, and a photopolymerization method.

為了調整聚合物B之分子量,可使用鏈轉移劑。作為所使用之鏈轉移劑之例,可列舉:辛基硫醇、月桂基硫醇、第三壬基硫醇、第三(十二烷基)硫醇、巰基乙醇、α-硫甘油等具有巰基之化合物;硫代乙醇酸;硫代乙醇酸甲酯、硫代乙醇酸乙酯、硫代乙醇酸丙酯、硫代乙醇酸丁酯、硫代乙醇酸第三丁酯、硫代乙醇酸2-乙基己酯、硫代乙醇酸辛酯、硫代乙醇酸異辛酯、硫代乙醇酸癸酯、硫代乙醇酸十二烷基酯、乙二醇之硫代乙醇酸酯、新戊二醇之硫代乙醇酸酯、季戊四醇之硫代乙醇酸酯等硫代乙醇酸酯類;α-甲基苯乙烯二聚物等。In order to adjust the molecular weight of the polymer B, a chain transfer agent can be used. Examples of the chain transfer agent used include octyl mercaptan, lauryl mercaptan, third nonyl mercaptan, third (dodecyl) mercaptan, mercaptoethanol, and α-thioglycerol. Thiol compounds; Thioglycolic acid; Methyl thioglycolate, ethyl thioglycolate, propyl thioglycolate, butyl thioglycolate, third butyl thioglycolate, thioglycolic acid 2-ethylhexyl ester, octyl thioglycolate, isooctyl thioglycolate, decyl thioglycolate, dodecyl thioglycolate, thioglycolate of ethylene glycol, neopentyl Thioglycolates such as thioglycolates of diols and thioglycolates of pentaerythritol; α-methylstyrene dimers, etc.

作為鏈轉移劑之使用量,並無特別限制,通常相對於單體100重量份,適宜設為0.05重量份~20重量份,較佳為0.1重量份~15重量份,進而較佳為0.2重量份~10重量份。藉由如此調整鏈轉移劑之使用量,可獲得較佳之分子量之聚合物B。鏈轉移劑可單獨使用一種或組合兩種以上使用。The use amount of the chain transfer agent is not particularly limited, but it is generally suitably set to 0.05 to 20 parts by weight, preferably 0.1 to 15 parts by weight, and more preferably 0.2 to 100 parts by weight of the monomer. Parts to 10 parts by weight. By adjusting the use amount of the chain transfer agent in this way, a polymer B having a preferable molecular weight can be obtained. The chain transfer agent may be used singly or in combination of two or more kinds.

聚合物B之使用量相對於聚合物A之使用量100重量份,例如可設為0.1重量份以上,就獲得更高之效果之觀點而言,可設為0.3重量份以上,可設為0.4重量份以上,可設為0.5重量份以上,亦可設為1重量份以上或2重量份以上,但並無特別限定。又,就避免凝聚力之過度之降低之觀點而言,聚合物B之使用量相對於100重量份聚合物A例如可為75重量份以下,可為50重量份以下,可為20重量份以下,可為10重量份以下,可為8重量份以下,亦可為5重量份以下。The used amount of the polymer B is 100 parts by weight relative to the used amount of the polymer A. For example, it can be set to 0.1 parts by weight or more. From the viewpoint of obtaining a higher effect, it can be set to 0.3 parts by weight or more, and can be set to 0.4. Although it is 0.5 weight part or more, it may be 1 weight part or more, or 2 weight part or more, but it does not specifically limit. From the viewpoint of avoiding excessive reduction in cohesion, the amount of polymer B used may be, for example, 75 parts by weight or less, 50 parts by weight or less, and 20 parts by weight or less with respect to 100 parts by weight of polymer A. It may be 10 parts by weight or less, 8 parts by weight or less, and 5 parts by weight or less.

黏著劑層可於不會大幅地損及藉由此處所揭示之技術所獲得之效果之範圍內,視需要含有聚合物A及聚合物B以外之聚合物(任意聚合物)。此種任意聚合物之使用量通常適宜設為黏著劑層中所含之全部聚合物成分之20重量%以下。於若干種態樣中,上述任意聚合物之使用量可為上述全部聚合物成分之5重量%以下,亦可為1重量%以下。亦可為實質上不含聚合物A及聚合物B以外之聚合物之黏著劑層。The adhesive layer may contain a polymer (an arbitrary polymer) other than the polymer A and the polymer B as needed, as long as the effect obtained by the technology disclosed herein is not significantly impaired. The use amount of such an arbitrary polymer is usually suitably set to 20% by weight or less of the total polymer components contained in the adhesive layer. In several aspects, the amount of the above-mentioned arbitrary polymer may be 5% by weight or less, and may also be 1% by weight or less. It may also be an adhesive layer which does not substantially contain polymers other than polymer A and polymer B.

(交聯劑)
於黏著劑層中,可以調整凝聚力等為目的視需要使用交聯劑。作為交聯劑,可使用黏著劑之領域中公知之交聯劑,例如可列舉:異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等。尤佳為異氰酸酯系交聯劑、環氧系交聯劑、金屬螯合物系交聯劑。交聯劑可單獨使用一種或組合兩種以上使用。此處所揭示之技術可以至少使用異氰酸酯系交聯劑作為交聯劑之態樣良好地實施。
(Crosslinking agent)
In the adhesive layer, a cross-linking agent can be used as necessary for the purpose of adjusting cohesion and the like. As the cross-linking agent, cross-linking agents known in the field of adhesives can be used, and examples thereof include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, Carbodiimide-based crosslinking agents, metal chelate-based crosslinking agents, and the like. Particularly preferred are isocyanate-based crosslinking agents, epoxy-based crosslinking agents, and metal chelate-based crosslinking agents. The crosslinking agents may be used singly or in combination of two or more kinds. The technique disclosed here can be implemented well using at least an isocyanate-based crosslinking agent as the crosslinking agent.

作為異氰酸酯系交聯劑之例,可列舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族多異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(例如Tosoh製造之「Coronate L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(例如Tosoh製造之「Coronate HL」)、苯二甲基二異氰酸酯之三羥甲基丙烷加成物(例如三井化學製造之「Takenate D110N」,六亞甲基二異氰酸酯之異氰尿酸酯體(例如Tosoh製造之「Coronate HX」)等異氰酸酯加成物等。Examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butyl diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexyl diisocyanate, isophorone di Cycloaliphatic isocyanates such as isocyanates; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylolpropane / toluene diisocyanate three Polymer adducts (e.g. "Coronate L" manufactured by Tosoh), trimethylolpropane / hexamethylene diisocyanate terpolymer adducts (e.g. "Coronate HL" manufactured by Tosoh), xylylenediamine Isocyanate trimethylolpropane adducts (such as "Takenate D110N" manufactured by Mitsui Chemicals, isocyanurate bodies of hexamethylene diisocyanate (such as "Coronate HX" manufactured by Tosoh), etc. .

作為環氧系交聯劑,可列舉:雙酚A、表氯醇型環氧系樹脂、伸乙基縮水甘油醚、聚乙二醇二縮水甘油醚、甘油二縮水甘油醚、甘油三縮水甘油醚、1,6-己二醇縮水甘油醚、三羥甲基丙烷三縮水甘油醚、二縮水甘油基苯胺、二胺縮水甘油胺、N,N,N',N'-四縮水甘油基間苯二甲胺及1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷等。Examples of the epoxy-based crosslinking agent include bisphenol A, an epichlorohydrin-type epoxy resin, ethylene glycol glycidyl ether, polyethylene glycol diglycidyl ether, glycerol diglycidyl ether, and glycerol triglycidyl. Ether, 1,6-hexanediol glycidyl ether, trimethylolpropane triglycidyl ether, diglycidylaniline, diamine glycidylamine, N, N, N ', N'-tetraglycidyl group Xylylenediamine and 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane.

使用交聯劑之情形時之使用量並無特別限定,例如相對於100重量份聚合物A可設為超過0重量份之量。於若干種態樣中,交聯劑之使用量相對於100重量份聚合物A,例如可為0.01重量份以上,可為0.05重量份以上,亦可為0.1重量份以上、0.5重量份以上、1重量份以上、1.5重量份以上或2重量份以上。藉由增大交聯劑之使用量,有獲得更高之凝聚力之傾向。另一方面,就避免因過度之凝聚力提高所致之黏性降低之觀點而言,交聯劑之使用量相對於100重量份聚合物A,通常適宜設為15重量份以下,可設為10重量份以下,亦可設為5重量份以下。交聯劑之使用量不過多就利用黏著劑之流動性而更良好地表現出聚合物B之使用效果之觀點而言亦可能變得有利。When the crosslinking agent is used, the amount used is not particularly limited, and for example, it can be set to an amount exceeding 0 parts by weight based on 100 parts by weight of the polymer A. In several aspects, the amount of the cross-linking agent used may be, for example, 0.01 parts by weight or more, 0.05 parts by weight or more, or 0.1 parts by weight, 0.5 parts by weight or more, relative to 100 parts by weight of the polymer A. 1 part by weight or more, 1.5 parts by weight or more, or 2 parts by weight or more. By increasing the amount of cross-linking agent used, there is a tendency to obtain higher cohesion. On the other hand, from the viewpoint of avoiding a decrease in viscosity due to an excessive increase in cohesive force, the amount of the crosslinking agent to be used is usually 15 parts by weight or less relative to 100 parts by weight of the polymer A, and may be set to 10 It may be 5 parts by weight or less. The use amount of the cross-linking agent is not too much. It may also be advantageous from the viewpoint of utilizing the fluidity of the adhesive to better exhibit the use effect of the polymer B.

為了更有效地進行交聯反應,亦可使用交聯觸媒。作為交聯觸媒,可例示:鈦酸四正丁酯、鈦酸四異丙酯、乙醯丙酮鐵、氧化丁基錫、二月桂酸二辛基錫等金屬系交聯觸媒等。其中,較佳為二月桂酸二辛基錫等錫系交聯觸媒。交聯觸媒之使用量並無特別限制,例如相對於100重量份聚合物A可設為約0.0001重量份~1重量份(典型而言為0.05重量份以下)。In order to perform the crosslinking reaction more efficiently, a crosslinking catalyst may be used. Examples of the cross-linking catalyst include metal-based cross-linking catalysts such as tetra-n-butyl titanate, tetra-isopropyl titanate, iron acetoacetone, butyl tin oxide, and dioctyl tin dilaurate. Among them, tin-based crosslinking catalysts such as dioctyltin dilaurate are preferred. The use amount of the cross-linking catalyst is not particularly limited. For example, it can be set to about 0.0001 to 1 part by weight (typically 0.05 part by weight or less) based on 100 parts by weight of the polymer A.

於黏著劑層中可視需要使用多官能性單體。多官能性單體藉由代替如上所述之交聯劑、或與該交聯劑組合使用,可有助於實現凝聚力之調整等目的。例如於由光硬化型黏著劑組合物所形成之黏著劑層中,可良好地使用多官能性單體。
作為多官能性單體,例如可列舉:乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸烯丙酯、(甲基)丙烯酸乙烯酯、二乙烯苯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯、丁二醇(甲基)丙烯酸酯、己二醇二(甲基)丙烯酸酯等。其中,可良好地使用三羥甲基丙烷三(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯。多官能性單體可單獨使用一種或組合兩種以上使用。
If necessary, a polyfunctional monomer may be used in the adhesive layer. The polyfunctional monomer can be used for the purpose of adjusting the cohesive force, etc. by replacing or using the cross-linking agent in combination with the cross-linking agent. For example, a polyfunctional monomer can be used favorably in the adhesive layer formed from a photocurable adhesive composition.
Examples of the polyfunctional monomer include ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, and polypropylene glycol di (meth) Acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ethylene glycol di (methyl) ) Acrylate, 1,6-hexanediol di (meth) acrylate, 1,12-dodecanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetra Methylol methane tri (meth) acrylate, allyl (meth) acrylate, vinyl (meth) acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, acrylic urethane, Butanediol (meth) acrylate, hexanediol di (meth) acrylate, and the like. Among them, trimethylolpropane tri (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and dipentaerythritol hexa (meth) acrylate can be favorably used. The polyfunctional monomer may be used singly or in combination of two or more kinds.

多官能性單體之使用量根據其分子量或官能基數等而不同,通常相對於100重量份聚合物A適宜設為0.01重量份~3.0重量份左右之範圍。於若干種態樣中,多官能性單體之使用量相對於100重量份聚合物A,例如可為0.02重量份以上,亦可為0.03重量份以上。藉由增大多官能性單體之使用量,有獲得更高之凝聚力之傾向。另一方面,就避免因過度之凝聚力提高所致之黏性之降低之觀點而言,多官能性單體之使用量相對於100重量份聚合物A可為2.0重量份以下,可為1.0重量份以下,亦可為0.5重量份以下。多官能性單體之使用量不過多就利用黏著劑之流動性而更良好地表現聚合物B之使用效果之觀點而言可能變得有利。The used amount of the polyfunctional monomer varies depending on the molecular weight, the number of functional groups, and the like, and is generally suitably set to a range of about 0.01 to 3.0 parts by weight based on 100 parts by weight of the polymer A. In several aspects, the amount of the polyfunctional monomer used may be, for example, 0.02 parts by weight or more and 0.03 parts by weight or more relative to 100 parts by weight of the polymer A. By increasing the amount of the polyfunctional monomer used, a higher cohesive force tends to be obtained. On the other hand, from the viewpoint of avoiding a decrease in viscosity due to an excessive increase in cohesive force, the amount of the polyfunctional monomer used may be 2.0 parts by weight or less and may be 1.0 weight based on 100 parts by weight of polymer A It may be 0.5 parts by weight or less. The use amount of the polyfunctional monomer is not too much, which may be advantageous from the viewpoint of utilizing the fluidity of the adhesive to better express the use effect of the polymer B.

(黏著賦予樹脂)
黏著劑層中可視需要含有黏著賦予樹脂。作為黏著賦予樹脂,並無特別限制,例如可列舉:松香系黏著賦予樹脂、萜烯系黏著賦予樹脂、酚系黏著賦予樹脂、烴系黏著賦予樹脂、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。黏著賦予樹脂可單獨使用一種或組合兩種以上使用。
(Adhesion imparting resin)
The adhesive layer may contain an adhesion-imparting resin as needed. The adhesion-imparting resin is not particularly limited, and examples thereof include rosin-based adhesion-imparting resin, terpene-based adhesion-imparting resin, phenol-based adhesion-imparting resin, hydrocarbon-based adhesion-imparting resin, ketone-adhesion-impart resin, and polyamide adhesion Resin imparting, epoxy-based adhesive imparting resin, elastic system adhesive imparting resin, and the like. The adhesion-imparting resin may be used alone or in combination of two or more.

於使黏著劑層含有黏著賦予樹脂之態樣中,該黏著賦予樹脂之含量並無特別限定,可以視目的或用途發揮適當之黏著性能之方式設定。黏著賦予樹脂相對於100重量份聚合物A之含量(於含有兩種以上之黏著賦予樹脂之情形時為該等之合計量)例如可設為5~500重量份左右。再者,此處所揭示之技術亦可以黏著賦予樹脂之含量相對於100重量份聚合物A未達5重量份、未達2重量份或未達1重量份之態樣、或者黏著劑層實質上不含黏著賦予樹脂之態樣良好地實施。In a state in which the adhesive layer contains the adhesion-imparting resin, the content of the adhesion-imparting resin is not particularly limited, and it can be set in such a manner as to exert appropriate adhesion performance depending on the purpose or application. The content of the adhesion-imparting resin with respect to 100 parts by weight of the polymer A (the total amount when the two or more adhesion-imparting resins are contained) can be set to about 5 to 500 parts by weight, for example. In addition, the technology disclosed herein can also adhere to a resin content of less than 5 parts by weight, less than 2 parts by weight, or less than 1 part by weight relative to 100 parts by weight of polymer A, or the adhesive layer can be substantially The implementation without the adhesion-imparting resin is well performed.

作為黏著賦予樹脂,可良好地使用軟化點(軟化溫度)為約80℃以上(較佳為約100℃以上、例如約120℃以上)者。根據具有上述下限值以上之軟化點之黏著賦予樹脂,存在有效地改善初期低黏著性及積層體使用時之強黏著性的傾向。軟化點之上限並無特別限制,例如可為約200℃以下(典型而言180℃以下)。黏著賦予樹脂之軟化點可基於JIS K2207所規定之軟化點試驗方法(環球法)進行測定。As the adhesion-imparting resin, those having a softening point (softening temperature) of about 80 ° C. or higher (preferably about 100 ° C. or higher, for example, about 120 ° C. or higher) can be favorably used. The adhesion-imparting resin having a softening point of the above lower limit value or more tends to effectively improve the initial low adhesion and the strong adhesion when the laminate is used. The upper limit of the softening point is not particularly limited, and may be, for example, about 200 ° C or lower (typically 180 ° C or lower). The softening point of the adhesion-imparting resin can be measured based on the softening point test method (ring and ball method) specified in JIS K2207.

(黏著劑層之形成)
黏著劑層(1)可為黏著劑組合物之硬化層。即,該黏著劑層(1)可藉由將水分散型、溶劑型、光硬化型、熱熔型等之黏著劑組合物塗佈於適當之表面後適當實施硬化處理而形成。於進行兩種以上之硬化處理(乾燥、交聯、聚合、冷卻等)之情形時,該等可同時進行、或以多階段進行。於使用單體成分之部分聚合物(丙烯酸系聚合物漿液)之黏著劑組合物中,典型而言,作為上述硬化處理,進行最終之共聚反應。即,將部分聚合物供於進一步之共聚反應而形成完全聚合物。例如若為光硬化性之黏著劑組合物,則實施光照射。亦可視需要實施交聯、乾燥等硬化處理。例如於必須以光硬化性黏著劑組合物進行乾燥之情形時,於乾燥後進行光硬化即可。於使用完全聚合物之黏著劑組合物中,典型而言,作為上述硬化處理,視需要實施乾燥(加熱乾燥)、交聯等處理。
(Formation of adhesive layer)
The adhesive layer (1) may be a hardened layer of the adhesive composition. That is, the adhesive layer (1) can be formed by applying an adhesive composition such as a water-dispersible type, a solvent type, a photo-hardening type, a hot-melt type, or the like to an appropriate surface and then performing a curing treatment as appropriate. When two or more types of hardening treatments (drying, crosslinking, polymerization, cooling, etc.) are performed, these can be performed simultaneously or in multiple stages. In the adhesive composition of a part of the polymer (acrylic polymer slurry) using a monomer component, the final copolymerization reaction is typically performed as the above-mentioned hardening treatment. That is, a part of the polymer is subjected to a further copolymerization reaction to form a complete polymer. For example, if it is a photocurable adhesive composition, light irradiation is performed. Hardening treatments such as cross-linking and drying can also be performed if necessary. For example, when it is necessary to dry with a photocurable adhesive composition, it is sufficient to perform photocuring after drying. In the adhesive composition using a complete polymer, typically, as the above-mentioned hardening treatment, treatments such as drying (heat-drying) and crosslinking are performed as necessary.

黏著劑組合物之塗佈例如可使用凹版輥式塗佈機、逆輥塗佈機、接觸輥塗佈機、浸漬輥塗機、棒式塗佈機、刮刀塗佈機、噴霧塗佈機等慣用之塗佈機實施。用於下述黏著劑層(2)之形成之黏著劑組合物及其他黏著劑組合物之塗佈亦可藉由相同之方式實施。For the application of the adhesive composition, for example, a gravure roll coater, a reverse roll coater, a touch roll coater, a dip roll coater, a bar coater, a blade coater, a spray coater, or the like can be used. The conventional coating machine is used. The coating of the adhesive composition used for the formation of the following adhesive layer (2) and other adhesive compositions can also be performed in the same manner.

<由含有基礎聚合物P及光硬化劑之光硬化性組合物所形成之黏著劑層>
黏著劑層(2)含有基礎聚合物P及光硬化劑,顯示出藉由活性光線(例如UV)之照射而硬化從而黏著力提高之性質。因此,可以於黏著力提高步驟中進行活性光線之照射作為引起黏著力上升之刺激之態樣良好地用於此處所揭示之積層體製造方法。就提高利用活性光線照射之硬化效率之觀點而言,構成黏著劑層(2)之黏著劑組合物(光硬化性組合物)較佳為含有光起始劑。就抑制於使光硬化前之黏著劑層變硬、於局部去除步驟中將第二區域之黏著片材剝離去除時黏著劑殘留於被黏著體上之現象、即糊劑殘留現象之觀點而言,較佳為對基礎聚合物P導入交聯結構。
<Adhesive layer formed from a photocurable composition containing a base polymer P and a photohardener>
The adhesive layer (2) contains a base polymer P and a photo-hardening agent, and exhibits a property of being hardened by irradiation with active light (for example, UV) to improve adhesion. Therefore, the irradiation of active light in the adhesion improvement step can be favorably used in the laminated body manufacturing method disclosed herein as a stimulus that causes an increase in adhesion. From the viewpoint of improving the curing efficiency by irradiation with active light, the adhesive composition (photocurable composition) constituting the adhesive layer (2) preferably contains a photoinitiator. From the viewpoint of suppressing the phenomenon that the adhesive layer is hardened before photo-hardening and the adhesive sheet remains on the adherend when the adhesive sheet in the second region is peeled and removed in the partial removal step, that is, the paste remaining phenomenon Preferably, a crosslinked structure is introduced into the base polymer P.

(基礎聚合物P)
作為黏著劑層(2)之基礎聚合物P(以下,有時簡稱為「聚合物P」),就光學透明性等觀點而言,可良好地使用丙烯酸系聚合物。例如較佳為黏著劑層(2)之50重量%以上為丙烯酸系聚合物。作為丙烯酸系聚合物,可良好地使用其構成單體成分總量中之40重量%以上為與上述聚合物A相同之(甲基)丙烯酸烷基酯。
(Base polymer P)
As the base polymer P (hereinafter, sometimes referred to simply as "polymer P") of the adhesive layer (2), an acrylic polymer can be suitably used from the viewpoint of optical transparency and the like. For example, 50% by weight or more of the adhesive layer (2) is preferably an acrylic polymer. As the acrylic polymer, an alkyl (meth) acrylate in which 40% by weight or more of the total constituent monomer components are the same as the polymer A described above can be used favorably.

丙烯酸系聚合物較佳為含有具有能夠進行交聯之官能基之單體成分作為共聚成分。作為具有能夠進行交聯之官能基之單體,可列舉含羥基單體或含羧基單體。作為含羥基單體及含羧基單體之例,可列舉與作為黏著劑層(1)中所含之聚合物A之構成單體成分所例示之單體相同者。其中,較佳為含有含羥基單體。聚合物P之羥基或羧基成為與下述交聯劑之反應點。藉由對聚合物P導入交聯結構,凝聚力提高,黏著劑層(2)之接著性提高,並且黏著劑之流動性降低,因此有局部去除步驟中於被黏著體之糊劑殘留減少之傾向。The acrylic polymer preferably contains a monomer component having a functional group capable of crosslinking as a copolymerization component. Examples of the monomer having a functional group capable of crosslinking include a hydroxyl-containing monomer or a carboxyl-containing monomer. Examples of the hydroxyl-containing monomer and the carboxyl-containing monomer include the same monomers as those exemplified as the constituent monomer component of the polymer A contained in the adhesive layer (1). Among these, it is preferable to contain a hydroxyl-containing monomer. The hydroxyl group or carboxyl group of the polymer P becomes a reaction point with the following crosslinking agent. By introducing a cross-linked structure to the polymer P, the cohesive force is improved, the adhesiveness of the adhesive layer (2) is improved, and the fluidity of the adhesive is reduced. Therefore, there is a tendency that the paste residue in the adherend is reduced during the partial removal step. .

丙烯酸系聚合物中,含羥基單體與含羧基單體之合計量相對於構成單體成分總量較佳為1~30重量%,更佳為3~25重量%,進而較佳為5~20重量%。尤佳為含有羥基之(甲基)丙烯酸酯之含量為上述範圍。In the acrylic polymer, the total amount of the hydroxyl-containing monomer and the carboxyl-containing monomer is preferably 1 to 30% by weight, more preferably 3 to 25% by weight, and still more preferably 5 to 3% by weight based on the total amount of the constituent monomer components. 20% by weight. It is particularly preferred that the content of the (meth) acrylate containing a hydroxyl group is in the above range.

丙烯酸系聚合物較佳為含有含氮單體作為構成單體成分。作為含氮單體之例,可列舉與作為黏著劑層(1)中所含之聚合物A之構成單體成分所例示之單體相同者。含氮單體之含量相對於構成單體成分總量較佳為1~30重量%,更佳為3~25重量%,進而較佳為5~20重量%。丙烯酸系聚合物較佳為於上述範圍內含有N-乙烯基吡咯啶酮作為含氮單體。The acrylic polymer preferably contains a nitrogen-containing monomer as a constituent monomer component. Examples of the nitrogen-containing monomer include the same monomers as those exemplified as the constituent monomer component of the polymer A contained in the adhesive layer (1). The content of the nitrogen-containing monomer is preferably 1 to 30% by weight, more preferably 3 to 25% by weight, and still more preferably 5 to 20% by weight based on the total amount of the constituent monomer components. The acrylic polymer preferably contains N-vinylpyrrolidone as a nitrogen-containing monomer within the above range.

於丙烯酸系聚合物含有含羥基單體與含氮單體兩者作為單體成分之情形時,有提高黏著劑之凝聚力及透明性之傾向。丙烯酸系聚合物中,含羥基單體與含氮單體之合計量相對於構成單體成分總量較佳為5~50重量%,更佳為10~40重量%,進而較佳為15~35重量%。When the acrylic polymer contains both a hydroxyl-containing monomer and a nitrogen-containing monomer as monomer components, there is a tendency that the cohesive force and transparency of the adhesive are improved. In the acrylic polymer, the total amount of the hydroxyl-containing monomer and the nitrogen-containing monomer is preferably 5 to 50% by weight, more preferably 10 to 40% by weight, and still more preferably 15 to 50% by weight based on the total amount of the constituent monomer components. 35% by weight.

丙烯酸系聚合物亦可含有上述以外之單體成分,例如含氰基單體、乙烯酯單體、芳香族乙烯基單體、含環氧基單體、乙烯醚單體、含磺基單體、含磷酸基單體、含酸酐基單體等。The acrylic polymer may contain monomer components other than the above, such as cyano-containing monomers, vinyl ester monomers, aromatic vinyl monomers, epoxy-containing monomers, vinyl ether monomers, and sulfo-containing monomers. , Phosphate group-containing monomers, acid anhydride group-containing monomers, and the like.

丙烯酸系聚合物中,均聚物之Tg為40℃以上之單體之含量相對於該丙烯酸系聚合物之構成單體成分總量較佳為5~50重量%,更佳為10~40重量%。就抑制局部去除步驟中之糊劑殘留之觀點而言,聚合物P之構成單體成分較佳為含有均聚物之Tg為80℃以上之單體成分,更佳為含有均聚物之Tg為100℃以上之單體成分。丙烯酸系聚合物中,均聚物之Tg為100℃以上之單體之含量相對於構成單體成分總量較佳為0.1重量%以上,更佳為0.5重量%以上,進而較佳為1重量%以上,尤佳為3重量%以上。尤佳為MMA之含量為上述範圍。再者,用作聚合物P之丙烯酸系聚合物之Tg之較佳範圍可與上述聚合物A之較佳Tg相同。In the acrylic polymer, the content of the monomer having a Tg of 40% or more of the homopolymer is preferably 5 to 50% by weight, and more preferably 10 to 40% by weight based on the total amount of constituent monomer components of the acrylic polymer. %. From the viewpoint of suppressing the paste residue in the local removal step, the constituent monomer component of the polymer P is preferably a monomer component containing a homopolymer having a Tg of 80 ° C. or higher, and more preferably a homopolymer containing Tg It is a monomer component of 100 ° C or higher. In the acrylic polymer, the content of the monomer having a Tg of 100 ° C. or more of the homopolymer is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and further preferably 1% by weight based on the total amount of the constituent monomer components. % Or more, particularly preferably 3% by weight or more. It is particularly preferred that the content of MMA is in the above range. Furthermore, the preferable range of Tg of the acrylic polymer used as the polymer P may be the same as the preferable Tg of the polymer A described above.

丙烯酸系聚合物可與黏著劑層(1)中所含之聚合物A同樣地藉由公知之各種聚合方法而獲得。例如可良好地採用溶液聚合法。The acrylic polymer can be obtained by various known polymerization methods in the same manner as the polymer A contained in the adhesive layer (1). For example, a solution polymerization method can be favorably used.

光硬化前之黏著劑層之接著力容易受聚合物P之構成成分及分子量影響。就同時實現適度之接著性與局部去除步驟中抑制糊劑殘留之觀點而言,丙烯酸系聚合物之重量平均分子量較佳為10萬~500萬,更佳為30萬~300萬,進而較佳為50萬~200萬。再者,於對聚合物P導入交聯結構之情形時,聚合物P之分子量係指導入交聯結構前之分子量。The adhesion of the adhesive layer before photo-curing is easily affected by the constituent components and molecular weight of the polymer P. From the viewpoint of achieving both moderate adhesion and suppression of paste residue in the local removal step, the weight average molecular weight of the acrylic polymer is preferably 100,000 to 5 million, more preferably 300,000 to 3 million, and even more preferably It is 500,000 to 2 million. When a crosslinked structure is introduced into the polymer P, the molecular weight of the polymer P refers to the molecular weight before the crosslinked structure is introduced.

(交聯劑)
就使黏著劑具有適度之凝聚力之觀點而言,較佳為對聚合物P導入交聯結構。例如藉由於使聚合物P聚合後之溶液中添加交聯劑,且視需要進行加熱,而導入交聯結構。作為交聯劑,可列舉:異氰酸酯系交聯劑、環氧系交聯劑、㗁唑啉系交聯劑、氮丙啶系交聯劑、碳二醯亞胺系交聯劑、金屬螯合物系交聯劑等。該等交聯劑與導入至聚合物P之羥基等官能基進行反應而形成交聯結構。作為異氰酸酯系交聯劑,可使用與黏著劑層(1)相同者。
(Crosslinking agent)
From the viewpoint of imparting an appropriate cohesive force to the adhesive, it is preferable to introduce a crosslinked structure into the polymer P. For example, a cross-linking structure is introduced by adding a cross-linking agent to the solution after polymerizing the polymer P and heating it as necessary. Examples of the crosslinking agent include an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, an oxazoline-based crosslinking agent, an aziridine-based crosslinking agent, a carbodiimide-based crosslinking agent, and a metal chelate. Cross-linking agents. These crosslinking agents react with a functional group such as a hydroxyl group introduced into the polymer P to form a crosslinked structure. As the isocyanate-based crosslinking agent, the same one as the adhesive layer (1) can be used.

交聯劑之使用量只要根據聚合物P之組成或分子量等而適當調整即可。交聯劑之使用量相對於100重量份聚合物P,例如可為0.1~10重量份左右,較佳為0.3~7重量份,更佳為0.5~5重量份,進而較佳為1~4重量份。為了促進交聯結構之形成,亦可與黏著劑層(1)同樣地使用交聯觸媒。The amount of the crosslinking agent used may be appropriately adjusted according to the composition, molecular weight, and the like of the polymer P. The amount of the cross-linking agent to be used is, for example, about 0.1 to 10 parts by weight, preferably 0.3 to 7 parts by weight, more preferably 0.5 to 5 parts by weight, and even more preferably 1 to 4 parts with respect to 100 parts by weight of the polymer P. Parts by weight. In order to promote the formation of a cross-linked structure, a cross-linking catalyst may be used in the same manner as the adhesive layer (1).

(光硬化劑)
構成黏著劑層(2)之黏著劑組合物構成為,藉由除含有聚合物P以外亦含有光硬化劑而顯示出光硬化性。黏著劑層(2)顯示出如下性質:藉由在與被黏著體貼合後進行活性光線之照射作為使黏著力上升之刺激,而進行光硬化,黏著力提高。
(Light hardener)
The pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer (2) is configured to exhibit a light-curing property by containing a light-curing agent in addition to the polymer P. The adhesive layer (2) exhibits the following properties: by irradiating active light after bonding with the adherend, as a stimulus for increasing the adhesive force, light curing is performed to improve the adhesive force.

作為光硬化劑,可使用光硬化性單體、或光硬化性低聚物。作為光硬化劑,較佳為於1分子中具有2個以上之乙烯性不飽和鍵之化合物。又,光硬化劑較佳為顯示出與聚合物P之相溶性之化合物。就顯示出與聚合物P之適度之相溶性之方面而言,光硬化劑較佳為於常溫下為液體者。藉由光硬化劑與聚合物P相溶,於組合物中均勻地分散,而能夠確保與被黏著體之接觸面積,且可形成透明性較高之黏著劑層(2)。As the photocuring agent, a photocurable monomer or a photocurable oligomer can be used. As the photohardening agent, a compound having two or more ethylenically unsaturated bonds in one molecule is preferred. The photo-curing agent is preferably a compound exhibiting compatibility with the polymer P. In terms of exhibiting a moderate compatibility with the polymer P, the photohardener is preferably a liquid at normal temperature. The photohardening agent is compatible with the polymer P and is uniformly dispersed in the composition, thereby ensuring a contact area with the adherend and forming an adhesive layer (2) having high transparency.

聚合物P與光硬化劑之相溶性主要受到化合物之結構之影響。化合物之結構與相溶性例如可藉由Hansen溶解度參數進行評價,有聚合物P與光硬化劑之溶解度參數之差越小則相溶性變得越高之傾向。The compatibility of the polymer P with the light hardener is mainly affected by the structure of the compound. The structure and compatibility of a compound can be evaluated by, for example, Hansen solubility parameters. The smaller the difference between the solubility parameters of the polymer P and the photohardener, the higher the compatibility tends to become.

就與丙烯酸系聚合物之相溶性較高之方面而言,較佳為使用多官能(甲基)丙烯酸酯作為光硬化劑。作為多官能(甲基)丙烯酸酯,可列舉:聚乙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、聚四亞甲基二醇二(甲基)丙烯酸酯、雙酚A環氧乙烷改性二(甲基)丙烯酸酯、雙酚A環氧丙烷改性二(甲基)丙烯酸酯、烷二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙烯酸酯、乙氧基化異三聚氰酸三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、二(三羥甲基丙烷)四(甲基)丙烯酸酯、乙氧基化季戊四醇四(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇聚(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、(甲基)丙烯酸胺基甲酸酯、環氧(甲基)丙烯酸酯、丁二烯(甲基)丙烯酸酯、異戊二烯(甲基)丙烯酸酯等。In terms of high compatibility with an acrylic polymer, it is preferable to use a polyfunctional (meth) acrylate as a light hardener. Examples of the polyfunctional (meth) acrylate include polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, polytetramethylene glycol di (meth) acrylate, Bisphenol A ethylene oxide modified di (meth) acrylate, bisphenol A propylene oxide modified di (meth) acrylate, alkanediol di (meth) acrylate, tricyclodecane dimethanol Di (meth) acrylate, ethoxylated isotricyanate tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri ( (Meth) acrylate, bis (trimethylolpropane) tetra (meth) acrylate, ethoxylated pentaerythritol tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol poly (methyl) ) Acrylate, dipentaerythritol hexa (meth) acrylate, neopentyl glycol di (meth) acrylate, glycerol di (meth) acrylate, (meth) acrylate urethane, epoxy (formaldehyde) Group) acrylate, butadiene (meth) acrylate, isoprene (meth) acrylate, and the like.

聚合物P與光硬化劑之相溶性亦受化合物之分子量影響。有光硬化性化合物之分子量越小則與聚合物P之相溶性變得越高之傾向。就與聚合物P之相溶性之觀點而言,光硬化劑之分子量較佳為1500以下,更佳為1000以下。The compatibility of the polymer P with the light hardener is also affected by the molecular weight of the compound. The smaller the molecular weight of the photocurable compound, the higher the compatibility with the polymer P tends to be. From the viewpoint of compatibility with the polymer P, the molecular weight of the photocuring agent is preferably 1500 or less, and more preferably 1,000 or less.

光硬化劑之種類或含量主要對光硬化後之黏著力產生影響。有官能基當量越小(即,每單位分子量之官能基數越大),光硬化劑之含量越大,則光硬化後之黏著力變得越大之傾向。The type or content of light hardener mainly affects the adhesion after light hardening. The smaller the functional group equivalent (that is, the larger the number of functional groups per unit molecular weight), the larger the content of the photohardening agent, and the larger the adhesive force after photohardening tends to become.

就提高光硬化後之黏著力之觀點而言,光硬化劑之官能基當量(g/eq)較佳為500以下,更佳為450以下。另一方面,若光交聯密度過度地上升,則有黏著劑之黏性降低而導致黏著力降低之情形。因此,光硬化劑之官能基當量較佳為100以上,更佳為130以上,進而較佳為150以上,尤佳為180以上。From the viewpoint of improving the adhesion after light curing, the functional group equivalent (g / eq) of the light curing agent is preferably 500 or less, and more preferably 450 or less. On the other hand, if the photocrosslinking density is excessively increased, the viscosity of the adhesive may be reduced, which may result in a decrease in adhesion. Therefore, the functional group equivalent of the photocuring agent is preferably 100 or more, more preferably 130 or more, even more preferably 150 or more, and even more preferably 180 or more.

於丙烯酸系聚合物與多官能丙烯酸酯光硬化劑之組合中,於光硬化劑之官能基當量較小之情形時,聚合物P與光硬化劑之相互作用較強,有光硬化前之黏著力變高之傾向。於此處所揭示之技術中,就將光硬化前之黏著力抑制為適當之範圍而提高局部去除步驟中之第二區域之去除性之觀點而言,亦較佳為光硬化劑之官能基當量為上述範圍內。In the combination of an acrylic polymer and a polyfunctional acrylate light hardener, when the functional group equivalent of the light hardener is small, the interaction between the polymer P and the light hardener is strong, and there is adhesion before light hardening. Tendency to become higher. In the technique disclosed herein, from the viewpoint of suppressing the adhesive force before photocuring to an appropriate range and improving the removability of the second region in the partial removal step, the functional group equivalent of the photocuring agent is also preferred. Within the above range.

黏著劑組合物中之光硬化劑之含量相對於100重量份聚合物P,較佳為1~50重量份,更佳為5~40重量份,進而較佳為10~35重量份。藉由使光硬化性化合物以未硬化(未反應)之單體或低聚物之形式含有於黏著劑組合物中,可獲得光硬化性之黏著劑層。為了使光硬化劑於未硬化之狀態下含有於組合物中,較佳為於使聚合物P聚合後之聚合物溶液中添加光硬化劑。The content of the light hardener in the adhesive composition is preferably 1 to 50 parts by weight, more preferably 5 to 40 parts by weight, and still more preferably 10 to 35 parts by weight based on 100 parts by weight of the polymer P. When the photocurable compound is contained in the adhesive composition as an uncured (unreacted) monomer or oligomer, a photocurable adhesive layer can be obtained. In order to make the light hardener contained in the composition in an uncured state, it is preferable to add the light hardener to the polymer solution after polymerizing the polymer P.

若黏著劑組合物中之光硬化劑之含量變大,則光硬化劑容易滲出至黏著劑層之表面。若光硬化劑大量地滲出,則容易於去除第二區域後之被黏著體殘留光硬化劑。另一方面,藉由使少量之光硬化劑滲出至表面,能夠抑制黏著劑層對被黏著體之黏著力,良好地同時實現光硬化前之低黏著性與光硬化後之強黏著性。If the content of the light hardening agent in the adhesive composition becomes large, the light hardening agent easily leaks out to the surface of the adhesive layer. If the light hardening agent oozes out in large amounts, it is easy to leave the light hardening agent on the adherend after removing the second region. On the other hand, by exuding a small amount of light curing agent to the surface, the adhesion of the adhesive layer to the adherend can be suppressed, and the low adhesion before light curing and the strong adhesion after light curing can be achieved simultaneously.

(光起始劑)
黏著劑層(2)較佳為含有光起始劑。光起始劑藉由活性光線之照射產生活性種,促進光硬化劑之硬化反應。作為光起始劑,可根據光硬化劑之種類等而使用光陽離子起始劑(光酸產生劑)、光自由基起始劑、光陽離子起始劑(光鹼產生劑)等。於使用多官能丙烯酸酯作為光硬化劑之情形時,較佳為使用光自由基起始劑。作為光自由基起始劑,可列舉:羥基酮類、苯偶醯二甲基縮酮類、胺基酮類、醯基氧化膦類、二苯甲酮類、含三氯甲基之三衍生物等。光自由基產生劑可單獨使用,亦可混合2種以上使用。黏著劑層中之光起始劑之含量相對於黏著劑層之總量100重量份較佳為0.001~10重量份,更佳為0.01~5重量份。
(Light initiator)
The adhesive layer (2) preferably contains a photoinitiator. The photoinitiator generates active species through the irradiation of active light to promote the curing reaction of the photohardener. As a photoinitiator, a photocationic initiator (photoacid generator), a photoradical initiator, a photocationic initiator (photobase generator), etc. can be used according to the kind of photohardening agent and the like. In the case where a polyfunctional acrylate is used as the light hardener, it is preferable to use a photoradical initiator. Examples of the photo-radical initiator include hydroxy ketones, benzophenone dimethyl ketals, amino ketones, fluorenyl phosphine oxides, benzophenones, and tri-derivatives containing trichloromethyl Things. The photo radical generator may be used alone or in combination of two or more. The content of the light initiator in the adhesive layer is preferably 0.001 to 10 parts by weight, and more preferably 0.01 to 5 parts by weight based on 100 parts by weight of the total amount of the adhesive layer.

(其他添加劑)
除上述例示之各成分以外,黏著劑層亦可於不會較大地損及藉由此處所揭示之技術所獲得之效果之範圍內含有矽烷偶合劑、黏著性賦予劑、塑化劑、軟化劑、抗劣化劑、填充劑、著色劑、紫外線吸收劑、抗氧化劑、界面活性劑、抗靜電劑等添加劑。
(Other additives)
In addition to the components exemplified above, the adhesive layer may also contain a silane coupling agent, an adhesiveness imparting agent, a plasticizer, and a softening agent within a range that does not greatly impair the effect obtained by the technology disclosed herein. , Anti-deterioration agents, fillers, colorants, ultraviolet absorbers, antioxidants, surfactants, antistatic agents and other additives.

(黏著劑層之形成)
黏著劑層(2)例如可藉由將含有聚合物P、光硬化劑及視需要使用之其他成分之黏著劑組合物塗佈於適當之表面後,視需要將溶劑乾燥去除而形成。作為乾燥方法,可適當採用適當之方法。加熱乾燥溫度較佳為40℃~200℃,更佳為50℃~180℃,進而較佳為70℃~170℃。乾燥時間較佳為5秒~20分鐘,更佳為5秒~15分鐘,進而較佳為10秒~10分鐘。
(Formation of adhesive layer)
The adhesive layer (2) can be formed, for example, by applying an adhesive composition containing a polymer P, a light hardener, and other components used as needed, to an appropriate surface, and drying and removing the solvent as necessary. As a drying method, an appropriate method can be used suitably. The heating and drying temperature is preferably 40 ° C to 200 ° C, more preferably 50 ° C to 180 ° C, and even more preferably 70 ° C to 170 ° C. The drying time is preferably 5 seconds to 20 minutes, more preferably 5 seconds to 15 minutes, and even more preferably 10 seconds to 10 minutes.

於黏著劑組合物含有交聯劑之情形時,較佳為於溶劑之乾燥之同時、或於溶劑之乾燥後藉由加熱或老化進行交聯。加熱溫度或加熱時間係根據所使用之交聯劑之種類而適當設定,通常於20℃~160℃之範圍內,藉由1分鐘~7天左右之加熱進行交聯。用於將溶劑乾燥去除之加熱亦可兼作用於交聯之加熱。於藉由交聯劑對聚合物導入交聯結構後,光硬化劑亦維持未反應之狀態。因此,形成包含導入了交聯結構之聚合物P與未反應之光硬化劑之光硬化性黏著劑層(2)。When the adhesive composition contains a cross-linking agent, it is preferred to perform the cross-linking by heating or aging while drying the solvent or after drying the solvent. The heating temperature or heating time is appropriately set according to the type of the cross-linking agent to be used, and is usually cross-linked by heating in the range of 20 ° C to 160 ° C for about 1 minute to 7 days. The heating used for drying and removing the solvent can also be used for the heating of crosslinking. After the cross-linking agent is used to introduce a cross-linked structure to the polymer, the photohardener also maintains an unreacted state. Therefore, a photocurable adhesive layer (2) containing the polymer P into which the crosslinked structure is introduced and an unreacted photocuring agent is formed.

(摩擦力)
關於光硬化前之黏著劑層(2),就容易抑制黏著力之觀點而言,較佳為藉由摩擦力顯微鏡(FFM)之輕敲模式測得之頻率5 Hz下之摩擦力為頻率0.1 Hz下之摩擦力之2~5倍。又,於黏著劑層(2)之頻率0.1 Hz與5 Hz之摩擦力之比處於該範圍之情形時,有容易使光硬化後之黏著力較光硬化前大幅地上升之傾向。
(Friction)
Regarding the adhesive layer (2) before photo-hardening, from the viewpoint of easily suppressing the adhesive force, it is preferable that the frictional force at a frequency of 5 Hz measured by a tapping mode of a friction force microscope (FFM) is a frequency of 0.1 2 to 5 times the friction at Hz. In addition, when the ratio of the frictional force between the frequency of 0.1 Hz and 5 Hz of the adhesive layer (2) is in this range, the adhesive force after photo-hardening tends to increase significantly compared with that before photo-hardening.

於FFM中,將於掃描式探針顯微鏡(SPM)之探針與試樣表面之間作用之力轉換為懸臂之板彈簧之位移(扭轉量),電性地檢測出該位移。位移量與差分電壓成比例,摩擦力與懸臂之彈簧常數及位移量成比例。因此,摩擦力與FFM差分電壓成比例。頻率5 Hz下之摩擦力與頻率0.1 Hz下之摩擦力之比與兩者之FFM差分信號之比相等。In FFM, a force acting between a probe of a scanning probe microscope (SPM) and a sample surface is converted into a displacement (torsion amount) of a cantilever leaf spring, and the displacement is electrically detected. The displacement is proportional to the differential voltage, and the friction force is proportional to the spring constant and displacement of the cantilever. Therefore, the friction force is proportional to the FFM differential voltage. The ratio of the friction force at a frequency of 5 Hz to the friction force at a frequency of 0.1 Hz is equal to the ratio of the FFM differential signals of the two.

由奈米摩擦學所獲得之摩擦力有反映出黏著劑層之表面與被黏著體之接著性之傾向,摩擦力較小意味著黏著劑之表面接近於液狀,黏性較小。於黏著劑層之表面具有黏性之情形時,摩擦力變大,並且藉由FFM所測定之摩擦力呈現出頻率依存性。於特定之頻率下測定之摩擦力容易反映出黏著劑組合物之構成成分各者之物性,相對於此,頻率依存有更確實地反映出表面之特性之傾向。摩擦力之頻率依存越小,表示黏性越小,液狀之特性越強,摩擦力之頻率依存越大,則有黏性越大,對被黏著體之接著性變得越高之傾向。例如,於黏著劑層之基礎聚合物與光硬化劑並非完全相溶系之情形時,液狀之光硬化劑滲出至表面,而於與被黏著體之接著界面形成接著阻礙層(WBL,Weak Boundary Layer),液狀之特性變強,因此有摩擦力及摩擦力之頻率依存變小之傾向。The frictional force obtained by nano-tribology reflects the tendency of the adhesion between the surface of the adhesive layer and the adherend. A small frictional force means that the surface of the adhesive is close to a liquid and has a low viscosity. When the surface of the adhesive layer is tacky, the frictional force becomes large, and the frictional force measured by the FFM exhibits frequency dependence. The frictional force measured at a specific frequency easily reflects the physical properties of each of the constituent components of the adhesive composition. On the other hand, the frequency dependency tends to more accurately reflect the characteristics of the surface. The smaller the frequency dependence of the friction force, the smaller the viscosity, the stronger the liquid properties, and the greater the frequency dependence of the friction force, the greater the viscosity, and the higher the adhesion to the adherend. For example, when the base polymer of the adhesive layer and the light hardener are not completely compatible, the liquid light hardener oozes out to the surface, and a bonding layer (WBL, Weak Boundary) is formed at the bonding interface with the adherend. Layer), the characteristics of the liquid state are stronger, so there is a tendency that the friction force and the frequency dependence of the friction force become smaller.

藉由控制黏著劑層(2)中之聚合物P與光硬化劑之相溶性,有少量之光硬化劑滲出至黏著劑層表面而形成WBL之情形。若適度地形成WBL,則表面(接著界面)之特性發生變化,摩擦力及摩擦力之頻率依存變小。藉此,容易進行局部去除步驟中之第二區域之剝離。By controlling the compatibility between the polymer P in the adhesive layer (2) and the light hardener, a small amount of light hardener leaks out to the surface of the adhesive layer to form WBL. If the WBL is formed moderately, the characteristics of the surface (and then the interface) change, and the frequency dependence of the frictional force and frictional force becomes small. Thereby, peeling of the second region in the partial removal step is easily performed.

於光硬化前之黏著劑層之頻率5 Hz下之摩擦力為頻率0.1 Hz下之摩擦力之5倍以下之情形時,有光硬化前之黏著劑層與被黏著體之剝離變得容易之傾向。就避免光硬化劑之滲出之觀點而言,黏著劑層之頻率5 Hz下之摩擦力較佳為頻率0.1 Hz下之摩擦力之2倍以上,更佳為3倍以上,進而較佳為3.5倍以上。When the friction force at a frequency of 5 Hz of the adhesive layer before light hardening is 5 times or less than the friction force at a frequency of 0.1 Hz, peeling of the adhesive layer and the adherend before light hardening becomes easy. tendency. From the viewpoint of preventing the light hardener from oozing out, the friction force of the adhesive layer at a frequency of 5 Hz is preferably more than twice the friction force at a frequency of 0.1 Hz, more preferably 3 times or more, and even more preferably 3.5. Times more.

就同時實現對被黏著體之適度之接著性與剝離性之觀點而言,使用彈簧常數40 N/m之懸臂測得之光硬化前之黏著劑層於頻率5 Hz下之FFM差分信號較佳為0.01~1 V,更佳為0.05~0.9 V,進而較佳為0.1~0.8 V,尤佳為0.2~0.7 V。From the viewpoint of simultaneously achieving moderate adherence and peelability to the adherend, the FFM differential signal at 5 Hz of the adhesive layer before photo-hardening measured using a cantilever with a spring constant of 40 N / m is better It is 0.01 to 1 V, more preferably 0.05 to 0.9 V, still more preferably 0.1 to 0.8 V, and even more preferably 0.2 to 0.7 V.

就提高光硬化後之黏著力之觀點而言,較佳為光硬化後之黏著劑層藉由FFM所測得之頻率5 Hz下之摩擦力為頻率0.1 Hz下之摩擦力之5倍以上,更佳為5.5倍以上。使用彈簧常數40 N/m之懸臂測得之光硬化後之黏著劑層於頻率5 Hz下之FFM差分信號較佳為0.1 V以上,更佳為0.2 V以上,進而較佳為0.3 V以上。就提高黏著力之觀點而言,光硬化後之黏著劑層之摩擦力越大越佳。因此,摩擦力之上限並無特別限制,使用彈簧常數40 N/m之懸臂測得之5 Hz下之FFM差分信號一般為10 V以下,若考慮黏著劑之特性之平衡,則較佳為5 V以下。From the viewpoint of improving the adhesion after photo-hardening, it is preferable that the friction force at a frequency of 5 Hz measured by the FFM after the photo-hardening of the adhesive layer is more than 5 times the friction force at a frequency of 0.1 Hz. More preferably, it is 5.5 times or more. The FFM differential signal of the light-hardened adhesive layer measured at 5 Hz using a cantilever with a spring constant of 40 N / m is preferably 0.1 V or more, more preferably 0.2 V or more, and even more preferably 0.3 V or more. From the viewpoint of improving the adhesive force, the larger the frictional force of the adhesive layer after photo-hardening, the better. Therefore, the upper limit of the friction force is not particularly limited. The FFM differential signal measured at 5 Hz using a cantilever with a spring constant of 40 N / m is generally less than 10 V. If the balance of the characteristics of the adhesive is considered, it is preferably 5 V or less.

光硬化後之黏著劑層於頻率5 Hz下之摩擦力較佳為光硬化前之黏著劑層於頻率5 Hz下之摩擦力之1.5倍以上,更佳為2倍以上,進而較佳為2.5倍以上,尤佳為3倍以上。有光硬化前後之摩擦力之比越大,則利用光硬化所產生之接著力之增加率變得越高之傾向。光硬化後之摩擦力一般為光硬化前之摩擦力之20倍以下,較佳為10倍以下。The frictional force of the adhesive layer after photo-hardening at a frequency of 5 Hz is preferably 1.5 times or more, more preferably 2 times or more, and more preferably 2.5 of the frictional force of the adhesive layer before photo-hardening at a frequency of 5 Hz. More than 3 times, especially preferably 3 times or more. The larger the ratio of the friction force before and after the light hardening, the higher the increase rate of the adhesion force generated by the light hardening. The friction force after light curing is generally 20 times or less, preferably 10 times or less, the friction force before light curing.

再者,光硬化前及光硬化後之黏著劑層於頻率0.1 Hz及5 Hz下之摩擦力係藉由於掃描式探針顯微鏡(Hitachi High-Tech Science製造之「AFM5300E」)之FFM模式下,藉由下述條件,以單向之掃描寬度5 μm(往返掃描10 μm)進行摩擦測定,讀取自測定範圍之左側起3 μm之位置上之差分電壓而測得。
(測定條件)
懸臂:BudgetSensors製造之「Tap300E-G」(相當於彈簧常數40 N/m者)
ADD值:8.44 V、DIF值:0.4 V、FFM值:0 V
環境:真空、室溫
掃描速度:0.1 Hz、1 Hz及5 Hz
In addition, the frictional force of the adhesive layer before and after light hardening at frequencies of 0.1 Hz and 5 Hz is due to the FFM mode of a scanning probe microscope ("AFM5300E" manufactured by Hitachi High-Tech Science). Under the following conditions, the friction measurement was performed with a unidirectional scanning width of 5 μm (reciprocating scanning 10 μm), and the differential voltage at a position of 3 μm from the left side of the measurement range was measured and measured.
(Measurement conditions)
Cantilever: "Tap300E-G" manufactured by BudgetSensors (equivalent to spring constant 40 N / m)
ADD value: 8.44 V, DIF value: 0.4 V, FFM value: 0 V
Environment: Vacuum, room temperature Scanning speed: 0.1 Hz, 1 Hz and 5 Hz

作為可用於黏著劑層(2)之光硬化之活性光線之例,可列舉紫外線(UV)、可見光、紅外線、X射線、α射線、β射線、及γ射線等。就容易抑制保管狀態下之黏著劑層之硬化且容易硬化之方面而言,作為活性光線,較佳為UV。活性光線之照射強度或照射時間只要根據黏著劑層之組成或厚度等適當設定即可。Examples of the active light that can be used for photocuring of the adhesive layer (2) include ultraviolet (UV), visible light, infrared, X-ray, α-ray, β-ray, and γ-ray. In terms of easiness in suppressing hardening and hardening of the adhesive layer in the storage state, UV is preferred as the active light. The irradiation intensity or irradiation time of the active light may be appropriately set according to the composition or thickness of the adhesive layer.

黏著劑層(2)為光硬化性,可任意地設定硬化之時刻。因此,於將黏著片材貼設於被黏著體後,能夠在使黏著劑光硬化之前的期間之任意時刻實施局部去除步驟,能夠靈活地應對裝置之製造步驟之準備時間。The adhesive layer (2) is photocurable, and the timing of curing can be arbitrarily set. Therefore, after the adhesive sheet is attached to the adherend, the partial removal step can be performed at any time during the period before the adhesive is light-cured, and the preparation time of the device manufacturing step can be flexibly handled.

<黏著片材之構造>
此處所揭示之製造方法所使用之黏著片材之厚度並無特別限定,例如可為3 μm~11 mm左右。就黏著片材之操作性等觀點而言,黏著片材之厚度通常適宜為5 μm以上,可為10 μm以上,亦可為30 μm以上。就局部去除步驟中之第二區域之剝離作業性等觀點而言,於若干種態樣中,可良好地使用厚度為50 μm以上、70 μm以上或90 μm以上之黏著片材。又,就切割步驟中之切斷加工性或局部去除步驟中之第二區域之剝離作業性等觀點而言,黏著片材之厚度例如可為1000 μm以下,可為600 μm以下,可為350 μm以下,可為200 μm以下,亦可為150 μm以下。
< Structure of Adhesive Sheet >
The thickness of the adhesive sheet used in the manufacturing method disclosed herein is not particularly limited, and may be, for example, about 3 μm to 11 mm. From the viewpoints of the operability of the adhesive sheet, the thickness of the adhesive sheet is usually preferably 5 μm or more, may be 10 μm or more, and may be 30 μm or more. From the viewpoints of peeling workability of the second region in the partial removal step, in several aspects, an adhesive sheet having a thickness of 50 μm or more, 70 μm or more, or 90 μm or more can be used favorably. From the viewpoints of cutting processability in the cutting step or peeling workability in the second region in the partial removal step, the thickness of the adhesive sheet may be, for example, 1,000 μm or less, 600 μm or less, and 350. μm or less, 200 μm or less, or 150 μm or less.

於包含基材層與黏著劑層之黏著片材中,黏著劑層之厚度並無特別限定,例如可設為1 μm~1000 μm左右之範圍。於若干種態樣中,黏著劑層之厚度例如可為3 μm以上,可為5 μm以上,可為8 μm以上,可為10 μm以上,可為13 μm以上,亦可為20 μm以上或超過20 μm。藉由增大黏著劑層之厚度,黏著力上升步驟後之黏著力上升,有獲得黏著片更牢固地接合於被黏著體之積層體之傾向。另一方面,若黏著劑層之厚度過大,則可能有因第一區域之黏著劑與第二區域之黏著劑之黏連等而導致局部去除步驟中之作業性(例如第一區域與第二區域之分離性)降低之傾向。就該觀點而言,黏著劑層之厚度例如可為300 μm以下,可為200 μm以下,可為150 μm以下,可為100 μm以下,可為70 μm以下,可為50 μm以下,可為40 μm以下,亦可為30 μm以下。In the adhesive sheet including the base material layer and the adhesive layer, the thickness of the adhesive layer is not particularly limited, and may be, for example, in a range of about 1 μm to 1000 μm. In several aspects, the thickness of the adhesive layer can be, for example, 3 μm or more, 5 μm or more, 8 μm or more, 10 μm or more, 13 μm or more, or 20 μm or more. More than 20 μm. By increasing the thickness of the adhesive layer, the adhesive force after the step of increasing the adhesive force is increased, and there is a tendency that the adhesive sheet is more firmly joined to the laminated body of the adherend. On the other hand, if the thickness of the adhesive layer is too large, there may be workability in the local removal step due to the adhesion between the adhesive in the first region and the adhesive in the second region (such as the first region and the second region). Regional separation) tends to decrease. From this viewpoint, the thickness of the adhesive layer may be, for example, 300 μm or less, 200 μm or less, 150 μm or less, 100 μm or less, 70 μm or less, 50 μm or less, and may be It is 40 μm or less, and may be 30 μm or less.

於包含基材層與黏著劑層之黏著片材中,基材層之厚度並無特別限定,例如可為2 μm~10 mm左右。就黏著片材之操作性或防止局部去除步驟中之第二區域之破裂之觀點而言,於若干種態樣中,基材層之厚度例如可為5 μm以上,可為10 μm以上,可為25 μm以上,可為35 μm以上,可為50 μm以上,亦可為60 μm以上。又,就切割步驟中之切斷加工性等觀點而言,於若干種態樣中,基材層之厚度例如可為1000 μm以下,可為500 μm以下,可為300 μm以下,可為200 μm以下,可為150 μm以下,可為100 μm以下,亦可為90 μm以下。In the adhesive sheet including the base material layer and the adhesive layer, the thickness of the base material layer is not particularly limited, and may be, for example, about 2 μm to 10 mm. From the viewpoint of the operability of the adhesive sheet or the prevention of cracking of the second region in the partial removal step, the thickness of the base material layer may be, for example, 5 μm or more and 10 μm or more in several aspects. It is 25 μm or more, 35 μm or more, 50 μm or more, and 60 μm or more. From the viewpoint of cutting processability in the cutting step, in some aspects, the thickness of the base material layer may be, for example, 1,000 μm or less, 500 μm or less, 300 μm or less, and 200 μm or less. It can be 150 μm or less, 100 μm or less, or 90 μm or less.

此處所揭示之製造方法所使用之黏著片材可以基材層之厚度Ts大於黏著劑層之厚度Ta之態樣良好地實施。即,較佳為Ts/Ta大於1。Ts/Ta例如可為1.1以上,可為1.2以上,可為1.5以上,可為2以上,亦可為2.5以上,但並無特別限定。又,Ts/Ta例如可為50以下,可為20以下,可為10以下,亦可為7以下。藉由使用滿足上述任一上限值且/或滿足上述任一下限值之構成之黏著片材,有平衡性良好地同時實現局部去除步驟中之良好之剝離作業性與黏著力上升步驟後之黏著片對被黏著體之牢固之接著性的傾向。The adhesive sheet used in the manufacturing method disclosed herein can be implemented well in a state where the thickness Ts of the substrate layer is greater than the thickness Ta of the adhesive layer. That is, Ts / Ta is preferably greater than 1. Ts / Ta may be, for example, 1.1 or more, 1.2 or more, 1.5 or more, 2 or more, and 2.5 or more, but it is not particularly limited. The Ts / Ta may be, for example, 50 or less, 20 or less, 10 or less, or 7 or less. By using an adhesive sheet having a composition that satisfies any one of the above upper limit values and / or any one of the above lower limit values, a good balance can be achieved at the same time to achieve good peeling workability in the local removal step and adhesion improvement step. The tendency of the adhesive sheet to adhere firmly to the adherend.

於若干種態樣中,用於貼附步驟之黏著片材例如可為面積為2500 cm2 以上且短邊之長度為50 cm以上。於使用如上所述大尺寸之黏著片材之態樣中,採用此處所揭示之製造方法尤其有意義。藉由使用該黏著片材,有良好地發揮例如提高位置精度、提高形狀精度、提高生產性等中之一種或兩種以上之效果的傾向。又,根據此處所揭示之製造方法,於使黏著片材之黏著力上升之黏著力上升步驟之前進行將該黏著片材之第二區域剝離去除之局部去除步驟,因此即便為如上所述大尺寸之黏著片材,亦容易進行第二區域之剝離去除。根據上述黏著片材之面積為3600 cm2 以上、更佳為4900 cm2 以上之態樣、或上述短邊之長度為60 cm以上、更佳為70 cm以上之態樣,可發揮更高之效果。In several aspects, the adhesive sheet used in the attaching step may be, for example, an area of 2500 cm 2 or more and a length of the short side of 50 cm or more. In the case of using the large-sized adhesive sheet as described above, it is particularly meaningful to adopt the manufacturing method disclosed herein. By using this adhesive sheet, there is a tendency that one or two or more effects such as improvement in position accuracy, shape accuracy, productivity, and the like are favorably exhibited. In addition, according to the manufacturing method disclosed herein, the partial removal step of peeling and removing the second region of the adhesive sheet is performed before the adhesive force increasing step of increasing the adhesive force of the adhesive sheet, so even with the large size as described above It is also easy to peel and remove the second region of the adhesive sheet. According to the aspect that the area of the above-mentioned adhesive sheet is 3600 cm 2 or more, and more preferably 4900 cm 2 or more, or that the length of the short side is 60 cm or more, and more preferably 70 cm or more, a higher performance can be achieved. effect.

<用途>
根據此處所揭示之方法,可高效率地製造於被黏著體上精度良好地形成有黏著片之圖案且上述圖案之耐久性優異之積層體。利用該優勢,此處所揭示之方法可良好地應用於製造將車輛之外裝材或內裝材、建築物之外裝材或內裝材等建材、窗玻璃、看板、標識、家電製品、光學製品、電子製品等製品或其構成構件作為被黏著體,且利用黏著片之圖案局部地覆蓋此種被黏著體的積層體之用途。上述積層體可為上述各種製品或其構成構件。上述黏著片藉由作為上述積層體之構成要素包含於各種製品,可有助於對該積層體中所含之被黏著體、或包含上述積層體之製品或其構件賦予裝飾、顯示、保護、補強、衝擊緩和、應力集中之緩和、形狀維持、形狀恢復等功能。此處所揭示之方法例如可良好地應用於具備膜覆蓋層之FPC之製造。
< Applications >
According to the method disclosed herein, it is possible to efficiently manufacture a laminated body having a pattern on which an adhesive sheet is formed on an adherend with high accuracy and excellent durability of the pattern. Using this advantage, the method disclosed here can be well applied to the manufacture of building materials such as vehicle exterior materials or interior materials, building exterior materials or interior materials, window glass, kanbans, signs, home appliances, optical A product such as a product, an electronic product, or a component thereof is used as an adherend, and the laminated body of such an adherend is partially covered with a pattern of an adhesive sheet. The laminated body may be the above-mentioned various products or its constituent members. The above-mentioned adhesive sheet is included in various products as a constituent element of the laminated body, and can contribute to giving decoration, display, protection, or the like to the adherend contained in the laminated body, or the article or the member including the laminated body, Reinforcement, shock mitigation, stress concentration mitigation, shape maintenance, shape recovery and other functions. The method disclosed herein can be well applied to, for example, the production of FPC with a film cover layer.

又,關於用於光學製品之光學構件或用於電子製品之電子構件,高度之積體化、小型輕量化、薄型化不斷發展,可積層線膨脹係數或厚度不同之複數個較薄之光學構件/電子構件。藉由將此種構件作為被黏著體,利用此處所揭示之方法形成上述構件經黏著片局部地覆蓋之積層體,可對上述光學構件/電子構件賦予適度之剛性。藉此,於製造製程及/或製造後之製品中,可抑制因上述線膨脹係數或厚度不同之複數個構件間可能產生之應力所導致之捲曲或彎曲。In addition, regarding optical components used for optical products or electronic components used in electronic products, the integration of height, miniaturization, weight reduction, and thinness are continuously developed, and a plurality of thinner optical components having different linear expansion coefficients or thicknesses can be laminated. / Electronic components. By using such a component as an adherend and using the method disclosed herein to form a laminated body in which the component is partially covered by the adhesive sheet, it is possible to impart appropriate rigidity to the optical component / electronic component. Therefore, in the manufacturing process and / or the manufactured product, curling or bending caused by the stress that may be generated between the plurality of members having different linear expansion coefficients or thicknesses can be suppressed.

又,於光學製品/電子製品之製造製程中,於如上所述對較薄之光學構件/電子構件進行切斷加工等形狀加工處理之情形時,藉由形成該構件(被黏著體)經黏著片局部地覆蓋之積層體,而可利用上述黏著片作為補強構件,緩和伴隨上述積層體之加工之對光學構件/電子構件之局部之應力集中,可減少龜裂、破裂、積層構件之剝離等風險。對光學構件/電子構件貼附補強構件而進行操作亦可有助於該構件之搬送、積層、旋轉等時之局部之應力集中之緩和、或因該構件之自重所導致之彎折或彎曲之抑制等。In addition, in the manufacturing process of optical products / electronic products, when a thin optical member / electronic member is subjected to shape processing such as cutting processing as described above, the member (adhered body) is formed by adhesion. The laminated body partially covered by the sheet, and the above-mentioned adhesive sheet can be used as a reinforcing member to alleviate the local stress concentration of the optical member / electronic member accompanying the processing of the laminated body, which can reduce cracks, cracks, and peeling of the laminated member, etc. risk. The operation of attaching the reinforcing member to the optical member / electronic member can also help to alleviate the local stress concentration of the member during transportation, lamination, rotation, etc., or the bending or bending caused by the weight of the member. Suppression, etc.

進而,包含被黏著體經上述黏著片之圖案局部地覆蓋之積層體的光學製品或電子製品等裝置於在市場上供消費者使用之階段,即便於該裝置掉落之情形、置於重量物之下之情形、飛來物碰撞之情形等施加意外之應力之情形時,亦可藉由使該裝置中所含之上述黏著片發揮作為補強構件之功能,而緩和施加於裝置之應力,提高耐久性。Furthermore, devices such as optical products or electronic products including laminated bodies that are partially covered by the pattern of the above-mentioned adhesive sheet by the adherent are at the stage of being available to consumers in the market, even when the device is dropped and placed on a heavy object. In cases where unexpected stress is applied, such as in the following situations, or when flying objects collide, the above-mentioned adhesive sheet contained in the device can be used as a reinforcing member to reduce the stress applied to the device and improve Durability.

此處所揭示之方法例如可良好地用以製造將各種攜帶型設備(可攜式設備)之構成構件作為被黏著體,利用黏著片之圖案局部地覆蓋上述構件之積層體。此處所謂「攜帶」,並不單指能夠攜帶,而係指具有個人(標準成人)能夠相對容易地搬運之程度之攜帶性。又,此處所謂攜帶型設備之例可包括:行動電話、智慧型手機、平板型個人電腦、筆記型個人電腦、各種隨身設備、數位相機、數位攝錄影機、音響設備(攜帶音樂播放器、錄音筆等)、計算機(計算器等)、攜帶型遊戲設備、電子辭典、電子記事本、電子書籍、車載用資訊設備、攜帶型收音機、攜帶型電視、攜帶型印表機、攜帶型掃描儀、攜帶型數據機等攜帶電子設備,此外,亦可包括機械式手錶或懷錶、手電筒、放大鏡等。構成上述攜帶電子設備之構件之例可包括用於液晶顯示器等薄層顯示器或膜型顯示器等之類之圖像顯示裝置之光學膜或顯示面板等。此處所揭示之方法亦可良好地應用於製造將汽車、家電製品等中之各種構件作為被黏著體,利用黏著片之圖案局部地覆蓋該構件之積層體的用途。
[實施例]
The method disclosed here can be used, for example, to make a laminated body that uses the components of various portable devices (portable devices) as adherends and uses the pattern of the adhesive sheet to locally cover the components. The term “carrying” here does not only mean that it can be carried, but refers to the degree of portability that an individual (standard adult) can carry relatively easily. Examples of so-called portable devices include: mobile phones, smart phones, tablet personal computers, notebook personal computers, various portable devices, digital cameras, digital video cameras, and audio equipment (carrying music players) , Recording pen, etc.), computers (calculators, etc.), portable gaming devices, electronic dictionaries, electronic notebooks, electronic books, in-vehicle information equipment, portable radios, portable TVs, portable printers, portable scanning Instruments, portable modems, and other portable electronic devices. In addition, they can also include mechanical watches or pocket watches, flashlights, magnifiers, etc. Examples of the components constituting the above-mentioned portable electronic device may include an optical film or a display panel used in an image display device such as a thin-layer display such as a liquid crystal display or a film-type display. The method disclosed herein can also be well applied to the use of various components in automobiles, home appliances, etc. as adherends, and the use of the pattern of the adhesive sheet to partially cover the laminated body of the components.
[Example]

以下,說明關於本發明之若干種實施例,但並非意欲將本發明限定於該具體例所示者。再者,以下之說明中之「份」及「%」若無特別說明,則為重量基準。Hereinafter, several embodiments of the present invention will be described, but it is not intended to limit the present invention to those shown in the specific examples. In addition, "part" and "%" in the following descriptions are based on weight unless otherwise specified.

(聚合物A1之製備)
於具備攪拌翼、溫度計、氮氣導入管及冷卻器之反應容器中,加入丙烯酸2-乙基己酯(2EHA)63份、N-乙烯基吡咯啶酮(NVP)15份、甲基丙烯酸甲酯(MMA)9份、丙烯酸2-羥基乙酯(HEA)13份、及作為聚合溶劑之乙酸乙酯200份,於60℃下,於氮氣環境下攪拌2小時後,投入作為熱起始劑之AIBN 0.2份,於60℃下進行6小時反應,而獲得聚合物A1之溶液。該聚合物A1之Mw為110萬。
(Preparation of polymer A1)
In a reaction vessel equipped with a stirring wing, a thermometer, a nitrogen introduction tube, and a cooler, 63 parts of 2-ethylhexyl acrylate (2EHA), 15 parts of N-vinylpyrrolidone (NVP), and methyl methacrylate were added. (MMA) 9 parts, 2-hydroxyethyl acrylate (HEA) 13 parts, and 200 parts of ethyl acetate as a polymerization solvent. After stirring at 60 ° C under a nitrogen atmosphere for 2 hours, put them in as a thermal initiator. 0.2 parts of AIBN was reacted at 60 ° C for 6 hours to obtain a solution of polymer A1. The Mw of the polymer A1 was 1.1 million.

(聚合物A2之製備)
將所使用之單體之組成變更為2EHA/HEA=95/5(重量比),除此以外,藉由與聚合物A1之合成相同之方式進行溶液聚合,藉此獲得聚合物A2之溶液。該聚合物A2之Mw為90萬。
(Preparation of polymer A2)
Except changing the composition of the monomers used to 2EHA / HEA = 95/5 (weight ratio), solution polymerization was performed in the same manner as in the synthesis of polymer A1, thereby obtaining a solution of polymer A2. The Mw of the polymer A2 was 900,000.

(聚合物A3之製備)
於具備攪拌翼、溫度計、氮氣導入管及冷卻器之反應容器中,加入2EHA 96.2份、HEA 3.8份及作為聚合溶劑之乙酸乙酯150份,於60℃下,於氮氣環境下攪拌2小時後,投入作為熱起始劑之AIBN 0.2份,於60℃下進行6小時反應,而獲得聚合物A3之溶液(固形物成分40%)。該聚合物A3之Mw為54萬。
(Preparation of polymer A3)
In a reaction vessel equipped with a stirring wing, a thermometer, a nitrogen introduction tube, and a cooler, add 96.2 parts of 2EHA, 3.8 parts of HEA, and 150 parts of ethyl acetate as a polymerization solvent, and stir at 60 ° C under a nitrogen environment for 2 hours. 0.2 parts of AIBN as a thermal initiator was added and reacted at 60 ° C. for 6 hours to obtain a solution of polymer A3 (solid content 40%). The Mw of the polymer A3 was 540,000.

(聚合物B1之製備)
於具備攪拌翼、溫度計、氮氣導入管及冷卻器之反應容器中,投入MMA 40份、甲基丙烯酸正丁酯(BMA)20份、甲基丙烯酸2-乙基己酯(2EHMA)20份、官能基當量為900 g/mol之含聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:X-22-174ASX,信越化學工業股份有限公司製造)9份、官能基當量為4600 g/mol之含聚有機矽氧烷骨架之甲基丙烯酸酯單體(商品名:KF-2012,信越化學工業股份有限公司製造)11份、乙酸乙酯100份、及作為鏈轉移劑之硫甘油0.6份,於70℃下,於氮氣環境下攪拌1小時後,投入作為熱起始劑之AIBN 0.2份,於70℃下進行3小時反應後,進而投入0.1重量份之AIBN,繼而於80℃下反應5小時。以此方式獲得含矽氧烷結構之聚合物B1之溶液。該聚合物B1之Mw為20000。
(Preparation of polymer B1)
In a reaction vessel equipped with a stirring wing, a thermometer, a nitrogen introduction tube and a cooler, put 40 parts of MMA, 20 parts of n-butyl methacrylate (BMA), 20 parts of 2-ethylhexyl methacrylate (2EHMA), 9 parts of a polyorganosiloxane skeleton-containing methacrylate monomer (brand name: X-22-174ASX, manufactured by Shin-Etsu Chemical Industry Co., Ltd.) having a functional group equivalent of 900 g / mol and a functional group equivalent of 4600 g 11 parts per mol of a polyorganosiloxane-containing methacrylate monomer (trade name: KF-2012, manufactured by Shin-Etsu Chemical Industry Co., Ltd.), 100 parts of ethyl acetate, and thioglycerin as a chain transfer agent 0.6 parts, after stirring at 70 ° C for 1 hour under a nitrogen atmosphere, 0.2 parts of AIBN as a thermal initiator was added, and after reacting at 70 ° C for 3 hours, 0.1 parts by weight of AIBN was further added, followed by 80 ° C The reaction was continued for 5 hours. In this way, a solution of a polymer B1 containing a siloxane structure was obtained. The Mw of the polymer B1 was 20,000.

再者,上述各聚合物之重量平均分子量係使用GPC裝置(Tosoh公司製造,HLC-8220GPC)於下述條件下進行測定,藉由聚苯乙烯換算而求出。
・樣品濃度:0.2 wt%(四氫呋喃(THF)溶液)
・樣品注入量:10 μl
・溶析液:THF・流速:0.6 ml/min
・測定溫度:40℃
・管柱:
樣品管柱;TSKguardcolumn SuperHZ-H(1根)+TSKgel SuperHZM-H(2根)
參考管柱;TSKgel SuperH-RC(1根)
・檢測器:示差折射計(RI)
The weight-average molecular weight of each of the polymers was measured using a GPC apparatus (manufactured by Tosoh Corporation, HLC-8220GPC) under the following conditions, and was determined by polystyrene conversion.
・ Sample concentration: 0.2 wt% (tetrahydrofuran (THF) solution)
・ Sample injection volume: 10 μl
・ Eluent: THF ・ Flow rate: 0.6 ml / min
・ Measurement temperature: 40 ° C
・ Pipe:
Sample column; TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H (2)
Reference column; TSKgel SuperH-RC (1)
・ Detector: Differential refractometer (RI)

<黏著片材之製作>
(黏著片材D1)
於上述聚合物A1之溶液中,相對於該溶液中所含之聚合物A1之100份,以固形物成分基準計,添加2.5份聚合物B1、2.5份異氰酸酯系交聯劑(商品名:Takenate D110N,三羥甲基丙烷苯二甲基二異氰酸酯,三井化學公司製造),均勻地混合而製備黏著劑組合物C1。
於未經表面處理之厚度75 μm之PET膜(Toray製造之「Lumirror S10」)之單面直接塗佈黏著劑組合物C1,於110℃下加熱2分鐘而進行乾燥,藉此形成厚度25 μm之黏著劑層,於該黏著劑層之表面(黏著面)貼合剝離襯墊(Mitsubishi Chemical公司製造之MRQ50T100,單面經聚矽氧系剝離劑處理之聚酯膜,厚度50 μm)之剝離處理面而進行保護。以此方式,獲得於包含厚度75 μm之PET膜之基材層之單面具有黏著劑層,且該黏著劑層之表面(黏著面)由剝離襯墊進行保護之形態之黏著片材D1。
< Production of adhesive sheet >
(Adhesive sheet D1)
In the solution of the polymer A1 described above, 2.5 parts of polymer B1 and 2.5 parts of an isocyanate-based cross-linking agent (trade name: Takenate) were added based on the solid content of 100 parts of the polymer A1 contained in the solution. D110N, trimethylolpropane xylylene diisocyanate, manufactured by Mitsui Chemicals Co., Ltd.) was uniformly mixed to prepare an adhesive composition C1.
Adhesive composition C1 was directly coated on one side of a 75 μm-thick PET film (“Lumirror S10” manufactured by Toray) without surface treatment, and dried at 110 ° C. for 2 minutes to form a thickness of 25 μm. Adhesive layer, the release layer (MRQ50T100 manufactured by Mitsubishi Chemical Co., polyester film treated with silicone release agent on one side, thickness 50 μm) is attached to the surface (adhesive surface) of the adhesive layer. Treat the surface for protection. In this way, an adhesive sheet D1 was obtained in the form of having an adhesive layer on one side of a substrate layer including a PET film having a thickness of 75 μm, and the surface (adhesive surface) of the adhesive layer was protected by a release liner.

(黏著片材D2)
於上述聚合物A1之溶液中,相對於該溶液中所含之聚合物A1之100份,以固形物成分基準計,添加異氰酸酯系交聯劑(商品名:Takenate D110N,三羥甲基丙烷苯二甲基二異氰酸酯,三井化學公司製造)2.5份、光硬化劑(商品名:A-200,聚乙二醇#200二丙烯酸酯,官能基當量154 g/eq,新中村化學工業製造)30份、及光起始劑0.1份,均勻地混合,而製備黏著劑組合物C2。作為光起始劑,使用1-羥基環己基苯己酮(BASF製造之「Irgacure 184」)。
於未經表面處理之厚度75 μm之PET膜(Toray製造之「Lumirror S10」)之單面,使用槽輥直接塗佈黏著劑組合物C2,於130℃下加熱1分鐘而進行乾燥,藉此形成厚度25 μm之黏著劑層。於該黏著劑層之表面(黏著面)貼合剝離襯墊(表面經聚矽氧剝離劑處理之PET膜,厚度25 μm)之剝離處理面而進行保護,於25℃之環境下進行4天老化處理而進行交聯。以此方式,獲得黏著面由剝離襯墊保護之形態之黏著片材D2。
(Adhesive sheet D2)
In the solution of the polymer A1 described above, an isocyanate-based crosslinking agent (trade name: Takenate D110N, trimethylolpropanebenzene) was added based on the solid content based on 100 parts of the polymer A1 contained in the solution. 2.5 parts of dimethyl diisocyanate, manufactured by Mitsui Chemicals Co., Ltd., light hardener (trade name: A-200, polyethylene glycol # 200 diacrylate, functional group equivalent 154 g / eq, manufactured by Shin Nakamura Chemical Industry Co., Ltd.) 30 Parts and 0.1 parts of the photoinitiator were mixed uniformly to prepare an adhesive composition C2. As a photoinitiator, 1-hydroxycyclohexylacetophenone ("Irgacure 184" manufactured by BASF) was used.
On one side of a 75 μm-thick PET film ("Lumirror S10" manufactured by Toray) without surface treatment, the adhesive composition C2 was directly applied using a grooved roller, and dried at 130 ° C for 1 minute, thereby drying A 25 μm thick adhesive layer was formed. On the surface (adhesive surface) of the adhesive layer, a release-treated surface (a PET film treated with a silicone release agent, a thickness of 25 μm) is bonded to the release-treated surface for protection, and the protection is performed at 25 ° C for 4 days. Cross-linking by aging treatment. In this way, an adhesive sheet D2 in a form where the adhesive surface is protected by a release liner is obtained.

(黏著片材D3)
於上述聚合物A2之溶液中,相對於該溶液中所含之聚合物A2之100份,以固形物成分基準計,添加異氰酸酯系交聯劑(商品名:Takenate D110N,三羥甲基丙烷苯二甲基二異氰酸酯,三井化學公司製造)2.5份,均勻地混合而製備黏著劑組合物C3。使用黏著劑組合物C3代替黏著劑組合物C1,除此以外,藉由與黏著片材D1之製作相同之方式獲得黏著面由剝離襯墊保護之形態之黏著片材D3。
(Adhesive sheet D3)
In the solution of the polymer A2 described above, an isocyanate-based crosslinking agent (trade name: Takenate D110N, trimethylolpropanebenzene) was added based on the solid content based on 100 parts of the polymer A2 contained in the solution. 2.5 parts of dimethyl diisocyanate, manufactured by Mitsui Chemicals Co., Ltd., were mixed uniformly to prepare an adhesive composition C3. In addition to using the adhesive composition C3 instead of the adhesive composition C1, an adhesive sheet D3 in a form where the adhesive surface is protected by a release liner is obtained in the same manner as the production of the adhesive sheet D1.

(黏著片材D4)
不使用聚合物B1,除此以外,藉由與黏著劑組合物C1之製備相同之方式製備黏著劑組合物C4。使用黏著劑組合物C4代替黏著劑組合物C1,除此以外,藉由與黏著片材D1之製作相同之方式,獲得黏著面由剝離襯墊保護之形態之黏著片材D4。
(Adhesive sheet D4)
Except that the polymer B1 was not used, an adhesive composition C4 was prepared in the same manner as in the preparation of the adhesive composition C1. In addition to using the adhesive composition C4 instead of the adhesive composition C1, an adhesive sheet D4 in a form where the adhesive surface is protected by a release liner is obtained in the same manner as the production of the adhesive sheet D1.

(黏著片材D5)
於上述聚合物A3之溶液中,相對於該溶液中所含之聚合物A3之100份,以固形物成分基準計,添加聚合物B1 2.5份、異氰酸酯系交聯劑(商品名:Coronate L(三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物之75%乙酸乙酯溶液,Tosoh公司製造)3.3份,均勻地混合而製備黏著劑組合物C5。使用黏著劑組合物C5代替黏著劑組合物C1,除此以外,藉由與黏著片材D1之製作相同之方式,獲得黏著面由剝離襯墊保護之形態之黏著片材D5。
(Adhesive sheet D5)
In the solution of the polymer A3, 2.5 parts of polymer B1 and an isocyanate-based crosslinking agent (trade name: Coronate L ( 3.3 parts of 75% ethyl acetate solution of trimethylolpropane / toluene diisocyanate terpolymer adduct, manufactured by Tosoh Company), uniformly mixed to prepare adhesive composition C5. Adhesive composition C5 was used instead of the adhesive Except for the composition C1, an adhesive sheet D5 having an adhesive surface protected by a release liner was obtained in the same manner as in the production of the adhesive sheet D1.

<對聚醯亞胺之黏著力之測定>
藉由將厚度12.5 μm之聚醯亞胺膜(Toray-Dupont製造之「Kapton 50EN」)經由雙面黏著帶(日東電工製造之「No.531」)固定於玻璃板,而製作黏著力測定用試片。又,將黏著片材D1~D4及D5裁斷為寬度25 mm之短條狀而製作測定用樣品。
於23℃、50%RH之標準環境下,使2 kg之輥往返1次而使測定用樣品之黏著面壓接至上述試片。將其於上述標準環境下放置30分鐘後,使用拉伸試驗機(Minebea社製造之「TCM-1kNB」),依據JIS Z0237,於剝離角度180度、拉伸速度300 mm/min之條件下測定剝離強度(初期黏著力)B0 [N/25 mm]。
< Measurement of adhesion to polyimide >
A 12.5 μm-thick polyimide film ("Kapton 50EN" manufactured by Toray-Dupont) was fixed to a glass plate through a double-sided adhesive tape ("No. 531" manufactured by Nitto Denko) to prepare an adhesive force measurement. Audition. In addition, the adhesive sheets D1 to D4 and D5 were cut into short strips having a width of 25 mm to prepare samples for measurement.
Under a standard environment of 23 ° C. and 50% RH, a 2 kg roller was reciprocated once, and the adhesive surface of the measurement sample was crimped to the test piece. After leaving it in the above standard environment for 30 minutes, it was measured using a tensile tester ("TCM-1kNB" manufactured by Minebea) in accordance with JIS Z0237 under conditions of a peeling angle of 180 degrees and a tensile speed of 300 mm / min. Peeling strength (initial adhesion) B 0 [N / 25 mm].

又,針對黏著片材D1、D2、D5,藉由與初期黏著力B0 之測定相同之方式將測定用樣品之黏著面壓接至試片,將其於上述標準環境下放置30分鐘後,施加表1所示之刺激,進而於上述標準環境下放置30分鐘後,同樣地,於剝離角度180度、拉伸速度300 mm/min之條件下測定剝離強度(刺激後黏著力)B1 [N/25 mm]。表1所示之各刺激之內容具體而言如以下所述。
加熱:於80℃下加熱5分鐘。
UV照射:使用Ushio公司製造之UniField,以成為2000 mJ/cm2 之光量之方式照射主波長約365 nm之紫外線。
Further, the adhesive sheet for D1, D2, D5, and the initial adhesive force B by the same manner as the measurement of the 0-pressure measurement of the contact adhesive surface of the sample to the test strip, which will be placed for 30 minutes under the above standard environment, After applying the stimulus shown in Table 1 and leaving it in the standard environment for 30 minutes, the peeling strength (adhesive strength after stimulation) B 1 was measured under the conditions of a peeling angle of 180 degrees and a tensile speed of 300 mm / min. N / 25 mm]. The contents of each stimulus shown in Table 1 are specifically described below.
Heating: heating at 80 ° C for 5 minutes.
UV irradiation: The UniField manufactured by Ushio company was used to irradiate ultraviolet rays with a main wavelength of about 365 nm in a light amount of 2000 mJ / cm 2 .

由所獲得之結果,以刺激後黏著力B1 相對於初期黏著力B0 之比之形式算出黏著力上升比(B1 /B0 )。將結果示於表1。再者,將測定用樣品壓接至上述試片,於上述標準環境下放置24小時後,不特別施加刺激而於剝離角度180度、拉伸速度300 mm/min之條件下測定剝離強度(24小時後黏著力),結果黏著片材D1為0.45 N/25 mm,黏著片材D2為0.56 N/25 mm,黏著片材D3為0.36 N/25 mm,黏著片材D4為19.29 N/25 mm,黏著片材D5為0.77 N/25 mm,均為初期黏著力B0 之1.6倍以下。From the obtained results, the adhesion increase ratio (B 1 / B 0 ) was calculated as the ratio of the adhesion B 1 to the initial adhesion B 0 after stimulation. The results are shown in Table 1. Furthermore, the measurement sample was pressure-bonded to the test piece, and after being left in the standard environment for 24 hours, the peeling strength was measured at a peeling angle of 180 degrees and a tensile speed of 300 mm / min without applying a special stimulus (24 Adhesion after hours), the result is that the adhesive sheet D1 is 0.45 N / 25 mm, the adhesive sheet D2 is 0.56 N / 25 mm, the adhesive sheet D3 is 0.36 N / 25 mm, and the adhesive sheet D4 is 19.29 N / 25 mm , The adhesive sheet D5 is 0.77 N / 25 mm, both of which are less than 1.6 times the initial adhesive force B 0 .

[表1]
[Table 1]

<積層體之製造>
(製造例1)
將黏著片材D1裁斷成寬度25 mm、長度100 mm之尺寸,而製備積層體製造用黏著片材。又,作為被黏著體,準備厚度12.5 μm、寬度30 mm、長度120 mm之聚醯亞胺膜(Toray-Dupont公司製造,「Kapton 50EN」)。將上述黏著片材貼合於上述被黏著體,對該黏著片材實施圖案加工後賦予刺激而使黏著力上升,藉此製作利用上述經圖案加工之黏著片材覆蓋上述被黏著體之構成之積層體。
< Manufacturing of laminated body >
(Manufacturing example 1)
The adhesive sheet D1 was cut into a width of 25 mm and a length of 100 mm to prepare an adhesive sheet for manufacturing a laminated body. In addition, a polyimide film ("Kapton 50EN" manufactured by Toray-Dupont, Inc.) having a thickness of 12.5 μm, a width of 30 mm, and a length of 120 mm was prepared as an adherend. The adhesive sheet is adhered to the adherend, and the adhesive sheet is subjected to pattern processing to give stimulation to increase the adhesive force, thereby producing a structure in which the pattern-processed adhesive sheet is used to cover the adherend. Laminated body.

具體而言,將上述被黏著體之中央與上述黏著片材之中央進行位置對準,利用手壓輥將上述黏著片材貼附於上述被黏著體(貼附步驟)。
於所獲得之黏著片材/被黏著體積層物中之黏著片材之寬度中央設定自該黏著片材之長度方向之一端呈直線狀延伸至另一端之寬度2 mm、長度100 mm之第二區域。藉由沿上述第二區域與其兩側之第一區域之邊界(兩條直線)自黏著片材面側照射雷射,而實施僅將黏著片材D1切斷之切斷加工(切割步驟)。上述切斷加工係使用GCC公司製造之雷射切斷裝置「Spirit,Model number SI-30V」,於以下之條件下進行。
速度(Speed):9.0%
功率(Power):10.0%
DPI:500
PPI:400
將第二區域之一端自被黏著體剝離,利用拉伸試驗機之夾頭夾住,於剝離角度180度、拉伸速度300 mm/min之條件下,沿黏著片材之長度方向進行拉伸,藉此將寬度2 mm之狹縫狀之第二區域自被黏著體剝離去除(局部去除步驟)。
繼而,藉由進行上述加熱(80℃、5分鐘)作為黏著力上升刺激(黏著力上升步驟),而製造目標之積層體。
Specifically, the center of the adherend is aligned with the center of the adhesive sheet, and the adhesive sheet is attached to the adherend using a hand pressure roller (attachment step).
The center of the width of the adhesive sheet in the obtained adhesive sheet / adhered volume layer is set from one end in the longitudinal direction of the adhesive sheet to a straight line extending to the other end with a width of 2 mm and a second length of 100 mm. region. A laser beam is irradiated from the adhesive sheet surface side along the boundary (two straight lines) of the second region and the first region on both sides of the adhesive sheet to perform a cutting process (cutting step) of cutting only the adhesive sheet D1. The above cutting process is performed using a laser cutting device "Spirit, Model number SI-30V" manufactured by GCC, under the following conditions.
Speed: 9.0%
Power: 10.0%
DPI: 500
PPI: 400
One end of the second region was peeled off from the adherend, clamped by a chuck of a tensile tester, and stretched in the length direction of the adhesive sheet under the conditions of a peeling angle of 180 degrees and a stretching speed of 300 mm / min. Therefore, the slit-shaped second region with a width of 2 mm is peeled off from the adherend (partial removal step).
Then, the above-mentioned heating (80 ° C., 5 minutes) was performed as an adhesion increase stimulus (adhesion increase step) to produce a target laminate.

(製造例2)
使用黏著片材D2代替黏著片材D1,且於黏著力上升步驟中將所施加之刺激自加熱變更為上述UV照射(主波長約365 nm、光量2000 mJ/cm2 ),除上述方面以外,藉由與製造例1相同之程序製造積層體。
(Manufacturing example 2)
Use the adhesive sheet D2 instead of the adhesive sheet D1, and change the applied stimulus self-heating to the above-mentioned UV irradiation (principal wavelength of about 365 nm and light intensity of 2000 mJ / cm 2 ) in the step of increasing the adhesive force. In addition to the above, The laminated body was produced by the same procedure as in Production Example 1.

(製造例3~5)
分別使用黏著片材D1、D3及D4,不進行黏著力上升步驟,除該方面以外,藉由與製造例1相同之程序製造積層體。
(Production Examples 3 to 5)
A laminated body was produced by the same procedure as in Production Example 1 except that the adhesive force raising step was not performed using the adhesive sheets D1, D3, and D4, respectively.

(製造例8)
使用黏著片材D5代替黏著片材D1,除該方面以外,藉由與製造例1相同之程序製造積層體。
(Manufacturing example 8)
A laminated body was produced by the same procedure as in Production Example 1 except that the adhesive sheet D5 was used instead of the adhesive sheet D1.

(狹縫部去除性評價)
於各製造例之局部去除步驟中,於將自被黏著體剝離第二區域時未發現被黏著體發生伸長等變形之情形時評價為「G」(圖案加工性良好),於發現變形之情形時評價為「P」(圖案加工性不足)。將結果示於表2。
再者,於製造例5中,由於未能適當地進行第二區域之剝離,故而未進行以下之耐久性試驗。又,於製造例1~4、8中,於剝離第二區域時均未於被黏著體發現糊劑殘留。
(Evaluation of Removability of Slit Part)
In the partial removal step of each manufacturing example, when no deformation such as elongation of the adherend was found when the adherend was peeled from the second region, it was evaluated as "G" (good pattern workability), and when deformation was found At that time, it was evaluated as "P" (pattern workability was insufficient). The results are shown in Table 2.
Furthermore, in Production Example 5, the peeling of the second region could not be properly performed, so the following durability test was not performed. In addition, in Production Examples 1 to 4, and 8 even when the second region was peeled off, no paste remained in the adherend.

(耐久性試驗)
針對藉由製造例1~4、8所獲得之積層體,使用Yuasa system公司製造之面狀體無負載U字伸縮試驗機「DLDM111LH」及夾具(面狀體無負載U字伸縮試驗夾具),於伸縮速度30 rpm、彎曲半徑3 mm、伸縮次數100次之條件下進行耐久性試驗。
具體而言,如圖6所示,將樣品60之兩端部x、y利用雙面膠帶(未圖示)固定於上述試驗機之夾板部分61、62後,於上述條件下,重複進行如樣品60自平面之狀態以黏著片材側為內側彎折成彎曲半徑3 mm之U字狀的伸縮。於將樣品60彎折時,藉由夾板之作動使樣品60之兩端部x、y接觸,並且利用另外設置之板部63、64自兩外側將樣品60之其他部分於無負載之條件下夾入。
藉由目視觀察100次伸縮後之樣品之狀態,於黏著片材與被黏著體之間未發現隆起之情形時評價為「G」(耐久性良好),於發現隆起之情形時評價為「P」(耐久性不足)。將結果示於表2。
(Durability test)
For the laminated bodies obtained in Manufacturing Examples 1 to 4, and 8, a flat body no-load U-shaped telescopic tester "DLDM111LH" and a jig (flat body no-load U-shaped telescopic test fixture) manufactured by Yuasa system were used. The durability test was performed under the conditions of a telescopic speed of 30 rpm, a bending radius of 3 mm, and a number of telescopic times.
Specifically, as shown in FIG. 6, both ends x and y of the sample 60 are fixed to the splint portions 61 and 62 of the testing machine by using a double-sided tape (not shown). The sample 60 was folded in a U-shape with a bending radius of 3 mm from the flat state with the adhesive sheet side as the inner side. When the sample 60 is bent, the two ends x, y of the sample 60 are brought into contact by the action of the splint, and the other parts of the sample 60 are used from the outer sides under the condition of no load by using the additional plate portions 63 and 64. embed.
By visually observing the state of the sample after 100 expansions, it was evaluated as "G" (good durability) when no bulge was found between the adhesive sheet and the adherend, and "P" when it was found. "(Insufficient durability). The results are shown in Table 2.

[表2]
[Table 2]

如表2所示,藉由加熱或UV照射進行了黏著力上升處理之製造例1、2、8於局部去除步驟中之第二區域之剝離性良好,且製造之積層體顯示出良好之耐久性。於使用具備含有使N-乙烯基環狀醯胺共聚而成之聚合物A1之黏著劑層的黏著片材D1、D2製造積層體之製造例1、2中,獲得尤其良好之結果。與此相對,於未進行黏著力上升處理之製造例3~5中,製造例3、4所獲得之積層體之耐久性較低,製造例5於局部去除步驟中之第二區域之剝離性存在問題。As shown in Table 2, in Production Examples 1, 2, and 8 in which the adhesion-rise treatment was performed by heating or UV irradiation, the second region in the partial removal step had good peelability, and the manufactured laminate showed good durability. Sex. Particularly good results were obtained in Production Examples 1 and 2 using the adhesive sheets D1 and D2 having an adhesive layer containing a polymer A1 copolymerized with N-vinyl cyclic amidine. On the other hand, in Manufacturing Examples 3 to 5 which were not subjected to the adhesion-increasing treatment, the laminates obtained in Manufacturing Examples 3 and 4 had low durability, and the peelability of the second region in the partial removal step in Manufacturing Example 5 was low. There is a problem.

(製造例6)
如圖7所示,準備於寬度120 mm、長度220 mm之聚醯亞胺膜72之單面之寬度中央具有自該膜72之長度方向之一端呈直線狀延伸至另一端之寬度1.9 mm之銅圖案配線74的被黏著體70。將黏著片材D1裁斷成寬度100 mm、長度200 mm之尺寸,將所獲得之黏著片材利用手壓輥貼附於該被黏著體70之銅圖案配線形成面之大致中央(貼附步驟)。
於所獲得之黏著片材/被黏著體積層物,與上述銅圖案配線重疊地設定沿寬度方向橫跨上述黏著片材而延伸之寬度2 mm之第二區域,沿該第二區域與其兩側之第一區域之邊界,自上述積層物之黏著片材側進行與製造例1相同之雷射切斷,藉此實施僅將上述黏著片材切斷之切斷加工(切割步驟)。
繼而,藉由將上述第二區域自被黏著體剝離去除(局部去除步驟),獲得經具有寬度2 mm之狹縫之黏著片局部地覆蓋被黏著體,且於該狹縫中露出銅圖案配線之構成的積層體。
(Manufacturing example 6)
As shown in FIG. 7, the width center of one side of the polyimide film 72 having a width of 120 mm and a length of 220 mm has a width of 1.9 mm extending linearly from one end in the length direction of the film 72 to the other end. The adherend 70 of the copper pattern wiring 74. The adhesive sheet D1 is cut into a width of 100 mm and a length of 200 mm, and the obtained adhesive sheet is attached to the approximate center of the copper pattern wiring forming surface of the adherend 70 by a hand roller (attachment step). .
A second region with a width of 2 mm extending across the adhesive sheet in the width direction is set on the obtained adhesive sheet / adhered volume layer to overlap the copper pattern wiring, along the second region and both sides thereof The boundary of the first region is subjected to laser cutting similar to that of Production Example 1 from the adhesive sheet side of the laminate, thereby performing a cutting process (cutting step) of cutting only the adhesive sheet.
Then, by peeling and removing the second area from the adherend (partial removal step), it is obtained that the adherend is partially covered by the adhesive sheet having a slit with a width of 2 mm, and the copper pattern wiring is exposed in the slit. Laminated body.

(製造例7)
將黏著片材D4裁斷成寬度100 mm、長度200 mm之尺寸,將其背面(基材層之與設置有黏著劑層之側為相反側之面)貼合於Toyochem公司製造之臨時固定膠帶「LE-900」之黏著面。
於所獲得之黏著片材/臨時固定膠帶積層物,設定沿寬度方向橫跨該黏著片材而延伸之寬度2 mm之第二區域,沿該第二區域與其兩側之第一區域之邊界,自上述積層物之黏著片材側進行與製造例1相同之雷射切斷,藉此實施僅將上述黏著片材切斷之切斷加工。
繼而,藉由將上述第二區域自臨時固定膠帶剝離去除,而獲得形成有上述狹縫之黏著片之背面支持於上述臨時固定膠帶之積層物。
使用Beac公司製造之高精度膜貼合機(型號:BCF250RH),將上述積層物之黏著單側以上述狹縫與上述銅圖案配線重疊之方式於常溫下壓接至與製造例6相同之被黏著體後,僅將上述臨時固定膠帶剝離。
(Manufacturing example 7)
The adhesive sheet D4 was cut to a width of 100 mm and a length of 200 mm, and the back surface (the surface of the base material layer opposite to the side on which the adhesive layer was provided) was stuck to a temporary fixing tape manufactured by Toyochem. LE-900 "adhesive surface.
On the obtained adhesive sheet / temporary fixing tape laminate, set a second region with a width of 2 mm extending across the adhesive sheet in the width direction, along the boundary between the second region and the first regions on both sides of the adhesive sheet, The same laser cutting as in Production Example 1 was performed from the adhesive sheet side of the laminate, thereby performing a cutting process of cutting only the adhesive sheet.
Then, the second region is peeled and removed from the temporary fixing tape to obtain a laminate on which the back surface of the adhesive sheet having the slits formed therein is supported by the temporary fixing tape.
Using a high-precision film bonding machine (model: BCF250RH) manufactured by Beac Company, the adhesive side of the laminate was crimped to the same blanket as in Manufacturing Example 6 at room temperature in such a manner that the slits overlap the copper pattern wiring. After the adherend, only the temporary fixing tape described above was peeled off.

(狹縫形成精度評價試驗)
針對藉由製造例6、7所獲得之積層體,使用Olympus公司製造之測長顯微鏡(型號:STM6),如圖8所示,將銅圖案配線74之中心線L0與設置於黏著片76、76之間之狹縫之中心線L1的距離設為誤差X而進行測量。基於該測量結果,於誤差X未達50 μm之情形時判定為「合格」,於誤差X為50 μm以上之情形時判定為「不合格」。將結果示於表3。
(Slit formation accuracy evaluation test)
For the multilayer bodies obtained in Manufacturing Examples 6 and 7, a length measuring microscope (model: STM6) manufactured by Olympus was used. As shown in FIG. 8, the center line L0 of the copper pattern wiring 74 and the adhesive sheet 76, The distance of the center line L1 of the slits between 76 is measured as the error X. Based on this measurement result, it is judged as "Pass" when the error X is less than 50 μm, and it is judged as "Fail" when the error X is 50 μm or more. The results are shown in Table 3.

[表3]
[table 3]

以上,對本發明之具體例進行了詳細說明,但該等僅為例示,並不限定申請專利範圍。申請專利範圍所記載之技術包含將以上所例示之具體例進行各種變化、變更而成者。In the foregoing, specific examples of the present invention have been described in detail, but these are merely examples and do not limit the scope of patent application. The technology described in the patent application scope includes various changes and modifications to the specific examples illustrated above.

1‧‧‧積層體1‧‧‧ laminated body

10‧‧‧被黏著體 10‧‧‧ adherend

10A‧‧‧表面 10A‧‧‧ surface

20‧‧‧黏著片材 20‧‧‧ Adhesive sheet

21‧‧‧第一區域 21‧‧‧First Zone

21A‧‧‧黏著片 21A‧‧‧Adhesive sheet

21B‧‧‧黏著片 21B‧‧‧Adhesive sheet

22‧‧‧第二區域 22‧‧‧Second Zone

50‧‧‧積層體製造裝置 50‧‧‧Laminated body manufacturing device

51‧‧‧貼附機構 51‧‧‧ Attachment

52‧‧‧切割機構 52‧‧‧cutting mechanism

53‧‧‧剝離機構 53‧‧‧Stripping agency

54‧‧‧黏著力上升機構 54‧‧‧Adhesive force rising mechanism

60‧‧‧樣品 60‧‧‧sample

61‧‧‧夾板部分 61‧‧‧Plywood section

62‧‧‧夾板部分 62‧‧‧Plywood section

63‧‧‧板部 63‧‧‧ Board

64‧‧‧板部 64‧‧‧ Board

70‧‧‧被黏著體 70‧‧‧ adherend

72‧‧‧聚醯亞胺膜 72‧‧‧Polyimide film

74‧‧‧銅圖案配線 74‧‧‧ copper pattern wiring

76‧‧‧黏著片 76‧‧‧ Adhesive sheet

202‧‧‧基材層 202‧‧‧ substrate layer

204‧‧‧黏著劑層 204‧‧‧Adhesive layer

C‧‧‧切斷預定線 C‧‧‧ cut off the planned line

L‧‧‧雷射光 L‧‧‧ laser light

L0‧‧‧銅圖案配線之中心線 L0‧‧‧ Centerline of copper pattern wiring

L1‧‧‧狹縫之中心線 L1‧‧‧ the centerline of the slit

S10‧‧‧貼附步驟 S10‧‧‧ Attach step

S20‧‧‧切割步驟 S20‧‧‧ Cutting steps

S30‧‧‧局部去除步驟 S30‧‧‧Partial removal step

S40‧‧‧黏著力上升步驟 S40‧‧‧Adhesion step

X‧‧‧誤差 X‧‧‧ error

x‧‧‧端部 x‧‧‧ end

y‧‧‧端部 y‧‧‧end

圖1係表示一實施形態之積層體製造方法之流程圖。FIG. 1 is a flowchart showing a method for manufacturing a laminated body according to an embodiment.

圖2係表示藉由一實施形態之積層體製造方法所製造之積層體之立體圖。 FIG. 2 is a perspective view showing a laminated body manufactured by a laminated body manufacturing method according to an embodiment.

圖3係圖2之III-III線剖視圖。 FIG. 3 is a sectional view taken along the line III-III in FIG. 2.

圖4係說明一實施形態之積層體製造方法之切割步驟之立體圖。 FIG. 4 is a perspective view illustrating a cutting step of a method for manufacturing a laminated body according to an embodiment.

圖5係表示一實施形態之積層體製造方法所使用之積層體製造裝置之概略構成的說明圖。 5 is an explanatory diagram showing a schematic configuration of a multilayer body manufacturing apparatus used in a multilayer body manufacturing method according to an embodiment.

圖6係表示耐久性試驗之實施方法之說明圖。 FIG. 6 is an explanatory diagram showing a method for implementing a durability test.

圖7係表示用於狹縫形成精度評價試驗之被黏著體之俯視圖。 FIG. 7 is a plan view showing an adherend used in a slit formation accuracy evaluation test.

圖8係表示狹縫形成精度評價試驗中之誤差X之說明圖。 FIG. 8 is an explanatory diagram showing an error X in a slit formation accuracy evaluation test.

Claims (14)

一種積層體製造方法,該積層體係包含被黏著體與局部地覆蓋該被黏著體之黏著片者,且該積層體之製造方法依序包括: 貼附步驟,其係將包含基材層與積層於該基材層之至少上述被黏著體側之面之黏著劑層的黏著片材貼附於上述被黏著體; 切割步驟,其係對上述黏著片材中構成上述黏著片之第一區域與不構成上述黏著片之第二區域之邊界實施切斷加工; 局部去除步驟,其係使上述第一區域殘留於上述被黏著體上並且將上述第二區域自上述被黏著體剝離去除;及 黏著力上升步驟,其係使上述第一區域對上述被黏著體之黏著力上升。A laminated body manufacturing method. The laminated system includes an adherend and an adhesive sheet partially covering the adherend, and the manufacturing method of the laminated body includes: The attaching step includes attaching an adhesive sheet including a substrate layer and an adhesive layer laminated on at least the surface of the adherend side of the substrate layer to the adherend; The cutting step includes cutting the boundary between the first region constituting the adhesive sheet and the second region not constituting the adhesive sheet in the adhesive sheet; A partial removal step, which leaves the first region on the adherend and peels and removes the second region from the adherend; and The step of increasing the adhesive force is to increase the adhesive force of the first region to the adherend. 如請求項1之積層體製造方法,其中上述黏著力上升步驟包含加熱處理。The method for manufacturing a laminated body according to claim 1, wherein the step of increasing the adhesive force includes heat treatment. 如請求項2之積層體製造方法,其中上述黏著劑層含有:聚合物A,其玻璃轉移溫度未達0℃;及聚合物B,其係具有聚有機矽氧烷骨架之單體與(甲基)丙烯酸系單體之共聚物。For example, the method for manufacturing a laminated body according to claim 2, wherein the adhesive layer contains: polymer A, whose glass transition temperature is less than 0 ° C; and polymer B, which is a monomer having a polyorganosiloxane frame and (A Based) a copolymer of acrylic monomers. 如請求項3之積層體製造方法,其中構成上述聚合物A之單體成分含有N-乙烯基環狀醯胺。The method for producing a laminated body according to claim 3, wherein the monomer component constituting the polymer A contains N-vinyl cyclic amidine. 如請求項1之積層體製造方法,其中上述黏著力上升步驟包含紫外線照射處理。The method for manufacturing a laminated body according to claim 1, wherein the step of increasing the adhesive force includes an ultraviolet irradiation treatment. 如請求項5之積層體製造方法,其中上述黏著劑層包含含有基礎聚合物與光硬化劑之光硬化性組合物, 上述光硬化劑為多官能(甲基)丙烯酸酯,且 上述光硬化劑之含量相對於上述基礎聚合物100重量份為1重量份以上且50重量份以下。The method for manufacturing a laminated body according to claim 5, wherein the adhesive layer comprises a photocurable composition containing a base polymer and a photohardener, The photocuring agent is a polyfunctional (meth) acrylate, and The content of the photocuring agent is 1 part by weight or more and 50 parts by weight or less based on 100 parts by weight of the base polymer. 如請求項1至6中任一項之積層體製造方法,其中於上述黏著力上升步驟中,使上述黏著片材對上述被黏著體之黏著力上升至該步驟前之2倍以上。The method for manufacturing a laminated body according to any one of claims 1 to 6, wherein in the step of increasing the adhesive force, the adhesive force of the adhesive sheet to the adherend is increased to more than twice that before the step. 如請求項1至7中任一項之積層體製造方法,其中上述局部去除步驟係於上述黏著片材對上述被黏著體之黏著力超過2 N/25 mm之前進行。The method for manufacturing a laminated body according to any one of claims 1 to 7, wherein the partial removing step is performed before the adhesive force of the adhesive sheet to the adherend exceeds 2 N / 25 mm. 如請求項1至8中任一項之積層體製造方法,其中藉由上述黏著力上升步驟,使上述第一區域之黏著片材對上述被黏著體之黏著力為3 N/25 mm以上。The laminated body manufacturing method according to any one of claims 1 to 8, wherein the adhesion force of the adhesive sheet in the first region to the adherend is 3 N / 25 mm or more by the above-mentioned adhesive force increasing step. 如請求項1至9中任一項之積層體製造方法,其中上述第二區域係以該第二區域之至少一端到達上述黏著片材之端之方式設定。The laminated body manufacturing method according to any one of claims 1 to 9, wherein the second region is set so that at least one end of the second region reaches the end of the adhesive sheet. 如請求項10之積層體製造方法,其中上述第二區域為到達上述黏著片材之端之一端朝向該黏著片材之端變寬之形狀。The method for manufacturing a laminated body according to claim 10, wherein the second region has a shape that reaches one end of the adhesive sheet and widens toward the end of the adhesive sheet. 如請求項1至11中任一項之積層體製造方法,其中上述貼附步驟所使用之上述黏著片材之面積為2500 cm2 以上,且短邊之長度為50 cm以上。The laminated body manufacturing method according to any one of claims 1 to 11, wherein the area of the above-mentioned adhesive sheet used in the above-mentioned attaching step is 2500 cm 2 or more, and the length of the short side is 50 cm or more. 如請求項1至12中任一項之積層體製造方法,其中作為上述貼附步驟所使用之上述黏著片材及上述被黏著體,使用包含複數個與上述積層體對應之單元者;且 作為上述貼附步驟之後進行之步驟,進而包括將上述黏著片材及上述被黏著體分割成上述單元之分割步驟。The method for manufacturing a laminated body according to any one of claims 1 to 12, wherein the adhesive sheet and the adherend used in the above-mentioned attaching step include a plurality of units corresponding to the laminated body; and As a step performed after the above-mentioned attaching step, a step of dividing the adhesive sheet and the adherend into the units is further included. 一種積層體製造裝置,其係用以實施如請求項1至13中任一項之製造方法之裝置,且包含: 貼附機構,其貼附上述黏著片材; 切割機構,其對上述黏著片材實施切斷加工; 剝離機構,其將上述黏著片材之上述第二區域剝離;及 黏著力上升機構,其對上述黏著片材賦予黏著力上升刺激。A laminated body manufacturing device is a device for implementing the manufacturing method according to any one of claims 1 to 13, and includes: An attachment mechanism for attaching the above-mentioned adhesive sheet; A cutting mechanism for cutting the adhesive sheet; A peeling mechanism that peels the second region of the adhesive sheet; and The adhesive force increasing mechanism imparts an adhesive force increasing stimulus to the adhesive sheet.
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