TW201931438A - Lighting method for lamp - Google Patents
Lighting method for lamp Download PDFInfo
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- TW201931438A TW201931438A TW107144003A TW107144003A TW201931438A TW 201931438 A TW201931438 A TW 201931438A TW 107144003 A TW107144003 A TW 107144003A TW 107144003 A TW107144003 A TW 107144003A TW 201931438 A TW201931438 A TW 201931438A
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- exposure
- lamp
- power
- discharge lamp
- light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/84—Lamps with discharge constricted by high pressure
- H01J61/88—Lamps with discharge constricted by high pressure with discharge additionally constricted by envelope
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Discharge Lamps And Accessories Thereof (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Circuit Arrangements For Discharge Lamps (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
本發明係關於一種可發出用於例如印刷配線基板等之曝光的光之燈之點亮方法。The present invention relates to a lighting method capable of emitting a lamp for exposure of, for example, a printed wiring board or the like.
向來所使用的一種印刷配線基板是為了實際將零件安裝於電子機器而在樹脂或玻璃環氧樹脂材料的基板上以銅等之金屬形成的配線圖案。此等之印刷配線基板上之配線圖案的形成係可使用一種光蝕刻技術。光蝕刻係對於全面上形成有成為配線的金屬層之基板上的全面,塗布感光性薬劑之光阻劑,並藉由照射由曝光裝置而來的照射光,使之通過與該配線圖案相同之光罩來進行的。One type of printed wiring board that has been used in the past is a wiring pattern formed of a metal such as copper on a substrate of a resin or a glass epoxy material in order to actually mount the component on an electronic device. The formation of the wiring pattern on such a printed wiring substrate can use a photo etching technique. The photolithography is applied to a substrate on which a metal layer to be wired is formed over the entire surface, and a photoresist for applying a photosensitive tincture is applied, and the irradiation light from the exposure device is irradiated to be the same as the wiring pattern. The reticle is carried out.
光阻劑係有:因照射光致使光阻劑的溶解性降低之負型光阻劑、與相反地因照射光致使光阻劑的溶解性增大之正型光阻劑。藉由化學處理而去除因照射光致使溶解性相對地增大之光阻劑部分,藉由蝕刻除去露出的金屬層時,在殘留有光阻劑的部分之下方只有金屬層殘留,因除去了光阻劑而在基板上形成配線圖案。即使是照射光照射在正型、負型任一者的光阻劑之情況下,為了確保照射面全面皆為均一的曝光量,則可以使用平均1燈的發光量的多個放電燈做為光源。The photoresist includes a negative photoresist which reduces the solubility of the photoresist due to irradiation of light, and a positive photoresist which, in contrast, causes the solubility of the photoresist to increase due to the irradiation of light. By removing the photoresist portion which relatively increases the solubility due to the irradiation light by chemical treatment, when the exposed metal layer is removed by etching, only the metal layer remains below the portion where the photoresist remains. A photoresist is used to form a wiring pattern on the substrate. Even in the case where the irradiation light is applied to the photoresist of either the positive type or the negative type, in order to ensure that the irradiation surface is uniformly uniform in total, it is possible to use a plurality of discharge lamps having an average amount of light emission of one lamp as light source.
放電燈係藉由使得在發光管內之氣密的内部空間中被相互分離對向配置的一對電極彼此之間發生電弧放電、激發被封入該内部空間的水銀而產生紫外光之發光。The discharge lamp generates ultraviolet light by causing arc discharge between the pair of electrodes disposed opposite to each other in the airtight internal space in the arc tube to excite the mercury enclosed in the internal space.
依照光阻劑的種類來決定最適當的曝光時間;即,決定將來自放電燈的光照射於光阻劑的時間長度。因此,放電燈與曝光對象物(光阻劑等)之間配置快門,藉由只在需要的時間打開快門,一般而言的實施方式是:以最適當的曝光時間對於曝光對象物進行曝光,除此以外的期間(例如,更換曝光對象物的期間等)快門是關閉。(例如,專利文獻1)。
《先行技術文獻》
《專利文獻》The most appropriate exposure time is determined according to the type of the photoresist; that is, the length of time during which the light from the discharge lamp is irradiated to the photoresist is determined. Therefore, a shutter is disposed between the discharge lamp and the exposure target (resist or the like), and by opening the shutter only at a required time, in general, the exposure of the object to be exposed is performed at the most appropriate exposure time. The shutter is closed during other periods (for example, during replacement of the exposure target). (for example, Patent Document 1).
Advanced Technology Literature
Patent Literature
《專利文獻1》 特開2002-373840號公報Patent Document 1 JP-A-2002-373840
《發明所欲解決的課題》"The subject to be solved by the invention"
然而,習用的曝光方法是有問題的。因為藉由以快門來控制曝光時間,即使是不實施曝光,燈也還是需要持續地發光,不僅造成電力的無效,而且經常以額定電力發光致使燈無法達成長使用壽命化。However, the conventional exposure method is problematic. Since the exposure time is controlled by the shutter, even if the exposure is not performed, the lamp needs to continuously emit light, which not only causes power failure, but also often causes the lamp to fail to achieve a long service life by the rated power.
本發明是有鑑於這類的課題而完成者,其目的在於提供一種放電燈之點亮方法,其為能夠降低對於曝光對象物的曝光沒有貢獻且無用的電力,並且能夠達成燈之長使用壽命化。
《用以解決課題之手段》The present invention has been made in view of the above problems, and an object of the invention is to provide a method for lighting a discharge lamp, which is capable of reducing power that does not contribute to exposure of an object to be exposed and is useless, and can achieve a long life of the lamp. Chemical.
"Means to solve the problem"
根據本發明之一方面,提供一種燈之點亮方法,其中
在對於曝光對象物進行曝光的曝光時間內,對於燈供給曝光用電力,
前述曝光時間以外,對於前述燈供給待機電力,該待機電力係比前述曝光用電力還更低、且能夠維持前述燈之點亮狀態。According to an aspect of the invention, there is provided a lighting method of a lamp, wherein an exposure power is supplied to a lamp during an exposure time for exposing an exposure object,
In addition to the exposure time, the standby power is supplied to the lamp, and the standby power is lower than the exposure power, and the lighting state of the lamp can be maintained.
較佳者是前述燈為放電燈,前述曝光用電力的供給時間是:比前述放電燈的内壓達到在前述曝光用電力持續供給至前述放電燈的情況下之前述放電燈的定常内壓之時間還要更短。Preferably, the lamp is a discharge lamp, and the supply time of the exposure power is a constant internal pressure of the discharge lamp when the internal pressure of the discharge lamp is continuously supplied to the discharge lamp. Time is even shorter.
較佳者是前述燈為LED(發光二極體);前述曝光用電力的供給時間是:比前述LED的接點溫度達到前述曝光用電力持供給至前述LED的情況下之前述LED的定常接點溫度之時間還要更短。Preferably, the lamp is an LED (Light Emitting Diode); and the supply time of the exposure power is a constant connection of the LED when the contact temperature of the LED reaches the exposure power and is supplied to the LED. The time to point the temperature is even shorter.
較佳者是:前述燈在LED的情況下,在前述曝光時間以外停止對於前述燈供給電力而使之熄燈。Preferably, in the case of the LED, the lamp stops supplying power to the lamp and turns off the light outside the exposure time.
較佳者是:配合曝光的光阻劑之受光感度,在前述曝光時間的期間改變來自前述燈的照射強度。
《發明效果》Preferably, the intensity of the light from the exposed lamp is changed during the exposure time by the light sensitivity of the exposed photoresist.
Invention effect
根據本發明,可以提供一種燈之點亮方法,其為能夠減低對於曝光對象物的曝光沒有貢獻之無用的電力、並且能夠達成燈之長使用壽命化。According to the present invention, it is possible to provide a method of lighting a lamp which is capable of reducing unnecessary power that does not contribute to exposure of an object to be exposed, and which can achieve a long life of the lamp.
(實施例1)(Example 1)
(曝光機10之構成)
圖1係顯示本發明所適用之實施例1有關的曝光機10。曝光機10係大略由曝光裝置50、集成器12、凹面鏡14、照射面16、快門24所構成。(Composition of exposure machine 10)
Fig. 1 is a view showing an exposure machine 10 according to Embodiment 1 to which the present invention is applied. The exposure machine 10 is roughly constituted by an exposure device 50, an integrator 12, a concave mirror 14, an irradiation surface 16, and a shutter 24.
曝光裝置50係放射含有適合於曝光對象物X之曝光的波長之光。曝光裝置50之詳細係在説明曝光機10之構成以後再進行説明。The exposure device 50 emits light having a wavelength suitable for exposure of the exposure target X. The details of the exposure device 50 will be described after explaining the configuration of the exposure machine 10.
集成器12係具有:接受來自曝光裝置50的光之入射面18、以及提高所接收的光之均一性並射出該光之出射面20。入射面18及出射面20係分別形成有複數個飛眼透鏡21。The integrator 12 has an incident surface 18 that receives light from the exposure device 50, and an exit surface 20 that enhances the uniformity of the received light and emits the light. The entrance surface 18 and the exit surface 20 are formed with a plurality of fly-eye lenses 21, respectively.
凹面鏡14係在其内側具有反射凹面22。該凹面鏡14係以反射凹面22反射由集成器12射出的光而成為平行光。The concave mirror 14 has a reflective concave surface 22 on its inner side. The concave mirror 14 reflects the light emitted from the integrator 12 by the reflective concave surface 22 to become parallel light.
照射面16係接受來自凹面鏡14的平行光之光;並配置在對於該平行光而言為約略垂直的方向。在該照射面16上放置曝光對象物X。在曝光對象物X的表面,塗布例如感光劑或光阻劑。藉由使來自凹面鏡14的平行光照射於曝光對象物X中之所期望的區域,而在曝光對象物X的表面上形成所期望的電路圖案等。The irradiation surface 16 receives the light of the parallel light from the concave mirror 14 and is disposed in a direction approximately perpendicular to the parallel light. The exposure target X is placed on the irradiation surface 16. On the surface of the exposure target X, for example, a sensitizer or a photoresist is applied. A desired circuit pattern or the like is formed on the surface of the exposure target X by irradiating the parallel light from the concave mirror 14 to a desired region in the exposure target X.
快門24係被配置在集成器12之出射面20側、用以開關來自放電燈110的光之路徑(光路)的裝置。配合曝光對象物X之曝光時間來開啟快門24而讓來自放電燈110的光達到曝光對象物X;曝光時間以外的時間是藉由關閉快門24而使來自放電燈110的光達不到所期望的照射面16。另外,配設快門24的位置,當然是不限定於本實施例,而是也可以配設在自放電燈110到曝光對象物X為止之間的光路上之其他的位置。The shutter 24 is a device that is disposed on the exit surface 20 side of the integrator 12 and that switches the path (optical path) of light from the discharge lamp 110. The shutter 24 is opened in conjunction with the exposure time of the exposure target X to allow the light from the discharge lamp 110 to reach the exposure target X; the time other than the exposure time is such that the light from the discharge lamp 110 is not achieved by closing the shutter 24 The illuminated surface 16. Further, the position at which the shutter 24 is disposed is of course not limited to the embodiment, and may be disposed at another position on the optical path between the discharge lamp 110 and the exposure target X.
(曝光裝置50之構成)
圖2係顯示本發明所適用的實施例1有關的曝光裝置50之圖。又,圖3係曝光裝置50之平面圖。曝光裝置50係具備有複數個光源裝置100、框架52、放電燈用開關53、放電燈用電源54、以及控制部60。(Composition of exposure device 50)
Fig. 2 is a view showing an exposure apparatus 50 according to Embodiment 1 to which the present invention is applied. 3 is a plan view of the exposure device 50. The exposure device 50 includes a plurality of light source devices 100, a frame 52, a discharge lamp switch 53, a discharge lamp power source 54, and a control unit 60.
光源裝置100係放射含有適合於曝光對象物X之曝光的波長之光。光源裝置100,如圖4所示,大略是由放電燈110、反射鏡150、以及絶緣基台170所構成。另外,有時候也將反射鏡150與絶緣基台170一起合併記載為反射鏡容器151。The light source device 100 emits light having a wavelength suitable for exposure of the exposure target X. As shown in FIG. 4, the light source device 100 is roughly constituted by a discharge lamp 110, a mirror 150, and an insulating base 170. Further, the mirror 150 is sometimes combined with the insulating base 170 as the mirror container 151.
放電燈110係如圖5所示,具有發光管部112、以及由該發光管部112延伸出的一對之密封部114。發光管部112及一對之密封部114係以石英玻璃而一體化形成的。再者,在發光管部112内還更進一步形成由密封部114所密閉的内部空間116。As shown in FIG. 5, the discharge lamp 110 has an arc tube portion 112 and a pair of sealing portions 114 extending from the arc tube portion 112. The arc tube portion 112 and the pair of sealing portions 114 are integrally formed of quartz glass. Further, an internal space 116 sealed by the sealing portion 114 is further formed in the arc tube portion 112.
在放電燈110之各密封部114内係分別設置有:經埋設的鉬製的箔118、一端為連接於箔118的一側端部並且其他端為被配置於内部空間116内的鎢製的一對電極120、以及一端為連接於箔118的另一側端部並且其他端由密封部114往外部延伸出之一對引線(lead)棒122。又,内部空間116係封入有指定量的水銀124及鹵素(例如,溴)。Each of the sealing portions 114 of the discharge lamp 110 is provided with an embedded molybdenum foil 118, one end of which is connected to one end of the foil 118, and the other end of which is disposed in the interior space 116. A pair of electrodes 120, and one end is connected to the other end of the foil 118 and the other ends are extended outward by the sealing portion 114 by a pair of lead bars 122. Further, the internal space 116 is sealed with a specified amount of mercury 124 and halogen (for example, bromine).
當對於被設置於放電燈110的一對引線棒122施加指定之高電壓時,則在被設置於發光管部112之内部空間116的一對電極120間開始的輝光放電移動為電弧放電,因該電弧所引起的蒸發及被激發的水銀124而放射出光(主要是紫外線)。When a predetermined high voltage is applied to the pair of lead bars 122 provided in the discharge lamp 110, the glow discharge started between the pair of electrodes 120 provided in the internal space 116 of the arc tube portion 112 is caused to be an arc discharge. The evaporation caused by the arc and the excited mercury 124 emit light (mainly ultraviolet rays).
返回到圖4,在本實施例中之此種的光源裝置100的一側之密封部114係被插設於反射鏡150の密封部插設孔156。另外,放電燈110可以是交流點燈用,也可以是直流點燈用。Returning to Fig. 4, the sealing portion 114 on one side of the light source device 100 of the present embodiment is inserted into the sealing portion insertion hole 156 of the mirror 150. In addition, the discharge lamp 110 may be used for an alternating current lighting or a direct current lighting.
反射鏡150係在其内側表面具有椀狀的反射面152。該反射面152係用以反射來自放電燈110的光之一部分,該放電燈係被配置成使發光管部112為位置於反射鏡150的内側。在本實施例中,該反射面152係規定旋轉拋物面。又,放電燈110中之發光點(概略是在内部空間116中之一對電極120間所形成的電弧之中央位置)係與該旋轉拋物面的焦點一致。藉此,放電燈110之發光點所放射、於反射面152反射後、由反射鏡150的開口154發出之光係幾乎成為平行光。當然,反射面152之形狀不是限定於此,可以是旋轉橢圓面或其他的旋轉面;或者也可以是旋轉面以外的形狀。又,不必要使發光點與焦點成為一致;也可以是按照需要而使發光點偏離焦點一些。The mirror 150 has a bowl-shaped reflecting surface 152 on its inner side surface. The reflective surface 152 is configured to reflect a portion of the light from the discharge lamp 110 that is configured to position the arc tube portion 112 on the inside of the mirror 150. In the present embodiment, the reflecting surface 152 defines a paraboloid of rotation. Further, the light-emitting point in the discharge lamp 110 (generally, the center position of the arc formed between one of the electrodes 120 in the internal space 116) coincides with the focus of the paraboloid of revolution. Thereby, the light emitted from the light-emitting point of the discharge lamp 110 and reflected by the reflecting surface 152 and emitted by the opening 154 of the mirror 150 is almost parallel light. Of course, the shape of the reflecting surface 152 is not limited thereto, and may be a rotating elliptical surface or another rotating surface; or may be a shape other than the rotating surface. Further, it is not necessary to make the light-emitting point coincide with the focus; it is also possible to make the light-emitting point deviate from the focus as needed.
又,反射鏡150中之開口154係突出設置有一自反對側起的底頸部155。另外,在反射鏡150的反射面152係形成有:可供放電燈110中之一側的密封部114插設之密封部插設孔156。該密封部插設孔156係自反射面152的底部起朝著底頸部155的前端而被形成。Further, the opening 154 in the mirror 150 is protruded from the bottom neck portion 155 from the opposite side. Further, on the reflecting surface 152 of the mirror 150, a sealing portion insertion hole 156 into which the sealing portion 114 on one side of the discharge lamp 110 is inserted is formed. The seal insertion hole 156 is formed from the bottom of the reflecting surface 152 toward the front end of the bottom neck portion 155.
如圖1所示,藉由將反射鏡150組合於放電燈110,使得以自放電燈110所放射出的光係沿著反射面152的中心軸CL行進的光,成為在指定的角度(開口角)之範囲內往反射鏡150的前方行進。As shown in FIG. 1, by combining the mirror 150 with the discharge lamp 110, the light emitted from the discharge lamp 110 travels along the central axis CL of the reflecting surface 152 at a predetermined angle (opening). The corners of the corners travel toward the front of the mirror 150.
回到圖4,絶緣基台170係由陶瓷等之電氣絶緣體所形成,並形成有:可供反射鏡150之底頸部155、及插設於密封部插設孔156的放電燈110中之一側的密封部114插入的反射鏡插入穴172。藉由將底頸部155及密封部114插入反射鏡插入穴172;絶緣基台170成為從外側覆蓋密封部插設孔156。Referring back to FIG. 4, the insulating base 170 is formed of an electrical insulator such as ceramic, and is formed with a bottom neck portion 155 for the mirror 150 and a discharge lamp 110 inserted into the sealing portion insertion hole 156. The mirror inserted into the sealing portion 114 on one side is inserted into the hole 172. The bottom neck portion 155 and the sealing portion 114 are inserted into the mirror insertion hole 172; the insulating base 170 is covered with the sealing portion insertion hole 156 from the outside.
又,在絶緣基台170係形成有與上述的反射鏡插入穴172連通之内側空間174;另外,該内側空間174與外側相互連通,並形成有可供電源線A插通的電源線插通穴176。Further, the insulating base 170 is formed with an inner space 174 that communicates with the mirror insertion hole 172 described above; and the inner space 174 communicates with the outer side to form a power line through which the power supply line A can be inserted. Hole 176.
另外,絶緣基台170及放電燈110係藉由具有電氣絶緣性及高熱傳導性之無機接着劑C而相互固定。具體説明時,將反射鏡150之底頸部155的端部、及、放電燈110之一側的密封部114插入絶緣基台170之反射鏡插入穴172內;另外,在電源線A配置於絶緣基台170之内側空間174的狀態下,於該内側空間174充填無機接着劑C。Further, the insulating base 170 and the discharge lamp 110 are fixed to each other by an inorganic adhesive C having electrical insulating properties and high thermal conductivity. Specifically, the end portion of the bottom neck portion 155 of the mirror 150 and the sealing portion 114 on one side of the discharge lamp 110 are inserted into the mirror insertion hole 172 of the insulating base 170; and the power supply line A is disposed in the power supply line A. In the state of the inner space 174 of the insulating base 170, the inorganic space C is filled in the inner space 174.
回到圖3,框架52係一種可用以形成可供複數個光源裝置100裝設的複數個凹處58之約略呈長方體狀的元件材料。Returning to Fig. 3, frame 52 is an approximately rectangular parallelepiped component material that can be used to form a plurality of recesses 58 for a plurality of light source devices 100.
回到圖2,放電燈用電源54係對於被安裝於框架52上之各光源裝置100的放電燈110所需要的電力。又,放電燈用開關53係用來開啟或關閉供給於放電燈110的電流。Returning to Fig. 2, the discharge lamp power source 54 is the power required for the discharge lamp 110 of each of the light source devices 100 mounted on the frame 52. Further, the discharge lamp switch 53 is for turning on or off the current supplied to the discharge lamp 110.
控制部60係具有操作放電燈用電源54而控制從放電燈用電源54供給至放電燈110的電力を控制。具體而言,如圖6所示,控制部60係在放電燈用電源54使曝光對象物X曝光之際,只在該曝光所需要的時間(曝光時間)供給曝光用電力H(例如,放電燈110的額定電力)。又,進行控制以在上述曝光時間以外,對於放電燈110供給比曝光用電力H還要更低、且能維持放電燈110之點亮狀態的待機電力L。The control unit 60 has a power supply control for controlling the discharge lamp power supply 54 to control the power supply from the discharge lamp power supply 54 to the discharge lamp 110. Specifically, as shown in FIG. 6 , when the discharge lamp power source 54 exposes the exposure target X, the control unit 60 supplies the exposure power H only for the time (exposure time) required for the exposure (for example, discharge). The rated power of the lamp 110). In addition, control is performed to supply the discharge lamp 110 with standby power L that is lower than the exposure power H and that can maintain the lighting state of the discharge lamp 110, in addition to the above-described exposure time.
此外,在圖6中,雖然是例示了放電燈用電源54供給脈衝波形狀的曝光用電力H之例子,然而,供給放電燈用電源54之曝光用電力Hの波形當然不是限定於此,也可以是如圖7所示使自待機電力L起到曝光用電力H為止是一次函數型(直線型)增加及減少,也可以是使之未圖示之二次函數型(放物線型)增加及減少。再更進一步而言,例如,如圖8所示,曝光時間內之曝光用電力H的値也可以是非一定值的。如圖8所示,即使是在曝光時間之前半是供給比較高的曝光用電力,操曝光時間的後半供給比較低的曝光用電力之情況下,曝光時間内所供給的電力量(電力的時間積分而得之値)係與圖6或圖7之圖案同等。又,也可以是按照曝光對象物X(例如,光阻劑)的特性,如圖9及圖10所示,改變曝光時間中之供給至放電燈110的電力來改變放電燈110之發光強度。In addition, although the example of the discharge electric power H of the pulse-wave shape is supplied to the discharge lamp power supply 54 as an example, the waveform of the exposure electric power H supplied to the discharge lamp power supply 54 is not limited to this, of course. As shown in FIG. 7 , the primary power type (linear type) may be increased or decreased from the standby power L to the exposure power H, or a quadratic function type (release type) not shown may be added. cut back. Still further, for example, as shown in FIG. 8, the enthalpy of the exposure power H during the exposure time may be non-constant. As shown in FIG. 8, even if the exposure power is relatively high in the first half of the exposure time and the relatively low exposure power is supplied in the second half of the exposure time, the amount of power supplied during the exposure time (the time of the power) The integral is equivalent to the pattern of Fig. 6 or Fig. 7. Further, in accordance with the characteristics of the exposure target X (for example, a photoresist), as shown in FIGS. 9 and 10, the electric power supplied to the discharge lamp 110 during the exposure time may be changed to change the luminous intensity of the discharge lamp 110.
如此,藉由改變在曝光時間中供給至放電燈110的電力,可以根據光阻劑之反應程度來進行短時間之電力調整,能夠供給適合於光阻劑之光反應的光量。As described above, by changing the electric power supplied to the discharge lamp 110 during the exposure time, it is possible to perform power adjustment for a short period of time depending on the degree of reaction of the photoresist, and it is possible to supply an amount of light suitable for the photoreaction of the photoresist.
(曝光裝置50之動作)
曝光裝置50之電源開關(未圖示)被導入時,則放電燈用開關53成為開啟,並開始自放電燈用電源54對於光源裝置100之放電燈110的給電。當開始給電時,放電燈110就被點亮。此外,在該階段,自放電燈用電源54供給至放電燈110的電力是待機電力L。(Operation of exposure device 50)
When the power switch (not shown) of the exposure device 50 is introduced, the discharge lamp switch 53 is turned on, and the power supply from the discharge lamp power source 54 to the discharge lamp 110 of the light source device 100 is started. When the power is turned on, the discharge lamp 110 is illuminated. Further, at this stage, the electric power supplied from the power source 54 for the discharge lamp to the discharge lamp 110 is the standby power L.
然後,開始對於曝光對象物X之曝光作業,當曝光對象物X配置於曝光機10之照射面16時,放電燈用電源54為於指定的時間(即,指定的曝光時間)、對於放電燈110供給比開始電力還要更高的曝光用電力H。又,與此同時並開啟曝光機10的快門24,讓來自放電燈110的曝光用之光照射於曝光對象物X來實施曝光作業。Then, the exposure operation for the exposure target X is started. When the exposure target X is placed on the irradiation surface 16 of the exposure machine 10, the discharge lamp power supply 54 is for a specified time (that is, a specified exposure time), for the discharge lamp. 110 supplies an exposure power H higher than the start power. At the same time, the shutter 24 of the exposure machine 10 is turned on, and the exposure light from the discharge lamp 110 is irradiated onto the exposure target X to perform an exposure operation.
當達到指定的曝光時間時,關閉快門24並且自放電燈用電源54供給至放電燈110的電力自曝光用電力H回到待機電力L。在那之後,將曝光終止之曝光對象物X替換成未曝光的曝光對象物X,再進行上述之曝光作業。以後,反復進行該曝光作業。When the specified exposure time is reached, the shutter 24 is turned off and the electric power supplied from the discharge lamp power source 54 to the discharge lamp 110 is returned from the exposure power H to the standby power L. After that, the exposure target X to which the exposure is terminated is replaced with the unexposed exposure target X, and the exposure operation described above is performed. Thereafter, the exposure operation is repeated.
(曝光裝置50之特徴)
根據本實施例,在關閉快門24而不對於曝光對象物X實施曝光時,自放電燈用電源54對於放電燈110供給待機電力L;在開啟快門24而對於曝光對象物X實施曝光之際,自放電燈用電源54對於放電燈110供給比待機電力L還要更高的曝光用電力H。(Special features of the exposure device 50)
According to the present embodiment, when the shutter 24 is closed and exposure is not performed on the exposure target X, the self-discharge lamp power supply 54 supplies the standby power L to the discharge lamp 110; when the shutter 24 is opened and the exposure target X is exposed, The self-discharge lamp power supply 54 supplies the discharge lamp 110 with an exposure power H higher than the standby power L.
藉此,因為在關閉快門24以致自放電燈110之光不對於曝光對象物X之曝光產生貢獻時,由於是以比較低的待機電力L供給至放電燈110,所以能夠減低無用的電力。By this means, when the shutter 24 is closed so that the light from the discharge lamp 110 does not contribute to the exposure of the exposure target X, since it is supplied to the discharge lamp 110 at a relatively low standby power L, useless power can be reduced.
又,與經常以額定電力使放電燈110持續點亮之習用的方法比較之下,因為是以比額定電力還低的待機電力L來點亮放電燈110的時間變長,所以能夠達成放電燈110之長使用壽命化。Further, in comparison with the conventional method of continuously lighting the discharge lamp 110 with the rated electric power, since the discharge lamp 110 is turned on at the standby electric power L lower than the rated electric power, the discharge lamp can be realized. The long life of 110 is long.
另外,當關注點燈中之放電燈110的發光管部112之内部空間116的壓力時,在經常以額定電力使放電燈110持續地點亮之習用的方法之情況下,如圖11所示,供給至放電燈110的電力、及、内部空間116的壓力係幾乎一定的。相對於此,在本實施例的放電燈110之點亮方法的情況下,如圖12所示,在供給待機電力L時之内部空間116的壓力是比較低的;當開始供給曝光用電力H時,則該壓力開始上昇。在自曝光用電力H回到待機電力L時,開始上昇的壓力成為最大而開始降低。以後,反復進行這一類的動作。Further, when attention is paid to the pressure of the internal space 116 of the arc tube portion 112 of the discharge lamp 110 in the lighting, in the case of the conventional method of constantly lighting the discharge lamp 110 with the rated electric power, as shown in FIG. The electric power supplied to the discharge lamp 110 and the pressure in the internal space 116 are almost constant. On the other hand, in the case of the lighting method of the discharge lamp 110 of the present embodiment, as shown in FIG. 12, the pressure of the internal space 116 when the standby power L is supplied is relatively low; when the supply of the exposure power H is started. At this time, the pressure begins to rise. When the self-exposure power H returns to the standby power L, the pressure that starts to rise becomes maximum and starts to decrease. In the future, this type of action is repeated.
根據本實施例的放電燈110之點亮方法,供給曝光用電力H之時間係比在放電燈110的内壓(發光管部112中之内部空間116的壓力)達到於該曝光用電力H持續被供給至放電燈110的情況下之放電燈110的定常内壓(即,如圖8所例示之類的壓力狀態)之時間還要更短。因此,即使是讓在實施曝光對象物X的曝光作業時之曝光用電力H、與習用的方法中之額定電力成為一致而放射同量的光,放電燈110的發光管部112中之内部空間116之峰值壓力係可以被抑制到保持比在採用習用的方法之情況還要更低。According to the lighting method of the discharge lamp 110 of the present embodiment, the time for supplying the exposure power H is higher than the internal pressure of the discharge lamp 110 (the pressure of the internal space 116 in the arc tube portion 112) reaches the exposure power H. The time of the constant internal pressure (i.e., the pressure state as illustrated in Fig. 8) of the discharge lamp 110 in the case of being supplied to the discharge lamp 110 is also shorter. Therefore, even if the exposure power H at the time of performing the exposure operation of the exposure target X is the same as the rated power in the conventional method, the same amount of light is emitted, and the internal space in the arc tube portion 112 of the discharge lamp 110 is emitted. The peak pressure of 116 can be suppressed to a lower level than in the case of the conventional method.
如此,當抑制發光管部112中之内部空間116的壓力保持於壓力時,即便是在自放電燈110所放射之光中所包含的可見光之中,波長比較短的光(短波長光)、及紫外光之比例也是增加的。當短波長光之比例增加時,曝光對象物X上所設置的光阻劑之曝光效率就會向上提高。由以上的事由來看,根據本實施例之放電燈110之點亮方法,就能夠對於曝光對象物X之曝光效率的提昇給予貢獻。When the pressure of the internal space 116 in the arc tube portion 112 is suppressed from being maintained at a pressure, even a light having a relatively short wavelength (short-wavelength light) among the visible light included in the light emitted from the discharge lamp 110, And the ratio of ultraviolet light is also increased. When the ratio of the short-wavelength light is increased, the exposure efficiency of the photoresist provided on the exposure target X is increased upward. In view of the above, according to the lighting method of the discharge lamp 110 of the present embodiment, it is possible to contribute to the improvement of the exposure efficiency of the exposure target X.
(變形例1)
在上述的實施例中,雖然是針對使用放電燈110來做為燈的情況下之點亮方法速行説明了,然而,也可以使用LED(發光二極體)或雷射做為燈來代替放電燈110。(Modification 1)
In the above-described embodiment, although the lighting method in the case where the discharge lamp 110 is used as the lamp is described as a quick description, it is also possible to use an LED (Light Emitting Diode) or a laser as a lamp instead. Discharge lamp 110.
特別是在使用LED來做為燈的情況下,係在該LED之接點溫度(在使LED發光時發熱之P型半導體與N型半導體相互接合的接合部之温度)為比達到將曝光用電力持續地供給至LED的情況中之LED的定常接點溫度為止之時間還要更短的時間內供給曝光用電力。In particular, when an LED is used as the lamp, the contact temperature of the LED (the temperature of the joint portion where the P-type semiconductor and the N-type semiconductor which generate heat when the LED emits light are mutually joined) is used for the exposure. The power for exposure is supplied in a shorter period of time until the constant temperature of the LED in the case where the power is continuously supplied to the LED.
因此,可以使用在使每次的曝光時間內供給至LED的電力上昇之後所產生的來自LED之光(紫外線)的照射強度之峰值(圖13参照),所以能夠更有效率良好地對於曝光對象物進行曝光。Therefore, it is possible to use the peak of the irradiation intensity (light in FIG. 13) of the light from the LED (the ultraviolet light) generated after the power supplied to the LED is increased for each exposure time (see FIG. 13), so that the exposure target can be more efficiently performed. The object is exposed.
更進一步而言,在上述的實施形態中,雖然在曝光時間以外是供給比曝光用電力H還要更低的待機電力L,然而在使用LED或雷射來做為燈的情況下,也可以是停止在曝光時間以外所供給的電力而讓該LED或雷射熄燈。Furthermore, in the above-described embodiment, the standby power L is supplied lower than the exposure power H except for the exposure time. However, when the LED or the laser is used as the lamp, It is to stop the power supplied outside the exposure time and turn off the LED or the laser.
(變形例2)
在使用LED或雷射來做為燈的情況下,當然在使用放電燈110的情況下,也可以是使自曝光時間内中之光源裝置100所照射的光之照射強度成為一定值,也可以取而代之以如圖14所示將連続曝光時間分為例如2個(「第1曝光時間」と「第2曝光時間」),在第1曝光時間與第2曝光時間改變自光源裝置100所照射的光之照射強度。(Modification 2)
When an LED or a laser is used as the lamp, of course, when the discharge lamp 110 is used, the irradiation intensity of the light irradiated by the light source device 100 during the exposure time may be a constant value. Instead, as shown in FIG. 14, the flail exposure time is divided into, for example, two ("first exposure time" と "second exposure time"), and the first exposure time and the second exposure time are changed from the illumination by the light source device 100. The intensity of light illumination.
在上述之圖14中,雖然是例示了在第1曝光時間中增強照射強度,而在第2曝光時間使之比該照射強度還弱的例子,然而,當然也可以是如圖15所示,在第1曝光時間減弱照射強度而在第2曝光時間使之比該照射強度還強。又,也可以是如圖16所示,在第1曝光時間中逐漸增強照射強度,而在第2曝光時間使照射強度成為一定值。更進一步而言,可以將連續曝光時間分為3個以上;例如,可以是如圖17所示,在第1曝光時間中逸漸增強照射強度;在第2曝光時間中為一定的照射強度;在第3曝光時間逐漸減弱照射強度。又,也可以是如圖18所示,第1曝光時間中急劇地漸增照射強度;在第2曝光時間中使照射強度急落到最初之後再成為一定;在第3曝光時間中使照射強度急增到最初之後再以二次函數漸減。如此,改變照射強度,可使用在以LED雷射做為燈的情況,當然也可以是在使用放電燈110的情況下使用。In the above-mentioned FIG. 14, although the example in which the irradiation intensity is increased in the first exposure time and the second exposure time is made weaker than the irradiation intensity is illustrated, it is needless to say that as shown in FIG. The irradiation intensity is weakened at the first exposure time and is stronger than the irradiation intensity at the second exposure time. Further, as shown in FIG. 16, the irradiation intensity may be gradually increased in the first exposure time, and the irradiation intensity may be set to a constant value in the second exposure time. Furthermore, the continuous exposure time can be divided into three or more; for example, as shown in FIG. 17, the irradiation intensity is gradually increased in the first exposure time; and the irradiation intensity is constant in the second exposure time; The irradiation intensity is gradually weakened at the third exposure time. Further, as shown in FIG. 18, the irradiation intensity may be gradually increased in the first exposure time, and the irradiation intensity may be made constant after the first exposure time, and the irradiation intensity may be made constant in the third exposure time. After the initial increase, the function is gradually reduced by the quadratic function. As described above, in the case where the irradiation intensity is changed, a case where the LED laser is used as the lamp can be used, and of course, the discharge lamp 110 can be used.
如此,藉由改變曝光時間中供給至燈的電力,就能夠根據光阻劑的反應程度而在進行短時間的電力調整,並能夠供給適合於光阻劑之光反應的光量。As described above, by changing the electric power supplied to the lamp during the exposure time, it is possible to perform power adjustment for a short period of time depending on the degree of reaction of the photoresist, and to supply an amount of light suitable for the photoreaction of the photoresist.
本次所揭示的實施形態,正因為全部的各點皆為例示,因而當然推斷為非限制性的。本發明之範圍不只是上述所説明的而已,而是意圖包括申請專利範圍所揭示者,並包括與申請專利範圍均等之意味及範囲内之全部的變更。The embodiment disclosed in the present invention is assumed to be non-limiting, since all the points are exemplified. The scope of the present invention is not limited by the scope of the invention, but is intended to be included in the scope of the claims.
10‧‧‧曝光機10‧‧‧Exposure machine
12‧‧‧集成器 12‧‧‧ Integrator
14‧‧‧凹面鏡 14‧‧‧ concave mirror
16‧‧‧照射面 16‧‧‧ illuminated surface
18‧‧‧入射面 18‧‧‧Incoming surface
20‧‧‧出射面 20‧‧‧Outlet
21‧‧‧飛眼透鏡 21‧‧‧ flying eye lens
22‧‧‧反射凹面 22‧‧‧Reflective concave
24‧‧‧快門 24‧‧ ‧Shutter
50‧‧‧曝光裝置 50‧‧‧Exposure device
52‧‧‧框架 52‧‧‧Frame
53‧‧‧放電燈用開關 53‧‧‧Discharge lamp switch
54‧‧‧放電燈用電源 54‧‧‧Power supply for discharge lamps
58‧‧‧凹處 58‧‧‧ recess
60‧‧‧控制部 60‧‧‧Control Department
100‧‧‧光源裝置 100‧‧‧Light source device
110‧‧‧放電燈 110‧‧‧discharge lamp
112‧‧‧發光管部 112‧‧‧Lighting tube department
114‧‧‧密封部 114‧‧‧ Sealing Department
116‧‧‧内部空間 116‧‧‧Internal space
118‧‧‧箔 118‧‧‧Foil
120‧‧‧電極 120‧‧‧electrode
122‧‧‧引線棒 122‧‧‧ lead bars
124‧‧‧水銀 124‧‧‧ Mercury
150‧‧‧反射鏡 150‧‧‧Mirror
151‧‧‧反射鏡容器 151‧‧‧Mirror container
152‧‧‧反射面 152‧‧‧reflecting surface
154‧‧‧開口 154‧‧‧ openings
155‧‧‧底頸部 155‧‧‧ bottom neck
156‧‧‧密封部插設孔 156‧‧‧ Sealing hole
170‧‧‧絶緣基台 170‧‧‧Insert base
172‧‧‧反射鏡插入穴 172‧‧‧Mirror insertion hole
174‧‧‧内側空間 174‧‧‧ inside space
176‧‧‧電源線插通穴 176‧‧‧Power cord plugged into the hole
X‧‧‧曝光對象物 X‧‧‧ Exposure objects
H‧‧‧曝光用電力 H‧‧‧Exposure power
L‧‧‧待機電力 L‧‧‧Standby power
圖1係顯示可適用於本發明之曝光機10的一例之圖。Fig. 1 is a view showing an example of an exposure machine 10 which can be applied to the present invention.
圖2係顯示可適用於本發明之曝光裝置50的一例之圖。 Fig. 2 is a view showing an example of an exposure apparatus 50 which can be applied to the present invention.
圖3係顯示可適用於本發明之曝光裝置50的一例之平面圖。 Fig. 3 is a plan view showing an example of an exposure apparatus 50 which can be applied to the present invention.
圖4係顯示可適用於本發明之光源裝置100的一例之斷面圖。 Fig. 4 is a cross-sectional view showing an example of a light source device 100 which can be applied to the present invention.
圖5係顯示放電燈110的一例之斷面圖。 FIG. 5 is a cross-sectional view showing an example of the discharge lamp 110.
圖6係顯示:根據本發明有關的點燈方法對於放電燈110供給電力的一例之曲線圖。 Fig. 6 is a graph showing an example of electric power supplied to the discharge lamp 110 in accordance with the lighting method according to the present invention.
圖7係顯示:根據本發明有關的點燈方法對於放電燈110供給電力之其他的一例之曲線圖。 Fig. 7 is a graph showing another example of the electric power supplied to the discharge lamp 110 by the lighting method according to the present invention.
圖8係顯示:根據本發明有關的點燈方法對於放電燈110供給電力之其他的一例之曲線圖。 Fig. 8 is a graph showing another example of the electric power supplied to the discharge lamp 110 by the lighting method according to the present invention.
圖9係顯示:根據本發明有關的點燈方法對於放電燈110供給電力之其他的一例之曲線圖。 Fig. 9 is a graph showing another example of the electric power supplied to the discharge lamp 110 by the lighting method according to the present invention.
圖10係顯示:根據本發明有關的點燈方法對於放電燈110供給電力之其他的一例之曲線圖。 Fig. 10 is a graph showing another example of the electric power supplied to the discharge lamp 110 by the lighting method according to the present invention.
圖11係顯示:根據習用之點亮方法對於放電燈給電之電力及發光管部之内部空間的壓力之一例的曲線圖。 Fig. 11 is a graph showing an example of the electric power applied to the discharge lamp and the pressure in the internal space of the arc tube portion according to the conventional lighting method.
圖12係顯示:根據本發明有關的點燈方法對於放電燈110供給電力、及、發光管部112之内部空間116的壓力之一例的曲線圖。 Fig. 12 is a graph showing an example of the electric power supplied to the discharge lamp 110 and the pressure in the internal space 116 of the arc tube portion 112 according to the lighting method according to the present invention.
圖13係顯示:根據變形例1有關的點燈方法從對於LED開始供給電力起之經過時間、與自該LED照射之光的照射強度間之関係的一例之曲線圖。 Fig. 13 is a graph showing an example of the relationship between the elapsed time from the start of power supply to the LED and the irradiation intensity of the light irradiated from the LED according to the lighting method according to the first modification.
圖14係顯示:根據變形例2有關的點燈方法在曝光時間内之光的照射強度之一例的圖。 Fig. 14 is a view showing an example of the irradiation intensity of light in the exposure time according to the lighting method according to the second modification.
圖15係顯示:根據變形例2有關的點燈方法在曝光時間内之光的照射強度之一例的圖。 Fig. 15 is a view showing an example of the irradiation intensity of light in the exposure time according to the lighting method according to the second modification.
圖16係顯示:根據變形例2有關的點燈方法在曝光時間内之光的照射強度之一例的圖。 Fig. 16 is a view showing an example of the irradiation intensity of light in the exposure time according to the lighting method according to the second modification.
圖17係顯示:根據變形例2有關的點燈方法在曝光時間内之光的照射強度之一例的圖。 Fig. 17 is a view showing an example of the irradiation intensity of light in the exposure time according to the lighting method according to the second modification.
圖18係顯示:根據變形例2有關的點燈方法在曝光時間内之光的照射強度之一例的圖。 Fig. 18 is a view showing an example of the irradiation intensity of light in the exposure time according to the lighting method according to the second modification.
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