TW201930642A - Shadow frame with sides having a varied profile for improved deposition uniformity - Google Patents

Abstract

Embodiments of the present disclosure generally relates a shadow frame including two opposing major side frame members adjacent to two opposing minor side frame members coupled together with a corner bracket, wherein the corner bracket includes a corner inlay having legs that extend in directions generally orthogonal to each other.

Description

Masking frame with varying profile sides to improve deposition uniformity

The embodiments of the present disclosure generally relate to a shadow frame used in a plasma processing chamber.

Modern semiconductor devices require the formation of features such as organic light emitting diodes (OLEDs), transistors and low-k dielectric films by depositing and removing multiple layers of conductive material from a glass substrate , Semiconductor material layer and dielectric material layer. Glass substrate process technologies include plasma-enhanced chemical vapor deposition (PECVD), physical vapor deposition (PVD), and etching. Due to the relatively low process temperature required to deposit a thin film and the good film quality produced by the plasma process, the plasma process is widely used in the production of flat panel devices.

Generally, the plasma process includes placing a substrate in a vacuum chamber on a support member (often referred to as a susceptor or heater), and forming an upper exposed surface adjacent to the substrate (upper exposed surface) a plasma. By introducing one or more process gases into the chamber and using an electric field to excite the gas so that the gas is decomposed into charged particles and neutral particles, the plasma system is formed. A plasma can be generated inductively (e.g. using an inductive RF coil), and / or capacitively (e.g. using a parallel plate electrode), or by using microwave energy (microwave energy) ) To produce.

During processing, the edges and back of the glass substrate and the components inside the chamber must be protected from deposition. Typically, a deposition masking device or shadow frame is placed along the periphery of the substrate to prevent the processing gas or plasma from reaching the edges and back of the substrate and keep the substrate on the support during the process Component. The shielding frame may be disposed in the processing chamber on the support member, so when the support member moves to a higher processing position, the shielding frame is lifted up and contacts an edge portion of the substrate. Therefore, the shadow frame covers a few millimeters around the upper surface of the substrate, thereby avoiding the back and edge deposition on the portion of the substrate covered by the shadow frame.

Along with considering the benefits of using a shelter frame, the current shelter frame design still has some disadvantages. The prior art masking frame typically reduces the deposition on the uncovered edge of the substrate adjacent to the masking frame edge compared to the inner side deposition of the substrate edge. The deposition non-uniformity is more exaggerated in the corners of the substrate.

Therefore, there is a need in the art for a shadow frame to provide more deposition around the substrate.

The embodiments of the present disclosure generally relate to a shadow frame, including two opposite major side frame members adjacent to two opposite minor side frame members, the main edge frame The member and the secondary edge frame member are coupled to each other using a corner bracket, wherein the corner bracket includes a corner inlay with a leg, and the feet are substantially orthogonal to each other Direction extends.

In another embodiment, a shadow frame includes two opposing primary edge frame members adjacent to two opposing secondary edge frame members, the primary edge frame member and the secondary edge frame member are in a coupling interface (coupling) interface) using a corner bracket to couple with each other, wherein each corner bracket includes a corner inlay with a pin, the pin extends in a direction substantially orthogonal to each other, and wherein each corner bracket includes a round corner rounded corner).

In another embodiment, a shadow frame includes two opposing primary edge frame members adjacent to two opposing secondary edge frame members. The primary edge frame member and the secondary edge frame member include a recessed area ( A coupling interface of recessed area) is coupled to each other using a corner bracket, wherein each corner bracket includes a round corner portion and a corner inlay with a pin, the pin extends in a direction substantially orthogonal to each other, the corner is inlaid The piece includes a planar upper surface and a sloped planar surface. The inclined plane and the planar upper surface include an angle at an angle, and a notch is formed in the center of the recessed area.

Therefore, it can be understood in detail that the above-mentioned features of the disclosure are disclosed. For a more detailed description of the disclosure (as outlined above), reference may be made to the embodiments, some of which are shown in the drawings. It is worth noting that, however, these drawings only show representative embodiments of the present disclosure, and therefore are not intended to limit the present invention. The present disclosure may allow other equivalent embodiments.

To help understanding, where possible, the same reference symbols are used to indicate the same elements common to the drawings. It is expected that the elements in one embodiment can be used to advantage in other embodiments without special reference.

The embodiments of the present disclosure generally relate to a shielding frame used in a processing chamber. In one or more embodiments described below, a shadow frame is formed as a multi-piece shadow frame body.

Due to the narrow edge lip, the shadow frame enhances the amorphous silicon uniformity, so the substrate has less shadow. The uniform arrangement of electrically insulating materials also helps the amorphous silicon deposition uniformity. With reference to the following drawings, the disclosed embodiments are described in more detail.

FIG. 1 is a schematic cross-sectional view of an exemplary processing chamber 10 having a shielding frame according to an embodiment. An example of a processing chamber that can benefit from this disclosure is a plasma enhanced chemical vapor deposition processing chamber, which can be taken from AKT America, Inc., AKT America, Inc. It is a subsidiary of Applied Materials, Inc., Santa Clara, California, located in Santa Clara, California. It is understandable that other plasma processing chambers including plasma processing chambers of other manufacturers may be suitable for implementing the present disclosure.

The processing chamber 10 includes a chamber body 12 and a backing plate 14 disposed thereon. The chamber body 12 has a processing region 16. The dimensions of the chamber body 12 and related components of the processing chamber 10 are not limited and are generally proportionally larger than the size of a substrate 29 to be processed. Any suitable substrate size can be processed. Examples of suitable substrate sizes include substrates having a surface area of about 5,500 square centimeters or more, for example about 25,000 square centimeters or more, for example about 50,000 square centimeters or more. In one embodiment, a substrate having a surface area of about 100,000 cm2 or more can be processed.

A gas distribution plate 18 is mounted to the back plate 14 and defines the upper boundary of the processing area 16. A plurality of holes 20 are formed in the gas distribution plate 18 to allow delivery of process gas therein. A gas source 40 can deliver a gas to the plenum formed between the gas distribution plate 18 and the back plate 14 to evenly distribute the processing gas, and thus uniformly deliver the processing gas to pass through Cross the gas distribution plate 18. A power source 42 is electrically coupled to the gas distribution plate 18 to generate a plasma from the processing gas, and the plasma flows through the hole 20. Substrate support 32 is almost entirely composed of aluminum or another conductive metal to serve as a counter-electrode of gas distribution plate 18. The power source 42 may be any type of power source used in the plasma enhanced chemical vapor deposition chamber, such as an RF power source. A shadow frame 22 is shown as being disposed on a substrate support 32. The shadow frame 22 includes a shadow frame body 24 having a frame member 26 affixed thereto.

The chamber body 12 also includes a shadow frame support 44 which is formed annularly around the substrate support 32. When the substrate support 32 is located at a lower position, the shielding frame 22 is supported by the shielding frame support 44.

The substrate support 32, which may also be referred to as a pedestal or heater, is disposed in the processing chamber 10 and is actuated by a motor 33. At an elevated processing position, the substrate support 32 having the substrate 29 disposed on one of the substrate supporting surfaces 34 of the substrate support 32 supports the shielding frame body 24 of the shielding frame 22 and defines the processing area The lower boundary of 16 so that the substrate 29 is positioned in the processing area 16. The frame member 26 extends to cover a part of the substrate 29 and contacts a part of the substrate 29, and the shielding frame body 24 is supported on the substrate support surface 34.

The substrate 29 is introduced into and removed from the processing chamber 10 through an opening 36 formed in the chamber body 12, and the opening 36 is selectively passed through a slit valve mechanism (not shown) Shown) to seal. The lift pin 38 is slidably disposed through the substrate support 32 and can be adapted to hold a substrate at an upper end of the lift pin 38. By using the motor 33 to lower the substrate support 32, the lift pin 38 can be actuated.

FIG. 2 is an isometric view of the substrate support 32 of FIG. 1 and the shielding frame 22 according to one embodiment. The shadow frame 22 includes two opposing primary edge frame members 26 adjacent to two opposing secondary edge frame members 28. Each of the primary edge frame members 26 is coupled to the secondary edge frame members 28 by corner brackets 30. In addition, the substrate support 32 includes a corner inlay 50 at the interface between a substrate receiving surface 52 of the substrate support 32 and a peripheral ledge 54. As described above, a main body 56 of the substrate support 32 is composed of aluminum or other electrically conductive material to serve as a counter electrode connected to the gas distribution plate 18. However, the corner insert 50 may be composed of a ceramic material, which is recessed in a pocket formed in the main body 56. In the case where a substrate is slightly misaligned with the substrate receiving surface 52 of the substrate support 32, the corner inlay 50 can reduce arcing.

FIG. 3 is an enlarged isometric view of the substrate support 32 and the shield frame 22 of FIG. 2. The corner insert 50 is shown as being formed in a recess 58 in the main body 56 of the substrate support 32. The corner bracket 30 is also shown as coupling the primary edge frame member 28 and a primary edge frame member 26. The corner bracket 30 includes a radiused or rounded corner portion 60 and a pin 62 that extend orthogonally from a longitudinal direction of the main edge frame member 26. In one aspect, the main edge frame member 26, including pins 62 on opposite ends, is formed in a "C" shape. The corner bracket 30 also includes a corner insert 64 coupled to an inner peripheral edge 66, 68 of the primary edge frame member 26 and the secondary edge frame member 28, respectively. The corner insert 64 may be secured to the main edge frame member 26 using a fastener 70. A seam cover 72 may be included to cover the interface between the primary edge frame member 26 and the corner insert 64, and to cover the interface between the corner insert 64 and the secondary edge frame member 28. The fastener 70 can be used to fix the seam cover 72 to the main edge frame member 26. All corner inserts 64, fasteners 70, primary edge frame members 26, secondary edge frame members 28, and seam cover 72 may be made of ceramic materials.

Figure 4 is an exploded isometric view of the corner bracket 30. The main edge frame member 26 includes a recessed area 74 in which the corner insert 64 can be placed. Since a 90 degree angle may be difficult to form in the recessed area 74, a radius or notch 76 may be provided on an inner edge of the recessed area 74. For the fixture 70 shown in FIG. 3, the recessed area 74 may have an opening 78.

The corner insert 64 includes a main body 79 having a planar surface 80 that transitions to a tapered or inclined flat surface 82. The opening 78 is formed in the main body 79 to receive the fixing member 70 shown in FIG. 3. The main body 79 includes two pins 81 and 83 extending in directions substantially orthogonal to each other. The intersection of the inclined flat surfaces 82 on the pins 81 and 83 has a radius corner 84.

A coupling interface 86 is used to couple the primary edge frame member 26 to the secondary edge frame member 28. The coupling interface 86 includes a plurality of pins 88. The pin 88 is inserted into the opening formed in the edge of the primary edge frame member 26 and the secondary edge frame member 28. The fixing 90 can be used to fix the pin 88 in the primary edge frame member 26 and the secondary edge frame member 28. The pin 88 may be a metallic material, such as aluminum. The fixing member 90 may be made of a ceramic material.

Each seam cover 72 includes a first surface 92 and a recessed second surface 94 that is a plane lower than the first surface 92. The angle of the recessed second surface 94 may be an angle that substantially matches the inclined flat surface 82 of the corner insert 64.

Fig. 5 is a side cross-sectional view of the frame member 95 along the line 5-5 of Fig. 4. The frame member 95 may be the primary edge frame member 26 or the secondary edge frame member 28. An inner peripheral edge 96 is shown, which may be the inner peripheral edge 66, 68 of the primary edge frame member 26 or the secondary edge frame member 28. The inner peripheral edge 96 includes a flat surface 97 that is a plane orthogonal to an upper surface 98 of the frame member 95. The inner peripheral edge 96 may be referred to as a "bull nose" configuration.

Figure 6 is a side cross-sectional view of the corner insert 64 along the line 6-6 of Figure 4. The inclined flat surface 82 includes an angle α with respect to a plane of the flat surface 80. The angle α may be about 6 degrees to about 8 degrees, for example about 7 degrees. The inclined flat surface 82 may be referred to as a "knife edge" configuration. A substrate coverage area 99 is shown in Figure 6. The substrate coverage area 99 may be about 7 mm, about 5 mm, or about 3 mm.

Extensive testing is performed using the shielding frame 22 as described herein. The deposition on the edge of the substrate adjacent to the inner peripheral edges 66, 68 of the primary edge frame member 26 and the secondary edge frame member 28 and the deposition of the inclined flat surface 82 of the corner insert 64 show an increased thickness distribution thickness profile).

In summary, although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various modifications and retouching without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be deemed as defined by the scope of the attached patent application.

10‧‧‧Process chamber

12‧‧‧Chamber main body

14‧‧‧Backplane

16‧‧‧ Processing area

18‧‧‧Gas distribution board

20‧‧‧ hole

22‧‧‧Shading frame

24‧‧‧Shadow frame main body

26、28‧‧‧Frame member

29‧‧‧ substrate

30‧‧‧corner bracket

32‧‧‧Substrate support

33‧‧‧Motor

34‧‧‧Substrate support surface

36‧‧‧ opening

38‧‧‧ Promotion

40‧‧‧gas source

42‧‧‧Power

44‧‧‧Shading frame support

50‧‧‧corner inlay

52‧‧‧Substrate receiving surface

54‧‧‧ Surrounding truss

56‧‧‧Main

58‧‧‧Cavities

60‧‧‧round corner

62‧‧‧pin

64‧‧‧corner inlay

66, 68‧‧‧ inner periphery

70‧‧‧Fixed parts

72‧‧‧Seam cover

74‧‧‧Sag area

76‧‧‧Notch

78‧‧‧ opening

79‧‧‧Main

80‧‧‧flat surface

81, 83‧‧‧pin

82‧‧‧Tilt flat surface

84‧‧‧ Fillet

86‧‧‧Coupling interface

88‧‧‧pin

90‧‧‧Fixed parts

92‧‧‧First surface

94‧‧‧recessed second surface

95‧‧‧Frame member

96‧‧‧ inner periphery

97‧‧‧flat surface

98‧‧‧Upper surface

99‧‧‧ substrate coverage area

5-5, 6-6‧‧‧ line

α‧‧‧Angle

FIG. 1 is a schematic cross-sectional view of an exemplary processing chamber using a shielding frame according to an embodiment. FIG. 2 is an isometric view of the shielding frame and the substrate support of FIG. 1 according to an embodiment. Figure 3 is an isometric view of the substrate support and shield frame of Figure 2. Figure 4 is an exploded isometric view of the corner bracket. Figure 5 is a side cross-sectional view of a frame member along the line 5-5 of Figure 4. Figure 6 is a side cross-sectional view of the corner insert along line 6-6 of Figure 4.

Claims (21)

A shadow frame includes: two opposing major side frame members, adjacent to two opposing minor side frame members, and the main edge frames The intersection between the member and the secondary edge frame members is coupled to each other using a corner bracket, wherein each of the corner brackets includes a corner insert with a plurality of legs (corner inlay), the pins extend in directions that are substantially orthogonal to each other. The shielding frame as described in item 1 of the scope of the patent application, wherein each of the corner brackets includes a seam cover, each of the seam covers is placed in its own corner inlay and the The interface between a major side member of two opposite main edge frame members, and between the respective corner inlay and the minor side member of the minor edge frame members Interface. The shielding frame as described in item 2 of the scope of the patent application, wherein the corner inlay includes a sloped planar surface, and the sloping planar surface is at an angle to a plane of a planar upper surface. The shielding frame as described in item 3 of the patent application scope, wherein the angle between the inclined flat surface and the flat upper surface is about 7 degrees. The shielding frame as described in item 2 of the patent application scope, wherein the seam cover has a first surface and a second surface. The shielding frame as described in item 5 of the patent application range, wherein the second surface is concave and the second surface is a plane lower than the first plane. The shielding frame as described in item 6 of the patent application scope, wherein the corner inlay includes an inclined flat surface, and the inclined flat surface is at an angle to a plane of a flat upper surface. The shielding frame as described in item 7 of the patent application range, wherein the angle of the second surface substantially matches the angle of the inclined flat surface. The shielding frame as described in item 1 of the patent application scope, wherein the corner bracket includes a rounded corner. A shielding frame includes: two opposing primary edge frame members adjacent to two opposing secondary edge frame members, the primary edge frame members and the secondary edge frame members in a coupling interface (coupling interface) A corner bracket is used to couple to each other, wherein each of the corner brackets includes a corner inlay with a plurality of pins, the pins extend in directions that are substantially orthogonal to each other, and wherein the corner Each of the corner brackets includes a rounded corner. The shielding frame as described in item 10 of the patent application scope, wherein the coupling interface includes a plurality of pins. The shielding frame as described in item 10 of the patent application scope, wherein the coupling interface includes a seam cover. The shielding frame as described in item 12 of the patent application range, wherein the seam cover has a first surface and a second surface. The shielding frame as described in item 13 of the patent application range, wherein the second surface is concave, and the second surface is a plane lower than the first plane. The shielding frame as described in item 14 of the patent application range, wherein the corner insert includes an inclined flat surface that intersects a plane of a flat upper surface at an angle. The shielding frame as described in item 15 of the patent application range, wherein the angle of the second surface substantially matches the angle of the inclined flat surface. A shielding frame includes: two opposing primary edge frame members adjacent to two opposing secondary edge frame members, the primary edge frame members and the secondary edge frame members including a recessed area (recessed area) ) Of a coupling interface using a corner bracket to couple to each other, wherein: each of the corner brackets includes a round corner portion and a corner inlay with a plurality of pins, the pins are substantially along each other Extending in an orthogonal direction; the corner insert includes a flat upper surface and an inclined flat surface, the inclined flat surface intersects a plane of the flat upper surface at an angle; and a notch (notch) formed in the recess The center of the area. The shielding frame as described in item 17 of the patent application scope, wherein the coupling interface includes a seam cover. The shielding frame as described in item 18 of the patent application range, wherein the seam cover has a first surface and a second surface. The shielding frame as described in item 19 of the patent application range, wherein the second surface is concave, and the second surface is lower than a plane of the first surface. The shielding frame as described in item 17 of the patent application scope, wherein the coupling interface includes a plurality of pins.